Light-emitting devices and their fabrication methods, display substrates

Abstract

This disclosure relates to a light-emitting device and its fabrication method, as well as a display electrode. The light-emitting device of this disclosure includes: a first electrode, a light-emitting layer, and a second electrode stacked sequentially. The first electrode includes: a first transparent conductive layer and a second transparent conductive layer stacked sequentially along a direction away from the light-emitting layer; multiple metal layers located between the first and second transparent conductive layers; and spacer conductive layers located between adjacent metal layers. The spacer conductive layers have lower reactivity than the metal layers. This disclosure avoids the formation of large foreign particles from corrosion of the metal layers by corrosive gases, which could lead to punctures of the light-emitting layer and the second electrode, resulting in dark spots in the light-emitting device.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a light-emitting device and its fabrication method, and a display substrate. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display substrates have attracted widespread attention due to their characteristics such as self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low power consumption, low driving voltage, high luminous efficiency, and short response time. As a new generation of display products, they have been widely used in display, lighting, and smart wearable fields. Summary of the Invention

[0003] This disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a light-emitting device, a method for fabricating the same, and a display substrate.

[0004] To achieve the above objectives, this disclosure provides a light-emitting device, comprising: a first electrode, a light-emitting layer, and a second electrode sequentially stacked; wherein the first electrode comprises:

[0005] A first transparent conductive layer and a second transparent conductive layer are sequentially stacked along a direction away from the light-emitting layer;

[0006] A multilayer metal layer located between the first transparent conductive layer and the second transparent conductive layer;

[0007] A spacer conductive layer located between two adjacent metal layers;

[0008] The reactivity of the spacer conductive layer is lower than that of the metal layer.

[0009] In some embodiments, the thickness of the metal layer closest to the first transparent conductive layer is less than the thickness of the other metal layers.

[0010] In some embodiments, the thickness of the metal layer closest to the first transparent conductive layer is greater than 0 and less than or equal to 0.

[0011] In some embodiments, the ratio of the sum of the thicknesses of all the metal layers to the thickness of the first transparent conductive layer is in the range of 10 to 15.

[0012] In some embodiments, the thickness of the spacer conductive layer is less than the thickness of any one of the metal layers.

[0013] In some embodiments, the materials of the first transparent conductive layer and the second transparent conductive layer both include indium tin oxide, the material of the metal layer includes silver, and the material of the spacer conductive layer includes indium tin oxide and at least one of platinum and gold.

[0014] In some embodiments, the metal surface closest to the first transparent conductive layer has a protrusion on the surface facing the first transparent conductive layer;

[0015] The first transparent conductive layer has an opening; at least a portion of the protrusion is located within the opening.

[0016] In some embodiments, the number of metal layers is 2 to 5.

[0017] This disclosure also provides a method for fabricating a light-emitting device, including...

[0018] Form the first electrode;

[0019] A light-emitting layer is formed on one side of the first electrode;

[0020] A second electrode is formed on the side of the light-emitting layer away from the first electrode;

[0021] The step of forming the first electrode includes:

[0022] Forming a second transparent conductive material layer;

[0023] Multiple metal material layers are formed on one side of the second transparent conductive material layer, wherein a spacer conductive material layer is formed between two adjacent metal material layers; and the reactivity of the spacer conductive material layer is lower than that of the metal layer.

[0024] A first transparent conductive material layer is formed on the side of the multilayer metal material layer opposite to the second electrode;

[0025] A patterning process is performed on the first transparent conductive material layer, the multilayer metal material layer, the spacer conductive material layer, and the second transparent conductive material layer to form the first transparent conductive layer, the multilayer metal layer, the spacer conductive layer, and the second transparent conductive layer, respectively.

