Semiconductor wafer glue coating device

Abstract

The present invention discloses a semiconductor wafer glue coating device, which relates to the field of wafer glue coating technology, including a bottom plate, a collection frame fixedly connected to the top of the bottom plate, a rotating cylinder rotatably connected to the inside of the collection frame, a rotating disk fixedly connected to the top of the rotating cylinder, a motor installed at the top of the bottom plate, and a positioning mechanism and a brushing mechanism. The present invention sets a brushing mechanism, the electric push rod drives the movable seat to move downward, the plug plate moves downward and contacts the push block, the push block is pushed to displace, the displacement of the push block drives the displacement block to slide, drives the positioning column to displace and separate from the wafer, and prevents friction between the positioning column and the wafer during rotation; at the same time, the displacement of the push block drives the brush pad to displace, the brush pad is displaced and contacts the edge of the wafer, so that during the rotation of the wafer, the brush pad brushes the edge of the wafer, which is convenient for preventing glue from remaining on the edge of the wafer, and the design can also facilitate the rapid replacement of the brush pad.

Description

Technical Field

[0001] The invention relates to the technical field of wafer gluing, in particular to a semiconductor wafer gluing device. Background Art

[0002] There are many ways to coat wafers with glue, such as spraying, pulling, flowing, rolling, centrifugal, etc. The most commonly used method is to use centrifugal method to rotate the coating equipment (ie, the rotary coating method). Specifically, during the rotation of the wafer, the coated photoresist flows to the edge and back of the wafer through the combined effects of centrifugal force, gravity, surface tension, etc.

[0003] However, when the glue is applied by spinning, the excess photoresist is thrown out of the wafer by centrifugal force, and glue is likely to remain on the edge of the wafer, which is difficult to remove after the glue dries. In order to prevent glue from remaining on the edge of the wafer, a semiconductor wafer glue coating device is provided. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor wafer glue coating device in order to prevent glue from remaining on the edge of the wafer.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor wafer glue coating device, comprising a bottom plate, a collecting frame is fixedly connected to the top of the bottom plate, a rotating cylinder is rotatably connected to the inside of the collecting frame, a rotating disk is fixedly connected to the top of the rotating cylinder, a motor is installed at the top of the bottom plate, a second spur gear is fixedly connected to the outer wall of the rotating cylinder, an output end of the motor is connected to the first spur gear, the first spur gear is meshed with the second spur gear, an electric push rod is arranged above the rotating disk, the output end of the electric push rod is connected to a movable seat, a nozzle is installed at the bottom end of the movable seat, a liquid inlet pipe is installed at the top of the movable seat, the liquid inlet pipe is communicated with the nozzle, the wafer is kept at the same axial position as the rotating disk by a positioning mechanism, the edge of the wafer is brushed by a brushing mechanism, and the wafer is fixed to the top of the rotating disk by an exhaust unit;

[0006] The cam is fixedly provided with a toothed plate, and the outer wall of the displacement seat is rotatably connected to the rotation shaft, and the outer wall of the displacement seat is rotatably connected to the rotation column, and one end of the rotation column is fixedly connected to the second threaded rod that passes through the toothed plate.

[0007] As a further scheme of the present invention: the brushing mechanism includes a telescopic rod, the telescopic rod is symmetrically fixedly connected to the outer wall of the movable seat, one end of the telescopic rod is fixedly connected to a plug plate, the outer wall of the sliding frame is provided with a slot and a displacement slot, the slot is for the plug plate to be inserted, the bottom end of the displacement seat is fixedly connected to a displacement block, the displacement block is slidably connected to the inner wall of the displacement slot, the interior of the sliding frame is located at the bottom end of the displacement block and is rotatably connected to a fourth spur gear, the interior of the sliding frame is located at the bottom end of the fourth spur gear and is slidably connected to a pushing block, the pushing block and the sliding frame are connected with a first spring, one end of the pushing block extends to the inner cavity of the slot, the other end of the pushing block is fixedly connected to an elastic sheet, the end of the elastic sheet away from the pushing block is fixedly connected to a docking block, one end of the docking block is provided with a mounting block, the outer wall of the mounting block is fixedly connected to a brush pad, the end of the mounting block away from the brush pad is fixedly connected to a connecting block, and the docking block is provided with a connecting groove at one end of the mounting block.

