Chip packaging device and packaging method thereof

Abstract

The invention belongs to the technical field of packaging devices, and discloses a chip packaging device and a packaging method thereof.The chip packaging device comprises a workbench, a top plate is fixedly installed at the top end of the workbench, a packaging structure is connected to the bottom of the top plate, a tray is arranged below the packaging structure, and the tray is arranged at the top end of the workbench; a feeding assembly and a discharging assembly are arranged at the top end of the workbench, the feeding assembly comprises two positioning bases arranged at the top end of the workbench, moving bases are installed at the bottom ends of the two positioning bases, a threaded rod is in threaded connection with the interior of one moving base, and a motor is installed at one end of the threaded rod; the discharging assembly comprises a push plate arranged at the top end of the workbench, the bottom end of the push plate is installed on the outer wall of the threaded rod, the threaded rod rotates to drive the positioning base and the push plate to move synchronously, feeding and discharging are conducted on the tray, the feeding and discharging efficiency is improved, the operation process of workers is simplified, and then the overall efficiency of chip packaging is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of packaging devices, and in particular relates to a chip packaging device and a packaging method thereof. Background Art

[0002] Chip packaging plays a vital role in the semiconductor manufacturing process. It is mainly responsible for tightly combining semiconductor chips with external electrical connections, heat dissipation structures and protective devices. Through this packaging process, the chip can have the physical and electrical characteristics required for practical applications, ensuring its stability and reliability in various working environments. After searching, such as patent: CN216849850U A chip packaging device based on information technology control, including a workbench, a top plate, a packaging device, a chip support plate and a clamping positioning plate, the corner end between the workbench and the top plate is welded with a fixing column, the packaging device is arranged in the middle of the bottom of the top plate, the chip support plate is arranged in the middle of the top of the workbench, the front and rear ends of the top middle of the workbench are fixed with a limit plate, the limit plate is arranged at the front and rear ends of the chip support plate, the clamping positioning plate is arranged on both sides of the chip support plate, the outer end of the mounting plate is fixed with a push rod, the outer end of the push rod is connected to an electric push rod device, the chip packaging device based on information technology control is convenient for limiting the placement of the chip support plate, the push rod is automatically controlled to be telescopically adjusted, so that the clamping positioning plate stably clamps the chip support plate, so that the packaging process is more accurate, and the smoke impurities generated during the packaging process are purified by automatic suction filtration; During operation, current chip packaging equipment requires that the tray carrying the chips be placed under the packaging structure, which then processes the chips. Although the tray can be pushed to the center on both sides through a positioning mechanism, the operator still needs to manually place the tray between two limit plates and remove it after processing is completed. This method of loading and unloading is inefficient, which in turn affects the overall efficiency of chip packaging. Summary of the invention

[0003] The object of the present invention is to provide a chip packaging device and a packaging method thereof to solve the problems raised in the above background technology.

[0004] In order to achieve the above-mentioned object, the present invention provides the following technical solution: a chip packaging device, comprising a workbench, a top plate is fixedly installed on the top of the workbench, a packaging structure is connected to the bottom of the top plate, a tray is arranged below the packaging structure, the tray is arranged on the top of the workbench, and a loading assembly and a unloading assembly are arranged on the top of the workbench; The feeding assembly includes a positioning seat arranged at the top of the workbench, two positioning seats are provided, cooling components are arranged inside the two positioning seats, the two positioning seats are respectively arranged at the two ends of the tray, and the bottom ends of the two positioning seats are installed with moving seats, and the two moving seats are slidably installed inside the workbench, and the internal thread of one of the moving seats is connected with a threaded rod, and a motor is installed at one end of the threaded rod; The unloading assembly comprises a push plate arranged on the top of the workbench, the push plate is arranged on one side of the tray, and the bottom end of the push plate is installed on the outer wall of the threaded rod.

[0005] As a further technical solution of the present invention, a connecting block is installed on one side of the positioning seat, a magnetic block is fixedly installed on the outer wall of the connecting block, a wedge block is arranged on one side of the magnetic block, a magnetic plate is arranged under the wedge block, and the wedge block and the magnetic plate are both fixedly installed on the inner wall of the workbench.

[0006] As a further technical solution of the present invention, the top of the connecting block is fixedly connected to a connecting shaft, the top of the connecting shaft is fixedly installed with a limiting plate, the limiting plate is slidably installed inside the positioning seat, and a second spring is arranged between the limiting plate and the positioning seat.

[0007] As a further technical solution of the present invention, the bottom of the positioning seat is slidably connected to a limiting rod, the limiting rod is fixedly installed inside the moving seat, and the outer wall of the limiting rod is provided with a first spring.

