Display panel, method for manufacturing display panel, and electronic device

Abstract

This application provides a display panel, a method for manufacturing the display panel, and an electronic device. The display panel includes: a driving backplate; a bonding layer located on one side of the driving backplate; a planarization layer located on the side of the bonding layer away from the driving backplate; and a light-shielding layer located on the side of the planarization layer away from the driving backplate. By providing a planarization layer on top of the bonding layer, the planarization layer can offset any unevenness that may exist in the bonding layer, effectively improving the flatness of the light-shielding layer disposed on top of the planarization layer, thereby improving the visual uniformity of the display panel in the screen-off state.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] With the development of display device manufacturing technology, Mini LEDs and Micro-LEDs have become widely used due to their superior advantages in brightness, resolution, contrast ratio, energy consumption, lifespan, response speed, and thermal stability. However, Mini LED or Micro-LED display panels currently have certain defects, resulting in visual defects such as visible white spots, white patches, or uneven grain patterns when not emitting light, which affect the user experience. Summary of the Invention

[0003] In order to overcome the above-mentioned shortcomings in the prior art, the purpose of this application is to provide a display panel, the display panel comprising:

[0004] Drive backplane;

[0005] Bonding layer located on one side of the drive backplate;

[0006] A planarization layer located on the side of the bonding layer away from the drive backplate;

[0007] A light-shielding layer located on the side of the planarization layer away from the drive backplate.

[0008] In some possible implementations, the display panel further includes at least one light-emitting unit electrically connected to the driving backplane via the bonding layer, and the planarization layer and the light-shielding layer include openings exposing the light-emitting unit.

[0009] In some possible implementations, at least a portion of the light-emitting unit protrudes from the bonding layer;

[0010] In the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving back plate to the driving back plate is less than the distance from the side of the light-emitting unit away from the driving back plate to the driving back plate.

[0011] In some possible implementations, the distance from the side of the light-shielding layer away from the driving backplate to the driving backplate is less than or equal to the distance from the side of the light-emitting device away from the driving backplate to the driving backplate.

[0012] Preferably, in the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving backplate to the side of the light-emitting unit away from the driving backplate is 3 micrometers to 5 micrometers.

[0013] In some possible implementations, the material of the planarization layer includes organic adhesives.

[0014] Another object of this application is to provide a method for manufacturing a display panel, the method comprising:

[0015] Provide a drive backplane;

[0016] A bonding layer is formed on the drive backplane;

[0017] A planarization layer is formed on the side of the bonding layer away from the drive backplate;

[0018] A light-shielding layer is formed on the side of the planarization layer away from the drive backplate.

[0019] In some possible implementations, prior to the step of forming a planarization layer on the side of the bonding layer away from the drive backplane, the method further includes:

[0020] At least one light-emitting unit is bonded to the driving backplate via the bonding layer;

[0021] The step of forming a planarization layer on the side of the bonding layer away from the drive backplate includes:

[0022] A planarization layer is formed on the side of the bonding layer away from the drive backplate, covering the bonding layer and exposing the light-emitting unit;

[0023] The step of forming a light-shielding layer on the side of the planarization layer away from the drive backplate includes:

[0024] A planarization layer is formed on the side of the planarization layer away from the drive backplate, covering the planarization layer and exposing the light-emitting unit.

[0025] In some possible implementations, at least a portion of the light-emitting unit protrudes from the bonding layer; after the step of forming a planarization layer covering the bonding layer and exposing the light-emitting unit on the side of the bonding layer away from the drive backplane, the method further includes:

[0026] The planarization layer is thinned so that the distance from the side of the planarization layer away from the driving backplate to the driving backplate is less than the distance from the side of the light-emitting unit away from the driving backplate to the driving backplate.

[0027] Another object of this application is to provide a method for manufacturing a display panel, the method comprising:

[0028] Provide a drive backplane;

[0029] A bonding layer is formed on the drive backplane;

[0030] A planarization layer is formed on the side of the bonding layer away from the drive backplate;

[0031] The planarization layer and the bonding layer are thinned as a whole, and the planarization layer and at least a portion of the bonding layer are removed;

[0032] A light-shielding layer is formed on the side of the bonding layer away from the drive backplate.

[0033] Another object of this application is to provide an electronic device, the electronic device comprising the display panel provided in this application or a display panel manufactured by the manufacturing method of the display panel provided in this application.

