Micro energy system and preparation method

Abstract

The embodiment of the present disclosure provides a micro energy system and a preparation method. The system includes: a silicon substrate, a micro battery assembly, an adapter, an energy assembly and a power management chip. The silicon substrate includes an electrode area, an adapter area and a substrate area connected to each other in sequence. The electrode area forms at least part of the negative electrode of the micro battery assembly. The adapter runs through the adapter area along the thickness direction of the silicon substrate. The energy assembly and the power management chip are both arranged in the substrate area. The power management chip is located between the adapter and the energy assembly. The battery transmission end of the power management chip is electrically connected to the micro battery assembly through the adapter, and the power management chip is electrically connected to the energy assembly. By electrically connecting the energy assembly to the micro battery assembly through the power management chip, it is possible to convert external energy into electrical energy and store it in the micro battery assembly, thereby improving the utilization rate of external resources. The micro battery assembly, the energy assembly and the power management chip are integrated on the silicon substrate to realize the miniaturization and integration of the electronic system.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the field of electronic technology, and specifically relate to a micro energy system and a preparation method thereof. Background Art

[0002] With the rapid development of the Internet of Things, smart electronic devices such as mobile phones, tablets, wireless headphones and smart bracelets have been widely used in people's daily lives. At present, the main way to power these electronic devices on the market is to use lithium batteries. However, with the increasingly obvious trend of miniaturization and ultra-thinness of portable and wearable devices, lithium batteries can no longer meet the demand for convenience due to their large thickness and weight; in addition, the large size makes lithium batteries have certain disadvantages in the integration of devices and appearance beautification. On the other hand, traditional lithium batteries need to be repeatedly charged by external power supplies, making it difficult to save energy. Summary of the invention

[0003] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide a micro energy system and a preparation method thereof.

[0004] The first aspect of the present disclosure provides a micro energy system, a silicon substrate, the silicon substrate comprising an electrode area, a transfer area and a substrate area connected in sequence; a micro battery assembly, the micro battery assembly comprising a positive current collector plate, a positive electrode, an electrolyte layer, a negative electrode and a negative current collector plate stacked in sequence, the electrode area forming at least part of the negative electrode; an adapter, the adapter area having a through hole penetrating along the thickness direction of the silicon substrate, the adapter extending along the length of the through hole to the upper and lower surfaces of the adapter area, the first end of the adapter being electrically connected to the negative current collector plate; a power management chip, the power management chip being arranged on the upper surface of the substrate area, the battery transmission end of the power management chip being electrically connected to the positive current collector plate and the second end of the adapter, the power management chip and the power management chip also having an external transmission end, the external transmission end being used to connect an external load; an energy component, the energy component being arranged on the upper surface of the substrate area, the power management chip being located between the adapter and the energy component, the energy component being electrically connected to the input end of the power management chip, the energy component being used to collect external energy.

[0005] In some embodiments of the present disclosure, along the direction from top to bottom of the micro energy system, the energy component includes a top electrode, a functional layer and a bottom electrode connected in sequence, the bottom electrode is arranged on the upper surface of the substrate area, the top electrode and the bottom electrode are respectively electrically connected to the input end of the power management chip, and the functional layer is used to collect at least one of light energy, thermal energy, mechanical energy, chemical energy, electromagnetic energy, and sound energy.

[0006] In some embodiments of the present disclosure, the negative electrode includes a negative electrode body and a plurality of protrusions, and the plurality of protrusions are disposed on an upper surface of the negative electrode body.

[0007] In some embodiments of the present disclosure, a plurality of the protrusions are arranged in an array.

[0008] A second aspect of the present disclosure provides a method for preparing a micro energy system, which is used to prepare the micro energy system according to any of the above embodiments. The method comprises:

[0009] Dividing the silicon substrate into an electrode region, a transfer region and a substrate region;

[0010] A transition piece is prepared in the substrate area, wherein the transition piece penetrates the thickness direction of the silicon substrate;

[0011] The negative electrode, electrolyte layer, positive electrode, positive electrode current collector and negative electrode current collector of the microbattery assembly are prepared in the electrode area, and the bottom electrode, functional layer and top electrode of the energy assembly are prepared in sequence on the upper surface of the substrate area;

[0012] A power management chip is arranged on the upper surface of the substrate area, and the input end of the power management chip is electrically connected to the top electrode and the bottom electrode, the battery transmission end of the power management chip is electrically connected to the positive electrode current collecting plate, and the battery transmission end of the power management chip is electrically connected to the negative electrode current collecting plate through an adapter, and the external transmission end of the power management chip is used to connect an external load.

[0013] In some embodiments of the present disclosure, the negative electrode, electrolyte layer, positive electrode, positive current collector and negative current collector of the microbattery assembly are prepared in the electrode area, and before the bottom electrode, functional layer and top electrode of the energy assembly are sequentially prepared on the upper surface of the substrate area, the method further includes:

[0014] A transition piece is prepared in the transition area, and the transition piece penetrates the thickness direction of the silicon substrate;

[0015] Wherein, two ends of the adapter are respectively connected to the negative electrode current collecting plate and the battery transmission end of the power management chip.

[0016] In some embodiments of the present disclosure, preparing a transition piece in the transition area, wherein the transition piece runs through the thickness direction of the silicon substrate, specifically includes:

[0017] Etching a through hole in the transfer area by dry etching;

[0018] Depositing silicon oxide or silicon nitride on the inner surface of the through hole to form an insulating layer;

[0019] Depositing tantalum metal or tantalum nitride on the surface of the insulating layer to form a barrier layer;

[0020] Copper is plated in the through hole forming the barrier layer to form a transition piece penetrating the transition area in the thickness direction.

