Three-in-one LED, display equipment lamp panel, manufacturing method of display equipment lamp panel and display equipment

Abstract

The invention relates to a three-in-one LED, a display device lamp panel, a manufacturing method of the display device lamp panel and a display device. The three-in-one LED is provided with a first epoxy resin layer and a second epoxy resin layer, and the second epoxy resin layer covers the first epoxy resin layer. The process method comprises the following steps that an LED display screen lamp panel is fixed to a platform; preparing a steel mesh, aligning the steel mesh with a lamp panel of the LED display screen, and forming holes in corresponding LED light-emitting positions; adding epoxy resin mixed liquid into the steel mesh, and rolling the epoxy resin mixed liquid by using a rubber scraper, so that the epoxy resin mixed liquid leaks onto the LED lamp cup from the corresponding steel mesh holes; and the LED display screen lamp panel is taken out and baked.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a three-in-one LED, a display device light board, a manufacturing method thereof, and a display device. Background Art

[0002] The existing LED display screen is usually produced by mounting multiple three-in-one LED lamps on a substrate. Figure 1 As shown, after the die is fixed in the packaging process, epoxy resin is poured into the LED cup groove, and after the epoxy resin is baked in a furnace and solidified, a translucent epoxy resin layer is formed that is lower than the surface of the lamp cup.

[0003] In the process of implementing the present invention, the inventors found that there are at least the following problems in the prior art:

[0004] (1) Usually, the LED cup slot opening is equal to the effective light-emitting angle of the chip, which can obtain the maximum light-emitting angle of the LED. When the LED lamp cup is blocked, the LED light-emitting angle is within 110 degrees, which cannot meet the requirements of the LED display for a large light-emitting angle;

[0005] (2) LED lamp cups are usually made by injection molding. Different LED lamp cups may be produced by different molds. Due to the difference in texture between molds, the different textures on the surface of the LED lamp cups cause different surface colors of different LEDs in the black screen state, resulting in poor color consistency of the LED display screen, that is, the product has pitting, flowery screen, etc. Summary of the invention

[0006] Based on this, the purpose of the embodiments of the present invention is to provide a three-in-one LED, a display device light board, a manufacturing method thereof, and a display device, so as to increase the light-emitting angle of the three-in-one LED and avoid the problem of inconsistent colors when the display device is black.

[0007] In the first aspect, the three-in-one LED described in the embodiment of the present invention is characterized in that it includes a prefabricated three-in-one LED and a second epoxy resin layer, the prefabricated three-in-one LED includes an LED lamp cup, a red wafer, a blue wafer, a green wafer and a first epoxy resin layer, the LED lamp cup forms an LED lamp trough, the red wafer, the blue wafer and the green wafer are arranged in the LED lamp trough, the first epoxy resin layer fills the LED lamp trough and forms an outer surface with a concave curved surface, and the second epoxy resin layer covers the LED lamp cup and the first epoxy resin layer.

[0008] Based on the existing prefabricated three-in-one LED, the second epoxy resin layer covers the LED lamp cup and the concave first epoxy resin layer, which can increase the light-emitting angle of the LED and enable the three-in-one LED of the embodiment of the present invention to avoid the problem of inconsistent colors when the screen is black when applied to a display device.

[0009] As a preferred solution, the outer surface of the second epoxy resin layer in the embodiment of the present invention is a convex curved surface, that is, the first epoxy resin layer and the second epoxy resin layer form a convex lens structure, which can maximize the light-emitting angle when refracting light.

[0010] As a preferred solution, the thickness of the second epoxy resin layer in the embodiment of the present invention is 0.2-0.3 mm; more preferably, the thickness of the second epoxy resin layer is 0.2 mm. The thickness of the second epoxy resin layer of 0.2-0.3 mm can maximize the light-emitting angle of the LED, which can be increased by about 10 degrees, and can also increase the brightness by about 3%; if the thickness is too large, it is not conducive to production and the cost is increased.

[0011] As a preferred solution, the second epoxy resin layer in the embodiment of the present invention includes epoxy resin and blue pigment, so that the second epoxy resin layer is blue, which is most effective in improving the problem of poor surface color consistency of the display device in a black screen state.

