Inverter power supply and power supply method
By setting up a copper plating on the aluminum radiator and welding the circuit to it, the thermal conductivity of the aluminum radiator is used to solve the problem of insufficient heat dissipation performance of the existing power module in high-power scenarios, achieving more efficient heat dissipation effect and power transmission.
Patent Information
- Application Number
- CN202411959971.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2044-12-30
AI Technical Summary
The existing power modules have insufficient heat dissipation performance in high power scenarios, resulting in excessive temperatures, affecting the performance and cost of the module.
An aluminum radiator is used as an indispensable part of the power module, and a copper plating layer is installed on it, and the circuit with large heat generation is directly welded and fixed on the copper plating layer, and the thermal conductivity of the aluminum radiator is used for direct conduction of heat and direct transmission of electrical energy.
It effectively improves the heat dissipation effect of the power module, solves the problem of insufficient heat dissipation performance in high-power scenarios, and ensures the stable transmission of electricity and the efficient operation of the module.
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Figure CN119383933B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and in particular to an inverter power supply and a power supply method. Background Art
[0002] A power module is a module that is encapsulated into a whole by combining high-power semiconductor devices according to certain functional combinations. The power module can realize different functions such as rectification and inversion according to the different semiconductor components encapsulated. Due to its small size, high integration, and convenient function switching, it is widely used in various inverter power supply scenarios that require power conversion.
[0003] For power modules, many related technologies have been proposed in the prior art, such as the patent documents with publication numbers CN221935757U and CN110783323A, which disclose corresponding power modules. The power modules disclosed generally include a copper substrate, a DBC ceramic substrate, a rectifier circuit and an inverter circuit. The rectifier circuit and the inverter circuit are fixed on the DBC ceramic substrate, and the DBC ceramic substrate is fixed on the copper substrate by bolts or welding. The power module using the above structure has the advantages of high integration, small size, stable and reliable performance, and is therefore widely used in related equipment such as welding machines and cutting machines.
[0004] All power modules will generate heat when working, especially the rectifier circuit will generate a lot of heat when working, and the amount of heat generated is proportional to the power. If the heat is too large and there is no time to dissipate it to the surrounding medium, it will fail due to excessive temperature. Therefore, the thermal management of the power module plays a vital role in the performance and cost of the module.
[0005] In order to avoid the overheating of power semiconductor devices, the prior art proposes to cancel the copper substrate, set a copper-plated layer on the aluminum heat sink, and directly solder the DBC ceramic substrate to the copper-plated layer. For example, the patent document with publication number CN210668342U discloses a heat dissipation structure of a semiconductor power module. Since the copper substrate is eliminated, the semiconductor power module can effectively improve the heat dissipation performance. However, after careful analysis, it was found that since there is still a DBC ceramic substrate between the rectifier circuit and the aluminum heat sink, and the thermal conductivity coefficient of the DBC ceramic substrate is 24W / m·K, which is much smaller than the thermal conductivity coefficient of the aluminum heat sink of 260W / m·K, when it is applied to high-power scenarios such as 10-30KW, there is still a technical problem of insufficient heat dissipation performance. Summary of the invention
[0006] In order to overcome the above-mentioned technical problems existing in the prior art, the present invention provides an inverter power supply and a power supply method. The present invention uses an aluminum radiator as an indispensable component of a power module. A copper plating layer is provided on the aluminum radiator, and a circuit with high heat generation is directly welded and fixed on the copper plating layer. The aluminum radiator is used to conduct heat and electricity at the same time to carry out direct conduction of heat and direct transmission of electric energy, which not only ensures the stable transmission of electric energy, but also further improves the heat dissipation effect of the power module, thereby solving the technical problem that the existing power module still has insufficient heat dissipation performance when applied to high-power scenarios.