[0008] As a further technical solution of the present invention, a guide plate is fixedly installed on the top of the workbench, and two guide plates are symmetrically arranged.

[0009] As a further technical solution of the present invention, rollers are rotatably installed inside the guide plate, and the rollers are evenly distributed.

[0010] As a further technical solution of the present invention, the cooling component includes a first dust suction pipe arranged inside the positioning seat, the first dust suction pipes are evenly arranged, each of the first dust suction pipes is fixedly connected by a connecting pipe, an air pump is installed on the outer wall of the connecting pipe, a filter chamber is arranged at one end of the connecting pipe away from the air pump, the filter chamber is opened inside the positioning seat, a maintenance plate is arranged above the filter chamber, and air outlet holes are evenly opened inside the maintenance plate.

[0011] As a further technical solution of the present invention, a one-way valve is installed on the outer wall of the connecting pipe.

[0012] As a further technical solution of the present invention, the maintenance plate is connected to the positioning seat by bolts.

[0013] As a further technical solution of the present invention, a filter plate is installed inside the filter cavity.

[0014] As a further technical solution of the present invention, side panels are installed on both sides of the positioning seat through a rotating assembly, and second dust suction pipes are evenly arranged inside the two side panels.

[0015] As a further technical solution of the present invention, the rotating assembly includes a rotating shaft fixedly mounted on the inner wall of the side plate, a gear fixedly mounted on the outer wall of the rotating shaft, a rack plate meshingly connected to one side of the gear, a connecting plate fixedly mounted on one end of the rack plate, a slider fixedly mounted on the bottom end of the connecting plate, the slider is slidably mounted inside a slide groove, the slide groove is opened at the top of a fixed seat, and the fixed seat is fixedly mounted on the top of the workbench.

[0016] A packaging method for a chip packaging device comprises the following steps: S1: When packaging the chip, first place the tray carrying the chip on one side of the push plate so that the side wall of the tray fits with the side wall of the push plate, then drive the threaded rod to rotate through the motor, the rotation of the threaded rod drives the push plate to move, so that the push plate pushes the tray toward the positioning seat, so that the tray moves to the bottom of the packaging structure, and the push plate moves and resets by reversing the threaded rod, and finally the chip carried on the top of the tray is packaged through the packaging structure; S101: During packaging, another tray can be placed on the side wall of the push plate. When the chip packaging in the tray below the packaging structure is completed, the motor drives the threaded rod to rotate again. The rotation of the threaded rod drives the movement of the moving seat. The movement of the moving seat drives the movement of the positioning seat, so that the two positioning seats clamp the packaged tray and move it away: S102: When the positioning seat clamps the pallet and moves to unload the material, the movement of the positioning seat drives the movement of the connecting block, and the movement of the connecting block drives the movement of the magnetic block. When the magnetic block moves to one end of the wedge block, the magnetic block is pressed downward by the inclined surface of the wedge block to make the magnetic block parallel to the magnetic plate. The magnetic force of the two makes the magnetic block move to one side of the magnetic plate to fit. At the same time, the movement of the magnetic block drives the movement of the connecting block. The movement of the connecting block drives the positioning seat to move a distance away from the pallet through the connecting shaft, so that the two positioning seats clamp the pallet and move it to the unloading area and then release the pallet. S103: At the same time, the rotation of the threaded rod drives the push plate to push the new tray under the packaging structure; S104: When the positioning seat clamps the tray to the unloading area and the push plate pushes the new tray to the bottom of the packaging structure, the push plate is moved and reset by reversing the threaded rod, and the positioning seat is moved to one side of the packaging structure and reset. When the magnetic block moves and separates from the magnetic plate, the second spring releases elastic potential energy to drive the limit plate to move up, so that the magnetic block moves up and resets. When the magnetic block is separated from the magnetic plate, the first spring releases elastic potential energy to drive the positioning seat to one side of the tray and reset, so that the two positioning seats move inward after moving to the bottom of the packaging structure to clamp the tray. Finally, the chip carried on the top of the tray is packaged through the packaging structure. Repeat the above steps for continuous operation.

[0017] A packaging method for a chip packaging device further comprises the following steps: S2: During chip packaging, when the push plate pushes the tray to move to one side of the packaging structure, the tray is guided by two guide plates to align the position of the tray so that the tray moves horizontally to the bottom of the packaging structure.

[0018] A packaging method for a chip packaging device further comprises the following steps: S3: When the device is unloading, the air pump is started and connected through the connecting pipe, so that the first dust suction pipe generates suction, and the heat above the tray is sucked into the filter chamber, and discharged from the air outlet after filtering; S31: At the same time, the positioning seat moves to one side to drive the slider to slide inside the slide groove, and the position of the slider is guided by the inclined part inside the slide groove, so that the connecting plate moves to the side away from the positioning seat, and the movement of the connecting plate drives the movement of the rack plate, and the movement of the rack plate drives the rotation of the gear, and the rotation of the gear drives the rotation of the rotating shaft. The rotation of the rotating shaft drives the side plate to rotate inward and be perpendicular to the positioning seat. The side plates at both ends of the two positioning seats rotate to form a rectangle above the tray, so that the packaged chips are fully cooled.

