Apparatus and method for controlling perpendicularity between micro springs

Abstract

The utility model relates to a device and method for controlling the perpendicularity between micro spring plates, relates to the field of electronic packaging technology, is used for corresponding welding of the substrate with multiple micro springs and PBC plate, and contains substrate pedestal, positioning plate and glue injection frame, the top of substrate pedestal is equipped with the positioning groove for positioning the substrate, and the both sides of substrate pedestal to the positioning groove are equipped with the guide column, and substrate pedestal is equipped with the glue injection frame corresponding the position of substrate, the bottom of positioning plate is equipped with the guide hole corresponding adaptation with two guide columns, and the position between two guide holes of positioning plate is arranged with multiple positioning convex columns for positioning micro spring in array, and the length of positioning convex column is 15-20% of the length of micro spring, the utility model passes through the water-soluble filling glue of injection to make micro spring have rigidity, so as to ensure the accurate butt joint of micro spring and PBC plate welding point when micro spring is welded with PBC plate, and can effectively ensure the perpendicularity of micro spring and PBC plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic packaging, in particular to a device and method for controlling the perpendicularity between micro spring plates. BACKGROUND

[0002] The spring contact of the micro spring solder column has better impact resistance, vibration resistance, flexibility and other characteristics, especially the ability to resist large deformation in the Z direction, which provides better flexibility for interlayer spring contact array interconnection in high temperature and harsh environments, and is increasingly concerned by high reliability packaging. However, the micro spring itself is small in quality and poor in stability, and is easily offset by external force, so it is more difficult to achieve micro spring vertical interconnection than solder column. Especially when CCGA uses micro spring pins for interconnection, the number of micro spring arrays is large, and the clamping and welding process of the micro spring conversion tooling is poor in controllability, which leads to problems such as micro spring offset, poor coplanarity and large inclination, and further leads to poor solder joint reliability due to the deviation of micro spring pins of CCGA devices from the pads during assembly with the PCB. Therefore, the micro spring assembly precision control technology is extremely important.

[0003] A Chinese patent (publication number: CN114698265A) discloses a method and device for controlling the perpendicularity between micro spring plates. The patent fixes a PCB on which solder is applied and micro springs are placed; compresses all micro springs at the same time and then re-solders them to the PCB; fixes another PCB on which solder is applied, flips the PCB on which the micro springs are soldered, and makes the micro springs align with the solder points of the other PCB and move downward, so that the micro springs are compressed and then re-soldered to the PCB. However, the patent ignores factors such as micro spring tolerance, guide column tolerance, micro spring inclination and poor micro spring stiffness, which leads to problems such as micro spring offset and micro spring position not being well solved. SUMMARY

[0004] In order to overcome the deficiencies in the background art, the present application discloses a device for controlling the perpendicularity between micro spring plates.

[0005] To achieve the above-mentioned application purposes, the present application adopts the following technical solutions:

[0006] A device for controlling the perpendicularity between micro spring plates is used to make a substrate on which a plurality of micro springs are soldered correspondingly soldered to a PBC plate, and comprises a substrate base, a positioning plate and a glue injection frame. The substrate base is provided at the top with a positioning groove for positioning the substrate, and the substrate base is provided on both sides of the positioning groove with guide columns. The substrate base is provided at a position corresponding to the substrate with a glue injection frame. The positioning plate is provided at the bottom with guide holes corresponding to and adapted to the two guide columns, and the positioning plate is provided between the two guide holes at a position corresponding to the guide holes with a plurality of positioning protruding columns for positioning the micro springs. The length of the positioning protruding columns is 15-20% of the length of the micro springs, the diameter of the column body at the end of the positioning protruding columns connected to the positioning plate is not less than the inner diameter of the micro springs, and the end of the positioning protruding columns away from the positioning plate is provided with a chamfered or rounded structure.

