Three-in-one combination device

Abstract

The present invention relates to a three-in-one combination device, which sets the pre-compression amount of the right spring group to be smaller than the pre-compression amount of the left spring group. When the transfer mechanism is grabbing and stacking substrates and cover plates, the movable plate applies pressure to the substrates and cover plates and is subjected to a reaction force, and the pressure applied by the movable plate to the substrates and cover plates is different on the long sides on both sides, thereby avoiding the horizontal tilt of the substrates and cover plates caused by the movable plate applying pressure to the substrates and cover plates when grabbing and stacking due to the first jacking component and the second jacking platform component being biased against the first right positioning plate and the second right positioning plate. At the same time, the present application also utilizes a pressing cylinder to apply downward pressure to the long side of the movable plate after the substrates and cover plates are grabbed and before stacking, so as to correct the horizontal position of the movable plate, so as to avoid the problem of tilting due to the different pre-compression amounts of the right spring group and the left spring group.

Description

Technical Field

[0001] The invention relates to the field of mechanical automation, in particular to a three-in-one combined device. Background Art

[0002] In the field of semiconductor packaging and electronic equipment manufacturing, accurately placing the substrate with the chip on the carrier and then covering it with a cover is an important step to protect the chip and ensure the stable operation of the electronic components. This process requires a high degree of automation and precision to ensure product quality and production efficiency. However, when performing this operation, the three-in-one combination equipment in the prior art often faces the technical problem of horizontal tilting of the substrate and the cover during the grabbing and stacking process, which not only affects the alignment accuracy of the package, but may also cause damage to the chip, reducing the overall production efficiency and product quality.

[0003] The three-in-one combined equipment in the prior art usually includes a carrier stage mechanism, a substrate stage mechanism, a cover stage mechanism and a transfer mechanism. Among them, the transfer mechanism is responsible for grabbing the substrate from the substrate stage mechanism and placing it on the carrier stage mechanism, and then grabbing the cover from the cover stage mechanism and covering it on the substrate. In order to achieve this process, the transfer mechanism is often equipped with a grabbing component, which is connected to the moving plate through elastic elements such as springs to achieve flexible grabbing of the substrate and the cover to avoid damage caused by hard contact.

[0004] However, in order to accommodate products of different sizes, the positioning components of the long sides of the substrate stage mechanism and the cover stage mechanism can move relative to each other. The lifting stage components in the substrate stage mechanism and the cover stage mechanism are usually offset from the positioning components on one side (such as the right side). When the grabbing component of the transfer mechanism applies downward pressure to grab the substrate or cover plate, this offset will cause the substrate or cover plate to be subjected to uneven pressure distribution in the horizontal direction. Specifically, due to the offset of the lifting stage component, when the grabbing component applies pressure, the support of the substrate or cover plate close to the lifting stage component (such as the right side) is relatively stable, while the side away from the lifting stage component (such as the left side) is relatively lacking in support, making the substrate or cover plate easy to tilt toward the side away from the lifting stage component. The emergence of the tilt problem not only affects the alignment accuracy between the substrate and the cover plate during the packaging process, reduces the packaging work efficiency, but may also cause the chip to be subjected to unnecessary pressure during the packaging process, increasing the risk of chip damage. Summary of the invention

[0005] The object of the present invention is to provide a three-in-one combined device, which can prevent the base plate and the cover plate from tilting in the horizontal direction during the grasping process, so as to improve the working efficiency of packaging.

[0006] To achieve the above object, the present invention provides the following technical solution: a three-in-one assembly device for placing a substrate with a chip on a carrier and then covering the substrate with a cover, the three-in-one assembly device comprising:

[0007] A carrier platform mechanism, used for placing the carrier;

[0008] A substrate stage mechanism is used to place a substrate; the substrate stage mechanism comprises a first right positioning plate and a first left pushing assembly which are arranged opposite to each other, and a first lifting stage assembly which is arranged between the first right positioning plate and the first left pushing assembly; the first right positioning plate and the first left pushing assembly position the long side of the substrate, and the lifting stage assembly is offset from the first right positioning plate;

[0009] A cover plate platform mechanism is used to place the cover plate; the cover plate platform mechanism comprises a second right positioning plate and a second left pushing assembly arranged opposite to each other, and a second lifting platform assembly arranged between the second right positioning plate and the second left pushing assembly; the second right positioning plate and the second left pushing assembly position the long side of the cover plate, and the second lifting platform assembly is offset from the second right positioning plate;

