A device suitable for high-temperature vibration testing of sensors

Abstract

The present invention relates to a device suitable for high-temperature vibration testing of sensors, belonging to the field of sensor testing; the device comprises a high-temperature box, a cooling device, a vibration table, a test auxiliary device and a support structure; wherein the vibration table is axially placed horizontally; the high-temperature box is installed on the ground through the support structure; the high-temperature box is located above the vibration table; a through hole is provided at the center of the lower surface of the high-temperature box; the cooling device is axially vertically installed on the upper surface of the vibration table, and the top of the cooling device extends into the through hole on the lower surface of the high-temperature box; the top of the cooling device is in contact with the high-temperature box and is not fixedly connected; the test auxiliary device is installed on the top of the cooling device, and the test auxiliary device is located in the inner cavity of the high-temperature box; the sensor to be tested is installed on the test auxiliary device; the present invention realizes vibration testing in a high-temperature environment.

Description

Technical Field

[0001] The invention belongs to the field of sensor testing and relates to a device suitable for high-temperature vibration testing of a sensor. Background Art

[0002] The working environment of products such as hypersonic aircraft and aircraft engines is relatively harsh. The sensors that monitor their working process need to withstand the environmental test of high temperature and vibration. According to the needs of these fields, the sensor development department needs to develop sensors that can work normally in high temperature and vibration environments.

[0003] During the development process, ground tests are required to simulate the high-temperature vibration environment in which the sensor operates normally. Currently, commonly used testing equipment includes high-temperature chambers for testing the sensor's performance at high temperatures and specialized vibration tables. However, due to factors such as the size of the high-temperature chamber and the inability of conventional vibration tables to operate at high temperatures, there is no mature high-temperature vibration testing equipment. Summary of the Invention

[0004] The technical problem solved by the present invention is to overcome the deficiencies of the prior art and propose a device suitable for high-temperature vibration testing of sensors, thereby realizing vibration testing in a high-temperature environment.

[0005] The solution of the present invention is:

[0006] A device suitable for high-temperature vibration testing of sensors, comprising a high-temperature box, a cooling device, a vibration table, a test auxiliary device and a support structure;

[0007] Among them, the vibration table is placed axially horizontally; the high-temperature box is installed on the ground through a supporting structure; the high-temperature box is located above the vibration table; a through hole is provided at the center of the lower surface of the high-temperature box; the cooling device is axially vertically installed on the upper surface of the vibration table, and the top of the cooling device extends into the through hole on the lower surface of the high-temperature box; the top of the cooling device is in contact with the high-temperature box, and is not fixedly connected; the test auxiliary device is installed on the top of the cooling device, and the test auxiliary device is located in the inner cavity of the high-temperature box; the external sensor to be tested is installed on the test auxiliary device.

[0008] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the high-temperature box includes an outer shell and an inner layer;

[0009] Among them, the outer shell is a hollow rectangular shell structure; the bottom of the outer shell is installed on the ground through a supporting structure; the inner layer is attached to the inner wall of the outer shell; and through holes are provided at the center positions of the bottoms of the outer shell and the inner layer.

[0010] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the inner layer provides a high-temperature environment for the inner cavity of the high-temperature box; and the outer shell realizes protection and heat insulation.

[0011] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the cooling device is fixedly connected to the vibration table by threads, and a vibration environment is applied to the cooling device through the vibration table.

[0012] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the cooling device transmits the vibration provided by the vibration table to the test auxiliary device to realize the vibration test of the sensor to be tested; at the same time, the cooling device prevents the high-temperature environment generated by the high-temperature box from being transmitted to the vibration table.

[0013] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the test auxiliary device includes a vibration conductive shell, a first sensor interface, a second sensor interface, a third sensor interface, a fourth sensor interface and a sensor mounting seat;

[0014] Among them, the vibration conduction shell is a cylindrical structure placed axially vertically; the sensor mounting seat is installed on the top of the vibration conduction shell; the first sensor interface, the second sensor interface, the third sensor interface, and the fourth sensor interface are all groove structures; the first sensor interface, the second sensor interface, the third sensor interface, and the fourth sensor interface are arranged on the sensor mounting seat.

[0015] In the above-mentioned device suitable for high-temperature vibration testing of sensors, a mounting platform is provided on the bottom outer wall of the vibration conducting shell; the vibration conducting shell is screw-connected to the cooling device via the mounting platform.

[0016] In the above-mentioned device suitable for high-temperature vibration testing of sensors, vertical internal channels are provided at the axes of the vibration conduction shell and the sensor mounting seat, which serve as channels for the data transmission lines of the external sensors to be tested to prevent the cables from failing due to heat.