[0034] Compared with the prior art, this application has the following beneficial effects:

[0035] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By setting a planarization layer on the bonding layer, the planarization layer can offset the unevenness that may exist in the bonding layer, thereby effectively improving the flatness of the light-shielding layer set on the planarization layer, and thus improving the visual uniformity of the display panel in the off state. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of a display panel in the prior art;

[0038] Figure 2 One of the schematic diagrams of a display panel provided in an embodiment of this application;

[0039] Figure 3 A second schematic diagram of a display panel provided in an embodiment of this application;

[0040] Figure 4 A third schematic diagram of a display panel provided in an embodiment of this application;

[0041] Figure 5 Fourth schematic diagram of a display panel provided in an embodiment of this application;

[0042] Figure 6 One of the schematic flowcharts of a method for manufacturing a display panel provided in an embodiment of this application;

[0043] Figure 7 Fifth schematic diagram of a display panel provided in an embodiment of this application;

[0044] Figure 8 A second schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0045] Figure 9 This is a sixth schematic diagram of a display panel provided in an embodiment of this application.

[0046] Icons: 100 - Driver backplate; 200 - Bonding layer; 300 - Light-emitting unit; 400 - Planarization layer; 500 - Light-shielding layer. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0049] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0050] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0051] Please see Figure 1 In some Mini LED or Micro-LED display panels, an electrical connection between the light-emitting units 300' and the driving backplate 100' is achieved by setting a bonding layer 200' on the driving backplate 100'. After the light-emitting units 300' are bonded, a light-shielding layer 500' is also set between the light-emitting units 300' to improve the contrast of the display panel.

[0052] However, the surface of the drive backplate 100' may have uneven areas, or the bonding layer 200' may have uneven areas during the bonding process. The material of the light-shielding layer 500' is usually not fluid enough, which may also result in some unevenness in the light-shielding layer 500'. This unevenness may lead to visual defects such as visible white spots, white patches, or uneven particles in the non-light-emitting state, affecting the user experience.

[0053] In view of this, this embodiment provides a solution that can reduce the risks of the above-mentioned problems. The solution provided in this embodiment will be described in detail below.

[0054] Please see Figure 2 , Figure 2 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a driving backplate 100, a bonding layer 200, a planarization layer 400, and a light-shielding layer 500.

[0055] The driving backplane 100 may include a thin-film transistor (TFT) array backplane, including a plurality of driving units arranged in an array, the driving units being used to drive the light-emitting unit 300 to emit light. At least one or a pair of bonding electrodes may be disposed on one side of the driving backplane 100, the bonding electrodes being used for electrical connection with the light-emitting unit 300.

[0056] The bonding layer 200 is located on one side of the drive backplate 100, for example, on the side of the drive backplate 100 where the bonding electrode is disposed. Optionally, in this embodiment, the bonding layer 200 may include anisotropic conductive film (ACF).

[0057] The planarization layer 400 may be located on the side of the bonding layer 200 away from the drive backplate 100. In this embodiment, compared to the bonding layer 200, the planarization layer 400 may be made of a material with relatively high fluidity, and during the process of setting the planarization layer 400, it can level itself to fill and offset uneven areas on the bonding layer 200.

[0058] The light-shielding layer 500 is located on the side of the planarization layer 400 away from the drive backplate 100. The light-shielding layer 500 may be made of an opaque or poorly transparent material; for example, the light-shielding layer 500 may be formed by printing with black ink.

[0059] Based on the above design, in this embodiment, by setting the planarization layer 400 on the bonding layer 200, the planarization layer 400 can offset the unevenness that may exist in the bonding layer 200, thereby effectively improving the flatness of the light-shielding layer 500 set on the planarization layer 400, and thus improving the visual uniformity of the display panel in the screen-off state.

[0060] In some possible implementations, please refer again. Figure 2 The display panel further includes at least one light-emitting unit 300 electrically connected to the drive backplane 100 via the bonding layer 200, and the planarization layer 400 and the light-shielding layer 500 include openings exposing the light-emitting unit 300.

[0061] For example, in this embodiment, after forming the bonding layer 200, at least one light-emitting unit 300 can be transferred onto the bonding layer 200, and then the light-emitting unit 300 can be bonded to the driving backplane 100 through the bonding layer 200 by pressure bonding. After the bonding of the light-emitting unit 300 is completed, a planarization layer 400 can be provided on the bonding layer 200, so that the planarization layer 400 covers the bonding layer 200 and exposes the light-emitting unit 300. Then, a light-shielding layer 500 is provided on the planarization layer 400, so that the light-shielding layer 500 covers the planarization layer 400 and exposes the light-emitting unit 300.

