A method and system for cross-checking a package based on a 3D model with a 3D model
By automating the 3D model category identification and cross-checking process, the problem of low efficiency in manually comparing packaged models with 3D models is solved, achieving efficient and accurate model comparison, and ensuring the accuracy of design verification and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 粤港澳大湾区(广东)国创中心
- Filing Date
- 2024-09-26
- Publication Date
- 2026-05-29
AI Technical Summary
In existing technologies, the method of manually comparing the encapsulated model with the 3D model is inefficient, prone to errors, and time-consuming.
An automated cross-checking method based on 3D models is adopted. Through 3D model category judgment, preprocessing and packaging graphic information extraction, the geometry and copper layer layout of the packaging model and the 3D model are automatically compared to reduce human error.
It improves the accuracy and efficiency of comparing packaging models with 3D models, reduces human error, ensures the accuracy of design verification, avoids assembly problems caused by design discrepancies, and improves production efficiency.
Smart Images
Figure CN119378200B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of computer technology, specifically relating to a method and system for encapsulation and cross-checking of 3D models. Background Technology
[0002] With technological advancements, in the electronic design process, in addition to conventional schematic and PCB design, more and more manufacturers are also engaging in digital prototype design, electromechanical co-design, and simulation design. Therefore, in the electronic design phase, manufacturers utilize symbolic models, package models, and 3D models, with 3D models playing an increasingly important role in future electronic design processes. Consequently, the number of 3D models for electronic components is increasing rapidly. For manufacturers, preparing accurate symbolic models, package models, and 3D models is a significant challenge. Package models and 3D models are closely related; generally, component package models are generated by examining the contact surfaces between the 3D model and the PCB board, along with relevant standards. With the rapid increase in the number of 3D models, ensuring the accuracy of both package and 3D models, especially quickly verifying their accuracy, is a major challenge for manufacturers. Currently, manufacturers rely on manual methods: manually measuring the dimensions of the package model from EDA modeling software and the dimensions of the 3D model from CAD modeling software. Then, they compare the measured dimensions manually to determine data accuracy. Therefore, the existing methods for checking the packaged model and the 3D model have the following drawbacks: manually obtaining the size data of the packaged model is prone to errors; manually obtaining the size data of the 3D model is prone to errors; manually comparing the size data of the packaged model and the size data of the 3D model is prone to errors; manual processing is inefficient and time-consuming. Summary of the Invention
[0003] To overcome the shortcomings of existing technologies, this invention provides a method for cross-checking 3D models based on encapsulation, thereby solving the problem of low efficiency in manual comparison of encapsulation models in existing technologies.
[0004] One embodiment of the present invention provides a method for cross-checking 3D models and packaging based on 3D models, including the following steps: automatically classifying the input 3D model to distinguish the types of electronic components in the 3D model; receiving the result of the 3D model category preprocessing, stretching the XY plane to the positive Z-axis by a certain value to form a cube, and taking the intersection of the cube and the 3D model to form a preprocessed 3D model; extracting copper layer graphic information data of the package based on the data result of the 3D model category preprocessing module and the package file; and comparing the geometry of the 3D model with the copper layer layout of the package graphic based on the preprocessed 3D model.
[0005] In one embodiment, the automatic classification of the 3D model includes the following steps: distinguishing whether the 3D model is a surface-mount electronic component or a connector-type electronic component; if it is determined to be a surface-mount electronic component, determining whether it is in contact with the XY plane and whether there is a part with a Z-axis coordinate less than 0.
[0006] In one embodiment, the system receives the category determination result and the package file of the 3D model; extracts the surface copper layer graphic information of the package; if the category determination result of the 3D model is a connector, extracts the geometric center point coordinates and area of the hole; draws a DXF graphic and stretches it along the Z-axis to form a preprocessed 3D model; and outputs the preprocessed 3D model. The connector output data also includes the geometric center point coordinates and area array of the hole.
[0007] In one embodiment, the method further includes generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, then it is also necessary to return the coordinates of the geometric center point of each individual entity that intersects the connector with the XY plane and projected onto the XY plane, as well as the area of each entity projected onto the XY plane.
