Mems chip testing apparatus

Abstract

The application discloses a MEMS chip testing device, which comprises a rack and a material bin assembly, a feeding and discharging assembly and a testing assembly which are respectively installed on the rack, the feeding and discharging assembly comprises an X-direction driving module, a movable Y-direction driving module, a movable Z-axis driving module and a plurality of suction nozzles for picking up chips, the vertically arranged suction nozzles are movably installed on the Z-axis driving module, the material bin assembly comprises at least one feeding box and at least two discharging boxes, and a plurality of chip material trays which are arranged in the vertical direction are arranged in the feeding box and the discharging boxes. The application can realize stable pressing of each chip by a pressing head during the testing process, double-axis multi-angle rotation of a plurality of chips, batch testing of the plurality of chips, guarantee of the stability and consistency of the force of the chips during the whole testing process, rapid picking and placing of the chips in the chip seats through the strip-shaped through holes, improvement of the production testing efficiency and guarantee of the testing precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a MEMS chip testing device. BACKGROUND

[0002] In recent years, the miniaturization trend of MEMS chips is more and more obvious, and the detection demand for MEMS chips is also increasing. MEMS is of various types, and hundreds of millions of MEMS are consumed in the world every year, and are widely used in smart phones, automotive electronics, intelligent manufacturing and other fields. And the market share of MEMS chips depends on their own quality. The quality detection of MEMS chips usually needs to use the corresponding test seat to realize the control of the quality of MEMS chips. However, the existing products for testing MEMS chips have too high manufacturing cost, and cannot be well popularized and used on a larger scale, thereby greatly increasing the manufacturing cost and test cycle of MEMS chip manufacturers, and thus being not conducive to improving their economic benefits. SUMMARY

[0003] The purpose of the present application is to provide a MEMS chip testing device which can realize batch testing of multiple chips, ensure the stability and consistency of the force of the chips in the whole testing process, and quickly pick and place the chips in the chip seat through the strip-shaped through hole, thereby improving the production test efficiency and ensuring the test accuracy.

[0004] To achieve the above purpose, the technical scheme adopted by the present application is: a MEMS chip testing device, comprising: a rack and a material bin assembly, a feeding and discharging assembly and a testing assembly respectively installed on the rack, the feeding and discharging assembly comprising: an X-direction driving module, a Y-direction driving module movably installed on the X-direction driving module, a Z-axis driving module movably installed on the Y-direction driving module and a plurality of suction nozzles for picking up chips, the vertically arranged suction nozzles being movably installed on the Z-axis driving module, the material bin assembly comprising at least one feeding box and at least two discharging boxes, a plurality of chip trays arranged in the vertical direction being arranged in the feeding box and the discharging box, the testing assembly arranged on one side of the material bin assembly and below the feeding and discharging assembly comprising: a marble base plate horizontally installed on the rack, a first support plate vertically installed on the upper surface of the marble base plate, a second support plate and a test carrier plate arranged between the first support plate and the second support plate, the test carrier plate being installed on the rotating part of a first turntable rotatable around a first direction, the fixed part of the first turntable being installed on a rotating base, one end of the rotating base rotatably connected with the first support plate being installed on the rotating part of a second turntable rotatable around a second direction, the fixed part of the second turntable being installed on the second support plate;

[0005] The upper surface of the test board is provided with at least one transverse cylinder which can stretch and contract along the Y direction perpendicular to the X direction, a movable plate connected with the piston rod of the transverse cylinder is slidably arranged above the test board, at least two vertical cylinders are installed on the movable plate, the piston rod of each vertical cylinder is connected with the pressing plate, when the pressing head on the pressing plate moves above the chip seat with the transverse cylinder and the piston rod of the vertical cylinder is in the contracted state, the pressing head is in extrusion contact with the chip in the chip seat.

[0006] The further improved scheme in the above technical scheme is as follows:

[0007] 1. In the above scheme, one surface of a movable activity board in the vertical direction is installed on the Z-axis driving module, the other surface of the activity board is provided with a variable distance module, a support bar is installed on each variable distance slider of the variable distance module, and a suction nozzle is installed at the lower end of each support bar connected with the variable distance slider.

[0008] 2. In the above scheme, a blade cylinder is installed at the lower end of each support bar, and the upper end of each suction nozzle is connected with the corresponding blade cylinder.

