Laser engraving machine and focus height detection method

Abstract

This application relates to the field of laser engraving technology, providing a laser engraving machine and a method for detecting focus height. The laser engraving machine includes: a housing; a Z-axis drive assembly connected to the housing; a laser module connected to the Z-axis drive assembly, the Z-axis drive assembly driving the laser module to move along the Z-axis; a detection slider connected to the laser module, the detection slider being movable relative to the laser module on the Z-axis; a contact switch mounted on the laser module, the contact switch being located on the movement path of the detection slider; and a control component mounted on the housing, the contact switch and the Z-axis drive assembly being electrically connected to the control component, the control component receiving an electrical signal generated by the contact switch, and the control component being configured to determine the working height of the laser module based on the electrical signal generated by the contact switch. The focus height detection method according to the embodiments of this application achieves intelligent detection and determination of the working height of the laser module, enabling accurate and rapid determination of the focus height.

Description

Technical Field

[0001] This application relates to the field of laser engraving technology, and in particular to laser engraving machines and methods for detecting focus height. Background Technology

[0002] With the advancement of technology and the continuous development of society, various DIY small desktop devices are becoming increasingly popular. In particular, laser engraving machines are widely used in the fields of material cutting and engraving due to their simple structure, strong versatility, and low cost.

[0003] Among related technologies, determining the focusing height of a laser engraving machine is quite complicated. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the related art. To this end, this application proposes a laser engraving machine that can accurately and quickly determine the focus height.

[0005] The laser engraving machine according to the first aspect of this application includes:

[0006] case;

[0007] Z-axis drive assembly, connected to the housing;

[0008] A laser module is connected to the Z-axis drive assembly, which is used to drive the laser module to move along the Z-axis;

[0009] A detection slider is connected to the laser module, and the detection slider can move relative to the laser module on the Z-axis;

[0010] A contact switch is installed on the laser module, and the contact switch is located on the moving path of the detection slider;

[0011] A control component is mounted on the housing. The contact switch and the Z-axis drive assembly are both electrically connected to the control component. The control component is used to receive the electrical signal generated by the contact switch. The control component is configured to determine the working height of the laser module based on the electrical signal generated by the contact switch.

[0012] According to the laser engraving machine of this application embodiment, when the workpiece is located below the laser engraving machine, the control unit controls the Z-axis drive assembly to move the laser module along the Z-axis, causing the laser module and the detection slider mounted on the laser module to move towards the workpiece. When the detection slider contacts the workpiece, under the reaction force of the workpiece, the detection slider will move relative to the laser module and trigger a contact switch. After the contact switch is triggered, it generates an electrical signal, which is sent to the control unit. This allows the control unit to determine the working height of the laser module based on the electrical signal generated by the contact switch, thus realizing intelligent detection and determination of the working height of the laser module, and enabling accurate and quick determination of the focus height.

[0013] According to one embodiment of this application, the laser module includes a body and a guide post. The guide post is connected to the connecting surface of the body away from the housing. The detection slider is sleeved on the guide post and can slide relative to the guide post. The contact switch is installed on the connecting surface and is located between the detection slider and the connecting surface.

[0014] According to one embodiment of this application, the laser engraving machine includes at least two contact switches, the at least two contact switches including a first contact switch and a second contact switch, the first contact switch and the second contact switch being symmetrically arranged about the guide post.

[0015] According to one embodiment of this application, a buffer block is connected to the end face of the detection slider that is away from the detection surface.

[0016] According to one embodiment of this application, the laser engraving machine further includes a motion component, which is mounted on the housing, and a Z-axis drive component is connected to the motion component. The motion component is used to drive the Z-axis drive component to move along the X-axis and / or Y-axis.

[0017] According to one embodiment of this application, the motion component includes an X-axis drive component, and the Z-axis drive component is connected to the X-axis drive component. The X-axis drive component is used to drive the Z-axis drive component to move along the X-axis direction.

[0018] According to one embodiment of this application, the motion component includes a Y-axis drive component mounted on the housing, and an X-axis drive component connected to the Y-axis drive component, wherein the Y-axis drive component is used to drive the X-axis drive component to move.

[0019] According to one embodiment of this application, the housing has a receiving cavity, and the moving component is disposed within the receiving cavity.

