LED display unit and manufacturing method thereof

Abstract

The invention relates to the technical field of micro LEDs, in particular to an LED display unit and a manufacturing method thereof. The invention provides a manufacturing method of an LED display unit. The manufacturing method comprises the following steps of inversely transferring at least one LED chip and a driving chip to a substrate assembly; the substrate assembly is coated with glue to form a first glue layer so as to wrap the LED chip and the driving chip, and electrodes of the LED chip and the driving chip are reserved through etching; performing circuit construction on the LED chip and the driving chip; and carrying out secondary gluing on the substrate assembly to form a second glue layer to wrap the circuit, and carrying out pin manufacturing based on the second glue layer. A reverse manufacturing scheme is adopted. According to the manufacturing method of the LED display unit, the chip is firstly arranged on the substrate assembly, then photoetching development is gradually carried out on the circuit on the chip to manufacture the circuit, and the circuit is protected through two times of photoresist coating before and after circuit manufacturing, so that the production efficiency and the qualified rate of the LED display unit are greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of micro LEDs, and in particular to an LED display unit and a manufacturing method thereof. Background Art

[0002] Micro LED (micro light-emitting diode display) display technology refers to a display technology that uses self-luminous micron-sized LEDs (light-emitting diodes) as light-emitting pixel units and assembles them on a driving panel to form a high-density LED array. Due to the small size, high integration and self-luminescence of Micro LED chips, Micro LEDs have greater advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability compared to LCD and OLED in terms of display. Micro LED applications will expand from flat panel displays to AR / VR / MR, space displays, flexible transparent displays, wearable / implantable optoelectronic devices, optical communications / optical interconnections, medical detection, smart car lights and many other fields. It is expected that by 2025, products based on Micro-LED technology such as high-end TVs, mobile phones, watches, etc. will gradually be launched on the market, and the market output value will exceed US$2.8 billion.

[0003] Micro LED will have great application prospects in the future, but the current cost of Micro LED manufacturing has seriously affected its commercialization process. The main reason is that the bottleneck of transfer technology still needs to be broken through. In the related technology, it is necessary to transfer the chips one by one using a swing-arm device. On the one hand, the swing-arm transfer requires a suction nozzle for adsorption, but when the chip size is too small, the suction nozzle cannot be used. It is therefore difficult to transfer chips with smaller sizes, and the transfer speed is limited. On the other hand, in order to ensure that the chip is electrically connected correctly, the accuracy of the transfer position needs to be maintained during the chip transfer process. However, it is difficult for existing transfer equipment to meet the requirements of accuracy and transfer speed at the same time. Therefore, the manufacturing of LED display units in the related technology is time-consuming and labor-intensive, and the product manufacturing qualification rate is not high, which makes the manufacturing and production cost of LED display units too high. Summary of the invention

[0004] In the related art, it is difficult to ensure both transfer rate and transfer accuracy in the manufacturing process of LED display units, which results in the problem that the manufacturing of LED display units is time-consuming and labor-intensive, and the product manufacturing qualification rate is not high.

[0005] In a first aspect, the present application provides a method for manufacturing an LED display unit, which comprises the following steps:

[0006] Transferring at least one LED chip and a driver chip upside down to a substrate assembly;

[0007] Applying glue on the substrate assembly to form a first glue layer to wrap the LED chip and the driver chip, and leaving electrodes of the LED chip and the driver chip by etching;

[0008] Conducting circuit construction on the LED chip and the driver chip;

[0009] A second adhesive layer is formed on the substrate assembly to wrap the circuit, and pins are manufactured based on the second adhesive layer.

[0010] In combination with the first aspect, in one embodiment, before transferring the at least one LED chip and the driver chip upside down to the substrate assembly, the method further includes:

[0011] A sapphire or glass plate is used as a substrate, and insulating glue is coated on the surface of the substrate to manufacture the substrate assembly.

[0012] In combination with the first aspect, in one implementation, the step of applying glue on the substrate assembly to form a first glue layer to wrap the LED chip and the driver chip includes:

[0013] The first glue layer is formed by covering the LED chip and the driver chip with black photoresist to encapsulate the LED chip and the driver chip.

