Semiconductor device and electronic device

Abstract

The present invention makes it possible to obtain an attached state of a cover member so as to obtain good handling performance and prevent foreign matter from contaminating the inside of a package in a semiconductor device, and also makes it possible to easily remove the cover member so as to eliminate defects such as ghosting and flaws due to the presence of the cover member. The semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame holding the cover member on the substrate; and a cover holding unit that detachably holds the cover member to at least a portion of the frame.

Description

Technical Field

[0001] The present disclosure relates to semiconductor devices and electronic devices. Background Art

[0002] Examples of known semiconductor devices including semiconductor elements (semiconductor chips) such as imaging elements (such as CMOS image sensors) or light-emitting elements such as semiconductor lasers include semiconductor devices having a hollow package structure obtained by tightly covering an upper opening portion of a box-shaped package main body portion in which a semiconductor chip is mounted with a transparent glass cover as a cover member. For example, the protective glass is a member required to obtain good operability of the semiconductor device or prevent foreign matter from entering the package of the semiconductor device during a step of mounting a lens unit on the semiconductor device or the like.

[0003] Regarding the package structure as described above, for example, when the semiconductor device is incorporated into a predetermined arrangement structure forming an electronic device (such as a camera device), the cover glass is removed from the package body portion for reasons such as the cover glass may cause ghosting, glare, or an error in the optical path distance. That is, as one use mode of the semiconductor device, once the glass cover attached to the package body portion is removed, the semiconductor device is used for the glass cover.

[0004] However, in general, the cover glass is fixed to the opening of the package body with an adhesive to tightly cover the opening, making it difficult to remove the cover glass. Currently, the cover glass is removed by forcibly peeling off the bonding portion of the cover glass relative to the package body, or by relying on an expert to remove the cover glass.

[0005] Therefore, the following structure is disclosed in Patent Document 1: as a mounting and dismounting mechanism, a glass cover is detachably fixed to a housing forming a package body portion using an adhesive. Patent Document 1 discloses that the adhesive has such an adhesive strength as to prevent the glass cover from being separated during handling such as transportation or handling of the imaging device and to allow the glass cover to be separated without damaging the housing or the glass cover.

[0006] Reference List

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 11-355508 Summary of the invention

[0009] Problems to be solved by the present invention

[0010] Patent Document 1 includes a description of the adhesive strength of an adhesive for fixing a cover glass, but does not specifically disclose the material of the adhesive, the bonding method, etc. Therefore, after reflow mounting on a setting substrate, etc., it is difficult to obtain the adhesive strength of the adhesive as described above, and the technology disclosed in Patent Document 1 has poor feasibility.

[0011] In addition, according to the configuration of fixing the glass cover using an adhesive, the glass may be broken when the glass cover is removed according to the adhesive strength of the adhesive. In the case of glass breakage, for example, there is a possibility that defects such as imaging defects may occur due to scattered glass fragments attached to the pixels of the semiconductor chip.

[0012] The purpose of the present technology is to provide a semiconductor device and an electronic device that can obtain an attached state of a cover member so as to obtain good operability of the semiconductor device and prevent foreign matter from entering the interior of the package, and allow the cover member to be easily removed to solve problems such as ghosting and light spots caused by the presence of the cover member.

[0013] Solution to the problem

[0014] A semiconductor device according to the present technology includes: a substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and a cover holding portion detachably holding the cover member relative to at least a portion of the frame.

[0015] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame includes a frame main body portion, which surrounds the semiconductor element and forms a supporting surface for supporting the cover member, and the semiconductor device also includes a cover fixing portion as the cover holding portion, which is arranged on the upper side of the frame main body portion and fixes the cover member to the frame by limiting the movement of the cover member supported on the supporting surface relative to the frame main body portion.

[0016] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the cover member is a member having a flat plate shape, and the frame includes a step forming portion as the cover fixing portion, the step forming portion forming a step portion relative to the support surface, and the step forming portion contacts the side surface of the cover member to limit the movement of the cover member, and a retaining portion, the retaining portion contacts the side surface of the cover member and limits the movement of the cover member in a direction away from the support surface.

[0017] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame includes: a clip portion, which is configured to attach the cover member to the frame main body portion and remove the cover member from the frame main body portion by utilizing temporary elastic deformation; and a hook portion, which is arranged on the side opposite to the clip portion across the cover member, and the hook portion allows the edge portion of the cover member to be assembled between the hook portion and the supporting surface.

[0018] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame main body portion has a recessed portion which opens at the support surface and is partially covered by the cover member.

[0019] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame includes a first frame portion fixed to the substrate and a second frame portion forming the cover holding portion and detachably attached to the first frame portion.

[0020] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the second frame portion includes: a frame-shaped main body portion that holds the cover member; and a joining portion that is arranged in the main body portion and joins with the first frame portion so that the second frame portion is held by the first frame portion.

[0021] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the engaging portion is a rotating engaging body which is rotatably supported relative to the main body portion while being urged by an urging member in a direction to engage with the engaging portion formed in the first frame portion.

[0022] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the first frame portion has a recessed portion which is opened in an upper surface and is partially covered by the cover member.

[0023] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame includes a frame main body portion, which surrounds the semiconductor element and forms a supporting surface for supporting the cover member, and the semiconductor device further includes a step forming portion as the cover holding portion, the step forming portion is arranged on the upper side of the frame main body portion, forms a step portion relative to the supporting surface, and a bonding portion, which is interposed between the frame main body portion and the cover member and includes an adhesive for fixing the cover member to the frame main body portion.

[0024] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame main body portion has a recessed portion which opens at the support surface and is partially covered by the cover member.

[0025] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the adhesive includes a hot melt adhesive, and a recess for positioning the bonding portion is formed in at least one of the support surface and a lower surface of the cover member facing the support surface.

[0026] A semiconductor device according to the present technology includes: a substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and a frame holding portion holding the frame in a manner that allows attachment or detachment relative to the substrate.

