High and low temperature integrated temperature control system for semiconductor probe station

Abstract

The invention discloses a high and low temperature integrated temperature control system for a semiconductor probe station. The system comprises a compressor, an oil separator, an air-cooled condenser, a fan, a dry filter, a plurality of bypass valves, an electromagnetic valve, an expansion tank, an evaporative condenser, an evaporator, a magnetic drive pump and a connecting pipeline. The method has the beneficial effects that the single-compressor automatic cascade technology is simple in structure and high in reliability; the evaporator and the evaporative condenser adopt modular design, so that the heat preservation effect is good; the hot gas bypass valve and the electronic expansion valve are used for temperature regulation and control to realize accurate regulation and control of cold and hot, an expansion tank refrigerant management technology is adopted, a pressure relief point is selected at a low-temperature liquid pipe section, and the flow of a low-temperature refrigerant in the system is regulated according to a load, so that a compressor always operates at a lower load, and energy conservation and noise reduction are realized; the problem that a conventional pump shaft seal is prone to leakage at low temperature is solved, and the maintenance and use cost can be greatly reduced for high-volatility and expensive fluorinated liquid.

Description

Technical Field

[0001] The invention relates to the technical field of temperature control devices for semiconductor probe stations, in particular to a high and low temperature integrated temperature control system for a semiconductor probe station. Background Art

[0002] In the semiconductor manufacturing process, the probe station is mainly used for wafer inspection, chip development and fault analysis. Through the test of the probe station, the function, electrical parameters and radio frequency of the bare chip on the wafer can be tested, which plays a vital role in ensuring product quality and reliability. The probe station test process requires rapid temperature rise and fall and precise temperature control at each temperature point in a large temperature range. The temperature control range is: -70℃~25℃, which is inseparable from the high-precision high and low temperature integrated unit.

[0003] At present, the high and low temperature integrated units for probe stations on the market are basically monopolized by a few brands from Japan, South Korea and Germany. These brands develop products based on dual-compressor mechanical cascade technology. With the rapid development of this industry in China, there is an urgent need for domestically produced models to replace imported products. Summary of the invention

[0004] The object of the present invention is to provide a high and low temperature integrated temperature control system for a semiconductor probe station to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high and low temperature integrated temperature control system for a semiconductor probe station, comprising an evaporator, wherein a first pipe, a second pipe, a third pipe and a fourth pipe are respectively provided on both sides of the evaporator and connected thereto, wherein the other ends of the first pipe and the second pipe are respectively provided with a fluorine liquid inlet and a fluorine liquid outlet connected thereto, wherein the other end of the fourth pipe away from the evaporator is provided with an evaporative condenser connected thereto, wherein a throttling capillary and a gas-liquid separator are provided in the evaporative condenser, wherein the gas-liquid separator is connected to an air-cooled condenser via a fifth pipe, and the other end of the third pipe away from the evaporator is connected to the other end of the air-cooled condenser.

[0006] Further optimized, a magnetically driven pump and a gas collecting cylinder are arranged in sequence between the first pipeline and the fluorinated liquid inlet. The magnetically driven pump solves the problem that the conventional pump shaft seal is prone to leakage at low temperatures. In the face of highly volatile and expensive fluorinated liquids, the maintenance and use costs can be greatly reduced.

[0007] For further optimization, the other end of the gas collecting cylinder away from the magnetically driven pump is provided with a sixth pipeline connected thereto, and the other end thereof is provided with a liquid replenishing tank connected thereto.

[0008] In a further optimization, a temperature sensor is provided between the second pipe and the fluorinated liquid outlet.

[0009] Further optimized, the third pipeline is provided with a pressure relief solenoid valve, an expansion tank, a fluorine replenishing solenoid valve, a compressor and an oil separator in sequence, and the expansion tank refrigerant management technology, the pressure relief point is selected in the low-temperature liquid pipe section, and the flow of the low-temperature refrigerant in the system is adjusted according to the load, so that the compressor always runs at a lower load, thereby achieving energy saving and noise reduction.

