An LED lamp bead of sun light source simulation and a sun light source simulator thereof

Abstract

The application discloses a kind of sun-like light source LED lamp bead and its sun-like light source simulator, sun-like light source LED lamp bead includes: substrate, several LED chips, encapsulation glue and fluorescent powder.Sun-like light source simulator includes multiple sun-like light source LED lamp bead of array splicing.The application has multiple LED chips in each wave band, and multiple fluorescent powders are reasonably matched, the matching degree of its spectrum with solar spectrum is high, and is extended to 360~1300nm wave band range, more close to real solar spectrum.Compared with previous xenon lamp light source, the application spectrum matching degree is higher, and start temperature is low, safety is significantly more optimal, and service life is longer;It is not necessary to design filter structure to filter out some unnecessary peak.Compared with sun-like light source used in daily lighting, the wave band range of the application is wider, is applicable to perovskite battery, laminated battery, silicon solar cell, organic battery, photocatalysis, photohydrolysis, photoreaction, material aging and other research and development test fields.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of LED lamp beads of imitating sunlight source, and the sunlight simulation light source including such sunlight spectrum LED lamp beads. BACKGROUND

[0002] Thin-film battery is a kind of thin-film solar cell in layered structure, is a kind of high-efficiency energy product, and has become a new trend of international photovoltaic market development. Thin-film battery or other types of solar cell need to test its performance and standard before leaving factory, and the test system of solar cell needs to use specific artificial light source to irradiate the battery, and the corresponding test value is obtained through the feedback of battery performance.

[0003] At present, the traditional test method is to use xenon lamp (xenon arc lamp) as solar simulator for testing solar cell. Xenon lamp is a kind of high-intensity gas discharge lamp, which ionizes xenon gas and generates arc light through 20kV high-voltage pulse generated instantaneously, and the solar simulation light is obtained after the arc light is filtered.

[0004] However, as a solar simulation light source, xenon lamp has the following defects: (1) the starting voltage of xenon lamp is as high as 20kV, which is dangerous and prone to safety accidents in laboratory. (2) the optical structure of xenon lamp is complex, and there are many sharp peaks far away from the spectrum of xenon lamp, so technicians need to design a complex filtering structure to filter out these sharp peaks before using it as a simulated sunlight. (3) the color temperature of xenon lamp is about 6000K, and the wavelength before 750nm is very similar to sunlight, but the matching of the wavelength after 750nm is poor.

[0005] There are also some LED lamps imitating sunlight spectrum on the market, but their purposes are different from the above, which are used for reading illumination and other aspects, mainly for human eyes to watch. The wavelength of light that can be perceived by human eyes is generally between 400nm and 700nm, so these LED lamps can only imitate the spectrum of visible light band; however, if such imitating sunlight illumination lamp is applied to the test of solar cell, it is not applicable. SUMMARY

[0006] In order to overcome the shortcomings of the prior art, one of the purposes of the present application is to provide a kind of LED lamp beads of imitating sunlight source, and the second purpose is to provide a kind of sunlight source simulator including LED lamp beads of imitating sunlight source, which can solve the problems of poor safety, the need to match complex filtering structure and poor matching with sunlight of xenon lamp as a solar simulation light source in the prior art.

[0007] The present application is realized by the following technical solutions:

[0008] An LED lamp bead imitating sunlight source, comprising: a substrate, a plurality of LED chips, encapsulating glue and fluorescent powder; the LED chips are fixed on the substrate by the encapsulating glue, and the fluorescent powder is mixed in the encapsulating glue; the LED chips comprise: a first chip with wavelength of 365-370 nm, a second chip with wavelength of 380-385 nm, a third chip with wavelength of 390-395 nm, a fourth chip with wavelength of 395-400 nm, a fifth chip with wavelength of 405-410 nm, a sixth chip with wavelength of 420-425 nm, a seventh chip with wavelength of 435-440 nm, an eighth chip with wavelength of 450-455 nm, a ninth chip with wavelength of 460-465 nm, a tenth chip with wavelength of 470-475 nm, an eleventh chip with wavelength of 700-748 nm, a twelfth chip with wavelength of 750-790 nm, a thirteenth chip with wavelength of 800-852 nm, a fourteenth chip with wavelength of 860-890 nm, a fifteenth chip with wavelength of 900-948 nm, a sixteenth chip with wavelength of 970-985 nm, a seventeenth chip with wavelength of 1000-1070 nm, and an eighteenth chip with wavelength of 1100-1300 nm.

