Display module and display device

Abstract

Embodiments of the present application provide a display module and a display device, the display module comprising a display panel, the display panel comprising a display part, a bending part and a binding part, the bending part connecting the display part and the binding part, the binding part being bent to a non-light-emitting side of the display panel through the bending part; the display module further comprising a support layer, the support layer comprising a first support part and a second support part, along a first direction, the first support part being located on a side of the display part close to the binding part, and the second support part being located on a side of the binding part close to the display part; the first direction being a thickness direction of the display panel; the display module further comprising a support structure and an adhesive structure, along the first direction, the support structure and the adhesive structure are both located between the first support part and the second support part, and the support layer covers the adhesive structure; along a second direction, the adhesive structure is located on a side of at least part of the support structure close to the bending part; by adopting the technical scheme provided by the present application, the structural stability of the display module can be improved by setting the adhesive structure.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, display panels have been widely used in people's production and daily life. To better meet people's needs, adjustments can be made to display panels, such as adjusting the film layers within the display panel, thereby improving the overall effect of the display panel. Summary of the Invention

[0003] This invention provides a display module and a display device. By providing an adhesion structure between a first support portion and a second support portion, the structural stability of the display module can be improved.

[0004] In a first aspect, embodiments of the present invention provide a display module, including a display panel;

[0005] The display panel includes a display section, a bending section, and a bonding section. The bending section connects the display section and the bonding section, and the bonding section is bent through the bending section to the non-light-emitting side of the display panel.

[0006] The display module further includes a support layer, which includes a first support portion and a second support portion. Along a first direction, the first support portion is located on the side of the display portion near the bonding portion, and the second support portion is located on the side of the bonding portion near the display portion; the first direction is the thickness direction of the display panel.

[0007] The display module further includes a support structure and an adhesive structure. Along the first direction, the support structure and the adhesive structure are both located between the first support portion and the second support portion, and the support layer covers the adhesive structure. Along the second direction, the adhesive structure is located on at least a portion of the support structure near the bending portion. The second direction intersects the first direction.

[0008] In a second aspect, embodiments of the present invention provide a display device, including the display module described in the first aspect.

[0009] This invention provides a display module. The display module includes a display panel comprising a display portion, a bending portion, and a bonding portion. The display portion is located on the light-emitting side of the display panel, and the bending portion causes the bonding portion to bend to the non-light-emitting side of the display panel. Further, the support layer of the display module includes a first support portion and a second support portion. The display module also includes a support structure located between the first and second support portions. The arrangement of the first support portion, the second support portion, and the support structure ensures the stability of the overall structure. Additionally, the display module includes an adhesion structure located between the first and second support portions, with the adhesion structure positioned near at least a portion of the support structure close to the bending portion. On one side of the display module, due to the adhesive structure, the film layer in the display module will not peel off due to stress at the bending and bonding parts. The support layer covers the adhesive structure, which can be understood as the adhesive structure being located at the end of part of the support structure near the bending part, and the end of the support layer near the bending part is closer to the bending part than the end of the adhesive structure near the bending part. In other words, the adhesive structure is located within the defined area of ​​the first and second support parts. By setting the adhesive structure in the display module, it helps to ensure that the second support part will not warp due to stress or peel off from the support structure, thereby better ensuring the overall structural stability of the display module.

[0010] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of exemplary embodiments of the present invention, the accompanying drawings used in describing the embodiments are briefly introduced below. Obviously, the accompanying drawings described are only a portion of the drawings of the embodiments to be described in this invention, and not all of the drawings. For those skilled in the art, other drawings can be obtained from these drawings without any creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0013] Figure 2 This is a cross-sectional schematic diagram of the first display module provided in an embodiment of the present invention;

[0014] Figure 3 This is a cross-sectional schematic diagram of the second type of display module provided in an embodiment of the present invention;

[0015] Figure 4 This is a cross-sectional schematic diagram of the third type of display module provided in the embodiments of the present invention;

[0016] Figure 5This is a cross-sectional schematic diagram of the fourth type of display module provided in the embodiments of the present invention;

[0017] Figure 6 This is a cross-sectional schematic diagram of the fifth type of display module provided in the embodiments of the present invention;

[0018] Figure 7 This is a cross-sectional schematic diagram of the sixth type of display module provided in the embodiments of the present invention;

[0019] Figure 8 This is a cross-sectional schematic diagram of the seventh display module provided in the embodiments of the present invention;

[0020] Figure 9 This is a top view schematic diagram of a conductive layer provided in an embodiment of the present invention;

[0021] Figure 10 This is a schematic diagram of the first adhesion structure provided in the embodiments of the present invention;

[0022] Figure 11 This is a schematic diagram of the second adhesion structure provided in an embodiment of the present invention;

[0023] Figure 12 This is a schematic diagram of a support structure provided in an embodiment of the present invention;

[0024] Figure 13 This is a schematic diagram of an adhesion structure provided in an embodiment of the present invention;

[0025] Figure 14 This is a schematic diagram of a first structural representation of a display module provided in an embodiment of the present invention;

[0026] Figure 15 This is a schematic diagram of a second structure of a display module provided in an embodiment of the present invention;

[0027] Figure 16 This is a schematic diagram of a third structure of a display module provided in an embodiment of the present invention;

[0028] Figure 17 yes Figure 1 An enlarged schematic diagram of region E in the middle;

[0029] Figure 18 This is a cross-sectional schematic diagram of the eighth display module provided in the embodiments of the present invention;

[0030] Figure 19 This is a cross-sectional schematic diagram of the ninth type of display module provided in the embodiments of the present invention;

[0031] Figure 20 This is a cross-sectional schematic diagram of the tenth display module provided in the embodiment of the present invention;

[0032] Figure 21 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a system, product, or device comprising a series of units is not necessarily limited to those steps or units explicitly listed, but may include other units not explicitly listed or inherent to such products or devices.

[0035] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 2 This is a cross-sectional schematic diagram of the first display module provided in the embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of the second type of display module provided in an embodiment of the present invention. Figure 4 This is a cross-sectional schematic diagram of the third type of display module provided in the embodiments of the present invention, for reference. Figures 1 to 4As shown, this embodiment of the invention provides a display module 10, including a display panel 100; the display panel 100 includes a display portion 100a, a bending portion 100b, and a bonding portion 100c, the bending portion 100b connects the display portion 100a and the bonding portion 100c, and the bonding portion 100c is bent through the bending portion 100b to the non-light-emitting side of the display panel 100; the display module 10 also includes a support layer 200, the support layer 200 includes a first support portion 210 and a second support portion 220, along a first direction X1, the first support portion 210 is located on the display portion 100a near the bonding portion 100c. On the side, the second support portion 220 is located on the side of the bonding portion 100c near the display portion 100a; the first direction X1 is the thickness direction of the display panel 100; the display module 10 also includes a support structure 300 and an adhesive structure 400. Along the first direction X1, the support structure 300 and the adhesive structure 400 are both located between the first support portion 210 and the second support portion 220, and the support layer 200 covers the adhesive structure 400; along the second direction X2, the adhesive structure 400 is located on the side of at least a portion of the support structure 300 near the bending portion 100b; the second direction X2 intersects with the first direction X1.

