An integrated test method and related equipment for simulating semiconductor equipment and EAP system

Abstract

The present invention provides an integrated test method and related equipment for simulating semiconductor equipment and EAP system, by extracting key parameters from the equipment operation manual, and setting test scripts for different test phases based on the extracted key parameters, wherein the key parameters are parameters required for the semiconductor process flow; the test system performs characteristic test on the test equipment using the characteristic test script, and generates corresponding characteristic test results; based on the process flow test script, the process flow of the test equipment is simulated in the test system, and while simulating the process flow, the EAP system is integrated tested through the CIM service simulation interface, the EAP system simulates the workflow of the production line containing the test equipment according to the EAP configuration file and the integrated test script, and verifies whether the control and response of the EAP system to the workflow are accurate. The present invention designs an automated test based on the test standard process, which improves the test efficiency and accuracy.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an integrated testing method for simulating semiconductor equipment and an EAP system and related equipment. Background Art

[0002] EAP (Equipment Automation Program) is a system for data collection and automatic control of equipment in the semiconductor manufacturing process. Before developing functions for a semiconductor device, developers are generally required to sort out some parameters that need to be paid attention to in the process flow through the equipment operation manual or instruction manual, such as Recipe (process recipe), Scenario (usage scenario) and CEID (collection event ID), as well as SVID (state variable ID), DVID (data variable ID), ECID (equipment constant ID), Alarm (alarm event) and other parameter values. Write the SML format file used to describe the communication of semiconductor equipment in the semiconductor standard protocol, send the SML file through the EAP simulator to test the characteristics of the equipment, and decide how to develop the EAP system based on the test results.

[0003] Due to the diversity of semiconductor equipment manufacturers and models, when testing the equipment, there is often a discrepancy between the equipment manual and the actual version of the equipment, which makes it impossible for testers to accurately set test parameters and processes. Or, due to the lack of testing experience and unfamiliarity with the relevant data and communication data structure of the equipment operation, the test efficiency is low, which affects the efficiency of subsequent EAP development and simulation testing. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides an integrated testing method and related equipment for simulating semiconductor equipment and EAP systems, aiming to help semiconductor companies perform automated testing based on standardized processes during the EAP development phase and equipment testing, thereby improving testing efficiency and reducing equipment testing time.

[0005] In order to achieve the above purpose and other advantages, the present invention adopts the following technical solutions:

[0006] In a first aspect, the present invention provides an integrated testing method for simulating a semiconductor device and an EAP system, including a testing system integrated with a semiconductor device simulator, the method comprising:

[0007] Extract key parameters from equipment operation manuals of different document categories, and set test scripts for different test phases based on the extracted key parameters, wherein the key parameters are parameters required for the semiconductor process flow, and the test scripts for different test phases include: feature test scripts, process flow test scripts, and integration test scripts;

[0008] The test system performs a characteristic test on the test device using the characteristic test script and generates a corresponding characteristic test result, wherein the characteristic test result includes: a process flow test script and an EAP configuration file;

[0009] Based on the process flow test script, the process flow of the test equipment is simulated in the test system, and while simulating the process flow, the EAP system is integrated tested through the CIM service simulation interface. The EAP system simulates the workflow of the production line including the test equipment according to the EAP configuration file and the integration test script, and verifies whether the EAP system's control and response to the workflow are accurate.

[0010] According to a method for simulating an integrated test of a semiconductor device and an EAP system provided by the present invention, based on the process flow test script, simulating the process flow of the test device in the test system, and while simulating the process flow, performing an integrated test on the EAP system through a CIM service simulation interface, the EAP system simulates the workflow of a production line including the test device according to the EAP configuration file and the integrated test script, and verifies whether the control and response of the EAP system to the workflow are accurate, including:

[0011] According to the EAP configuration file, the EAP system is configured accordingly;

[0012] Through the CIM service simulation interface, the test system transmits the data generated in the simulation process to the EAP system in real time;

[0013] The test system executes the integrated test script to perform a simulation test on the EAP system, wherein the EAP system simulates receiving process flow information issued by a semiconductor manufacturing execution system, and the semiconductor manufacturing execution system is used to manage a production line including the test equipment;

[0014] During the integration test, the test system monitors the response and control of the EAP system in real time, verifies whether the control and response of the EAP system to the process flow are accurate according to the expected results in the integration test script, and records the test results and reflects them in the test log;

[0015] The test results are analyzed and collated to form a test report and output it.

