Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, in the direction away from a substrate, an isolation structure comprises a first isolation part and a second isolation part which are arranged in a stacked mode, the second isolation part comprises an extending part extending towards a corresponding isolation opening relative to the first isolation part, and the side, facing the substrate, of at least part of the extending part is provided with an uneven surface. The packaging unit is at least in contact with the surface of one side, facing the substrate, of the extending part. According to the design, the packaging unit is in contact with the uneven surface in the extending part, the contact area between the packaging unit and the extending part is increased, the binding force between the packaging unit and the extending part is improved, the packaging unit and the extending part are not prone to being separated, in addition, the structure can prolong the invasion path of water vapor or etching liquid, and the packaging effect of the packaging unit on the light-emitting device is improved. Damage of the isolation structure or poor display of the light-emitting device caused by invasion of water vapor or etching liquid is improved, and the stability and the display effect of the display panel are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. It is widely used in various consumer electronic products such as smart phones, TVs, laptops, desktop computers, car displays, wearable devices, etc. due to its excellent color and picture quality, and has become the mainstream technology in display panels.

[0003] However, the process performance of current OLED display products needs to be further improved. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for preparing a display panel, and an electronic device.

[0005] In a first aspect of the present application, a display panel is provided, the display panel comprising:

[0006] substrate;

[0007] an isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening on the substrate, and in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion stacked together, the second isolation portion includes an extension portion extending toward the corresponding isolation opening relative to the first isolation portion, and at least a portion of the extension portion has an uneven surface on a side facing the substrate;

[0008] A light emitting device, at least part of which is located in the isolation opening;

[0009] The packaging unit is located on a side of the light emitting device away from the substrate and at least contacts with a surface of the protruding portion facing the substrate.

[0010] In a possible implementation of the present application, the light-emitting device includes a first light-emitting device and a second light-emitting device emitting light of different colors, the isolation opening includes a first isolation opening and a second isolation opening, the first light-emitting device is at least partially located in the first isolation opening, the second light-emitting device is at least partially located in the second isolation opening, and the extension portion includes a first extension portion extending toward the first isolation opening and a second extension portion extending toward the second isolation opening;

[0011] The maximum undulation height of the surface of the first extension portion facing the substrate is different from the maximum undulation height of the surface of the second extension portion facing the substrate, wherein the maximum undulation height of the surface refers to the distance between the point on the surface closest to the substrate and the point on the surface farthest from the substrate in a direction perpendicular to the plane where the substrate is located;

[0012] Preferably, the maximum undulation height of the first protruding portion toward the surface of one side of the substrate is smaller than the maximum undulation height of the second protruding portion toward the surface of one side of the substrate;

[0013] Preferably, a maximum undulation height of the first protruding portion toward a surface of a side of the substrate is smaller than a maximum undulation height of the first protruding portion away from a surface of a side of the substrate.

[0014] In a possible implementation of the present application, the light-emitting device further includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, the isolation opening further includes a third isolation opening, the third light-emitting device is at least partially located in the third isolation opening, and the extension portion further includes a third extension portion extending toward the third isolation opening;

[0015] The maximum undulation height of the first extension portion toward the surface of one side of the substrate, the maximum undulation height of the second extension portion toward the surface of one side of the substrate, and the maximum undulation height of the third extension portion toward the surface of one side of the substrate increase in sequence.

[0016] In a possible implementation of the present application, the light-emitting device further includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, the isolation opening further includes a third isolation opening, the third light-emitting device is at least partially located in the third isolation opening, and the extension portion further includes a third extension portion extending toward the third isolation opening;

[0017] The maximum undulation height of the third protruding portion toward the surface of one side of the substrate is smaller than the maximum undulation height of the second protruding portion toward the surface of one side of the substrate;

[0018] Preferably, a maximum undulation height of the third protruding portion away from a surface of one side of the substrate is smaller than a maximum undulation height of the first protruding portion away from a surface of one side of the substrate.

[0019] In a possible implementation of the present application, on the uneven surface of the protruding portion facing the substrate, the maximum undulation height of the surface is 1 / 10-1 / 2 of the thickness of the portion where the orthographic projection of the second isolation portion on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate.

[0020] In a possible implementation of the present application, in a direction perpendicular to the plane where the substrate is located, the minimum distance between the uneven surface of the protruding portion facing the side of the substrate and the substrate is less than or equal to the distance between the portion of the second isolation portion where the orthographic projection of the second isolation portion on the substrate coincides with the orthographic projection of the first isolation portion on the substrate and the side of the substrate.

[0021] In a possible implementation manner of the present application, a protrusion and / or a groove is provided on a side of the extension portion facing the substrate;

[0022] The orthographic projection of the protrusion and / or the groove on the substrate surrounds the orthographic projection of the isolation opening on the substrate;

[0023] Preferably, the orthographic projections of the protrusion and / or the groove on the substrate continuously surround the orthographic projection of the isolation opening on the substrate, or the orthographic projections of the protrusion and / or the groove on the substrate discontinuously surround the orthographic projection of the isolation opening on the substrate.

[0024] In a possible implementation manner of the present application, in a direction perpendicular to the plane where the substrate is located, the distance between the protrusion and the substrate is less than or equal to the distance between a portion of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate and the substrate;

[0025] In a direction perpendicular to the plane of the substrate, the distance between the groove and the substrate is greater than or equal to the distance between a portion of the second isolation portion where the orthographic projection of the second isolation portion on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate and the substrate.

[0026] In one possible implementation of the present application, in a direction perpendicular to the plane of the substrate, the height of the protrusion and / or the depth of the groove is 1 / 4-2 / 3 of the thickness of the portion where the orthographic projection of the second isolation portion on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate.

[0027] In a possible implementation of the present application, in a cross section perpendicular to the plane where the substrate is located and passing through the center of an adjacent isolation opening, the cross-sectional shape of the protrusion and / or the groove includes a rectangle, a sawtooth shape, or an arc shape.

