Three-dimensional printing method, apparatus, device, and storage medium

Abstract

Embodiments of the present disclosure relate to a three-dimensional printing method, device, equipment and storage medium, wherein the method comprises: obtaining a target exposure image and a neighboring exposure image, wherein the neighboring exposure image is a next frame exposure image corresponding to the target exposure image; determining a top layer image region based on the target exposure image and the neighboring exposure image, wherein the top layer image region is an image region in the target exposure image that is different from the neighboring exposure image; determining a real model height and an estimated forming height corresponding to the top layer image region; and if the real model height is not equal to the estimated forming height, adjusting a forming thickness corresponding to the top layer image region in a three-dimensional printing process, so that an actual forming height corresponding to the top layer image region is equal to the real model height. According to the embodiments of the present disclosure, the vertical printing precision can be improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to the technical field of three-dimensional printing, and in particular to a three-dimensional printing method, device, equipment and storage medium. BACKGROUND

[0002] Three-dimensional printing is a rapid prototyping technology. The principle of light-curing-based three-dimensional printing is to obtain a plurality of layer contour data by cutting a three-dimensional model horizontally layer by layer at a fixed layer thickness as an interval from bottom to top, then fill each layer contour data to generate an exposure image, then take each of the plurality of exposure images as a current exposure image, and perform the following printing operation based on the current exposure image: using ultraviolet light to irradiate a resin material through the current exposure image to make it solidify, thereby finally printing the model layer by layer on a printing platform.

[0003] However, there is often a difference between the forming height and the real height of the three-dimensional model, resulting in low vertical printing precision. SUMMARY

[0004] To solve the above technical problems or at least partially solve the above technical problems, embodiments of the present disclosure provide a three-dimensional printing method, device, equipment and storage medium.

[0005] A first aspect of embodiments of the present disclosure provides a three-dimensional printing method, the method comprising:

[0006] obtaining a target exposure image and a neighboring exposure image, wherein the neighboring exposure image is a next frame exposure image corresponding to the target exposure image;

[0007] determining a top layer image area based on the target exposure image and the neighboring exposure image, wherein the top layer image area is an image area in the target exposure image that is different from the neighboring exposure image;

[0008] determining a real model height and an estimated forming height corresponding to the top layer image area;

[0009] if the real model height is not equal to the estimated forming height, adjusting a forming thickness corresponding to the top layer image area in a three-dimensional printing process, so that an actual forming height corresponding to the top layer image area is equal to the real model height.

[0010] A second aspect of embodiments of the present disclosure provides a three-dimensional printing device, the device comprising:

[0011] a first obtaining module configured to obtain a target exposure image and a neighboring exposure image, wherein the neighboring exposure image is a next frame exposure image corresponding to the target exposure image;

[0012] The first determining module is configured to determine a top layer image area based on the target exposure image and the adjacent exposure image, wherein the top layer image area is an image area in the target exposure image that is different from the adjacent exposure image.

[0013] The second determining module is configured to determine a real model height corresponding to the top layer image area and an estimated forming height.

[0014] The adjusting module is configured to adjust a forming thickness corresponding to the top layer image area in the three-dimensional printing process if the real model height is not equal to the estimated forming height, so that an actual forming height corresponding to the top layer image area is equal to the real model height.

[0015] A third aspect of the embodiments of the present disclosure provides an electronic device, the server comprising: a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the method of the first aspect.

[0016] A fourth aspect of the embodiments of the present disclosure provides a computer readable storage medium, the storage medium stores a computer program, and when the computer program is executed by a processor, the method of the first aspect can be implemented.

[0017] The technical solutions provided by the embodiments of the present disclosure have the following advantages compared with the prior art:

[0018] In the embodiments of the present disclosure, the target exposure image and the adjacent exposure image can be obtained, wherein the adjacent exposure image is a next frame exposure image corresponding to the target exposure image; the top layer image area is determined based on the target exposure image and the adjacent exposure image, wherein the top layer image area is an image area in the target exposure image that is different from the adjacent exposure image; the real model height corresponding to the top layer image area and the estimated forming height are determined; and if the real model height is not equal to the estimated forming height, the forming thickness corresponding to the top layer image area is adjusted in the three-dimensional printing process, so that the actual forming height corresponding to the top layer image area is equal to the real model height. As can be seen, the top layer image area can be identified from the target exposure image by using the above technical solutions, and the forming thickness corresponding to the top layer image area is adjusted in the three-dimensional printing process, so that the actual forming height corresponding to the top layer image area is equal to the real model height. Thus, the problem that the actual forming height is not equal to the real model height in the prior art is solved, and the vertical printing precision is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0020] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 It is a structural schematic diagram of a three-dimensional model provided by related technologies;

[0022] Figure 2 This is a schematic diagram of another three-dimensional model provided by related technologies;

