Display panel and display device

By setting grooves on the inorganic encapsulation layer and filling them with different materials, the encapsulation failure problem of foldable displays was solved, achieving good encapsulation effect and bending resistance under different bending angles.

CN119486483BActive Publication Date: 2026-02-06HEFEI VISIONOX TECH CO LTD
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Patent Information

Application Number
CN202411877926.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2026-02-06
Estimated Expiration
2044-12-18

AI Technical Summary

Technical Problem

Existing foldable displays suffer from insufficient bending flexibility, leading to encapsulation failure.

Method used

Grooves are set on the inorganic encapsulation layer of the display panel, and a filling structure with a different material than the inorganic encapsulation layer is filled in the grooves to form a discontinuous film layer, so as to disperse stress and improve the flexibility of the inorganic encapsulation layer.

Benefits of technology

It improves the encapsulation effect of the display panel under different bending angles and enhances the bending resistance of the display panel.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a display panel and a display device. The display panel comprises a display area and a non-display area located at the periphery of the display area. The display panel comprises a substrate, an inorganic encapsulation layer and a filling structure. The non-display area comprises a bending area and a dam surrounding at least part of the display area. The dam is located on the side of the bending area away from the display area. The inorganic encapsulation layer is arranged on one side of the substrate and located in the non-display area. The inorganic encapsulation layer in the bending area is provided with at least one groove. The filling structure is arranged in the groove. The material of the filling structure is different from that of the inorganic encapsulation layer. In this way, the bending resistance and the encapsulation effect of the display panel can be improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] In recent years, folding display screens have realized the breakthrough of exhibiting a larger screen view in a limited space by combining flexible display screen technology with folding mechanical structures. This technology not only improves the screen utilization rate of mobile devices, but also brings users a more flexible and convenient use experience. The applicant of the present application found in a long-term research and development process that the packaging of the folding display screen has the defect that the insufficient bending resistance leads to packaging failure. SUMMARY

[0003] The technical problem solved by the present application is to provide a display panel and a display device, which can improve the bending resistance and packaging effect of the display panel.

[0004] To solve the above technical problem, one technical solution adopted by the present application is to provide a display panel, which comprises a display area and a non-display area located at least partially around the display area, and comprises: a substrate; the non-display area comprises a bending area and a dam surrounding at least part of the display area, and the bending area is located on the side of the dam away from the display area; an inorganic packaging layer is arranged on one side of the substrate, and the inorganic packaging layer is located in the non-display area, and the inorganic packaging layer in the bending area is provided with at least one groove; a filling structure is arranged in the groove, wherein the filling structure is different in material from the inorganic packaging layer.

[0005] To solve the above technical problem, another technical solution adopted by the present application is to provide a display device comprising the display panel according to any one of the above.

[0006] The beneficial effects of the present application are as follows: different from the prior art, the present application sets a groove on the inorganic packaging layer in the non-display area, and the filling structure is arranged in the groove. Since the filling structure is different in material from the inorganic packaging layer, the inorganic packaging layer in the non-display area is a discontinuous film layer, which can disperse the stress of the film layer when bending, improve the bendability of the inorganic packaging layer, and thus enable the display panel to have good packaging effect under different bending angles. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0008] Wherein:

[0009] Figure 1 is a structural schematic diagram of an embodiment of the display panel of the present application;

[0010] Figure 2 is a position schematic diagram of the groove in the display panel in an embodiment; Figure 1

[0011] Figure 3 is a cross-sectional view of the display panel along the AA' line in an embodiment in the display panel; Figure 2

[0012] Figure 4 is a cross-sectional view of the display panel along the BB' line in an embodiment in the display panel; Figure 2

[0013] Figure 5 is a cross-sectional view of the display panel along the AA' line in another embodiment in the display panel; Figure 2

[0014] Figure 6 is a cross-sectional view of the display panel along the AA' line in yet another embodiment in the display panel; Figure 2

[0015] Figure 7 is a position schematic diagram of the groove in the display panel in another embodiment; Figure 1