[0008] As a further solution of the present invention: the inner wall of the slide groove fits with the outer wall of the sliding frame, the outer wall of the sliding frame is provided with a first threaded hole, and the outer wall of the first threaded rod is symmetrically provided with external threads matching the first threaded hole.

[0009] As a further solution of the present invention: a second threaded hole is formed on the outer wall of the tooth block, and external threads matching the second threaded hole are symmetrically arranged on the outer wall of the second threaded rod.

[0010] As a further solution of the present invention: the outer wall of the tooth block is provided with a tooth groove, and the tooth groove is meshed with the third spur gear.

[0011] As a further solution of the present invention: the outer wall of the plug plate is in contact with the inner wall of the slot, and a first inclined surface is provided at one end of the push block located in the inner cavity of the slot.

[0012] As a further solution of the present invention: the outer walls of the displacement block and the push block are both provided with gear teeth, and the gear teeth are meshed with the fourth spur gear.

[0013] As a further solution of the present invention: the outer wall of the displacement block is in contact with the inner wall of the displacement groove, a limiting hole is provided on the outer wall of the displacement block, a limiting rod is fixedly connected to the inner wall of the displacement groove, and the outer wall of the limiting rod is in contact with the inner wall of the limiting hole.

[0014] As a further solution of the present invention: the outer wall of the connecting block is in contact with the inner wall of the connecting groove, and a rubber ring is provided on the outer wall of the connecting block.

[0015] As a further solution of the present invention: the exhaust unit includes an exhaust pipe, which is rotatably connected to the bottom end of the rotating cylinder, a ventilation groove is provided inside the rotating cylinder, a hollow groove is provided inside the rotating disk, and an air intake port is provided at the top of the rotating disk; the air intake port is connected to the exhaust pipe through the hollow groove and the ventilation groove.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. By setting a positioning mechanism, rotating the rotating block drives the first threaded rod to rotate, and the first threaded rod drives the displacement seat to move; rotating the rotating column drives the second threaded rod to rotate, and the second threaded rod drives the positioning column to move. When placing the wafer, the outer wall of the wafer contacts the four positioning columns, thereby keeping the wafer and the rotating disk in the same axial position; this design is convenient for positioning the position of the wafer, and by adjusting the position of the displacement seat and the positioning column, it is convenient to position wafers of different sizes.

[0018] 2. By setting up a brushing mechanism, the electric push rod drives the movable seat to move downward, and the plug plate moves downward to contact the pushing block, pushing the pushing block to move, and the displacement of the pushing block drives the displacement block to slide, driving the positioning column to move and separate from the wafer, thereby preventing friction between the wafer and the positioning column during rotation; at the same time, the displacement of the pushing block drives the brushing pad to move, and the displacement of the brushing pad contacts the edge of the wafer, so that during the rotation of the wafer, the brushing pad brushes the edge of the wafer to prevent glue from remaining on the edge of the wafer, and the design can also facilitate the quick replacement of the brushing pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 It is a schematic diagram of the internal structure of the collection frame of the present invention;

[0021] Figure 3 It is a schematic diagram of the internal structure of the rotating drum of the present invention;

[0022] Figure 4 It is a structural schematic diagram of the mounting frame of the present invention;

[0023] Figure 5 It is a schematic diagram of the internal structure of the displacement seat of the present invention;

[0024] Figure 6 It is a schematic diagram of the installation position of the plug board of the present invention;

[0025] Figure 7 It is a schematic diagram of the internal structure of the sliding frame of the present invention;

[0026] Figure 8 It is a schematic diagram of the internal structure of the docking block of the present invention.