[0014] In combination with the first aspect, in one implementation, the circuit construction of the LED chip and the driver chip includes:

[0015] Corresponding circuits are led out on the LED chip and the driver chip pins by exposure and development.

[0016] In combination with the first aspect, in one embodiment, the second coating of the substrate assembly to form a second adhesive layer to wrap the circuit includes: using a printing or spin coating process to cover the circuit with photoresist to form the second adhesive layer. 6. The method for manufacturing an LED display unit according to claim 5, characterized in that the pin manufacturing based on the second adhesive layer includes:

[0017] Using photolithography technology to expose and etch contact points on the LED chip and the driver chip pins of the second glue layer;

[0018] The cover is pressed onto the photoresist to fix it and complete the pin production.

[0019] In combination with the first aspect, in one implementation, the step of pressing the cover plate onto the photoresist to complete the fixation includes:

[0020] A sapphire cover plate or a glass cover plate with a welding reserved groove is pressed onto the second adhesive layer.

[0021] In combination with the first aspect, in one implementation, completing the pin production includes:

[0022] Installing a plurality of copper blocks in the welding reserved grooves of the cover plate;

[0023] The copper block is connected to the contact points on the LED chip and the driver chip pins by eutectic welding.

[0024] In combination with the first aspect, in one embodiment, the driver chip is provided with five pin connection points, and the five pin connection points are respectively used to connect to an external data input terminal, a clock signal input, a red light forward power signal, a blue-green light forward power signal and a ground wire.

[0025] In a second aspect, the present application provides an LED display unit, which is manufactured using any of the manufacturing methods of the LED display unit described above.

[0026] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0027] The present application transfers the chip upside down onto the substrate assembly, and then gradually makes the circuit from the chip. Therefore, there is no need to align and weld the chip with the connecting pad chip when the chip is transferred. In this way, the requirements for accuracy during chip movement are reduced, and the chip is allowed to have a certain position deviation. Furthermore, the present application applies glue before and after the LED chip and the driver chip circuit structure. The two layers of glue can protect the chip circuit, avoid short circuits or non-required connections between the chip circuits, and greatly improve the product qualification rate. As a result, the implementation scheme of the present application can realize batch transfer of chips while ensuring the qualification rate of chip products, thereby improving the production efficiency of LED display units. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 This is a top view of an LED display unit after transferring the LED chip in one embodiment of the present application;

[0030] Figure 2 This is a top view of an LED display unit after transferring the LED chip and the driver chip in one embodiment of the present application;

[0031] Figure 3 This is a cross-sectional view of an LED display unit after transferring the LED chip and the driver chip in one embodiment of the present application;

[0032] Figure 4 This is a cross-sectional view of an LED display unit after the first photoresist coating in one embodiment of the present application;

[0033] Figure 5 This is a top view of the LED display unit in one embodiment of the present application after the circuit structure is completed;

[0034] Figure 6 This is a cross-sectional view of an LED display unit in an embodiment of the present application after the circuit structure is completed;

[0035] Figure 7 This is a cross-sectional view of an LED display unit after the second photoresist coating in one embodiment of the present application;

[0036] Figure 8 This is a cross-sectional view of an LED display unit during the cover plate pressing process in one embodiment of the present application;

[0037] Fig. 9 This is a cross-sectional view of an LED display unit after eutectic welding of a copper block in one embodiment of the present application;

[0038] Fig.10 This is a top view of an LED display unit after eutectic welding of a copper block in one embodiment of the present application;

[0039] Fig.11 This is a schematic diagram of a driver chip in one embodiment of the present application;

[0040] Fig.12 This is a schematic diagram of the working principle of a driver chip in one embodiment of the present application.

[0041] In the figure: 1. LED chip; 2. driver chip; 3. substrate assembly; 4. cover plate; 5. copper block; 6. first adhesive layer; 7. second adhesive layer. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] In the related art, it is difficult to ensure both transfer rate and transfer accuracy in the manufacturing process of LED display units, which results in the problem that the manufacturing of LED display units is time-consuming and labor-intensive, and the product manufacturing qualification rate is not high.

[0044] In a first aspect, the present application provides a method for manufacturing an LED display unit in an embodiment, which comprises the following steps:

[0045] Step S1, manufacturing a substrate assembly 3.