[0017] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the first sensor interface and the fourth sensor interface are both horizontally arranged on the sensor mounting base, and the first sensor interface and the fourth sensor interface are perpendicular to each other; the second sensor interface and the third sensor interface are both vertically arranged on the sensor mounting base; the second sensor interface is located at the center of the sensor mounting base; and the third sensor interface is located at the side of the sensor mounting base away from the fourth sensor interface.

[0018] In the above-mentioned device suitable for high-temperature vibration testing of sensors, the inner diameters of the first sensor interface, the second sensor interface, the third sensor interface, and the fourth sensor interface are set according to requirements to achieve high-temperature vibration testing of sensors of various sizes to be tested.

[0019] The beneficial effects of the present invention compared with the prior art are:

[0020] (1) The high-temperature vibration test auxiliary device of the present invention avoids the conventional vibration table from operating at high temperatures, meets the requirements of vibration testing in high-temperature environments, and integrates two independent test items into a new test item;

[0021] (2) The high-temperature vibration test auxiliary device of the present invention, due to its airtightness and heat-insulating design, ensures that only the sensor measuring surface is subjected to the high-temperature environment test, which protects the sensor and the corresponding cables on the one hand, and simulates the working environment of the sensor as much as possible on the other hand;

[0022] (3) The high-temperature vibration test auxiliary device of the present invention has multiple sensor installation ports on the head, which can simultaneously install sensors axially and laterally, and perform axial vibration tests and lateral vibration tests on sensors at the same time, thereby improving the efficiency of vibration tests. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the overall apparatus for high temperature vibration testing of the present invention;

[0024] Figure 2 Schematic diagram of the test auxiliary device of the present invention. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the embodiments.

[0026] The present invention provides a device suitable for high-temperature vibration testing of sensors. The sensor to be tested is inserted into a high-temperature box through a high-temperature vibration test auxiliary device. The end of the high-temperature vibration test auxiliary device is finally connected to a vibration table to provide a vibration working environment. In order to avoid high temperature damage to the vibration table and its facilities, a cooling device is added between the high-temperature vibration test auxiliary device and the vibration table. Finally, the sensor can be subjected to axial and lateral high-temperature vibration tests at the same time.

[0027] Apparatus suitable for high temperature vibration test of sensors, such as Figure 1 As shown, it specifically includes a high-temperature box 1, a cooling device 2, a vibration table 3, a test auxiliary device 4, and a support structure 5. The vibration table 3 is placed horizontally in the axial direction; the high-temperature box 1 is installed on the ground through the support structure 5; the high-temperature box 1 is located above the vibration table 3; a through hole is provided at the center of the lower surface of the high-temperature box 1; the cooling device 2 is axially and vertically installed on the upper surface of the vibration table 3, and the top of the cooling device 2 extends into the through hole on the lower surface of the high-temperature box 1; the top of the cooling device 2 is in contact with the high-temperature box 1, but is not fixedly connected; the test auxiliary device 4 is installed on the top of the cooling device 2, and the test auxiliary device 4 is located in the inner cavity of the high-temperature box 1; the external sensor to be tested is installed on the test auxiliary device 4.

[0028] The cooling device 2 is fixedly connected to the vibration table 3 through threads, and a vibration environment is applied to the cooling device 2 through the vibration table 3.

[0029] The high-temperature box 1 comprises an outer shell 11 and an inner layer 12. The outer shell 11 is a hollow rectangular parallelepiped structure. The bottom of the outer shell 11 is mounted on the ground via a support structure 5. The inner layer 12 is attached to the inner wall of the outer shell 11. Through holes are provided at the center of the bottoms of both the outer shell 11 and the inner layer 12. The inner layer 12 provides a high-temperature environment within the inner cavity of the high-temperature box 1; the outer shell 11 provides protection and thermal insulation.

[0030] The present invention transmits the vibration provided by the vibration table 3 to the test auxiliary device 4 through the cooling device 2, thereby realizing the vibration test of the sensor to be tested; at the same time, the cooling device 2 prevents the high temperature environment generated by the high temperature box 1 from being transmitted to the vibration table 3.

[0031] like Figure 2 As shown, the test auxiliary device 4 includes a vibration conductive shell 41, a first sensor interface 42, a second sensor interface 43, a third sensor interface 44, a fourth sensor interface 45, and a sensor mounting base 47. The vibration conductive shell 41 is a cylindrical structure placed vertically in the axial direction; the sensor mounting base 47 is mounted on the top of the vibration conductive shell 41; the first sensor interface 42, the second sensor interface 43, the third sensor interface 44, and the fourth sensor interface 45 are all groove-shaped; the first sensor interface 42, the second sensor interface 43, the third sensor interface 44, and the fourth sensor interface 45 are mounted on the sensor mounting base 47.