[0019] The beneficial effects of the present invention are as follows: The present invention is provided by cooperating with a loading component and a unloading component. When packaging chips, the tray carrying the chips is first placed on one side of the push plate so that the side wall of the tray is fitted with the side wall of the push plate. Then, the motor drives the threaded rod to rotate, and the rotation of the threaded rod drives the movement of the push plate, so that the push plate pushes the tray in the direction of the positioning seat, so that the tray moves to the bottom of the packaging structure, and the threaded rod is reversed to reset the push plate. Finally, the chip carried on the top of the tray is packaged through the packaging structure. During packaging, another tray can be placed on the side wall of the push plate. When the chip packaging in the tray below the packaging structure is completed, the motor drives the threaded rod to rotate again, and the rotation of the threaded rod drives the movement of the moving seat. The movement of the moving seat drives the movement of the positioning seat, so that the two positioning seats clamp the packaged tray and move it away, and the push plate pushes the new tray to the bottom of the packaging structure to continue packaging. The device drives the positioning seat and the push plate to move synchronously by the rotation of the threaded rod to load and unload the tray, thereby improving the loading and unloading efficiency, simplifying the operation process of the staff, and thereby improving the overall efficiency of chip packaging.

[0020] The present invention sets a cooling component. When the device is unloading, the air pump is started and connected through the connecting pipe, so that the first dust suction pipe generates suction, which can not only effectively remove pollutants such as particles, dust, organic matter and so on attached to the chip surface to ensure the cleanliness of the chip surface, but also absorb the heat on the tray surface to reduce the temperature of the chip, so as to ensure the stability and reliability of the chip after packaging.

[0021] The present invention arranges a rotating assembly, and when the positioning seat moves to unload materials, the slider slides inside the slide slot, and the moving position of the slider is guided by the inclined portion inside the slide slot, so that the connecting plate moves to the side away from the positioning seat, and the movement of the connecting plate drives the movement of the rack plate, and the movement of the rack plate drives the rotation of the gear, and the rotation of the gear drives the rotation of the rotating shaft, and the rotation of the rotating shaft drives the side plates to rotate inwardly and be perpendicular to the positioning seat, and the side plates at both ends of the two positioning seats rotate to form a rectangle above the pallet, thereby increasing the cooling range as much as possible, thereby improving the cooling efficiency and effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic cross-sectional view of the overall structure of the present invention; Figure 3 For the present invention Figure 2 A schematic diagram of the structure enlargement in the middle; Figure 4 For the present invention Figure 2 A magnified schematic diagram of the structure at B in the middle; Figure 5 It is a front view of the overall structure of the present invention; Figure 6It is a structural schematic diagram of the mobile seat of the present invention; Figure 7 It is a structural schematic diagram of the positioning seat of the present invention; Figure 8 For the present invention Figure 7 A magnified schematic diagram of the structure at C in the middle; Fig. 9 It is a schematic cross-sectional view of the structure of the positioning seat of the present invention; Fig.10 For the present invention Fig. 9 A magnified schematic diagram of the structure at D in the middle; Fig.11 It is a schematic diagram of the structural cross-section of the guide plate of the present invention.

[0023] In the figure: 1. workbench; 2. top plate; 3. packaging structure; 4. tray; 5. positioning seat; 6. moving seat; 7. threaded rod; 8. motor; 9. limit rod; 10. first spring; 11. push plate; 12. guide plate; 13. connecting block; 14. magnetic block; 15. connecting shaft; 16. limit plate; 17. second spring; 18. wedge block; 19. magnetic plate; 20. connecting pipe; 21. air pump; 22. first dust suction pipe; 23. one-way valve; 24. filter chamber; 25. maintenance plate; 26. air outlet; 27. filter plate; 28. side plate; 29. ​​second dust suction pipe; 30. rotating shaft; 31. gear; 32. rack plate; 33. connecting plate; 34. slider; 35. slide groove; 36. fixed seat; 37. roller. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] like Figures 1 to 11 As shown, in an embodiment of the present invention, a chip packaging device includes a workbench 1, a top plate 2 is fixedly installed on the top of the workbench 1, a packaging structure 3 is connected to the bottom of the top plate 2, a tray 4 is arranged below the packaging structure 3, the tray 4 is arranged on the top of the workbench 1, and a loading assembly and a unloading assembly are arranged on the top of the workbench 1; The loading assembly includes a positioning seat 5 arranged at the top of the workbench 1, and two positioning seats 5 are provided. The two positioning seats 5 are provided with cooling components inside. The two positioning seats 5 are respectively arranged at the two ends of the tray 4. The bottom ends of the two positioning seats 5 are both installed with moving seats 6. The two moving seats 6 are both slidably installed inside the workbench 1. The internal thread of one of the moving seats 6 is connected with a threaded rod 7, and one end of the threaded rod 7 is installed with a motor 8; The unloading assembly includes a push plate 11 arranged on the top of the workbench 1 , the push plate 11 is arranged on one side of the tray 4 , and the bottom end of the push plate 11 is installed on the outer wall of the threaded rod 7 .