[0010] The transfer mechanism is supported by a bracket and runs above the carrier platform mechanism, the substrate platform mechanism and the cover plate platform mechanism to transfer the substrate and the cover plate to the carrier platform mechanism in sequence. The transfer mechanism includes a grasping assembly and a main cylinder that drives the grasping assembly to move in the height direction. The grasping assembly includes a positioning plate, a moving plate arranged below the positioning plate, a plurality of springs arranged between the positioning plate and the moving plate, an adjusting column connecting the positioning plate and the moving plate, and a suction nozzle arranged below the moving plate. The positioning plate and the adjusting column are slidably connected. The plurality of springs are divided into a right spring group and a left spring group. The right spring group and the left spring group are respectively arranged close to the long side of the moving plate, and the pre-compression amount of the right spring group is less than the pre-compression amount of the left spring group. The transfer mechanism is also provided with a pressing cylinder for pressing the long side position of the moving plate.

[0011] Furthermore, the adjusting column includes a rod body and a head arranged on one end of the rod body, a threaded portion is formed on the other end of the rod body, a threaded hole is formed on the movable plate to realize threaded connection with the threaded portion, a through hole is formed on the positioning plate for the rod body to pass through, the head is located above the positioning plate and the diameter of the head is larger than the diameter of the through hole.

[0012] Furthermore, the movable plate and the positioning plate are provided with accommodating grooves for accommodating the ends of the springs.

[0013] Furthermore, the movable plate includes an upper movable plate and a lower movable plate which are stacked and fixed, the threaded hole and the accommodating groove are arranged on the upper movable plate, the suction nozzle is arranged on the lower movable plate, and an air flow channel connected with the suction nozzle is formed in the lower movable plate.

[0014] Furthermore, a plurality of level sensors for detecting horizontality are arranged on the carrier platform mechanism.

[0015] Furthermore, the carrier platform mechanism includes a third left-side positioning plate and a second left-side pushing assembly that are relatively arranged, and a third lifting platform assembly that is arranged between the third left-side positioning plate and the second left-side pushing assembly, the third left-side positioning plate and the second left-side pushing assembly position the long side of the carrier, and the third lifting platform assembly is offset from the third left-side positioning plate.

[0016] Furthermore, the substrate stage mechanism also includes two groups of first conveyor belt assemblies arranged opposite to each other, and the first right positioning plate and the first left pushing assembly are respectively fixed on the two groups of first conveyor belt assemblies; the carrier stage mechanism also includes two groups of second conveyor belt assemblies arranged opposite to each other, and the third left positioning plate and the second left pushing assembly are respectively fixed on the second conveyor belt assemblies.

[0017] Furthermore, the three-in-one combined equipment further comprises a workbench, and a slide rail assembly is arranged between the workbench and the first conveyor belt assembly and the second conveyor belt assembly;

[0018] The carrier stage mechanism and the substrate stage mechanism are both provided with width driving components for driving the first conveyor belt component and the second conveyor belt component to move in the width direction.

[0019] Furthermore, the substrate stage mechanism includes a first positioning component for positioning the short side of the substrate, the cover stage mechanism includes a second positioning component for positioning the short side of the cover, and the carrier stage mechanism includes a third positioning component for positioning the short side of the carrier. One side of the carrier stage mechanism is provided with a position acquisition component for acquiring position information of a positioning column of the carrier on the carrier stage mechanism, and the first positioning component and the second positioning component move to corresponding positions according to the acquired position information.

[0020] Furthermore, the position acquisition component includes a displacement sensor and a driving member for driving the displacement sensor to move, the displacement sensor has a contact sensing head, a buffer sleeve is provided on the contact sensing head, and the formula for the contact sensing head to detect the position of the positioning column is as follows:

[0021] ,

[0022] in, Represents the X-axis position data directly measured by the displacement sensor; Represents the thickness of the buffer sleeve; Represents the elastic deformation amount of the buffer sleeve after being subjected to force; Represents the actual X-axis position of the positioning column.