[0032] The bottom outer wall of the vibration conduction shell 41 is provided with a mounting platform; the vibration conduction shell 41 is fixedly connected to the cooling device 2 by threads through the mounting platform.

[0033] Vertical internal channels are provided at the axes of the vibration conducting shell 41 and the sensor mounting seat 47 to serve as channels for the data transmission lines of the external sensors to be tested, thereby preventing the cables from failing due to heat.

[0034] The first sensor interface 42 and the fourth sensor interface 45 are both horizontally mounted on the sensor mounting base 47, perpendicular to each other. The second sensor interface 43 and the third sensor interface 44 are both vertically mounted on the sensor mounting base 47. The second sensor interface 43 is located at the center of the sensor mounting base 47, while the third sensor interface 44 is located on the side of the sensor mounting base 47 away from the fourth sensor interface 45. The inner diameters of the first sensor interface 42, the second sensor interface 43, the third sensor interface 44, and the fourth sensor interface 45 are adjusted as needed to enable high-temperature vibration testing of sensors of various sizes.

[0035] In the present invention, the cooling device 2 is located between the vibration table 3 and the test auxiliary device 4 and is threadedly connected to the test auxiliary device 4. On the one hand, it transmits vibration to the test auxiliary device 4, and on the other hand, it prevents the high temperature in the high temperature box from being transmitted to the vibration table.

[0036] The high temperature box 1 is located on the top of the high temperature vibration test device, is in contact with the cooling device 2 but is not fixedly connected, and is the heat source of the high temperature vibration device.

[0037] The test auxiliary device 4 is above the cooling device 2 and is threadedly connected to the cooling device 2. It is used to install the sensor, protect the inner side of the sensor and its cables from high temperature damage, and transmit vibration to the sensor.

[0038] like Figure 2 As shown, based on the above technical solution, the test auxiliary device 4 is further described. To minimize the impact of high temperature on the cooling device and vibration table while protecting the sensor from high temperature "corrosion," the test auxiliary device 4 adopts a slender design. While the head is subjected to high temperature "corrosion," the heat transferred from the bottom to the cooling device and vibration table is minimized. The test auxiliary device 4 includes a vibration-conducting housing 41, four sensor interfaces 42-45, and the sensor to be tested.

[0039] The vibration conduction shell 41 has two characteristics. On the one hand, the geometry of the internal channel needs to be designed due to the limitation of the sensor size and the corresponding cable routing problem. On the other hand, it is necessary to spray heat-insulating material on the inner wall to prevent high temperature from damaging the cable and the inner side of the sensor.

[0040] There are four sensor interfaces 42 to 45, of which interfaces 43 and 44 are on the top surface of the head of the auxiliary device 4, and interfaces 42 and 45 are on the side of the head of the auxiliary device 4. Interfaces 42 and 43 can be installed with Class A sensors, and interfaces 44 and 45 can be installed with Class B sensors; sensor interfaces 42 to 45 are the main channels connecting the vibration conduction shell 41 with the external environment. The test environment is a high-temperature environment, so airtightness treatment is required at the sensor interface to prevent high-temperature gas from entering the vibration conduction shell 41.

[0041] During the high-temperature vibration test, for Class B sensors, sensors can be installed on the top and side surfaces of the auxiliary device 4 at the same time. The cables pass through the inner cavities of the sensor interfaces 44 and 45 and the connected vibration conduction shell 41, and are connected to the acquisition system through the cooling device 2 to determine the working status of the sensor. During the process, the Class B sensors can be subjected to axial and lateral high-temperature vibration tests at the same time.

[0042] In the present invention, a device suitable for high-temperature vibration testing of sensors is assembled at the use position, and the sensor is installed on the top and side surfaces of the auxiliary device 4. The sensor cable is connected to the acquisition system through the vibration conduction shell 41 and the cooling device 2. When the test working environment is started, the airtight design and the setting of the heat insulation material in the auxiliary device 4 are beneficial to the protection of the sensor and its cable. The slender design of the auxiliary device 4 and the function of the cooling device 2 minimize the impact of high-temperature heat transfer on the vibration table and other equipment. In this way, the axial and lateral high-temperature vibration tests of the sensor can be carried out safely and effectively.