[0012] In the second aspect, the display device light board of the embodiment of the present invention comprises a substrate and a plurality of the above-mentioned three-in-one LEDs, and the plurality of the three-in-one LEDs are fixed on the substrate. Due to the inclusion of the above-mentioned three-in-one LEDs, the display device light board of the embodiment of the present invention can enable the prepared display device to expand the viewing angle of the display device, while avoiding the problem of inconsistent colors when the display device is black.

[0013] In a third aspect, the display device according to the embodiment of the present invention includes a display device light board. The display device according to the embodiment of the present invention can expand the viewing angle of the display device and avoid the problem of inconsistent colors when the display device is black.

[0014] In a fourth aspect, the method for manufacturing a light board of a display device according to an embodiment of the present invention comprises the following steps:

[0015] The substrate is fixed on a platform, and a plurality of prefabricated three-in-one LEDs are fixed on the substrate in a certain order to obtain a prefabricated display device light board;

[0016] Prepare a steel mesh with a plurality of mesh holes, place the steel mesh on the prefabricated display device light board and align it with it, and the plurality of mesh holes correspond to the plurality of prefabricated three-in-one LED positions one by one;

[0017] Filling the mesh with epoxy resin mixture so that the epoxy resin mixture falls and covers the prefabricated three-in-one LED;

[0018] The prefabricated display device light board with epoxy resin mixture is baked to obtain the display device light board.

[0019] The manufacturing method of the display device light board described in the embodiment of the present invention has simple steps, simple operation, and is convenient for large-scale production. Compared with directly using a three-in-one LED with a convex surface, it avoids the problem of production material throwing, improves production stability and saves costs.

[0020] As a preferred solution, the steel mesh in the embodiment of the present invention has a thickness of 0.2-0.3mm and a mesh area of ​​77-83% of the LED area; more preferably, the steel mesh has a thickness of 0.2mm and a mesh area of ​​80% of the LED area. The setting of a mesh area of ​​77-83% of the LED area enables the falling epoxy resin mixture to just cover the entire LED surface and maximize the light-emitting angle of the LED; at the same time, it prevents the epoxy resin mixture from flowing under the lamp cup and between two adjacent LED lamp cups.

[0021] As a preferred solution, the epoxy resin mixture in the embodiment of the present invention includes epoxy resin and blue pigment. The blue pigment makes the second epoxy resin layer blue, which is most effective in improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen noise will occur.

[0022] As a preferred solution, the baking temperature in the embodiment of the present invention is 80-100°C and the baking time is 4-5 minutes. The temperature and time are just enough to completely cure the epoxy resin mixture and avoid energy waste caused by too high temperature and too long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to better understand and implement the present invention, the present invention is described in detail below with reference to the accompanying drawings. The protection scope of the present invention is not limited to the following description.

[0024] Figure 1 It is a schematic diagram of the existing three-in-one LED structure;

[0025] Figure 2 is a schematic diagram of the three-in-one LED structure of Example 1;

[0026] Figure 3 is a cross-sectional view of a light panel of a display device of Example 2;

[0027] Figure 4 is a schematic diagram of the substrate;

[0028] Figure 5 It is a top view of the light board of the display device;

[0029] Figure 6 It is a schematic diagram of the steel mesh;

[0030] Among them: 1-LED lamp cup, 2-LED pin, 3-first epoxy resin layer, 4-blue wafer, 5-green wafer, 6-red wafer, 7-second epoxy resin layer, 8-substrate, 9-steel mesh, 91-mesh. DETAILED DESCRIPTION

[0031] In the description of the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] In addition, the term "connection" is also used in the specification and claims, which should not be understood as limited to direct connection. Therefore, the expression "device A is connected to device B" should not be limited to the device A being directly connected to device B in the device or system, which means that there is a path between device A and device B, which may be a path including other devices or tools.

[0033] like Figure 1 As shown, the prefabricated three-in-one LED includes: an LED lamp cup 1, an LED pin 2, a red wafer 6, a blue wafer 4, a green wafer 5, and a first epoxy resin layer 3. The LED lamp cup forms an LED lamp trough, and the red wafer 6, the blue wafer 4, and the green wafer 5 are arranged in the LED lamp trough. The first epoxy resin layer 3 fills the LED lamp trough and forms an outer surface with a concave curved surface; an LED pin 2 is arranged below the outer surface of the LED lamp cup 1.