[0009] The fluorescent powder comprises a first fluorescent powder, a second fluorescent powder and a third fluorescent powder mixed together, the first fluorescent powder has an emission wavelength of 510-530 nm, the second fluorescent powder has an emission wavelength of 480-500 nm, and the third fluorescent powder has an emission wavelength of 650-670 nm; the ratio of the first fluorescent powder, the second fluorescent powder and the third fluorescent powder is 85%:10%:5%; the weight ratio of the fluorescent powder to the encapsulating glue is 7 wt%.

[0010] Further, the first fluorescent powder is green fluorescent powder, the second fluorescent powder is blue fluorescent powder, and the third fluorescent powder is red fluorescent powder.

[0011] Further, the number of the first chips is 3, the number of the second chips is 2, the number of the third chips is 2, the number of the fourth chips is 1, the number of the fifth chips is 3, the number of the sixth chips is 3, the number of the seventh chips is 6, the number of the eighth chips is 11, the number of the ninth chips is 9, the number of the tenth chips is 7, the number of the eleventh chips is 4, the number of the twelfth chips is 5, the number of the thirteenth chips is 8, the number of the fourteenth chips is 5, the number of the fifteenth chips is 5, the number of the sixteenth chips is 3, the number of the seventeenth chips is 13, and the number of the eighteenth chips is 10.

[0012] Further, the LED chip comprises the first chip string, the second chip string, the third chip string, the fourth chip string, the fifth chip string, the sixth chip string, the seventh chip string, the eighth chip string, the ninth chip string and the tenth chip string connected in parallel with each other; the first chip string comprises the ninth chip, the fourth chip, the first chip, the eighth chip, the seventeenth chip, the fourteenth chip, the seventeenth chip, the fourteenth chip, the tenth chip and the eighteenth chip connected in series; the second chip string comprises the eighth chip, the thirteenth chip, the twelfth chip, the first chip, the ninth chip, the sixth chip, the thirteenth chip, the sixteenth chip, the thirteenth chip and the eighteenth chip connected in series; the third chip string comprises the fifteenth chip, the ninth chip, the seventeenth chip, the seventh chip, the fifth chip, the eleventh chip, the seventeenth chip, the ninth chip, the tenth chip and the eighteenth chip connected in series; the fourth chip string comprises the eighth chip, the fifteenth chip, the twelfth chip, the first chip, the seventh chip, the eleventh chip, the eighth chip, the fifteenth chip, the tenth chip and the eighteenth chip connected in series; the fifth chip string comprises the sixteenth chip, the ninth chip, the seventeenth chip, the seventh chip, the fifth chip, the twelfth chip, the fourteenth chip, the tenth chip, the tenth chip and the eighteenth chip connected in series; the sixth chip string comprises the eighth chip, the seventeenth chip, the thirteenth chip, the second chip, the seventh chip, the eleventh chip, the sixth chip, the seventeenth chip, the seventeenth chip and the eighteenth chip connected in series; the seventh chip string comprises the fourteenth chip, the ninth chip, the second chip, the seventh chip, the fifth chip, the twelfth chip, the seventeenth chip, the seventeenth chip, the tenth chip and the eighteenth chip connected in series; the eighth chip string comprises the eighth chip, the seventeenth chip, the twelfth chip, the third chip, the seventh chip, the eleventh chip, the sixth chip, the seventeenth chip, the seventeenth chip and the eighteenth chip connected in series; the ninth chip string comprises the seventeenth chip, the ninth chip, the thirteenth chip, the eighth chip, the eighth chip, the ninth chip, the fifteenth chip, the thirteenth chip, the tenth chip and the eighteenth chip connected in series; and the tenth chip string comprises the eighth chip, the sixteenth chip, the thirteenth chip, the third chip, the ninth chip, the eighth chip, the eighth chip, the fourteenth chip, the thirteenth chip and the eighteenth chip connected in series.

[0013] Further, the components and the ratio of the encapsulation glue are: UC520: HR-660-2: B490A: A glue: B glue = 0.12: 0.0086: 0.012: 1: 1.

