Apparatus for maskless material deposition on another substrates by direct laser writing and method for using same

Abstract

An apparatus includes an optical write module and an optical characterization module. The optical write module is configured to emit a laser beam and direct the laser beam to a substrate. The optical characterization module is optically coupled to the optical write module such that the optical write module and the optical characterization module share the same optical path. The optical write module is configured to emit a viewing beam toward the substrate. The optical characterization module is also configured to determine whether the mixture of the solution and the suspension is in contact with the substrate. When it is determined that the mixture is in contact with the substrate, a laser beam is caused to irradiate the mixture near the surface of the substrate, thereby forming a deposition of mechanically rigid material in contact with the substrate.

Description

Technical Field

[0001] The present invention relates to a maskless material deposition method, and more particularly, to a device for performing maskless material deposition on an arbitrary substrate by direct laser writing and a method using the same. Background Art

[0002] Diamond and diamond-like materials have many desirable properties, including wear resistance, thermal conductivity, electrical resistivity, acoustic conductivity, and corrosion resistance, which make them attractive for use in a variety of industrial applications. In the field of quantum computing, diamond can serve as a perfect carrier for quantum bit spin defects called nitrogen vacancy (NV) color centers. For example, one signal detection method requires depositing a microwave waveguide on the surface of the diamond, very close to the NV center. Traditional methods require expensive and complex equipment to grow conductive metals at specific locations, and alignment of the waveguide with the NV center has always been a problem.

[0003] Furthermore, known material deposition methods often require patterned masks, which is neither economical nor time-efficient. The waveguide design depends on the distribution of NV centers in diamond, which is arbitrary and unpredictable. Therefore, each sample requires a unique design, which makes the mask a disposable item and is not very reasonable to use. Therefore, a mask-free method with low economic and time costs is urgently needed.

[0004] Adhering micro-material patterns on different substrates is very important in many scenarios. Moreover, since a cleaning process is also required, it is expected that the deposited micro-material pattern will continue to remain after cleaning. Some existing methods achieve this by heavily etching the substrate surface, which should be avoided in some cases. This is because damage to the surface may cause problems, and direct laser writing methods provide a possible solution to overcome the above problems.

[0005] Therefore, there is a need for an improved method that can deposit materials on a substrate surface without using a mask, thereby eliminating the limitation of the substrate material and also enhancing the adhesion of the deposited pattern. Summary of the invention

[0006] The purpose of the present invention is to provide a device and a method of using the same to solve the above problems existing in the prior art.

[0007] In the present invention, the solution provided relates to the deposition of materials that can be used to produce conductive, semiconducting, insulating features and patterns. Through the provided device, the composition can be advantageously deposited on various substrates at low temperatures. The deposited material can form a strong attachment relationship with the substrate and can resist rinsing, ultrasonic waves and soaking of organic solvents. It can also allow the nanoparticle composition to form a maskless deposition on different substrates.

[0008] According to one aspect of the present invention, a method is provided, which is to use a platform to perform maskless material deposition on any substrate. The method includes the following steps: fixing the substrate using a substrate holder; using a first liquid injector, providing a first solution containing a metal acid salt, a metal ion, an active halogen ion or a combination thereof to the substrate; using a second liquid injector, providing a first suspension containing nanoparticles, a photosensitive reducing agent, an electron donor solvent or a combination thereof to the substrate to form a reagent on the substrate, wherein the substrate is exposed to an ambient gas or air environment; arranging a laser source to emit a laser beam; guiding the laser beam and focusing the laser beam on the reagent on the substrate; arranging a light source to emit an observation beam to the reagent on the substrate; and determining whether the reagent remains on the first area of ​​the substrate, wherein when it is determined that the reagent is on the first area of ​​the substrate, enabling the laser beam to irradiate the reagent on the first area of ​​the substrate to form a mechanically rigid material deposit in contact with the first area of ​​the substrate, and the irradiation of the reagent by the laser beam occurs in a gas or air environment.