[0016] According to an integrated testing method for simulating semiconductor equipment and EAP system provided by the present invention, the step of extracting key parameters from equipment operation manuals of different document categories includes:

[0017] Classify the equipment operation manuals according to document categories;

[0018] For the device operation manual whose document category is image, extract key parameter information in the image and convert it into a text block;

[0019] For the device operation manual whose document category is text, obtaining a text block of key parameters in the text according to a preset data extraction script;

[0020] The text blocks are concatenated and combined, and converted into key parameters that meet the requirements of the SML communication format.

[0021] According to an integrated testing method for simulating semiconductor equipment and EAP system provided by the present invention, the step of extracting information of key parameters in an image and converting it into a text block comprises:

[0022] Use optical character recognition technology to convert the text in the image into text content in text format;

[0023] Using natural language processing technology to perform word segmentation and syntactic analysis on the text content, extracting key information according to preset extraction rules to form serialized text blocks;

[0024] Based on the semantic information and background knowledge provided by the knowledge graph in the semiconductor field, classify the serialized text blocks;

[0025] The classified text blocks are integrated and converted into key parameters that meet the requirements of the SML communication format.

[0026] According to an integrated testing method for simulating semiconductor equipment and an EAP system provided by the present invention, the step of setting test scripts for different test phases based on the extracted key parameters includes:

[0027] Establish a test framework based on script engine and graphics, configure parameters through a graphical interface and integrate them into the script, arrange scripts for different test stages and define the execution order and logical relationship of the scripts in the form of a flowchart.

[0028] According to the integrated testing method of simulating semiconductor equipment and EAP system provided by the present invention, the step of setting the test script based on the extracted key parameters further includes:

[0029] The help document of the semiconductor communication protocol is configured in the test framework, and by parsing the help document, when configuring parameters in a graphical interface, the keywords in the script are provided with detailed prompts and highlighted marks.

[0030] According to an integrated testing method for simulating semiconductor equipment and an EAP system provided by the present invention, the step of the testing system performing a characteristic test on the testing equipment using the characteristic test script comprises:

[0031] The test system establishes a communication connection with the test equipment and obtains actual operating parameters of the test equipment;

[0032] Based on the actual operating parameters, the parameters in the characteristic test script are verified, and the characteristic test script is automatically executed after the verification passes.

[0033] In a second aspect, the present invention provides an electronic device, the electronic device comprising:

[0034] One or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to execute an integrated testing method for simulating a semiconductor device and an EAP system according to the present invention as described above.

[0035] In a third aspect, the present invention provides a computer-readable storage medium having a computer program / instruction stored thereon, which, when executed by a processor, implements the steps of an integrated testing method for simulating semiconductor devices and EAP systems provided by the present invention as described in any one of the above.

[0036] In a fourth aspect, the present invention provides a computer program product, comprising a computer program / instruction, which, when executed by a processor, implements the steps of an integrated testing method for simulating semiconductor devices and EAP systems provided by the present invention as described in any one of the above.

