Server cooling device and server

Abstract

The present application relates to the technical field of air-cooled heat dissipation equipment, and discloses a server heat dissipation device and a server, comprising at least one composite heat dissipation plate, at least one heat conductor and at least one air-cooled heat dissipation component, wherein the composite heat dissipation plate has a first surface, and the first surface is used to abut against the heat dissipation surface of the heating part, and a liquid cooling chamber and a heat equalization chamber are arranged in the composite heat dissipation plate, and the heat equalization chamber and the liquid cooling chamber are arranged in a stacked manner in a direction away from the first surface; the portion of the heat conductor close to its first end is arranged in the composite heat dissipation plate and is located between the heat equalization chamber and the liquid cooling chamber; the portion of the heat conductor close to its second end is arranged in the air-cooled heat dissipation component, so as to improve the heat dissipation uniformity of the server, reduce noise, and avoid data loss.

Description

Technical Field

[0001] The present application relates to the technical field of air-cooling and heat dissipation equipment, and in particular to a server heat dissipation device and a server. Background Art

[0002] When the server is working, the processor will generate a lot of heat. When the temperature inside the server is too high, the performance of the hardware components will be affected. For example, the processor may automatically reduce the frequency due to overheating, thereby reducing the processing speed and affecting the operating efficiency of the server. High temperature environment will accelerate the aging process of hardware and shorten the service life of the server. In high temperature environment, the stability of the server will be seriously affected. Problems such as system crashes and data loss may occur. Therefore, server heat dissipation is an important factor affecting the efficient operation of the server.

[0003] In the related technology, with the continuous improvement of processor manufacturing technology, the power consumption of the processor is also increasing, and the requirements for the radiator are also increasing. Air cooling and liquid cooling are the mainstream cooling methods of servers. In order to improve the cooling efficiency, the air-cooled radiator will become larger and larger; the liquid-cooled radiator will increase the circulation speed of the cooling medium to improve the cooling efficiency.

[0004] However, the increase in the size of the air-cooled radiator places higher requirements on the overall chassis size, and the temperature of the air after passing through the processor is very high, causing the temperature of the components located at the rear end of the processor in the server to be too high and the cooling effect to be poor, which also affects the efficient operation of the server. At the same time, the fan speed is getting higher and higher, causing the noise of the server to increase. Liquid-cooled radiators often leak or CDU (Cooling Distribution Unit) often fails, causing the processor to overheat and the server to have problems such as data loss. Summary of the invention

[0005] The present application provides a server heat dissipation device and a server to improve the heat dissipation uniformity of the server, reduce noise, and avoid data loss.

[0006] On the one hand, the present application provides a server heat dissipation device, comprising at least one composite heat sink, at least one heat conductor and at least one air-cooled heat dissipation component, wherein the composite heat sink has a first surface, the first surface is used to abut against the heat dissipation surface of the heat-generating part, and a liquid cooling chamber and a heat equalizing chamber are arranged in the composite heat sink, the heat equalizing chamber and the liquid cooling chamber are stacked in a direction away from the first surface, the heat conductor is arranged in the composite heat sink near its first end, and is located between the heat equalizing chamber and the liquid cooling chamber; the heat conductor is arranged in the air-cooled heat dissipation component near its second end.

[0007] Beneficial effects: by bringing the first surface of the composite heat sink into contact with the heat dissipation surface of a heat-generating component (such as a processor, etc.), the heat-saturating chamber and the liquid-cooling chamber are stacked in a direction away from the first surface, and the portion of the heat conductor close to its first end is arranged in the composite heat sink and is located between the heat-saturating chamber and the liquid-cooling chamber; since the heat-saturating chamber is continuously circulated and transformed between liquid and gas through a phase change medium, rapid absorption and transfer of heat can be achieved, thereby enhancing the cooling effect of the composite heat sink on the heat dissipation surface of the heat-generating component, so that the heat generated by the heat-generating component can be promptly absorbed and transferred by the composite heat sink, and transferred to various parts of the composite heat sink.

[0008] Part of the heat on the composite heat sink is transferred to the air-cooled heat dissipation component through the heat conductor, and heat is exchanged and dissipated through the airflow generated by the fan in the server. The other part of the heat is absorbed by the cooling medium circulating in the liquid cooling cavity and discharged to the outside of the server along with the cooling medium.

[0009] Since the cooling medium in the liquid cooling chamber takes away part of the heat generated by the heat-generating components, the heat taken away by the air-cooling airflow generated by the fan is reduced. Therefore, after the air-cooling airflow passes through the air-cooling heat dissipation components and the heat-generating components, the temperature rise of the air-cooling airflow is reduced. Therefore, when passing through the components at the rear end of the heat-generating components, the components at the rear end of the server can be effectively cooled. Therefore, without increasing the volume of the fan and the fan speed, the uniformity of the ambient temperature of each running component in the server can be achieved, thereby ensuring the high efficiency of the server operation, improving the performance of the server, and avoiding the increase in the volume of the server chassis and the problem of high service noise.

[0010] Secondly, when the liquid cooling circuit fails or the server is powered off and the cooling medium stops circulating, the server can adjust the fan speed to ensure that the heat-generating components continue to work, to avoid the server crashing due to overheating in a short period of time and causing data loss; and in the event of a sudden power outage, the server can also use the built-in power supply unit in the server (such as BBU, Battery Backup Unit, the battery backup unit in the server) to power the system fan for a short time, so that the system fan can run for a certain period of time, to ensure that the heat-generating components do not overheat in a short period of time, so that the server has time to save data and avoid data loss.

[0011] In an optional embodiment, the heat conductor is a heat pipe, and a portion of the heat pipe located inside the composite heat dissipation plate is connected to the heat equalization chamber.

[0012] In an optional embodiment, the height of the heat pipe gradually decreases along a third direction from the second end to the first end, wherein the third direction is perpendicular to the first surface.

[0013] In an optional embodiment, a plurality of the heat conductors are provided, and locations of the plurality of heat conductors located in the composite heat sink are spaced apart along a first direction, and locations of the plurality of heat conductors located in the composite heat sink all extend along a second direction, wherein the first direction is parallel to the first surface, and the second direction is perpendicular to the first direction and parallel to the first surface.

[0014] In an optional embodiment, the heat conductor is located in a position inside the air-cooled heat dissipation component, and is flat along a third direction, wherein the third direction is perpendicular to the first surface; and / or, the heat conductor is located in a position inside the composite heat dissipation plate, and is flat along the first direction, and is planar at a position close to the heat equalization chamber.

[0015] In an optional embodiment, heat exchange parts are provided on two inner surfaces of the heat-averaging chamber respectively close to the first surface and the heat conductor, and the heat exchange parts are fin-shaped or porous.

[0016] In an optional embodiment, the composite heat sink includes a liquid cooling plate body and a heat spreader body, the first surface and the heat spreader cavity are both located on the heat spreader body, the portion of the heat conductor close to the first end is connected to the heat spreader body, the liquid cooling cavity is located in the liquid cooling plate body, the surface of the heat spreader body opposite to the first surface is the second surface, the second surface is in contact with the liquid cooling plate body, and the liquid cooling plate body and the heat spreader body are detachably connected.

