Color filter and preparation method thereof, array substrate and display device

Abstract

The invention discloses a color filter and a preparation method thereof, an array substrate and a display device. The color filter comprises a plurality of light filtering units (20) which are arranged on a substrate (10) and transmit light of different colors, and light shielding layers (30) located between the adjacent light filtering units (20) transmitting the light of different colors. The filter unit (20) comprises a first surface facing the substrate (10), a second surface deviating from the substrate, and a third surface connecting the first surface and the second surface; a light shielding layer (30) is arranged on the third surface of at least one of two adjacent light filtering units (20) transmitting light of different colors.

Description

Color filter and preparation method thereof, array substrate and display device Technical Field

[0001] The present disclosure relates to, but is not limited to, the field of display technology, and in particular to a color filter and a preparation method thereof, an array substrate, and a display device. Background Art

[0002] In some liquid crystal display (LCD) products, approximately two-thirds of the backlight is lost due to the absorption of light by the red / green / blue (R / G / B) color filters. Effectively utilizing non-absorbent color filters could potentially improve light energy efficiency. Furthermore, color filter technology based on traditional organic photoresist is limited by materials and equipment, making it difficult to further increase product resolution.

[0003] Dielectric thin-film filters utilize the interference of light in a dielectric medium and are composed of two or more layers with low and high refractive indices. If these thin-film filters can be patterned using an array process to form R / G / B dielectric films, there is a chance to overcome the limitations of existing color filter technology for high pixel density (PPI) products. This is particularly important for near-eye display products such as virtual reality (VR). For LCD products, the dielectric film formed on the substrate must be patterned to form the R / G / B dielectric films. However, the inorganic color filter processing presents several significant challenges. First, the R / G / B dielectric films have different stacking structures and thicknesses, requiring sequential processing. However, given the complexity of the process, the materials used must be as consistent as possible, which poses the risk of damage to the previous dielectric films during subsequent processing. Second, as the pixel density of the product increases, cross-linking between pixels is inevitable.

[0004] Summary of the Invention

[0005] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0006] An embodiment of the present disclosure provides a color filter, comprising a plurality of filter units that transmit light of different colors and are arranged on a substrate, and a shading layer located between adjacent filter units that transmit light of different colors; the filter units include a first surface facing the substrate, a second surface away from the substrate, and a third surface connecting the first surface and the second surface; the shading layer is provided on the third surface of at least one of two adjacent filter units that transmit light of different colors.

[0007] An embodiment of the present disclosure also provides an array substrate, comprising the color filter described above, and a circuit structure layer arranged on a side of the multiple filter units away from the substrate, the circuit structure layer comprising a transistor, a gate line, a data line and a first electrode; the transistor comprises a gate electrode, an active layer, a source electrode and a drain electrode, the gate electrode is connected to the gate line, the source electrode is connected to the data line, and the drain electrode is connected to the first electrode.

[0008] An embodiment of the present disclosure further provides a display device comprising the color filter.

[0009] The present disclosure also provides a method for preparing a color filter, comprising:

[0010] forming a plurality of first filter units on a substrate, wherein the first filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0011] forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units;

[0012] forming a plurality of second filter units on a substrate, wherein the second filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0013] Etching the plurality of first protection units, completely removing the first protection units on the second surface of the first filter unit, and at least partially retaining the first protection units on the third surface of the first filter unit, wherein the first protection units retained on the third surface of the first filter unit serve as a first light shielding layer;

[0014] forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units;

[0015] forming a plurality of third filter units on the substrate;

[0016] The multiple second protection units are etched, and the second protection units on the second surface of the first filter unit and the second protection units on the second surface of the second filter unit are removed, the second protection units on the third surface of the second filter unit are at least partially retained, and the second protection units on the first shading layer are at least partially retained; the second protection units retained on the third surface of the second filter unit and the second protection units retained on the first shading layer are the second shading layer.

[0017] The present disclosure also provides another method for preparing a color filter, including:

[0018] forming a plurality of first filter units on a substrate, wherein the first filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0019] forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units;

[0020] A plurality of second filter units are formed on a substrate, wherein the second filter units at least partially cover the first protection units on the third surfaces of the adjacent first filter units; the second filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0021] Etching the plurality of first protection units, removing the first protection units on the second surface of the first filter unit, and retaining the first protection units on the third surface of the first filter unit that are covered by the second filter unit, wherein the first protection units retained on the third surface of the first filter unit serve as a first light shielding layer;

[0022] forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units;

[0023] forming a plurality of third filter units on the substrate, wherein the third filter units at least partially cover the second protection units on the third surfaces of the adjacent first filter units, and the third filter units at least partially cover the second protection units on the third surfaces of the adjacent second filter units;

[0024] The multiple second protection units are etched, and the second protection units on the second surface of the first filter unit and the second protection units on the second surface of the second filter unit are removed, the second protection units on the third surface of the first filter unit covered by the third filter unit are retained, and the second protection units on the third surface of the second filter unit covered by the third filter unit are retained; the second protection units retained on the third surface of the first filter unit and the second protection units retained on the third surface of the second filter unit are the second shading layer.

[0025] The present disclosure also provides another method for preparing a color filter, comprising:

[0026] forming a light-shielding layer on the substrate, wherein the light-shielding layer has a grid-like structure;

[0027] forming a plurality of first filter units on the substrate, wherein the plurality of first filter units are located in the plurality of first grid holes of the light shielding layer;

[0028] forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units;

[0029] forming a plurality of second filter units on the substrate, wherein the plurality of second filter units are located in the plurality of second grid holes of the light shielding layer;

[0030] removing the plurality of first protection units to expose a surface of the first filter unit away from the substrate;

[0031] forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units;

[0032] forming a plurality of third filter units on the substrate, wherein the plurality of third filter units are located in the plurality of third grid holes of the light shielding layer;

[0033] The plurality of second protection units are removed to expose a surface of the first filter unit away from the substrate and a surface of the second filter unit away from the substrate.

[0034] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are intended to provide a further understanding of the technical solutions of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solutions of the present disclosure and do not constitute a limitation of the technical solutions of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual scale and are intended only to illustrate the contents of the present disclosure.

