TFT substrate high-efficiency drying device

Abstract

The present application relates to the technical field of plane display, in particular to a TFT substrate high-efficiency drying device, which comprises a drying box and a pressure driving mechanism, the upper side of the drying box is provided with a supporting mechanism, one side of the drying box is slidably provided with a sealing plate, the pressure driving mechanism comprises a drying box sealing plate and a hydraulic cylinder, the drying box sealing plate is provided with an air extraction cylinder, when the hydraulic cylinder is braked upward, the air inside the drying chamber is extracted, the evaporation and removal of moisture are accelerated by reducing the pressure, and the efficiency of moisture evaporation is accelerated.The present application can extract the air into the inside of the drying chamber when the air vent hole is communicated with the drying chamber through the movable sealing plate, and can conveniently heat the TFT substrate, when the sealing plate shields the air vent hole, the hydraulic cylinder extracts the air inside the drying chamber, thereby reducing the air pressure inside the drying chamber, the evaporation and removal of moisture are accelerated by reducing the pressure, and the efficiency of moisture evaporation is accelerated.

Description

Technical Field

[0001] This invention relates to a drying apparatus, and more particularly to a high-efficiency drying apparatus for TFT substrates, belonging to the field of flat panel display technology. Background Technology

[0002] A TFT substrate is a driving circuit built on a glass substrate. It includes thin film transistors (TFTs) and related metal layers, insulating layers and other structures. Each TFT is usually composed of a gate electrode, a source electrode, a drain electrode, a semiconductor layer and a gate insulating layer.

[0003] The main purpose of drying TFT substrates is to remove residual moisture and particulate matter from the substrate surface, ensuring the cleanliness of the substrate surface, thereby improving the performance and reliability of TFTs. During the TFT manufacturing process, since many semiconductor devices are set on the TFT substrate, the baking temperature of the semiconductor devices is a key factor affecting the chip performance. Semiconductor devices are extremely sensitive and have a narrow operating temperature range. Too high or too low a temperature may affect performance and must be strictly controlled. Too high a temperature may damage the chip, while too low a temperature may not achieve the expected baking effect, affecting the conductivity and stability of the TFT, and in severe cases, affecting the lifespan of the semiconductor.

[0004] Therefore, there is an urgent need to improve the high-efficiency drying device for TFT substrates to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of this invention is to provide a high-efficiency drying device for TFT substrates. When the sliding sealing plate connects the vent hole to the drying chamber, air can be drawn into the interior of the drying chamber, which also facilitates heat dissipation of the TFT substrate. When the sealing plate blocks the vent hole, the hydraulic cylinder draws air from the interior of the drying chamber, thereby reducing the air pressure inside the drying chamber. By reducing the pressure, the evaporation and removal of moisture are accelerated, thus increasing the efficiency of moisture evaporation.

[0006] To achieve the above objectives, the main technical solutions adopted by the present invention include:

[0007] A high-efficiency drying device for TFT substrates includes a drying chamber and a pressure driving mechanism disposed directly above the drying chamber. A drying chamber is provided on the upper side of the drying chamber, and a support mechanism is fixedly disposed inside the drying chamber. A TFT substrate is disposed on the support mechanism.

[0008] A sealing groove is provided on one side of the drying chamber, and a sealing plate is slidably disposed inside the sealing groove. A vent hole communicating with the inside of the drying chamber is provided on the sealing groove, and the vent hole is sealed by sliding the sealing plate.

[0009] The pressure driving mechanism includes a drying chamber sealing plate and a hydraulic cylinder. The drying chamber sealing plate is provided with an air extraction cylinder that communicates with the drying chamber. The output end of the hydraulic cylinder is provided with a piston, which is slidably disposed inside the air extraction cylinder. When the hydraulic cylinder brakes upward, it is used to extract air from inside the drying chamber, thereby reducing the air pressure inside the drying chamber. By reducing the pressure, the evaporation and removal of moisture are accelerated, thus increasing the efficiency of moisture evaporation.