[0028] In a possible implementation of the present application, the display panel further includes a pixel defining layer, the pixel defining layer is located on one side of the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate;

[0029] The pixel defining layer includes a pixel opening, and the pixel opening is connected to the isolation opening;

[0030] Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate;

[0031] Preferably, in the direction away from the substrate, the light-emitting device also includes a first electrode, a light-emitting material layer and a second electrode which are stacked in sequence, the first electrode is located on the side of the pixel defining layer facing the substrate, at least part of the first electrode is exposed from the pixel opening position, and the second electrode overlaps the isolation structure.

[0032] In a possible implementation of the present application, the isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0033] Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0034] In a possible implementation of the present application, the display panel further includes a first encapsulation layer;

[0035] The first encapsulation layer is located at a side of the encapsulation unit away from the substrate, and the first encapsulation layer comprises a flat surface on the side away from the substrate;

[0036] Preferably, the display panel further comprises a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate;

[0037] Preferably, the encapsulation unit and the second encapsulation layer include inorganic materials, and the first encapsulation layer includes organic materials.

[0038] According to a second aspect of the present application, a display panel is provided, comprising:

[0039] substrate;

[0040] An isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening on the substrate, in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion stacked, the second isolation portion includes an extension portion extending toward the corresponding isolation opening relative to the first isolation portion, and in a direction perpendicular to the plane where the substrate is located, at least a portion of the surface of the extension portion facing the side of the substrate includes a plurality of position areas with different distances from the substrate;

[0041] A light emitting device, at least part of which is located in the isolation opening;

[0042] The packaging unit is located on a side of the light emitting device away from the substrate and at least contacts with a surface of the protruding portion facing the substrate.

[0043] In a possible implementation of the present application, the distance between part of the position area and the substrate is greater than or equal to the distance between a part of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection on the substrate of the first isolation portion and the substrate; and / or,

[0044] The distance between part of the position area and the substrate is less than or equal to the distance between a part of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection on the substrate of the first isolation portion and the substrate facing the substrate.

[0045] In a third aspect of the present application, a method for preparing a display panel is further provided, the method comprising:

[0046] providing a substrate;

[0047] An isolation structure material layer is fabricated on the substrate, and the isolation structure material layer is patterned to obtain an isolation structure formed by stacked first isolation parts and second isolation parts in a direction away from the substrate, and at least a portion of the second isolation part relative to the extension of the first isolation part forms an uneven surface on a side facing the substrate, wherein the isolation structure encloses an isolation opening on the substrate;

[0048] A light emitting device is fabricated in the isolation opening corresponding to the protruding portion having the uneven surface on the side facing the substrate;

[0049] A packaging unit is manufactured on a side of the light emitting device away from the substrate, and the packaging unit is made to contact at least a surface of the protruding portion facing the substrate.

[0050] In a possible implementation of the present application, the isolation structure material layer includes a first isolation structure material layer and a second isolation structure material layer, and the step of patterning the isolation structure material layer to obtain an isolation structure formed by a first isolation portion and a second isolation portion stacked in a direction away from the substrate, and causing at least a portion of the second isolation portion to form an uneven surface on a side of the substrate that extends outward from the first isolation portion, includes:

[0051] Sequentially manufacturing the first isolation structure material layer and the second isolation structure material layer on the substrate;

[0052] The second isolation structure material layer and the first isolation structure material layer are patterned to obtain the isolation structure, wherein the isolation structure includes the second isolation portion formed by the patterned second isolation structure material layer and the first isolation portion formed by the patterned first isolation structure material layer;

[0053] The evaporated film layer in a part of the isolation opening is etched, and while removing the evaporated film layer, an etching substance is used to etch a side of the protruding portion facing the substrate to form an uneven surface.

[0054] In a possible implementation of the present application, the isolation opening includes a first isolation opening and a second isolation opening, and the step of etching the evaporated film layer in part of the isolation opening, and etching a side of the extension portion facing the substrate by etching a substance to form an uneven surface while removing the evaporated film layer, includes:

[0055] Vapor-depositing a vapor-deposited film layer for forming a light-emitting device in the first isolation opening and the isolation opening;

[0056] The evaporated film layer in the second isolation opening is removed by etching, and an uneven surface is formed by etching a side of the extended portion corresponding to the second isolation opening facing the substrate.

[0057] In a possible implementation of the present application, the isolation structure material layer includes a first isolation structure material layer and a second isolation structure material layer, and the step of patterning the isolation structure material layer to obtain an isolation structure formed by a first isolation portion and a second isolation portion stacked in a direction away from the substrate, and causing at least a portion of the second isolation portion to form an uneven surface on a side of the substrate that extends outward from the first isolation portion, includes:

[0058] Manufacturing the first isolation structure material layer on the substrate, and patterning the first isolation structure material layer to obtain a first isolation portion;

[0059] Making an auxiliary layer having the same height as the first isolation portion, and forming a protrusion and / or a groove at a position of the auxiliary layer close to the first isolation portion;

[0060] Making a second isolation structure material layer on a side of the auxiliary layer away from the substrate, and patterning the second isolation structure material layer to obtain a second isolation portion, wherein an extension of the second isolation portion relative to the first isolation portion includes a protrusion and / or a groove on a side facing the substrate;

[0061] The auxiliary layer is removed.

[0062] In a fourth aspect of the present application, an electronic device is also provided, comprising a display panel in any possible implementation of the first aspect or the second aspect, or a display panel prepared in any possible implementation of the third aspect.

[0063] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, in the direction away from the substrate, the isolation structure includes a first isolation part and a second isolation part that are stacked, the second isolation part includes an extension part that extends toward the corresponding isolation opening relative to the first isolation part, at least part of the extension part has an uneven surface on the side facing the substrate, and the packaging unit is in contact with at least the surface of the extension part on the side facing the substrate. With such a design, the contact area between the packaging unit and the uneven surface of the extension part is increased, the bonding force between the two is improved, and the two are not easy to separate. In addition, the above structure can also extend the path of water vapor or etching liquid invasion, improve the packaging effect of the packaging unit on the light-emitting device, improve the damage to the isolation structure or poor display of the light-emitting device caused by the invasion of water vapor or etching liquid, and improve the stability and display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0065] Figure 1 The schematic diagram of the positional relationship between the isolation structure and the isolation opening provided by this embodiment is illustrated;

[0066] Figure 2 Example Figure 1 One of the cross-sectional diagrams at the AA position in the middle part;