[0026] This disclosure also provides a display substrate, including:

[0027] Substrate;

[0028] A pixel circuit and a plurality of light-emitting devices are disposed on the substrate. The light-emitting devices are light-emitting devices as described in any one of the above descriptions. The light-emitting devices are located on the side of the pixel circuit away from the substrate. The first electrode is electrically connected to the pixel circuit. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0030] Figure 1 This is a cross-sectional structural diagram of the light-emitting device in some embodiments;

[0031] Figure 2 This is a cross-sectional structural schematic diagram of the light-emitting device in some other embodiments;

[0032] Figure 3 This is a schematic cross-sectional view of the first electrode in some embodiments;

[0033] Figure 4 This is a schematic cross-sectional view of the first electrode in some embodiments of this disclosure;

[0034] Figure 5 This is a cross-sectional structural schematic diagram of the first electrode in some other embodiments of this disclosure;

[0035] Figure 6 This is a cross-sectional structural schematic diagram of the first electrode in some other embodiments of this disclosure;

[0036] Figure 7 This is a cross-sectional structural schematic diagram of the first electrode in some other embodiments of this disclosure;

[0037] Figure 8 This is a schematic cross-sectional view of the display substrate in some embodiments of this disclosure.

[0038] 1. First electrode; 2. Light-emitting layer; 3. Second electrode; 11. First transparent conductive layer; 12. Metal layer; 13. Second transparent conductive layer; 14. Spacer conductive layer; 120. Protrusion; 10. Substrate; 20. Driving circuit layer; 30. Light-emitting device; 21. Thin-film transistor; 211. Source; 212. Drain; 213. Active layer; 214. Gate; 22. Storage capacitor; 221. Second electrode plate; 222. First electrode plate; 201. First gate insulating layer; 202. Second gate insulating layer; 203. Interlayer dielectric layer; 204. Passivation layer; 205. Planarization layer; 206. Pixel defining layer. Detailed Implementation

[0039] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0041] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0043] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0044] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0045] An OLED display substrate includes a substrate and multiple light-emitting devices located on one side of the substrate. Figure 1 This is a cross-sectional structural diagram of the light-emitting device in some embodiments.

[0046] like Figure 1 As shown, the light-emitting device includes a first electrode 1, a light-emitting layer 2, and a second electrode 3 stacked sequentially. The first electrode 1 can be, for example, an anode, and the second electrode 3 can be, for example, a cathode. The light-emitting principle of the device is that, driven by the electric field generated by the first electrode 1 and the second electrode 3, charge carriers are injected into the light-emitting layer 2 and recombine within the light-emitting layer 2 to generate light.

[0047] Figure 2 This is a cross-sectional structural diagram of the light-emitting device in some other embodiments. Figure 3 This is a schematic cross-sectional view of the first electrode 1 in some embodiments.

[0048] like Figure 2 and Figure 3 As shown, the first electrode 1 includes a first transparent conductive layer 11, a metal layer 12, and a second transparent conductive layer 13 stacked sequentially. The first transparent conductive layer 11 and the second transparent conductive layer 13 are both made of indium tin oxide (ITO), and the metal layer 12 is made of silver (Ag).

[0049] Because the ITO film itself is relatively porous, harmful gases such as acids and alkalis in the air can penetrate the first transparent conductive layer 11 and enter the metal layer 12, reacting with Ag and causing Ag to be corroded. Figure 3 As shown, after Ag is corroded, Ag-containing foreign particles are generated and undergo volume expansion, forming protrusions 120 on the surface of the metal layer 12 facing the first transparent conductive layer 11 and breaking through the first transparent conductive layer 11. If the protrusions 120 are large, after breaking through the first transparent conductive layer 11, they may extend beyond the first transparent conductive layer 11 in the direction close to the light-emitting layer 2. Furthermore, the protrusions 120 may also damage the light-emitting layer 2, affecting the light-emitting effect of the light-emitting device.

[0050] In other embodiments, the light-emitting layer 2 between the first electrode 1 and the second electrode 3 is multilayered, and adjacent light-emitting layers 2 are connected in series through a charge generation layer (CGL). In this case, the light-emitting device is a tandem organic light-emitting diode (Tandem OLED). This type of Tandem OLED requires a large current to be lit. Ag-containing foreign particles, under the excitation of a large current, may further puncture the light-emitting layer 2 and the first electrode 1, causing an open circuit in the Tandem OLED, resulting in dark spots and affecting the light-emitting effect. Furthermore, as the light-emitting device is used, the Ag-containing foreign particles continuously increase in size, and the light-emitting device also ages. Therefore, Ag-containing foreign particles will have a greater impact on the light-emitting effect of the device.

