Integrated circuit test carrier plate and test equipment

Abstract

The invention discloses an integrated circuit test carrier plate and test equipment, and relates to the technical field of circuit test. The device comprises a carrier, a convex plate is constructed in the middle of the top face of the carrier, a containing carrier plate is constructed on the convex plate, and two mounting frames are symmetrically mounted on the carrier; and the clamping mechanism comprises a lower pressing plate which is horizontally mounted on the mounting frame in a sliding manner and is used for pressing the bottom surface of the test circuit board. According to the invention, the two lower pressing plates are far away from each other, and the upper pressing plate is far away from the test circuit board through the transmission part in the process, so that the circuit board is not clamped, the lower pressing plates are separated from the test circuit board, and the test circuit board falls down to the containing carrier plate, and therefore, when the test circuit boards are continuously aligned in batches, the test efficiency is improved. The circuit boards can be gradually stacked on the containing carrier plate, and the circuit boards can be taken out after being stacked to a certain height, so that the taking-out times of the circuit boards can be effectively reduced, and the testing efficiency is further improved.

Description

Technical Field

[0001] The present application relates to the field of circuit testing technology, and in particular to an integrated circuit testing substrate and testing equipment. Background Art

[0002] An integrated circuit board is a substrate used to support and connect electronic components. It consists of an insulating substrate layer and conductive tracks embedded in it, which are used to transmit electrical signals. Various electronic components such as capacitors, resistors, diodes and integrated circuits are also installed on the integrated circuit board, which are fixed to the board by welding or surface mounting technology.

[0003] When testing batches of circuit boards, the circuit boards need to be correctly mounted on the test equipment. This allows the probes on the test equipment to contact the circuit boards, ensuring that all test points are aligned with the corresponding probes or test fixtures. When testing the leather of the circuit boards, the circuit boards need to be repeatedly removed from the test carrier, and then replaced with the next circuit board to clamp it, which is inefficient during testing.

[0004] Therefore, the present invention provides an integrated circuit test carrier and a test device. Summary of the invention

[0005] The purpose of this application is to solve the problems in the above-mentioned background technology, and this application provides an integrated circuit test carrier and a test device.

[0006] In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions: Integrated circuit test substrate, including: A carrier, wherein a convex plate is configured in the middle of the top surface of the carrier, a carrier plate is configured on the convex plate, and two mounting frames are symmetrically mounted on the carrier; The clamping mechanism comprises a lower pressing plate horizontally slidably mounted on the mounting frame, which is used to press the bottom surface of the test circuit board, an upper pressing plate rotatably mounted on the lower pressing plate, which is used to press the top of the test circuit board, and a transmission member acting on the upper pressing plate is mounted on the mounting frame. When the two lower pressing plates move away from each other, the corresponding upper pressing plate is driven to rotate in a direction away from the test circuit board through the transmission member; The carrier plate is located between the two lower pressing plates and at the lower position; A conveying assembly is installed on the carrier and acts on the upper pressing plate. When the upper pressing plate rotates to separate from the test circuit board, the test circuit board separated from the lower pressing plate is stacked onto the containing carrier through the conveying assembly; The adjusting component is installed on the carrier and is used for driving the lower pressing plate to move.

[0007] Furthermore, the lower pressure plate is horizontally slidably installed on the mounting frame, and the transmission member includes a rotating bar frame with one end rotatably installed on the mounting frame, a moving rod is slidably inserted on the rotating bar frame, and the free end of the moving rod is hinged on the upper pressure plate, a protrusion is constructed on one side of the moving rod, a through groove is opened on one side of the upper pressure plate, and a column rod sliding tangent to the through groove is installed on the protrusion.

[0008] Furthermore, the conveying assembly includes two transmission belt assemblies symmetrically installed on the mounting frame, the lower pressure plate is located between the two transmission belt assemblies, the transmission belt assembly includes two mounting rods rotatably installed on the mounting frame, the coaxial mounting rods are connected to each other, the two mounting rods are distributed up and down and are both rotatably equipped with transmission wheels, a conveyor belt is installed between the two transmission wheels, two placement plates are installed on the outer surfaces of the two vertical sections of the conveyor belt, and a driving member for driving the mounting rods to rotate is installed on the mounting frame.