[0014] Further, for the same group of chip strings, the LED chips are connected by gold wire welding between each other to realize series connection.

[0015] Further, the sun-simulating light source LED lamp bead further comprises a lens, which is mounted on the substrate in a reverse manner to cover the LED chip.

[0016] Further, the substrate is a milky white glue material substrate.

[0017] A sun-simulating light source simulator comprises the sun-simulating light source LED lamp bead, and a plurality of the sun-simulating light source LED lamp beads are arrayed and spliced.

[0018] Compared with the prior art, the present application has the following beneficial effects:

[0019] The sun-simulating light source LED lamp bead provided by the present application has a plurality of LED chips cooperating in each waveband, and a plurality of fluorescent powders are reasonably proportioned, the light emitted by each LED chip in cooperation with the fluorescent powder has an effect similar to being "carved" along the sun spectrum, the matching degree of the light spectrum with the sun spectrum is high, and the waveband range is expanded to 360-1300 nm, which is closer to the real sun spectrum. The sun-simulating light source LED lamp bead provided by the present application is easy to array and splice into a large-area light source, and is applied to performance testing of a solar cell as a sun-simulating light source, so that the performance feedback of the cell is more real.

[0020] Compared with the previous xenon lamp light source, (1) the present application has a higher light spectrum matching degree, a lower starting temperature, a lower working temperature, and a significantly better safety; (2) the working life is longer, and the cost and lamp replacement and calibration time can be saved; (3) the LED optical structure is simpler, and no additional filter structure needs to be designed to filter out some unnecessary sharp peaks, and the operation is more direct and simple.

[0021] Compared with the sun-simulating light source for daily life lighting, the waveband range of the present application is wider, and is suitable for research and development testing fields such as perovskite cells, stacked cells, silicon solar cells, organic cells, photocatalysis, photohydrolysis, photoreaction, material aging, etc. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 Fig. 1 is a top view of a sun-simulating light source lamp bead structure of the present application;

[0023] Figure 2 Fig. 4 is a spectrum diagram of the lamp bead and the sun light of the present application.

[0024] In the figure: 10, substrate; 20, LED chip; 21, first chip string; 22, second chip string; 23, third chip string; 24, fourth chip string; 25, fifth chip string; 26, sixth chip string; 27, seventh chip string; 28, eighth chip string; 29, ninth chip string; 210, tenth chip string. DETAILED DESCRIPTION

[0025] Hereinafter, the present application will be further described in conjunction with the drawings and specific embodiments, it should be noted that the following described embodiments or technical features can be combined to form new embodiments without conflict.

[0026] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0027] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] As Figure 1 shown, the present application discloses a kind of imitated sunlight source LED lamp pearl, including: using insulating material substrate 10, several for color LED chip 20, encapsulation glue and fluorescent powder.The mounting structure of lamp pearl is: LED chip 20 is fixed by encapsulation glue and is attached on substrate 10, fluorescent powder is mixed in encapsulation glue.

[0030] LED chip 20 adopts a plurality of different wave bands of LED chip 20.Fluorescent powder is matched with a plurality of different fluorescent powders.

[0031] Example one

[0032] The LED chip 20 includes: a first chip with a wavelength of 365-370 nm, a second chip with a wavelength of 380-385 nm; a third chip with a wavelength of 390-395 nm; a fourth chip with a wavelength of 395-400 nm, a fifth chip with a wavelength of 405-410 nm, a sixth chip with a wavelength of 420-425 nm, a seventh chip with a wavelength of 435-440, an eighth chip with a wavelength of 450-455, a ninth chip with a wavelength of 460-465 nm, a tenth chip with a wavelength of 470-475 nm, an eleventh chip with a wavelength of 700-748 nm, a twelfth chip with a wavelength of 750-790 nm, a thirteenth chip with a wavelength of 800-852 nm, a fourteenth chip with a wavelength of 860-890 nm, a fifteenth chip with a wavelength of 900-948 nm, a sixteenth chip with a wavelength of 970-985 nm, a seventeenth chip with a wavelength of 1000-1070 nm, and an eighteenth chip with a wavelength of 1100-1300 nm.