[0023] The beneficial effects of the present invention are as follows: the three-in-one combined device of the present application sets the pre-compression amount of the right spring group to be smaller than the pre-compression amount of the left spring group. In this way, when the transfer mechanism grabs the substrate and the cover plate, when the movable plate applies pressure to the substrate and the cover plate and is subjected to a reaction force, since the pre-compression amount of the right spring group is smaller than the pre-compression amount of the left spring group, the pressure exerted by the movable plate on the substrate and the cover plate is different on the long sides on both sides, wherein the pressure on the long sides close to the first right positioning plate and the second right positioning plate is smaller than the pressure on the long sides away from the first right positioning plate and the second right positioning plate. The pressure on the long side of the positioning plate can avoid the substrate and cover plate from tilting in the horizontal direction due to the pressure applied by the moving plate to the substrate and cover plate during grasping caused by the first lifting platform assembly and the second lifting platform assembly being biased against the first right positioning plate and the second right positioning plate. At the same time, the present application also uses a pressure cylinder to apply downward pressure to the long side of the moving plate after the substrate and cover plate are grasped and before stacking, so as to correct the horizontal position of the moving plate and avoid the problem of tilting due to different pre-compression amounts of the right spring group and the left spring group. In summary, the present application can effectively solve the problem of horizontal tilting of the substrate and the cover plate during the grasping process by setting the pre-compression amounts of the right spring group and the left spring group differently and using a pressure cylinder, thereby improving the accuracy of alignment and the stability of operation, which helps to improve the work efficiency of packaging.

[0024] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the structure of a three-in-one combination device according to an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A schematic diagram of the structure of the transfer mechanism in FIG.

[0027] Figure 3 for Figure 1 Schematic diagram of the structure of the substrate stage mechanism. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] Please combine Figures 1 to 3A three-in-one combined device shown in a preferred embodiment of the present application is used to place a substrate with a chip on a carrier, and then cover the top of the substrate. The outer contours of the substrate, carrier and cover are all rectangular. The carrier is provided with a positioning column, and the substrate and cover are correspondingly provided with positioning holes. When the substrate and cover are stacked on the carrier in sequence, the positioning column passes through the positioning hole in sequence, and thus the packaging is completed. Through the matching setting of the positioning column and the positioning hole, the position displacement of the chip in the substrate due to shaking during the transportation of subsequent products can be avoided. The three-in-one combined device includes a workbench 10, a carrier stage mechanism 20 for placing a carrier, a substrate stage mechanism 30 for placing a substrate, a cover stage mechanism 40 for placing a cover, a transfer mechanism 60 supported by a bracket 50, and a control system (not shown). The carrier stage mechanism 20, the substrate stage mechanism 30, the cover stage mechanism 40, and the transfer mechanism 60 are all fixed on the workbench 10. A linear module 51 is disposed on the bracket 50 , and the transfer mechanism 60 is disposed on the linear module 51 to achieve movement above the carrier stage mechanism 20 , the substrate stage mechanism 30 and the cover stage mechanism 40 .

[0033] The substrate stage mechanism 30 includes a first right positioning plate 31 and a first left pushing assembly 32 which are arranged opposite to each other, and a first lifting stage assembly 33 which is arranged between the first right positioning plate 31 and the first left pushing assembly 32. The first right positioning plate 31 and the first left pushing assembly 32 position the long side of the substrate, and the first lifting stage assembly 33 is offset from the first right positioning plate 31.

[0034] The cover plate stage mechanism 40 includes a second right positioning plate 41 and a second left push assembly 42 that are arranged opposite to each other, and a second lifting stage assembly 43 that is arranged between the second right positioning plate 41 and the second left push assembly 42. The second right positioning plate 41 and the second left push assembly 42 position the long side of the cover plate, and the second lifting stage assembly 43 is offset from the second right positioning plate 41. The transfer mechanism 60 operates above the carrier stage mechanism 20, the substrate stage mechanism 30 and the cover plate stage mechanism 40 to transfer the substrate and the cover plate to the carrier on the carrier stage mechanism 20 in sequence.

[0035] The transfer mechanism 60 includes a grabbing assembly 61 and a main cylinder 62 for driving the grabbing assembly 61 to move in the height direction. The grabbing assembly 61 includes a positioning plate 611, a moving plate 612 arranged below the positioning plate 611, a plurality of springs 613 arranged between the positioning plate 611 and the moving plate 612, an adjusting column 614 connecting the positioning plate 611 and the moving plate 612, and a suction nozzle 615 arranged below the moving plate 612. Since the grabbing positions of the substrate and the cover plate are different during the grabbing process, in this embodiment, the number of the grabbing assemblies 61 on the transfer mechanism 60 is two, which are used to grab the substrate and the cover plate respectively. The positioning plate 611 and the adjusting column 614 are slidably connected, specifically, the positioning plate 611 is sleeved on the adjusting column 614, and the positioning plate 611 and the adjusting column 614 are clearance-fitted. The plurality of springs 613 are divided into a right spring group 6131 and a left spring group 6132 . The right spring group 6131 and the left spring group 6132 are respectively arranged close to the long side of the movable plate 612 . The pre-compression amount of the right spring group 6131 is smaller than the pre-compression amount of the left spring group 6132 .