[0010] Preferably, the drying chamber sealing plate corresponds to the port of the drying chamber. The upper side of the drying chamber sealing plate is provided with symmetrically distributed electric telescopic rods. The telescopic rod output end of the electric telescopic rod is fixedly connected to the drying chamber sealing plate. When the electric telescopic rod is braked downward, the drying chamber sealing plate engages with the port of the drying chamber and seals the port of the drying chamber. After the drying chamber sealing plate seals the drying chamber, the air inside the drying chamber is extracted by the hydraulic cylinder, thereby reducing the internal pressure of the drying chamber.

[0011] Preferably, the support mechanism includes a fixed support frame and a movable support frame. The fixed support frame is fixedly disposed inside the drying chamber, and the movable support frame is slidably disposed inside the drying chamber corresponding to the fixed support frame. A groove is provided on the inner side of the drying chamber, and the movable support frame is slidably disposed inside the groove.

[0012] The fixed support frame and the movable support frame are provided with corresponding substrate slots, and the TFT substrate is snapped into the inside of the substrate slot.

[0013] Preferably, an adjustment mechanism is fixedly provided on the movable support frame. The adjustment mechanism includes a brake block, which is disposed on the movable support frame. A brake rod is connected to one side of the brake block, and the end of the brake rod away from the brake block passes through the drying box and is connected to the drying box by a threaded connection.

[0014] A limiting hole is provided on one side of the brake block, and one end of the brake rod is connected to a limiting block, which is rotatably disposed inside the limiting hole.

[0015] Preferably, a brake handle is connected to the end of the brake lever away from the brake block, and the brake handle is located on the outside of the drying chamber.

[0016] Preferably, a cleaning mechanism is slidably disposed on the fixed support frame, the cleaning mechanism including a cleaning slider, and a guide block slidably connected to the fixed support frame is disposed on the cleaning slider;

[0017] The upper and lower sides of the cleaning slider are connected to support arm fixing blocks. A cleaning support arm is fixedly installed on the support arm fixing block, and a cleaning brush is fixedly installed on the cleaning support arm. The cleaning brush abuts against the side of the TFT substrate.

[0018] Preferably, one end of the cleaning slider is connected to a lead screw drive block, the lead screw drive block is threadedly connected to a transmission lead screw, one end of the transmission lead screw passes through the drying chamber and is connected to a driven gear, a cleaning motor is fixedly installed on one side of the driven gear on the outer side of the drying chamber, a drive gear is installed at the output end of the cleaning motor, the drive gear is rotatably connected to the driven gear, and the cleaning motor is used to rotate the transmission lead screw.

[0019] Preferably, a rubber sealing gasket is provided on the outer side of the sealing plate, and a sealing plate handle is provided on the top of the sealing plate.

[0020] Preferably, a heating chamber is provided at the bottom of the drying oven, and a heating coil is fixedly installed inside the heating chamber.

[0021] Preferably, a support frame is fixedly installed at the bottom of the drying oven, the upper end of the electric telescopic rod is fixedly connected to the support frame, a C-shaped fixing plate is fixedly installed on the support frame, and the upper end of the pressure driving mechanism is fixedly connected to the C-shaped fixing plate.

[0022] This invention has at least the following beneficial effects:

[0023] 1. When the dynamic sealing plate connects the vent hole to the drying chamber, it can draw air into the interior of the drying chamber, while facilitating heat dissipation for the TFT substrate. When the sealing plate blocks the vent hole, the hydraulic cylinder draws air from the interior of the drying chamber, thereby reducing the air pressure inside the drying chamber. By reducing the pressure, the evaporation and removal of moisture are accelerated, thus speeding up the efficiency of moisture evaporation.

[0024] 2. A heating coil is fixedly installed inside the heating chamber. After the heating coil is activated, the drying chamber is heated, which increases the internal energy inside the drying chamber and the gap between molecules, thus enabling the TFT substrate inside the drying chamber to be dried. When the air inside the drying chamber escapes after thermal expansion and contraction, the hydraulic cylinder on the starter pulls the piston upward towards the air extraction cylinder, further reducing the pressure inside the drying chamber and greatly improving the efficiency of moisture evaporation.

