Refrigeration cycle device

Abstract

A refrigeration cycle device (1) is provided with a refrigerant circuit (11) and an adsorbent. The refrigerant circuit (11) has a compressor (31) that compresses the refrigerant, and an expansion mechanism (32) that decompresses the refrigerant. The refrigerant circuit (11) constitutes a vapor compression type refrigeration cycle in which a refrigerant circulates. The adsorbent adsorbs and desorbs the refrigerant circulating in the first unit. The refrigerant circuit (11) has a high-pressure region and a low-pressure region. The refrigeration cycle device (1) is operated under at least one of a first condition and a second condition. Under the first condition, the pressure of the refrigerant in the high-pressure region is equal to or less than the critical pressure of the refrigerant, and the temperature of the refrigerant in the high-pressure region exceeds the critical temperature of the refrigerant. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure corresponding to the evaporation temperature of the refrigerant when the adsorbent material does not adsorb or desorb the refrigerant.

Description

Technical Field

[0001] The present disclosure relates to a refrigeration cycle device. Background Art

[0002] Conventionally, hybrid refrigeration systems have been used, combining a vapor compression refrigeration cycle with an adsorption refrigeration cycle. Patent Document 1 (International Publication No. 2009 / 145278) discloses a hybrid refrigeration system that alternately cools and heats a pair of adsorbers in an adsorption refrigeration cycle to reduce the mechanical workload of the compressor in the vapor compression refrigeration cycle, thereby repeating the adsorption and desorption of the refrigerant. Summary of the Invention Technical problem to be solved by the invention

[0003] Conventionally, there has been no hybrid refrigeration system that utilizes pressure changes of a refrigerant circulating in a vapor compression refrigeration cycle to control adsorption and desorption of a refrigerant in an adsorption refrigeration cycle. Technical solutions used to solve technical problems

[0004] The refrigeration cycle device of the first aspect includes a first unit and an adsorbent material. The first unit has a compressor for compressing the refrigerant and an expansion mechanism for decompressing the refrigerant. The first unit constitutes a vapor compression refrigeration cycle for circulating the refrigerant. The adsorbent material adsorbs and desorbs the refrigerant circulating in the first unit. The first unit also has a high-pressure region and a low-pressure region. In the high-pressure region flows the refrigerant after being compressed by the compressor and before being decompressed by the expansion mechanism. In the low-pressure region flows the refrigerant after being decompressed by the expansion mechanism and before being compressed by the compressor. The refrigeration cycle device operates under at least one of the first and second conditions. Under the first condition, the pressure of the refrigerant in the high-pressure region is below the critical pressure of the refrigerant, and the temperature of the refrigerant in the high-pressure region exceeds the critical temperature of the refrigerant. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorbent material does not adsorb or desorb the refrigerant.

[0005] Compared to a refrigeration cycle device using a vapor compression refrigeration cycle without an adsorbent, the refrigeration cycle device of the first aspect has a lower operating pressure and can utilize the heat of adsorption and desorption of the refrigerant. Therefore, the refrigeration cycle device of the first aspect can reduce costs and improve the efficiency of the refrigeration cycle.

[0006] The refrigeration cycle device of the second aspect includes a first unit and an adsorbent. The first unit has a compressor for compressing the refrigerant and an expansion mechanism for decompressing the refrigerant. The first unit constitutes a vapor compression refrigeration cycle for circulating the refrigerant. The adsorbent material adsorbs and desorbs the refrigerant circulating in the first unit. The first unit also has a high-pressure region and a low-pressure region. In the high-pressure region flows the refrigerant after being compressed by the compressor and before being decompressed by the expansion mechanism. In the low-pressure region flows the refrigerant after being decompressed by the expansion mechanism and before being compressed by the compressor. The refrigeration cycle device operates under at least one of the first and second conditions. Under the first condition, the pressure of the refrigerant in the high-pressure region is below the critical pressure of the refrigerant, and the temperature of the refrigerant in the high-pressure region exceeds the saturation temperature of the refrigerant corresponding to the pressure of the refrigerant in the high-pressure region. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorbent material does not adsorb or desorb the refrigerant.

[0007] Compared to a refrigeration cycle device using a vapor compression refrigeration cycle without an adsorbent, the refrigeration cycle device of the second aspect has a lower operating pressure and can utilize the heat of adsorption and desorption of the refrigerant. Therefore, the refrigeration cycle device of the second aspect can reduce costs and improve the efficiency of the refrigeration cycle.

[0008] The refrigeration cycle apparatus according to the third aspect is the refrigeration cycle apparatus according to the second aspect, wherein the pressure of the refrigerant in the high-pressure region is equal to or lower than the saturation pressure of R32 corresponding to 65° C. in the vapor compression refrigeration cycle in which R32 circulates.