[0036] Among them, further, refer to Figures 1 to 4 As shown, the display module 10 includes a display panel 100, which includes a display section 100a. The display section 100a is located in the light-emitting section of the display panel 100. Light emission is achieved by driving light-emitting elements (not specifically shown in the figure) disposed in the display section 100a, thereby realizing the overall display function of the display module 10. Further, refer to... Figures 1 to 4 As shown, the display panel 100 also includes a bending portion 100b and a bonding portion 100c. The bending portion 100b is bendable, and the bending portion 100b causes the bonding portion 100c to be positioned on the non-light-emitting side of the display panel 100 through bending. It should be noted that... Figure 1 The film structure is shown unfolded to illustrate the relative positional relationship between the display part 100a, the bending part 100b, and the binding part 100c, without bending the bending part 100b. Figures 2 to 4 To show a partial cross-sectional view of the structure of module 10, the bent portion 100b is shown bent. Specifically, refer to... Figures 2 to 4 The bending portion 100b is a bent arc-shaped structure. The binding portion 100c is connected to the display portion 100a through the bending portion 100b, and the binding portion 100c is bent to the non-light-emitting side of the display panel 100 through the bending portion 100b. This reduces the area of ​​the lower bezel in the display module 10 and increases the screen-to-body ratio. Further, refer to... Figure 1 As shown, on the non-light-emitting side of the display panel 100, a plurality of bonding terminals (see reference) are provided on the bonding part 100c. Figure 1The bonding terminals 110 and 120 shown are electrically connected to the pads 100A1 of the driver chip 100A and the pads 100B1 of the flexible circuit board 100B, respectively. The signals provided by the driver chip 100A and the flexible circuit board 100B are transmitted to the display panel 100 through the bonding terminals, thereby realizing the display function of the display panel 100.

[0037] Further reference Figures 2 to 4 As shown, the display module 10 also includes a support layer 200, which includes a first support portion 210 and a second support portion 220. Along the first direction X1, the first support portion 210 is located on the side of the display portion 100a near the bonding portion 100c, and the second support portion 220 is located on the side of the bonding portion 100c near the display portion 100a. This can be understood as the first support portion 210 supporting the display portion 100a and the second support portion 220 supporting the bonding portion 100c. Simultaneously, the display module 10 also includes a support structure 300. Along the first direction X1, the support structure 300 is located between the first support portion 210 and the second support portion 220, that is, the support structure 300 is located within the area defined by the first support portion 210 and the second support portion 220. The first support portion 210 and the second support portion 220 can be understood as the back plate of the display module 10. The support layer 200 and the support structure 300 both play a supporting role to ensure the overall structural stability of the display module 10.

[0038] Furthermore, the display module 10 also includes an adhesion structure 400. Along the first direction X1, the adhesion structure 400 is also located between the first support portion 210 and the second support portion 220. That is, the adhesion structure 400 and the support structure 300 are both located within the area defined by the first support portion 210 and the second support portion 220. Further, refer to... Figures 2 to 4As shown, along the second direction X2, the adhesion structure 400 is located on the side of at least a portion of the support structure 300 near the bending portion 100b. The bending portion 100b causes the bonding portion 100c to bend towards the non-light-emitting side of the display panel 100. Therefore, the bending portion 100b and the bonding portion 100c experience stress that causes them to deflect towards the non-light-emitting side. Since the bonding portion 100c is located on the side of the second support portion 220 away from the display portion 100a, the stress generated by the bonding portion 100c and the bending portion 100b can cause the second support portion 200 to tend to move away from the support structure 300, or in other words, it can lead to a potential peeling of the support layer 200, affecting the overall structural stability of the display module 10. The adhesive structure 400 disposed on the first support portion 210 and the second support portion 220 has a certain viscosity, which can play a strong adhesive and fixative effect on the second support portion 220, ensuring the structural stability of the support layer 200 and preventing the support layer 200 from peeling off. At the same time, the adhesive structure 400 can also provide corresponding support force, thereby ensuring the overall structural stability of the display module 10.

[0039] Further reference Figures 2 to 4 As shown, along the first direction X1, the support layer 200 covers the adhesion structure 400. Specifically, the projection of the support layer 200 onto the first direction X1 covers the projection of the adhesion structure 400 onto the first direction X1; or, the adhesion structure 400 disposed on the first support portion 210 and the second support portion 220 does not exceed the defined area of ​​the first support portion 210 and the second support portion 220; or, the end of the first support portion 210 near the bend portion 100b is closer to the bend portion 100b than the end of the adhesion structure 400 near the bend portion 100b. In the prior art, corresponding to the placement area of ​​the adhesion structure 400 provided in the embodiment of the present invention, a support structure is generally provided. The support structure generally includes foam, copper foil, and other film layers used for support. The thickness of the adhesion layer adhering to the second support portion is small, resulting in insufficient adhesion to the second support portion, leading to a greater risk of warping and peeling of the second support portion. The embodiments of the present invention can be understood as shortening the length of at least a portion of the support structure 300 in the second direction X2, and setting the area left after the shortening as an adhesion structure 400. In this way, the adhesion structure 400 can have a large thickness and strong adhesion, ensuring that the support layer 200 will not be peeled off due to existing stress, thereby achieving the reliability of the structure of the display module 10.

[0040] Further reference Figures 2 to 4As shown, along the second direction X2, the adhesion structure 400 is located on at least a portion of the support structure 300 near the bend 100b. The support structure 300 may include multiple film layers, such as mesh adhesive, foam, or copper foil. The adhesion structure 400 is located on a portion of the film layers of the support structure 300 near the bend 100b. This can also be understood as, with reference to... Figures 2 to 4 As shown, the thickness of the adhesion structure 400 can be set differently along the first direction X1. The specific thickness value of the adhesion structure 400, or which film layers of the adhesion structure 400 are located on the side of the support structure 300 closest to the bending portion 100b, can be set differently according to the needs of the display module 10, reflecting the diverse setting methods of the adhesion structure 400.