[0051] In order to at least alleviate or solve one of the aforementioned technical problems, this disclosure provides a light-emitting device, a method for fabricating the same, and a display substrate.

[0052] Figure 4 This is a schematic cross-sectional view of the first electrode in some embodiments of this disclosure. Figure 5 This is a cross-sectional structural diagram of the first electrode in some other embodiments of this disclosure.

[0053] In some embodiments, such as Figure 4 and Figure 5 As shown, the present disclosure provides a light-emitting device comprising: a first electrode 1, a light-emitting layer 2, and a second electrode 3 stacked sequentially. The first electrode 1 includes: a first transparent conductive layer 11 and a second transparent conductive layer 13 stacked sequentially along a direction away from the light-emitting layer 2; a multilayer metal layer 12 located between the first transparent conductive layer 11 and the second transparent conductive layer 13; and a spacer conductive layer 14 located between adjacent metal layers 12. The spacer conductive layer 14 has a lower reactivity than the metal layers 12.

[0054] For example, in Figure 4 In the illustrated embodiment, the metal layer 12 consists of two layers, and correspondingly, a spacer conductive layer 14 is disposed between these two metal layers 12. Figure 5 In the embodiment shown, the metal layer 12 has three layers, and a spacer conductive layer 14 is provided between each two adjacent metal layers 12, that is, the number of spacer conductive layers 14 is two.

[0055] As mentioned above, corrosive gases can easily penetrate the first transparent conductive layer 11 and enter the metal layer 12, reacting with the metal to generate foreign particles. Based on this, the present embodiment separates the metal layer 12 by setting a spacer conductive layer 14, while making the reactivity of the spacer conductive layer 14 lower than that of the metal layer 12. That is, the spacer conductive layer 14 will not react with the corrosive gas, or at least reacts more slowly than the corrosive gas reacts with the metal layer material. By setting the spacer conductive layer 14, the problem of corrosive gases continuing to react with the metal layer 12 and causing the foreign particles to be too large can be prevented, thereby ensuring that the light emission effect of the light-emitting device is not affected.

[0056] Alternatively, the light-emitting device can emit, for example, red, green, blue, or white light.

[0057] Optionally, the second electrode 3 can be made of metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc.

[0058] Optionally, the materials of the first transparent conductive layer 11 and the second transparent conductive layer 13 in the first electrode 1 both include ITO, and the material of the metal layer includes Ag.

[0059] Optionally, the material of the spacer conductive layer 14 may include ITO, or a metal with lower reactivity than Ag, such as platinum (Pt), gold (Au), etc.

[0060] Optionally, the light-emitting layer 2 may include small molecule organic materials or polymer molecule organic materials, and may be fluorescent light-emitting materials or phosphorescent light-emitting materials, and may emit red light, green light, blue light, or white light.

[0061] In some embodiments, such as Figure 4 and Figure 5 As shown, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is smaller than the thickness of the other metal layers 12.

[0062] Specifically, in Figure 4 In the embodiment shown, the metal layer 12 consists of two layers, and the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is less than the thickness D1 of the other metal layer 12.

[0063] exist Figure 5In the illustrated embodiment, the metal layer 12 comprises three layers: a metal layer 12 closest to the first transparent conductive layer 11, a metal layer 12 furthest from the first transparent conductive layer 11, and another metal layer located between the metal layer 12 closest to the first transparent conductive layer 11 and the metal layer 12 furthest from the first transparent conductive layer 11. The thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is less than the thickness D2 of the metal layer 12 furthest from the first transparent conductive layer 11, and the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is less than the thickness D3 of the other metal layer 12. The thickness D2 of the metal layer 12 furthest from the first transparent conductive layer 11 and the thickness D3 of the other metal layer 12 can be the same or different; this embodiment does not limit this.

