A power module packaging structure and a power module

Abstract

The application discloses a power module packaging structure and a power module, and is applied to the technical field of power devices, wherein a plurality of unitized power modules are arranged on the surface of a bottom plate, gaps are formed between adjacent unitized power modules, the adjacent unitized power modules are electrically connected to each other through connecting components, and the connecting components are arranged above the bottom plate; an isolation plate is arranged on the position corresponding to the gaps on the surface of the bottom plate, and the surface of the side of the isolation plate facing the edge of the unitized power module is an insulating surface; the projection position of the edge of the gap in the adjacent unitized power modules on the surface of the bottom plate is located in the insulating surface. Through the arrangement of the isolation plate, the creeping path of the unitized power module cannot directly extend downward along the thickness direction to the bottom plate at the edge thereof, but needs to first creep horizontally to the outside of the insulating surface at the edge thereof, and then creep along the thickness direction to the bottom plate, so that the creeping distance of the unitized power module is greatly increased, and the power module has sufficient insulation capacity.

Description

Technical Field

[0001] This invention relates to the field of high-voltage, high-capacity power device technology, and in particular to a power module packaging structure and a power module. Background Technology

[0002] Traditional power modules typically use copper metal base plates as a mechanical support and a carrier for efficient heat conduction. However, the large-scale parallel connection of chips in high-voltage, high-capacity power modules requires the use of ultra-large area metal base plates as a structural carrier.

[0003] In existing technologies, high-voltage, high-capacity power modules can be configured with multiple unitized power modules, each with its own small-area insulating substrate. Electrical connections between these unitized power modules constitute a complete power module. However, ensuring sufficient insulation performance for these unitized power modules is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a power module packaging structure that can ensure that the power module has sufficient insulation capability; another purpose of this invention is to provide a power module that can ensure that the power module has sufficient insulation capability.

[0005] To address the aforementioned technical problems, this invention provides a power module packaging structure, including a base plate, an isolation plate, and multiple unitized power modules;

[0006] The base plate surface is provided with a plurality of unitized power modules, and there is a gap between adjacent unitized power modules. Adjacent unitized power modules are electrically connected to each other through connecting components, which are positioned across the base plate.

[0007] The isolation plate is provided on the surface of the base plate at the position corresponding to the gap, and the side surface of the isolation plate facing the edge of the unitized power module is an insulating surface; the projection position of the edge forming the gap in the adjacent unitized power module along the thickness direction on the surface of the base plate is located within the insulating surface.

[0008] Optionally, the isolation plate is located below the gap, and the insulating surface covers the projection of the gap onto the base plate.

[0009] Optionally, the unitized power module has a substrate, which is fixedly connected to the base plate by an adhesive layer, with the edge of the substrate suspended above the base plate, and the gap formed between adjacent substrates;

[0010] The edge of the insulating surface is located within the projection range of the substrate along the thickness direction onto the base plate, and outside the projection range of the adhesive layer along the thickness direction.

[0011] Optionally, the surface of the area where the base plate contacts the adhesive layer is provided with grooves.

[0012] Optionally, the plurality of unitized power modules are arranged sequentially on the surface of the base plate along a first direction, and the plurality of isolation plates are arranged sequentially on the base plate along the first direction.

[0013] Optionally, the base plate includes a heat dissipation layer and a core layer along the thickness direction, wherein the coefficient of thermal expansion of the core layer is smaller than that of the heat dissipation layer.

[0014] Optionally, the base plate includes a first heat dissipation layer, a first connecting layer, a core layer, a second connecting layer, and a second heat dissipation layer arranged sequentially along the thickness direction, and the unitized power module is located on the surface of the first heat dissipation layer.

[0015] Optionally, the base plate has a groove on its surface, and the isolation plate is located within the groove.

[0016] Optionally, the groove is filled with an insulating material that covers the isolation plate.

[0017] Optionally, the groove extends from the first heat dissipation layer to the first connecting layer, and the isolation plate is fixedly connected to the first connecting layer within the groove.