[0036] FIG1 is a schematic top view of a color filter layer according to some exemplary embodiments;

[0037] FIG2 is a schematic diagram of the AA cross-sectional structure of FIG1 in some exemplary embodiments;

[0038] FIG3 is a schematic diagram of the AA cross-sectional structure of FIG1 in some other exemplary embodiments;

[0039] FIG4 is a schematic diagram of the AA cross-sectional structure of FIG1 in some further exemplary embodiments;

[0040] FIG5a-1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of first filter units according to some exemplary embodiments;

[0041] FIG5a-2 is a schematic top view of the structure of a color filter after forming a plurality of first filter units according to some exemplary embodiments;

[0042] FIG5 b is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first protective layer according to some exemplary embodiments;

[0043] FIG5 c is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first photoresist according to some exemplary embodiments;

[0044] FIG5 d is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of second filter units according to some exemplary embodiments;

[0045] FIG5e-1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first light-shielding layer according to some exemplary embodiments;

[0046] FIG5e-2 is a schematic top view of the color filter structure after forming the first light-shielding layer according to some exemplary embodiments;

[0047] FIG5 f is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second protective layer according to some exemplary embodiments;

[0048] FIG5 g is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second photoresist according to some exemplary embodiments;

[0049] FIG5h is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of third filter units according to some exemplary embodiments;

[0050] FIG5i is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second light-shielding layer according to some exemplary embodiments;

[0051] FIG6a-1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of first filter units according to some other exemplary embodiments;

[0052] FIG6a-2 is a schematic top view of the structure of a color filter after forming a plurality of first filter units according to other exemplary embodiments;

[0053] FIG6 b is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first protective layer according to some other exemplary embodiments;

[0054] FIG6 c is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first photoresist according to some other exemplary embodiments;

[0055] FIG6 d is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of second filter units according to some other exemplary embodiments;

[0056] FIG6e-1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first light-shielding layer according to some other exemplary embodiments;

[0057] FIG6e-2 is a schematic top view of the structure of the color filter after forming the first light-shielding layer according to some other exemplary embodiments;

[0058] FIG6 f is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second protective layer according to some other exemplary embodiments;

[0059] FIG6 g is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second photoresist according to some other exemplary embodiments;

[0060] FIG6h is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of third filter units according to some other exemplary embodiments;

[0061] FIG6i is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second light-shielding layer according to some other exemplary embodiments;

[0062] FIG7 a - 1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming a light shielding layer according to some further exemplary embodiments;

[0063] FIG7a-2 is a schematic top view of the structure of color filters after forming a light shielding layer according to some other exemplary embodiments;

[0064] FIG7 b is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first filter film according to some other exemplary embodiments;

[0065] FIG7 c is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first photoresist according to some further exemplary embodiments;

[0066] FIG7 d - 1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of first filter units according to some further exemplary embodiments;

[0067] FIG7 d - 2 is a schematic top view of the structure of a color filter after forming a plurality of first filter units according to some further exemplary embodiments;

[0068] FIG7e is a schematic diagram of a partial cross-sectional structure of a color filter after forming a first protective layer according to some further exemplary embodiments;

[0069] FIG7 f is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of second filter units according to some further exemplary embodiments;

[0070] FIG7g is a schematic diagram of a partial cross-sectional structure of a color filter after the first protective layer is removed according to some other exemplary embodiments;

[0071] FIG7h is a schematic diagram of a partial cross-sectional structure of a color filter after forming a second protective layer according to some other exemplary embodiments;

[0072] FIG7i is a schematic diagram of a partial cross-sectional structure of a color filter after forming a plurality of third filter units according to some further exemplary embodiments;

[0073] FIG7j is a schematic diagram of a partial cross-sectional structure of a color filter after the second protective layer is removed according to some other exemplary embodiments;

[0074] FIG8 is a schematic diagram of a partial cross-sectional structure of an array substrate according to some exemplary embodiments;

[0075] FIG9 is a schematic structural diagram of a display device according to some exemplary embodiments;

[0076] FIG. 10 is a schematic structural diagram of display devices according to some other exemplary embodiments. DETAILED DESCRIPTION

[0077] Those skilled in the art should understand that the technical solutions of the embodiments of the present disclosure may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the embodiments of the present disclosure, and all should be included in the scope of the claims of the present disclosure.

[0078] As shown in Figures 1, 2 and 3, Figure 1 is a schematic diagram of a top view of a color filter layer in some exemplary embodiments, Figure 2 is a schematic diagram of an AA cross-sectional structure of Figure 1 in some exemplary embodiments, and Figure 3 is a schematic diagram of an AA cross-sectional structure of Figure 1 in other exemplary embodiments. The color filter includes a plurality of filter units 20 that transmit light of different colors and are provided on a substrate 10 (Figure 1 illustrates a plurality of first filter units 21 that transmit light of a first color, a plurality of second filter units 22 that transmit light of a second color, and a plurality of third filter units 23 that transmit light of a third color), with and a light-shielding layer 30 located between adjacent filter units 20 that transmit light of different colors; the filter unit 20 includes a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface connecting the first surface and the second surface (FIG. 2 illustrates the third surface 201 of the first filter unit 21, the third surface 202 of the second filter unit 22, and the third surface 203 of the third filter unit 23); the light-shielding layer 30 is provided on the third surface of at least one of the two adjacent filter units 20 that transmit light of different colors.

[0079] The color filter of the disclosed embodiments can avoid light crosstalk between two adjacent filter units that transmit light of different colors by providing the light-shielding layer 30. Furthermore, the light-shielding layer 30 is provided on the third surface of the filter unit. Thus, during the preparation process of the color filter of some exemplary embodiments, a protective film layer can be formed to cover a filter unit that transmits a certain color of light after forming that filter unit. This protective film layer can prevent damage to the previously formed filter unit during the subsequent preparation of other filter units. Furthermore, after the subsequent filter units are prepared, the protective film layer can be removed using an etching process. During the etching process, the protective film layer may remain on the third surface of the filter unit, and the protective film layer remaining on the third surface of the filter unit can serve as the light-shielding layer 30. Therefore, the light-shielding layer 30 is provided on the third surface of the filter unit. Thus, in the preparation process of the color filter of some exemplary embodiments, the same film layer can be used to protect the previously prepared filter unit and to form the light-shielding layer 30, thereby preventing the previously prepared filter unit from being damaged in subsequent processes and simplifying the preparation process of the color filter.

[0080] In some exemplary embodiments, as shown in FIG. 2 , the slope angle of the third surface of at least one of two adjacent filter units that transmit light of different colors is 70 degrees to 90 degrees.

[0081] When dry etching is used to etch the film layer covering the large slope angle pattern, since the absolute thickness of the large slope angle pattern in the direction perpendicular to the substrate 10 is large, the etched film layer is likely to remain at the large slope angle position. Therefore, in some embodiments, the large slope angle of the third surface of the filter unit can be utilized to form the light-shielding layer 30 on the third surface of the filter unit.