[0027] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame includes a frame main body portion, which surrounds the semiconductor element and forms a supporting surface for supporting the cover member, and the cover member is fixed to the supporting surface, and the semiconductor device further includes a step forming portion as the frame retaining portion, the step forming portion is arranged on the lower side of the frame main body portion, a step portion is formed relative to the lower surface of the frame main body portion, and the step portion contacts the side surface of the substrate to limit the movement of the substrate, and a bonding portion, which is interposed between the frame main body portion and the substrate and includes an adhesive for fixing the frame main body portion to the substrate.

[0028] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the adhesive includes a hot melt adhesive, and a recess for positioning the bonding portion is formed in at least one of a lower surface of the frame body portion and an upper surface of the substrate facing the lower surface.

[0029] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the frame includes a frame main body portion, which surrounds the semiconductor element and forms a supporting surface for supporting the cover member, and the cover member is fixed to the supporting surface, and the semiconductor device also includes a joining portion as the frame holding portion, which is arranged on the lower side of the frame main body portion and fixes the frame to the substrate by joining with the substrate.

[0030] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the joining portion includes a retaining tab portion configured to be in a state of being retained to the joining portion formed in the substrate by temporary elastic deformation.

[0031] According to another aspect of the semiconductor device of the present technology, in the semiconductor device, the bonding portion and the substrate are configured so that relative rotation of the frame and the substrate with the vertical direction as the rotation axis direction causes the bonding portion to bond with a bonding portion formed in the substrate.

[0032] An electronic device according to the present technology includes a semiconductor device including: a substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and a cover holding portion detachably holding the cover member relative to at least a portion of the frame.

[0033] An electronic device according to the present technology includes a semiconductor device, which includes: a substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and a frame holding portion holding the frame in a manner that allows it to be loaded and unloaded relative to the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a plan view of the configuration of the solid-state imaging device according to the first embodiment of the present technology.

[0035] Figure 2 is along Figure 1 Cross-sectional end view taken along line AA in FIG.

[0036] Figure 3 is along Figure 1 A cross-sectional end view taken along line BB in FIG.

[0037] Figure 4 is along Figure 1 Cross-sectional end view taken along line CC in FIG.

[0038] Figure 5 yes Figure 2 Enlarged view of section D.

[0039] Figure 6 yes Figure 2 Enlarged view of part E.

[0040] Figure 7 : are diagrams for describing a method for manufacturing the solid-state imaging device according to the first embodiment of the present technology.

[0041] Figure 8 : are diagrams for describing a method for manufacturing the solid-state imaging device according to the first embodiment of the present technology.

[0042] Fig. 9 : are diagrams for describing a method for manufacturing the solid-state imaging device according to the first embodiment of the present technology.

[0043] Fig.10 It is an explanatory diagram of a method for removing a cover glass of a solid-state imaging device according to a first embodiment of the present technology.

[0044] Fig.11 is a side sectional view showing a use example of the solid-state imaging device according to the first embodiment of the present technology.

[0045] Fig.12 It is a plan view of the configuration of a modified example of the solid-state imaging device according to the first embodiment of the present technology.

[0046] Fig.13 It is along Fig.12 Cross-sectional end view taken along line FF in FIG.

[0047] Fig.14 : is a diagram for describing a method for manufacturing the configuration of the first modification example of the solid-state imaging device according to the first embodiment of the present technology.

[0048] Fig.15 It is a plan view of the configuration of a second modification example of the solid-state imaging device according to the first embodiment of the present technology.

[0049] Fig.16 It is along Fig.15 Cross-sectional end view taken along line GG in FIG.

[0050] Fig.17 It is a plan view of the configuration of a solid-state imaging device according to a second embodiment of the present technology.

[0051] Fig.18 It is along Fig.17 Cross-sectional end view taken along line HH in FIG.

[0052] Fig.19 It is along Fig.17 Cross-sectional end view taken along line II in FIG.

[0053] Fig. 20 is along Fig.17 Cross-sectional end view taken along line JJ in FIG.

[0054] Fig.21 : is a side end view showing a state in which the cover of the solid-state imaging device according to the second embodiment of the present technology is removed.

[0055] Fig. 22 2 is a diagram for describing a method for manufacturing the solid-state imaging device according to the second embodiment of the present technology.

[0056] Fig.23 : is an upper perspective view showing the configuration of a solid-state imaging device according to a third embodiment of the present technology.

[0057] Fig.24 It is along Fig.23 A cross-sectional view taken along line KK in FIG.

[0058] Fig.25 yes Fig.24 Enlarged view of section L in FIG.

[0059] Fig.26 is an exploded perspective view showing the configuration of a solid-state imaging device according to a third embodiment of the present technology.

[0060] Fig. 27 : is a lower perspective view showing a cover body according to a third embodiment of the present technology.

[0061] Fig.28 : is a diagram for describing a method for manufacturing a solid-state imaging device according to a third embodiment of the present technology.

[0062] Fig.29 : is an upper perspective view showing the configuration of a modification example of the solid-state imaging device according to the third embodiment of the present technology.

[0063] Fig.30 is along Fig.29 A cross-sectional view taken along line MM.

[0064] Fig.31 : is an upper perspective view showing the configuration of a modification example of the solid-state imaging device according to the third embodiment of the present technology.

[0065] Fig.32 It is a plan view of the configuration of a solid-state imaging device according to a fourth embodiment of the present technology.

[0066] Fig.33 yes Fig.32 NN line cross-sectional view.

[0067] Fig.34 is along Fig.32 A cross-sectional end view taken along line OO.

[0068] Fig.35 yes Fig.32 PP line cross-sectional view.

[0069] Fig.36 It is a diagram for describing a method of manufacturing a solid-state imaging device according to a fourth embodiment of the present technology.

[0070] Fig.37 It is an explanatory diagram of a method for removing the cover glass of the solid-state imaging device according to the fourth embodiment of the present technology.

[0071] Fig.38 is a side sectional view showing a use example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0072] Fig.39It is a side sectional view of the configuration of a first modified example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0073] Fig.40 A side sectional view of the configuration of a second modification example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0074] Fig.41 yes Fig.40 Magnified view of section Q in FIG.