[0008] In one embodiment, a pre-processed 3D model of the package is generated; if the pre-processed 3D model is a connector, the coordinates of the geometric center point of the connector hole are returned, and the area of each hole is recorded as an array of coordinates ArrDXY.
[0009] In one embodiment, a preprocessed 3D model is generated; the preprocessed 3D model of the package is determined; if the preprocessed 3D model is a connector, the coordinates of the geometric center point of each independent entity of the connector intersecting with the XY plane are input, as well as the area of each entity projected onto the XY plane, the coordinates of the geometric center point of the connector hole, and the area of each hole.
[0010] This invention also provides an embodiment of a 3D model-based packaging and 3D model cross-checking system, characterized by comprising a 3D model category preprocessing module, a 3D model graphics preprocessing module, a packaging graphics preprocessing module, and a packaging graphics and 3D model graphics comparison module. The 3D model category preprocessing module automatically classifies the input 3D model to distinguish the types of electronic components within the 3D model. The 3D model graphics preprocessing module receives the results from the 3D model category preprocessing module, stretches the XY plane towards the positive Z-axis by a certain value to form a cube, and intersects this cube with the 3D model to form a preprocessed 3D model. The packaging graphics preprocessing module receives the data results from the 3D model category preprocessing module and the packaging file, extracting copper layer graphic information data from the packaging surface. The packaging graphics and 3D model graphics comparison module inputs the preprocessed 3D model and compares the geometry of the 3D model with the copper layer layout of the packaging graphics.
[0011] In one embodiment, the 3D model category preprocessing module includes distinguishing whether the 3D model is a surface-mount type electronic component or a connector type electronic component;
[0012] Input the 3D model file into the 3D model category preprocessing module, extract the coordinate range of the model in the Z direction from the 3D model file, and determine whether the coordinate range in the Z direction is less than 0.
[0013] In one embodiment, the 3D model graphics preprocessing module includes: generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, then it is also necessary to return the coordinates of the geometric center point of each independent entity intersecting the connector with the XY plane projected onto the XY plane, and the area of each entity projected onto the XY plane.
[0014] In one embodiment, the encapsulation graphic preprocessing module includes generating a preprocessed 3D model of the encapsulation; if the preprocessed 3D model is a connector, then returning the coordinates of the geometric center point of the connector hole, and recording the coordinate array as ArrDXY with the area of each hole.
[0015] In one embodiment, the module for comparing the packaged graphic with the 3D model graphic further includes a pre-processed 3D model generated by the 3D model graphic pre-processing module; determining the pre-processed 3D model of the package; if the pre-processed 3D model is a connector, inputting the coordinates of the geometric center point of each independent entity intersecting the XY plane of the connector projected onto the XY plane, as well as the area of each entity projected onto the XY plane, the coordinates of the geometric center point of the connector hole, and the area of each hole.
[0016] The above embodiments provide a method and system for encapsulation and cross-checking of 3D models based on 3D models, which have the following beneficial effects:
[0017] 1. The 3D model category preprocessing module, 3D model graphics preprocessing module, and encapsulation graphics preprocessing module provided by this invention enable automatic representation of the encapsulation model's size data in a 3D model format and the 3D model's size data in a 3D model format. This automatic extraction of 3D model representation data avoids errors that can occur with manual acquisition. Automated processing significantly improves efficiency.
[0018] 2. This invention utilizes a module for comparing encapsulated graphics with 3D model graphics. By comparing the coordinates and dimensions of the 3D model and holes one by one, errors that can occur manually are effectively avoided. This ensures that the results of each comparison are reproducible and traceable, effectively preventing data errors. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0020] Figure 1 This diagram illustrates the working steps of the 3D model-based encapsulation and 3D model cross-checking method provided in the first embodiment of the present invention.
[0021] Figure 2 This is a block diagram of the 3D model-based encapsulation and 3D model cross-checking system in the second embodiment of the present invention;
[0022] Figure 3 This is a flowchart of the 3D model category preprocessing module provided in the second embodiment of the present invention;
[0023] Figure 4 This is a flowchart of the 3D model graphics preprocessing module provided in the second embodiment of the present invention;
[0024] Figure 5 This is a flowchart of the encapsulation graphic preprocessing module provided in the second embodiment of the present invention;
[0025] Figure 6 The flowchart shows the process of the module for comparing packaged graphics and 3D model graphics provided in the second embodiment of the present invention. Detailed Implementation
[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0027] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0028] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.