[0009] 3. In the above scheme, a vertical contraction cylinder is further installed on the activity board, the lower end of the piston rod of the contraction cylinder is connected with a horizontally arranged adsorption plate, a plurality of adsorption holes opened on the lower surface of the adsorption plate are communicated with a vacuum pump or a vacuum generator through a pipeline, and when the piston rod of the contraction cylinder is in the elongated state, the lower surface of the adsorption plate is lower than the lower end surface of the suction nozzle.

[0010] 4. In the above scheme, a visual support is installed on one side of the Y direction driving module and located on one side of the Z-axis driving module, a camera and a light source located directly below the camera are installed on the surface of the visual support opposite to the driving module and movable along the Y direction.

[0011] 5. The scheme, the hopper assembly further comprises: a bottom substrate and a plurality of partitions installed on the upper surface of the bottom substrate, the adjacent partitions and the bottom substrate form a hopper area for embedding the upper hopper or the lower hopper, the bottom surface of each upper hopper and lower hopper and the upper surface of the bottom substrate in the corresponding hopper area are connected by at least one set of hopper slide rail and hopper slide block.

[0012] 6. The scheme, a plurality of partitions are connected by a baffle plate near one end of the test assembly, and at least two sets of guide columns and guide sleeves are arranged between each upper hopper, lower hopper and baffle plate.

[0013] 7. The scheme, the first direction and the second direction are perpendicular to each other, and the intersection point coincides with the center of gravity of the test assembly.

[0014] 8. The scheme, the fixed part of each first rotating disc and second rotating disc is installed with a rotating motor and a wire sliding ring for driving the rotating part to rotate.

[0015] Due to the use of the above technical scheme, the present application has the following advantages compared with the prior art:

[0016] 1. The MEMS chip testing equipment of the application, which is arranged on one side of the hopper assembly and below the feeding and discharging assembly, and comprises a marble base plate horizontally arranged on a rack, a first support plate vertically arranged on the upper surface of the marble base plate, a second support plate, and a test carrier plate arranged between the first support plate and the second support plate, wherein the test carrier plate is arranged on the rotating part of a first rotating disc rotatable in a first direction, the fixed part of the first rotating disc is arranged on a rotating base, one end of the rotating base rotatably connected with the first support plate is arranged on the rotating part of a second rotating disc rotatable in a second direction, and the upper surface of the test carrier plate is sequentially provided with a test plate in communication with a host computer and a chip carrier plate electrically connected with the test plate, the chip carrier plate is provided with a plurality of chip seats on the upper surface opposite to the test plate, the lower surface of a pressing plate arranged above the chip carrier plate is provided with a plurality of pressing heads corresponding to the chip seats, the plurality of pressing heads are arranged to form at least two pressing head columns, the plurality of pressing heads in each pressing head column are arranged at intervals along the X direction, a strip-shaped through hole extending along the X direction is formed in the upper surface of the pressing plate between any two adjacent pressing head columns, the upper surface of the test carrier plate is provided with at least one transverse cylinder which can extend and retract along the Y direction perpendicular to the X direction, a movable plate connected with the piston rod of the transverse cylinder is slidably arranged above the test carrier plate, at least two vertical cylinders are arranged on the movable plate, and the piston rod of each vertical cylinder is connected with the pressing plate, so that the plurality of chips can be stably pressed and held by the pressing heads and rotated in two axes and at multiple angles during the testing process, thereby realizing batch testing of the plurality of chips, the stability and consistency of the force applied to the chips during the testing process can be ensured, the chips in the chip seats can be quickly taken out and placed through the strip-shaped through hole, the production testing efficiency is improved, and the testing precision is ensured.

[0017] 2、The MEMS chip testing equipment of the application, a surface of a movable carrier plate which can move in a vertical direction is mounted on a Z-axis driving module, a variable distance module is mounted on another surface of the movable carrier plate, a support strip is mounted on each variable distance slider of the variable distance module, a suction nozzle is mounted on the lower end of each support strip connected with the upper end of the variable distance slider, the suction nozzles can simultaneously pick up and carry multiple chips between the material bin assembly and the testing assembly, the distance between the suction nozzles can be adjusted to compensate for the position difference between the chips in the material bin assembly and the testing assembly, thereby improving the chip conveying efficiency and the testing efficiency; further, a blade cylinder is mounted on the lower end of each support strip, the upper end of each suction nozzle is connected with the corresponding blade cylinder, the chip can be independently picked up and placed by the contraction of the blade cylinder without affecting the chips on other suction nozzles; in addition, a vertically arranged contraction cylinder is mounted on the movable carrier plate, the lower end of the piston rod of the contraction cylinder is connected with a horizontally arranged adsorption plate, a plurality of adsorption holes opened in the lower surface of the adsorption plate are communicated with a vacuum pump or a vacuum generator through a pipeline, when the piston rod of the contraction cylinder is in an elongated state, the lower surface of the adsorption plate is lower than the lower end surface of the suction nozzle, the chip tray as a whole can be adsorbed and carried, and the suction nozzle can be prevented from being interfered and damaged during the carrying process. BRIEF DESCRIPTION OF DRAWINGS