[0025] 3. The fixed support frame on the support mechanism is fixedly installed inside the drying chamber, which improves the stability of the fixed support frame. The movable support frame is slidably installed inside the groove of the drying chamber, so it can be adjusted according to the size of the TFT substrate, thus improving the range of use and flexibility.

[0026] 4. The cleaning slider is slidably mounted on the fixed support frame via a guide block, which improves the stability of the cleaning slider's movement. While the cleaning slider is moving, it drives the cleaning support arm on the fixed block of the support arm to move, which in turn drives the cleaning brush on the cleaning support arm to move. The cleaning brush cleans the sides of the TFT substrate, thereby achieving the purpose of dust removal. Attached Figure Description

[0027] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0028] Figure 1 This is a cross-sectional view of the present invention;

[0029] Figure 2 This is a perspective view of the present invention;

[0030] Figure 3 This is a partial structure of the present invention. Figure 1 ;

[0031] Figure 4 This is a structural diagram of the drying oven of the present invention;

[0032] Figure 5 This is a partial structure of the present invention. Figure 2 ;

[0033] Figure 6 This is a partial structure of the present invention. Figure 3 ;

[0034] Figure 7 This is a partial structure of the present invention. Figure 4 ;

[0035] Figure 8 This is a structural diagram of the cleaning mechanism of the present invention;

[0036] Figure 9 This is a structural diagram of the adjustment mechanism of the present invention.

[0037] In the diagram, 1. Drying chamber; 101. Heating chamber; 102. Drying chamber; 103. Sealing groove; 104. Vent hole; 105. Slide groove; 2. Pressure drive mechanism; 201. Drying chamber sealing plate; 202. Hydraulic cylinder; 203. Air extraction cylinder; 204. Piston; 3. Support mechanism; 301. Fixed support frame; 302. Movable support frame; 303. Base plate slot; 4. Cleaning mechanism; 401. Cleaning motor; 402. Transmission screw; 403. Cleaning slider; 404. Screw drive block 405. Support arm fixing block; 406. Cleaning support arm; 407. Cleaning brush; 408. Guide block; 409. Drive gear; 410. Driven gear; 5. Adjustment mechanism; 501. Brake block; 502. Brake lever; 503. Brake handle; 504. Limiting hole; 505. Limiting block; 6. Sealing plate; 601. Sealing plate handle; 7. Electric telescopic rod; 701. Telescopic rod output end; 8. Heating coil; 9. Support frame; 901. C-shaped fixing plate; 10. TFT substrate. Detailed Implementation

[0038] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0039] like Figures 1-9 As shown, the high-efficiency drying device for TFT substrates provided in this embodiment includes a drying chamber 1 and a pressure driving mechanism 2 disposed directly above the drying chamber 1. A drying chamber 102 is provided on the upper side of the drying chamber 1. A support mechanism 3 is fixedly disposed inside the drying chamber 102. A TFT substrate 10 is disposed on the support mechanism 3. The TFT substrate 10 can be dried by placing it on the support mechanism 3. The structure is simple, improving the convenience of use and the drying efficiency. Since there are many semiconductor devices disposed on the TFT substrate, the baking temperature of the semiconductor devices is a key factor affecting the chip performance. Semiconductor devices are extremely sensitive and have a narrow operating temperature range. Too high or too low a temperature may affect the performance and must be strictly controlled. Too high a temperature may damage the chip, while too low a temperature may not achieve the expected baking effect. Therefore, baking at room temperature will affect the service life of the semiconductor.