[0029] Example 1
[0030] refer to Figure 1 One embodiment of the present invention provides a method for cross-checking packaging based on 3D models and 3D models. The method is characterized in that the automatic classification of 3D models further includes the following steps: distinguishing whether the 3D model is a surface-mount type electronic component or a connector type electronic component; if it is determined to be a surface-mount type electronic component, determining whether it is in contact with the XY plane and has no part with a Z-axis coordinate less than 0.
[0031] Receive the category judgment result and package file of the 3D model; extract the surface copper layer graphic information of the package; if the category judgment result of the 3D model is a connector, extract the geometric center point coordinates and area of the hole; draw DXF graphics and stretch them along the Z-axis to form a preprocessed 3D model; output the preprocessed 3D model, and the connector output data also includes the geometric center point coordinates and area array of the hole.
[0032] The steps for generating a preprocessed 3D model include: determining whether the 3D model is a connector; if it is a connector, then the coordinates of the geometric center point of each independent entity intersecting the XY plane, projected onto the XY plane, and the area of each entity projected onto the XY plane, are also returned. A preprocessed 3D model of the encapsulation is generated; if the preprocessed 3D model is a connector, the coordinates of the geometric center point of the connector holes and the area of each hole are returned, and the coordinate array is recorded as ArrDXY. A preprocessed 3D model is generated; determining whether the preprocessed 3D model is an encapsulation, if the preprocessed 3D model is a connector, the coordinates of the geometric center point of each independent entity intersecting the XY plane, projected onto the XY plane, the area of each entity projected onto the XY plane, the coordinates of the geometric center point of the connector holes, and the area of each hole are input.
[0033] Example 2
[0034] refer to Figure 2 The present invention also provides an embodiment of a cross-checking system for packaging and 3D models based on 3D models. The system comprises a 3D model category preprocessing module, a 3D model graphic preprocessing module, a packaging graphic preprocessing module, and a module for comparing packaging graphics and 3D model graphics. The 3D model category preprocessing module automatically classifies the input 3D model to distinguish the types of electronic components within the 3D model. The 3D model graphic preprocessing module receives the results from the 3D model category preprocessing module, stretches the XY plane towards the positive Z-axis by a certain value to form a cube, and intersects this cube with the 3D model to form a preprocessed 3D model. The packaging graphic preprocessing module receives the data results from the 3D model category preprocessing module and the packaging file, and extracts the copper layer graphic information data from the packaging surface. The module for comparing packaging graphics and 3D model graphics inputs the preprocessed 3D model and compares the geometry of the 3D model with the copper layer layout of the packaging graphic.
[0035] refer to Figure 3The 3D model category preprocessing module distinguishes whether a 3D model is a surface-mount electronic component or a connector electronic component. The judgment steps include: inputting a 3D model file (e.g., Step) into the 3D model category preprocessing module; extracting the Z-axis coordinate range of the model from the 3D model file; and determining whether the Z-axis coordinate range is less than 0. If the Z-axis coordinate range contains values less than 0, IsThrough is output as True, and the 3D model is not processed. The 3D model category preprocessing module outputs: ① IsThrough is True (indicating the 3D model is a connector); ② the original 3D model; if the Z-axis coordinate range does not contain values less than 0, IsThrough is output as False; when IsThrough is False, it determines whether the Z-axis coordinate range contains a value equal to 0; when IsThrough is False, if the Z-axis coordinate range contains a value equal to 0 (0 indicates intersection with the XY plane), the 3D model is not processed. The 3D model category preprocessing module outputs: ① IsThrough is False (indicating the 3D model is a surface-mapped type); ② The original 3D model. When IsThrough is False, if the coordinate range in the Z direction does not contain a value equal to 0 (0 indicates intersection with the XY plane), then the 3D model is moved downwards to intersect with the XY plane (containing a value equal to 0), and the 3D model is updated. The 3D model category preprocessing module outputs: ① IsThrough is False (indicating the 3D model is a surface-mapped type); ② The updated 3D model. The 3D model file is input into the 3D model category preprocessing module, which extracts the coordinate range in the Z direction of the model from the 3D model file and determines whether the coordinate range in the Z direction is less than 0.