[0016] Figure 8 is a cross-sectional view of the display panel along the CC' line in an embodiment in the display panel; Figure 7

[0017] Figure 9 is a cross-sectional view of the display panel along the DD' line in an embodiment in the display panel; Figure 7

[0018] Figure 10 is a cross-sectional view of the display panel along the AA' line in still another embodiment in the display panel; Figure 2

[0019] Figure 11 is a structural schematic diagram of an embodiment of the display device of the present application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application. ​​​​​​​​​

[0021] In the prior art, in order to ensure the effectiveness of the packaging, inorganic packaging is used in the periphery of the display panel. When the display area of the screen body is bent, the inorganic layer is a rigid material, which is easy to cause the screen body to break, and finally leads to packaging failure of the screen body, display abnormalities and other display problems. The present application proposes the following solutions to solve the above problems.

[0022] Referring to Figures 1 to 4 , the display panel 100 includes a display area 11 and a non-display area 12 located at least partially around the display area 11 (the non-display area 12 can be arranged only on part of the periphery of the display area 11, or can surround the entire display area 11), wherein the display panel 100 can be an LCD display panel (Liquid Crystal Display), an OLED display panel (Organic Light-Emitting Diode), or a Mirco-LED display panel (Micro Light Emitting Diode). The display area 11 is used to display a picture and usually includes light-emitting pixels, drive circuits and other structures. The non-display area 12 is not used to display a picture and usually includes peripheral circuits and other structures. The non-display area 12 includes a bending area 125 and a dam 9 surrounding at least part of the display area 11. The bending area 125 is located on the side of the dam 9 away from the display area 11. The display panel 100 includes a substrate 1, an inorganic packaging layer 2, a filling structure 4, a light-emitting layer 5, an array layer 6 and a first packaging layer 7.

[0023] The substrate 1 plays a supporting role in the display panel 100. It can be a flexible substrate or a rigid substrate. When the substrate 1 is a flexible substrate, its material can be polyimide (PI). When the substrate 1 is a rigid substrate, its material can be glass or metal. The structure of the substrate 1 is not limited in the present application.

[0024] The inorganic packaging layer 2 is arranged on one side of the substrate 1 and located in the non-display area 12. The inorganic packaging layer 2 in the bending area 125 is provided with at least one groove 3, that is, the groove 3 is arranged in the bending area 125. The material of the inorganic packaging layer 2 includes inorganic materials, which usually have good chemical stability and are not easy to react with the surrounding environment, and can play a packaging role to avoid the intrusion of external water and oxygen into the inside of the display panel 100.

[0025] The array layer 6 is located on one side of the substrate 1 and is used to drive the light-emitting layer 5 to emit light. The array layer 6 includes a pixel driving circuit 21, which can be, for example, a 2T1C circuit, a 7T1C circuit, a 7T2C circuit, or a 9T1C circuit, and the like. The present application does not limit the specific structure thereof. Among them, the “2T1C circuit” refers to a pixel circuit including two thin film transistors (T) and one capacitor (C) in the pixel driving circuit 21, and the other “7T1C circuit”, “7T2C circuit”, “9T1C circuit” and the like are sequentially deduced. Among them, the pixel driving circuit 21 includes a transistor 211 and a storage capacitor 212 and the like. The transistor 211 includes a semiconductor part, a gate, a source and a drain. The storage capacitor 212 includes a first plate and a second plate. Among them, the gate and the first plate can be located in the first metal layer, the second plate can be located in the second metal layer, and the source and the drain can be located in the third metal layer. An insulating layer is arranged between the first metal layer and the second metal layer, and between the second metal layer and the third metal layer.

[0026] The light-emitting layer 5 is arranged on the side of the array layer 6 away from the substrate 1 and in the display area 11. The light-emitting layer 5 includes a light-emitting element 51, which can be one or multiple. When the number of light-emitting elements 51 is multiple, some light-emitting elements 51 emit red light, some light-emitting elements 51 emit green light, and some light-emitting elements 51 emit blue light. It should be noted that the color of the light emitted by the light-emitting element 51 can not be limited to red, green and blue, but can also be yellow or other colors, which is not limited herein.