[0009] Furthermore, the adjustment assembly includes a transmission rod rotatably mounted on the carrier, two hinged rods are symmetrically hinged on the transmission rod, the free ends of the two hinged rods are respectively hinged on the two lower pressure plates, and a hand-held rod is constructed on the transmission rod.

[0010] Furthermore, a sliding frame plate is horizontally slidably installed on the lower pressure plate, a return spring is installed between the sliding frame plate and the lower pressure plate, the hinged rod is hinged on the sliding frame plate, and the driving member acts on the sliding frame plate. When the sliding frame plates are located at the maximum limit position away from each other, the sliding frame plate continues to move to drive the mounting rod to rotate through the driving member.

[0011] Furthermore, the driving member includes a driving rod rotatably mounted on the mounting frame, a pulley assembly is installed between the driving rod and one of the mounting rods, a first gear is installed on the driving rod, two second gears are rotatably mounted on the mounting frame, an annular toothed belt is installed for transmission between the two second gears, the first gear is meshed with the annular toothed belt, a spring telescopic rod is installed on the mounting frame, a forcing frame is installed at the free end of the spring telescopic rod, a forcing plate for contacting the forcing frame is constructed on the sliding frame plate, a wedge plate is vertically slidably mounted on the forcing frame, a connecting spring is installed between the wedge plate and the sliding frame plate, and a plurality of wedge-shaped grooves for inserting the wedge plate are arranged in an array on the outer peripheral side of the annular toothed belt.

[0012] Furthermore, the mounting frame is horizontally slidably mounted on the carrier, and an actuator for driving the two mounting frames to move is mounted on the carrier.

[0013] Furthermore, the actuator comprises an adjusting screw which is horizontally and rotatably mounted on the carrier, the adjusting screw is symmetrically provided with positive and negative threads, and two mounting frames are symmetrically threadedly sleeved on the adjusting screw.

[0014] Furthermore, the mounting rod is unidirectionally rotatable, the upper pressing plate is L-shaped and one end is rotatably mounted on the lower pressing plate, and the other end of the upper pressing plate is rotatably mounted with a holding plate for contacting the test circuit board.

[0015] The integrated circuit testing equipment comprises the above-mentioned integrated circuit testing carrier, and also comprises a capacitor box, a mounting seat is installed on the capacitor box, a plate body is vertically slidably mounted on the mounting seat, a probe is installed at the bottom of the plate body, the carrier is installed on the capacitor box and is located below the probe, and a manual part for driving the plate body to move is installed on the mounting seat.

