Ceramic rock plate bottom surface edging, chamfering and polishing equipment and edging and polishing method thereof

Abstract

The invention relates to the technical field of ceramic rock plate machining, in particular to ceramic rock plate bottom face edge grinding, chamfering and polishing equipment and an edge grinding and polishing method thereof.The ceramic rock plate bottom face edge grinding, chamfering and polishing equipment comprises a belt conveyor and a polishing machine, and the belt conveyor is provided with a rack and a conveying belt; the limiting mechanism comprises limiting frame bodies symmetrically arranged on the two sides of the rack and a driving assembly, the area between the two limiting frame bodies is sequentially provided with a first limiting area and a second limiting area in the conveying direction of the conveying belt, and the polishing machine is located in the second limiting area. A sliding jacking assembly used for jacking the ceramic rock plate upwards is arranged in the first limiting area. According to the ceramic rock plate polishing machine, after a ceramic rock plate is limited in the ceramic rock plate polishing machine through the two limiting frame bodies, the polishing machine is adjusted to the position where the corners of the ceramic rock plate pass under the guidance of the limiting frame bodies, the bottom face chamfer of the ceramic rock plate can be accurately and comprehensively polished, and it is ensured that the polishing effect is optimal.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic rock slab processing, and in particular to a ceramic rock slab bottom surface edge grinding, chamfering and polishing device and an edge grinding and polishing method thereof. Background Art

[0002] Ceramic rock slabs are extruded and chamfered at the four corners of the bottom surface after forming. Edges that have not been chamfered and polished usually have a large initial roughness. Although the polishing process can improve the smoothness of the surface, its effect is limited. If the initial roughness is too large, polishing may not be able to completely remove these unevenness. And the edges that have not been chamfered and polished will still appear rough after polishing, affecting the quality and appearance of the final product. Ceramic rock slabs may vibrate when polishing during the transportation process. The vibration may come from factors such as the movement of the conveying system and the high-speed rotation of the polishing wheel. Vibration not only affects the polishing quality, but may also cause incomplete chamfering of the bottom surface of the ceramic rock slab.

[0003] The currently disclosed Chinese patent CN116690401B is a polishing device for ceramic equipment, including a fixed plate, a movable plate, a vertical plate, a rotating shaft, a movable barrel and a conveyor belt arranged at the top of the fixed plate for conveying ceramic tiles. The vertical plate is vertically arranged at the top of the fixed plate and located on one side of the conveyor belt. The movable plate is located above the conveyor belt and is vertically slidably connected to one side of the vertical plate through a movable member. The rotating shaft is rotatably connected to the bottom end of the movable plate. The barrel mouth of the movable barrel faces downward and is located below the movable plate. A groove is opened at the top of the movable barrel for the bottom end of the rotating shaft to pass through. At this time, a compression spring is arranged between the movable barrel and the movable plate, and a polishing grinding wheel located in the movable barrel is arranged at the bottom end of the rotating shaft. A motor for driving the rotating shaft to rotate is arranged on the movable plate, and a clamping member for clamping ceramic tiles is arranged on the movable barrel.

[0004] According to the above patent, the above patent fixes the ceramic by clamping, and then uses the buffering effect of the compression spring to press the polishing wheel against the ceramic, so as to reduce the shaking of the ceramic during the polishing process. However, this method fixes the ceramic in a specific position for polishing, and it is impossible to accurately polish the ceramic during the transportation process, which limits the improvement of the polishing efficiency. Therefore, there is a need for a limiting frame that can adapt to the ceramic rock slab, so that the ceramic rock slab can maintain a stable grinding effect during the transportation process. The edge grinding, chamfering and polishing equipment. In addition, in the process of limiting the position of the ceramic rock slab in the prior art, the bright surface of the ceramic rock slab and the conveyor belt produce friction, which easily leads to wear of the bright surface of the ceramic rock slab, resulting in a reduction in the yield rate. Summary of the invention

[0005] In view of the problems existing in the existing technology, a ceramic rock slab bottom surface edge grinding, chamfering and polishing equipment is provided. Through the precise control of the limiting mechanism, the ceramic rock slab is stably centered during the conveying process. During the limiting process, the sliding lifting assembly lifts the ceramic rock slab to prevent the ceramic rock slab from rubbing against the conveyor belt. After the ceramic rock slab is limited by the two limiting frames, the limiting rollers on the limiting frames are in contact with the ceramic rock slab instead of applying pressure, which ensures that the ceramic rock slab can still move with the conveyor belt. The polishing machine is adjusted to the position where the edges and corners of the ceramic rock slab pass under the guidance of the limiting frames, and can perform comprehensive and precise grinding on the bottom chamfers of the ceramic rock slab, thereby ensuring that the grinding effect of the ceramic rock slab during the conveying process reaches the best state, effectively improving the quality and appearance of the product.