[0020] According to one embodiment of this application, the laser engraving machine further includes a plurality of support columns connected to the housing, the plurality of support columns being evenly arranged along the circumference of the housing.

[0021] The focus height detection method according to the second aspect of this application includes:

[0022] Obtain the feedback signal of the contact switch;

[0023] The focusing height of the laser module is determined based on the feedback signal from the contact switch and the motion data from the Z-axis drive assembly.

[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is one of the structural schematic diagrams of the laser engraving machine provided in the embodiments of this application;

[0027] Figure 2 This is a second schematic diagram of the structure of the laser engraving machine provided in the embodiments of this application;

[0028] Figure 3 This is provided by the embodiments of this application. Figure 2 Enlarged structural diagram at point A;

[0029] Figure 4 This is one of the partial structural schematic diagrams of the laser engraving machine provided in the embodiments of this application;

[0030] Figure 5 This is a second partial structural schematic diagram of the laser engraving machine provided in the embodiments of this application;

[0031] Figure 6 This is a schematic flowchart of the focus height detection method provided in the embodiments of this application. Detailed Implementation

[0032] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0033] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0035] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0037] The following is combined with Figures 1 to 6 This application describes the laser engraving machine and the method for detecting focus height.

[0038] According to the embodiments of the first aspect of this application, such as Figure 1 and Figure 2 As shown, the laser engraving machine includes:

[0039] Casing 10;

[0040] Z-axis drive assembly 20 is connected to the housing 10;

[0041] The laser module 30 is connected to the Z-axis drive assembly 20, which is used to drive the laser module 30 to move along the Z-axis.

[0042] A detection slider 40 is connected to the laser module 30, and the detection slider 40 can move relative to the laser module 30 on the Z-axis;

[0043] A contact switch 50 is installed on the laser module 30, and the contact switch 50 is located on the moving path of the detection slider 40;

[0044] A control component 60 is installed on the housing 10. The contact switch 50 and the Z-axis drive assembly 20 are both electrically connected to the control component 60. The control component 60 is used to receive the electrical signal generated by the contact switch 50. The control component 60 is configured to determine the working height of the laser module 30 based on the electrical signal generated by the contact switch 50.

[0045] According to the laser engraving machine of this application embodiment, when the workpiece is located below the laser engraving machine, the control component 60 controls the Z-axis drive assembly 20 to move the laser module 30 along the Z-axis, causing the laser module 30 and the detection slider 40 mounted on the laser module 30 to move towards the workpiece. When the detection slider 40 contacts the workpiece, under the reaction force of the workpiece, the detection slider 40 will move relative to the laser module 30 and trigger the contact switch 50. After the contact switch 50 is triggered, it generates an electrical signal, which is sent to the control component 60. The control component 60 can determine the working height of the laser module 30 based on the electrical signal generated by the contact switch 50, realizing intelligent detection and determination of the working height of the laser module 30, and accurately and quickly determining the focus height.

[0046] Understandably, focus height is a crucial parameter when using a laser engraving machine, directly impacting the quality and effect of engraving or cutting. Focus height refers to the distance between the laser head and the surface of the material being processed. Correct focus height ensures the laser beam is focused on the material surface, resulting in optimal engraving or cutting effects.

[0047] For example, the control unit 60 can determine the working time of the Z-axis drive assembly 20 based on the time it receives the electrical signal generated by the contact switch 50, which means it can determine the time it takes for the Z-axis drive assembly 20 to drive the laser module 30 to move along the Z-axis to the workpiece. Based on the working parameters of the Z-axis drive assembly 20, the control unit 60 can determine the moving speed of the laser module 30, and then determine the moving distance of the laser module 30, that is, the working height of the laser module 30, and then determine the focusing height of the laser engraving machine.

[0048] In some embodiments, such as Figure 2 and Figure 3 As shown, the laser module 30 includes a body 301 and a guide post. The guide post is connected to the connecting surface 302 of the body 301 away from the housing 10. The detection slider 40 is sleeved on the guide post and can slide relative to the guide post. The contact switch 50 is installed on the connecting surface 302 and is located between the detection slider 40 and the connecting surface 302.