[0040] A sealing groove 103 is provided on one side of the drying chamber 1. A sealing plate 6 is slidably arranged inside the sealing groove 103. A vent hole 104 communicating with the inside of the drying chamber 102 is provided on the sealing groove 103. The vent hole 104 is sealed by sliding the sealing plate 6. The vent hole 104 on the sealing groove 103 is connected to the inside of the drying chamber 102. A rubber sealing gasket is provided on the outer side of the sealing plate 6. A sealing plate handle 601 is provided on the top of the sealing plate 6. When the sealing plate 6 is slid to connect the vent hole 104 with the drying chamber 102, air can be drawn into the inside of the drying chamber 102, which also facilitates heat dissipation of the TFT substrate 10. When the sealing plate 6 blocks the vent hole 104, the drying chamber 102 is sealed. The structure is simple and improves the flexibility and convenience of use.

[0041] To avoid unnecessary damage to semiconductor devices during baking, the TFT substrate 10 is dried by reducing pressure. The pressure driving mechanism 2 includes a drying chamber sealing plate 201 and a hydraulic cylinder 202. The drying chamber sealing plate 201 is provided with an air extraction cylinder 203 that communicates with the drying chamber 102. The output end of the hydraulic cylinder 202 is provided with a piston 204, which is slidably disposed inside the air extraction cylinder 203. When the hydraulic cylinder 202 is braked upward, it is used to extract air from inside the drying chamber 102, thereby reducing the air pressure inside the drying chamber 102. By reducing the pressure, the evaporation and removal of moisture are accelerated, thus increasing the efficiency of moisture evaporation.

[0042] In addition, a heating chamber 101 is provided at the bottom of the drying chamber 1. A heating coil 8 is fixedly installed inside the heating chamber 101. After the heating coil 8 is activated, the drying chamber 1 is heated, which increases the internal energy inside the drying chamber 102 and increases the gap between molecules, thereby enabling the drying of the TFT substrate 10 inside the drying chamber 102.

[0043] Then, as the air inside the drying chamber 102 escapes after thermal expansion and contraction, the hydraulic cylinder 202 on the start-up point pulls the piston 204 upward toward the air extraction cylinder 203, further reducing the pressure inside the drying chamber 102 and greatly improving the efficiency of moisture evaporation.

[0044] Furthermore, to facilitate the sealing of the drying chamber 102 by the drying oven sealing plate 201, such as... Figure 1 , Figure 2 as well as Figure 3As shown, the drying chamber sealing plate 201 corresponds to the port of the drying chamber 102. Symmetrically distributed electric telescopic rods 7 are provided on the upper side of the drying chamber sealing plate 201. The telescopic rod output end 701 of the electric telescopic rod 7 is fixedly connected to the drying chamber sealing plate 201. When the electric telescopic rod 7 is braked downward, the drying chamber sealing plate 201 is engaged at the port of the drying chamber 102 and seals the port of the drying chamber 102. After the drying chamber sealing plate 201 seals the drying chamber 102, the air inside the drying chamber 102 is extracted by the hydraulic cylinder 202, thereby reducing the internal pressure of the drying chamber 1. The electric telescopic rod 7 is fixedly provided on the upper side of the drying chamber sealing plate 201. The telescopic rod output end 701 of the electric telescopic rod 7 presses the drying chamber sealing plate 201 into the interior of the drying chamber 102, which can improve the convenience of use and ensure the sealing of the drying chamber 102.

[0045] Furthermore, such as Figure 5 and Figure 6 As shown, the support mechanism 3 includes a fixed support frame 301 and a movable support frame 302. The fixed support frame 301 is fixedly installed inside the drying chamber 102, and the movable support frame 302 is slidably installed inside the drying chamber 102 in correspondence with the fixed support frame 301. A groove 105 is provided on the inner side of the drying chamber 102, and the movable support frame 302 is slidably installed inside the groove 105. The fixed support frame 301 on the support mechanism 3 is fixedly installed inside the drying chamber 102 to improve the stability of the fixed support frame 301. The movable support frame 302 is slidably installed inside the groove 105 of the drying chamber 102, so it can be adjusted according to the size of the TFT substrate 10, improving the range of use and flexibility.

[0046] The fixed support frame 301 and the movable support frame 302 are provided with corresponding substrate slots 303. The TFT substrate 10 is snapped into the inside of the substrate slot 303. The fixed support frame 301 and the movable support frame 302 are provided with substrate slots 303. The TFT substrate 10 is snapped into the inside of the substrate slot 303. The structure is simple and improves the convenience of use.