[0027] Meanwhile, the light-emitting element 51 includes a first electrode, a light-emitting material layer and a second electrode which are sequentially stacked in the direction away from the substrate 1.

[0028] The first encapsulation layer 7 is arranged on the side of the light-emitting layer 5 away from the substrate 1. The orthographic projection of the first encapsulation layer 7 on the substrate 1 covers the orthographic projection of the light-emitting layer 5 on the substrate 1.

[0029] The filling structure 4 is arranged in the groove 3. The filling structure 4 is different in material from the inorganic encapsulation layer 2.

[0030] Specifically, the filling structure 4 can be arranged in part of the groove 3, or can be arranged in the entire area of the groove 3. The material of the filling structure 4 is different from that of the inorganic encapsulation layer 2, so that the inorganic encapsulation layer 2 is discontinuous, and the bendability of the inorganic encapsulation layer 2 in the non-display area 12 can be improved.

[0031] From the above, it can be seen that the application sets the groove 3 on the inorganic encapsulation layer 2, and the filling structure 4 is arranged in the groove 3. Since the filling structure 4 is different from the material of the inorganic encapsulation layer 2, the inorganic encapsulation layer 2 located in the non-display area 12 is a discontinuous film layer, that is, the inorganic encapsulation layer 2 located in the non-display area 12 is in a patterned structure, which can disperse the stress of the film layer when bending, has stronger stress bearing capacity when bending, and can improve the bendability of the inorganic encapsulation layer 2, so that the display panel 100 has good encapsulation effect under different bending angles.

[0032] Continuing to refer to Figure 3 In an embodiment, the inorganic encapsulation layer 2 is arranged in the same layer as at least part of the inorganic film layers in the array layer 6.

[0033] Specifically, the inorganic encapsulation layer 2 is arranged in the same layer as at least part of the inorganic film layers in the array layer 6, so that the inorganic encapsulation layer 2 and the array layer 6 can be prepared at the same time during preparation, improving the preparation efficiency.

[0034] Continuing to refer to Figure 3 In an embodiment, the inorganic encapsulation layer 2 is arranged in the same layer as one inorganic film layer in the array layer 6. Refer to Figure 5 In another embodiment, the inorganic encapsulation layer 2 is arranged in the same layer as multiple inorganic film layers in the array layer 6. Continuing to refer to Figure 5 In a specific example, the inorganic encapsulation layer 2 is arranged in the same layer as all the inorganic film layers in the array layer 6. It can be understood that, compared with the inorganic encapsulation layer 2 arranged in the same layer as one inorganic film layer in the array layer 6, the inorganic encapsulation layer 2 is thicker when arranged in the same layer as multiple inorganic film layers in the array layer 6.

[0035] In an embodiment, the inorganic film layer in the array layer 6 extends to the non-display area 12 to form the inorganic encapsulation layer 2.

[0036] In an embodiment, when there is also an inorganic film layer between the array layer 6 and the substrate 1, the inorganic encapsulation layer 2 can also be arranged in the same layer as the inorganic film layer between the array layer 6 and the substrate 1.

[0037] In an embodiment, refer to Figure 3 and Figure 5The groove 3 penetrates the inorganic encapsulation layer 2, so as to further improve the stress bearing capacity of the display panel 100 when being bent. It should be noted that the drawings of the present application are schematically illustrated with the groove 3 penetrating the inorganic encapsulation layer 2, but this does not mean that the groove 3 must penetrate the inorganic encapsulation layer 2. In other embodiments, the groove 3 can also not penetrate the inorganic encapsulation layer 2, that is, the groove 3 is a blind groove, and the depth of the groove 3 is less than the thickness of the inorganic encapsulation layer 2. In an embodiment, when the film layer in the array layer 6 extends to the non-display area 12 to form the inorganic encapsulation layer 2, and the groove 3 penetrates the inorganic encapsulation layer 2, it is equivalent to that the groove 3 penetrates the array layer 6.