[0036] It should be noted that the pre-compression amount refers to the degree to which the spring 613 has been compressed before normal operation. By adjusting the pre-compression amount, the reaction of the spring 613 when subjected to external force can be changed, including its stiffness (i.e., the force required for the spring 613 to produce a unit deformation) and the deformation amount (i.e., the elongation or shortening amount of the spring 613 when subjected to external force). In this embodiment, the first lifting platform assembly 33 and the second lifting platform assembly 43 are offset on one side of the first right positioning plate 31 and the second right positioning plate 41. If the pre-compression amount of the spring groups on both sides is the same, then when the gripping assembly 61 applies pressure, the substrate and the cover plate may tilt to one side due to the torque generated by the offset. In order to avoid this situation, by reducing the pre-compression amount of the right spring group 6131, the reaction force generated by the right spring group 6131 can be reduced relative to the left spring group 6132 under the same external force, thereby offsetting the torque generated by the offset and maintaining the horizontal stability of the substrate or cover plate.

[0037] In this embodiment, although the torque generated by the offset of the first lifting platform assembly 33 and the second lifting platform assembly 43 can be offset to a certain extent by adjusting the difference in pre-compression between the right spring group 6131 and the left spring group 6132, so that the substrate or cover plate maintains horizontal stability during the grasping process, there may still be a slight tilt in the horizontal direction due to the "sliding connection between the positioning plate 611 and the adjustment column 614" and the reset of the spring 613. The specific reasons are:

[0038] First, as an elastic element, the spring 613 has a limited reset capability. During the grabbing and stacking process, the spring 613 will be subjected to continuous compression and release, which will cause fatigue and performance degradation of the spring 613. In particular, when the pre-compression amount of the right spring group 6131 is less than that of the left spring group 6132, the reaction force generated by the right spring group 6131 is relatively small under the same deformation amount, and is therefore more susceptible to interference from external factors. If the right spring 613 is fatigued due to long-term use, its reset capability will be further weakened, which may increase the risk of the substrate or cover plate tilting to the right during the grabbing and stacking process.

[0039] Secondly, the sliding connection design between the positioning plate 611 and the adjustment column 614 enables the positioning plate 611 to be fine-tuned along the axial direction of the adjustment column 614 to a certain extent. Although the clearance fit design increases the flexibility of the system, it may also introduce unstable factors. Especially in the high-speed or high-precision grasping process, slight vibrations or shocks may cause slight changes in the position of the positioning plate 611 relative to the adjustment column 614, thereby affecting the positioning accuracy of the grasping component 61 on the substrate or cover plate.

[0040] In order to further overcome the potential unstable factors, the transfer mechanism 60 is also provided with a pressing cylinder 63 for pressing the long side position of the movable plate 612. It should be noted that the stroke amount of the pressing cylinder 63 on the two long side positions of the movable plate 612 is the same, and the stroke amount is the value set during the previous adjustment to ensure that the pressure applied by the pressing cylinders 63 on both sides to the movable plate 612 is balanced, thereby further offsetting the tilt that may be caused by the different pre-compression amounts of the spring 613 group, vibration or impact. When the pressing cylinder 63 presses the movable plate 612 to the set stroke amount, the pressing cylinder 63 is reset. There is no fixed connection between the pressing cylinder 63 and the movable plate 612. Only when the pressing cylinder 63 is working, the piston rod is pushed out by air pressure and directly pressed on the long side position of the movable plate 612, thereby applying downward pressure. In the present embodiment, a pressing cylinder 63 is provided on each long side, and in other embodiments, multiple pressing cylinders 63 may also be provided.