[0007] The method for using the device for controlling the verticality between micro-spring plates comprises the following steps:

[0008] S1. Position the substrate: place the substrate in the positioning groove of the substrate base, and place the glue injection frame at the substrate position so that the bottom of the glue injection frame is sealed with the top of the substrate base;

[0009] S2. Microspring positioning: install the positioning plate on the guide column and insert the positioning boss into the top of the microspring;

[0010] S3, glue injection and curing, injecting water-soluble filling glue into the glue injection frame, and heating and curing the water-soluble filling glue according to the water-soluble filling glue heating and curing process;

[0011] S4, reflow soldering, first remove the positioning plate and the glue injection frame, clean the top of the solidified micro spring, place the PBC board printed with solder paste on the top of the micro spring, then send it into the reflow soldering furnace for soldering, and then cool it down and take it out;

[0012] S5. Cleaning and inspection: dissolve and remove the water-soluble filling glue, then clean and dry the substrate, and check whether the PBC board and micro spring welding results meet the standards.

[0013] Preferably, the water-soluble filling glue in step S3 is 98316UV glue.

[0014] Preferably, a separation plate for separating the microspring from the positioning boss is provided at the bottom of the positioning plate, and openings are provided on the surface of the separation plate at positions corresponding to the positioning boss and the guide column.

[0015] Preferably, handles are provided on both sides of the top of the positioning plate.

[0016] Preferably, positioning pins are provided on both sides of the top of the separation plate, and pin holes corresponding to the positioning pins are provided at positions of the positioning plate corresponding to the positioning pins, and the positioning pins can pass through the corresponding pin holes.

[0017] Preferably, a mounting plate for positioning the PBC board is included, and a clamping groove for positioning the PBC board is provided on the mounting plate surface; guide openings corresponding to the two guide columns are provided on both sides of the mounting plate corresponding to the clamping groove.

[0018] Preferably, one side of the top of the glue injection frame is connected to an overflow pipe; and ear plates corresponding to the two guide columns are provided on both sides of the glue injection frame.

[0019] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects:

[0020] The device for controlling the perpendicularity between micro spring plates has simple structure, is easy to assemble, has low production cost and high yield; the glue injection frame is arranged at the position corresponding to the substrate on the substrate base, the glue injection frame is arranged at the substrate position, the bottom of the glue injection frame is sealed with the top of the substrate base, water-soluble filling glue is injected into the glue injection frame, the water-soluble filling glue is heated and solidified according to the water-soluble filling glue heating and solidification process, so that the micro spring has rigidity, so as to ensure the accurate butt joint of the micro spring and the welding point on the PBC plate when the micro spring is welded with the PBC plate, and the perpendicularity of the micro spring and the PBC plate can be effectively ensured; further, the overflow pipe is communicated with one side of the top of the glue injection frame, so that the glue injection height can be effectively controlled.

[0021] Further, the separating plate for separating the micro spring from the positioning convex column is arranged at the bottom of the positioning plate, so that the positioning convex column does not pull the micro spring when the positioning plate is removed after welding, so that the micro spring is deformed or directly separated from the substrate.

[0022] The mounting plate for positioning the PBC plate is further arranged, the plate surface of the mounting plate is provided with the clamping groove for positioning the PBC plate, so that the PBC plate can be mounted in the clamping groove, so that the position of the PBC plate can be accurately positioned; the mounting plate is provided with the guide hole corresponding to the two guide columns on the two sides corresponding to the clamping groove, the mounting plate can be mounted on the guide column and moved up and down along the guide column, so that the PBC plate can be accurately butt jointed with the micro spring. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a structural schematic view of the present application;

[0024] Figure 2 It is a sectional view of the present application;

[0025] Figure 3 It is a structural schematic view of the substrate welded with the micro spring;

[0026] Figure 4 It is a state schematic view when the PBC plate is welded.

[0027] In the figure: 1, substrate; 2, micro spring; 3, substrate base; 4, positioning plate; 5, guide column; 6, positioning convex column; 7, separating plate; 8, handle; 9, positioning pin; 10, mounting plate; 11, glue injection frame; 12, overflow pipe. DETAILED DESCRIPTION

[0028] The application can be explained in detail by the following examples, the purpose of the disclosure is to protect all technical improvements within the scope of the application, in the description of the application, it is understood that if the terms "up", "down", "front", "back", "left", "right" and the like indicate the orientation or position relationship, only corresponds to the drawings of the application, in order to facilitate the description of the application, and not indicate or imply that the device or element must have a particular orientation.