[0049] Understandably, the guide post guides the movement of the detection slider 40. The contact switch 50 is positioned between the detection slider 40 and the connecting surface 302; therefore, when the detection slider 40 contacts the workpiece and moves towards the connecting surface 302, it triggers the contact switch 50.

[0050] In some embodiments, the laser engraving machine further includes a locking assembly connected to the detection slider 40. The locking structure includes a locked state and an unlocked state. In the locked state, the locking structure fixes the detection slider 40 and the laser module 30 together. In the unlocked state, the detection slider 40 is movable relative to the laser module 30.

[0051] Understandably, when the working height needs to be determined, the locking component is in the unlocked state, allowing the detection slider 40 to move relative to the laser module 30, so that the detection slider 40 can trigger the contact switch 50 after contacting the workpiece.

[0052] After the working height is determined, if the detection slider 40 is still movable, it may affect the laser engraving. Therefore, after the working height is determined, that is, when the detection slider 40 triggers the contact switch 50, the locking assembly is locked. The locking structure fixes the detection slider 40 and the laser module 30, so that the detection slider 40 can no longer move relative to the laser module 30, thus avoiding any impact on the laser engraving.

[0053] Specifically, the locking assembly includes a clamping member and a driving member. The driving member is connected to the detection slider 40 and the clamping member. The driving member drives the clamping member to open and close, switching the clamping member between a clamped state and a released state. In the clamped state, the clamping member is fixedly connected to the guide post. In the released state, the clamping member is spaced apart from the guide post. It can be understood that when the detection slider 40 needs to be movable, the driving member is controlled to open the clamping member, placing it in the released state. When the detection slider 40 does not need to be movable, the driving member is controlled to clamp the clamping member, placing it in the clamped state, thus fixing the clamping member to the guide post and the detection slider 40.

[0054] Furthermore, the driving component is connected to the control component 60, which is configured to: determine that the detection slider 40 is in contact with the workpiece; control the Z-axis drive assembly 20 to keep the detection slider 40 in contact with the workpiece; determine that the contact switch 50 is triggered; control the driving component to drive the clamping component to clamp; and control the Z-axis drive assembly 20 to move the laser module 30. In other words, after the detection slider 40 contacts the workpiece, it does not move initially. Once the contact switch 50 is triggered and generates an electrical signal, the clamping component is first controlled to fix the detection slider 40 and the guide post. Then, the Z-axis drive assembly 20 is controlled to move the laser module 30 and the detection slider 40 away from the workpiece, ensuring that the detection slider 40 does not protrude beyond the laser of the laser module 30 when it is fixed.

[0055] In some embodiments, the laser engraving machine includes at least two contact switches 50, the at least two contact switches 50 including a first contact switch 50 and a second contact switch 50, the first contact switch 50 and the second contact switch 50 being symmetrically arranged about the guide post.

[0056] Understandably, by having at least two contact switches 50, even if one contact switch 50 fails, the other contact switch 50 can still work normally, thus improving the working stability of the laser engraving machine.

[0057] In some embodiments, a buffer block is connected to the end face of the detection slider 40 that is away from the detection surface.

[0058] It is understandable that by setting up a buffer block, the detection slider 40 will not directly contact the workpiece, so as to avoid damage to the workpiece.

[0059] In some embodiments, such as Figure 2 and Figure 3As shown, the laser engraving machine also includes a motion component 70, which is mounted on the housing 10. The Z-axis drive component 20 is connected to the motion component 70, and the motion component 70 is used to drive the Z-axis drive component 20 to move along the X-axis and / or Y-axis.

[0060] It is understandable that the motion component 70 drives the Z-axis drive component 20 to move along the X-axis and / or Y-axis, and the laser module 30 is connected to the Z-axis drive component 20, thus the laser module 30 also moves along the X-axis and / or Y-axis. In other words, through the cooperation of the motion component 70 and the Z-axis drive component 20, the laser module 30 can move in three directions: X-axis, Y-axis, and Z-axis, enabling the laser module 30 to perform fine engraving on the workpiece.

[0061] In some embodiments, such as Figure 2 As shown, the motion component 70 includes an X-axis drive component 701, and the Z-axis drive component 20 is connected to the X-axis drive component 701. The X-axis drive component 701 is used to drive the Z-axis drive component 20 to move along the X-axis direction.