[0038] In an embodiment, the material of the filling structure 4 includes a metal material.

[0039] Specifically, the material of the filling structure 4 includes a metal material, and the metal material has strong bendability and is not easy to break. This setting can further improve the bending resistance of the display panel 100.

[0040] Of course, in other embodiments, the material of the filling structure 4 can also include an organic material, and the present application does not limit the material of the filling structure 4.

[0041] In an embodiment, the above-mentioned metal material includes at least one of aluminum, copper, steel, molybdenum and titanium. For example, the metal material can only include aluminum, or can be a mixture of copper and steel.

[0042] In combination with Figures 2 to 9 The first encapsulation layer 7 is arranged on the side of the inorganic encapsulation layer 2 away from the substrate 1. The orthographic projection of the first encapsulation layer 7 on the substrate 1 covers at least part of the orthographic projection of the filling structure 4 on the substrate 1, that is, at least the filling structure 4 is encapsulated by the first encapsulation layer 7, so as to avoid the invasion of external water and oxygen into the filling structure 4 and avoid the corrosion of the filling structure 4 by the external environment to cause encapsulation failure. The first encapsulation layer 7 can be a single-layer structure or a multi-layer structure, which can be specifically referred to the following description.

[0043] Continuing to refer to Figures 2 to 5 In an embodiment, the orthographic projection of the first encapsulation layer 7 on the substrate 1 covers part of the orthographic projection of the filling structure 4 on the substrate 1, that is, the first encapsulation layer 7 only covers part of the filling structure 4. Meanwhile, the display panel 100 further includes a second encapsulation layer 8. The second encapsulation layer 8 is located in the non-display area 12 and at least on the side of the filling structure 4 away from the substrate 1. The total orthographic projection of the second encapsulation layer 8 and the first encapsulation layer 7 on the substrate 1 covers the orthographic projection of the filling structure 4 on the substrate 1.

[0044] Specifically, the first encapsulation layer 7 covers part of the filling structure 4, and the second encapsulation layer 8 is further arranged to cover the remaining part of the filling structure 4, i.e., the total orthographic projection of the first encapsulation layer 7 and the second encapsulation layer 8 on the substrate 1 covers the orthographic projection of the filling structure 4 on the substrate 1. This arrangement can ensure that the filling structure 4 is completely covered, and the filling structure is prevented from being corroded by the outside world to cause encapsulation failure.

[0045] In an embodiment, the orthographic projection of the second encapsulation layer 8 on the substrate 1 covers the orthographic projection of the filling structure 4 on the substrate 1.

[0046] In another embodiment, the orthographic projection of the second encapsulation layer 8 on the substrate 1 can also completely cover the orthographic projection of the filling structure 4 on the substrate 1. In summary, as long as the first encapsulation layer 7 and the second encapsulation layer 8 can together cover the filling structure 4.

[0047] In yet another embodiment, referring to Figure 6 , the orthographic projection of the first encapsulation layer 7 on the substrate 1 can not overlap with the orthographic projection of the filling structure 4 on the substrate 1, and the orthographic projection of the second encapsulation layer 8 on the substrate 1 completely covers the orthographic projection of the filling structure 4 on the substrate 1, i.e., this embodiment encapsulates the filling structure 4 by the second encapsulation layer 8 alone. This arrangement can reduce the contact interface between different film layers, and avoid the water and oxygen in the outside world from invading the filling structure 4 from the contact interface between different film layers.

[0048] In an embodiment, the material of the second encapsulation layer 8 includes at least one of blue glue and sealing glue. Specifically, the material of the second encapsulation layer 8 includes one or more of blue glue and sealing glue, for example, the material of the second encapsulation layer 8 only includes blue glue, or the material of the second encapsulation layer 8 includes a mixture of blue glue and sealing glue.