[0075] Fig.42 : is a diagram for describing a method for manufacturing the configuration of the second modification example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0076] Fig.43 It is a partially enlarged side sectional view of the configuration of a third modified example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0077] Fig.44 It is a partially enlarged side cross-sectional view of the configuration of a fourth modification example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0078] Fig.45 It is a partially enlarged side sectional view of the configuration of a fifth modification example of the solid-state imaging device according to the fourth embodiment of the present technology.

[0079] Fig.46 is a side sectional view of the configuration of a solid-state imaging device according to a fifth embodiment of the present technology.

[0080] Fig.47 : are diagrams for describing a method for manufacturing the solid-state imaging device according to the fifth embodiment of the present technology.

[0081] Fig.48 It is a side sectional view of the configuration of a first modified example of the solid-state imaging device according to the fifth embodiment of the present technology.

[0082] Fig.49 yes Fig.48 Enlarged view of section R in FIG.

[0083] Fig.50 It is a partially enlarged side cross-sectional view of the configuration of a second modification example of the solid-state imaging device according to the fifth embodiment of the present technology.

[0084] Fig.51 It is a partially enlarged side cross-sectional view of the configuration of a third modified example of the solid-state imaging device according to the fifth embodiment of the present technology.

[0085] Fig.52It is a partially enlarged side cross-sectional view of the configuration of a fourth modification example of the solid-state imaging device according to the fifth embodiment of the present technology.

[0086] Fig.53 : is an upper perspective view showing the configuration of a solid-state imaging device according to a sixth embodiment of the present technology.

[0087] Fig.54 It is along Fig.53 Cross-sectional end view taken along line SS in FIG.

[0088] Fig.55 yes Fig.54 Magnified view of section T in FIG.

[0089] Fig.56 : is a plan view showing the configuration of the substrate side of the solid-state imaging device according to the sixth embodiment of the present technology.

[0090] Fig.57 is an exploded perspective view showing the configuration of a solid-state imaging device according to a sixth embodiment of the present technology.

[0091] Fig.58 : is a diagram for describing a method for manufacturing the solid-state imaging device according to the sixth embodiment of the present technology.

[0092] Fig.59 : is a diagram for describing a method for manufacturing the solid-state imaging device according to the sixth embodiment of the present technology.

[0093] Fig.60 : is a plan view showing the configuration of the substrate side of the first modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0094] Fig.61 : is a plan view showing the configuration of the substrate side of the second modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0095] Fig.62 It is a side sectional view of the configuration of a third modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0096] Fig.63 yes Fig.62 Magnified view of section U in FIG.

[0097] Fig.64 : is a plan view showing the configuration of the substrate side of the third modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0098] Fig.65 : is an exploded perspective view showing the configuration of a third modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0099] Fig.66 It is an explanatory diagram of a method of manufacturing a third modified example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0100] Fig.67 : is a plan view showing the configuration of the substrate side of the fourth modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0101] Fig.68 : is an exploded perspective view showing the configuration of a fourth modification example of the solid-state imaging device according to the sixth embodiment of the present technology.

[0102] Fig.69 is a partially cut-away cross-sectional plan view showing a configuration of a solid-state imaging device according to a seventh embodiment of the present technology.

[0103] Fig.70 It is along Fig.69 A cross-sectional view taken along line VV in FIG.

[0104] Fig.71 is an exploded perspective view showing the configuration of a solid-state imaging device according to a seventh embodiment of the present technology.

[0105] Fig.72 : are diagrams for describing a method for manufacturing the solid-state imaging device according to the seventh embodiment of the present technology.

[0106] Fig.73 : are diagrams for describing a method for manufacturing the solid-state imaging device according to the seventh embodiment of the present technology.

[0107] Fig.74 It is a partially cut-away cross-sectional plan view showing the configuration of a modification example of the solid-state imaging device according to the seventh embodiment of the present technology.

[0108] Fig.75 is an exploded perspective view showing the configuration of a modification example of the solid-state imaging device according to the seventh embodiment of the present technology.

[0109] Fig.76 : is a block diagram showing a configuration example of an electronic device including a solid-state imaging device according to an embodiment of the present technology. DETAILED DESCRIPTION

[0110] According to the present technology, by devising a configuration of a frame portion that holds a cover member such as a glass cover, the cover member can be easily removed as needed, and disadvantages can be avoided while having advantages due to the presence of the cover member.

[0111] Hereinafter, a mode for carrying out the present technology (hereinafter, referred to as an "embodiment") will be described with reference to the accompanying drawings. In addition, the drawings are schematic, and the dimensional ratios of the various parts and the like are not necessarily consistent with the actual dimensional ratios. In addition, the dimensional relationships and ratios are of course partially different between the drawings. In the embodiments described below, an imaging device (solid-state imaging device) including a solid-state imaging element as an example of a semiconductor element will be described as an example of a semiconductor device. Note that the embodiments will be described in the following order.

[0112] 1. Configuration Example of Solid-State Imaging Device According to First Embodiment

[0113] 2. Method for Manufacturing the Solid-State Imaging Device According to the First Embodiment

[0114] 3. Use Example of Solid-State Imaging Device According to First Embodiment

[0115] 4. Modification of the Solid-State Imaging Device According to the First Embodiment

[0116] 5. Configuration Example of Solid-State Imaging Device According to Second Embodiment

[0117] 6. Method for Manufacturing the Solid-State Imaging Device According to the Second Embodiment

[0118] 7. Configuration Example of Solid-State Imaging Device According to Third Embodiment

[0119] 8. Method for manufacturing the solid-state imaging device according to the third embodiment

[0120] 9. Modification of the Solid-State Imaging Device According to the Third Embodiment

[0121] 10. Configuration Example of Solid-State Imaging Device According to Fourth Embodiment

[0122] 11. Method for manufacturing the solid-state imaging device according to the fourth embodiment

[0123] 12. Use Example of Solid-State Imaging Device According to Fourth Embodiment

[0124] 13. Modification of the Solid-State Imaging Device According to the Fourth Embodiment

[0125] 14. Configuration Example of Solid-State Imaging Device According to Fifth Embodiment

[0126] 15. Method for manufacturing the solid-state imaging device according to the fifth embodiment

