3D model-based packaging and 3D model cross inspection method and system

Abstract

The invention provides a packaging and 3D model cross inspection method and system based on a 3D model, and the method comprises the steps: carrying out the automatic class judgment of an input 3D model, and distinguishing the types of electronic components in the 3D model; according to the result of the 3D model category preprocessing module, the XY plane is stretched by a certain numerical value in the positive direction of the Z axis to form a cube, and the cube and the 3D model are intersected to form a preprocessed 3D model; a 3D model file including but not limited to a step format is input into a 3D model-based packaging and 3D model cross checking system of the component. A packaging file is input into a 3D model-based packaging and 3D model cross checking system of the component, and the system finally outputs Pass, Warning and Fail results. According to the automatic extraction method of the mode of representing the data through the 3D model, errors caused by manual acquisition are avoided, and the comparison efficiency is greatly improved according to automatic processing.

Description

Technical Field

[0001] The present invention belongs to the field of computer technology, and in particular relates to a 3D model-based packaging and 3D model cross-checking method and system. Background Art

[0002] With the development of technology, in the process of electronic design, in addition to conventional schematic design and PCB design, more and more manufacturers will also carry out digital prototype design, electromechanical collaborative design, and simulation design. Therefore, in the electronic design stage, manufacturers will use data such as symbol models, package models, and 3D models. In particular, 3D models will play an increasingly important role in the future electronic design process. Therefore, the number of 3D models of electronic components is increasing rapidly. For manufacturers, it is a huge challenge for them to prepare accurate symbol models, package models, and 3D models. The package model is quite related to the 3D model. Generally speaking, the package model of the component is generated through the contact surface between the 3D model and the PCB board and related standards. With the rapid growth of the number of 3D models, how to ensure the accuracy of the package and 3D model, especially the rapid confirmation of the accuracy of the package model and the 3D model, is a huge challenge for all manufacturers. At present, manufacturers use manual methods: manually measure the size data of the package model from the EDA modeling software, and manually measure the size data of the 3D model from the CAD modeling software. Then compare the measured related size data, and determine whether the data is correct based on the results of manual comparison. Therefore, the existing method of checking the packaging model and the 3D model has the following defects: manually obtaining the dimensional data of the packaging model is prone to errors; manually obtaining the dimensional data of the 3D model is prone to errors; manually comparing the dimensional data of the packaging model and the dimensional data of the 3D model is prone to errors; manual processing is inefficient and time-consuming. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a package based on a 3D model and a cross-check method of the 3D model to solve the problem of low efficiency of manual comparison of package models in the prior art.

[0004] One of the embodiments of the present invention provides a cross-check method for a package and a 3D model based on a 3D model, comprising the following steps: automatically determining the category of an input 3D model to distinguish the types of electronic components in the 3D model; receiving the result of the 3D model category preprocessing, stretching the XY plane in the positive direction of the Z axis by a certain value to form a cube, taking the intersection of the cube and the 3D model to form a preprocessed 3D model; extracting the copper layer graphic information data on the package surface based on the data results and package file received from the 3D model category preprocessing module; and comparing the geometric shape of the 3D model with the copper layer layout of the package graphic based on the preprocessed 3D model.

[0005] In one of the embodiments, the automatic category determination of the 3D model includes the following steps: distinguishing whether the 3D model is a surface mount type electronic component or a connector type electronic component; if it is determined to be a surface mount type electronic component, determining whether it is in contact with the XY plane and has no part with a Z-axis coordinate less than 0.

[0006] In one of the embodiments, the category judgment result and the package file of the 3D model are received; the surface copper layer graphic information of the package is extracted; if the category judgment result of the 3D model is a connector, the geometric center point coordinates and area of ​​the hole are extracted; the dxf graphic is drawn and stretched toward the Z axis to form a 3D model; the pre-processed 3D model is output, and the connector output data also includes the geometric center point coordinates and area array of the hole.

[0007] In one of the embodiments, it also includes generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, it is also necessary to return the coordinates of the geometric center point of each independent entity intersecting the connector and the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane.

[0008] In one of the embodiments, a preprocessed 3D model of a package is generated; if the preprocessed 3D model is a connector, the coordinates of the geometric center points of the connector holes and the area of ​​each hole are returned and the coordinate array is recorded as ArrDXY.

[0009] In one of the embodiments, a preprocessed 3D model is generated by a 3D model graphics preprocessing module; the preprocessed 3D model of the package is judged, and if the preprocessed 3D model is a connector, the geometric center point coordinates of each independent entity of the connector intersecting with the XY plane are projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane, the geometric center point coordinates of the connector hole and the area of ​​each hole.