[0021] In some embodiments of the present disclosure, the negative electrode, electrolyte layer, positive electrode, positive current collector and negative current collector of the microbattery assembly are prepared in the electrode area, and the bottom electrode, functional layer and top electrode of the energy assembly are prepared on the upper surface of the substrate area, specifically including:

[0022] Etching the upper surface of the electrode region to form a negative electrode of the microbattery assembly;

[0023] depositing an electrolyte material on the upper surface of the negative electrode to form an electrolyte layer;

[0024] Printing a bottom electrode solution on the upper surface of the substrate area, and heat treating to obtain a bottom electrode of the energy component;

[0025] Printing a functional material solution on the upper surface of the bottom electrode and heat treating it to obtain a functional layer of the energy component;

[0026] Printing a positive electrode slurry on the upper surface of the electrolyte layer and drying it to obtain a positive electrode of the microbattery assembly;

[0027] Magnetron sputtering an aluminum film on the upper surface of the positive electrode to form a positive electrode current collector of the micro-battery assembly;

[0028] Magnetron sputtering an ITO film on the upper surface of the functional layer to form a top electrode of the energy component;

[0029] A copper film is magnetron sputtered on the lower surface of the negative electrode to form a negative electrode current collecting plate of the micro-battery assembly, and the negative electrode current collecting plate is connected to the first end of the adapter.

[0030] In some embodiments of the present disclosure, the step of depositing an electrolyte material on the upper surface of the negative electrode to form an electrolyte layer specifically includes:

[0031] depositing lithium phosphate on the upper surface of the silicon substrate;

[0032] coating a photoresist on the upper surface of the negative electrode;

[0033] placing the silicon substrate in ammonia water to remove lithium phosphate;

[0034] The silicon substrate is placed in an acetone solution to remove the photoresist to form an electrolyte layer.

[0035] In some embodiments of the present disclosure, the step of printing a bottom electrode solution on the upper surface of the substrate region and heat treating to obtain a bottom electrode of the energy component specifically includes:

[0036] The lanthanum nickelate solution is prepared by a sol-gel method;

[0037] The lanthanum nickelate solution is printed on the upper surface of the substrate area by screen printing;

[0038] placing the silicon substrate in an oven for drying;

[0039] The dried silicon substrate is heated to obtain the bottom electrode of the energy component.

[0040] In some embodiments of the present disclosure, before dividing the silicon substrate into the electrode area, the transfer area and the substrate area, the method specifically includes:

[0041] Cleaning silicon substrates;

[0042] Spin coating photoresist on the upper surface of the silicon substrate;

[0043] A pattern is formed on the upper surface of the silicon substrate using a mask.

[0044] The micro energy system and preparation method of the disclosed embodiment, the micro energy system also includes a silicon substrate, the silicon substrate includes an electrode area, a transfer area and a substrate area, wherein the electrode area is used as the negative electrode of the micro battery assembly, the negative electrode current collector is arranged on the lower surface of the electrode area, the electrolyte layer, the positive electrode and the positive electrode current collector are arranged in sequence on the upper surface of the electrode area, the transfer area is provided with a transfer piece that runs through the thickness direction of the silicon substrate, the upper surface of the substrate area is provided with an energy assembly and a power management chip, the battery transmission end of the power management chip is electrically connected to the negative electrode current collector of the micro battery assembly through the transfer piece, the battery transmission end of the power management chip is electrically connected to the positive electrode current collector of the micro battery assembly, and the input end of the power management chip is electrically connected to the energy assembly. By electrically connecting the energy assembly to the micro battery assembly through the power management chip with rectification and transmission functions, external energy can be obtained, and the external energy can be converted into electrical energy and stored in the micro battery assembly, thereby providing a continuous power supply for electronic products, and at the same time, improving energy utilization, reducing the number of times the external power supply charges the micro battery assembly, and saving electrical energy. In addition, micro-battery components, energy components and power management chips are integrated on a silicon substrate to reduce the volume of the micro-energy system, save the installation space of the micro-energy system, realize the miniaturization and integration of the electronic system, improve the energy density of the micro-energy system, and improve the safety performance of the micro-energy system. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic diagram of the overall structure of the micro energy system of the disclosed embodiment;

[0046] Figure 2 for Figure 1 A schematic diagram of the structure of the micro-battery assembly shown;

[0047] Figure 3 for Figure 1 The schematic diagram of the structure of the energy component and part of the silicon substrate shown;

[0048] Figure 4 for Figure 1 The structural schematic diagram of the power management chip shown;

[0049] Figure 5 is a schematic diagram of step S100 of the method for preparing the micro energy system disclosed in the present invention;

[0050] Figure 6 is a schematic diagram of step S200 of the method for preparing the micro energy system disclosed in the present invention;

[0051] Figure 7 is a schematic diagram of step S300 of the method for preparing the micro energy system disclosed in the present invention;

[0052] Figure 8 It is a schematic diagram of step S400 of the method for preparing the micro energy system disclosed in the present invention.

