Packaging adhesive film and photovoltaic module comprising same

Abstract

An encapsulation adhesive film for a photovoltaic module includes an encapsulation layer and a heat resistant layer disposed adjacent to the encapsulation layer. The encapsulation layer includes polyethylene in an amount of 50 wt% to 100 wt%. The heat resistant layer includes one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), a cycloolefin polymer (COP), a cycloolefin copolymer (COC), polylactic acid (PLA), polyvinyl furanate (PEF), an isosorbide polymer, and polycarbonate (PC) in an amount of 50 wt% to 100 wt%.

Description

Technical Field

[0001] The present application generally relates to an encapsulation film for a photovoltaic module, a photovoltaic module including the encapsulation film, and a method for manufacturing the photovoltaic module. Background Art

[0002] Photovoltaic modules are widely used to generate electricity from sunlight. Photovoltaic modules can be produced using heterojunction technology (HJT) and smart grid connection technology (SWCT) to improve cost and performance efficiency compared to conventional bus bar technology.

[0003] Photovoltaic modules produced using HJT and SWCT typically include multiple conductors (eg, wires) connecting multiple photovoltaic layers together and transparent films that encapsulate and secure the conductors to the photovoltaic layers.

[0004] An example of a currently used transparent film includes unmodified polyethylene (PE). However, multiple conductors may burn through the unmodified polyethylene during the manufacture of the photovoltaic module. In addition, the use of unmodified polyethylene may cause shear stresses to be transmitted to the interface between the photovoltaic layer and the multiple conductors during vacuum lamination and / or during service due to thermal cycling. Another example of a currently used transparent film includes a PET / LDPE (polyethylene terephthalate / low-density polyethylene) structure. However, PET may block ultraviolet light, thereby reducing the efficiency of the photovoltaic module. Summary of the invention

[0005] An encapsulation film for a photovoltaic module has been developed. The encapsulation film can provide reliable adhesion of multiple conductors to the photovoltaic layer of the photovoltaic module. In other words, the encapsulation film can have improved dimensional stability so that the multiple conductors can be securely placed on the photovoltaic layer during the manufacture of the photovoltaic module. In addition, the encapsulation film can prevent the multiple conductors from burning through the photovoltaic module during the manufacture of the photovoltaic module and during the operation of the photovoltaic module. In addition, the encapsulation film can provide dimensional stability, thereby allowing a more reliable electrical connection between the multiple conductors and the photovoltaic module. The encapsulation film can be substantially transparent to UV light, visible light, and IR light, thereby improving the efficiency of the photovoltaic module during operation.

[0006] One embodiment of the present disclosure is an encapsulation film for a photovoltaic module. The encapsulation film includes an encapsulation layer, and the encapsulation layer includes polyethylene in an amount of 50% to 100% by weight. The encapsulation film further includes a heat-resistant layer, and the heat-resistant layer is arranged adjacent to the encapsulation layer. The heat-resistant layer includes one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC) in an amount of 50% to 100% by weight.

[0007] During the manufacture of the photovoltaic module, the encapsulation layer can be bonded to the plurality of conductors and to the photovoltaic layer of the photovoltaic module. Specifically, during the lamination of the encapsulation film, the encapsulation layer can soften, flow and form around the plurality of conductors.

[0008] The heat-resistant layer can provide dimensional stability to the encapsulation layer during the manufacture of the photovoltaic module and during the operation of the photovoltaic module. In addition, the heat-resistant layer can prevent the plurality of conductors from burning through the encapsulation film during the manufacture of the photovoltaic module and during the operation of the photovoltaic module. The heat-resistant layer can also provide additional properties to the encapsulation film, such as barrier properties, anti-corrosion properties, UV resistance, etc.

[0009] In some embodiments, the polyethylene of the encapsulation layer is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid esters, and glycidyl methacrylate in an amount of 0.01 wt % to 9 wt % of the encapsulation layer. For example, the modification of the polyethylene of the encapsulation layer can improve the flow and / or adhesion properties of the encapsulation layer when heated.

[0010] In some embodiments, the polyethylene of the encapsulation layer includes at least one of ultra low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, linear medium density polyethylene, metallocene low density polyethylene, high density polyethylene, ethylene vinyl acetate, vinyl acrylate, ethylene acrylic acid and methacrylic acid copolymers.

[0011] In some embodiments, the encapsulation layer comprises a thickness of 5 microns to 100 microns.

[0012] In some embodiments, the heat-resistant layer comprises a thickness of 1.5 micrometers to 30 micrometers.

[0013] In some embodiments, the heat resistant layer comprises a glass transition temperature (Tg) greater than 85°C, and preferably greater than 140°C.

[0014] In some embodiments, the heat-resistant layer comprises a glass transition temperature (Tg) greater than 20° C. The heat-resistant layer further comprises a melting temperature (Tm) greater than 85° C., and preferably greater than 140° C.

[0015] A glass transition temperature and / or melting temperature greater than 140°C can enable the heat-resistant layer to provide dimensional stability to the encapsulation layer during the manufacture of the photovoltaic module and during the operation of the photovoltaic module, and further prevent the multiple conductors from burning through the encapsulation film during the manufacture of the photovoltaic module and during the operation of the photovoltaic module.

[0016] In some embodiments, for incident light having a wavelength greater than 280 nanometers, the encapsulation film transmits at least 80% of the incident light. In other words, in some embodiments, the encapsulation film can be substantially transparent to light having ultraviolet wavelengths, visible light wavelengths, and / or infrared wavelengths. Therefore, the encapsulation film can improve the efficiency of the photovoltaic module.

[0017] In some embodiments, the encapsulation film further includes a first adhesive layer disposed between the encapsulation layer and the heat-resistant layer, wherein the first adhesive layer bonds the heat-resistant layer to the encapsulation layer.

[0018] In some embodiments, the packaging film further includes an auxiliary layer, the auxiliary layer is opposite to the packaging layer and is disposed adjacent to the heat-resistant layer. The auxiliary layer includes 50 wt % to 100 wt % of polyethylene.

[0019] The auxiliary layer can act as a primer and improve the adhesion of the integral encapsulant layer (encapsulating the encapsulant film) to the encapsulant film. The auxiliary layer can also help to distribute stress-related forces arising from dimensional changes of the integral encapsulant layer during manufacture and operation of the photovoltaic module.

[0020] In some embodiments, the polyethylene of the auxiliary layer is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylate, and glycidyl methacrylate in an amount of 0.01 wt % to 9 wt % of the auxiliary layer. For example, the modification of the polyethylene of the auxiliary layer can improve the adhesion properties of the auxiliary layer when heated.

[0021] In some embodiments, the auxiliary layer comprises a thickness of 5 micrometers to 100 micrometers.