[0067] Figure 3 Example Figure 1 The second cross-sectional diagram at the AA position;

[0068] Figure 4 Example Figure 1 The third cross-sectional diagram at the AA position;

[0069] Figure 5 Example Figure 1 The fourth cross-sectional diagram at the AA position;

[0070] Figure 6 Example Figure 1 The fifth schematic cross-sectional view of the middle part at position AA;

[0071] Figure 7 Example Figure 1 The sixth schematic diagram of the cross section at the AA position in the middle part;

[0072] Figure 8 One of the positional relationships between the protrusions and / or recesses and the isolation openings is exemplified;

[0073] Fig. 9 The second example of the positional relationship between the protrusion and / or the groove and the isolation opening is illustrated;

[0074] Fig.10 Several shapes of protrusions or grooves provided on the side of the extension toward the substrate are exemplified;

[0075] Fig.11 A structural schematic diagram illustrating an isolation structure is shown;

[0076] Fig.12 Example Figure 1 The seventh cross-sectional diagram at the AA position;

[0077] Fig.13 Example Figure 1 The eighth cross-sectional diagram at the AA position;

[0078] Fig.14 A schematic diagram illustrating a process of a method for preparing a display panel provided in this embodiment;

[0079] Fig.15 for Fig.14 The corresponding process diagram;

[0080] Fig.16 Example implementation Fig.14 One of the process flow diagrams of step S12;

[0081] Fig.17a and Fig.17b Example implementation Fig.14 The second process flow diagram of step S12.

[0082] Icons: 1-display panel; 11-substrate; 12-isolation structure; 1201-isolation opening; 1201a-first isolation opening; 1201b-second isolation opening; 1201c-third isolation opening; 121-first isolation portion; 122-second isolation portion; 1221-extending portion; 1221a-first extending portion; 1221b-second extending portion; 1221c-third extending portion; 123-third isolation portion; 13-light-emitting device; 13a-first Light-emitting device; 13b-second light-emitting device; 13c-third light-emitting device; 131-first electrode; 132-light-emitting material layer; 133-second electrode; 14-pixel defining layer; 1401-pixel opening; 151-packaging unit; 152-first packing layer; 153-second packing layer; 161-protrusion; 162-groove; 20-isolation structure material layer; 201-first isolation structure material layer; 202-second isolation structure material layer; 30-auxiliary layer. DETAILED DESCRIPTION

[0083] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0084] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0085] Improving the density of light-emitting devices in a display panel (i.e., pixel density) is an important way to improve the display effect. However, the display panels currently made using fine metal evaporation mask (FMM) technology are unable to further increase the density of light-emitting devices due to technical limitations. After long-term research, the inventors found that in order to solve the technical problem that the density of light-emitting devices cannot be further increased, an isolation structure is set in some display panels. When the light-emitting material layer and the cathode are evaporated in the entire layer, the light-emitting material layer and the cathode can be disconnected at the isolation structure position. Through multiple evaporation and multiple etching processes, light-emitting devices of different colors can be formed in different isolation openings. The above process is also called light-emitting device patterning.

[0086] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, Patent PCT / CN2024 / 099072, Patent CN117979755A, Patent CN117998900A, Patent CN1 17062489A, patent CN117580403A, patent CN116583155A, patent CN116669477A, ​​patent CN117396039A, patent CN116669480A, patent CN116600606A, and patent CN117500332A record related technical solutions of isolation structure (or partition structure or isolation column) and packaging layer, and their contents are incorporated into this application by reference for reference.

[0087] In the above-mentioned display panel, there are display defects such as dark spots, which will affect the display effect of the display panel and further reduce the user experience.

[0088] In order to solve the above problems, the inventor innovatively designed the following technical solution, and the specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in this embodiment below for the above problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0089] Please refer to Figure 1 and Figure 2 , Figure 1 The schematic diagram of the distribution of the isolation structure provided by this embodiment is illustrated. Figure 2 Example Figure 1 In the present embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13 and a packaging unit 151, wherein the substrate 11 may be a multi-layer structure, the substrate 11 at least includes a plurality of conductive layers and an insulating layer located between adjacent conductive layers, a pixel circuit for providing a driving signal to the light-emitting device 13 is formed in the substrate 11, and the conductive layer may be a metal conductive layer.

[0090] The isolation structure 12 is located on one side of the substrate 11, and the isolation structure 12 encloses an isolation opening 1201 on the substrate 11. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 that are stacked, and the orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11, and the second isolation portion 122 extends toward the corresponding isolation opening 1201 relative to the first isolation portion 121 to form an undercut structure (undercut structure), through which the light-emitting material layer and the electrode layer evaporated on the entire surface can be disconnected at this position, so as to form the film layer of the light-emitting device independently in different isolation openings 1201.

[0091] The second isolation portion 122 includes an extension portion 1221 extending toward the corresponding isolation opening 1201 relative to the first isolation portion 121. In this embodiment, at least a portion of the extension portion 1221 has an uneven surface on the side facing the substrate 11. The uneven surface has a larger surface area than a flat surface. That is, at least a portion of the extension portion 1221 has a plurality of position areas at different distances from the substrate 11 on the side facing the substrate 11.

[0092] At least a portion of the light-emitting device 13 is arranged in the isolation opening 1201, and the packaging unit 151 is located on the side of the light-emitting device 13 away from the substrate 11. The packaging unit 151 extends from the surface of the light-emitting device 13 through the first isolation portion 121 toward the side wall of the isolation opening 1201 to the side of the second isolation portion 122 away from the substrate 11. The packaging unit 151 is in contact with at least the surface of the extension portion 1221 facing the substrate 11.

[0093] In the above structure, by contacting the packaging unit 151 with the uneven surface of the protruding portion 1221, the contact area between the two can be increased, the bonding force between the two can be improved, and the two are not easily separated. In addition, the above structure can also extend the invasion path of water vapor or etching liquid, improve the packaging effect of the packaging unit 151 on the light-emitting device 13, improve the damage to the isolation structure 12 or poor display of the light-emitting device 13 caused by the invasion of water vapor or etching liquid, and improve the stability and display effect of the display panel 1.