[0053] The reference numerals in the accompanying drawings represent the following:

[0054] 100. Micro energy system;

[0055] 10. Silicon substrate; S1. Electrode area; S2. Transfer area; S3. Power management chip area; S4. Energy area;

[0056] 20. Micro battery assembly; 21. Negative electrode; 211. Negative electrode body; 212. Raised portion; 22. Electrolyte layer; 23. Positive electrode; 24. Positive electrode current collector; 25. Negative electrode current collector;

[0057] 30. Energy component; 31. Bottom electrode; 32. Functional layer; 33. Top electrode;

[0058] 40. Power management chip; a. a first end of the input terminal; b. a second end of the input terminal; c. a first end of the battery transmission terminal; d. a second end of the battery transmission terminal; e. a first end of the external transmission terminal; f. a second end of the external transmission terminal;

[0059] 50. Adapter. DETAILED DESCRIPTION

[0060] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0061] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0062] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0063] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, the element described as "below other elements or features" or "below other elements or features" will be subsequently oriented to "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0064] like Figures 1 to 4As shown, the first aspect of the present disclosure provides a micro energy system 100, which includes: a silicon substrate 10, a micro battery assembly 20, an energy assembly 30, a power management chip 40 and an adapter 50. Specifically, the silicon substrate 10 includes an electrode area S1, an adapter area S2 and a substrate area connected to each other in sequence, the micro battery assembly 20 includes a positive current collector 24, a positive electrode 23, an electrolyte layer 22, a negative electrode 21 and a negative current collector 25 stacked in sequence, the electrode area S1 forms at least part of the negative electrode 21, the adapter area S2 has a through hole penetrating along the thickness direction of the silicon substrate 10, and the adapter 50 Extending along the length of the through hole to the upper and lower surfaces of the adapter area S2, the first end of the adapter 50 is electrically connected to the negative current collector 25, the second end of the adapter 50 is electrically connected to the battery transmission end of the power management chip 40, the battery transmission end of the battery management chip is electrically connected to the positive current collector 24, the power management chip 40 and the energy component 30 are both arranged in the substrate area, the power management chip 40 is located between the adapter 50 and the energy component 30, the input end of the power management chip 40 is electrically connected to the energy component 30, the energy component 30 is used to collect external energy, and the power management chip 40 also has an external transmission end for connecting an external load.

[0065] According to the micro energy system 100 of the embodiment of the present disclosure, it includes a micro battery assembly 20, an energy assembly 30 and a power management chip 40, wherein the input end of the power management chip 40 is electrically connected to the energy assembly 30, the battery transmission end of the power management chip 40 is electrically connected to the micro battery assembly 20 through the adapter 50, and the external transmission end of the power management chip 40 is used for an external load. The energy assembly 30 obtains at least one of external light energy, heat energy, mechanical energy, chemical energy, electromagnetic energy, and sound energy to transfer the obtained energy to the power management chip 40 through the input end of the power management chip 40, and the power management chip 40 can transfer the energy transferred by the energy assembly 30 to the micro battery assembly 20 through the battery transmission end, so as to store the energy of the energy assembly 30 in the micro battery assembly 20 to provide continuous power for electronic products. The external transmission end of the power management chip 40 can be used to connect an external charging device. The external charging device transfers electric energy to the power management chip 40 through the external transmission end. The power management chip 40 transfers electric energy to the microbattery assembly 20 to charge the microbattery assembly 20. The external transmission end of the power management chip 40 can also be connected to an external power-consuming device (such as an electronic product). The microbattery assembly 20 transfers electric energy to the power management chip 40. The power management chip 40 transfers electric energy to the external power-consuming device through the external transmission end to provide power to the external power-consuming device.

[0066] By electrically connecting the energy component 30 with the micro-battery component 20 through the power management chip 40 with rectification and transmission functions, external energy can be obtained, and the external energy can be converted into electrical energy and stored in the micro-battery component 20, thereby providing a continuous power supply for electronic products, and at the same time, improving energy utilization, reducing the number of times the external power source charges the micro-battery component 20, and saving electrical energy. The micro-energy system 100 also includes a silicon substrate 10, and the silicon substrate 10 includes an electrode area S1 and a substrate area, wherein the electrode area S1 can form at least part of the negative electrode 21 of the micro-battery component 20, and the rest of the micro-battery component 20 is arranged in the electrode area S1, and the substrate area is provided with an energy component 30 and a power management chip 40, that is, the micro-battery component 20, the energy component 30 and the power management chip 40 are integrated on the silicon substrate 10, so as to reduce the volume of the micro-energy system 100, save the installation space of the micro-energy system 100, realize the miniaturization and integration of the electronic system, improve the energy density of the micro-energy system, and improve the safety performance of the micro-energy system.

[0067] In some embodiments of the present disclosure, Figure 1 , Figure 2 As shown, the micro battery assembly 20 includes a positive electrode 23, an electrolyte layer 22, a positive current collector 24 and a negative current collector 25. Specifically, along the direction from the top to the bottom of the micro energy system 100, the positive current collector 24, the positive electrode 23, the electrolyte layer 22, the negative electrode 21 and the negative current collector 25 are connected in sequence, that is, the positive current collector 24, the positive electrode 23 and the electrolyte layer 22 are arranged on the upper surface of the negative electrode 21, and the negative current collector 25 is arranged on the lower surface of the negative electrode 21, that is, the positive current collector 24, the positive electrode 23 and the electrolyte layer 22 are arranged on the upper surface of the electrode area S1 of the silicon substrate 10, and the negative current collector 25 is arranged on the lower surface of the electrode area S1 of the silicon substrate 10. The positive current collector 24 is electrically connected to the c-end of the battery transmission end of the power management chip 40, and the negative current collector 25 is electrically connected to the d-end of the battery transmission end of the power management chip 40. The power management chip 40 and the micro-battery assembly 20 realize the transmission of electric energy through the electrical connection between the c-terminal and the positive electrode current collecting plate 24 and the d-terminal and the negative electrode current collecting plate 25 .

