A method and system for cutting a boule

Abstract

The application provides a crystal bar cutting method and system, comprising: acquiring an output load of a cutting saw when cutting a crystal bar; acquiring a roughness of a cutting surface of the crystal bar; monitoring a dulling degree of the cutting saw according to the output load and the roughness; and cutting the crystal bar according to the dulling degree. In this way, the dulling degree of the cutting saw can be monitored in real time, so that the cutting saw can be polished or replaced according to the dulling degree, thereby improving the service life of the cutting saw and the cutting quality of the crystal bar.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a method and system for cutting a crystal bar. BACKGROUND

[0002] In the production process of a semiconductor wafer, after a crystal bar is drawn by a Czochralski method, the crystal bar needs to be cut into a plurality of block segments, each block segment is then cut into a thin initial wafer, and the initial wafer is finally polished, polished, and cleaned to obtain a wafer.

[0003] The crystal bar is usually cut by a band saw cutting device. During use, the cutting edge of the band saw becomes blunt with the increase of the service life, which leads to a decrease in the cutting force and then causes the cutting surface of the crystal bar to be not smooth. In the prior art, the cutting performance of the band saw needs to be observed and judged by personnel, and the band saw needs to be manually polished by a grinding stone after becoming blunt. The personnel requirement is high, and it is difficult to achieve real-time monitoring and processing. SUMMARY

[0004] Therefore, the present application provides a method and system for cutting a crystal bar, which can monitor a cutting saw in real time and is beneficial to the maintenance of the cutting saw.

[0005] To achieve the above object, the present application provides the following technical solutions:

[0006] A method for cutting a crystal bar, comprising:

[0007] obtaining an output load of a cutting saw when cutting a crystal bar;

[0008] obtaining a roughness of a cutting surface of the crystal bar;

[0009] monitoring a blunting degree of the cutting saw according to the output load and the roughness;

[0010] cutting the crystal bar according to the blunting degree.

[0011] Optionally, the monitoring of the blunting degree of the cutting saw comprises:

[0012] setting a first preset value and a second preset value;

[0013] comparing a maximum value of the output load with the first preset value and comparing the roughness with the second preset value;

[0014] if the maximum value of the output load is greater than the first preset value and the roughness is greater than the second preset value, it is determined that the cutting saw is in a blunted state.

[0015] Optionally, the method further comprises:

[0016] If it is determined that the cutting saw is in a dull state, the cutting saw is polished.

[0017] Optionally, the output load is set as an output current of the cutting saw.

[0018] Optionally, during cutting of the crystal bar, the cutting saw is operated at a constant feed speed.

[0019] A crystal bar cutting system based on the crystal bar cutting method according to any one of the above, comprising:

[0020] a cutting saw for cutting the crystal bar;

[0021] a measuring device for measuring roughness of a cutting surface of the crystal bar;

[0022] a polishing device for polishing the cutting saw;

[0023] a control device in communication connection with the cutting saw, the measuring device and the polishing device, and capable of controlling the polishing device to polish the cutting saw according to an output load of the cutting saw and a measurement result of the measuring device.

[0024] Optionally, the cutting saw comprises a band saw, and a main pulley and a slave pulley for driving the band saw to rotate, and the output load is set as an output current of the main pulley.

[0025] Optionally, the measuring device comprises a support and a measuring instrument, the measuring instrument is arranged on the support and is capable of moving towards and away from the cutting surface of the crystal bar.

[0026] Optionally, the polishing device comprises a base and a polishing head, the polishing head is connected with the base through a buffer module and is capable of elastically abutting against the cutting saw under driving of the base.

[0027] Optionally, the crystal bar is arranged on a bearing device, the bearing device is in communication connection with the control device and is capable of driving the crystal bar to displace.