[0010] For further optimization, a drying filter connected to the fifth pipeline and the air-cooled condenser is provided between the fifth pipeline and the air-cooled condenser.

[0011] For further optimization, the third pipeline is provided with a seventh pipeline connected thereto, and the seventh pipeline is provided with a hot gas bypass valve connected thereto.

[0012] For further optimization, an electronic expansion valve is provided on the third pipeline between the evaporator and the evaporative condenser.

[0013] Further optimized, the pressure relief solenoid valve is arranged between the evaporative condenser and the expansion tank, and is located on the third pipeline.

[0014] Further optimized, a fan is provided at one end of the air-cooled condenser, and an eighth pipe connected to the third pipe is provided at one end of the evaporative condenser.

[0015] Beneficial Effects

[0016] The semiconductor probe station high and low temperature integrated temperature control system provided by the present invention adopts a single compressor automatic cascade technology, which is simpler in structure and more reliable than a dual compressor mechanical cascade technology; the evaporator, evaporative condenser and corresponding connecting pipes and valves are modularly designed, and the polyurethane foaming insulation process is carried out as a whole, with good insulation effect; a hot gas bypass valve and an electronic expansion valve are used for temperature regulation and control to achieve precise regulation of hot and cold, thereby achieving high-precision temperature control, expansion tank refrigerant management technology, the pressure relief point is selected in the low-temperature liquid pipe section, and the flow of low-temperature refrigerant in the system is adjusted according to the load, so that the compressor always runs at a lower load, thereby achieving energy saving and noise reduction, and a magnetically driven pump solves the problem that the conventional pump shaft seal is prone to leakage at low temperatures, and in the face of highly volatile and expensive fluorinated liquids, the maintenance and use costs can be greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic plan view of the overall structure of the present invention. DETAILED DESCRIPTION

[0018] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0019] Example

[0020] like Figure 1 As shown, a high and low temperature integrated temperature control system of a semiconductor probe station includes an evaporator 14, and a first pipe 21, a second pipe 22, a third pipe 24 and a fourth pipe 25 are respectively provided on both sides of the evaporator 14, and the other ends of the first pipe 21 and the second pipe 22 are respectively provided with a fluorine liquid inlet 20 and a fluorine liquid outlet 19 connected thereto, and the other end of the fourth pipe 25 away from the evaporator 14 is provided with an evaporative condenser 12 connected thereto, and a throttling capillary 8 and a gas-liquid separator 7 are provided in the evaporative condenser 12, and the gas-liquid separator 7 is connected to the air-cooled condenser 4 through a fifth pipe 28, and the other end of the third pipe 24 away from the evaporator 14 is connected to the other end of the air-cooled condenser 4.

[0021] In this embodiment, a magnetically driven pump 16 and a gas collecting cylinder 15 are sequentially disposed between the first pipe 21 and the fluorinated liquid inlet 20 .

[0022] The other end of the gas collecting cylinder 15 away from the magnetic drive pump 16 is provided with a sixth pipeline 23 connected thereto, and the other end thereof is provided with a liquid replenishing tank 18 connected thereto.

[0023] A temperature sensor 17 is provided between the second pipe 22 and the fluorinated liquid outlet 19 .

[0024] The third pipeline 24 is provided with a pressure relief solenoid valve 9, an expansion tank 10, a fluorine replenishing solenoid valve 11, a compressor 1 and an oil separator 2 in sequence.

[0025] A drying filter 6 connected to the fifth pipeline 28 and the air-cooled condenser 4 is provided between the fifth pipeline 28 and the air-cooled condenser 4 .

[0026] The third pipe 24 is provided with a seventh pipe 29 connected thereto, and the seventh pipe 29 is provided with a hot gas bypass valve 5 connected thereto. The third pipe 24 between the evaporator 14 and the evaporative condenser 12 is provided with an electronic expansion valve 13. The hot gas bypass valve (hot) and the electronic expansion valve (cold) are used for temperature regulation and control. Through the precise PID algorithm, accurate regulation of hot and cold is achieved, thereby achieving high-precision temperature control. Compared with the traditional electric heating tube hedging temperature control, there is no need for additional heat source, saving energy and operating costs.