[0022] In some embodiments, the encapsulation layer, the heat-resistant layer, and the auxiliary layer are co-extruded together.

[0023] The encapsulation layer, the heat-resistant layer and the auxiliary layer can provide a symmetrical structure to the encapsulation film. The symmetrical structure can reduce or prevent the curling of the encapsulation film, thereby facilitating the processing of the encapsulation film.

[0024] In some embodiments, the packaging film further includes a second adhesive layer, the second adhesive layer is disposed between the auxiliary layer and the heat-resistant layer, and the second adhesive layer bonds the auxiliary layer to the heat-resistant layer.

[0025] In some embodiments, the heat-resistant layer defines an outer surface of the packaging film.

[0026] In some embodiments, at least one of the encapsulation layer and the heat-resistant layer is irradiated with a total irradiation dose of 10 kGy to 200 kGy. Irradiating the encapsulation layer and / or the heat-resistant layer can improve its heat-resistant properties.

[0027] Another embodiment of the present disclosure is an encapsulation film for a photovoltaic module. The encapsulation film includes an encapsulation layer, the encapsulation layer includes polyethylene in an amount of 50% to 100% by weight. The encapsulation film further includes a heat-resistant layer, the heat-resistant layer is arranged adjacent to the encapsulation layer. The heat-resistant layer includes one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC) in an amount of 50% to 100% by weight. The encapsulation film further includes a first adhesive layer, the first adhesive layer is arranged between the encapsulation layer and the heat-resistant layer. The first adhesive layer adheres the heat-resistant layer to the encapsulation layer. The encapsulation film further includes an auxiliary layer, the auxiliary layer is opposite to the encapsulation layer and is arranged adjacent to the heat-resistant layer. The auxiliary layer includes polyethylene in an amount of 50% to 100% by weight. The packaging film further includes a second adhesive layer, which is disposed between the auxiliary layer and the heat-resistant layer. The second adhesive layer adheres the auxiliary layer to the heat-resistant layer.

[0028] Another embodiment of the present disclosure is a photovoltaic module. The photovoltaic module includes a photovoltaic layer. The photovoltaic module further includes a plurality of conductors, and the plurality of conductors are arranged on the photovoltaic layer. The photovoltaic module further includes an encapsulation film. The encapsulation film includes an encapsulation layer that encapsulates a plurality of conductors. The encapsulation layer includes polyethylene in an amount of 50% by weight to 100% by weight. The encapsulation film further includes a heat-resistant layer, and the heat-resistant layer is arranged adjacent to the encapsulation layer. The heat-resistant layer includes one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC) in an amount of 50% by weight to 100% by weight.

[0029] In some embodiments, the photovoltaic module further includes an integral encapsulation adhesive layer that completely encloses the photovoltaic layer and the encapsulation adhesive film.

[0030] In some embodiments, the encapsulation film is not coextensive with the photovoltaic layer, such that the encapsulation film partially covers the photovoltaic layer.

[0031] In some embodiments, the photovoltaic module further comprises a front sheet and a back sheet disposed opposite to the front sheet. The photovoltaic layer is disposed between the front sheet and the back sheet. Each of the front sheet and the back sheet comprises glass or polymer.

[0032] Another embodiment of the present disclosure is a method for manufacturing a photovoltaic module. The method includes providing a photovoltaic layer. The method further includes placing a plurality of conductors on the photovoltaic layer. The method further includes laminating an encapsulation film on the photovoltaic layer, so that the encapsulation layer of the encapsulation film encapsulates the plurality of conductors.

[0033] Several aspects of the subject matter can be embodied individually or together. These aspects can be used alone or in combination with other aspects of the subject matter described herein, and the description of these aspects together is not intended to exclude the use of such aspects alone or to require these aspects alone or in different combinations. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present disclosure may be more fully understood by considering the following detailed description of various embodiments of the present disclosure in conjunction with the accompanying drawings, in which:

[0035] Figure 1 is a schematic cross-sectional view of a photovoltaic module according to an embodiment of the present disclosure;

[0036] Figure 2A and 2B is a schematic diagram of manufacturing according to an embodiment of the present disclosure Figure 1A cross-sectional view of a method of a photovoltaic module;

[0037] Figure 3 is a schematic cross-sectional view of a packaging adhesive film according to an embodiment of the present disclosure;

[0038] Figure 4 is a schematic cross-sectional view of a packaging film according to another embodiment of the present disclosure; and

[0039] Figure 5 is a schematic cross-sectional view of a packaging adhesive structure according to an embodiment of the present disclosure.

[0040] The drawings are not necessarily drawn to scale. The same numbers used in the drawings refer to similar components. However, it should be understood that the use of a number to refer to a component in a given figure is not intended to limit the component labeled with the same number in another figure. DETAILED DESCRIPTION

[0041] The present application describes an encapsulation film. The encapsulation film includes an encapsulation layer, the encapsulation layer includes polyethylene in an amount of 50 wt % to 100 wt %. The encapsulation film further includes a heat-resistant layer, the heat-resistant layer is disposed adjacent to the encapsulation layer. The heat-resistant layer includes one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC) in an amount of 50 wt % to 100 wt %.

[0042] During the manufacture of the photovoltaic module, the encapsulation layer can be bonded to the plurality of conductors and to the photovoltaic layer of the photovoltaic module. Specifically, during the lamination of the encapsulation film, the encapsulation layer can soften, flow and form around the plurality of conductors.

[0043] The heat-resistant layer can provide dimensional stability to the encapsulation layer during the manufacture of the photovoltaic module and during the operation of the photovoltaic module. In addition, the heat-resistant layer can prevent the plurality of conductors from burning through the encapsulation film during the manufacture of the photovoltaic module and during the operation of the photovoltaic module. The heat-resistant layer can further provide additional properties to the encapsulation film, such as barrier properties, anti-corrosion properties, etc.

[0044] As used herein, the terms "first" and "second" are used as identifiers. Therefore, such terms should not be interpreted as limitations on the present disclosure. When used in conjunction with features or elements, the terms "first" and "second" may be interchangeable in embodiments of the present disclosure.

[0045] As used herein, the term "film" is a material having a very high ratio of length or width to thickness. A film has two major surfaces defined by a length and a width. Films generally have good flexibility and can be used in a variety of applications. Films may also have a suitable thickness and / or material composition such that the film is flexible, semi-rigid or rigid. Films may be described as single-layer or multi-layer.

[0046] As used herein, the terms "inner" and "outer" refer to the major surfaces of a film or layer.

[0047] As used herein, the term "tie layer" refers to a layer having the primary function of bonding two adjacent layers together. The tie layer can be positioned between two layers of a multilayer film to keep the two layers in position relative to each other and prevent undesirable delamination. Unless otherwise specified, the tie layer can have any suitable composition that provides a desired level of adhesion to one or more surfaces of the contact tie layer material.