[0009] The refrigeration cycle apparatus according to the fourth aspect is the refrigeration cycle apparatus according to the second aspect, wherein the pressure of the refrigerant in the high-pressure region is equal to or lower than the saturation pressure of R134a corresponding to 65° C. in the vapor compression refrigeration cycle in which R134a circulates.

[0010] A refrigeration cycle device according to a fifth aspect is the refrigeration cycle device according to any one of the second to fourth aspects, wherein the adsorbent includes a metal-organic structure including metal ions and organic ligands.

[0011] A refrigeration cycle apparatus according to a sixth aspect is the refrigeration cycle apparatus according to any one of the second to fifth aspects, wherein the refrigerant is carbon dioxide.

[0012] The refrigeration cycle device of the seventh aspect includes a first unit and an adsorbent material. The first unit has a compressor for compressing the refrigerant and an expansion mechanism for decompressing the refrigerant. The first unit constitutes a vapor compression refrigeration cycle for circulating the refrigerant. The adsorbent material adsorbs and desorbs the refrigerant circulating in the first unit. The first unit also has a high-pressure region and a low-pressure region. In the high-pressure region flows the refrigerant after being compressed by the compressor and before being decompressed by the expansion mechanism. In the low-pressure region flows the refrigerant after being decompressed by the expansion mechanism and before being compressed by the compressor. The refrigeration cycle device operates under at least one of the first and second conditions. Under the first condition, the pressure of the refrigerant in the high-pressure region is lower than the saturation pressure of the refrigerant corresponding to the condensation temperature when the adsorbent material does not adsorb or desorb the refrigerant. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorbent material does not adsorb or desorb the refrigerant.

[0013] Compared to a refrigeration cycle device using a vapor compression refrigeration cycle without an adsorbent, the refrigeration cycle device of the seventh aspect has a lower operating pressure and can utilize the heat of adsorption and desorption of the refrigerant. Therefore, the refrigeration cycle device of the seventh aspect can reduce costs and improve the efficiency of the refrigeration cycle.

[0014] A refrigeration cycle device according to an eighth aspect is the refrigeration cycle device according to the seventh aspect, wherein the adsorption material includes a metal-organic structure including metal ions and organic ligands.

[0015] A refrigeration cycle apparatus according to a ninth aspect is the refrigeration cycle apparatus according to the seventh aspect or the eighth aspect, wherein the refrigerant is ammonia or propane. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the mixed cycle included in the refrigeration cycle device. Figure 2 This is a graph showing the relationship between the adsorption amount of the adsorbent and the pressure of the refrigerant. Figure 3 This is a graph showing the relationship between the adsorption amount of the adsorbent and the enthalpy of the refrigerant. Figure 4 This is a graph showing the relationship between the refrigerant pressure and the refrigerant enthalpy. Figure 5 It is a graph showing the isotherms of the refrigerant adsorbed on the adsorbent. Figure 6 This is a structural diagram of an example of a refrigeration cycle device. Figure 7 It is the Mollier diagram of the refrigerant in the first embodiment. Figure 8is a Mollier diagram of the refrigerant in the second embodiment. DETAILED DESCRIPTION

[0017] (1) Overall structure Refrigeration cycle device 1 comprises a hybrid cycle combining a vapor compression cycle and an adsorption cycle. The vapor compression cycle is a vapor compression refrigeration cycle and a heat pump cycle that utilizes the transfer of latent heat generated by the evaporation and condensation of the refrigerant. The adsorption cycle is an adsorption refrigeration cycle and a heat pump cycle that utilizes the transfer of latent heat generated by the adsorption and desorption of the refrigerant onto an adsorbent. Examples of refrigeration cycle device 1 include air conditioning and refrigeration systems.

[0018] like Figure 1 As shown, the refrigeration cycle device 1 includes a refrigerant circuit 11 and an adsorption circuit 12. The refrigerant circuit 11 constitutes a vapor compression cycle in which a refrigerant circulates, and the adsorption circuit 12 constitutes an adsorption cycle in which an adsorbent circulates.

[0019] The refrigeration cycle device 1 may have only one circuit, which performs the functions of at least one of the refrigerant circuit 11 and the adsorption circuit 12. In this case, the refrigeration cycle device 1 may include a circuit in which a mixture of refrigerant and adsorbent material circulates. Furthermore, the refrigeration cycle device 1 may include a circuit in which only refrigerant circulates and includes a mechanism for bringing the circulating refrigerant into contact with the adsorbent material. In this case, the adsorbent material does not circulate.

[0020] The refrigeration cycle device 1 may also have two circuits consisting of a circuit having the function of the refrigerant circuit 11 and a circuit having the function of the adsorption circuit 12. In this case, the refrigeration cycle device 1 includes a mechanism for bringing the refrigerant circulating in the refrigerant circuit 11 into contact with the adsorption material circulating in the adsorption circuit 12. Figure 1 In FIG. 1 , for the sake of explanation, the refrigerant circuit 11 and the adsorption circuit 12 are depicted as independent circuits.

