Optical assembly and electronic device

Abstract

The invention provides an optical assembly and electronic equipment. The optical assembly comprises a camera module, a light source, a light receiver and a light guide part. The camera module comprises a substrate, a structural member, an image sensor and a lens. The structural member, the image sensor and the light source are all arranged on the substrate. The image sensor, the lens, and the light receiver are located in an enclosed space of the structural member. The light source and the light receiver are separated by a structure. The light guide part is used for conducting light emitted by the light source to the periphery of the light inlet of the camera module. The camera module and the light source are integrated on the substrate, so that the probe light sensor formed by the light source and the light receiver and the camera module can share one optical window, and the visual effect of the display screen can be improved.

Description

Technical Field

[0001] The present application relates to the design of a detection light sensor in an electronic device, and more particularly to an optical component and an electronic device. Background Art

[0002] In consumer electronic devices such as mobile phones, proximity sensors are often needed to sense the proximity or distance between the user and the electronic device, and to control the electronic device based on the proximity detection results. For example, when the mobile phone is answering a call, if it detects that the distance between the mobile phone and the ear is less than a threshold, the display screen (to reduce power consumption and increase battery life) and the touch screen (to avoid accidental touches on the touch screen) are turned off. Among them, the optical proximity detection sensing method is called proximity light sensing.

[0003] At present, the detection light sensor (for example, the proximity light sensor) in consumer electronic devices is generally placed under the screen. In order for the proximity light sensor to work properly, a separate optical window needs to be defined on the display screen for transmitting the light received and emitted by the proximity light sensor. For consumer electronic devices, an optical window corresponding to the front camera also needs to be set on the display screen.

[0004] Setting multiple optical windows on the display screen for the front camera and the proximity light sensor at the same time, due to the large number of openings and their independence, leads to poor visual effects. How to reduce the number of optical windows on the display screen and improve the visual effect while meeting the optical performance of the front camera and the proximity light sensor is the direction of research and development in the industry. Summary of the invention

[0005] The present application provides an optical component and an electronic device. The optical component integrates the functions of a camera module and a detection light sensor, and can reduce the optical window on the display screen and improve the visual effect while meeting the optical performance of the front camera and the detection light sensor.

[0006] In a first aspect, an embodiment of the present application provides an optical component, which includes a camera module, a light source, a light receiver and a light guide, wherein the camera module includes a substrate, a structural component, an image sensor and a lens, wherein the image sensor is arranged on the substrate, the structural component is cylindrical and one end of which is connected to the substrate, the structural component and the substrate are jointly arranged to form an enclosed space, the image sensor and the lens are located in the enclosed space, and the end of the structural component away from the substrate is a light entrance of the camera module; the light source is arranged on the substrate and is used to send a light signal; the light guide is used to transmit the light signal to the periphery of the light entrance, and the refractive index of the light guide material constituting the light guide is greater than or equal to 1.4; the light receiver is located in the enclosed space, the light source and the light receiver are separated by the structural component, and the light receiver is used to receive the light signal entering the enclosed space through the light entrance.

[0007] The present application integrates the camera module and the detection light sensor into one optical assembly by arranging the light receiver of the detection light sensor in the enclosed space of the structural member, and separating the light source and the light receiver by the structural member. Since the structural member has a light-shielding property, the structural member separates the light receiver and the light source, and can achieve light isolation between the light receiver and the light source, avoid the light crosstalk emitted by the light source to the area where the control chip is located, and can ensure the detection efficiency of the detection light sensor. Moreover, the detection light sensor in the optical assembly provided by the present application uses the peripheral area of ​​the light inlet of the camera module as the light exit area of ​​the light source, that is, the detection light sensor and the camera module can share an optical window on the display screen. Due to the high transmittance of this optical window, it is beneficial to improve the detection efficiency of the detection light sensor. For electronic devices, there is no need to set multiple optical windows on the display screen, so that the visual effect of the display screen is better, the screen-to-body ratio is improved, and it also has the advantage of saving the internal space of the electronic device.

[0008] In a possible implementation, the light guide comprises an inner body and an enveloping layer, the inner body comprises a light incident surface, a light emitting surface and an outer peripheral surface, the outer peripheral surface is connected between the light incident surface and the light emitting surface, the enveloping layer is sleeved on the outer peripheral surface of the inner body, the inner body is all made of the light guiding material, and the enveloping layer is used to achieve the transmission of light from the light incident surface to the light emitting surface in the inner body. This solution provides a specific structure of a light guide, which is formed by combining an inner body and an enveloping layer. The provision of the enveloping layer is conducive to the transmission of light entering the inner body from the light incident surface to the light emitting surface in the inner body, and the light guiding efficiency is high, which can avoid the phenomenon of large amount of light leakage in the light guide.

[0009] In a possible implementation, the surrounding layer is a total reflection film, which is used to achieve total reflection of light in the inner body. This solution can improve the efficiency of light transmission in the inner body and improve the utilization rate of optical signals by setting the surrounding layer as a total reflection film.

[0010] In a possible implementation, the material of the total reflection film is a metal film or a dielectric total reflection film. This solution provides two specific materials for the total reflection film, and a suitable total reflection film can be selected according to specific use requirements, thereby improving the application flexibility of the light guide.

[0011] In a possible implementation, the outer surface of the light guide includes at least one fully reflective curved surface. This solution forms a light transmission path between the light incident surface and the light exit surface by limiting the outer surface of the light guide to include at least one fully reflective curved surface, so that the light signal inside the light guide can be transmitted inside the light guide according to the required path, adapting to the specific use environment of the camera module.

[0012] In a possible implementation, the light guide includes a first curved segment and a second curved segment, the first curved segment is located between the second curved segment and the light incident surface, the number of the total reflection curved surfaces is two, namely the first curved surface and the second curved surface, the first curved surface is the surface of the first curved segment, the second curved surface is the surface of the second curved segment, and the bending radius of the first curved segment is smaller than the bending radius of the second curved segment. This solution provides a specific structural form of a light guide, and the formation of the first curved segment and the second curved segment enables the light guide to transmit optical signals between the light source and the periphery of the light incident port of the camera module, and the formation of the first curved surface and the second curved surface provides conditions for the total reflection transmission of optical signals inside the light guide.

[0013] In a possible implementation, the light guide is an optical fiber. This solution provides a specific light guide, and setting the light guide as an optical fiber can ensure the light transmission efficiency and easily match the shape of the structural parts of the camera module.

[0014] In a possible implementation manner, the light source, the light receiver, and the light guide member constitute a proximity light sensor, and the proximity light sensor is used to determine the distance of a target object.

[0015] In a possible implementation, the light source, the light receiver, and the light guide constitute a structured light sensor (eg, a TOF rangefinder) for determining the position of a target object, such as 3D scanning.

[0016] In a possible implementation manner, the light guide component and the structural component are an integrally formed structure.

[0017] In a possible implementation, the structural member has a light source accommodating area, the light source is located in the light source accommodating area, an isolation portion is formed between the light source accommodating area and the surrounding space, and the isolation portion is used to separate the light receiver from the light source.

[0018] This solution accommodates the light source by setting a light source accommodating area on the structural member, so that the light signal emitted by the light source can be concentrated in the light source accommodating area and transmitted to the light output area through the light guide. Such a design is conducive to improving the luminous utilization rate of the light source, enhancing the sensing efficiency of the detection light sensor, and reducing the light loss caused by the light emitted by the light source diffusing in other spaces of the electronic device.

[0019] In a possible implementation manner, the structural member includes a top end and a bottom end that are relatively arranged, and a main body area connected between the top end and the bottom end, the light entrance is located at the top end, and the light source accommodating area is located at the bottom end.

[0020] In this solution, the light source accommodating area formed on the structural member is set at the bottom of the structural member. Since the light source needs to be electrically connected to the driving circuit on the substrate through a conductive wire and the bottom of the structural member is closer to the substrate, this design facilitates the wiring of the light source.

[0021] In a possible implementation, the light source accommodating area has an open end and a light exit hole, the light source is arranged on the substrate, the open end is used to be combined with the substrate, and the light exit hole is used to transmit the light signal. This solution arranges the light source on the substrate and utilizes the combination of the open end of the light source accommodating area of ​​the structural member and the substrate to achieve installation of the light source in the light source accommodating area, which is convenient for assembly and wiring of the light source.

[0022] In a possible implementation, the detection light sensor further includes a light guide, one end of which is located in the light exit hole or extends into the light source accommodating area through the light exit hole, and the other end of which is located in the light exit area of ​​the optical signal.

[0023] By providing a light guide, this solution can allow more light signals emitted by the light source to be transmitted to the light exit area, thereby improving the utilization rate of the light signal and the detection efficiency of the detection light sensor.

[0024] In a possible implementation, the light guide includes a light emitting portion, the light emitting portion is located in the light emitting area of ​​the optical signal, and the light emitting portion is arranged around at least a portion of the structural member. This solution converts the point light source at the light incident position of the light guide into a surface light source at the light emitting position, which can more clearly illuminate the detection target. By arranging the light emitting portion of the light guide to surround at least a portion of the structural member, the light emitting area of ​​the light guide is expanded at the periphery of the light emitting area of ​​the structural member, so that the light emission in the light emitting area is more uniform.

[0025] In a specific implementation, the light emitting portion may be in a closed ring shape, so that the periphery of the structural member has a 360-degree surrounding light-emitting band, thereby expanding the light emitting area, improving the uniformity of the light emitting, and improving the detection efficiency of the detection light sensor.

[0026] In other implementations, the light emitting portion may also be in the shape of a ring, a semi-ring, an arc, etc. with an opening.

[0027] In a possible implementation, the light guide has an overall rod-shaped structure, and includes a light incident surface, a transmission section, and a light emitting surface. The transmission section is connected between the light incident surface and the light emitting surface, the light incident surface faces the light source, and the light emitting surface is located in the light emitting area of ​​the light signal of the detection light sensor. The transmission section has an elongated rod-shaped structure, and the end faces at both ends of the transmission section constitute the light incident surface and the light emitting surface. The light emitting surface of the light guide provided by this solution has the same shape as the light incident surface, and the light guide has the advantages of simple structure and flexible assembly.

[0028] In a possible implementation, the structural member includes a top end and a bottom end that are relatively arranged, and a main body area connected between the top end and the bottom end, the light source accommodating area is located at the top end, the top end surrounds a cylindrical structure, the internal space of the cylindrical structure is the light entrance, the light source accommodating area is formed on the end face or outer surface of the cylindrical structure, and the light source accommodating area and the light entrance are separated by the structural member. This solution arranges the light source at the top end of the structural member so that the light source is located in the optical window, and there is no need to arrange a light guide, and the light of the light source can be directly emitted from the display screen, which not only improves the utilization rate of light and the detection efficiency of the detection light sensor, but also eliminates the need for a light guide, saving the cost of optical components.

[0029] In a specific embodiment, the end surface of the structural member located in the optical window is provided with a step surface, and the step surface is a mounting groove wall formed by cutting off part of the structural member. The light source is fixed on the step surface. In this solution, the step surface is formed at the end of the structural member located in the optical window, and the step surface is formed by removing material, which is conducive to ensuring the small size of the optical window and improving the screen-to-body ratio of the display screen.