[0009] According to one aspect of the present invention, a method is provided for performing maskless material deposition on any substrate using a platform. The method comprises the following steps: fixing the substrate using a substrate holder; providing a first solution including a metallization, a metal ion, an active halogen ion or a combination thereof into a transparent solution container using a first liquid injector; providing a first suspension including nanoparticles, a photosensitive reducing agent, an electron donor solvent or a combination thereof into the transparent solution container using a second liquid injector to form a mixture of the first solution and the first suspension in the transparent solution container; positioning the sample in the transparent solution container so that the sample is immersed in the mixture of the first solution and the first suspension; arranging a laser source to emit a laser beam; guiding the laser beam and focusing the laser beam onto the sample; arranging a light source to emit an observation beam onto the sample; and irradiating the sample with the laser beam to form a mechanically rigid material deposition in contact with the sample. Liquid injector

[0010] According to one aspect of the present invention, there is provided an apparatus for performing maskless material deposition on an arbitrary substrate. The apparatus comprises an optical writing module and an optical characterization module. The optical writing module is configured to emit a laser beam and direct the laser beam to the substrate. The optical characterization module is optically coupled to the optical writing module so that the optical writing module and the optical characterization module share the same optical path. The optical characterization module is configured to emit an observation beam to the substrate. The optical characterization module is also configured to determine whether a mixture of a solution and a suspension is in contact with the substrate. When it is determined that the mixture is in contact with the substrate, a laser beam is enabled to irradiate the mixture near the surface of the substrate, thereby forming a mechanically rigid material deposition in contact with the substrate.

[0011] In the present disclosure, a method is provided that can be applied to conductive, semiconducting or insulating materials for making functional patterned deposits on any substrate. The material deposition can form a strong adhesion to the substrate, which is advantageously promoted by direct writing lasers. In addition, the material deposition conversion temperature is low, which can avoid damage to the substrate. The nanoparticle composition allows deposition to be formed on different substrates without the need for masks. In addition, the solution provided by the present invention can simultaneously achieve nitrogen vacancy (NV) optical detection and waveguide deposition in a single device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The embodiments of the present invention will be described in more detail with reference to the accompanying drawings, in which:

[0013] Figure 1 A schematic diagram of an apparatus provided according to an embodiment of the present invention, which is used for performing maskless material deposition on any substrate;

[0014] Figure 2A , Figure 2B , Figure 2C and Figure 2D A schematic diagram of a method for using a platform according to an embodiment of the present invention, which is used for performing maskless material deposition on any substrate;

[0015] Figure 3 A schematic diagram of a method for using a platform according to an embodiment of the present invention for performing maskless material deposition on an arbitrary substrate; and

[0016] Figure 4 It is a schematic diagram of an apparatus provided according to an embodiment of the present invention, which is used for performing maskless material deposition on any substrate. DETAILED DESCRIPTION

[0017] In the following description, an apparatus for performing maskless material deposition on any substrate and a method using the apparatus as a platform are described as preferred examples. Those skilled in the art will appreciate that modifications, including additions and / or substitutions, may be made without departing from the scope and spirit of the invention. Specific details may be omitted so as not to obscure the invention; however, the present disclosure is written to enable those skilled in the art to practice the teachings herein without undue experimentation.

[0018] In the present disclosure, various embodiments or examples are provided to illustrate different aspects of the subject matter. Specific examples of components and arrangements are included. However, these descriptions are illustrative only and are not intended to be limiting. When describing features, a reference to a first feature being formed on or above a second feature may refer to a situation where the first feature directly contacts the second feature, or to a situation where an additional feature separates them. In addition, for clarity and simplicity, reference numbers or letters may be repeated in the examples, but no relationship between the different embodiments or configurations is implied.

[0019] In this context, to simplify the explanation, terms related to spatial directions, such as "below", "beneath", "lower", "above", "upper", "under", "left", "right" and similar expressions may be used to describe the relationship between one component or feature shown in the figures and another component or feature. In addition to the orientation shown in the figures, these spatial terms are intended to cover various orientations of the device during use or operation. The device can be positioned in different ways (for example, rotating the passivation layer 90 degrees or in other orientations), so the spatial descriptors mentioned here may be applied for clarification. It is worth noting that when a component is described as being "connected" or "coupled" to another component, it can be directly connected or coupled to that component, or intermediate components may be involved.