[0048] As used herein, the term "polyethylene" refers to a homopolymer or copolymer having at least one ethylene monomer bond within the repeating backbone of the polymer. The ethylene bond can be represented by the general formula: [CH2—CH2] n The polyethylene may be formed by any method known to those skilled in the art.

[0049] As used herein, the terms "ethylene / vinyl alcohol copolymer" and "EVOH" both refer to polymerized ethylene vinyl alcohol. Ethylene / vinyl alcohol copolymers include saponified (or hydrolyzed) ethylene / vinyl acrylate copolymers and refer to vinyl alcohol copolymers with ethylene comonomers prepared, for example, by hydrolysis of vinyl acrylate copolymers or by chemical reaction with vinyl alcohol. The degree of hydrolysis is preferably at least 50%, and more preferably at least 85%. Preferably, the ethylene / vinyl alcohol copolymers include about 28-48 mol % ethylene, more preferably about 32-44 mol % ethylene, and even more preferably about 38-44 mol % ethylene.

[0050] As used herein, the terms "polymethyl methacrylate" and "PMMA" refer to a polymer containing methyl methacrylate (MMA) as a monomer. The IUPAC name of PMMA is poly(methyl 2-methylpropionate).

[0051] As used herein, the terms "polymethylpentene" and "PMP" refer to a polyolefin polymer whose major component is 4-methylpentene-1.

[0052] As used herein, the terms "cycloolefin polymer" and "COP" refer to polymers obtained from cycloolefins, such as norbornene, tetracyclododecane, derivatives thereof, and the like.

[0053] As used herein, the terms "cyclic olefin copolymer" and "COC" refer to a copolymer composed of ethylene units and / or units including alpha olefins and cyclic, bicyclic or polycyclic olefins.

[0054] As used herein, the terms "polylactic acid" and "PLA" refer to polylactic acid having a main chain structure of (C3H4O2) n or [–C(CH3)HC(=O)O–] n Polylactic acid can be obtained by condensation of dehydrated lactic acid C(CH3)(OH)HCOOH. Alternatively, polylactic acid can be prepared by ring-opening polymerization of the cyclic dimer lactide [–C(CH3)HC(=O)O–]2 of the basic repeating unit.

[0055] As used herein, the terms "polyethylene furanoate" and "PEF" refer to polyethylene 2,5-furandicarboxylate.

[0056] As used herein, the term "isosorbide polymer" refers to a polymer comprising isosorbide. Isosorbide polymers may alternatively be referred to as "isosorbide-based polymers". Isosorbide polymers are bio-based polymers. Isosorbide polymers may have a similar structure and / or similar functions to PMMA. Examples of isosorbide polymers include DURABIO, available from Mitsubishi Chemical Corporation. TM .

[0057] As used herein, the terms "polycarbonate" and "PC" refer to polymers comprising the same or different carbonate units, or copolymers comprising the same or different carbonate units and one or more units other than carbonate (ie, copolycarbonate).

[0058] As used herein, the terms "ethylene vinyl acetate" and "EVA" refer to copolymers of ethylene and vinyl acetate.

[0059] As used herein, the term "polyolefin" refers to a polyolefin having the general formula (CH2CHR) n A polymer wherein R is an alkyl group.

[0060] As used herein, the term "extrusion" refers to the process of forming a continuous shape by forcing a molten plastic material through a die, followed by cooling or chemical hardening. The term "coextrusion" refers to the process of extruding two or more materials through a single die having two or more orifices, the die being arranged so that the extrudates merge together and weld into a layered structure before cooling (i.e., quenching).

[0061] As used herein, the term "modified" refers to chemical derivatives, such as chemical derivatives having anhydride functional groups in any form, such as anhydrides of maleic acid, crotonic acid, citric acid, itaconic acid, fumaric acid, etc., whether grafted onto a polymer, copolymerized with a polymer, or otherwise associated with one or more polymer functions, and also includes derivatives of such functional groups, such as acids, esters, and metal salts derived therefrom. Another example of a common modification is an acrylate-modified polyolefin.

[0062] As used herein, the terms "melting temperature" and "Tm" refer to the temperature at which the solid and liquid phases of a material can coexist in equilibrium.

[0063] As used herein, the terms "glass transition temperature" and "Tg" refer to the temperature at which the glass and liquid phases of an amorphous material exist in equilibrium at any fixed pressure, and are the temperatures that roughly define the "bend" point of a density versus temperature graph of a material. The glass transition temperature of a semi-crystalline material is below its melting temperature.

[0064] As used herein, the term "adjacent" means close, near, adjacent, adjacent or adjacent. The term includes, but is not limited to, reasonably close or near and touching, having a common border or directly in contact.

[0065] As used herein, the term "barrier properties" refers to the properties of a material or layer that controls the resistance of a permeable element such as a membrane, panel, mesh, packaging, etc. to corrosive agents, and includes but is not limited to oxygen barriers, moisture (e.g., water, humidity, etc.) barriers, chemical barriers, etc.

[0066] As used herein, the term "oxygen transmission rate" (OTR) is defined as the amount of oxygen that will pass through a material in a given period of time. When measured at a defined temperature and humidity, cm is typically used. 3 / m 2 . The OTR is defined in units of days or similar.

[0067] As used herein, the term "water vapor transmission rate" (WVTR) is defined as the steady-state rate at which water vapor permeates through a membrane under specified conditions of temperature and relative humidity. When measured at defined temperature and humidity, g / m2 is typically used. 2 . Define WVTR in units of days or similar units.

[0068] Figure 1 A schematic cross-sectional view of a photovoltaic module 10 according to an embodiment of the present disclosure is shown.

[0069] The photovoltaic module 10 includes a photovoltaic layer 12. The photovoltaic layer 12 may be a semiconductor structure, such as silicon (n + n(or p)p +). The photovoltaic layer 12 may alternatively be referred to as a solar cell layer or a semiconductor wafer.

[0070] The photovoltaic module 10 further includes a plurality of conductors 14 disposed on the photovoltaic layer 12. Specifically, the plurality of conductors 14 may be disposed on the photovoltaic layer 12 in a parallel configuration relative to each other. Figure 1 In the illustrated embodiment of FIG. 1 , the plurality of conductors 14 include a first conductor group 15A and a second conductor group 15B disposed on opposite sides of the photovoltaic layer 12. Specifically, in FIG. Figure 1 In the illustrated embodiment of FIG. 1 , the first conductor set 15A is disposed on a first major surface 13A of the photovoltaic layer 12 , and the second conductor set 15B is disposed on a second major surface 13B of the photovoltaic layer 12 opposite the first major surface 13A.