[0049] It should be noted that the material of the second encapsulation layer 8 is not limited in the present application, for example, the material of the second encapsulation layer 8 can also be the same as the material of the inorganic encapsulation layer 2, so as to reduce the cost.

[0050] Continuing to refer to Figure 3 and Figure 5 In an embodiment, the first encapsulation layer 7 includes a first sub-layer 71, a second sub-layer 72 and a third sub-layer 73 arranged in sequence in the direction away from the substrate 1. That is, the first encapsulation layer 7 adopts a three-layer encapsulation structure, which can prevent the influence of dust, water and oxygen and mechanical damage in the outside world on the light-emitting layer 5, thereby prolonging the service life of the display panel 100.

[0051] In an embodiment, the orthographic projection of the second sub-layer 72 on the substrate 1 is located within the orthographic projection of the first sub-layer 71 on the substrate 1, while the orthographic projection of the first sub-layer 71 on the substrate 1 is coincident with the orthographic projection of the third sub-layer 73 on the substrate 1, and further, the first sub-layer 71 away from the display area 11 is in contact with the third sub-layer 73 away from the display area 11, which improves the packaging effect.

[0052] In an embodiment, the first sub-layer 71 is an inorganic material layer, the second sub-layer 72 is an organic material layer, and the third sub-layer 73 is an inorganic material layer. This arrangement can ensure that the film layer above the filling structure 4 is an inorganic film layer, and the sealing effect of the inorganic film layer is strong, which can ensure the sealing effect of the filling structure 4.

[0053] Of course, in other embodiments, the first packaging layer 7 can also be a single-layer structure.

[0054] Continuing to refer to Figure 2 and Figure 3 In an embodiment, the groove 3 extends to the edge of the display panel 100, the filling structure 4 is arranged in a partial area in the groove 3, and the second packaging layer 8 extends from the side of the filling structure 4 away from the substrate 1 to the direction away from the display area 11 into the groove 3.

[0055] Specifically, the filling structure 4 and the second packaging layer 8 are arranged in the groove 3 and jointly fill the groove 3, and the second packaging layer 8 and the first packaging layer 7 jointly package the filling structure 4, so that the filling structure 4 has a good water and oxygen isolation effect.

[0056] Of course, in other embodiments, the groove 3 can also be entirely filled by the filling structure 4, and at this time, the second packaging layer 8 is not arranged in the groove 3, but is only located on the side of the filling structure 4 away from the substrate 1.

[0057] Referring to Figures 7 to 9 and Figure 3 Unlike the embodiment, at this time, the orthographic projection of the first packaging layer 7 on the substrate 1 covers the orthographic projection of the entire filling structure 4 on the substrate 1.

[0058] Specifically, the first packaging layer 7 not only encapsulates the light-emitting layer 5, but also covers the entire filling structure 4, so that the filling structure 4 is isolated from water and oxygen, and Figure 3 Compared with the embodiment, at this time, as long as the first packaging layer 7 is extended during the processing process, the first packaging layer 7 can cover the filling structure 4, which facilitates improving the processing efficiency.

[0059] Continuing to refer to Figure 8In an embodiment, the orthographic projection of the first encapsulation layer 7 on the substrate 1 away from the end of the display area 11 is located between the orthographic projection of the array layer 6 on the substrate 1 and the orthographic projection of the inorganic encapsulation layer 2 on the substrate 1 away from the end of the display area 11. That is, the first encapsulation layer 7 away from the end of the display area 11 does not extend to the edge of the substrate 1, that is, the orthographic projection of the first encapsulation layer 7 on the substrate 1 is located within the substrate 1, and there is a preset distance between the outer edge of the first encapsulation layer 7 and the outer edge of the substrate 1, so as to avoid the increase of the thickness of the edge of the display panel 100 due to the extension of the first encapsulation layer 7 to the edge of the substrate 1, and the setting makes the edge of the display panel 100 more easily bent.