[0017] In an optional embodiment, at least a portion of the heat conductor located inside the composite heat sink protrudes from the second surface, and a groove portion is provided on the surface of the liquid cooling plate body in contact with the second surface, and the groove portion accommodates the portion of the heat conductor protruding from the second surface.

[0018] In an optional embodiment, a fixing frame is further included, which is annular, and the edge of the liquid cooling plate body is provided with a fixing flange, the inner ring edge of the fixing frame is crimped with the fixing flange, and the fixing frame is used to be fixedly connected to the mainboard assembly.

[0019] In an optional implementation, a first thermally conductive adhesive layer is provided between the groove portion and the heat conductor; and / or a second thermally conductive adhesive layer is provided between the second surface and the liquid cooling plate body.

[0020] In an optional embodiment, it also includes multiple isolation slot shells and multiple liquid cooling pipelines, the input end and the output end of the liquid cooling cavity are both connected to the liquid cooling pipeline, each of the liquid cooling pipelines is respectively arranged in each of the isolation slot shells, and the isolation slot shells are used to connect to the mainboard assembly.

[0021] In an optional embodiment, a plurality of water retaining ribs are arranged at intervals in the isolation tank shell along the direction in which the isolation tank shell extends.

[0022] In an optional embodiment, there are multiple composite heat sinks, each of which is connected to at least one heat conductor, and the liquid cooling cavities in the multiple composite heat sinks are connected in series and used to communicate with a cooling medium circuit.

[0023] In an optional embodiment, a plurality of the air-cooling heat dissipation components are provided, and each of the air-cooling heat dissipation components is respectively connected to a portion of the plurality of heat conductors.

[0024] On the other hand, the present application further provides a server, comprising: a server heat dissipation device in any one of the above embodiments.

[0025] Beneficial effect: Because the server includes a server heat dissipation device, it has the same effect as the server heat dissipation device and is not described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the related technologies, the drawings required for use in the specific implementation methods or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is an axial side view of a server heat dissipation device according to an embodiment of the present application;

[0028] Figure 2 It is an axial side view of another perspective of a server heat dissipation device according to an embodiment of the present application;

[0029] Figure 3 A top view of a server heat dissipation device according to an embodiment of the present application;

[0030] Figure 4 for Figure 3 Sectional view at AA in the middle;

[0031] Figure 5 This is an axial side view of a heat sink in a server heat dissipation device according to an embodiment of the present application;

[0032] Figure 6 This is an axial side view of a liquid cooling plate in a server heat dissipation device according to an embodiment of the present application;

[0033] Figure 7 It is an axial side view of an isolation tank shell and a liquid cooling pipeline in a server heat dissipation device according to an embodiment of the present application;

[0034] Figure 8 It is an axial side view of an isolation slot shell in a server heat dissipation device according to an embodiment of the present application;

[0035] Fig. 9 It is an axial side view of the bottom surface of a heat-saturating chamber in a server heat dissipation device according to an embodiment of the present application;

[0036] Fig.10 This is an axial side view of an isolation slot shell in another server heat dissipation device according to an embodiment of the present application.

[0037] Description of reference numerals:

[0038] X, first direction; Y, second direction; Z, third direction;

[0039] 1. Composite heat sink; 2. Heat conductor; 3. Air-cooled heat dissipation assembly; 4. Isolation tank shell; 5. Liquid cooling pipeline; 6. Fixed frame;

[0040] 11. first side; 12. liquid cooling chamber; 13. soaking chamber; 14. liquid cooling plate; 15. soaking plate; 16. second side; 17. groove; 121. liquid outlet; 122. liquid inlet; 131. high position area; 132. low position area;

[0041] 21. heat pipe; 41. water retaining rib; 141. fixed flange. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0043] In the related art, when the server is working, the processor will generate a lot of heat. When the temperature inside the server is too high, the performance of the hardware components will be affected. For example, the processor may automatically reduce the frequency due to overheating, thereby reducing the processing speed and affecting the operating efficiency of the server. High temperature environment will accelerate the aging process of hardware and shorten the service life of the server. In high temperature environment, the stability of the server will be seriously affected. Problems such as system crashes and data loss may occur. Therefore, server heat dissipation is an important factor affecting the efficient operation of the server.

[0044] With the continuous improvement of processor manufacturing technology, the power consumption of processors is also increasing, and the requirements for radiators are also increasing. Air cooling and liquid cooling are the mainstream cooling methods for servers. In order to improve the cooling efficiency, the air-cooled radiator will become larger and larger; the liquid-cooled radiator will increase the circulation speed of the cooling medium to improve the cooling efficiency.

[0045] However, the increase in the size of the air-cooled radiator places higher requirements on the overall chassis size, and the temperature of the air after passing through the processor is very high, causing the temperature of the components located at the rear end of the processor in the server to be too high and the cooling effect to be poor, which also affects the efficient operation of the server. At the same time, the fan speed is getting higher and higher, causing the noise of the server to increase. Liquid-cooled radiators often leak or CDU (Cooling Distribution Unit) often fails, causing the processor to overheat and the server to have problems such as data loss.

[0046] Therefore, the present application provides a server heat dissipation device and a server to improve the heat dissipation uniformity of the server, reduce noise, and avoid data loss.

[0047] Combine the following Figures 1 to 10 , describing an embodiment of the present application.

[0048] According to an embodiment of the present application, on the one hand, a server heat dissipation device is provided, such as Figures 1 to 4 As shown, it includes at least one composite heat dissipation plate 1, a heat conductor 2 and an air-cooled heat dissipation component 3, and the specific scheme is as follows.

[0049] like Figure 1 As shown, the composite heat sink 1 is provided with at least one, specifically, the composite heat sink 1 is a plate with good thermal conductivity such as a copper plate, an aluminum plate, etc.; the composite heat sink 1 has a first surface 11, and the first surface 11 is used to abut against the heat dissipation surface of the heat-generating component to achieve the fit between the first surface 11 and the heat-generating component, thereby improving the heat exchange efficiency between the composite heat sink 1 and the heat-generating component; Figure 3 As shown, a liquid cooling chamber 12 and a heat-averaging chamber 13 are provided in the composite heat sink 1. Specifically, the heat-averaging chamber 13 can be a VC heat-averaging chamber (VC, Vapor-Chamber, vacuum chamber heat-averaging plate heat dissipation technology); the heat-averaging chamber 13 and the liquid cooling chamber 12 are stacked in a direction away from the first surface 11, and the liquid cooling chamber 12 is used to communicate with a cooling medium circuit to achieve liquid cooling.

[0050] like Figure 4 As shown, at least one heat conductor 2 is provided, and the specific number can be selected and set according to the specific size of the composite heat sink 1; the portion of the heat conductor 2 close to its first end is arranged in the composite heat sink 1, and is located between the heat equalization chamber 13 and the liquid cooling chamber 12, so as to perform heat exchange with the composite heat sink 1.