[0018] Optionally, the isolation plate includes a solder layer, a metal layer and an insulating ceramic layer arranged sequentially along the thickness direction, wherein the solder layer is fixedly connected to the first connecting layer.

[0019] The present invention also provides a power module, including the power module packaging structure as described in any of the preceding claims.

[0020] The present invention provides a power module packaging structure, including a base plate, an isolation plate, and multiple unitized power modules; multiple unitized power modules are disposed on the surface of the base plate, with gaps between adjacent unitized power modules, and adjacent unitized power modules are electrically connected to each other through connecting components, which are positioned across the base plate; an isolation plate is disposed on the surface of the base plate corresponding to the gaps, and the side surface of the isolation plate facing the edge of the unitized power module is an insulating surface; the projection position of the edge forming the gap in the adjacent unitized power module on the surface of the base plate is located within the insulating surface.

[0021] By setting an isolation plate on the surface of the base plate, and ensuring that the projection of the opposite edges of adjacent unitized power modules along the thickness direction on the base plate surface is located within the insulating surface of the isolation plate, the creepage path of the unitized power module cannot extend directly downwards along the thickness direction to the base plate at its edge. Instead, it needs to creep horizontally to the outside of the insulating surface at its edge first, and then creep along the thickness direction to the base plate. This greatly increases the creepage distance of the unitized power module and ensures that the power module has sufficient insulation capability.

[0022] The present invention also provides a power module, which has the same beneficial effects as described above, and will not be described in detail here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of a power module packaging structure provided in an embodiment of the present invention;

[0025] Figure 2 for Figure 1 Schematic diagram of the structure of the unitized power module;

[0026] Figure 3 for Figure 1 Top view of the midsole plate;

[0027] Figure 4 for Figure 1 A partial view;

[0028] Figure 5 Figure 1 creepage path diagram of a modular power module;

[0029] Figure 6 This is a side view of a specific base plate provided in an embodiment of the present invention;

[0030] Figure 7 This is a side view of a specific isolation plate provided in an embodiment of the present invention.

[0031] In the figure: 1. Unitized power module, 101. Source copper layer, 102. Drain copper layer, 103. Control signal ceramic copper-clad substrate, 104. Power chip, 105. Power bonding wire, 106. Gate control terminal of main power chip, 107. Source control terminal of main power chip, 108. Gate control terminal of auxiliary power chip, 109. Source control terminal of auxiliary power chip, 110. Drain-side capacitor terminal of power module, 111. Source-side capacitor terminal of power module, 112. Control bonding wire, 113. Substrate;

[0032] 2. Base plate; 21. Core layer; 22. First heat dissipation layer; 23. Second heat dissipation layer; 24. First connecting layer; 25. Second connecting layer; 201. Trench;

[0033] 3. Isolation plate, 301. Insulating ceramic layer, 302. Metal layer, 303. Solder layer;

[0034] 4. Connecting components. Detailed Implementation

[0035] The core of this invention is to provide a power module packaging structure. In the prior art, high-voltage, high-capacity power modules can be configured with multiple unitized power modules, each with its own small-area insulating substrate. Electrical connections between different unitized power modules constitute a complete power module. However, for unitized power modules, the creepage distance is only vertically downwards from the edge of the insulating substrate to the base plate. This short creepage distance results in poor insulation performance of the substrate in the unitized power module.

[0036] The power module packaging structure provided by the present invention includes a base plate, an isolation plate, and multiple unitized power modules. Multiple unitized power modules are disposed on the surface of the base plate, and there is a gap between adjacent unitized power modules. Adjacent unitized power modules are electrically connected to each other through connecting components, which are positioned across the base plate. An isolation plate is disposed on the surface of the base plate corresponding to the gap, and the side surface of the isolation plate facing the edge of the unitized power module is an insulating surface. The projection position of the edge forming the gap in the adjacent unitized power modules on the surface of the base plate is located within the insulating surface.