[0026] Existing: CN216849850U discloses a chip packaging device based on information technology control. This patent discloses a workbench, a top plate, a packaging device and a chip tray. The workbench 1, the top plate 2, the packaging structure 3, the tray 4 and the specific packaging method in this application document all adopt the same technical means in this prior art, and this technical means will not be repeated here one by one; Through the cooperation of the loading assembly and the unloading assembly, when packaging the chip, firstly, the tray 4 carrying the chip is placed on one side of the push plate 11, so that the side wall of the tray 4 fits with the side wall of the push plate 11, and then the motor 8 drives the threaded rod 7 to rotate, and the rotation of the threaded rod 7 drives the push plate 11 to move, so that the push plate 11 pushes the tray 4 toward the positioning seat 5, so that the tray 4 moves to the bottom of the packaging structure 3, and the push plate 11 moves and resets by reversing the threaded rod 7, and finally the chip carried on the top of the tray 4 is packaged by the packaging structure 3; During packaging, another tray 4 can be placed on the side wall of the push plate 11. When the chip packaging in the tray 4 below the packaging structure 3 is completed, the motor 8 drives the threaded rod 7 to rotate again. The rotation of the threaded rod 7 drives the movement of the moving seat 6. The movement of the moving seat 6 drives the movement of the positioning seat 5, so that the two positioning seats 5 move away with the tray 4 after packaging. The push plate 11 pushes the new tray 4 to the bottom of the packaging structure 3 to continue packaging. The device drives the positioning seat 5 and the push plate 11 to move synchronously by rotating the threaded rod 7 to load and unload the tray 4, thereby improving the loading and unloading efficiency, simplifying the operation process of the staff, and further improving the overall efficiency of chip packaging.

[0027] like Figure 2 and Figure 3 As shown, a connecting block 13 is installed on one side of the positioning seat 5, a magnetic block 14 is fixedly installed on the outer wall of the connecting block 13, a wedge block 18 is provided on one side of the magnetic block 14, a magnetic plate 19 is provided below the wedge block 18, and both the wedge block 18 and the magnetic plate 19 are fixedly installed on the inner wall of the workbench 1.

[0028] The magnetic block 14 and the magnetic plate 19 are magnetically connected; The initial position of the magnetic block 14 is located above the magnetic plate 19, and the two are arranged alternately; When the positioning seat 5 clamps the tray 4 and moves to unload, the movement of the positioning seat 5 drives the movement of the connecting block 13, and the movement of the connecting block 13 drives the movement of the magnetic block 14. When the magnetic block 14 moves to one end of the wedge block 18, the magnetic block 14 is pressed downward by the inclined surface guide of the wedge block 18, so that the magnetic block 14 is parallel to the magnetic plate 19, and the magnetic block 14 moves to the side of the magnetic plate 19 to fit together through the magnetic force of the two. At the same time, the movement of the magnetic block 14 drives the movement of the connecting block 13, and the movement of the connecting block 13 drives the positioning seat 5 to move through the connecting shaft 15, so that the positioning seat 5 moves a distance to the side away from the tray 4, so that the two positioning seats 5 clamp the tray 4 and move it to the unloading area and then release the tray 4; The magnetic plate 19 is located on the left side of the positioning seat 5. The length of the magnetic plate 19 is slightly shorter than the distance that the positioning seat 5 moves to the left, so that the positioning seat 5 remains in an outwardly opened state when it moves rightward and resets.

[0029] like Fig. 9 and Fig.10 As shown, the top of the connecting block 13 is fixedly connected with a connecting shaft 15 , the top of the connecting shaft 15 is fixedly installed with a limiting plate 16 , the limiting plate 16 is slidably installed inside the positioning seat 5 , and a second spring 17 is arranged between the limiting plate 16 and the positioning seat 5 .