[0007] To achieve the above purpose, the technical solution adopted by the present invention is as follows:
[0008] In a first aspect, the present invention provides an inverter power supply, comprising a housing, in which a power module, a transformer, a power input module, a positive output module and a negative output module are respectively fixed; wherein:
[0009] The power module includes a three-phase rectifier circuit, an inverter circuit, a secondary rectifier circuit and an independent aluminum heat sink;
[0010] The aluminum radiator is fixed in the housing through an insulating bracket, and a copper plating layer is provided on the aluminum radiator;
[0011] The three-phase rectifier circuit and the inverter circuit are both indirectly welded to the copper-plated layer through the DBC ceramic substrate, the input end and the output end of the three-phase rectifier circuit are electrically connected to the power input module and the input end of the inverter circuit respectively, and the output end of the inverter circuit is connected to the primary of the transformer;
[0012] The secondary rectifying circuit comprises a plurality of Frd chips which are first connected in series and then in parallel, each Frd chip is directly soldered on the copper-plated layer, the negative electrode of each Frd chip faces the copper-plated layer, and the positive electrode of each chip faces away from the copper-plated layer; the positive electrode of the secondary rectifying circuit is electrically connected to the secondary of the transformer, and the negative electrode of the secondary rectifying circuit is electrically connected to the aluminum radiator through the copper-plated layer;
[0013] The positive output module and the negative output module are electrically connected to the aluminum heat sink and the transformer secondary through conductive sheets respectively;
[0014] The three-phase rectifier circuit is used to rectify external three-phase alternating current into direct current, the inverter circuit is used to invert direct current into alternating current required by the primary of the transformer, the secondary of the transformer is used to output in two ways, one way is output to the negative output module through the conductive sheet, and the other way is output to the secondary rectifier circuit, the secondary rectifier circuit is used to rectify the alternating current provided by the transformer into direct current, and output it to the positive output module through the copper plating layer, the aluminum heat sink and the conductive sheet in sequence.
[0015] The aluminum radiator is provided with fins on one side and a smooth plane on the other side, and the copper plating layer is arranged on the smooth plane.
[0016] The aluminum heat sink is fixed to the corresponding conductive sheet by bolts.
[0017] A cooling fan facing the aluminum radiator is fixed on the casing, and an insulating air duct is fixed between the aluminum radiator and the cooling fan.
[0018] In a second aspect, the present invention provides an inverter power supply, comprising a housing, in which a power module, a transformer, a power input module, a positive output module and a negative output module are respectively fixed; wherein:
[0019] The power module includes an insulating support, a three-phase rectifier module, an inverter module and a secondary rectifier module. The three-phase rectifier module includes a first aluminum radiator, a second aluminum radiator and a three-phase rectifier circuit. The inverter module includes a third aluminum radiator and an inverter circuit. The secondary rectifier module includes a fourth aluminum radiator and a secondary rectifier circuit. The first aluminum radiator, the second aluminum radiator, the third aluminum radiator and the fourth aluminum radiator are all fixed on the insulating support at intervals. The first aluminum radiator, the second aluminum radiator, the third aluminum radiator and the fourth aluminum radiator are all provided with a copper plating layer.
[0020] The three-phase rectifier circuit includes six rectifier diode chips, wherein the cathode surfaces of three rectifier diode chips are welded on the copper-plated layer of the first aluminum radiator to form a common cathode group structure, and the anode surfaces of the remaining three rectifier diode chips are welded on the copper-plated layer of the second aluminum radiator to form a common anode group structure, and the first aluminum radiator and the second aluminum radiator are electrically connected to the input end of the inverter circuit as the positive output end and the negative output end respectively; the anode surfaces of the three rectifier diode chips on the first aluminum radiator are connected to the cathode surfaces of the three rectifier diode chips on the second aluminum radiator one by one through wires, and then connected to the power input module through wires;
[0021] The inverter circuit is indirectly welded to the copper-plated layer of the third aluminum radiator through a DBC ceramic substrate, and the output end of the inverter circuit is connected to the primary of the transformer;
[0022] The secondary rectifying circuit comprises a plurality of Frd chips which are first connected in series and then in parallel, each Frd chip is directly soldered on the copper-plated layer of the fourth aluminum radiator, the negative electrode of each Frd chip faces the copper-plated layer, and the positive electrode of each chip faces away from the copper-plated layer; the positive electrode of the secondary rectifying circuit is electrically connected to the secondary of the transformer, and the negative electrode of the secondary rectifying circuit is electrically connected to the fourth aluminum radiator through the copper-plated layer;
[0023] The positive output module and the negative output module are electrically connected to the fourth aluminum heat sink and the transformer secondary through conductive sheets respectively;
[0024] The three-phase rectifier circuit is used to rectify the external three-phase alternating current into direct current and output it to the inverter circuit through the first aluminum radiator and the second aluminum radiator. The inverter circuit is used to invert the direct current into the alternating current required by the primary of the transformer. The secondary of the transformer is used to output in two ways, one way is output to the negative output module through the conductive sheet, and the other way is output to the secondary rectifier circuit. The secondary rectifier circuit is used to rectify the alternating current provided by the transformer into direct current, and output it to the positive output module through the copper plating layer, the fourth aluminum radiator and the conductive sheet in sequence.