[0018] FIG. 1 is a schematic diagram of the overall structure of the MEMS chip testing equipment of the application; Figure 1 FIG. 1 is a schematic diagram of the overall structure of the MEMS chip testing equipment of the application;

[0019] FIG. 2 is a schematic diagram of the rotating test table structure of the MEMS chip testing equipment of the application; Figure 2 FIG. 2 is a schematic diagram of the rotating test table structure of the MEMS chip testing equipment of the application;

[0020] FIG. 3 is a schematic diagram of the local structure of the rotating test table of the MEMS chip testing equipment of the application; Figure 3 FIG. 3 is a schematic diagram of the local structure of the rotating test table of the MEMS chip testing equipment of the application;

[0021] Figure 4 FIG. 4 is a schematic diagram of the material bin structure of the MEMS chip testing equipment of the application; Figure 3 FIG. 4 is a schematic diagram of the material bin structure of the MEMS chip testing equipment of the application;

[0022] FIG. 5 is a first perspective view of the local structure of the feeding structure of the MEMS chip testing equipment of the application; Figure 5 FIG. 5 is a first perspective view of the local structure of the feeding structure of the MEMS chip testing equipment of the application;

[0023] Figure 6 FIG. 6 is a second perspective view of the local structure of the feeding structure of the MEMS chip testing equipment of the application;

[0024] FIG. 6 is a second perspective view of the local structure of the feeding structure of the MEMS chip testing equipment of the application; Figure 7 FIG. 7 is a schematic diagram of the material bin structure of the MEMS chip testing equipment of the application;

[0025] FIG. 7 is a schematic diagram of the material bin structure of the MEMS chip testing equipment of the application; Figure 8 Figure 7 FIG. 8 is an enlarged view of structure A in FIG. 7;

[0026] FIG. 8 is an enlarged view of structure A in FIG. 7; Figure 9 ​​​The internal structure of the material bin of the MEMS chip testing equipment of the present application is shown in the figure;

[0027] The internal structure of the material bin of the MEMS chip testing equipment of the present application is shown in the figure; Figure 10 The internal structure of the material bin of the MEMS chip testing equipment of the present application is shown in the figure.

[0028] In the above figure: 100, rack; 200, chip; 300, chip tray; 1, marble base plate; 2, first support plate; 3, second support plate; 4, test carrier plate; 51, first turntable; 52, second turntable; 53, rotary motor; 54, wiring slip ring; 6, rotating base; 7, test plate; 8, chip carrier plate; 9, chip seat; 10, pressing plate; 11, pressing head; 12, vertical cylinder; 13, horizontal cylinder; 14, movable plate; 15, strip-shaped through hole; 21, X-direction driving module; 22, Y-direction driving module; 221, visual support; 222, camera; 223, light source; 23, Z-axis driving module; 24, suction nozzle; 25, movable carrier plate; 26, variable distance module; 261, variable distance slider; 262, support; 27, support strip; 28, blade cylinder; 29, contraction cylinder; 30, adsorption plate; 301, adsorption hole; 31, feeding box; 32, discharging box; 33, bottom base plate; 34, partition plate; 35, box area; 361, bin slide rail; 362, bin slide block; 37, baffle; 371, guide column; 372, guide sleeve; 38, support plate; 39, screw rod; 40, top plate; 41, motor; 42, nut; 43, vertical support plate; 441, slide rail; 442, slide block; 45, movable block; 461, guide column; 462, guide sleeve; 47, bearing seat; 48, limiting plate; 49, first push block; 50, second push block; 51, first cylinder; 52, second cylinder. DETAILED DESCRIPTION

[0029] The present application can be further understood by the specific examples given below, but they are not a limitation of the present application.