[0027] The pressure relief solenoid valve 9 is arranged between the evaporative condenser 12 and the expansion tank 10, and is located on the third pipeline 24. The expansion tank refrigerant management technology adopts the pressure relief point selected in the low-temperature liquid pipe section. The flow of low-temperature refrigerant in the system is adjusted according to the load, so that the compressor always runs at a lower load, thereby achieving energy saving and noise reduction.

[0028] A fan 3 is provided at one end of the air-cooled condenser 4 , and an eighth pipe 27 connected to the third pipe 24 is provided at one end of the evaporative condenser 12 .

[0029] Single compressor automatic cascade technology, compared with dual compressor mechanical cascade technology, this technology has a simpler structure and higher reliability; a single compressor reduces components and connection points, improves system reliability and service life, and saves equipment installation space and use costs.

[0030] The magnetic drive pump solves the problem of conventional pump shaft seals leaking easily at low temperatures. In the face of highly volatile and expensive fluorinated liquids, it can greatly reduce maintenance and use costs.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the invention content within the protection scope of the present invention.

Claims

1. High and low temperature integrated temperature control system for semiconductor probe station, characterized by: The invention comprises an evaporator (14), wherein two sides of the evaporator (14) are respectively provided with a first pipe (21), a second pipe (22), a third pipe (24) and a fourth pipe (25) connected thereto, wherein the other ends of the first pipe (21) and the second pipe (22) are respectively provided with a fluorinated liquid inlet (20) and a fluorinated liquid outlet (19) connected thereto, wherein the other end of the fourth pipe (25) away from the evaporator (14) is provided with an evaporative condenser (12) connected thereto, wherein a throttling capillary (8) and a gas-liquid separator (7) are provided in the evaporative condenser (12), wherein the gas-liquid separator (7) is connected to an air-cooled condenser (4) via a fifth pipe (28), and the other end of the third pipe (24) away from the evaporator (14) is connected to the other end of the air-cooled condenser (4).

2. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: A magnetically driven pump (16) and a gas collecting cylinder (15) are arranged in sequence between the first pipeline (21) and the fluorinated liquid inlet (20).

3. The high and low temperature integrated temperature control system of the semiconductor probe station according to claim 2 is characterized in that: The other end of the gas collecting cylinder (15) away from the magnetically driven pump (16) is provided with a sixth pipeline (23) connected thereto, and the other end thereof is provided with a liquid replenishing tank (18) connected thereto.

4. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: A temperature sensor (17) is provided between the second pipe (22) and the fluorinated liquid outlet (19).

5. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: The third pipeline (24) is provided with a pressure relief solenoid valve (9), an expansion tank (10), a fluorine replenishing solenoid valve (11), a compressor (1) and an oil separator (2) in sequence.

6. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: A drying filter (6) connected to the fifth pipe (28) and the air-cooled condenser (4) is provided between the fifth pipe (28) and the air-cooled condenser (4).

7. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: The third pipeline (24) is provided with a seventh pipeline (29) connected thereto, and the seventh pipeline (29) is provided with a hot gas bypass valve (5) connected thereto.

8. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: An electronic expansion valve (13) is provided on the third pipeline (24) between the evaporator (14) and the evaporative condenser (12).

9. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 5, characterized in that: The pressure relief solenoid valve (9) is arranged between the evaporative condenser (12) and the expansion tank (10), and is located on the third pipeline (24).

10. The high and low temperature integrated temperature control system for a semiconductor probe station according to claim 1, characterized in that: A fan (3) is provided at one end of the air-cooled condenser (4), and an eighth pipe (27) connected to the third pipe (24) is provided at one end of the evaporative condenser (12).

Images