[0051] like Figure 1 As shown, the air-cooled heat dissipation component 3 has an air-cooled heat dissipation structure, and at least one air-cooled heat dissipation component 3 is provided. The specific number can be selected and set according to the number of heat conductors 2 and the space of the server; the portion of the heat conductor 2 close to its second end is arranged in the air-cooled heat dissipation component 3 to air-cool the heat conductor 2; specifically, the air-cooled heat dissipation component 3 has a fin or a porous honeycomb-shaped heat dissipation portion, which diffuses heat into the air through air intake; of course, a fan can also be provided on the air-cooled heat dissipation component 3, and the heat dissipation effect of the air-cooled heat dissipation component 3 can be enhanced by integrating the heat dissipation portion with the fan.

[0052] It needs to be explained that the above-mentioned "first surface 11 is used to abut against the heat dissipation surface of the heat-generating part", that is, the composite heat dissipation plate 1 is pressed onto the heat dissipation surface of the heat-generating component under a certain pressure, and the pressure can be set according to actual needs. Of course, the pressure value can also be 0; specifically, the heat-generating component can be a processor, etc.

[0053] It should be noted that the heat conductor 2 can be an object with heat conductivity such as a copper bar, an aluminum bar or a heat pipe 21.

[0054] Specifically, the liquid cooling cavity 12 can be a rectangular cavity, and a fin portion or a porous structure portion is provided on the surface of the liquid cooling cavity 12 close to the first surface 11. More specifically, the fin portion is a plurality of sheets arranged side by side and spaced apart, which can enhance the heat exchange efficiency between the cooling medium in the liquid cooling cavity 12 and the composite heat sink 1; the porous structure portion can be a honeycomb-shaped heat-conducting surface in which the holes are connected to each other. Of course, the material of the heat-conducting surface is welded by heat-conducting metal wires, which can also enhance the heat exchange efficiency between the cooling medium in the liquid cooling cavity 12 and the composite heat sink 1.

[0055] Preferably, a plurality of partitions are arranged in the liquid cooling cavity 12, and the partitions extend along the flow direction of the cooling medium in the liquid cooling cavity 12 to separate the liquid cooling cavity 12 into a plurality of liquid cooling channels. Specifically, the extension direction of the liquid cooling channel can be any direction.

[0056] In the specific use process, such as Figure 1 As shown, taking the heat dissipation of the processor in the server as an example, the first surface 11 of the composite heat sink 1 is brought into contact with the heating surface of the processor (preferably, a thermal grease layer is provided between the first surface 11 and the processor to enhance the heat exchange efficiency), and the composite heat sink 1 is fixed by a fixing frame 6, and the fixing frame 6 is connected to the mainboard in the server through an elastic member to achieve abutment between the composite heat sink 1 and the processor under a certain pressure, wherein the elastic member may be an elastic compression spring or a screw sleeved with a spring, etc.

[0057] The air-cooling heat dissipation component 3 is arranged on the path of the air-cooling airflow in the server, so that the air-cooling airflow can enter the air-cooling heat dissipation component 3 to cool the air-cooling heat dissipation component 3; of course, the air-cooling heat dissipation component 3 can also be an integrated structure with the fan in the server; the input and output ends of the liquid cooling chamber 12 are connected to the cooling medium circuit, and the cooling medium is introduced for circulation, so that during the operation of the server, the server is cooled by air cooling and liquid cooling at the same time.

[0058] In this embodiment, if Figures 1 to 4 As shown, by bringing the first surface 11 of the composite heat sink 1 into contact with the heat dissipation surface of the processor, the heat-saturating chamber 13 and the liquid-cooling chamber 12 are stacked in sequence in a direction away from the first surface 11, and the portion of the heat conductor 2 close to its first end is arranged in the composite heat sink 1, and is located between the heat-saturating chamber 13 and the liquid-cooling chamber 12; since the heat-saturating chamber is continuously circulated and transformed between the liquid and gas states through the phase change medium, rapid absorption and transfer of heat can be achieved, thereby enhancing the cooling effect of the composite heat sink 1 on the heat dissipation surface of the processor, so that the heat generated by the processor can be absorbed and transferred by the composite heat sink 1 in time, and transferred to various parts of the composite heat sink 1.

[0059] Part of the heat on the composite heat sink 1 is transferred to the air-cooled heat dissipation component 3 through the heat conductor 2, and heat is exchanged and dissipated through the airflow generated by the fan in the server. The other part of the heat is absorbed by the cooling medium circulating in the liquid cooling chamber 12 and discharged to the outside of the server along with the cooling medium.

[0060] Since the cooling medium in the liquid cooling chamber 12 takes away a part of the heat generated by the processor, the heat taken away by the air-cooling airflow generated by the fan is reduced, so that after the air-cooling airflow passes through the air-cooling heat dissipation component 3 and the processor, the temperature rise of the air-cooling airflow is reduced, so that when passing through the components at the rear end of the processor, the components at the rear end of the server can be effectively cooled, so that without increasing the fan volume and fan speed, the uniformity of the ambient temperature of each running component in the server can be achieved, the operating efficiency of the server is guaranteed, the performance of the server is improved, and at the same time, the increase in the volume of the server chassis and the problem of high service noise are avoided.

[0061] Secondly, when the liquid cooling circuit fails or the server loses power, the cooling medium stops circulating and the server can adjust the fan speed to ensure that the processor continues to work, to avoid the server crashing due to overheating in a short period of time and causing data loss. In the event of a sudden power outage, the server can also use the built-in power supply unit in the server (such as BBU, Battery Backup Unit, the battery backup unit in the server) to power the system fan for a short time, so that the system fan can run for a certain period of time, to ensure that the processor does not overheat in a short period of time, so that the server has time to save data and avoid data loss.

[0062] At the same time, the heat generated by the processor is first heat exchanged through the heat conductor 2, and then heat exchanged with the liquid cooling chamber 12. Therefore, when the cooling medium circuit fails and stops working or the power is cut off, since the heat conductor 2 is closer to the first surface 11, the heat conductor 2 can absorb the heat transferred from the processor faster and as much as possible, effectively cooling the processor and ensuring the working performance of the processor.

[0063] In one embodiment, Figure 4 As shown, the heat conductor 2 is a heat pipe 21, and there is sintered metal copper powder inside the heat pipe 21. The sintered metal copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall of the heat pipe 21 and improve the heat exchange efficiency.

[0064] In this embodiment, a heat pipe 21 is used to connect the composite heat sink 1 and the air-cooled heat sink component 3. The phase change medium in the heat pipe 21 is heated at the composite heat sink 1 and converted into gas, which is transferred to the air-cooled heat sink component 3 along the heat pipe 21. After being cooled by air, it is converted into liquid and then flows back to the composite heat sink 1, thereby realizing the heat conduction function. The heat conduction rate is fast, which can improve the heat conduction efficiency and the air-cooling cooling efficiency.

[0065] In one embodiment, Figure 4 As shown, the heat conductor 2 is a heat pipe 21, and the portion of the heat pipe 21 located in the composite heat sink 1 is connected to the heat equalization chamber 13, that is, the portion of the heat pipe 21 located in the composite heat sink 1 is connected to the inside of the heat equalization chamber 13, and the phase change medium in the heat equalization chamber 13 can directly enter the heat pipe 21 and be transferred to the air-cooled heat dissipation component 3 through the heat pipe 21 for cooling.

