A high-temperature disc spring and its hot forming process

Abstract

This application relates to a hot forming process for high-temperature disc springs, belonging to the technical field of disc spring production, and includes the following steps: a heating step of heating the blank; a pressing step of placing the heated blank between the upper die and the lower die and pressing the blank through the cooperation of the upper die and the lower die; a displacement step of moving the position of the blank; a repeating step of repeating the pressing step and the displacement step several times; and a heat preservation step of adjusting the temperatures of the upper die and the lower die to make their temperatures within the standard range. This application has the advantage of being able to reduce the probability of die deformation.

Description

Technical Field

[0001] The present application relates to the technical field of disc spring production, and in particular to a high-temperature disc spring and its hot forming process. Background Art

[0002] During the production process of disc springs, heating and pressing are required to obtain products that meet the standards. However, in the existing molds during use, due to the heat in the product itself, the heat is conducted to the mold, and during the repeated heating and cooling processes, after long-term use, the mold will deform, resulting in an increase in the error of the produced products and a decrease in the yield rate. Summary of the Invention

[0003] Aiming at the deficiencies of the existing technology, one of the purposes of the present application is to provide a high-temperature disc spring and its hot forming process, which has the advantage of being able to reduce the probability of mold deformation.

[0004] The above object of the present application is achieved through the following technical solutions:

[0005] A hot forming process for a high-temperature disc spring includes the following steps: a heating step of heating the blank; a pressing step of placing the heated blank between an upper die and a lower die and pressing the blank through the cooperation of the upper die and the lower die; a shifting step of moving the position of the blank; a repeating step of repeating the pressing step and the shifting step several times; and a heat preservation step of adjusting the temperatures of the upper die and the lower die to be within the standard range.

[0006] By adopting the above technical solutions, during the production process, the temperatures of the upper die and the lower die are adjusted so that the temperatures of the upper die and the lower die are within the range, thereby being able to reduce the repeated heating and cooling of the mold, and thus being able to reduce the probability of mold deformation after long-term use.

[0007] In a preferred example of the present application, it can be further configured that: both the upper die and the lower die are provided with heat conduction cavities for accommodating heat conduction media.

[0008] By adopting the above technical solutions, the existence of the heat conduction cavities for accommodating heat conduction media makes the temperatures of the upper die and the lower die more stable.

[0009] In a preferred example of the present application, it can be further configured that: the upper die is provided with an upper inlet and an upper outlet both connected to the heat conduction cavity on the upper die, the lower die is provided with a lower outlet and a lower inlet both connected to the heat conduction cavity on the lower die, the upper inlet is used to be connected to the lower outlet, and the upper outlet is used to be connected to the lower inlet.

[0010] By adopting the above technical solution, since the product is placed on the lower mold, the temperature of the lower mold will be slightly higher than that of the upper mold. Therefore, the heat conduction cavity of the upper mold is connected to the heat conduction cavity of the lower mold, thereby achieving the purpose of temperature adjustment.

[0011] In a preferred example of the present application, it can be further configured that one-way valves are provided at both the upper inlet and the lower inlet, and the one-way valves conduct unidirectionally towards the heat conduction cavity. One-way valves are provided at both the upper outlet and the lower outlet, and the one-way valves conduct unidirectionally towards the outside.

[0012] By adopting the above technical solution, the presence of the one-way valves can reduce the probability of liquid leakage in the heat conduction cavity.

[0013] In a preferred example of the present application, it can be further configured that a pressure relief port and a pressure boost port are further provided on the upper mold, and both the pressure relief port and the pressure boost hole are connected to the heat conduction cavity on the upper mold.

[0014] By adopting the above technical solution, the presence of the pressure boost port and the pressure relief port enables the heat conduction medium in the heat conduction cavity on the upper mold and the heat conduction cavity on the lower mold to flow faster.

[0015] In a preferred example of the present application, it can be further configured that in the heat preservation step, it includes a temperature acquisition step and a temperature adjustment step. In the temperature acquisition step, the temperature in the heat conduction cavity is acquired. When the temperature of the heat conduction cavity on the lower mold does not meet the standard, it enters the temperature adjustment step. In the temperature adjustment step, the heat conduction cavity on the upper mold is pressurized, so that the pressure in the heat conduction cavity on the upper mold increases, thereby enabling the heat conduction medium to enter the heat conduction cavity on the lower mold and replacing the heat conduction medium in the heat conduction cavity on the lower mold.