[0037] By setting an isolation plate on the surface of the base plate, and ensuring that the projection of the opposite edges of adjacent unitized power modules along the thickness direction on the base plate surface is located within the insulating surface of the isolation plate, the creepage path of the unitized power module cannot extend directly downwards along the thickness direction to the base plate at its edge. Instead, it needs to creep horizontally to the outside of the insulating surface at its edge first, and then creep along the thickness direction to the base plate. This greatly increases the creepage distance of the unitized power module and ensures that the power module has sufficient insulation capability.

[0038] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] Example 1

[0040] Please refer to Figures 1 to 5 , Figure 1 This is a schematic diagram of a power module packaging structure provided in an embodiment of the present invention; Figure 2 for Figure 1 Schematic diagram of the structure of the unitized power module; Figure 3 for Figure 1 Top view of the midsole plate; Figure 4 for Figure 1 A partial view; Figure 5 Figure 1 The creepage path diagram of a modular power module.

[0041] See Figure 1 In this embodiment of the invention, the power module packaging structure includes a base plate 2, an isolation plate 3, and multiple unitized power modules 1. Multiple unitized power modules 1 are disposed on the surface of the base plate 2, with gaps between adjacent unitized power modules 1. Adjacent unitized power modules 1 are electrically connected to each other via connecting components 4, which straddle the base plate 2. The isolation plate 3 is disposed on the surface of the base plate 2 corresponding to the gaps, and the side of the isolation plate 3 facing the edge of the unitized power module 1 is an insulating surface. The projection of the edge forming the gap in adjacent unitized power modules 1 along the thickness direction onto the surface of the base plate 2 is located within the insulating surface.

[0042] The aforementioned base plate 2 serves as a heat sink for the entire power module packaging structure, primarily functioning to dissipate heat. The specific structure of the base plate 2 will be described in detail in the following embodiments and will not be repeated here. The aforementioned unitized power module 1 is disposed on the surface of the base plate 2. Each unitized power module 1 typically includes a substrate 113 and functional structures located on the surface of the substrate 113. The aforementioned base plate 2 is typically a large-area base plate 2, while the substrate 113 relative to the base plate 2 is typically a small-area substrate 113. Multiple substrates 113 are typically disposed on the surface of the base plate 2.

[0043] See Figure 2Each substrate 113 typically has a functional structure on its surface, which usually includes any one or any combination of the following: a source copper cladding layer 101, a drain copper cladding layer 102, a control signal ceramic copper cladding substrate 103, a power chip 104, a power bonding wire 105, a gate control terminal 106 for the main power chip, a source control terminal 107 for the main power chip, a gate control terminal 108 for the auxiliary power chip, a source control terminal 109 for the auxiliary power chip, a drain-side capacitor terminal 110 for the power module, a source-side capacitor terminal 111 for the power module, a control bonding wire 112, etc. The specific content of the functional structure can be set according to the actual situation and is not specifically limited here.

[0044] In this embodiment, there is a gap between adjacent unitized power modules 1, and the unitized power modules 1 need to be electrically connected to form a complete high-voltage, high-capacity power module. In this embodiment, the adjacent unitized power modules 1 can be electrically connected to each other across the gap by a connecting component 4. Obviously, the connecting component 4 is specifically positioned above the base plate 2. The specific structure of the connecting component 4 can be referred to in the prior art, and will not be described in detail here. The connecting component 4 can be a bridge or a bonding wire, etc., and is not specifically limited here.

[0045] See Figure 3 An isolation plate 3 is provided on the surface of the base plate 2 at the position corresponding to the above-mentioned gap. Along the thickness direction, the isolation plate 3 is usually located below the substrate 113 in the unitized power module 1. The isolation plate 3 is specifically set at the position corresponding to the gap. The side surface of the isolation plate 3 facing the edge of the unitized power module 1 needs to be an insulating surface, that is, the upper surface of the isolation plate 3 is usually an insulating surface. The insulating surface is a non-conductive surface, which is usually formed by insulating material.