[0025] The three-phase rectifier module, inverter module and secondary rectifier module are arranged in sequence on the insulating bracket, a first heat-resistant insulator is fixed between the first aluminum radiator and the second aluminum radiator, a second heat-resistant insulator is provided between the first aluminum radiator and the third aluminum radiator and between the second aluminum radiator and the third aluminum radiator, a third heat-resistant insulator is provided between the third aluminum radiator and the fourth aluminum radiator, and the first heat-resistant insulator is provided with a transfer channel which is respectively connected to the air duct of the first aluminum radiator and the air duct of the second aluminum radiator.
[0026] The housing is fixed with cooling fans facing the three-phase rectifier module, the inverter module and the secondary rectifier module respectively, and an insulating air duct is fixed between the power module and the cooling fan.
[0027] The fourth aluminum heat sink is fixed to the corresponding conductive sheet by bolts.
[0028] In a third aspect, the present invention provides a power supply method of an inverter power supply, comprising the following steps:
[0029] Step A: Turn on the power input module to connect the three-phase rectifier circuit to the external three-phase AC power supply. After the three-phase rectifier circuit rectifies the external three-phase AC power into DC power, it is connected to the capacitor C through the functional terminals U+ and U-, and after being filtered by the capacitor C, it is output to the inverter circuit;
[0030] Step B: The inverter circuit inverts the DC power into AC power and outputs it to the primary of the transformer through the functional terminals MFAC1 and MFAC2;
[0031] Step C: The secondary of the transformer is divided into two output paths, one path is output to the negative output module through the reactor and the conductive sheet in sequence for power supply, and the other path is output to the secondary rectification circuit through the functional terminals DA1, DA2, DA3, and DA4;
[0032] Step D: The secondary rectification circuit rectifies the AC power provided by the transformer into DC power, and outputs it to the positive output module through the copper-plated layer, aluminum heat sink and conductive sheet in sequence for power supply.
[0033] By adopting the above technical solution, the beneficial technical effects of the present invention are:
[0034] 1. The inverter power supply provided by the present invention adopts two power modules with different structures, wherein:
[0035] The first power module uses an independent aluminum heat sink, and a copper layer is arranged on the independent aluminum heat sink. The three-phase rectifier circuit and the inverter circuit are indirectly welded on the copper layer, and the secondary rectifier circuit is directly welded on the copper layer.
[0036] The second power module uses four independent aluminum heat sinks, all of which are provided with copper-plated layers. The chips of the three-phase rectifier circuit are directly soldered to the copper-plated layers of two of the aluminum heat sinks, the inverter circuit is indirectly soldered to the copper-plated layer of one aluminum heat sink, and the chip of the secondary rectifier circuit is directly soldered to the copper-plated layer of another aluminum heat sink.
[0037] It should be noted that when the power module is running, the secondary rectifier circuit generates the most heat, followed by the three-phase rectifier circuit, and the inverter circuit generates less heat. The above two power modules provided by the present invention both specifically use copper plating and aluminum heat sinks as thermal and electrical conductors. Compared with the prior art, the DBC ceramic substrate structure and heat conducting parts are partially reduced, so even when applied to high-power scenarios such as 10-30KW, the heat dissipation effect of the power module can be effectively improved.
[0038] It should also be noted that the second power module mentioned above uses four independent aluminum heat sinks, so its production cost is higher and the installation process is more complicated compared to the first power module which only uses one independent aluminum heat sink. However, on the one hand, since the three-phase rectifier circuit eliminates the DBC ceramic substrate and the corresponding installation process, it can also reduce the production cost to a certain extent. On the other hand, since each circuit uses an independent aluminum heat sink, the heat dissipation effect of each circuit can be maximized, which is conducive to further improving the heat dissipation effect of the power module, and is particularly suitable for space-constrained application scenarios such as submarine optical fiber pipeline welding, oil pipeline, and natural gas pipeline welding.
[0039] In summary, the present invention regards the aluminum heat sink as an indispensable component of the power module. A copper plating layer is provided on the aluminum heat sink, and the circuit with high heat generation is directly welded and fixed on the copper plating layer. The aluminum heat sink is used to conduct heat and electricity at the same time to carry out direct conduction of heat and direct transmission of electric energy, which not only ensures the stable transmission of electric energy, but also further improves the heat dissipation effect of the power module when applied to high-power scenarios.
[0040] In addition, the technical effect of the power supply method of the present invention is substantially the same as the technical effect of the above-mentioned inverter power supply, and will not be described in detail.
[0041] 2. The present invention achieves the fixation between the aluminum heat sink and the corresponding conductive sheet by means of bolts, which has the advantage of improving the stability of the connection between the aluminum heat sink and the conductive sheet, and is conducive to ensuring the stability of power supply.