[0082] In some exemplary embodiments, as shown in FIG1 and FIG2 , the plurality of filter units include a plurality of first filter units 21 that transmit a first color of light, a plurality of second filter units 22 that transmit a second color of light, and a plurality of third filter units 23 that transmit a third color of light. The light-shielding layer 30 may not be provided on the third surface of the plurality of first filter units 21, the plurality of second filter units 22, or the plurality of third filter units 23. For example, in the example of FIG2 , the light-shielding layer 30 is provided on both the third surface 201 of the first filter unit 21 and the third surface 202 of the second filter unit 22, but not on the third surface 203 of the third filter unit 23.

[0083] In some examples of this embodiment, as shown in FIG2 , the first filter unit 21, the second filter unit 22, or the third filter unit 23 serves as a reference filter unit. The light-shielding layer 30 between the reference filter unit and the adjacent filter unit includes a first light-shielding layer 31 and a second light-shielding layer 32. The first light-shielding layer 31 is disposed on the third surface of the reference filter unit, and the second light-shielding layer 32 is at least partially disposed on a side of the first light-shielding layer 31 away from the reference filter unit. For example, in the example of FIG2 , the first filter unit 21 serves as the reference filter unit.

[0084] In some exemplary embodiments, as shown in FIG. 2 , at least two adjacent filter units transmitting light of different colors have an overlapping portion, and the orthographic projection of the light shielding layer 30 on the substrate 10 includes the orthographic projection of the overlapping portion on the substrate 10 .

[0085] In some exemplary embodiments, as shown in FIG. 2 , the orthographic projections of the third surfaces of at least two adjacent filter units transmitting light of different colors on the substrate 10 overlap, and the orthographic projections of the second surfaces on the substrate 10 do not overlap.

[0086] In some exemplary embodiments, as shown in FIG2 , the material of the light shielding layer 30 may be metal, and the thickness of the light shielding layer 30 may be not less than This ensures the light-blocking effect.

[0087] In some exemplary embodiments, as shown in FIG. 3 , adjacent filter units transmitting light of different colors have overlapping portions, and the light shielding layer 30 is at least partially located between the overlapping portions.

[0088] In some examples of this embodiment, as shown in FIG3 , a portion of the light-shielding layer 30 is located on the third surface of the overlapping portion, and another portion extends in a direction parallel to the substrate 10. The light-shielding layer 30 may not be provided on the third surface of the non-overlapping portion of adjacent filter units that transmit light of different colors.

[0089] In some exemplary embodiments, as shown in Figures 2 and 3, the light-shielding layer 30 completely covers the edge of the third surface close to the substrate 10 and extends a portion thereof in a direction parallel to the substrate 10. This can improve the light-shielding effect and reduce light crosstalk between adjacent filter units that transmit light of different colors.

[0090] In some examples of this embodiment, the light shielding layer 30 may extend 0.5um to 3um in a direction parallel to the substrate 10, that is, in FIG. 2 , d is 0.5um to 3um, thus achieving a better light shielding effect.

[0091] In some exemplary embodiments, as shown in FIG2 , the first filter unit 21 can transmit red light and reflect light of other colors except red, the second filter unit 22 can transmit green light and reflect light of other colors except green, and the third filter unit 23 can transmit blue light and reflect light of other colors except blue. The multiple filter units of the color filter can include only three types of filter units that transmit red light, green light, and blue light, respectively. The multiple filter units of the color filter can include multiple groups of filter units, each group of filter units including a first filter unit 21, a second filter unit 22, and a third filter unit 23. The three filter units of each group of filter units can be arranged in a straight line or in a triangle. In other embodiments, the multiple filter units of the color filter can include four types of filter units that transmit red light, green light, blue light, and white light (or yellow light), respectively. The present disclosure does not limit the type and arrangement of the filter units of the color filter.

[0092] In some exemplary embodiments, as shown in FIG. 4 , which is a schematic diagram of the AA cross-sectional structure of FIG. 1 in yet other exemplary embodiments, the light shielding layer 30 is a grid-like structure, and the material of the light shielding layer 30 is copper.

[0093] In some exemplary embodiments, the first filter unit 21, the second filter unit 22, and the third filter unit 23 may each include a plurality of stacked inorganic film layers, wherein the plurality of inorganic film layers include at least one low refractive index film layer and at least one high refractive index film layer. The material of the low refractive index film layer may be silicon dioxide (SiO2), magnesium fluoride (MgF2), etc., and the material of the high refractive index film layer may be silicon nitride (SiN), titanium dioxide (TiO2), titanium pentoxide (Ti2O5), niobium pentoxide (Nb2O5), zirconium dioxide (ZrO2), yttrium trioxide (Y2O3), zinc sulfide (ZnS), etc. The thickness of the first filter unit 21, the second filter unit 22, and the third filter unit 23 may be to Considering the film stress and filtering effect, the thickness can be to The first filter unit 21 can transmit the first color light and reflect light of other colors except the first color light, the second filter unit 22 can transmit the second color light and reflect light of other colors except the second color light, and the third filter unit 23 can transmit the third color light and reflect light of other colors except the third color light. In this way, in some products that use the color filter of this example, such as liquid crystal display devices, the light reflected by the color filter can be reflected by the backlight source assembly and then re-enter the color filter, which can improve the utilization rate of the light.

[0094] In some exemplary embodiments, the substrate 10 may be a transparent hard substrate or a transparent soft substrate, such as a glass substrate, a polyimide (PI) substrate, etc.

[0095] The following illustrates the structure of a color filter through the fabrication process. The "patterning process" referred to in this disclosure includes processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping for metallic, inorganic, or transparent conductive materials. For organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed by any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed by any one or more of spraying, spin coating, and inkjet printing; and etching can be performed by any one or more of dry etching and wet etching, although this disclosure does not limit these processes. A "thin film" refers to a thin layer of a material deposited on a substrate using deposition, coating, or other processes. If the thin film does not require a patterning process during the entire fabrication process, it can also be referred to as a "layer." If a patterning process is required during the entire fabrication process, the film before the patterning process is referred to as a "thin film," and the film after the patterning process is referred to as a "layer." The "layer" after the patterning process contains at least one "pattern." The "thickness" of a film layer is the dimension of the film layer perpendicular to the substrate. In the exemplary embodiments of the present disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0096] In some exemplary embodiments, taking the color filter shown in FIG. 2 as an example, the preparation process of the color filter may include the following operations:

[0097] (1) A multilayer dielectric film is deposited on a glass substrate 10 to form a first filter film, and the first filter film is patterned to form a plurality of first filter units 21, as shown in FIG5a-1 and FIG5a-2. FIG5a-1 is a schematic diagram of a partial cross-sectional structure of a color filter of some exemplary embodiments after forming a plurality of first filter units 21, and FIG5a-2 is a schematic diagram of a top view structure of a color filter of some exemplary embodiments after forming a plurality of first filter units 21. FIG5a-1 illustrates one first filter unit 21, and FIG5a-2 illustrates a plurality of first filter units 21.