[0016] The beneficial effects of this application are as follows: The present application moves the two lower pressing plates away from each other. During this process, the upper pressing plate is moved away from the test circuit board by the transmission member, and no longer clamps the circuit board. The lower pressing plate is detached from the test circuit board, and the test circuit board falls downward onto the holding carrier. Therefore, when the circuit boards are tested in batches continuously, the circuit boards will gradually be stacked on the holding carrier. When the circuit boards are stacked to a certain height, they can be taken out together. This can effectively reduce the number of times the circuit boards are taken out, thereby further improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the test carrier of this application; Figure 2 This application Figure 1 Partial stereoscopic cutaway view; Figure 3 This application Figure 1 Another partial three-dimensional cutaway view; Figure 4 This application Figure 1 Another partial three-dimensional cutaway view; Figure 5 This application Figure 1 Schematic diagram of some structures; Figure 6 This application Figure 5 Partial stereoscopic cutaway view; Figure 7 This application Figure 5 Another partial three-dimensional cutaway view; Figure 8 is a schematic diagram of the test equipment for this application; Fig. 9 It is a schematic diagram of the structure after the combination of this application; Fig.10This application Figure 2 A magnified view of the structure at center; Fig.11 This application Figure 4 A magnified view of the structure at B in the middle; Figure numerals: 1, carrier; 2, convex plate; 3, holding plate; 4, mounting frame; 5, clamping mechanism; 501, upper pressing plate; 502, lower pressing plate; 503, transmission member; 5031, rotating bar frame; 5032, moving rod; 5033, convex block; 5034, through groove; 5035, column; 6, conveying assembly; 601, mounting rod; 602, transmission wheel; 603, conveyor belt; 604, placement plate; 7, adjustment assembly; 701, transmission rod; 702, hinged rod; 703, hand-held rod; 8 , driving member; 801, driving rod; 802, pulley assembly; 803, first gear; 804, annular toothed belt; 805, wedge plate; 806, connecting spring; 807, wedge groove; 808, spring telescopic rod; 809, forcing frame; 8010, forcing plate; 8011, second gear; 9, sliding frame plate; 10, actuator; 1001, adjusting screw; 11, holding plate; 12, capacitor box; 13, mounting seat; 14, plate body; 15, probe; 16, manual part; 17, return spring. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0019] like Figure 1-Figure 11 As shown, an integrated circuit test carrier proposed in one embodiment of the present application includes: A carrier 1, a convex plate 2 is formed in the middle of the top surface of the carrier 1, a carrier plate 3 is formed on the convex plate 2, and two mounting frames 4 are symmetrically mounted on the carrier 1; The clamping mechanism 5 includes a lower pressing plate 502 horizontally slidably mounted on the mounting frame 4, which is used to press the bottom surface of the test circuit board. The upper pressing plate 501 is rotatably mounted on the lower pressing plate 502, which is used to press the top of the test circuit board. The mounting frame 4 is equipped with a transmission member 503 acting on the upper pressing plate 501. When the two lower pressing plates 502 move away from each other, the corresponding upper pressing plate 501 is driven to rotate in a direction away from the test circuit board through the transmission member 503. That is to say, when the two lower pressing plates 502 approach each other, the upper pressing plate 501 is caused to rotate in a direction close to the test circuit board through the transmission member 503; The carrier plate 3 is located between the two lower pressing plates 502 and at the lower position; The conveying assembly 6 is installed on the carrier 1 and acts on the upper pressing plate 501. When the upper pressing plate 501 rotates to separate from the test circuit board, the test circuit board separated from the lower pressing plate 502 is stacked on the containing carrier 3 through the conveying assembly 6; The adjusting component 7 is mounted on the carrier 1 and is used to drive the lower pressing plate 502 to move. That is to say, when in use, the test circuit board is first placed on the two lower pressing plates 502, and then the two lower pressing plates 502 are driven to approach each other through the adjusting component 7. The lower pressing plates 502 will slowly increase the contact area with the test circuit board when moving. As the lower pressing plates 502 move, the upper pressing plate 501 will rotate in the direction close to the test circuit board through the transmission member 503 until the upper pressing plate 501 is pressed on the test circuit board. After the test of the test circuit board is completed, the upper pressing plate 501 can be adjusted. The joint component 7 makes the two lower pressure plates 502 move away from each other. During this process, the upper pressure plate 501 is moved away from the test circuit board through the transmission member 503, and no longer clamps the circuit board. As the lower pressure plate 502 continues to move, the lower pressure plate 502 will gradually separate from the test circuit board, causing the test circuit board to fall downward onto the holding carrier 3. Therefore, when the circuit boards are tested in batches continuously, the circuit boards will gradually be stacked on the holding carrier 3. When the circuit boards are stacked to a certain height, they can be taken out together. This can effectively reduce the number of times the circuit boards are taken out, thereby further improving the test efficiency.