[0027] In the figure: 1, bottom plate; 2, collecting frame; 3, rotating cylinder; 4, rotating disk; 5, motor; 6, positioning mechanism; 601, mounting frame; 602, slide groove; 603, sliding frame; 604, first threaded rod; 605, rotating block; 606, displacement seat; 607, third spur gear; 608, rotating rod; 609, positioning column; 610, supporting plate; 611, tooth block; 612, second threaded rod; 613, rotating column; 7, brushing mechanism; 701, telescopic rod; 702, plug plate; 703, slot; 704, displacement slot ;705, displacement block;706, fourth spur gear;707, push block;708, first spring;709, elastic sheet;710, docking block;711, mounting block;712, brush pad;713, connecting block;714, connecting groove;8, exhaust unit;801, exhaust pipe;802, ventilation groove;803, hollow groove;804, air inlet;9, first spur gear;10, second spur gear;11, electric push rod;12, movable seat;13, nozzle;14, liquid inlet pipe;15, limit rod;16, rubber ring. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0030] See also Figures 1 to 8 In an embodiment of the present invention, a semiconductor wafer glue coating device includes a base plate 1, a collecting frame 2 is fixedly connected to the top of the base plate 1, a rotating cylinder 3 is rotatably connected inside the collecting frame 2, a rotating disk 4 is fixedly connected to the top of the rotating cylinder 3, a motor 5 is installed at the top of the base plate 1, a second spur gear 10 is fixedly connected to the outer wall of the rotating cylinder 3, an output end of the motor 5 is connected to a first spur gear 9, the first spur gear 9 is meshed with the second spur gear 10, an electric push rod 11 is arranged above the rotating disk 4, an output end of the electric push rod 11 is connected to a movable seat 12, a nozzle 13 is installed at the bottom end of the movable seat 12, a liquid inlet pipe 14 is installed at the top of the movable seat 12, and the liquid inlet pipe 14 is communicated with the nozzle 13, the wafer is kept in the same axial position as the rotating disk 4 by a positioning mechanism 6, the edge of the wafer is brushed by a brushing mechanism 7, and the wafer is fixed to the top of the rotating disk 4 by an exhaust unit 8.

[0031] In this embodiment: the wafer is placed on the top of the rotating disk 4, the positioning mechanism 6 makes the wafer and the rotating disk 4 at the same axial position, the wafer is fixed on the top of the rotating disk 4 by the exhaust unit 8, and then the motor 5 is started. The operation of the motor 5 drives the first spur gear 9 to rotate, the rotation of the first spur gear 9 drives the second spur gear 10 to rotate, the rotation of the second spur gear 10 drives the rotating cylinder 3 to rotate, the rotation of the rotating cylinder 3 drives the rotating disk 4 to rotate, and the rotation of the rotating disk 4 drives the wafer to rotate; at this time, the electric push rod 11 is started, the operation of the electric push rod 11 drives the movable seat 12 to move downward, the movement of the movable seat 12 drives the nozzle 13 to move to the top of the wafer, the nozzle 13 sprays glue onto the wafer, and the wafer rotates so that the glue is evenly distributed on the surface of the wafer.

[0032] Please refer to Figures 2 to 5 The positioning mechanism 6 includes a mounting frame 601, which is fixedly connected to the top of the collection frame 2. A slide groove 602 is symmetrically provided on the top of the mounting frame 601. A sliding frame 603 is slidably connected to the inner wall of the slide groove 602. The electric push rod 11 is installed at the bottom end of the crossbar portion of the mounting frame 601. A rotating block 605 is rotatably connected to the outer wall of the mounting frame 601. A first threaded rod 604 that passes through the sliding frame 603 is fixedly connected to the outer wall of the rotating block 605. A displacement seat 606 is provided at one end of the sliding frame 603. The interior of the seat 606 is symmetrically rotatably connected to the third spur gear 607, the outer wall of the third spur gear 607 is fixedly connected to a rotating rod 608, one end of the rotating rod 608 is fixedly connected to a positioning column 609, the bottom end of the positioning column 609 is fixedly connected to a support plate 610, the interior of the displacement seat 606 is located on the outer wall of the third spur gear 607 and is slidably connected to a tooth block 611, the outer wall of the displacement seat 606 is rotatably connected to a rotating column 613, and one end of the rotating column 613 is fixedly connected to a second threaded rod 612 that passes through the tooth block 611.

[0033] In this embodiment, when adjusting the position of the sliding frame 603, the rotating block 605 is rotated, and the rotating block 605 rotates to drive the first threaded rod 604 to rotate, and the first threaded rod 604 rotates to drive the sliding frame 603 to move in the sliding groove 602, and the two sliding frames 603 move synchronously in opposite directions, thereby driving the displacement seat 606 to move; when adjusting the position of the positioning column 609, the rotating column 613 is rotated, and the rotating column 613 rotates to drive the second threaded rod 612 to rotate, and the second threaded rod 612 rotates to drive The tooth block 611 is displaced, and the displacement of the tooth block 611 drives the third spur gear 607 to rotate. The rotation of the third spur gear 607 drives the rotating rod 608 to rotate. The rotation of the rotating rod 608 drives the positioning column 609 to displace. When the wafer is placed, the outer wall of the wafer is in contact with the four positioning columns 609, thereby keeping the wafer and the rotating disk 4 in the same axial position, which is convenient for positioning the position of the wafer. The position of the displacement seat 606 and the positioning column 609 can be adjusted to facilitate the positioning operation of wafers of different sizes.