[0098] Illustratively, the first filter unit 21 includes a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface 201 connecting the first surface and the second surface. The cross-section of the first filter unit 21 may be a trapezoid.

[0099] During the patterning process of this step, dry etching may be used to ensure that the slope angle of the third surface 201 of the plurality of first filter units 21 is 70 degrees to 90 degrees.

[0100] (2) A first protective film is deposited on the substrate 10 on which the aforementioned pattern is formed, and the first protective film is patterned to form a first protective layer 310. The first protective layer 310 includes a plurality of first protective units 311, and the plurality of first protective units 311 are correspondingly covered on the plurality of first filter units 21. The second surface and the third surface 201 of each first filter unit 21 are completely covered by the first protective unit 311. The first protective unit 311 can prevent damage to the first filter unit 21 during the subsequent preparation of the second filter unit 22 or the third filter unit 23. As shown in FIG. 5 b, FIG. 5 b illustrates a first filter unit 21 and a first protective unit 311.

[0101] For example, the material of the first protection unit 311 can be metal, such as molybdenum (Mo), titanium (Ti) and other metals that are easy to dry etch. In addition, for light shielding considerations, the thickness of the metal layer can be no less than The edge of each first protection unit 311 may extend beyond the edge of the first surface of the first filter unit 21 by 0.5 μm to 3 μm.

[0102] (3) A multilayer dielectric film is deposited on the substrate 10 having the aforementioned pattern to form a second filter film 220, and the second filter film 220 is patterned to form a plurality of second filter units 22. For example, the second filter unit 22 includes a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface 202 connecting the first surface and the second surface. The cross-sectional shape of the second filter unit 22 can be trapezoidal. The slope angle of the third surface 202 of the second filter unit 22 can be 70 degrees to 90 degrees. Adjacent second filter units 22 and first filter units 21 can overlap, as shown in Figures 5c and 5d. The process of patterning the second filter film 220 to form a plurality of second filter units 22 can include: coating photoresist, mask exposure, development, etching, and other processes. Figures 5c and 5d illustrate the photoresist (first photoresist 41) after development in this process.

[0103] Subsequently, the plurality of first protection units 311 are etched to form a first light-shielding layer 31. When dry etching the film layer covering the large-angle pattern, due to the large absolute thickness of the large-angle pattern in the direction perpendicular to the substrate 10, it is easy for the etched film layer to remain at the large-angle position. Therefore, after etching the first protection units 311 on the first filter unit 21, the first protection units 311 will remain on the third surface 201 of the first filter unit 21. The remaining first protection units 311 serve as the first light-shielding layer 31. As shown in Figures 5e-1 and 5e-2, Figure 5e-1 is a schematic diagram of the partial cross-sectional structure of the color filter after the first light-shielding layer 31 is formed in some exemplary embodiments, and Figure 5e-2 is a schematic diagram of the top view of the color filter after the first light-shielding layer 31 is formed in some exemplary embodiments.

[0104] (4) A second protective film is deposited on the substrate 10 on which the aforementioned pattern is formed, and the second protective film is patterned to form a second protective layer 320. The second protective layer 320 includes a plurality of second protective units 321, each of which completely covers a first filter unit 21 and a second filter unit 22 adjacent to the first filter unit 21, and a portion of each second protective unit 321 covers the first light shielding layer 31. The second protective unit 321 can prevent damage to the first filter unit 21 and the second filter unit 22 during the subsequent preparation of the third filter unit 23. As shown in FIG5f, FIG5f illustrates a second protective unit 321.

[0105] For example, the material of the second protection unit 321 can be metal, such as molybdenum (Mo), titanium (Ti) and other metals that are easy to dry etch. The material of the second protection unit 321 can be the same as that of the first protection unit 311. In addition, for light shielding considerations, the thickness of the second protection unit 321 can be no less than The edge of each second protection unit 321 may extend beyond the edge of the first surface of the second filter unit 22 by 0.5 um to 3 um.

[0106] (5) A multilayer dielectric film is deposited on the substrate 10 on which the aforementioned pattern is formed to form a third filter film 230, and the third filter film 230 is patterned to form a plurality of third filter units 23. For example, the third filter unit 23 includes a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface 203 connecting the first surface and the second surface. The cross-sectional shape of the third filter unit 23 can be a trapezoid. Adjacent third filter units 23 and second filter units 22 can overlap, and adjacent third filter units 23 and first filter units 21 can overlap. For high PPI products, adjacent filter units that transmit light of different colors will inevitably overlap. As shown in Figures 5g and 5h. The process of patterning the third filter film 230 to form a plurality of third filter units 23 may include: coating photoresist, mask exposure, development, etching, and other processes. Figures 5g and 5h illustrate the photoresist (second photoresist 42) after development in this process.

[0107] Subsequently, the plurality of second protection units 321 are etched to form a second light-shielding layer 32. After etching the second protection units 321 on the first filter unit 21 and the second filter unit, residues of the second protection units 321 remain on the first light-shielding layer 31 and the third surface 202 of the second filter unit 22. The residues of the second protection units 321 serve as the second light-shielding layer 32. The light-shielding layer 30 between adjacent first filter units 21 and second filter units 22 includes the first light-shielding layer 31 and the second light-shielding layer 32. The light-shielding layer 30 between adjacent first filter units 21 and third filter units 23 includes the first light-shielding layer 31 and the second light-shielding layer 32. The light-shielding layer 30 between adjacent second filter units 22 and third filter units 23 serves as the second light-shielding layer 32. This is shown in FIG5i and FIG2.