[0046] In this embodiment, the projection of the edge forming the gap in adjacent unitized power modules 1 along the thickness direction onto the surface of the base plate 2 is located within the insulating surface. Since the gap is located between adjacent unitized power modules 1, it is specifically formed by two adjacent edges of adjacent unitized power modules 1. These edges are typically adjacent edges of two adjacent substrates, with the gap formed between these two edges. The projection of the edge along the thickness direction must specifically lie within the insulating surface; that is, the area directly below the edge must fall within the insulating surface. This prevents the creepage path of the unitized power module 1 from contacting the base plate 2 vertically downwards from its edge.

[0047] The aforementioned modular power module 1 can be manufactured by soldering alone and can also be tested independently, avoiding the situation where a single component is damaged and the entire module is scrapped after using a large substrate 113 to solder all components and complete the required processes.

[0048] In this embodiment, one isolation plate 3 is provided for each gap. Each isolation plate 3 has an insulating surface. The isolation plate 3 can be located below the gap, and the insulating surface covers the projection of the gap onto the base plate 2. At this time, the size of the insulating surface is usually not smaller than the size of the gap. The projections of the two edges of the same gap along the thickness direction can fall on the same insulating surface. In this case, only one isolation plate 3 needs to be provided between adjacent unitized power modules 1.

[0049] See Figure 4 In this embodiment, the unitized power module 1 has a substrate 113, which is fixedly connected to the base plate 2 via an adhesive layer. The edge of the substrate 113 is suspended above the base plate 2, and a gap is formed between adjacent substrates 113. The edge of the insulating surface is located within the projection range of the substrate 113 along the thickness direction onto the base plate 2, but outside the projection range of the adhesive layer along the thickness direction. Specifically, the substrate 113 can be a ceramic copper-clad substrate 113, or a substrate 113 with a metal-insulator-metal sandwich structure; no specific limitation is made here.

[0050] The substrate 113 and the base plate 2 are typically fixedly connected by an adhesive layer, which can be a layered structure formed by materials such as solder. Since the adhesive layer has a certain thickness, in this embodiment, the edge of the substrate 113 can be suspended above the base plate 2, and a gap is formed between adjacent substrates 113. In this embodiment, the edge of the insulating surface can be located within the projection range of the substrate 113 along the thickness direction, i.e., the insulating surface can extend below the substrate 113, and the isolation plate 3 can extend below the substrate 113; however, the insulating surface needs to be located outside the projection range of the adhesive layer along the thickness direction, i.e., the insulating surface typically does not extend below the adhesive layer, and the isolation plate 3 typically does not extend below the adhesive layer, to ensure a firm connection between the unitized power module 1 and the base plate 2.

[0051] In this embodiment, the creepage requirements for power module 1 to the base plate 2 are higher, such as... Figure 5 As shown, the specific creepage path in this embodiment is as follows: starting from the right edge of the source copper layer 101 of the first unitized power module 1, creeping perpendicularly to the right side of the substrate 113 along the upper surface of the substrate 113 to the right edge, then creeping perpendicularly to the lower surface of the substrate 113 along the right side of the substrate 113 to the right edge of the lower surface of the substrate 113, and finally creeping perpendicularly to the right side of the lower copper layer of the substrate 113 along the lower surface of the substrate 113 to the junction of the substrate 113 and the base plate 2, forming the shortest creepage path from the first power module 1 to the base plate 2. Obviously, the above-mentioned isolation plate 3 can greatly increase the creepage distance and avoid the creepage path from the edge of the substrate 113 directly downward to the base plate 2.