[0030] In one possible implementation, the light receiver is integrated on the image sensor. The “integration” in “the light receiver is integrated on the image sensor” can be understood as a physical connection relationship, for example, the light receiver is glued to the image sensor, and can also be understood as a circuit integration relationship, for example, the light receiver is arranged inside the image sensor, and the light receiver serves as a circuit element in the image sensor. The present application integrates the light receiver on the image sensor so that the light receiver does not occupy additional space in the camera module, and only utilizes the area at the edge of the imaging area on the image sensor that can capture light. For example, this area on the image sensor was originally idle and no other electronic devices were set. Therefore, the present application integrates the light receiver on the image sensor so that the idle space of the image sensor can be utilized, so that the combined design of the detection light sensor and the camera module will not affect the size and structural layout of the camera module itself.

[0031] In a possible implementation, the image sensor has a first area, a second area, and a third area, the second area is located inside the first area, the third area is located inside the first area and outside the second area, and the light receiver is located in the third area; the first area is the area formed by the light entering the camera module through the light inlet and projected on the image sensor, and the second area is the imaging area of ​​the camera module. This solution provides a specific location for setting the light receiver on the image sensor, making the integration of the light receiver on the image sensor feasible.

[0032] In a possible implementation, the camera module further includes a filter, the filter is located between the image sensor and the lens, the filter includes region 1 and region 2, the region 1 is arranged corresponding to the second region, the region 1 is used to transmit visible light and cut off infrared light, the region 2 is located at the periphery of the region 1, the region 2 is arranged corresponding to the third region, the region 2 is used to transmit infrared light or partially transmit infrared light. This solution sets the properties of region 1 and region 2 of the filter to match the solution of integrating the receiver on the image sensor, so that the overall optical module can maintain the size of the camera module, and integrate the function of the detection light sensor without changing the spatial layout of the camera module.

[0033] In a possible implementation manner, the optical filter includes an isolation region, where the isolation region is connected between the region 1 and the region 2, and the isolation region is used to prevent infrared light from entering the second region.

[0034] In a possible implementation, the light receiver is connected to the inner wall of the structural member. This solution provides a solution of arranging the light receiver on the inner wall of the structural member, which does not change the design of the image sensor and the filter, and has a lower design cost.

[0035] In a possible embodiment, the camera module also includes a filter, which is located between the image sensor and the lens, and is used to transmit visible light and cut off infrared light. The light receiver is located in the space between the filter and the lens, and the filter is used to reflect the light signal emitted by the light source entering the enclosed space to the light receiver.

[0036] In a possible implementation, the camera module further includes a filter, the filter is located between the image sensor and the lens, and the light receiver is disposed on the filter and is located on the side of the filter facing the lens. This solution can achieve the same optical design of the image sensor and the filter by integrating the light receiver on the filter. It only needs to fix the light receiver on the filter and then electrically connect the light receiver and the substrate through wires. This solution has the advantages of low design cost and easy implementation.

[0037] In a possible implementation, the optical filter and the image sensor are stacked on a substrate, and the optical receiver is electrically connected to the substrate. In this solution, the optical filter and the image sensor are stacked so that the stacked structure formed by the optical filter and the image sensor jointly supports the optical receiver, which facilitates the assembly and fixation of the optical receiver and ensures the structural stability of the optical receiver.

[0038] In a possible implementation, the optical component further includes a substrate, the image sensor is disposed on the substrate, and the structural member is connected to the substrate; the detection light sensor further includes a signal processor, the signal processor is disposed on the substrate, the signal processor is used to control the light source, and the signal processor is also used to receive and process the signal of the light receiver. This solution can improve the integration of the camera module and the detection light sensor by integrating the signal processor on the substrate. In other implementations, the signal processor can also be disposed on other circuit boards in the electronic device.

[0039] In a possible implementation manner, the signal processor is located in the surrounding space and integrated on the image sensor.

[0040] In a possible implementation, the signal processor is located outside the structural member, the light source is located on the substrate, and the signal processor and the light source are located on the same side of the structural member. This solution facilitates the wiring arrangement of the substrate by arranging the light source and the signal processor adjacent to each other, making the electrical connection path between the light source and the signal processor closer, which is conducive to improving the working efficiency of the detection light sensor.

[0041] In a possible implementation, the image sensor is provided with a timing circuit and an analog-to-digital converter, the timing circuit and the analog-to-digital converter are electrically connected, the substrate is provided with a controlled current source, the controlled current source is electrically connected between the light source and the current output channel of the image sensor, the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor. This solution provides a design solution for at least part of the circuit in the image sensor, which controls the signal of the controlled current source through the timing circuit, outputs the stroboscopic signal through the current output channel, and combines the exposure time of the image sensor with the switch of the power supply, so as to realize a specific control solution for the optical component.

[0042] In a possible implementation, the image sensor is provided with a timing circuit and an analog-to-digital converter, the timing circuit and the analog-to-digital converter are electrically connected, the substrate includes a power signal output port and a power signal input port, the power signal output port and the power signal input port are used to be electrically connected to a controlled current source located outside the substrate, the light source is electrically connected to the power signal input port, the power signal output port is electrically connected to a current output channel of the image sensor, the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor. This solution provides a design solution for at least part of the circuit in the image sensor, the signal of the controlled current source is regulated by the timing circuit, the controlled current source is arranged outside the substrate, and the power signal input port and the power output port are arranged on the substrate, which can save the space of the substrate and is conducive to the miniaturization design of the camera module. This solution also outputs a stroboscopic signal through a current output channel, and combines the exposure time of the image sensor with the switch of the power supply, so as to realize a specific control solution for the optical component.

[0043] In a second aspect, the present application provides an electronic device, comprising an optical component and a display screen provided by any possible embodiment of the first aspect, wherein the display screen has an optical window, the light entrance is located in the optical window, and the area between the light entrance and the inner wall of the optical window constitutes the light exit area of ​​the light signal emitted by the light source.

[0044] The electronic device provided by the present application adopts the optical component provided by the first aspect, so that the display screen of the electronic device has a specific better screen-to-body ratio. Only one optical window needs to be set to meet the two different functions of the camera module and the detection light sensor, saving the opening area on the display screen. Moreover, the integrated design of the camera module and the detection light sensor is also conducive to saving space inside the electronic device, and does not affect the respective functions of the camera module and the detection light sensor. Since the light transmittance of the optical window of the camera module is relatively high, the present application can improve the detection efficiency of the detection light sensor.

[0045] In a possible implementation, the light source is located on the inner wall of the optical window. The present application can set the light source on the inner wall of the optical window, saving space inside the electronic device and improving the efficiency of the light source.

[0046] In a possible implementation, the light source is disposed on the back of the display screen. The present application can use the back of the display screen as the installation location of the light source, which can save space inside the electronic device. The position of the light source on the back of the display screen can be close to the optical window, which can also improve the efficiency of the light source.

[0047] In a possible implementation, the light source is integrated into the display screen. The light source can be integrated into the display screen during the manufacturing process, or the display screen can be driven to drive the light source. Such a design saves the internal space of the electronic device to a greater extent.

[0048] In a third aspect, the present application provides a control system, including a driver, a first receiving circuit, a second receiving circuit and a control circuit, wherein the control circuit is electrically connected to the driver, the first receiving circuit and the second receiving circuit, the first receiving circuit is used to receive and process the optical signal of the detection light sensor, the second receiving circuit is used to receive and process the image signal of the camera module, and the driver is used to drive the power supply of the detection light sensor to emit light.

[0049] In a possible implementation manner, the first receiving circuit includes a signal amplifying circuit and a signal sampling circuit.

[0050] In a possible implementation, the driver, the first receiving circuit, the second receiving circuit and the control circuit are all integrated in an image signal processor; or, the first receiving circuit, the second receiving circuit and the control circuit are all integrated in an image signal processor, and the driver is independently arranged outside the image signal processor.

[0051] The control system provided in the present application integrates a first receiving circuit for collecting detection signals from a detection light sensor and a second receiving circuit for collecting imaging signals from a camera module. One control system can control two optical modules with different functions, which can save the area of ​​the circuit board occupied by the control system and is conducive to the miniaturized design of electronic equipment.

[0052] In a fourth aspect, the present application provides a control method for controlling the optical component provided by any possible implementation of the first aspect, the control method comprising periodically executing imaging control of the camera module and detection control of the detection light sensor; wherein, in the interval time period between two imaging controls of the camera module, the detection control of the detection light sensor is performed once or multiple times; or, in the interval time period between two detection controls of the detection light sensor, the imaging control of the camera module is performed once or multiple times.

[0053] The control method provided in this solution is used to realize the scenario that the imaging part (image sensor) of the camera module can be inoperative when the detection light sensor is operating. The imaging control of the camera module and the detection control of the proximity light sensor can be performed in different time periods. The detection light sensor can be independently controlled without starting the camera module, which can reduce the energy consumption of electronic equipment.

[0054] In a possible implementation, the detection light sensor is a proximity light sensor, and the detection control of the detection light sensor in each detection cycle includes:

[0055] Turning off the light source, exposing the light receiver for the first time to generate a first light signal, and receiving and processing the first light signal through a first receiving circuit;

[0056] Turning on the light source, exposing the light receiver for a second time to generate a second light signal, and receiving and processing the second light signal through the first receiving circuit;

[0057] A proximity light detection signal is determined based on the first light signal and the second light signal.

[0058] The control method provided in this solution is used to realize a scenario in which when the proximity light sensor is working, the imaging part (image sensor) of the camera module is also working, but the imaging of the proximity light sensor and the camera module are completely independent.

[0059] In a possible implementation, the detection light sensor is a proximity light sensor, and the detection control of the detection light sensor in each detection cycle includes:

[0060] Turning off the light source, exposing the camera module to light, generating a first light signal, and receiving and processing the first light signal through a second receiving circuit;

[0061] Turning on the light source to expose the light receiver to generate a second light signal, and receiving and processing the second light signal through the first receiving circuit;

[0062] A proximity light detection signal is determined based on the first light signal and the second light signal.

[0063] The control method provided in this solution is used to realize a scenario in which when the proximity light sensor is working, the imaging part (image sensor) of the camera module is also working, but the imaging of the proximity light sensor and the camera module is completed in cooperation with each other.

