A humidity control method and system for a switchgear

Abstract

The present application relates to the field of automatic control, and in particular to a humidity control method and system for a switch cabinet, which obtains temperature values and humidity values at multiple time points inside the switch cabinet, and calculates the dew point temperature inside the switch cabinet based on the temperature value and humidity value of the high-temperature area at the current time. Considering that the temperature distribution inside the switch cabinet is not balanced, the present application focuses on whether the low-temperature area will produce condensed water. The temperature of the low-temperature area is mainly affected by the heat transfer effect of the high-temperature area and the environment, so the temperature range of the low-temperature area is inferred based on the pre-constructed temperature distribution model, the temperature value of the high-temperature area, and the environmental temperature. Through trend analysis and dew point temperature comparison, it is determined whether the temperature of the low-temperature area is below the dew point temperature. If there is a possibility, it is inferred that there is a risk of water vapor condensation. When there is a risk of water vapor condensation in the low-temperature area of the switch cabinet, the present application controls the dehumidification module to dehumidify the inside of the switch cabinet to avoid water vapor condensation.

Description

Technical Field

[0001] The present invention relates to the field of automatic control, and in particular to a humidity control method and system for a switch cabinet. Background Art

[0002] Switchgear is an electrical device used in power systems, primarily for distributing, controlling, and protecting electrical energy. It consists of various types of switchgear and other auxiliary equipment that work together to ensure the safe and reliable operation of the power system.

[0003] Switchgear installed outdoors is susceptible to condensation and high humidity in certain weather conditions. Therefore, existing technologies often add condensation modules to the exterior of the switchgear to condense moisture from the air before delivering dry air into the switchgear. However, continuous operation of the condensation modules incurs high operating costs. Therefore, existing technologies often set humidity thresholds to control the operation of the condensation modules. However, the temperature distribution within the switchgear is not uniform throughout, so this control method can also lead to the formation of condensation within the switchgear. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a humidity control method and system for a switch cabinet to solve the problems in the background technology.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A humidity control method for a switch cabinet according to the present invention comprises the following steps:

[0007] Obtaining internal temperature and humidity values ​​within the switchgear at multiple time points; and obtaining the ambient temperature value of the switchgear environment at the current time point and temperature prediction values ​​at multiple future time points, where the multiple time points include the current time point, and the internal temperature value is the temperature value of the high-temperature area of ​​the switchgear, which includes the area where the main busbar connection point is located, the area where the circuit breaker is located, the area where the contactor and other high-power electrical components are located, the transformer room, the cable inlet and outlet terminals, and the area where the heating device is located;

[0008] The dew point temperature inside the switch cabinet is calculated based on the internal temperature value and the internal humidity value at the current time point; and the temperature range of the low-temperature area in the switch cabinet is determined based on the internal temperature value at the current time point, the ambient temperature value at the current time point, and a pre-constructed temperature distribution model, wherein the temperature distribution model includes the temperature ranges of the low-temperature areas corresponding to multiple internal and external temperature units, each internal and external temperature unit includes an internal temperature value range and an ambient temperature value range, and the low-temperature areas include the top and the area close to the top plate, the bottom and part of the area close to the ground, the area where the vents are located, the leeward side or the shielded area, the area away from the main heat source, and the standby equipment or line area in a non-working state;

[0009] Determine the temperature difference change trend between the high-temperature area and the low-temperature area in the switchgear based on the internal temperature values ​​at multiple time points and the temperature prediction values ​​at multiple future time points, and determine the water vapor condensation risk based on the dew point temperature, the temperature range of the low-temperature area, and the temperature difference change trend;

[0010] When there is a risk of water vapor condensation in the switch cabinet, the dehumidification module in the switch cabinet is controlled to dehumidify the switch cabinet.

[0011] In one embodiment of the present application, controlling a dehumidification module in the switch cabinet to dehumidify the switch cabinet includes:

[0012] S1, controls the dehumidification module to dehumidify the air in the switch cabinet at rated power for a target time, and re-obtains the internal temperature and internal humidity values ​​after dehumidification;

[0013] S2, updating the dew point temperature based on the re-acquired internal temperature value and internal humidity value;

[0014] S3, based on the updated dew point temperature, the temperature range of the low-temperature area and the temperature difference change trend, determine whether there is a risk of water vapor condensation in the switch cabinet. If there is a risk of water vapor condensation, return to step S1 until there is no risk of water vapor condensation; if there is no risk of water vapor condensation, control the dehumidification module to stop dehumidification.

[0015] In one embodiment of the present application, the dew point temperature The mathematical representation of is:

[0016]

[0017]

[0018] Where, is the internal humidity value, is the internal temperature value, is an intermediate variable.

[0019] In one embodiment of the present application, the process of constructing the temperature distribution model includes:

[0020] Acquire a plurality of historical sample data, wherein the historical sample data includes an overall infrared thermal image of the switch cabinet, an ambient temperature value of an environment in which the switch cabinet is located, and an internal temperature value at a same time point;

[0021] Reading temperature values ​​of one or more low-temperature areas from the entire infrared thermal image of the switch cabinet;

[0022] Dividing the plurality of historical sample data based on the plurality of pre-divided internal temperature value ranges to obtain a plurality of data units; and dividing each data unit based on the plurality of pre-divided ambient temperature value ranges to obtain a plurality of internal and external temperature units; and density clustering the plurality of historical sample data in the plurality of internal and external temperature units based on the temperature values ​​of the low temperature region to obtain a plurality of data clusters;

[0023] The data cluster that meets the first target condition is used as the target cluster, wherein the first target condition includes: the number of historical sample data is greater than a preset number threshold, and the variance of the temperature values ​​of all low-temperature areas is less than a preset variance threshold;

[0024] Calculate the mean temperature value of the low temperature area of ​​all historical sample data in the target cluster and standard deviation , and based on the mean of the temperature values and standard deviation Temperature range for building multiple target clusters ;

[0025] A temperature distribution model is constructed based on the multiple internal and external temperature units and the temperature ranges of the low-temperature areas corresponding to the multiple internal and external temperature units.