[0041] Furthermore, the adhesion structure 400 provided in this embodiment of the invention is located within the defined range of the first support portion 210 and the second support portion 220, or is... Figure 2 , Figure 3 and Figure 4 Taking the structure shown as an example, it is located below the second support portion 220. Unlike the protective adhesive filled in the bending radius limiting area of ​​the bending portion 100b, the main function of the adhesive structure 400 provided in this embodiment of the invention is to provide a larger adhesive force to the second support portion 220, so as to ensure that it remains stable and does not lift up under the action of a larger adhesive force.

[0042] Optional, see reference Figures 2 to 4 As shown, the display module 10 also includes film structures such as a polarizer 600, optical adhesive 700, a cover plate 800, and a protective layer 900. The polarizer 600, optical adhesive 700, and cover plate 800 are located on the side of the display section 100a away from the bonding section 100c, and the protective layer 900 at least covers the bent section 100b. The polarizer 600 reduces the amount of light incident on the display module 10 that re-emits from it, thus reducing interference from ambient light and ensuring the overall display effect of the display module 10. The optical adhesive 700 bonds the overall structure, ensuring the overall structural stability of the display module 10. The cover plate 800 and protective layer 900 protect the structure of the display module 10, ensuring its reliability. Other film layers can be added adaptively for different display modules 10; however, these will not be described in detail in this embodiment.

[0043] In summary, the display module provided in this embodiment of the invention has a support structure and an adhesive structure disposed between the first support portion and the second support portion. The support layer and the support structure are used to provide support for the overall structure of the display module, and the adhesive structure ensures the stability of the structure of the first support portion and the second support portion, avoids peeling of the support layer, and thus better ensures the overall structural stability of the display module.

[0044] Continue to refer to Figures 2 to 4 As shown, the support structure 300 includes a first adhesive layer 310, a buffer layer 320 and a conductive layer 330 stacked along the first direction X1. The first adhesive layer 310 is located on the side of the buffer layer 320 near the first support portion 210. Along the second direction X2, the adhesive structure 400 is located at least on the side of the conductive layer 330 near the bend portion 100b.

[0045] Furthermore, in combination Figures 2 to 4 As shown, the support structure 300 includes a first adhesive layer 310, a buffer layer 320, and a conductive layer 330. Specifically, the first adhesive layer 310 is located on the side of the first support portion 210 away from the display portion 100a. The first adhesive layer 310 can be understood as a mesh adhesive, used to adhere the first support portion 210 to the buffer layer 320 in the support structure 300. The buffer layer 320 is located on the side of the first adhesive layer 310 away from the first support portion 210. The buffer layer 320 can be understood as foam or other highly flexible structures, and can buffer the impact force or stress received by the display module 10. The conductive layer 330 is located on the side of the buffer layer 320 away from the first adhesive layer 310. The conductive layer 330 can be copper foil or other structures with good thermal or electrostatic conduction effects. On the one hand, the conductive layer 330 has a certain degree of hardness to ensure the structural stability of the support structure 300. On the other hand, the conductive layer 330 has thermal and electrical conductivity, which can transfer heat and conduct static electricity, thereby avoiding the influence of heat and static electricity on the display module 10, and thus ensuring the structural stability and reliability of the display module 10.

[0046] Depending on the different settings of the support structure 300, the specific settings of the adhesion structure 400 can vary, as shown below:

[0047] Optional, continue to refer to Figure 2 As shown, along the second direction X2, the adhesion structure 400 is located on the side of the support structure 300 near the bend 100b.

[0048] The placement of the adhesion structure 400 in the display module 10 can be as follows: Figure 2 As shown, along the second direction X2, the adhesive structure 400 is located on the side of the entire support structure 300 near the bend 100b. Specifically, along the second direction X2, the adhesive structure 400 includes a portion of the first adhesive layer 310 near the bend 100b, a portion of the buffer layer 320 near the bend 100b, and a portion of the conductive layer 330 near the bend 100b.

[0049] Further reference Figure 2As shown, the adhesive structure 400 is bonded to the second support portion 220, and also bonded to the first support portion 210, thus maximizing the thickness of the adhesive structure 400. The adhesiveness of the adhesive structure 400 can be enhanced by increasing its thickness, thereby ensuring stronger structural stability between the first support portion 210 and the second support portion 220, and ultimately guaranteeing the overall structural stability of the display module 10.

[0050] Optional, continue to refer to Figure 3 As shown, along the first direction X1, the adhesion structure 400 and the first adhesion layer 310 at least partially overlap.

[0051] Furthermore, the placement of the adhesion structure 400 in the display module 10 can be as follows: Figure 3 As shown, along the second direction X2, the adhesive structure 400 is located on the side of the buffer layer 320 and the conductive layer 330 near the bending portion 100b. Simultaneously, the adhesive structure 400 is located on the side of the first adhesive layer 310 near the second support portion 220. Specifically, along the second direction X2, the adhesive structure 400 includes a portion of the buffer layer 320 near the bending portion 100b, and the adhesive structure 400 also includes a portion of the conductive layer 330 near the bending portion 100b.

[0052] Further reference Figure 3 As shown, along the second direction X2, the extension length of the first adhesive layer 310 is greater than the extension length of the buffer layer 320, and also greater than the extension length of the conductive layer 330. An adhesive structure 400 can be installed in the area where the first adhesive layer 310 extends compared to the buffer layer 320. Specifically, one side of the adhesive structure 400 is attached to the second support portion 220, and the other side of the adhesive structure 400 is also attached to a portion of the first adhesive layer 310. The adhesive structure 400 also has a relatively large thickness and good adhesive strength, preventing warping and peeling of the second support portion 220. Simultaneously, the first adhesive layer 310 exists between the adhesive structure 400 and the first support portion 210, and the first adhesive layer 310 also has a certain degree of adhesion. The structural stability of the first support portion 210 and the second support portion 220 can be ensured through the first adhesive layer 310 and the adhesive structure 400.

[0053] Combination Figure 3As shown, in the area where the adhesive structure 400 is set, considering that the first adhesive layer 310 in the support structure 300 also has a certain degree of adhesion, the adhesive structure 400 can be set on the side of the first adhesive layer 310 close to the second support portion 220. On the one hand, this can reduce the thickness of the adhesive structure 400 and thus reduce the manufacturing cost of the adhesive structure 400. On the other hand, it can also ensure the stability of the structure between the first support portion 210 and the second support portion 220, thereby ensuring the overall structural stability of the display module 10.

[0054] Optional, continue to refer to Figure 4 As shown, along the first direction X1, the adhesive structure 400 overlaps at least partially with the first adhesive layer 310 and the buffer layer 320.