[0028] The crystal bar cutting method and system provided in the present application can monitor the dull degree of the cutting saw in real time by data calculation and comparison of the output load of the cutting saw and the roughness of the cutting surface of the crystal bar after cutting and detection of the crystal bar are completed, so as to polish or replace the cutting saw according to the dull degree of the cutting saw, thereby improving the service life of the cutting saw and the cutting quality of the crystal bar. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the accompanying drawings in the following description only are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative effort based on the provided drawings.

[0030] Figure 1 A flow chart of a crystal bar cutting method shown in some embodiments;

[0031] Figure 2 A top view of a crystal bar cutting system shown in some embodiments;

[0032] Figure 3 A front view of a crystal bar cutting system shown in some embodiments;

[0033] Figure 4 A structural schematic diagram of a grinding device shown in some embodiments.

[0034] In the drawings: 1, crystal bar; 2, bearing device; 3, measuring instrument; 4, support; 5, grinding device; 6, band saw; 7, main pulley; 8, slave pulley; 51, grinding head; 52, buffer module; 53, base. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort fall within the scope of protection of the present application.

[0036] As shown in the drawings, the embodiments of the present application provide a crystal bar cutting method, comprising the following steps: Figures 1-4

[0037] S1, obtaining the output load of the cutting saw when cutting the crystal bar 1;

[0038] ​In step S1, the cutting saw is used to cut the crystal bar 1, and during the cutting process, the cutting saw cuts the crystal bar 1 at a constant feed speed and forms a cutting surface on the crystal bar 1. The output load of the cutting saw first increases and then decreases with the increase of the cutting depth, that is, the output load is small when the cutting saw starts cutting, the output load is maximum when the cutting saw cuts to the middle of the wafer, and the output load is small when the cutting saw finishes cutting. Under the condition that the feed speed and the material of the crystal bar 1 are certain, the greater the output load, the greater the degree of passivation of the cutting saw, that is, the lower the cutting force of the cutting saw. Here, the output load of the cutting saw obtained is preferably set as an output current load, and can also be set as a power load or other load parameters.

[0039] S2, obtain the roughness of the cutting surface of the crystal bar 1;

[0040] In step S2, after the cutting saw finishes cutting, the roughness of the cutting surface of the crystal bar 1 can be detected by using the measuring instrument 3, and the measuring method can be manual or automatic. Under the condition that the feed speed of the cutting saw and the material of the crystal bar 1 are certain, the greater the roughness of the cutting surface of the crystal bar 1, the greater the degree of passivation of the cutting saw.

[0041] S3, monitor the degree of passivation of the cutting saw according to the output load and the roughness;

[0042] S4, cut the crystal bar according to the degree of passivation.

[0043] In steps S3 and S4, after the cutting and detection of the crystal bar 1 are completed, the degree of passivation of the cutting saw can be monitored in real time by data calculation and comparison of the obtained output load of the cutting saw and the roughness of the cutting surface of the crystal bar 1, and then the subsequent crystal bar cutting process is carried out according to the degree of passivation of the cutting saw, for example, the crystal bar is continuously cut in the subsequent process, or the cutting saw is polished in the subsequent process. In this way, the subsequent process can be controlled according to the real-time state of the cutting saw, so as to polish or replace the cutting saw according to the degree of passivation of the cutting saw, thereby improving the service life of the cutting saw and improving the cutting quality of the crystal bar 1.

[0044] It should be noted that the degree of passivation of the cutting saw can include a passivated state and a non-passivated state, and whether the cutting saw needs to be polished is determined by judging whether the cutting saw is passivated, that is, when the cutting saw is in the passivated state, the crystal bar can be continuously cut, and when the cutting saw is in the passivated state, the cutting saw can be polished. In addition, the degree of passivation of the cutting saw can also include multiple levels of passivation, for example, when the degree of passivation of the cutting saw reaches level one, the cutting saw needs to be polished, and when the degree of passivation of the cutting saw reaches level two, the cutting saw needs to be replaced.