[0010] The present invention also provides an embodiment, a cross-check system of a package and a 3D model based on a 3D model, characterized in that it includes a 3D model category preprocessing module, a 3D model graphic preprocessing module, a package graphic preprocessing module, and a package graphic and 3D model graphic comparison module, wherein the 3D model category preprocessing module includes automatically judging the category of the input 3D model and distinguishing the types of electronic components in the 3D model; the 3D model graphic preprocessing module includes receiving the result of the 3D model category preprocessing module, stretching the XY plane in the positive direction of the Z axis by a certain value to form a cube, and taking the intersection of the cube and the 3D model to form a preprocessed 3D model; the package graphic preprocessing module receives the data result and the package file of the 3D model category preprocessing module, and extracts the graphic information data of the copper layer on the package surface; the package graphic and 3D model graphic comparison module inputs the preprocessed 3D model and compares the geometric shape of the 3D model with the copper layer layout of the package graphic.

[0011] In one embodiment, the 3D model category preprocessing module includes distinguishing whether the 3D model is a surface mount type electronic component or a connector type electronic component;

[0012] The 3D model file is input into the 3D model category preprocessing module, the coordinate range of the model in the Z direction is extracted from the 3D model file, and it is determined whether the coordinate range in the Z direction is less than 0.

[0013] In one embodiment, the 3D model graphics preprocessing module includes: generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, it is also necessary to return the coordinates of the geometric center point of each independent entity where the connector intersects with the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane.

[0014] In one embodiment, the package graphics preprocessing module includes generating a preprocessed 3D model of the package; if the preprocessed 3D model is a connector, returning the coordinates of the geometric center point of the connector hole and the area of ​​each hole to record the coordinate array as ArrDXY.

[0015] In one embodiment, the package graphic and 3D model graphic comparison module also includes a preprocessed 3D model generated by a 3D model graphic preprocessing module; judging the preprocessed 3D model of the package, if the preprocessed 3D model is a connector, inputting the geometric center point coordinates of each independent entity where the connector intersects with the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane, the geometric center point coordinates of the connector hole and the area of ​​each hole.

[0016] The above embodiments provide a 3D model-based package and 3D model cross-check method and system with the following beneficial effects:

[0017] 1. The 3D model category preprocessing module, 3D model graphic preprocessing module, and package graphic preprocessing module provided by the present invention enable the dimensional data of the package model to be automatically represented in the form of a 3D model, and the dimensional data of the 3D model to be represented in the form of a 3D model. This method of automatically extracting 3D model representation data avoids the mistakes that would be made by manual acquisition. Automated processing greatly improves efficiency.

[0018] 2. The present invention uses a package graphic and 3D model graphic comparison module to compare the coordinates and dimensions of the 3D model and the hole one by one, effectively avoiding manual errors. It ensures that the results of each comparison are reproducible and traceable, and can effectively avoid data errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 A working step diagram of a 3D model-based package and 3D model cross-checking method provided in the first embodiment of the present invention;

[0021] Figure 2 A block diagram of a 3D model-based package and 3D model cross-checking system in a second embodiment of the present invention;

[0022] Figure 3 A flowchart of a 3D model category preprocessing module provided in the second embodiment of the present invention;

[0023] Figure 4 A flowchart of a 3D model graphics preprocessing module provided in the second embodiment of the present invention;

[0024] Figure 5 A flowchart of a packaging graphics preprocessing module provided in accordance with the second embodiment of the present invention;

[0025] Figure 6 This is a flowchart of a module for comparing package graphics and 3D model graphics provided in the second embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] Example 1

[0030] refer to Figure 1 One embodiment of the present invention provides a cross-check method of a package and a 3D model based on a 3D model, characterized in that the automatic category judgment of the 3D model also includes the following steps: distinguishing whether the 3D model is a surface-mount type electronic component or a connector type electronic component; if it is determined to be a surface-mount type electronic component, determining whether it is in contact with the XY plane and has no part with a Z-axis coordinate less than 0.

[0031] Receive the category judgment result and package file of the 3D model; extract the surface copper layer graphic information of the package; if the category judgment result of the 3D model is a connector, extract the geometric center point coordinates and area of ​​the hole; draw the dxf graphic and stretch it to the Z axis to form a 3D model; output the preprocessed 3D model, and the connector output data also includes the geometric center point coordinates and area array of the hole.