[0037] The present invention provides an integrated test method and related equipment for simulating semiconductor equipment and EAP system, which extracts key parameters from equipment operation manuals of different document categories, and sets test scripts for different test phases based on the extracted key parameters. The key parameters are parameters required for the semiconductor process flow, and the test scripts for different test phases include: characteristic test scripts, process flow test scripts, and integrated test scripts; the test system uses the characteristic test script to perform characteristic test on the test equipment, and generates corresponding characteristic test results, which include: process flow test scripts and EAP configuration files; based on the process flow test script, the process flow of the test equipment is simulated in the test system, and while simulating the process flow, the EAP system is integrated tested through the CIM service simulation interface, and the EAP system simulates the workflow of the production line containing the test equipment according to the EAP configuration file and the integrated test script, and verifies whether the control and response of the EAP system to the workflow are accurate. In view of the existing technology that uses manual methods to perform integrated testing of third-party CIM system simulation, the present invention designs an automated test based on a test standard process, which improves test efficiency and accuracy and reduces equipment borrowing time. At the same time, the test results of the characteristic test optimized the configuration of the process simulation test and the EAP system, improved the efficiency of the EAP system, and were able to fully verify the workflow and control response capabilities of the EAP system on the actual production line, ensuring that the EAP system could accurately and efficiently control production equipment after adjustment and going online. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other implementation methods can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 It is a flowchart of an integrated testing method of a simulated semiconductor device and an EAP system provided by an embodiment of the present invention;

[0040] Figure 2 It is a schematic diagram of a flow chart before a characteristic test provided by an embodiment of the present invention;

[0041] Figure 3 It is a functional schematic diagram of a test framework based on a script engine and UI graphics provided by an embodiment of the present invention;

[0042] Figure 4 This is an example diagram of an interface for parameter configuration management in a UI graphical interface provided by an embodiment of the present invention;

[0043] Figure 5This is an example diagram of a UI interoperability page generated based on a script provided in an embodiment of the present invention;

[0044] Figure 6 is a schematic diagram of a characteristic test flow provided by an embodiment of the present invention;

[0045] Figure 7 This is an example diagram of an interface for a machine data extraction and verification function provided by an embodiment of the present invention;

[0046] Figure 8 It is a schematic diagram of the flow of the simulation integration test provided by an embodiment of the present invention;

[0047] Fig. 9 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0048] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows.

[0049] It should be noted that it is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in the present invention can be combined with other embodiments without conflict. Unless otherwise defined, the technical terms or scientific terms involved in the present invention should be the usual meanings understood by people with ordinary skills in the technical field to which the present invention belongs. The words "one", "a", "a", "the" and the like involved in the present invention do not indicate a quantitative limitation and may represent the singular or plural. The terms "including", "comprising", "having" and any of their variations involved in the present invention are intended to cover non-exclusive inclusions; the terms "first", "second", "third", etc. involved in the present invention are merely to distinguish similar objects and do not represent a specific ordering of objects.

[0050] To facilitate understanding of the embodiments of the present invention, the following is an explanation of the key terms / technical abbreviations in the present invention:

[0051] CIM (Computer Integrated Manufacturing): Computer integrated manufacturing system.

[0052] EAP (Equipment Automation Program): Equipment automation system.

[0053] CEID (Collection Event ID): Collection event ID.

[0054] SVID (Status Variable ID): Status variable ID.

[0055] DVID (Data Variable ID): Data variable ID.

[0056] ECID (Equipment Constant ID): Equipment constant ID.

[0057] SML (SECS Message Language): A format used to describe semiconductor device communication messages.

[0058] OCR (Optical Character Recognition): Optical character recognition.

[0059] NLP (Natural Language Processing): Natural Language Processing.

[0060] KG (Knowledge Graph): Knowledge graph.

[0061] The applicant found that in the prior art, the technician wrote parameter messages in the SML communication format after checking the equipment operation manual, and manually sent the parameter messages through the EAP simulation software for feature testing, and the workload of parameter writing was huge. If the written parameter message does not match the existing parameter version of the machine, manual inspection and adjustment are required, which increases the risk of error. After the feature test is completed, it is necessary to manually write test files for subsequent semiconductor equipment simulation and configuration files for EAP system development based on the test results. When large-scale equipment testing is required, this method is inefficient and will be difficult to cope with. The entire process lacks the support of automated tools, resulting in technicians spending a lot of time and energy on manual adjustments when upgrading production lines, replacing equipment, or changing test processes. Therefore, in order to overcome the above-mentioned shortcomings, the present application provides an integrated testing method and related equipment for simulating semiconductor equipment and EAP systems, and introduces an automated testing solution based on standardized processes, aiming to help semiconductor companies improve testing efficiency and reduce equipment borrowing time during the EAP development stage and when equipment borrows opportunities for testing.