[0094] Please refer to Figure 3In the present embodiment, the light-emitting device 13 includes a first light-emitting device 13a and a second light-emitting device 13b with different light-emitting colors, the isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b, the first light-emitting device 13a is at least partially located in the first isolation opening 1201a, the second light-emitting device 13b is at least partially located in the second isolation opening 1201b, and the extension portion 1221 includes a first extension portion 1221a extending toward the first isolation opening 1201a and a second extension portion 1221b extending toward the second isolation opening 1201b.

[0095] In this embodiment, the first light-emitting device 13a can be manufactured before the second light-emitting device 13b. When manufacturing the second light-emitting device 13b, it is necessary to first remove the film layers (e.g., the light-emitting material layer, the cathode layer) related to the first light-emitting device 13a manufactured in the second isolation opening 1201b. Specifically, an etching material is used to remove the film layers related to the first light-emitting device 13a in the second isolation opening 1201b, and the etching material is controlled to at least etch the side of the second extension 1221b facing the substrate 11 to form an uneven surface. In addition, after the second light-emitting device 13b is manufactured in the second isolation opening, it is also necessary to remove the film layers related to the second light-emitting device 13b manufactured at the position of the first isolation opening 1201a. In this process, the etching material will etch the side of the first extension 1221a away from the substrate 11, while the side of the first extension 1221a facing the substrate 11 will not be etched because it is in contact with the packaging unit 151. That is, through the above analysis, it can be known that the side of the first extension portion 1221a facing the substrate 11 can maintain a flat surface, while the side of the second extension portion 1221b facing the substrate 11 will form an uneven surface due to one etching. At the same time, the side of the first extension portion 1221a away from the substrate 11 will also become uneven due to etching and removing the relevant film layer of the second light-emitting device 13b at the position of the first isolation opening 1201a.

[0096] From the above analysis, it can be seen that in this embodiment, the maximum undulation height of the surface of the first extension portion 1221a facing the substrate 11 is different from the maximum undulation height of the surface of the second extension portion 1221b facing the substrate 11, wherein the maximum undulation height of the surface refers to the distance between the point on the surface closest to the substrate 11 and the point farthest from the substrate 11 in a direction perpendicular to the plane where the substrate 11 is located.

[0097] Optionally, the maximum undulation height of the surface of the first protruding portion 1221 a facing the substrate 11 is smaller than the maximum undulation height of the surface of the second protruding portion 1221 b facing the substrate 11 .

[0098] In this embodiment, the maximum undulation height of the surface of the first protruding portion 1221 a facing the substrate 11 is smaller than the maximum undulation height of the surface of the first protruding portion 1221 a away from the substrate 11 .

[0099] For further information, please refer to Figure 4 In the present embodiment, the light-emitting device 13 further includes a third light-emitting device 13c having a light-emitting color different from that of the first light-emitting device 13a and the second light-emitting device 13b, the isolation opening 1201 further includes a third isolation opening 1201c, the third light-emitting device 13c is at least partially located in the third isolation opening 1201c, and the extension portion 1221 further includes a third extension portion 1221c extending toward the third isolation opening 1201c.

[0100] In a possible implementation of this embodiment, the third light emitting device 13c is manufactured after the second light emitting device 13b, and the first isolation opening 1201a, the second isolation opening 1201b and the third isolation opening 1201c can be formed simultaneously before the first light emitting device 13a is manufactured. Before the third light emitting device 13b is manufactured, the third isolation opening 1201c will undergo two etching processes of etching to remove the relevant film layer of the first light emitting device 13a and to remove the relevant film layer of the second light emitting device 13b, so the third extension portion 1221c will undergo two etching effects. Figure 4 As shown, in this embodiment, the maximum undulation height of the first extension portion 1221a toward the surface of one side of the substrate 11, the maximum undulation height of the second extension portion 1221b toward the surface of one side of the substrate 11, and the maximum undulation height of the third extension portion 1221c toward the surface of one side of the substrate 11 increase successively.

[0101] In another possible implementation of this embodiment, the third light emitting device 13c is manufactured after the second light emitting device 13b, the first isolation opening 1201a and the second isolation opening 1201b can be formed simultaneously before manufacturing the first light emitting device 13a, and the third isolation opening 1201c can be formed after manufacturing the second light emitting device 13b. In this implementation, the third isolation opening 1201c will not be affected by etching to remove the film layer related to the previously manufactured light emitting device, so the third extension portion 1221c will not be affected by etching. Please refer to Figure 5In this case, the maximum undulation height of the surface of the third protrusion 1221c facing the substrate 11 is less than the maximum undulation height of the surface of the second protrusion 1221b facing the substrate 11. The side of the third protrusion 1221c facing the substrate 11 and the side of the first protrusion 1221a facing the substrate 11 both have relatively flat surfaces. In addition, since the side of the first protrusion 1221a away from the substrate 11 will be affected by the removal of the film layer related to the second light-emitting device 13b and the film layer related to the third light-emitting device 13c at the position of the first isolation opening 1201a, the side of the first protrusion 1221a away from the substrate 11 will form an uneven surface, that is, in this embodiment, the maximum undulation height of the surface of the third protrusion 1221c away from the substrate 11 is less than the maximum undulation height of the surface of the first protrusion 1221a away from the substrate 11.

[0102] In this embodiment, on the uneven surface of the protruding portion 1221 facing the substrate 11, the maximum undulation height of the surface is 1 / 10-1 / 2 of the thickness of the portion where the orthographic projection of the second isolation portion 122 on the substrate 11 coincides with the orthographic projection of the first isolation portion 121 on the substrate 11. By way of example, the maximum undulation height of the surface is 1 / 10, 2 / 19, 1 / 9, 2 / 17, 1 / 8, 2 / 15, 1 / 7, 2 / 11, 1 / 5, 2 / 9, 2 / 7, 1 / 3, 2 / 5 or 1 / 2 of the thickness of the second isolation portion 122 that coincides with the first isolation portion 121.

[0103] In this embodiment, in the direction perpendicular to the plane where the substrate 11 is located, the minimum distance between the uneven surface of the extension portion 1221 facing the substrate 11 side and the substrate 11 is less than or equal to the distance between the portion of the second isolation portion 122 where the orthographic projection on the substrate 11 coincides with the orthographic projection of the first isolation portion 121 on the substrate 11 and the substrate 11.