[0029] Embodiment 1, combined with the attached Figures 1-3 A device and method for controlling the verticality between micro springs, for corresponding welding of a substrate 1 with a plurality of micro springs 2 and a PBC plate; comprising a substrate base 3 and a positioning plate 4; the top of the substrate base 3 is provided with a positioning groove for positioning the substrate 1, that is, the substrate 1 can be placed in the positioning groove during use, so as to accurately determine the position of the substrate 1.

[0030] The substrate base 3 is provided with a guide column 5 on both sides of the positioning groove; the bottom of the positioning plate 4 is provided with a guide hole corresponding to the two guide columns 5, that is, the guide column 5 can be inserted into the two guide holes of the positioning plate 4, so that the positioning plate 4 can move vertically up and down along the guide column 5. The positioning plate 4 is arranged with a plurality of positioning convex columns 6 for positioning the micro spring 2 between the positions corresponding to the two guide holes, and the positioning convex column 6 is connected to the positioning plate 4 at one end of the column body with a diameter not less than the inner diameter of the micro spring 2;

[0031] It should be noted that the end of the positioning convex column 6 away from the positioning plate 4 is treated with a reverse right angle or a reverse round angle, so as to facilitate the fitting of the micro spring 2 on the column body of the positioning convex column 6; since the positioning convex column 6 is connected to the positioning plate 4 at one end of the column body with a diameter not less than the inner diameter of the micro spring 2, the micro spring 2 can be tightly inserted with the positioning convex column 6, and this tight connection mode is particularly important, which is the key to ensuring the subsequent welding quality. The tight insertion of the micro spring 2 with the positioning convex column 6 can ensure the verticality of the micro spring 2 with the substrate 1 by the verticality of the positioning convex column 6 with the substrate 1, and can determine the position of the micro spring 2 by the positioning convex column 6 and ensure the verticality of the micro spring 2.

[0032] It should be noted that the length of the positioning convex column 6 is 15-20% of the length of the micro spring 2.

[0033] The glue injection frame 11 is arranged at the position corresponding to the substrate 1 of the substrate base 3, that is, the glue injection frame 11 can be placed at the position of the substrate 1, the bottom of the glue injection frame 11 is sealed with the top of the substrate base 3, water-soluble filling glue is injected into the glue injection frame 11, the water-soluble filling glue is heated and solidified according to the water-soluble filling glue heating and solidifying process, so that the micro spring 2 has rigidity, so as to ensure that the micro spring 2 is precisely connected with the welding point on the PBC plate when the micro spring 2 is welded with the PBC plate, and the perpendicularity of the micro spring 2 and the PBC plate can be effectively ensured; further, the overflow pipe 12 is communicated with one side of the top of the glue injection frame 11, so that the glue injection height can be effectively controlled; the ear plates corresponding to the two guide columns 5 are arranged on both sides of the glue injection frame 11, that is, the glue injection frame 11 can be installed on the guide column 5 through the ear plate, so that the position of the glue injection frame 11 can be accurately positioned.

[0034] The use method of the device for controlling the perpendicularity between the micro spring plates comprises the following steps:

[0035] S1, positioning the substrate 1, placing the substrate 1 in the positioning groove of the substrate base 3, and placing the glue injection frame 11 at the position of the substrate 1, so that the bottom of the glue injection frame 11 is sealed with the top of the substrate base 3;

[0036] S2, positioning the micro spring 2, installing the positioning plate 4 on the guide column 5, and inserting the positioning convex column 6 into the top of the micro spring 2;

[0037] S3, glue injection and solidification, water-soluble filling glue is injected into the glue injection frame 11, and the water-soluble filling glue is heated and solidified according to the water-soluble filling glue heating and solidifying process; preferably, the water-soluble filling glue is 98316 UV glue, the curing temperature is 50-80℃, and the curing time is 0.5-3h, and the 98316 UV glue can be removed by hydrolysis subsequently;