[0046] Specifically, the above step S1 includes: using a sapphire or glass plate as a substrate, and coating the surface of the substrate with insulating glue to form the substrate assembly 3. Preferably, the insulating glue coating method can be spin coating.

[0047] It should be noted that the applicant has found that the flatness of the substrate assembly 3 will also affect the transfer speed due to certain precision requirements on the transfer position during chip transfer. Sapphire or glass plate materials have high flatness, so sapphire or glass plate materials are used to make the substrate in the above embodiment. Furthermore, in the above embodiment, a layer of high-viscosity glue is applied on the substrate to assist in the subsequent steps of transferring the bonded chip.

[0048] Step S2: transfer at least one LED chip 1 and a driver chip 2 upside down to the substrate assembly 3.

[0049] It should be noted that in this application, the LED chip 1 and the driver chip 2 need to be arranged on the substrate assembly 3, and a line connection is required between the two. The driver chip 2 controls the LED chip 1 to achieve static control of the lamp beads, thereby increasing the brightness of the LED screen while reducing power consumption. The chip inversion transfer process used in step S2 of this application can be directly turned upside down on the substrate assembly 3 with the electrical surface of the chip facing down, shortening the signal transmission path between chips, thereby greatly shortening the interconnection distance, increasing the connection density, and reducing resistance and inductance, thereby improving the electrical performance and heat dissipation of the chip.

[0050] Furthermore, since the inverted transfer has no lead frame, this packaging method has stronger impact resistance and can meet the needs of mass chip transfer. In order to improve production efficiency, multiple chips can be arranged on a carrier sheet first, and then inverted onto the substrate assembly 3 after arrangement, so that they can be transferred in batches.

[0051] It is worth noting that, due to the inverted transfer without lead frame, this packaging method has stronger impact resistance and can meet the needs of mass chip transfer. In addition, the substrate assembly 3 is made of sapphire or glass material, with high overall flatness. The combination of the two makes the transfer process yield and production rate higher.

[0052] The present application provides a preferred embodiment, such as Figure 1 As shown, taking an LED lamp bead unit as an example, three LED chips 1 of different colors can be transferred to one of the substrate components 3. Since the substrate component 3 is coated with high-viscosity glue, it is convenient to bond the LED chips 1.

[0053] It should be noted that the number of LED chips 1 transferred from a single LED lamp bead unit is not limited to 3, and the number of driver chips 2 is not limited to 1. During the production process, different numbers of LED chips 1 and driver chips 2 can be combined and designed as needed, and multiple chip combinations can be transferred at the same time.

[0054] In combination with the above preferred embodiments, in one implementation mode, Figure 2 As shown, three LED chips 1 and a driver chip 2 are arranged on the left and right of a substrate assembly 3 to facilitate subsequent circuit fabrication.

[0055] It is worth mentioning that 驱 The dynamic chip 2, namely the IC driver chip (Integrated Circuit Chip), is used to realize static control of the lamp beads, improve the brightness of the LED screen and reduce power consumption. The driver chip 2 is built into the lamp beads, and each lamp bead can be controlled individually through the driver chip 2. The brightness control is more precise, and different from the traditional display screen (using dynamic scanning), the brightness efficiency of this method is 100%, which reduces the brightness loss. Therefore, compared with the traditional display screen at the same brightness, the LED display unit produced in this application has lower power consumption. And when using the same Micro LED chip, a higher brightness of the entire screen can be achieved.

[0056] In some preferred embodiments, Fig.12 As shown, the driver chip 2 includes: a power input module, a power processing module, a power output port, a signal input module, and a signal processing module;

[0057] The operation logic of the driver chip 2 includes: the power input module receives the power from the outside, part of which is used to power the IC, and part of which is converted into a constant current to power the LED chip through the output port; the signal input module receives data and clock information, and the data information includes address code information and LED lighting related information. When the signal is input for the first time, the type of information is determined by the terminal and tail of different information. If it is address code information, the chip will be written with a new address code, which will become the default address code value of the chip in the future.

[0058] Furthermore, the use principle of the driver chip 2 includes: when the subsequent signal is input, it is necessary to judge whether the corresponding address code of the written information is the same in the signal processing module and the address storage module to execute the subsequent instruction, and if it is different, it will not be processed. Other information is to control the power processing module to output the corresponding current value to different power output ports to achieve the purpose of achieving different chip brightness.