[0020] like Figure 1-3 and Fig.11As shown, in some embodiments, the lower pressing plate 502 is horizontally slidably mounted on the mounting frame 4, and the transmission member 503 includes a rotating bar frame 5031 with one end rotatably mounted on the mounting frame 4, and a moving rod 5032 is slidably inserted on the rotating bar frame 5031, and the free end of the moving rod 5032 is hinged on the upper pressing plate 501, and a protrusion 5033 is constructed on one side of the moving rod 5032, and a through groove 5034 is opened on one side of the upper pressing plate 501, and a column 5035 tangential to the through groove 5034 is installed on the protrusion 5033. That is to say, when the lower pressing plates 502 approach each other, the upper pressing plate 501 rotatably mounted on the lower pressing plate 502 will also move. Because the free end of the moving rod 5032 is hinged on the upper pressing plate 501, the horizontal movement of the upper pressing plate 501 will cause the moving rod 5032 to move. The upper pressing plate 501 is moved on the rotating bar frame 5031, and because the moving rod 5032 moves on the rotating bar frame 5031, the moving rod 5032 and the rotating bar frame 5031 will rotate adaptively, thereby making the column rod 5035 move in the through groove 5034. At this time, the upper pressing plate 501 is adaptively rotated because the column rod 5035 moves in the through groove 5034, thereby achieving the lower pressing plate 502 to approach each other so that the upper pressing plate 501 rotates downward to press the test circuit board. When the upper pressing plate 501 is pressed on the test circuit board, the lower pressing plate 502 stops moving to achieve the pressing of the test circuit board, which is more convenient to use and does not require additional driving force to drive the upper pressing plate 501 to move. After the lower pressing plates 502 are away from each other, the upper pressing plate 501 rotates upward to facilitate the subsequent placement of the circuit board on the lower pressing plate 502.

[0021] like Figure 1-Figure 3 and Figure 7As shown, in some embodiments, the conveying assembly 6 includes two transmission belt assemblies symmetrically mounted on the mounting frame 4, the lower pressure plate 502 is located between the two transmission belt assemblies, the transmission belt assembly includes two mounting rods 601 rotatably mounted on the mounting frame 4, the coaxial mounting rods 601 are connected to each other, the two mounting rods 601 are distributed up and down and are both rotatably mounted with transmission wheels 602, a conveyor belt 603 is installed between the two transmission wheels 602, two placement plates 604 are installed on the outer surfaces of the two vertical sections of the conveyor belt 603, and a driving member 8 for driving the mounting rods 601 to rotate is installed on the mounting frame 4. After the clamping of the test circuit board is completed, one of the placement plates 604 on the conveyor belt 603 is in contact with the test circuit board. The bottom of the test circuit board is in contact. When the test circuit board is no longer clamped after the test is completed, one of the conveyor belts 603 is rotated by the driving member 8, so that the placement plate 604 moves downward. The four placements move downward at the same time, which will cause the circuit board to move downward, so that the test circuit board is placed steadily on the holding carrier 3 to prevent the circuit board from falling too fast and causing damage. At this time, another conveyor belt 603 on the conveyor belt 603 is just flush with the lower pressure plate 502, which is convenient for placing the test circuit board. Preferably, the placement plate 604 can be detachably installed, and the placement plate 604 is provided with a notch as shown in the figure, which plays a role of limiting, making it convenient for the staff to place and locate the position of the test circuit board.

[0022] like Figure 1 and Figure 7 As shown, in some embodiments, the adjustment component 7 includes a transmission rod 701 rotatably mounted on the carrier 1, and two hinged rods 702 are symmetrically hinged on the transmission rod 701, and the free ends of the two hinged rods 702 are respectively hinged on the two lower pressure plates 502, and a hand-held rod 703 is constructed on the transmission rod 701. That is to say, when the hand-held rod 703 is rotated, the rotation of the transmission rod 701 will drive the hinged rod 702 hinged thereon to rotate. Because one end of the hinged rod 702 is hinged on the lower pressure plate 502, the rotation of the transmission rod 701 will drive the lower pressure plate 502 to move through the hinged rod 702, thereby realizing the two lower pressure plates 502 approaching or moving away from each other, thereby ensuring the synchronization of the two lower pressure plates 502, and there is no need to control the two lower pressure plates 502 separately, which is more convenient to use. In this embodiment, the transmission rod 701 can be manually driven without the hand-held rod 703. By installing a reduction motor on the carrier 1, the reduction motor is connected to the transmission rod 701, and the rotation of the transmission rod 701 can also be realized.