[0062] It is understandable that the X-axis drive component 701 drives the Z-axis drive component 20 to move along the X-axis direction, and the laser module 30 will also move along the X-axis direction accordingly. In other words, through the cooperation of the X-axis drive component 701 and the Z-axis drive component 20, the laser module 30 can be moved along both the Z-axis and X-axis directions.

[0063] In some embodiments, such as Figure 2 As shown, the motion component 70 includes a Y-axis drive component 702, which is mounted on the housing 10. The X-axis drive component 701 is connected to the Y-axis drive component 702, and the Y-axis drive component 702 is used to drive the X-axis drive component 701 to move.

[0064] It is understandable that the laser module 30 moves along the Y-axis direction as the Y-axis drive component 702 drives the Z-axis drive component 20. In other words, the cooperation between the Y-axis drive component 702 and the Z-axis drive component 20 allows the laser module 30 to move along both the Z and Y axes.

[0065] In some examples, the X-axis drive assembly 701, the Y-axis drive assembly 702, and the Z-axis drive assembly 20 are, for example, drive motors or drive cylinders.

[0066] In some embodiments, such as Figure 2 and Figure 3 As shown, the housing 10 has a receiving cavity 101, and the motion component 70 is disposed in the receiving cavity 101.

[0067] Understandably, by placing the motion component 70 within the receiving cavity 101, the space of the laser engraving machine is fully utilized, making the structure of the laser engraving machine compact and reducing its size.

[0068] In some embodiments, such as Figure 1 and Figure 2 As shown, the laser engraving machine also includes a plurality of support columns 80, which are connected to the housing 10, and the plurality of support columns 80 are evenly arranged along the circumference of the housing 10.

[0069] Understandably, by providing multiple support pillars 80, the support pillars 80 can support the shell 10. The evenly distributed multiple support pillars 80 can provide stable support.

[0070] To improve the engraving accuracy of a laser engraving machine, it is also necessary to perform horizontal calibration. Specifically, such as... Figure 4 and Figure 5 ,

[0071] Laser engraving machines also include a worktable, which is used to support the workpiece.

[0072] Laser engraving machines also include:

[0073] A calibration assembly connected to the laser module 30 includes a calibration mounting plate 1, a first Y-axis detection block 2, a second Y-axis detection block 3, and a Z-axis detection block 4. The first Y-axis detection block 2 and the second Y-axis detection block 3 are stacked relative to the Z-axis detection block 4. The upper surfaces of the first Y-axis detection block 2, the second Y-axis detection block 3, and the Z-axis detection block 4 are all on the same plane. The first Y-axis detection block 2 and the second Y-axis detection block 3 are mounted on the first end of the calibration mounting plate 1, and the Z-axis detection block 4 is mounted on the calibration mounting plate 1. The Z-axis detection block 4 is farther away from the first end of the calibration mounting plate 1 than the first Y-axis detection block 2 and the second Y-axis detection block 3.

[0074] The detection assembly is mounted on the worktable and includes a detection mounting plate 5, a first Y-axis pressure detection unit 6, a second Y-axis pressure detection unit 7, and a Z-axis pressure detection unit 8. The first Y-axis pressure detection unit 6 and the second Y-axis pressure detection unit 7 are symmetrically arranged with respect to the Z-axis pressure detection unit 8. The lower surfaces of the first Y-axis pressure detection unit 6, the second Y-axis pressure detection unit 7, and the Z-axis pressure detection unit 8 are all on the same plane. The first Y-axis pressure detection unit 6 and the second Y-axis pressure detection unit 7 are mounted on the first end of the detection mounting plate 5, and the Z-axis pressure detection unit 8 is mounted on the detection mounting plate 5. The Z-axis pressure detection unit 8 is farther away from the first end of the detection mounting plate 5 than the first Y-axis pressure detection unit 6 and the second Y-axis pressure detection unit 7.

[0075] The Z-axis detection block 4 is equipped with a signal source, and the Z-axis pressure detection part 8 is equipped with a signal detection element. The signal detection element is suitable for detecting the signal strength of the signal source, and the signal detection element is electrically connected to the control component 60.