[0062] Reference Figure 1 As shown, an embodiment of the present invention provides an integrated testing method for simulating a semiconductor device and an EAP system, including a testing system integrated with a semiconductor device simulator, the method comprising:

[0063] Step S1: Extract key parameters from equipment operation manuals of different document categories, and set test scripts for different test phases based on the extracted key parameters. The key parameters are the parameters required for the semiconductor process flow. The test scripts for different test phases include: feature test scripts, process flow test scripts, and integration test scripts.

[0064] The entire application process of this embodiment can be divided into three stages: pre-characteristic test, characteristic test and simulated integration test. Before the characteristic test, intelligent data extraction of the equipment operation manual and graphical arrangement and setting of the test scripts required for each stage are performed.

[0065] In this embodiment, in step S1, the step of extracting key parameters from device operation manuals of different document categories includes:

[0066] Step S101: classifying the equipment operation manuals according to document categories;

[0067] Step S102: for the device operation manual whose document category is image, extract the key parameter information in the image and convert it into a text block;

[0068] Step S103: for the device operation manual whose document category is text, obtain the text block of key parameters in the text according to the preset data extraction script;

[0069] Step S104: concatenate and combine the text blocks and convert them into key parameters that meet the requirements of the SML communication format.

[0070] Specifically, Figure 2 As shown in the figure, the operation manuals of semiconductor equipment are preliminarily sorted and classified according to their document categories (such as image category, text category, etc.). Through classification, different processing methods can be adopted for different types of documents to improve processing efficiency and accuracy.

[0071] For image-based equipment operation manuals, image recognition technology (such as OCR, optical character recognition) is needed to extract key parameter information from the image, such as Recipe (process recipe), Scenario (usage scenario), CEID (collection event ID), SVID (state variable ID), DVID (data variable ID), ECID (equipment constant ID), Alarm (alarm event), etc. After extraction, this information is converted into an SML file that conforms to the semiconductor communication format for subsequent processing and analysis.

[0072] For text-based equipment operation manuals, such as text files in word, excel, html, and json formats, you can use preset data extraction scripts to automatically obtain key parameters in the text. These scripts can usually use regular expressions, text parsing algorithms, and other technologies to accurately identify and extract key parameter information in the text.

[0073] SML (Secs Message Language) in the semiconductor communication protocol is a standard language used for communication between semiconductor manufacturing equipment and factory automation systems. It is part of the SECS / GEM (Semiconductor Equipment Communication Standard / Generic Equipment Model) protocol. SML uses a standardized message structure to define the content and format of messages exchanged between the device and the host, ensuring that the device and the host can understand each other's information. It also supports two-way communication for equipment monitoring, control and data collection. SML is also an important part of the SECS / GEM protocol, which can help devices from different manufacturers achieve interoperability and automated management. It is widely used in equipment communication and automated control in semiconductor production, such as equipment start-up, stop, data reporting, alarm management, etc. In order to facilitate the integration and interaction of new equipment, the key parameters extracted from the equipment operation manual are formed into text blocks, which are combined and converted to SML format through splicing, which helps improve the compatibility and scalability of the test.

[0074] In this embodiment, step S102 specifically includes:

[0075] Step S1021: using optical character recognition technology to convert the text in the image into text content in text format;

[0076] Step S1022: using natural language processing technology to perform word segmentation and syntactic analysis on the text content, extracting key information according to preset extraction rules to form a serialized text block;

[0077] Step S1023: Classify the serialized text blocks based on the semantic information and background knowledge provided by the knowledge graph in the semiconductor field;

[0078] Step S1024: Integrate the classified text blocks and convert them into key parameters that meet the requirements of the SML communication format.

[0079] Specifically, in the steps of OCR recognition and preprocessing, text block serialization, and text block classification, the specific applications of OCR, NLP, and KG technologies are as follows: OCR technology is used to accurately convert the text content in the image into a computer-readable format. Through OCR technology, the system can recognize the text in the image and convert it into editable text. By using preprocessing technologies such as binarization, denoising, and tilt correction on the image, the accuracy and efficiency of OCR recognition are improved. These preprocessing steps help eliminate noise and interference in the image, allowing OCR technology to recognize text more accurately.