[0045] In some embodiments, the step S3 comprises:

[0046] setting a first preset value and a second preset value;

[0047] comparing the maximum value of the output load with the first preset value and comparing the roughness with the second preset value;

[0048] if the maximum value of the output load is greater than the first preset value and the roughness is greater than the second preset value, it is determined that the cutting saw is in a dull state.

[0049] The first preset value is the maximum value of the output load of the cutting saw, and the second preset value is the maximum roughness of the cutting surface of the crystal bar 1. The operator can appropriately adjust the preset values according to the actual situation. When the dullness degree of the cutting saw is at a critical value (i.e., between the dull and non-dull states), the maximum output load of the cutting saw when cutting the crystal bar 1 is the first preset value, and the roughness of the cutting surface of the cut crystal bar 1 is the second preset value. In this way, by comparing the actual output load of the cutting saw and the roughness of the cutting surface of the crystal bar 1, the dullness degree of the cutting saw can be determined, and it can be determined whether the cutting saw needs to be polished to remove the dullness.

[0050] Further, the crystal bar cutting method further comprises:

[0051] if it is determined that the cutting saw is in a dull state, the cutting saw is polished.

[0052] The dullness degree of the cutting saw is determined after each cutting of the crystal bar 1 by the cutting saw. If the cutting saw is in a dull state, the cutting saw is polished. If the cutting saw is in a non-dull state, the cutting saw cuts the crystal bar 1 again. In this way, the dullness degree of the cutting saw can be determined after each cutting, and the dullness degree of the cutting saw can be monitored in real time, which is beneficial to prolong the service life of the cutting saw and improve the cutting quality of the crystal bar 1.

[0053] It should be noted that the polishing of the cutting saw can be manual polishing, i.e., the operator manually polishes the cutting saw after receiving the signal that the cutting saw is in a dull state. It can also be set to automatic polishing, i.e., the grinding device manually polishes the cutting saw after receiving the signal that the cutting saw is in a dull state.

[0054] The embodiment of the application further provides a crystal bar cutting system based on the crystal bar cutting method, which comprises a cutting saw, a measuring device, a grinding device 5 and a control device. The cutting saw is used for cutting the crystal bar 1 and forming a cutting surface on the crystal bar 1, the measuring device is used for measuring the roughness of the cutting surface of the crystal bar 1, and the grinding device 5 is used for grinding the cutting saw. During the cutting of the crystal bar 1 by the cutting saw, the cutting saw will gradually blunt due to wear. If the roughness measured by the measuring device is large, it indicates that the degree of blunting of the cutting saw is large, and then the cutting saw can be ground by the grinding device 5.

[0055] The control device is in communication connection with the cutting saw, the measuring device and the grinding device 5, so that the control device can obtain the output load of the cutting saw and the measurement result of the measuring device. The control device can obtain whether the cutting saw is in a blunted state by calculating and comparing the obtained data information, and grind the cutting saw in the blunted state by the grinding device 5. In this way, the control device can automatically monitor the blunting degree of the cutting saw, and automatically grind the cutting saw according to the monitoring result, which is beneficial to improving the service life of the cutting saw and the cutting quality of the crystal bar 1.

[0056] In some embodiments, the cutting saw comprises a band saw 6, a main pulley 7 and a slave pulley 8, the band saw 6 is linked on the main pulley 7 and the slave pulley 8, the main pulley 7 and the slave pulley 8 are used for supporting the band saw 6, and the band saw 6 can be driven to rotate by the main pulley 7 to cut the crystal bar 1 by the band saw 6. The output load of the cutting saw is set as the output current of the main pulley 7, that is, the control device judges whether the cutting saw is in a blunted state according to the output current of the main pulley 7 and the measurement result of the measuring device. In this way, the blunting degree of the cutting saw is judged by the output current of the main pulley 7, which is beneficial to improving the accuracy and timeliness of monitoring