[0023] like Figure 1-Figure 3 and Fig.11As shown, in some embodiments, a sliding frame plate 9 is horizontally slidably installed on the lower pressing plate 502, a return spring 17 is installed between the sliding frame plate 9 and the lower pressing plate 502, the hinged rod 702 is hinged on the sliding frame plate 9, and the driving member 8 acts on the sliding frame plate 9. When the sliding frame plates 9 are at the maximum limit position away from each other, the sliding frame plate 9 continues to move to drive the mounting rod 601 to rotate through the driving member 8. That is to say, when the test circuit board is in a clamping state, the rotation of the transmission rod 701 will cause the sliding frame plates 9 to move away from each other, and the return spring 17 has a certain The elastic strength of the drive rod 701 is such that the two sliding frame plates 9 move away from each other, and the mounting rod 601 is rotated through the driving member 8, thereby causing the multiple placement plates 604 to move downward, which is more convenient and quick to use, and the placement plates 604 can be moved without additional driving force.

[0024] like Figure 1 , Figure 7 and Fig.10As shown, in some embodiments, the driving member 8 includes a driving rod 801 rotatably mounted on the mounting frame 4, a pulley assembly 802 is installed between the driving rod 801 and one of the mounting rods 601, a first gear 803 is installed on the driving rod 801, two second gears 8011 are rotatably mounted on the mounting frame 4, an annular toothed belt 804 is installed between the two second gears 8011, the first gear 803 is meshed with the annular toothed belt 804, a spring telescopic rod 808 is installed on the mounting frame 4, and a free end of the spring telescopic rod 808 is provided. A forcing frame 809 is installed, and a forcing plate 8010 for contacting the forcing frame 809 is constructed on the sliding frame plate 9. A wedge plate 805 is vertically slidably installed on the forcing frame 809. A connecting spring 806 is installed between the wedge plate 805 and the sliding frame plate 9. A plurality of wedge grooves 807 for inserting the wedge plate 805 are arranged in an array on the outer peripheral side of the annular toothed belt 804. That is to say, when the two lower pressure plates 502 move to the maximum limit position and move away from each other, the transmission rod 701 continues to move to drive the sliding frame plates 9 to move away from each other, and the sliding When the frame plates 9 move away from each other, they will contact the forcing plate 8010 on the forcing frame 809, thereby causing the two forcing frames 809 to move away from each other. The forcing frames 809 move away from each other, thereby causing the ejection telescopic rod to be elongated. When the forcing frame 809 moves, a side plane on the wedge plate 805 will contact the wedge groove 807, thereby driving the annular toothed belt 804 to move. At this time, the second gear 8011 will also rotate, and the annular toothed belt 804 is meshed with the first gear 803, so at this time the first gear 803 will rotate, thereby driving the driving rod connected thereto. 801 rotates. Because a pulley assembly 802 is installed between the driving rod 801 and the mounting rod 601, the mounting rod 601 rotates to realize the movement of the conveyor belt 603, so as to achieve the purpose of moving the placement plate 604 downward. When the sliding frame plate 9 moves to the maximum limit, one placement plate 604 is flush with the lower pressure plate 502, and the other placement plate 604 is located away from the lower pressure plate 502, ensuring that every time the conveyor belt 603 moves, there is exactly one placement plate 604 that can move to be flush with the lower pressure plate 502.

[0025] like Figure 5 As shown, in some embodiments, the mounting frame 4 is horizontally slidably mounted on the carrier 1, and an actuator 10 for driving the two mounting frames 4 to move is mounted on the carrier 1. The design of the actuator 10 can adjust the distance between the two mounting frames 4, thereby being able to adapt to different types of test circuit boards, further improving the scope of use.