[0021] The refrigeration cycle device 1 has an adsorption section 21 and a desorption section 22. The adsorption section 21 and the desorption section 22 together include a portion of the refrigerant circuit 11 and a portion of the adsorption circuit 12. In the adsorption section 21 and the desorption section 22, the refrigerant can freely flow between the refrigerant circuit 11 and the adsorption circuit 12. The adsorption material cannot flow between the refrigerant circuit 11 and the adsorption circuit 12. In the adsorption section 21, the refrigerant flowing from the refrigerant circuit 11 into the adsorption circuit 12 is adsorbed by the adsorption material flowing in the adsorption circuit 12. In the desorption section 22, the refrigerant desorbed from the adsorption material flowing in the adsorption circuit 12 flows from the adsorption circuit 12 into the refrigerant circuit 11.

[0022] The refrigerant circuit 11 includes a compressor 31 and an expansion mechanism 32. The compressor 31 compresses the refrigerant circulating within the refrigerant circuit 11. The expansion mechanism 32 decompresses the refrigerant circulating within the refrigerant circuit 11. The compressor 31 is, for example, a rotary compressor. The expansion mechanism 32 is, for example, an electronic expansion valve. In the refrigerant circuit 11, the refrigerant is compressed by the compressor 31, passes through the adsorption unit 21, is decompressed by the expansion mechanism 32, passes through the desorption unit 22, and is compressed again by the compressor 31.

[0023] The refrigerant circuit 11 has a high-pressure region and a low-pressure region. Refrigerant flows through the high-pressure region after being compressed by the compressor 31 and before being decompressed by the expansion mechanism 32. Refrigerant flows through the low-pressure region after being decompressed by the expansion mechanism 32 and before being compressed by the compressor 31. The high-pressure region corresponds to the portion of the refrigerant circuit 11 encompassed by the adsorption unit 21. The low-pressure region corresponds to the portion of the refrigerant circuit 11 encompassed by the desorption unit 22.

[0024] The refrigerant circulating in the refrigerant circuit 11 is carbon dioxide. Alternatively, the refrigerant may be ammonia or propane.

[0025] The adsorption circuit 12 includes a booster 41 and a pressure reducer 42. The booster 41 boosts the pressure of the adsorbent material circulating in the adsorption circuit 12. The pressure reducer 42 reduces the pressure of the adsorbent material circulating in the adsorption circuit 12. The booster 41 is, for example, a powder pump. The pressure reducer 42 is, for example, a powder valve. In the adsorption circuit 12, the pressure of the adsorbent material is boosted by the booster 41, passes through the adsorption section 21, is depressurized by the pressure reducer 42, passes through the desorption section 22, and is again boosted by the booster 41. Depending on the structure of the refrigeration cycle device 1, the adsorption circuit 12 may not include the booster 41 and the pressure reducer 42.

[0026] The adsorption circuit 12 may further include a heat exchanger 43. The heat exchanger 43 exchanges heat between the upstream side of the booster 41 and the upstream side of the pressure reducer 42. The heat exchanger 43 transfers a portion of the heat of the adsorbent flowing between the adsorption section 21 and the pressure reducer 42 to the adsorbent flowing between the desorption section 22 and the booster 41.

[0027] The adsorption material circulating in the adsorption circuit 12 includes a metal-organic structure, which includes metal ions and organic ligands. Metal-organic structure (MOF: Metal-Organic Framework) refers to a porous material with a very large specific surface area obtained by the reaction of metal ions and organic ligands. In the metal-organic structure, organic ligands are linked to metal ions to obtain a polymer structure with countless openings inside. The metal-organic structure can adjust the opening diameter and topological structure by selecting and combining metal ions and organic ligands respectively. The metal-organic structure can adjust the opening diameter by selecting and combining metal ions and organic ligands, so that it can selectively adsorb the target substance. The metal-organic structure is used as a porous material with the function of selectively storing and separating molecules and ions. In this embodiment, the metal-organic structure is used as an adsorption material for adsorbing and desorbing refrigerants. Examples of metal-organic structures are MOF-5 and MOF-200. The adsorption material is, for example, a powder of the metal-organic structure.

[0028] (2) Action The adsorbent material adsorbs and desorbs the refrigerant circulating in the refrigerant circuit 11. The adsorbent material adsorbs and desorbs the refrigerant by changing the pressure of the refrigerant circulating in the refrigerant circuit 11. Specifically, the adsorbent material adsorbs the refrigerant at high pressure and desorbs the refrigerant at low pressure.

[0029] Assume that the high-pressure region of the refrigerant circuit 11 is filled with refrigerant at a pressure of pH and a temperature of TH. Assume that the low-pressure region of the refrigerant circuit 11 is filled with refrigerant at a pressure of pL and a temperature of TL. The pressure pH is higher than the pressure pL. The temperature TH is higher than the temperature TL. The adsorbent material adsorbs the refrigerant in the high-pressure region of the refrigerant circuit 11. The adsorbent material desorbs the refrigerant in the low-pressure region of the refrigerant circuit 11. In the adsorption section 21, refrigerant flowing in the high-pressure region of the refrigerant circuit 11 flows into the adsorption circuit 12 and is adsorbed by the adsorbent material. In the desorption section 22, the refrigerant desorbed from the adsorbent material flowing in the adsorption circuit 12 flows into the low-pressure region of the refrigerant circuit 11.