[0104] In the above embodiment, the uneven surface of the extension 1221 facing the substrate 11 is formed by etching the film layer related to the light emitting device 13 in the isolation opening 1201. In another embodiment, the uneven surface of the extension 1221 facing the substrate 11 can be formed by separately made protrusions and / or grooves.

[0105] In another embodiment, please refer to Figure 6 and Figure 7 The side of the extension 1221 facing the substrate 11 is formed with an uneven surface by protrusions 161 and / or grooves 162 made separately. Figure 6 As shown, the side of the extension 1221 facing the substrate 11 may only be formed with the protrusions 161 to form an uneven surface; Figure 7As shown, the side of the extension 1221 facing the substrate 11 may also be formed with an uneven surface by only the grooves 162. In other embodiments, the side of the extension 1221 facing the substrate 11 may also be formed with an uneven surface by both the protrusions 161 and the grooves 162. In the embodiment, the number of protrusions 161 and the grooves 162 may be set according to actual needs, and the specific number is not limited in this embodiment.

[0106] Please refer to Figure 8 In this embodiment, the orthographic projection of the protrusion 161 and / or the groove 162 on the substrate 11 surrounds the orthographic projection of the isolation opening 1201 on the substrate 11. In a possible implementation, the orthographic projection of the protrusion 161 and / or the groove 162 on the substrate 11 continuously surrounds the orthographic projection of the isolation opening 1201 on the substrate 11, that is, the orthographic projection of the protrusion 161 and / or the groove 162 on the substrate 11 is a continuous ring, for example, refer to Figure 8 In another possible implementation, the orthographic projection of the protrusion 161 and / or the groove 162 on the substrate 11 is discontinuously surrounding the orthographic projection of the isolation opening 1201 on the substrate 11, that is, the orthographic projection of the protrusion 161 and / or the groove 162 on the substrate 11 is a discontinuous ring. For example, please refer to Fig. 9 Preferably, the orthographic projections of the protrusions 161 and / or the grooves 162 on the substrate 11 continuously surround the orthographic projections of the isolation openings 1201 on the substrate 11 .

[0107] In this embodiment, in a direction perpendicular to the plane where the substrate 11 is located, the distance between the protrusion 161 and the substrate 11 is less than or equal to the distance between the portion of the second isolation portion 122 where the orthographic projection on the substrate 11 coincides with the orthographic projection on the substrate 11 of the first isolation portion 121 and the substrate 11 facing the substrate 11. In a direction perpendicular to the plane where the substrate 11 is located, the distance between the groove 162 and the substrate 11 is greater than or equal to the distance between the portion of the second isolation portion 122 where the orthographic projection on the substrate 11 coincides with the orthographic projection on the substrate 11 of the first isolation portion 121 and the substrate 11 facing the substrate 11. That is, the distance between at least a portion of the position area on the surface of the extension portion 1221 facing the substrate side and the substrate 11 is greater than or equal to the distance between the second isolation portion 122 coincident with the first isolation portion 121 and the substrate 11, and / or the distance between at least a portion of the position area on the surface of the extension portion 1221 facing the substrate side and the substrate 11 is less than or equal to the distance between the second isolation portion 122 coincident with the first isolation portion 121 and the substrate 11.

[0108] Further, in this embodiment, in the direction perpendicular to the plane where the substrate 11 is located, the height of the protrusion 161 and / or the depth of the groove 162 is 1 / 4-2 / 3 of the thickness of the portion where the orthographic projection of the second isolation portion 122 on the substrate 11 coincides with the orthographic projection of the first isolation portion 121 on the substrate 11. Exemplarily, the height of the protrusion 161 and / or the depth of the groove 162 is 1 / 4, 2 / 7, 1 / 3, 2 / 5, 1 / 2, 7 / 12 or 2 / 3 of the thickness of the second isolation portion 122 that coincides with the first isolation portion 121, etc.

[0109] Please refer to Fig.10 In a cross section perpendicular to the plane where the substrate 11 is located and passing through the center of the adjacent isolation opening 1201 , the cross-sectional shape of the protrusion 161 and / or the groove 162 includes a rectangular shape, a sawtooth shape, and an arc shape.

[0110] For further information, please refer to Fig.11 , the isolation structure 12 further includes a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121 and the second isolation portion 122 are stacked in sequence, and the orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the third isolation portion 123 on the substrate 11, that is, the orthographic projection area of ​​the first isolation portion 121 on the substrate 11 is smaller than the orthographic projection area of ​​the third isolation portion 123 on the substrate 11, and the third isolation portion 123 will extend relative to the first isolation portion 121 toward the direction of the corresponding isolation opening 1201. Optionally, the orthographic projection of the third isolation portion 123 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11.

[0111] In this embodiment, the material of the first isolation portion 121 includes aluminum, silver or copper, the material of the second isolation portion 122 includes titanium or molybdenum, and the material of the third isolation portion 123 includes molybdenum or titanium.

[0112] For further information, please refer to Fig.12, the display panel 1 further includes a pixel defining layer 14, the pixel defining layer 14 is located on one side of the substrate 11, and the isolation structure 12 is located on the side of the pixel defining layer 14 away from the substrate 11. The pixel defining layer 14 includes a pixel opening 1401, at least part of the light emitting device 13 is located in the pixel opening 1401, and the pixel opening 1401 is connected to the isolation opening 1201. Exemplarily, the orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. The orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. In this embodiment, the pixel defining layer 141 may be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 141 is an inorganic pixel defining layer. When the pixel defining layer 141 is an inorganic pixel defining layer, the pixel defining layer 141 may be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed alternately of silicon oxide and silicon nitride.

[0113] Please refer again Fig.12 In the direction away from the substrate 11, the light emitting device 13 includes a first electrode 131, a light emitting material layer 132 and a second electrode 133 which are stacked in sequence, at least a portion of the first electrode 131 is exposed from the pixel opening 1401, and the second electrode 133 extends from the pixel opening 1401 through the pixel defining layer 14 to the side wall of the isolation structure 12 facing the isolation opening 1201, wherein the second electrode 133 may overlap with the third isolation portion 123, may overlap with the first isolation portion 121, or may overlap with both the third isolation portion 123 and the first isolation portion 121. Exemplarily, the first electrode 131 may be the anode of the light emitting device 13, and the second electrode 133 may be the cathode of the light emitting device 13.