[0108] Based on the color filter illustrated in FIG2 and the preparation process of the color filter illustrated in FIG5a to FIG5i, an embodiment of the present disclosure further provides a method for preparing the color filter, including:

[0109] forming a plurality of first filter units on a substrate, wherein the first filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0110] forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units;

[0111] forming a plurality of second filter units on a substrate, wherein the second filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0112] Etching the plurality of first protection units, completely removing the first protection units on the second surface of the first filter unit, and at least partially retaining the first protection units on the third surface of the first filter unit, wherein the first protection units retained on the third surface of the first filter unit serve as a first light shielding layer;

[0113] forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units;

[0114] forming a plurality of third filter units on the substrate;

[0115] The multiple second protection units are etched, and the second protection units on the second surface of the first filter unit and the second protection units on the second surface of the second filter unit are removed, the second protection units on the third surface of the second filter unit are at least partially retained, and the second protection units on the first shading layer are at least partially retained; the second protection units retained on the third surface of the second filter unit and the second protection units retained on the first shading layer are the second shading layer.

[0116] In some other exemplary embodiments, taking the color filter shown in FIG. 3 as an example, the preparation process of the color filter may include the following operations:

[0117] (1) A multilayer dielectric film is deposited on a glass substrate 10 to form a first filter film, and the first filter film is patterned to form a plurality of first filter units 21, as shown in FIG6a-1 and FIG6a-2. FIG6a-1 is a schematic diagram of a partial cross-sectional structure of a color filter of some exemplary embodiments after forming a plurality of first filter units 21, and FIG6a-2 is a schematic diagram of a top view structure of a color filter of some exemplary embodiments after forming a plurality of first filter units 21. FIG6a-1 illustrates one first filter unit 21, and FIG6a-2 illustrates a plurality of first filter units 21.

[0118] Illustratively, the first filter unit 21 includes a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface 201 connecting the first surface and the second surface. The cross-section of the first filter unit 21 may be a trapezoid.

[0119] During the patterning process of this step, dry etching may be used to ensure that the slope angle of the third surface 201 of the plurality of first filter units 21 is 70 degrees to 90 degrees.

[0120] (2) A first protective film is deposited on the substrate 10 on which the aforementioned pattern is formed, and the first protective film is patterned to form a first protective layer 310. The first protective layer 310 includes a plurality of first protective units 311, and the plurality of first protective units 311 are correspondingly covered on the plurality of first filter units 21. The second surface and the third surface 201 of each first filter unit 21 are completely covered by the first protective unit 311. The first protective unit 311 can prevent damage to the first filter unit 21 during the subsequent preparation of the second filter unit 22 or the third filter unit 23. As shown in FIG. 6 b, FIG. 6 b illustrates a first filter unit 21 and a first protective unit 311.

[0121] For example, the material of the first protection unit 311 can be metal, such as copper (Cu), aluminum (Al), molybdenum-niobium alloy (MoNb) or molybdenum-nickel-titanium alloy (MoNiTi), which is not easy to dry etch. In addition, for light shielding considerations, the thickness of the metal layer can be not less than The edge of each first protection unit 311 may extend beyond the edge of the first surface of the first filter unit 21 by 0.5 μm to 3 μm.

[0122] (3) A second filter film 220 is formed by depositing multiple layers of dielectric films on the substrate 10 having the aforementioned pattern. The second filter film 220 is patterned to form a plurality of second filter units 22. The second filter units 22 overlap with the third surface 201 of the adjacent first filter unit 21. The second filter units 22 at least partially cover the first protective units 311 on the third surface 201 of the adjacent first filter unit 21. For example, the second filter units 22 cover the first protective units 311 on the third surface 201 of the adjacent first filter unit 21 near one end of the substrate 10. The second filter units 22 include a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface 202 connecting the first and second surfaces. The cross-sectional shape of the second filter units 22 can be trapezoidal. The slope angle of the third surface 202 of the second filter units 22 can be 70 to 90 degrees, as shown in Figures 6c and 6d. The process of patterning the second filter film 220 to form a plurality of second filter units 22 may include: coating photoresist, mask exposure, development, etching and other processes. FIG. 6 c and FIG. 6 d illustrate the photoresist (first photoresist 41 ) after development in this process.

[0123] Subsequently, wet etching can be used to etch the multiple first protection units 311, and the first protection units 311 on the second surface of the first filter unit 21 are removed. The first protection units 311 on the third surface 201 of the first filter unit 21, which are covered by the second filter unit 22, are retained. The first protection units 311 retained on the third surface 201 of the first filter unit 21 constitute the first light-shielding layer 31. The first light-shielding layer 31 is located on the third surface 201 of the first filter unit 21 and is covered by the second filter unit 22. As shown in Figures 6e-1 and 6e-2, Figure 6e-1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming the first light-shielding layer 31 in some exemplary embodiments, and Figure 6e-2 is a schematic diagram of a top-down structure of a color filter after forming the first light-shielding layer 31 in some exemplary embodiments.

[0124] (4) A second protective film is deposited on the substrate 10 on which the aforementioned pattern is formed, and the second protective film is patterned to form a second protective layer 320. The second protective layer 320 includes a plurality of second protective units 321, each of which completely covers a first filter unit 21 and a second filter unit 22 adjacent to the first filter unit 21. The second protective unit 321 can prevent damage to the first filter unit 21 and the second filter unit 22 during the subsequent preparation of the third filter unit 23. As shown in FIG6f, FIG6f illustrates a second protective unit 321.

[0125] For example, the material of the second protection unit 321 can be metal, such as copper (Cu), aluminum (Al), molybdenum-niobium alloy (MoNb) or molybdenum-nickel-titanium alloy (MoNiTi), which is not easy to dry etch. The material of the second protection unit 321 can be the same as that of the first protection unit 311. In addition, for light shielding considerations, the thickness of the second protection unit 321 can be no less than The edge of each second protection unit 321 may extend beyond the edge of the first surface of the first filter unit 21 and the edge of the first surface of the second filter unit 22 by 0.5 μm to 3 μm.

[0126] (5) A multilayer dielectric film is deposited on the substrate 10 having the aforementioned pattern to form a third filter film 230. The third filter film 230 is patterned to form a plurality of third filter units 23. The third filter unit 23 overlaps with the adjacent second filter unit 22, and the third filter unit 23 overlaps with the adjacent first filter unit 21. The third filter unit 23 at least partially covers the second protective unit 321 on the third surface 201 of the adjacent first filter unit 21, and the third filter unit 23 at least partially covers the second protective unit 321 on the third surface 202 of the adjacent second filter unit 22. For example, the third filter unit 23 covers the second protective unit 321 on the third surface 202 of the adjacent second filter unit 22 near one end of the substrate 10, and the third filter unit 23 covers the second protective unit 321 on the third surface 201 of the adjacent first filter unit 21 near one end of the substrate 10. For high-PPI products, adjacent filter units transmitting different colors of light inevitably overlap. For example, the third filter unit 23 includes a first surface facing the substrate 10, a second surface facing away from the substrate 10, and a third surface 203 connecting the first and second surfaces. The cross-sectional shape of the third filter unit 23 can be trapezoidal, as shown in Figures 6g and 6h. The process of patterning the third filter film 230 to form multiple third filter units 23 can include steps such as applying photoresist, mask exposure, development, and etching. Figures 6g and 6h illustrate the developed photoresist (second photoresist 42) during this process.