[0080] In the text block serialization phase, NLP technology is responsible for processing the recognized text through word segmentation, part-of-speech tagging, syntactic analysis, etc. Through these processes, the text blocks can be serialized according to certain rules to form an orderly and easy-to-understand text flow. This helps to conduct more in-depth analysis and processing of the text later.

[0081] As an auxiliary tool, the knowledge graph (KG) provides rich semantic information and background knowledge in the text block classification stage, obtains entities, concepts and relationships related to the text, and then accurately determines the category and attributes of the text. Therefore, the use of KG technology can help the system understand the text content more deeply and ensure the accuracy and rationality of classification.

[0082] The extracted and classified text blocks are integrated to form complete key parameter information. Then, according to the requirements of the SML communication format, we convert this information into key parameters that conform to the SML format.

[0083] In this embodiment, in step S1, the step of setting the test scripts of different test phases based on the extracted key parameters includes:

[0084] Establish a test framework based on script engine and graphics, configure parameters through a graphical interface and integrate them into the script, arrange scripts for different test stages and define the execution order and logical relationship of the scripts in the form of a flowchart.

[0085] Specifically, a script-driven system is built, which can be linked to UI graphics for parameter configuration and visual arrangement of test scripts. The script engine is deeply bound to the UI graphical test framework, and has interoperability between scripts and UI. Figure 3As shown in the figure, the test framework cleverly combines the flexibility of the script engine and the intuitiveness of the graphical interface. The script engine can interpret and execute scripts written by users to implement complex test logic, while the graphical interface provides users with an intuitive and easy-to-use operating environment. The UI graphics and the script engine exchange data and transmit instructions through the communication module to ensure the synchronization and coordination of user operations and script execution. Through the combination of the two, users can easily perform operations such as parameter configuration, script editing, process arrangement, and result viewing, which greatly improves test efficiency and accuracy. Figure 4 As shown in the figure, the user binds some key parameters extracted from the device operation manual in the UI graphical interface. The UI interoperability page used to generate the test script is as follows: Figure 5 shown.

[0086] The framework has built-in syntax definitions for scripting languages, which helps users write scripts that meet specifications, thereby reducing errors and improving the quality of scripts. Users can freely arrange the test process in the graphical interface and define the execution order and conditions of the scripts. This allows users to flexibly build complex test scenarios to meet different test requirements. To ensure the security of script execution, the framework adopts a sandbox isolation mechanism to isolate the execution environments of scripts in different test phases from each other. In addition, security control functions are provided to prevent malicious scripts from causing damage to the system. The framework supports dynamic loading and unloading of scripts, and users can add or remove test scripts at any time without restarting the system. The framework also provides comprehensive script management functions, including script storage, version control, and calling. This helps users better manage and maintain business-related scripts and ensure the smooth progress of testing work. After the test is executed, the framework will display the test results and related information in the graphical interface to help users quickly understand the test situation.

[0087] In this embodiment, step S1 further includes:

[0088] The help document of the semiconductor communication protocol is configured in the test framework. By parsing the help document, the keywords in the script are prompted with details and highlighted when configuring parameters in the graphical interface.

[0089] Specifically, the automated test solution implemented in this implementation is set based on the test standard process, providing help documents for semiconductor communication protocols (such as documents in HTML, PDF, Markdown, etc.), parsing the content of the help documents, and the test framework needs to identify keywords and related information related to the semiconductor communication protocol for subsequent use in parameter configuration and script editing. The test framework can expand multiple semiconductor communication protocols and help document formats, thereby improving its versatility and applicability.

[0090] When the user enters or selects a keyword in the graphical interface for parameter configuration or script editing, the test framework can generate corresponding detailed prompts based on the keyword and highlight the keyword. Detailed prompts usually include the definition, purpose, possible value range or examples of the keyword. The matching keywords are highlighted using application-specific styles, such as different colors, bold fonts, etc. Detailed prompts and highlighted marks can help users enter and configure parameters more accurately and avoid configuration errors caused by misunderstanding or missing keywords.