[0034] Please refer to Figures 6 to 8 The brushing mechanism 7 includes a telescopic rod 701, which is symmetrically fixedly connected to the outer wall of the movable seat 12, one end of the telescopic rod 701 is fixedly connected to a plug plate 702, the outer wall of the sliding frame 603 is provided with a slot 703 and a displacement slot 704, the slot 703 is for the plug plate 702 to be inserted, the bottom end of the displacement seat 606 is fixedly connected to a displacement block 705, the displacement block 705 is slidably connected to the inner wall of the displacement slot 704, the interior of the sliding frame 603 is located at the bottom end of the displacement block 705 and is rotatably connected to a fourth spur gear 706, and the interior of the sliding frame 603 is located at the bottom end of the fourth spur gear 706 and is slidably connected to A pushing block 707 is provided, and a first spring 708 is connected between the pushing block 707 and the sliding frame 603. One end of the pushing block 707 extends to the inner cavity of the slot 703. The other end of the pushing block 707 is fixedly connected to an elastic sheet 709. The end of the elastic sheet 709 away from the pushing block 707 is fixedly connected to a docking block 710. A mounting block 711 is provided at one end of the docking block 710. A brush pad 712 is fixedly connected to the outer wall of the mounting block 711. The end of the mounting block 711 away from the brush pad 712 is fixedly connected to a connecting block 713. A connecting groove 714 is provided at one end of the docking block 710 toward the mounting block 711.

[0035] In this embodiment, the electric push rod 11 drives the movable seat 12 to move downward, and drives the nozzle 13 to move toward the wafer. At this time, the movable seat 12 is displaced through the telescopic rod 701 to drive the plug plate 702 to move downward. The plug plate 702 moves downward and contacts the push block 707, pushing the push block 707 to move, squeezing the first spring 708. The displacement of the push block 707 drives the fourth spur gear 706 to move. The displacement of the fourth spur gear 706 drives the displacement block 705 to slide in the displacement groove 704. The displacement of the displacement block 705 drives the displacement seat 606 to move. The displacement of the displacement seat 606 drives the positioning column 609 to move with the wafer. The circles are separated to prevent friction between the wafer and the positioning column 609 during rotation; at the same time, the pushing block 707 is displaced through the elastic sheet 709 to drive the docking block 710 to move, the docking block 710 is displaced to drive the installation block 711 to move, the installation block 711 is displaced to drive the brush pad 712 to move, the brush pad 712 is displaced to contact the edge of the wafer, so that during the rotation of the wafer, the brush pad 712 brushes the edge of the wafer to prevent glue from remaining on the edge of the wafer; and the brush pad 712 can be installed and disassembled by inserting or removing the connecting block 713 into or out of the connecting groove 714, so as to facilitate the replacement operation of the brush pad 712.

[0036] Please refer to Figures 4 to 5 The inner wall of the slide groove 602 is in contact with the outer wall of the sliding frame 603 . The outer wall of the sliding frame 603 is provided with a first threaded hole. The outer wall of the first threaded rod 604 is symmetrically provided with external threads matching the first threaded hole.

[0037] In this embodiment, the rotating block 605 is rotated, the rotating block 605 drives the first threaded rod 604 to rotate, and the first threaded rod 604 drives the sliding frame 603 to move in the sliding groove 602.

[0038] Please refer to Figures 4 to 5 A second threaded hole is formed on the outer wall of the tooth block 611 , and external threads matching the second threaded hole are symmetrically arranged on the outer wall of the second threaded rod 612 . A tooth groove is formed on the outer wall of the tooth block 611 , and the tooth groove is meshed with the third spur gear 607 .

[0039] In this embodiment: the rotating column 613 is rotated, the rotating column 613 drives the second threaded rod 612 to rotate, the second threaded rod 612 rotates to drive the tooth block 611 to move, the displacement of the tooth block 611 drives the third spur gear 607 to rotate, the third spur gear 607 rotates to drive the rotating rod 608 to rotate, and the rotating rod 608 rotates to drive the positioning column 609 to move.