[0064] In a possible implementation, determining the proximity light detection signal according to the first light signal and the second light signal is specifically:

[0065] The proximity light detection signal is obtained by subtracting the first light signal from the second light signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 is a schematic diagram of an electronic device provided in one embodiment of the present application;

[0067] Figure 2 yes Figure 1 A schematic diagram of the structure of the electronic device shown at another angle;

[0068] Figure 3 is a schematic diagram of an electronic device provided in one embodiment of the present application;

[0069] Figure 4 yes Figure 3 A partial cross-sectional view of the electronic device shown;

[0070] Figure 5 is a schematic diagram of a control chip of a detection light sensor in an optical assembly provided in one embodiment of the present application;

[0071] Figure 6 is a schematic diagram of an optical component provided in one embodiment of the present application;

[0072] Figure 7 is a schematic diagram of a control chip of a detection light sensor in an optical assembly provided in one embodiment of the present application;

[0073] Fig. 8A is a plan view of an image sensor of a camera module in an optical assembly provided in one embodiment of the present application;

[0074] Figure 8Bis a plan view of an image sensor of a camera module in an optical assembly provided in one embodiment of the present application;

[0075] Fig. 9A It is a plan view of a filter of a camera module in an optical assembly provided in one embodiment of the present application;

[0076] Fig. 9B It is a plan view of a filter of a camera module in an optical assembly provided in one embodiment of the present application;

[0077] Fig.10 yes Figure 4 A schematic diagram of the optical path of the embodiment shown;

[0078] Fig.11 is a schematic diagram of an optical component provided in one embodiment of the present application;

[0079] Fig.12 is a schematic diagram of an optical component provided in one embodiment of the present application;

[0080] Fig.13 is a schematic diagram of an optical component provided in one embodiment of the present application;

[0081] Fig.14 is a schematic diagram of an optical component provided in one embodiment of the present application;

[0082] Fig.15 is a three-dimensional schematic diagram of an optical component provided by an embodiment of the present application;

[0083] Fig.16 yes Fig.15 A three-dimensional exploded schematic diagram of an optical component in one direction is provided;

[0084] Fig.17 yes Fig.15 A three-dimensional exploded schematic diagram of the optical component provided in another direction;

[0085] Fig.18 Shown is a schematic diagram of a substrate and an electronic device disposed on the substrate provided in one embodiment;

[0086] Fig.19A is a schematic diagram of an optical component provided in one embodiment of the present application;

[0087] Fig.19B yes Fig.19A A cross-sectional view of the optical assembly shown;

[0088] Fig. 20A , Fig. 20B and Fig. 20CThey are respectively a stereoscopic view, a plan view, and a cross-sectional view of a light guide in an optical assembly provided in one embodiment of the present application;

[0089] Fig.21 is a schematic diagram of a control system provided by one embodiment of the present application;

[0090] Fig. 22 is a schematic diagram of a control system provided by an embodiment of the present application;

[0091] Fig.23 is a schematic diagram of a control method provided by a first embodiment of the present application;

[0092] Fig.24 is a schematic diagram of a control method provided by a second embodiment of the present application;

[0093] Fig.25 It is a circuit arrangement architecture on a substrate of an optical component and a partial circuit architecture on a system-level chip provided in one embodiment of the present application;

[0094] Fig.26 It is a circuit arrangement architecture on a substrate of an optical component and a partial circuit architecture of a system-level chip and a power management module provided in one embodiment of the present application. DETAILED DESCRIPTION

[0095] The following describes possible implementations of the present application in conjunction with the accompanying drawings in possible implementations of the present application.

[0096] See also Figure 1 , Figure 1 1 is a schematic diagram of an electronic device 1000 provided in a possible embodiment of the present application. The electronic device may be a mobile phone, a tablet, a laptop, a television, a vehicle-mounted device, a wearable device, or other electronic products. The wearable device may be a smart bracelet, a smart watch, a wireless headset, augmented reality (AR) glasses, an augmented reality helmet, virtual reality (VR) glasses, and a virtual reality helmet.

[0097] The possible implementation methods of the present application are described by taking the electronic device being a mobile phone as an example.

[0098] Please also read Figure 1 and Figure 2 , Figure 2 yes Figure 1The electronic device 1000 shown is a schematic diagram of the structure at another angle. The electronic device 1000 includes a housing 100, a display screen 200, a front camera device 300, a rear camera device 400, a mainboard 500, a processor 600, a memory 700 and a battery 800. The display screen 200 is used to display images, and the display screen 200 can also integrate a touch screen function. The display screen 200 is installed on the housing 100. The housing 100 may include a frame 1001 and a back cover 1002. The display screen 200 and the back cover 1002 are respectively installed on opposite sides of the frame 1001. In this possible implementation, in the external space of the electronic device 1000, the space facing the display screen 200 is defined as the front of the electronic device 1000, and the space facing the back cover 1002 is defined as the rear of the electronic device 1000.

[0099] In some possible implementations, the front camera device 300 is located inside the housing 100 and below the display screen 200. The display screen 200 is provided with a front camera hole 2001, and the front camera device 300 collects light in front of the electronic device 1000 through the front camera hole 2001 to achieve shooting.

[0100] In one embodiment, the optical assembly provided by the present application can be applied at the position of the front camera device 300. Specifically, the optical assembly provided by the present application includes at least part of the front camera device 300 and a detection light sensor, and the detection light sensor collects environmental information through the front camera hole 2001. For example, when a user is answering a call, the user will approach the front camera device 300, and the detection light sensor detects and turns off the display screen to reduce power consumption and increase battery life, and turns off the touch screen to prevent the touch screen from being accidentally touched.

[0101] The detection light sensor may be a proximity light sensor or a structured light sensor (eg, a TOF rangefinder) for determining the position of a target object, such as 3D scanning.

[0102] In some possible implementations, the back cover 1002 is provided with at least one rear camera hole 1003. The rear camera device 400 is located inside the housing 100, and the rear camera device 400 collects light from behind the electronic device 1000 through at least one rear camera hole 1003 to achieve shooting. In possible implementations of the present application, "at least one" includes two situations: one and more, more means more than two, and "more than" includes this number. The rear camera device 400 includes at least one camera module 4001, for example, it may include one or more of a standard camera module, a telephoto camera module, a wide-angle camera module, an ultra-telephoto camera module, and an ultra-wide-angle camera module. Exemplarily, the rear camera device 400 includes a standard camera, a wide-angle camera, and a periscope telephoto camera.

[0103] In one embodiment, the optical assembly provided by the present application can also be applied to the position of the rear camera device 400. When the detection light sensor senses the environment through the back cover of the electronic device, the optical assembly provided by the present application can include at least part of the rear camera device 400 and the detection light sensor, and the detection light sensor collects environmental information through the rear camera hole 1003. For example, when the mobile phone needs to lock the screen, you can put your hand at the position of the rear camera device 400, and the detection light sensor detects and transmits a signal to the system-level image sensor (SOC), and the SOC controls the phone to lock the screen. Similarly, the detection light sensor can be a proximity light sensor or a structured light sensor.

[0104] In some possible implementations, the rear camera device 400 may further include a flash module 4002. The rear cover 1002 is provided with a flash hole 1004, and the flash module 4002 is located inside the housing 100, and emits light through the flash hole 1004. The mainboard 500 is located inside the housing 100, and the processor 600 and the memory 700 are fixed to the mainboard 500. The display screen 200, the front camera device 300 and the rear camera device 400 are electrically connected to the processor 600. The memory 700 is used to store computer program codes. The computer program code includes computer instructions. The processor 600 is used to call computer instructions to enable the electronic device 1000 to perform corresponding operations, for example, to enable the display screen 200 to display a target image, to enable the front camera device 300 and the rear camera device 400 to capture a target image, etc. The battery 800 is electrically connected to the mainboard 500, and is used to power the electronic device 1000. In some possible implementations, the electronic device 1000 may also include one or more functional modules such as an antenna module, a mobile communication module, a sensor module, a motor, a microphone module, a speaker module, etc., and these functional modules may be electrically connected to the processor 600 to transmit signals.

[0105] Please also read Figure 3 and Figure 4 , Figure 3 A schematic diagram of an electronic device 1000 provided in one embodiment is shown. Figure 4 for Figure 3 The partial cross-sectional view of the electronic device 1000 is shown, and the cross-sectional position is Figure 3 The BB indicates the position of the line. Figure 3 As shown, the electronic device 1000 includes a display screen 200, and the display screen 200 has an optical window 200H. The optical window 200H can be a window for the front camera to collect image information. The optical window 200H is set on the display screen 200 and is close to the top of the display screen 200. The optical window 200H can be located in the middle of the width direction of the display screen 200, or in the corner of the top of the display screen 200.

[0106] See also Figure 4 In one embodiment, the display screen 200 is an OLED display screen. The display screen 200 includes a supporting layer 204, a TFT (Thin Film Transistor) layer 203, a display layer 202, and a protective layer 201 which are stacked in sequence. The supporting layer 204 is used to support the TFT layer 203 and the display layer 202. The TFT layer 203 is used to drive the display layer 202 to emit light. The protective layer 201 is used to protect the display layer 202. The protective layer 201 can be glass, i.e., CG (Cover Glass). At the position of the optical window 200H, the display screen 200 only retains the protective layer 201. That is, at the position of the optical window 200H, the supporting layer 204, the TFT layer 203, and the display layer 202 all form through holes. Therefore, at the position of the optical window 200H, only the protective layer 201 affects the transmittance. Since the protective layer 201 is transparent, the optical window 200H of the display screen 200 has a high transmittance.

[0107] See also Figure 4 The electronic device provided in the present application is provided with an optical component 10, and the optical component 10 is arranged below the display screen 200 and assembled at the position of the optical window 200H. The optical component 10 interacts with the outside world through the optical window 200H on the display screen 200 to collect relevant information, for example, image information and proximity light information. The optical component 10 includes a camera module 30 and a detection light sensor 50. In the present embodiment, the detection light sensor 50 is a proximity light sensor. The camera module 30 and the detection light sensor 50 in the optical component 10 provided in the embodiment of the present application share an optical window 200H, and there is no need to additionally set different optical windows on the display screen for the camera module 30 and the detection light sensor 50 to use. Therefore, the optical component 10 provided in the embodiment of the present application is applied in an electronic device, so that the appearance integrity of the display screen 200 of the electronic device is better and the screen-to-body ratio of the display screen 200 is larger.

[0108] In one implementation, the camera module 30 includes a substrate 31 , a structural member 32 , an image sensor 33 , a filter 34 , and a lens 35 .

[0109] The structural member 32 is cylindrical and is arranged to form an enclosed space 321. Along the direction of the optical axis of the camera module 30, the two opposite ends of the structural member 32 are both open, one end is located at the optical window 200H, and the other end is buckled on the substrate 31. The image sensor 33, the filter 34 and the lens 35 are located in the enclosed space 321, and along the direction of the optical axis of the camera module 30, the filter 34 is located between the image sensor 33 and the lens 35.

[0110] In one embodiment, the image sensor 33 is fixed on the substrate 31 . The filter 34 and the lens 35 are fixed to the structure 32 . Figure 4 The illustrated embodiment only schematically shows the relative positional relationship between the various structural elements in the camera module 30, and does not limit the specific connection method between the various structural elements, the specific position setting, nor the structural form of the various structural elements. For example: In one embodiment, the structural member 32 can be an integrated structure. In other embodiments, the structural member 32 can also be formed by connecting two or more structures, for example, one of the cylindrical structures is used to fix the lens 35, and one of the frame-shaped base structures is used to install the filter 34 between the lens 35 and the image sensor 33 (the filter 34 can also be other types of optical elements), and the different structures of the structural member 32 can be fixed by gluing.

[0111] See also Figure 4 In one embodiment, the detection light sensor 50 includes a light source 51, a control chip 52 and a light guide 53. The light source 51 is used to send a light signal. Specifically, the light source 51 is used to send a light signal to realize a proximity light function or a proximity / distance judgment. For example, the light emitted by the light source 51 is an infrared light signal. In a specific embodiment, the light emitted by the light source 51 is an infrared light of 940nm±20nm. In a specific embodiment, the light source 51 is a vertical cavity surface emitting laser (VCSEL). The light guide 53 is used to transmit the infrared light signal emitted by the light source 51 to the optical window 200H, and emit the display screen 200 from the optical window 200H to irradiate the sensing object outside the display screen 200. After the infrared light signal is reflected by the sensing object, it can enter the surrounding space 321 of the camera module from the optical window 200H. The control chip 52 is used to receive the light signal (such as infrared light) emitted by the light source 51 entering the surrounding space 321.