[0127] Subsequently, wet etching can be used to etch the multiple second protection units 321, and the second protection units 321 on the second surface of the first filter unit 21 and the second protection units 321 on the second surface of the second filter unit 22 are removed, and the second protection units 321 on the third surface 201 of the first filter unit 21 covered by the third filter unit 23 are retained, and the second protection units 321 on the third surface 202 of the second filter unit 22 covered by the third filter unit 23 are retained; the second protection units 321 retained on the third surface 201 of the first filter unit 21 and the second protection units 321 retained on the third surface 202 of the second filter unit 22 are the second shading layer 32. The light shielding layer 30 between the adjacent first filter unit 21 and the second filter unit 22 is the first light shielding layer 31, the light shielding layer 30 between the adjacent first filter unit 21 and the third filter unit 23 is the second light shielding layer 32, and the light shielding layer 30 between the adjacent second filter unit 22 and the third filter unit 23 is the second light shielding layer 32, as shown in FIG6i and FIG3.

[0128] Based on the color filter illustrated in FIG3 and the preparation process of the color filter illustrated in FIG6a to FIG6i, an embodiment of the present disclosure further provides a method for preparing the color filter, including:

[0129] forming a plurality of first filter units on a substrate, wherein the first filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0130] forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units;

[0131] A plurality of second filter units are formed on a substrate, wherein the second filter units at least partially cover the first protection units on the third surfaces of the adjacent first filter units; the second filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface;

[0132] Etching the plurality of first protection units, removing the first protection units on the second surface of the first filter unit, and retaining the first protection units on the third surface of the first filter unit that are covered by the second filter unit, wherein the first protection units retained on the third surface of the first filter unit serve as a first light shielding layer;

[0133] forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units;

[0134] forming a plurality of third filter units on the substrate, wherein the third filter units at least partially cover the second protection units on the third surfaces of the adjacent first filter units, and the third filter units at least partially cover the second protection units on the third surfaces of the adjacent second filter units;

[0135] The multiple second protection units are etched, and the second protection units on the second surface of the first filter unit and the second protection units on the second surface of the second filter unit are removed, the second protection units on the third surface of the first filter unit covered by the third filter unit are retained, and the second protection units on the third surface of the second filter unit covered by the third filter unit are retained; the second protection units retained on the third surface of the first filter unit and the second protection units retained on the third surface of the second filter unit are the second shading layer.

[0136] In some further exemplary embodiments, taking the color filter shown in FIG. 4 as an example, the preparation process of the color filter may include the following operations:

[0137] (1) A copper (Cu) metal grid is formed on a glass substrate 10 using an electroplating process to form a light-shielding layer 30. This is shown in Figures 7a-1 and 7a-2. Figure 7a-1 is a schematic diagram of a partial cross-sectional structure of a color filter after forming the light-shielding layer 30 in some exemplary embodiments, and Figure 7a-2 is a schematic diagram of a top view of the color filter after forming the light-shielding layer 30 in some exemplary embodiments.

[0138] For example, the copper metal grid can be produced using an additive process. Considering high PPI requirements, the copper metal width can be 1 to 3 μm. The height of the copper metal grid can be increased by 2 to 5 μm, depending on the thickness of the filter unit. This can completely isolate adjacent filter units. The copper metal grid acts as a light shield, preventing subsequent crosstalk between adjacent filter units that transmit light of different colors.

[0139] (2) Depositing a multilayer dielectric film on the glass substrate 10 to form a first filter film 210, as shown in FIG7b ; patterning the first filter film 210 to form a plurality of first filter units 21, wherein the plurality of first filter units 21 are located within the plurality of first mesh holes of the copper metal mesh. As shown in FIG7d-1 and FIG7d-2 , FIG7d-1 is a schematic diagram of a partial cross-sectional structure of a color filter according to some exemplary embodiments after forming the plurality of first filter units 21, and FIG7d-2 is a schematic diagram of a top view of a color filter according to some exemplary embodiments after forming the plurality of first filter units 21. FIG7d-1 illustrates one first filter unit 21, and FIG7d-2 illustrates a plurality of first filter units 21.

[0140] Among them, the process of patterning the first filter film 210 to form multiple first filter units 21 may include: coating photoresist, mask exposure, development, etching and other processes. Figure 7c is a structural schematic diagram of some exemplary embodiments of the color filter after the photoresist (first photoresist 41) is developed during the process of patterning to form multiple first filter units 21.

[0141] (3) A first protective film is deposited on the substrate 10 on which the aforementioned pattern is formed, and the first protective film is patterned to form a first protective layer 310. The first protective layer 310 includes a plurality of first protective units 311, and the plurality of first protective units 311 are correspondingly covered on the plurality of first filter units 21, and each first filter unit 21 can be completely covered by the first protective unit 311. The first protective unit 311 can prevent damage to the first filter unit 21 during the subsequent preparation of the second filter unit 22 or the third filter unit 23. As shown in FIG. 7e, FIG. 7e illustrates a first filter unit 21 and a first protective unit 311.

[0142] Exemplarily, the material of the first protection unit 311 may be other metals except copper, such as aluminum (Al), molybdenum-niobium alloy (MoNb), or molybdenum-nickel-titanium alloy (MoNiTi).

[0143] (4) A second filter film is formed by depositing multiple layers of dielectric films on the substrate 10 having the aforementioned pattern. The second filter film is patterned to form a plurality of second filter units 22. The plurality of second filter units 22 are located within the plurality of second mesh holes of the copper metal mesh, as shown in FIG. 7f.

[0144] Subsequently, the plurality of first protection units 311 are removed, and the surface of the first filter unit 21 away from the substrate 10 is exposed, as shown in FIG7g .