[0006] In order to solve the problems of the prior art, the present invention provides a ceramic rock slab bottom surface grinding, chamfering and polishing equipment, including a belt conveyor and polishing machines symmetrically arranged on both sides thereof, the belt conveyor having a frame and a conveyor belt, and also including a limiting mechanism for keeping the ceramic rock slab in a central position on the conveyor belt, the limiting mechanism including limiting frames symmetrically arranged on both sides of the frame and a driving assembly for driving the two limiting frames to move in a conveying direction perpendicular to the conveying belt, each limiting frame is fixedly provided with a plurality of the polishing machines described above along the conveying direction of the conveyor belt, and when the driving assembly In the process of the parts driving the two limit frames to approach each other, the ceramic rock slab is in a state of being gradually limited between the two limit frames, and the polishing machine is accurately located at the position where the corners of the ceramic rock slab pass, so that the bottom chamfer of the ceramic rock slab is fully polished, and a first limit area and a second limit area are successively provided between the two limit frames along the conveying direction of the conveyor belt, the polishing machine is located in the second limit area, and the first limit area is provided with a sliding lifting component for lifting the ceramic rock slab upward to prevent the ceramic rock slab from rubbing against the conveyor belt during the limiting process.

[0007] Preferably, the limiting frame is composed of a first limiting plate and a second limiting plate, and a movable side plate which is transmission-connected to the driving assembly is fixedly connected between the first limiting plate and the second limiting plate. When the ceramic rock slab is limited by the two first limiting plates, the first limiting area is formed between the two first limiting plates. At the same time, the second limiting area is formed between the two second limiting plates, so that the ceramic rock slab is instantly polished by the polishing machine the moment it enters the second limiting area.

[0008] Preferably, the first limiting plate and the second limiting plate are both provided with a plurality of limiting rollers capable of contacting the edge of the ceramic rock slab along the conveying direction of the conveyor belt, and the rotation direction of the limiting rollers is parallel to the conveying direction of the conveyor belt.

[0009] Preferably, a camera for observing the size of the ceramic rock slab is provided on the frame and located in the first limiting area. A signal transmitter is provided on one of the two movable side plates, and a signal receiver corresponding to the signal transmitter is provided on the other movable side plate. When the camera observes the size of the ceramic rock slab and senses the distance through the signal transmitter and the signal receiver, the two first limiting plates are in a state of limiting the ceramic rock slab instead of applying pressure, so that the ceramic rock slab can still move with the conveyor belt.

[0010] Preferably, a support for installing the polishing machine is fixedly provided on each second limiting plate, and a slide rail for sliding connection of the support is fixedly provided on the frame along the direction of movement of the second limiting plate, and the slide rail is provided with a positioning component for fixing the position of the polishing machine after the second limiting area is formed.

[0011] Preferably, a supporting ball is provided on each second limiting plate at a position corresponding to the polishing machine, and the second limiting plate has a ball seat for mounting the supporting ball.

[0012] Preferably, the polishing machine includes a grinding disc and a grinding driver fixedly arranged on a support, the grinding driver has a main shaft that can rotate and rise and fall, the grinding disc has a rotating shaft coaxial with the main shaft, a sleeve is fixedly arranged on the main shaft, the rotating shaft is inserted in the sleeve in the form of a sliding card, and a compression spring is fixedly arranged between the rotating shaft and the sleeve.

[0013] Preferably, a cooling bin body fixedly connected to the support is provided on the shaft sleeve, the cooling bin body has a liquid inlet, a liquid outlet channel is provided between the cooling bin body and the shaft sleeve, an inner ring and an outer ring for opening and closing the liquid outlet channel are also provided between the cooling bin body and the shaft sleeve, when the inner ring and the outer ring fit together, the liquid outlet channel is in a closed state, and when the outer ring gradually moves away from the inner ring, the liquid outlet channel is in a gradually open state.

[0014] Preferably, the sliding lifting assembly includes a lifting plate arranged below the conveyor belt, balls arranged in a matrix on the lifting plate, and a lifting cylinder fixedly arranged on a frame to drive the lifting plate to rise and fall.

[0015] The present invention also provides a method for edge grinding and polishing the bottom surface of a ceramic rock plate, comprising the following steps:

[0016] S1, start the conveyor belt to transport the ceramic rock slab;

[0017] S2. Start the limiting mechanism to gradually center the ceramic rock plate. During this process, start the sliding lifting assembly to lift the ceramic rock plate upward to prevent friction between the ceramic rock plate and the conveyor belt;

[0018] S3. After the ceramic slab is limited, the polishing machine is at the position where the edge of the ceramic slab passes, and the sliding lifting assembly is started again to lower the ceramic slab onto the conveyor belt, and continue to be transported through the conveyor belt;

[0019] S4. Start the polishing machine and use the grinding disc to fully grind the bottom chamfer of the ceramic rock slab during transportation.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention uses a limiting mechanism to precisely control the ceramic rock plate to ensure that it is stably centered during transportation. At the same time, the ceramic rock plate is lifted by a sliding lifting component, which effectively avoids friction between the ceramic rock plate and the conveyor belt, thereby preventing scratch damage caused by friction.