[0026] In one embodiment of the present application, determining a temperature difference trend between a high-temperature area and a low-temperature area in a switch cabinet based on internal temperature values ​​at multiple time points and temperature prediction values ​​at multiple future time points includes:

[0027] Calculating a temperature trend within the switch cabinet based on internal temperature values ​​at multiple time points, and determining a temperature trend of the ambient temperature based on temperature prediction values ​​at multiple future time points, wherein the temperature trend includes an upward trend, a downward trend, and a trend with no unidirectional change;

[0028] When the temperature trend inside the switch cabinet and the ambient temperature is an upward trend or a downward trend, calculate the change amount;

[0029] When one of the second target conditions is met, it is predicted that the temperature difference between the high-temperature area and the low-temperature area in the switch cabinet has a trend of increasing, wherein the second target condition includes: the switch cabinet is on an upward trend and the ambient temperature is on a downward trend; the switch cabinet is on an upward trend and the ambient temperature has no unidirectional change trend; the switch cabinet is on an upward trend and the ambient temperature has an upward trend, and the change in the switch cabinet is greater than the change in the environment; the switch cabinet has no unidirectional change trend and the ambient temperature has a downward trend.

[0030] In one embodiment of the present application, the process of determining the temperature trend includes:

[0031] Mapping the temperature values ​​at multiple time points into a two-dimensional coordinate system, wherein the horizontal axis of the two-dimensional coordinate system is the time axis and the vertical axis of the two-dimensional coordinate system is the temperature axis, wherein the temperature values ​​are internal temperature values ​​or temperature prediction values;

[0032] Slide along the time axis based on the pre-built sliding window, and calculate the average temperature value of all time points in the sliding window at each sliding ,in, Indicates the sliding order;

[0033] When any two adjacent average values ​​satisfy: , it is determined that the temperature inside the switch cabinet is in a downward trend; when any two adjacent average values ​​meet: , it is determined that the temperature in the switch cabinet is on an upward trend; otherwise, it is determined that there is no unidirectional change trend.

[0034] In one embodiment of the present application, the water vapor condensation risk is determined based on the dew point temperature, the temperature range of the low temperature area, and the temperature difference change trend, including:

[0035] The lower limit of the temperature range of the low temperature region is With the dew point temperature Make a comparison;

[0036] exist When the water vapor condensation risk exists at the current time point, , , and when the temperature difference between the high-temperature area and the low-temperature area in the switch cabinet tends to increase, it is determined that the switch cabinet has a risk of water vapor condensation at a future time point, among which, is the set temperature difference threshold.

[0037] In one embodiment of the present application, the dehumidification module is a semiconductor cooling module, and a drainage hole is provided at the bottom of the dehumidification module, and the drainage hole discharges condensed water out of the switch cabinet through a pipe.

[0038] In one embodiment of the present application, it further includes:

[0039] When there is a risk of water vapor condensation in the switch cabinet, an alarm information is sent to the target object.

[0040] The application also provides a humidity control system of a switch cabinet, comprising:

[0041] An acquisition module is configured to acquire internal temperature values and internal humidity values of the switch cabinet at multiple time points, and to acquire an ambient temperature value of an environment in which the switch cabinet is located at a current time point and temperature prediction values of the environment at multiple future time points, wherein the multiple time points include the current time point, the internal temperature values are temperature values of high-temperature regions of the switch cabinet, and the high-temperature regions include regions where main bus connection points, circuit breakers, contactors and other high-power electrical components, transformers, cable in-out terminals and heating devices are located.

[0042] A temperature analysis module is configured to calculate a dew point temperature inside the switch cabinet based on the internal temperature values and the internal humidity values at the current time point, and to determine a temperature range of low-temperature regions in the switch cabinet based on the internal temperature values at the current time point, the ambient temperature value at the current time point and a pre-constructed temperature distribution model, wherein the temperature distribution model includes temperature ranges of low-temperature regions corresponding to multiple internal-external temperature units, each internal-external temperature unit includes an internal temperature value range and an ambient temperature value range, and the low-temperature regions include regions at the top and near the top plate, regions at the bottom and near the ground, regions where ventilation openings are located, regions on leeward sides or sheltered regions, regions far away from main heat sources, and regions of standby devices or lines in non-working states.

[0043] A risk determination module is configured to determine temperature difference change trends of the high-temperature regions and the low-temperature regions in the switch cabinet based on the internal temperature values at the multiple time points and the temperature prediction values at the multiple future time points, and to determine a water vapor condensation risk based on the dew point temperature, the temperature range of the low-temperature regions and the temperature difference change trends.

[0044] A dehumidification control module is configured to control a dehumidification module in the switch cabinet to dehumidify the switch cabinet when there is a risk of water vapor condensation in the switch cabinet.

[0045] The beneficial effects of the present invention are as follows: a humidity control method and system for a switchgear cabinet obtains temperature and humidity values ​​within the switchgear cabinet at multiple time points and calculates the dew point temperature within the switchgear cabinet based on the temperature and humidity values ​​of the current high-temperature zone. Considering the uneven temperature distribution within the switchgear cabinet, the present application focuses on whether condensation will occur in the low-temperature zone. The temperature of the low-temperature zone is primarily affected by the heat transfer effect between the high-temperature zone and the surrounding environment. Therefore, the temperature range of the low-temperature zone is estimated based on a pre-established temperature distribution model, the temperature values ​​of the high-temperature zone, and the ambient temperature. Trend analysis and dew point temperature comparison are then used to determine whether the temperature in the low-temperature zone is likely to fall below the dew point. If so, a risk of condensation is estimated. When there is a risk of condensation in the low-temperature zone of the switchgear cabinet, the present application controls the dehumidification module to dehumidify the switchgear cabinet to prevent condensation. This application fully considers the uneven temperature distribution within the switchgear cabinet, determines the risk of condensation in the low-temperature zone, and then controls the dehumidification module to dehumidify the air. Compared to existing threshold control methods, this method effectively prevents condensation in the low-temperature zone while reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0047] Figure 1 This is a schematic diagram of the switch cabinet partitions in one embodiment of the present application;

[0048] Figure 2 Schematic diagram of the structure of a humidity control system shown in one embodiment of the present application;

[0049] Figure 3 This is a flow chart of a humidity control method for a switch cabinet shown in one embodiment of the present application;

[0050] Figure 4 This is a structural diagram of a humidity control system for a switch cabinet shown in one embodiment of the present application. DETAILED DESCRIPTION

[0051] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0052] It should be noted that the drawings provided in the following embodiments only schematically illustrate the basic concept of the present application, and only the layers related to the present application are shown in the drawings, rather than being drawn according to the number, shape and size of the layers in actual implementation. The actual implementation of each layer pattern, quantity and proportion can be a random change, and the layer layout pattern can also be more complex.