[0042] 3. The present invention is beneficial to improving the concentration and efficiency of heat dissipation through the heat dissipation fan and the insulated air duct.
[0043] 4. The present invention provides a heat-resistant insulator between each aluminum heat sink, which is beneficial to improving the insulation effect of the power module while reducing the overall volume of the power module.
[0044] 5. The present invention can ensure that the cold air generated by the cooling fan always acts strongly on the aluminum radiator through the insulated air duct, which is beneficial to further improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] Figure 1 It is a schematic diagram of the three-dimensional structure inside the casing of the present invention;
[0046] Figure 2 for Figure 1 A schematic diagram of a top view structure;
[0047] Figure 3 Schematic diagram of the three-dimensional structure of the power module (I);
[0048] Figure 4 It is a schematic diagram of the main structure of the three-phase rectifier circuit, inverter circuit and secondary rectifier circuit on the aluminum heat sink;
[0049] Figure 5 for Figure 4 A partial enlarged view of
[0050] Figure 6 It is a top view structural diagram of the functional terminals on the plastic housing of the power module;
[0051] Figure 7 This is a schematic diagram of the structure of the power module (II).
[0052] The markings in the figure are: 1. casing, 2. power module, 3. transformer, 4. power input module, 5. positive output module, 6. negative output module, 7. reactor, 8. capacitor C, 9. three-phase rectifier circuit, 10. inverter circuit, 11. secondary rectifier circuit, 12. insulating bracket, 13. aluminum radiator, 14. copper plating layer, 15. DBC ceramic substrate, 16. conductive sheet, 17. first aluminum radiator, 18. second aluminum radiator, 19. third aluminum radiator, 20. fourth aluminum radiator, 21. first heat-resistant insulator, 22. second heat-resistant insulator, 23. Frd chip, 24. cooling fan, 25. insulating air duct, 26. plastic casing. DETAILED DESCRIPTION
[0053] Example 1
[0054] like Figure 1-2 As shown, this embodiment provides an inverter power supply, which includes a housing 1, in which a power module 2, a transformer 3, a power input module 4, a reactor 7, a capacitor C8, a positive output module 5 and a negative output module 6 are fixed.
[0055] like Figure 3-6 As shown, the power module 2 includes a three-phase rectifier circuit 9, an inverter circuit 10, a secondary rectifier circuit 11, a plastic housing 26 and an independent aluminum heat sink 13. The aluminum heat sink 13 is preferably a fin-type structure and is fixed in the housing through an insulating bracket 12. A copper-plated layer 14 for conducting and conducting heat is provided on the aluminum heat sink 13. The three-phase rectifier circuit 9 and the inverter circuit 10 are both indirectly welded to the copper-plated layer 14 through a DBC ceramic substrate 15. The power input module 4 is used to provide 380V three-phase AC power for the inverter power supply. The input end of the three-phase rectifier circuit 9 is connected to the power input module 4 through functional terminals AC1, AC2 and AC3. The output end of the three-phase rectifier circuit 9 is electrically connected to the capacitor C8 and the inverter circuit 10 through functional terminals U+ and U-, respectively. The three-phase rectifier circuit 9 rectifies the AC power into DC power, and outputs it to the inverter circuit 10 after filtering by the capacitor C8. The output end of the inverter circuit 10 is used to connect to the primary of the transformer 3.
[0056] like Figure 3-6 As shown, the secondary rectifying circuit 11 includes a plurality of Frd chips 23 connected in series and then in parallel, each Frd chip 23 is directly soldered on the copper-plated layer 14, the negative electrode surface of each Frd chip 23 faces the copper-plated layer 14, and the positive electrode surface of each chip faces away from the copper-plated layer 14. The positive electrode of the secondary rectifying circuit 11 is electrically connected to the secondary of the transformer 3 through the functional terminals DA1, DA2, DA3, and DA4, and the negative electrode of the secondary rectifying circuit 11 is electrically connected to the aluminum heat sink 13 through the copper-plated layer 14.
[0057] like Figure 6 As shown, the plastic housing 26 is fixed on the aluminum heat sink 13 , the three-phase rectifier circuit 9 , the inverter circuit 10 and the secondary rectifier circuit 11 are all located in the plastic housing 26 , and the above-mentioned functional terminals are all arranged on the plastic housing 26 .