[0055] Furthermore, the placement of the adhesion structure 400 in the display module 10 can be as follows: Figure 4 As shown, along the second direction X2, the adhesion structure 400 is located on the side of the conductive layer 330 near the bend portion 100b. Simultaneously, the adhesion structure 400 is located on the side of the buffer layer 320 near the second support portion 220. Specifically, along the second direction X2, the adhesion structure 400 includes a portion of the conductive layer 330 located on the side near the bend portion 100b.

[0056] Further reference Figure 4 As shown, along the second direction X2, the extension lengths of the first adhesive layer 310 and the buffer layer 320 are greater than the extension length of the conductive layer 330. An adhesive structure 400 can be installed in the area where the buffer layer 320 extends compared to the conductive layer 330. Specifically, one side of the adhesive structure 400 is attached to the second support portion 220, and the other side of the adhesive structure 400 is also attached to a portion of the buffer layer 320. The adhesive structure 400 has good adhesive strength, preventing warping and peeling of the second support portion 220; simultaneously, the buffer layer 320 between the adhesive structure 400 and the first support portion 210 ensures that external forces can be buffered in the area where the adhesive structure 400 is installed, thereby ensuring the reliability of the display module 10.

[0057] Combination Figure 4 As shown, by setting the adhesion structure 400, the second support portion 220 can be effectively prevented from being peeled off. Furthermore, a buffer layer 320 is retained on the side of the adhesion structure 400 near the first support portion 210. On the one hand, while ensuring a good adhesion effect to the second support portion 220, the thickness of the adhesion structure 400 can be reduced, thereby reducing the manufacturing cost of the adhesion structure 400. On the other hand, it can also ensure that external forces can be buffered in the area where the adhesion structure 400 is set, thereby ensuring the reliability of the display module 10.

[0058] Continue to refer to Figures 2 to 4 As shown, the support structure 300 further includes a second adhesive layer 340 located between the conductive layer 330 and the second support portion 220 along the first direction X1; along the second direction X2, at least a portion of the adhesive structure 400 is located on the side of the conductive layer 330 and the second adhesive layer 340 near the bending portion 100b; along the first direction X1, the thickness of the adhesive structure 400 is greater than the thickness of the second adhesive layer 340.

[0059] Furthermore, the support structure 300 also includes a second adhesive layer 340, which is located between the conductive layer 330 and the second support portion 220. The second adhesive layer 340 also has a certain degree of adhesion. The second adhesive layer 340 can ensure a stable adhesion relationship between the conductive layer 330 and the second support portion 220, and prevent the second support portion 220 from peeling off at the conductive layer 330.

[0060] Further reference Figures 2 to 4 As shown, along the second direction X2, at least a portion of the adhesive structure 400 is located on the side of the conductive layer 330 and the second adhesive layer 340 near the bend portion 100b. In other words, the adhesive structure 400 includes a portion of the conductive layer 330 near the bend portion 100b and a portion of the second adhesive layer 340 near the bend portion 100b, and its thickness is greater than that of the second adhesive layer 340. Compared to the second adhesive layer 340, it has a stronger adhesive strength to the second support portion 220, ensuring that the second support portion 220 in this portion will not peel off due to warping stress.

[0061] Among them, reference Figures 2 to 4 As shown, along the first direction X1, the thickness of the second adhesion layer 340 is h, reference... Figure 2 As shown, along the first direction X1, the thickness of the adhesion structure 400 is h1, where h1 > h; Reference Figure 3 As shown, the thickness of the adhesion structure 400 is h2, where h2 > h; Reference Figure 4 As shown, the thickness of the adhesion structure 400 is h3, where h3 > h. In general, along the first direction X1, the thickness of the second adhesion layer 340 is less than the thickness of the adhesion structure 400.

[0062] Furthermore, the display module 10 can be made thinner by reducing the thickness of the second adhesive layer 340. Specifically, the adhesive structure 400 ensures the overall structural stability of the display module 10 and prevents the second support portion 220 from peeling off at the support structure 300. Therefore, the thickness of the second adhesive layer 340 can be reduced, achieving a thinner display module 10 without affecting its structural stability.

[0063] Optionally, when the thickness of the adhesion structure 400 along the first direction X1 is sufficiently large, for example as... Figure 2 As shown, when the projected area of ​​the adhesion structure 400 along the first direction X1 is sufficiently large, the display module 10 can ensure the structural stability of the second support portion 220 simply by setting the adhesion structure 400. In this case, the second adhesion layer 340 can be omitted, thereby further reducing the thickness of the display module 10 and better achieving a thinner design for the display module 10.

[0064] Continue to refer to Figures 2 to 4 As shown, the viscosity coefficient of the adhesive structure 400 is greater than that of the second adhesive layer 340.

[0065] Further reference Figures 2 to 4 As shown, taking the support structure 300 including the second adhesive layer 340 as an example, along the second direction X2, the distance between the adhesive structure 400 and the bending portion 100b is less than the distance between the second adhesive layer 340 and the bending portion 100b; at the same time, the projection of the adhesive structure 400 onto the first direction X1 overlaps with the projection of the bonding portion 100c onto the first direction X1, so the degree of anti-peel protection of the second support portion 220 by the adhesive structure 400 is greater than the degree of anti-peel protection of the second support portion 220 by the second adhesive layer 340. Therefore, adjusting the adhesive coefficient of the adhesive structure 400 to be greater than the adhesive coefficient of the second adhesive layer 340 can better ensure the stability of the overall structure of the display module 10.

[0066] Figure 5 This is a cross-sectional schematic diagram of the fourth display module provided in the embodiments of the present invention. Figure 6 This is a cross-sectional schematic diagram of the fifth display module provided in the embodiments of the present invention. Figure 7 This is a cross-sectional schematic diagram of the sixth display module provided in the embodiment of the present invention, for reference. Figures 5 to 7 As shown, the adhesion structure 400 includes a first adhesion portion 410 and a second adhesion portion 420 connected together; along the first direction X1, the first adhesion portion 410 is located between the conductive layer 330 and the second support portion 220; along the second direction X2, the second adhesion portion 420 is located on the side of the conductive layer 330 and the first adhesion portion 410 near the bending portion 100b, and the thickness of the second adhesion portion 420 is greater than the thickness of the first adhesion portion 410; the first adhesion portion 410 is reused as the second adhesion layer 340.

[0067] For details, please refer to Figures 5 to 7 As shown, the adhesion structure 400 includes a first adhesion portion 410, which is located between the conductive layer 330 and the second support portion 220 along a first direction X1, for achieving adhesion between the conductive layer 330 and the second support portion 220. Further, the location of the first adhesion portion 410 corresponds to... Figures 2 to 7 The second adhesive layer 340 shown can be reused as the second adhesive layer 340, so the first adhesive portion 410 can be reused as the second adhesive layer 340.