[0052] In this embodiment, a groove 201 is provided on the surface of the area where the base plate 2 contacts the adhesive layer. The groove 201 is typically provided on the surface of the base plate 2. When the base plate 2 is a multi-layer laminated composite structure, the groove 201 is provided on the surface of the uppermost layer of the floor. Specifically, the groove 201 is provided in the area where the base plate 2 contacts the adhesive layer; that is, the adhesive layer is fixedly connected to the base plate 2 at the point where it contacts the groove 201. Since the base plate 2 is fixedly connected to multiple unitized power modules 1 in this embodiment, there are multiple areas on the surface of the base plate 2 that contact the adhesive layer. In each area where the base plate 2 contacts the adhesive layer, at least one groove 201 is provided, and usually multiple grooves 201 are provided. These multiple grooves 201 are typically parallel to each other and evenly spaced in the area where the base plate 2 contacts the adhesive layer. The groove 201 is used to absorb and accommodate the warping deformation of the base plate 2 and adhesive layer caused by thermal stress during use, ensuring temperature connection between the base plate 2 and the substrate 113.

[0053] In this embodiment, the plurality of unitized power modules 1 are arranged sequentially along a first direction on the surface of the base plate 2, and the plurality of partition plates 3 are arranged sequentially along the first direction on the base plate 2. The first direction is usually the long side direction of the base plate 2. In this case, the plurality of partition plates are distributed in parallel, dividing the base plate 2 into multiple regions and fixing them to the corresponding unitized power modules 1.

[0054] The power module packaging structure provided in this embodiment, by setting an isolation plate 3 on the surface of the base plate 2, and ensuring that the projection positions of the opposite edges of adjacent unitized power modules 1 along the thickness direction on the surface of the base plate 2 are located within the insulating surface of the isolation plate 3, prevents the creepage path of the unitized power module 1 from extending directly downwards along the thickness direction to the base plate 2. Instead, it requires creeping horizontally to the outside of the insulating surface and then creeping along the thickness direction to the base plate 2, thereby greatly increasing the creepage distance of the unitized power module 1 and ensuring that the power module has sufficient insulation capability. Using localized reinforced insulation can further reduce thermal resistance and lower the manufacturing difficulty.

[0055] The specific details of the power module packaging structure provided by this invention will be described in detail in the following embodiments.

[0056] Example 2

[0057] Please refer to Figure 6 as well as Figure 7 , Figure 6 This is a side view of a specific base plate provided in an embodiment of the present invention; Figure 7 This is a side view of a specific isolation plate provided in an embodiment of the present invention.

[0058] Unlike the embodiments described above, the embodiments of the present invention further define the structure of the base plate 2 based on the embodiments described above. The remaining details have been described in detail in the embodiments described above and will not be repeated here.

[0059] See Figure 6 In this embodiment of the invention, the base plate 2 includes a heat dissipation layer and a core layer 21 along the thickness direction. The coefficient of thermal expansion of the core layer 21 is smaller than that of the heat dissipation layer. Specifically, a composite plate is used as the base plate 2 in this embodiment. The base plate 2 is formed by combining the heat dissipation layer and the core layer 21 along the thickness direction. The coefficient of thermal expansion of the core layer 21 needs to be smaller than that of the heat dissipation layer to reduce the coefficient of thermal expansion of the large base plate 2. The heat dissipation layer is mainly used for heat dissipation, while the core layer 21 is mainly used to reduce the coefficient of thermal expansion of the base plate 2, thereby preventing warping or other deformations of the base plate 2 during use. Typically, the layer on the side of the base plate 2 facing the unitized power module 1 is the heat dissipation layer, which can promptly conduct heat away from the unitized power module 1.