[0053] In the following description, a large number of details are discussed to provide a more thorough explanation of the embodiments of the present application, however, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details.

[0054] Figure 1 is a schematic diagram of the switch cabinet partition in an embodiment of the present application, as Figure 1 indicated, the switch cabinet for humidity control in the present application is mainly an outdoor switch cabinet. Under outdoor conditions, the temperature distribution inside and outside the switch cabinet is not balanced. The indoor switch cabinet has a more balanced internal temperature due to the air conditioning system. The temperature distribution of the outdoor switch cabinet will be affected by external weather conditions, and also depends on the heat generation of internal electrical components and the heat dissipation design. The following is a high temperature area and a low temperature area illustrated by the present application:

[0055] (1) High temperature area

[0056] Main bus connection point: Even in cold weather, this is a high temperature area due to the large amount of heat generated by the large current passing through.

[0057] Near circuit breakers, contactors and other high-power electrical components: These components will have certain energy loss converted into heat during operation, especially in the case of carrying large current or frequent action, the temperature around them will still remain relatively high.

[0058] Transformer room: If the switch cabinet contains a small transformer, the heat generated during its operation is sufficient to make this area a high temperature area.

[0059] Cable entry and exit terminal: Especially when the cable carries a large current, the joint part may become warm due to resistance heating.

[0060] Near heating devices: In order to prevent the influence of low temperature on electrical performance, some switch cabinets are equipped with heaters or temperature control systems. The area near these heating devices will maintain a higher temperature.

[0061] (2) Low temperature area

[0062] Top and area close to the top plate: In winter, especially at night or on cloudy days, the top may become very cold due to the sinking of cold air and the lack of direct sunlight.

[0063] Bottom and near the ground: Although the bottom is generally cooler because cold air is heavier and tends to sink, this effect is more pronounced in cold weather, especially if the ground is also cold.

[0064] Near vents: If you have a good ventilation system, the vents will bring in cool air from outside, making these places even cooler.

[0065] Leeward or sheltered areas: Although these areas are not affected by direct wind chill, they can become quite cold if they lack adequate heat sources (such as no electrical equipment or heating).

[0066] Locations away from major heat sources: For example, areas where low-power components such as auxiliary control circuits and signal devices are located may be very low in cold weather due to their low heat generation and distance from major heat sources.

[0067] Standby equipment or lines in non-operating state: Non-operating equipment does not generate additional heat, so in cold environments, the temperature of these parts may be close to or even lower than the external ambient temperature.

[0068] Figure 2 This is a schematic diagram of the structure of the humidity control system shown in one embodiment of the present application. Figure 2 As shown, this application uses a cloud-based + distributed controller approach for humidity control. Each switch cabinet has a built-in distributed controller (such as a single-chip microcontroller or FPGA programmable controller), and each distributed controller is connected to the cloud controller via a network. Basic data collection, big data model construction, and control command issuance in this application are all performed on the cloud server.

[0069] Furthermore, this application utilizes semiconductor refrigeration technology within the switchgear's condensation module, creating localized condensation conditions to lower the relative humidity within the cabinet and directly drain any condensed moisture. When the distributed control receives control instructions from the cloud controller, the activation mechanism draws the humid air from the switchgear into the dehumidification duct via a fan. The moisture in the air then condenses into water after passing through the semiconductor refrigeration mechanism, which is then discharged from the cabinet through a water pipe.

[0070] By applying a DC power supply to the semiconductor cooling device, the Peltier effect causes the cold end of the semiconductor to absorb heat from the outside world, gradually lowering the ambient temperature, while the hot end releases heat to the hot end. This repeated cooling action, driven by a fan, successfully drains condensed water out of the switchgear, ensuring that the air humidity within the enclosed space reaches the set value.

[0071] Figure 3 This is a flow chart of a humidity control method for a switch cabinet shown in one embodiment of the present application. Figure 3 As shown, a humidity control method for a switch cabinet according to this embodiment may include the following steps:

[0072] S310, obtaining internal temperature values ​​and internal humidity values ​​within the switch cabinet at multiple time points; and obtaining the ambient temperature value of the environment in which the switch cabinet is located at the current time point and temperature prediction values ​​at multiple future time points, wherein the multiple time points include the current time point, and the internal temperature value is the temperature value of the high-temperature area of ​​the switch cabinet;

[0073] Existing switchgear monitoring systems include temperature sensors installed in high-temperature areas, such as temperature sensors installed in busbars, wire bars, etc. This application only uses existing temperature and humidity sensors to collect internal temperature and humidity values ​​in high-temperature areas, thereby saving costs. In addition, when air flows inside the switchgear, it is more likely that air in the high-temperature area will produce condensed water when it encounters a low-temperature area, especially when the temperature in the low-temperature area is lower than the dew point temperature. Air saturated with water vapor at the dew point temperature will condense water when it encounters a low temperature. Therefore, it is safer to use the temperature and humidity of the high-temperature area to calculate the dew point temperature.

[0074] In addition, the environment in which the switchgear is located will also affect the temperature of the low-temperature area, thereby determining the temperature of the low-temperature area. Therefore, this application obtains the current temperature of the switchgear environment and the predicted temperature at multiple future time points by setting a thermometer or checking the temperature measurement value of a weather station (depending on whether there is a heat source that affects the temperature nearby; if so, a thermometer is required).

[0075] S320, calculating the dew point temperature inside the switchgear based on the internal temperature value and the internal humidity value at the current time point; and determining the temperature range of the low-temperature area in the switchgear based on the internal temperature value and the ambient temperature value at the current time point and a pre-built temperature distribution model, wherein the temperature distribution model includes the temperature ranges of the low-temperature area corresponding to a plurality of internal and external temperature units, each internal and external temperature unit including an internal temperature value range and an ambient temperature value range;

[0076] Among them, the dew point temperature The mathematical representation of is:

[0077]

[0078]

[0079] Where, is the internal humidity value, is the internal temperature value, is an intermediate variable.