[0041] The three-in-one combination device of the present application sets the pre-compression amount of the right spring group 6131 to be smaller than the pre-compression amount of the left spring group 6132. In this way, when the transfer mechanism 60 grabs the substrate and the cover plate, the movable plate 612 applies pressure to the substrate and the cover plate and is subjected to a reaction force. Since the pre-compression amount of the right spring group 6131 is smaller than the pre-compression amount of the left spring group 6132, the pressure exerted by the movable plate 612 on the substrate and the cover plate is different on the long sides on both sides, wherein the pressure exerted on the long sides close to the first right positioning plate 31 and the second right positioning plate 41 is smaller than the pressure exerted on the long sides away from the first right positioning plate 31 and the second right positioning plate 41, thereby avoiding the substrate and the cover plate from tilting in the horizontal direction due to the pressure exerted by the movable plate 612 on the substrate and the cover plate during grabbing caused by the first lifting platform assembly 33 and the second lifting platform assembly 43 being biased against the first right positioning plate 31 and the second right positioning plate 41. At the same time, the present application also utilizes the pressure cylinder 63 to apply downward pressure to the long side of the movable plate 612 after the substrate and cover plate are grasped and before stacking, so as to correct the horizontal position of the movable plate 612, so as to avoid the problem of tilting due to the different pre-compression amounts of the right spring group 6131 and the left spring group 6132. In summary, the present application can effectively solve the problem of horizontal tilting of the substrate and cover plate during the grasping process by setting the pre-compression amounts of the right spring group 6131 and the left spring group 6132 differently and utilizing the pressure cylinder 63, thereby improving the accuracy of alignment and the stability of operation, and helping to improve the work efficiency of packaging.

[0042] It should be noted that, in the present embodiment, the pre-compression amount of the right spring group 6131 is set to be smaller than the pre-compression amount of the left spring group 6132. However, in other embodiments, if the first right positioning plate 31 of the substrate stage mechanism 30 and the second right positioning plate 41 of the cover stage mechanism 40 are set on the left side, they are changed to the first left positioning plate and the second left positioning plate, and the first lifting platform assembly 33 and the second lifting platform assembly 43 are biased towards the first left positioning plate and the second left positioning plate, then the pre-compression amount of the right spring group 6131 is set to be greater than the pre-compression amount of the left spring group 6132.

[0043] In this embodiment, the adjustment column 614 includes a rod body 6141 and a head 6142 disposed on one end of the rod body 6141, a threaded portion is formed on the other end of the rod body 6141, a threaded hole is formed on the movable plate 612 to achieve threaded connection with the threaded portion, a through hole (not numbered) is provided on the positioning plate 611 for the rod body 6141 to pass through, and the head 6142 is located above the positioning plate 611 and the diameter of the head 6142 is greater than the diameter of the through hole. The movable plate 612 and the positioning plate 611 are provided with a receiving groove 64 for accommodating the end of the spring 613, and the receiving groove 64 is provided to facilitate the assembly of the spring 613. The movable plate 612 includes an upper movable plate 612 and a lower movable plate 612 that are stacked and fixed, and the threaded hole and the receiving groove 64 are provided on the upper movable plate 612. The suction nozzle 615 is arranged on the lower moving plate 612. An airflow channel (not shown) communicating with the suction nozzle 615 is formed in the lower moving plate 612. The airflow channel runs through one side of the lower moving plate 612 to be connected to the vacuum device. By arranging the moving plate 612 as two separate structures, the upper moving plate 612 and the lower moving plate 612, it is convenient to arrange the airflow channel, the threaded hole, and the containing groove 64, and the manufacturing process is simple.

[0044] In the present embodiment, the carrier platform mechanism 20 includes a third left-side positioning plate 21 and a second left-side pushing assembly 22 that are relatively arranged, and a third lifting platform assembly 23 that is arranged between the third left-side positioning plate 21 and the second left-side pushing assembly 22. The third left-side positioning plate 21 and the second left-side pushing assembly 22 position the long side of the carrier, and the third lifting platform assembly 23 is offset from the third left-side positioning plate 21. The first lifting platform assembly 33, the second lifting platform assembly 43 and the third lifting platform assembly 23 have roughly the same structure. Taking the first lifting platform assembly 33 as an example, it includes a lifting platform 331 and a lifting drive mechanism 332 arranged below the lifting platform 331, and the lifting drive mechanism 332 drives the lifting platform 331 to move up and down. In the present embodiment, the first lifting platform assembly 33 and the second lifting platform assembly 43 have the same structure, and both are used to lift up a carrier or a substrate that has been moved into place.