[0071] In addition, each of the plurality of conductors 14 can be arranged to be in direct contact with the photovoltaic layer 12. Each of the plurality of conductors 14 can include a metal wire coated with a coating. The coating can include an alloy with a low melting point. In some embodiments, the metal wire can be completely coated with the alloy coating, or only partially coated on one or more sides of the surface (i.e., the first main surface 13A or the second main surface 13B) contacting the photovoltaic layer 12.

[0072] The photovoltaic module 10 further includes a packaging film 100. The packaging film 100 includes a packaging layer 110 and a heat-resistant layer 120 disposed adjacent to the packaging layer 110.

[0073] like Figure 1 As shown in FIG. 1 , the encapsulation layer 110 encapsulates the plurality of conductors 14. The encapsulation layer 110 can encapsulate and fix the plurality of conductors 14 on the photovoltaic layer 12. Figure 1 In the illustrated embodiment of , the photovoltaic module 10 includes a pair of encapsulation films 100 disposed on opposite sides of the photovoltaic layer 12. In addition, the encapsulation layer 110 of one pair of encapsulation films 100 encapsulates the first conductor group 15A, and the encapsulation layer 110 of the other pair of encapsulation films 100 encapsulates the second conductor group 15B.

[0074] In some embodiments, the encapsulation film 100 is not coextensive with the photovoltaic layer 12, so that the encapsulation film 100 partially covers the photovoltaic layer 12. In other words, the size of the encapsulation film 100 may be smaller than the photovoltaic layer 12. The encapsulation film 100 may not completely cover the major surfaces 13A, 13B of the photovoltaic layer 12. Parts of the photovoltaic layer 12 on the major surfaces 13A, 13B may not be in direct contact with the plurality of conductors 14 or the encapsulation film 100.

[0075] exist Figure 1In the illustrated embodiment of the present invention, one of the pair of encapsulation films 100 completely covers the first conductor group 15A, and the other of the pair of encapsulation films 100 completely covers the second conductor group 15B. In addition, each of the pair of encapsulation films 100 partially covers the photovoltaic layer 12. The encapsulation films 100 will be referred to later. Figure 3 Detailed description.

[0076] In some embodiments, the photovoltaic module 10 further includes a front sheet 21 and a back sheet 22 disposed opposite to the front sheet 21. Specifically, the photovoltaic layer 12 may be disposed between the front sheet 21 and the back sheet 22. In some embodiments, each of the front sheet 21 and the back sheet 22 includes glass or polymer.

[0077] In some embodiments, the photovoltaic module 10 further includes an integral encapsulation adhesive layer 25 that completely encloses the photovoltaic layer 12 and the encapsulation adhesive film 100. Specifically, the integral encapsulation adhesive layer 25 can be disposed between the front plate 21 and the back plate 22, so that the integral encapsulation adhesive layer 25 completely encloses the photovoltaic layer 12 and the encapsulation adhesive film 100. In some embodiments, the integral encapsulation adhesive layer 25 can include ethylene vinyl acetate (EVA) or polyolefin elastomer (POE).

[0078] Figure 2A and 2B Schematically shows the manufacturing method according to an embodiment of the present disclosure Figure 1 A method of producing a photovoltaic module 10.

[0079] refer to Figure 1 , 2A 2B, the method includes providing a photovoltaic layer 12. The method further includes placing a plurality of conductors 14 on the photovoltaic layer 12. The plurality of conductors 14 can be placed in direct contact with the photovoltaic layer 12. In some embodiments, as Figure 1 As shown in , the method may include positioning a first conductor set 15A and a second conductor set 15B on opposite sides of the photovoltaic layer 12 .

[0080] The method further includes laminating the encapsulation film 100 on the photovoltaic layer 12, so that the encapsulation layer 110 of the encapsulation film 100 encapsulates the plurality of conductors 14. Figure 1 As shown in , the method may include laminating a first conductor group 15A located on a first main surface 13A of the photovoltaic layer 12 with one of a pair of encapsulation films 100, and laminating a second conductor group 15B located on a second main surface 13B of the photovoltaic layer 12 with the other of the pair of encapsulation films 100. It can be noted that the encapsulation film 100 can be laminated on the photovoltaic layer 12 by any suitable lamination process. In some embodiments, the encapsulation film 100 can be laminated on the photovoltaic layer 12 by vacuum lamination.

[0081] although Figure 2A and 2B Although not shown in the figure, the method may further include placing the photovoltaic layer 12 and the encapsulation film 100 between the front plate 21 and the back plate 22. The method may further include providing an integral encapsulation layer 25, so that the integral encapsulation layer 25 completely encloses the photovoltaic layer 12 and the encapsulation film 100. The integral encapsulation layer 25 may be provided in a liquid or semi-liquid state.

[0082] During the manufacture of the photovoltaic module 10, the encapsulation film 100 can be contacted with the plurality of conductors 14 with heat and pressure. This can cause the encapsulation layer 110 to soften, flow and form around the plurality of conductors 14. Thus, the encapsulation layer 110 can be bonded to the plurality of conductors 14 and the photovoltaic layer 12.

[0083] For example, the heat-resistant layer 120 can provide high stiffness due to its high melting temperature and / or high glass transition temperature. Therefore, the heat-resistant layer 120 can provide dimensional stability for the encapsulation layer 110 (the encapsulation layer may have a low melting temperature and / or a low glass transition temperature), thereby stabilizing the plurality of conductors 14 during lamination. Specifically, the heat-resistant layer 120 can provide dimensional stability for the encapsulation layer 110 (when the encapsulation layer 110 may be in a glass state during the manufacture of the photovoltaic module 10), thereby stabilizing the plurality of conductors 14, and isolating the plurality of conductors 14 from forces (e.g., shear forces) originating from the overall encapsulation layer 25, for example, during the vacuum lamination process. Therefore, the encapsulation film 100 can provide reliable adhesion of the plurality of conductors 14 to the photovoltaic layer 12. In addition, the heat-resistant layer 120 can prevent the plurality of conductors 14 from burning through the encapsulation film 100 during the manufacture of the photovoltaic module 10 and during the operation of the photovoltaic module 10.

[0084] Figure 3 A schematic cross-sectional view of a packaging adhesive film 100 according to an embodiment of the present disclosure is shown.

[0085] The encapsulation layer 110 includes polyethylene in an amount of 50% to 100% by weight. In some embodiments, the encapsulation layer 110 may include polyethylene in an amount of about 70%, about 80%, about 90%, or about 95%. In some embodiments, the encapsulation layer 110 may include only polyethylene (ie, 100% polyethylene).