[0080] The application determines the temperature range of the low-temperature area in the switch cabinet based on a pre-constructed temperature distribution model, thereby determining whether the temperature of the low-temperature area in the switch cabinet will be lower than the dew point temperature. If it is lower, the air cooling will not be able to accommodate the current amount of water vapor, thereby condensing water droplets. Therefore, due to the cost, wiring difficulty and electromagnetic interference, it is not possible to install temperature sensors in all low-temperature areas of the switch cabinet to directly collect temperature values. The application determines the temperature value of the low-temperature area in a big data statistical manner.

[0081] Because different switch cabinet models have different internal structures, the distribution of high-temperature areas and low-temperature areas is also different. Therefore, the temperature distribution model in the application is only for the same model of switch cabinet. In addition, multiple temperature distribution models can be constructed for multiple models of switch cabinets, and the principles are the same.

[0082] In this embodiment, the temperature distribution model based on big data is constructed in the following manner, specifically including:

[0083] (1) Obtain a plurality of historical sample data, wherein the historical sample data includes an infrared thermal image of the entire switch cabinet at the same time point, an ambient temperature value of the environment in which the switch cabinet is located, and an internal temperature value;

[0084] (2) Read the temperature value of one or more low-temperature areas from the infrared thermal image of the entire switch cabinet;

[0085] In the basic data collection stage, the staff or fixed infrared camera needs to take infrared thermal images of the entire switch cabinet at regular intervals, thereby obtaining the overall temperature distribution of the switch cabinet. The specific process includes:

[0086] Obtain infrared thermal images: Use an infrared thermal imager to scan the target area (such as a switch cabinet) to ensure that all points of interest are captured. Save high-quality infrared images for subsequent analysis.

[0087] Import images into analysis software: Import the captured infrared images into professional analysis software provided by the thermal imager manufacturer, such as FLIR Tools, Testo IRSoft, etc. Confirm that the timestamp, environmental conditions (such as humidity, wind speed, etc.) and other relevant parameters are correctly recorded, as these information is very important for accurate interpretation of the results.

[0088] Calibration and settings: If necessary, adjust the emissivity, background temperature and other parameters according to the actual situation to ensure measurement accuracy. Different materials have different emissivities, and selecting the correct value can improve accuracy.

[0089] Select a point or area of ​​interest: In the software interface, you can mark the specific location (point, line, or surface) you want to measure by clicking or dragging a box with your mouse. For multiple points, you can add markers one by one and give each marker a name or number for easy identification.

[0090] Read Temperature Data: The software automatically calculates and displays the temperature at the selected point. You can view the temperature at a single point or obtain statistics such as the average, maximum, and minimum temperatures for the entire area. Record the temperature data for further analysis or report generation.

[0091] Here is an example:

[0092] Assume that this application is to analyze the temperature distribution of different electrical components inside an outdoor switchgear:

[0093] Preparation stage: A FLIR T-series thermal imaging camera was used to fully scan the switch cabinet and obtain clear infrared images.

[0094] Import and setup: Import the image into FLIR Tools and confirm that all environmental parameters are set correctly, especially the emissivity of the metal surface is set correctly (for example, around 0.9).

[0095] Select the monitoring points: Decide to monitor several key locations: main busbar connection points, circuit breakers, transformer room, and bottom vents.

[0096] Markings were placed at these four locations and named "Busbar Connection", "Circuit Breaker", "Transformer" and "Ventilation" respectively.

[0097] Reading temperature: After software processing, we get the following temperature data:

[0098] High temperature area: The temperature at the busbar connection is about 55°C; the temperature near the circuit breaker is about 48°C; the temperature inside the transformer room is about 50°C;

[0099] Low temperature area: The temperature at the bottom vent is close to the external ambient temperature, approximately 10°C.

[0100] It is worth noting that the temperature of the internal high-temperature area can be determined using either the reading from the infrared thermal image or the reading from the internal temperature and humidity sensor. If the two differ significantly, the sensor reading shall prevail.

[0101] (3) dividing the plurality of historical sample data based on the plurality of pre-divided internal temperature value ranges to obtain a plurality of data units; dividing each data unit based on the plurality of pre-divided ambient temperature value ranges to obtain a plurality of internal and external temperature units; and density clustering the plurality of historical sample data in the plurality of internal and external temperature units based on the temperature values ​​of the low temperature region to obtain a plurality of data clusters;

[0102] After obtaining a large amount of basic data through step (2), the historical sample data can be divided. First, the sample data is divided into multiple internal and external temperature units based on multiple internal temperature value ranges and ambient temperature value ranges. Then, the historical sample data within the multiple internal and external temperature units are density clustered. Since the temperature in the low temperature area is mainly affected by the internal temperature and ambient temperature, the multiple data clusters obtained are generally one main data cluster and other abnormal data clusters with less data.

[0103] (4) taking the data cluster that meets the first target condition as the target cluster, wherein the first target condition includes: the number of historical sample data is greater than a preset number threshold, and the variance of the temperature values ​​of all low-temperature areas is less than a preset variance threshold;

[0104] In order to retain the main data clusters and filter out interference data, this application sets two screening conditions, namely, the data volume is greater than the quantity threshold, and the variance is less than the preset variance threshold. In this way, the main data clusters with a large number and a relatively dense distribution are screened out as reference data sets. For example:

[0105] Internal temperature: 50°C-55°C; ambient temperature 0°C-5°C; reference data set {12.5°C, 10.2°C, 11.4°C....}.

[0106] (5) Calculate the mean temperature value of the low temperature area of ​​all historical sample data in the target cluster and standard deviation , and based on the mean of the temperature values and standard deviation Temperature range for building multiple target clusters ;

[0107] In order to convert the discrete reference data set into a continuous range, this application uses the 3 times standard deviation principle to construct the temperature range of multiple target clusters. In a normal distribution (also known as a Gaussian distribution or bell curve), approximately 99.73% of the data points will fall within three standard deviations of the mean. This is based on the "68-95-99.7 rule" or "rule of thumb" in statistics.

[0108] (6) Construct a temperature distribution model based on the multiple internal and external temperature units and the temperature ranges of the low-temperature areas corresponding to the multiple internal and external temperature units.