[0023] Figure 3 This is a flowchart of a 3D printing method provided in an embodiment of this disclosure;

[0024] Figure 4 This is a schematic diagram of the structure of a batch of three-dimensional models provided in the embodiments of this disclosure;

[0025] Figure 5 This is a schematic diagram of the structure of a three-dimensional model provided in an embodiment of this disclosure;

[0026] Figure 6 This is a schematic diagram of another three-dimensional model provided in an embodiment of this disclosure;

[0027] Figure 7 This is a schematic diagram of the structure of another three-dimensional model provided in this embodiment of the disclosure;

[0028] Figure 8 This is a schematic diagram of the structure of another three-dimensional model provided in the embodiments of this disclosure;

[0029] Figure 9 This is a flowchart illustrating another 3D printing method provided in an embodiment of this disclosure;

[0030] Figure 10 This is a schematic diagram of the structure of a three-dimensional printing device provided in an embodiment of this disclosure;

[0031] Figure 11 This is a schematic diagram of the structure of an electronic device according to an embodiment of this disclosure. Detailed Implementation

[0032] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0033] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0034] The applicant discovered through research that the main reason for the difference between the projected height and the actual height of the 3D model is that the actual height of the 3D model is not an integer multiple of the fixed layer thickness. For example, Figure 1 This is a structural diagram of a three-dimensional model provided by related technologies. Figure 2 This is a schematic diagram of another three-dimensional model provided by related technologies; see [link / reference]. Figure 1 and Figure 2 `layerID` represents the slice number. The remaining height `hoffset` is defined as the portion of the actual height of the 3D model (`hexp`) that is less than a fixed layer thickness `h`. See also... Figure 1 When the remaining height hoffset is less than 0.5 times the fixed layer thickness h, printing ends after the printing operation based on the first n exposure images, resulting in the formed height hori of the generated printed model being less than the actual height hexp of the 3D model. See also... Figure 2 When the remaining height is greater than 0.5 times the fixed layer thickness h, after printing based on the first n exposure images, printing continues based on the (n+1)th exposure image. Since each layer of exposure images generates a fixed layer thickness h with a fixed exposure intensity, the resulting printed model's height is greater than the actual height hexp of the 3D model. Therefore, when the actual height of the 3D model is not an integer multiple of the fixed layer thickness, there will be a difference between the model's printed height and its actual height, resulting in low vertical accuracy. To solve the above technical problems, this disclosure provides a 3D printing method, apparatus, medium, and electronic device. The 3D printing method provided in this disclosure will be described in detail below.

[0035] Figure 3 This is a flowchart illustrating a 3D printing method provided in an embodiment of this disclosure. This method can be executed by an electronic device. The electronic device can be exemplarily understood as a device such as a mobile phone, tablet computer, laptop computer, desktop computer, or smart TV. Figure 3 As shown, the method provided in this embodiment includes the following steps:

[0036] S310. Acquire the target exposure image and the adjacent exposure image, wherein the adjacent exposure image is the next frame exposure image corresponding to the target exposure image.

[0037] Specifically, by slicing a 3D model at fixed intervals from bottom to top with fixed slice thicknesses, N (N is a positive integer greater than 1) slice layers can be obtained (e.g. Figure 4 The diagram shows 12 slice layers (QP) and the corresponding exposure image for each slice layer. If the target exposure image is the exposure image corresponding to the nth slice layer, then when 1 ≤ n < N, the adjacent exposure image is the exposure image corresponding to the (n+1)th slice layer. When n = N, a blank exposure image can be used as the adjacent exposure image.

[0038] It should also be noted that in the scenario of printing a single 3D model, the exposure image is obtained by slicing that 3D model individually. However, in the scenario of printing multiple 3D models together (e.g., ...), the exposure image is obtained by slicing that 3D model individually. Figure 4 The three 3D models (410) in the image are obtained by slicing the multiple 3D models together.

[0039] S320. Determine the top-level image region based on the target exposure image and adjacent exposure images, wherein the top-level image region is the image region in the target exposure image that differs from the adjacent exposure images.

[0040] Specifically, the top-level image region is the image region corresponding to the top of the 3D model. It should be noted that the "top" mentioned here includes the local top (e.g., the top of the model itself). Figure 5 The top of the local area (510) and the top of the highest point (e.g.) Figure 5 The highest top of the middle (520).

[0041] It is understandable that if a certain image region in the target exposure image cannot be found in adjacent exposure images, it means that the height of the portion of the 3D model from which that image region is cut is insufficient to obtain the corresponding image region in the next slicing. In other words, that image region corresponds to at least a portion of the top of the 3D model. Based on this, the top layer image region can be determined by comparing the target exposure image and adjacent exposure images.

[0042] In some embodiments, S320 may include: subtracting adjacent exposure images from the target exposure image using Boolean subtraction to obtain a Boolean subtraction result; and determining the top-level image region based on the Boolean subtraction result.