[0060] With reference to Figure 8 In an embodiment, the first encapsulation layer 7 comprises a first sub-layer 71, a second sub-layer 72 and a third sub-layer 73 which are sequentially stacked in the direction away from the substrate 1, wherein the orthographic projection of the first sub-layer 71 on the substrate 1 covers the orthographic projection of the filling structure 4 on the substrate 1.

[0061] Specifically, the first encapsulation layer 7 adopts a three-layer encapsulation structure, which can prevent the influence of external dust, water oxygen and mechanical damage on the light-emitting layer 5, thereby prolonging the service life of the display panel 100. Meanwhile, the first sub-layer 71 covers the filling structure 4, and the inorganic encapsulation layer 2 encapsulates the filling structure 4 together.

[0062] It should be noted that in other embodiments, the first encapsulation layer 7 can also adopt a single-layer structure.

[0063] With reference to Figure 8 In an embodiment, in the non-display area 12, part of the first sub-layer 71 away from the display area 11 is in contact with part of the third sub-layer 73 away from the display area 11, thereby improving the encapsulation effect.

[0064] With reference to Figure 7 In an embodiment, the orthographic projection of the third sub-layer 73 on the substrate 1 is located within the orthographic projection of the first sub-layer 71 on the substrate 1, which is beneficial to save materials and improve the bending performance of the display panel 100. However, in other embodiments, as shown in Figure 3 the orthographic projections of the first sub-layer 71 and the third sub-layer 73 on the substrate 1 can also completely coincide.

[0065] That is, at this time, the second sub-layer 72 is recessed relative to the first sub-layer 71 and the third sub-layer 73, and the first sub-layer 71 and the third sub-layer 73 extending out of the second sub-layer 72 are in contact, which can increase the sealing performance of the first encapsulation layer 7.

[0066] In an embodiment, the material of the first sub-layer 71 and the third sub-layer 73 comprises an inorganic material, and the material of the second sub-layer 72 comprises an organic material, which can achieve a good encapsulation effect. It should be noted that the material of the first sub-layer 71, the second sub-layer 72 and the third sub-layer 73 is not limited in the present application, and can be selected according to actual needs.

[0067] From Figure 8 It can be seen that another difference between the embodiment of Figure 3 and the embodiment of the present application is that, in the embodiment of Figure 7 , the groove 3 does not extend to the edge position of the inorganic encapsulation layer 2.

[0068] However, in another embodiment, referring to Figure 10 , when the orthographic projection of the first encapsulation layer 7 on the substrate 1 covers the orthographic projection of the filling structure 4 on the substrate 1, the groove 3 can also be arranged to extend to the edge position of the inorganic encapsulation layer 2, which can further display the bending performance of the bending area 125 of the display panel 100.

[0069] It should be noted that the encapsulation structure for encapsulating the filling structure 4 is not limited in the present application, and the filling structure 4 can be encapsulated by only the first encapsulation layer 7, or can be encapsulated by only the second encapsulation layer 8, or can be encapsulated by the first encapsulation layer 7 and the second encapsulation layer 8 together. In addition, the groove 3 can extend to the edge of the display panel 100, or can not extend to the edge of the display panel 100.

[0070] Continuing to refer to Figure 3 and Figure 4 , in an embodiment, the dam 9 is located on the side of the inorganic encapsulation layer 2 away from the substrate 1, and the orthographic projection of the first encapsulation layer 7 on the substrate 1 covers the orthographic projection of the dam 9 on the substrate 1, and the filling structure 4 is arranged outside the dam 9.

[0071] Among them, the number of dams 9 can be one, or multiple, such as two, three or more, which is not limited here.

[0072] Among them, the dam 9 can be arranged around the entire display area 11, or can be arranged around part of the display area 11, that is, the dam 9 can be a full-enclosing structure, or can be a half-enclosing structure.

[0073] In an embodiment, the orthographic projection of the first sub-layer 71 and the third sub-layer 73 on the substrate 1 covers the dam 9, and the first sub-layer 71 and the third sub-layer 73 are connected in contact outside the dam 9. Meanwhile, the second sub-layer 72 is located inside the dam 9, that is, the dam 9 surrounds the second sub-layer 72 to block the second sub-layer 72 by the dam 9.