[0030] Embodiment 1: a MEMS chip testing device, comprising: a rack 100 and a magazine assembly, an up-down feeding assembly, a testing assembly respectively mounted on the rack 100, the up-down feeding assembly comprising: an X-direction driving module 21, a Y-direction driving module 22 movably mounted on the X-direction driving module 21, a Z-axis driving module 23 movably mounted on the Y-direction driving module 22 and a plurality of suction nozzles 24 for picking up chips 200, the vertically arranged suction nozzles 24 are movably mounted on the Z-axis driving module 23, the magazine assembly comprises at least one up-feeding box 31 and at least two down-feeding boxes 32, a plurality of chip magazines 300 are arranged in the up-feeding box 31 and the down-feeding box 32 in the vertical direction, the testing assembly arranged on one side of the magazine assembly and below the up-down feeding assembly comprises: a marble base plate 1 horizontally mounted on the rack 100, a first support plate 2 vertically mounted on the upper surface of the marble base plate 1, a second support plate 3 and a testing carrier plate 4 arranged between the first support plate 2 and the second support plate 3, the testing carrier plate 4 is mounted on the rotating part of a first turntable 51 rotatable around a first direction, the fixed part of the first turntable 51 is mounted on a rotating base 6, one end of the rotating base 6 rotatably connected with the first support plate 2 is mounted on the rotating part of a second turntable 52 rotatable around a second direction, the fixed part of the second turntable 52 is mounted on the second support plate 3;

[0031] A test plate 7 in communication with an upper computer and a chip carrier plate 8 electrically connected with the test plate 7 are sequentially arranged above the testing carrier plate 4, a plurality of chip seats 9 are arranged on the upper surface of the chip carrier plate 8 opposite to the test plate 7, a plurality of pressure heads 11 corresponding to the chip seats 9 are arranged on the lower surface of a pressing plate 10 arranged above the chip carrier plate 8, the plurality of pressure heads 11 are arranged to form at least two pressure head columns, the plurality of pressure heads 11 in each pressure head column are arranged in the X-direction, a strip-shaped through hole 15 extending in the X-direction is arranged on the upper surface of the pressing plate 10 between any two adjacent pressure head columns, at least one transverse cylinder 13 extending in the Y-direction perpendicular to the X-direction is mounted on the upper surface of the testing carrier plate 4, a movable plate 14 connected with the piston rod of the transverse cylinder 13 is slidably arranged above the testing carrier plate 4, at least two vertical cylinders 12 are mounted on the movable plate 14, the piston rod of each vertical cylinder 12 is connected with the pressing plate 10, when the pressure heads 11 on the pressing plate 10 move above the chip seats 9 and the piston rod of the vertical cylinder 12 is in the retracted state, the pressure heads 11 are in extrusion contact with the chips 200 in the chip seats 9.

[0032] A surface of a movable carrier plate 25 which can move in vertical direction is installed on the Z-axis driving module 23, and another surface of the movable carrier plate 25 is installed with a variable distance module 26, each variable distance slider 261 of the variable distance module 26 is installed with a support bar 27, and the lower end of each support bar 27 which is connected with the variable distance slider 261 is installed with a suction nozzle 24.

[0033] The lower end of each support bar 27 is installed with a blade cylinder 28, and the upper end of each suction nozzle 24 is connected with the corresponding blade cylinder 28.

[0034] The movable carrier plate 25 is also installed with a vertically arranged contraction cylinder 29, the lower end of the piston rod of the contraction cylinder 29 is connected with a horizontally arranged adsorption plate 30, and a plurality of adsorption holes 301 which are opened on the lower surface of the adsorption plate 30 are communicated with a vacuum pump or a vacuum generator through pipelines, when the piston rod of the contraction cylinder 29 is in the elongated state, the lower surface of the adsorption plate 30 is lower than the lower end surface of the suction nozzle 24.

[0035] The variable distance module 26 is installed on the movable carrier plate 25 through a support 262 and located on the side of the contraction cylinder 29 which is away from the movable carrier plate 25.

[0036] A visual support 221 which can move in Y direction is installed on the Y direction driving module 22 and located on the side of the Z-axis driving module 23, and the surface of the visual support 221 which is away from the driving module 22 is installed with a camera 222 and a light source 223 which is located directly below the camera 222.

[0037] The inner walls of each of the upper feeding box 31 and the lower feeding box 32 are fixedly installed with a horizontally extending support plate 38, the upper end of a vertically extending lead screw 39 penetrates through the support plate 38 and is connected with a top plate 40 which is arranged above the support plate 38, the lower end of the lead screw 39 is connected with the output shaft of a motor 41, a nut 42 which is sleeved outside the lead screw 39 is fixedly installed on the support plate 38 in threaded cooperation with the lead screw 39, the lower surface of the support plate 38 is installed with a vertical support plate 43, and a movable block 45 which can move in vertical direction is installed on the vertical support plate 43 through a slide rail 441 and a sliding block 442, and the motor 41 is installed on the movable block 45.