[0026] like Figure 5As shown, in some embodiments, the actuator 10 includes an adjusting screw 1001 horizontally and rotatably mounted on the carrier 1, and the adjusting screw 1001 is symmetrically provided with positive and negative threads, and two mounting frames 4 are symmetrically threadedly sleeved on the adjusting screw 1001. When the adjusting screw 1001 rotates, because the two mounting frames 4 are symmetrically threadedly sleeved on the adjusting screw 1001, rotating the adjusting screw 1001 will make the mounting frames 4 move closer to or farther away from each other, and there is no need to move the mounting frames 4 separately, which is more convenient to use. Moreover, because the threaded fit is self-locking, the mounting frames 4 will not be pulled to move when the sliding frame 9 is moved.

[0027] like Figure 1-Figure 11 As shown, in some embodiments, the mounting rod 601 is unidirectionally rotatable, the upper pressure plate 501 is L-shaped and one end is rotatably mounted on the lower pressure plate 502, and the other end of the upper pressure plate 501 is rotatably mounted with a holding plate 11 for contacting the test circuit board. The unidirectional rotation of the mounting rod 601 is a prior art, and for example, an isomorphic ratchet mechanism can realize the unidirectional rotation of the mounting rod 601, which is a well-known technical means. The design of the rotation of the holding plate 11 can ensure that the holding plate 11 has a good contact area with the test circuit board when the upper pressure plate 501 presses the test circuit board, thereby ensuring the firmness of the clamping.

[0028] like Figure 8-Figure 9 As shown, the integrated circuit testing equipment includes the above-mentioned integrated circuit testing carrier, and also includes a capacitor box 12, a mounting seat 13 is installed on the capacitor box 12, a board body 14 is vertically slidably installed on the mounting seat 13, a probe 15 is installed at the bottom of the board body 14, the carrier 1 is installed on the capacitor box 12 and is located below the probe 15, and a manual part 16 for driving the board body 14 to move is installed on the mounting seat 13. The manual part 16 is the existing technology of the existing integrated circuit device, as shown in the figure, including a pull rod rotatably installed on the mounting seat 13, a connecting rod is hinged between the pull rod and the board body 14, and the movement of the board body 14 is realized. The movement of the board body 14 makes the probe 15 contact with the corresponding power element, so that the test circuit board can be powered on for testing.

[0029] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An integrated circuit test carrier, characterized in that: include: A carrier (1), wherein a convex plate (2) is formed in the middle of the top surface of the carrier (1), a holding plate (3) is formed on the convex plate (2), and two mounting frames (4) are symmetrically mounted on the carrier (1); The clamping mechanism (5) comprises a lower pressing plate (502) mounted horizontally and slidably on the mounting frame (4) and used to press the bottom surface of the test circuit board; an upper pressing plate (501) is rotatably mounted on the lower pressing plate (502) and used to press the top of the test circuit board; a transmission member (503) acting on the upper pressing plate (501) is mounted on the mounting frame (4); when the two lower pressing plates (502) move away from each other, the transmission member (503) drives the corresponding upper pressing plate (501) to rotate in a direction away from the test circuit board; The holding plate (3) is located between the two lower pressing plates (502) and at a lower position; a conveying assembly (6) mounted on the carrier (1) and acting on the upper pressing plate (501); when the upper pressing plate (501) rotates to separate from the test circuit board, the test circuit board separated from the lower pressing plate (502) is stacked onto the containing carrier (3) through the conveying assembly (6); An adjustment component (7) is mounted on the carrier (1) and is used to drive the lower pressing plate (502) to move.

2. The integrated circuit test carrier according to claim 1, characterized in that: The lower pressing plate (502) is horizontally slidably mounted on the mounting frame (4); the transmission member (503) comprises a rotating bar frame (5031) with one end rotatably mounted on the mounting frame (4); a moving rod (5032) is slidably inserted on the rotating bar frame (5031); the free end of the moving rod (5032) is hinged on the upper pressing plate (501); a convex block (5033) is constructed on one side of the moving rod (5032); a through groove (5034) is opened on one side of the upper pressing plate (501); and a column rod (5035) is mounted on the convex block (5033) and is slidably tangent to the through groove (5034).