[0020] In the present disclosure, the terms "approximately", "substantially", "substantially" and "about" are used to describe slight variations. When combined with an event or circumstance, these terms can indicate both the exact and approximate occurrence of the event or circumstance. When used for a specific value or range, "approximately" generally means within ±10%, ±5%, or ±1% of the given value or range. Unless otherwise stated, all ranges mentioned include their endpoints. For example, "substantially coplanar" can mean surfaces that are a few microns (μm) apart from each other along the same plane, such as within 10 μm, 5 μm, or 1 μm.

[0021] Figure 1Schematic diagram of an apparatus 100A according to some embodiments of the present invention, which is used for performing maskless material deposition on any substrate. The apparatus 100A is a platform for a direct laser writing system, providing a one-stop service. The apparatus 100A includes a sample carrier 110, an optical writing module 120, an optical characterization module 130, a first liquid injector 140, and a second liquid injector 150.

[0022] The sample carrier 110 is configured to hold the substrate 102 or to fix the substrate 102 to its top surface. The substrate 120 can be processed on the substrate 120 to form a mechanically rigid material deposition on the top surface of the substrate 120. The mechanically rigid material deposition can be formed by a reagent 104. The reagent 104 can be formed by a mixed solution and a suspension, and the solution and the suspension are formed by dripping or injecting by the first liquid injector 140 and the second liquid injector 150, respectively. In various embodiments, before forming the mechanically rigid material deposition, the first liquid injector 140 and the second liquid injector 150 can be prepared.

[0023] The first liquid injector 140 is configured to provide a first solution including a metal acid salt, a metal ion, a reactive halogen ion or a combination thereof. To this end, the first liquid injector 140 has an inner wall that is chemically inert relative to the stored first solution, thereby preventing any chemical reaction from occurring, so that it can be stably stored in the first liquid injector 140. In one embodiment, the first solution includes chloride (Cl) ions, fluorine (F) ions, hydroxyl (OH) ions or a combination thereof. In one embodiment, the first solution includes gold chloride (III) hydrochloride (HAuCl4), chloroplatinic acid (H2PtCl6), silver nitrate (AgNO3), ferric chloride (FeCl3), a noble metal solution or a combination thereof. The inner wall of the first liquid injector 140 is selected to prevent any chemical reaction between the stored substances. In some embodiments, the first liquid injector 140 can be configured to perform dripping, spraying, microfluidic channels, ink injection or a combination thereof, so that the reagent 104 can be applied to the substrate 102 by optionally selecting dripping, spraying, microfluidic channels, ink injection or a combination thereof.

[0024] The second liquid injector 150 is configured to provide a first suspension, which includes nanoparticles, a photosensitive reducing agent, an electron donor solvent, or a combination thereof. In this regard, the second liquid injector 150 has an inner wall that is chemically inert to the stored first suspension, thereby preventing any chemical reaction from occurring, so that it can be stably stored in the second liquid injector 150. In one embodiment, the photosensitive reducing agent of the first suspension includes reduced graphene oxide, quantum dots, carbon ink particles, or a combination thereof. In one embodiment, the electron donor solvent of the first suspension includes water, ethanol, propanol, isopropanol, acetone, methanol, or a combination thereof. The inner wall of the second liquid injector 150 is selected to prevent any chemical reaction between the stored substances. In some embodiments, the second liquid injector 150 can be configured to perform dripping, spraying, microfluidics, ink injection, or a combination thereof, so that the reagent 104 can be applied to the substrate 102 by optionally selecting dripping, spraying, microfluidics, ink injection, or a combination thereof.

[0025] It should be particularly mentioned that, although the first liquid injector 140 and the second liquid injector 150 are used for injection, according to various embodiments of the present invention, a single injector may also be used to inject the mixture of the first solution and the first suspension. The present invention is not limited by the injection form.

[0026] The optical writing module 120 is disposed above the sample carrier 110 , and includes a laser source 122 , an optical modulation component 124 , a dichroic mirror 126 , and a lens 128 .

[0027] The laser source 122 is optically coupled to the optical modulation component 124 to provide a laser beam LA. The laser source 122 can provide a continuous wave laser or a pulsed laser in the visible light range or a wavelength of 405nm or 532nm. When the laser source 122 is configured to provide a laser beam with a wavelength of 405nm or 532nm, the laser power can be set to 0.01mW to 400mW. In one embodiment, the optical modulation component 124 is a shutter or an acousto-optic modulator (AOM) to control the on / off state of the laser beam LA. The laser source 122 of the present invention is not limited by the wavelength applied to the laser beam.