[0016] By adopting the above technical solution, during use, by detecting the temperature, when the temperature does not meet the standard, the heat conduction medium is replaced.

[0017] In a preferred example of the present application, it can be further configured that in the pressing step, the number of executions of the shifting step of the current blank is acquired, and the pressing duration is adjusted according to the number of executions.

[0018] By adopting the above technical solution, that is, during production, the blank needs to be pressed multiple times. Each time it is pressed, it is shifted once. The pressing times for different numbers of presses are different, so as to achieve a good forming effect on the blank.

[0019] In a preferred example of the present application, it can be further configured that in the temperature adjustment step, the number of executions of the shifting step of the current blank is acquired, and the temperature of the heat conduction medium entering the heat conduction cavity on the upper mold through pressurization is adjusted according to the number of executions.

[0020] By adopting the above technical solution, at different pressing times, due to inconsistent durations, the temperature is adjusted by confirming the pressing duration, thereby achieving a good adjustment effect.

[0021] The present application also discloses a high-temperature disc spring, which is obtained by adopting the above high-temperature disc spring hot forming process. Brief Description of the Drawings

[0022] Figure 1 It is a schematic cross-sectional structure diagram of the mold of the present application.

[0023] Reference signs: 1, upper mold; 11, upper outlet; 12, upper inlet; 2, lower mold; 21, lower inlet; 22, lower outlet; 3, heat conduction cavity; 31, B cavity; 32, A cavity; 4, extending pipe; 5, blank. Detailed Description of the Embodiment

[0024] The following further details the present application with reference to the drawings.

[0025] Refer to Figure 1 , a high-temperature disc spring hot forming process disclosed in the present application, includes the following steps: heating step, heating the blank 5; pressing step, placing the heated blank 5 between the upper mold 1 and the lower mold 2, obtaining the execution times of the current blank 5 displacement step, and adjusting the pressing duration according to the execution times, and pressing the blank 5 by the cooperation of the upper mold 1 and the lower mold 2; displacement step, moving the position of the blank 5; repeating step, repeating the pressing step and the displacement step several times; heat preservation step, adjusting the temperatures of the upper mold 1 and the lower mold 2 to make their temperatures within the standard range. For example, in the repeating step, the pressing step is repeated 2 times and the displacement step is repeated once. For example, the first pressing is 15 seconds, the first displacement (rotating the blank 5 by 180°), the first repeated pressing is 20 seconds, the first repeated displacement (rotating the blank 5 by 180°); the second repeated pressing is 90 seconds.

[0026] Both the upper die 1 and the lower die 2 are provided with heat conduction cavities 3 for accommodating heat conduction media. The upper die 1 is provided with an upper inlet 12 and an upper outlet 11 both communicating with the heat conduction cavity 3 on the upper die 1. The heat conduction cavity 3 on the upper die 1 is divided into a non-communicating A cavity 32 and B cavity 31. The upper die 1 is also provided with a pressure relief port and a pressure boosting port. The pressure relief port communicates with the A cavity 32, and the pressure boosting port communicates with the B cavity 31. The lower die 2 is provided with a lower outlet 22 and a lower inlet 21 both communicating with the heat conduction cavity 3 on the lower die 2. The upper inlet 12 is used to communicate with the lower outlet 22. An extension pipe 4 can be arranged at the upper inlet 12 or the lower outlet 22. For example, the extension pipe 4 is arranged at the upper inlet 12 and is used to extend into the lower outlet 22. The surface of the extension pipe 4 is provided with a rubber sealing ring for sealing connection with the lower outlet 22. The upper outlet 11 is used to communicate with the lower inlet 21 in the same way as the communication scheme between the upper outlet 11 and the lower inlet 21. Check valve one is arranged at both the upper inlet 12 and the lower inlet 21, and check valve one conducts unidirectionally towards the heat conduction cavity 3. Check valve two is arranged at both the upper outlet 11 and the lower outlet 22, and check valve two conducts unidirectionally towards the outside. To ensure the strength of the die, a support structure such as a support beam or a support column can be arranged in the heat conduction cavity 3.