[0047] To facilitate adjustment of the distance between the movable support frame 302 and the fixed support frame 301, such as Figure 5 and Figure 9As shown, an adjustment mechanism 5 is fixedly installed on the movable support frame 302. The adjustment mechanism 5 includes a brake block 501, which is mounted on the movable support frame 302. A brake rod 502 is connected to one side of the brake block 501. The end of the brake rod 502 away from the brake block 501 passes through the drying chamber 1 and is connected to the drying chamber 1 by a threaded connection. The brake block 501 on the adjustment mechanism 5 is fixedly mounted on the support mechanism 302, and the brake block 501 is adjusted by rotating the brake rod 502. 502 pushes the movable support frame 302 forward to improve ease of use. A limit hole 504 is opened on one side of the brake block 501. One end of the brake rod 502 is connected to a limit block 505. The limit block 505 is rotatably set inside the limit hole 504. In order to facilitate the adjustment of the brake block 501, a limit hole 504 is opened on the brake block 501. The limit block 505 at one end of the brake rod 502 is rotatably set inside the limit hole 504. Therefore, while rotating the brake rod 502, the brake block 501 can be pushed to realize the displacement of the movable support frame 302.

[0048] At the same time, such as Figure 1 As shown, the brake lever 502 is connected to a brake handle 503 at the end away from the brake block 501. The brake handle 503 is located on the outside of the drying chamber 1. One end of the brake lever 502 extends out of the drying chamber 1 and is connected to the brake handle 503. The brake lever 502 is rotated by the brake handle 503. The structure is simple and easy to use.

[0049] Furthermore, such as Figure 4 , Figure 5 , Figure 6 as well as Figure 8 As shown, a cleaning mechanism 4 is slidably disposed on the fixed support frame 301. The cleaning mechanism 4 includes a cleaning slider 403. A guide block 408 is disposed on the cleaning slider 403 and slidably connected to the fixed support frame 301. The cleaning mechanism 4 is disposed on the support frame 3 to facilitate the cleaning of the side of the TFT substrate 10. It helps to clean the dust on the surface of the TFT substrate 10 while drying.

[0050] The upper and lower sides of the cleaning slider 403 are connected to support arm fixing blocks 405. A cleaning support arm 406 is fixedly installed on the support arm fixing block 405. A cleaning brush 407 is fixedly installed on the cleaning support arm 406. The cleaning brush 407 abuts against the side of the TFT substrate 10. The cleaning slider 403 is slidably mounted on the fixed support frame 301 through the guide block 408 to improve the stability of the movement of the cleaning slider 403. When the cleaning slider 403 moves, it drives the cleaning support arm 406 on the support arm fixing block 405 to move, which in turn drives the cleaning brush 407 on the cleaning support arm 406 to move. The cleaning brush 407 cleans the side of the TFT substrate 10, thereby achieving the purpose of dust removal.

[0051] In addition, to improve cleaning efficiency, such as Figure 8 As shown, one end of the cleaning slider 403 is connected to a lead screw drive block 404, which is threadedly connected to a transmission lead screw 402. One end of the transmission lead screw 402 passes through the drying chamber 1 and is connected to a driven gear 410. A cleaning motor 401 is fixedly mounted on the outer side of the drying chamber 1 on one side of the driven gear 410. A drive gear 409 is mounted on the output end of the cleaning motor 401, and the drive gear 409 is rotatably connected to the driven gear 410. The cleaning motor 401 is used to rotate the transmission lead screw 402. A lead screw drive block is mounted on one side of the cleaning slider 403. Block 404, the lead screw drive block 404 is connected to the transmission lead screw 402 by a thread. Therefore, the rotation of the transmission lead screw 402 can drive the cleaning slider 403 to slide cyclically on the fixed support frame 301. A cleaning motor 401 is provided at one end of the transmission lead screw 402. After the cleaning motor 401 is started, it drives the driven gear 410 to rotate, which in turn drives the drive gear 409 on the transmission lead screw 402 to rotate. Therefore, the cleaning motor 401 can drive the cleaning slider 403 to move cyclically on the support mechanism 3, without manual operation, thus improving cleaning efficiency.