[0030] Reference Figures 1 to 4 , the operation of the heat pump cycle of the refrigeration cycle device 1 will be described. Figures 1 to 4 1 and 2 show a cycle of the refrigerant in the refrigerant circuit 11 (a→b→c→d→a) and a cycle of the adsorbent in the adsorption circuit 12 (a′→b′→c′→d′→a′). Figure 2 The graph shows changes in the adsorption amount and the pressure of the refrigerant adsorbed on the adsorption material in the heat pump cycle, wherein the adsorption amount is the mass of the refrigerant adsorbed per unit mass of the adsorption material. Figure 3The graph shows the adsorption amount of the adsorbent and the change in enthalpy of the refrigerant adsorbed on the adsorbent in the heat pump cycle. Figure 4 The graphs show changes in the refrigerant pressure and enthalpy of the refrigerant in the heat pump cycle. In the refrigeration cycle device 1 , it is assumed that heat can flow freely between the refrigerant circuit 11 and the adsorption circuit 12 .

[0031] In the refrigerant circuit 11, the refrigerant is compressed by the compressor 31 (a→b). In the adsorption circuit 12, the pressure of the adsorbent is increased by the booster 41 (a'→b'). This causes the pressure of the refrigerant and adsorbent to rise from pL to pH. During this process, a portion of the heat Q1 generated by the adiabatic compression of the refrigerant is transferred to the adsorbent. In other words, the refrigerant cools the adsorbent while being compressed. As a result, the temperature of the refrigerant and adsorbent rises from TL to TH.

[0032] Next, in the adsorption unit 21, the refrigerant gradually adsorbs onto the adsorption material while releasing heat Q2 (b'→c'). During this process, the adsorption amount of the adsorption material increases from mL to mH. As a result, in the adsorption unit 21, most of the refrigerant in the refrigerant circuit 11 is adsorbed onto the adsorption material in the adsorption circuit 12. Figure 1 In the adsorption portion 21 , as indicated by hatched arrows in the adsorption portion 21 , the refrigerant in the refrigerant circuit 11 moves to the adsorption circuit 12 and is adsorbed by the adsorption material.

[0033] Next, in the adsorption circuit 12, the adsorbent is depressurized by the depressurizer 42 (c' → d'). This causes the pressure of the adsorbent to drop from pH to pL. During this process, the temperature of the adsorbent drops from TH to TL due to the isenthalpic expansion of the refrigerant desorbed from the adsorbent. Furthermore, due to the temperature difference between the refrigerant and the adsorbent, the depressurized adsorbent in the adsorption circuit 12 is cooled, contributing heat Q3 to the refrigerant in the refrigerant circuit 11. Furthermore, heat Q5 is transferred from the pre-depressurized adsorbent to the pre-pressurized adsorbent via the heat exchanger 43.

[0034] Next, in the desorption section 22, the refrigerant gradually desorbs from the adsorption material while absorbing heat Q4 (d'→a'). In this process, the adsorption amount of the adsorption material decreases from mH to mL. As a result, most of the refrigerant adsorbed on the adsorption material of the adsorption circuit 12 is desorbed and flows into the refrigerant circuit 11. Figure 1 In the desorption section 22 , as indicated by hatched arrows in the desorption section 22 , the refrigerant desorbed from the adsorption material in the desorption circuit 12 moves to the refrigerant circuit 11 .

[0035] like Figure 2As shown in the figure, in the adsorption process (b'→c') where the refrigerant is adsorbed to the adsorbent material, the pressure is pH, and the adsorption amount of the adsorbent material increases from mL to mH. In the desorption process (d'→a') where the refrigerant is desorbed from the adsorbent material, the pressure is pL, and the adsorption amount of the adsorbent material decreases from mH to mL. Figure 3 As shown, during the adsorption process, the enthalpy decreases by Δh1. During the desorption process, the enthalpy increases by Δh2. During the adsorption process, the heat Q2 released from the adsorption unit 21 is proportional to Δh1. During the desorption process, the heat Q4 absorbed by the adsorption unit 22 is proportional to Δh2.

[0036] Assume that the change in enthalpy caused by the heat exchange performed by the heat exchanger 43 is Δh3. Assume that the change in enthalpy caused by the heating of the adsorbent material during the pressure increase process (a'→b') of the adsorbent material is Δh4. Assume that the change in enthalpy caused by the cooling of the adsorbent material during the pressure reduction process (c'→d') of the adsorbent material is Δh5. Figure 4 As shown in the figure, the change in total enthalpy during the compression process (a→b) of the refrigerant is expressed as Δh4-Δh3. The change in total enthalpy during the decompression process (c'→d') of the adsorption material is expressed as Δh5-Δh3. Figure 4 In FIG, the state change of the refrigerant during adiabatic compression is indicated by a dotted arrow, and the state change of the refrigerant during isenthalpic expansion is indicated by a dashed arrow.