[0022] After the ceramic slab is stabilized by the two limit frames, the polisher is precisely adjusted to the position where the edge of the ceramic slab passes under the guidance of the limit frames. This ensures that the polisher can accurately and comprehensively grind the bottom chamfer of the ceramic slab, avoiding the incomplete chamfering caused by the inaccurate position of the polisher, thereby ensuring the best grinding effect.

[0023] 2. The present invention also observes the size of the ceramic rock plate through a camera, and combines the precise distance measurement function of the signal transmitter and the signal receiver to dynamically adjust the position of the two limit frames. It ensures that the ceramic rock plate is stably centered and not subject to excessive pressure when entering the two first limit plates. With the contact between the limit roller and the ceramic rock plate, it ensures that the ceramic rock plate can smoothly follow the movement of the conveyor belt, and avoids the situation where the movement of the ceramic rock plate is blocked due to direct contact between the first limit plate and the ceramic rock plate. While significantly improving the limit accuracy, it also ensures the efficient chamfering and grinding of the bottom surface of the ceramic rock plate.

[0024] 3. The present invention also fixes the polishing machine through a positioning assembly, thereby avoiding uneven polishing caused by inaccurate positioning of the polishing machine, improving the comprehensiveness of chamfering and polishing of the bottom surface of the ceramic rock slab, and laying a good foundation for subsequent overall polishing of the bottom surface of the ceramic rock slab. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the top surface of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0026] Figure 2 It is a three-dimensional structural schematic diagram of the bottom surface orientation of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0027] Figure 3It is a partial three-dimensional structural cross-sectional view of a ceramic rock slab bottom surface edge grinding, chamfering and polishing device of the present invention.

[0028] Figure 4 It is a partial plan view of a ceramic rock slab bottom surface edge grinding, chamfering and polishing device of the present invention.

[0029] Figure 5 It is a top view of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0030] Figure 6 It is a three-dimensional structural schematic diagram of a polishing machine of a ceramic rock slab bottom surface edge grinding, chamfering and polishing device of the present invention.

[0031] Figure 7 It is a partial three-dimensional structural schematic diagram of a polishing machine of a ceramic rock slab bottom surface edge grinding, chamfering and polishing device of the present invention.

[0032] Figure 8 It is a top view of a polishing machine of a ceramic rock slab bottom surface edge grinding, chamfering and polishing device of the present invention.

[0033] Fig. 9 The present invention Figure 8 Plane section view at AA.

[0034] Fig.10 The present invention Fig. 9 A cross-sectional view of the three-dimensional structure at BB.

[0035] The numbers in the figure are: 1. Ceramic rock plate; 2. Rack; 21. Support; 22. Slide rail; 23. Positioning assembly; 231. Magnetic rod; 232. Magnetic ring; 3. Conveyor belt; 31. First limiting area; 32. Second limiting area; 4. Polishing machine; 41. Grinding disc; 411. Cooling chamber; 4111. Liquid inlet; 4112. Liquid outlet channel; 42. Grinding drive; 421. Spindle; 422. Rotating shaft; 423. Bushing; 4231. Inner ring; 4232. Outer ring; 424. Compression spring; 5. Limiting mechanism; 51. Limiting frame body; 511, first limit plate; 5111, limit roller; 512, second limit plate; 5121, support ball; 5122, ball seat; 513, movable side plate; 5131, guide rod; 5132, guide sleeve; 5133, return spring; 52, drive assembly; 521, guide rail; 5211, slider; 522, connecting rod; 523, rotary drive; 6, sliding lifting assembly; 61, lifting plate; 611, baffle; 62, ball; 63, lifting cylinder; 7, camera; 71, signal transmitter; 72, signal receiver. DETAILED DESCRIPTION

[0036] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] See also Figure 1-Figure 5 As shown, a ceramic rock slab bottom surface grinding, chamfering and polishing equipment includes a belt conveyor and polishing machines 4 symmetrically arranged on both sides thereof, the belt conveyor has a frame 2 and a conveyor belt 3, and also includes a limiting mechanism 5 for keeping the ceramic rock slab 1 in a centered position on the conveyor belt 3, the limiting mechanism 5 includes limiting frames 51 symmetrically arranged on both sides of the frame 2 and a driving assembly 52 for driving the two limiting frames 51 to move in a conveying direction perpendicular to the conveyor belt 3, each limiting frame 51 is fixedly provided with a plurality of the polishing machines 4 along the conveying direction of the conveyor belt 3, and when the driving assembly 52 drives the two limiting frames 51 to move in a symmetrical manner, the two limiting frames 51 are fixedly provided with a plurality of the polishing machines 4 along the conveying direction of the conveyor belt 3, and when the driving assembly 52 drives the two limiting frames 51 to move in a symmetrical manner, the two limiting frames 51 are fixedly provided with a plurality of the polishing machines 4 In the process of the bodies 51 approaching each other, the ceramic rock slab 1 is in a state of being gradually limited between the two limiting frames 51, and the polishing machine 4 is accurately located at the position where the corners of the ceramic rock slab 1 pass, so that the bottom chamfer of the ceramic rock slab 1 is fully polished, and a first limiting area 31 and a second limiting area 32 are sequentially provided between the two limiting frames 51 along the conveying direction of the conveyor belt 3. The polishing machine 4 is located in the second limiting area 32, and the first limiting area 31 is provided with a sliding lifting component 6 for lifting the ceramic rock slab 1 upward to prevent the ceramic rock slab 1 from rubbing against the conveyor belt 3 during the limiting process.