[0034] Example 1

[0035] The three-in-one LED in this embodiment includes: a prefabricated three-in-one LED and a second epoxy resin layer 7 .

[0036] like Figure 2 As shown, the second epoxy resin layer 7 covers the LED lamp cup 1 of the prefabricated three-in-one LED and the first epoxy resin layer 3 .

[0037] In an embodiment of the present invention, the material of the LED lamp cup includes but is not limited to PPA; in a preferred embodiment, the second epoxy resin layer 7 includes epoxy resin and blue pigment, that is, the second epoxy resin layer is blue, which is most effective in improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen flower phenomenon will occur. Among them, the epoxy resin can be selected from common commercially available epoxy resins without limitation. Preferably, the type of epoxy resin in the second epoxy resin layer 7 is the same as the type of epoxy resin in the first epoxy resin layer 3, so that the two layers of epoxy resin have better compatibility, and the two epoxy resin layers are more tightly combined and not easy to fall off. In a preferred embodiment, the outer surface of the second epoxy resin layer is a convex surface. In this way, the first epoxy resin layer and the second epoxy resin layer form a convex lens structure, which can maximize the light-emitting angle when refracting light; the thickness of the second epoxy resin layer is preferably 0.2-0.3mm, which can maximize the light-emitting angle of the LED on the one hand, which can increase it by about 10 degrees, and on the other hand, it can also increase the brightness by about 3%, and the thickness is moderate, which is convenient for production and cost saving. See Figure 1 and Figure 2 The light-emitting angle of the prefabricated three-in-one LED is 108°, and the light-emitting angle of the three-in-one LED in the embodiment of the present invention is 117°.

[0038] After the second epoxy resin layer is added to the three-in-one LED described in this embodiment, the second epoxy resin layer forms a convex lens structure on the surface of the LED, which can increase the light-emitting angle after refracting the light; and the three-in-one LED of the embodiment of the present invention can avoid the problem of inconsistent colors when the screen is black when applied to a display device, thereby avoiding pitting and screen noise.

[0039] Example 2

[0040] The display device light board of this embodiment includes: a substrate 8 (such as Figure 4 ) and the three-in-one LED of Example 1.

[0041] like Figure 3 As shown, the three-in-one LED of Embodiment 1 is connected to the substrate 8 via the LED pin 2. Figure 5 As shown, three-in-one LEDs are arranged in an array on a PCB.

[0042] In the embodiment of the present invention, the substrate may be, but is not limited to, a PCB. In other embodiments, it may be in other forms as long as it can fix a plurality of three-in-one LEDs so as to be used as a display device later.

[0043] The display device light board described in this embodiment can enable the prepared display device to expand the viewing angle of the display device, while avoiding the problem of inconsistent colors when the display device is black.

[0044] Example 3

[0045] The method for manufacturing the light board of the display device in this embodiment is as follows:

[0046] The substrate is fixed on a platform, and a prefabricated three-in-one LED array is arranged on the substrate to obtain a prefabricated display device light board;

[0047] Prepare a 0.2 mm steel mesh, the steel mesh is as follows Figure 6 As shown, a plurality of mesh holes are provided on the steel mesh, and the mesh hole area is 80% of the LED area. The steel mesh is placed on the prefabricated display device light board and aligned with it, and a plurality of the mesh holes correspond to a plurality of the prefabricated three-in-one LED positions one by one;

[0048] Filling the mesh with epoxy resin mixture so that the epoxy resin mixture falls and covers the prefabricated three-in-one LED;

[0049] The prefabricated display device light board with the epoxy resin mixture is baked at a temperature of 100° C. for 4 minutes to obtain a display device light board.

[0050] The epoxy resin mixture described in the embodiment of the present invention includes epoxy resin and blue pigment, so that a second epoxy resin layer is formed after the final baking and forming, and the second epoxy resin layer is blue, which is the best for improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen noise will occur. The resin type selected for the epoxy resin is the same as the resin type of the epoxy resin in the first epoxy resin layer, so that the two layers of epoxy resin have better compatibility.