[0037] Figure 5 The isotherms of the refrigerant during adsorption and desorption are shown for the heat pump cycle suitable for the refrigeration cycle device 1. Figure 5 In the figure, the isotherm at temperature TH is represented by a solid line, and the isotherm at temperature TL is represented by a dashed line. In the adsorption process (b'→c'), when the refrigerant is adsorbed onto the adsorbent material at a pressure of pH and a temperature of TH, the amount adsorbed by the adsorbent material on the isotherm at temperature TH preferably increases from mL to mH at a pressure between pL and pH. In the desorption process (d'→a'), when the refrigerant is desorbed from the adsorbent material at a pressure of pL and a temperature of TL, the amount adsorbed by the adsorbent material on the isotherm at temperature TL preferably decreases from mH to mL at a pressure between pL and pH.

[0038] (3) Detailed structure Reference Figure 6 ,right Figure 1 The specific structure of the refrigeration cycle apparatus 1 shown will be described.

[0039] Figure 6 The refrigeration cycle device 301 shown has a refrigerant circuit 311 for circulating refrigerant. The refrigerant circuit 311 includes Figure 1The adsorbent material flows along with the refrigerant in a portion of the refrigerant circuit 311. In other words, in the refrigeration cycle device 301, a mixture of the refrigerant and the adsorbent material circulates in the refrigerant circuit 311.

[0040] The refrigerant circuit 311 includes a compressor 331, an expansion mechanism 332, a first heat exchanger 333, a second heat exchanger 334, a switching unit 335, a first fan 336, a second fan 337, a booster 341, and a separator 351. The compressor 331 corresponds to Figure 1 The compressor 31. The booster 341 is equivalent to Figure 1 The booster 41. The expansion mechanism 332 includes Figure 1 The functions of both the expansion mechanism 32 and the pressure reducer 42 are realized.

[0041] The switching unit 335 switches the flow direction of the mixture of refrigerant and adsorbent circulating in the refrigerant circuit 311. The switching unit 335 is, for example, a four-way reversing valve. Figure 6 The solid line shows the first mode of flow direction with Figure 6 The flow direction is switched between the first and second modes shown by the dashed lines. In the first mode, the discharge sides of the compressor 331 and the booster 341 are connected to the first heat exchanger 333, and the suction sides of the compressor 331 and the booster 341 are connected to the second heat exchanger 334. In the second mode, the discharge sides of the compressor 331 and the booster 341 are connected to the second heat exchanger 334, and the suction sides of the compressor 331 and the booster 341 are connected to the first heat exchanger 333.

[0042] The separator 351 is provided between the suction sides of the compressor 331 and the booster 341 and the switching unit 335 .

[0043] The separator 351 separates the mixture of refrigerant and adsorbent circulating in the low-pressure region of the refrigerant circuit 311 into refrigerant and adsorbent. The separator 351 separates the refrigerant and adsorbent by, for example, centrifugal separation. The refrigerant separated by the separator 351 is compressed in the compressor 331. The adsorbent separated by the separator 351 is pressurized in the booster 341. Figure 6 As shown, the adsorbent material, whose pressure has been increased by the booster 341, merges with the refrigerant compressed by the compressor 331. After merging, the refrigerant and adsorbent are delivered to the switching unit 335. Thus, the refrigerant circuit 311 branches in the separator 351 and merges between the compressor 331 / booster 341 and the switching unit 335.

[0044] In the first heat exchanger 333, high-pressure refrigerant is adsorbed onto the adsorbent in the first mode, while low-pressure refrigerant is desorbed from the adsorbent in the second mode. In the second heat exchanger 334, low-pressure refrigerant is desorbed from the adsorbent in the first mode, while high-pressure refrigerant is adsorbed onto the adsorbent in the second mode. In both the first and second heat exchangers 333, 334, the refrigerant is heated by adsorption onto the adsorbent, or cooled by desorption from the adsorbent. As a result, heat is exchanged between the heated or cooled refrigerant and the air in both the first and second heat exchangers 333, 334. The first fan 336 transports the air that has undergone superheat exchange in the first heat exchanger 333 to a designated location. The second fan 337 transports the air that has undergone superheat exchange in the second heat exchanger 334 to a designated location.