[0064] In this embodiment, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is smaller than the thickness of the other metal layers 12. This minimizes the volume of Ag foreign particles generated after the metal layer 12 closest to the first transparent conductive layer 11 is corroded by corrosive gases in an acidic or alkaline environment. This ensures that the small size of the foreign particles prevents them from penetrating the light-emitting layer 2 and the second electrode 3, thereby reducing the occurrence of dark spots. Simultaneously, due to the presence of the spacer conductive layer 14, the next metal layer 12 will not be corroded to generate foreign particles.

[0065] In fact, it is understandable that when preparing the metal layer 12 closest to the first transparent conductive layer 11, the thickness of the metal layer 12 closest to the first transparent conductive layer 11 can be reduced as much as possible, serving as a "sacrificial layer" to absorb acidic and alkaline gases. After the thinner metal layer 12 is corroded, only a small amount of Ag foreign particles are generated. This can achieve the goal of minimizing the volume of Ag foreign particles generated after the metal layer 12 closest to the first transparent conductive layer 11 is corroded by corrosive gases in an acidic or alkaline environment, so that the foreign particles cannot pierce the light-emitting layer 2 and the second electrode 3 due to their small size, thereby reducing the occurrence of dark spots.

[0066] The thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 can be set according to actual needs. In the embodiments of this disclosure, the thickness of each film layer, such as the thickness of the first transparent conductive layer 11, each metal layer 12, and the second transparent conductive layer 13, can all be set according to actual needs.

[0067] For example, in some embodiments, such as Figure 4 and Figure 5 As shown, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than 0 and less than or equal to 0.

[0068] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0069] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0070] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0071] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0072] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0073] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0074] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0075] Optionally, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is greater than or equal to... and less than or equal to

[0076] Specifically, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 can be... or

[0077] In this embodiment of the disclosure, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 is set to be greater than 0 and less than or equal to 0. This allows the Ag foreign particles generated after the metal layer 12 closest to the first transparent conductive layer 11 is corroded by corrosive gases in an acidic or alkaline environment to be relatively small. This ensures that the small size of the foreign particles prevents them from penetrating the light-emitting layer 2 and the second electrode 3, thereby reducing the occurrence of dark spots. Considering reducing the difficulty of the manufacturing process and lowering costs, the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 can be set to be greater than or equal to... and less than or equal to

[0078] In some embodiments, the ratio of the sum of the thicknesses of all metal layers 12 to the thickness of the first transparent conductive layer 11 ranges from 10 to 15.

[0079] Optionally, the thickness of the first transparent conductive layer 11 is the same as the thickness of the second transparent conductive layer 13.

[0080] For example, in Figure 4 In the embodiment shown, the ratio of the sum of the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11 and the thickness D1 of the other metal layer 12 to the thickness of the first transparent conductive layer 11 is in the range of 10 to 15.

[0081] exist Figure 5 In the embodiment shown, the ratio of the sum of the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11, the thickness D2 of the metal layer 12 furthest from the first transparent conductive layer 11, and the thickness D3 of another metal layer 12 to the thickness of the first transparent conductive layer 11 is in the range of 10 to 15.

[0082] Optionally, the ratio of the sum of the thicknesses of all metal layers 12 to the thickness of the first transparent conductive layer 11 can be in the range of 10, 10.5, 11, 11.5, 12, 12.5, 13, 13.5, 14, 14.5 or 15.

[0083] In some embodiments, such as Figure 1 As shown, the ratio of the thickness of the metal layer 12 to the thickness of the first transparent conductive layer 11 ranges from 10 to 15.

[0084] In some embodiments, the thickness D5 of the spacer conductive layer 14 is less than the thickness of any metal layer 12.

[0085] For example, in Figure 4 In the embodiment shown, the thickness D5 of the spacer conductive layer 14 is less than the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11, and the thickness D5 of the spacer conductive layer 14 is less than the thickness D1 of the other metal layer 12.

[0086] exist Figure 5 In the illustrated embodiment, the thickness D5 of the spacer conductive layer 14 is less than the thickness D4 of the metal layer 12 closest to the first transparent conductive layer 11, the thickness D5 of the spacer conductive layer 14 is less than the thickness D2 of the metal layer 12 furthest from the first transparent conductive layer 11, and the thickness D5 of the spacer conductive layer 14 is less than the thickness D3 of the other metal layer 12.