[0038] S4, reflow soldering, first remove the positioning plate 4 and the glue injection frame 11, clean the top of the solidified micro spring 2, place the PBC plate printed with tin paste on the top of the micro spring 2, and then send it into the reflow soldering furnace for welding, and then cool and take out;

[0039] S5, cleaning and inspection, the water-soluble filling glue is dissolved and removed, and then the substrate 1 is cleaned and dried, and whether the welding result of the PBC plate and the micro spring 2 meets the standard is checked.

[0040] In the actual use process, it is found that because the diameter of the one end column body connected with the positioning convex column 6 and the positioning plate 4 is not less than the inner diameter of the micro spring 2, the micro spring 2 is difficult to separate from the positioning convex column 6;

[0041] The drawings are combined Figure 2A device for controlling the verticality between micro spring plates, which is different from the device of embodiment 1 in that the bottom of the positioning plate 4 is provided with a separation plate 7 for separating the micro spring 2 from the positioning protruding column 6 on the basis of embodiment 1, the separation plate 7 is provided with an opening corresponding to the positions of the positioning protruding column 6 and the guide column 5, that is, the separation plate 7 can move away from the positioning plate 4 along the guide column 5, so that the micro spring 2 tightly sleeved with the positioning protruding column 6 is separated from the positioning protruding column 6, preventing the positioning protruding column 6 from pulling the micro spring 2 when the positioning plate 4 needs to be removed after welding, causing the micro spring 2 to deform, or causing the micro spring 2 to directly separate from the substrate 1;

[0042] It should be noted that the hole diameter of the opening corresponding to the separation plate 7 and the positioning protruding column 6 is smaller than the outer diameter of the micro spring 2, so that the micro spring 2 can be separated from the positioning protruding column 6; the opening corresponding to the separation plate 7 and the guide column 5 is used to ensure that the separation plate 7 can move vertically up and down along the guide column 5 by using the guiding function of the guide column 5.

[0043] Embodiment 3, combined with the accompanying drawings Figure 4 A device for controlling the verticality between micro spring plates, which is different from the device of embodiment 1 in that the mounting plate 10 for positioning the PBC plate is further included on the basis of embodiment 1 or 2, the mounting plate 10 is provided with a clamping groove on the surface for positioning the PBC plate, that is, the PBC plate can be installed in the clamping groove, so as to accurately position the position of the PBC plate; the two sides of the mounting plate 10 corresponding to the clamping groove are provided with guide openings corresponding to the two guide columns 5, the mounting plate 10 can be installed on the guide column 5 and move up and down along the guide column 5, so as to accurately butt joint the PBC plate and the micro spring 2.

[0044] Embodiment 4, combined with the accompanying drawings Figures 1-2 A device for controlling the verticality between micro spring plates, which is different from the device of embodiment 1 in that the mounting plate 10 for positioning the PBC plate is further included on the basis of embodiment 1 or 2, the mounting plate 10 is provided with a clamping groove on the surface for positioning the PBC plate, that is, the PBC plate can be installed in the clamping groove, so as to accurately position the position of the PBC plate; the two sides of the mounting plate 10 corresponding to the clamping groove are provided with guide openings corresponding to the two guide columns 5, the mounting plate 10 can be installed on the guide column 5 and move up and down along the guide column 5, so as to accurately butt joint the PBC plate and the micro spring 2.

[0045] The top of the separation plate 7 is provided with a positioning pin 9 on both sides, the position corresponding to the positioning pin 9 of the positioning plate 4 is provided with a pin hole corresponding to the positioning pin 9, and the positioning pin 9 can pass through the corresponding pin hole, that is, through the corresponding cooperation of the positioning pin 9 and the corresponding pin hole of the positioning plate 4, the position of the separation plate 7 can be accurately positioned, and at the same time, when the micro spring 2 is separated from the positioning protruding column 6, the separation plate 7 can be moved downward relative to the positioning plate 4 by pressing the positioning pin 9, which is convenient to operate.