[0045] In this way, in the refrigeration cycle device 301, as the mixture of refrigerant and adsorbent material circulates in the refrigerant circuit 311, the refrigerant is heated or cooled, and the air that has undergone heat exchange with the refrigerant is transported to a predetermined location. The following describes a case where the refrigeration cycle device 301 is an air conditioning device. The first heat exchanger 333 is an indoor heat exchanger, and the second heat exchanger 334 is an outdoor heat exchanger. When the refrigeration cycle device 301 is performing heating operation, by switching to the first mode, the refrigerant is adsorbed onto the adsorbent material in the first heat exchanger 333, thereby being heated. The air that has undergone heat exchange with the refrigerant and is heated is transported to a predetermined location by the first fan 336.

[0046] The refrigeration cycle device 301 may also include a component for separating the mixture of the refrigerant in the high pressure region circulating in the refrigerant circuit 311 and the adsorbent into the refrigerant and the adsorbent. In this case, the separated refrigerant is equivalent to Figure 6 The expansion mechanism 332 is decompressed, and the separated adsorbent material is Figure 1 The components of the pressure reducer 42 reduce pressure.

[0047] Figure 1 The specific structure of the refrigeration cycle device 1 shown is not limited to Figure 6 For example, the refrigeration cycle apparatus 1 may not include the components corresponding to the booster 341 and the separator 351 of the refrigeration cycle apparatus 301, and may include a single circuit in which a mixture of the refrigerant and the adsorbent circulates.

[0048] In addition, the refrigeration cycle device 1 may also have two circuits consisting of a refrigerant circuit for circulating the refrigerant and an adsorption material circuit for circulating the adsorption material. In this case, the refrigeration cycle device 1 has a structure for allowing the refrigerant flowing in the refrigerant circuit to freely enter and exit the adsorption material circuit. For example, the refrigeration cycle device 1 has a mixing section that separates the refrigerant circuit from the adsorption material circuit by a gas permeable membrane through which the refrigerant can pass but the adsorption material cannot pass. The mixing section is equivalent to Figure 1 The adsorption section 21 and the desorption section 22 are shown. In the mixing section, the refrigerant is mixed with the adsorption material, so that the refrigerant is adsorbed or desorbed.

[0049] Alternatively, the refrigeration cycle device 1 may have a structure in which two adsorption units (a first adsorption unit and a second adsorption unit) are provided in a refrigerant circuit through which refrigerant circulates. The first adsorption unit and the second adsorption unit include adsorption materials that come into contact with the refrigerant circulating in the refrigerant circuit. In this case, the refrigeration cycle device 1 has a structure capable of switching between a first mode and a second mode. In the first mode, the first adsorption material adsorbs the refrigerant while the second adsorption material desorbs the refrigerant. In the second mode, the first adsorption material desorbs the refrigerant while the second adsorption material adsorbs the refrigerant.

[0050] (4) Operating conditions The refrigeration cycle device 1 operates in a manner that satisfies at least one of the first condition and the second condition. Next, specific examples of the first condition and the second condition will be described with reference to the Mollier diagram (ph diagram) showing the state of the refrigerant in the refrigeration cycle. Figure 7 and Figure 8 The saturated liquid line L1, dry saturated vapor line L2 and critical point CP of the refrigerant are depicted in FIG. The critical point CP is the end point on the high pressure side of the saturated liquid line L1 and the dry saturated vapor line L2. Figure 7 Isotherms at temperatures TH, TC, and TS are depicted by dot-dash lines.

[0051] (4-1) First embodiment In this embodiment, carbon dioxide is used as the refrigerant in the refrigeration cycle device 1. The first condition and the second condition are as follows. First condition: The pressure of the refrigerant in the high-pressure region is lower than the critical pressure of the refrigerant, and the temperature of the refrigerant in the high-pressure region exceeds the critical temperature of the refrigerant. Second condition: The pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorption material does not adsorb or desorb the refrigerant.

[0052] exist Figure 7In FIG. 1 , the refrigeration cycle C1 of the refrigeration cycle device 1 is shown by a solid line, and the refrigeration cycle C2 of the refrigeration cycle device including only the vapor compression cycle is shown by a dotted line. Figure 1 The refrigerant circuit 11 is in each state of the refrigerant cycle a→b→c→d→a.

[0053] Under the first condition, the pressure PH of the refrigerant in the high-pressure region of the refrigeration cycle device C1 is below the critical pressure PC of the refrigerant. The critical pressure PC is the pressure at the critical point CP. In addition, under the first condition, the temperature TH of the refrigerant in the high-pressure region of the refrigeration cycle C1 exceeds the critical temperature TC of the refrigerant. The temperature TH is the temperature of the high-temperature and high-pressure refrigerant after being compressed by the compressor 31, and is the temperature of the refrigerant in state b of the refrigeration cycle C1. The critical temperature TC is the temperature at the critical point CP. Figure 7 In the embodiment, the temperature TH indicated by the isothermal line passing through the state b is higher than the temperature TC indicated by the isothermal line passing through the critical point CP.

[0054] Under the second condition, the refrigerant pressure PL in the low-pressure region of the refrigeration cycle C1 is lower than the saturation pressure PL' of the refrigerant corresponding to the evaporation temperature when the adsorbent is not adsorbing or desorbing the refrigerant. The saturation pressure PL' corresponds to the pressure in the low-pressure region of the refrigeration cycle C2.