[0114] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The setting of the isolation structure 12 can form film layers of light-emitting devices of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can separate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, so that different light-emitting devices 13 are independent of each other, so as to improve the crosstalk between adjacent light-emitting devices 13 and enhance the display effect. Adjacent light-emitting devices 13 can be independently packaged to improve the packaging yield. At the same time, due to the existence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask to save the manufacturing cost of the display panel.

[0115] For further information, please refer to Fig.13The display panel 1 further includes a first encapsulation layer 152, which is located on a side of the encapsulation unit 151 away from the substrate 11, and at least covers the encapsulation unit 151. Optionally, the first encapsulation layer 152 includes a flat surface on a side away from the substrate 11.

[0116] Furthermore, the display panel 1 further includes a second encapsulation layer 153 , and the second encapsulation layer 153 is located on a side of the first encapsulation layer 15 away from the substrate 11 .

[0117] Optionally, the encapsulation unit 151 and the second encapsulation layer 153 include an inorganic material, and the first encapsulation layer 152 includes an organic material, that is, the encapsulation unit 151 and the second encapsulation layer 153 may be an inorganic encapsulation layer, and the first encapsulation layer 152 may be an organic encapsulation layer. For example, the encapsulation unit 151 and the second encapsulation layer 153 may be formed by chemical vapor deposition (CVD), and the first encapsulation layer 152 may be formed by inkjet printing (IJP).

[0118] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the second packaging layer 153 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0119] This embodiment also provides another display panel. The display panel includes: a substrate, an isolation structure, a light-emitting device and a packaging unit. Specifically, the isolation structure is located on one side of the substrate, the isolation structure encloses an isolation opening on the substrate, and in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion that are stacked, the second isolation portion includes an extension portion extending toward the corresponding isolation opening relative to the first isolation portion, and in a direction perpendicular to the plane where the substrate is located, at least part of the surface of the extension portion facing the side of the substrate includes a plurality of position areas with different distances from the substrate; at least part of the light-emitting device is located in the isolation opening; the packaging unit is located on a side of the light-emitting device away from the substrate, and at least in contact with the surface of the extension portion facing the side of the substrate.

[0120] Optionally, the distance between the partial position area and the substrate is greater than or equal to the distance between the part of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate and the side of the substrate toward the substrate; and / or, the distance between the partial position area and the substrate is less than or equal to the distance between the part of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate and the side of the substrate toward the substrate.

[0121] Based on the same inventive concept, this embodiment also provides a method for preparing a display panel, please refer to Fig.14 and Fig.15 ,in Fig.14 The schematic diagram of the process of manufacturing the display panel provided in this embodiment is shown in FIG. Fig.15 Example Fig.14 The corresponding process diagram is combined with the following Fig.14 and Fig.15 The method for manufacturing the display panel provided in this embodiment is described in detail.

[0122] Step S11, providing a substrate 11.

[0123] In this embodiment, the substrate 11 is a multi-layer structure, and the substrate 11 includes at least multiple conductive layers and insulating layers located between adjacent conductive layers. A pixel circuit that provides a driving signal for the light-emitting device is formed in the substrate 11. Exemplarily, the conductive layer includes a metal conductive layer.

[0124] Step S12, making an isolation structure material layer 20 on one side of the substrate 11, and patterning the isolation structure material layer 20 to obtain an isolation structure 12 formed by a stacked first isolation portion 121 and a second isolation portion 122 in a direction away from the substrate 11, and making at least a portion of the second isolation portion 122 form an uneven surface toward the side of the substrate 11 with an extension portion 1221 extending out from the first isolation portion 121.

[0125] Step S13 , manufacturing the light emitting device 13 in the isolation opening 1201 corresponding to the protruding portion 1221 having the uneven surface on the side facing the substrate 11 .

[0126] Step 14: manufacturing a packaging unit 151 on a side of the light emitting device 13 away from the substrate 11 , and making the packaging unit 151 at least in contact with a surface of the extension portion 1221 facing the substrate 11 .

[0127] The display panel formed by the above preparation method can increase the contact area between the packaging unit 151 and the extension portion 1222 on the side facing the substrate 11, thereby improving the bonding force between the two and making the two difficult to separate. In addition, the structure formed by the above preparation method can also extend the invasion path of water vapor or etching liquid, enhance the packaging effect of the packaging unit 151 on the light-emitting device 13, improve the damage to the isolation structure 12 or poor display of the light-emitting device 13 caused by the invasion of water vapor or etching liquid, and improve the stability and display effect of the display panel.

[0128] In one implementation of this embodiment, the uneven surface of the side of the extension 1221 facing the substrate 11 can be formed by controlling the reaction time or reaction concentration of the etching material during the patterning process of the light-emitting device. In detail, the isolation structure material layer 20 may include a first isolation structure material layer and a second isolation structure material layer, please refer to Fig.16, step S12 can be implemented in the following way.

[0129] First, a first isolation structure material layer 201 and a second isolation structure material layer 202 are sequentially formed on the substrate 11 .

[0130] Next, the second isolation structure material layer 202 and the first isolation structure material layer 201 are patterned to obtain an isolation structure 12 , which includes a second isolation portion 122 formed by the patterned second isolation structure material layer 202 and a first isolation portion 121 formed by the patterned first isolation structure material layer 201 .

[0131] Then, a vapor-deposited film layer for forming a light-emitting device is made in the isolation opening 1201, and the vapor-deposited film layer in part of the isolation opening 1201 is etched. While removing the vapor-deposited film layer, an uneven surface is formed on the side of the extension 1221 facing the substrate 11 by etching the etching material.

[0132] Taking the formation of an uneven surface on the protruding portion at the position of the second isolation opening as an example, the isolation opening may include a first isolation opening and a second isolation opening, and the specific method of removing the evaporated film layer to form the uneven surface may be: evaporate the evaporated film layer used to form the light-emitting device in the first isolation opening and the isolation opening; then etch away the evaporated film layer in the second isolation opening, and etch the uneven surface on the side of the protruding portion corresponding to the second isolation opening facing the substrate.