[0038] During the conveying process of the ceramic rock slab 1, the belt conveyor is first started to convey the ceramic rock slab 1 with the bottom facing upward. When the ceramic rock slab 1 enters the first limiting area 31, its bottom surface has not yet been polished. At this time, the limiting mechanism 5 starts to operate, and drives the two limiting frames 51 to move along the conveying direction perpendicular to the conveyor belt 3 through the driving component 52, gradually approaching the ceramic rock slab 1.

[0039] To ensure that the ceramic rock slab 1 does not generate friction with the conveyor belt 3 during the limiting process, the sliding lifting assembly 6 is started synchronously to lift the ceramic rock slab 1 upward to separate it from the conveyor belt 3. Scratches or other damage caused by friction are effectively avoided. As the limiting frame 51 gradually approaches, the ceramic rock slab 1 is gradually limited in the center. When the ceramic rock slab 1 is completely centered, the limiting frame 51 stops moving, the sliding lifting assembly 6 also stops working, and the ceramic rock slab 1 slowly descends and re-contacts the conveyor belt 3. At this point, the ceramic rock slab 1 has been stably and centrally positioned, ready for the subsequent grinding process.

[0040] Subsequently, as the conveyor belt 3 continues to convey the ceramic rock slab 1, the ceramic rock slab 1 enters the second limiting area 32, which is the area where the polishing machine 4 is located. The polishing machine 4 is fixed on the limiting frame 51, and adjusts its position as the limiting frame 51 moves, ensuring that the polishing machine 4 can be accurately positioned at the position where the corners of the ceramic rock slab 1 pass. During the conveying process, the polishing machine 4 fully grinds the chamfer of the bottom surface of the ceramic rock slab 1, and gradually removes the chamfered portion of the bottom surface of the ceramic rock slab 1 to achieve the best grinding effect. This step lays a good foundation for the subsequent polishing of the bottom surface of the ceramic rock slab 1 as a whole. After the ceramic rock slab 1 has been fully polished, it enters the next polishing process for overall bottom surface polishing.

[0041] See also Figure 1-Figure 8 As shown, the limiting frame 51 is composed of a first limiting plate 511 and a second limiting plate 512, and a movable side plate 513 which is transmission-connected to the driving assembly 52 is fixedly connected between the first limiting plate 511 and the second limiting plate 512. When the ceramic rock slab 1 is limited by the two first limiting plates 511, the first limiting area 31 is formed between the two first limiting plates 511. At the same time, the second limiting area 32 is formed between the two second limiting plates 512, so that the ceramic rock slab 1 is instantly polished by the polishing machine 4 at the moment of entering the second limiting area 32.

[0042] The movable side plate 513 has a guide rod 5131 extending outward near both ends thereof, and a guide sleeve 5132 through which the guide rod 5131 passes is fixedly provided on the frame 2. A return spring 5133 is fixedly connected between the guide sleeve 5132 and the guide rod 5131. A guide rail 521 is fixedly provided on the outer side of each movable side plate 513 along its length direction, and two sliders 5211 are slidably provided in the guide rail 521. The driving assembly 52 includes a connecting rod 522 respectively hingedly provided between each slider 5211 and the corresponding guide sleeve 5132, and a rotation driver 523 fixedly provided on the frame 2 for respectively driving each connecting rod 522 to rotate with the hinge point of the guide sleeve 5132 as the axis.

[0043] When the ceramic rock slab 1 enters the first limiting area 31, the driving assembly 52 starts working. The rotary driver 523 drives the connecting rod 522 to rotate, and the rotation of the connecting rod 522 drives the slider 5211 to slide along the guide rail 521. The sliding of the slider 5211 pushes the movable side plate 513 to move the limiting frame 51 along the conveying direction perpendicular to the conveyor belt 3. The movable side plate 513 moves smoothly under the guidance of the guide rod 5131 and the guide sleeve 5132 to ensure that the movement of the limiting frame 51 is accurate. After the first limiting area 31 in which the ceramic rock slab 1 is limited is formed between the two first limiting plates 511, the second limiting area 32 is also formed between the two second limiting plates 512 at the same time. The range of the first limiting area 31 and the second limiting area 32 are consistent. Therefore, after being centered by the two first limiting plates 511, the ceramic rock slab 1 can directly enter the second limiting area 32 and be immediately polished by the polishing machine 4, avoiding the step of limiting again in the second limiting area 32, thereby improving the efficiency of chamfering and grinding of the ceramic rock slab 1.