[0112] The light guide 53 is used to transmit the optical signal emitted by the light source 51. The optical signal can enter the light guide 53 through the light incident surface of the light guide 53 and be transmitted to the light output surface in the light guide 53. The optical signal is emitted through the light output surface. In one embodiment, the refractive index of the light guide material constituting the light guide 53 is greater than or equal to 1.4. For example, the refractive index of the light guide 53 is 1.5, 1.6, etc. The light guide material of the light guide 53 can be PC (polycarbonate material), glass, PMMA (polymethyl methacrylate material), etc. In one embodiment, the light guide can also be an optical fiber, such as a plastic optical fiber or a quartz optical fiber.

[0113] See also Figure 4In one embodiment, the light source 51 and the control chip 52 are respectively arranged in different spaces, and the control chip 52 is arranged in the surrounding space 321 of the structural member 32. The light source 51 and the control chip 52 are separated by the structural member 32, so that the light emitted by the light source 51 cannot directly irradiate the position of the control chip 52. Figure 4 As shown, in one embodiment, both the image sensor 33 and the light source 51 are disposed on the substrate 31. The bottom end of the structural member 32 (the end of the structural member 32 away from the display screen 200) is connected to the substrate 31 to form two chambers C1 and C2, wherein one chamber C1 accommodates the image sensor 33, and the other chamber C2 accommodates the light source 51, that is, in this embodiment, the structural member 32 is provided with a light source accommodating area (chamber C2), and the light source accommodating area is located at the bottom end of the structural member 32. In this solution, the light source accommodating area formed on the structural member 32 is disposed at the bottom end of the structural member 32. Since the light source 51 needs to be electrically connected to the driving circuit on the substrate 31 through a conductive wire, and since the bottom end of the structural member is connected to the substrate 31, such a design facilitates the wiring of the light source 51.

[0114] Figure 4 In one embodiment shown, the light receiver and signal processor of the detection light sensor are integrated on the control chip 52, and the control chip 52 is used to receive infrared light signals and process the infrared light signals. The control chip 52 is arranged on the image sensor 33, for example, the two can be stacked, and the control chip 52 is stacked on the surface of the image sensor 33 away from the substrate 31. Alternatively, the control chip 52 is integrated in the image sensor 33. The "integration" in "the control chip 52 is integrated in the image sensor 33" can be understood as a physical connection relationship, for example, the control chip 52 is glued to the image sensor, and can also be understood as a circuit integration relationship, for example, the control chip 52 is arranged inside the image sensor, and the control chip 52 is used as a circuit element in the image sensor. The control chip 52 can be electrically connected to the circuit in the substrate 31, for example, by electrically connecting the circuit in the substrate 31 by gold wire. In one embodiment, the control chip 52 and the light source 51 are electrically connected, and the two can be electrically connected through the wiring in the substrate 31. The control chip 52 is used to control the light source 51 to emit light. In other implementations, the control chip 52 may not be electrically connected to the light source 51 , and the light source 51 may be controlled to emit light through other control circuits in the electronic device.

[0115] See also Figure 5 , Figure 5The figure shows a schematic diagram of a control chip 52 of a detection light sensor in an optical component provided in an embodiment of the present application. The control chip 52 is electrically connected to a light source 51. The control chip 52 is also electrically connected to a microcontroller unit (MCU) or a system on chip (SOC) of an electronic device to control the control chip 52 through the MCU or SOC or to exchange information with the control chip 52. The control chip 52 includes a light receiver 521 and a signal processor 522. Among them, the control chip 52 is the device and circuit in the solid line frame between the light source 51 and the MCU or SOC. The signal processor 522 is part of the device and circuit in the dotted line frame in the control chip 52. Figure 5 The control chip 52 provided in the embodiment shown in the figure integrates an optical receiver 521 and a signal processor 522. The specific position of the optical receiver 521 is not limited to Figure 5 In the case shown, the optical receiver 521 may also be arranged in the dotted frame. Figure 5 The specific positions of the components in the control chip 52 shown are only schematic representations of the connection relationship between the components, and do not limit the specific position arrangement of the components.

[0116] Specifically, the signal processor 522 includes a digital-to-analog converter (e.g., an IDAC, i.e., a current-shaped digital-to-analog converter), an amplifier, an analog-to-digital converter (ADC), a control memory, and a light source driver (Tx_driver). The light source driver is used to drive the light source to emit light. The digital-to-analog converter is used to eliminate the crosstalk of ambient light. The amplifier and the ADC are used to amplify the electrical signal converted and output by the optical receiver 521 and convert it into a digital signal. The amplifier can increase the gain. The control memory is used to coordinate transmission and reception, and store the digital signal after the ADC output. The control memory is connected to the MCU or SOC through an interface (e.g., an I2C interface). In one embodiment, the MCU or SOC configures the signal processor 522 through the I2C interface and reads the test data stored in the signal processor 522. The signal processor 522 can report the status or test data of the signal processor 522 to the MCU or SOC through the interface.

[0117] Figure 6 A schematic diagram of an optical component 10 provided in accordance with one embodiment of the present application. Figure 6 The embodiments shown and Figure 4 The difference between the embodiments shown is that the control chip 52 in the detection light sensor 50 is arranged differently. Figure 6In this embodiment, the control chip 52 includes a light receiver 521 and a signal processor 522, which are independent devices and can be located at different positions on the substrate 31, so as to have a more flexible configuration mode. In order to save the internal space of the camera module 30, only the light receiver 521 can be arranged inside the camera module 30. For example, the light receiver 521 is located in the surrounding space 321. Specifically, in one embodiment, the light receiver 521 can be formed on the image sensor 33. In one embodiment, the light receiver 521 is integrated on the image sensor 33. The "integration" in "the light receiver 521 is integrated on the image sensor 33" can be understood as a physical connection relationship, such as the light receiver is glued to the image sensor, and can also be understood as a circuit integration relationship, for example, the light receiver is arranged inside the image sensor, and the light receiver serves as a circuit element in the image sensor.

[0118] The signal processor 522 is disposed on the substrate 31 , and the signal processor 522 may be located outside the structural member 32 . Figure 6 It is only a schematic representation of a specific solution in which the signal processor 522 is located on the periphery of the structural member 32. In other embodiments, the signal processor 522 may be arranged side by side with the light source 51, or the signal processor 522 may be arranged inside the same chamber as the light source 51. The electrical connection between the signal processor 522 and the light source 51 may be achieved through internal wiring of the substrate 31, or may be directly connected on the surface of the substrate 31 through wires. The optical receiver 521 may be electrically connected to the circuits in the substrate 31, for example, by means of gold wires. The electrical connection between the signal processor 522 and the optical receiver 521 may be electrically connected through wiring in the substrate 31.

[0119] See also Figure 7 , Figure 7 Shown is a schematic diagram of a control chip 52 of a detection light sensor in an optical component provided in one embodiment of the present application. Figure 7 The solid line frame represents the signal processor 522, and the optical receiver 521 may be a PD. The optical receiver 521 and the light source 51 are located outside the solid line frame, and it can be understood that the optical receiver 521, the light source 51 and the signal processor 522 are independent devices. Figure 7 The specific architecture of the signal processor 522 is shown in FIG. Figure 5 The specific architecture of the signal processor 522 is the same as shown and will not be described in detail.

[0120] Figure 4 In the illustrated embodiment, the control chip 52 is integrated on the image sensor 33 . Figure 6In the illustrated embodiment, the light receiver 521 is integrated on the image sensor 33. After the light emitted by the light source 51 exits the optical window 200H, it is reflected by the detection target, enters the camera module 30 from the optical window 200H, passes through the lens 35 and the filter 34 in sequence, and enters the control chip 52 or the light receiver 521.

[0121] based on Figure 4 and Figure 6 In one embodiment, see Fig. 8A , Fig. 8A The figure is a schematic plan view of an image sensor of a camera module in an optical assembly provided in one embodiment of the present application. For the image sensor 33, its effective area is the first area 331. The first area 331 is Fig. 8A The area within the larger solid line box in the figure. The light entrance hole of the camera module is circular, and when light enters the camera module, a circular light entrance projection area 334 is formed. Fig. 8A The area within the dotted circle is the incident light projection area 334 on the image sensor 33. The area where the incident light projection area 334 and the first area 331 intersect is the image generation area on the image sensor 33. Since the captured image or video is rectangular, a rectangular imaging effective area needs to be formed within the image generation area on the image sensor 33. The present application defines the imaging effective area as the second area 332, such as Fig. 8A As shown, the second area 332 is an area surrounded by a rectangular frame located in the first area 331. The area within the imaging effective area and outside the second area 332 is an additional area, that is, light can be projected into this area, but this area is not used for imaging of the camera module. This application defines this additional area as a third area 333.

[0122] In summary, the image sensor 33 has a first area 331 , a second area 332 and a third area 333 . The second area 332 is located inside the first area 331 , and the third area 333 is located inside the first area 331 and outside the second area 332 . Figure 4 The control chip in the embodiment shown is located in the third area 333. Figure 6 The light receiver in the illustrated embodiment is located in the third area 333 .

[0123] See also Figure 8B , Figure 8B Shown is a plan view of an image sensor of a camera module in an optical assembly provided in one embodiment of the present application. Figure 8B The embodiments shown and Fig. 8A The differences between the embodiments shown are: Figure 8BIn the illustrated embodiment, the image sensor 33 also has a transition zone 335, and the transition zone 335 is located between the second area 332 and the third area 333, that is, the setting of the transition zone 335 makes the second area 332 and the third area 333 not directly adjacent to each other. Due to the setting of the transition zone 335, this solution can prevent infrared light from entering the second area 332 (imaging area). For example, if the transition zone 335 is not provided, when the camera module is assembled, there may be assembly tolerances, etc., which may cause infrared light to enter the second area 332 (imaging area) and cause the image sensor to have a color cast.

[0124] See also Figure 8B In one embodiment, the image sensor further includes a logic area 336, which is located in a rectangular area outside the first area 331, and the logic area 336 partially overlaps with the circular light incident projection area 334. The logic area refers to a non-imaging area, which is generally the area where the image signal processor (ISP) is located.

[0125] based on Figure 4 and Figure 6 In one embodiment, see Fig. 9A , Fig. 9A FIG. 3 is a schematic plan view of a filter of a camera module in an optical assembly provided in an embodiment of the present application. The filter 34 is rectangular and has an outer edge 340. Similarly, Fig. 9A The dotted circular area is the incident light projection area 344 on the filter 34, and the area where the incident light projection area 344 and the outer edge 340 intersect is the effective light transmission area. Since the captured image or video is rectangular, a rectangular imaging light transmission area needs to be formed in the effective light transmission area on the filter 34. The present application defines this imaging light transmission area as area one 341. The area within the effective light transmission area and outside area one 341 is an additional area, that is, light can pass through this area, but this part of the light is not used for imaging. The present application defines the additional area on the filter 34 as area two 342. Area two 342 is located outside area one 341.

[0126] In one embodiment, see Fig. 9B , Fig. 9B Shown is a plan view of a filter of a camera module in an optical assembly provided in one embodiment of the present application. Fig. 9B The embodiments shown and Fig. 9A The differences between the embodiments shown are: Fig. 9B In the illustrated embodiment, the filter 34 further includes an isolation region 343 ( Fig. 9BThe rectangular black frame between the middle area 1 341 and the area 2 342 represents the isolation area 343, which is connected between the area 1 341 and the area 2 342. The isolation area 343 is used to prevent the image sensor from having a color cast due to infrared light entering the second area (the imaging area on the image sensor). The isolation area 343 needs to be a low-transmittance material or an opaque material. The isolation area 343 can prevent infrared light from reaching the imaging area of ​​the image sensor and causing crosstalk.