[0028] The dichroic mirror 126 is coupled to the laser source 122 to receive the laser beam LA. The dichroic mirror 126 is used to reflect the laser beam LA, thereby changing its propagation direction, and after being reflected by the dichroic mirror 126, it is called the laser beam LB. In this regard, the dichroic mirror 126 is also used to allow another beam of light with a different wavelength from the laser beam LA to pass through. For example, the observation beam from the position above the dichroic mirror 126 can pass through the dichroic mirror 126 and continue to propagate downward. In this way, the laser beam and the observation beam can be separated by the dichroic mirror 126.

[0029] The lens 128 is coupled to the dichroic mirror 126 to receive the laser beam LB and serves as an objective lens to focus the laser beam LB onto the top surface of the substrate 102. For example, after being focused by the lens 128, the laser beam LB can be concentrated onto the reagent 104 on the substrate 102. In one embodiment, the lens 128 can be configured using an air objective lens, an oil objective lens, or a water immersion objective lens.

[0030] One of the purposes of setting the optical writing module 120 is to guide the laser beam to the reagent 104 on the substrate 102. In one embodiment, the optical writing module 120 also includes an optical coupler for receiving the light beam LB emitted from the reagent 104 on the substrate 102. In one embodiment, the optical coupler is set using at least one photon waveguide, at least one optical fiber, at least one attenuation coupler or a combination thereof. In one embodiment, the optical coupler is set using a reflector and a lens in free space. In one embodiment, the optical writing module 120 also includes a laser galvanometer scanning system, which is used to control the focus of the lens 128 to move. Therefore, the optical writing module 120 can use the laser galvanometer scanning system to optically adjust the focus of the laser beam LB on the reagent 104 on the substrate 102. In this regard, the focus of the laser beam LB can be adjusted to a position in the reagent 104 close to the surface of the substrate 102, and includes continuous movement along the surface direction of the substrate 102.

[0031] Optical characterization module 130 is disposed above sample carrier 110 and optical writing module 120, and includes light source 132, first beam splitter 134, second beam splitter 136, light receiver 138, and image recorder 139. Optical characterization module 130 is optically coupled to optical writing module 120 so they can share the same optical path.

[0032] The light source 132 is optically coupled to the first beam splitter 134 and is configured to provide a light beam OB1 . The light beam OB1 is used as an observation light beam for optical characterization, and has a wavelength or a wavelength interval different from that of the laser beam provided by the laser source 122 .

[0033] The first beam splitter 134 and the second beam splitter 136 are configured together to guide the observation beam. The first beam splitter 134 and the second beam splitter 136 can be optically coupled with the light source 132, the light receiver 138, the image recorder 139 and the dichroic mirror 126. Specifically, the light beam OB1 is reflected by at least the first beam splitter 134, and then referred to as the light beam OB2, and then passes through the dichroic mirror 126, and then propagates toward the reagent 104 on the substrate 102 through the lens 128. In this regard, the observation beam is used to realize real-time observation during the manufacturing process through the reflected light formed by self-reflection.

[0034] The light reflected from the light beam OB2 is marked as the light beam OB2', which propagates to the first beam splitter 134 and the second beam splitter 136 in sequence. The first beam splitter 134 and the second beam splitter 136 can guide the light beam OB2' to the image recorder 139, wherein the image recorder 139 is configured to observe the formation of the mechanical rigid material deposition in real time. In one embodiment, the image recorder 139 can determine whether the reagent 104 remains on the desired area of ​​the substrate 102. Such an arrangement can improve the device manufacturing yield of the platform. The optical receiver 138 is configured to receive an optical signal from the reagent 104 on the substrate 102 for optical characterization, and therefore there is no need to move the substrate 102, which includes measuring the absorption coefficient, reflectivity, transmittance or other optical properties.