[0044] After a ceramic slab 1 is polished, the driving assembly 52 works in the reverse direction, the rotary driver 523 drives the connecting rod 522 to rotate in the reverse direction, the slider 5211 slides back to its original position along the guide rail 521, and the movable side plate 513 returns to its initial position under the action of the reset spring 5133. The first limit plate 511 and the second limit plate 512 move outward accordingly, making limit preparations for the entry of the next ceramic slab 1, so as to facilitate limit adjustment according to the size of the ceramic slab 1.

[0045] See also Figure 3 , Figure 4 and Fig. 9 As shown, the first limiting plate 511 and the second limiting plate 512 are provided with a plurality of limiting rollers 5111 that can contact the edge of the ceramic rock slab 1 along the conveying direction of the conveyor belt 3, and the rotation direction of the limiting rollers 5111 is parallel to the conveying direction of the conveyor belt 3.

[0046] During the limiting process, the limiting roller 5111 improves the limiting effect of the ceramic rock plate 1 during the conveying process. The rotation direction of the limiting roller 5111 is parallel to the conveying direction of the conveyor belt 3, so when the ceramic rock plate 1 follows the conveyor belt 3, the limiting roller 5111 can smoothly contact and roll with the edge of the ceramic rock plate 1, thereby reducing friction. This effectively avoids the situation where the side of the ceramic rock plate 1 is scratched due to excessive friction, ensures the quality of the ceramic rock plate 1, and maintains its stable conveying.

[0047] See also Figure 1 , Figure 3 and Figure 5As shown, a camera 7 for observing the size of the ceramic rock slab 1 is provided on the frame 2 and located in the first limiting area 31. A signal transmitter 71 is provided on one of the two movable side plates 513, and a signal receiver 72 corresponding to the signal transmitter 71 is provided on the other movable side plate 513. When the camera 7 observes the size of the ceramic rock slab 1 and senses the distance through the signal transmitter 71 and the signal receiver 72, the two first limiting plates 511 are in a state of limiting the ceramic rock slab 1 therein rather than applying pressure, so that the ceramic rock slab 1 can still move with the conveyor belt 3.

[0048] Before the driving component 52 drives the two limit frames 51 to limit the ceramic rock slab 1, the size of the ceramic rock slab 1 is observed through the camera 7 on the frame 2 to accurately obtain the specific size information of the ceramic rock slab 1. Subsequently, through the cooperation of the signal transmitter 71 and the signal receiver 72, that is, the signal transmitter 71 sends a signal and the signal receiver 72 receives the reflected signal, these signals are transmitted to the controller for calculation, so as to accurately measure the distance between the two limit frames 51.

[0049] The driving component 52 dynamically adjusts the positions of the two first limiting plates 511 according to the measurement results, so that the ceramic rock plate 1 can be stably centered when entering the first limiting area 31 to avoid excessive pressure. This ensures that the ceramic rock plate 1 will not be unable to move with the conveyor belt 3 due to excessive squeezing during the limiting process, and can still maintain a state of moving smoothly with the conveyor belt 3. Not only does it improve the accuracy and stability of the limiting, it also ensures the efficient chamfering of the bottom surface of the ceramic rock plate 1.

[0050] See also Figure 3-Figure 10 As shown, each second limiting plate 512 is fixedly provided with a support 21 for installing the polishing machine 4, and a slide rail 22 for sliding connection of the support 21 is fixedly provided on the frame 2 along the moving direction of the second limiting plate 512, and the slide rail 22 is provided with a positioning component 23 for fixing the position of the polishing machine 4 after the second limiting area 32 is formed.

[0051] The positioning assembly 23 includes a magnetic rod 231 fixedly arranged on the frame 2 along the track direction of the slide rail 22 and a magnetic ring 232 slidably sleeved on the magnetic rod 231 and fixedly connected to the support 21. The magnetic rod 231 and the magnetic ring 232 are both electromagnets. By controlling the power-on state of the magnetic rod 231 and the magnetic ring 232, magnetic attraction is generated between the magnetic rod 231 and the magnetic ring 232, so that the support 21 is fixed at a predetermined position on the slide rail 22.

[0052] The positioning assembly 23 can also include an electric screw that is rotatably arranged along the track direction of the slide rail 22 and a threaded sleeve that is arranged on the electric screw and fixedly connected to the support 21. The electric screw and the threaded sleeve are not shown in the figure. The movement of the threaded sleeve is controlled by the electric screw, so that the support 21 is fixed at a predetermined position on the slide rail 22.

[0053] The positioning assembly 23 can also include a slot provided on the slide rail 22 and a buckle provided on the support 21, which are not shown in the figure. The support 21 can be locked by the cooperation of the buckle and the slot, so that the support 21 is fixed at a predetermined position on the slide rail 22.