[0127] Fig.10 Shown Figure 4 The optical path schematic diagram of the embodiment shown, Figure 6 The embodiment shown may also have similar optical paths. Fig.10 , in the optical axis direction of the camera module, area 1 341 of the filter 34 is arranged correspondingly to the second area 332 of the image sensor 33, and area 2 342 is arranged correspondingly to the third area 333 of the image sensor 33. The "corresponding arrangement" mentioned here can be understood as that the two are corresponding in the optical path, and their shapes can be the same, but it does not mean that the sizes of the two are the same. For example, the size of area 1 341 of the filter 34 can be smaller than the size of the second area 332 of the image sensor 33. In one embodiment, area 1 341 of the filter 34 is used to transmit visible light and cut off infrared light. Area 2 342 of the filter 34 is used to transmit infrared light or partially transmit infrared light.

[0128] like Fig.10 As shown, the infrared light emitted by the light source 51 is transmitted to the optical window 200H through the light guide 53, and then emitted from the display screen 200 and projected to the detection target, and then enters the optical window 200H after being reflected by the detection target. After passing through the lens 35, the infrared light is projected onto the second region 342 of the filter 34. Since the second region 342 can transmit infrared light or partially transmit infrared light, the infrared light passes through the second region 342 of the filter and is projected onto the third region 333 of the image sensor 33. The control chip 52 is arranged in the third region 333, so the control chip 52 can receive the infrared light and process the infrared light signal to realize the detection function of the detection light sensor and judge the state (close or far) of the detection target relative to the display screen.

[0129] This solution sets the properties of area 1 and area 2 of the filter to match the solution of integrating the receiver on the image sensor, so that the overall optical module can maintain the size of the camera module and integrate the function of the detection light sensor without changing the spatial layout of the camera module.

[0130] Fig.10In the illustrated embodiment, the camera module 30 captures the target scene through the optical window 200H. Light from the target scene passes through the optical window 200H, sequentially through the lens 35 and the area 1 341 of the filter 34, and is projected onto the second area 332 of the image sensor 33, so that the image sensor 33 captures image information.

[0131] Fig.11 Shown is a schematic diagram of an optical component provided in one embodiment. Fig.11 In the illustrated embodiment, the control chip 52 is disposed on the filter 34. The control chip 52 is located on the surface of the filter 34 away from the image sensor 33. The control chip 52 can be electrically connected to the substrate 31 by gold wire. All areas on the filter 34 are used to transmit visible light and cut off infrared light. In this embodiment, the filter 34 and the image sensor 33 are stacked, that is, the filter 34 is directly attached to the surface of the image sensor 33. This method eliminates the connection between the filter 34 and the structural member 32. Moreover, the filter 34 and the image sensor 33 are used to carry the control chip 52 together, so that the assembly of the control chip 52 in the camera module has structural stability, and can also ensure that the overall structure of the camera module is simple, which is conducive to the design of miniaturization.

[0132] Fig.12 Shown is a schematic diagram of an optical component provided in one embodiment. Fig.12 In the illustrated embodiment, the filter 34 is fixedly connected to the structural member 32, and the optical receiver 521 is disposed on the filter 34. The optical receiver 521 is located on the surface of the filter 34 away from the image sensor 33. The entire area on the filter 34 is used to transmit visible light and cut off infrared light. The signal processor 522 of the optical proximity sensor is located on the substrate 31 and can be disposed on the periphery of the structural member 32. This solution continues the design scheme of separately arranging the filter 34 and the image sensor 33, and integrates the optical receiver 521 on the filter 34. The signal processor 522 is disposed on the periphery of the structural member 32, so that the optical devices inside the structural member 32 are as few as possible, and the optical device carried by the filter 34 is only the optical receiver 521, the structure is simple and light, and the optical receiver 521 only needs two wires to be connected to the substrate 31, and the electrical connection line is simple.

[0133] Fig.13 Shown is a schematic diagram of an optical component provided in one embodiment. Fig.13In the illustrated embodiment, the light receiver 521 is connected to the inner wall of the structural member 32. The present solution provides a solution for arranging the light receiver on the inner wall of the structural member, which can keep the design of the image sensor and the filter unchanged, and has a lower design cost. In one embodiment, the light receiver 521 is located on the side of the filter 34 away from the image sensor 33, that is, the light receiver 521 is located in the space between the lens 35 and the filter 34. The filter 34 is used to transmit visible light and cut off infrared light, and the filter 34 is used to reflect the light signal (infrared light) emitted by the light source 51 entering the enclosed space to the light receiver 521. In the present embodiment, the filter 34 can be fixedly connected to the structural member 32 (such as Fig.13 In one embodiment, the transmittance of the filter 34 is greater than x%, where x can be any value within a range of greater than or equal to 1 and less than or equal to 80.

[0134] For example, the optical receiver 521 can be disposed on the filter 34. By integrating the optical receiver on the filter, the optical design of the image sensor and the filter can be kept unchanged. It is only necessary to fix the optical receiver on the filter and then electrically connect the optical receiver and the substrate through a wire. The solution has the advantages of low design cost and easy implementation.

[0135] In other implementations, the filter 34 may also be stacked on the surface of the image sensor 33 (eg Fig.11 As shown in FIG. 1 , the optical receiver 521 is fixed on the surface of the optical filter 34. The optical filter 34 and the image sensor 33 are stacked so that the stacked structure formed by the optical filter 34 and the image sensor 33 jointly supports the optical receiver, which is convenient for assembling and fixing the optical receiver and can also ensure the structural stability of the optical receiver.

[0136] The optical receiver 521 and the structural member 32 may be connected by screws, adhesive or other fixing methods. The optical receiver 521 and the substrate 31 may be electrically connected, specifically, by a wire extending along the inner wall of the structural member to the substrate 31, and the two ends of the wire are electrically connected to the optical receiver 521 and the substrate 31 respectively. The signal processor 522 is disposed on the substrate 31 and is located at the periphery of the structural member 32, and the signal processor 522 and the optical receiver 521 are electrically connected through the wiring inside the substrate 31.

[0137] Figure 4 , Figure 6 , Fig.11 , Fig.12In the embodiment shown, the light sources 51 are all disposed on the substrate 31, and the light sources 51 are located in the chamber C2 of the structural member 32, and the chamber C2 is also called the light source accommodating area. By arranging the light source accommodating area on the structural member 32 to accommodate the light source 51, the light signal emitted by the light source 51 can be concentrated in the light source accommodating area and transmitted to the light emitting area through the light guide. Such a design is conducive to improving the light emitting utilization rate of the light source 51, improving the detection efficiency of the detection light sensor, and reducing the light loss caused by the light emitted by the light source 51 due to diffusion in other spaces of the electronic device. Figure 4 As shown, the light source accommodating area (chamber C2) has an open end C21 and a light outlet C22. The structural member 32 is made of a light-shielding material. Specifically, the bottom of the chamber C2 is an open end C21, and the open end C21 of the bottom of the chamber C2 is combined with the substrate 31, so that the chamber C2 is buckled on the substrate 31, and the light source 51 is accommodated in the chamber C2. This solution is convenient for assembly and wiring of the light source 51 by setting the light source 51 on the substrate 31 and utilizing the combination of the open end C21 of the light source accommodating area of ​​the structural member 32 and the substrate 31. The light guide 53 transmits the light emitted by the light source 51 to the position of the optical window 200H. One end of the light guide 53 can be located in the light outlet C22. One end of the light guide 53 can also pass through the light exit hole C22 and extend into the cavity C2. By providing the light guide 53, the light signal emitted by the light source 51 can be more transmitted to the light exit area, which can improve the utilization rate of the light signal and the detection efficiency of the detection light sensor.

[0138] Fig.13 In the embodiment shown, the light source 51 is fixed on the outer surface of the structural member 32. Specifically, Fig.13 As shown, the outer surface of the structural member 32 includes a mounting surface, and the mounting surface faces the display screen 200. The orientation of the mounting surface can be the same as that of the substrate 31, and the mounting surface can be parallel to the surface of the substrate 31. The mounting surface is located between the substrate 31 and the display screen 200. The light source 51 can be connected to the mounting surface by screws, adhesive or other fixing methods. One end of the light guide 53 is directly opposite to the light source 51, and the other end of the light guide 53 is located in the optical window 200H. The light guide 53 is used to transmit the light emitted by the light source 51 to the optical window 200H. In other embodiments, the detection light sensor 50 may not be provided with a light guide 53, and the light emitted by the light source 51 may be reflected to the optical window 200H by the structural member 32, the display screen 200 or other structural members. In this embodiment, since the light source 51 is arranged on the mounting surface, the distance between the light source 51 and the optical window 200H is smaller than the distance between the substrate 31 and the optical window 200H. Compared with Fig.12In the illustrated embodiment, the light source 51 has a higher utilization rate of light emission and a smaller light loss, which can improve the detection efficiency of the detection light sensor 50 .

[0139] Fig.13 In the illustrated embodiment, the light source 51 is electrically connected to the substrate 31, and specifically, the electrical connection can be achieved through an electrical connection line 511, which can be arranged along the outer surface of the structural member 32, or can be arranged in the space outside the structural member 32, or can be buried inside the structural member 32. The signal processor 522 and the light source 51 can be electrically connected through the combination of the electrical connection line 511 and the wiring inside the substrate 31.

[0140] Fig.14 Shown is a schematic diagram of an optical component provided in one embodiment. Fig.14 In the illustrated embodiment, the detection light sensor 50 includes a light source 51 and a control chip 52, and the detection light sensor 50 does not include a light guide. The light source 51 is disposed on an end of the structural member 32 away from the substrate 31. The light source 51 is located in the optical window 200H. Specifically, a step surface 328 is provided on the end face of the structural member 32 located in the optical window 200H, and the step surface 328 is a mounting groove wall formed by cutting off part of the structural member 32. The light source 51 is fixed on this step surface 328. This solution forms a step surface at one end of the structural member located in the optical window, and the step surface is formed by removing material, which is conducive to ensuring a small size of the optical window and improving the screen-to-body ratio of the display screen. The end of the structural member 32 located in the optical window 200H is the top of the structural member 32. This solution can be understood as setting a light source accommodating area at the top of the structural member 32. The mounting groove where the step surface 328 is located can be understood as the structure of the light source accommodating area. The light source 51 is set in the light source accommodating area. This solution sets the light source 51 at the top of the structural member 32 so that the light source 51 is located in the optical window. There is no need to set a light guide, and the light from the light source 51 can be directly emitted from the display screen. This not only improves the utilization rate of light and the detection efficiency of the detection light sensor, but also eliminates the need for a light guide and saves the cost of optical components. Specifically, the top of the structural member 32 is surrounded by a cylindrical structure, the internal space of the cylindrical structure is the light inlet, and the lens 35 is located in the internal space of the cylindrical structure. The light source accommodating area can be formed on the end face or outer surface of the cylindrical structure of the structural member 32. Fig.14 As shown, the light source accommodating area is open (or opening-shaped) on one side of the end surface and one side of the outer surface of the cylindrical structure, and the opening of the end surface is used for the light from the light source 51 to directly emit the display screen. The opening of the outer surface is used to lead out the electrical connection line 511 connected between the light source 51 and the substrate 31.