[0076] Understandably, during the calibration operation, the motion component 70 and the Z-axis drive component 20 move the calibration mounting plate 1 to the preset calibration position, and then continue to move the calibration mounting plate 1. At this time, the signal source can be detected by the signal detection component. The closer the signal source is to the signal detection component, the stronger the signal strength detected by the signal detection component. Based on the detection result of the signal detection component, the calibration mounting plate 1 is controlled to move in the direction of signal enhancement, thereby guiding the movement of the calibration mounting plate 1 to quickly bring the Z-axis detection block 4 and the Z-axis pressure detection unit 8 into contact. At this time, even if the first Y-axis detection block 2 is not in contact with the first Y-axis pressure detection unit 6, it is close to the first Y-axis pressure detection unit 6. Even if the second Y-axis detection block 3 is not in contact with the second Y-axis pressure detection unit 7, it is close to the second Y-axis pressure detection unit 7. Only slight adjustments are needed to bring the first Y-axis detection block 2 into contact with the first Y-axis pressure detection unit 6 and the second Y-axis detection block 3 into contact with the second Y-axis pressure detection unit 7, making the horizontal calibration simpler and faster. When the Z-axis detection block 4 and the Z-axis pressure detection unit 8 come into contact, the Z-axis pressure detection unit 8 will detect pressure. When the first Y-axis detection block 2 comes into contact with the first Y-axis pressure detection unit 6, the first Y-axis pressure detection unit 6 will detect pressure. When the second Y-axis detection block 3 comes into contact with the second Y-axis pressure detection unit 7, the second Y-axis pressure detection unit 7 will detect pressure. Based on the detection data of the first Y-axis pressure detection unit 6, the second Y-axis pressure detection unit 7, and the Z-axis pressure detection unit 8, the positions of the first Y-axis detection block 2, the second Y-axis detection block 3, and the Z-axis detection block 4 can be determined. When it is determined that the first Y-axis detection block 2 comes into contact with the first Y-axis pressure detection unit 6, the second Y-axis detection block 3 comes into contact with the second Y-axis pressure detection unit 7, and the Z-axis detection block 4 comes into contact with the Z-axis pressure detection unit 8, the Z-axis coordinate of the Z-axis detection block 4 at this time can be obtained. The Z-axis coordinate at this time is the Z value in the calibration point coordinate parameters. Based on the coordinates of the first Y-axis detection block 2 and the second Y-axis detection block 3 at this time, the Y value and U value in the calibration point coordinate parameters can be determined. Furthermore, it eliminates the need for manual judgment on whether the detection block is in contact with the pressure detection unit, thereby improving the intelligence level of horizontal calibration and effectively avoiding deviations in the obtained calibration point coordinate parameters.

[0077] It is understandable that the Y and U values ​​in the calibration point coordinate parameters are determined based on the coordinates of the first Y-axis detection block 2 and the second Y-axis detection block 3 at this time. This can be done by using the coordinates of the midpoint of the line connecting the first Y-axis detection block 2 and the second Y-axis detection block 3 to determine the Y and U values ​​in the calibration point coordinate parameters, or by combining the coordinate parameters of the first Y-axis detection block 2 and the second Y-axis detection block 3.

[0078] It should be noted that the end of the detection mounting plate 5 closest to the calibration mounting plate 1 has an arc-shaped structure, but the detection mounting plate 5 can also be a circular structure.

[0079] In one embodiment of this application, the laser engraving machine further includes a calibration component for calibrating the movement of the calibration mounting plate 1. The calibration component includes a first Y-axis calibration component, a second Y-axis calibration component, and a Z-axis calibration component. The first Y-axis calibration component is disposed between the first Y-axis pressure detection unit 6 and the end of the first end of the detection mounting plate 5. The second Y-axis calibration component is disposed between the second Y-axis pressure detection unit 7 and the end of the first end of the detection mounting plate 5. The Z-axis calibration component is disposed between the Z-axis pressure detection unit 8 and the first Y-axis pressure detection unit 6. The lines connecting the first Y-axis calibration component and the first Y-axis pressure detection unit 6, the second Y-axis calibration component and the second Y-axis pressure detection unit 7, and the Z-axis calibration component and the Z-axis pressure detection unit 8 are all parallel to each other.