[0032] The step of generating a preprocessed 3D model includes determining whether the 3D model is a connector; if it is a connector, it is also necessary to return the geometric center point coordinates of each independent entity where the connector intersects with the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane. Generate a preprocessed 3D model of the package; if the preprocessed 3D model is a connector, return the geometric center point coordinates of the connector hole, and the area of ​​each hole to record the coordinate array as ArrDXY. The preprocessed 3D model generated by the 3D model graphics preprocessing module; determine the preprocessed 3D model of the package, if the preprocessed 3D model is a connector, input the geometric center point coordinates of each independent entity where the connector intersects with the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane, the geometric center point coordinates of the connector hole, and the area of ​​each hole.

[0033] Example 2

[0034] refer to Figure 2 The present invention also provides an embodiment, a cross-check system of a package and a 3D model based on a 3D model, characterized in that it includes a 3D model category preprocessing module, a 3D model graphic preprocessing module, a package graphic preprocessing module, and a package graphic and 3D model graphic comparison module, wherein the 3D model category preprocessing module includes automatically judging the category of the input 3D model and distinguishing the types of electronic components in the 3D model; the 3D model graphic preprocessing module includes receiving the result of the 3D model category preprocessing module, stretching the XY plane in the positive direction of the Z axis by a certain value to form a cube, and taking the intersection of the cube and the 3D model to form a preprocessed 3D model; the package graphic preprocessing module receives the data result and the package file of the 3D model category preprocessing module, and extracts the graphic information data of the copper layer on the package surface; the package graphic and 3D model graphic comparison module inputs the preprocessed 3D model and compares the geometric shape of the 3D model with the copper layer layout of the package graphic.

[0035] refer to Figure 3, the 3D model category preprocessing module includes distinguishing whether the 3D model is a surface mount type electronic component or a connector type electronic component. The judgment step includes: inputting the 3D model file (such as Step) into the 3D model category preprocessing module; extracting the coordinate range of the model in the Z direction from the 3D model file. And judging whether the coordinate range in the Z direction is less than 0; if the coordinate range in the Z direction contains a value less than 0, outputting IsThrough as True, and not processing the 3D model. The 3D model category preprocessing module outputs ① IsThrough as True (indicating that the 3D model is a connector); ② the original 3D model; if the coordinate range in the Z direction does not contain a value less than 0, outputting IsThrough as False; when IsThrough is False, judging whether there is a value equal to 0 in the coordinate range in the Z direction; when IsThrough is False, if the coordinate range in the Z direction contains a value equal to 0 (0 means intersecting with the XY plane), the 3D model is not processed. The output of the 3D model category preprocessing module is ①IsThrough is False (indicating that the 3D model is a surface mount type); ②the original 3D model; when IsThrough is False, if the coordinate range in the Z direction does not contain a value equal to 0 (0 means intersecting with the XY plane), the 3D model is moved downward so that it intersects with the XY plane (contains a value equal to 0) and the 3D model is updated. The output of the 3D model category preprocessing module is ①IsThrough is False (indicating that the 3D model is a surface mount type); ②the updated 3D model; the 3D model file is input into the 3D model category preprocessing module, the coordinate range of the model in the Z direction is extracted from the 3D model file, and it is determined whether the coordinate range in the Z direction is less than 0.

[0036] The 3D model graphics preprocessing module includes: generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, it is also necessary to return the coordinates of the geometric center point of each independent entity intersecting the connector and the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane.

[0037] refer to Figure 4The working steps of the 3D model preprocessing module include: inputting IsThrough and the 3D model file (Step) into the 3D model graphics preprocessing module; in a CAD environment, stretching the XY plane to the positive direction of the Z axis by a specified value to form a cube StepXY; performing Boolean operations on the input 3D model file (Step) and StepXY, taking the intersection, and forming a preprocessed 3D model StepUN; judging whether the input IsThrough is a connector; if the input is a connector, projecting each entity of StepUN onto the XY plane to form a two-dimensional graphic, recorded as DxfStepUN[a1,…,an]; calculating DxfStepUN[a1,…,a The coordinate center values ​​XY1, XY2, …, XYn of each an figure in DxfStepUN[a1, …, an] are calculated, recorded as ArrCXY[XY1, XY2, …, XYn]; the areas S1, S2, …, Sn of each an figure in DxfStepUN[a1, …, an] are calculated, recorded as SquareC[S1, S2, …, Sn]; if the input IsThrough is False, the 3D model graphics preprocessing module outputs the StepUN model, and does not output [ArrCXY] and [SquareC]; if the input IsThrough is True, the 3D model graphics preprocessing module outputs the StepUN model, and outputs [ArrCXY] and [SquareC].