[0141] The light emitted by the light source 51 is directly emitted from the optical window 200H to the display screen 200, and no light guide is required. The light source 51 and the substrate 31 are electrically connected through an electrical connection line 511, which extends to the substrate 31 along the outer surface of the structural member 32 and is electrically connected to the wiring inside the substrate 31. The wiring inside the substrate 31 can realize the electrical connection between the light source 51 and the control chip 52. Fig.14 The specific configuration of the optical receiver and the signal processor of the control chip 52 in the embodiment shown can also be replaced by Fig.13 , Fig.12 , Fig.11 , Figure 6 The designs of the optical receiver 521 and the signal processor 522 in the illustrated embodiment.

[0142] Fig.15 Shown is a three-dimensional schematic diagram of an optical component 10 provided in one embodiment. Fig.16 for Fig.15 A perspective exploded schematic diagram of an optical component in one direction is provided. Fig.17 for Fig.15 Provides an exploded perspective view of the optical assembly from another perspective. Fig.15 , Fig.16 and Fig.17 The optical component 10 includes a substrate 31, and the substrate 31 is used to set electronic devices. The electronic devices of the optical component 10, such as the image sensor 33, the light source 51, and the signal processor 522, are set on the substrate 31. The light receiver can be integrated with the image sensor 33. The structural member 32 includes a first structure 32A and a second structure 32B. The first structure 32A surrounds to form a first surrounding space 321A, and the second structure 32B surrounds to form a second surrounding space 321B. The first surrounding space 321A is used to accommodate the lens 35. In one embodiment, the second surrounding space 321B is used to accommodate the image sensor 33 and the filter 34. In one embodiment, the second surrounding space 321B can only accommodate the filter 34, and the image sensor 33 can be sunk into the substrate 31. For example, a groove is provided on the surface of the substrate 31 to accommodate the image sensor.

[0143] See also Fig.16 and Fig.17 , the first structure 32A and the second structure 32B are fixedly connected by the adhesive layer B1, and the second structure 32B and the substrate 31 are fixedly connected by the adhesive layer B2. This solution facilitates the assembly of the filter 34 and the lens 35 by designing the structural member 32 as a split structure, which is conducive to ensuring the position accuracy and connection reliability of each component in the camera module. In other implementations, the first structure 32A and the second structure 32B can also be designed as an integrated structure.

[0144] like Fig.15 As shown, in this embodiment, the vertical projection of the structural member 32 on the substrate 31 covers a part of the area of ​​the substrate 31. The structural member 32 is buckled on the substrate 31, and the image sensor is accommodated inside the structural member 32, and the light source 51 is located outside the structural member 32. Such a design can make the structural member 32 have the advantage of small size, so that the optical component has the advantage of light weight. Moreover, the light source 51 and the light receiver located inside the structural member 32 are separated by the structural member 32, and there is no need to set multiple chambers on the structural member 32, so that the structure of the structural member 32 is simplified, which has the advantage of low manufacturing cost.

[0145] See also Fig.15 , Fig.16 and Fig.17 , the optical component 10 includes a shielding cover 40, which is buckled on the substrate 31. The shielding cover 40 is located on one side of the structural member 32 and is used to shield the electronic devices on the substrate 31 and outside the structural member 32. For example, in one embodiment, the light source 51 is located on the periphery of the structural member 32, and the shielding cover 40 surrounds the light source 51, and the light source 51 is located in the receiving space formed by the substrate 31 of the shielding cover. Such a design can prevent the light emitted by the light source 51 from leaking to the outside of the optical component 10, and can improve the utilization rate of the optical signal emitted by the light source 51. The shielding cover 40 is provided with a through hole 401, and the through hole 401 is used to accommodate the light guide 53. Specifically, one end of the light guide 53 can extend from the through hole 401 into the receiving space between the shielding cover 40 and the substrate 31, so that one end of the light guide 53 can be adjacent to the light source 51. One end of the light guide 53 may also be located inside the through hole 401 (i.e., not extending into the light shield, but only stopping in the space surrounded by the through hole 401), and the light emitted by the light source 51 is mapped to one end of the light guide 53, so that the light can enter the light guide 53. The light guide 53 transmits the optical signal to the light exit area, i.e., the periphery of the end of the structural member 32 away from the substrate 31.

[0146] See also Fig.15 The light guide 53 includes a light emitting portion 530, which is a portion of the light guide 53 located in the light emitting area of ​​the light signal emitted by the light source 51 of the detection light sensor. In one embodiment, the light emitting portion 530 surrounds at least a portion of the structural member 32. Fig.15In the illustrated embodiment, the light emitting portion 530 may be in the shape of a closed ring. Specifically, the light emitting portion 530 may be in the shape of a circular ring, a polygonal ring structure, and the like. The present application designs the light emitting portion 530 as a closed ring, and changes the point light source at the light entrance position of the light guide 53 into a surface light source at the light exit position, so that the detection target can be illuminated more clearly. The light emitting portion 530 is within the optical window, and the light emitting portion 530 may fully surround the portion of the structural member 32 located within the optical window, so that the light from the light source 51 forms an annular light exit surface at the optical window position, and may be emitted in all directions (360 degrees) from the periphery of the light entrance position of the camera module, so that the infrared light emitted by the light source 51 may enter more of the interior of the structural member 32, thereby improving the detection efficiency of the detection light sensor. In other embodiments, the light emitting portion 530 may also be in the shape of a ring, a semi-ring, an arc, and the like with an opening.

[0147] See also Fig.16 and Fig.17 The structural member 32 includes a top end 323 and a bottom end 324 which are arranged opposite to each other, and a main body region 325 connected between the top end 323 and the bottom end 324. The top end 323 is formed at the top of the first structural body 32A, and the bottom end 324 is formed at the bottom of the second structural body 32B. The bottom end 324 is connected to the substrate 31, and the top end 323 extends into the optical window. The top end 323 surrounds a cylindrical structure, and the internal space of the cylindrical structure is the light inlet of the camera module.

[0148] In one implementation, the light source vacant area may be formed at the top end 323 , for example, at the end face or outer surface of the top end 323 , and the light source accommodating area and the light entrance are separated by a structural member 32 .

[0149] Fig.18 FIG. 1 is a schematic diagram of a substrate and an electronic device disposed on the substrate provided in an embodiment. Fig.18 and Fig.15 , an image sensor 33 is disposed on the substrate 31, a light source 51 and a signal processor 522 are disposed on the substrate 31, and the light source 51 and the signal processor 522 are disposed on the same side of the image sensor 33. Fig.15 As shown, the light source 51 and the signal processor 522 are located on the same side of the structural member 32. The light source 51 and the signal processor 522 are arranged adjacent to each other. The adjacent arrangement can be understood as that no other electronic devices are arranged between the light source 51 and the signal processor 522. Such a design facilitates the wiring arrangement of the substrate 31, so that the electrical connection path between the light source 51 and the signal processor 522 is closer, which is conducive to improving the working efficiency of the detection light sensor. In one embodiment, the light source 51, the signal processor 522 and other electronic devices on the substrate 31 located outside the structural member 32 are all located in the enclosed space formed by the shielding cover 40 and the substrate 31.

[0150] Fig.19A Shown is a schematic diagram of an optical component provided in one embodiment. Fig.19B for Fig.19A A cross-sectional view of the optical assembly is shown. Fig.19A and Fig.19B In the illustrated embodiment, the bottom end of the structural member 32 is combined with the substrate 31, and the structural member 32 and the substrate 31 are connected to form two chambers C1 and C2, wherein one chamber C1 accommodates the image sensor 33, and the other chamber C2 accommodates the light source 51. The two chambers C1 and C2 are separated by a partition wall 326 formed by the structural member 32. A light exit hole C22 is formed on the side of the chamber C2 away from the substrate 31. The light guide 53 passes through the light exit hole C22, one end of the light guide 53 is in the chamber C2, and the other end of the light guide 53 is at the top end of the structural member 32 (i.e., the end of the structural member 32 away from the substrate 31 and the end of the structural member 32 located at the optical window position).

[0151] Fig. 20A , Fig. 20B and Fig. 20C They are respectively a stereoscopic view, a plan view, and a cross-sectional view of a light guide in an optical assembly provided in one embodiment of the present application.

[0152] See also Fig. 20A , Fig. 20B and Fig. 20C The light guide 53 includes a light incident surface 531, a transmission section 532 and a light emitting surface 533. The transmission section 532 is an elongated rod-shaped structure with a bent shape. The cross-section of the transmission section 532 can be circular, square, triangular, polygonal, irregular, etc. The light incident surface 531 is an end surface of the transmission section 532, and is the end surface of the transmission section 532 facing the light source 51. The light emitting portion 530 is connected to the end of the transmission section 532 away from the light source. The light emitting surface 533 is the end surface of the light emitting portion 530, and is the surface facing the external space of the display screen. In the present embodiment, the light emitting portion 530 is in a circular ring shape, surrounding the periphery of the structural member.

[0153] In one embodiment, the refractive index of the light-guiding material of the light guide is greater than or equal to 1.4. The refractive index of the light-guiding material of the light guide is greater than the refractive index of the external environment of the light guide, which can satisfy the light to be totally reflected and propagated in the light guide. For example, the refractive index of the light-guiding material of the light guide (taking PC as an example) is 1.5, and the external environment is air, and the refractive index of air is 1. In this case, when the light enters the light guide, since the refractive index of the light-guiding material is greater than the refractive index of the external environment of the light guide, the light can be totally reflected in the light guide.

[0154] like Fig. 20AAs shown, in one embodiment, the outer surface of the light guide 53 includes at least one total reflection curved surface 5321. At the position of the total reflection curved surface 5321, the calculation formula of the total reflection critical angle of the light is:

[0155]

[0156] Wherein, n1 is the refractive index of the light-guiding material, and n2 is the refractive index of the material outside the light-guiding material and in contact with the light-guiding material.

[0157] Taking PC material and air as an example, the calculation formula for the total reflection critical angle of light is:

[0158]

[0159] The conditions that need to be met in the design of the light guide provided in one embodiment of the present application at the position of the total reflection curved surface 5321 are:

[0160] θ1>θc>41.8°,

[0161] This design can improve the transmission efficiency of light.

[0162] like Fig. 20B As shown, in one embodiment, the transmission section 532 of the light guide 53 includes a first curved section 532A and a second curved section 532B, the first curved section 532A is located between the second curved section 532B and the light incident surface 531, the number of the total reflection curved surfaces is two, namely, a first curved surface S1 and a second curved surface S2, the first curved surface S1 is the surface of the first curved section 532A, the second curved surface S2 is the surface of the second curved section 532B, and the bending radius of the first curved section 532A is smaller than the bending radius of the second curved section 532B.

[0163] like Fig. 20C As shown, in one embodiment, the light guide 53 includes an inner body 5301 and an enclosing layer 5302, the inner body 5301 includes a light incident surface 531, a light emitting surface 533 and an outer peripheral surface 535, the outer peripheral surface 535 is connected between the light incident surface 531 and the light emitting surface 533, the enclosing layer 5302 is sleeved on the outer peripheral surface 535 of the inner body 5301, the inner body 5301 is all made of light guiding material, and the enclosing layer 5302 is used to realize the transmission of light from the light incident surface 531 to the light emitting surface 533 in the inner body 5301.

[0164] In one embodiment, the surrounding layer 5302 is a total reflection film, which is used to achieve total reflection of light in the inner body 5301. The material of the surrounding layer 5302 is a metal film or a dielectric total reflection film. The material of the metal film can be silver, aluminum, etc., and the material of the dielectric total reflection film can be tantalum oxide, etc.

[0165] In one implementation, the material of the inner body 5301 may be PC (polycarbonate material), glass, PMMA (polymethyl methacrylate material), or the like.