[0068] In some embodiments of the present disclosure, Figure 2 As shown, the negative electrode 21 includes a negative electrode body 211 and a plurality of protrusions 212. The negative electrode body 211 is a plate body. The plurality of protrusions 212 are arranged on the upper surface of the negative electrode body 211. The plurality of protrusions 212 are arranged in an array. By arranging a plurality of protrusions 212 in an array on the upper surface of the negative electrode body 211 of the plate structure, the surface area of ​​the upper surface of the negative electrode 21 is increased.

[0069] In some embodiments of the present disclosure, Figure 1As shown, a transfer member 50 is also provided on the silicon substrate 10, and the transfer member 50 is provided in the transfer area S2 along the thickness direction of the silicon substrate 10. Specifically, the second end of the transfer member 50 extends to the upper surface of the transfer area S2, and the second end of the transfer member 50 contacts the d end of the battery transmission end of the power management chip 40, and the transfer member 50 is electrically connected to the power management chip 40 through the battery transmission end; the first end of the transfer member 50 extends to the lower surface of the transfer area S2, and the first end of the transfer member 50 contacts the negative electrode current collecting plate 25, and the transfer member 50 is electrically connected to the negative electrode current collecting plate 25.

[0070] In some embodiments of the present disclosure, Figure 1 As shown, the power management chip 40 is arranged at one end of the substrate area close to the electrode area S1, and the energy component 30 is arranged at one end of the substrate area away from the electrode area S1. Along the direction from the electrode area S1 to the substrate area, that is, along the length direction of the silicon substrate 10, the power management chip 40 is located between the adapter 50 and the energy component 30. That is, along the length direction of the silicon substrate 10, the micro battery assembly 20, the adapter 50, the power management chip 40 and the energy component 30 are arranged in sequence. By arranging the adapter 50 and the power management chip 40 between the micro battery assembly 20 and the energy component 30, the connection between the power management chip 40 and the energy component 30, the power management chip 40 and the micro battery assembly 20, and the power management chip 40 and the adapter 50 is reduced, so that the wiring of the micro energy system 100 is more concise.

[0071] In some embodiments of the present disclosure, Figure 1 , Figure 3 As shown, along the direction from the top to the bottom of the micro energy system 100, the energy component 30 includes a top electrode 33, a functional layer 32 and a bottom electrode 31 connected in sequence, that is, the bottom electrode 31, the functional layer 32 and the top electrode 33 are arranged in sequence on the upper surface of the substrate area. The top electrode 33 is electrically connected to the a end of the input end of the power management chip 40, and the bottom electrode 31 is electrically connected to the b end of the input end of the power management chip 40. The power management chip 40 and the energy component 30 realize the transmission of external energy through the top electrode 33 being electrically connected to the a end and the bottom electrode 31 being electrically connected to the b end. The thin film material of the functional layer 32 includes but is not limited to ferroelectric thin film, semiconductor thin film, insulating thin film, and conductive thin film. The types of energy collected by the functional layer 32 include but are not limited to light energy, thermal energy, mechanical energy, chemical energy, electromagnetic energy and sound energy. For example, when light is irradiated on the top electrode of the ITO thin film material or the temperature difference in the environment is large, the energy component can generate current, and the energy component transmits the current signal to the power management chip, and the power management chip transmits the current signal to the micro battery component after processing, so as to store it in the micro battery component.

[0072] In some embodiments of the present disclosure, Figure 1 , Figure 4As shown, the external transmission end of the power management chip 40 also includes an e-end and an f-end, and the power management chip 40 is electrically connected to an external power supply device through the e-end and the f-end, or the power management chip 40 is electrically connected to an electronic power-consuming device through the e-end and the f-end. Specifically, the functional layer 32 is used to collect energy, and the energy collected by the functional layer 32 includes but is not limited to light energy, thermal energy, mechanical energy, chemical energy, electromagnetic energy and sound energy. The material of the functional layer 32 includes but is not limited to ferroelectric film, semiconductor film, insulating film, and conductive film.

[0073] like Figures 5 to 8 As shown, the second aspect of the present disclosure provides a method for preparing a micro energy system, which is used to prepare the micro energy system according to any of the above embodiments, and the preparation method includes:

[0074] S100: dividing the silicon substrate into an electrode area, a transfer area and a substrate area;

[0075] S200: preparing a transfer component in the transfer area, wherein the transfer component penetrates through the thickness direction of the silicon substrate;

[0076] S300: preparing a negative electrode, an electrolyte layer, a positive electrode, a positive current collector and a negative current collector of a microbattery assembly in the electrode region, and sequentially preparing a bottom electrode, a functional layer and a top electrode of an energy assembly on the upper surface of the substrate region;

[0077] S400: A power management chip is disposed on the upper surface of the substrate area, an input end of the power management chip is electrically connected to the top electrode and the bottom electrode, a battery transmission end of the power management chip is electrically connected to the positive current collecting plate and the negative current collecting plate, and an external transmission end of the power management chip is used to connect an external load.