[0027] In the heat preservation step, it includes a temperature acquisition step and a temperature adjustment step. In the temperature acquisition step, the temperature in the heat conduction cavity is acquired. When the temperature of the heat conduction cavity on the lower die 2 does not meet the standard, it enters the temperature adjustment step. In the temperature adjustment step, the number of execution times of the displacement step of the current blank 5 is acquired, and the temperature of the heat conduction medium entering the heat conduction cavity on the upper die 1 through pressurization is adjusted according to the number of execution times. The heat conduction cavity on the upper die 1 is pressurized by pouring the heat conduction medium through the pressure boosting port, so that the pressure in the heat conduction cavity on the upper die 1 increases, thereby enabling the heat conduction medium to enter the heat conduction cavity on the lower die 2 and replacing the heat conduction medium in the heat conduction cavity on the lower die 2. The heat conduction medium of the lower die 2 enters the heat conduction cavity 3 of the upper die 1 under the action of pressure. In actual use, for example, the heat conduction medium is heat conduction oil. When circulating the heat conduction oil, gas is poured into the B cavity 31 through the pressure boosting port, so that the pressure of the B cavity 31 increases. Under the action of pressure, the liquid in the B cavity 31 will flow into the heat conduction cavity 3 in the lower die 2. Since the temperature in the heat conduction cavity 3 in the lower die 2 is higher than the temperature of the heat conduction cavity 3 in the upper die 1, the high-temperature heat conduction medium in the heat conduction cavity 3 in the lower die 2 will flow into the A cavity 32. Due to the existence of the pressure relief hole, part of the heat conduction medium in the A cavity 32 will be discharged. This part of the heat conduction medium is collected and injected into the B cavity 31 through a pipeline.

[0028] This application also discloses a high-temperature disc spring prepared by the above process.

[0029] The implementation principle of this embodiment is: by regulating the temperature of the die, the probability of the die deforming during long-term use is reduced.

[0030] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application. Therefore, all equivalent changes made according to the structure, shape, and principle of this application shall be covered within the protection scope of this application.

Claims

1. A hot forming process for high-temperature conical disc springs, characterized in that: It includes the following steps: a heating step of heating the blank (5); a pressing step of placing the heated blank (5) between the upper die (1) and the lower die (2) and pressing the blank (5) through the cooperation of the upper die (1) and the lower die (2); a displacement step of moving the position of the blank (5); a repeating step of repeatedly executing the pressing step and the displacement step several times; a heat preservation step of adjusting the temperatures of the upper die (1) and the lower die (2) to make their temperatures within the standard range. Both the upper die (1) and the lower die (2) are provided with heat conduction cavities (3) for accommodating heat conduction media. The upper die (1) is provided with an upper inlet (12) and an upper outlet (11) communicating with the heat conduction cavity (3) on the upper die (1), and the lower die (2) is provided with a lower outlet (22) and a lower inlet (21) communicating with the heat conduction cavity (3) on the lower die (2). The upper inlet (12) is used to communicate with the lower outlet (22), and the upper outlet (11) is used to communicate with the lower inlet (21). One-way valves I are provided at both the upper inlet (12) and the lower inlet (21), and the one-way valves I conduct unidirectionally towards the heat conduction cavity (3). One-way valves II are provided at both the upper outlet (11) and the lower outlet (22), and the one-way valves II conduct unidirectionally towards the outside. The heat conduction cavity (3) on the upper die (1) is divided into a non-communicating A cavity (32) and B cavity (31). The upper die (1) is further provided with a pressure relief port and a pressure boosting port. The pressure relief port communicates with the A cavity (32), and the pressure boosting port communicates with the B cavity (31). In the heat preservation step, it includes a temperature obtaining step and a temperature adjusting step. In the temperature obtaining step, the temperature in the heat conduction cavity (3) is obtained. When the temperature of the heat conduction cavity (3) on the lower die (2) does not meet the standard, it enters the temperature adjusting step. In the temperature adjusting step, the heat conduction cavity (3) on the upper die (1) is pressurized, so that the pressure in the heat conduction cavity (3) on the upper die (1) increases, thereby enabling the heat conduction medium to enter the heat conduction cavity (3) on the lower die (2) to replace the heat conduction medium in the heat conduction cavity (3) on the lower die (2).

2. The hot forming process of a high-temperature conical spring according to claim 1, wherein: In the pressing step, the execution times of the displacement step of the current blank (5) are obtained, and the pressing duration is adjusted according to the execution times.

3. A hot forming process for a high-temperature disc spring according to claim 2, characterized in that: In the temperature adjusting step, the execution times of the displacement step of the current blank (5) are obtained, and the temperature of the heat conduction medium entering the heat conduction cavity (3) on the upper die (1) through pressurization is adjusted according to the execution times.

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