[0033] The fluorescent powder includes first fluorescent powder, second fluorescent powder and third fluorescent powder mixed together. The first fluorescent powder has an emission wavelength of 510-530 nm, the second fluorescent powder has an emission wavelength of 480-500 nm, and the third fluorescent powder has an emission wavelength of 650-670 nm. The ratio of the first fluorescent powder, the second fluorescent powder and the third fluorescent powder is 85%:10%:5%. The weight percentage of the fluorescent powder in the encapsulating glue is 7 wt%. Specifically, the first fluorescent powder is green fluorescent powder, the second fluorescent powder is blue fluorescent powder, and the third fluorescent powder is red fluorescent powder.

[0034] More specifically, the number of first chips is 3, the number of second chips is 2, the number of third chips is 2, the number of fourth chips is 1, the number of fifth chips is 3, the number of sixth chips is 3, the number of seventh chips is 6, the number of eighth chips is 11, the number of ninth chips is 9, the number of tenth chips is 7, the number of eleventh chips is 4, the number of twelfth chips is 5, the number of thirteenth chips is 8, the number of fourteenth chips is 5, the number of fifteenth chips is 5, the number of sixteenth chips is 3, the number of seventeenth chips is 13, and the number of eighteenth chips is 10.

[0035] More specifically, the LED chip 20 of the lamp bead adopts a circuit connection structure of ten series and ten parallels, which includes first chip string 21, second chip string 22, third chip string 23, fourth chip string 24, fifth chip string 25, sixth chip string 26, seventh chip string 27, eighth chip string 28, ninth chip string 29 and tenth chip string 210 connected in parallel with each other.

[0036] The first chip string 21 includes, in series, a ninth chip, a fourth chip, a first chip, an eighth chip, a seventeenth chip, a fourteenth chip, a seventeenth chip, a fourteenth chip, a tenth chip, and an eighteenth chip.

[0037] The second chip string 22 includes, in series, an eighth chip, a thirteenth chip, a twelfth chip, a first chip, a ninth chip, a sixth chip, a thirteenth chip, a sixteenth chip, a thirteenth chip, and an eighteenth chip.

[0038] The third chip string 23 includes, in series, a fifteenth chip, a ninth chip, a seventeenth chip, a seventh chip, a fifth chip, an eleventh chip, a seventeenth chip, a ninth chip, a tenth chip, and an eighteenth chip.

[0039] The fourth chip string 24 includes, in series, an eighth chip, a fifteenth chip, a twelfth chip, a first chip, a seventh chip, an eleventh chip, an eighth chip, a fifteenth chip, a tenth chip, and an eighteenth chip.

[0040] The fifth chip string 25 includes, in series, a sixteenth chip, a ninth chip, a seventeenth chip, a seventh chip, a fifth chip, a twelfth chip, a fourteenth chip, a tenth chip, a tenth chip, and an eighteenth chip.

[0041] The sixth chip string 26 includes, in series, an eighth chip, a seventeenth chip, a thirteenth chip, a second chip, a seventh chip, an eleventh chip, a sixth chip, a fifteenth chip, a seventeenth chip, and an eighteenth chip.

[0042] The seventh chip string 27 includes, in series, a fourteenth chip, a ninth chip, a second chip, a seventh chip, a fifth chip, a twelfth chip, a seventeenth chip, a seventeenth chip, a tenth chip, and an eighteenth chip.

[0043] The eighth chip string 28 includes, in series, an eighth chip, a seventeenth chip, a twelfth chip, a third chip, a seventh chip, an eleventh chip, a sixth chip, a seventeenth chip, a seventeenth chip, and an eighteenth chip.

[0044] The ninth chip string 29 includes, in series, a seventeenth chip, a ninth chip, a thirteenth chip, an eighth chip, an eighth chip, a ninth chip, a fifteenth chip, a thirteenth chip, a tenth chip, and an eighteenth chip.

[0045] The tenth chip string 210 includes, in series, an eighth chip, a sixteenth chip, a thirteenth chip, a third chip, a ninth chip, an eighth chip, an eighth chip, a fourteenth chip, a thirteenth chip, and an eighteenth chip.

[0046] Specifically, the components and proportions of the encapsulation glue are UC520:HR-660-2:B490A:A glue:B glue=0.12:0.0086:0.012:1:1.