[0078] According to the preparation method of the micro energy system of the embodiment of the present disclosure, the silicon substrate is first divided into an electrode area, a transfer area and a substrate area, and then the negative electrode, electrolyte layer, positive electrode, positive current collector and negative current collector of the micro battery assembly are prepared in the electrode area, and the adapter is prepared in the transfer area. The bottom electrode, functional layer and top electrode of the energy assembly are prepared in sequence on the upper surface of the substrate area. Finally, a power management chip is arranged on the upper surface of the substrate area, and the input end of the power management chip is electrically connected to the top electrode and the bottom electrode of the energy assembly, and the battery transmission end of the power management chip is electrically connected to the positive current collector of the micro battery assembly, and the battery transmission end of the power management chip is electrically connected to the negative current collector of the micro battery assembly through the adapter. The energy assembly obtains at least one of external light energy, heat energy, mechanical energy, chemical energy, electromagnetic energy and sound energy to transfer the obtained energy to the power management chip through the input end of the power management chip, and the power management chip can transfer the energy transmitted by the energy assembly to the micro battery assembly through the battery transmission end, so as to store the energy of the energy assembly in the micro battery assembly to provide continuous power for electronic products. The external transmission end of the power management chip can be used to connect an external charging device. The external charging device transmits electric energy to the power management chip through the external transmission end. The power management chip transmits electric energy to the micro-battery assembly through the battery transmission end to charge the micro-battery assembly. The external transmission end of the power management chip can also be connected to an external power-consuming device (such as an electronic product). The battery transmission end of the micro-battery assembly transmits electric energy to the power management chip. The power management chip transmits electric energy to the external power-consuming device through the external transmission end to provide power for the external power-consuming device. By electrically connecting the energy assembly to the micro-battery assembly through a power management chip with rectification and transmission functions, it is possible to convert external energy into electric energy and store it in the micro-battery assembly, reduce the number of external charging times of the micro-battery assembly, and increase the service life of the micro-battery assembly. At the same time, it improves the utilization rate of external energy and saves electric energy. The micro energy system also includes a silicon substrate, which includes an electrode area, a transfer area and a substrate area, wherein the electrode area serves as the negative electrode of the micro battery assembly, a negative electrode current collector is arranged on the lower surface of the electrode area, an electrolyte layer, a positive electrode and a positive electrode current collector are arranged in sequence on the upper surface of the electrode area, a transfer part is arranged in the transfer area which runs through the thickness direction of the silicon substrate, an energy assembly and a power management chip are arranged on the upper surface of the substrate area, a battery transmission end of the power management chip is electrically connected to the negative electrode current collector of the micro battery assembly through the transfer part, a battery transmission end of the power management chip is electrically connected to the positive electrode current collector of the micro battery assembly, and an input end of the power management chip is electrically connected to the energy assembly. That is, the micro battery assembly, the energy assembly and the power management chip are integrated on the silicon substrate to reduce the volume of the micro energy system, save the installation space of the micro energy system, and realize the miniaturization and integration of the electronic system.

[0079] In some embodiments of the present disclosure, S100: before dividing the silicon substrate into the electrode region, the transfer region and the substrate region, specifically includes:

[0080] S010: cleaning the silicon substrate;

[0081] S020: Spin-coating a photoresist on the upper surface of the silicon substrate;

[0082] S030: forming a pattern on the upper surface of the silicon substrate using a mask plate.

[0083] First, clean the silicon substrate with ethanol, acetone or other solutions; then, spin-coat the upper surface of the silicon substrate with photoresist; finally, cover the upper surface of the photoresist with a mask plate, and use photolithography processes such as exposure and development to form a pattern on the upper surface of the silicon substrate, such as Figure 5 Schematic diagram of forming a pattern on the upper surface of a silicon substrate is shown. Specifically, the pattern processing methods of the upper surface of the silicon substrate include but are not limited to photolithography, etching, laser direct writing, and nanoimprinting.

[0084] S100: Divide the silicon substrate into an electrode area, a transfer area and a substrate area.

[0085] According to the photolithography pattern on the surface of the silicon substrate, the silicon substrate is divided into an electrode area S1, a transfer area S2 and a substrate area, wherein the electrode area serves as the negative electrode of the micro-battery assembly, and the substrate area serves as a carrier of the power management chip and the energy assembly. Specifically, the substrate area includes the power management chip area S3 and the energy area S4 (such as Figure 5 As shown in the figure, a power management chip is arranged on the upper surface of the power management chip area S3, and an energy component is arranged on the upper surface of the energy area S4. The electrode area S1, the transfer area S2, the power management chip area S3 and the energy area S4 are arranged in sequence along the length direction of the silicon substrate. The lengths of the electrode area S1, the transfer area S2, the power management chip area S3 and the energy area S4 are different, but since the width of the silicon substrate remains unchanged, the electrode area S1, the transfer area S2, the power management chip area S3 and the energy area S4 have the same width. The silicon substrate is an integrated structure.

[0086] In some embodiments of the present disclosure, S300: before preparing the negative electrode, electrolyte layer, positive electrode, positive current collector and negative current collector of the microbattery assembly in the electrode area, and sequentially preparing the bottom electrode, functional layer and top electrode of the energy assembly on the upper surface of the substrate area, it also includes:

[0087] S200: preparing a transfer component in the transfer area, wherein the transfer component penetrates through the thickness direction of the silicon substrate;

[0088] Wherein, two ends of the adapter are respectively connected to the negative electrode current collecting plate and the battery transmission end of the power management chip.

[0089] like Figure 6A side schematic diagram of a silicon substrate is shown, in which an adapter connecting a power management chip and a microbattery assembly is prepared in the substrate area. The adapter runs through the thickness direction of the silicon substrate, and the two ends of the adapter extend to the upper and lower surfaces of the substrate area respectively. The adapter can connect the power management chip arranged on the upper surface of the substrate area and the negative current collecting plate arranged on the lower surface of the electrode area.

[0090] In some embodiments of the present disclosure, S200: preparing a transition piece in the transition area, wherein the transition piece penetrates the thickness direction of the silicon substrate, specifically includes:

[0091] S210: etching a through hole in the transfer area by dry etching;

[0092] S220: depositing silicon oxide or silicon nitride on the inner surface of the through hole to form an insulating layer;

[0093] S230: depositing tantalum metal or tantalum nitride on the surface of the insulating layer to form a barrier layer;

[0094] S240: Copper is plated in the through hole of the barrier layer to form a transition piece that penetrates the thickness direction of the substrate area.