[0043] The high-temperature vibration test auxiliary device of the present invention avoids the conventional vibration table from working at high temperatures, meets the requirements of vibration testing in high-temperature environments, and integrates two independent test items into a new test item.

[0044] The high-temperature vibration test auxiliary device of the present invention ensures that only the sensor measuring surface is subjected to the high-temperature environment test due to its airtightness and heat insulation design. On the one hand, it protects the sensor and the corresponding cables, and on the other hand, it simulates the working environment of the sensor as much as possible.

[0045] The high-temperature vibration test auxiliary device of the present invention has multiple sensor installation ports on the head, which can simultaneously install sensors axially and laterally, and simultaneously perform axial vibration tests and lateral vibration tests on sensors, thereby improving the efficiency of vibration tests.

[0046] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solutions of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the scope of protection of the technical solutions of the present invention.

Claims

1. A device suitable for high-temperature vibration testing of sensors, characterized by: It comprises a high temperature box (1), a cooling device (2), a vibration table (3), a test auxiliary device (4) and a supporting structure (5); The vibration table (3) is placed horizontally in the axial direction; the high temperature box (1) is installed on the ground through a support structure (5); the high temperature box (1) is located above the vibration table (3); a through hole is provided at the center of the lower surface of the high temperature box (1); the cooling device (2) is installed vertically in the axial direction on the upper surface of the vibration table (3), and the top of the cooling device (2) extends into the through hole on the lower surface of the high temperature box (1); the top of the cooling device (2) contacts the high temperature box (1) and is not fixedly connected; the test auxiliary device (4) is installed on the top of the cooling device (2), and the test auxiliary device (4) is located in the inner cavity of the high temperature box (1); the external sensor to be tested is installed on the test auxiliary device (4); The cooling device (2) is screw-connected to the vibration table (3), and a vibration environment is applied to the cooling device (2) via the vibration table (3); The cooling device (2) transmits the vibration provided by the vibration table (3) to the test auxiliary device (4), thereby realizing a vibration test on the sensor to be tested; at the same time, the cooling device (2) prevents the high temperature environment generated by the high temperature box (1) from being transmitted to the vibration table (3); The test auxiliary device (4) comprises a vibration conducting shell (41), a first sensor interface (42), a second sensor interface (43), a third sensor interface (44), a fourth sensor interface (45) and a sensor mounting seat (47); The vibration conducting shell (41) is a cylindrical structure placed vertically in the axial direction; the sensor mounting seat (47) is installed on the top of the vibration conducting shell (41); the first sensor interface (42), the second sensor interface (43), the third sensor interface (44), and the fourth sensor interface (45) are all groove structures; the first sensor interface (42), the second sensor interface (43), the third sensor interface (44), and the fourth sensor interface (45) are arranged on the sensor mounting seat (47); The bottom outer wall of the vibration conduction shell (41) is provided with a mounting platform; the vibration conduction shell (41) is screw-connected to the cooling device (2) via the mounting platform; The axis of the vibration conducting shell (41) and the sensor mounting seat (47) are both provided with a vertical internal channel, which serves as a channel for the data transmission line of the external sensor to be tested to prevent the cable from being damaged by heat; The first sensor interface (42) and the fourth sensor interface (45) are both horizontally arranged on the sensor mounting base (47), and the first sensor interface (42) and the fourth sensor interface (45) are perpendicular to each other; the second sensor interface (43) and the third sensor interface (44) are both vertically arranged on the sensor mounting base (47); the second sensor interface (43) is located at the center of the sensor mounting base (47); and the third sensor interface (44) is located at a side of the sensor mounting base (47) away from the fourth sensor interface (45).

2. The device for high-temperature vibration testing of sensors according to claim 1, characterized in that: The high temperature box (1) comprises an outer shell (11) and an inner layer (12); The outer shell (11) is a hollow rectangular shell structure; the bottom of the outer shell (11) is installed on the ground through a supporting structure (5); the inner layer (12) is attached to the inner wall of the outer shell (11); and through holes are provided at the center positions of the bottoms of the outer shell (11) and the inner layer (12).

3. The device for high-temperature vibration testing of sensors according to claim 2, characterized in that: The inner layer (12) provides a high-temperature environment for the inner cavity of the high-temperature box (1); and the outer shell (11) provides protection and heat insulation.

4. The device for high-temperature vibration testing of sensors according to claim 3, characterized in that: The inner diameters of the first sensor interface (42), the second sensor interface (43), the third sensor interface (44), and the fourth sensor interface (45) are set according to requirements to achieve high-temperature vibration testing of sensors to be tested in various sizes.

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