[0047] The LED lamp bead of the present application has multiple LED chips 20 cooperating in each waveband, and multiple phosphors are reasonably proportioned, and the light emitted by each LED chip 20 in cooperation with the phosphor excitation reaches an effect similar to "carving" along the solar spectrum (for example, the light spectrum of the LED lamp bead is shown in the figure, and the curve T1 is the spectrum of the light scattered by the lamp bead, and the curve T2 is the solar spectrum of the real sunlight), the matching degree of the spectrum and the solar spectrum is high, and is extended to the waveband range of 360-1300 nm, and is more close to the real solar spectrum. The LED lamp bead of the present application is easy to array and splice into a large-area light source, and is applied to the performance test of the solar cell as a solar simulation light source, and the performance feedback of the cell obtained is more real. Figure 2

[0048] Compared with the previous xenon lamp light source: (1) the present application has a higher spectrum matching degree, and a lower starting temperature and a lower working temperature, and the safety is significantly better; (2) the working life is longer, and the cost and the lamp calibration time can be saved; (3) the LED optical structure is simpler, and additional filtering structure is not needed to filter out some unnecessary peaks, and the operation is more direct and simple.

[0049] Compared with the solar simulation light source used in daily life, the waveband range of the present application is wider, and is suitable for the research and development test field of perovskite cells, laminated cells, silicon solar cells, organic cells, photocatalysis, photohydrolysis, photoreaction, material aging, etc.

[0050] Preferably, for the same group of chip strings, the LED chips 20 between each other are connected by gold wire welding to realize the series connection of the same chip string. Of course, the gold wire can be replaced by copper wire.

[0051] Preferably, the LED lamp bead of the solar simulation light source further comprises a lens, and the lens is mounted on the substrate 10 in a reverse manner, so as to surround the outside of all the LED chips 20, and the light emitted by the LED is scattered out of the lamp bead after passing through the lens.

[0052] Preferably, the substrate 10 is made of a milky white glue material, and the material has insulation.

[0053] The present application also discloses a solar light source simulator comprising the LED lamp bead of the solar simulation light source, and multiple LED lamp beads are arrayed and spliced into a large-area light source as a simulated solar light source. Any solar light source simulator using the same or substantially same LED lamp bead of the solar simulation light source as described above shall be within the protection scope of the present application. ​

[0054] The above embodiments are only the preferred embodiments of the present application, and cannot be used to limit the scope of protection of the present application. Any non-essential changes and substitutions made by those skilled in the art based on the present application shall fall within the scope of protection of the present application.

Claims

1. A solar-like LED lamp bead, characterized in that: include: A substrate, a plurality of LED chips, a packaging adhesive, and phosphor powder; the LED chips are bonded and fixed to the substrate by the packaging adhesive, and the phosphor powder is mixed in the packaging adhesive; The LED chips include: a first chip with a wavelength of 365-370 nm and a second chip with a wavelength of 380-385 nm; A third chip with a wavelength of 390-395nm; a fourth chip with a wavelength of 395-400nm, a fifth chip with a wavelength of 405-410nm, a sixth chip with a wavelength of 420-425nm, a seventh chip with a wavelength of 435-440nm, an eighth chip with a wavelength of 450-455nm, a ninth chip with a wavelength of 460-465nm, a tenth chip with a wavelength of 470-475nm, an eleventh chip with a wavelength of 700-748nm, a twelfth chip with a wavelength of 750-790nm, a thirteenth chip with a wavelength of 800-852nm, a fourteenth chip with a wavelength of 860-890nm, a fifteenth chip with a wavelength of 900-948nm, a sixteenth chip with a wavelength of 970-985nm, a seventeenth chip with a wavelength of 1000-1070nm, and an eighteenth chip with a wavelength of 1100-1300nm; The phosphor includes a mixed first phosphor, a second phosphor and a third phosphor. The emission wavelength of the first phosphor is 510-530 nm, the emission wavelength of the second phosphor is 480-500 nm, and the emission wavelength of the third phosphor is 650-670 nm. The ratio of the first phosphor, the second phosphor and the third phosphor is 85%: 10%: 5%. The weight proportion of the phosphor to the encapsulation glue is 7 wt%.