[0035] In one embodiment, the apparatus 100A further includes an actuator 136 configured to adjust the optical relationship between the sample carrier 110, the optical writing module 120, and the optical characterization module 130, so that the focus of the laser source 122 can be continuously moved along the surface of the substrate 102, thereby causing the writing laser beam to move horizontally over the reagent 104 on the substrate 102. In this regard, the profile of the deposition of the mechanically rigid material depends on the trajectory of the writing laser beam.

[0036] The described platform integrates the above components to improve the automation efficiency of direct laser writing systems, including automated tools for process control and inspection. This design improves productivity, reduces errors, and speeds up the device manufacturing process. In addition, it allows real-time imaging, observation, recording, and measurement of optical properties during the laser writing process.

[0037] Figure 2A , Figure 2B , Figure 2C , Figure 2D Schematic diagram of a method for performing maskless material deposition on an arbitrary substrate using a platform according to an embodiment of the present invention.

[0038] exist Figure 2A In the process, the substrate 102 is fixed by the sample carrier 110 to facilitate the subsequent deposition process on the substrate 102. At this stage, preparatory work can also be performed. The first solution is prepared and placed in the first liquid injector 140, and the first suspension is prepared and placed in the second liquid injector 150. The optical writing module 120 is set so that the focus of the laser source can be adjusted to a position near the surface of the substrate 102, that is, the area where deposition is scheduled to be performed. The optical characterization module 130 is set so that the observation beam provided by the optical characterization module 130 can take an image or video of the deposition performed on the substrate 102.

[0039] exist Figure 2BIn the step of forming the reagent 104 on the substrate 102, a portion of the first solution and a portion of the first suspension are applied to the surface of the substrate 102 by the first liquid injector 140 and the second liquid injector 150, respectively, to mix them and form the reagent 104 on the substrate 102. At this stage, the substrate 102 is exposed to the surrounding gas or air environment. For example, the first region R1 of the substrate 102 is covered with the reagent 104, while the second region R2 of the substrate 102 is directly exposed to the surrounding gas or air environment.

[0040] Next, refer to Figure 2C , the optical characterization module 130 (such as Figure 1 The image recorder 139 (as shown in FIG. 1 ) determines whether the reagent 104 is held on the first region R1 of the substrate 102. When it is determined that the reagent 104 is on the first region R1 of the substrate 102, the optical writing module 120 (as shown in FIG. 1 ) is triggered. Figure 1 The laser source 122 and the optical modulation component 124 of the optical writing module 120 are provided so that the writing laser beam WL can irradiate the reagent 104 on the first region R1 of the substrate 102, thereby forming a mechanically rigid material deposit 10 in contact with the first region R1 of the first substrate 102. The irradiation of the writing laser beam WL to the reagent 104 is maskless, so that the second region R2 of the substrate 102 is exposed to the gas or air environment during the irradiation process. The position of the formed mechanically rigid material deposit 10 is determined by the focus of the laser source 122 of the optical writing module 120 (as shown in FIG. Figure 1 In one embodiment, after a single deposition process to form the mechanically rigid material deposit 10, the deposition process may be repeated to thicken the mechanically rigid material deposit 10 or make the mechanically rigid material deposit 10 more dense.

[0041] In short, after these prepared materials (for example, metal ions, active halogen ions and nanoparticles, photosensitive reducing agents, or electron donor solvents) are applied to the surface of the substrate 102, a writing laser beam WL with appropriate power can be focused onto the substrate surface; thereafter, the photon-induced chemical reduction process is completed, and the materials aggregate to form a mechanically rigid material deposit 10.

[0042] Specifically, when the writing laser beam WL is focused on the reagent 104, free electrons will be excited by photons from the valence band of the photosensitive reducing agent (e.g., semiconductor nanoparticles), triggering a chemical reduction process. Such a process will convert the metal ions present in the solution into metal particles, metal salt microcrystals, or metal oxide particles on the substrate surface. As the initial material begins to take shape, the local heating caused by the laser will cause an increase in vapor pressure, ultimately leading to the formation of microbubbles. These microbubbles contribute to convection and capillary forces, and transport particles to the bottom of the microbubbles, so that a portion of the particles can be fixed there. At the same time, the focused writing laser beam WL can act as a light trap, driving the particles to the focus of the substrate surface. The scattering force further enhances the adhesion between the particles and the substrate. By combining these mechanisms, the reduced material grown on the particle surface effectively acts as an adhesive and bonds the captured particles together, forming a mechanically strong deposit 10 (e.g., capable of forming a 3D pattern) again on the substrate surface or at the top of the previously deposited material layer. In addition, the presence of active halogen ions also enhances the adhesion between the material and the substrate. The in-situ etching mechanism promoted by active halide ions also enhances the strong adhesion between the deposited material and the substrate. In addition, this method does not contain the use of any strong acid, thus reducing the contamination of the final surface of the substrate.