[0127] 16. Modification of the Solid-State Imaging Device According to the Fifth Embodiment

[0128] 17. Configuration Example of Solid-State Imaging Device According to Sixth Embodiment

[0129] 18. Method for manufacturing the solid-state imaging device according to the sixth embodiment

[0130] 19. Modification of the Solid-State Imaging Device According to the Sixth Embodiment

[0131] 20. Configuration Example of Solid-State Imaging Device According to Seventh Embodiment

[0132] 21. Method for manufacturing the solid-state imaging device according to the seventh embodiment

[0133] 22. Modification of the Solid-State Imaging Device According to the Seventh Embodiment

[0134] 23. Example of electronic device configuration

[0135] <1. Configuration Example of Solid-State Imaging Device According to First Embodiment>

[0136] Will refer to Figures 1 to 6 A configuration example of a solid-state imaging device according to a first embodiment of the present technology is described. Note that the up-down direction of the solid-state imaging device 1 refers to Figure 2 Up and down direction.

[0137] like Figure 1 and Figure 2 As shown, the solid-state imaging device 1 includes: a substrate 5; an image sensor 2 as a solid-state imaging element mounted on the substrate 5; a transparent glass cover 4 as a cover member covering the image sensor 2 from above; and a frame 6 forming a frame portion that supports the glass cover 4 relative to the substrate 5. In the solid-state imaging device 1, the package body 3 is formed by the substrate 5 and the frame 6, the image sensor 2 is mounted on the substrate 5, and the frame 6 is provided on the substrate 5. It should be noted that in Figure 1 In the figure, the portion visible through the glass cover 4 is indicated by a solid line.

[0138] The solid-state imaging device 1 has a hollow package structure obtained by covering the upper opening portion of a box-shaped package main body portion 3 in which an image sensor 2 as a semiconductor chip is mounted with a cover glass 4. That is, the solid-state imaging device 1 has a structure as a package structure in which the cover glass 4 is mounted on a substrate 5 with a frame 6 interposed therebetween, the substrate 5 having the image sensor 2 mounted thereon, and a cavity 8 as a hollow portion is formed around the image sensor 2.

[0139] The substrate 5 is an insertion substrate and is a flat member having a rectangular plate-like profile. The substrate 5 has a surface 5a as one plate surface on which the image sensor 2 is mounted, a rear surface 5b as another plate surface on the opposite side to the surface 5a, and side surfaces 5c provided on four sides. The image sensor 2 is chip-bonded to the surface 5a of the substrate 5. The image sensor 2 is bonded to the surface 5a of the substrate 5 using a chip bonding material 9 including an insulating or conductive adhesive or the like. Note that the plate thickness direction of the substrate 5 coincides with the up-and-down direction of the solid-state imaging device 1, and a side corresponding to the surface 5a and a side corresponding to the rear surface 5b coincide with the upper side and the lower side, respectively.

[0140] The substrate 5 is a ceramic substrate using ceramics such as aluminum oxide (Al2O3) or aluminum nitride (AlN) silicon nitride (Si3N4) as a base material, and is a circuit board on which a predetermined circuit pattern including a metal material is formed. Note that the substrate 5 may be, for example, another type of substrate such as an organic substrate (which is a type of fiber reinforced plastic) using an organic material such as glass epoxy as a base material, and a glass substrate using glass.

[0141] The image sensor 2 is a semiconductor element including a semiconductor substrate containing silicon (Si), which is an example of a semiconductor. The image sensor 2 is a rectangular plate-shaped chip, one side corresponding to the front surface 2a as one plate surface is a light receiving surface side, and the other plate surface on the opposite side is a rear surface 2b. The image sensor 2 has side surfaces 2c provided on four side surfaces.

[0142] A plurality of light receiving elements (photoelectric conversion elements) are formed on one side corresponding to the front surface 2a of the image sensor 2. The image sensor 2 is a complementary metal oxide semiconductor (CMOS) image sensor. It should be noted that the image sensor 2 may be another type of imaging element, for example, a charge coupled device (CCD) image sensor.

[0143] The image sensor 2 includes a pixel area 12, which is a light receiving area in which a plurality of pixels 11 are formed, and a peripheral area 13, which is an area around the pixel area 12, on a side corresponding to the front surface 2a. In the pixel area 12, a large number of pixels 11 are formed in a predetermined arrangement pattern such as a Bayer arrangement, and form a light receiving portion in the image sensor 2. A predetermined peripheral circuit is formed in the peripheral area 13. The pixels 11 each include a photodiode as a photoelectric converter having a photoelectric conversion function and a plurality of pixel transistors.

[0144] On the side corresponding to the front surface 2a of the image sensor 2, a color filter and an on-chip lens are formed on the semiconductor substrate so as to correspond to each pixel 11 via an anti-reflection film including an oxide film or the like, a planarization film including an organic material, etc. Light incident on the on-chip lens is received by the photodiode via the color filter, the planarization film, etc.

[0145] It should be noted that the configuration of the image sensor 2 according to the present technology is not particularly limited. Examples of the configuration of the image sensor 2 include a front side illumination type in which the pixel area 12 is formed on the front surface side of the semiconductor substrate, a rear side illumination type in which a photodiode or the like is arranged on the opposite side, and the rear surface side of the semiconductor substrate is used as a light receiving surface side to improve light transmittance, and the like.

[0146] The substrate 5 and the image sensor 2 are electrically connected through a plurality of wirings (bonding wirings) 10 as connecting members. The wires 10 are conductive wires and are thin metal wires including, for example, Au (gold), Cu (copper), Al (aluminum), etc. One end of each wire 10 is connected to an electrode 15 formed on the surface 5a of the substrate 5, and the other end is connected to an electrode formed in a peripheral area 13 of the front surface 2a of the image sensor 2, and these electrodes are electrically connected to each other.

[0147] The plurality of wires 10 are provided based on the number of electrodes 15 of the substrate 5, etc. Figure 1 In the example shown, the plurality of wires 10 are provided with respect to a pair of sides facing each other in the image sensor 2. However, the arrangement positions of the plurality of wires 10 are not particularly limited, and for example, the plurality of wires 10 may be provided with respect to four sides of the image sensor 2.