[0074] In combination withFigure 3 and Figure 8 In an embodiment, the surface of the filling structure 4 away from the substrate 1 is in the same plane as the surface of the inorganic encapsulation layer 2 away from the substrate 1. Specifically, this arrangement can ensure the flatness of the display panel 100.

[0075] Of course, in other embodiments, the surface of the filling structure 4 away from the substrate 1 can not be in the same plane as the surface of the inorganic encapsulation layer 2 away from the substrate 1. For example, the surface of the filling structure 4 away from the substrate 1 can be recessed relative to the surface of the inorganic encapsulation layer 2 away from the substrate 1, or the surface of the filling structure 4 away from the substrate 1 can be convex relative to the surface of the inorganic encapsulation layer 2 away from the substrate 1.

[0076] Continuing to refer to Figure 1 In an embodiment, the non-display area 12 includes a first sub-area 121, a second sub-area 122, a third sub-area 123, and a fourth sub-area 124 connected to each other, the first sub-area 121 and the second sub-area 122 are located on opposite sides of the display area 11 in the width direction, and the third sub-area 123 and the fourth sub-area 124 are located on opposite sides of the display area 11 in the length direction, wherein the inorganic encapsulation layer 2 located in the first sub-area 121 and / or the inorganic encapsulation layer 2 located in the second sub-area 122 is provided with a groove 3.

[0077] Specifically, in an application scenario, the inorganic encapsulation layer 2 located in the first sub-area 121 is provided with a groove 3 to ensure the bendability of the inorganic encapsulation layer 2 of the first sub-area 121, in another application scenario, the inorganic encapsulation layer 2 located in the second sub-area 122 is provided with a groove 3 to ensure the bendability of the inorganic encapsulation layer 2 of the second sub-area 122, and in yet another application scenario, the inorganic encapsulation layer 2 located in the first sub-area 121 and the inorganic encapsulation layer 2 located in the second sub-area 122 are both provided with a groove 3 to ensure the bendability of the inorganic encapsulation layer 2 of the first sub-area 121 and the second sub-area 122.

[0078] Of course, in other embodiments, the inorganic encapsulation layer 2 located in the third sub-area 123 and the inorganic encapsulation layer 2 located in the fourth sub-area 124 can also be provided with a groove 3.

[0079] Referring to Figure 2 and Figure 7 In an embodiment, the number of grooves 3 is multiple, and multiple grooves 3 are arranged at intervals around the display area 11, and each groove 3 is provided with a filling structure 4. Specifically, by arranging multiple grooves 3, the inorganic encapsulation layer 2 can still have good encapsulation effect under bending at different angles.

[0080] Continuing to refer to Figure 2 and Figure 7In an embodiment, the recess 3 is a rectangular region. In other embodiments, the recess 3 can be a triangular region or a circular region, and the application does not limit the shape of the recess 3.

[0081] Referring to Figure 11 The display device 200 comprises the display panel 100 of any of the above embodiments, and the detailed structure can refer to the above embodiments, which will not be described here. The display device 200 can be a television, a mobile phone, a computer, a stage screen, or other electronic equipment, and the application does not limit the specific type thereof.

[0082] The above is only an embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area located at least partially around the periphery of the display area. The display panel includes: Substrate; The non-display area includes a bend and a dam surrounding at least a portion of the display area, the bend being located on the side of the dam away from the display area; An inorganic encapsulation layer is disposed on one side of the substrate, the inorganic encapsulation layer is located in the non-display area, and the inorganic encapsulation layer located in the bending area is provided with at least one groove; A filling structure is disposed in the groove, wherein the filling structure is made of a different material than the inorganic encapsulation layer, and the filling structure is made of a metallic material.

2. The display panel according to claim 1, characterized in that, The metallic material includes at least one of aluminum, copper, steel, molybdenum, and titanium.