[0066] Specifically, the portion of the heat pipe 21 located in the composite heat dissipation plate 1 can be connected to the heat-averaging chamber 13 partially along its axial direction, or can be connected to the heat-averaging chamber 13 along its entire axial direction; its connection method can be detachable, such as plug-in through a sliding sealing structure, or connected by a threaded sealing screw connection. Of course, the heat pipe 21 and the heat-averaging chamber 13 can be set as an integrally molded structure. This structure can avoid the risk of leakage of the phase change medium.

[0067] In this embodiment, if Figure 4 As shown, by directly connecting the heat pipe 21 with the heat-averaging chamber 13, the heat-averaging chamber 13 does not need to absorb heat from the processor, so that the phase change medium is converted into a gas state, and then converted into a liquid state along the inner top of the heat-averaging chamber 13 away from the first surface 11. The heat is then transferred to the heat pipe 21 through the upper wall of the heat-averaging plate, and a gaseous phase change medium is formed in the heat pipe 21 to be discharged to the external environment within the air-cooled heat dissipation component 3.

[0068] The heat absorbed by the heat-spreading chamber 13 from the heating part of the processor can be directly converted into a gas by the phase change medium, and then directly enter the heat pipe 21, and be transferred to the air-cooling heat dissipation component 3 through the heat pipe 21 for air cooling, thereby avoiding the need for heat to undergo two phase changes between the heat-spreading plate and the heat pipe 21, thereby improving the heat transfer efficiency and the air-cooling heat dissipation effect.

[0069] In one embodiment, the height of the heat pipe 21 gradually decreases along the third direction Z from the second end to the first end, wherein the third direction Z is perpendicular to the first surface 11; that is, the height of the heat pipe 21 gradually decreases along the third direction Z as it extends from one end located at the air-cooled heat dissipation component 3 to the direction located at the composite heat dissipation plate 1.

[0070] In this embodiment, by gradually decreasing the height of the heat pipe 21 from the second end to the first end along the third direction Z, the liquid phase change medium can be easily refluxed and the gaseous phase change medium can be diffused toward the air-cooled heat dissipation component 3, thereby improving the heat exchange efficiency.

[0071] In one embodiment, Figure 1 and Figure 4 As shown, a plurality of heat conductors 2 are provided, and the portions of the plurality of heat conductors 2 located in the composite heat dissipation plate 1 are arranged at intervals along the first direction X, and the portions of the plurality of heat conductors 2 located in the composite heat dissipation plate 1 all extend along the second direction Y, wherein the first direction X is parallel to the first surface 11, and the second direction Y is perpendicular to the first direction X and parallel to the first surface 11; that is, the portions of the plurality of heat conductors 2 located in the composite heat dissipation plate 1 are all at the same distance from the first surface 11 and are evenly distributed.

[0072] It is worth noting that although the plurality of heat conductors 2 located inside the composite heat sink 1 are extended along the second direction Y and are spaced apart in the first direction X, the arrangement of the plurality of heat conductors 2 located outside the composite heat sink 1 is not restricted and can be adjusted according to needs and spatial layout, but a smooth transition is usually performed.

[0073] Specifically, Figure 1 As shown, a plurality of air-cooling heat dissipation components 3 are provided, and each air-cooling heat dissipation component 3 is respectively connected to a portion of the plurality of heat conductors 2; specifically, the number of heat conductors 2 connected to a composite heat dissipation plate 1 is 2 to 8, preferably any one of 2, 4, 6 and 8, such as Figure 1As shown, preferably there are 6 heat conductors 2, wherein every 2 heat conductors 2 share an air-cooled heat dissipation component 3. As shown in the figure, 6 heat conductors 2 are connected to each composite heat sink 1, the two heat conductors 2 located in the middle are connected to an air-cooled heat dissipation component 3 located on one side of the composite heat sink 1 along the second direction Y, and the remaining 4 heat conductors 2 are divided into two groups and are respectively connected to two air-cooled heat dissipation components 3 located on the other side of the composite heat sink 1 along the second direction Y.

[0074] More specifically, along the first direction X, the distance between any two adjacent heat conductors 2 is 2 mm to 5 mm, preferably any one of 2 mm, 3 mm, 4 mm and 5 mm, and more preferably 3 mm.

[0075] In this embodiment, if Figure 1 As shown, by arranging a plurality of heat conductors 2, the plurality of heat conductors 2 are arranged at intervals along the first direction X, and the portions of the plurality of heat conductors 2 located in the composite heat sink 1 all extend along the second direction Y, thereby ensuring the uniformity of the distribution of the heat conductors 2 in the composite heat sink 1, improving the uniformity of heat exchange with the heating surface of the processor, and ensuring the temperature uniformity of various portions of the processor.

[0076] In one embodiment, Figure 5 As shown, the heat conductor 2 is located in the air-cooled heat dissipation component 3 and is flat along the third direction Z, wherein the third direction Z is perpendicular to the first surface 11 .

[0077] In this embodiment, since the space in the thickness direction of the server is generally 4.45 cm, the space is relatively tight, and thus the thickness of the air-cooled heat dissipation component 3 is also relatively small. By locating the heat conductor 2 in the position of the air-cooled heat dissipation component 3 and setting it to be flat along the third direction Z, the space occupied in the thickness direction of the server can be reduced, the contact area between the heat conductor 2 and the air-cooled heat dissipation component 3 can be increased, and the air-cooled cooling effect can be improved.

[0078] In one embodiment, Figure 5 As shown, the heat conductor 2 is located inside the composite heat sink 1 and is flat along the first direction X, and the portion close to the heat equalization chamber 13 is planar, that is, the cross section of the heat conductor 2 is a combination of a rectangular lower portion and a semicircular upper portion.

[0079] In this embodiment, the portion of the heat conductor 2 located in the composite heat sink 1 is flat along the first direction X, which can increase the contact area between the heat conductor 2 and the composite heat sink 1, and improve the heat exchange efficiency; at the same time, the portion of the heat conductor 2 located in the composite heat sink 1 and close to the heat equalizing chamber 13 is planar, which can increase the contact area between the heat conductor 2 and the heat equalizing chamber 13, thereby further improving the heat exchange efficiency.

[0080] In one embodiment, heat exchange parts are provided on two inner surfaces of the heat-averaging chamber 13 respectively close to the first surface 11 and the heat conductor 2. The heat exchange parts are fin-shaped or porous to increase the heat exchange area with the phase change medium.

[0081] Specifically, the heat exchange part is porous, and sintered metal copper powder can be arranged in the heat-averaging chamber 13. The sintered metal copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall surface of the heat-averaging chamber 13 to increase the heat exchange efficiency.

[0082] In this embodiment, heat exchange parts are provided on two inner surfaces of the heat-averaging chamber 13, respectively close to the first surface 11 and the heat conductor 2, so as to increase the contact area with the phase change medium, thereby improving the heat exchange efficiency between the phase change medium and the heat-averaging chamber 13, thereby improving the heat dissipation efficiency of the composite heat sink 1; and the heat exchange part is fin-shaped or porous, with a simple structure and high heat exchange efficiency.