[0040] Please refer to Figures 6 to 8The outer wall of the insert plate 702 fits with the inner wall of the slot 703 , and a first inclined surface is provided at one end of the push block 707 located in the inner cavity of the slot 703 .

[0041] In this embodiment, the movable seat 12 is displaced by the telescopic rod 701 to drive the plug plate 702 to move downward, and the plug plate 702 moves downward to contact the push block 707, pushing the push block 707 to move.

[0042] Please refer to Figures 6 to 8 The outer walls of the displacement block 705 and the push block 707 are both provided with gear teeth, which mesh with the fourth spur gear 706. The outer wall of the displacement block 705 fits with the inner wall of the displacement groove 704. A limiting hole is provided on the outer wall of the displacement block 705. The inner wall of the displacement groove 704 is fixedly connected to the limiting rod 15, and the outer wall of the limiting rod 15 fits with the inner wall of the limiting hole.

[0043] In this embodiment, the displacement of the push block 707 drives the fourth spur gear 706 to move, the displacement of the fourth spur gear 706 drives the displacement block 705 to slide in the displacement groove 704, and the displacement of the displacement block 705 drives the displacement seat 606 to move.

[0044] Please refer to Figures 6 to 8 The outer wall of the connecting block 713 fits with the inner wall of the connecting groove 714 , and a rubber ring 16 is provided on the outer wall of the connecting block 713 .

[0045] In this embodiment: by inserting or removing the connecting block 713 into or out of the connecting groove 714 , the brush pad 712 can be installed and removed, which facilitates the replacement operation of the brush pad 712 , and the rubber ring 16 is used to improve the firmness of the connection between the connecting block 713 and the connecting groove 714 .

[0046] Please refer to Figures 2 to 3 The exhaust unit 8 includes an exhaust pipe 801, which is rotatably connected to the bottom end of the rotating cylinder 3. A ventilation groove 802 is provided inside the rotating cylinder 3, a hollow groove 803 is provided inside the rotating disk 4, and an air intake port 804 is provided at the top of the rotating disk 4; the air intake port 804 is connected to the exhaust pipe 801 through the hollow groove 803 and the ventilation groove 802.

[0047] In this embodiment: the wafer is placed on the top of the rotating disk 4, and air is extracted through the exhaust pipe 801. The exhaust pipe 801 extracts the air in the hollow groove 803 through the ventilation groove 802, and the wafer is fixed on the top of the rotating disk 4 by negative pressure. It is worth mentioning that one end of the exhaust pipe 801 is connected to the vacuum pump.