[0043] In some embodiments, the applied writing laser beam WL has the following conditions: precision: about 100nm; laser wavelength: about 532nm; speed: 2mm / s; power: 0.01mW-400mW. The power of the writing laser beam WL can be kept low and is a maximum of 400mW on any application substrate. The power depends on the NA value of the objective lens. In contrast, common laser writing methods require high-power ultrafast lasers. Through the above method, the mechanically rigid material deposit 10 can be deposited into a solid structure with a functional pattern and maintain strong adhesion to the substrate 102, thereby allowing waveguide and device manufacturing. For example, the mechanically rigid material deposit 10 is deposited as a solid metal structure, which has strong adhesion to the substrate 102, so that the deposit can remain intact after ultrasonic treatment in different solvents (including acetone, isopropanol or ethanol) for more than 30 minutes. In one embodiment, the mechanically rigid material deposit 10 is a solid rigid composite pattern made of pure metal, solid metal salt, metal oxide or a combination thereof.

[0044] Refer to Figure 2D By using a laser galvanometer scanning system or an actuator, the sample carrier 110, the optical writing module 120, and the optical characterization module 130 (such as Figure 1 ), which makes the optical writing module 120 (see Figure 1) can continuously move along the surface of the substrate 102, thereby forming the mechanically rigid material deposit 10 into a continuous pattern. Accordingly, the writing laser beam WL moves laterally to the position of the writing laser beam WL'. In this way, by controlling the optical writing module 120 (such as Figure 1 The relative movement between the focus of the laser source 122 (shown) and the target sample (e.g., mechanically rigid material deposition 10) can form electrodes, waveguides, capacitors, conductive or insulating pads or other functional patterns by continuously depositing metal.

[0045] The laser writing process can then be repeated and the sample thoroughly cleaned to complete the configuration. This method can deposit different types of materials to make complex structured devices such as FETs, capacitors, resistors, etc. This method can be used to create microwave guides on diamond, to make electronic devices, to make flexible devices and / or quantum devices; and / or photonic structures; and / or electrodes for testing the electronic properties of 2D materials, especially in the way of printing out circuits with a printer.

[0046] In this way, the applied deposition method can be combined with optical characterization of semiconductor samples, allowing sample selection, Raman measurements, device fabrication, and optical quality inspection within the same setup; for example, a mechanically rigid material deposition 10 of a substrate 102 held by a sample carrier 110 can be subjected to Raman measurements or optical quality inspection. Similarly, since the applied deposition method can be combined with optical localization of nitrogen vacancy (NV) centers in diamond, it allows direct NV optical detection, device fabrication, and optical measurements to be performed simultaneously within the same setup without the need for markings on the diamond surface; for example, NV optical detection and optical measurements of a mechanically rigid material deposition 10 of a substrate 102 held by a sample carrier 110 can be performed without the need for markings on the diamond surface of the substrate during the measurement process.

[0047] In one embodiment, the writing laser beam WL can be replaced by an electron beam to improve accuracy. In one embodiment, the deposition method can be repeated for different material depositions by changing the first solution or first suspension composition, so the resulting mechanically rigid material deposition will have a different composition.

[0048] Figure 3A schematic diagram of a method according to an embodiment of the present invention is shown, which is to perform maskless material deposition on any substrate using a platform. In this embodiment, the relative movement relationship between the laser source focus and the sample can be controlled so that the mechanical rigid material deposition 10 can be formed into a continuous deposition pattern across different substrates. Specifically, the sample carrier 110 can carry a bottom substrate 170, and the top substrate 172 is attached to the bottom substrate 170. For example, the top substrate 172 grows from the bottom substrate 170 or is formed on the bottom substrate 170. During the deposition process of the mechanical rigid material deposition 10, the focus of the laser source can be moved laterally from a position above the top substrate 172 and then away from the top substrate 172. Therefore, for the continuous deposition pattern of the mechanical rigid material deposition 10, it can extend from the top substrate 172 to some areas of the bottom substrate 170, and these areas are not covered by the top substrate 172.