[0062] For some possible implementations, please refer to Figure 3 At least a portion of the light-emitting unit 300 protrudes from the bonding layer 200. In the thickness direction of the display panel, the distance H1 from the side of the planarization layer 400 away from the driving back plate 100 to the driving back plate 100 is less than the distance H2 from the side of the light-emitting unit 300 away from the driving back plate 100 to the driving back plate 100. This avoids the light-shielding layer 500's height being higher than the light-emitting unit 300's height, thus preventing it from affecting the light emission effect of the light-emitting unit 300.

[0063] In this case, please refer to Figure 4 After the light-shielding layer 500 is set, the distance H3 from the side of the light-shielding layer 500 away from the driving back plate 100 to the driving back plate 100 is less than or equal to the distance H2 from the side of the light-emitting unit 300 away from the driving back plate 100 to the driving back plate 100. In this way, the light-shielding layer 500 will not block the light-emitting unit 300.

[0064] Further, please refer to Figure 5In some possible implementations, the distance H4 from the side of the planarization layer 400 away from the driving backplate 100 to the side of the light-emitting unit 300 away from the driving backplate 100 in the thickness direction of the display panel is 3 micrometers to 5 micrometers.

[0065] In this case, the thickness H5 of the light-shielding layer 500 can be less than or equal to the distance H4 from the side of the planarization layer 400 away from the driving back plate 100 to the side of the light-emitting unit 300 away from the driving back plate 100.

[0066] In some possible implementations, the planarization layer 400 is made of an organic adhesive. Thus, after the planarization layer 400 is formed, it can be thinned by ashing the organic material.

[0067] Please see Figure 6 , Figure 6 This embodiment also provides a flowchart illustrating a method for manufacturing a display panel, which may include the following steps.

[0068] Step S110: Provide a drive backplane 100.

[0069] Step S120: A bonding layer 200 is formed on the drive backplate 100.

[0070] In step S130, a planarization layer 400 is formed on the side of the bonding layer 200 away from the drive backplate 100.

[0071] In step S140, a light-shielding layer 500 is formed on the side of the planarization layer 400 away from the drive back plate 100.

[0072] Thus, by setting a planarization layer 400 on the bonding layer 200, the planarization layer 400 can offset any unevenness that may exist in the bonding layer 200, thereby effectively improving the flatness of the light-shielding layer 500 set on the planarization layer 400, and thus improving the visual uniformity of the display panel in the off state.

[0073] In some possible implementations, prior to step S130, the method also bonds at least one light-emitting unit 300 to the driving backplate 100 via the bonding layer 200.

[0074] In step S130, a planarization layer 400 covering the bonding layer 200 and exposing the light-emitting unit 300 can be formed on the side of the bonding layer 200 away from the drive backplate 100. For example, a patterned planarization layer 400 exposing the light-emitting unit 300 can be formed on the bonding layer 200 by using a corresponding photomask.

[0075] In step S140, a planarization layer 400 covering the planarization layer 400 and exposing the light-emitting unit 300 can be formed on the side of the planarization layer 400 away from the drive backplate 100. For example, the light-shielding layer 500 can be formed on the planarization layer 400 by ink printing using a corresponding photomask.

[0076] In some possible implementations, at least a portion of the light-emitting unit 300 protrudes from the bonding layer 200. See also... Figure 7 After step S130, the planarization layer 400 can be thinned so that the distance from the side of the planarization layer 400 away from the driving back plate 100 to the driving back plate 100 is less than the distance from the side of the light-emitting unit 300 away from the driving back plate 100 to the driving back plate 100.

[0077] For example, the material of the planarization layer 400 may include organic adhesive. After step S130, the planarization layer 400 may be ashing treated to reduce the thickness of the planarization layer 400.

[0078] After the planarization layer 400 is thinned, step S140 is performed to form a light-shielding layer 500 on the side of the thinned planarization layer 400 away from the driving backplate 100. In this way, the height of the light-shielding layer 500 can be prevented from being greater than the height of the light-emitting unit 300.

[0079] Please refer to Figure 8 , Figure 8 This is a flowchart illustrating another method for manufacturing a display panel provided in this embodiment. The method may include the following steps.

[0080] Step S210: Provide a drive backplane 100.