[0043] In one example, determining the top-level image region based on the Boolean subtraction result can include directly using the Boolean subtraction result as the top-level image region. This makes determining the top-level image region simple and convenient.

[0044] In another example, determining the top-level image region based on the Boolean subtraction result can include performing erosion processing, noise reduction processing, and dilation reduction processing on the Boolean subtraction result in sequence to obtain the top-level image region.

[0045] Understandably, the top of a 3D model typically includes two types. The first type exists only in the slice layer corresponding to the target exposure image, and is completely absent from the slice layers corresponding to adjacent exposure images (e.g., ...). Figure 5 The top layer (510 shown in the diagram) corresponds to the top layer image region that can be directly obtained through Boolean subtraction; the second type exists both in the slice layer corresponding to the target exposure image and in the slice layer corresponding to adjacent exposure images (such as...). Figure 6 The top part (610) shown is a local area, but because its area differs between the target exposed image and adjacent exposed images, it can also be obtained as a detection result during Boolean subtraction. This is the top layer image region we expect to obtain. However, to eliminate slopes and other noise interference, further filtering can be performed. That is, the Boolean subtraction result is first subjected to erosion processing with parameter α to eliminate noise, and then dilation and reduction processing is performed to achieve the purpose of filtering noise. In this way, the obtained top layer image region can be more accurate.

[0046] Of course, AI (neural network model) methods can be used to determine the top-level image region based on the target exposure image and adjacent exposure images. This application does not limit this approach.

[0047] S330. Determine the actual model height and estimated molding height corresponding to the top image region.

[0048] Specifically, the estimated molding height refers to the height of the printed model after obtaining the estimated molding thickness based on the top image region with an estimated exposure intensity, where the estimated molding thickness is a fixed slice layer thickness.

[0049] For example, if a 3D model is sliced ​​from bottom to top with a fixed slice thickness h, then the estimated forming thickness corresponding to each exposure image is h. In this case, if the target exposure image is the exposure image corresponding to the nth slice layer, then the estimated forming height hori = n*h.

[0050] Specifically, the actual model height is the height of the top layer of the top image region in the 3D model.

[0051] In some embodiments, determining the true model height corresponding to the top-level image region includes:

[0052] S331. Perform pixel sampling on the top-level image region to obtain multiple sampling points.

[0053] Specifically, a sampling point is a two-dimensional pixel point sampled from the top-level image region.

[0054] S332. For each sampling point, determine the corresponding 3D point on the 3D model corresponding to the sampling point in the top layer image area, determine the intersection point of the straight line passing through the 3D point and extending in the direction of the model height with the surface of the 3D model, and determine the height corresponding to the sampling point as the height of the intersection point on the 3D model whose difference from the estimated forming height is less than or equal to the estimated forming thickness.

[0055] Specifically, the model height direction is the direction perpendicular to the slice layer. For example, if the plane containing the slice layer is parallel to the XY plane, then the model height direction is the Z direction.

[0056] Specifically, the height of the intersection point on the 3D model refers to the height of the horizontal plane at which the intersection point is located, parallel to the slice layer.

[0057] Specifically, based on the mapping relationship between the image coordinates of pixels in the top-level image region and the 3D coordinates of 3D points on the 3D model, the 3D point corresponding to the sampling point can be determined.

[0058] S333. Determine the true model height corresponding to the top-level image region based on the height corresponding to each sampling point.

[0059] Specifically, the average height of each sampling point can be used as the true model height corresponding to the top-level image region. Alternatively, the minimum and maximum heights can be removed from the heights of each sampling point before calculating the average height as the true model height corresponding to the top-level image region. This application does not limit this approach.

[0060] For example, see Figure 7 and Figure 8 Three sampling points were randomly selected from the top image region (e.g., Figure 7 and Figure 8 The circular points shown are used to obtain the three-dimensional coordinates of three 3D points based on the image coordinates of the three sampling points. For each 3D point, a straight line is drawn vertically upwards from the point Z = -∞ at the X and Y coordinates of that 3D point. The intersection point of the straight line with the surface of the 3D model is determined (e.g., the circular points shown). Figure 7 and Figure 8 (The square points shown in the image) The Z-coordinates of the intersection points are stored in a Z-coordinate list. From the Z-coordinates of the intersection points, the heights that are within the range of the estimated molding layer thickness and are the distance from the estimated molding height (hori) are selected as the heights corresponding to the sampling points (e.g., ...). Figure 7 and Figure 8 (The three sampling points in the middle have the same height), and finally the average height of the top model corresponding to the top of the top image region is obtained by averaging the heights of each sampling point.