[0058] like Figure 1-2 As shown, the positive output module 5 is electrically connected to the aluminum heat sink 13 through the conductive sheet 16, and the aluminum heat sink 13 is fixed to the corresponding conductive sheet 16 by bolts, and the negative output module 6 is electrically connected to the secondary of the transformer 3 through the conductive sheet 16 and the reactor 7 in turn.
[0059] The specific functions of the above components are as follows: the three-phase rectifier circuit 9 is used to rectify the external three-phase AC power into DC power and output it to the inverter circuit 10; the inverter circuit 10 is used to invert the DC power into the AC power required by the primary of the transformer 3; the secondary of the transformer 3 is used to output in two ways, one way is output to the negative output module 6 through the inductor 7 and the conductive sheet 16, and the other way is output to the secondary rectifier circuit 11; the secondary rectifier circuit 11 is used to rectify the AC power provided by the transformer 3 into DC power, and output it to the positive output module 5 in turn through the copper plating layer 14, the aluminum heat sink 13 and the conductive sheet 16.
[0060] According to a preferred implementation of this embodiment, the aluminum heat sink 13 is provided with fins on one side and a smooth plane on the other side, and the copper plating layer 14 is arranged on the smooth plane.
[0061] According to an optional implementation of this embodiment, the area of the copper-plated layer 14 is compatible with the area required by the three-phase rectifier circuit 9, the inverter circuit 10 and the secondary rectifier circuit 11, or the area of the copper-plated layer 14 is larger than the area required by the three-phase rectifier circuit 9, the inverter circuit 10 and the secondary rectifier circuit 11.
[0062] According to another preferred implementation of this embodiment, a cooling fan 24 facing the aluminum radiator 13 is fixed on the housing 1, and to ensure a better heat dissipation effect, an insulating air duct 25 is also fixed between the aluminum radiator 13 and the cooling fan 24.
[0063] In this embodiment, the secondary rectifier circuit 11, which generates the most heat when working in the power module 2, is directly welded to the copper-plated layer 14 of the aluminum heat sink 13. It can directly transfer electrical conduction and heat through the copper-plated layer 14 and the aluminum heat sink 13, thereby effectively improving the heat dissipation effect of the power module 2, thereby enabling the inverter power supply to be suitable for use in working conditions with higher power.
[0064] Example 2
[0065] like Figure 1-2 As shown, the present invention provides an inverter power supply, which includes a housing 1, in which a power module 2, a transformer 3, a power input module 4, a reactor 7, a capacitor C8, a positive output module 5 and a negative output module 6 are fixed.
[0066] like Figure 7As shown, the power module 2 includes an insulating bracket 12, a three-phase rectifier module, an inverter module, a plastic shell 26 and a secondary rectifier module. The three-phase rectifier module, the inverter module and the secondary rectifier module are all independent modules. The three-phase rectifier module includes a first aluminum heat sink 17, a second aluminum heat sink 18 and a three-phase rectifier circuit 9; the inverter module includes a third aluminum heat sink 19 and an inverter circuit 10; the secondary rectifier module includes a fourth aluminum heat sink 20 and a secondary rectifier circuit 11; the first aluminum heat sink 17, the second aluminum heat sink 18, the third aluminum heat sink 19 and the fourth aluminum heat sink 20 are all fixed on the insulating bracket 12 at intervals, and the first aluminum heat sink 17, the second aluminum heat sink 18, the third aluminum heat sink 19 and the fourth aluminum heat sink 20 are all provided with a copper plating layer 14.
[0067] Specifically, the three-phase rectifier circuit 9 includes six rectifier diode chips, of which the cathode surfaces of three rectifier diode chips are welded on the copper-plated layer 14 of the first aluminum heat sink 17 to form a common cathode group structure, and the anode surfaces of the remaining three rectifier diode chips are welded on the copper-plated layer 14 of the second aluminum heat sink 18 to form a common anode group structure. The anode surfaces of the three rectifier diode chips on the first aluminum heat sink 17 are connected to the cathode surfaces of the three rectifier diode chips on the second aluminum heat sink 18 one by one through wires, and then connected to the power input module 4 through functional terminals AC1, AC2, AC3 and wires. The first aluminum heat sink 17 and the second aluminum heat sink 18 are electrically connected to the input end of the inverter circuit 10 as a positive conductor and a negative conductor, respectively.
[0068] Furthermore, a positive output terminal electrically connected to the functional terminal U+ is welded on the first aluminum heat sink 17, a negative output terminal electrically connected to the functional terminal U- is welded on the second aluminum heat sink 18, and the output end of the three-phase rectifier circuit 9 is electrically connected to the capacitor C8 and the inverter circuit 10 through the functional terminals U+ and U- respectively. The three-phase rectifier circuit 9 rectifies the alternating current into direct current, and after filtering by the capacitor C8, outputs it to the inverter circuit 10.