[0166] See also Fig.19A In one embodiment, the light guide 53 can be assembled and connected with the structural member 32 as a whole. In one embodiment, the light guide 53 can be an integrally formed structure with the structural member 32. Specifically, the structural member and the light guide can be made into one structural member by a two-color injection molding process and a mold design to realize the alternating flow of two different material melts in the mold cavity, thereby reducing the number of parts, increasing assembly efficiency, and improving the overall structural reliability of the camera module.

[0167] In other embodiments, the light guide is in the form of a rod, and includes a light incident surface, a transmission section, and a light emitting surface. The transmission section is connected between the light incident surface and the light emitting surface. The light incident surface faces the light source. The light emitting surface is located in the light emitting area of ​​the light signal emitted by the light source 51. The transmission section is in the form of an elongated rod, and the end surfaces at both ends of the transmission section constitute the light incident surface and the light emitting surface. This solution is equivalent to Fig.15 On the basis of the light guide in the invention, the light emitting portion does not form a ring structure, but directly forms a light emitting surface with one end of the transmission section.

[0168] The present application integrates the camera module and the detection light sensor into one optical assembly by arranging the light receiver of the detection light sensor in the enclosed space of the structural member, and separating the light source and the light receiver by the structural member. Since the structural member has a light shielding property, the structural member separates the light receiver and the light source, and can achieve light isolation between the light receiver and the light source, avoid the light crosstalk emitted by the light source to the area where the control chip is located, and can ensure the detection efficiency of the detection light sensor. Moreover, the detection light sensor in the optical assembly provided by the present application uses the peripheral area of ​​the light inlet of the camera module as the light exit area of ​​the light source, that is, the detection light sensor and the camera module share an optical window on a display screen. Due to the high transmittance of this optical window, it is beneficial to improve the detection efficiency of the detection light sensor. For electronic devices, there is no need to set multiple optical windows on the display screen, so that the visual effect of the display screen is better. The present application can improve the screen-to-body ratio and also has the advantage of saving internal space of electronic devices.

[0169] The present application integrates the light receiver on the image sensor so that the light receiver does not occupy extra space in the camera module, and only utilizes the area at the edge of the imaging area on the image sensor that can capture light. For example, this area on the image sensor is originally idle and no other electronic devices are set. Therefore, the present application integrates the light receiver on the image sensor so that the idle space of the image sensor can be utilized, so that the combined design of the detection light sensor and the camera module does not affect the size and structural layout of the camera module itself.

[0170] In a specific implementation, it is assumed that the light source of the detection light sensor adopts a vertical cavity surface emitting laser (VCSEL), and the light guide is implemented using a 1mm plastic optical fiber. The transmittance of the lens in the camera module (including the optical window after the screen window is opened) is 80%. Since the optical path of the light guide is <10cm, the transmission loss of the light guide can be ignored. The coupling loss between the VCSEL and the light guide can be easily achieved to <2dB. That is, >62% of the light signal sent by the VCSEL will be coupled into the light guide. The equivalent transmittance of the transmission path is >49%.

[0171] Assuming that the transmittance of the filter is >10%, the equivalent transmittance of the receiving channel is >8%.

[0172] It can be seen that the equivalent transmittance can be increased by 30 to 490 times by using the optical assembly provided in the embodiment of the present application. The effective signal strength can be increased by 30 to 490 times during detection light detection, and it is easy to distinguish the signal strength difference of target objects at different set distances (such as 3CM and 5CM).

[0173] Since the light source and the light receiver are separated by a structural member, that is, the two are arranged in an independent cavity, the light signal sent by the light source is difficult to directly crosstalk the detector, and can only be sent to the outside of the display screen through the light guide, thereby reducing the crosstalk from the light source to the detector. By adopting the method of the present invention, when detecting the difference in signal strength of a target object at a distance of 3cm / 5cm, it is easier to obtain a higher signal to noise ratio (Signal to Interference plus Noise Ratio, SNR), that is, it is easier to distinguish a target object at a distance of 3cm / 5cm, that is, it is easier to make a judgment of approaching or far away.

[0174] The electronic device provided by the present application adopts the optical component provided by the first aspect, so that the display screen of the electronic device has a specific better screen-to-body ratio. Only one optical window needs to be set to meet the two different functions of the camera module and the detection light sensor, saving the opening area on the display screen. Moreover, the integrated design of the camera module and the detection light sensor is also conducive to saving space inside the electronic device, and does not affect the respective functions of the camera module and the detection light sensor. Since the light transmittance of the optical window of the camera module is relatively high, the present application can improve the detection efficiency of the detection light sensor.

[0175] In a possible implementation, the light source is located on the inner wall of the optical window. The present application can set the light source on the inner wall of the optical window, saving space inside the electronic device and improving the efficiency of the light source.

[0176] In a possible implementation, the light source is disposed on the back of the display screen. The present application can use the back of the display screen as the installation location of the light source, which can save space inside the electronic device. The position of the light source on the back of the display screen can be close to the optical window, which can also improve the efficiency of the light source.

[0177] In a possible implementation, the light source is integrated into the display screen. The light source can be integrated into the display screen during the manufacturing process, or the display screen can be driven to drive the light source. Such a design saves the internal space of the electronic device to a greater extent.

[0178] See also Fig.21 In a possible implementation, the present application provides a control system, which can be a control circuit for an integrated camera module and a detection light sensor. The control system includes a driver, a first receiving circuit Rx1, a second receiving circuit Rx2, and a control circuit. The first receiving circuit Rx1 is used to receive and process the light signal of the detection light sensor, and the second receiving circuit Rx2 is used to receive and process the image signal of the imaging part of the camera module. Functional circuits such as a signal amplification circuit and a signal sampling circuit can be set in both the first receiving circuit Rx1 and the second receiving circuit Rx2.

[0179] The driver is electrically connected to the control circuit, and the driver is also electrically connected to the light source 51 . The control circuit transmits a control signal to the driver, and the driver is used to control the light source 51 to emit light.

[0180] Fig.21In the figure, the arrowed line marked as ctrl between the control circuit and the driver represents the control signal line for the control circuit to transmit the control signal to the driver. Similarly, there are control signal lines (ctrl lines) between the control circuit and the first receiving circuit RX1 and between the control circuit and the second receiving circuit RX2. The arrowed line marked as data between the first receiving circuit RX1 and the control circuit represents the data signal line for the first receiving circuit RX1 to transmit the data signal to the control circuit. Similarly, there is a data signal line (data line) between the second receiving circuit RX2 and the control circuit.

[0181] The first receiving circuit Rx1 is electrically connected to the control circuit, and the first receiving circuit Rx1 is also electrically connected to the optical receiver 521 of the detection light sensor. The optical receiver 521 can be a detector structure arranged in an array. The control circuit transmits a control signal to the first receiving circuit Rx1, so that the first receiving circuit Rx1 receives the optical signal collected by the detection light sensor. The first receiving circuit Rx1 can also transmit the received optical signal to the control circuit.

[0182] The second receiving circuit Rx2 is electrically connected to the control circuit, and the second receiving circuit Rx2 is also electrically connected to the image sensor 33 of the camera module. The control circuit transmits a control signal to the second receiving circuit Rx2, so that the second receiving circuit Rx2 receives the image signal collected by the image sensor 33. The second receiving circuit Rx2 can also transmit the received image signal to the control circuit.

[0183] Fig.21 In one embodiment shown, the control system is integrated into an image signal processor (ISP), that is, the control system is designed in an ISP chip. The driver, the first receiving circuit Rx1, the second receiving circuit Rx2, and the control circuit are all integrated into the ISP chip.

[0184] Fig. 22 In one embodiment shown, the first receiving circuit Rx1, the second receiving circuit Rx2 and the control circuit in the control system are integrated into an image signal processor (ISP), and the driver is arranged outside the ISP, that is, the driver is separated to form a separate chip or control circuit.

[0185] The control system provided in the present application integrates a first receiving circuit for collecting detection signals from a detection light sensor and a second receiving circuit for collecting imaging signals from a camera module. One control system can control two optical modules with different functions, which can save the area of ​​the circuit board occupied by the control system and is conducive to the miniaturized design of electronic equipment.

[0186] The present application also provides a control method for an optical component, the control method comprising periodically executing imaging control of the camera module and detection control of the detection light sensor; wherein, in the interval time period between two imaging controls of the camera module, the detection control of the detection light sensor is performed once or multiple times; or, in the interval time period between two detection controls of the detection light sensor, the imaging control of the camera module is performed once or multiple times. The control method provided by this scheme is used to realize a scenario in which the imaging part (image sensor) of the camera module may not work when the detection light sensor is working. The imaging control of the camera module and the detection control of the proximity light sensor may be performed in time periods. The detection light sensor may be independently controlled without starting the camera module, which can reduce the energy consumption of electronic equipment.

[0187] Give Fig.21 and Fig.23 In one embodiment, the detection light sensor is a proximity light sensor, and the detection control of the detection light sensor in each detection cycle includes the following steps:

[0188] S101, turn off the light source 51, and the control circuit controls the first receiving circuit RX1 to perform the first exposure on the light receiver 521 of the proximity light sensor to generate a first light signal. Assume that the time of the first exposure is T1. During the T1 time, the light source 51 of the proximity light sensor is in the off state, that is, the driver has no driving signal output to the light source 51, and the light source 51 does not emit light. During the T1 time, the first light signal is received and processed by the first receiving circuit RX1. The first light signal can be a background environment signal, and the background environment signal includes: light intensity, background noise, or background light in the background environment.

[0189] S102, turning on the light source 51, making the light source 51 emit light for T2 time, and at the same time, the control circuit controls the first receiving circuit RX1 to expose the light receiver 521 of the proximity light sensor for a second time to generate a second light signal, and the first receiving circuit processes the second light signal.

[0190] S103: Determine a proximity light detection signal according to the first light signal and the second light signal.

[0191] S104, judging whether the target object is moving away or approaching according to the final approaching light detection signal, and outputting an approaching or moving away state indication.

[0192] The image signal of the imaging exposure of the camera module is collected through the second receiving circuit RX2.

[0193] In this embodiment, the second receiving circuit RX2 drives the imaging control part of the camera module ( Fig.23The first receiving circuit RX1 drives the control part of the proximity light sensor ( Fig.23 The background light is collected and the received signal is collected to indicate the driving period).

[0194] Based on the first embodiment, in other embodiments, the steps of the above control method may not include step S103, and instead: signal acquisition is performed by integration. Specifically, when the signal is acquired by integration, step S101 and step S102 can be subtracted by reverse integration. Assuming that step S101 is a forward integration, step S102 adopts reverse integration. Assuming that step S101 adopts reverse integration, step S102 adopts forward integration. This solution can be achieved by switching the polarity of the input of the integration circuit.

[0195] In one embodiment, in combination Fig.21 and Fig.24 The present application provides a control method for realizing a scenario in which when the proximity light sensor is working, the imaging part (image sensor) of the camera module is also working, but the imaging of the proximity light sensor and the camera module is completed in cooperation with each other.

[0196] In this embodiment, the detection control of the detection light sensor in each detection cycle includes the following steps:

[0197] S301, turn off the light source 51, and the control circuit controls the second receiving circuit RX2 to expose the image sensor 33 to generate a first light signal. Assuming that the exposure time is T10, during the T10 time, the light source 51 close to the light sensor is in a closed state, that is, the driver has no driving signal output to the light source 51, and the light source 51 does not emit light. During the T10 time, the first light signal is received and processed by the second receiving circuit RX2.