[0091] Step S2: The test system performs a characteristic test on the test equipment using the characteristic test script and generates a corresponding characteristic test result, wherein the characteristic test result includes: a process flow test script and an EAP configuration file.

[0092] Reference Figure 6 As shown, in this embodiment, step S2 specifically includes:

[0093] Step S201: the test system establishes a communication connection with the test device and obtains actual operating parameters of the test device;

[0094] Step S202: based on the actual operating parameters, the parameters in the characteristic test script are verified, and the characteristic test script is automatically executed after the verification passes.

[0095] Specifically, in the actual production environment, the test equipment is tested. The test system first establishes a communication connection with the test equipment, and can accurately capture the actual operating parameters from the test equipment through the test script and UI graphical interface, such as Figure 7 As shown. The actual operating parameters after pulling can generate the configuration file of the EAP system. After the test equipment is completed, the system performs data verification on the parameters extracted from the equipment operation manual according to the actual operating parameters obtained, avoiding test anomalies caused by the difference between the equipment operation manual and the actual machine. If the parameters in the SML format do not match the parameter version of the existing machine, manual inspection and adjustment are performed in the graphical interface, which avoids the interference of erroneous data on the test results and ensures the accuracy and integrity of the data. After the data verification is passed, the test system will automatically execute the characteristic test script to perform characteristic tests on the equipment, such as a series of tests on the specific performance and functions (electrical characteristics, mechanical characteristics, environmental adaptability, etc.) of the equipment. Automated testing significantly reduces manual intervention, not only shortens the test cycle and reduces labor costs, but also can continue to run unattended, improving test efficiency. Through characteristic testing, problems and deficiencies of the equipment can be discovered in a timely manner, providing strong support for the improvement and optimization of the equipment, ensuring that it can work normally and achieve the expected results in actual applications.

[0096] Through simulation testing, various situations of the equipment can be tested and evaluated without actually connecting the equipment, thereby reducing testing costs and risks. After the simulation test is completed, the test files (such as process flow test scripts) for subsequent equipment simulation testing and the EAP configuration files and test reports for subsequent EAP system simulation integration are output. The process flow test script can be adjusted in the UI graphical interface to meet the needs of the process flow simulation of the subsequent test equipment.

[0097] Reference Figure 8 As shown, step S3: based on the process flow test script, simulate the process flow of the test equipment in the test system, and while simulating the process flow, perform integration testing on the EAP system through the CIM service simulation interface. The EAP system simulates the workflow of the production line containing the test equipment according to the EAP configuration file and the integration test script, and verifies whether the EAP system's control and response to the workflow are accurate.

[0098] In this embodiment, step S3 specifically includes:

[0099] Step S301: According to the EAP configuration file, the EAP system is configured accordingly;

[0100] Step S302: The test system transmits the data generated in the simulated process flow to the EAP system in real time through the CIM service simulation interface;

[0101] Step S303: the test system executes the integrated test script to perform a simulation test on the EAP system, and the EAP system simulates receiving the process flow information issued by the semiconductor manufacturing execution system, and the semiconductor manufacturing execution system is used to manage the production line including the test equipment;

[0102] Step S304: During the integration test, the test system monitors the response and control of the EAP system in real time, verifies whether the EAP system controls and responds to the process accurately according to the expected results in the integration test script, and records the test results and reflects them in the test log;

[0103] Step S305: Analyze and organize the test results, generate a test report and output it.