[0052] In this embodiment, as Figure 2 As shown, a support frame 9 is fixedly installed at the bottom of the drying oven 1. The upper end of the electric telescopic rod 7 is fixedly connected to the support frame 9. A C-shaped fixing plate 901 is fixedly installed on the support frame 9. The upper end of the pressure drive mechanism 2 is fixedly connected to the C-shaped fixing plate 901. The pressure drive mechanism 2 and the drying oven 1 are fixed by the support frame 9 to improve the overall structural strength. The pressure drive mechanism 2 is fixed by the C-shaped fixing plate 901 to improve the stability of the pressure drive mechanism 2.

[0053] like Figures 1-9 As shown, the principle of the high-efficiency drying device for TFT substrates provided in this embodiment is as follows:

[0054] The TFT substrate 10 can be dried by placing it on the support mechanism 3. The structure is simple, which improves the convenience of use and the drying efficiency. Since there are many semiconductor devices on the TFT substrate, the baking temperature of the semiconductor devices is a key factor affecting the chip performance. Semiconductor devices are extremely sensitive and have a narrow operating temperature range. Too high or too low a temperature may affect the performance and must be strictly controlled. When the sliding sealing plate 6 connects the vent 104 with the drying chamber 102, air can be drawn into the interior of the drying chamber 102, which also facilitates heat dissipation of the TFT substrate 10. When the sealing plate 6 blocks the vent 104, it seals the drying chamber 102. The structure is simple and improves the flexibility and convenience of use.

[0055] To avoid unnecessary damage to semiconductor devices during baking, the TFT substrate 10 is dried by reducing the pressure. A heating coil 8 is fixedly installed inside the heating chamber 101. After the heating coil 8 is activated, the drying chamber 1 is heated, which increases the internal energy inside the drying chamber 102 and increases the gap between molecules, thereby enabling the TFT substrate 10 inside the drying chamber 102 to be dried.

[0056] Then, when the air inside the drying chamber 102 escapes after thermal expansion and contraction, the hydraulic cylinder 202 is activated to pull the piston 204 upwards towards the air extraction cylinder 203, further reducing the pressure inside the drying chamber 102 and greatly improving the efficiency of moisture evaporation.

[0057] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0058] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.

[0059] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A high-efficiency drying apparatus for TFT substrates, comprising a drying chamber (1) and a pressure driving mechanism (2) disposed directly above the drying chamber (1), characterized in that, The upper side of the drying oven (1) is provided with a drying chamber (102), and a support mechanism (3) is fixedly provided inside the drying chamber (102). A TFT substrate (10) is provided on the support mechanism (3). A sealing groove (103) is provided on one side of the drying box (1), and a sealing plate (6) is slidably arranged inside the sealing groove (103). A vent hole (104) communicating with the inside of the drying chamber (102) is provided on the sealing groove (103), and the vent hole (104) is sealed by sliding the sealing plate (6). The pressure driving mechanism (2) includes a drying chamber sealing plate (201) and a hydraulic cylinder (202). The drying chamber sealing plate (201) is provided with an air extraction cylinder (203) that communicates with the drying chamber (102). The output end of the hydraulic cylinder (202) is provided with a piston (204). The piston (204) is slidably disposed inside the air extraction cylinder (203). When the hydraulic cylinder (202) brakes upward, the hydraulic cylinder (202) is used to extract the air inside the drying chamber (102), thereby reducing the air pressure inside the drying chamber (102). By reducing the pressure, the evaporation and removal of moisture are accelerated, thus speeding up the efficiency of moisture evaporation. The drying chamber sealing plate (201) corresponds to the port of the drying chamber (102). The upper side of the drying chamber sealing plate (201) is provided with symmetrically distributed electric telescopic rods (7). The telescopic rod output end (701) of the electric telescopic rod (7) is fixedly connected to the drying chamber sealing plate (201). When the electric telescopic rod (7) is braked downward, the drying chamber sealing plate (201) is engaged at the port of the drying chamber (102) and seals the port of the drying chamber (102). After the drying chamber sealing plate (201) seals the drying chamber (102), the air inside the drying chamber (102) is drawn out by the hydraulic cylinder (202), thereby reducing the internal pressure of the drying chamber (1). The support mechanism (3) includes a fixed support frame (301) and a movable support frame (302). The fixed support frame (301) is fixedly installed inside the drying chamber (102). The movable support frame (302) is slidably installed inside the drying chamber (102) in correspondence with the fixed support frame (301). A groove (105) is provided on the inner side of the drying chamber (102). The movable support frame (302) is slidably installed inside the groove (105). The fixed support frame (301) and the movable support frame (302) are provided with corresponding substrate slots (303), and the TFT substrate (10) is snapped into the inside of the substrate slots (303).