[0059] In some optional embodiments, the signals of all chips of the LED display unit are connected in parallel to the same bus, and the bus outputs data uniformly. When the data address code is the same as the address code written by the chip, the subsequent instructions are executed.

[0060] It is worth noting that the present application has the driver chip 2 built into the lamp bead, which can realize the individual control of each lamp bead, and the brightness control is more precise. Different from the traditional display screen (using dynamic scanning), the brightness efficiency of this method is 100%, which reduces the loss of brightness, so the power consumption is lower at the same brightness. And when the same Micro LED chip is used, a higher brightness of the entire screen can be achieved.

[0061] In some specific embodiments, Fig.11 As shown, the driver chip 2 has 8 connection points, including: DIN, CLK, VCCR, VCC, GND, OUT1, OUT2, and OUT 3. Among them, DIN is used as data input, CLK is used as clock signal input, VCCR is used as red light positive power signal; VCC is used as blue-green light positive power signal; GND is used for grounding; OUT1-3 are used as negative pole signals of LED.

[0062] Furthermore, in the above specific embodiment, the external connection points of the LED display unit equipped with the driving chip 2 only include five pin connection points: DIN, CLK, VCCR, VCC, and GND.

[0063] It can be understood that the LED display unit equipped with a driver chip 2 does not require the introduction of an additional IC. The overall module design is simple and has few circuits. It only needs to reserve the corresponding input data port and power port. This can realize an ultra-thin display module while meeting the terminal's requirements for power consumption and brightness.

[0064] Step S3, applying glue on the substrate assembly 3 to form a first glue layer 6 to wrap the LED chip 1 and the driver chip 2, and leaving out the electrodes of the LED chip 1 and the driver chip 2 by etching.

[0065] In some optional embodiments, the photoresist coating process may be completed by a printing or spin coating process.

[0066] It is understandable that the method of spin coating is used to distribute the photoresist onto a substrate rotating at high speed, and a uniform film is formed by centrifugal force and diffusion of the viscous resist. The process steps of spin coating are short, the obtained film is smooth and the thickness is precisely controlled, which is suitable for scenes requiring high-speed and high-quality coating. The principle of using printing for photoresist coating is to deposit the photoresist in the form of droplets, and to achieve coating by controlling the formation and deposition of droplets. Therefore, the printing process is suitable for situations where the substrate surface has a large number of features or different morphologies. When used specifically, the appropriate coating method can be selected according to the use conditions and application scenarios.

[0067] Specifically, the gluing process in the above step S3 includes: Figure 4 As shown, black photoresist is covered around the LED chip 1 and the driver chip 2 to form a first glue layer 6 , and the first glue layer 6 is used to wrap the LED chip 1 and the driver chip 2 .

[0068] It should be noted that the application of the photoresist in the above step S3 of the present application plays a filling role on the one hand, which is convenient for the subsequent circuit production. The underfill glue is applied around the chip so that the chip is wrapped with the underfill glue, so that the chip has the underfill effect function. On the other hand, the first glue layer 6 is used to prevent the subsequent circuit production process from causing short circuits or non-required connections between the circuits of the chips.

[0069] Furthermore, in order to facilitate the subsequent steps of using photolithography technology to construct circuits for the electrodes of the LED chip 1 and the driver chip 2, after applying the first glue layer 6 in the above step S3, the electrodes of the LED chip 1 and the driver chip 2 are left out by etching.

[0070] Step S4, constructing circuits for the LED chip 1 and the driver chip 2.

[0071] Specifically, Figure 5 As shown, photolithography technology is used to lead out corresponding circuits on the pins of the LED chip 1 and the driver chip 2 by exposure and development, and the circuits include a conductive circuit between the LED chip 1 and the driver chip 2.

[0072] It is understandable that in the chip design stage, software will be used to design and simulate the circuit to ensure that the connections between the various components are correct. In the manufacturing process of step S4 above, the designed circuit pattern is transferred to the wafer through photolithography technology to form various electronic components and connections between them. These connections can be regarded as "wires" between chips, and data transmission and function realization between chips are achieved by controlling the size and direction of voltage and current.