[0104] Specifically, the CIM service simulation interface is a bridge connecting the test system and the EAP system. The CIM system includes a manufacturing execution system (MES), a defect management system (DMS), a recipe management system (RMS), etc. The semiconductor equipment simulator integrated in the test system is used to simulate the process flow of the test equipment. The test system is also integrated with a CIM service simulation interface, through which the test system can transmit the data generated in the process flow of the simulated test equipment to the EAP system in real time. The EAP configuration file generated in step S2 contains the configuration information and rules that the EAP system needs to follow during the test. The test system will configure the EAP system accordingly according to the EAP configuration file to ensure the smooth progress of the integrated test. The integrated test script contains detailed test steps and expected results for the EAP system. The test system will conduct a comprehensive test on the EAP system in accordance with the requirements of the integrated test script. During the test, the EAP system simulates the receipt of the process flow information issued by the semiconductor manufacturing execution system, and the test system will monitor the response and control of the EAP system in real time and record the test results. According to the expected results in the integrated test script, the test system will verify whether the control and response of the EAP system to the process flow is accurate. If the EAP system is found to have problems or does not meet the expected requirements, the test system will record the problems and provide feedback in the test report. Relevant personnel will process and improve based on the feedback information. Therefore, the test results generated after the semiconductor device characteristic test is completed, such as the EAP configuration file, can be directly used for the integrated development and simulation testing of the EAP system without manual writing, and can quickly verify whether the logic of the EAP system meets expectations.

[0105] In summary, the embodiment of the present invention provides an integrated test method for simulating semiconductor equipment and EAP system, which extracts key parameters from the equipment operation manuals of different document categories, and sets test scripts for different test phases based on the extracted key parameters. The key parameters are the parameters required for the semiconductor process flow. The test scripts for different test phases include: characteristic test scripts, process flow test scripts, and integrated test scripts. The test system uses the characteristic test script to perform characteristic test on the test equipment and generates corresponding characteristic test results. The characteristic test results include: process flow test scripts and EAP configuration files. Based on the process flow test script, the process flow of the test equipment is simulated in the test system, and while simulating the process flow, the EAP system is integrated tested through the CIM service simulation interface. The EAP system simulates the workflow of the production line containing the test equipment according to the EAP configuration file and the integrated test script, and verifies whether the control and response of the EAP system to the workflow are accurate. In view of the existing technology that uses manual methods to perform integrated testing of third-party CIM system simulation, the present invention designs an automated test based on a test standard process, which improves test efficiency and accuracy and reduces equipment borrowing time.

[0106] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.

[0107] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0108] The electronic device comprises: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the integrated testing method of simulating semiconductor devices and EAP systems as provided in any one or more of the above embodiments. Fig. 9 An exemplary structural diagram of the electronic device is disclosed. Fig. 9 As shown, the electronic device includes: one or more processors 1101, a memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0109] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Fig. 9 The example of connecting through bus is taken in the following.

[0110] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator rod, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0111] In order to provide interaction with the user, the electronic device may be a computer. The computer has: a display device (e.g., a cathode ray tube (CRT) or an LCD monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and the input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0112] In an embodiment of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the integrated test method of simulating semiconductor devices and EAP systems provided in any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0113] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0114] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0115] It should be noted that more specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in combination with an instruction execution system, apparatus, or device.

[0116] Computer-readable storage media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change random-access memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0117] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0118] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. For example, an application-specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device may be used for implementation. In some embodiments, the software program of the present application may be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including related data structures) may be stored in a computer-readable recording medium, such as a RAM memory, a magnetic or optical drive or a floppy disk and the like. In addition, some steps or functions of the present application may be implemented by hardware, for example, as a circuit that cooperates with a processor to perform various steps or functions.

[0119] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, which, when executed by the processor, generate in whole or in part the process or function described in the embodiment of the present application. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website site, a computer, a server, or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL, Digital Subscriber Line)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server, or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrated. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state drive, SSD, solid statedisk), etc.

[0120] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0121] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A method for integrated testing of a simulated semiconductor device and an EAP system, characterized in that: A test system including a semiconductor device simulator is provided, wherein the method comprises: Extract key parameters from equipment operation manuals of different document categories, and set test scripts for different test phases based on the extracted key parameters, wherein the key parameters are parameters required for the semiconductor process flow, and the test scripts for different test phases include: feature test scripts, process flow test scripts, and integration test scripts; The test system performs a characteristic test on the test equipment using the characteristic test script and generates a corresponding characteristic test result, wherein the characteristic test result optimizes the configuration of the process simulation test and the EAP system; Based on the process flow test script, the process flow of the test equipment is simulated in the test system, and while simulating the process flow, the EAP system is integrated tested through the CIM service simulation interface. The EAP system simulates the workflow of the production line including the test equipment according to the EAP configuration file and the integration test script, and verifies whether the EAP system's control and response to the workflow are accurate.