[0060] Specifically, in this embodiment, the base plate 2 includes a first heat dissipation layer 22, a first connecting layer 24, a core layer 21, a second connecting layer 25, and a second heat dissipation layer 23 arranged sequentially along the thickness direction. The unitized power module 1 is located on the surface of the first heat dissipation layer 22. That is, in this embodiment, the core layer 21 serves as the middle layer of the base plate 2. The first heat dissipation layer 22 is disposed on the side facing the unitized power module 1, and the first heat dissipation layer 22 and the core layer 21 are fixedly connected by the first connecting layer 24. The second heat dissipation layer 23 is disposed on the side of the core layer 21 away from the unitized power module 1, and the second heat dissipation layer 23 and the core layer 21 are fixedly connected by the second connecting layer 25. Specifically, the core layer 21 can be a silicon carbide aluminum (AlSiC) layer, the first heat dissipation layer 22 and the second heat dissipation layer 23 can be copper layers, and the first connecting layer 24 and the second connecting layer 25 can be sintered silver layers or low-temperature sintered copper layers.

[0061] In preparing the aforementioned base plate 2, metal deposition methods such as electroplating, vapor deposition, and magnetron sputtering can be used to deposit 5-100 micrometer-sized copper, silver, or gold metals as part of the first connecting layer 24 and part of the second connecting layer 25 on the surface of a low-CTE metal, non-metal, or alloy material such as silicon carbide aluminum, molybdenum, copper molybdenum, or copper tungsten. In the first heat dissipation layer 22 and the second heat dissipation layer 23, 5-100 micrometer-sized copper, silver, or gold metals such as copper or aluminum are deposited as part of the first connecting layer 24 and part of the second connecting layer 25.

[0062] Subsequently, using low-temperature copper sintering, low-temperature silver sintering, low-temperature liquid phase diffusion technology or soft soldering method, the low CTE core layer 21, the high thermal conductivity first heat dissipation layer 22 and the second heat dissipation layer 23 are sintered or welded together to form a multi-layer structure. The sintering temperature is usually less than 250°C, the sintering time is usually less than 60 minutes, and the sintering pressure is usually less than 20 MPa to form the aforementioned base plate 2.

[0063] In this embodiment, a groove is provided on the surface of the base plate 2, and the isolation plate 3 is located in the groove. The groove is used to hold the isolation plate 3, so the position of the groove needs to correspond to the position of the isolation plate 3. The groove is usually set to correspond to the position of the gap. Specifically, in this embodiment, the groove extends from the first heat dissipation layer 22 to the first connecting layer 24, and the isolation plate 3 is fixedly connected to the first connecting layer 24 in the groove. When setting the groove, the first heat dissipation layer 22 can be prepared according to the area of ​​the base plate 2 that needs to contact the bonding layer during the preparation of the first heat dissipation layer 22. When bonding the core layer 21 and the first heat dissipation layer 22, the first heat dissipation layer 22 and the core layer 21 are connected to each other according to the position of the unitized power module 1, thereby forming the groove between adjacent first heat dissipation layers 22. This method can avoid high-depth etching of the first heat dissipation layer 22 and simplify the preparation process. The depth of the groove is typically between 0.05mm and 1mm. It is used to control the amount of copper on the first heat dissipation layer 22 on the base plate 2 in the plane and vertical directions, control its thermomechanical stress, and minimize the residual stress when the base plate 2 is connected to the unitized substrate 113 over a large area in subsequent processes.

[0064] In this embodiment, the isolation plate 3 can be specifically disposed within the aforementioned groove. The isolation plate 3 is typically fixedly connected to the bottom surface of the groove, meaning it is usually bonded to the first connecting layer 24. The groove is typically filled with an insulating material covering the isolation plate 3 to ensure its insulating performance. This insulating material can be PI (polyimide) or similar materials; however, the specific material is not specifically limited in this embodiment.

[0065] See Figure 7 In this embodiment, the isolation plate 3 includes a solder layer 303, a metal layer 302, and an insulating ceramic layer 301 arranged sequentially along its thickness direction. The solder layer 303 is fixedly connected to the first connecting layer 24. The insulating ceramic layer 301 forms an insulating surface, the metal layer 302 is mainly used for the fixed connection between the solder layer 303 and the insulating ceramic layer 301, and the solder layer 303 is mainly used for the fixed connection between the isolation plate 3 and the base plate 2. The bonding process between the isolation plate 3 and the first connecting layer 24 can refer to the process of the fixed connection between the first heat dissipation layer 22 and the core layer 21, and will not be described again here.