[0045] In this embodiment, the substrate stage mechanism 30 and the carrier stage mechanism 20 realize continuous transmission of substrates and carriers through conveyor belts. Specifically, the substrate stage mechanism 30 also includes two sets of first conveyor belt assemblies 34 arranged opposite to each other, and the first right positioning plate 31 and the first left push-resistance assembly 32 are respectively fixed on the two sets of first conveyor belt assemblies 34; the carrier stage mechanism 20 also includes two sets of second conveyor belt assemblies 24 arranged opposite to each other, and the third left positioning plate 21 and the second left push-resistance assembly 22 are respectively fixed on the second conveyor belt assembly 24. In this embodiment, the third left positioning plate 21 and the first right positioning plate 31 are plate bodies fixed on the second conveyor belt assembly 24 and the first conveyor belt assembly 34, respectively. When the substrate and the carrier are respectively transported to the designated position by the first conveyor belt assembly 34 and the second conveyor belt assembly 24 (usually detected by sensors), the first lifting platform assembly 33 and the third lifting platform assembly 23 are respectively started, and the respective lifting platforms 331 lift the substrate and the carrier, so that the substrate and the carrier leave the first conveyor belt assembly 34 and the second conveyor belt assembly 24. The first conveyor belt assembly 34 and the second conveyor belt assembly 24 adopt the existing technology and will not be described in detail here.

[0046] In order to enable the substrate stage mechanism 30 and the carrier stage mechanism 20 to transport substrates and carriers of different sizes, the positions of the first conveyor belt assembly 34 and the second conveyor belt assembly 24 on the workbench 10 can be adjusted along the width direction of the substrate and the carrier. Specifically, a slide rail assembly 71 is provided between the workbench 10 and the first conveyor belt assembly 34 and the second conveyor belt assembly 24, and a width driving assembly (unnumbered) for driving the first conveyor belt assembly 34 and the second conveyor belt assembly 24 to move along the width direction is provided on the carrier stage mechanism 20 and the substrate stage mechanism 30. A plurality of stacked cover plates are placed on the cover plate stage mechanism 40. In this embodiment, a receiving cavity (unnumbered) for receiving a plurality of cover plates is formed between the second right positioning plate 41, the second left push-butt assembly 22 and the second positioning assembly 44. When the upper cover plate is moved out by the transfer mechanism 60, its lifting platform 331 is lifted up one grid. In order to make the cover plate platform mechanism 40 adapt to covers of different sizes, the cover plate platform mechanism 40 also includes a fixing plate 73 for fixing the second left push component 42 on the linear drive component 74.

[0047] In order to confirm the flatness after stacking and avoid tilting and offsetting in the horizontal direction, a plurality of level sensors 75 for detecting the horizontality are arranged on the carrier platform mechanism 20. Specifically, the level sensors 75 are laser sensors.

[0048] The first right side positioning plate 31, the second right side positioning plate 41, and the third left side positioning plate 21 are fixed structures, and their positions will not change. The first left side pushing and abutting assembly 32, the second left side pushing and abutting assembly 42, and the second left side pushing and abutting assembly 22 adjust their positions according to the requirements of different sizes. In this way, the long sides of the substrate, the cover plate, and the carrier are positioned respectively by the first right side positioning plate 31 and the first left side pushing and abutting assembly 32, the second right side positioning plate 41 and the second left side pushing and abutting assembly 42, and the third left side positioning plate 21 and the second left side pushing and abutting assembly 22. In addition to the long sides, in this embodiment, the three-in-one device also realizes the positioning of the short sides of the substrate, the cover plate, and the carrier. Specifically, the substrate stage mechanism 30 includes a first positioning assembly 35 for positioning the short sides of the substrate, the cover plate stage mechanism 40 includes a second positioning assembly 44 for positioning the short sides of the cover plate, and the carrier stage mechanism 20 includes a third positioning assembly 25 for positioning the short sides of the carrier. The principles of the first positioning assembly 35, the second positioning assembly 44, and the third positioning assembly 25 are similar. Taking the first positioning assembly 35 as an example, the first positioning assembly 35 is located between the two first conveyor belt assemblies 34 and on both sides of the lifting platform 331. It includes a front positioning assembly 351 and a rear positioning assembly 352, wherein the front positioning assembly 351 is provided with a sensing member (not numbered) for detecting whether there is a substrate on the lifting platform 331. When there is a substrate on the lifting platform 331, the front positioning assembly 351 and the rear positioning assembly 352 are respectively driven by the upper and lower linear drive assemblies and the front and rear linear drive assemblies provided below them to move upward and forward and backward to respectively support the two short sides of the substrate. The upper and lower directions are the height directions of the substrate stage mechanism 30, and the front and rear directions are the extension directions of the long sides of the substrate.