[0054] When the ceramic rock slab 1 is limited by the two first limit plates 511, the second limit plate 512 moves following the first limit plate 511. At this time, the support 21 fixed to the second limit plate 512 drives the polishing machine 4 to move along the slide rail 22. After the ceramic rock slab 1 is stably limited, the support 21 is fixed to the predetermined position on the slide rail 22 by starting the positioning assembly 23. This ensures that the polishing machine 4 remains stable and motionless during operation, so that the chamfered portion of the bottom surface of the ceramic rock slab 1 can be fully polished.

[0055] See also Figure 4 and Fig. 9 As shown, a supporting ball 5121 is provided on each second limiting plate 512 at a position corresponding to the polishing machine 4 , and a ball seat 5122 for mounting the supporting ball 5121 is provided on the second limiting plate 512 .

[0056] The ceramic rock plate 1 is polished by the polishing machine 4 during the conveying process. Since the supporting sphere 5121 is arranged corresponding to the polishing machine 4, the polished part of the ceramic rock plate 1 is effectively supported to prevent it from being deformed due to the polishing pressure, thereby improving the polishing accuracy and stability.

[0057] In addition, the supporting sphere 5121 can rotate freely on the ball seat 5122, thereby reducing the friction between the ceramic rock slab 1 and the supporting point during the transportation of the ceramic rock slab 1, avoiding surface scratches and damage caused by friction, and protecting the surface quality of the ceramic rock slab 1.

[0058] See also Figure 3-Figure 10 As shown, the polishing machine 4 includes a grinding disc 41 and a grinding driver 42 fixedly arranged on a support 21, the grinding driver 42 has a main shaft 421 that can rotate and rise and fall, the grinding disc 41 has a rotating shaft 422 coaxial with the main shaft 421, a sleeve 423 is fixedly provided on the main shaft 421, the rotating shaft 422 is inserted in the sleeve 423 in the form of a sliding card, and a compression spring 424 is fixedly provided between the rotating shaft 422 and the sleeve 423.

[0059] A clamping strip is provided inside the shaft sleeve 423 along its axial direction, and a clamping groove for slidingly engaging with the clamping strip is provided on the rotating shaft 422 along its axial direction.

[0060] When the ceramic slab 1 is conveyed to the bottom of the polishing machine 4, the main shaft 421 of the grinding driver 42 descends and drives the grinding disc 41 to contact the bottom surface of the ceramic slab 1. The position of the grinding disc 41 can be adjusted according to the thickness of the ceramic slab 1. The specific structure for driving the main shaft 421 to rise and fall is not shown in the figure. The rotational motion of the main shaft 421 is transmitted to the rotating shaft 422 through the shaft sleeve 423, so that the grinding disc 41 rotates at high speed for grinding.

[0061] In order to ensure that the grinding disc 41 can stably and effectively grind the chamfer of the bottom surface of the ceramic rock plate 1, through the action of the compression spring 424, as the main shaft 421 continues to descend, the compression spring 424 is compressed, so that the grinding disc 41 is stably and appropriately pressed on the bottom surface of the ceramic rock plate 1. This ensures that the grinding disc 41 always maintains good contact with the surface of the ceramic rock plate 1, thereby achieving effective grinding of the chamfer of the bottom surface of the ceramic rock plate 1.

[0062] See also Figure 3-Figure 10 As shown, a cooling chamber body 411 fixedly connected to the support 21 is sleeved on the shaft sleeve 423, and the cooling chamber body 411 has a liquid inlet 4111, and a liquid outlet channel 4112 is provided between the cooling chamber body 411 and the shaft sleeve 423, and an inner ring 4231 and an outer ring 4232 for opening and closing the liquid outlet channel 4112 are also provided between the cooling chamber body 411 and the shaft sleeve 423. When the inner ring 4231 and the outer ring 4232 fit together, the liquid outlet channel 4112 is in a closed state, and when the outer ring 4232 gradually moves away from the inner ring 4231, the liquid outlet channel 4112 is in a gradually opened state.

[0063] During the grinding process of the grinding disc 41 being pressed against the bottom surface of the ceramic rock plate 1 by the compression spring 424, the coolant enters from the liquid inlet 4111 of the cooling chamber 411 and is stored in the cooling chamber 411. As the spindle 421 descends, the outer ring 4232 gradually moves away from the inner ring 4231, the liquid outlet channel 4112 gradually opens, and the coolant flows out through the liquid outlet channel 4112 and is evenly sprinkled on the grinding disc 41. This effectively reduces the high temperature generated by the grinding disc 41 during the grinding process, reduces the heat accumulation of the grinding disc 41, and further improves the grinding effect.

[0064] See also Figure 2-Figure 4 As shown, the sliding lifting assembly 6 includes a lifting plate 61 arranged below the conveyor belt 3, balls 62 arranged in a matrix on the lifting plate 61, and a lifting cylinder 63 fixedly arranged on the frame 2 to drive the lifting plate 61 to move up and down.