[0038] The lower surface of the top plate 40 is installed with at least two vertically extending guide columns 461, and the support plate 38 is installed with guide sleeves 462 which correspond to the guide columns 461, and each guide column 461 penetrates through the corresponding guide sleeve 462 and is in sliding cooperation with the guide sleeve 462.

[0039] The four guide columns 461 are respectively installed at the four corners of the lower surface of the top plate 40.

[0040] The lower end of the screw rod 39 is rotatably mounted on the movable block 45 through a bearing seat 47.

[0041] The nut 42 is fixedly mounted on the lower surface of the support plate 38.

[0042] The upper surface of the support plate 38 is provided with a limiting plate 48 outside the corners at both ends of the top plate 40. A plurality of chip trays 300 stacked on the upper surface of the top plate 40 are located in the area surrounded by the four vertically extending limiting plates 48. Each of the first push blocks 49 is arranged outside the two ends of any long side of the uppermost chip tray 300. Each of the second push blocks 50 is arranged outside any short side of the chip tray 300. The first push blocks 49 movable along the short side direction of the chip tray 300 are respectively connected with the piston rods of the first cylinders 51. The second push blocks 50 movable along the long side direction of the chip tray 300 are connected with the piston rods of the second cylinders 52.

[0043] The second push blocks 50 are arranged outside at least one limiting plate 48, and the limiting plate 48 is provided with a clearance hole for the second push blocks 50 to pass through.

[0044] The first cylinders 51 and the second cylinders 52 are respectively mounted on the inner walls of the upper loading box 31 and the lower loading box 32 or the limiting plate 48.

[0045] The first cylinders 51 are respectively arranged outside the two ends of the chip tray 300. The first push blocks 49 are L-shaped push blocks. The vertical part of the L-shaped push block is connected with the piston rod of the first cylinder 51, and the horizontal part is arranged outside the two ends of the long side of the uppermost chip tray 300. The inner walls of the upper loading box 31 and the lower loading box 32 are provided with clearance holes for the horizontal part of the L-shaped push block to embed.

[0046] The first direction and the second direction are perpendicular to each other, and the intersection point coincides with the center of gravity of the test assembly.

[0047] The first support plate 2 and the second support plate 3 are both marble support plates.

[0048] The fixed part of each of the first rotating disc 51 and the second rotating disc 52 is respectively provided with a rotating motor 53 and a wire sliding ring 54 for driving the rotating part to rotate. The first rotating disc, the second rotating disc, the rotating motor, and the wire sliding ring are all obtained by outsourcing and belong to the prior art category, which will not be described here.

[0049] The pressure head 11 is an elastic pressure head.

[0050] The pressure head 11 is a polyurethane pressure head.

[0051] The upper ends of the piston rods of the four vertical air cylinders 12 are respectively connected to the four corners of the lower surface of the pressing plate 10.

[0052] The two lateral air cylinders 13 are respectively installed outside the two ends of the pressing plate 10.

[0053] The two movable plates 14 connected to the piston rods of the two lateral air cylinders 13 are respectively slidably installed on the lower surface of the test plate 7 through at least one set of slide rails 141 and slide blocks 142.

[0054] The MEMS chip testing device of the embodiment 2 comprises a rack 100, a magazine assembly, an up-and-down assembly and a testing assembly which are respectively installed on the rack 100. The up-and-down assembly comprises an X-direction driving module 21, a Y-direction driving module 22 movably installed on the X-direction driving module 21, a Z-axis driving module 23 movably installed on the Y-direction driving module 22 and a plurality of suction nozzles 24 for picking up chips 200. The vertically arranged suction nozzles 24 are movably installed on the Z-axis driving module 23. The magazine assembly comprises at least one up-loading box 31 and at least two down-loading boxes 32. A plurality of chip magazines 300 are arranged in the up-loading box 31 and the down-loading boxes 32 in the vertical direction. The testing assembly arranged on one side of the magazine assembly and below the up-and-down assembly comprises a marble base plate 1 horizontally installed on the rack 100, a first support plate 2 vertically installed on the upper surface of the marble base plate 1, a second support plate 3 and a test plate 4 arranged between the first support plate 2 and the second support plate 3. The test plate 4 is installed on the rotating part of a first turntable 51 which can rotate in a first direction. The fixed part of the first turntable 51 is installed on a rotating base 6. One end of the rotating base 6 is rotatably connected to the first support plate 2. The other end of the rotating base 6 is installed on the rotating part of a second turntable 52 which can rotate in a second direction. The fixed part of the second turntable 52 is installed on the second support plate 3.