[0086] In some embodiments, the polyethylene of the encapsulation layer 110 includes at least one of ultra low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, linear medium density polyethylene, metallocene low density polyethylene, high density polyethylene, ethylene vinyl acetate, vinyl acrylate, ethylene acrylic acid and methacrylic acid copolymers.

[0087] Furthermore, in some embodiments, the polyethylene of the encapsulation layer 110 is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid esters, and glycidyl methacrylate in an amount of 0.01 wt % to 9 wt % of the encapsulation layer 110. For example, the modification of the polyethylene of the encapsulation layer 110 may improve the flow and / or adhesion properties of the encapsulation layer 110 when heated.

[0088] The encapsulation layer 110 includes a thickness 110T. The thickness 110T of the encapsulation layer 110 may be an average thickness of the encapsulation layer 110. In some embodiments, the thickness 110T is 5 microns to 100 microns. In some embodiments, the thickness 110T may be about 10 microns, about 20 microns, about 30 microns, about 40 microns, about 50 microns, about 60 microns, about 70 microns, about 80 microns, or about 90 microns.

[0089] The encapsulation film 100 further includes a heat-resistant layer 120. The heat-resistant layer 120 includes one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cyclic olefin polymer (COP), cyclic olefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer, and polycarbonate (PC) in an amount of 50 wt % to 100 wt %.

[0090] exist Figure 3 In the illustrated embodiment of the encapsulation film 100, the encapsulation film 100 further includes a first adhesive layer 115 disposed between the encapsulation layer 110 and the heat-resistant layer 120. The first adhesive layer 115 bonds the heat-resistant layer 120 to the encapsulation layer 110. However, it can be noted that the first adhesive layer 115 is optional and can be omitted from the encapsulation film 100, in which case the encapsulation layer 110 is disposed adjacent to the heat-resistant layer 120.

[0091] The first bonding layer 115 may include polyethylene in an amount of 50 wt % to 100 wt %. In some embodiments, the polyethylene of the first bonding layer 115 may be modified with maleic anhydride (MAH) in an amount of 0.01 wt % to 9 wt % of the first bonding layer 115. In one example, the first bonding layer 115 may include low-density polyethylene modified with maleic anhydride.

[0092] In addition, the first adhesive layer 115 may include a thickness 115T. The thickness 115T of the first adhesive layer 115 may be an average thickness of the first adhesive layer 115. In some embodiments, the thickness 115T of the first adhesive layer 115 may be 2 micrometers to 6 micrometers.

[0093] As discussed above, for example, the heat-resistant layer 120 can provide high stiffness due to its high melting temperature and / or high glass transition temperature. Specifically, in some embodiments, the heat-resistant layer 120 includes a glass transition temperature (Tg) greater than 85° C., and preferably greater than 140° C. Such a high glass transition temperature can enable the heat-resistant layer 120 including an amorphous polymer (such as PMMA) to be able to withstand lamination during lamination with the photovoltaic module 10 ( Figure 1 ) and provide high stiffness and dimensional stability to the encapsulation layer 110 during operation of the photovoltaic module 10.

[0094] In some other embodiments, the heat-resistant layer 120 includes a glass transition temperature (Tg) greater than 20° C., and further includes a melting temperature (Tm) greater than 85° C., and preferably greater than 140° C. This combination of glass transition temperature and high melting temperature can enable the heat-resistant layer 120 including a semi-crystalline polymer (such as EVOH) to be laminated during lamination with the photovoltaic module 10 ( Figure 1 ) and provide high stiffness and dimensional stability to the encapsulation layer 110 during operation of the photovoltaic module 10.

[0095] The heat-resistant layer 120 includes a thickness 120T. The thickness 120T of the heat-resistant layer 120 may be an average thickness of the heat-resistant layer 120. In some embodiments, the thickness 120T of the heat-resistant layer 120 is 1.5 micrometers to 30 micrometers. In some embodiments, the thickness 120T may be about 5 micrometers, about 10 micrometers, about 15 micrometers, about 20 micrometers, or about 25 micrometers.

[0096] The encapsulant film 100 may need to be substantially transparent to incident light having ultraviolet (UV) wavelengths, visible light wavelengths, and infrared (IR) wavelengths to prevent the photovoltaic module 10 ( Figure 1 In other words, the encapsulant film 100 may need to be UV transparent, visible light transparent, and IR transparent in order to promote the operating efficiency of the photovoltaic module 10. To this end, in some embodiments, for incident light 30 having a wavelength greater than 280 nanometers (nm), the encapsulant film 100 transmits at least 80% of the incident light 30. In some embodiments, for incident light 30 having a wavelength greater than 280 nm, the encapsulant film 100 may transmit at least 90% of the incident light 30. Specifically, in Figure 3 In the illustrated embodiment, for incident light 30 having a wavelength greater than 280 nm, the encapsulation layer 110 , the first adhesive layer 115 and the heat-resistant layer 120 may transmit at least 80%, and preferably at least 90%, of the incident light 30 together.

[0097] In some embodiments, at least one of the encapsulation layer 110 and the heat-resistant layer 120 is irradiated with a total irradiation dose of 10 kilograys (kGy) to 200 kGy. The irradiation of at least one of the encapsulation layer 110 and the heat-resistant layer 120 may be performed by electron beam curing. Irradiating the encapsulation layer 110 and / or the heat-resistant layer 120 may improve its heat-resistant properties.

[0098] The heat-resistant layer 120 can also further provide various additional properties (e.g., barrier properties, UV resistance, corrosion resistance) for the packaging film 100. Specifically, the heat-resistant layer 120 improves resistance to potential induced degradation (PID), resistance to corrosion due to, for example, acetic acid or other corrosive compounds, and provides barrier properties (e.g., reduced water vapor transmission rate (WVTR) and reduced oxygen transmission rate (OTR)) for the packaging film 100.

[0099] exist Figure 3 In the illustrated embodiment of FIG. 1 , the heat-resistant layer 120 defines the outer surface 101 of the packaging film 100. However, in some other embodiments, the packaging film 100 may include an additional layer defining the outer surface 101. Figure 4 Examples of such additional layers are described.

[0100] Figure 4 FIG. 2 shows a schematic cross-sectional view of a packaging adhesive film 200 according to another embodiment of the present disclosure. Figure 3 Components of the encapsulation adhesive film 100 that are similar to components of the encapsulation adhesive film 200 are denoted by similar reference numerals.

[0101] exist Figure 4 In the embodiment shown in FIG. 1 , the encapsulation film 200 further includes an auxiliary layer 130 disposed opposite to the encapsulation layer 110. The heat-resistant layer 120 is disposed between the auxiliary layer 130 and the encapsulation layer 110. Figure 4 In the illustrated embodiment, the auxiliary layer 130 defines the outer surface 101 of the packaging film 200 .