[0069] Specifically, the inverter circuit 10 is indirectly soldered to the copper-plated layer 14 of the third aluminum heat sink 19 through the DBC ceramic substrate 15 , and the output end of the inverter circuit 10 is used to be connected to the primary of the transformer 3 .
[0070] Specifically, the secondary rectifying circuit 11 includes a plurality of Frd chips 23 which are first connected in series and then in parallel. Each Frd chip 23 is directly soldered to the copper-plated layer 14 of the fourth aluminum heat sink 20. The negative electrode surface of each Frd chip 23 faces the copper-plated layer 14, and the positive electrode surface of each chip faces away from the copper-plated layer 14. The positive electrode of the secondary rectifying circuit 11 is electrically connected to the secondary of the transformer 3 through the functional terminals DA1, DA2, DA3, and DA4, and the negative electrode of the secondary rectifying circuit 11 is electrically connected to the fourth aluminum heat sink 20 through the copper-plated layer 14.
[0071] It should be noted that the plastic shell 26 in this embodiment is fixed on the first aluminum radiator 17, the second aluminum radiator 18, the third aluminum radiator 19 and the fourth aluminum radiator 20 at the same time, the three-phase rectifier module, the inverter module and the secondary rectifier module are all located in the plastic shell 26, and the above-mentioned functional terminals are all arranged on the plastic shell 26.
[0072] like Figure 1-2 As shown, the positive output module 5 is electrically connected to the fourth aluminum radiator 20 through the conductive sheet 16, and the fourth aluminum radiator 20 is fixed to the corresponding conductive sheet 16 by bolts, and the negative output module 6 is electrically connected to the secondary of the transformer 3 through the conductive sheet 16 and the inductor 7 in turn.
[0073] The specific functions of the above components are as follows: the three-phase rectifier circuit 9 is used to rectify the external three-phase AC power into DC power and output it to the inverter circuit 10 through the first aluminum radiator and the second aluminum radiator. The inverter circuit 10 is used to invert the DC power into the AC power required by the primary of the transformer 3. The secondary of the transformer 3 is used to output in two ways, one way is output to the negative output module 6 through the conductive sheet 16, and the other way is output to the secondary rectifier circuit 11. The secondary rectifier circuit 11 is used to rectify the AC power provided by the transformer 3 into DC power, and output it to the positive output module 5 in turn through the copper plating layer 14, the fourth aluminum radiator 20 and the conductive sheet 16.
[0074] It should be noted that the above-mentioned first aluminum radiator 17, second aluminum radiator 18, third aluminum radiator 19 and fourth aluminum radiator 20 are preferably fin-shaped structures, the first aluminum radiator 17, second aluminum radiator 18, third aluminum radiator 19 and fourth aluminum radiator 20 all have smooth planes, and the copper plating layer 14 is arranged on the smooth planes. The sum of the smooth plane areas of the first aluminum radiator 17 and the second aluminum radiator 18 is compatible with the area required by the three-phase rectifier module, the smooth plane area of the third aluminum radiator 19 is compatible with the area required by the inverter module, and the smooth plane area of the fourth aluminum radiator 20 is compatible with the area required by the secondary rectifier module.
[0075] According to a preferred implementation of this embodiment, Figure 7 As shown, the three-phase rectifier module, the inverter module and the secondary rectifier module are arranged in sequence on the insulating bracket 12, a first heat-resistant insulator 21 is fixed between the first aluminum radiator 17 and the second aluminum radiator 18, a second heat-resistant insulator 22 is fixed between the first aluminum radiator 17 and the third aluminum radiator 19, between the second aluminum radiator 18 and the third aluminum radiator 19, and between the third aluminum radiator 19 and the fourth aluminum radiator 20, and the first heat-resistant insulator 21 is provided with a transfer channel which is respectively connected to the air duct of the first aluminum radiator 17 and the air duct of the second aluminum radiator 18.
[0076] According to another preferred implementation of the present embodiment, cooling fans 24 facing the three-phase rectifier module, the inverter module and the secondary rectifier module are fixed on the casing 1, and an insulating air duct 25 is fixed between the power module 2 and the cooling fan 24. The cooling fan 24 cooperates with the aluminum radiator to further improve the heat dissipation effect of the power module when it is working.