[0066] The power module packaging structure provided in this embodiment is suitable for 1200V SiC MOSFET chips, 3.3kV, 6.5kV, and 10kV SiC high-voltage devices or silicon-based power devices, etc. Using a base plate 2 with a core layer 21 effectively solves problems such as warping of the base plate 2 during use due to its excessive thermal expansion coefficient. Since the grooves are used to accommodate the isolation plate 3, an array of grooves is formed in the base plate 2. This array-groove design allows for the control of thermomechanical stress and residual stress from large-area connections in the multi-layered base plate 2.

[0067] Example 3

[0068] Unlike the embodiments described above, this invention further describes the power module based on the aforementioned embodiments. The specific structure of this power module can be referenced in correspondence with the structure of the power module packaging described above.

[0069] In this embodiment of the invention, the power module includes the power module packaging structure described in the above embodiments. The specific structure of the power module packaging structure has been described in detail in the above embodiments and will not be repeated here. The power module provided in this embodiment, equipped with the above-described power module packaging structure, can have sufficient insulation capability.

[0070] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0071] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0072] The foregoing has provided a detailed description of a power module packaging structure and a power module provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A power module packaging structure, characterized in that, Includes a base plate, isolation plate, and multiple unitized power modules; The base plate surface is provided with a plurality of unitized power modules, and there is a gap between adjacent unitized power modules. Adjacent unitized power modules are electrically connected to each other through connecting components, which are positioned across the base plate. The isolation plate is provided on the surface of the base plate at the position corresponding to the gap, and the side surface of the isolation plate facing the edge of the unitized power module is an insulating surface; The unitized power module has a substrate, which is fixedly connected to the base plate by an adhesive layer. The edge of the substrate is suspended above the base plate, and a gap is formed between adjacent substrates. The isolation plate is located below the gap, and the edge of the insulating surface is located within the projection range of the substrate along the thickness direction on the base plate, and outside the projection of the adhesive layer along the thickness direction. The creepage path of the unitized power module starts from the edge of the source copper layer of the unitized power module, creeps along the upper surface of the substrate to the edge of the substrate, then creeps along the side of the substrate to the edge of the lower surface of the substrate, and finally creeps along the lower surface of the substrate to the junction of the substrate and the base plate.

2. The power module packaging structure according to claim 1, characterized in that, The surface of the area where the base plate contacts the adhesive layer is provided with grooves.

3. The power module packaging structure according to claim 1, characterized in that, The plurality of unitized power modules are arranged sequentially on the surface of the base plate along a first direction, and the plurality of isolation plates are arranged sequentially on the base plate along the first direction.

4. The power module packaging structure according to claim 1, characterized in that, The base plate includes a heat dissipation layer and a core layer along the thickness direction, wherein the coefficient of thermal expansion of the core layer is less than that of the heat dissipation layer.

5. The power module packaging structure according to claim 4, characterized in that, The base plate includes a first heat dissipation layer, a first connecting layer, a core layer, a second connecting layer, and a second heat dissipation layer arranged sequentially along the thickness direction, and the unitized power module is located on the surface of the first heat dissipation layer.

6. The power module packaging structure according to claim 5, characterized in that, The base plate has a groove on its surface, the isolation plate is located in the groove, and the groove is filled with insulating material covering the isolation plate.

7. The power module packaging structure according to claim 6, characterized in that, The groove extends from the first heat dissipation layer to the first connecting layer. The isolation plate is fixedly connected to the first connecting layer within the groove. The isolation plate includes a solder layer, a metal layer, and an insulating ceramic layer arranged sequentially along the thickness direction. The solder layer is fixedly connected to the first connecting layer.

8. A power module, characterized in that, Includes the power module packaging structure as described in any one of claims 1 to 7.

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