[0061] It is understandable that by setting up pixel sampling of the top-level image region to obtain multiple sampling points, determining the height corresponding to the sampling points, and determining the height of the real model corresponding to the top-level image region based on the height of each sampling point, the method of determining the height of the real model is simple, convenient, and not cumbersome, which helps to reduce the implementation difficulty of determining the height of the real model.

[0062] Optionally, the area of ​​the top-level image region is positively correlated with the number of sampling points.

[0063] Understandably, by setting the area of ​​the top-level image region to be positively correlated with the number of sampling points, when the area of ​​the top-level image region is relatively large, a sufficient number of sampling points can be obtained to determine the true model height corresponding to the top-level image region. This helps to reduce the risk of low accuracy in calculating the true model height due to a small number of sampling points. Conversely, when the area of ​​the top-level image region is relatively large, a smaller number of sampling points can be obtained to determine the true model height corresponding to the top-level image region, reducing the computational load and improving the efficiency of determining the true model height.

[0064] Of course, AI can also be used to determine the actual model height corresponding to the top image region, and this application does not limit this.

[0065] S340. If the actual model height is not equal to the estimated molding height, adjust the molding thickness corresponding to the top layer image area during the 3D printing process so that the actual molding height corresponding to the top layer image area is equal to the actual model height.

[0066] Specifically, the actual molding height is the actual molding height of the top of the printed model corresponding to the top layer image area, obtained after exposure of the top layer image area. It should be noted that the actual molding height equals the actual model height, meaning that the error between the two is within a preset error range. This preset error range can be set by those skilled in the art according to actual conditions, and is not limited here.

[0067] Specifically, in the photopolymerization process, the greater the exposure intensity, the greater the thickness of the cured material layer; conversely, the smaller the exposure intensity, the smaller the thickness of the cured material layer. Therefore, the exposure intensity can be adjusted by adjusting the image grayscale of the top image area, thereby adjusting the corresponding thickness of the top image area.

[0068] It is understandable that when the actual model height is not equal to the estimated forming height, if the forming thickness corresponding to the top image region is not adjusted as in related technologies, the forming thickness corresponding to the top image region will be the same as the forming thickness corresponding to other image regions in the target exposure image, both being estimated forming thicknesses. This results in an inconsistency between the actual model height and the estimated forming height corresponding to the top image region, leading to lower vertical printing accuracy. However, in this embodiment, when the actual model height is not equal to the estimated forming height, the forming thickness corresponding to the top image region can be adjusted to make the actual forming height corresponding to the top image region equal to the actual model height, thereby improving vertical printing accuracy.

[0069] This embodiment of the invention can identify the top layer image region from the target exposure image and adjust the molding thickness corresponding to the top layer image region during the 3D printing process so that the actual molding height corresponding to the top layer image region is equal to the height of the real model. This solves the problem in the prior art that the actual molding height is not equal to the height of the real model, thereby improving the vertical printing accuracy.

[0070] Figure 9 This is a schematic flowchart of another 3D printing method provided in this disclosure. This disclosure optimizes the above embodiments and can be combined with various optional solutions from one or more of the above embodiments.

[0071] like Figure 9 As shown, the 3D printing method may include the following steps.

[0072] S910. Acquire the target exposure image and the adjacent exposure image, wherein the adjacent exposure image is the next frame exposure image corresponding to the target exposure image.

[0073] Specifically, the S910 is similar to the S310, and will not be described in detail here.

[0074] S920. Determine the top-level image region based on the target exposure image and adjacent exposure images, wherein the top-level image region is the image region in the target exposure image that differs from the adjacent exposure images.

[0075] Specifically, the S920 is similar to the S320, and will not be described in detail here.

[0076] S930. Determine the actual model height and estimated molding height corresponding to the top image region.

[0077] Specifically, the S930 is similar to the S330, and will not be described in detail here.

[0078] S940. Determine the remaining height based on the actual model height and the estimated molding height.

[0079] Specifically, see [link to relevant documentation] Figure 7If the estimated molding height is less than the actual model height, the remaining height is the difference between the actual model height and the estimated molding height, i.e., hoffset = hexp - hori. See also... Figure 8 If the estimated molding height is greater than the actual model height, first subtract the estimated molding thickness from the estimated molding height to obtain the intermediate estimated molding height, then subtract the intermediate estimated molding height from the actual model height to obtain the remaining height, i.e., hoffset = hexp - (hori - h).

[0080] S950. If the estimated molding height is less than the actual model height, the estimated molding thickness is obtained by exposing the target exposure image with the estimated exposure intensity, and the compensated molding thickness is obtained by exposing the top layer image area with the compensated exposure intensity, wherein the compensated molding thickness is equal to the remaining height.

[0081] Specifically, the molding thickness corresponding to the top image area is the sum of the estimated molding thickness and the compensated molding thickness.