[0087] In some embodiments, such as Figure 4 and Figure 5As shown, the thickness D5 of the spacer conductive layer 14 is less than or equal to the thickness D6 of the first transparent conductive layer.

[0088] This embodiment of the disclosure reduces the impact of the spacer conductive layer 14 on the first electrode 1 by setting the thickness of the spacer conductive layer 14.

[0089] In some embodiments, the materials of the first transparent conductive layer 11 and the second transparent conductive layer 13 both include indium tin oxide, the material of the metal layer 12 includes silver, and the material of the spacer conductive layer 14 includes indium tin oxide and at least one of platinum (Pt) and gold (Au).

[0090] For example, in Figure 4 In the illustrated embodiment, the materials of the first transparent conductive layer 11 and the second transparent conductive layer 13 both include indium tin oxide (ITO), the metal layer 12 is made of silver, and the spacer conductive layer 14 is made of indium tin oxide (ITO). In this case, the first electrode 1 is formed by interleaved deposition of multiple layers of ITO and multiple layers of Ag. Specifically, the film layers of the first electrode 1, along the direction away from the light-emitting layer 2, sequentially include: ITO, Ag, ITO, Ag, and ITO.

[0091] exist Figure 5 In the illustrated embodiment, the materials of the first transparent conductive layer 11 and the second transparent conductive layer 13 both include indium tin oxide (ITO), the metal layer 12 is made of silver, and the spacer conductive layer 14 is made of indium tin oxide (ITO). In this case, the specific film layers of the first electrode 1, along the direction away from the light-emitting layer 2, sequentially include: ITO, Ag, ITO, Ag, ITO, Ag, and ITO.

[0092] In this embodiment of the disclosure, after the spacer conductive layer 14 is set as an ITO film layer, that is, the first electrode 1 has multiple ITO film layers. On this basis, the multiple ITO film layers can block corrosive gases, thereby preventing corrosive gases from continuing to penetrate downwards into the metal layer 12 that is further away from the light-emitting layer 2, avoiding corrosion of the metal layer 12 that is further away from the light-emitting layer 2, thereby avoiding the generation of large foreign particles.

[0093] When metals such as Pt and Au are used to prepare the spacer conductive layer 14, the high density of the metal prevents corrosive gases from further corroding the lower metal layer 12. Therefore, the spacer conductive layer 14 can effectively isolate the corrosive gases. Simultaneously, since metals such as Pt and Au are less reactive than Ag, the spacer conductive layer 14 can also prevent reactions with corrosive gases that could generate foreign particles.

[0094] Figure 6 This is a cross-sectional structural diagram of the first electrode in some other embodiments of this disclosure. Figure 7 This is a cross-sectional structural diagram of the first electrode in some other embodiments of this disclosure.

[0095] In some embodiments, such as Figure 6 and Figure 7 As shown, the surface of the metal layer 12 closest to the first transparent conductive layer 11 facing the first transparent conductive layer 11 has at least one protrusion 120; the first transparent conductive layer 11 has at least one opening; the orthographic projection of the opening onto the second transparent conductive layer 13 at least partially overlaps with the orthographic projection of the protrusion onto the second transparent conductive layer 13. At least a portion of the protrusion 120 is located within the opening.

[0096] Figure 6 The embodiments shown are actually Figure 4 The illustrated embodiment shows a cross-sectional view of the metal layer 12 closest to the first transparent conductive layer 11, where corrosion has generated Ag-containing foreign particles. That is, Figure 4 In the illustrated embodiment, the metal layer 12 closest to the first transparent conductive layer 11 corrodes, generating Ag-containing foreign particles that form protrusions 120. These protrusions 120 pierce the first transparent conductive layer 11, creating an opening in the first transparent conductive layer 11, thus forming... Figure 6 The diagram shows a cross-sectional structure.