[0057] The crystal bar 1 is arranged on the bearing device 2, so that the bearing device 2 can carry the crystal bar 1 and drive the crystal bar 1 to move. During operation, the bearing device 2 can drive the crystal bar 1 to displace along the axial direction of the bearing device 2 to adjust the cutting position of the crystal bar 1, and after the cutting of the crystal bar 1 by the cutting saw is completed, the bearing device 2 drives the crystal bar 1 to displace along the axial direction by a unit distance, so that the cutting saw can cut the crystal bar 1 again. The bearing device 2 is in communication connection with the control device, so that the control device can control the position of the crystal bar 1, which is beneficial to cooperating with the cutting saw and the measuring device to complete the cutting of the crystal bar 1 and the roughness measurement of the cutting surface of the crystal bar 1.

[0058] It should be noted that the bearing device 2 can also drive the crystal bar 1 to displace along the radial direction, so that the cutting saw can complete the cutting of the crystal bar 1. In addition, other components can also be used to drive the cutting saw to displace relative to the crystal bar 1 along the radial direction to complete the cutting of the crystal bar 1.

[0059] As shown in FIG. 1, the cutting saw comprises a band saw 6, a main pulley 7 and a slave pulley 8, the band saw 6 is linked on the main pulley 7 and the slave pulley 8, the main pulley 7 and the slave pulley 8 are used for supporting the band saw 6, and the band saw 6 can be driven to rotate by the main pulley 7 to cut the crystal bar 1 by the band saw 6. The output load of the cutting saw is set as the output current of the main pulley 7, that is, the control device judges whether the cutting saw is in a blunted state according to the output current of the main pulley 7 and the measurement result of the measuring device. In this way, the blunting degree of the cutting saw is judged by the output current of the main pulley 7, which is beneficial to improving the accuracy and timeliness of monitoring Figure 3As shown, the measuring device includes a support 4 and a measuring instrument 3, the measuring instrument 3 is arranged on the support 4 and can act in the direction close to and away from the cutting surface of the crystal bar 1. Specifically, the support 4 is provided with a swing rod, the first end of the swing rod is rotationally linked with the support 4, and the second end is connected with the measuring instrument 3. When it is necessary to measure the roughness of the cutting surface of the crystal bar 1, the control device controls the swing rod to swing forward, so that the second end of the swing rod is close to the crystal bar 1, and then the measuring instrument 3 can be moved to the cutting surface of the crystal bar 1, which is beneficial to improve the measurement accuracy of the roughness. When the roughness measurement is completed, the swing rod swings reversely, so that the second end of the swing rod is away from the crystal bar 1, and then the measuring instrument 3 avoids affecting the subsequent cutting of the crystal bar 1.

[0060] As shown in the figure, Figure 4 The grinding device 5 includes a base 53 and a grinding head 51, the grinding head 51 is connected with the base 53 through a buffer module 52, so that the grinding head 51 can be elastically displaced relative to the base 53, for example, the buffer module 52 is arranged as a compression spring. When the cutting saw is in the passivation state, the control device controls the base 53 to approach the cutting saw, and the base 53 drives the grinding head 51 to contact the cutting saw, and under the action of the buffer module 52, the grinding head 51 elastically abuts on the cutting saw. In this way, through the arrangement of the buffer module 52, it can be prevented that the grinding head 51 damages the cutting saw due to too large thrust force on the cutting saw.

[0061] As shown in the figure, Figure 1 The crystal bar 1 cutting method is specifically described in combination with the above embodiment.

[0062] Set the feed speed V0, set the current maximum load A0 of the main pulley 7 (i.e. the first preset value), and set the roughness specification Ra0 (i.e. the second preset value);

[0063] The main pulley 7 drives the band saw 6 to cut the crystal bar 1 at the set speed V0 through high-speed rotation;

[0064] Record the output current AX of the main pulley 7 during the cutting process;

[0065] After the cutting is completed, the roughness Ra of the cutting surface is measured, and when AX>A0 and Ra> Ra0, the grinding device 5 is started to polish the band saw 6;

[0066] The next cutting is performed.