[0082] In some embodiments, obtaining the compensated forming thickness based on the top image region with compensated exposure intensity includes: if the target exposure image is the last layer exposure image, then after obtaining the estimated forming thickness based on the target exposure image with estimated exposure intensity, the compensated forming thickness can be obtained directly based on the top image region with compensated exposure intensity.

[0083] Specifically, "target exposure image is the last exposure image" means that "target exposure image is the exposure image corresponding to the Nth slice layer".

[0084] Specifically, the estimated exposure intensity is the exposure intensity at which the thickness of the solidified layer of material is determined by irradiating the material with the target exposure image.

[0085] Specifically, the compensated exposure intensity is the exposure intensity at which the thickness of the solidified layer of material is equal to the compensated molding thickness when the material is irradiated through the top image area, where the compensated molding thickness is equal to the remaining height.

[0086] In other embodiments, obtaining a compensated forming thickness based on the top-level image region with compensated exposure intensity includes: if the target exposure image is not the last layer exposure image, then obtaining an estimated forming thickness based on the target exposure image with an estimated exposure intensity, and then obtaining a compensated forming thickness based on the top-level image region and adjacent exposure images with compensated exposure intensity; the method further includes: obtaining a first supplemented forming thickness based on adjacent exposure images with a first supplemented exposure intensity, wherein the sum of the compensated forming thickness and the first supplemented forming thickness is the estimated forming thickness.

[0087] Specifically, the first fill-in exposure intensity is the exposure intensity at which the thickness of the solidified layer of material is the first fill-in forming thickness when the material is irradiated by adjacent exposure images, wherein the first fill-in forming thickness is the difference obtained by subtracting the remaining height from the estimated forming thickness.

[0088] For example, such as Figure 7 As shown, if the estimated forming height *hori* is less than the actual model height *hexp*, and the forming thickness corresponding to the top image region is not adjusted, the actual height of the part corresponding to the top image region after forming will be less than the actual model height of the 3D model. Therefore, it is necessary to compensate with an exposure action whose thickness is the remaining height *hoffset* and whose exposure image is the top image region. Specifically, if n = N, then after obtaining the estimated forming thickness by exposing the target exposure image with the estimated exposure intensity, an additional exposure action is added to compensate for the forming thickness with the remaining height *hoffset* and whose exposure image is the top image region. If n < N, then after obtaining the estimated forming thickness by exposing the target exposure image with the estimated exposure intensity, the exposure actions corresponding to adjacent exposure images need to be divided into two sub-processes. The forming thickness of the first sub-process is the remaining height *hoffset*, and the exposure image used is the Boolean combination of the top image region and the adjacent image region. The forming thickness of the second sub-process is the difference between the estimated forming thickness *h* and the remaining height *hoffset* (i.e., *h - *hoffset*), and the exposure image used is the adjacent image region.

[0089] Understandably, by dividing the exposure action of adjacent exposure images into two sub-processes, there is no need to add an additional step based on the top image region to compensate for the exposure intensity and obtain the compensated forming thickness. This ensures that adjusting the forming thickness of the top image region will not increase the exposure steps, nor will it affect the normal printing of other 3D models that are being 3D printed together.

[0090] S960. If the estimated molding height is greater than the actual model height, the loss molding thickness is obtained by exposing the top image area with loss exposure intensity, where the loss molding thickness is equal to the remaining height.

[0091] Specifically, the forming thickness corresponding to the top image area is the loss forming thickness, i.e., the remaining height.

[0092] In some embodiments, obtaining the loss molding thickness by exposing the top image region with a lossy exposure intensity includes: if the target exposure image is the last layer exposure image, then the loss molding thickness can be obtained directly by exposing the top image region with a lossy exposure intensity.

[0093] Specifically, the loss exposure intensity is the exposure intensity at which the thickness of the solidified layer of material is equal to the loss molding thickness, achieved by irradiating the material through the top image area.

[0094] In other embodiments, the loss molding thickness is obtained by exposing the top image region with a lossy exposure intensity, including: if the target exposure image is not the last layer exposure image, the loss molding thickness is obtained by exposing the top image region and adjacent exposure images with a lossy exposure intensity; the method further includes: obtaining a second fill molding thickness by exposing the adjacent exposure images with a second fill exposure intensity, wherein the sum of the compensated molding thickness and the second fill molding thickness is the estimated molding thickness.

[0095] Specifically, the second fill-in exposure intensity is the exposure intensity at which the thickness of the solidified layer of material is the second fill-in molding thickness when the material is irradiated by adjacent exposure images, wherein the second fill-in molding thickness is the difference obtained by subtracting the remaining height from the estimated molding thickness.