[0145] (5) A second protective film is deposited on the substrate 10 having the aforementioned pattern formed thereon, and the second protective film is patterned to form a second protective layer 320. The second protective layer 320 includes a plurality of second protective units 321, each of which completely covers a first filter unit 21 and a second filter unit 22 adjacent to the first filter unit 21. The second protective unit 321 can prevent damage to the first filter unit 21 and the second filter unit 22 during the subsequent preparation of the third filter unit 23. As shown in FIG7h, FIG7h illustrates a second protective unit 321.

[0146] For example, the material of the second protection unit 321 may be other metals besides copper, such as aluminum (Al), molybdenum-niobium alloy (MoNb), or molybdenum-nickel-titanium alloy (MoNiTi). The material of the second protection unit 321 may be the same as that of the first protection unit 311 .

[0147] (6) A third filter film is formed by depositing multiple layers of dielectric films on the substrate 10 having the aforementioned pattern. The third filter film is patterned to form a plurality of third filter units 23. The plurality of third filter units 23 are located within the plurality of third grid holes of the copper metal grid, as shown in FIG. 7i.

[0148] Among them, the process of patterning the third filter film to form multiple third filter units 23 may include: coating photoresist, mask exposure, development, etching and other processes. Figure 7i is a structural schematic diagram of the color filter of some exemplary embodiments after the photoresist (second photoresist 42) is developed during the process of patterning to form multiple third filter units 23.

[0149] Subsequently, the plurality of second protection units 321 are removed, and the surface of the first filter unit 21 away from the substrate 10 and the surface of the second filter unit 22 away from the substrate 10 are exposed, as shown in FIG7j.

[0150] (7) A wet etching process is used to reduce the thickness of the copper metal grid so that the thickness of the copper metal grid is approximately the same as that of the filter unit. The difference in thickness between the copper metal grid and the filter unit can be within ± 1 μm, as shown in FIG4 . In the wet etching process, due to the wettability of the wet etching, the etching time needs to be controlled to prevent the thickness of the copper metal grid from being too small.

[0151] Based on the color filter illustrated in FIG4 and the preparation process of the color filter illustrated in FIG7a to FIG7j, an embodiment of the present disclosure further provides a method for preparing the color filter, including:

[0152] forming a light-shielding layer on the substrate, wherein the light-shielding layer has a grid-like structure;

[0153] forming a plurality of first filter units on the substrate, wherein the plurality of first filter units are located in the plurality of first grid holes of the light shielding layer;

[0154] forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units;

[0155] forming a plurality of second filter units on the substrate, wherein the plurality of second filter units are located in the plurality of second grid holes of the light shielding layer;

[0156] removing the plurality of first protection units to expose a surface of the first filter unit away from the substrate;

[0157] forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units;

[0158] forming a plurality of third filter units on the substrate, wherein the plurality of third filter units are located in the plurality of third grid holes of the light shielding layer;

[0159] The plurality of second protection units are removed to expose a surface of the first filter unit away from the substrate and a surface of the second filter unit away from the substrate.

[0160] An embodiment of the present disclosure also provides an array substrate, as shown in Figure 8, which is a schematic diagram of a partial cross-sectional structure of an array substrate of some exemplary embodiments, wherein the array substrate includes a color filter 51 of an embodiment of the present disclosure, and the array substrate also includes a circuit structure layer 52 arranged on a side of the multiple filter units away from the substrate 10, the circuit structure layer 52 includes a transistor, a gate line, a data line and a first electrode; the transistor includes a gate electrode, an active layer, a source electrode and a drain electrode, the gate electrode is connected to the gate line, the source electrode is connected to the data line, and the drain electrode is connected to the first electrode.

[0161] The present disclosure also provides a display device including the color filter of the present disclosure. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system.

[0162] In some exemplary embodiments, as shown in FIG9 , which is a schematic structural diagram of a display device according to some exemplary embodiments, the display device may be a liquid crystal display device, comprising a backlight assembly 61 and a display panel 62 disposed on the light-emitting side of the backlight assembly 61. The display panel 62 comprises a color filter substrate 621 and an array substrate 622 arranged in a pair, a liquid crystal 625 positioned between the array substrate 622 and the color filter substrate 621, an upper polarizer 624 disposed on a side of the array substrate 622 facing away from the color filter substrate 621, and a lower polarizer 623 disposed on a side of the color filter substrate 621 facing away from the array substrate 622. The color filter substrate 621 includes a color filter according to an embodiment of the present disclosure. The color filter substrate 621 may be disposed between the array substrate 622 and the backlight assembly 61.

[0163] In other exemplary embodiments, as shown in FIG10 , which is a schematic structural diagram of a display device according to other exemplary embodiments, the display device may be a liquid crystal display device, comprising a backlight assembly 61, a display panel 62 disposed on the light-emitting side of the backlight assembly 61, and a color filter 63 according to an embodiment of the present disclosure disposed between the display panel 62 and the light-emitting surface of the backlight assembly 61. The display panel 62 comprises a color filter substrate 621 and an array substrate 622 arranged in a pair, a liquid crystal 625 disposed between the array substrate 622 and the color filter substrate 621, a lower polarizer 623 disposed on a side of the array substrate 622 facing away from the color filter substrate 621, and an upper polarizer 624 disposed on a side of the color filter substrate 621 facing away from the array substrate 622. The array substrate 622 may be disposed between the color filter substrate 621 and the backlight assembly 61. In other embodiments, the color filter 63 may be disposed between the array substrate 622 and the lower polarizer 623.

[0164] In the drawings, the sizes of components, layer thicknesses, or regions are sometimes exaggerated for clarity. Therefore, the embodiments of the present disclosure are not necessarily limited to these dimensions, and the shapes and sizes of each component in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate some examples, and the embodiments of the present disclosure are not limited to the shapes or values ​​shown in the drawings.

[0165] In this description, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus includes a state where the angle is greater than 85° and less than 95°.

[0166] In the description herein, the terms "upper", "lower", "left", "right", "top", "inner", "outer", "axial", "four corners", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the embodiments of the present disclosure, and do not indicate or imply that the structure referred to has a specific orientation, is constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present disclosure.

[0167] In the description herein, unless otherwise expressly specified or limited, the terms "connect," "fixed connection," "installation," and "assembly" should be understood in a broad sense, for example, to mean a fixed connection, a detachable connection, or an integral connection; the terms "installation," "connection," and "fixed connection" can mean a direct connection, an indirect connection through an intermediate medium, or internal communication between two components. A person of ordinary skill in the art can understand the meaning of the above terms in the embodiments of the present disclosure according to the circumstances.

