Acoustic black hole effect-based array vibration reduction structure F-F sandwich plate

Abstract

The invention relates to the technical field of mechanical vibration and noise control, in particular to an acoustic black hole effect-based array vibration reduction structure Fuliang sandwich plate, which comprises an outer side upper layer plate, an outer side lower layer plate, an array vibration reduction structure, a piezoelectric plate and a Fuliang circuit, and is characterized in that the outer side upper layer plate and the outer side lower layer plate are arranged on two sides in parallel; the multiple vibration reduction structure units form an array vibration reduction structure and are arranged between the upper layer plate and the lower layer plate on the outer side. Wave energy generated by mechanical vibration is transmitted to an interlayer array vibration reduction structure from an upper layer plate and a lower layer plate on the outer side, the wave energy in the structure is gathered at the position of the plane on the outer side of the shell through the acoustic black hole effect of each vibration reduction structure unit, and then the piezoelectric material is pasted at the position through the charge effect. According to the array vibration reduction structure, the piezoelectric material generates electric charges when being deformed by external force, so that energy of structural vibration is converted into electric energy, energy recovery is carried out, in addition, the array vibration reduction structure is composed of a plurality of different vibration reduction structure units, the vibration reduction frequency band can be effectively widened, and therefore the vibration reduction effect is better achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical vibration and noise control, and in particular to a Farasis sandwich panel with an array vibration reduction structure based on an acoustic black hole effect. Background Art

[0002] The noise and vibration problems generated by mechanical transmission systems during operation have always been difficult problems that need to be solved urgently in the engineering field. Noise and vibration not only pose potential risks to the health of workers, but also cause serious pollution and interference to the surrounding environment.

[0003] The acoustic black hole effect is a phenomenon in which the thickness of a thin-walled structure is cut according to the power law, and the geometric parameters of the thin-walled structure are used to gradually reduce the propagation speed of waves in the structure. Ideally, the wave speed is reduced to zero and no reflection occurs. The acoustic black hole has the characteristics of wide-band effectiveness and simple and flexible implementation methods for wave gathering. It has obvious advantages in applications such as vibration reduction and noise reduction, energy recovery, etc. of thin-walled structures. However, in actual applications, the edge truncation of the acoustic black hole will lead to the existence of a non-zero reflection coefficient, thereby weakening the acoustic black hole effect.

[0004] Piezoelectric shunt damping technology makes full use of the charge effect of piezoelectric materials. When the mechanical transmission system is deformed by external force, the piezoelectric material generates charges. These charges can be collected and dissipated, thereby converting the energy of structural vibration into electrical energy and dissipating the energy, thereby achieving a vibration reduction effect and better blocking the spread of noise. Summary of the invention

[0005] The purpose of the present invention is to provide an array vibration reduction structure, a Farasis sandwich plate, based on the acoustic black hole effect, which aims to convert the kinetic energy gathered by the acoustic black hole structure into electrical energy through the action of piezoelectric sheets and store it for use by external sensors.

[0006] To achieve the above-mentioned objectives, the present invention provides an array vibration reduction structure, a Farasis sandwich plate, based on the acoustic black hole effect, comprising an outer upper and lower layer plate, an array vibration reduction structure, a piezoelectric sheet and a Farasis circuit, wherein the outer upper and lower layer plates are two layers of oppositely arranged and parallel layer plates, the array vibration reduction structure is arranged between the outer upper and lower layer plates, the array vibration reduction structure is composed of a plurality of vibration reduction structure units arranged in a regular array, and the two ends of each of the vibration reduction structure units are respectively connected to the outer upper and lower layer plates, the piezoelectric sheet is installed between or on the side surfaces of each of the vibration reduction units, and the Farasis circuit is electrically connected to the two poles of the piezoelectric sheet.

[0007] Preferably, the vibration reduction units are all thin-walled cylindrical shell structures and are arranged in an acoustic black hole configuration. The size of the acoustic black hole satisfies the following relationship within one period:

[0008]

[0009] in, represents the slope of the acoustic black hole region; h(θ) represents the thickness of the contour of the acoustic black hole region; h max ,h min is the thickness of the thickest and thinnest parts of the acoustic black hole region; m is the power index, and the range of the power index is defined as m≥2; θ1, θ2 represent the starting and ending angles of the acoustic black hole part within one period.

[0010] Preferably, the Farasis energy circuit includes four diodes, a voltage regulator and a battery. The four diodes constitute a rectification circuit, and the current is stabilized by the voltage regulator and the electrical energy is stored in the battery.