[0198] S302, turn on the light source 51, and make the light source 51 emit light for T20 time, and at the same time, the control circuit controls the first receiving circuit RX1 to expose the light receiver 521 of the proximity light sensor to generate a second light signal. The second light signal is received and processed by the first receiving circuit.

[0199] S303: Determine a proximity light detection signal according to the first light signal and the second light signal.

[0200] Since the imaging part of the image sensor 33 and the light receiver 521 corresponding to the second receiving circuit RX2 and the first receiving circuit RX1 are at different positions on the image sensor in the camera module, the imaging part of the image sensor 33 and the light receiver 521 respond differently to the light signal. Therefore, when eliminating the influence of background noise or background light, it is necessary to normalize the signal measured in step S302 and the signal measured in step S301, or perform coefficient conversion.

[0201] S304, judging whether the target object is moving away or approaching according to the final approaching light detection signal, and outputting an approaching or moving away state indication.

[0202] The image signal of the imaging exposure of the camera module is collected by the second receiving circuit.

[0203] The control method provided by this scheme includes the second receiving circuit RX2 driving the imaging control part of the camera module ( Fig.24 The control part (in which the imaging exposure or ambient light detection exposure and the imaging exposure indication driving period are used) and the first receiving circuit RX1 drives the proximity light sensor Fig.24 Before the first receiving circuit RX1 drives the light receiver of the proximity light sensor to collect the received signal, the second receiving circuit RX2 drives the image sensor to perform imaging exposure or ambient light detection exposure. This part of the exposure task is equivalent to the task of collecting background light by the first receiving circuit RX1 driving the proximity light sensor in the first embodiment and the second embodiment.

[0204] Fig.25 A circuit arrangement architecture on a substrate of an optical component and a partial circuit architecture on a system-level chip are provided in one embodiment of the present application. Fig.25 In one embodiment, the light source 51 and the image sensor 33 are both disposed on the substrate 31, and the light receiver 522 is integrated in the image sensor 33. The image sensor 33 is provided with a timing circuit and an analog-to-digital converter, and the timing circuit and the analog-to-digital converter are electrically connected. The substrate 31 is provided with a controlled current source, which is electrically connected between the light source 51 and the current output channel (STROBE channel) of the image sensor 33, and the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, which is a power control signal determined according to the exposure time of the image sensor. Fig.25 In the circuit architecture provided by the illustrated embodiment, a controlled current source for driving the light source 51 to emit light is disposed on the substrate 31, and a light source control signal for aligning the exposure time of the image sensor 33 is emitted by a current output channel (STROBE channel) of the camera of the image sensor.

[0205] Fig.26The present invention provides a circuit arrangement architecture on a substrate of an optical component and a partial circuit architecture of a system-level chip and a power management module. Fig.26 In one embodiment, the light source 51 and the image sensor 33 are both disposed on the substrate 31, and the light receiver 522 is integrated in the image sensor 33. The image sensor is provided with a timing circuit and an analog-to-digital converter, and the timing circuit and the analog-to-digital converter are electrically connected. The substrate includes a power signal output port K2 and a power signal input port K1, and the power signal output port K2 and the power signal input port K1 are used to be electrically connected to a controlled current source located outside the substrate. The light source 51 is electrically connected to the power signal input port K1, and the power signal output port K2 is electrically connected to the current output channel (STROBE channel) of the image sensor 33. The current output channel K2 is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor 33.

[0206] The present solution provides a circuit design solution for at least part of the image sensor, which regulates the signal of a controlled current source through a timing circuit, outputs a stroboscopic signal through a current output channel, and combines the exposure time of the image sensor with the switching of a power supply to realize a specific control solution for an optical component.

[0207] See also Fig.26 In one embodiment, the controlled current source is disposed in a power management module (PMU). It can be understood that the present solution can use the controlled current source in the power management module (PMU) to drive the light source 51 to emit light. Such a design can save space on the substrate 31, which is conducive to the miniaturization design of the camera module. The present solution also outputs a stroboscopic signal through a current output channel, and combines the exposure time of the image sensor with the switch of the power supply to realize a specific control scheme of the optical component.

[0208] Apart from Fig.25 and Fig.26 In addition to the illustrated embodiment, the controlled current source may also be located at other locations within the electronic device.

[0209] See also Fig.25 and Fig.26 The image signal processor is integrated in the image sensor, and the image signal processor is electrically connected to the analog-to-digital converter, which is used to receive and process the signal collected by the light receiver 522, and send the signal to the image signal processor for processing. The image signal processor on the substrate 31 is electrically connected to the digital signal processing module on the system-level chip. The system-level chip is provided with a proximity light signal processing module and a visible light signal processing module, and the proximity light signal processing module and the visible light signal processing module are both electrically connected to the digital signal processing module.

[0210] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0211] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application; in the absence of conflict, the possible implementations of the present application and the features of the possible implementations can be combined with each other. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An optical component, characterized in that: It includes a camera module, a light source, a light receiver and a light guide. The camera module comprises a substrate, a structural member, an image sensor and a lens, wherein the image sensor is arranged on the substrate, the structural member is cylindrical and one end of the structural member is connected to the substrate, the structural member and the substrate are jointly arranged to form an enclosed space, the image sensor and the lens are located in the enclosed space, and the end of the structural member away from the substrate is a light inlet of the camera module; The light source is disposed on the substrate and is used to send an optical signal; The light guide is used to transmit the optical signal to the periphery of the light entrance, and the refractive index of the light guide material constituting the light guide is greater than or equal to 1.4; the optical receiver is located in the enclosed space, the light source and the optical receiver are separated by the structural member, and the optical receiver is used to receive the optical signal entering the enclosed space through the light entrance.

2. The optical component according to claim 1, characterized in that The light guide component includes an inner body and an enclosing layer, the inner body includes a light incident surface, a light emitting surface and an outer peripheral surface, the outer peripheral surface is connected between the light incident surface and the light emitting surface, the enclosing layer is sleeved on the outer peripheral surface of the inner body, the inner body is all made of the light guiding material, and the enclosing layer is used to realize the transmission of light from the light incident surface to the light emitting surface in the inner body.

3. The optical component according to claim 2, characterized in that The surrounding layer is a total reflection film, which is used to achieve total reflection of light in the inner body.

4. The optical component according to claim 3, characterized in that The material of the total reflection film is a metal film or a dielectric total reflection film.

5. The optical component according to any one of claims 1 to 4, characterized in that: The outer surface of the light guide element includes at least one total reflection curved surface.

6. The optical component according to claim 5, characterized in that The light guide includes a first curved segment and a second curved segment, the first curved segment is located between the second curved segment and the light incident surface, the number of the total reflection curved surfaces is two, namely the first curved surface and the second curved surface, the first curved surface is the surface of the first curved segment, the second curved surface is the surface of the second curved segment, and the bending radius of the first curved segment is smaller than the bending radius of the second curved segment.

7. The optical component according to claim 2, characterized in that The light guide is an optical fiber.

8. The optical component according to any one of claims 1 to 7, characterized in that: The structural member has a light source accommodating area, the light source is located in the light source accommodating area, an isolation portion is formed between the light source accommodating area and the surrounding space, and the isolation portion is used to separate the light receiver from the light source.

9. The optical component according to claim 8, characterized in that The structural member comprises a top end and a bottom end which are arranged opposite to each other and a main body area connected between the top end and the bottom end. The light entrance is located at the top end, and the light source accommodating area is located at the bottom end.

10. The optical component according to claim 9, characterized in that The light source accommodating area has an open end and a light exit hole. The light source is arranged on a substrate. The open end is used to be combined with the substrate, and the light exit hole is used to transmit the light signal.

11. The optical component according to claim 10, characterized in that One end of the light guide member where the light incident surface is located is located in the light exit hole or extends into the light source accommodating area through the light exit hole.

12. The optical component according to any one of claims 1 to 11, characterized in that: The light guide member includes a light emitting portion, the light emitting portion is located at the periphery of the light incident port, and the light emitting portion is arranged around at least a portion of the structural member.

13. The optical component according to any one of claims 1 to 12, characterized in that: The light receiver is integrated on the image sensor.

14. The optical component according to claim 13, characterized in that The image sensor has a first area, a second area and a third area, the second area is located inside the first area, the third area is located within the first area and outside the second area, and the light receiver is located in the third area; The first area is an area formed by the light entering the camera module through the light entrance and projected onto the image sensor, and the second area is an imaging area of ​​the camera module.

15. The optical component according to claim 14, characterized in that The camera module also includes a filter, which is located between the image sensor and the lens. The filter includes area one and area two. The area one is arranged corresponding to the second area. The area one is used to transmit visible light and cut off infrared light. The area two is located outside the area one. The area two is arranged corresponding to the third area. The area two is used to transmit infrared light or partially transmit infrared light.

16. The optical component according to claim 15, characterized in that The filter includes an isolation region connected between the first region and the second region, and the isolation region is used to prevent infrared light from entering the second region.

17. The optical component according to any one of claims 1 to 12, characterized in that: The light receiver is connected to an inner wall of the structural member.

18. The optical component according to claim 17, characterized in that The camera module also includes a filter, which is located between the image sensor and the lens, and is used to transmit visible light and cut off infrared light. The light receiver is located in the space between the filter and the lens, and is used to reflect the light signal emitted by the light source entering the enclosed space to the light receiver.

19. The optical component according to any one of claims 1 to 12, characterized in that: The camera module also includes a filter, which is located between the image sensor and the lens. The light receiver is arranged on the filter and is located on a side of the filter facing the lens.

20. The optical component according to claim 19, characterized in that The filter and the image sensor are stacked on the substrate, and the light receiver is electrically connected to the substrate.

21. The optical component according to any one of claims 1 to 20, characterized in that: The optical receiver further comprises a signal processor, which is disposed on the substrate and is used for receiving and processing the signal of the optical receiver.

22. The optical component according to claim 21, characterized in that The signal processor is located in the surrounding space and integrated on the image sensor; or, The signal processor is located at the periphery of the structural component and is arranged on the substrate. The signal processor and the light source are located on the same side of the structural component.

23. The optical component according to any one of claims 1 to 22, characterized in that: The light source, the light receiver, and the light guide constitute a proximity light sensor.

24. The optical component according to any one of claims 1 to 23, characterized in that: The light guide member and the structural member are an integrally formed structure.

25. The optical component according to any one of claims 1 to 24, characterized in that: The image sensor is provided with a timing circuit and an analog-to-digital converter, the timing circuit and the analog-to-digital converter are electrically connected, the substrate is provided with a controlled current source, the controlled current source is electrically connected between the light source and the current output channel of the image sensor, the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor.

26. The optical component according to any one of claims 1 to 24, characterized in that: The image sensor is provided with a timing circuit and an analog-to-digital converter, the timing circuit and the analog-to-digital converter are electrically connected, the substrate includes a power signal output port and a power signal input port, the power signal output port and the power signal input port are used to be electrically connected to a controlled current source located outside the substrate, the light source is electrically connected to the power signal input port, the power signal output port is electrically connected to a current output channel of the image sensor, the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor.

27. An electronic device, characterized in that: It comprises an optical component and a display screen as described in any one of claims 1 to 26, wherein the display screen has an optical window, the light inlet is located in the optical window, and the area between the light inlet and the inner wall of the optical window constitutes a light exit area of ​​the light signal emitted by the light source.

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