[0049] Figure 4 Schematic diagram of an apparatus 100B provided according to an embodiment of the present invention, which is used for performing maskless material deposition on any substrate. The apparatus 100B has a configuration similar to the apparatus 100A, except that the apparatus 100B further includes a transparent solution container 180 to replace the previous sample carrier 110. The transparent solution container 180 has an opening 182 and a receiving space connected to the opening 182. The receiving space can be configured to receive a sample 184 from a first liquid injector 140 and a second liquid injector 150, respectively, and a mixture 186 of a solution and a suspension. The first liquid injector 140 and the second liquid injector 150 can drip the solution and the suspension through the opening 182 to fill the receiving space. The optical writing module 120 and the optical characterization module 130 are coupled to each other to provide a writing laser beam WL, which is propagated toward the sample 184 in the transparent solution container 180. During the formation process of the mechanically rigid material deposition, the sample 184 is immersed in the mixture 186 as a whole. This configuration shows that the technical solution provided by the present invention is flexible and different components can be replaced to adapt to different manufacturing conditions / requirements.

[0050] As described above, the present invention realizes maskless material deposition on any substrate and has the following advantages:

[0051] (1) The solution provided by the present invention can be completed without a mask (ie, a maskless process).

[0052] (2) The solution provided by the present invention can be completed at low temperature and will not damage the substrate under the deposited material.

[0053] (3). The solution provided by the present invention can simultaneously realize sample selection, material deposition and sample quality inspection.

[0054] (4) The solution provided by the present invention can achieve ultra-high precision down to the order of tens of nanometers in optics according to the selection of laser wavelength and the type of objective lens used.

[0055] (5) The solution provided by the present invention can immediately deposit the material below the focus of the light beam.

[0056] (6). The solution provided by the present invention can create a 3D structure of material combination.

[0057] (7). The solution provided by the present invention can complete the entire patterning process within a few seconds for a single sample of several tens of microns in size.

[0058] (8) The solution provided by the present invention is excellent in economic cost control and is easy to promote.

[0059] (9). The solution provided by the present invention allows direct manufacture of basic microelectronic devices.

[0060] (10). The solution provided by the present invention can be deployed in a simple environment at room temperature without the need for extreme conditions.

[0061] The above description of the present invention is provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present invention to the precise form disclosed. For those skilled in the art, many modifications and variations will be apparent.

[0062] The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.

Claims

1. A method for performing maskless material deposition on an arbitrary substrate by using a platform, characterized in that include: Fixing the substrate using a substrate carrier; Using a first liquid injector, providing a first solution containing a metal salt, a metal ion, an active halogen ion, or a combination thereof onto the substrate; Using a second liquid injector, providing a first suspension comprising nanoparticles, a photosensitive reducing agent, an electron donor solvent, or a combination thereof onto the substrate, thereby forming a reagent on the substrate when the substrate is exposed to an ambient gas or air environment; A laser source is provided to emit a laser beam; directing and focusing the laser beam onto the reagent on the substrate; a light source disposed to emit an observation beam onto the reagent on the substrate; as well as Determining whether the reagent is retained on the first area of ​​the substrate, wherein, when it is determined that the reagent is on the first area of ​​the substrate, driving the laser beam to irradiate the reagent on the first area of ​​the substrate to form a mechanically rigid material deposition in contact with the first area of ​​the substrate, wherein the irradiation of the reagent by the laser beam occurs in a gas or air environment.

2. The method according to claim 1, characterized in that Also includes: The formation of the mechanically rigid material deposit is observed and recorded in real time via the observation beam using an image recorder.

3. The method according to claim 2, characterized in that Also includes: After the mechanically rigid material is deposited, an optical signal from the reagent on the substrate is received by an optical receiver for optical characterization without moving the substrate.