[0055] The refrigerant pressure PH value in the high-pressure region of the refrigeration cycle C1 can also be appropriately set. For example, the pressure PH is set to be lower than the saturation pressure of R32 at 65°C in a vapor compression refrigeration cycle in which R32 circulates. For example, the pressure PH is set to be lower than the saturation pressure of R134a at 65°C in a vapor compression refrigeration cycle in which R134a circulates.

[0056] (4-2) Second embodiment In this embodiment, propane is used as the refrigerant in the refrigeration cycle device 1. The first condition and the second condition are as follows. First condition: The refrigerant pressure in the high-pressure region is lower than the saturation pressure of the refrigerant corresponding to the condensing temperature when the adsorbent material does not adsorb or desorb the refrigerant. Second condition: The pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorption material does not adsorb or desorb the refrigerant.

[0057] exist Figure 8 In FIG. 1 , the refrigeration cycle C3 of the refrigeration cycle device 1 is shown by a solid line, and the refrigeration cycle C4 of the refrigeration cycle device including only the vapor compression cycle is shown by a dotted line. Figure 1 The refrigerant circuit 11 is in each state of the refrigerant cycle a→b→c→d→a.

[0058] Under the first condition, the refrigerant pressure PH in the high-pressure region of the refrigeration cycle C3 is lower than the saturation pressure PH' of the refrigerant corresponding to the condensation temperature when the adsorbent material is not adsorbing or desorbing the refrigerant. The saturation pressure PH' corresponds to the pressure in the high-pressure region of the refrigeration cycle C4.

[0059] Under the second condition, the refrigerant pressure PL in the low-pressure region of the refrigeration cycle C3 is lower than the saturation pressure PL' of the refrigerant corresponding to the evaporation temperature when the adsorbent is not adsorbing or desorbing the refrigerant. The saturation pressure PL' corresponds to the pressure in the low-pressure region of the refrigeration cycle C4.

[0060] (5) Characteristics exist Figure 7 and Figure 8 In the example, the operating pressure of the refrigeration cycle device 1 is PH, and the operating pressure of the conventional refrigeration cycle device is PH'. The operating pressure PH is lower than the operating pressure PH'. Therefore, the operating pressure of the refrigeration cycle device 1 is lower than that of the conventional refrigeration cycle device having a vapor compression refrigeration cycle but not having an adsorbent. For example, Figure 7 As shown, when the refrigerant is carbon dioxide, the operating pressure PH' of conventional refrigeration cycle devices is approximately 10 MPa, while the operating pressure PH of refrigeration cycle device 1 is approximately 1.5 MPa. The operating pressure is the pressure of the compressed refrigerant within the refrigeration cycle. The higher the operating pressure, the greater the mechanical workload of the compressor, and the higher the pressure resistance (design pressure) required of components that make up the refrigerant circuit, such as the compressor housing. Therefore, the higher the operating pressure, the higher the cost of electricity used to drive the compressor and the cost of system components.

[0061] Therefore, the refrigeration cycle device 1 can operate at an operating pressure lower than that of conventional refrigeration cycle devices, thereby reducing manufacturing and operating costs. In addition, the refrigeration cycle device 1 has a reduced design pressure, which can make components such as the compressor housing more compact and improve system reliability.

[0062] Furthermore, when the refrigeration cycle device 1 is an air conditioner, it can increase cooling and heating capacity by utilizing the refrigerant's heat of adsorption and desorption for cooling and heating. Therefore, by controlling the refrigerant's heat of adsorption and desorption, the refrigeration cycle device 1 can improve refrigeration cycle efficiency and reduce operating costs compared to conventional refrigeration cycle devices.

[0063] (6) Modification (6-1) Modification A In the first embodiment, the first condition may be that the refrigerant pressure in the high-pressure region is lower than the critical pressure of the refrigerant and the refrigerant temperature in the high-pressure region exceeds the saturation temperature of the refrigerant corresponding to the refrigerant pressure in the high-pressure region.

[0064] Under this first condition, the pressure PH of the refrigerant in the high-pressure region of the refrigeration cycle device C1 is below the critical pressure PC of the refrigerant. In addition, the temperature TH of the refrigerant in the high-pressure region of the refrigeration cycle device C1 exceeds the saturation temperature TS of the refrigerant corresponding to the pressure of the refrigerant in the high-pressure region. The temperature TH is the temperature of the high-temperature and high-pressure refrigerant compressed by the compressor 31, and is the temperature of the refrigerant in state b of the refrigeration cycle C1. Figure 7 As shown, the saturation temperature TS corresponds to the temperature at the point where the line of the refrigerant pressure PH in the high-pressure region of the refrigeration cycle C1 intersects the dry saturated vapor line L2.