[0077] This embodiment uses four independent aluminum heat sinks, and installs the three-phase rectifier module, inverter module and secondary rectifier module on the copper-plated layer 14 of each independent aluminum heat sink. Compared with the power module 2 of embodiment 1, the production cost of this embodiment is higher and the installation process is more complicated. However, since each circuit uses an independent aluminum heat sink, the heat dissipation effect of each circuit can be maximized, which is conducive to further improving the heat dissipation effect of the power module 2, and is particularly suitable for the application scenario of high-power and small-volume welding machine power supply above 10KW.
[0078] Example 3
[0079] Based on Example 1 or Example 2, this embodiment provides a power supply method of an inverter power supply, which includes the following steps:
[0080] Step A: Turn on the power input module 4 to connect the three-phase rectifier circuit 9 to the external three-phase AC power supply. After the three-phase rectifier circuit 9 rectifies the external three-phase AC power into DC power, it is connected to the capacitor C8 through the functional terminals U+ and U-, and after being filtered by the capacitor C8, it is output to the inverter circuit 10.
[0081] Step B: The inverter circuit 10 inverts the DC power into AC power and outputs it to the primary of the transformer 3 through the functional terminals MFAC1 and MFAC2 on the plastic housing 26 .
[0082] Step C: The secondary output of the transformer 3 is divided into two paths, one path is output to the negative output module 6 through the inductor 7 and the conductive sheet 16 in sequence for power supply, and the other path is output to the secondary rectification circuit 11 through the functional terminals DA1, DA2, DA3, and DA4.
[0083] Step D: The secondary rectifying circuit 11 rectifies the AC power provided by the transformer 3 into DC power, and outputs the DC power to the positive output module 5 through the copper-plated layer 14, the aluminum heat sink and the conductive sheet 16 in sequence for power supply.
[0084] The power supply method described in this embodiment can also effectively improve the heat dissipation effect of the power module 2 because it uses the copper-plated layer 14 and the aluminum heat sink to directly transfer electricity and heat, thereby making the inverter power supply suitable for use in working conditions with higher power.
[0085] Example 4
[0086] This embodiment tests the inverter power supplies of Embodiments 1 and 2 respectively, and tests the heat dissipation structure of the semiconductor power module disclosed in the patent document with publication number CN210668342U as a comparative example, as follows:
[0087] 1. Experimental purpose: Through temperature comparison, verify that the present invention has better heat dissipation performance.
[0088] 2. Experimental process:
[0089] ① Using the same process and batch materials, inverter power supplies using the power modules described in Examples 1 and 2 were respectively manufactured;
[0090] ②. Install the inverter power supply on the same experimental platform and adjust the load to the same resistance value;
[0091] ③. Preset the same output power;
[0092] ④. Pre-embed the K-type probe to the same reference position of each power module;
[0093] ⑤. Use a point thermometer to record relevant data;
[0094] ⑥. The test data obtained are shown in Table 1 below:
[0095] Table 1 Test conditions and test results
[0096]
[0097] From the above tests, it can be seen that according to the characteristics of different heat generation of each circuit when the inverter power supply is running, the present invention adopts a combined technical solution of indirectly soldering to the copper-plated layer 14 through the DBC ceramic substrate 15 and directly soldering to the copper-plated layer 14, and using an aluminum heat sink for thermal and electrical conduction, which can effectively improve the heat dissipation effect of the power module when the inverter power supply is running.
[0098] The above description is only a specific implementation mode of the present invention. Any feature disclosed in this specification, unless otherwise stated, can be replaced by other alternative features that are equivalent or have similar purposes; all the disclosed features, or all the steps in the methods or processes, except for mutually exclusive features and / or steps, can be combined in any way.