[0055] The upper surface of the test board 4 is provided with at least one transverse cylinder 13 which can extend in the Y direction perpendicular to the X direction, and the upper surface of the test board 4 is provided with at least two vertical cylinders 12, and the piston rod of each vertical cylinder 12 is connected with the pressing plate 10, when the pressing head 11 on the pressing plate 10 is moved to above the chip seat 9 by the transverse cylinder 13 and the piston rod of the vertical cylinder 12 is in the retracted state, the pressing head 11 is in extrusion contact with the chip 200 in the chip seat 9.

[0056] The above-mentioned stock bin assembly further comprises a bottom substrate 33 and a plurality of partition plates 34 which are spaced apart and installed on the upper surface of the bottom substrate 33, and the adjacent partition plate 34 and the bottom substrate 33 form a stock box area 35 which can be embedded with the upper stock box 31 or the lower stock box 32, and the bottom surface of each of the above-mentioned upper stock box 31 and lower stock box 32 and the upper surface of the bottom substrate 33 in the corresponding stock box area 35 are connected by at least one group of stock bin sliding rails 361 and stock bin sliding blocks 362.

[0057] The plurality of partition plates 34 are each connected with a baffle plate 37 at one end close to the test assembly, and at least two groups of guide columns 371 and guide sleeves 372 which cooperate with each other are arranged between each of the above-mentioned upper stock box 31 and lower stock box 32 and the baffle plate 37.

[0058] The above-mentioned pressing head 11 is a silica gel pressing head.

[0059] Firstly, the piston rod of each vertical cylinder and transverse cylinder of the test assembly is placed in the first state, so that the pressing head moved by the vertical cylinder is away from the chip seat in the vertical direction, and the strip-shaped through hole on the pressing plate moved by the transverse cylinder is above the chip seat, so as to facilitate the placement of the chip in the chip seat.

[0060] Through the suction nozzle of the feeding and discharging assembly, the chip tray located at the uppermost layer in the upper stock box of the stock bin assembly is picked up to pick up the chip to be tested, and then the combination of the X direction, Y direction and Z axis of the feeding and discharging assembly is moved to carry the chip to be tested into the chip seat of the test assembly.

[0061] When picking up the chips to be tested in the feeding box, the distance between the adjacent variable distance sliders on the variable distance module is consistent with the distance between the adjacent chips in the feeding box. Before placing the chip to be tested on the suction nozzle into the chip seat of the test assembly, the distance between the adjacent variable distance sliders is adjusted by the variable distance module so as to be consistent with the distance between the adjacent chip seats, so that the chip to be tested on each suction nozzle can be placed into the chip seat at the same time. The adjustment of the distance between the suction nozzles by the variable distance module compensates for the difference in chip position between the material bin assembly and the test assembly, improves the conveying efficiency and test efficiency of the chips, and the variable distance module is obtained by outsourcing and belongs to the existing technical category, which will not be described here.

[0062] The piston rods of the horizontal cylinder and the vertical cylinder of the test assembly are switched from the first state to the second state respectively, so that the column of pressure heads on the pressure plate moving with the horizontal cylinder moves to the upper side of the chip to be tested in the chip seat, and the pressure head moving with the vertical cylinder approaches the chip seat in the vertical direction and presses the chip to be tested tightly.

[0063] The first turntable and the second turntable are driven to rotate by the rotary motor, so as to drive the chip to be tested in the chip seat to rotate in two directions. In this process, the performance of the chip is tested, and the chip is classified according to the test result. The specific test process and test software do not belong to the invention points of the present application, which will not be described here.

[0064] After the test is completed, the first turntable and the second turntable are reset, and the piston rods of the vertical cylinder and the horizontal cylinder of the test assembly are switched from the second state back to the first state respectively, so that the pressure head moving with the vertical cylinder moves away from the chip seat in the vertical direction, and the strip-shaped through hole on the pressure plate moving with the horizontal cylinder moves to the upper side of the chip seat, so as to pick up the chip in the chip seat which has been tested and put the next batch of chips to be tested into the chip seat.