[0148] The electrodes 15 of the substrate 5 to which the leads 10 are connected are electrically connected to a plurality of terminal electrodes 16 formed on the back surface 5b side of the substrate 5 via a prescribed wiring portion formed on the substrate 5. For each of the terminal electrodes 16, for example, a connection terminal (such as a solder ball) is provided for electrically connecting to a terminal of a setting substrate, which is a circuit board on which the solid-state imaging device 1 is mounted in an electronic device on which the solid-state imaging device 1 is mounted.

[0149] The frame 6 forms a frame-shaped portion provided on the substrate 5 to surround the image sensor 2, and forms a peripheral wall portion on the substrate 5. The frame 6 includes wall portions 20 provided on four sides in a rectangular shape (including a square shape) corresponding to the rectangular shape of the substrate 5 in a plan view, and the wall portions 20 form a frame body portion 26 in a frame shape. Each wall portion 20 has a substantially rectangular outline with the up-down direction as the longitudinal direction in a side surface cross-sectional view (see FIG. 1 ). Figure 2 The wall portion 20 has an inner wall surface 21 which is a wall surface adjacent to the image sensor 2 and an outer wall surface 22 which is an outer wall surface on the opposite side to the inner wall surface 21 .

[0150] The frame 6 is arranged so that the outer wall surface 22 of each wall portion 20 is flush with the side surface 5c of the substrate 5. Note that the frame 6 may be arranged so that the outer wall surface 22 of each wall portion 20 is located inside or outside relative to the side surface 5c of the substrate 5.

[0151] The frame 6 has a glass support surface 23 on the upper side. The glass support surface 23 is a surface formed by the upper surface of each wall portion 20, and has a rectangular frame shape in a plan view. The glass support surface 23 is formed as a plane located on a predetermined virtual plane perpendicular to the up-down direction. In the frame 6, the glass support surface 23 is in contact with the peripheral edge portion of the lower surface 4b of the protective glass cover 4, and serves as a support surface for supporting the protective glass cover 4.

[0152] As described above, the frame 6 includes a frame-shaped portion formed by four wall portions 20 as the frame main body portion 26, which surrounds the image sensor 2 and forms the glass support surface 23 that supports the cover glass 4. In addition, the frame 6 also has a lower surface 24 that is a surface on the opposite side of the glass support surface 23 in the frame main body portion 26.

[0153] The frame 6 has a rectangular opening 25 on the upper side. The opening 25 is formed by inner wall surfaces 21 provided on four sides corresponding to the outer shape of the frame 6 when viewed from above. In the frame 6, the glass support surface 23 forms an opening end surface of the opening 25. The frame 6 thus forms the opening 25 of the package body 3.

[0154] The frame 6 is disposed on the surface 5a of the substrate 5 so that the lower surface 24 is located outside the electrode 15 to which the wiring 10 is connected without contacting the wire 10 and the electrode 15. The frame 6 is provided by fixing a frame-shaped member on the surface 5a of the substrate 5 using an adhesive such as an epoxy resin adhesive or an acrylic resin adhesive.

[0155] The frame 6 is a single component composed of, for example, a resin material such as epoxy resin, a metal material such as stainless steel, copper (Cu), ceramics, etc. As the material of the frame 6, a material that is easily elastically deformed to a certain extent is used. In addition, from the viewpoint of preventing reflection of light, for example, a low-reflection black resin material obtained by adding a black pigment such as carbon black or titanium black to a resin such as a liquid crystal polymer or polyetheretherketone (PEEK) is used, and the frame 6 is manufactured by a known method such as injection molding or transfer molding. Note that the frame 6 is not limited to, for example, a configuration including only one type of material, and may have a composite structure having a portion including a metal material and a portion including a resin material.

[0156] In addition, the frame 6 may be a portion formed into a predetermined shape by performing injection molding with respect to the substrate 5 using a mold such as a transfer mold. In this case, in the injection molding for forming the frame 6, for example, a frame portion including a portion of the frame 6 to be corresponding to each substrate element is formed into a lattice shape by injection molding with respect to an integrated collective substrate in which a plurality of substrate elements to be the substrate 5 are continuous. Then, the molded product in which the frame portion is formed on the collective substrate by injection molding is divided by cutting or the like, thereby obtaining a configuration having the frame 6 on the substrate 5, that is, the package body portion 3.

[0157] When the frame 6 is formed by injection molding using a mold, the material of the frame 6 is, for example, a thermosetting resin containing silicon oxide as a main component or containing a filler such as aluminum oxide. Specifically, as a resin material forming the frame 6, for example, a thermosetting resin (such as a phenolic resin, a silicone resin, an acrylic resin, an epoxy resin, or a polyurethane resin), a thermoplastic resin (such as polyamide-imide or polypropylene), a photosensitive resin (such as a UV curing resin, which is an acrylic resin), rubber, or other known resin materials are used alone or in combination. Even in this case, by using a black resin material containing a black pigment such as carbon black as the material of the frame 6, the frame 6 becomes a black portion, and the frame 6 can be used as a light shielding portion.

[0158] As described above, the package main body portion 3 includes: a substrate 5 forming a substrate portion on which the image sensor 2 is mounted; and a frame 6 provided on the upper side of the substrate 5 so as to surround the image sensor 2 and form a frame portion having an opening portion 25 formed on the upper side. As described above, in the package main body portion 3, the frame 6 as a component separate from the substrate 5 forming the substrate portion forms the frame portion. Note that the package main body portion 3 may include an integrated member such as a box-shaped package substrate having an opening side as above.

[0159] The cover glass 4 is an example of a transparent member, is provided on the substrate 5 via the frame 6, and is located above the image sensor 2. The cover glass 4 is a flat plate-like member having a rectangular plate-like outer shape and having an outer dimension larger than that of the image sensor 2. The cover glass 4 has an upper surface 4a as an upper plate surface, a lower surface 4b as a lower plate surface on the opposite side to the upper surface 4a and facing the image sensor 2, and side surfaces 4c provided on four sides.