[0065] (6-2) Modification B In the second embodiment, the refrigerant used in the refrigeration cycle apparatus 1 may be ammonia.

[0066] (6-3) Modification C The adsorbent used in the refrigeration cycle apparatuses 1 and 301 is a metal organic structure. However, materials other than the metal organic structure may be used as the adsorbent.

[0067] While the embodiments of the present disclosure have been described above, it should be understood that various modifications in form and detail can be made without departing from the spirit and scope of the present disclosure as described in the claims. Explanation of symbols

[0068] 1. 301 refrigeration cycle device; 11. 311 adsorption circuit (unit 1); 31, 331 compressor; 32, 332Expansion mechanism. Prior art literature Patent Literature

[0069] Patent Document 1: International Publication No. 2009 / 145278

Claims

1. A refrigeration cycle device (1, 301), characterized in that: include: A first unit (11, 311), the first unit having a compressor (31, 331) for compressing a refrigerant and an expansion mechanism (32, 332) for decompressing the refrigerant, and constituting a vapor compression refrigeration cycle for circulating the refrigerant; as well as an adsorbent material, the adsorbent material adsorbing and desorbing the refrigerant circulating in the first unit, The first unit also has: a high-pressure region through which flows the refrigerant after being compressed by the compressor and before being decompressed by the expansion mechanism; as well as a low-pressure region in which the refrigerant flows after being decompressed by the expansion mechanism and before being compressed by the compressor, The refrigeration cycle device is operated under at least one of a first condition and a second condition. Under the first condition, the pressure of the refrigerant in the high-pressure region is below the critical pressure of the refrigerant, and the temperature of the refrigerant in the high-pressure region exceeds the critical temperature of the refrigerant. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorption material does not adsorb or desorb the refrigerant.

2. A refrigeration cycle device (1, 301), characterized in that: include: A first unit (11, 311), the first unit having a compressor (31, 331) for compressing a refrigerant and an expansion mechanism (32, 332) for decompressing the refrigerant, and constituting a vapor compression refrigeration cycle for circulating the refrigerant; as well as an adsorbent material, the adsorbent material adsorbing and desorbing the refrigerant circulating in the first unit, The first unit also has: a high-pressure region through which flows the refrigerant after being compressed by the compressor and before being decompressed by the expansion mechanism; as well as a low-pressure region in which the refrigerant flows after being decompressed by the expansion mechanism and before being compressed by the compressor, The refrigeration cycle device is operated under at least one of a first condition and a second condition. Under the first condition, the pressure of the refrigerant in the high-pressure region is below the critical pressure of the refrigerant, and the temperature of the refrigerant in the high-pressure region exceeds the saturation temperature of the refrigerant corresponding to the pressure of the refrigerant in the high-pressure region. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorption material does not adsorb or desorb the refrigerant.

3. The refrigeration cycle device according to claim 2, characterized in that: The pressure of the refrigerant in the high-pressure region is equal to or lower than the saturation pressure of R32 corresponding to 65° C. in a vapor compression refrigeration cycle in which R32 circulates.

4. The refrigeration cycle device according to claim 2, characterized in that: The pressure of the refrigerant in the high-pressure region is equal to or lower than the saturation pressure of R134a corresponding to 65° C. in a vapor compression refrigeration cycle in which R134a circulates.

5. The refrigeration cycle device according to any one of claims 2 to 4, characterized in that: The adsorption material includes a metal organic structure, and the metal organic structure includes metal ions and organic ligands.

6. The refrigeration cycle device according to any one of claims 2 to 5, characterized in that: The refrigerant is carbon dioxide.

7. A refrigeration cycle device (1, 301), characterized in that: include: A first unit (11, 311), the first unit having a compressor (31, 331) for compressing a refrigerant and an expansion mechanism (32, 332) for decompressing the refrigerant, and constituting a vapor compression refrigeration cycle for circulating the refrigerant; as well as an adsorbent material, the adsorbent material adsorbing and desorbing the refrigerant circulating in the first unit, The first unit also has: a high-pressure region through which flows the refrigerant after being compressed by the compressor and before being decompressed by the expansion mechanism; as well as a low-pressure region in which the refrigerant flows after being decompressed by the expansion mechanism and before being compressed by the compressor, The refrigeration cycle device is operated under at least one of a first condition and a second condition. Under the first condition, the pressure of the refrigerant in the high-pressure region is lower than the saturation pressure of the refrigerant corresponding to the condensation temperature when the adsorbent material does not adsorb or desorb the refrigerant. Under the second condition, the pressure of the refrigerant in the low-pressure region is lower than the saturation pressure of the refrigerant corresponding to the evaporation temperature when the adsorption material does not adsorb or desorb the refrigerant.

8. The refrigeration cycle device according to claim 7, characterized in that: The adsorption material includes a metal organic structure, and the metal organic structure includes metal ions and organic ligands.

9. The refrigeration cycle device according to claim 7 or 8, characterized in that: The refrigerant is ammonia or propane.

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