Claims

1. A color filter, comprising a plurality of filter units for transmitting light of different colors arranged on a substrate, and a shading layer located between adjacent filter units for transmitting light of different colors; the filter units comprise a first surface facing the substrate, a second surface away from the substrate, and a third surface connecting the first surface and the second surface; the shading layer is arranged on the third surface of at least one of two adjacent filter units for transmitting light of different colors.

2. The color filter according to claim 1, wherein: The multiple filtering units include multiple first filtering units that transmit first color light, multiple second filtering units that transmit second color light, and multiple third filtering units that transmit third color light; the shading layer is not set on the third surface of the multiple first filtering units or the multiple second filtering units or the multiple third filtering units.

3. The color filter according to claim 1, wherein: The plurality of filter units include a plurality of first filter units transmitting a first color light, a plurality of second filter units transmitting a second color light, and a plurality of third filter units transmitting a third color light; The first filter unit, the second filter unit, or the third filter unit is used as a reference filter unit, and the shading layer between the reference filter unit and the filter unit adjacent thereto includes a first shading layer and a second shading layer, the first shading layer is arranged on the third surface of the reference filter unit, and the second shading layer is at least partially arranged on a side of the first shading layer away from the reference filter unit.

4. The color filter according to claim 1, wherein: At least two adjacent filter units transmitting light of different colors have an overlapping portion, and the orthographic projection of the light-shielding layer on the substrate includes the orthographic projection of the overlapping portion on the substrate.

5. The color filter according to claim 1, wherein: The orthographic projections of the third surfaces of at least two adjacent filter units transmitting light of different colors on the substrate overlap, and the orthographic projections of the second surfaces on the substrate do not overlap.

6. The color filter according to claim 1, wherein: Adjacent filter units transmitting light of different colors have overlapping parts, and the light shielding layer is at least partially located between the overlapping parts.

7. The color filter according to claim 6, wherein: A portion of the light shielding layer is located on the third surface of the overlapping portion, and another portion of the light shielding layer extends in a direction parallel to the substrate.

8. The color filter according to claim 6, wherein: The light shielding layer is not disposed on the third surfaces of the non-overlapping portions of adjacent filter units that transmit light of different colors.

9. The color filter according to claim 1, wherein: The light shielding layer completely covers the edge of the third surface close to the substrate and extends a portion thereof in a direction parallel to the substrate.

10. The color filter according to claim 9, wherein: The light shielding layer extends 0.5um to 3um in a direction parallel to the substrate.

11. The color filter according to claim 1, wherein: The slope angle of the third surface of at least one of two adjacent filter units that transmit light of different colors is 70 degrees to 90 degrees.

12. The color filter according to claim 1, wherein: The light shielding layer is a grid-like structure, and the material of the light shielding layer is copper.

13. The color filter according to claim 1, wherein: The light filtering unit includes a plurality of stacked inorganic film layers.

14. An array substrate, comprising the color filter according to any one of claims 1 to 13, and a circuit structure layer arranged on a side of the multiple filter units away from the substrate, the circuit structure layer comprising a transistor, a gate line, a data line and a first electrode; the transistor comprises a gate electrode, an active layer, a source electrode and a drain electrode, the gate electrode is connected to the gate line, the source electrode is connected to the data line, and the drain electrode is connected to the first electrode.

15. A display device comprising the color filter according to any one of claims 1 to 13.

16. A method for preparing a color filter, comprising: forming a plurality of first filter units on a substrate, wherein the first filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface; forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units; forming a plurality of second filter units on the substrate, wherein the second filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface; Etching the plurality of first protection units, completely removing the first protection units on the second surface of the first filter unit, and at least partially retaining the first protection units on the third surface of the first filter unit, wherein the first protection units retained on the third surface of the first filter unit are first light shielding layers; forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units; forming a plurality of third filter units on the substrate; Etching the plurality of second protection units, removing the second protection units on the second surface of the first filter unit and the second protection units on the second surface of the second filter unit, at least partially retaining the second protection units on the third surface of the second filter unit, and at least partially retaining the second protection units on the first light shielding layer; The second protection unit retained on the third surface of the second filter unit and the second protection unit retained on the first light shielding layer are a second light shielding layer.

17. A method for preparing a color filter, comprising: forming a plurality of first filter units on a substrate, wherein the first filter units include a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface; forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units; forming a plurality of second filter units on the substrate, wherein the second filter units at least partially cover the first protection units on the third surfaces of the first filter units adjacent thereto; The second filter unit comprises a first surface facing the substrate, a second surface facing away from the substrate, and a third surface connecting the first surface and the second surface; The plurality of first protection units are etched, and the first protection units on the second surface of the first filter unit are removed, and the first protection units on the third surface of the first filter unit covered by the second filter unit are retained, and the first protection units on the third surface of the first filter unit are retained. The first protection unit remaining is a first light shielding layer; forming a second protective layer on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer comprises a plurality of second protective units, and the second protective units cover adjacent first filter units and second filter units; forming a plurality of third filter units on the substrate, wherein the third filter units at least partially cover the second protection units on the third surface of the first filter units adjacent thereto, and the third filter units at least partially cover the second protection units on the third surface of the second filter units adjacent thereto; Etching the plurality of second protection units, and removing the second protection units on the second surface of the first filter unit and the second protection units on the second surface of the second filter unit, retaining the second protection units on the third surface of the first filter unit covered by the third filter unit, and retaining the second protection units on the third surface of the second filter unit covered by the third filter unit; The second protection unit retained on the third surface of the first filter unit and the second protection unit retained on the third surface of the second filter unit are a second light shielding layer.

18. A method for preparing a color filter, comprising: forming a light shielding layer on the substrate, wherein the light shielding layer is a grid-like structure; Forming a plurality of first filter units on the substrate, wherein the plurality of first filter units are located in a plurality of first grid holes of the light shielding layer; forming a first protective layer on a side of the plurality of first filter units away from the substrate, wherein the first protective layer comprises a plurality of first protective units, and the first protective units completely cover the first filter units; forming a plurality of second filter units on the substrate, wherein the plurality of second filter units are located in the plurality of second grid holes of the light shielding layer; removing the plurality of first protection units to expose a surface of the first filter unit away from the substrate; A second protective layer is formed on a side of the plurality of first filter units and the plurality of second filter units away from the substrate, wherein the second protective layer includes a plurality of second protective units. The adjacent first filter unit and the second filter unit overlap; forming a plurality of third filter units on the substrate, wherein the plurality of third filter units are located in a plurality of third grid holes of the light shielding layer; The plurality of second protection units are removed to expose a surface of the first filter unit away from the substrate and a surface of the second filter unit away from the substrate.

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