[0160] The cover glass 4 closes the opening 25 while being supported on the glass support surface 23 of the frame 6. The cover glass 4 is provided on the frame 6 so as to be parallel to and spaced apart from the image sensor 2 on the light receiving surface side of the image sensor 2. The cover glass 4 has an outer dimension larger than the opening dimension of the opening 25, and is provided on the glass support surface 23 of the frame 6 so as to cover the entirety of the opening 25 from above.

[0161] The cover glass 4 transmits various types of light incident from the side surface corresponding to the upper surface 4a through an optical system such as a lens located above the cover glass 4. The light transmitted through the cover glass 4 reaches the light receiving surface of the image sensor 2 through the cavity 8. The cover glass 4 has a function of protecting the light receiving surface side of the image sensor 2. It should be noted that as a transparent member according to the present technology, for example, a plastic plate, a silicon plate, or the like may be used instead of the cover glass 4.

[0162] In the solid-state imaging device 1 having the above configuration, light transmitted through the cover glass 4 passes through the cavity 8 , and is received and detected by light receiving elements forming the pixels 11 arranged in the pixel region 12 of the image sensor 2 .

[0163] The solid-state imaging device 1 having the above-described configuration includes the following configuration of a fixing structure for fixing the cover glass 4 to the frame 6 forming the package main body portion 3. That is, the solid-state imaging device 1 includes a cover fixing portion 30 provided on the upper side of the frame main body portion 26 as a cover holding portion that detachably holds the cover glass 4 relative to the frame 6. The cover fixing portion 30 is a portion that fixes the cover glass 4 supported on the glass supporting surface 23 to the frame main body portion 26. The cover fixing portion 30 is provided as a part of the frame 6.

[0164] In the following, for the convenience of description, Figure 1 The left-right direction and the up-down direction in are respectively defined as an X direction (first direction) and a Y direction (second direction) which are orthogonal to each other in a plan view of the solid-state imaging device 1, and Figure 2 The left and right sides of correspond to the left and right sides of the solid-state imaging device 1 .

[0165] In the solid-state imaging device 1, the frame 6 includes a pair of step forming portions 31 arranged to face each other and retaining portions (32, 33) arranged to face each other as the cover fixing portion 30. The step forming portion 31 and the retaining portions (32, 33) are provided as sections of the wall portion 20 protruding upward from the glass supporting surface 23.

[0166] Each step forming portion 31 is a portion that forms a step portion 35 with respect to the glass supporting surface 23, and contacts the side surface 4c of the cover glass 4 to restrict the movement of the cover glass 4 with respect to the frame 6 (see Figure 3The step forming portion 31 is a wall-shaped portion formed along a pair of wall portions 20 that are opposed to each other with respect to the frame main body portion 26 formed into a frame shape by four wall portions 20 .

[0167] Each step forming portion 31 is provided on the wall portion 20 on the outer side (corresponding to the side of the outer wall surface 22) in the wall thickness direction of the wall portion 20, and forms a step portion 35 together with the glass support surface 23. The step forming portion 31 includes an inner side surface 36, which is an inner wall surface and serves as a contact surface with the side surface 4c of the glass cover 4, an outer side surface 37, and a horizontal upper surface 38. The step forming portion 31 is formed so that the outer side surface 37 is located on the same plane as the outer wall surface 22 of the wall portion 20.

[0168] The step forming portion 31 is provided on a pair of wall portions 20 that are opposed to each other in the Y direction over the entire range in the extending direction (X direction) of the wall portion 20. That is, each step forming portion 31 is provided so that the end faces 39 on both sides in the X direction are flush with the outer wall surface 22 of the adjacent wall portion 20 (see FIG. Figure 1 ). However, the step forming portion 31 may be provided on the corresponding wall portion 20 or at a plurality of positions along the extending direction of the wall portion 20 .

[0169] The step forming portion 31 has an upper surface 38 as a step surface, and the upper surface 38 is higher than the glass support surface 23. In the step portion 35, the inner surface 36 is located outside the inner wall surface 21 of the wall portion 20 and is formed as a surface parallel to the inner wall surface 21. Figure 3 In the example shown, the step forming portion 31 has a dimension of about 1 / 2 of the wall thickness of the wall portion 20 in the wall thickness direction of the wall portion 20. However, the dimension of the step forming portion 31 in the wall thickness direction is not particularly limited.

[0170] The pair of step forming portions 31 are provided so that the dimension between the inner side surfaces 36 opposing each other is substantially the same as or slightly larger than the dimension of the glass cover 4 in the Y direction. In a state where the glass cover 4 is fitted between the pair of step forming portions 31, the pair of step forming portions 31 restricts the movement of the glass cover 4 in the Y direction on the glass supporting surface 23 by contacting the side surface 4c of the glass cover 4 at the inner side surfaces 36. As described above, the pair of step forming portions 31 form the step portion 35 that prevents the shade glass cover 4 supported on the glass supporting surface 23 from being displaced in the lateral direction in the Y direction on both sides of the frame main body portion 26 in the Y direction.

[0171] exist Figure 3In the example shown, the dimension of the step forming portion 31 in the up-down direction is larger than the plate thickness dimension of the glass cover 4. However, the dimension of the step forming portion 31 in the up-down direction may be substantially the same as the plate thickness dimension of the glass cover 4, or may be smaller than the plate thickness dimension of the glass cover 4.

[0172] The retaining portions (32, 33) are portions that come into contact with the side surface 4c of the cover glass 4 and restrict movement in a direction away from the glass support surface 23. The frame 6 includes a clip portion 32 as a first retaining portion and a hook portion 33 as a second retaining portion as retaining portions for fixing the cover glass 4 to the frame 6 together with a pair of step forming portions 31.

[0173] The clip portion 32 and the hook portion 33 are partially formed in the extension direction (Y direction) of the wall portion 20. In addition, the clip portion 32 and the hook portion 33 are formed in a common position range in the Y direction. However, in each wall portion 20, the clip portion 32 and the hook portion 33 may be provided over the entire range in the extension direction of the wall portion 20, or may be formed in position ranges different from each other in the Y direction.