[0011] The present invention provides a Farasis sandwich plate with an array vibration reduction structure based on an acoustic black hole effect, comprising an outer upper and lower layer plate, an array vibration reduction structure, a piezoelectric sheet and a Farasis circuit, wherein the outer upper and lower layer plates are arranged in parallel on both sides, a plurality of vibration reduction structure units form an array vibration reduction structure and are arranged between the outer upper and lower layer plates, presenting an array sandwich plate-like structure, the vibration reduction structure unit has an acoustic black hole structure, and the piezoelectric sheet is installed between or on the outer side of each vibration reduction structure unit of the array vibration reduction structure, and is connected to the Farasis circuit. The present invention transfers the wave energy generated by mechanical vibration from the outer upper and lower layer plates to the array vibration reduction structure of the sandwich, utilizes the acoustic black hole effect of each vibration reduction structure unit to gather the wave energy in the structure at the position of the outer plane of the shell, and then utilizes the charge effect of the piezoelectric material pasted here, the piezoelectric material generates a charge when deformed by an external force, thereby converting the energy of the structural vibration into electrical energy and recovering the energy, and the array vibration reduction structure is composed of a plurality of different vibration reduction structure units, which can effectively broaden the frequency band of vibration reduction, thereby better achieving the vibration reduction effect and better blocking the propagation of noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a structural schematic diagram of a Farasis sandwich panel of an array vibration reduction structure based on the acoustic black hole effect of the present invention.

[0014] Figure 2 It is a top plan schematic diagram of the array vibration reduction structure of the present invention.

[0015] Figure 3 It is a schematic diagram of a two-dimensional acoustic black hole of a cross section of the first vibration reduction structural unit of the present invention.

[0016] Figure 4 It is a schematic diagram of the dimensional relationship of an enlarged portion of a two-dimensional acoustic black hole of a cross section of the first vibration reduction structural unit of the present invention.

[0017] Figure 5 It is a schematic diagram of the structure of the Farasis Energy circuit of the present invention.

[0018] 1-outer upper and lower plates, 2-array vibration reduction structure, 201-first vibration reduction structure unit, 202-second vibration reduction structure unit, 203-third vibration reduction structure unit, 204-fourth vibration reduction structure unit, 205-fifth vibration reduction structure unit, 206-sixth vibration reduction structure unit, 3-piezoelectric sheet, 401-first end, 402-second end, 403-diode I, 404-diode II, 405-diode III, 406-diode IV, 407-voltage regulator, 408-battery. DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0020] See also Figures 1 to 5 The present invention provides an array vibration reduction structure based on the acoustic black hole effect, a Farasis sandwich plate, comprising an outer upper and lower layer plate 1, an array vibration reduction structure 2, a piezoelectric sheet 3 and a Farasis circuit, wherein the outer upper and lower layer plates 1 are two layers of layer plates that are oppositely arranged and parallel, and the array vibration reduction structure 2 is arranged between the outer upper and lower layer plates 1. The array vibration reduction structure 2 is composed of a plurality of vibration reduction structure units arranged in a regular array, and the two ends of each of the vibration reduction structure units are respectively connected to the outer upper and lower layer plates 1, and the piezoelectric sheet 3 is installed between or on the side surfaces of each of the vibration reduction units, and the Farasis circuit is electrically connected to the two poles of the piezoelectric sheet 3.

[0021] Further, the array vibration reduction structure 2 is composed of a first vibration reduction structure unit 201, a second vibration reduction structure unit 202, a third vibration reduction structure unit 203, a fourth vibration reduction structure unit 204, a fifth vibration reduction structure unit 205, and a sixth vibration reduction structure unit 206, wherein the central part is 7 sixth vibration reduction structure units 206 arranged in a honeycomb structure, and the outer side of the honeycomb structure is respectively composed of 2 first vibration reduction structure units 201, 1 second vibration reduction structure unit 202, 1 third vibration reduction structure unit 203, 1 fourth vibration reduction structure unit 204, and 1 fifth vibration reduction structure unit 205. Specifically, the array vibration reduction structure 2 is composed of a plurality of vibration reduction structure units arranged in a certain pattern, and different vibration reduction structure units can reduce vibration in different frequency bands. Arranging according to this pattern can effectively broaden the frequency band of vibration reduction, thereby better achieving the vibration reduction effect and better blocking the propagation of noise. Figure 2 It is a top plan schematic diagram of the array vibration reduction structure 2 of the present invention.

[0022] The vibration reduction units are all thin-walled cylindrical shell structures and are arranged in an acoustic black hole. The size of the acoustic black hole satisfies the following relationship within one period:

[0023]

[0024] in, represents the slope of the acoustic black hole region; h(θ) represents the thickness of the contour of the acoustic black hole region; h max ,h min is the thickness of the thickest and thinnest parts of the acoustic black hole region; m is the power index, and the range of the power index is defined as m≥2; θ1, θ2 represent the starting and ending angles of the acoustic black hole part in one cycle. Figure 3 and Figure 4 The schematic diagram of the two-dimensional acoustic black hole of the cross section of the first vibration reduction structure unit 201 is shown in the figure, one of the curves is when m=2. By comparison, it can be seen that the parameter m in this structural formula is ≥ 2. The size of the two-dimensional acoustic black hole of each vibration reduction structure unit in the array vibration reduction structure 2 is the same as the size of the two-dimensional acoustic black hole of the first vibration reduction structure unit 201.

[0025] Figure 5 The external Farasis circuit is shown.