[0102] In some embodiments, the auxiliary layer 130 includes polyethylene in an amount of 50 wt % to 100 wt %. In some embodiments, the polyethylene of the auxiliary layer 130 may include at least one of ultra-low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, linear medium density polyethylene, metallocene low density polyethylene, high density polyethylene, ethylene vinyl acetate, vinyl acrylate, ethylene acrylic acid, and methacrylic acid copolymers.

[0103] Furthermore, in some embodiments, the polyethylene of the auxiliary layer 130 is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid esters, and glycidyl methacrylate in an amount of 0.01 wt % to 9 wt % of the auxiliary layer 130 .

[0104] The auxiliary layer 130 can act as a primer and improve the overall encapsulation glue layer 25 ( Figure 1 ) and the packaging film 200. In some embodiments, the auxiliary layer 130 may be irradiated with a total irradiation dose of 10 kGy to 200 kGy.

[0105] The auxiliary layer 130 includes a thickness 130T. The thickness 130T of the auxiliary layer 130 may be an average thickness of the auxiliary layer 130. In some embodiments, the thickness 130T is 5 microns to 100 microns. In some embodiments, the thickness 130T may be about 10 microns, about 20 microns, about 30 microns, about 40 microns, about 50 microns, about 60 microns, about 70 microns, about 80 microns, or about 90 microns.

[0106] exist Figure 4 In the illustrated embodiment of FIG. 1 , the encapsulation adhesive film 200 further includes a second adhesive layer 125 disposed between the auxiliary layer 130 and the heat-resistant layer 120 . The second adhesive layer 125 bonds the auxiliary layer 130 to the heat-resistant layer 120 .

[0107] The second bonding layer 125 may include polyethylene in an amount of 50 wt % to 100 wt %. In some embodiments, the polyethylene of the second bonding layer 125 may be modified with maleic anhydride (MAH) in an amount of 0.01 wt % to 9 wt % of the second bonding layer 125. In one example, the second bonding layer 125 may include low-density polyethylene modified with maleic anhydride.

[0108] In addition, the second adhesive layer 125 may include a thickness 125T. The thickness 125T of the second adhesive layer 125 may be an average thickness of the second adhesive layer 125. In some embodiments, the thickness 125T of the second adhesive layer 125 may be 2 micrometers to 6 micrometers.

[0109] In some embodiments, for incident light 30 having a wavelength greater than 280 nm, the encapsulation film 200 transmits at least 80% of the incident light 30. In some embodiments, for incident light 30 having a wavelength greater than 280 nm, the encapsulation film 200 may transmit at least 90% of the incident light 30. Figure 4 In the illustrated embodiment, for incident light 30 having a wavelength greater than 280 nm, the encapsulation layer 110 , the first adhesive layer 115 , the heat-resistant layer 120 , the second adhesive layer 125 and the auxiliary layer 130 together can transmit at least 80%, and preferably at least 90% of the incident light 30 .

[0110] In addition, the encapsulation layer 110, the heat-resistant layer 120, and the auxiliary layer 130 may provide a symmetrical structure to the encapsulation film 200. The symmetrical structure may reduce or prevent curling of the encapsulation film 200, thereby facilitating processing of the encapsulation film 200. In addition, the rigidity provided by the heat-resistant layer 120 may facilitate handling of the encapsulation film 200 during a roll-to-roll process.

[0111] In addition, in some embodiments, the encapsulation layer 110, the heat-resistant layer 120 and the auxiliary layer 130 are coextruded together. In some embodiments, the auxiliary layer 130, the second adhesive layer 125, the heat-resistant layer 120, the first adhesive layer 115 and the encapsulation layer 110 are coextruded with each other and positioned relative to each other in a sequential order.

[0112] Figure 5 An encapsulation adhesive structure 300 according to an embodiment of the present disclosure is shown.

[0113] The encapsulation structure 300 includes Figure 4 Specifically, the encapsulation layer 110 of one encapsulation film 200 from the plurality of encapsulation films 200 is disposed adjacent to the auxiliary layer 130 of an adjacent encapsulation film 200 from the plurality of encapsulation films 200 .

[0114] In addition, the encapsulation glue structure 300 may optionally include a third adhesive layer 135 disposed between two adjacent encapsulation glue films 200 from a plurality of encapsulation glue films 200. The third adhesive layer 135 can make two adjacent encapsulation glue films 200 adhere to each other. The third adhesive layer 135 may include polyethylene in an amount of 50% by weight to 100% by weight. In some embodiments, the polyethylene of the third adhesive layer 135 may be modified with maleic anhydride (MAH) in an amount of 0.01% by weight to 9% by weight of the third adhesive layer 135. In one example, the third adhesive layer 135 may include low-density polyethylene modified with maleic anhydride. In addition, the third adhesive layer 135 may include a thickness 135T. The thickness 135T of the third adhesive layer 135 may be the average thickness of the third adhesive layer 135. In some embodiments, the thickness 135T of the third adhesive layer 135 may be 2 microns to 6 microns.

[0115] In a similar embodiment of the encapsulant structure 300, the structure may include two encapsulant films 200 oriented adjacent to each other with auxiliary layers 130 coextruded adjacent to each other via collapsing bubble coextruded therein, thereby creating an overall symmetrical structure.

[0116] In some embodiments, for incident light 30 with a wavelength greater than 280 nm, the encapsulant structure 300 can transmit at least 80% of the incident light 30. In some embodiments, for incident light 30 with a wavelength greater than 280 nm, the encapsulant structure 300 can transmit at least 90% of the incident light 30.

[0117] refer to Figure 1 and 5 Due to the presence of the plurality of heat-resistant layers 120 , the encapsulation adhesive structure 300 can further improve the stability of the plurality of conductors 14 and isolate the plurality of conductors 14 from forces (eg, shear forces) originating from the overall encapsulation adhesive layer 25 .

[0118] Unless expressly excluded or otherwise limited, each document cited in this application, including any cross-referenced documents, is incorporated into this application in its entirety by this reference. The citation of any document does not admit that it is prior art relative to any embodiment disclosed in this application, or that it teaches, indicates or discloses any such embodiment alone or in combination with any other one or more references. In addition, if any meaning or definition of a term in this application conflicts with any meaning or definition of the same term in a document incorporated by reference, the meaning or definition assigned to the term in this application shall prevail.

[0119] Unless otherwise indicated, all numbers expressing size, amounts, ranges, limitations, and physical and other properties used in this application are to be understood as being followed in all instances by the term “about.” Accordingly, unless expressly indicated to the contrary, the numerical parameters set forth in this application are approximations that can vary depending upon the desired properties sought to be obtained by one of ordinary skill in the art without undue experimentation using the teachings disclosed in this application.