[0065] The chip which has been tested is picked up from the chip seat by the suction nozzle of the feeding and discharging assembly, and then moved to the upper side of the material bin assembly by the combination of the X-axis, the Y-axis and the Z-axis of the feeding and discharging assembly. According to the classification of the chip obtained in the test process, the chips of different grades are put into the chip trays in different discharging boxes, for example, the chips of grade A are put into the chip tray in the A discharging box, and the chips of grade B are put into the chip tray in the B discharging box. When a chip which has been tested needs to be put into the chip tray in the corresponding discharging box, the suction nozzle with the chip which has been tested is first moved to the upper side of the corresponding chip tray by the combination of the X-axis, the Y-axis and the Z-axis, and then the chip is put into the corresponding chip tray by further driving the suction nozzle downward by the blade cylinder. In this process, the chips on the other suction nozzles will not be interfered and will not fall off.

[0066] When all the chips in the test assembly that have been tested are moved to the chip tray in the unloading box, the suction nozzle of the loading and unloading assembly picks up the chip tray on the uppermost layer in the loading box of the material bin assembly to pick up the chip to be tested, and then moves the chip to be tested to the chip seat of the test assembly through the combination of the X, Y and Z axes of the loading and unloading assembly for the next round of testing, and the process is repeated in turn.

[0067] When all the chips to be tested in the chip tray on the uppermost layer in the loading box of the material bin assembly are picked up, the Z axis of the loading and unloading assembly is moved to the high position, and then the suction plate is moved above the empty chip tray through the combination of the X and Y axes of the loading and unloading assembly, and then the piston rod of the contraction cylinder is in the elongated state so that the lower surface of the suction plate is in contact with the upper surface of the empty chip tray, the vacuum pump or vacuum generator is started to adsorb the empty chip tray, and then the empty chip tray is moved to the stacking position of the empty tray through the combination of the X and Y axes of the loading and unloading assembly.

[0068] Then, the motor drives the top plate to move upward, so that the chip tray stacked on the upper surface of the top plate and containing the chip to be tested moves upward to make up the position, and the chip tray on the uppermost layer moves to the loading position; then the first cylinder and the second cylinder drive the first push block and the second push block to position the chip tray on the uppermost layer from two directions, improve the position accuracy of the chip tray on the uppermost layer, and further improve the accuracy of subsequent chip loading.

[0069] When the above-mentioned MEMS chip testing equipment is used, it can realize stable pressing of each chip and double-axis multi-angle rotation of multiple chips during testing through the pressure head, so as to realize batch testing of multiple chips, ensure the stability and consistency of the force on the chip during the whole testing process, and quickly take and place the chip in the chip seat through the strip-shaped through hole, improve the production testing efficiency and ensure the testing accuracy. The simultaneous picking and carrying of multiple chips can be realized between the material bin assembly and the test assembly, the distance between the suction nozzles can be adjusted to compensate for the position difference between the material bin assembly and the test assembly, the carrying efficiency and testing efficiency of the chip can be improved, the independent taking and placing of the chip can be realized through the contraction of the blade cylinder without affecting the chip on the other suction nozzle, and the chip tray can be adsorbed and carried as a whole without interfering with and damaging the suction nozzle during the carrying process.