[0068] For details, please refer to Figures 5 to 7 As shown, the adhesion structure 400 also includes a second adhesion portion 420. The second adhesion portion 420 is located at least along the second direction X2 on the side of the conductive layer 330 and the first adhesion portion 410 near the bending portion 100b. That is, along the second direction X2, the distance between the second adhesion portion 420 and the bending portion 100b is less than the distance between the first adhesion portion 410 and the bending portion 100b. At the same time, the projection of the second adhesion portion 420 onto the first direction X1 overlaps with the projection of the bonding portion 100c onto the first direction X1. Therefore, the degree of anti-peel protection of the second support portion 220 by the second adhesion portion 420 is greater than the degree of anti-peel protection of the second support portion 220 by the first adhesion portion 410. Therefore, adjusting the thickness of the second adhesion portion 420 to be greater than the thickness of the first adhesion portion 410 ensures the stability of the film layer at the second adhesion portion 420, which can better ensure the stability of the overall structure of the display module 10.

[0069] Furthermore, the first adhesive portion 410 is reused as the second adhesive layer 340, and the first adhesive portion 410 and the second adhesive portion 420 are made of the same material, so they can be manufactured and integrated at the same time, thereby reducing the manufacturing cost of the display module 10.

[0070] Continue to refer to Figures 2 to 7 As shown, along the first direction X1, the adhesion structure 400 overlaps with at least a portion of the binding portion 100c.

[0071] In this case, the orthographic projection of the adhesive structure 400 onto the first direction X1 overlaps with the orthographic projection of the bonding portion 100c onto the first direction X1. Because the bonding portion 100c is bent by the bending portion 100b and moved to the non-light-emitting side of the display panel 100, the bonding portion 100c is more prone to warping and peeling of the second support portion 220, affecting the structural stability of the display module 10. The adhesive structure 400 has good adhesive strength, effectively preventing warping and peeling of the second support portion 220. However, the area of ​​the second support portion 220 that overlaps with the bonding portion 100c along the first direction X1 exhibits a more pronounced tendency to warp and peel. Therefore, adjusting the overlapping area between the adhesive structure 400 and a portion of the bonding portion 100c can more effectively ensure the structural stability of the second support portion 220. Specifically, the overlap should be at least partially along the first direction X1, for example, refer to... Figure 2 The middle aa area can ensure the overall structural stability of the display module 10.

[0072] Continue to refer to Figures 2 to 7 As shown, the binding part 100c includes a binding end 100c1. Along the second direction X2, the binding end 100c1 is the end of the binding part 100c away from the bent part 100b. Along the first direction X1, the adhesive structure 400 overlaps with the binding end 100c1.

[0073] For details, please refer to Figures 2 to 7 As shown, the bonding portion 100c includes a bonding end portion 100c1, which is located on the side of the bonding portion 100c away from the bending portion 100b. The bonding end portion 100c1 can be understood as the end position of the display panel 100 at the bonding portion 100c. Furthermore, the bending of the bending portion 100b causes the bonding portion 100c to be on the non-light-emitting side of the display panel 100. Because the bending of the structure causes stress biased towards the non-light-emitting side, it can cause the second support portion 220 to peel off, thereby affecting the structural stability of the display module 10. The adhesive structure 400 provided in this embodiment of the invention has strong adhesion and can bond the second support portion 220, preventing it from peeling off.

[0074] Furthermore, since the binding end 100c1 is located at the end of the binding end 100c1, if the binding portion 100c of the display panel 100 causes the second support portion 220 to peel off, it should start from the binding end 100c1 and gradually cause the second support portion 220 to detach from the support structure 300. The adhesive structure 400 provided in this embodiment overlaps with the binding end 100c1 along the first direction X1, or in other words, the orthographic projection of the adhesive structure 400 onto the first direction X1 overlaps with the orthographic projection of the binding end 100c1 onto the first direction X1. The adhesive structure 400 prevents the second support portion 220 from peeling off from the support structure 300 from the source, thereby ensuring the structural stability of the second support portion 220 and the overall structural stability of the display module 10.

[0075] Continue to refer to Figure 2 As shown, the area of ​​the binding part 100c is S1, and the area of ​​the binding part 100c that overlaps with the adhesion structure 400 in the first direction X1 is S2; wherein, S2 / S1≥50%.

[0076] Furthermore, the area of ​​the bonding portion 100c is S1, and the area of ​​the overlapping region between the adhesive structure 400 and the bonding portion 100c along the first direction X1 is S2. The larger the overlapping area S2, the better the adhesion effect of the adhesive structure 400 on the second support portion 220, ensuring that the second support portion 220 will not be peeled off. Specifically, S1 and S2 can satisfy: S2 / S1 ≥ 50%. Figure 2As shown, region aa can be understood as the region where the adhesive structure 400 overlaps with the bonding portion 100c along the first direction X1, and region bb can be understood as the region corresponding to the bonding portion 100c. By increasing the overlapping area between the adhesive structure 400 and the bonding portion 100c, the structural stability of the second support portion 220 can be further ensured, thereby improving the overall structural stability of the display module 10.

[0077] Figure 8 This is a cross-sectional schematic diagram of the seventh display module provided in the embodiments of the present invention. Figure 9 This is a top view schematic diagram of a conductive layer provided in an embodiment of the present invention, for reference. Figure 1 , Figure 8 and Figure 9 As shown, the conductive layer 330 includes a first conductive portion 331 and a second conductive portion 332. Along the second direction X2, the second conductive portion 332 is located on the side of the first conductive portion 331 near the bending portion 100b. The second conductive portion 332 includes a perforation 332a that penetrates the conductive layer 330. The adhesive structure 400 is bonded to the second support portion 220 through the perforation 332a.

[0078] Among them, reference Figure 8 and Figure 9 As shown, the conductive layer 330 may include a first conductive portion 331 and a second conductive portion 332, and along the second direction X2, the second conductive portion 332 is located on the side of the first conductive portion 331 near the bend portion 100b. Further, along the first direction X1, the projection of the first conductive portion 331 does not overlap with the projection of the adhesive structure 400, while the projection of the second conductive portion 332 overlaps with the projection of the adhesive structure 400.