[0109] After obtaining the temperature distribution model, the temperature range of all low-temperature areas can be roughly obtained based on the current internal temperature of the switch cabinet and the ambient temperature.

[0110] S330, determining a temperature difference variation trend between a high-temperature area and a low-temperature area in the switchgear based on internal temperature values ​​at multiple time points and temperature prediction values ​​at multiple future time points, and performing a water vapor condensation risk assessment based on the dew point temperature, the temperature range of the low-temperature area, and the temperature difference variation trend;

[0111] The risk assessment logic is that if the temperature in the low-temperature area at the current time is likely to be lower than the dew point, or if the temperature in the low-temperature area at the current time is trending lower than the dew point, then a condensation risk is determined. At this point, the cloud server issues a control command to control the dehumidification module.

[0112] Therefore, before making a judgment, it is necessary to analyze the temperature difference trend between the high-temperature and low-temperature areas in the switchgear. When the external conditions are cold, if the temperature difference becomes larger, the low-temperature area will be closer to the external temperature, and the temperature in the low-temperature area will drop further, more likely to drop to the dew point temperature, and the risk of condensation water will increase.

[0113] The process of determining the temperature difference trend includes:

[0114] S3301, calculating a temperature trend inside the switchgear based on internal temperature values ​​at multiple time points, and determining a temperature trend of the ambient temperature based on temperature prediction values ​​at multiple future time points, wherein the temperature trend includes an upward trend, a downward trend, and a trend with no unidirectional change;

[0115] Through data analysis, trend analysis is performed on the internal temperature values ​​at multiple existing time points, and trend analysis is performed on the temperature forecast values ​​at multiple future time points. The analysis process includes:

[0116] (1) mapping the temperature values ​​at multiple time points into a two-dimensional coordinate system, wherein the horizontal axis of the two-dimensional coordinate system is the time axis, and the vertical axis of the two-dimensional coordinate system is the temperature axis, wherein the temperature values ​​are internal temperature values ​​or temperature prediction values;

[0117] (2) Slide along the time axis based on the pre-built sliding window, and calculate the average temperature value of all time points in the sliding window at each sliding. ,in, Indicates the sliding order;

[0118] (3) When any two adjacent average values ​​satisfy: , it is determined that the temperature inside the switch cabinet is in a downward trend; when any two adjacent average values ​​meet: , it is determined that the temperature in the switch cabinet is on an upward trend; otherwise, it is determined that there is no unidirectional change trend.

[0119] In order to ignore the impact of individual data fluctuations on trend analysis, this application uses a sliding window to analyze trends. Data is processed and analyzed by moving a fixed-size time window or data point number window on a continuous data stream. The sliding window can effectively smooth out short-term random fluctuations, making long-term trends more obvious. In addition, compared to simply taking a period of historical data as a reference, the sliding window allows for a faster response to new data points. Because each time new data arrives, the window slides forward, discarding the oldest data point and adding the latest data point, which helps reduce lag in the analysis results.

[0120] S3302, when the temperature trend inside the switch cabinet and the ambient temperature is an upward trend or a downward trend, calculate the change amount;

[0121] In many cases, a drop in ambient temperature will also cause the temperature inside the switchgear to drop, but the rate of drop will be slower due to the operation of the electrical components inside the switchgear. Therefore, if the ambient temperature and the switchgear temperature change trends are the same, it is still necessary to calculate the change to determine whether there is a larger temperature difference.

[0122] S3303: When one of the second target conditions is met, it is predicted that the temperature difference between the high temperature area and the low temperature area in the switch cabinet has a tendency to increase. The second target condition includes the following four situations:

[0123] (1) The switch cabinet temperature is rising and the ambient temperature is falling. For example, if the load on the components in the switch cabinet increases but the ambient temperature continues to drop, the temperature difference will gradually increase.

[0124] (2) The switch cabinet temperature is rising, and the ambient temperature has no unidirectional change trend; for example, if the load of the components in the switch cabinet increases, but the ambient temperature remains stable, the temperature difference will gradually increase;

[0125] (3) The switch cabinet temperature and the ambient temperature are both on an upward trend, and the change in the switch cabinet is greater than the change in the environment. For example, a drop in ambient temperature will also cause the temperature inside the switch cabinet to drop, but because the electrical components in the switch cabinet are working, the rate of drop will be slower, which will cause the temperature difference to gradually increase.

[0126] (4) The switch cabinet has no unidirectional change trend, and the ambient temperature is on a downward trend. For example, the switch cabinet maintains a stable internal temperature due to the continuous operation of the components. However, the external ambient temperature gradually decreases, which will cause the temperature difference to gradually increase.

[0127] In addition, there are many situations where the temperature difference gradually decreases and the temperature difference remains constant. This application only needs to focus on the situation that causes the temperature difference between the low temperature area and the high temperature area to gradually increase, so other situations will not be expanded here.

[0128] In this application, the risk assessment process based on the above temperature difference changes is as follows:

[0129] The lower limit of the temperature range of the low temperature region is With the dew point temperature For comparison, the lower limit of the temperature range in the low temperature area is The lowest possible temperature, since the main purpose of this application is to prevent the occurrence of water vapor condensation, and to set the lower limit of the temperature range in the low temperature area As a comparison benchmark.

[0130] If the following conditions are met at the current time: the lowest temperature that may occur in the low temperature area is lower than the current dew point temperature, that is, If the air in the high-temperature area encounters the low-temperature area, the air will be cooled, resulting in the air being oversaturated with water, and the water vapor will condense into water droplets. Therefore, it is determined that there is a risk of water vapor condensation at the current time point;

[0131] If the current time point does not meet the above conditions, but the lowest temperature that may appear in the low temperature area at the current moment is close to the dew point temperature, and the temperature difference trend is gradually increasing, that is, when the above conditions are met, , , and the temperature difference between the high-temperature area and the low-temperature area in the switch cabinet tends to increase; the low-temperature area is more susceptible to the external temperature, so the larger the temperature difference, the temperature of the low-temperature area will gradually approach and fall below the dew point temperature, which will lead to condensation of water vapor. Therefore, in this case, it is determined that the switch cabinet will have the risk of condensation of water vapor at a future time point. is the set temperature difference threshold.

[0132] S340: When there is a risk of water vapor condensation in the switch cabinet, control a dehumidification module in the switch cabinet to dehumidify the switch cabinet.