[0049] According to the above content, the substrate stage mechanism 30 and the carrier stage mechanism 20 can transport substrates and carriers of different sizes, and correspondingly, the size of the cover plate will also change accordingly. When the sizes of the substrate, carrier and cover plate are different, the positions of the positioning posts and positioning holes in the width direction (of the substrate, carrier and cover plate) will change, and their positions in the length direction (of the substrate, carrier and cover plate) will not change. Due to the above reasons, in order to facilitate positioning, in this embodiment, the position of the front positioning component 351 can be set in advance according to different sizes, and the positioning holes and positioning posts are located on one side of the front positioning component 351, and then the position of the rear positioning component 352 can be adjusted according to the size of the substrate, carrier and cover plate, wherein the system is preset with the position data of the positioning posts and positioning holes of each size, and when the size of the currently transported substrate, carrier and cover plate is input into the system, the system calls the corresponding data to obtain the position data of the positioning posts and positioning holes.

[0050] However, the above scheme can only locate products of known size. When there are products of unknown size, it is necessary to reset them in advance and then input them into the system, which is cumbersome for users. In order to solve this problem and realize the full automation of the three-in-one combination equipment, high-precision graphic recognition technology can also be used. In addition, in the packaging process described in the background technology, the precise positioning between the carrier, substrate and cover plate is achieved by the precise matching of the alignment column and the corresponding alignment hole. However, in view of the tiny size characteristics of the alignment hole and the alignment column, the positioning operation is highly dependent on high-precision graphic recognition technology to accurately capture the position information of these subtle elements, thereby ensuring the accurate alignment of each component. However, the adoption of high-precision graphic recognition technology significantly increases the cost of equipment, and in view of the relatively affordable market pricing of chip products, this high technical investment is not economical. Therefore, although high-precision recognition technology can theoretically ensure accurate alignment, its cost-effectiveness does not meet industry needs when it is actually applied to the positioning of carriers, substrates and cover plates.

[0051] On the other hand, if we rely on manual operation to complete this alignment process, although it may reduce equipment costs to a certain extent, it will be accompanied by a significant decline in work efficiency, which obviously does not meet the high-efficiency requirements of modern production.

[0052] In order to solve this problem, a position acquisition component (not shown) is provided on one side of the carrier platform mechanism 20 for acquiring position information of the positioning column of the carrier on the carrier platform mechanism 20, and the first positioning component 35 and the second positioning component 44 move to corresponding positions according to the acquired position information.

[0053] Specifically, the position acquisition component includes a displacement sensor and a driving member that drives the displacement sensor to move linearly. The displacement sensor has a contact sensing head, and a buffer sleeve is provided on the contact sensing head. The formula for the contact sensing head to detect the position of the positioning column is as follows:

[0054] ,

[0055] in, Represents the X-axis position data directly measured by the sensor (including the influence of the buffer sleeve);

[0056] Represents the thickness of the cushioning sleeve (static thickness when no force is applied);

[0057] Represents the elastic deformation (i.e. thickness change) of the buffer sleeve after being subjected to force;

[0058] Represents the actual X-axis position of the positioning column (i.e. the position after removing the influence of the buffer sleeve);

[0059] By setting it in this way, the degree of automation and cost investment are balanced, overcoming the inherent contradiction between the alignment accuracy and economy in the prior art. The value is 10.5mm (the position directly measured by the sensor). The value is 0.10mm (static thickness of the buffer sleeve). The value is 0.05mm (the assumed elastic deformation of the buffer sleeve), then mm, this value is the actual position of the positioning column on the X-axis (the position after removing the influence of the buffer sleeve). It should be noted that in actual application, in order to facilitate calculation, the final value is In this embodiment, the driving member is a cylinder, and the driving member can use the conventional contact force feedback or displacement change detection method in the prior art to know that the position acquisition component abuts against the positioning column, so that the driving member stops the movement of the position acquisition component.