[0083] In one embodiment, Figure 4 As shown, the composite heat sink 1 includes a liquid cooling plate body 14 and a heat soaking plate body 15, and the first surface 11 and the heat soaking cavity 13 are both located on the heat soaking plate body 15. Figure 5 As shown, the portion of the heat conductor 2 close to the first end is connected to the heat spreader 15, as shown in FIG. Figure 4 As shown, the liquid cooling cavity 12 is located in the liquid cooling plate body 14, and the surface of the heat spreader body 15 opposite to the first surface 11 is the second surface 16. The second surface 16 abuts against the liquid cooling plate body 14 to achieve heat transfer. The liquid cooling plate body 14 and the heat spreader body 15 are detachably connected to facilitate the maintenance of the liquid cooling plate body 14 or the heat spreader body 15 respectively.

[0084] Specifically, Figure 4 As shown, the heat spreader 15 and the liquid cooling plate 14 are arranged to overlap and contact along the third direction Z, and can be elastically connected to the mainboard assembly through a fixed frame 6, or the heat spreader 15 and the liquid cooling plate 14 can be connected to the mainboard assembly respectively through a fixed frame 6 or other forms of fixing parts.

[0085] In this embodiment, if Figure 4 As shown, by dividing the heat spreader body 15 and the liquid cooling plate body 14 into two parts and arranging them in an overlapping manner, the liquid cooling circulation system can be repaired separately without shutting down the server; and the heat spreader body 15 or the liquid cooling plate body 14 can be replaced separately when either is damaged, which can reduce maintenance costs.

[0086] In one embodiment, Figure 4 and Figure 5 As shown, at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes out of the second surface 16, as shown in FIG. Figure 6As shown, a groove portion 17 is provided on the surface of the liquid cooling plate body 14 that contacts the second surface 16 , and the groove portion 17 accommodates the portion of the heat conductor 2 that protrudes from the second surface 16 .

[0087] It is worth noting that at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes from the second surface 16, that is, a portion of the heat conductor 2 is embedded in the heat spreader body 15, and another portion protrudes from the second surface 16 to be accommodated in the groove portion 17; it can also be, for example Figure 5 As shown, the surface of the heat conductor 2 close to the heat spreader 15 is in close contact with or in communication with the heat spreader 15 , and the heat conductor 2 is entirely protruded from the second surface 16 and accommodated in the groove 17 .

[0088] Specifically, the shape of the groove portion 17 matches the shape of the protruding second surface 16 of the heat conductor 2 , and the number of the groove portions 17 also matches the number of the heat conductors 2 .

[0089] like Figure 5 As shown, the cross section of the heat conductor 2 located inside the composite heat sink 1 can be directional, or can be an arch shape, that is, the upper part of the square is a semicircle, or can be other shapes.

[0090] In this embodiment, if Figures 4 to 6 As shown, by accommodating at least a portion of the heat conductor 2 located inside the composite heat sink 1 in the liquid cooling plate, not only can the relative positions of the liquid cooling plate and the heat spreader be positioned, but also the maintenance of the heat conductor 2 and the heat spreader can be facilitated.

[0091] In a specific embodiment, Figure 4 As shown, the server heat dissipation device also includes a fixed frame 6, which is annular in shape. A fixed flange 141 is provided at the edge of the liquid cooling plate body 14. The inner ring edge of the fixed frame 6 is crimped with the fixed flange 141, and the fixed frame 6 is used to be fixedly connected to the mainboard assembly; specifically, the fixed frame 6 and the mainboard assembly can be elastically connected by an elastic member or a bolt with a spring.

[0092] In this embodiment, the heat spreader 15 and the liquid cooling plate 14 are positioned and connected via the groove 17 and the heat conductor 2. A fixed flange 141 is provided at the edge of the liquid cooling plate 14 and is crimped and fixed via the fixing frame 6. The fixing method is simple and easy to disassemble.

[0093] In one embodiment, a first thermally conductive adhesive layer is provided between the groove portion 17 and the heat conductor 2; and / or a second thermally conductive adhesive layer is provided between the second surface 16 and the liquid cooling plate body 14. Specifically, the first thermally conductive adhesive layer and the second thermally conductive adhesive layer are thermally conductive silicone grease or other thermally conductive colloids.

[0094] In this embodiment, by setting a first thermally conductive adhesive layer between the groove portion 17 and the heat conductor 2, a gap between the heat conductor 2 and the groove portion 17 can be avoided, thereby improving the thermal conductivity efficiency; by setting a second thermally conductive adhesive layer between the second surface 16 and the liquid-cooled plate body 14, a gap between the second surface 16 and the liquid-cooled plate body 14 can be avoided, thereby improving the thermal conductivity efficiency.

[0095] In one embodiment, Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown, the server heat dissipation device also includes multiple isolation slot shells 4 and multiple liquid cooling pipelines 5. The input end and the output end of the liquid cooling cavity 12 are both connected to the liquid cooling pipeline 5. Each liquid cooling pipeline 5 is respectively arranged in each isolation slot shell 4. The isolation slot shell 4 is used to connect with the mainboard assembly.

[0096] It should be noted that if Figure 3 As shown, the shape of the liquid cooling pipeline 5 in the server needs to be designed to avoid the shapes of other components in the server. For example, if a certain component is on the optimal layout route of the liquid cooling pipeline 5, the liquid cooling pipeline 5 needs to be bent to avoid the layout, and the bend avoidance is designed with a large rounded corner; similarly, the air cooling heat dissipation component 3 also needs to be designed to avoid the shape of other components in the server. Figure 1 In the figure, the air-cooling heat dissipation component 3 is partially hollowed out.

[0097] Specifically, Figure 8 As shown, the cross-section of the isolation trough shell 4 is U-shaped. The isolation trough shell 4 can be a shell made of plastic material, or a shell made of aluminum or other materials. The isolation trough shell 4 and the liquid cooling pipeline 5 are connected by a snap-fit ​​structure, such as a snap-fit ​​protrusion is provided in the shell, and the liquid cooling pipeline 5 can also be connected by glue bonding.

[0098] In this embodiment, by providing the isolation tank shell 4 , the liquid cooling pipeline 5 can be fixed and the anti-deformation capability of the liquid cooling pipeline 5 can be maintained.

[0099] In one embodiment, Fig.10 As shown, a plurality of water retaining ribs 41 are arranged at intervals in the isolation trough shell 4 along the extending direction of the isolation trough shell 4; specifically, the height of the water retaining ribs 41 is 2mm~3mm, preferably 3mm, and the spacing between the water retaining ribs 41 is 30mm~100mm, which can be any one of 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm and 100mm.

[0100] In this embodiment, by arranging a plurality of water retaining ribs 41 at intervals in the isolation tank shell 4, when a slight leakage occurs in the portion of the liquid cooling pipeline 5 located in the isolation tank shell 4, a certain amount of liquid cooling medium can be stored to prevent the liquid cooling medium from damaging the mainboard assembly; at the same time, the deformation resistance of the isolation tank shell 4 can be enhanced.

[0101] In one embodiment, Figure 3 As shown, a liquid inlet 122 and a liquid outlet 121 are provided at the top of the composite heat sink 1 along the third direction Z, which are respectively connected to the liquid inlet end and the liquid outlet end of the liquid cooling chamber 12, and the liquid inlet 122 and the liquid outlet 121 are respectively provided at two ends of the composite heat sink 1 along the second direction Y, and the direction of the liquid outlet 121 and the direction of the liquid inlet 122 are the same as those in the second direction Y, and are relatively arranged, which can reduce the length of the composite heat sink 1 in the second direction Y.