[0051] The manufacturing method for preparing the display device light board described in this embodiment has simple steps and a simple process, and is convenient for large-scale production. The problems of insufficient LED light emitting angle and poor color consistency of the display device are solved through a simple process method.

[0052] Example 4

[0053] The method for manufacturing the light board of the display device in this embodiment is as follows:

[0054] The substrate is fixed on a platform, and the prefabricated three-in-one LEDs are fixed on the substrate in a certain order to obtain a prefabricated display device light board;

[0055] Prepare a 0.2 mm steel mesh, the steel mesh is as follows Figure 6 As shown, a plurality of mesh holes are provided on the steel mesh, and the mesh hole area is 80% of the LED area. The steel mesh is placed on the prefabricated display device light board and aligned with it, and a plurality of the mesh holes correspond to a plurality of the prefabricated three-in-one LED positions one by one;

[0056] Filling the mesh with epoxy resin mixture so that the epoxy resin mixture falls and covers the prefabricated three-in-one LED;

[0057] The prefabricated display device light board with the epoxy resin mixture is baked at a temperature of 80° C. for 5 minutes to obtain a display device light board.

[0058] The epoxy resin mixture described in the embodiment of the present invention includes epoxy resin and blue pigment, so that a second epoxy resin layer is formed after the final baking and molding. The second epoxy resin layer is blue, which is most effective in improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen flower phenomenon will occur.

[0059] The manufacturing method for preparing the display device light board described in this embodiment has simple steps and a simple process, and is convenient for large-scale production. The problems of insufficient LED light emitting angle and poor color consistency of the display device are solved through a simple process method.

[0060] Example 5

[0061] The method for manufacturing the light board of the display device in this embodiment is as follows:

[0062] The substrate is fixed on a platform, and the prefabricated three-in-one LEDs are fixed on the substrate in a certain order to obtain a prefabricated display device light board;

[0063] Prepare a 0.3 mm steel mesh, the steel mesh is as follows Figure 6 As shown, a plurality of mesh holes are provided on the steel mesh, and the mesh hole area is 77% of the LED area. The steel mesh is placed on the prefabricated display device light board and aligned with it, and a plurality of the mesh holes correspond to a plurality of the prefabricated three-in-one LED positions one by one;

[0064] Filling the mesh with epoxy resin mixture so that the epoxy resin mixture falls and covers the prefabricated three-in-one LED;

[0065] The prefabricated display device light board with the epoxy resin mixture is baked at a temperature of 100° C. for 4 minutes to obtain a display device light board.

[0066] The epoxy resin mixture described in the embodiment of the present invention includes epoxy resin and blue pigment, so that a second epoxy resin layer is formed after the final baking and molding. The second epoxy resin layer is blue, which is most effective in improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen flower phenomenon will occur.

[0067] The manufacturing method for preparing the display device light board described in this embodiment has simple steps and a simple process, and is convenient for large-scale production. The problems of insufficient LED light emitting angle and poor color consistency of the display device are solved through a simple process method.

[0068] Example 6

[0069] The method for manufacturing the light board of the display device in this embodiment is as follows:

[0070] The substrate is fixed on a platform, and the prefabricated three-in-one LEDs are fixed on the substrate in a certain order to obtain a prefabricated display device light board;

[0071] Prepare a 0.2 mm steel mesh, the steel mesh is as follows Figure 6 As shown, a plurality of mesh holes are provided on the steel mesh, and the mesh hole area is 83% of the LED area. The steel mesh is placed on the prefabricated display device light board and aligned with it, and a plurality of the mesh holes correspond to a plurality of the prefabricated three-in-one LED positions one by one;

[0072] Filling the mesh with epoxy resin mixture so that the epoxy resin mixture falls and covers the prefabricated three-in-one LED;

[0073] The prefabricated display device light board with the epoxy resin mixture is baked at a temperature of 100° C. for 4 minutes to obtain a display device light board.

[0074] The epoxy resin mixture described in the embodiment of the present invention includes epoxy resin and blue pigment, so that a second epoxy resin layer is formed after the final baking and molding. The second epoxy resin layer is blue, which is most effective in improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen flower phenomenon will occur.

[0075] The manufacturing method for preparing the display device light board described in this embodiment has simple steps and a simple process, and is convenient for large-scale production. The problems of insufficient LED light emitting angle and poor color consistency of the display device are solved through a simple process method.