[0065] The end of the lifting plate 61 close to the second limiting area 32 is provided with a baffle 611 capable of preventing the ceramic rock plate 1 from following the conveyor belt 3. Before the ceramic rock plate 1 is limited by the two first limiting plates 511, as the ceramic rock plate 1 is conveyed by the conveyor belt 3 to contact the baffle 611, the ceramic rock plate 1 stops moving relative to the conveyor belt 3. The lifting cylinder 63 then drives the lifting plate 61 to rise, and the ball 62 on the lifting plate 61 contacts the bottom of the ceramic rock plate 1 and provides smooth support. As the lifting plate 61 continues to rise, the ceramic rock plate 1 is smoothly lifted up to separate it from the conveyor belt 3.

[0066] The lifted position of the ceramic slab 1 is still between the two first limiting plates 511, which not only ensures the precise positioning of the ceramic slab 1, but also avoids the situation where the ceramic slab 1 generates a large friction force relative to the movement of the conveyor belt 3 during the limiting process. After the ceramic slab 1 is limited in the lifted state, the lifting plate 61 is reset, and the ceramic slab 1 is placed back on the conveyor belt 3. At this time, the baffle 611 is located below the ceramic slab 1, which does not affect the movement of the ceramic slab 1 following the conveyor belt 3.

[0067] A ceramic rock plate bottom surface grinding and polishing method is applied to a ceramic rock plate bottom surface grinding and chamfering polishing device, comprising the following steps:

[0068] S1, start the conveyor belt 3 to transport the ceramic rock slab 1;

[0069] S2, start the limiting mechanism 5 to gradually limit the ceramic rock plate 1 to the center. During this process, start the sliding lifting assembly 6 to lift the ceramic rock plate 1 upward to prevent friction between the ceramic rock plate 1 and the conveyor belt 3;

[0070] S3, after the ceramic rock plate 1 is limited, the polishing machine 4 is at the position where the corner of the ceramic rock plate 1 passes, and the sliding lifting assembly 6 is started again to lower the ceramic rock plate 1 to the conveyor belt 3, and continue to be transported by the conveyor belt 3;

[0071] S4, start the polishing machine 4, and use the grinding disc 41 to comprehensively grind the bottom chamfer of the ceramic rock slab 1 during the transportation process.

[0072] Through the precise control of the limiting mechanism 5, the present invention ensures that the ceramic rock slab 1 is stably centered during the transportation process. After the ceramic rock slab 1 is limited by the two limiting frames 51, the polishing machine 4 is adjusted to the position where the corners of the ceramic rock slab 1 pass under the guidance of the limiting frames 51. The bottom chamfer of the ceramic rock slab 1 can be accurately polished, ensuring the best polishing effect and avoiding vibration of the ceramic rock slab 1 during the polishing process. The bottom chamfer of the ceramic rock slab 1 becomes smooth and flat, laying a good foundation for the subsequent overall polishing process.

[0073] In addition, the size of the ceramic rock slab 1 is observed by the camera 7, and the signal is transmitted to the controller for precise distance measurement in combination with the signal transmitter 71 and the signal receiver 72. The position of the two limit frames 51 can be dynamically adjusted through the drive component 52 to ensure that the ceramic rock slab 1 is stably centered when entering the two first limit plates 511 without being subjected to excessive pressure, thereby ensuring that the ceramic rock slab 1 moves smoothly following the conveyor belt 3, thereby significantly improving the efficiency of the grinding process.

[0074] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the protection scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A ceramic rock plate bottom surface grinding, chamfering and polishing device, comprising a belt conveyor and polishing machines (4) symmetrically arranged on both sides thereof, wherein the belt conveyor has a frame (2) and a conveyor belt (3); It is characterized in that It also includes a limiting mechanism (5) for keeping the ceramic rock plate (1) in a central position on the conveyor belt (3), and the limiting mechanism (5) includes: Limiting frames (51) symmetrically arranged on both sides of the frame (2); and a driving assembly (52) for driving the two limiting frames (51) to move in a conveying direction perpendicular to the conveyor belt (3); A plurality of polishing machines (4) are fixedly arranged on each limiting frame (51) along the conveying direction of the conveyor belt (3); When the driving component (52) drives the two limiting frames (51) to approach each other, the ceramic rock plate (1) is gradually limited between the two limiting frames (51), and the polishing machine (4) is accurately located at the position where the edge of the ceramic rock plate (1) passes, so that the bottom chamfer of the ceramic rock plate (1) is fully polished; The area between the two limiting frames (51) is respectively the first limiting area (31) and the second limiting area (32) along the conveying direction of the conveyor belt (3); the polishing machine (4) is located in the second limiting area (32); and the first limiting area (31) is provided with a sliding lifting component (6) for lifting the ceramic rock plate (1) upwards to prevent the ceramic rock plate (1) from rubbing against the conveyor belt (3) during the limiting process.