2. The integrated testing method of the simulated semiconductor device and the EAP system according to claim 1, characterized in that: The step of simulating the process flow of the test equipment in the test system based on the process flow test script, and performing an integration test on the EAP system through the CIM service simulation interface while simulating the process flow, wherein the EAP system simulates the workflow of the production line including the test equipment according to the EAP configuration file and the integration test script, and verifies whether the control and response of the EAP system to the workflow are accurate, includes: According to the EAP configuration file, the EAP system is configured accordingly; Through the CIM service simulation interface, the test system transmits the data generated in the simulation process to the EAP system in real time; The test system executes the integrated test script to perform a simulation test on the EAP system, wherein the EAP system simulates receiving process flow information issued by a semiconductor manufacturing execution system, and the semiconductor manufacturing execution system is used to manage a production line including the test equipment; During the integration test, the test system monitors the response and control of the EAP system in real time, verifies whether the control and response of the EAP system to the process flow are accurate according to the expected results in the integration test script, and records the test results and reflects them in the test log; The test results are analyzed and collated to form a test report and output it.

3. The integrated testing method of the simulated semiconductor device and the EAP system according to claim 1, characterized in that: The step of extracting key parameters from device operation manuals of different document categories includes: Classify the equipment operation manuals according to document categories; For the device operation manual whose document category is image, extract key parameter information in the image and convert it into a text block; For the device operation manual whose document category is text, obtaining a text block of key parameters in the text according to a preset data extraction script; The text blocks are concatenated and combined, and converted into key parameters that meet the requirements of the SML communication format.

4. The integrated testing method of the simulated semiconductor device and the EAP system according to claim 3, characterized in that: The step of extracting information of key parameters in the image and converting it into a text block includes: Use optical character recognition technology to convert the text in the image into text content in text format; Using natural language processing technology to perform word segmentation and syntactic analysis on the text content, extracting key information according to preset extraction rules to form serialized text blocks; Based on the semantic information and background knowledge provided by the knowledge graph in the semiconductor field, classify the serialized text blocks; The classified text blocks are integrated and converted into key parameters that meet the requirements of the SML communication format.

5. The integrated testing method of the simulated semiconductor device and the EAP system according to claim 1, characterized in that: The step of setting test scripts for different test phases based on the extracted key parameters includes: Establish a test framework based on script engine and graphics, configure parameters through a graphical interface and integrate them into the script, arrange scripts for different test stages and define the execution order and logical relationship of the scripts in the form of a flowchart.

6. The integrated testing method of the simulated semiconductor device and the EAP system according to claim 5, characterized in that: The step of setting test scripts for different test phases based on the extracted key parameters also includes: The help document of the semiconductor communication protocol is configured in the test framework, and by parsing the help document, when configuring parameters in a graphical interface, the keywords in the script are provided with detailed prompts and highlighted marks.

7. The integrated testing method of the simulated semiconductor device and the EAP system according to claim 1, characterized in that: The step of the test system performing a characteristic test on the test device using the characteristic test script includes: The test system establishes a communication connection with the test equipment and obtains actual operating parameters of the test equipment; Based on the actual operating parameters, the parameters in the characteristic test script are verified, and the characteristic test script is automatically executed after the verification passes.

8. An electronic device, characterized in that: The electronic device comprises: One or more processors; and a memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the integrated testing method for simulating a semiconductor device and an EAP system as described in any one of claims 1-7.

9. A computer-readable storage medium having a computer program / instruction stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the integrated testing method of simulating a semiconductor device and an EAP system as described in any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the integrated testing method of simulating a semiconductor device and an EAP system as described in any one of claims 1 to 7 are implemented.

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