3. The display panel according to claim 1, characterized in that, The display panel further includes a first encapsulation layer disposed on the side of the inorganic encapsulation layer opposite to the substrate, wherein the orthographic projection of the first encapsulation layer on the substrate covers at least a portion of the orthographic projection of the filling structure on the substrate.

4. The display panel according to claim 3, characterized in that, The orthographic projection of the first encapsulation layer on the substrate covers a portion of the orthographic projection of the filling structure on the substrate, while the display panel further includes: The second encapsulation layer is located in the non-display area and at least on the side of the filling structure opposite to the substrate, wherein the total orthographic projection of the second encapsulation layer and the first encapsulation layer on the substrate covers the orthographic projection of the filling structure on the substrate.

5. The display panel according to claim 4, characterized in that, The groove extends to the edge of the display panel, the filling structure is disposed in a portion of the groove, and the second encapsulation layer extends from the side of the filling structure away from the substrate into the groove in a direction away from the display area.

6. The display panel according to claim 4, characterized in that, The first encapsulation layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially in a direction away from the substrate, wherein the orthogonal projection of the first sublayer on the substrate covers a portion of the orthogonal projection of the filling structure on the substrate.

7. The display panel according to claim 6, characterized in that, The orthographic projection of the second sublayer on the substrate lies within the orthographic projection of the first sublayer on the substrate; the orthographic projection of the third sublayer on the substrate coincides with the orthographic projection of the first sublayer on the substrate.

8. The display panel according to claim 6, characterized in that, In the non-display area, the first sub-layer, which is partially away from the display area, is in contact with the third sub-layer, which is also partially away from the display area.

9. The display panel according to claim 3, characterized in that, The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the filling structure on the substrate.

10. The display panel according to claim 9, characterized in that, The display panel further includes an array layer disposed on one side of the substrate. The inorganic encapsulation layer is disposed in the same layer as at least a portion of the inorganic film layers in the array layer, and the orthographic projection of the end of the first encapsulation layer away from the display area on the substrate is located between the orthographic projection of the array layer on the substrate and the orthographic projection of the end of the inorganic encapsulation layer away from the display area on the substrate.

11. The display panel according to claim 9, characterized in that, The first encapsulation layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially in a direction away from the substrate, wherein the orthogonal projection of the first sublayer on the substrate covers the orthogonal projection of the filling structure on the substrate.

12. The display panel according to claim 11, characterized in that, In the non-display area, the first sub-layer, which is partially away from the display area, is in contact with the third sub-layer, which is partially away from the display area. The orthographic projection of the third sublayer onto the substrate lies within the orthographic projection of the first sublayer onto the substrate.

13. The display panel according to claim 1, characterized in that, The surface of the filling structure facing away from the substrate and the surface of the inorganic encapsulation layer facing away from the substrate are on the same plane.

14. The display panel according to claim 1, characterized in that, The non-display area includes a first sub-area, a second sub-area, a third sub-area, and a fourth sub-area that are connected to each other. The first sub-area and the second sub-area are located on opposite sides in the width direction of the display area, and the third sub-area and the fourth sub-area are located on opposite sides in the length direction of the display area. The groove is provided in the inorganic encapsulation layer located in the first sub-area and / or the inorganic encapsulation layer located in the second sub-area.

15. The display panel according to claim 14, characterized in that, The number of grooves is multiple, and the multiple grooves are arranged at intervals around the display area, and each groove is provided with the filling structure.

16. The display panel according to claim 1, characterized in that, The display panel also includes: An array layer is disposed on one side of the substrate, wherein the inorganic encapsulation layer is disposed in the same layer as at least a portion of the inorganic film layers in the array layer; The groove penetrates the inorganic encapsulation layer.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 16.

Citation Information

Patent Citations

  • Flexible display panel and display device

    CN109065577A

  • Display panel and display device

    CN110556407A

  • Display panel and production method thereof

    CN113644099A

  • Display panel and display terminal

    CN115275045A

  • Display panel and display device

    CN116018031A