[0102] In one embodiment, Figure 1 and Figure 2 As shown, there are multiple composite heat sinks 1, each composite heat sink 1 is connected to at least one heat conductor 2, the liquid cooling chambers 12 in the multiple composite heat sinks 1 are connected in series, and are used to communicate with the cooling medium circuit, so that multiple heat-generating components can be liquid-cooled at the same time to simplify the design structure; preferably, the number of composite heat sinks 1 is 2 to 4, specifically any one of 2, 3 and 4, and more preferably 2.

[0103] In this embodiment, by providing a plurality of composite heat sinks 1, a plurality of heat generating components in the server can be cooled synchronously.

[0104] In one embodiment, Fig. 9 As shown, the portion where the inner bottom surface of the heat-averaging chamber 13 along the third direction Z overlaps with the multiple heat pipes 21 along the third direction Z is a high-position area 131, and the portion where the inner bottom surface of the heat-averaging chamber 13 along the third direction Z is misaligned with the multiple heat pipes 21 along the third direction Z is a low-position area 132. The height of the high-position area 131 along the third direction Z is higher than the low-position area 132, so that the refluxed liquid phase change medium is evenly distributed at the inner bottom of the heat-averaging chamber 13.

[0105] Specifically, the low-level area 132 is smoothly connected to the high-level area 131 , that is, tangent-connected, and the height of the low-level area 132 gradually decreases along the third direction Z in a direction away from the high-level area 131 .

[0106] More specifically, the height difference between the high area 131 and the low area is between 1 mm and 3 mm, that is, the height difference between the edge of the low area 132 close to the high area 131 and the edge of the low area far from the high area 131 is between 1 mm and 3 mm.

[0107] The above scheme is fully described below with an embodiment.

[0108] According to an embodiment of the present application, a server heat dissipation device is provided, such as Figures 1 to 4 As shown, it includes at least one composite heat dissipation plate 1, a heat conductor 2 and an air-cooled heat dissipation component 3, and the specific scheme is as follows.

[0109] like Figure 1 As shown, the composite heat sink 1 is provided with at least one, specifically, the composite heat sink 1 is a plate with good thermal conductivity such as a copper plate, an aluminum plate, etc.; the composite heat sink 1 has a first surface 11, and the first surface 11 is used to abut against the heat dissipation surface of the heat-generating component to achieve the fit between the first surface 11 and the heat-generating component, thereby improving the heat exchange efficiency between the composite heat sink 1 and the heat-generating component; Figure 3 As shown, a liquid cooling chamber 12 and a heat-averaging chamber 13 are provided in the composite heat sink 1. Specifically, the heat-averaging chamber 13 can be a VC heat-averaging chamber (VC, Vapor-Chamber, vacuum chamber heat-averaging plate heat dissipation technology); the heat-averaging chamber 13 and the liquid cooling chamber 12 are stacked in a direction away from the first surface 11, and the liquid cooling chamber 12 is used to communicate with a cooling medium circuit to achieve liquid cooling.

[0110] like Figure 4 As shown, at least one heat conductor 2 is provided, and the specific number can be selected and set according to the specific size of the composite heat sink 1; the portion of the heat conductor 2 close to its first end is arranged in the composite heat sink 1, and is located between the heat equalization chamber 13 and the liquid cooling chamber 12, so as to perform heat exchange with the composite heat sink 1.

[0111] like Figure 1 As shown, the air-cooled heat dissipation component 3 has an air-cooled heat dissipation structure, and at least one air-cooled heat dissipation component 3 is provided. The specific number can be selected and set according to the number of heat conductors 2 and the space of the server; the portion of the heat conductor 2 close to its second end is arranged in the air-cooled heat dissipation component 3 to air-cool the heat conductor 2; specifically, the air-cooled heat dissipation component 3 has a fin or a porous honeycomb-shaped heat dissipation portion, which diffuses heat into the air through air intake; of course, a fan can also be provided on the air-cooled heat dissipation component 3, and the heat dissipation effect of the air-cooled heat dissipation component 3 can be enhanced by integrating the heat dissipation portion with the fan.

[0112] Specifically, the liquid cooling cavity 12 can be a rectangular cavity, and a fin portion or a porous structure portion is provided on the surface of the liquid cooling cavity 12 close to the first surface 11. More specifically, the fin portion is a plurality of sheets arranged side by side and spaced apart, which can enhance the heat exchange efficiency between the cooling medium in the liquid cooling cavity 12 and the composite heat sink 1; the porous structure portion can be a honeycomb-shaped heat-conducting surface in which the holes are connected to each other. Of course, the material of the heat-conducting surface is welded by heat-conducting metal wires, which can also enhance the heat exchange efficiency between the cooling medium in the liquid cooling cavity 12 and the composite heat sink 1.

[0113] Preferably, a plurality of partitions are arranged in the liquid cooling cavity 12, and the partitions extend along the flow direction of the cooling medium in the liquid cooling cavity 12 to separate the liquid cooling cavity 12 into a plurality of liquid cooling channels. Specifically, the extension direction of the liquid cooling channel can be any direction.

[0114] More specifically, Figure 4 As shown, the heat conductor 2 is a heat pipe 21, and there is sintered metal copper powder inside the heat pipe 21. The sintered metal copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall of the heat pipe 21 and improve the heat exchange efficiency.

[0115] More specifically, Figure 4 As shown, the heat conductor 2 is a heat pipe 21, and the portion of the heat pipe 21 located in the composite heat sink 1 is connected to the heat equalization chamber 13, that is, the portion of the heat pipe 21 located in the composite heat sink 1 is connected to the inside of the heat equalization chamber 13, and the phase change medium in the heat equalization chamber 13 can directly enter the heat pipe 21 and be transferred to the air-cooled heat dissipation component 3 through the heat pipe 21 for cooling.

[0116] Specifically, the portion of the heat pipe 21 located in the composite heat dissipation plate 1 can be connected to the heat-averaging chamber 13 partially along its axial direction, or can be connected to the heat-averaging chamber 13 along its entire axial direction; its connection method can be detachable, such as plug-in through a sliding sealing structure, or connected by a threaded sealing screw connection. Of course, the heat pipe 21 and the heat-averaging chamber 13 can be set as an integrally molded structure. This structure can avoid the risk of leakage of the phase change medium.

[0117] More specifically, the height of the heat pipe 21 gradually decreases along the third direction Z from the second end to the first end, wherein the third direction Z is perpendicular to the first surface 11; that is, the height of the heat pipe 21 gradually decreases along the third direction Z as it extends from one end located at the air-cooled heat dissipation component 3 to the direction located at the composite heat dissipation plate 1.

[0118] More specifically, Figure 1 and Figure 4 As shown, a plurality of heat conductors 2 are provided, and the portions of the plurality of heat conductors 2 located in the composite heat dissipation plate 1 are arranged at intervals along the first direction X, and the portions of the plurality of heat conductors 2 located in the composite heat dissipation plate 1 all extend along the second direction Y, wherein the first direction X is parallel to the first surface 11, and the second direction Y is perpendicular to the first direction X and parallel to the first surface 11; that is, the portions of the plurality of heat conductors 2 located in the composite heat dissipation plate 1 are all at the same distance from the first surface 11 and are evenly distributed.