2. The high-efficiency drying apparatus for TFT substrates according to claim 1, characterized in that: An adjustment mechanism (5) is fixedly installed on the movable support frame (302). The adjustment mechanism (5) includes a brake block (501). The brake block (501) is installed on the movable support frame (302). A brake rod (502) is connected to one side of the brake block (501). The end of the brake rod (502) away from the brake block (501) passes through the drying box (1) and is connected to the drying box (1) by a threaded connection. A limiting hole (504) is provided on one side of the brake block (501), and one end of the brake rod (502) is connected to a limiting block (505). The limiting block (505) is rotatably disposed inside the limiting hole (504).

3. The high-efficiency drying apparatus for TFT substrates according to claim 2, characterized in that: The brake lever (502) is connected to a brake handle (503) at the end away from the brake block (501), and the brake handle (503) is located on the outside of the drying box (1).

4. The high-efficiency drying apparatus for TFT substrates according to claim 1, characterized in that: A cleaning mechanism (4) is slidably disposed on the fixed support frame (301). The cleaning mechanism (4) includes a cleaning slider (403). A guide block (408) is disposed on the cleaning slider (403) and is slidably connected to the fixed support frame (301). The upper and lower sides of the cleaning slider (403) are connected to support arm fixing blocks (405), and a cleaning support arm (406) is fixedly installed on the support arm fixing block (405). A cleaning brush (407) is fixedly installed on the cleaning support arm (406), and the cleaning brush (407) abuts against the side of the TFT substrate (10).

5. The high-efficiency drying apparatus for TFT substrates according to claim 4, characterized in that: One end of the cleaning slider (403) is connected to a lead screw drive block (404), and the lead screw drive block (404) is connected to a transmission lead screw (402) by a thread. One end of the transmission lead screw (402) passes through the drying box (1) and is connected to a driven gear (410). A cleaning motor (401) is fixedly installed on one side of the driven gear (410) on the outer side of the drying box (1). A drive gear (409) is installed at the output end of the cleaning motor (401). The drive gear (409) is rotatably connected to the driven gear (410). The cleaning motor (401) is used to rotate the transmission lead screw (402).

6. The high-efficiency drying apparatus for TFT substrates according to claim 1, characterized in that: A rubber sealing gasket is provided on the outer side of the sealing plate (6), and a sealing plate handle (601) is provided on the top of the sealing plate (6).

7. The high-efficiency drying apparatus for TFT substrates according to claim 1, characterized in that: The bottom of the drying oven (1) is provided with a heating chamber (101), and a heating coil (8) is fixedly installed inside the heating chamber (101).

8. The high-efficiency drying apparatus for TFT substrates according to claim 1, characterized in that: The bottom of the drying oven (1) is fixedly provided with a support frame (9), the upper end of the electric telescopic rod (7) is fixedly connected to the support frame (9), a C-shaped fixing plate (901) is fixedly provided on the support frame (9), and the upper end of the pressure driving mechanism (2) is fixedly connected to the C-shaped fixing plate (901).

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