[0174] The clip portion 32 and the hook portion 33 are provided in the frame body portion 26 at a pair of wall portions 20 facing each other, and are provided to face each other. In the example shown, the clip portion 32 is provided at the left wall portion 20, and the hook portion 33 is provided at the right wall portion 20.

[0175] Two sets of clip portions 32 and hook portions 33 facing each other are provided. That is, the locking portions 32 are provided at two positions of the left wall portion 20 at a predetermined interval in the Y direction, and the hook portion 33 is provided at a position of the right wall portion 20 facing the locking portions 32. In the frame body portion 26, the two sets of clip portions 32 and hook portions 33 are provided symmetrically with respect to the Y direction.

[0176] The clip portion 32 is provided on the outer side (corresponding to the outer wall surface 22 ) of the wall portion 20 in the wall thickness direction. The clip portion 32 has a support 41 formed upright on the glass support surface 23 and a locking protrusion 42 protruding inward in the X direction relative to the support 41 .

[0177] like Figure 5 As shown, the support column 41 is a wall-shaped portion with the X direction as the wall thickness direction, and includes an inner side surface 43, an outer side surface 44, and a horizontal upper surface 45. The inner side surface 43 is an inner wall surface and serves as a contact surface with the side surface 4c of the glass cover 4, and the outer side surface 44 is a wall surface opposite to the inner side surface 43. The clip portion 32 is formed so that the outer side surface 44 is located on the same plane as the outer wall surface 22 of the wall portion 20. Moreover, the clip portion 32 has side end surfaces 46 on both sides in the Y direction, and is formed to have a constant cross-sectional shape in the entire Y direction (see Figure 1 ).

[0178] In the clip portion 32, the inner side surface 43 is located outside the inner wall surface 21 of the wall portion 20 and is formed as a surface parallel to the inner wall surface 21. Figure 2 In the example shown in FIG. 1 , the thickness dimension (dimension in the X direction) of the support column 41 is about 1 / 3 of the wall thickness of the wall portion 20. However, the thickness dimension of the support column 41 is not particularly limited. In addition, the support column 41 is formed so that the dimension of the inner side surface 43 in the up-down direction is substantially the same as or slightly larger than the plate thickness of the glass cover 4.

[0179] The pressing protrusion 42 is formed at the upper portion of the support column 41. The pressing protrusion 42 includes an upper inclined surface 47 which is inclined downward from the outer side to the inner side in the wall thickness direction of the wall portion 20; and a lower inclined surface 48 which is inclined from the outer side to the inner side in the wall thickness direction of the wall portion 20 in the direction from the lower side to the upper side (see FIG. Figure 5 ).

[0180] The pressing protrusion 42 has a peak shape formed by an upper slope 47 and a lower slope 48 on the inner side of the peak side in a side view. The upper slope surface 47 and the lower slope surface 48 form a ridge 49 in the Y direction as an end portion on the protruding side of the pressing protrusion 42. Figure 2 In the example shown in , the upper inclined surface 47 and the lower inclined surface 48 are formed to be vertically symmetrical in a side view, and are formed to form an angle of about 90° in a side view. Note that there is no limitation on the angle formed by the upper inclined surface 47 and the lower inclined surface 48 in a side view.

[0181] The hook portion 33 is provided on the opposite side of the glass cover 4 from the clip portion 32 in the X direction. The hook portion 33 is provided on the wall portion 20 on the outer side (the side corresponding to the outer wall surface 22) in the wall thickness direction of the wall portion 20. The hook portion 33 includes: a support column 51 formed on the glass support surface 23 in an upright state; and a pressing protrusion 52 protruding inwardly in the X direction relative to the support column 51.

[0182] like Figure 6 As shown, the support column 51 is a wall-shaped portion with the X direction as a wall thickness direction, and includes an inner side surface 53, an outer side surface 54, and a horizontal upper surface 55, the inner side surface 53 being an inner wall surface and serving as a contact surface with the side surface 4c of the glass cover 4, and the outer side surface 54 being a wall surface opposite to the inner side surface 53. The hook portion 33 is formed so that the outer side surface 54 is located on the same plane as the outer wall surface 22 of the wall portion 20. In addition, the hook portion 33 has side end surfaces 56 on both sides in the Y direction, and is formed to have a constant cross-sectional shape throughout the Y direction.

[0183] In the hook portion 33, the inner side surface 53 is located outside the inner wall surface 21 of the wall portion 20 and is formed as a surface parallel to the inner wall surface 21. Figure 2 In the example shown in FIG. 1 , the thickness dimension (dimension in the X direction) of the support column 51 is about 1 / 2 of the wall thickness of the wall portion 20. However, the thickness dimension of the support column 51 is not particularly limited. In addition, the support column 51 is formed so that the dimension of the inner side surface 53 in the up-down direction is slightly larger than the plate thickness dimension of the glass cover 4.

[0184] The pressing protrusion 52 is formed at the upper portion of the support column 51. The stopper protrusion 52 includes: an upper inclined surface 57, which is inclined downward from the outside to the inside in the wall thickness direction of the wall portion 20; and a horizontal stopper surface 58, which is located above the glass support surface 23 and faces the glass support surface 23 (see FIG. Figure 6 ).

[0185] The anti-detachment protrusion 52 has a peak shape with the inner side of the peak formed by the upper inclined surface 57 and the anti-detachment surface 58 when viewed from the side. The upper inclined surface 57 and the retaining surface 58 form a ridge 59 as an end on the protruding side of the retaining protrusion 52 in the Y direction. Figure 2 In the example shown in , the upper inclined surface 57 and the holding surface 58 are formed to form an angle of about 60° in a side view. Note that there is no limitation on the angle formed by the upper inclined surface 57 and the holding surface 58 in a side view.

[0186] The clip portion 32 and the hook portion 33 are arranged so that the dimension between the inner side surfaces 43 and 53 opposing each other is substantially the same as or slightly larger than the dimension of the glass cover 4 in the X direction. In a state where the cover glass 4 is fitted between the clip portion 32 and the hook portion 33, the clip portion 32 and the hook portion 33 restrict movement of the cover glass 4 in the X direction on the glass supporting surface 23 by contacting the side surface 4 c of the cover glass 4 at the inner side surfaces 43 and 53.