[0119] Specifically, Figure 1As shown, a plurality of air-cooling heat dissipation components 3 are provided, and each air-cooling heat dissipation component 3 is respectively connected to a portion of the plurality of heat conductors 2; specifically, the number of heat conductors 2 connected to a composite heat dissipation plate 1 is 2 to 8, preferably any one of 2, 4, 6 and 8, such as Figure 1 As shown, preferably there are 6 heat conductors 2, wherein every 2 heat conductors 2 share an air-cooled heat dissipation component 3. As shown in the figure, 6 heat conductors 2 are connected to each composite heat sink 1, the two heat conductors 2 located in the middle are connected to an air-cooled heat dissipation component 3 located on one side of the composite heat sink 1 along the second direction Y, and the remaining 4 heat conductors 2 are divided into two groups and are respectively connected to two air-cooled heat dissipation components 3 located on the other side of the composite heat sink 1 along the second direction Y.

[0120] More specifically, along the first direction X, the distance between any two adjacent heat conductors 2 is 2 mm to 5 mm, preferably any one of 2 mm, 3 mm, 4 mm and 5 mm, and more preferably 3 mm.

[0121] More specifically, Figure 5 As shown, the heat conductor 2 is located in the air-cooled heat dissipation component 3 and is flat along the third direction Z, wherein the third direction Z is perpendicular to the first surface 11 .

[0122] More specifically, Figure 5 As shown, the heat conductor 2 is located inside the composite heat sink 1 and is flat along the first direction X, and the portion close to the heat equalization chamber 13 is planar, that is, the cross section of the heat conductor 2 is a combination of a rectangular lower portion and a semicircular upper portion.

[0123] More specifically, heat exchange parts are provided on two inner surfaces of the heat-averaging chamber 13 respectively close to the first surface 11 and the heat conductor 2. The heat exchange parts are fin-shaped or porous to increase the heat exchange area with the phase change medium.

[0124] Specifically, the heat exchange part is porous, and sintered metal copper powder can be arranged in the heat-averaging chamber 13. The sintered metal copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall surface of the heat-averaging chamber 13 to increase the heat exchange efficiency.

[0125] More specifically, Figure 4 As shown, the composite heat sink 1 includes a liquid cooling plate body 14 and a heat soaking plate body 15, and the first surface 11 and the heat soaking cavity 13 are both located on the heat soaking plate body 15. Figure 5 As shown, the portion of the heat conductor 2 close to the first end is connected to the heat spreader 15, as shown in FIG. Figure 4As shown, the liquid cooling cavity 12 is located in the liquid cooling plate body 14, and the surface of the heat spreader body 15 opposite to the first surface 11 is the second surface 16. The second surface 16 abuts against the liquid cooling plate body 14 to achieve heat transfer. The liquid cooling plate body 14 and the heat spreader body 15 are detachably connected to facilitate the maintenance of the liquid cooling plate body 14 or the heat spreader body 15 respectively.

[0126] Specifically, Figure 4 As shown, the heat spreader 15 and the liquid cooling plate 14 are arranged to overlap and contact along the third direction Z, and can be elastically connected to the mainboard assembly through a fixed frame 6, or the heat spreader 15 and the liquid cooling plate 14 can be connected to the mainboard assembly respectively through a fixed frame 6 or other forms of fixing parts.

[0127] More specifically, Figure 4 and Figure 5 As shown, at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes out of the second surface 16, as shown in FIG. Figure 6 As shown, a groove portion 17 is provided on the surface of the liquid cooling plate body 14 that contacts the second surface 16 , and the groove portion 17 accommodates the portion of the heat conductor 2 that protrudes from the second surface 16 .

[0128] It is worth noting that at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes from the second surface 16, that is, a portion of the heat conductor 2 is embedded in the heat spreader body 15, and another portion protrudes from the second surface 16 to be accommodated in the groove portion 17; it can also be, for example Figure 5 As shown, the surface of the heat conductor 2 close to the heat spreader 15 is in close contact with or in communication with the heat spreader 15 , and the heat conductor 2 is entirely protruded from the second surface 16 and accommodated in the groove 17 .

[0129] Specifically, the shape of the groove portion 17 matches the shape of the protruding second surface 16 of the heat conductor 2 , and the number of the groove portions 17 also matches the number of the heat conductors 2 .

[0130] like Figure 5 As shown, the cross section of the heat conductor 2 located inside the composite heat sink 1 can be directional, or can be an arch shape, that is, the upper part of the square is a semicircle, or can be other shapes.

[0131] More specifically, Figure 4 As shown, the server heat dissipation device also includes a fixed frame 6, which is annular in shape. A fixed flange 141 is provided at the edge of the liquid cooling plate body 14. The inner ring edge of the fixed frame 6 is crimped with the fixed flange 141, and the fixed frame 6 is used to be fixedly connected to the mainboard assembly; specifically, the fixed frame 6 and the mainboard assembly can be elastically connected by an elastic member or a bolt with a spring.

[0132] More specifically, a first thermally conductive adhesive layer is provided between the groove portion 17 and the heat conductor 2; and / or, a second thermally conductive adhesive layer is provided between the second surface 16 and the liquid cooling plate body 14. Specifically, the first thermally conductive adhesive layer and the second thermally conductive adhesive layer are thermally conductive silicone grease or other thermally conductive colloids.

[0133] More specifically, Figure 1 , Figure 2 , Figure 7 and Figure 8 As shown, the server heat dissipation device also includes multiple isolation slot shells 4 and multiple liquid cooling pipelines 5. The input end and the output end of the liquid cooling cavity 12 are both connected to the liquid cooling pipeline 5. Each liquid cooling pipeline 5 is respectively arranged in each isolation slot shell 4. The isolation slot shell 4 is used to connect with the mainboard assembly.

[0134] Specifically, Figure 8 As shown, the cross-section of the isolation trough shell 4 is U-shaped. The isolation trough shell 4 can be a shell made of plastic material, or a shell made of aluminum or other materials. The isolation trough shell 4 and the liquid cooling pipeline 5 are connected by a snap-fit ​​structure, such as a snap-fit ​​protrusion is provided in the shell, and the liquid cooling pipeline 5 can also be connected by glue bonding.

[0135] More specifically, Fig.10 As shown, a plurality of water retaining ribs 41 are arranged at intervals in the isolation trough shell 4 along the extending direction of the isolation trough shell 4; specifically, the height of the water retaining ribs 41 is 2mm~3mm, preferably 3mm, and the spacing between the water retaining ribs 41 is 30mm~100mm, which can be any one of 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm and 100mm.

[0136] More specifically, Figure 3 As shown, a liquid inlet 122 and a liquid outlet 121 are provided at the top of the composite heat sink 1 along the third direction Z, which are respectively connected to the liquid inlet end and the liquid outlet end of the liquid cooling chamber 12, and the liquid inlet 122 and the liquid outlet 121 are respectively provided at two ends of the composite heat sink 1 along the second direction Y, and the direction of the liquid outlet 121 and the direction of the liquid inlet 122 are the same as those in the second direction Y, and are relatively arranged, which can reduce the length of the composite heat sink 1 in the second direction Y.