2. The ceramic rock plate bottom surface grinding, chamfering and polishing equipment according to claim 1 is characterized in that: The limiting frame (51) is composed of a first limiting plate (511) and a second limiting plate (512), and a movable side plate (513) is fixedly connected between the first limiting plate (511) and the second limiting plate (512) and is transmission-connected to the driving component (52). When the ceramic rock slab (1) is limited by the two first limiting plates (511), the first limiting area (31) is formed between the two first limiting plates (511). At the same time, the second limiting area (32) is formed between the two second limiting plates (512), so that the ceramic rock slab (1) is instantly polished by the polishing machine (4) the moment it enters the second limiting area (32).

3. The ceramic rock plate bottom surface grinding, chamfering and polishing equipment according to claim 2 is characterized in that: The first limiting plate (511) and the second limiting plate (512) are provided with a plurality of limiting rollers (5111) capable of contacting the edge of the ceramic rock slab (1) along the conveying direction of the conveyor belt (3), and the rotation direction of the limiting rollers (5111) is parallel to the conveying direction of the conveyor belt (3).

4. The ceramic rock plate bottom surface grinding, chamfering and polishing equipment according to claim 3 is characterized in that: A camera (7) for observing the size of the ceramic rock slab (1) is provided on the frame (2) and located at the first limiting area (31). A signal transmitter (71) is provided on one of the two movable side plates (513), and a signal receiver (72) corresponding to the signal transmitter (71) is provided on the other movable side plate (513). When the camera (7) observes the size of the ceramic rock slab (1) and senses the distance through the signal transmitter (71) and the signal receiver (72), the two first limiting plates (511) are in a state of limiting the ceramic rock slab (1) therein rather than applying pressure, so that the ceramic rock slab (1) can still move along with the conveyor belt (3).

5. The ceramic rock plate bottom surface grinding, chamfering and polishing equipment according to claim 2 is characterized in that: A support (21) for mounting the polishing machine (4) is fixedly provided on each second limiting plate (512), and a slide rail (22) for sliding connection with the support (21) is fixedly provided on the frame (2) along the moving direction of the second limiting plate (512), and a positioning assembly (23) for fixing the position of the polishing machine (4) after the second limiting area (32) is formed is provided on the slide rail (22).

6. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 5 is characterized in that: A supporting sphere (5121) is provided on each second limiting plate (512) at a position corresponding to the polishing machine (4), and a ball seat (5122) for mounting the supporting sphere (5121) is provided on the second limiting plate (512).

7. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 6 is characterized in that: The polishing machine (4) comprises a grinding disc (41) and a grinding driver (42) fixedly arranged on a support (21), wherein the grinding driver (42) has a main shaft (421) capable of rotating and lifting, the grinding disc (41) has a rotating shaft (422) coaxial with the main shaft (421), a shaft sleeve (423) is fixedly arranged on the main shaft (421), the rotating shaft (422) is inserted into the shaft sleeve (423) in the form of a sliding engagement, and a compression spring (424) is fixedly arranged between the rotating shaft (422) and the shaft sleeve (423).

8. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 7 is characterized in that: A cooling chamber body (411) fixedly connected to the support (21) is sleeved on the shaft sleeve (423), the cooling chamber body (411) having a liquid inlet (4111), a liquid outlet channel (4112) between the cooling chamber body (411) and the shaft sleeve (423), an inner ring (4231) and an outer ring (4232) for opening and closing the liquid outlet channel (4112) are also provided between the cooling chamber body (411) and the shaft sleeve (423), when the inner ring (4231) and the outer ring (4232) fit together, the liquid outlet channel (4112) is in a closed state, and when the outer ring (4232) gradually moves away from the inner ring (4231), the liquid outlet channel (4112) is in a gradually opened state.

9. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 1, characterized in that: The sliding lifting assembly (6) comprises a lifting plate (61) arranged below the conveyor belt (3), balls (62) arranged in a matrix on the lifting plate (61), and a lifting cylinder (63) fixedly arranged on the frame (2) for driving the lifting plate (61) to move up and down.

10. A method for grinding and polishing the bottom surface of a ceramic rock plate, applied to a device for grinding and polishing the bottom surface of a ceramic rock plate as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1, start the conveyor belt (3) to convey the ceramic rock slab (1); S2, start the limiting mechanism (5) to gradually center the ceramic rock plate (1). During this process, start the sliding lifting assembly (6) to lift the ceramic rock plate (1) upward to prevent friction between the ceramic rock plate (1) and the conveyor belt (3); S3, after the ceramic rock plate (1) is limited, the polishing machine (4) is at the position where the edge of the ceramic rock plate (1) passes, and the sliding lifting assembly (6) is started again to lower the ceramic rock plate (1) onto the conveyor belt (3), and continue to be transported by the conveyor belt (3); S4, start the polishing machine (4), and use the grinding disc (41) to fully grind the bottom chamfer of the ceramic rock plate (1) during the transportation process.

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