[0120] As used in this application, the singular forms "a," "an," and "the" encompass embodiments having plural referents unless the context clearly dictates otherwise. As used in this application, the term "or" is generally used in its sense including "and / or" unless the context clearly dictates otherwise.

[0121] If used in this application, spatially relative terms, including but not limited to "lower," "upper," "bottom," "below," "above," "bottom," and "top" are used for ease of description to describe the spatial relationship of (one or more) elements to one another. Such spatially relative terms encompass different orientations of the device in use or operation, as well as specific orientations depicted in the figures and described in this application. For example, if an object depicted in a drawing is flipped or turned over, an element previously described as being below or below other elements would be above those other elements.

[0122] The accompanying drawings show some but not all embodiments. The elements depicted in the drawings are illustrative and are not necessarily drawn to scale, and the same (or similar) reference numerals represent the same (or similar) features throughout the drawings.

[0123] The disclosed descriptions, examples, embodiments, and figures are illustrative only and should not be construed as limiting. The present disclosure includes the disclosed descriptions, examples, embodiments, and figures; but is not limited to such descriptions, examples, embodiments, or figures. As briefly described above, unless explicitly indicated to the contrary, the reader should assume that the features of one disclosed embodiment may also apply to all other disclosed embodiments. Modifications and other embodiments will be apparent to those of ordinary skill in the packaging arts, and all such modifications and other embodiments are intended and deemed to be within the scope of the present disclosure.

[0124] Encapsulation Film Embodiment

[0125] A. A packaging film for a photovoltaic module, the packaging film comprising:

[0126] an encapsulation layer comprising polyethylene in an amount of 50 wt % to 100 wt %; and

[0127] A heat-resistant layer is disposed adjacent to the encapsulation layer, and the heat-resistant layer comprises 50 wt % to 100 wt % of one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC).

[0128] B. The encapsulation film according to embodiment A, wherein the polyethylene of the encapsulation layer is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid ester and glycidyl methacrylate in an amount of 0.01 wt % to 9 wt % of the encapsulation layer.

[0129] C. The encapsulation film according to any of the preceding embodiments, wherein the polyethylene of the encapsulation layer comprises at least one of ultra-low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, linear medium density polyethylene, metallocene low density polyethylene, high density polyethylene, ethylene vinyl acetate, vinyl acrylate, ethylene acrylic acid and methacrylic acid copolymers.

[0130] D. The encapsulation film according to any preceding embodiment, wherein the encapsulation layer comprises a thickness of 5 micrometers to 100 micrometers.

[0131] E. The encapsulation adhesive film according to any preceding embodiment, wherein the heat-resistant layer comprises a thickness of 1.5 micrometers to 30 micrometers.

[0132] F. The encapsulation adhesive film according to any preceding embodiment, wherein the heat-resistant layer comprises a glass transition temperature (Tg) greater than 85°C, and preferably greater than 140°C.

[0133] G. The encapsulation glue film according to any preceding embodiment, wherein the heat-resistant layer comprises a glass transition temperature (Tg) greater than 20°C, and wherein the heat-resistant layer further comprises a melting temperature (Tm) greater than 85°C, and preferably greater than 140°C.

[0134] H. The encapsulant film according to any preceding embodiment, wherein for incident light having a wavelength greater than 300 nanometers, the encapsulant film transmits at least 50%, and more preferably at least 75%, of the incident light.

[0135] I. The encapsulation adhesive film according to any preceding embodiment, further comprising a first adhesive layer disposed between the encapsulation layer and the heat-resistant layer, wherein the first adhesive layer bonds the heat-resistant layer to the encapsulation layer.

[0136] J. The encapsulation adhesive film according to any other embodiment, further comprising an auxiliary layer, the auxiliary layer being opposite to the encapsulation layer and disposed adjacent to the heat-resistant layer, the auxiliary layer comprising polyethylene in an amount of 50 wt % to 100 wt %.

[0137] K. The encapsulation adhesive film according to embodiment J, wherein the polyethylene of the auxiliary layer is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid ester and glycidyl methacrylate in an amount of 0.01 wt % to 9 wt % of the auxiliary layer.

[0138] L. The encapsulation film according to embodiment J or K, wherein the auxiliary layer comprises a thickness of 5 μm to 100 μm.

[0139] M. The encapsulation adhesive film according to any one of embodiments J to L, wherein the encapsulation layer, the heat-resistant layer and the auxiliary layer are co-extruded together.

[0140] N. The encapsulation adhesive film according to any one of embodiments J to M, further comprising a second adhesive layer disposed between the auxiliary layer and the heat-resistant layer, wherein the second adhesive layer bonds the auxiliary layer to the heat-resistant layer.

[0141] O. The encapsulation film according to any preceding embodiment, wherein the heat-resistant layer defines an outer surface of the encapsulation film.

[0142] P. The encapsulation glue film according to any preceding embodiment, wherein at least one of the encapsulation layer and the heat-resistant layer is irradiated with a total irradiation dose of 10 kilograys (kGy) to 200 kGy.

[0143] Q. A packaging film for a photovoltaic module, the packaging film comprising:

[0144] an encapsulation layer comprising polyethylene in an amount of 50 wt % to 100 wt %;

[0145] a heat-resistant layer disposed adjacent to the encapsulation layer, the heat-resistant layer comprising 50 wt % to 100 wt % of one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer, and polycarbonate (PC);

[0146] a first adhesive layer disposed between the encapsulation layer and the heat-resistant layer, wherein the first adhesive layer bonds the heat-resistant layer to the encapsulation layer;

[0147] an auxiliary layer, the auxiliary layer being disposed opposite to the encapsulation layer and adjacent to the heat-resistant layer, the auxiliary layer comprising polyethylene in an amount of 50 wt % to 100 wt %; and

[0148] A second adhesive layer is disposed between the auxiliary layer and the heat-resistant layer, wherein the second adhesive layer bonds the auxiliary layer to the heat-resistant layer.

[0149] Photovoltaic Module Embodiment

[0150] R. A photovoltaic module comprising:

[0151] Photovoltaic layer;

[0152] a plurality of conductors disposed on the photovoltaic layer; and

[0153] A packaging film, the packaging film comprising:

[0154] an encapsulation layer encapsulating the plurality of conductors, the encapsulation layer comprising polyethylene in an amount of 50 wt % to 100 wt %; and

[0155] A heat-resistant layer is disposed adjacent to the encapsulation layer, and the heat-resistant layer comprises 50 wt % to 100 wt % of one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC).

[0156] S. The photovoltaic module according to embodiment R further comprises an integral encapsulation adhesive layer completely enclosing the photovoltaic layer and the encapsulation adhesive film.