[0081] Step S220: A bonding layer 200 is formed on the drive backplate 100.

[0082] In step S230, a planarization layer 400 is formed on the side of the bonding layer 200 away from the drive backplate 100.

[0083] Step S240: The planarization layer 400 and the bonding layer 200 are thinned as a whole, and the planarization layer 400 and at least a portion of the bonding layer 200 are removed.

[0084] In step S250, a light-shielding layer 500 is formed on the side of the bonding layer 200 away from the drive backplate 100.

[0085] For example, please refer to Figure 9After forming the planarization layer 400 with a high surface flatness in step S230, the planarization layer 400 and the bonding layer 200 can be thinned as a whole in step S240. Since the planarization layer 400 is located on top of the bonding layer 200, the planarization layer 400 will be gradually removed first during the thinning process, and then a portion of the bonding layer 200 will be removed. Furthermore, the surface of the planarization layer 400 is already relatively flat before thinning, and after uniform thinning, the side of the bonding layer 200 that is away from the driving backplate 100 is also relatively flat. Thus, the light-shielding layer 500 is formed on the relatively flat bonding layer 200, improving the flatness of the light-shielding layer 500, thereby improving the visual uniformity of the display panel in the screen-off state.

[0086] This embodiment also provides an electronic device, which may include the display panel provided in this embodiment or a display panel manufactured by the above method. The electronic device may include devices with display functions such as monitors, video wall displays, mobile phones, tablets, laptops, and televisions.

[0087] In summary, the embodiments of this application provide a display panel, a method for manufacturing a display panel, and an electronic device. By setting a planarization layer on the bonding layer, the planarization layer can offset the unevenness that may exist in the bonding layer, effectively improving the flatness of the light-shielding layer set on the planarization layer, thereby improving the visual uniformity of the display panel in the off state.

[0088] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Drive backplane; Bonding layer located on one side of the drive backplate; A planarization layer located on the side of the bonding layer away from the drive backplate; A light-shielding layer located on the side of the planarization layer away from the drive backplate; The display panel further includes at least one light-emitting unit electrically connected to the driving backplane via the bonding layer, and the planarization layer and the light-shielding layer include openings exposing the light-emitting unit; At least a portion of the light-emitting unit protrudes from the bonding layer; In the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving back plate to the driving back plate is less than the distance from the side of the light-emitting unit away from the driving back plate to the driving back plate.

2. The display panel according to claim 1, characterized in that, In the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving backplate to the side of the light-emitting unit away from the driving backplate is 3 micrometers to 5 micrometers.

3. The display panel according to claim 1, characterized in that, The distance from the side of the light-shielding layer away from the driving back plate to the driving back plate is less than or equal to the distance from the side of the light-emitting unit away from the driving back plate to the driving back plate.

4. The display panel according to claim 1, characterized in that, The material of the planarization layer includes organic adhesive.

5. A method for manufacturing a display panel, characterized in that, The method comprises: Provide a drive backplane; A bonding layer is formed on the drive backplane; At least one light-emitting unit is bonded to the driving backplate via the bonding layer; A planarization layer is formed on the side of the bonding layer away from the drive backplate; The planarization layer is thinned so that the distance from the side of the planarization layer away from the driving backplate to the driving backplate is less than the distance from the side of the light-emitting unit away from the driving backplate to the driving backplate. A light-shielding layer is formed on the side of the planarization layer away from the drive backplate.

6. The method according to claim 5, characterized in that, The step of forming a planarization layer on the side of the bonding layer away from the drive backplate includes: A planarization layer is formed on the side of the bonding layer away from the drive backplate, covering the bonding layer and exposing the light-emitting unit; The step of forming a light-shielding layer on the side of the planarization layer away from the drive backplate includes: A light-shielding layer is formed on the side of the planarization layer away from the drive backplate, covering the planarization layer and exposing the light-emitting unit.

7. A method for manufacturing a display panel, characterized in that, The method comprises: Provide a drive backplane; A bonding layer is formed on the drive backplane; A planarization layer is formed on the side of the bonding layer away from the drive backplate; The planarization layer and the bonding layer are thinned as a whole, and the planarization layer and at least a portion of the bonding layer are removed; A light-shielding layer is formed on the side of the bonding layer away from the drive backplate.

8. An electronic device, characterized in that, The electronic device includes a display panel made by the method described in any one of claims 1-4 or any one of claims 5-7.

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