[0038] refer to Figure 5, the package graphics preprocessing module includes generating a preprocessed 3D model of the package; if the preprocessed 3D model is a connector, the geometric center point coordinates of the connector hole and the area of ​​each hole are returned and the coordinate array is recorded as ArrDXY. The specific steps are: input IsThrough and the package file (Kicad_mod) into the package graphics preprocessing module; extract graphics such as rectangles, circles, ellipses, polygons, etc. from the surface copper layer of the package, and output the extracted graphics to a two-dimensional graphic file such as Dxf; stretch the two-dimensional graphic file Dxf to a certain value in the positive direction of the Z axis. Form a 3D model (such as StepDxf); determine whether the input IsThrough is a connector; if the input is a connector, extract the closed figures in Dxf one by one, recorded as Dxf[a1,…,an]; calculate the coordinate center value XY1, XY2,…, XYn of each an figure in Dxf[a1,…,an], recorded as ArrDXY[XY1, XY2,…, XYn]; calculate the area S1, S2,…, Sn of each an figure in Dxf[a1,…,an], recorded as SquareD[S1, S2,…, Sn]; if the input IsThrough is False, the encapsulated graphics preprocessing module outputs the StepDxf model, and does not output [ArrDXY] and [SquareD]; if the input IsThrough is True, the encapsulated graphics preprocessing module outputs the StepDxf model, and outputs [ArrDXY] and [SquareD].

[0039] refer to Figure 6The package graphic and 3D model graphic comparison module also includes a preprocessed 3D model generated by a 3D model graphic preprocessing module; judging the preprocessed 3D model of the package, if the preprocessed 3D model is a connector, inputting the geometric center point coordinates of each independent entity intersecting the connector with the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane, the geometric center point coordinates of the connector hole and the area of ​​each hole. The specific working steps are as follows: (1) IsThrough (whether it is a connector), StepUN (3D model after 3D model graphics preprocessing), StepDxf (3D model after package graphics preprocessing), [SquareC] (connector situation, the area of ​​each StepUN projected on the XY plane), [SquareD] (connector situation, the area of ​​each package Dxf), [ArrCXY] (connector situation, the center coordinates of each StepUN projected on the XY plane), [ArrDXY] (connector situation, the center coordinates of each package Dxf), input the package graphics and 3D model graphics comparison module; record the input StepUN as 3DModelA, record the input StepDxf as 3DModelB, perform Boolean operation on 3DModelA and 3DModelB, take the intersection, and obtain 3DModelC; calculate the volume of 3DModelC, recorded as 3DVolumeC; calculate the volume of 3DModelA, recorded as 3DVolumeA; judge 3 Is the difference between DVolumeA and 3DVolumeC less than the input value (initial value 0.0001)? If the difference between 3DVolumeA and 3DVolume is greater than the input value (initial value 0.0001), the package graphics and 3D model graphics comparison module outputs a Fail result; if the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001) and IsThrough is False, the package graphics and 3D model graphics comparison module outputs a Pass result. s result; when the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001) and IsThrough is True, compare the values ​​of SquareC and SquareD one by one to determine whether the difference between each is less than the input value (initial value 0.001). If the values ​​of SquareC and SquareD are compared one by one, and the difference between each is greater than the input value (initial value 0.001), the package graphics and 3D model graphics comparison module outputs a Fail result.When the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001), IsThrough is True, and the values ​​of SquareC and SquareD are compared one by one, and the difference of each is less than the input value (initial value 0.001), the values ​​of [ArrCXY] and [ArrDXY] are compared one by one to determine whether the difference of each is less than the input value (initial value 0.001). If the values ​​of [ArrCXY] and [ArrDXY] are compared one by one, and the difference of each is less than the input value (initial value 0.001), the package graphics and 3D model graphics comparison module outputs a Pass result. When the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001), IsThrough is True, and the values ​​of SquareC and SquareD are compared one by one, and the difference of each is less than the input value (initial value 0.001), the values ​​of [ArrCXY] and [ArrDXY] are compared one by one to determine whether the difference of each is less than the input value (initial value 0.001). If the values ​​of [ArrCXY] and [ArrDXY] are compared one by one, and the difference of each is greater than the input value (initial value 0.001), the package graphic and 3D model graphic comparison module outputs a Warning result.

[0040] The embodiment provided by the present invention reduces the possibility of human error and improves the accuracy of design verification through a cross-check method and system for a package based on a 3D model and a 3D model, and through an automated 3D model category judgment and cross-check process. By comparing the geometric center point coordinates and area of ​​the 3D model and the package graphic, the accurate match between the package design and the 3D model is ensured, and assembly problems caused by design inconsistencies are avoided. The automated process reduces the time and workload of design engineers to manually check and compare the package and the 3D model. In addition, problems are discovered and corrected during the design phase, reducing the number of reworks during the production process and improving production efficiency. The system ensures the consistency of the package design and 3D model data, avoiding assembly errors caused by data mismatches.