[0097] Figure 7 The embodiments shown are actually Figure 5 The illustrated embodiment shows a cross-sectional view of the metal layer 12 closest to the first transparent conductive layer 11, where corrosion has generated Ag-containing foreign particles. Similarly, Figure 5 In the illustrated embodiment, the metal layer 12 closest to the first transparent conductive layer 11 corrodes, generating Ag-containing foreign particles that form protrusions 120. These protrusions 120 pierce the first transparent conductive layer 11, creating an opening in the first transparent conductive layer 11, thus forming... Figure 6 The diagram shows a cross-sectional structure.

[0098] In this embodiment, since the metal layer 12 closest to the first transparent conductive layer 11 has a relatively small thickness, the foreign particles generated by the reaction of the metal layer 12 near the first transparent conductive layer 11 with the corrosive gas are relatively small. Therefore, the protrusion will not puncture the light-emitting layer 2 and the second electrode 3, thereby avoiding the generation of dark spots.

[0099] In some embodiments, the number of metal layers 12 is 2 to 5. For example, the number of metal layers 12 can be 2, 3, 4 or 5.

[0100] For example, Figure 4 In the embodiment shown, the number of metal layers 12 is 2. Figure 5 In the embodiment shown, the number of metal layers 12 is 3.

[0101] Optionally, the orthographic projections of each film layer in the first electrode 1 onto the plane where the second transparent conductive layer 13 is located approximately coincide, meaning that each film layer in the first electrode 1 can be formed using the same patterning process. Specifically, the first transparent conductive layer 11, the metal layer 12, the spacer conductive layer 14, and the second transparent conductive layer 13 can be formed using the same patterning process.

[0102] The present invention does not limit the number of metal layers 12, but in order to reduce the difficulty of the preparation process and reduce the preparation cost, the present invention sets the number of metal layers 12 in the range of 2 to 5.

[0103] In some embodiments, this disclosure also provides a method for fabricating a light-emitting device. The fabrication method includes steps S01 to S03:

[0104] Step S01: Form the first electrode 1.

[0105] Step S02: Form a light-emitting layer 2 on one side of the first electrode 1.

[0106] Step S03: Form a second electrode 3 on the side of the light-emitting layer 2 away from the first electrode 1.

[0107] The step of forming the first electrode 1 includes steps S10 to S40:

[0108] Step S10: Form a second transparent conductive material layer.

[0109] Step S20: A multilayer metal material layer is formed on one side of the second transparent conductive material layer, and a spacer conductive material layer is formed between two adjacent metal material layers; wherein the reactivity of the spacer conductive material layer is lower than that of the metal material layer.

[0110] Step S30: Form a first transparent conductive material layer on the side of the multilayer metal material layer away from the second electrode 3;

[0111] Step S40: Perform a patterning process on the first transparent conductive material layer, the multilayer metal material layer, the spacer conductive material layer, and the second transparent conductive material layer to form the first transparent conductive layer 11, the multilayer metal layer 12, the spacer conductive layer 14, and the second transparent conductive layer 13, respectively, thereby obtaining the light-emitting device.

[0112] In some embodiments, step S20 includes steps S21 to S23:

[0113] Step S21: A metal material layer is formed on one side of the second transparent conductive material layer.

[0114] Step S22: Form a spacer conductive material layer on the side of the metal material layer away from the second transparent conductive material layer.

[0115] Step S23: Form another metal material layer on the side of the spacer conductive material layer away from the second transparent conductive material layer.

[0116] At this point, the number of metal material layers is 2. After completing step S23, proceeding to steps S30 and S40 will yield the desired result. Figure 4 The light-emitting device shown.

[0117] In other embodiments, step S20, in addition to steps S21 to S23, also includes:

[0118] Step S24: Repeat steps S22 and S23 until the number of metal material layers reaches the set value.

[0119] After completing step S24 and repeating steps S22 and S23 only once, the number of metal material layers is 3. In this case, proceeding with steps S30 and S40 will yield the desired result. Figure 5 The light-emitting device shown.