[0079] Further reference Figure 8 and Figure 9 As shown, the second conductive portion 332 includes a cutout 332a, which penetrates the conductive layer 330. The adhesion structure 400 can be bonded to the second support portion 220 through the cutout 332a, thereby ensuring a good adhesion effect to the second support portion 220 and ensuring the structural stability of the second support portion 220. The conductive layer 330 can be a copper foil, which has good thermal and electrical conductivity. The conductive layer 330 can dissipate heat and static electricity conducted to it, thereby ensuring the reliability of the display module 10. For example, see reference... Figure 8 As shown, the second conductive section 332 overlaps with the driver chip 100A and other components disposed in the bonding section 100c. The driver chip 100A generates heat and static electricity during operation. The arrangement of the second conductive section 332 helps to dissipate this heat and static electricity in a timely manner, thereby ensuring the reliability of the display module 10 and improving the display effect of the display module 10.

[0080] Continue to refer to Figure 8 and Figure 9 As shown, the second conductive portion 332 also includes grid lines 332b that define the cutouts 332a; the sum of the coverage areas of the cutouts 332a is greater than the coverage area of ​​the grid lines 332b.

[0081] Further reference Figure 8 and Figure 9 As shown, the second conductive section 332 also includes grid lines 332b, which surround the cutout 332a. These grid lines 332b can be understood as defining the cutout 332a. The grid lines 332b can dissipate heat generated in the surrounding area or conduct static electricity, thereby ensuring the reliability of the display module 10. Furthermore, the sum of the coverage areas of the cutouts 332a is greater than the coverage area of ​​the grid lines 332b. The larger the coverage area of ​​the cutouts 332a, the larger the bonding area between the adhesion structure 400 and the second support section 220, resulting in a more stable structure for the second support section 220. Specifically, a larger sum of the coverage areas of the cutouts 332a can be achieved by having a larger number of cutouts 332a in the second conductive section 332, or by having a larger coverage area for each cutout 332a.

[0082] Continue to refer to Figure 8 and Figure 9 As shown, the first conductive section 331 and the second conductive section 332 are connected.

[0083] Further reference Figure 9 As shown, the first conductive portion 331 and the second conductive portion 332 can be connected to ensure the flatness and continuity of the overall structure. For example, in the fabrication process of the conductive layer 330, the first conductive portion 331 and the second conductive portion 332 can be fabricated at different locations, ensuring that the first conductive portion 331 and the second conductive portion 332 are electrically connected. Furthermore, considering that the first conductive portion 331 and the second conductive portion 332 are located at the same position in the film layer, and that the first conductive portion 331 and the second conductive portion 332 are electrically connected, the first conductive portion 331 and the second conductive portion 332 can be an integrally formed structure, and the first conductive portion 331 and the second conductive portion 332 can be fabricated simultaneously, thereby reducing the manufacturing cost of the display module 10.

[0084] Furthermore, by connecting the first conductive portion 331 and the second conductive portion 332, the heat and static electricity conducted at the second conductive portion 332 can be transferred to the first conductive portion 331, ensuring the effective transfer of static electricity and heat in the display module 10. This is achieved by combining... Figure 8As shown, the projection of the driver chip 100A along the first direction X1 overlaps with the second conductive portion 332. In other words, the distance between the driver chip 100A and the second conductive portion 332 is less than the distance between the driver chip 100B and the first conductive portion 331. Therefore, by connecting the first conductive portion 331 and the second conductive portion 332, the heat and static electricity generated by the driver chip 100A conducted by the second conductive portion 332 can be further transferred, ensuring the effective transfer of static electricity and heat, thereby avoiding the influence of temperature and static electricity on the display module 10 and ensuring the overall reliability of the display module 10.

[0085] Figure 10 This is a schematic diagram of the first adhesion structure provided in the embodiment of the present invention; the adhesion structure 400 includes an adhesive colloid 400a and thermally conductive particles 400b disposed in the adhesive colloid 400a; the thermal conductivity coefficient of the thermally conductive particles 400b is greater than that of the adhesive colloid 400a.

[0086] Among them, reference Figure 10 As shown, the adhesion structure 400 includes an adhesive colloid 400a and thermally conductive particles 400b, with the thermally conductive particles 400b disposed within the adhesive colloid 400a. Furthermore, the thermal conductivity of the thermally conductive particles 400b is greater than that of the adhesive colloid 400a. Therefore, the adhesion structure 400 can transfer heat through the thermally conductive particles 400b, thereby dissipating heat generated in the surrounding structure. Thus, the adhesion structure 400 ensures both the stability and reliability of the display module 10 structure.

[0087] Figure 11 This is a schematic diagram of the second adhesion structure provided in the embodiment of the present invention; the adhesion structure 400 includes an adhesive colloid 400c and conductive particles 400d disposed within the adhesive colloid 400c; the resistivity of the conductive particles 400d is less than the resistivity of the adhesive colloid 400c.

[0088] Among them, reference Figure 11 As shown, the adhesion structure 400 includes an adhesive colloid 400c and conductive particles 400d, with the conductive particles 400d disposed within the adhesive colloid 400c. Furthermore, the resistivity of the conductive particles 400d is lower than that of the adhesive colloid 400c, and the conductive particles 400d exhibit good conductivity. Therefore, the adhesion structure 400 can discharge static electricity through the conductive particles 400d, thereby discharging static electricity to the surrounding structure. Thus, the adhesion structure 400 ensures both the stability and reliability of the display module 10 structure.

[0089] Figure 12 This is a schematic diagram of a support structure provided in an embodiment of the present invention. Figure 13This is a schematic diagram of an adhesion structure provided in an embodiment of the present invention. Figure 14 This is a schematic diagram of the first structure of a display module provided in an embodiment of the present invention. Figure 15 This is a schematic diagram of a second structural representation of a display module provided in an embodiment of the present invention. Figure 16 This is a schematic diagram of a third structure of a display module provided in an embodiment of the present invention, for reference. Figure 2 , Figures 12 to 16 As shown, the support structure 300 includes a support structure boundary 311 near the adhesive structure 400, and the adhesive structure 400 includes a first adhesive boundary 411 near the support structure 300. The support structure boundary 311 includes alternating first protrusions 311a and first recesses 311b, and the first adhesive boundary 411 includes alternating second protrusions 411a and second recesses 411b. The first protrusions 311a and second recesses 411b are connected, and the first recesses 311b are connected to the second protrusions 411a.

[0090] Further reference Figure 12 As shown, the support structure 300 includes a support structure boundary 311, which is located on the side boundary line of the support structure 300 near the binding part 100b. Figure 12 The second adhesive layer 340 of the support structure 300 is shown as an example. The support structure boundary 311 includes a first protrusion 311a and a first recess 311b, and the first protrusion 311a and the first recess 311b are alternately arranged. It can also be understood that there is a first recess 311b between two adjacent first protrusions 311a, and a first protrusion 311a between two adjacent first recesses 311b. The support structure boundary 311 is an uneven boundary line.