[0133] In another implementation of this embodiment, the uneven surface of the side of the extension 1221 facing the substrate 11 can be formed by separately made protrusions and / or grooves. In detail, the isolation structure material layer 20 may include a first isolation structure material layer and a second isolation structure material layer, please refer to Fig.17a and Fig.17b , step S12 can be implemented in the following way.

[0134] First, a first isolation structure material layer 201 is manufactured on the substrate 11 , and the first isolation structure material layer 201 is patterned to obtain the first isolation portion 121 .

[0135] Next, an auxiliary layer 30 having the same height as the first isolation portion 121 is manufactured, and a protrusion and / or a groove are formed at a position of the auxiliary layer 30 close to the first isolation portion 121 .

[0136] The auxiliary layer 30 may be an inorganic material layer (eg, a silicon oxide layer or a silicon nitride layer) or an organic material layer (eg, a photoresist layer).

[0137] Then, a second isolation structure material layer 202 is formed on a side of the auxiliary layer 30 away from the substrate 11, and the second isolation structure material layer 202 is patterned to obtain a second isolation portion 122, wherein the second isolation portion 122 includes a protrusion 161 and / or a groove 162 on a side facing the substrate 11 relative to an extension portion 1221 of the first isolation portion 121;

[0138] Finally, the auxiliary layer 30 is removed.

[0139] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a vehicle-mounted display device, a smart wearable device, a television, a laptop computer, and other devices with a display function.

[0140] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, in the direction away from the substrate, the isolation structure includes a first isolation part and a second isolation part that are stacked, the second isolation part includes an extension part that extends toward the corresponding isolation opening relative to the first isolation part, at least part of the extension part has an uneven surface on the side facing the substrate, and the packaging unit is in contact with at least the surface of the extension part on the side facing the substrate. With such a design, the contact area between the packaging unit and the uneven surface of the extension part is increased, the bonding force between the two is improved, and the two are not easy to separate. In addition, the above structure can also extend the path of water vapor or etching liquid invasion, improve the packaging effect of the packaging unit on the light-emitting device, improve the damage to the isolation structure or poor display of the light-emitting device caused by the invasion of water vapor or etching liquid, and improve the stability and display effect of the display panel.

[0141] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening on the substrate, and in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion stacked together, the second isolation portion includes an extension portion extending toward the corresponding isolation opening relative to the first isolation portion, and at least a portion of the extension portion has an uneven surface on a side facing the substrate; A light emitting device, at least part of which is located in the isolation opening; The packaging unit is located on a side of the light emitting device away from the substrate and at least contacts with a surface of the protruding portion facing the substrate.

2. The display panel according to claim 1, wherein: The light-emitting device includes a first light-emitting device and a second light-emitting device with different light-emitting colors, the isolation opening includes a first isolation opening and a second isolation opening, the first light-emitting device is at least partially located in the first isolation opening, the second light-emitting device is at least partially located in the second isolation opening, and the extension portion includes a first extension portion extending toward the first isolation opening and a second extension portion extending toward the second isolation opening; The maximum undulation height of the surface of the first extension portion facing the substrate is different from the maximum undulation height of the surface of the second extension portion facing the substrate, wherein the maximum undulation height of the surface refers to the distance between the point on the surface closest to the substrate and the point on the surface farthest from the substrate in a direction perpendicular to the plane where the substrate is located; Preferably, the maximum undulation height of the first protruding portion toward the surface of one side of the substrate is smaller than the maximum undulation height of the second protruding portion toward the surface of one side of the substrate; Preferably, a maximum undulation height of the first protruding portion toward a surface of a side of the substrate is smaller than a maximum undulation height of the first protruding portion away from a surface of a side of the substrate.

3. The display panel according to claim 2, wherein: The light emitting device further includes a third light emitting device having a light emitting color different from that of the first light emitting device and the second light emitting device, the isolation opening further includes a third isolation opening, the third light emitting device is at least partially located in the third isolation opening, and the extension portion further includes a third extension portion extending toward the third isolation opening; The maximum undulation height of the first extension portion toward the surface of one side of the substrate, the maximum undulation height of the second extension portion toward the surface of one side of the substrate, and the maximum undulation height of the third extension portion toward the surface of one side of the substrate increase in sequence.

4. The display panel according to claim 2, wherein: The light emitting device further comprises a third light emitting device having a light emitting color different from that of the first light emitting device and the second light emitting device, the isolation opening further comprises a third isolation opening, the third light emitting device is at least partially located in the third isolation opening, and the extension portion further comprises a third extension portion extending toward the third isolation opening; The maximum undulation height of the third protruding portion toward the surface of one side of the substrate is smaller than the maximum undulation height of the second protruding portion toward the surface of one side of the substrate; Preferably, a maximum undulation height of the third protruding portion away from a surface of one side of the substrate is smaller than a maximum undulation height of the first protruding portion away from a surface of one side of the substrate.

5. The display panel according to claim 2, wherein: On the uneven surface of the protruding portion facing the substrate, the maximum undulation height of the surface is 1 / 10-1 / 2 of the thickness of a portion where the orthographic projection of the second isolation portion on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate.

6. The display panel according to claim 2, wherein: In a direction perpendicular to the plane of the substrate, the minimum distance between the uneven surface of the protruding portion facing the substrate side and the substrate is less than or equal to the distance between the portion of the second isolation portion where the orthographic projection of the first isolation portion on the substrate coincides with the orthographic projection of the first isolation portion on the substrate and the substrate side.

7. The display panel according to claim 1, wherein: A protrusion and / or a groove is provided on a side of the extension portion facing the substrate; The orthographic projection of the protrusion and / or the groove on the substrate surrounds the orthographic projection of the isolation opening on the substrate; Preferably, the orthographic projections of the protrusion and / or the groove on the substrate continuously surround the orthographic projection of the isolation opening on the substrate, or the orthographic projections of the protrusion and / or the groove on the substrate discontinuously surround the orthographic projection of the isolation opening on the substrate.