[0157] T. The photovoltaic module of embodiment R or embodiment S, wherein the encapsulant film is not coextensive with the photovoltaic layer such that the encapsulant film partially covers the photovoltaic layer.

[0158] U. The photovoltaic module of any one of embodiments R to T, further comprising a front sheet and a back sheet disposed opposite the front sheet, wherein the photovoltaic layer is disposed between the front sheet and the back sheet, and wherein each of the front sheet and the back sheet comprises glass or a polymer.

[0159] V. A method of manufacturing a photovoltaic module according to any one of embodiments R to U, the method comprising:

[0160] providing a photovoltaic layer;

[0161] disposing a plurality of conductors on the photovoltaic layer; and

[0162] The encapsulation film is laminated on the photovoltaic layer so that the encapsulation layer of the encapsulation film encapsulates the plurality of conductors.

Claims

1. A packaging film for a photovoltaic module, the packaging film comprising: an encapsulation layer comprising polyethylene in an amount of 50 wt % to 100 wt %; and A heat-resistant layer is disposed adjacent to the encapsulation layer, and the heat-resistant layer comprises 50 wt % to 100 wt % of one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC).

2. The encapsulation film according to claim 1, wherein the polyethylene of the encapsulation layer is modified by 0.01 wt % to 9 wt % of one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid ester and glycidyl methacrylate of the encapsulation layer.

3. The encapsulation film according to claim 1, wherein the polyethylene of the encapsulation layer comprises at least one of ultra low density polyethylene, low density polyethylene, linear low density polyethylene, medium density polyethylene, linear medium density polyethylene, metallocene low density polyethylene, high density polyethylene, ethylene vinyl acetate, vinyl acrylate, ethylene acrylic acid and methacrylic acid copolymer. The encapsulation film according to claim 1 , wherein the encapsulation layer has a thickness of 5 μm to 100 μm. 5 . The encapsulation adhesive film according to claim 1 , wherein the heat-resistant layer comprises a thickness of 1.5 μm to 30 μm. 6 . The encapsulation film of claim 1 , wherein the heat-resistant layer comprises a glass transition temperature (Tg) greater than 85° C. 7 . 7 . The encapsulation adhesive film of claim 1 , wherein the heat-resistant layer comprises a glass transition temperature (Tg) greater than 20° C., and wherein the heat-resistant layer further comprises a melting temperature (Tm) greater than 85° C. 8 . The packaging film of claim 1 , wherein for incident light having a wavelength greater than 300 nanometers, the packaging film transmits at least 50% of the incident light. 9 . The encapsulation adhesive film according to claim 1 , further comprising a first adhesive layer disposed between the encapsulation layer and the heat-resistant layer, wherein the first adhesive layer bonds the heat-resistant layer to the encapsulation layer. 10 . The encapsulation adhesive film according to claim 1 , further comprising an auxiliary layer, the auxiliary layer being opposite to the encapsulation layer and disposed adjacent to the heat-resistant layer, the auxiliary layer comprising polyethylene in an amount of 50 wt % to 100 wt %.

11. The encapsulation adhesive film according to claim 10, wherein the polyethylene of the auxiliary layer is modified with one of maleic anhydride, carboxylic acid, methacrylic acid, acrylic acid, acrylic acid ester and glycidyl methacrylate in an amount of 0.01 wt% to 9 wt% of the auxiliary layer. 12 . The packaging adhesive film according to claim 10 , wherein the auxiliary layer comprises a thickness of 5 μm to 100 μm. 13 . The encapsulation adhesive film according to claim 10 , wherein the encapsulation layer, the heat-resistant layer and the auxiliary layer are co-extruded together. 14 . The encapsulation adhesive film of claim 10 , further comprising a second adhesive layer disposed between the auxiliary layer and the heat-resistant layer, wherein the second adhesive layer bonds the auxiliary layer to the heat-resistant layer. 15 . The packaging adhesive film according to claim 1 , wherein the heat-resistant layer defines an outer surface of the packaging adhesive film. 16 . The encapsulation adhesive film of claim 1 , wherein at least one of the encapsulation layer and the heat-resistant layer is irradiated with a total irradiation dose of 10 kilogray (kGy) to 200 kGy.

17. A packaging film for a photovoltaic module, the packaging film comprising: an encapsulation layer comprising polyethylene in an amount of 50 wt % to 100 wt %; a heat-resistant layer disposed adjacent to the encapsulation layer, the heat-resistant layer comprising 50 wt % to 100 wt % of one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer, and polycarbonate (PC); a first adhesive layer disposed between the encapsulation layer and the heat-resistant layer, wherein the first adhesive layer bonds the heat-resistant layer to the encapsulation layer; an auxiliary layer, the auxiliary layer being disposed opposite to the encapsulation layer and adjacent to the heat-resistant layer, the auxiliary layer comprising polyethylene in an amount of 50 wt % to 100 wt %; as well as A second adhesive layer is disposed between the auxiliary layer and the heat-resistant layer, wherein the second adhesive layer bonds the auxiliary layer to the heat-resistant layer.

18. A photovoltaic module comprising: Photovoltaic layer; a plurality of conductors disposed on the photovoltaic layer; and A packaging film, the packaging film comprising: an encapsulation layer encapsulating the plurality of conductors, the encapsulation layer comprising polyethylene in an amount of 50 wt % to 100 wt %; and A heat-resistant layer is disposed adjacent to the encapsulation layer, and the heat-resistant layer comprises 50 wt % to 100 wt % of one of ethylene vinyl alcohol (EVOH), polymethyl methacrylate (PMMA), polymethylpentene (PMP), cycloolefin polymer (COP), cycloolefin copolymer (COC), polylactic acid (PLA), polyethylene furanoate (PEF), isosorbide polymer and polycarbonate (PC). 19 . The photovoltaic module according to claim 18 , further comprising an integral encapsulation adhesive layer completely enclosing the photovoltaic layer and the encapsulation adhesive film. 20 . The photovoltaic module of claim 18 , wherein the encapsulant film is not coextensive with the photovoltaic layer, such that the encapsulant film partially covers the photovoltaic layer.

21. The photovoltaic module of claim 18, further comprising a front sheet and a back sheet disposed opposite the front sheet, wherein the photovoltaic layer is disposed between the front sheet and the back sheet, and wherein each of the front sheet and the back sheet comprises glass or a polymer.

22. A method of manufacturing the photovoltaic module according to claim 18, the method comprising: providing a photovoltaic layer; disposing a plurality of conductors on the photovoltaic layer; and The encapsulation film is laminated on the photovoltaic layer so that the encapsulation layer of the encapsulation film encapsulates the plurality of conductors.

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