[0137] More specifically, Figure 1 and Figure 2 As shown, there are multiple composite heat sinks 1, each composite heat sink 1 is connected to at least one heat conductor 2, the liquid cooling chambers 12 in the multiple composite heat sinks 1 are connected in series, and are used to communicate with the cooling medium circuit, so that multiple heat-generating components can be liquid-cooled at the same time to simplify the design structure; preferably, the number of composite heat sinks 1 is 2 to 4, specifically any one of 2, 3 and 4, and more preferably 2.

[0138] More specifically, Fig. 9 As shown, the portion where the inner bottom surface of the heat-averaging chamber 13 along the third direction Z overlaps with the multiple heat pipes 21 along the third direction Z is a high-position area 131, and the portion where the inner bottom surface of the heat-averaging chamber 13 along the third direction Z is misaligned with the multiple heat pipes 21 along the third direction Z is a low-position area 132. The height of the high-position area 131 along the third direction Z is higher than the low-position area 132, so that the refluxed liquid phase change medium is evenly distributed at the inner bottom of the heat-averaging chamber 13.

[0139] Specifically, the low-level area 132 is smoothly connected to the high-level area 131 , that is, tangent-connected, and the height of the low-level area 132 gradually decreases along the third direction Z in a direction away from the high-level area 131 .

[0140] More specifically, the height difference between the high area 131 and the low area is between 1 mm and 3 mm, that is, the height difference between the edge of the low area 132 close to the high area 131 and the edge of the low area far from the high area 131 is between 1 mm and 3 mm.

[0141] According to an embodiment of the present application, on the other hand, a server is provided, comprising the server heat dissipation device in any one of the above embodiments.

[0142] It should be noted that the server can be any one of a mail server, a database server, an application server, a Web server, a virtualization server, a cloud computing server, a website server, and a dedicated server.

[0143] In this embodiment, since the server includes the server heat dissipation device in the above embodiment, the server and the server heat dissipation device have the same technical effects, which will not be described in detail here.

[0144] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A server heat dissipation device, characterized in that: include: At least one composite heat sink (1), the composite heat sink (1) having a first surface (11), the first surface (11) being used to abut against a heat sink surface of a heat generating portion, the composite heat sink (1) being provided with a liquid cooling chamber (12) and a heat equalizing chamber (13), the heat equalizing chamber (13) and the liquid cooling chamber (12) being stacked in a direction away from the first surface (11); The composite heat sink (1) comprises a liquid cooling plate body (14) and a heat spreader body (15), the first surface (11) and the heat spreader cavity (13) are both located on the heat spreader body (15), the liquid cooling cavity (12) is located in the liquid cooling plate body (14), the surface of the heat spreader body (15) opposite to the first surface (11) is a second surface (16), and the second surface (16) is in contact with the liquid cooling plate body (14); At least one heat conductor (2), wherein a portion of the heat conductor (2) close to its first end is arranged inside the composite heat dissipation plate (1) and located between the heat-saturating chamber (13) and the liquid cooling chamber (12); At least one air-cooling heat dissipation component (3), wherein the portion of the heat conductor (2) close to the second end thereof is arranged inside the air-cooling heat dissipation component (3).

2. The server heat dissipation device according to claim 1, characterized in that: The heat conductor (2) is a heat pipe (21), and a portion of the heat pipe (21) located inside the composite heat dissipation plate (1) is connected to the heat-averaging chamber (13).

3. The server heat dissipation device according to claim 2, characterized in that: The height of the heat pipe (21) gradually decreases along a third direction (Z) from the second end to the first end, wherein the third direction (Z) is perpendicular to the first surface (11).

4. The server heat dissipation device according to claim 1, characterized in that: A plurality of the heat conductors (2) are provided, and locations of the plurality of the heat conductors (2) located in the composite heat dissipation plate (1) are arranged at intervals along a first direction (X), and locations of the plurality of the heat conductors (2) located in the composite heat dissipation plate (1) all extend along a second direction (Y), wherein the first direction (X) is parallel to the first surface (11), and the second direction (Y) is perpendicular to the first direction (X) and parallel to the first surface (11).

5. The server heat dissipation device according to claim 4, characterized in that: The heat conductor (2) is located inside the air-cooling heat dissipation component (3) and is flat along a third direction (Z), wherein the third direction (Z) is perpendicular to the first surface (11); And / or, the heat conductor (2) is located in a portion inside the composite heat dissipation plate (1), is flat along the first direction (X), and is planar at a portion close to the heat-averaging chamber (13).

6. The server heat dissipation device according to any one of claims 1 to 5, characterized in that: Heat exchange parts are provided on two inner surfaces of the heat-averaging chamber (13) respectively close to the first surface (11) and the heat conductor (2), and the heat exchange parts are in the shape of fins or multiple holes.

7. The server cooling device according to any one of claims 1 to 5, characterized in that: The portion of the heat conductor (2) close to the first end is connected to the heat diffusion plate (15), and the liquid cooling plate (14) is detachably connected to the heat diffusion plate (15).

8. The server heat dissipation device according to claim 7, characterized in that: At least a portion of the heat conductor (2) located inside the composite heat sink (1) protrudes from the second surface (16), and a groove portion (17) is provided on the surface of the liquid cooling plate (14) in contact with the second surface (16), and the groove portion (17) accommodates the portion of the heat conductor (2) protruding from the second surface (16).

9. The server heat dissipation device according to claim 8, characterized in that: It also comprises a fixing frame (6), the fixing frame (6) being annular, the edge of the liquid cooling plate body (14) being provided with a fixing flange (141), the inner ring edge of the fixing frame (6) being press-fitted with the fixing flange (141), and the fixing frame (6) being used for fixing connection with the mainboard assembly.

10. The server heat dissipation device according to claim 8, characterized in that: A first heat-conducting adhesive layer is provided between the groove portion (17) and the heat conductor (2); And / or, a second heat-conducting adhesive layer is provided between the second surface (16) and the liquid cooling plate body (14).

11. The server heat dissipation device according to any one of claims 1 to 5, characterized in that: It also comprises a plurality of isolation slot shells (4) and a plurality of liquid cooling pipelines (5), the input end and the output end of the liquid cooling cavity (12) are both connected to the liquid cooling pipeline (5), each of the liquid cooling pipelines (5) is arranged in each of the isolation slot shells (4), and the isolation slot shells (4) are used to be connected to the mainboard assembly.

12. The server heat dissipation device according to claim 11, characterized in that: A plurality of water retaining ribs (41) are arranged at intervals in the isolation tank shell (4) along the direction in which the isolation tank shell (4) extends.

13. The server heat dissipation device according to any one of claims 1 to 5, characterized in that: There are a plurality of composite heat sinks (1), each of which is connected to at least one heat conductor (2); the liquid cooling chambers (12) in the plurality of composite heat sinks (1) are connected in series and are used to communicate with a cooling medium circuit.

14. The server heat dissipation device according to claim 13, characterized in that: A plurality of the air-cooling and heat-dissipating components (3) are provided, and each of the air-cooling and heat-dissipating components (3) is respectively connected to a portion of the plurality of heat conductors (2).

15. A server, characterized in that: include: A server cooling device as described in any one of claims 1 to 14.

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