8. The display panel according to claim 7, wherein: In a direction perpendicular to the plane of the substrate, the distance between the protrusion and the substrate is less than or equal to the distance between a portion of the second isolation portion where the orthographic projection on the substrate coincides with the orthographic projection of the first isolation portion on the substrate and the substrate; In a direction perpendicular to the plane of the substrate, the distance between the groove and the substrate is greater than or equal to the distance between a portion of the second isolation portion where the orthographic projection of the second isolation portion on the substrate coincides with the orthographic projection of the first isolation portion on the substrate and the substrate.

9. The display panel according to claim 8, wherein: In a direction perpendicular to the plane of the substrate, the height of the protrusion and / or the depth of the groove is 1 / 4-2 / 3 of the thickness of a portion of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate.

10. The display panel according to claim 7, wherein: In a cross section perpendicular to the plane where the substrate is located and passing through the center of the adjacent isolation opening, the cross-sectional shape of the protrusion and / or the groove includes a rectangle, a sawtooth shape, and an arc shape.

11. The display panel according to any one of claims 1 to 10, characterized in that: The display panel further comprises a pixel defining layer, wherein the pixel defining layer is located on one side of the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer includes a pixel opening, and the pixel opening is connected to the isolation opening; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate; Preferably, in the direction away from the substrate, the light-emitting device also includes a first electrode, a light-emitting material layer and a second electrode which are stacked in sequence, the first electrode is located on the side of the pixel defining layer facing the substrate, at least part of the first electrode is exposed from the pixel opening position, and the second electrode overlaps the isolation structure.

12. The display panel according to any one of claims 1 to 10, characterized in that: The isolation structure further includes a third isolation portion, in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

13. The display panel according to any one of claims 1 to 10, characterized in that: The display panel further includes a first encapsulation layer; The first encapsulation layer is located at a side of the encapsulation unit away from the substrate, and the first encapsulation layer comprises a flat surface on the side away from the substrate; Preferably, the display panel further comprises a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate; Preferably, the encapsulation unit and the second encapsulation layer include inorganic materials, and the first encapsulation layer includes organic materials.

14. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening on the substrate, in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion stacked, the second isolation portion includes an extension portion extending toward the corresponding isolation opening relative to the first isolation portion, and in a direction perpendicular to the plane where the substrate is located, at least a portion of the surface of the extension portion facing the side of the substrate includes a plurality of position areas with different distances from the substrate; A light emitting device, at least part of which is located in the isolation opening; The packaging unit is located on a side of the light emitting device away from the substrate and at least contacts with a surface of the protruding portion facing the substrate.

15. The display panel according to claim 14, wherein: The distance between part of the position area and the substrate is greater than or equal to the distance between a part of the second isolation portion where the orthographic projection on the substrate coincides with the orthographic projection of the first isolation portion on the substrate and the substrate; and / or, The distance between part of the position area and the substrate is less than or equal to the distance between a part of the second isolation portion where the orthographic projection on the substrate overlaps with the orthographic projection of the first isolation portion on the substrate and the substrate.

16. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure material layer is fabricated on the substrate, and the isolation structure material layer is patterned to obtain an isolation structure formed by stacked first isolation parts and second isolation parts in a direction away from the substrate, and at least a portion of the second isolation part relative to the extension of the first isolation part forms an uneven surface on a side facing the substrate, wherein the isolation structure encloses an isolation opening on the substrate; A light emitting device is fabricated in the isolation opening corresponding to the protruding portion having the uneven surface on the side facing the substrate; A packaging unit is manufactured on a side of the light emitting device away from the substrate, and the packaging unit is made to contact at least a surface of the protruding portion facing the substrate.

17. The method for manufacturing a display panel according to claim 16, wherein: The isolation structure material layer comprises a first isolation structure material layer and a second isolation structure material layer, and the step of patterning the isolation structure material layer to obtain an isolation structure formed by a first isolation portion and a second isolation portion stacked in a direction away from the substrate, and making at least a portion of the second isolation portion relative to an extension of the first isolation portion form an uneven surface on a side facing the substrate, comprises: Sequentially manufacturing the first isolation structure material layer and the second isolation structure material layer on the substrate; The second isolation structure material layer and the first isolation structure material layer are patterned to obtain the isolation structure, wherein the isolation structure includes the second isolation portion formed by the patterned second isolation structure material layer and the first isolation portion formed by the patterned first isolation structure material layer; The evaporated film layer in a part of the isolation opening is etched, and while removing the evaporated film layer, an etching substance is used to etch a side of the protruding portion facing the substrate to form an uneven surface.

18. The method for manufacturing a display panel according to claim 17, wherein: The isolation opening includes a first isolation opening and a second isolation opening, and the step of etching the evaporated film layer in part of the isolation opening, and etching a side of the protruding portion facing the substrate by etching a substance to form an uneven surface while removing the evaporated film layer, includes: Vapor-depositing a vapor-deposited film layer for forming a light-emitting device in the first isolation opening and the isolation opening; The evaporated film layer in the second isolation opening is removed by etching, and an uneven surface is formed by etching a side of the extended portion corresponding to the second isolation opening facing the substrate.

19. The method for manufacturing a display panel according to claim 16, wherein: The isolation structure material layer comprises a first isolation structure material layer and a second isolation structure material layer, and the step of patterning the isolation structure material layer to obtain an isolation structure formed by a first isolation portion and a second isolation portion stacked in a direction away from the substrate, and making at least a portion of the second isolation portion relative to an extension of the first isolation portion form an uneven surface on a side facing the substrate, comprises: Manufacturing the first isolation structure material layer on the substrate, and patterning the first isolation structure material layer to obtain a first isolation portion; Making an auxiliary layer having the same height as the first isolation portion, and forming a protrusion and / or a groove at a position of the auxiliary layer close to the first isolation portion; Making a second isolation structure material layer on a side of the auxiliary layer away from the substrate, and patterning the second isolation structure material layer to obtain a second isolation portion, wherein an extension of the second isolation portion relative to the first isolation portion includes a protrusion and / or a groove on a side facing the substrate; The auxiliary layer is removed.

20. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 15, or a display panel prepared by the method for preparing a display panel described in any one of claims 16 to 19.

Images