[0120] In some embodiments, this disclosure also provides a display substrate. Figure 8 This is a schematic cross-sectional view of the display substrate in some embodiments of this disclosure. For example... Figure 8 As shown, the display substrate in this embodiment includes a substrate 10 and a pixel circuit and a plurality of light-emitting devices 30 disposed on the substrate 10. The light-emitting devices 30 are those described in any embodiment of this disclosure, wherein the light-emitting devices 30 are located on the side of the pixel circuit away from the substrate 10, and the first electrode 1 is electrically connected to the pixel circuit.

[0121] Optionally, the substrate 10 is a glass substrate. For example, the glass substrate can be at least one of alkali-free glass, alkaline glass, alumina glass, borosilicate glass, and quartz glass. Alternatively, the substrate 10 can also be a flexible substrate.

[0122] Optionally, such as Figure 8 As shown, the display substrate also includes a driving circuit layer 20 located between the substrate 10 and the light-emitting device 30. The driving circuit layer 20 includes a first gate insulating layer 201, a second gate insulating layer 202, an interlayer dielectric layer 203, a passivation layer 204, and a planarization layer 206, which are sequentially stacked on one side of the substrate 10 and in a direction away from the substrate 10.

[0123] The driving circuit layer 20 also includes a pixel circuit. The first electrode 1 is electrically connected to the pixel circuit. The pixel circuit provides driving signals to the thin-film transistor 21.

[0124] Specifically, such as Figure 8 As shown, the pixel circuit includes a thin-film transistor 21 and a storage capacitor 22.

[0125] The thin-film transistor 21 includes a gate 214, a source 211, a drain 212, and an active layer 213. The gate 214 is located between a first gate insulating layer 201 and a second gate insulating layer 202. The active layer 213 is located between the substrate 10 and the first gate insulating layer 201, and the source 211 and drain 212 are located between the second gate insulating layer 202 and the interlayer dielectric layer 203. The active layer 213 includes a channel portion and source 211 connection portions and drain 212 connection portions located on both sides of the channel portion. The source 211 connection portions are electrically connected to the source 211 of the thin-film transistor 21, and the drain 212 connection portions are electrically connected to the drain 212 of the thin-film transistor 21. Both the source 211 connection portions and the drain 212 connection portions may be doped with impurities (e.g., N-type or P-type impurities) with a higher impurity concentration than the channel portion. The channel portion is directly opposite the gate 214 of the thin-film transistor 21. When the voltage signal applied to the gate 214 reaches a certain value, a carrier path is formed in the channel portion, so that the drain 212 and source 211 of the thin-film transistor 21 are turned on. The first electrode 1 is electrically connected to the drain 212 of the thin-film transistor 21 through a via penetrating the planarization layer 205 and the passivation layer 204.

[0126] The storage capacitor 22 includes a first electrode 222 and a second electrode 221. The first electrode 222 is disposed on the same layer as the gate 214, and the second electrode 221 is located between the second gate insulating layer 202 and the interlayer dielectric layer 203.

[0127] Optionally, the first gate insulating layer 201, the second gate insulating layer 202, and the interlayer dielectric layer 203 can all be single-layer structures or multi-layer structures stacked along the thickness direction of the display panel. Each layer can be prepared by any one or more combinations of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON).

[0128] Optionally, the material of the passivation layer 204 may include a silicon compound. For example, it may include at least one of silicon oxide, silicon nitride, or silicon oxynitride.

[0129] Optionally, the planarization layer 205 is made of an organic insulating material. For example, the organic insulating material may include one or more resin-based materials such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and siloxane. For example, the organic insulating material may also be elastic, and may include one or more elastic materials such as urethane and thermoplastic polyurethane (TPU).

[0130] Optionally, the material of the pixel defining layer 206 may include one or more organic insulating materials such as polyimide, polyphthalamide, polyamide, acrylic resin, benzocyclobutene, or phenolic resin.

[0131] In one example, in a method for fabricating a light-emitting device 30 disclosed herein, the formation of the first electrode 1 in step S01 is specifically formed on the side of the planarization layer 205 away from the substrate 10, and the formation of the light-emitting layer 2 on one side of the first electrode 1 in step S02 is specifically formed on the side of the first electrode 1 away from the substrate 10.