[0133] When a risk determination is obtained, an alarm message is sent to relevant personnel and can also be recorded in the cloud. In addition, this application uses the following process for dehumidification to save energy consumption, including:

[0134] S1, controls the dehumidification module to dehumidify the air in the switch cabinet at rated power for a target time, and re-obtains the internal temperature and internal humidity values ​​after dehumidification;

[0135] The target duration can be 5 minutes or 10 minutes, which can be set according to requirements. After dehumidification, the temperature and humidity of the high-temperature area are reacquired.

[0136] S2, updating the dew point temperature based on the reacquired internal temperature value and internal humidity value; the calculation formula can refer to the foregoing description.

[0137] S3, judging whether there is a water vapor condensation risk in the switch cabinet based on the updated dew point temperature, the temperature range of the low-temperature area, and the temperature difference change trend, if there is a water vapor condensation risk, returning to step S1 until there is no water vapor condensation risk, and if there is no water vapor condensation risk, controlling the dehumidification module to stop dehumidification.

[0138] If there is still a water vapor condensation risk in combination with the updated dew point temperature, the next dehumidification cycle is entered, and the process is cycled to ensure that there is no water vapor condensation risk in the switch cabinet. This process needs to be combined with good sealing of the switch cabinet. If the sealing is poor, the temperature of the low-temperature area can be increased by setting a heating module, and the risk judgment is performed again.

[0139] After dehumidification treatment, if there is no water vapor condensation risk, the dehumidification module is immediately stopped to save energy. The bottom of the dehumidification module is provided with a drain hole, and the drain hole is connected to the switch cabinet through a pipeline to drain the condensed water.

[0140] The humidity control method of the switch cabinet provided by the application acquires temperature values and humidity values at multiple time points in the switch cabinet, and calculates the dew point temperature in the switch cabinet based on the temperature value and humidity value of the high-temperature area at the current time. Considering that the temperature distribution in the switch cabinet is not balanced, the application focuses on whether the low-temperature area will produce condensed water. The temperature of the low-temperature area is mainly affected by the heat transfer effect of the high-temperature area and the environment, so the temperature range of the low-temperature area is inferred based on the pre-constructed temperature distribution model, the temperature value of the high-temperature area, and the environmental temperature. Through trend analysis and dew point temperature comparison, it is determined whether the temperature of the low-temperature area is below the dew point temperature. If there is a possibility, it is inferred that there is a water vapor condensation risk. When there is a water vapor condensation risk in the low-temperature area of the switch cabinet, the application controls the dehumidification module to dehumidify the switch cabinet to avoid water vapor condensation. The application fully considers the characteristics of the uneven temperature distribution in the switch cabinet, determines the water vapor condensation risk in the low-temperature area of the switch cabinet, and then controls the dehumidification module to dehumidify the air. Compared with the existing threshold control, the energy consumption is reduced while the water vapor condensation in the low-temperature area is effectively avoided.

[0141] As shown in Figure 4 The application also provides a humidity control system of a switch cabinet, which comprises:

[0142] An acquisition module is configured to obtain internal temperature and humidity values ​​within the switchgear at multiple time points; and obtain the ambient temperature value of the environment in which the switchgear is located at the current time point and temperature prediction values ​​at multiple future time points, wherein the multiple time points include the current time point, and the internal temperature value is the temperature value of the high-temperature area of ​​the switchgear, which includes the area where the main busbar connection point is located, the area where the circuit breaker is located, the area where the contactor and other high-power electrical components are located, the transformer room, the cable inlet and outlet terminals, and the area where the heating device is located;

[0143] A temperature analysis module is used to calculate the dew point temperature inside the switch cabinet based on the internal temperature value and internal humidity value at the current time point; and determine the temperature range of the low-temperature area in the switch cabinet based on the internal temperature value and the ambient temperature value at the current time point and a pre-constructed temperature distribution model, wherein the temperature distribution model includes the temperature ranges of the low-temperature areas corresponding to multiple internal and external temperature units, each internal and external temperature unit includes an internal temperature value range and an ambient temperature value range, and the low-temperature areas include the top and the area near the top plate, the bottom and part of the area close to the ground, the area where the vents are located, the leeward side or the shielded area, the area away from the main heat source, and the standby equipment or line area in a non-working state;

[0144] a risk determination module, configured to determine a temperature difference variation trend between a high-temperature area and a low-temperature area within the switchgear based on internal temperature values ​​at multiple time points and temperature prediction values ​​at multiple future time points, and to perform a water vapor condensation risk determination based on the dew point temperature, the temperature range of the low-temperature area, and the temperature difference variation trend;

[0145] The dehumidification control module is used to control the dehumidification module in the switch cabinet to dehumidify the switch cabinet when there is a risk of water vapor condensation in the switch cabinet.

[0146] The humidity control system of the switch cabinet provided by the application obtains temperature values and humidity values at multiple time points in the switch cabinet, and calculates the dew point temperature in the switch cabinet based on the temperature value and the humidity value of the high-temperature area at the current time. Considering the uneven temperature distribution in the switch cabinet, the application focuses on whether the low-temperature area will produce condensed water. The temperature of the low-temperature area is mainly affected by the heat transfer effect of the high-temperature area and the environment, so the temperature range of the low-temperature area is inferred based on the pre-constructed temperature distribution model, the temperature value of the high-temperature area and the environmental temperature. Through trend analysis and dew point temperature comparison, it is determined whether the temperature of the low-temperature area is lower than the dew point temperature. If there is a possibility, it is inferred that there is a risk of water vapor condensation. When the application determines that there is a risk of water vapor condensation in the low-temperature area of the switch cabinet, the dehumidification module is controlled to dehumidify the switch cabinet to avoid water vapor condensation. The application fully considers the characteristics of the uneven temperature distribution in the switch cabinet, determines the risk of water vapor condensation in the low-temperature area of the switch cabinet, and then controls the dehumidification module to dehumidify the air. Compared with the existing threshold control, it can effectively avoid water vapor condensation in the low-temperature area while reducing energy consumption.

[0147] The embodiment also provides an electronic terminal, comprising a processor and a memory.

[0148] The memory is configured to store a computer program, and the processor is configured to execute the computer program stored in the memory, so that the terminal executes any method in the embodiment.