[0095] According to the photolithography pattern on the surface of the silicon substrate, dry etching is used to etch a through hole in the transition area, and the through hole passes through the transition area along the thickness direction of the silicon substrate. After the through hole is etched, silicon oxide or silicon nitride is deposited on the inner surface of the through hole by plasma enhanced chemical vapor deposition and other methods, and an insulating layer is formed on the inner surface of the through hole to isolate the metal subsequently filled in the through hole from the silicon on the inner surface of the through hole to prevent the filled metal from being electrically conductive with the silicon. After the insulating layer is formed on the inner surface of the through hole, tantalum metal or tantalum nitride is deposited on the surface of the insulating layer by atomic layer deposition, chemical vapor deposition or physical vapor deposition and other methods to form a barrier layer on the surface of the insulating layer to prevent the metal subsequently filled in the through hole from diffusing into the insulating layer. At the same time, the barrier layer can enhance the adhesion between the metal subsequently filled and the insulating layer. After the barrier layer is formed on the surface of the insulating layer, first, copper is plated in the through hole where the insulating layer and the barrier layer are formed by an electroplating process to form a copper column in the through hole; then, the silicon substrate is annealed to make the copper column grains in the through hole evenly distributed; then, the insulating layer, barrier layer and copper on the upper surface of the silicon substrate are removed by a chemical mechanical polishing method, and the upper surface of the silicon substrate is temporarily bonded; then, the lower surface of the silicon substrate is thinned by grinding or etching to expose the copper in the through hole; then, copper bumps are formed on the lower surface of the transition area S2 of the silicon substrate by a rewiring layer process, the upper surface of the silicon substrate is debonded, and copper bumps are formed on the upper surface of the transition area S2 of the silicon substrate by a rewiring layer process, and the copper bumps on the upper surface of the transition area S2 and the copper bumps on the lower surface are respectively connected to the two ends of the copper column in the through hole, and at this time, the preparation of the adapter is completed.

[0096] like Figure 7 As shown, S300: preparing a negative electrode, an electrolyte layer, a positive electrode, a positive current collector and a negative current collector of a microbattery assembly in the electrode area, and preparing a bottom electrode, a functional layer and a top electrode of an energy assembly on the upper surface of the substrate area, specifically including:

[0097] S310: Etching the upper surface of the electrode region to form a negative electrode of the micro-battery assembly;

[0098] According to the photolithography pattern of S030, dry etching or wet etching is performed on the electrode area of ​​the silicon substrate to form a negative electrode of the microbattery assembly on the upper surface of the electrode area. Specifically, a plurality of protrusions are etched on the upper surface of the electrode area, and the plurality of protrusions are arranged in an array to improve the resolution and sensitivity of the electrode. The protrusions in the electrode area are micrometer-level or nanometer-level. Specifically, the surface morphology of the negative electrode includes but is not limited to a plane, a cylindrical shape, a cone shape, a rectangular column shape, and a wavy shape.

[0099] S320: depositing an electrolyte material on the upper surface of the negative electrode to form an electrolyte layer;

[0100] First, lithium phosphate is deposited on the upper surface of the silicon substrate by atomic layer deposition as an electrolyte material; then, photoresist is applied on the upper surface of the electrode area where lithium phosphate is deposited and the outer surface of the protrusion by screen printing to protect the lithium phosphate material on the upper surface of the electrode area and the lithium phosphate material on the outer surface of the protrusion; after applying the photoresist, the silicon substrate is placed in ammonia water to remove the lithium phosphate deposited in the substrate area; after the silicon substrate is taken out of the ammonia water, it is placed in an acetone solution to remove the photoresist on the electrode area and the protrusion surface, thereby forming an electrolyte layer on the surface of the negative electrode. Specifically, the material of the electrolyte layer includes but is not limited to inorganic thin films, organic thin films, compounds, and metal thin films. The electrolyte material can also be prepared on the upper surface of the negative electrode by physical thin film deposition, chemical thin film deposition, material transfer, material coating, screen printing, in-situ chemical synthesis, etc.

[0101] S330: printing a bottom electrode solution on the upper surface of the substrate area, and performing heat treatment to obtain a bottom electrode of the energy component;

[0102] First, a lanthanum nickelate solution is prepared by a sol-gel method; then, the prepared lanthanum nickelate solution is printed on the upper surface of the power management chip area S3 of the substrate area by screen printing; finally, the silicon substrate is placed in a baking oven for drying, and placed on a heating table for heating to obtain a bottom electrode film. Specifically, the bottom electrode material can be selected from other materials other than lanthanum nickelate that have good conductivity and are relatively matched with the lattice constant of the functional layer film. In addition, the material of the bottom electrode can also be prepared on the upper surface of the substrate area of ​​the silicon substrate by thin film deposition, chemical thin film deposition, material transfer, material coating, etc.

[0103] S340: printing a functional material solution on the upper surface of the bottom electrode, and performing heat treatment to obtain a functional layer of the energy component;

[0104] First, a barium titanate ferroelectric solution is prepared by a sol-gel method; then, the prepared barium titanate ferroelectric solution is printed on the surface of the bottom electrode film by a screen printing method; finally, the silicon substrate is dried, heated and annealed to obtain a functional layer film. The annealing temperature is 700°C. Functional layer film materials include but are not limited to ferroelectric films, semiconductor films, insulating films, conductive films, etc., and the types of energy collected include but are not limited to light energy, thermal energy, mechanical energy, chemical energy, electromagnetic energy and sound energy. In addition, the material of the functional layer can also be prepared on the surface of the bottom electrode by thin film deposition, chemical thin film deposition, material transfer, material coating, etc.