[0091] Further reference Figure 13 As shown, the adhesion structure 400 includes a first adhesion boundary 411, which is located on the side of the adhesion structure 400 away from the binding portion 100b. The first adhesion boundary 411 includes a second protrusion 411a and a second recess 411b, and the second protrusions 411a and the second recesses 411b are alternately arranged. Alternatively, it can be understood that there is a second recess 411b between two adjacent second protrusions 411a, and a second protrusion 411a between two adjacent second recesses 411b. The first adhesion boundary 411 is an uneven boundary line.

[0092] For details, please refer to Figures 14 to 16As shown in Figure 14, the support structure boundary 311 and the first adhesion boundary 411 in the display module 10 are connected. Specifically, the first adhesion boundary 411 includes alternately arranged second protrusions 411a and second recesses 411b; the first protrusions 311a and the second recesses 411b are connected, and the first recesses 311b are connected to the second protrusions 411a. By staggering the connection of the protrusions and concaves, the contact area between the support structure 300 and the adhesion structure 400 can be increased, thereby improving the fusion effect between the support structure 300 and the adhesion structure 400, thus avoiding the peeling of the film layer at the junction of the support structure 300 and the adhesion structure 400, and ensuring the overall structural stability of the display module 10.

[0093] Optional, see reference Figures 14 to 16 As shown, the shapes of the first protrusion 311a, the first recess 311b, the second protrusion 411a, and the second recess 411b are diverse, such as triangular, rectangular, or arc-shaped, thereby reflecting the diversity at the junction of the support structure 300 and the adhesion structure 400. Figures 14 to 16 Only three different shapes are shown, and they can be adaptively adjusted according to the needs of the display module 10.

[0094] Continue to refer to Figure 2 As shown, along the second direction X2, the adhesion structure 400 includes a second adhesion boundary 421 near the side of the bend 100b, and the first support portion 210 includes a support portion boundary 211 near the side of the bend 100b; the distance between the orthographic projection of the second adhesion boundary 421 on the first support portion 210 and the support portion boundary 211 is L; wherein, 0 < L ≤ 5 mm.

[0095] For details, please refer to Figure 2As shown, the adhesion structure 400 also includes a second adhesion boundary 421, which is located on the side boundary line of the adhesion structure near the binding portion 100b. The first support portion 210 includes a support portion boundary 211, which is located on the side boundary line of the first support portion 210 near the binding portion 100b. The distance between the orthographic projection of the second adhesion boundary 421 onto the first support portion 210 and the support portion boundary 211 is L, and L satisfies: 0 < L ≤ 5 mm. For example, L can be 0.8 mm, 1 mm, 3 mm, or 4.5 mm, etc. This can be understood as the boundary of the adhesion structure 400 closest to the bending portion 100b being located within the area defined by the first support portion 210 and the second support portion 220. Therefore, the adhesion structure 400 as a whole is located within the area defined by the first support portion 210 and the second support portion 220. Furthermore, the adhesion structure 400 is positioned within the display area of ​​the first support portion 210 and the second support portion 220. This ensures the overall structural stability of the display module 10 without affecting the normal bending of the bending portion 100b, thereby guaranteeing the reliability of the display module 10.

[0096] Figure 17 yes Figure 1 An enlarged schematic diagram of region E in the middle, for reference. Figure 1 , Figure 2 and Figure 17 As shown, the display unit 100a includes a display area 100a1 and a first fan-out area 100a2, the first fan-out area 100a2 being located on the side of the display area 100a1 near the bending portion 100b; along the first direction X1, the adhesive structure 400 overlaps with both the display area 100a1 and the first fan-out area 100a2.

[0097] For details, please refer to Figure 17 As shown, the display unit 100a includes a display area 100a1 and a first fan-out area 100a2, wherein the first fan-out area 100a2 is located on the side of the display area 100a1 near the bend 100b. The display area 100a1 is used to realize the overall display function of the display panel 10, and the first fan-out area 100a2 is provided with some fan-out traces (not specifically shown in the figure) that transmit data to the display area 100a1. Figure 2 As shown, the adhesion structure 400 can overlap with both the display area 100a1 and the first fan-out trace 100a2 along the first direction X1. By maximizing the space for the adhesion structure 400, it is beneficial to ensure the stability of the second support portion 220 and prevent the second support portion 220 from peeling off, thereby better ensuring the overall structural stability of the display module 10.

[0098] Optional, see reference Figure 17As shown, the bonding portion 100c may further include a second fan-out area 100c1. The second fan-out area 100c1 is located on the side of the bonding portion 100c near the bending portion 100b. The fan-out area 100c1 can transmit signals transmitted on the non-light-emitting side (such as signals provided by the driver chip 100A or the flexible circuit board 100B), ensuring the overall display function of the display module 10. Further, refer to... Figure 17 As shown, the bonding area 100c may further include a test area 100c2, an electrostatic transfer area 100c3, a lamp-driving test area 100c4, and a bonding area 100c5, which are sequentially located away from the bending portion 100b. The bonding area 100c5 can be bonded and electrically connected to the flexible circuit board 100B. Specifically, the functional areas of the bonding portion 100c can be further enriched in design; this embodiment of the invention does not impose specific limitations on this.

[0099] Figure 18 This is a cross-sectional schematic diagram of the eighth display module provided in the embodiments of the present invention. Figure 19 This is a cross-sectional schematic diagram of the ninth display module provided in the embodiments of the present invention. Figure 20 This is a cross-sectional schematic diagram of the tenth display module provided in the embodiment of the present invention, for reference. Figures 18 to 20 As shown, the display module 10 also includes an encapsulating adhesive structure 500, which is located on at least one side of the bent portion 100b and is in contact with the bent portion 100b.

[0100] The display module 10 also includes an encapsulating adhesive structure 500, which is located on at least one side of the bent portion 100b, as shown in the reference section. Figure 18 and Figure 20 As shown, the encapsulating adhesive structure 500 is located on the side of the bend 100b near the support structure 300, as referenced. Figure 19 As shown, the encapsulating adhesive structure 500 can exist on the side of the bent portion 100b closest to the supporting structure 300, and can also exist on the side of the bent portion 100b furthest from the supporting structure 300. By setting the encapsulating adhesive structure 500, the space on both sides of the bent portion 100b can be filled, ensuring the overall structural stability of the display module 10, and also providing a certain degree of protection for the overall structure. Furthermore, the encapsulating adhesive structure 500 can have a certain degree of adhesion, thereby ensuring greater stability in the bending state of the bent portion 100b, and thus improving the overall structural stability of the display module 10.

[0101] Continue to refer to Figure 20 As shown, the encapsulating adhesive structure 500 includes a first encapsulating adhesive portion 510, which is located on the side of the bent portion 100b near the support structure 300; the first encapsulating adhesive portion 510 is reused as at least part of the adhesion structure 400.