[0048] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor wafer glue coating device, comprising a base plate (1), a collecting frame (2) is fixedly connected to the top of the base plate (1), a rotating cylinder (3) is rotatably connected to the inside of the collecting frame (2), a rotating disk (4) is fixedly connected to the top of the rotating cylinder (3), a motor (5) is installed at the top of the base plate (1), a second spur gear (10) is fixedly connected to the outer wall of the rotating cylinder (3), an output end of the motor (5) is connected to a first spur gear (9), the first spur gear (9) is meshed with the second spur gear (10), an electric push rod (11) is arranged above the rotating disk (4), the output end of the electric push rod (11) is connected to a movable seat (12), a nozzle (13) is installed at the bottom end of the movable seat (12), a liquid inlet pipe (14) is installed at the top of the movable seat (12), and the liquid inlet pipe (14) is connected to the nozzle (13), characterized in that: The wafer is maintained at the same axial position as the rotating disk (4) by a positioning mechanism (6), the edge of the wafer is brushed by a brushing mechanism (7), and the wafer is fixed to the top of the rotating disk (4) by an exhaust unit (8); The positioning mechanism (6) comprises a mounting frame (601), the mounting frame (601) is fixedly connected to the top of the collecting frame (2), the top of the mounting frame (601) is symmetrically provided with a slide groove (602), the inner wall of the slide groove (602) is slidably connected to a sliding frame (603), the electric push rod (11) is mounted on the bottom end of the crossbar portion of the mounting frame (601), the outer wall of the mounting frame (601) is rotatably connected to a rotating block (605), the outer wall of the rotating block (605) is fixedly connected to a first threaded rod (604) that passes through the sliding frame (603), and one end of the sliding frame (603) is provided with a displacement seat (606). The displacement seat (606) is symmetrically rotatably connected to a third spur gear (607) inside, the outer wall of the third spur gear (607) is fixedly connected to a rotating rod (608), one end of the rotating rod (608) is fixedly connected to a positioning column (609), the bottom end of the positioning column (609) is fixedly connected to a support plate (610), the displacement seat (606) is slidably connected to the outer wall of the third spur gear (607) on the outer wall, the displacement seat (606) is rotatably connected to a rotating column (613), one end of the rotating column (613) is fixedly connected to a second threaded rod (612) that passes through the tooth block (611); The brushing mechanism (7) comprises a telescopic rod (701), the telescopic rod (701) being symmetrically fixedly connected to the outer wall of the movable seat (12), one end of the telescopic rod (701) being fixedly connected to a plug plate (702), the outer wall of the sliding frame (603) being provided with a slot (703) and a displacement groove (704), the slot (703) being for the insertion of the plug plate (702), a displacement block (705) being fixedly connected to the bottom end of the displacement seat (606), the displacement block (705) being slidably connected to the inner wall of the displacement groove (704), a fourth spur gear (706) being rotatably connected to the bottom end of the displacement block (705) inside the sliding frame (603), a push gear (706) being slidably connected to the bottom end of the fourth spur gear (706) inside the sliding frame (603), A moving block (707) is provided, wherein a first spring (708) is connected between the pushing block (707) and the sliding frame (603), one end of the pushing block (707) extends to the inner cavity of the slot (703), the other end of the pushing block (707) is fixedly connected to an elastic sheet (709), one end of the elastic sheet (709) away from the pushing block (707) is fixedly connected to a docking block (710), one end of the docking block (710) is provided with a mounting block (711), an outer wall of the mounting block (711) is fixedly connected to a brush pad (712), one end of the mounting block (711) away from the brush pad (712) is fixedly connected to a connecting block (713), and one end of the docking block (710) facing the mounting block (711) is provided with a connecting groove (714).

2. A semiconductor wafer glue coating device according to claim 1, characterized in that: The inner wall of the slide groove (602) fits with the outer wall of the sliding frame (603), the outer wall of the sliding frame (603) is provided with a first threaded hole, and the outer wall of the first threaded rod (604) is symmetrically provided with external threads matching the first threaded hole.

3. The semiconductor wafer glue coating device according to claim 1, characterized in that: The outer wall of the tooth block (611) is provided with a second threaded hole, and the outer wall of the second threaded rod (612) is symmetrically provided with external threads matching the second threaded hole.

4. The semiconductor wafer glue coating device according to claim 1, characterized in that: The outer wall of the tooth block (611) is provided with a tooth groove, and the tooth groove is meshed with the third spur gear (607).

5. The semiconductor wafer glue coating device according to claim 1, characterized in that: The outer wall of the inserting plate (702) fits the inner wall of the slot (703), and a first inclined surface is provided at one end of the pushing block (707) located in the inner cavity of the slot (703).

6. The semiconductor wafer glue coating device according to claim 1, characterized in that: The outer walls of the displacement block (705) and the push block (707) are both provided with gear teeth, and the gear teeth are meshed with the fourth spur gear (706).

7. The semiconductor wafer glue coating device according to claim 1, characterized in that: The outer wall of the displacement block (705) fits with the inner wall of the displacement groove (704); a limiting hole is provided on the outer wall of the displacement block (705); a limiting rod (15) is fixedly connected to the inner wall of the displacement groove (704); and the outer wall of the limiting rod (15) fits with the inner wall of the limiting hole.

8. The semiconductor wafer glue coating device according to claim 1, characterized in that: The outer wall of the connection block (713) fits into the inner wall of the connection groove (714), and a rubber ring (16) is provided on the outer wall of the connection block (713).

9. The semiconductor wafer glue coating device according to claim 1, characterized in that: The air extraction unit (8) comprises an air extraction pipe (801), the air extraction pipe (801) being rotatably connected to the bottom end of the rotating cylinder (3), a ventilation groove (802) being provided inside the rotating cylinder (3), a hollow groove (803) being provided inside the rotating disk (4), and an air suction port (804) being provided at the top end of the rotating disk (4); the air suction port (804) is connected to the air extraction pipe (801) via the hollow groove (803) and the ventilation groove (802).

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