[0105] S350: printing a positive electrode slurry on the upper surface of the electrolyte layer, and drying the slurry to obtain a positive electrode of the microbattery assembly;

[0106] First, PVDF binder, N-methylpyrrolidone solvent, carbon conductive agent and positive electrode active material are mixed and stirred by a mixer, and the bubbles generated in the mixed solution during the stirring process are eliminated by vacuum treatment to obtain positive electrode slurry; then, the prepared positive electrode slurry is printed on the surface of S320 to prepare the electrolyte layer by screen printing; finally, the silicon substrate is placed in an oven for drying to form the positive electrode of the microbattery assembly on the surface of the electrolyte layer. In addition, the positive electrode slurry can also be prepared on the surface of the electrolyte layer by thin film deposition, chemical thin film deposition, material transfer, material coating, etc.

[0107] S360: magnetron sputtering an aluminum film on the upper surface of the positive electrode to form a positive electrode current collector of the micro-battery assembly;

[0108] First, a mask plate that can cover the substrate area and expose the electrode area is prepared by laser cutting a metal plate or an acrylic plate; then, the mask plate is placed on top of the silicon substrate, and an aluminum material is sputtered on top of the positive electrode in the electrode area by magnetron sputtering technology to form an aluminum film on top of the positive electrode, that is, a positive current collector plate made of aluminum is obtained. In addition, the material of the positive current collector plate can also be prepared on the surface of the positive electrode by thin film deposition, chemical thin film deposition, material transfer, material coating, etc.

[0109] S370: magnetron sputtering an ITO film on the upper surface of the functional layer to form a top electrode of the energy component;

[0110] First, a mask that can expose the energy area S4 of the substrate area is prepared by laser cutting a metal plate or an acrylic plate; then, the mask is placed above the silicon substrate, and a top electrode is prepared in the energy area S4 by magnetron sputtering technology, that is, an ITO film is magnetron sputtered on the surface of the functional layer to form a top electrode of the energy component on the surface of the functional layer. Specifically, the top electrode can be selected from other transparent conductive films other than ITO, and the two electrode materials include but are not limited to inorganic films, organic films, metal films, etc. In addition, the material of the top electrode can also be prepared on the surface of the functional layer by thin film deposition, chemical thin film deposition, material transfer, material coating, etc.

[0111] S380: magnetron sputtering a copper film on the lower surface of the negative electrode to form a negative current collecting plate of the micro-battery assembly, wherein the negative current collecting plate is connected to the first end of the adapter.

[0112] First, a mask plate that can expose the entire electrode area S1 and part of the transition area S2 is prepared by laser cutting a metal plate or an acrylic plate; then, the mask plate is placed on the lower surface of the silicon substrate to expose the entire lower surface of the electrode area S1 and part of the lower surface of the transition area S2; finally, a copper film is sputtered on the lower surface of the electrode area S1 and part of the lower surface of the transition area S2 by magnetron sputtering technology to form a negative current collector plate on the lower surface of the silicon substrate. Specifically, the negative current collector plate extends from the lower surface of the electrode area S1 to the lower surface of the transition area S2, and the negative current collector plate contacts the copper bump of the first end of the adapter of the transition area S2, so that the adapter made of copper material electrically connects the negative current collector plate to the power management chip.

[0113] like Figure 8 As shown, S400: a power management chip is set on the upper surface of the substrate area, the input end of the power management chip is electrically connected to the top electrode and the bottom electrode, the battery transmission end of the power management chip is electrically connected to the positive current collecting plate and the negative current collecting plate, and the external transmission end of the power management chip is used to connect an external load.

[0114] First, the power management chip is bonded to the upper surface of the power management chip S3 in the substrate area by eutectic bonding; then, the a and b ends of the input end of the power management chip are respectively connected to the top electrode and the bottom electrode of the energy unit by welding wires, and the c and d ends of the battery transmission end of the power management chip are respectively connected to the positive current collecting plate of the microbattery unit and the copper bump of the second end of the adapter by welding wires, wherein the d end is connected to the negative current collecting plate through the adapter, and the e and f ends of the external transmission end of the power management chip can be respectively connected to the external load by welding wires. Specifically, the external load can be an external charging device, or the external load is an electronic power-consuming device.

[0115] When the energy component acquires external energy through the functional layer, the energy component generates current, and transmits the current signal to the power management chip by connecting the top electrode to the input end a and the bottom electrode to the input end b. The power management chip processes the current signal, and then transmits the processed current signal to the micro-battery component through the c and d ends of the battery transmission end, and stores it in situ in the micro-battery component. When the external transmission end of the power management chip is connected to an external charging device, the external charging device transmits electric energy to the power management chip through the e and f ends of the external transmission end, and transmits it to the micro-battery component through the c and d ends of the battery transmission end of the power management chip, and stores it. When the external transmission end of the power management chip is connected to an electronic power-consuming device, the micro-battery component transmits electric energy to the power management chip through the positive current collector plate and the negative current collector plate, and transmits electric energy to the electronic power-consuming device through the external transmission end of the power management chip to power the electronic power-consuming device.