[0026] As shown in the figure, the diode, the first terminal 401, the second terminal 402, the voltage regulator 407, and the battery 408 all belong to the external Farasis circuit. The first terminal 401 and the second terminal 402 are respectively connected to the positive and negative electrodes of the piezoelectric sheet 3, the first terminal 401 is connected to the negative electrode of the diode II 404 and the positive electrode of the diode IV 406, the second terminal 402 is connected to the negative electrode of the diode I 403 and the positive electrode of the diode III 405, the positive input terminal of the voltage regulator 407 is connected to the negative electrode of the diode III 405 and the negative electrode of the diode IV 406, the positive output terminal of the voltage regulator 407 is connected to the positive electrode of the battery 408, the negative output terminal of the voltage regulator 407 and the negative electrode of the battery 408 are grounded, and the positive and negative output terminals of the battery 408 can supply power normally.

[0027] After the piezoelectric sheet 3 converts mechanical energy into electrical energy, the current flows into the circuit through the first terminal 401 and the second terminal 402 of the external Farasis circuit. After being rectified by diode I 403, diode II 404, diode III 405, and diode IV 406, the current will flow into the positive input terminal of the voltage regulator 407. After voltage stabilization by the voltage regulator 407, the electrical energy is stored in the battery 408. The electrical energy stored in the battery 408 can be used by external sensors. Among them, diode I 403, diode II 404, diode III 405, and diode IV 406 are classic rectifier circuits with rectification characteristics, which can change the direction of the current so that the current flows from the positive electrode to the voltage regulator 407 after being rectified by the diode. The voltage regulator 407 can adjust the output voltage to keep it in a fixed range. The battery 408 can store electrical energy for use by external sensors.

[0028] The vibration reduction process of the vibration and noise reduction Farasis sandwich plate structure based on the acoustic black hole effect can be described as:

[0029] The wave energy generated by external mechanical vibration or noise is transferred from the outer upper and lower plates 1 to the array vibration reduction structure 2 of the interlayer, and the wave energy in the structure is gathered at a specific position by utilizing the acoustic black hole effect on each vibration reduction structure unit in the array vibration reduction structure 2. Then, the charge effect of the piezoelectric material of the piezoelectric sheet 3 pasted here is utilized. When deformed by an external force, the piezoelectric material generates an electric charge, thereby converting the vibration energy outside the structure into electrical energy. The energy is recovered and stored in the battery, and can be used with an external sensor, thereby achieving a vibration reduction effect and better blocking the propagation of noise.

[0030] To sum up, the advantage of the present invention is that the wave energy generated by mechanical vibration is transferred from the outer upper and lower plates to the array vibration reduction structure of the interlayer, and the wave energy in the structure is gathered at the position of the outer plane of the shell by using the acoustic black hole effect of each vibration reduction structural unit, and then the charge effect of the piezoelectric material pasted here is used. When the piezoelectric material is deformed by an external force, an electric charge is generated, thereby converting the energy of the structural vibration into electrical energy and recovering the energy. The array vibration reduction structure is composed of several different vibration reduction structural units, which can effectively broaden the frequency band of vibration reduction, thereby better achieving the vibration reduction effect and better blocking the propagation of noise.

[0031] The vibration reduction structural unit in the array vibration reduction structure can effectively utilize the mechanism of acoustic black hole converging bending waves, and then use the piezoelectric sheet to stick to the converging point of the bending waves to recover the energy and improve the vibration reduction ability.

[0032] The advantages of the present invention are simple structure, high vibration reduction efficiency, resource recovery, and the ability to improve the working environment, fully utilize resources, and reduce energy waste.

[0033] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. An array vibration reduction structure based on acoustic black hole effect, namely, a Farasis sandwich panel, characterized in that: It includes outer upper and lower plates, an array vibration reduction structure, a piezoelectric sheet and a Farasis energy circuit. The outer upper and lower plates are two layers of plates that are oppositely arranged and parallel. The array vibration reduction structure is arranged between the outer upper and lower plates. The array vibration reduction structure is composed of a number of vibration reduction structure units arranged in a regular array. The two ends of each vibration reduction structure unit are respectively connected to the outer upper and lower plates. The piezoelectric sheet is installed between or on the side surfaces of each vibration reduction unit. The Farasis energy circuit is electrically connected to the two poles of the piezoelectric sheet.

2. The array vibration reduction structure based on acoustic black hole effect of Farasis sandwich panel according to claim 1, characterized in that: The vibration reduction units are all thin-walled cylindrical shell structures and are arranged in an acoustic black hole. The size of the acoustic black hole satisfies the following relationship within one period: in, represents the slope of the acoustic black hole region; h(θ) represents the thickness of the contour of the acoustic black hole region; h max ,h min is the thickness of the thickest and thinnest parts of the acoustic black hole region; m is the power index, and the range of the power index is defined as m≥2; θ1, θ2 represent the starting and ending angles of the acoustic black hole part within one period.

3. The array vibration reduction structure based on acoustic black hole effect of Farasis sandwich panel according to claim 2, characterized in that: The Farasis energy circuit includes four diodes, a voltage regulator and a battery. The four diodes form a rectification circuit. After the current is stabilized by the voltage regulator, the electric energy is stored in the battery.

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