[0041] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for cross-checking a package and a 3D model based on a 3D model, characterized in that: The following steps are involved: Automatically classify the input 3D model and distinguish the types of electronic components in the 3D model; receiving the result of the 3D model category preprocessing, stretching the XY plane in the positive direction of the Z axis by a certain value to form a cube, and intersecting the cube with the 3D model to form a preprocessed 3D model; Extracting the package upper copper layer graphic information data according to the received 3D model category preprocessed data results and package file; Based on the pre-processed 3D model, the geometric shape of the 3D model is compared with the copper layer layout of the package pattern.

2. The cross-check method of 3D model-based package and 3D model according to claim 1, characterized in that: The automatic category determination of the 3D model further includes the following steps: distinguishing whether the 3D model is a surface mount type electronic component or a connector type electronic component; If it is determined to be a surface-mount electronic component, determine whether it is in contact with the XY plane and has no part with a Z-axis coordinate less than 0.

3. The cross-check method of 3D model-based package and 3D model according to claim 1, characterized in that: The method further includes receiving a category determination result and a package file of the 3D model; extracting graphic information of the surface copper layer of the package; if the category determination result of the 3D model is a connector, extracting the geometric center point coordinates and area of ​​the hole; drawing a dxf graphic and stretching it along the Z axis to form a 3D model; and outputting a preprocessed 3D model, wherein the connector output data also includes an array of geometric center point coordinates and area of ​​the hole.

4. The cross-check method of 3D model-based package and 3D model according to claim 1, characterized in that: It also includes generating a pre-processed 3D model; determining whether the 3D model is a connector; if it is a connector, it is also necessary to return the coordinates of the geometric center point of each independent entity where the connector intersects the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane.

5. The cross-check method of 3D model-based package and 3D model according to claim 1, characterized in that: Generate a pre-processed 3D model of the package; if the pre-processed 3D model is a connector, return the coordinates of the geometric center points of the connector holes and the area of ​​each hole and record the coordinate array as ArrDXY.

6. The cross-check method of 3D model-based package and 3D model according to claim 1, characterized in that: A preprocessed 3D model generated by a 3D model graphics preprocessing module; determining the packaged preprocessed 3D model, if the preprocessed 3D model is a connector, inputting the geometric center point coordinates of each independent entity intersecting the connector with the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane, the geometric center point coordinates of the connector hole, and the area of ​​each hole.

7. A 3D model-based package and 3D model cross-check system, characterized in that: It includes 3D model category preprocessing module, 3D model graphics preprocessing module, package graphics preprocessing module, package graphics and 3D model graphics comparison module, The 3D model category preprocessing module includes automatic category determination of the input 3D model and distinguishing the types of electronic components in the 3D model; The 3D model graphics preprocessing module includes receiving the result of the 3D model category preprocessing module, stretching the XY plane in the positive direction of the Z axis by a certain value to form a cube, and intersecting the cube with the 3D model to form a preprocessed 3D model; The package graphics preprocessing module receives the data results and package files of the 3D model category preprocessing module, and extracts the package upper copper layer graphic information data; The package graphic and 3D model graphic comparison module inputs the pre-processed 3D model, compares the geometric shape of the 3D model with the copper layer layout of the package graphic, and outputs a 3D model judgment result.

8. The 3D model-based package and 3D model cross-checking system according to claim 7, characterized in that: The 3D model category preprocessing module includes distinguishing whether the 3D model is a surface mount type electronic component or a connector type electronic component; The 3D model file is input into the 3D model category preprocessing module, the coordinate range of the model in the Z direction is extracted from the 3D model file, and it is determined whether the coordinate range in the Z direction is less than 0.

9. The 3D model-based package and 3D model cross-checking system according to claim 7, characterized in that: The 3D model graphics preprocessing module includes: generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, returning the coordinates of the geometric center point of each independent entity where the connector intersects the XY plane projected onto the XY plane, as well as the area of ​​each entity projected onto the XY plane.

10. The 3D model-based package and 3D model cross-checking system according to claim 7, characterized in that: The package graphic preprocessing module includes generating a preprocessed 3D model of the package; if the preprocessed 3D model is a connector, returning the coordinates of the geometric center points of the connector holes and the area of ​​each hole and recording the coordinate array as ArrDXY.

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