[0096] For example, see [link to example]. Figure 8 If the estimated forming height *hori* is greater than the actual model height *hexp*, and the forming thickness corresponding to the top image region is not adjusted, the actual height of the formed portion corresponding to the top image region will be greater than the actual height of the 3D model. Therefore, it is necessary to replace the original exposure action with the estimated forming thickness *h* and the top image region with an exposure action using a forming thickness of *hoffset* and the top image region as the exposure image. Specifically, if n = N, then the forming thickness of the last layer's exposure action can be directly modified to the remaining height *hoffset*, and the exposure image can be replaced by the top image region instead of the target exposure image. If n < N, the exposure action corresponding to adjacent exposure images needs to be divided into two sub-processes. The forming thickness of the first sub-process is the remaining *hoffset*, and the exposure image used is the Boolean union result of the top image region and the adjacent exposure image. The forming thickness of the second sub-process is the difference between the estimated forming thickness *h* and the remaining height *hoffset* (i.e., *h - *hoffset*), and the exposure image used is the adjacent image region.

[0097] Understandably, by dividing the exposure action of adjacent exposure images into two sub-processes, there is no need to add an extra step of losing exposure intensity to obtain the loss molding thickness based on the top image region. This ensures that adjusting the molding thickness of the top image region will not increase the exposure steps, nor will it affect the normal printing of other 3D models that are being 3D printed together.

[0098] This embodiment of the invention can obtain a compensated molding thickness by exposing the top image region with a compensated exposure intensity when the estimated molding height is less than the actual model height, and obtain a lost molding thickness by exposing the top image region with a lost exposure intensity when the estimated molding height is greater than the actual model height. This achieves adjustment of the molding thickness corresponding to the top image region, thereby making the actual molding height corresponding to the top image region consistent with the actual model height of the three-dimensional model and improving vertical printing accuracy.

[0099] Figure 10 This is a schematic diagram of the structure of a 3D printing device provided in an embodiment of this disclosure. This 3D printing device can be understood as the aforementioned electronic device or a functional module within the aforementioned electronic device. For example... Figure 10 As shown, the 3D printing apparatus 1000 includes:

[0100] The first acquisition module 1010 is used to acquire a target exposure image and adjacent exposure images, wherein the adjacent exposure image is the next frame exposure image corresponding to the target exposure image;

[0101] The first determining module 1020 is used to determine a top-level image region based on the target exposure image and the adjacent exposure images, wherein the top-level image region is an image region in the target exposure image that differs from the adjacent exposure images;

[0102] The second determining module 1030 is used to determine the actual model height and the estimated molding height corresponding to the top-level image region;

[0103] The adjustment module 1040 is used to adjust the molding thickness corresponding to the top layer image area during the 3D printing process if the actual model height is not equal to the estimated molding height, so that the actual molding height corresponding to the top layer image area is equal to the actual model height.

[0104] In another embodiment of this disclosure, the first determining module 1020 may include:

[0105] The first processing submodule is used to subtract the adjacent exposure image from the target exposure image using Boolean subtraction to obtain a Boolean subtraction result;

[0106] The second processing submodule is used to sequentially perform erosion processing, noise reduction processing, and dilation reduction processing on the Boolean subtraction result to obtain the top layer image region.

[0107] In yet another embodiment of this disclosure, the second determining module 1030 may include:

[0108] The sampling submodule is used to perform pixel sampling on the top-level image region to obtain multiple sampling points;

[0109] The first determining submodule is used to determine, for each sampling point, a three-dimensional point corresponding to the sampling point on the three-dimensional model corresponding to the top layer image region, determine the intersection point of the straight line passing through the three-dimensional point and extending in the direction of model height with the surface of the three-dimensional model, and determine the height corresponding to the sampling point as the height of the intersection point on the three-dimensional model whose difference from the estimated molding height is less than or equal to the estimated molding thickness.

[0110] The second determining submodule is used to determine the height of the real model corresponding to the top-level image region based on the height corresponding to each of the sampling points.

[0111] In another embodiment of this disclosure, the area of ​​the top-level image region is positively correlated with the number of sampling points.

[0112] In another embodiment of this disclosure, the adjustment module 1040 may include:

[0113] The third determining submodule is used to determine the remaining height based on the actual model height and the estimated forming height;

[0114] The first exposure submodule is used to obtain an estimated forming thickness by exposing the target exposure image with an estimated exposure intensity based on the target exposure image if the estimated forming height is less than the actual model height, and to obtain a compensated forming thickness by exposing the top layer image region with a compensated exposure intensity, wherein the compensated forming thickness is equal to the remaining height.

[0115] The second exposure submodule is used to obtain a loss molding thickness by exposing the top layer image region with a lossy exposure intensity if the estimated molding height is greater than the actual model height, wherein the loss molding thickness is equal to the remaining height.

[0116] In another embodiment of this disclosure, the first exposure submodule may include:

[0117] The first exposure unit is used to obtain the compensated forming thickness by exposing the top layer image region and the adjacent exposure images with the compensated exposure intensity if the target exposure image is not the last layer exposure image.