[0080] Understandably, the calibration component can be used to perform preliminary calibration on the movement of the calibration mounting plate 1, so that the first Y-axis detection block 2 moves toward the first Y-axis pressure detection unit 6, the second Y-axis detection block 3 moves toward the second Y-axis pressure detection unit 7, and the Z-axis detection block 4 moves toward the Z-axis pressure detection unit 8.

[0081] Specifically, the first Y-axis calibrator is located in front of the first Y-axis pressure detection unit 6. That is, for the first Y-axis detection block 2 to move to the first Y-axis pressure detection unit 6, it must first pass through the first Y-axis calibrator. The first Y-axis calibrator only allows the first Y-axis detection block 2 to pass through; the second Y-axis detection block 3 or the Z-axis detection block 4 cannot pass through it. This ensures that the first Y-axis detection block 2 is the one that moves to the first Y-axis pressure detection unit 6 after passing through the first Y-axis calibrator, thus ensuring the accuracy of the horizontal calibration. The principles of the second Y-axis calibrator and the Z-axis calibrator are the same as those of the first Y-axis calibrator and will not be repeated here.

[0082] According to an embodiment of the second aspect of this application, an embodiment of a focus height detection method is provided. It should be noted that although the logical order is shown in the flowchart, under certain data, the steps shown or described may be performed in a different order than that shown here.

[0083] Before introducing the focus height detection method of the embodiments of this application, the application scenarios of the focus height detection method will be explained first. The focus height detection method of this application can be applied to smart terminals such as smartphones, tablets and computers connected to laser engraving machines, and can also be applied to servers connected to laser engraving machines. This application does not make any special limitations here, as long as they can support and implement the focus height detection method of this application.

[0084] The server-side component can be, for example, the processor on a laser engraving machine or a similar control element. The server-side component can also be a server independent of the laser engraving machine. This is just an example of the server-side component and is not specifically limited.

[0085] like Figure 6 As shown, the focus height detection method includes:

[0086] S100: Obtain the feedback signal from the contact switch 50;

[0087] S200: Based on the feedback signal of the contact switch 50 and the motion data of the Z-axis drive assembly 20, determine the focusing height of the laser module 30.

[0088] According to the focusing height detection method of this application embodiment, when the workpiece is located below the laser engraving machine, the control component 60 controls the Z-axis drive assembly 20 to drive the laser module 30 to move along the Z-axis, so that the laser module 30 and the detection slider 40 installed on the laser module 30 move towards the workpiece. When the detection slider 40 touches the workpiece, under the reaction force of the workpiece, the detection slider 40 will move relative to the laser module 30 and trigger the contact switch 50. After the contact switch 50 is triggered, it generates an electrical signal, which is sent to the control component 60, thereby obtaining the feedback signal of the contact switch 50. Then, based on the time of receiving the feedback signal, the control component 60 can determine the working time of the Z-axis drive assembly 20, that is, the time during which the Z-axis drive assembly 20 drives the laser module 30 to move along the Z-axis to the workpiece. Based on the working data of the Z-axis drive assembly 20, the moving speed of the laser module 30 can be determined, and the control component 60 can determine the moving distance of the laser module 30, that is, the working height of the laser module 30, and thus determine the focusing height of the laser engraving machine.

[0089] Understandably, exercise data includes exercise speed and exercise duration.

[0090] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0091] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software plus necessary general-purpose hardware platforms, and of course, it can also be implemented using hardware. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate this application and are not intended to limit this application. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of this application do not depart from the spirit and scope of the technical solutions of this application and should be covered within the scope of the claims of this application.