[0067] The following table is the corresponding relationship of the feed speed V0, the current maximum load A0 and the roughness specification Ra0. Among them, in the process of cutting the crystal bar by the cutting saw, the feed speed of the cutting saw is different, and the current maximum load of the cutting saw in the passivation state is also different, so the set value of the current maximum load A0 is associated with the set value of the feed speed V0, that is, the greater the set value of the feed speed, the greater the set value of the corresponding current maximum load.

[0068]

[0069] The above describes the basic principles of the present application in combination with specific embodiments, but it should be noted that the advantages, benefits, effects and the like mentioned in the present application are only examples and are not limiting, and these advantages, benefits, effects and the like cannot be considered as necessary for each embodiment of the present application. In addition, the above specific details disclosed are only for the purpose of illustration and understanding, and are not limiting, and the above details do not limit the present application to be necessarily implemented with the above specific details.

[0070] The block diagrams of the devices, apparatuses, equipment, systems involved in the present application are only illustrative examples and are not intended to require or imply the connection, arrangement, configuration as shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any manner. Words such as "include", "contain", "have" and the like are open-ended words, meaning "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein refer to the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to", and can be used interchangeably.

[0071] It should also be noted that in the devices, equipment and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be considered as equivalent solutions of the present application.

[0072] The above description of the disclosed aspects is provided so that any person skilled in the art can make or use the present application. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0073] It should be understood that the adjectives "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments of the present application are only used for clearer description of the technical solutions, and cannot be used to limit the protection scope of the present application.

[0074] The above description has been given for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain modifications, alterations, changes, additions and sub-combinations thereof.

Claims

1. A method of cutting a boule, comprising: The method comprises: acquiring an output load of a cutting saw when cutting a crystal bar; acquiring roughness of a cutting surface of the crystal bar; monitoring dullness of the cutting saw according to the output load and the roughness; wherein the method comprises: setting a first preset value and a second preset value; comparing a maximum value of the output load with the first preset value, and comparing the roughness with the second preset value; if the maximum value of the output load is greater than the first preset value, and the roughness is greater than the second preset value, it is determined that the cutting saw is in a dull state; cutting the crystal bar according to the dullness; wherein when the cutting saw is in a non-dull state, the cutting of the crystal bar is continued, and when the cutting saw is in a dull state, the cutting saw is polished.

2. The method of claim 1, wherein The output load is set as an output current of the cutting saw.

3. The method of claim 1, wherein When cutting the crystal bar, the cutting saw runs at a constant feed speed.

4. A crystal bar cutting system characterized by comprising: The method of cutting a crystal bar according to any one of claims 1-3, comprising: a cutting saw for cutting a crystal bar; a measuring device for measuring roughness of a cutting surface of the crystal bar; a polishing device for polishing the cutting saw; a control device in communication connection with the cutting saw, the measuring device and the polishing device, and capable of controlling the polishing device to polish the cutting saw according to an output load of the cutting saw and a measurement result of the measuring device.

5. The crystal bar cutting system of claim 4, wherein The cutting saw comprises a band saw, a main pulley and a slave pulley for driving the band saw to rotate, and the output load is set as an output current of the main pulley.

6. The crystal bar cutting system of claim 4, wherein The measuring device comprises a support and a measuring instrument, the measuring instrument is arranged on the support and is capable of moving towards and away from a cutting surface of the crystal bar.

7. The crystal bar cutting system of claim 4, wherein The polishing device comprises a base and a polishing head, the polishing head is connected with the base through a buffer module and is capable of elastically abutting against the cutting saw under the driving of the base.

8. The crystal bar cutting system of claim 4, wherein The crystal bar is arranged on a bearing device, the bearing device is in communication connection with the control device and is capable of driving the crystal bar to displace.

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