[0118] The device further includes a third exposure submodule, used to obtain a first compensation molding thickness by exposing the adjacent exposure images with a first compensation exposure intensity, wherein the sum of the compensation molding thickness and the first compensation molding thickness is the estimated molding thickness.

[0119] In another embodiment of this disclosure, the second exposure submodule may include:

[0120] The second exposure unit is used to obtain the loss forming thickness by exposing the top layer image region and the adjacent exposure images with the loss exposure intensity if the target exposure image is not the last layer exposure image.

[0121] The device further includes a fourth exposure submodule, used to obtain a second filler molding thickness by exposing the adjacent exposure images with a second filler exposure intensity, wherein the sum of the compensated molding thickness and the second filler molding thickness is the estimated molding thickness.

[0122] The apparatus provided in this embodiment can execute the methods of any of the above embodiments, and its execution method and beneficial effects are similar, so they will not be described again here.

[0123] This disclosure also provides an electronic device, which includes: a memory storing a computer program; and a processor for executing the computer program, wherein when the computer program is executed by the processor, it can implement the methods of any of the above embodiments.

[0124] Example, Figure 11 This is a schematic diagram of the structure of an electronic device according to an embodiment of this disclosure. See below for details. Figure 11 The diagram illustrates a structural schematic suitable for implementing the electronic device 1100 in the embodiments of this disclosure. The electronic device 1100 in the embodiments of this disclosure may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 11 The electronic device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments disclosed herein.

[0125] like Figure 11 As shown, electronic device 1100 may include a processing device (e.g., a central processing unit, a graphics processing unit, etc.) 1101, which can perform various appropriate actions and processes according to a program stored in read-only memory (ROM) 1102 or a program loaded from storage device 1108 into random access memory (RAM) 1103. The RAM 1103 also stores various programs and data required for the operation of electronic device 1100. The processing device 1101, ROM 1102, and RAM 1103 are interconnected via bus 1104. Input / output (I / O) interface 1105 is also connected to bus 1104.

[0126] Typically, the following devices can be connected to I / O interface 1105: input devices 1106 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output devices 1107 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1108 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1109. Communication device 1109 allows electronic device 1100 to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 11 An electronic device 1100 with various devices is shown; however, it should be understood that it is not required to implement or possess all of the devices shown. More or fewer devices may be implemented or possessed alternatively.

[0127] In particular, according to embodiments of this disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this disclosure include a computer program product comprising a computer program carried on a non-transitory computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication device 1109, or installed from storage device 1108, or installed from ROM 1102. When the computer program is executed by processing device 1101, it performs the functions defined in the methods of embodiments of this disclosure.

[0128] It should be noted that the computer-readable medium described in this disclosure can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this disclosure, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in connection with an instruction execution system, apparatus, or device. In this disclosure, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.

[0129] In some implementations, clients and servers can communicate using any currently known or future-developed network protocol such as HTTP (Hypertext Transfer Protocol) and can interconnect with digital data communication (e.g., communication networks) of any form or medium. Examples of communication networks include local area networks (“LANs”), wide area networks (“WANs”), the Internet (e.g., the Internet of Things), and peer-to-peer networks (e.g., ad hoc peer-to-peer networks), as well as any currently known or future-developed networks.

[0130] The aforementioned computer-readable medium may be included in the aforementioned electronic device; or it may exist independently and not assembled into the electronic device.

[0131] The aforementioned computer-readable medium carries one or more programs that, when executed by the electronic device, cause the electronic device to:

[0132] Acquire the target exposure image and adjacent exposure images, where the adjacent exposure image is the next frame exposure image corresponding to the target exposure image;

[0133] The top-level image region is determined based on the target exposure image and adjacent exposure images, wherein the top-level image region is the image region in the target exposure image that differs from the adjacent exposure images;

[0134] Determine the actual model height and estimated molding height corresponding to the top image region;

[0135] If the actual model height is not equal to the estimated molding height, the molding thickness corresponding to the top layer image area is adjusted during the 3D printing process so that the actual molding height corresponding to the top layer image area is equal to the actual model height.

[0136] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including but not limited to object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0137] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0138] The units described in the embodiments of this disclosure can be implemented in software or hardware. The names of the units are not, in some cases, intended to limit the specific unit.

[0139] The functions described above in this document can be performed, at least in part, by one or more hardware logic components. For example, exemplary types of hardware logic components that can be used, without limitation, include: Field Programmable Gate Arrays (FPGAs), Application-Specific Integrated Circuits (ASICs), Application Standard Products (ASSPs), System-on-Chip (SoCs), Complex Programmable Logic Devices (CPLDs), and so on.

[0140] In the context of this disclosure, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0141] This disclosure also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it can implement the methods of any of the above embodiments. The execution method and beneficial effects are similar, and will not be described again here.