[0073] It is worth noting that if Figure 6 As shown, the above steps of the present application adopt a solution of reverse production from the front. That is, the LED chip 1 and the driver chip 2 are first placed on the substrate assembly 3, and then the circuits are gradually photolithographically developed from the chip to produce the circuits, so that a certain position deviation is allowed when the chip is transferred to the substrate. And because the circuit is made from the electrode, the overall production difficulty is reduced. In the embodiment of the present application, the conductive circuit is post-produced, so the requirements for the initial position accuracy are not high, which reduces the production difficulty and improves the yield rate.

[0074] Step S5, applying glue a second time on the substrate assembly 3 to form a second glue layer 7 to wrap the circuit.

[0075] It is worth mentioning that the second coating of photoresist is used to wrap the circuit to prevent short circuit with other circuits during subsequent pin welding.

[0076] Step S6: Exposing and etching the contact points on the pins of the LED chip 1 and the driver chip 2 by photolithography technology.

[0077] It is worth noting that after the second adhesive layer 7 is coated, the five external contact points need to be exposed to facilitate the subsequent production of pins.

[0078] Step S7: Figure 8 As shown, the cover plate 4 is pressed onto the second adhesive layer 7 to complete the fixation.

[0079] It can be understood that by laminating the cover plate 4 with the adhesive layer on the substrate assembly 3, the problem of board bending and warping that is prone to occur during reflow soldering of the circuit board is solved.

[0080] In some optional embodiments, the cover plate 4 may be a sapphire cover plate or a glass cover plate.

[0081] It is worth noting that the sapphire cover has a high hardness. The cover plate 4 is made of a sapphire cover plate, which can protect the lamp beads in the future and prevent the ejector pin from damaging the chip.

[0082] Furthermore, the cover plate 4 needs to be patterned before being pressed and fixed. The patterning of the cover plate 4 includes opening a reserved groove on the cover plate 4 for subsequent welding of the copper block 5.

[0083] Step S8: completing the pin production.

[0084] Specifically, Fig. 9 As shown, multiple copper blocks 5 are installed in the welding reserved grooves of the cover plate 4, and the copper blocks 5 are connected to the contact points on the pins of the LED chip 1 and the driver chip 2 by eutectic welding to form the electrodes of the product, thereby connecting the chip pins and the circuits together. Finally, gold is plated on the surface of the pins by chemical deposition to form a protective coating to prevent surface oxidation. Fig.10 As shown, the LED display unit is finally produced.

[0085] In a second aspect, the present application provides an LED display unit, which is manufactured using the manufacturing method of the LED display unit described in any of the above embodiments.

[0086] Furthermore, if Fig.10 As shown, the LED display unit includes an LED chip 1 and a driving chip 2 which are arranged on a substrate assembly 3 .

[0087] In some specific embodiments, Fig.11As shown, the driver chip 2 has 8 connection points, including: DIN, CLK, VCCR, VCC, GND, OUT1, OUT2, and OUT 3. Among them, DIN is used as data input, CLK is used as clock signal input, VCCR is used as red light positive power signal; VCC is used as blue-green light positive power signal; GND is grounded; OUT1-3 are used as negative pole signals of LED.

[0088] In some preferred embodiments, the driver chip 2 is internally divided into a power input module, a power processing module, a power output port, a signal input module, and a signal processing module;

[0089] The operation logic of the driver chip 2 includes: the power input module receives the power from the outside, part of which is used to power the IC, and part of which is converted into a constant current to power the LED chip through the output port; the signal input module receives data and clock information, and the data information includes address code information and LED lighting related information. When the signal is input for the first time, the type of information is determined by the terminal and tail of different information. If it is address code information, the chip will be written with a new address code, which will become the default address code value of the chip in the future.

[0090] Furthermore, the use principle of the driver chip 2 includes: when the subsequent signal is input, it is necessary to judge whether the corresponding address code of the written information is the same in the signal processing module and the address storage module to execute the subsequent instruction, and if it is different, it will not be processed. Other information is to control the power processing module to output the corresponding current value to different power output ports to achieve the purpose of achieving different chip brightness.