[0076] Example 7

[0077] The method for manufacturing the light board of the display device in this embodiment is as follows:

[0078] The substrate is fixed on a platform, and the prefabricated three-in-one LEDs are fixed on the substrate in a certain order to obtain a prefabricated display device light board;

[0079] Prepare a 0.2 mm steel mesh, the steel mesh is as follows Figure 6 As shown, a plurality of mesh holes are provided on the steel mesh, and the mesh hole area is 80% of the LED area. The steel mesh is placed on the prefabricated display device light board and aligned with it, and a plurality of the mesh holes correspond to a plurality of the prefabricated three-in-one LED positions one by one;

[0080] Filling the mesh with epoxy resin mixture, and using a rubber scraper to roll the epoxy resin mixture into the mesh to cover the prefabricated three-in-one LED;

[0081] The prefabricated display device light board with the epoxy resin mixture is baked at a temperature of 80° C. for 5 minutes to obtain a display device light board.

[0082] In the description of the embodiments of the present invention, the scraper includes but is not limited to a rubber scraper.

[0083] The epoxy resin mixture described in the embodiment of the present invention includes epoxy resin and blue pigment, so that a second epoxy resin layer is formed after the final baking and molding. The second epoxy resin layer is blue, which is most effective in improving the problem of poor surface color consistency of the display device in the black screen state, and no pitting and screen flower phenomenon will occur.

[0084] The manufacturing method for preparing the display device light board described in this embodiment has simple steps and a simple process, and is convenient for large-scale production. The problems of insufficient LED light emitting angle and poor color consistency of the display device are solved through a simple process method.

[0085] Example 8

[0086] The display device of this embodiment includes the display device light board of embodiment 2. For example, the display device can be an LED display screen. The display device of this embodiment has a larger viewing angle and avoids the problem of inconsistent colors when the display device is black.

[0087] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A three-in-one LED, characterized in that: It includes a prefabricated three-in-one LED and a second epoxy resin layer. The prefabricated three-in-one LED includes an LED lamp cup, a red wafer, a blue wafer, a green wafer and a first epoxy resin layer. The LED lamp cup forms an LED lamp trough. The red wafer, the blue wafer and the green wafer are arranged in the LED lamp trough. The first epoxy resin layer fills the LED lamp trough and forms an outer surface with a concave curved surface. The second epoxy resin layer covers the LED lamp cup and the first epoxy resin layer.

2. The three-in-one LED according to claim 1, characterized in that: The outer surface of the second epoxy resin layer is a convex curved surface.

3. The three-in-one LED according to claim 1, characterized in that: The thickness of the second epoxy resin layer is 0.2-0.3 mm.

4. The three-in-one LED according to claim 1, characterized in that: The second epoxy resin layer includes epoxy resin and blue pigment.

5. A light board for a display device, comprising a substrate and a plurality of three-in-one LEDs according to any one of claims 1 to 4, wherein the plurality of three-in-one LEDs are fixed on the substrate.

6. A display device, comprising the display device light board according to claim 5.

7. The method for manufacturing the display device light board according to claim 5, characterized in that The following steps are involved: Fixing the substrate on a platform, fixing a plurality of the prefabricated three-in-one LEDs on the substrate in a certain order, to obtain a prefabricated display device light board; Prepare a steel mesh with a plurality of mesh holes, place the steel mesh on the prefabricated display device light board and align it with the prefabricated display device light board, and the plurality of mesh holes correspond to the plurality of prefabricated three-in-one LED positions one by one; Filling the mesh with epoxy resin mixture so that the epoxy resin mixture falls and covers the prefabricated three-in-one LED; The prefabricated display device light board with epoxy resin mixed liquid is baked to obtain the display device light board.

8. The method for manufacturing a display device light board according to claim 5, characterized in that The thickness of the steel mesh is 0.2-0.3 mm; the mesh area is 77-83% of the LED area.

9. The method for manufacturing a display device light board according to claim 5, characterized in that The epoxy resin mixed liquid comprises epoxy resin and blue pigment.

10. The method for manufacturing a light board of a display device according to claim 5, characterized in that The baking temperature is 80-100° C. and the baking time is 4-5 minutes.

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