[0116] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A micro energy system, characterized in that: The micro energy system comprises: A silicon substrate, comprising an electrode region, a transfer region and a substrate region connected in sequence; A microbattery assembly, the microbattery assembly comprising a positive current collector plate, a positive electrode, an electrolyte layer, a negative electrode and a negative current collector plate stacked in sequence, the electrode region forming at least a portion of the negative electrode; wherein the positive current collector plate, the positive electrode and the electrolyte layer are arranged on the upper surface of the electrode region of the silicon substrate, and the negative current collector plate is arranged on the lower surface of the electrode region of the silicon substrate; A transition piece, wherein the transition area has a through hole penetrating along the thickness direction of the silicon substrate, and the transition piece extends along the length of the through hole to the upper and lower surfaces of the transition area, wherein the first end of the transition piece extends to the lower surface of the transition area, the second end of the transition piece extends to the upper surface of the transition area, and the first end of the transition piece is electrically connected to the negative electrode current collecting plate; A power management chip, the power management chip is arranged on the upper surface of the substrate area, the battery transmission end of the power management chip is electrically connected to the positive electrode current collecting plate and the second end of the adapter, and the power management chip also has an external transmission end, and the external transmission end is used to connect an external load; An energy component, wherein the energy component is disposed on the upper surface of the substrate area, the power management chip is located between the adapter and the energy component, the energy component is electrically connected to the input end of the power management chip, and the energy component is used to collect external energy.

2. The micro energy system according to claim 1, characterized in that: Along the direction from top to bottom of the micro energy system, the energy component includes a top electrode, a functional layer and a bottom electrode connected in sequence, the bottom electrode is arranged on the upper surface of the substrate area, the top electrode and the bottom electrode are electrically connected to the input end of the power management chip respectively, and the functional layer is used to collect at least one of light energy, thermal energy, mechanical energy, chemical energy, electromagnetic energy and sound energy.

3. The micro energy system according to claim 1, characterized in that: The negative electrode includes a negative electrode body and a plurality of protrusions, wherein the plurality of protrusions are arranged on the upper surface of the negative electrode body.

4. The micro energy system according to claim 3, characterized in that: The plurality of protrusions are arranged in an array.

5. A method for preparing a micro energy system, used for preparing the micro energy system according to any one of claims 1 to 4, characterized in that: The preparation method comprises: Dividing the silicon substrate into an electrode region, a transfer region and a substrate region; A transition piece is prepared in the transition area, wherein the transition piece penetrates the thickness direction of the silicon substrate; The negative electrode, electrolyte layer, positive electrode, positive electrode current collector and negative electrode current collector of the microbattery assembly are prepared in the electrode area, and the bottom electrode, functional layer and top electrode of the energy assembly are prepared in sequence on the upper surface of the substrate area; A power management chip is arranged on the upper surface of the substrate area, and the input end of the power management chip is electrically connected to the top electrode and the bottom electrode, the battery transmission end of the power management chip is electrically connected to the positive electrode current collecting plate, and the battery transmission end of the power management chip is electrically connected to the negative electrode current collecting plate through the adapter, and the external transmission end of the power management chip is used to connect an external load.

6. The method for preparing a micro energy system according to claim 5, characterized in that: The step of preparing a transfer piece in the transfer area, wherein the transfer piece penetrates the thickness direction of the silicon substrate, specifically includes: Etching a through hole in the transfer area by dry etching; Depositing silicon oxide or silicon nitride on the inner surface of the through hole to form an insulating layer; Depositing tantalum metal or tantalum nitride on the surface of the insulating layer to form a barrier layer; Copper is plated in the through hole forming the barrier layer to form a transition piece penetrating the transition area in the thickness direction.

7. The method for preparing a micro energy system according to claim 5, characterized in that: The method of preparing the negative electrode, electrolyte layer, positive electrode, positive electrode current collector and negative electrode current collector of the microbattery assembly in the electrode area, and preparing the bottom electrode, functional layer and top electrode of the energy assembly on the upper surface of the substrate area specifically includes: Etching the upper surface of the electrode region to form a negative electrode of the microbattery assembly; depositing an electrolyte material on the upper surface of the negative electrode to form an electrolyte layer; Printing a bottom electrode solution on the upper surface of the substrate area, and heat treating to obtain a bottom electrode of the energy component; Printing a functional material solution on the upper surface of the bottom electrode and heat treating it to obtain a functional layer of the energy component; Printing a positive electrode slurry on the upper surface of the electrolyte layer and drying it to obtain a positive electrode of the microbattery assembly; Magnetron sputtering an aluminum film on the upper surface of the positive electrode to form a positive electrode current collector of the micro-battery assembly; Magnetron sputtering an ITO film on the upper surface of the functional layer to form a top electrode of the energy component; A copper film is magnetron sputtered on the lower surface of the negative electrode to form a negative electrode current collecting plate of the micro-battery assembly, and the negative electrode current collecting plate is connected to the first end of the adapter.

8. The method for preparing a micro energy system according to claim 7, characterized in that: The step of depositing an electrolyte material on the upper surface of the negative electrode to form an electrolyte layer specifically comprises: depositing lithium phosphate on the upper surface of the silicon substrate; coating a photoresist on the upper surface of the negative electrode; placing the silicon substrate in ammonia water to remove lithium phosphate; The silicon substrate is placed in an acetone solution to remove the photoresist to form an electrolyte layer.

9. The method for preparing a micro energy system according to claim 7, characterized in that: The step of printing a bottom electrode solution on the upper surface of the substrate area and heat treating to obtain a bottom electrode of the energy component specifically includes: The lanthanum nickelate solution is prepared by a sol-gel method; The lanthanum nickelate solution is printed on the upper surface of the substrate area by screen printing; placing the silicon substrate in an oven for drying; The dried silicon substrate is heated to obtain the bottom electrode of the energy component.

10. The method for preparing a micro energy system according to claim 5, characterized in that: Before dividing the silicon substrate into the electrode area, the transfer area and the substrate area, the method specifically includes: Cleaning silicon substrates; Spin coating photoresist on the upper surface of the silicon substrate; A pattern is formed on the upper surface of the silicon substrate using a mask.

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