[0070] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable persons skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A MEMS chip testing apparatus, comprising: The rack (100) and the magazine assembly, the feeding and discharging assembly and the testing assembly respectively installed on the rack (100), the feeding and discharging assembly comprises an X-direction driving module (21), a Y-direction driving module (22) movably installed on the X-direction driving module (21), a Z-axis driving module (23) movably installed on the Y-direction driving module (22) and a plurality of suction nozzles (24) for picking up chips (200), the vertically arranged suction nozzles (24) are movably installed on the Z-axis driving module (23), the magazine assembly comprises at least one feeding box (31) and at least two discharging boxes (32), a plurality of chip trays (300) arranged in the vertical direction are arranged in the feeding box (31) and the discharging box (32), characterized in that the testing assembly arranged on one side of the magazine assembly and below the feeding and discharging assembly comprises a marble base plate (1) horizontally installed on the rack (100), a first support plate (2) vertically installed on the upper surface of the marble base plate (1), a second support plate (3) and a testing carrier plate (4) arranged between the first support plate (2) and the second support plate (3), the testing carrier plate (4) is installed on the rotating part of a first rotating disc (51) rotatable in a first direction, the fixed part of the first rotating disc (51) is installed on a rotating base (6), one end of the rotating base (6) rotatably connected with the first support plate (2) is installed on the rotating part of a second rotating disc (52) rotatable in a second direction, and the fixed part of the second rotating disc (52) is installed on the second support plate (3); a testing plate (7) in communication with an upper computer and a chip carrier plate (8) electrically connected with the testing plate (7) are sequentially arranged above the testing carrier plate (4), a plurality of chip seats (9) are arranged on the upper surface of the chip carrier plate (8) away from the testing plate (7), a plurality of pressing heads (11) corresponding to the chip seats (9) are arranged on the lower surface of a pressing plate (10) arranged above the chip carrier plate (8), the plurality of pressing heads (11) are arranged to form at least two pressing head columns, and the plurality of pressing heads (11) in each pressing head column are arranged in the X-direction, a strip-shaped through hole (15) extending in the X-direction is arranged on the upper surface of the pressing plate (10) between any two adjacent pressing head columns, at least one transverse cylinder (13) extendable in the Y-direction perpendicular to the X-direction is installed on the upper surface of the testing carrier plate (4), a movable plate (14) connected with the piston rod of the transverse cylinder (13) is slidably arranged above the testing carrier plate (4), at least two vertical cylinders (12) are installed on the movable plate (14), the piston rod of each vertical cylinder (12) is connected with the pressing plate (10), and when the pressing heads (11) on the pressing plate (10) move above the chip seats (9) with the transverse cylinder (13) and the piston rod of the vertical cylinder (12) is in the retracted state, the pressing heads (11) are in extrusion contact with the chips (200) in the chip seats (9).

2. The MEMS chip testing apparatus of claim 1, wherein: A surface of a movable carrier plate (25) is mounted on a Z-axis driving module (23), and a variable distance module (26) is mounted on another surface of the movable carrier plate (25), each variable distance slider (261) of the variable distance module (26) is mounted with a support bar (27), and a suction nozzle (24) is mounted on the lower end of each support bar (27) connected with the variable distance slider (261).

3. The MEMS chip testing apparatus of claim 2, wherein: The lower end of each support bar (27) is mounted with a blade cylinder (28), and the upper end of each suction nozzle (24) is connected with a corresponding blade cylinder (28).

4. The MEMS chip testing apparatus according to claim 2 or 3, characterized in that: A vertically arranged contraction cylinder (29) is further mounted on the movable carrier plate (25), the lower end of the piston rod of the contraction cylinder (29) is connected with a horizontally arranged adsorption plate (30), a plurality of adsorption holes (301) opened on the lower surface of the adsorption plate (30) are communicated with a vacuum pump or a vacuum generator through pipelines, and when the piston rod of the contraction cylinder (29) is in an elongated state, the lower surface of the adsorption plate (30) is lower than the lower end surface of the suction nozzle (24).

5. The MEMS chip testing apparatus of claim 2, wherein: A visual support (221) is mounted on the Y-direction driving module (22) and located on one side of the Z-axis driving module (23), and a camera (222) and a light source (223) located directly below the camera (222) are mounted on the surface of the visual support (221) opposite to the driving module (22) and can move along the Y-direction.

6. The MEMS chip testing apparatus of claim 1, wherein: The hopper assembly further comprises a bottom base plate (33) and a plurality of partition plates (34) spacedly mounted on the upper surface of the bottom base plate (33), adjacent partition plates (34) and the bottom base plate (33) form a hopper area (35) for embedding the upper hopper (31) or the lower hopper (32), and the bottom surface of each upper hopper (31) or lower hopper (32) and the upper surface of the bottom base plate (33) in the corresponding hopper area (35) are slidably connected through at least one set of hopper slide rails (361) and hopper slide blocks (362).

7. The MEMS chip testing apparatus of claim 6, wherein: A baffle plate (37) is connected between the ends of the plurality of partition plates (34) close to the test assembly, and at least two sets of guide columns (371) and guide sleeves (372) are arranged between each upper hopper (31) or lower hopper (32) and the baffle plate (37).

8. The MEMS chip testing apparatus of claim 1, wherein: The first direction and the second direction are perpendicular to each other and the intersection point coincides with the center of gravity of the test assembly.

9. The MEMS chip testing apparatus of claim 1, wherein: A rotating motor and a wire sliding ring for driving the rotating part of each of the first rotating disc and the second rotating disc to rotate are mounted on the fixed part of each of the first rotating disc and the second rotating disc.

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