[0030] When the magnetic block 14 moves downward under the guidance of the wedge block 18, the movement of the magnetic block 14 drives the movement of the connecting shaft 15, and the movement of the connecting shaft 15 drives the movement of the limit plate 16. The limit plate 16 moves downward to deform the second spring 17 to store elastic potential energy. When the magnetic block 14 moves and separates from the magnetic plate 19, the elastic potential energy released by the second spring 17 drives the limit plate 16 to move upward, thereby causing the magnetic block 14 to move upward and reset.

[0031] like Figure 7 and Figure 8 As shown, the bottom of the positioning seat 5 is slidably connected to a limiting rod 9 , the limiting rod 9 is fixedly installed inside the moving seat 6 , and the outer wall of the limiting rod 9 is provided with a first spring 10 .

[0032] When the magnetic block 14 is connected to the magnetic plate 19 to drive the positioning seat 5 to move to the side away from the tray 4, the positioning seat 5 slides on the outer wall of the limit rod 9 at the same time, causing the first spring 10 to deform and store elastic potential energy. When the magnetic block 14 is separated from the magnetic plate 19, the elastic potential energy is released by the first spring 10 to drive the positioning seat 5 to move to one side of the tray 4 and reset, so that the two positioning seats 5 move inward after moving to the bottom of the packaging structure 3 to clamp the tray 4, which not only ensures the stability during unloading, but also improves the stability of the chip carried on the top of the tray 4 during processing.

[0033] like Figure 1 , Figure 2 and Fig.11As shown, a guide plate 12 is fixedly installed on the top of the workbench 1, and two guide plates 12 are symmetrically arranged.

[0034] The guide plate 12 is tilted and arranged close to one side of the push plate 11; When the push plate 11 pushes the tray 4 to move to one side of the packaging structure 3 for loading, the tray 4 is guided by the two guide plates 12 to facilitate the correct position of the tray 4.

[0035] like Fig.11 As shown, rollers 37 are rotatably mounted inside the guide plate 12, and the rollers 37 are evenly distributed.

[0036] The friction between the tray 4 and the guide plate 12 is reduced by the rollers 37 .

[0037] like Fig. 9 As shown, the cooling component includes a first dust suction pipe 22 arranged inside the positioning seat 5, the first dust suction pipe 22 is evenly arranged, each first dust suction pipe 22 is fixedly connected by a connecting pipe 20, an air pump 21 is installed on the outer wall of the connecting pipe 20, a filter chamber 24 is arranged at one end of the connecting pipe 20 away from the air pump 21, the filter chamber 24 is opened inside the positioning seat 5, a maintenance plate 25 is arranged above the filter chamber 24, and air outlet holes 26 are evenly opened inside the maintenance plate 25.

[0038] The first dust suction pipe 22 is arranged to be tilted downward; By setting the cooling component, when the device is unloading, the air pump 21 is started and connected through the connecting pipe 20, so that the first dust suction pipe 22 generates suction, which can not only effectively remove particles, dust, organic matter and other pollutants attached to the chip surface to ensure the cleanliness of the chip surface, but also absorb the heat on the surface of the tray 4 to reduce the temperature of the chip, so as to ensure the stability and reliability of the chip after packaging.

[0039] like Fig. 9 As shown, a one-way valve 23 is installed on the outer wall of the connecting pipe 20 .

[0040] Water is provided inside the filter chamber 24 to cool the gas; The one-way valve 23 prevents water in the filter chamber 24 from flowing out of the connecting pipe 20 .

[0041] like Figure 7 and Fig. 9 As shown, the maintenance plate 25 is connected to the positioning seat 5 by bolts.

[0042] It is convenient to remove the maintenance plate 25 and perform maintenance on the filter chamber 24 .

[0043] like Fig. 9 As shown, a filter plate 27 is installed inside the filter chamber 24 .

[0044] Impurities in the filter chamber 24 are filtered to purify the production environment and reduce the concentration of pollutants in the air.

[0045] like Figure 2 , Figure 6 , Figure 7 and Fig. 9 As shown, side plates 28 are installed on both sides of the positioning seat 5 through a rotating assembly, and second dust suction pipes 29 are evenly arranged inside the two side plates 28.

[0046] Each second dust suction pipe 29 inside the side plate 28 is fixedly connected to each other, and the second dust suction pipe 29 is connected to the connecting pipe 20 inside the positioning seat 5 through the connecting pipe 20; The heat is absorbed by the negative pressure inside the positioning seat 5 and the side plate 28, so that the temperature reduction range can be increased and the risk of chip damage due to overheating can be reduced as much as possible.