[0036] The 3D model graphics preprocessing module includes: generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, it also needs to return the coordinates of the geometric center point of each independent entity intersecting the connector with the XY plane projected onto the XY plane, as well as the area of each entity projected onto the XY plane.
[0037] refer to Figure 4The 3D model preprocessing module's steps include: inputting IsThrough and the 3D model file (Step) into the 3D model graphics preprocessing module; in a CAD environment, extending the XY plane towards the positive Z-axis by a specified value to form a cube StepXY; performing Boolean operations on the input 3D model file (Step) and StepXY, taking the intersection to form the preprocessed 3D model StepUN; determining whether the input IsThrough is a connector; if the input is a connector, projecting each entity of StepUN onto the XY plane to form a two-dimensional graphic, denoted as DxfStepUN[a1,…,an]; calculating DxfStepUN[a1,…,an]. The coordinate center values XY1, XY2, ..., XYn of each an graphic in [n] are denoted as ArrCXY[XY1, XY2, ..., XYn]. The area S1, S2, ..., Sn of each an graphic in DxfStepUN[a1, ..., an] is calculated and denoted as SquareC[S1, S2, ..., Sn]. If the input IsThrough is False, the 3D model graphics preprocessing module outputs the StepUN model and does not output [ArrCXY] and [SquareC]. If the input IsThrough is True, the 3D model graphics preprocessing module outputs the StepUN model and outputs [ArrCXY] and [SquareC].
[0038] refer to Figure 5The encapsulation graphic preprocessing module includes generating a preprocessed 3D model of the encapsulation; if the preprocessed 3D model is a connector, it returns the coordinates of the geometric center point of the connector hole, and records the area of each hole as an ArrDXY coordinate array. The specific steps are: inputting IsThrough and the encapsulation file (Kicad_mod) into the encapsulation graphic preprocessing module; extracting graphics, such as rectangles, circles, ellipses, polygons, etc., from the copper layer of the encapsulation, and outputting the extracted graphics as a two-dimensional graphic file such as DXF; stretching the two-dimensional graphic file DXF in the positive Z-axis direction by a certain value. Form a 3D model (e.g., StepDxf); determine if the input IsThrough is a connector; if the input is a connector, extract the closed shapes one by one from Dxf, denoted as Dxf[a1,…,an]; calculate the coordinate center values XY1, XY2,…, XYn of each an shape in Dxf[a1,…,an], denoted as ArrDXY[XY1, XY2,…, XYn]; calculate the area S1, S2,…, Sn of each an shape in Dxf[a1,…,an], denoted as SquareD[S1, S2,…, Sn]; if the input IsThrough is False, the encapsulated graphics preprocessing module outputs the StepDxf model, without outputting [ArrDXY] and [SquareD]; if the input IsThrough is True, the encapsulated graphics preprocessing module outputs the StepDxf model, and outputs [ArrDXY] and [SquareD].