[0091] In some optional embodiments, the signals of all chips of the LED display unit are connected in parallel to the same bus, and the bus outputs data uniformly. When the data address code is the same as the address code written by the chip, the subsequent instructions are executed.

[0092] It is worth noting that the present application has built-in driver chips in the lamp beads, which can realize individual control of each lamp bead, and the brightness control is more precise. Unlike traditional display screens (using dynamic scanning), this method has a brightness efficiency of 100%, which reduces brightness loss, so the power consumption is lower at the same brightness. And when the same Micro LED chip is used, a higher brightness of the entire screen can be achieved. The overall module design of the present application is simple, with few lines, and no additional IC needs to be introduced. Only the corresponding input data port and power port need to be reserved, which can realize an ultra-thin display module while meeting the terminal's requirements for power consumption and brightness.

[0093] In summary, in order to solve the problem of low production efficiency caused by high precision requirements of equipment for chip transfer in traditional solutions, this application adopts a reverse production solution. First, the chip is placed on the substrate assembly, and then the circuit is gradually photolithographically developed from the chip to produce the circuit, and the circuit is protected by two photoresist coatings before and after the circuit is produced, which greatly improves the production efficiency and qualified rate of the LED display unit.

[0094] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0095] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0096] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A method for manufacturing an LED display unit, characterized in that: The following steps are involved: Transferring at least one LED chip (1) and a driver chip (2) upside down to a substrate assembly (3); Applying glue on the substrate assembly (3) to form a first glue layer (6) to wrap the LED chip (1) and the driver chip (2), and leaving electrodes of the LED chip (1) and the driver chip (2) by etching; Producing circuit structures for the LED chip (1) and the driver chip (2); A second adhesive layer (7) is formed on the substrate assembly (3) to wrap the circuit, and pins are manufactured based on the second adhesive layer (7).

2. The method for manufacturing the LED display unit according to claim 1, characterized in that: Before the at least one LED chip (1) and the driver chip (2) are invertedly transferred to the substrate assembly (3), the method further comprises: A sapphire or glass plate is used as a substrate, and insulating glue is coated on the surface of the substrate to produce the substrate assembly (3).

3. The method for manufacturing the LED display unit according to claim 1, characterized in that: The method of applying glue on the substrate assembly (3) to form a first glue layer (6) to wrap the LED chip (1) and the driver chip (2) comprises: The first glue layer (6) is formed by covering the LED chip (1) and the driver chip (2) with black photoresist to encapsulate the LED chip (1) and the driver chip (2).

4. The method for manufacturing the LED display unit according to claim 3, characterized in that: The circuit construction of the LED chip (1) and the driver chip (2) comprises: Corresponding circuits are led out on the pins of the LED chip (1) and the driver chip (2) by means of exposure and development.

5. The method for manufacturing the LED display unit according to claim 3, characterized in that: The secondary coating of the substrate assembly (3) to form a second glue layer (7) to wrap the circuit comprises: using a printing or spin coating process to cover the circuit with photoresist to form the second glue layer (7).

6. The method for manufacturing the LED display unit according to claim 5, characterized in that: The pin production based on the second adhesive layer (7) comprises: Using photolithography technology to expose and etch contact points on the pins of the LED chip (1) and the driver chip (2) of the second adhesive layer (7); The cover plate (4) is pressed onto the photoresist to complete fixation and pin production.

7. The method for manufacturing the LED display unit according to claim 6, characterized in that: The step of pressing the cover plate (4) onto the photoresist to complete the fixing comprises: A sapphire cover plate or a glass cover plate with a welding reserved groove is pressed onto the second adhesive layer (7).

8. The method for manufacturing the LED display unit according to claim 7, characterized in that: The pin production process includes: Installing a plurality of copper blocks (5) in the welding reserved grooves of the cover plate (4); The copper block (5) is connected to the contact points on the pins of the LED chip (1) and the driver chip (2) through eutectic welding.

9. The method for manufacturing the LED display unit according to claim 1, characterized in that: The driving chip (2) is provided with five pin connection points, and the five pin connection points are respectively used to connect to an external data input terminal, a clock signal input, a red light forward power signal, a blue-green light forward power signal and a ground line.

10. An LED display unit, characterized in that: The LED display unit is manufactured by the manufacturing method of any one of claims 1 to 9.

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