[0046] The present application is not limited to the details of the foregoing exemplary embodiments and can be practiced with modification and alteration within the scope of the appended claims. Thus, the application is not to be limited to the details shown, as particularly provided in the above description, as these could vary in many ways.

Claims

1. A device for controlling the verticality between micro spring plates, used for welding a substrate (1) having a plurality of micro springs (2) welded thereon to a PBC plate, characterized in that: The invention comprises a substrate base (3), a positioning plate (4) and a glue injection frame (11); a positioning groove for positioning the substrate (1) is provided on the top of the substrate base (3); guide posts (5) are provided on both sides of the positioning groove of the substrate base (3); a glue injection frame (11) is provided at a position of the substrate base (3) corresponding to the substrate (1); a guide hole corresponding to the two guide posts (5) is provided at the bottom of the positioning plate (4); a plurality of positioning bosses (6) for positioning the microspring (2) are arranged in an array at positions between the two guide holes of the positioning plate (4); the length of the positioning bosses (6) is 15-20% of the length of the microspring (2); the diameter of the column body of the end of the positioning boss (6) connected to the positioning plate (4) is not less than the inner diameter of the microspring (2), and the end of the positioning boss (6) facing away from the positioning plate (4) is provided with a chamfer or rounded structure.

2. The method for using the device for controlling verticality between micro-spring plates according to claim 1, wherein: The following steps are involved: S1, positioning the substrate (1), placing the substrate (1) in the positioning groove of the substrate base (3), and placing the glue injection frame (11) at the position of the substrate (1), so that the bottom of the glue injection frame (11) is sealed with the top of the substrate base (3); S2, positioning the microspring (2), installing the positioning plate (4) on the guide column (5), and inserting the positioning boss (6) into the top of the microspring (2); S3, glue injection and curing, injecting water-soluble filling glue into the glue injection frame (11), and heating and curing the water-soluble filling glue according to the water-soluble filling glue heating and curing process; S4, reflow soldering, first remove the positioning plate (4) and the glue injection frame (11), clean the top of the solidified micro spring (2), place a PBC board printed with solder paste on the top of the micro spring (2), then send it into the reflow soldering furnace for soldering, and then cool it down and take it out; S5. Cleaning and inspection: dissolve and remove the water-soluble filling glue, then clean and dry the substrate (1), and check whether the welding results of the PBC board and the micro spring (2) meet the standards.

3. The method for using the device for controlling verticality between micro-spring plates according to claim 2, wherein: The water-soluble filling glue in step S3 is 98316UV glue.

4. The device for controlling verticality between micro-spring plates according to claim 1, wherein: A separation plate (7) for separating the microspring (2) from the positioning boss (6) is provided at the bottom of the positioning plate (4), and openings are provided on the surface of the separation plate (7) at positions corresponding to the positioning boss (6) and the guide column (5).

5. The device for controlling verticality between micro-spring plates according to claim 1, wherein: Handles (8) are provided on both sides of the top of the positioning plate (4).

6. The device for controlling verticality between micro-spring plates according to claim 4, wherein: Positioning pins (9) are provided on both sides of the top of the separation plate (7), and pin holes corresponding to the positioning pins (9) are provided on the positioning plate (4) at positions corresponding to the positioning pins (9), and the positioning pins (9) can pass through the corresponding pin holes.

7. The device for controlling verticality between micro-spring plates according to claim 1, wherein: It also includes a mounting plate (10) for positioning the PBC board, wherein the mounting plate (10) is provided with a clamping groove for positioning the PBC board on its surface; and guide openings corresponding to the two guide columns (5) are provided on both sides of the mounting plate (10) corresponding to the clamping groove.

8. The device for controlling verticality between micro-spring plates according to claim 1, wherein: One side of the top of the glue injection frame (11) is connected to an overflow pipe (12); and ear plates corresponding to and adapted to the two guide columns (5) are provided on both sides of the glue injection frame (11).

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