[0039] refer to Figure 6The module for comparing the packaged graphic with the 3D model graphic also includes a pre-processed 3D model generated by the 3D model graphic pre-processing module; it judges the pre-processed 3D model of the package, and if the pre-processed 3D model is a connector, it inputs the coordinates of the geometric center point of each independent entity intersecting the XY plane of the connector projected onto the XY plane, as well as the area of each entity projected onto the XY plane, the coordinates of the geometric center point of the connector hole, and the area of each hole. The specific working steps are as follows: (1) Compare IsThrough (whether it is a connector), StepUN (3D model after 3D model graphic pre-processing), StepDxf (3D model after packaged graphic pre-processing), [SquareC] (for connectors, the area of each StepUN projected onto the XY plane), [SquareD] (for connectors, the area of each package Dxf), [ArrCXY] (Connector configuration: center coordinates of the XY plane for each StepUN projection), [ArrDXY] (Connector configuration: center coordinates of each package DXF), input package graphic and 3D model graphic comparison module; denote the input StepUN as 3DModelA and the input StepDXF as 3DModelB, perform a Boolean operation on 3DModelA and 3DModelB, take the intersection to obtain 3DModelC; calculate the volume of 3DModelC, denoted as 3DVolumeC; calculate the volume of 3DModelA, denoted as 3DVolumeA; determine if the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001), if the difference between 3DVolumeA and 3DVolumeC is greater than the input value (initial value 0.0001), then... If the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001) and IsThrough is False, the module comparing the encapsulated graphic and the 3D model graphic will output a Fail result. If the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001) and IsThrough is True, the module comparing SquareC and SquareD will compare their values one by one to determine if the difference between each value is less than the input value (initial value 0.001). If the difference between SquareC and SquareD is greater than the input value (initial value 0.001), the module comparing the encapsulated graphic and the 3D model graphic will output a Fail result.When the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001), IsThrough is True, and the values of SquareC and SquareD are compared one by one, and the difference between each is less than the input value (initial value 0.001), the values of [ArrCXY] and [ArrDXY] are compared one by one to determine whether the difference between each is less than the input value (initial value 0.001). If the difference between [ArrCXY] and [ArrDXY] is less than the input value (initial value 0.001), the encapsulated graphic and 3D model graphic comparison module outputs the Pass result. When the difference between 3DVolumeA and 3DVolumeC is less than the input value (initial value 0.0001), IsThrough is True, and the values of SquareC and SquareD are compared one by one, and the difference between each is less than the input value (initial value 0.001), the values of [ArrCXY] and [ArrDXY] are compared one by one to determine whether the difference between each is less than the input value (initial value 0.001). If the difference between [ArrCXY] and [ArrDXY] is greater than the input value (initial value 0.001), the module comparing the encapsulated graphics and the 3D model graphics outputs a Warning result.
[0040] The embodiments provided by this invention employ a method and system for cross-checking 3D models and their corresponding packaging elements. Through automated 3D model category determination and cross-checking processes, the possibility of human error is reduced, improving the accuracy of design verification. By comparing the geometric center point coordinates and area of the 3D model and the packaging graphic, precise matching between the packaging design and the 3D model is ensured, avoiding assembly problems caused by design discrepancies. The automated process reduces the time and workload for design engineers to manually check and compare the packaging and 3D models. Furthermore, by identifying and correcting problems during the design phase, the number of rework operations during production is reduced, improving production efficiency. The system ensures the consistency between the packaging design and 3D model data, avoiding assembly errors caused by data mismatches.
[0041] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.
Claims
1. A method for encapsulation and cross-checking of 3D models based on 3D models, characterized in that, Includes the following steps: The system automatically classifies the input 3D model and distinguishes the types of electronic components within the 3D model. Receive the result of the 3D model category preprocessing, stretch the XY plane to the positive Z-axis by a certain value to form a cube, and take the intersection of the cube and the 3D model to form a preprocessed 3D model; Based on the received 3D model category preprocessed data results and package file, extract the copper layer graphic information data of the package, output DXF graphic based on the copper layer graphic information data, stretch the DXF graphic in the positive Z-axis direction by a certain value to form the preprocessed 3D model of the package. Based on the type of electronic component, the preprocessed 3D model, the preprocessed 3D model of the package, the area of each independent entity projected onto the XY plane where the preprocessed 3D model intersects with the XY plane, the two-dimensional area of the DXF graphic of each package, the center coordinates of the projected XY plane of each independent entity projected onto the XY plane where the preprocessed 3D model intersects with the XY plane, and the center coordinates of the DXF graphic of each package, the geometry of the preprocessed 3D model is compared with the copper layer layout of the package graphic in the preprocessed 3D model of the package, and the 3D model judgment result is output.
2. The method for encapsulation and cross-checking of 3D models based on 3D models as described in claim 1, characterized in that, The automatic 3D model classification also includes the following steps: distinguishing whether the 3D model is a surface-mount type electronic component or a connector type electronic component. If the electronic component is determined to be surface-mount, determine whether it is in contact with the XY plane and whether there is a part with a Z-axis coordinate less than 0.