4. The method according to claim 2, characterized in that: The wavelength of the laser beam provided by the laser source is 405 nm or 532 nm, and the laser power range is 0.01 mW to 400 mW.

5. The method according to claim 2, characterized in that: The observation light beam provided by the light source has a wavelength or wavelength interval different from that of the laser beam.

6. The method according to claim 1, characterized in that Also includes: During the mechanically rigid material deposition forming process, the optical relationship between the laser beam and the reagent held on the substrate is adjusted so that the mechanically rigid material deposition is formed into a continuous pattern.

7. The method according to claim 1, characterized in that Also included is directing the laser beam using a dichroic mirror.

8. The method according to claim 1, characterized in that: Also included is separating the laser beam and the observation beam using a dichroic mirror.

9. The method according to claim 1, characterized in that: Also included is a control optical modulation component for controlling the on / off state of the laser beam provided by the laser source.

10. The method according to claim 1, characterized in that Providing the first solution or providing the first suspension is achieved by drop casting, spin coating, spray coating, microfluidic channel, ink injection or a combination thereof.

11. The method according to claim 1, characterized in that: The irradiation of the reagent with the laser beam is maskless, so that during the irradiation, the second area of ​​the substrate is exposed to a gas or air environment.

12. The method according to claim 1, characterized in that Also included is performing a Raman measurement or an optical quality inspection on the mechanically rigid material deposition after forming the mechanically rigid material deposition without moving the substrate.

13. The method according to claim 1, characterized in that The first solution includes chloride (Cl) ions, fluoride (F) ions, hydroxyl (OH) ions, or a combination thereof.

14. The method according to claim 1, characterized in that The first solution includes gold (III) chloride hydrochloride (HAuCl4), chloroplatinic acid (H2PtCl6), silver nitrate (AgNO3), ferric chloride (FeCl3), a noble metal solution or a combination thereof.

15. The method according to claim 1, characterized in that The electron donor solvent includes water, ethanol, propanol, isopropanol, acetone, methanol or a combination thereof.

16. The method according to claim 1, characterized in that The photosensitive reducing agent includes reduced graphene oxide, quantum dots, carbon ink particles or a combination thereof.

17. The method according to claim 1, characterized in that Also includes: The mechanically rigid material deposition is subjected to nitrogen vacancy (NV) optical detection and optical measurement with the substrate held by the substrate carrier and without marks on the diamond surface of the substrate.

18. A method for performing maskless material deposition on an arbitrary substrate using a platform, characterized in that: include: Fixing the substrate using a substrate holder; providing a first solution comprising a metalate, a metal ion, an active halogen ion, or a combination thereof into the transparent solution container using a first liquid syringe; providing a first suspension comprising nanoparticles, a photosensitive reducing agent, an electron donating solvent, or a combination thereof into the transparent solution container using a second liquid syringe to form a mixture of the first solution and the first suspension in the transparent solution container; positioning the sample in the transparent solution container such that the sample is immersed in the mixture of the first solution and the first suspension; arranging a laser source to emit a laser beam; directing and focusing the laser beam onto the sample; a light source arranged to transmit an observation beam onto the sample; as well as A laser beam is directed toward the sample to form a mechanically rigid deposit of material in contact with the sample.

19. An apparatus for performing maskless material deposition on any substrate, characterized in that: include: an optical writing module configured to emit a laser beam and direct the laser beam to a substrate; as well as an optical characterization module optically coupled to the optical writing module such that the optical writing module and the optical characterization module share a same optical path, wherein the optical characterization module is configured to emit an observation beam toward the substrate; The optical characterization module is further configured to determine whether the mixture of solution and suspension is in contact with the substrate, and when it is determined that the mixture is in contact with the substrate, enable a laser beam to irradiate the mixture near the surface of the substrate, thereby forming a mechanically rigid material deposition in contact with the substrate.

20. The device according to claim 19, characterized in that Also includes: a first liquid injector configured to provide a first solution in contact with the substrate, the first solution comprising a metal acid salt, a metal ion, a reactive halogen ion, or a combination thereof; as well as The second liquid injector is configured to provide a first suspension in contact with the substrate, wherein the first suspension includes nanoparticles, a photosensitive reducing agent, an electron donor solvent, or a combination thereof.

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