[0132] Furthermore, in the step of forming the first electrode 1, the formation of the second transparent conductive material layer in step S10 specifically involves forming the second transparent conductive material layer on the side of the planarization layer 205 away from the substrate 10, and the formation of a multilayer metal material layer on one side of the second transparent conductive material layer in step S20 specifically involves forming a multilayer metal material layer on the side of the second transparent conductive material layer away from the substrate 10.

[0133] Optionally, such as Figure 8 As shown, the layer containing the first electrode 1 is located on the side of the layer containing the pixel defining layer 206 closer to the substrate 10. The layer containing the light-emitting layer 2 is located on the side of the layer containing the pixel defining layer 206 away from the substrate 10. The pixel defining layer 206 defines a pixel opening, and at least a portion of the light-emitting device 30 is located within the pixel opening. For example, a portion of the first electrode 1 is located within the pixel opening, the light-emitting layer 2 is located within the pixel opening, a portion of the second electrode 3 is located within the pixel opening, and another portion of the second electrode 3 is located on the side of the pixel defining layer 206 away from the substrate 10.

[0134] This disclosure also provides a display device. The display device includes the display substrate described in the embodiments of this disclosure. Specifically, the display device may include any device or product with display functionality. For example, the display device may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0135] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A light emitting device, characterized by, The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode. The sum of the thicknesses of all the metal layers and the thickness of the first transparent conductive layer are in a ratio range of 10-15. The thickness of the spacer conductive layer is smaller than the thickness of any one of the metal layers. The materials of the first transparent conductive layer and the second transparent conductive layer both comprise indium tin oxide, the material of the metal layer comprises silver, and the material of the spacer conductive layer comprises indium tin oxide and at least one of platinum and gold. The number of the metal layers is 2-5. The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode. The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode. The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode. The sum of the thicknesses of all the metal layers and the thickness of the first transparent conductive layer are in a ratio range of 10-15. The thickness of the spacer conductive layer is smaller than the thickness of any one of the metal layers.

2. The light emitting device of claim 1, wherein a thickness of the metal layer closest to the first transparent conductive layer is greater than 0 and less than or equal to 3. The light emitting device according to any one of claims 1 to 2, characterized in that, The materials of the first transparent conductive layer and the second transparent conductive layer both comprise indium tin oxide, the material of the metal layer comprises silver, and the material of the spacer conductive layer comprises indium tin oxide and at least one of platinum and gold.

4. The light emitting device according to any one of claims 1 to 2, wherein, The number of the metal layers is 2-5.

5. The light emitting device according to any one of claims 1 to 2, wherein, The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode.

6. The light emitting device according to any one of claims 1 to 2, wherein, The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode.

7. A method for fabricating a light-emitting device, characterized in that, The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode. The sum of the thicknesses of all the metal layers and the thickness of the first transparent conductive layer are in a ratio range of 10-15. The thickness of the spacer conductive layer is smaller than the thickness of any one of the metal layers. The materials of the first transparent conductive layer and the second transparent conductive layer both comprise indium tin oxide, the material of the metal layer comprises silver, and the material of the spacer conductive layer comprises indium tin oxide and at least one of platinum and gold. The number of the metal layers is 2-5. The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer; a multilayer metal layer between the first transparent conductive layer and the second transparent conductive layer; a spacer conductive layer between two adjacent metal layers; the spacer conductive layer has a lower activity than the metal layer; the surface of the metal layer closest to the first transparent conductive layer has a protrusion facing the first transparent conductive layer; the first transparent conductive layer has an opening; at least part of the protrusion is located in the opening; the thickness of the metal layer closest to the first transparent conductive layer is smaller than the thickness of the other metal layers; and the protrusion does not pierce the light-emitting layer and the second electrode. The application relates to an organic light-emitting device, comprising: a first electrode, a light-emitting layer and a second electrode which are sequentially stacked; wherein the first electrode comprises: a first transparent conductive layer and a second transparent conductive layer which are sequentially stacked in a direction away from the light-emitting layer ​ ​ ​ ​ ​ ​ 8. A display substrate, comprising: ​ ​ ​

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