[0102] Further reference Figure 20 As shown, in the encapsulating adhesive structure 500, the first encapsulating adhesive portion 510 is located on the side of the bending portion 100b near the supporting structure 300, while the adhesive structure 400 is located on the side of the supporting structure 300 near the bending portion 100b. Both the adhesive structure 400 and the encapsulating adhesive structure 500 have a certain degree of adhesion, so the area designated for the adhesive structure 400 can be replaced by the first encapsulating adhesive portion 510. However, it should be noted that the location of the adhesive structure 400 does not exceed the defined area of ​​the first supporting portion 210 and the second supporting portion 220, while the first encapsulating adhesive portion 510 can fill the entire area. Therefore, the total space occupied by the first encapsulating adhesive portion 510 is greater than the space occupied by the adhesive structure 400. Thus, the first encapsulating adhesive portion 510 is reused as at least part of the adhesive structure 400. By reusing the structure, the overall manufacturing cost of the display module 10 can also be reduced.

[0103] Based on the same inventive concept, embodiments of the present invention also provide a display device. Figure 21 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, such as... Figure 21 As shown, the display device 1 includes the display module 10 described in any of the above embodiments. Therefore, the display device 1 provided in this embodiment of the invention possesses the corresponding beneficial effects described in the above embodiments, which will not be repeated here. The display device 1 can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device.

[0104] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display module, characterized in that, Including the display panel; The display panel includes a display section, a bending section, and a bonding section. The bending section connects the display section and the bonding section, and the bonding section is bent through the bending section to the non-light-emitting side of the display panel. The display module further includes a support layer, which includes a first support portion and a second support portion. Along a first direction, the first support portion is located on the side of the display portion near the bonding portion, and the second support portion is located on the side of the bonding portion near the display portion; the first direction is the thickness direction of the display panel. The display module further includes a support structure and an adhesive structure. Along the first direction, the support structure and the adhesive structure are both located between the first support portion and the second support portion, and the support layer covers the adhesive structure. Along the second direction, the adhesive structure is located on at least a portion of the support structure on the side near the bend; the second direction intersects the first direction; The support structure includes a first adhesive layer, a buffer layer, and a conductive layer stacked along the first direction, wherein the first adhesive layer is located on the side of the buffer layer near the first support portion; along the second direction, the adhesive structure is located at least on the side of the conductive layer near the bend. The display module further includes an encapsulating adhesive structure, which is located on at least one side of the bent portion and in contact with the bent portion.

2. The display module according to claim 1, characterized in that, Along the second direction, the adhesive structure is located on the side of the support structure near the bend.

3. The display module according to claim 1, characterized in that, Along the first direction, the adhesive structure at least partially overlaps with the first adhesive layer.

4. The display module according to claim 1, characterized in that, Along the first direction, the adhesive structure at least partially overlaps with both the first adhesive layer and the buffer layer.

5. The display module according to claim 1, characterized in that, The support structure further includes a second adhesive layer located between the conductive layer and the second support portion along the first direction; Along the second direction, at least a portion of the adhesive structure is located on the side of the conductive layer and the second adhesive layer near the bend; along the first direction, the thickness of the adhesive structure is greater than the thickness of the second adhesive layer.

6. The display module according to claim 5, characterized in that, The viscosity coefficient of the adhesive structure is greater than that of the second adhesive layer.

7. The display module according to claim 5, characterized in that, The adhesive structure includes a first adhesive portion and a second adhesive portion connected together; Along the first direction, the first adhesive portion is located between the conductive layer and the second support portion; Along the second direction, the second adhesive portion is located on the side of the conductive layer and the first adhesive portion near the bend, and the thickness of the second adhesive portion is greater than the thickness of the first adhesive portion; The first adhesive portion is reused as the second adhesive layer.

8. The display module according to claim 1, characterized in that, Along the first direction, the adhesive structure overlaps with at least a portion of the binding portion.

9. The display module according to claim 8, characterized in that, The binding portion includes a binding end, which, along the second direction, is the end of the binding portion away from the bent portion; Along the first direction, the adhesive structure overlaps with the binding end.

10. The display module according to claim 8, characterized in that, The area of ​​the binding part is S1, and the area of ​​the binding part that overlaps with the adhesive structure in the first direction is S2; Among them, S2 / S1≥50%.

11. The display module according to claim 1, characterized in that, The conductive layer includes a first conductive portion and a second conductive portion, and along the second direction, the second conductive portion is located on the side of the first conductive portion near the bend. The second conductive portion includes a cutout, which penetrates the conductive layer; The adhesive structure is bonded to the second support portion through the perforation.

12. The display module according to claim 11, characterized in that, The second conductive portion also includes grid lines defining the hollowed-out area; The sum of the coverage areas of the hollowed-out areas is greater than the coverage area of ​​the grid lines.

13. The display module according to claim 11, characterized in that, The first conductive section and the second conductive section are connected.

14. The display module according to claim 1, characterized in that, The adhesion structure includes an adhesive colloid and thermally conductive particles disposed within the adhesive colloid. The thermal conductivity of the thermally conductive particles is greater than that of the adhesive colloid.

15. The display module according to claim 1, characterized in that, The adhesion structure includes an adhesive colloid and conductive particles disposed within the adhesive colloid. The resistivity of the conductive particles is less than that of the adhesive colloid.

16. The display module according to claim 1, characterized in that, The support structure includes a support structure boundary near the adhesive structure, and the adhesive structure includes a first adhesive boundary near the support structure. The support structure boundary includes alternating first protrusions and first recesses, and the first adhesion boundary includes alternating second protrusions and second recesses. The first protrusion and the second recess are connected, and the first recess is connected to the second protrusion.

17. The display module according to claim 1, characterized in that, Along the second direction, the adhesive structure includes a second adhesive boundary near the side of the bend, and the first support portion includes a support portion boundary near the side of the bend; The distance between the orthographic projection of the second adhesion boundary onto the first support portion and the boundary of the support portion is L; Where 0 < L ≤ 5 mm.

18. The display module according to claim 1, characterized in that, The display unit includes a display area and a first fan-out area, wherein the first fan-out area is located on the side of the display area near the bent portion; Along the first direction, the adhesive structure overlaps with both the display area and the first fan-out area.

19. The display module according to claim 1, characterized in that, The encapsulating adhesive structure includes a first encapsulating adhesive portion, which is located on the side of the bent portion near the supporting structure. The first encapsulating adhesive is partially reused as at least part of the adhesive structure.

20. A display device, characterized in that, Includes the display module as described in any one of claims 1-19.

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