[0149] The computer readable storage medium in the embodiment can be understood by those skilled in the art that all or part of the steps of the above-mentioned method embodiments can be completed by a computer program related hardware. The foregoing computer program can be stored in a computer readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the foregoing storage medium includes ROM, RAM, magnetic disk or optical disk and various storage program codes.

[0150] The electronic terminal provided by the embodiment includes a processor, a memory, a transceiver and a communication interface. The memory and the communication interface are connected with the processor and the transceiver and complete communication between each other. The memory is configured to store a computer program, the communication interface is configured to communicate, and the processor and the transceiver are configured to run the computer program, so that the electronic terminal executes each step of the method.

[0151] In the embodiment, the memory can include random access memory (RAM) and can also include non-volatile memory, such as at least one disk memory.

[0152] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.

[0153] In the above embodiments, although the present invention has been described in conjunction with specific embodiments of the present invention, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art based on the foregoing description. The embodiments of the present invention are intended to cover all such replacements, modifications and variations that fall within the broad scope of the appended claims.

[0154] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A humidity control method for a switch cabinet, characterized in that: Including steps: Obtaining internal temperature and humidity values ​​within the switchgear at multiple time points; and obtaining the ambient temperature value of the switchgear environment at the current time point and temperature prediction values ​​at multiple future time points, where the multiple time points include the current time point, and the internal temperature value is the temperature value of the high-temperature area of ​​the switchgear, which includes the area where the main busbar connection point is located, the area where the circuit breaker is located, the area where the contactor and other high-power electrical components are located, the transformer room, the cable inlet and outlet terminals, and the area where the heating device is located; The dew point temperature inside the switch cabinet is calculated based on the internal temperature value and the internal humidity value at the current time point; and the temperature range of the low-temperature area in the switch cabinet is determined based on the internal temperature value at the current time point, the ambient temperature value at the current time point and the pre-constructed temperature distribution model, wherein the temperature distribution model includes the temperature range of the low-temperature area corresponding to multiple internal and external temperature units, each internal and external temperature unit contains an internal temperature value range and an ambient temperature value range, and the low-temperature area includes the top and the area close to the top plate, the bottom and part of the area close to the ground, the area where the vents are located, the leeward side or the shielded area, the area away from the main heat source, and the spare equipment or line area in the non-working state; the construction process of the temperature distribution model includes: obtaining multiple historical sample data, wherein the historical sample data includes the overall infrared thermal image of the switch cabinet at the same time point the ambient temperature value and internal temperature value of the environment in which the switch cabinet is located; reading the temperature value of one or more low-temperature areas from the overall infrared thermal image of the switch cabinet; dividing the multiple historical sample data based on the multiple pre-divided internal temperature value ranges to obtain multiple data units; and dividing each data unit based on the multiple pre-divided ambient temperature value ranges to obtain multiple internal and external temperature units; and density clustering the multiple historical sample data in the multiple internal and external temperature units based on the temperature value of the low-temperature area to obtain multiple data clusters; taking the data cluster that meets the first target condition as the target cluster, wherein the first target condition includes: the number of historical sample data is greater than a preset number threshold, and the variance of the temperature values ​​of all low-temperature areas is less than a preset variance threshold; calculating the mean of the temperature values ​​of the low-temperature areas of all historical sample data in the target cluster and standard deviation , and based on the mean of the temperature values and standard deviation Temperature range for building multiple target clusters ; Constructing a temperature distribution model based on multiple internal and external temperature units and the temperature ranges of low-temperature areas corresponding to the multiple internal and external temperature units; Determine the temperature difference change trend between the high-temperature area and the low-temperature area in the switch cabinet based on the internal temperature values ​​at multiple time points and the temperature prediction values ​​at multiple future time points, and perform water vapor condensation risk judgment based on the dew point temperature, the temperature range of the low-temperature area and the temperature difference change trend; Determine the temperature difference change trend between the high-temperature area and the low-temperature area in the switch cabinet based on the internal temperature values ​​at multiple time points and the temperature prediction values ​​at multiple future time points, including: calculating the temperature trend in the switch cabinet based on the internal temperature values ​​at multiple time points, and determining the temperature trend of the ambient temperature based on the temperature prediction values ​​at multiple future time points, wherein the temperature trend includes an upward trend, a downward trend and a non-unidirectional change trend; when the temperature trend in the switch cabinet and the ambient temperature is an upward trend When the temperature in the switch cabinet is rising or decreasing, the temperature change is calculated; when one of the second target conditions is met, it is predicted that the temperature difference between the high temperature area and the low temperature area in the switch cabinet has a larger trend, wherein the second target condition includes: the temperature in the switch cabinet is rising and the ambient temperature is decreasing; the temperature in the switch cabinet is rising and the ambient temperature has no unidirectional change trend; the temperature in the switch cabinet is rising and the ambient temperature is rising, and the change in the temperature in the switch cabinet is greater than the change in the ambient temperature; the temperature in the switch cabinet has no unidirectional change trend and the ambient temperature has a decreasing trend; based on the dew point temperature, the temperature range of the low temperature area and the temperature difference change trend, the water vapor condensation risk is determined, including: setting the lower limit value of the temperature range of the low temperature area With the dew point temperature to compare; When the water vapor condensation risk exists at the current time point, , , and when the temperature difference between the high-temperature area and the low-temperature area in the switch cabinet tends to increase, it is determined that the switch cabinet has a risk of water vapor condensation at a future time point, among which, is the set temperature difference threshold; When there is a risk of water vapor condensation in the switch cabinet, the dehumidification module in the switch cabinet is controlled to dehumidify the switch cabinet.

2. A humidity control method for a switch cabinet according to claim 1, characterized in that: Controlling the dehumidification module in the switch cabinet to dehumidify the switch cabinet includes: S1, controls the dehumidification module to dehumidify the air in the switch cabinet at rated power for a target time, and re-obtains the internal temperature and internal humidity values ​​after dehumidification; S2, updating the dew point temperature based on the re-acquired internal temperature value and internal humidity value; S3, based on the updated dew point temperature, the temperature range of the low-temperature area and the temperature difference change trend, determine whether there is a risk of water vapor condensation in the switch cabinet. If there is a risk of water vapor condensation, return to step S1 until there is no risk of water vapor condensation; if there is no risk of water vapor condensation, control the dehumidification module to stop dehumidification.