Claims
1. An inverter power supply, comprising a housing (1), wherein a power module (2), a transformer (3), a power input module (4), a positive output module (5) and a negative output module (6) are respectively fixed in the housing (1); the characteristics are: The power module (2) comprises an insulating support (12), a three-phase rectifier module, an inverter module and a secondary rectifier module; the three-phase rectifier module comprises a first aluminum radiator (17), a second aluminum radiator (18) and a three-phase rectifier circuit (9); the inverter module comprises a third aluminum radiator (19) and an inverter circuit (10); the secondary rectifier module comprises a fourth aluminum radiator (20) and a secondary rectifier circuit (11); the first aluminum radiator (17), the second aluminum radiator (18), the third aluminum radiator (19) and the fourth aluminum radiator (20) are all fixed on the insulating support (12) at intervals; and the first aluminum radiator (17), the second aluminum radiator (18), the third aluminum radiator (19) and the fourth aluminum radiator (20) are all provided with a copper plating layer (14); The three-phase rectifier circuit (9) comprises six rectifier diode chips, wherein the cathode surfaces of three rectifier diode chips are welded on the copper-plated layer (14) of the first aluminum heat sink (17) to form a common cathode group structure, and the anode surfaces of the remaining three rectifier diode chips are welded on the copper-plated layer (14) of the second aluminum heat sink (18) to form a common anode group structure, and the first aluminum heat sink (17) and the second aluminum heat sink (18) are respectively electrically connected to the input end of the inverter circuit (10) as the positive output end and the negative output end; the anode surfaces of the three rectifier diode chips on the first aluminum heat sink (17) are respectively connected to the cathode surfaces of the three rectifier diode chips on the second aluminum heat sink (18) in a one-to-one correspondence through wires, and then connected to the power input module (4) through wires; The inverter circuit (10) is indirectly welded to the copper-plated layer (14) of the third aluminum heat sink (19) via a DBC ceramic substrate (15), and the output end of the inverter circuit (10) is connected to the primary of the transformer (3); The secondary rectifying circuit (11) comprises a plurality of Frd chips (23) which are first connected in series and then in parallel, each Frd chip (23) being directly soldered to the copper-plated layer (14) of the fourth aluminum heat sink (20), the negative electrode of each Frd chip (23) facing the copper-plated layer (14), and the positive electrode of each chip facing away from the copper-plated layer (14); the positive electrode of the secondary rectifying circuit (11) is electrically connected to the secondary of the transformer (3), and the negative electrode of the secondary rectifying circuit (11) is electrically connected to the fourth aluminum heat sink (20) via the copper-plated layer (14); The positive output module (5) and the negative output module (6) are respectively electrically connected to the fourth aluminum heat sink (20) and the secondary of the transformer (3) via conductive sheets (16); The three-phase rectifier circuit (9) is used to rectify external three-phase alternating current into direct current and output it to the inverter circuit (10) through the first aluminum heat sink (17) and the second aluminum heat sink (18); the inverter circuit (10) is used to invert the direct current into the alternating current required by the primary of the transformer (3); the secondary of the transformer (3) is used to output in two ways, one way is output to the negative output module (6) through the conductive sheet (16), and the other way is output to the secondary rectifier circuit (11); the secondary rectifier circuit (11) is used to rectify the alternating current provided by the transformer (3) into direct current, and output it to the positive output module (5) in sequence through the copper-plated layer (14), the fourth aluminum heat sink (20) and the conductive sheet (16); The three-phase rectifier module, the inverter module and the secondary rectifier module are arranged in sequence on the insulating bracket (12); a first heat-resistant insulator (21) is fixed between the first aluminum radiator (17) and the second aluminum radiator (18); a second heat-resistant insulator (22) is provided between the first aluminum radiator (17) and the third aluminum radiator (19) and between the second aluminum radiator (18) and the third aluminum radiator (19); a third heat-resistant insulator is provided between the third aluminum radiator (19) and the fourth aluminum radiator (20); and the first heat-resistant insulator (21) is provided with a switching channel that communicates with the air duct of the first aluminum radiator (17) and the air duct of the second aluminum radiator (18); The housing (1) is fixed with cooling fans (24) facing the three-phase rectifier module, the inverter module and the secondary rectifier module respectively, and an insulating air duct (25) is fixed between the power module (2) and the cooling fan (24).
2. The inverter power supply according to claim 1, characterized in that: The fourth aluminum heat sink (20) is fixed to the corresponding conductive sheet (16) by means of bolts.
3. A power supply method for an inverter power supply according to claim 1 or 2, characterized in that The following steps are involved: Step A: Turn on the power input module (4) to connect the three-phase rectifier circuit (9) to the external three-phase AC power supply. The three-phase rectifier circuit (9) rectifies the external three-phase AC power into DC power, connects the DC power to the capacitor C (8) through the functional terminals U+ and U-, and outputs the DC power to the inverter circuit (10) after filtering by the capacitor C (8). Step B: the inverter circuit (10) inverts the DC power into AC power and outputs it to the primary of the transformer (3) through the functional terminals MFAC1 and MFAC2; Step C: The secondary of the transformer (3) is divided into two output paths, one path is output to the negative output module (6) through the reactor (7) and the conductive sheet (16) in sequence for power supply, and the other path is output to the secondary rectification circuit (11) through the functional terminals DA1, DA2, DA3, and DA4; Step D: The secondary rectification circuit (11) rectifies the alternating current provided by the transformer (3) into direct current, and outputs the direct current to the positive output module (5) through the copper-plated layer (14), the aluminum heat sink (13) and the conductive sheet (16) in sequence for power supply.
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