[0142] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0143] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A three-dimensional printing method, characterized in that, include: Acquire a target exposure image and adjacent exposure images, wherein the adjacent exposure image is the next frame exposure image corresponding to the target exposure image, wherein if the target exposure image is the exposure image corresponding to the nth slice layer, then when 1≤n<N, the adjacent exposure image is the exposure image corresponding to the (n+1)th slice layer, and when n=N, the adjacent exposure image is a blank exposure image; A top-level image region is determined based on the target exposure image and the adjacent exposure images, wherein the top-level image region is the image region in the target exposure image that differs from the adjacent exposure images; Determine the actual model height and estimated molding height corresponding to the top-level image region; If the actual model height is not equal to the estimated molding height, the molding thickness corresponding to the top layer image area is adjusted during the 3D printing process so that the actual molding height corresponding to the top layer image area is equal to the actual model height.

2. The method according to claim 1, characterized in that, The step of determining the top-level image region based on the target exposure image and the adjacent exposure images includes: Subtract the adjacent exposed image from the target exposed image using Boolean subtraction to obtain the Boolean subtraction result; The Boolean subtraction result is subjected to erosion processing, noise reduction processing, and dilation reduction processing in sequence to obtain the top layer image region.

3. The method according to claim 2, characterized in that, Determining the true model height corresponding to the top-level image region includes: Multiple sampling points are obtained by sampling pixels in the top-level image region; For each sampling point, a three-dimensional point corresponding to the sampling point is determined on the three-dimensional model corresponding to the top image region. The intersection point of the straight line passing through the three-dimensional point and extending in the direction of model height with the surface of the three-dimensional model is determined. The height corresponding to the sampling point is determined as the height of the intersection point on the three-dimensional model whose difference from the estimated molding height is less than or equal to the estimated molding thickness. The height of the real model corresponding to the top-level image region is determined based on the height corresponding to each sampling point.

4. The method according to claim 3, characterized in that, The area of ​​the top-level image region is positively correlated with the number of sampling points.

5. The method according to claim 1, characterized in that, If the actual model height is not equal to the estimated molding height, adjusting the molding thickness corresponding to the top layer image region during the 3D printing process to make the actual molding height corresponding to the top layer image region equal to the actual model height includes: The remaining height is determined based on the actual model height and the estimated molding height. If the estimated forming height is less than the actual model height, then the estimated forming thickness is obtained by exposing the target exposure image with the estimated exposure intensity, and the compensated forming thickness is obtained by exposing the top layer image region with the compensated exposure intensity, wherein the compensated forming thickness is equal to the remaining height; If the estimated molding height is greater than the actual model height, then the loss molding thickness is obtained by exposing the top layer image region with loss exposure intensity, wherein the loss molding thickness is equal to the remaining height.

6. The method according to claim 5, characterized in that, The process of obtaining compensated molding thickness by exposing based on the top-level image region with compensated exposure intensity includes: If the target exposure image is not the last layer exposure image, the compensated forming thickness is obtained by exposing the top layer image region and the adjacent exposure images with the compensated exposure intensity. The method further includes: obtaining a first compensation molding thickness by exposing the adjacent exposure images with a first compensation exposure intensity, wherein the sum of the compensation molding thickness and the first compensation molding thickness is the estimated molding thickness.

7. The method according to claim 5, characterized in that, The process of obtaining the loss-forming thickness by exposing the top-level image region with lossy exposure intensity includes: If the target exposure image is not the last layer exposure image, the loss forming thickness is obtained by exposing the top layer image region and the adjacent exposure images with the loss exposure intensity. The method further includes: obtaining a second filler molding thickness by exposing the adjacent exposure images with a second filler exposure intensity, wherein the sum of the compensated molding thickness and the second filler molding thickness is the estimated molding thickness.

8. A three-dimensional printing apparatus, characterized in that, include: The first acquisition module is used to acquire a target exposure image and an adjacent exposure image, wherein the adjacent exposure image is the next frame exposure image corresponding to the target exposure image, wherein if the target exposure image is the exposure image corresponding to the nth slice layer, then when 1≤n<N the adjacent exposure image is the exposure image corresponding to the (n+1)th slice layer, and when n=N the adjacent exposure image is a blank exposure image; The first determining module is used to determine a top-level image region based on the target exposure image and the adjacent exposure images, wherein the top-level image region is an image region in the target exposure image that differs from the adjacent exposure images; The second determining module is used to determine the actual model height and the estimated molding height corresponding to the top-level image region; An adjustment module is used to adjust the molding thickness corresponding to the top layer image area during the 3D printing process if the actual model height is not equal to the estimated molding height, so that the actual molding height corresponding to the top layer image area is equal to the actual model height.

9. An electronic device, characterized in that, include: A processor and a memory, wherein the memory stores a computer program that, when executed by the processor, performs the method of any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The storage medium stores a computer program that, when executed by a processor, implements the method as described in any one of claims 1-7.

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