[0060] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A three-in-one assembly device for placing a substrate with a chip on a carrier and then covering the substrate with a cover, characterized in that: The three-in-one combination device comprises: A carrier platform mechanism, used for placing the carrier; A substrate stage mechanism is used to place a substrate; the substrate stage mechanism comprises a first right positioning plate and a first left pushing assembly which are arranged opposite to each other, and a first lifting stage assembly which is arranged between the first right positioning plate and the first left pushing assembly; the first right positioning plate and the first left pushing assembly position the long side of the substrate, and the lifting stage assembly is offset from the first right positioning plate; A cover plate platform mechanism is used to place the cover plate; the cover plate platform mechanism comprises a second right positioning plate and a second left pushing assembly arranged opposite to each other, and a second lifting platform assembly arranged between the second right positioning plate and the second left pushing assembly; the second right positioning plate and the second left pushing assembly position the long side of the cover plate, and the second lifting platform assembly is offset from the second right positioning plate; The transfer mechanism is supported by a bracket and runs above the carrier platform mechanism, the substrate platform mechanism and the cover platform mechanism to transfer the substrate and the cover plate to the carrier platform mechanism in sequence, the transfer mechanism comprising a grasping assembly and a main cylinder driving the grasping assembly to move in a height direction, the grasping assembly comprising a positioning plate, a moving plate arranged below the positioning plate, a plurality of springs arranged between the positioning plate and the moving plate, an adjusting column connecting the positioning plate and the moving plate, and a suction nozzle arranged below the moving plate, the positioning plate and the adjusting column are slidably connected, the plurality of springs are divided into a right spring group and a left spring group, the right spring group and the left spring group are respectively arranged close to the long side of the moving plate, the pre-compression amount of the right spring group is less than the pre-compression amount of the left spring group; the transfer mechanism is also provided with a pressing cylinder for pressing the long side position of the moving plate; The adjusting column includes a rod body and a head arranged on one end of the rod body, a threaded portion is formed on the other end of the rod body, a threaded hole is formed on the movable plate to realize threaded connection with the threaded portion, a through hole is formed on the positioning plate for the rod body to pass through, the head is located above the positioning plate and the diameter of the head is larger than the diameter of the through hole.

2. The three-in-one combination device according to claim 1, characterized in that: The movable plate and the positioning plate are provided with accommodating grooves for accommodating the ends of the springs.

3. The three-in-one combination device according to claim 2, characterized in that: The movable plate comprises an upper movable plate and a lower movable plate which are stacked and fixed, the threaded hole and the accommodating groove are arranged on the upper movable plate, the suction nozzle is arranged on the lower movable plate, and an air flow channel connected with the suction nozzle is formed in the lower movable plate.

4. The three-in-one combination device according to claim 1, characterized in that: The carrier platform mechanism is provided with a plurality of level sensors for detecting the levelness.

5. The three-in-one combination device according to claim 1, characterized in that: The carrier platform mechanism includes a third left-side positioning plate and a second left-side pushing assembly arranged relatively to each other, and a third lifting platform assembly arranged between the third left-side positioning plate and the second left-side pushing assembly, the third left-side positioning plate and the second left-side pushing assembly position the long side of the carrier, and the third lifting platform assembly is offset from the third left-side positioning plate.

6. The three-in-one combination device according to claim 5, characterized in that: The substrate stage mechanism also includes two groups of first conveyor belt assemblies arranged opposite to each other, and the first right positioning plate and the first left pushing assembly are respectively fixed on the two groups of first conveyor belt assemblies; the carrier stage mechanism also includes two groups of second conveyor belt assemblies arranged opposite to each other, and the third left positioning plate and the second left pushing assembly are respectively fixed on the second conveyor belt assemblies.

7. The three-in-one combination device according to claim 6, characterized in that: The three-in-one combined equipment further comprises a workbench, and a slide rail assembly is arranged between the workbench and the first conveyor belt assembly and the second conveyor belt assembly; The carrier stage mechanism and the substrate stage mechanism are both provided with width driving components for driving the first conveyor belt component and the second conveyor belt component to move in the width direction.

8. The three-in-one combination device according to claim 1, characterized in that: The substrate stage mechanism includes a first positioning component for positioning the short side of the substrate, the cover stage mechanism includes a second positioning component for positioning the short side of the cover, and the carrier stage mechanism includes a third positioning component for positioning the short side of the carrier. One side of the carrier stage mechanism is provided with a position acquisition component for acquiring position information of a positioning column of the carrier on the carrier stage mechanism, and the first positioning component and the second positioning component move to corresponding positions according to the acquired position information.

9. The three-in-one combination device according to claim 8, characterized in that: The position acquisition component includes a displacement sensor and a driving member for driving the displacement sensor to move. The displacement sensor has a contact sensing head, and a buffer sleeve is provided on the contact sensing head. The formula for detecting the position of the positioning column by the contact sensing head is as follows: ； in, Represents the X-axis position data directly measured by the displacement sensor; Represents the thickness of the buffer sleeve; Represents the elastic deformation amount of the buffer sleeve after being subjected to force; Represents the actual X-axis position of the positioning column.

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