[0047] like Figure 4 , Figure 6 and Figure 7 As shown, the rotating assembly includes a rotating shaft 30 fixedly mounted on the inner wall of the side plate 28, a gear 31 fixedly mounted on the outer wall of the rotating shaft 30, one side of the gear 31 is meshingly connected with a rack plate 32, one end of the rack plate 32 is fixedly mounted with a connecting plate 33, the bottom end of the connecting plate 33 is fixedly mounted with a slider 34, the slider 34 is slidably mounted inside a slide groove 35, the slide groove 35 is opened at the top of a fixed seat 36, and the fixed seat 36 is fixedly mounted on the top of the workbench 1.

[0048] One end of the slide 35 is inclined; By setting the rotating assembly, when the positioning seat 5 moves to unload materials, the slider 34 slides inside the slide groove 35, and the position of the slider 34 is guided by the inclined part inside the slide groove 35, so that the connecting plate 33 moves to the side away from the positioning seat 5, and the movement of the connecting plate 33 drives the movement of the rack plate 32, and the movement of the rack plate 32 drives the rotation of the gear 31, and the rotation of the gear 31 drives the rotation of the rotating shaft 30. The rotation of the rotating shaft 30 drives the side plate 28 to rotate inwardly and be perpendicular to the positioning seat 5. The side plates 28 at both ends of the two positioning seats 5 rotate to form a rectangle above the tray 4, thereby increasing the cooling range as much as possible, thereby improving the cooling efficiency and effect.

[0049] A packaging method for a chip packaging device comprises the following steps: S1: When packaging the chip, first place the tray 4 carrying the chip on one side of the push plate 11, so that the side wall of the tray 4 fits with the side wall of the push plate 11, and then drive the threaded rod 7 to rotate through the motor 8, and the rotation of the threaded rod 7 drives the push plate 11 to move, so that the push plate 11 pushes the tray 4 toward the positioning seat 5, so that the tray 4 moves to the bottom of the packaging structure 3, and the push plate 11 moves and resets by reversing the threaded rod 7, and finally the chip carried on the top of the tray 4 is packaged through the packaging structure 3; S101: During packaging, another tray 4 can be placed on the side wall of the push plate 11. When the chip packaging in the tray 4 below the packaging structure 3 is completed, the motor 8 drives the threaded rod 7 to rotate again. The rotation of the threaded rod 7 drives the movement of the moving seat 6. The movement of the moving seat 6 drives the movement of the positioning seat 5, so that the two positioning seats 5 clamp the packaged tray 4 and move it away: S102: When the positioning seat 5 clamps the tray 4 and moves to unload the material, the movement of the positioning seat 5 drives the movement of the connecting block 13, and the movement of the connecting block 13 drives the movement of the magnetic block 14. When the magnetic block 14 moves to one end of the wedge block 18, the magnetic block 14 is pressed downward by the inclined surface guide of the wedge block 18, so that the magnetic block 14 is parallel to the magnetic plate 19, and the magnetic block 14 is moved to the side of the magnetic plate 19 to fit together through the magnetic force of the two. At the same time, the movement of the magnetic block 14 drives the movement of the connecting block 13, and the movement of the connecting block 13 drives the positioning seat 5 to move a distance away from the tray 4 through the connecting shaft 15, so that the two positioning seats 5 clamp the tray 4 and move it to the unloading area, and then release the tray 4; S103: At the same time, the rotation of the threaded rod 7 drives the push plate 11 to push the new tray 4 to the bottom of the packaging structure 3; S104: When the positioning seat 5 clamps the tray 4 to the unloading area and the push plate 11 pushes the new tray 4 to the bottom of the packaging structure 3, the push plate 11 is moved and reset by reversing the threaded rod 7, and the positioning seat 5 is moved to one side of the packaging structure 3 and reset. When the magnetic block 14 moves and separates from the magnetic plate 19, the second spring 17 releases the elastic potential energy to drive the limit plate 16 to move upward, so that the magnetic block 14 moves upward and resets. When the magnetic block 14 is separated from the magnetic plate 19, the first spring 10 releases the elastic potential energy to drive the positioning seat 5 to move to one side of the tray 4 and reset, so that the two positioning seats 5 move inward after moving to the bottom of the packaging structure 3 to clamp the tray 4. Finally, the chip carried on the top of the tray 4 is packaged through the packaging structure 3. Repeat the above steps for continuous operation.

[0050] A packaging method for a chip packaging device further comprises the following steps: S2: During chip packaging, when the push plate 11 pushes the tray 4 to move to one side of the packaging structure 3, the two guide plates 12 guide the tray 4 to align the position of the tray 4 so that the tray 4 moves horizontally to the bottom of the packaging structure 3.