3. The humidity control method for a switch cabinet according to claim 2, characterized in that: The dew point temperature The mathematical representation of is: Where, is the internal humidity value, is the internal temperature value, is an intermediate variable.

4. The humidity control method for a switch cabinet according to claim 1, characterized in that: The process of determining the temperature trend includes: Mapping the temperature values ​​at multiple time points into a two-dimensional coordinate system, wherein the horizontal axis of the two-dimensional coordinate system is the time axis and the vertical axis of the two-dimensional coordinate system is the temperature axis, wherein the temperature values ​​are internal temperature values ​​or temperature prediction values; Slide along the time axis based on the pre-built sliding window, and calculate the average temperature value of all time points in the sliding window at each sliding ,in, Indicates the sliding order; When any two adjacent average values ​​satisfy: , it is determined that the temperature inside the switch cabinet is in a downward trend; when any two adjacent average values ​​meet: , it is determined that the temperature in the switch cabinet is on an upward trend; otherwise, it is determined that there is no unidirectional change trend.

5. The humidity control method for a switch cabinet according to claim 2, characterized in that: The dehumidification module is a semiconductor cooling module. A drainage hole is provided at the bottom of the dehumidification module. The drainage hole discharges condensed water out of the switch cabinet through a pipe.

6. The humidity control method for a switch cabinet according to claim 1, characterized in that: Also includes: When there is a risk of condensation in the switch cabinet, an alarm message is sent to the target object.

7. A humidity control system for a switch cabinet, characterized in that: include: An acquisition module is used to obtain the internal temperature and humidity values ​​of the switch cabinet at multiple time points; and obtaining the ambient temperature value of the environment in which the switchgear is located at the current time point and the temperature prediction values ​​at multiple future time points, wherein the multiple time points include the current time point, and the internal temperature value is the temperature value of the high-temperature area of ​​the switchgear, and the high-temperature area includes the area where the main busbar connection point is located, the area where the circuit breaker is located, the area where the contactor and other high-power electrical components are located, the transformer room, the cable inlet and outlet terminals, and the area where the heating device is located; The temperature analysis module is used to calculate the dew point temperature inside the switch cabinet based on the internal temperature value and internal humidity value at the current time point; and determine the temperature range of the low-temperature area in the switch cabinet based on the internal temperature value at the current time point and the ambient temperature value at the current time point and a pre-built temperature distribution model, wherein the temperature distribution model includes the temperature ranges of the low-temperature areas corresponding to multiple internal and external temperature units, each internal and external temperature unit includes an internal temperature value range and an ambient temperature value range, and the low-temperature areas include the top and the area close to the top plate, the bottom and part of the area close to the ground, the area where the vents are located, the leeward side or the shielded area, the area away from the main heat source, and the spare equipment or line area in the non-working state; the construction process of the temperature distribution model includes: obtaining multiple historical sample data, wherein the historical sample data includes the overall red and black areas of the switch cabinet at the same time point, External thermal image, ambient temperature value of the environment in which the switch cabinet is located, and internal temperature value; reading the temperature value of one or more low-temperature areas from the overall infrared thermal image of the switch cabinet; dividing multiple historical sample data based on multiple pre-divided internal temperature value ranges to obtain multiple data units; and dividing each data unit based on multiple pre-divided ambient temperature value ranges to obtain multiple internal and external temperature units; and density clustering multiple historical sample data in multiple internal and external temperature units based on the temperature value of the low-temperature area to obtain multiple data clusters; taking the data cluster that meets the first target condition as the target cluster, wherein the first target condition includes: the number of historical sample data is greater than a preset number threshold, and the variance of the temperature values ​​of all low-temperature areas is less than a preset variance threshold; calculating the mean of the temperature values ​​of the low-temperature areas of all historical sample data in the target cluster and standard deviation , and based on the mean of the temperature values and standard deviation Temperature range for building multiple target clusters ; Constructing a temperature distribution model based on multiple internal and external temperature units and the temperature ranges of low temperature areas corresponding to the multiple internal and external temperature units; A risk determination module is used to determine the temperature difference change trend between the high-temperature area and the low-temperature area in the switch cabinet based on the internal temperature values ​​at multiple time points and the temperature prediction values ​​at multiple future time points, and to perform water vapor condensation risk determination based on the dew point temperature, the temperature range of the low-temperature area and the temperature difference change trend; determining the temperature difference change trend between the high-temperature area and the low-temperature area in the switch cabinet based on the internal temperature values ​​at multiple time points and the temperature prediction values ​​at multiple future time points, including: calculating the temperature trend in the switch cabinet based on the internal temperature values ​​at multiple time points, and determining the temperature trend of the ambient temperature based on the temperature prediction values ​​at multiple future time points, wherein the temperature trend includes an upward trend, a downward trend and a non-unidirectional change trend; the temperature in the switch cabinet and the ambient temperature When the trend is an upward trend or a downward trend, the temperature change is calculated; when one of the second target conditions is met, it is predicted that the temperature difference between the high-temperature area and the low-temperature area in the switch cabinet has a larger trend, wherein the second target condition includes: the temperature in the switch cabinet is on an upward trend and the ambient temperature is on a downward trend; the temperature in the switch cabinet is on an upward trend and the ambient temperature has no unidirectional change trend; the temperature in the switch cabinet is on an upward trend and the ambient temperature has an upward trend, and the temperature change in the switch cabinet is greater than the change in the ambient temperature; the temperature in the switch cabinet has no unidirectional change trend and the ambient temperature has a downward trend; based on the dew point temperature, the temperature range of the low-temperature area and the temperature difference change trend, the water vapor condensation risk is determined, including: setting the lower limit value of the temperature range of the low-temperature area With the dew point temperature to compare; When the water vapor condensation risk exists at the current time point, , , and when the temperature difference between the high-temperature area and the low-temperature area in the switch cabinet tends to increase, it is determined that the switch cabinet has a risk of water vapor condensation at a future time point, among which, is the set temperature difference threshold; The dehumidification control module is used to control the dehumidification module in the switch cabinet to dehumidify the switch cabinet when there is a risk of water vapor condensation in the switch cabinet.

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