3. The method for encapsulation and cross-checking of 3D models based on 3D models as described in claim 1, characterized in that, It also includes receiving the category judgment result and encapsulation file of the 3D model; and extracting the surface copper layer graphic information of the encapsulation. If the 3D model category is determined to be a connector, the geometric center point coordinates and area of the hole are extracted; a DXF graphic is drawn and stretched along the Z-axis to form a pre-processed 3D model of the package; the pre-processed 3D model of the package is output, and the connector output data also includes the geometric center point coordinates and area array of the hole.
4. The method for encapsulation and cross-checking of 3D models based on 3D models as described in claim 1, characterized in that, It also includes generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, it is also necessary to return the coordinates of the geometric center point of each independent entity that intersects the connector with the XY plane and projected onto the XY plane, as well as the area of each entity projected onto the XY plane.
5. The method for encapsulation and cross-checking of 3D models based on 3D models as described in claim 1, characterized in that, Generate a pre-processed 3D model of the package; if the pre-processed 3D model of the package is a connector, return the coordinates of the geometric center point of the connector hole, and the area of each hole, and record the coordinate array as ArrDXY.
6. The method for encapsulation and cross-checking of 3D models based on 3D models as described in claim 1, characterized in that, Generate a preprocessed 3D model; determine the preprocessed 3D model. If the preprocessed 3D model is a connector, input the coordinates of the geometric center point of each independent entity that intersects the XY plane with the connector, the area of each entity projected onto the XY plane, the coordinates of the geometric center point of the connector hole, and the area of each hole.
7. A system for encapsulation and cross-checking of 3D models based on 3D models, characterized in that, This includes a 3D model category preprocessing module, a 3D model graphics preprocessing module, a packaged graphics preprocessing module, and a module for comparing packaged graphics with 3D model graphics. The 3D model category preprocessing module includes automatically classifying the input 3D model and distinguishing the types of electronic components in the 3D model; The 3D model graphics preprocessing module includes receiving the result of the 3D model category preprocessing module, stretching the XY plane to the positive Z-axis by a certain value to form a cube, and taking the intersection of the cube and the 3D model to form a preprocessed 3D model. The encapsulation graphic preprocessing module receives the data results and encapsulation file from the 3D model category preprocessing module, extracts the copper layer graphic information data on the encapsulation surface, outputs a DXF graphic based on the copper layer graphic information data, and stretches the DXF graphic in the positive Z-axis direction by a certain value to form a preprocessed 3D model of the encapsulation. The module comparing the packaged graphic with the 3D model graphic compares the geometry of the preprocessed 3D model with the copper layer layout of the packaged graphic in the preprocessed 3D model based on the type of electronic component, the preprocessed 3D model, the preprocessed 3D model of the package, the area of each independent entity projected onto the XY plane where the preprocessed 3D model intersects with the XY plane, the two-dimensional area of the DXF graphic of each package, the center coordinates of each independent entity projected onto the XY plane where the preprocessed 3D model intersects with the XY plane, and the center coordinates of the DXF graphic of each package. It then outputs the 3D model judgment result.
8. The 3D model-based encapsulation and 3D model cross-checking system as described in claim 7, characterized in that, The 3D model category preprocessing module includes distinguishing whether a 3D model is a surface-mount type electronic component or a connector type electronic component; Input the 3D model file into the 3D model category preprocessing module, extract the coordinate range of the model in the Z direction from the 3D model file, and determine whether the coordinate range in the Z direction is less than 0.
9. The 3D model-based encapsulation and 3D model cross-checking system as described in claim 7, characterized in that, The 3D model graphics preprocessing module includes: generating a preprocessed 3D model; determining whether the 3D model is a connector; if it is a connector, it also needs to return the coordinates of the geometric center point of each independent entity intersecting the connector with the XY plane projected onto the XY plane, as well as the area of each entity projected onto the XY plane.
10. The 3D model-based encapsulation and 3D model cross-checking system as described in claim 7, characterized in that, The encapsulation graphic preprocessing module includes generating a preprocessed 3D model of the encapsulation; if the preprocessed 3D model of the encapsulation is a connector, then the geometric center point coordinates of the connector holes are returned, and the area of each hole is recorded as a coordinate array ArrDXY.