[0051] A packaging method for a chip packaging device further comprises the following steps: S3: When the device is unloading, the air pump 21 is started and connected through the connecting pipe 20, so that the first dust suction pipe 22 generates suction, and the heat above the tray 4 is sucked into the filter chamber 24, and discharged from the air outlet 26 after filtering; S301: At the same time, the positioning seat 5 moves to one side to drive the slider 34 to slide inside the slide groove 35, and the position of the slider 34 is guided by the inclined part inside the slide groove 35, so that the connecting plate 33 moves to the side away from the positioning seat 5, and the movement of the connecting plate 33 drives the movement of the rack plate 32, and the movement of the rack plate 32 drives the rotation of the gear 31, and the rotation of the gear 31 drives the rotation of the rotating shaft 30. The rotation of the rotating shaft 30 drives the side plate 28 to rotate inward and be perpendicular to the positioning seat 5. The side plates 28 at both ends of the two positioning seats 5 rotate to form a rectangle above the tray 4, so that the packaged chips are fully cooled.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging device, comprising a workbench (1), characterized in that: A top plate (2) is fixedly mounted on the top of the workbench (1); a packaging structure (3) is connected to the bottom of the top plate (2); a tray (4) is arranged below the packaging structure (3); the tray (4) is arranged on the top of the workbench (1); and a loading assembly and a unloading assembly are arranged on the top of the workbench (1); The loading assembly comprises a positioning seat (5) arranged at the top of the workbench (1), wherein two positioning seats (5) are provided, and cooling components are provided inside the two positioning seats (5), and the two positioning seats (5) are respectively arranged at the two ends of the tray (4), and the bottom ends of the two positioning seats (5) are both installed with a moving seat (6), and the two moving seats (6) are both slidably installed inside the workbench (1), and the internal thread of one of the moving seats (6) is connected to a threaded rod (7), and a motor (8) is installed at one end of the threaded rod (7); The unloading assembly comprises a push plate (11) arranged at the top of the workbench (1), the push plate (11) being arranged on one side of the tray (4), and the bottom end of the push plate (11) being mounted on the outer wall of the threaded rod (7).

2. The chip packaging device according to claim 1, characterized in that: A connecting block (13) is installed on one side of the positioning seat (5), a magnetic block (14) is fixedly installed on the outer wall of the connecting block (13), a wedge block (18) is provided on one side of the magnetic block (14), a magnetic plate (19) is provided below the wedge block (18), and both the wedge block (18) and the magnetic plate (19) are fixedly installed on the inner wall of the workbench (1).

3. The chip packaging device according to claim 2, characterized in that: The top end of the connecting block (13) is fixedly connected to a connecting shaft (15), the top end of the connecting shaft (15) is fixedly mounted with a limiting plate (16), the limiting plate (16) is slidably mounted inside the positioning seat (5), and a second spring (17) is provided between the limiting plate (16) and the positioning seat (5).

4. The chip packaging device according to claim 1, characterized in that: The bottom of the positioning seat (5) is slidably connected to a limiting rod (9), the limiting rod (9) is fixedly mounted inside the moving seat (6), and the outer wall of the limiting rod (9) is provided with a first spring (10).

5. The chip packaging device according to claim 1, characterized in that: A guide plate (12) is fixedly mounted on the top of the workbench (1), and two guide plates (12) are symmetrically arranged.

6. The chip packaging device according to claim 5, characterized in that: Rollers (37) are rotatably mounted inside the guide plate (12), and the rollers (37) are evenly distributed.

7. The chip packaging device according to claim 1, characterized in that: The cooling component comprises a first dust suction pipe (22) arranged inside the positioning seat (5), the first dust suction pipes (22) are evenly arranged, each of the first dust suction pipes (22) is fixedly connected via a connecting pipe (20), an air pump (21) is installed on the outer wall of the connecting pipe (20), a filter chamber (24) is arranged at one end of the connecting pipe (20) away from the air pump (21), the filter chamber (24) is opened inside the positioning seat (5), a maintenance plate (25) is arranged above the filter chamber (24), and air outlet holes (26) are evenly opened inside the maintenance plate (25).

8. The chip packaging device according to claim 7, characterized in that: A one-way valve (23) is installed on the outer wall of the connecting pipe (20).

9. The chip packaging device according to claim 7, characterized in that: The maintenance plate (25) is connected to the positioning seat (5) via bolts.

10. The chip packaging device according to claim 7, characterized in that: A filter plate (27) is installed inside the filter cavity (24).

11. The chip packaging device according to claim 1, characterized in that: Side plates (28) are installed on both sides of the positioning seat (5) via a rotating assembly, and second dust suction pipes (29) are evenly arranged inside the two side plates (28).

12. The chip packaging device according to claim 11, characterized in that: The rotating assembly comprises a rotating shaft (30) fixedly mounted on the inner wall of the side plate (28); a gear (31) is fixedly mounted on the outer wall of the rotating shaft (30); a rack plate (32) is meshingly connected to one side of the gear (31); a connecting plate (33) is fixedly mounted on one end of the rack plate (32); a slider (34) is fixedly mounted on the bottom end of the connecting plate (33); the slider (34) is slidably mounted inside a slide groove (35); the slide groove (35) is opened at the top of a fixed seat (36); and the fixed seat (36) is fixedly mounted on the top of the workbench (1).