2. The solar-imitation LED lamp bead according to claim 1, characterized in that: The first phosphor is a green phosphor, the second phosphor is a cyan phosphor, and the third phosphor is a red phosphor.

3. The solar-imitation LED lamp bead according to claim 1, characterized in that: The number of the first chips is 3, the number of the second chips is 2, the number of the third chips is 2, the number of the fourth chips is 1, the number of the fifth chips is 3, the number of the sixth chips is 3, the number of the seventh chips is 6, the number of the eighth chips is 11, the number of the ninth chips is 9, the number of the tenth chips is 7, the number of the eleventh chips is 4, the number of the twelfth chips is 5, the number of the thirteenth chips is 8, the number of the fourteenth chips is 5, the number of the fifteenth chips is 5, the number of the sixteenth chips is 3, the number of the seventeenth chips is 13, and the number of the eighteenth chips is 10.

4. The sunlight-simulating LED lamp bead according to claim 1, wherein: The LED chips include: a first chip string, a second chip string, a third chip string, a fourth chip string, a fifth chip string, a sixth chip string, a seventh chip string, an eighth chip string, a ninth chip string, and a tenth chip string connected in parallel; The first chip string includes the following chips connected in series: a ninth chip, a fourth chip, a first chip, an eighth chip, a seventeenth chip, a fourteenth chip, a seventeenth chip, a fourteenth chip, a tenth chip, and an eighteenth chip; The second chip string includes the following chips connected in series: an eighth chip, a thirteenth chip, a twelfth chip, a first chip, a ninth chip, a sixth chip, a thirteenth chip, a sixteenth chip, a thirteenth chip, and an eighteenth chip; The third chip string includes the following chips connected in series: a fifteenth chip, a ninth chip, a seventeenth chip, a seventh chip, a fifth chip, an eleventh chip, a seventeenth chip, a ninth chip, a tenth chip, and an eighteenth chip; The fourth chip string includes the following chips connected in series: an eighth chip, a fifteenth chip, a twelfth chip, a first chip, a seventh chip, an eleventh chip, an eighth chip, a fifteenth chip, a tenth chip, and an eighteenth chip; The fifth chip string includes the following chips connected in series: a sixteenth chip, a ninth chip, a seventeenth chip, a seventh chip, a fifth chip, a twelfth chip, a fourteenth chip, a tenth chip, a tenth chip, and an eighteenth chip; The sixth chip string includes the following chips connected in series: an eighth chip, a seventeenth chip, a thirteenth chip, a second chip, a seventh chip, an eleventh chip, a sixth chip, a fifteenth chip, a seventeenth chip, and an eighteenth chip; The seventh chip string includes the following chips connected in series: a fourteenth chip, a ninth chip, a second chip, a seventh chip, a fifth chip, a twelfth chip, a seventeenth chip, a tenth chip, and an eighteenth chip; The eighth chip string includes the following chips connected in series: an eighth chip, a seventeenth chip, a twelfth chip, a third chip, a seventh chip, an eleventh chip, a sixth chip, a seventeenth chip, a seventeenth chip, and an eighteenth chip; The ninth chip string includes the following chips connected in series: a seventeenth chip, a ninth chip, a thirteenth chip, an eighth chip, an eighth chip, a ninth chip, a fifteenth chip, a thirteenth chip, a tenth chip, and an eighteenth chip; The tenth chip string includes the following chips connected in series: an eighth chip, a sixteenth chip, a thirteenth chip, a third chip, a ninth chip, an eighth chip, an eighth chip, a fourteenth chip, a thirteenth chip, and an eighteenth chip.

5. The sunlight-imitation LED lamp bead according to claim 4, characterized in that: For the chip strings of the same group, the two LED chips are connected by gold wire welding to achieve series connection.

6. The sunlight-simulating LED lamp bead according to claim 1, wherein: The sunlight-simulating LED lamp bead further comprises a lens, which is mounted upside down on the substrate to surround the LED chip.

7. The solar-imitation LED lamp bead according to claim 1, characterized in that: The substrate is a latex material substrate.

8. A solar light source simulator, characterized in that: It comprises a plurality of solar-imitation LED lamp beads according to any one of claims 1 to 7, wherein the plurality of solar-imitation LED lamp beads are spliced ​​into an array.

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