3. The integrated circuit test carrier according to claim 2, characterized in that: The conveying assembly (6) comprises two transmission belt assemblies symmetrically mounted on the mounting frame (4), the lower pressure plate (502) being located between the two transmission belt assemblies, the transmission belt assembly comprising two mounting rods (601) rotatably mounted on the mounting frame (4), the coaxial mounting rods (601) being connected to each other, the two mounting rods (601) being distributed up and down and both being rotatably mounted with transmission wheels (602), a conveyor belt (603) being transmission-mounted between the two transmission wheels (602), two placement plates (604) being mounted on the outer surfaces of the two vertical sections of the conveyor belt (603), and a driving member (8) for driving the mounting rods (601) to rotate being mounted on the mounting frame (4).

4. The integrated circuit test carrier according to claim 3, characterized in that: The adjustment assembly (7) comprises a transmission rod (701) rotatably mounted on the carrier (1), two hinged rods (702) being symmetrically hinged on the transmission rod (701), free ends of the two hinged rods (702) being respectively hinged on the two lower pressure plates (502), and a hand-held rod (703) being constructed on the transmission rod (701).

5. The integrated circuit test carrier according to claim 4, characterized in that: A sliding frame plate (9) is horizontally slidably mounted on the lower pressure plate (502), a return spring (17) is mounted between the sliding frame plate (9) and the lower pressure plate (502), the hinged rod (702) is hinged on the sliding frame plate (9), the driving member (8) acts on the sliding frame plate (9), and when the sliding frame plates (9) are at the maximum limit position away from each other, the sliding frame plates (9) continue to move to drive the mounting rod (601) to rotate through the driving member (8).

6. The integrated circuit test carrier according to claim 5, characterized in that: The driving member (8) comprises a driving rod (801) rotatably mounted on the mounting frame (4), a pulley assembly (802) being mounted between the driving rod (801) and one of the mounting rods (601), a first gear (803) being mounted on the driving rod (801), two second gears (8011) being rotatably mounted on the mounting frame (4), an annular toothed belt (804) being transmission-mounted between the two second gears (8011), the first gear (803) being meshed with the annular toothed belt (804), and the mounting frame (4) A spring telescopic rod (808) is mounted on the upper surface, a forcing frame (809) is mounted on the free end of the spring telescopic rod (808), a forcing plate (8010) for contacting the forcing frame (809) is constructed on the sliding frame plate (9), a wedge plate (805) is mounted on the forcing frame (809) for vertical sliding, a connecting spring (806) is mounted between the wedge plate (805) and the sliding frame plate (9), and a plurality of wedge grooves (807) for inserting the wedge plate (805) are arranged in an array on the outer peripheral side of the annular toothed belt (804).

7. The integrated circuit test carrier according to claim 6, characterized in that: The mounting frame (4) is horizontally slidably mounted on the carrier (1), and an actuator (10) for driving the two mounting frames (4) to move is mounted on the carrier (1).

8. The integrated circuit test carrier according to claim 7, characterized in that: The actuator (10) comprises an adjusting screw (1001) which is horizontally and rotatably mounted on the carrier (1), the adjusting screw (1001) being symmetrically provided with positive and negative threads, and two mounting frames (4) being symmetrically threadedly sleeved on the adjusting screw (1001).

9. The integrated circuit test carrier according to claim 8, characterized in that: The mounting rod (601) is unidirectionally rotatable, the upper pressing plate (501) is L-shaped and one end is rotatably mounted on the lower pressing plate (502), and the other end of the upper pressing plate (501) is rotatably mounted with a holding plate (11) for contacting a test circuit board.

10. An integrated circuit testing device, comprising the integrated circuit testing carrier according to claim 9, characterized in that: It also comprises a capacitor box (12), a mounting seat (13) being mounted on the capacitor box (12), a plate body (14) being mounted on the mounting seat (13) in a vertically slidable manner, a probe (15) being mounted on the bottom of the plate body (14), the carrier (1) being mounted on the capacitor box (12) and being located below the probe (15), and a manual part (16) for driving the plate body (14) to move being mounted on the mounting seat (13).

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