Claims

1. A laser engraving machine, characterized in that, include: case; Z-axis drive assembly, connected to the housing; A laser module is connected to the Z-axis drive assembly, which is used to drive the laser module to move along the Z-axis; A detection slider is connected to the laser module, and the detection slider can move relative to the laser module on the Z-axis; A contact switch is installed on the laser module, and the contact switch is located on the moving path of the detection slider; A control component is mounted on the housing. The contact switch and the Z-axis drive assembly are both electrically connected to the control component. The control component is used to receive the electrical signal generated by the contact switch. The control component is configured to determine the working height of the laser module based on the electrical signal generated by the contact switch. The laser engraving machine also includes a locking assembly connected to the detection slider. The locking assembly has a locked state and an unlocked state. In the locked state, the locking assembly is fixedly connected to the detection slider and the laser module. In the unlocked state, the detection slider can move relative to the laser module. The laser module includes a body and a guide post. The locking assembly includes a clamping member and a driving member. The driving member is connected to the detection slider and the clamping member. The driving member is used to drive the clamping member to open and close, so that the clamping member switches between a clamped state and a released state. In the clamped state, the clamping member is fixedly connected to the guide post. In the released state, the clamping member and the guide post are spaced apart. The laser engraving machine also includes a worktable, which is used to support the workpiece; The laser engraving machine also includes: A calibration assembly connected to a laser module includes a calibration mounting plate, a first Y-axis detection block, a second Y-axis detection block, and a Z-axis detection block. The first Y-axis detection block and the second Y-axis detection block are symmetrically arranged with respect to the Z-axis detection block. The upper surfaces of the first Y-axis detection block, the second Y-axis detection block, and the Z-axis detection block are all on the same plane. The first Y-axis detection block and the second Y-axis detection block are mounted on the first end of the calibration mounting plate. The Z-axis detection block is mounted on the calibration mounting plate, wherein the Z-axis detection block is farther away from the first end of the calibration mounting plate relative to the first Y-axis detection block and the second Y-axis detection block. A detection assembly is disposed on the worktable. The detection assembly includes a detection mounting plate, a first Y-axis pressure detection unit, a second Y-axis pressure detection unit, and a Z-axis pressure detection unit. The first Y-axis pressure detection unit and the second Y-axis pressure detection unit are symmetrically arranged with respect to the Z-axis pressure detection unit. The lower surfaces of the first Y-axis pressure detection unit, the second Y-axis pressure detection unit, and the Z-axis pressure detection unit are all on the same plane. The first Y-axis pressure detection unit and the second Y-axis pressure detection unit are mounted on the first end of the detection mounting plate. The Z-axis pressure detection unit is mounted on the detection mounting plate. The Z-axis pressure detection unit is farther away from the first end of the detection mounting plate than the first Y-axis pressure detection unit and the second Y-axis pressure detection unit. The Z-axis detection block is equipped with a signal source, and the Z-axis pressure detection unit is equipped with a signal detection element. The signal detection element is adapted to detect the signal strength of the signal source, and the signal detection element is electrically connected to the control component.

2. The laser engraving machine according to claim 1, characterized in that, The guide post is connected to the connecting surface of the body away from the housing. The detection slider is sleeved on the guide post and can slide relative to the guide post. The contact switch is installed on the connecting surface and is located between the detection slider and the connecting surface.

3. The laser engraving machine according to claim 1, characterized in that, The laser engraving machine includes at least two contact switches, including a first contact switch and a second contact switch, which are symmetrically arranged about the guide post.

4. The laser engraving machine according to claim 2, characterized in that, A buffer block is connected to the end face of the detection slider that is away from the connecting surface.

5. The laser engraving machine according to any one of claims 1 to 4, characterized in that, The laser engraving machine also includes a motion component, which is mounted on the housing. The Z-axis drive component is connected to the motion component, and the motion component is used to drive the Z-axis drive component to move along the X-axis and / or Y-axis.

6. The laser engraving machine according to claim 5, characterized in that, The motion component includes an X-axis drive component, and the Z-axis drive component is connected to the X-axis drive component. The X-axis drive component is used to drive the Z-axis drive component to move along the X-axis direction.

7. The laser engraving machine according to claim 6, characterized in that, The motion component includes a Y-axis drive component mounted on the housing, and an X-axis drive component connected to the Y-axis drive component, the Y-axis drive component being used to drive the X-axis drive component to move.

8. The laser engraving machine according to claim 5, characterized in that, The housing has a receiving cavity, and the moving component is disposed within the receiving cavity.

9. The laser engraving machine according to any one of claims 1 to 4, characterized in that, The laser engraving machine also includes multiple support columns connected to the housing, and the multiple support columns are evenly arranged along the circumference of the housing.

10. A method for detecting focus height based on a laser engraving machine as described in any one of claims 1 to 9, characterized in that, include: Obtain the feedback signal of the contact switch; The focusing height of the laser module is determined based on the feedback signal from the contact switch and the motion data from the Z-axis drive assembly.

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