13. A packaging method for a chip packaging device, the method being applicable to a chip packaging device as claimed in claims 1 to 12, characterized in that: The following steps are involved: S1: When packaging the chip, firstly, the tray (4) carrying the chip is placed on one side of the push plate (11) so that the side wall of the tray (4) fits with the side wall of the push plate (11), then the motor (8) drives the threaded rod (7) to rotate, and the rotation of the threaded rod (7) drives the push plate (11) to move, so that the push plate (11) pushes the tray (4) in the direction of the positioning seat (5), so that the tray (4) moves to the bottom of the packaging structure (3), and the threaded rod (7) is reversed to move the push plate (11) to reset, and finally the chip carried on the top of the tray (4) is packaged through the packaging structure (3); S101: During packaging, another tray (4) can be placed on the side wall of the push plate (11). When the chip packaging in the tray (4) below the packaging structure (3) is completed, the motor (8) drives the threaded rod (7) to rotate again. The rotation of the threaded rod (7) drives the movement of the moving seat (6). The movement of the moving seat (6) drives the movement of the positioning seat (5), so that the two positioning seats (5) clamp the tray (4) that has been packaged and move away: S102: When the positioning seat (5) clamps the tray (4) and moves to unload the material, the movement of the positioning seat (5) drives the movement of the connecting block (13), and the movement of the connecting block (13) drives the movement of the magnetic block (14). When the magnetic block (14) moves to one end of the wedge block (18), the magnetic block (14) is pressed downward by the inclined surface guide of the wedge block (18), so that the magnetic block (14) and the magnetic plate (19) are parallel, and the magnetic block (14) moves to the side of the magnetic plate (19) to fit together through the magnetic force of the two. At the same time, the movement of the magnetic block (14) drives the movement of the connecting block (13), and the movement of the connecting block (13) drives the positioning seat (5) to move a distance away from the tray (4), so that the two positioning seats (5) clamp the tray (4) and move to the unloading area, and then release the tray (4); S103: At the same time, the rotation of the threaded rod (7) drives the push plate (11) to push the new tray (4) to the bottom of the packaging structure (3); S104: When the positioning seat (5) clamps the tray (4) to the unloading area and the push plate (11) pushes the new tray (4) to the bottom of the packaging structure (3), the push plate (11) is moved and reset by reversing the threaded rod (7), and the positioning seat (5) is moved to one side of the packaging structure (3) and reset. When the magnetic block (14) moves and separates from the magnetic plate (19), the second spring (17) releases elastic potential energy to drive the limit plate (16) to move upward, so that the magnetic block (14) moves upward and resets. When the magnetic block (14) is separated from the magnetic plate (19), the first spring (10) releases elastic potential energy to drive the positioning seat (5) to one side of the tray (4) and resets. After the two positioning seats (5) move to the bottom of the packaging structure (3), they move inward to clamp the tray (4). Finally, the chip carried on the top of the tray (4) is packaged by the packaging structure (3). The above steps are repeated to perform continuous operation.

14. The packaging method of a chip packaging device according to claim 13, characterized in that: The following steps are also included: S2: During chip packaging, when the push plate (11) pushes the tray (4) to move toward one side of the packaging structure (3), the tray (4) is guided by two guide plates (12) to adjust the position of the tray (4) so ​​that the tray (4) moves horizontally to the bottom of the packaging structure (3).

15. The packaging method of a chip packaging device according to claim 13, characterized in that: The following steps are also included: S3: When the device is unloading, the air pump (21) is started and connected through the connecting pipe (20), so that the first dust suction pipe (22) generates suction, and the heat above the tray (4) is sucked into the filter chamber (24), and discharged from the air outlet (26) after being filtered; S301: At the same time, the positioning seat (5) moves to one side to drive the slider (34) to slide inside the slide groove (35), and the position of the slider (34) is guided by the inclined portion inside the slide groove (35), so that the connecting plate (33) moves to the side away from the positioning seat (5), and the movement of the connecting plate (33) drives the movement of the rack plate (32), and the movement of the rack plate (32) drives the rotation of the gear (31), and the rotation of the gear (31) drives the rotation of the rotating shaft (30), and the rotation of the rotating shaft (30) drives the side plate (28) to rotate inwardly and be perpendicular to the positioning seat (5), and the side plates (28) at both ends of the two positioning seats (5) rotate to form a rectangle located above the tray (4), so that the packaged chips are fully cooled.

Images