[0187] Furthermore, the clip portion 32 and the hook portion 33 restrict the upward movement of the cover glass 4 relative to the glass support surface 23 by positioning the cover glass 4 on the glass support surface 23 below the holding protrusions 42 and 52. That is, the clip portion 32 and the hook portion 33 hold the cover glass 4 relative to the wall portion 20 and restrict the movement of the cover glass 4 in the direction away from the glass support surface 23, and the holding protrusions 42 and 52 serve as contact portions relative to the upper surface 4a of the cover glass 4.

[0188] Specifically, the clip portion 32 holds the cover glass 4 relative to the wall portion 20, and the lower inclined surface 48 of the holding protrusion 42 serves as a contact surface with the upper corner portion of the cover glass 4. The hook portion 33 holds the cover glass 4 relative to the wall portion 20, and the holding surface 58 of the holding protrusion 52 serves as a contact surface with the upper surface 4a of the cover glass 4.

[0189] The hook portion 33 allows the right edge portion of the cover glass 4 to be fitted between the hook portion 33 and the glass support surface 23. Figure 6 As shown, the inner side surface 53 and the holding surface 58 of the hook portion 33 form a recess 50 together with the glass support surface 23. The recess 50 has an open side on the inner side in the wall thickness direction of the wall portion 20. The hook portion 33 holds the cover glass 4, and the right edge portion of the cover glass 4 is fitted in the recess 50.

[0190] like Figure 6 As shown, in a state where the glass cover 4 is supported on the glass support surface 23, there is a gap 50a between the upper surface 4a of the glass cover 4 and the holding surface 58 of the hook portion 33. Figure 6 , the size of the gap 50a is represented by dimension A1.

[0191] The clip portion 32 allows the cover glass 4 to be attached to and detached from the frame main body portion 26 by temporary elastic deformation. Specifically, as the temporary elastic deformation, the clip portion 32 is deformed to be warped outward in the wall thickness direction of the wall portion 20, thereby widening the space between the clip portion 32 and the hook portion 33 for attaching the cover glass 4 to the frame 6 from above (see Fig. 9 B). In addition, the clip portion 32 also performs similar elastic deformation when the cover glass 4 is removed from the frame 6. Therefore, the clip portion 32 is formed as a portion having flexibility that allows the clip portion 32 to be bent appropriately when the cover glass 4 is attached or detached.

[0192] like Figure 5 As shown, in the clip portion 32, the dimension B1 in the thickness direction of the support column 41 is set so as to perform the above-mentioned temporary elastic deformation. In the present embodiment, the thickness dimension B1 of the support column 41 of the clip portion 32 is smaller than the thickness dimension B2 of the support column 51 of the hook portion 33. Although it is only an example, in Figure 2 In the example shown, the thickness dimension B2 of the support column 51 is approximately 1.5 times the thickness dimension B1 of the support column 41 .

[0193] In addition, if Figure 1 and Figure 4 As shown in FIG. 1 , the frame body portion 26 has a recess 60 which opens at the glass support surface 23 and is at least partially covered with the glass cover 4. The recess 60 is formed in the left wall portion 20 on which the clip portion 32 is provided, and the clip portion 32 is located in the four wall portions 20 forming the frame body portion 26. The recess 60 is formed in the central portion of the left wall portion 20 and in the portion between the two clip portions 32 in the extending direction (Y direction) of the wall portion 20.

[0194] The recess 60 is formed in the middle portion of the wall portion 20 in the wall thickness direction (X direction). That is, at the formation position of the recess 60, a wall-like edge wall portion 66 forming a part of the glass support surface 23 is formed on the inner and outer sides in the X direction. The recess 60 is a recess having a rectangular opening shape in which the extending direction of the wall portion 20 in a plan view is the longitudinal direction, and includes four side surfaces 61 having a vertical surface shape and a bottom surface 62 having a horizontal surface shape.

[0195] The recessed portion 60 includes an exposed portion 60a exposed to the outer portion of the glass cover 4 in a plan view and a covered portion 60b covered with the glass cover 4 as a region portion relative to the glass cover 4 supported on the glass support surface 23. That is, the exposed portion 60a is the outer side ( Figure 1 The cover portion 60b is a portion of the recess 60 on the left side of the cover glass 4, and the cover portion 60b is an inner side of the left side surface 4c ( Figure 1 In the covered portion 60b of the recess 60, the lower surface 4b of the glass cover 4 faces the bottom surface 62. Figure 1 In the example shown, most of the inner portion of the recess 60 is the cover portion 60 b.

[0196] The recess 60 is used to allow a tool for removing the cover glass 4 from the frame 6 to act on the cover glass 4. In order to remove the cover glass 4, for example, a tool such as a precision flat-head screwdriver (a flat-head screwdriver of a precision screwdriver) is used. Therefore, the recess 60 has a size that ensures a space in which a tool such as a precision flat-head screwdriver can be inserted into the exposed portion 60a with a certain margin. Note that the shape and size of the recess 60, the formation position on the glass support surface 23, etc. are not particularly limited as long as the recess has an exposed portion 60a and a covered portion 60b relative to the cover glass 4 and has a space that allows a tool for removing the cover glass 4 to be inserted into the exposed portion 60a.

[0197] <2. Method for Manufacturing Solid-State Imaging Device According to First Embodiment>

[0198] Reference Figures 7 to 9 An example of a method for manufacturing the solid-state imaging device 1 according to the first embodiment of the present technology is described.

[0199] First, if Figure 7 As shown in A of FIG. 1 , a silicon wafer 70 having a pixel region 12 corresponding to each image sensor 2 formed on the front surface side is prepared. The silicon wafer 70 has undergone various processes for forming the image sensor 2. That is, the silicon wafer 70 is a semiconductor wafer in which a plurality of portions become the image sensor 2, each portion having a pixel group formed on one plate surface side in a predetermined arrangement.

[0200] like Figure 7 As shown in FIG. 1A , for the silicon wafer 70, a back grinding (BG) step of grinding the silicon wafer 70 from the side surface corresponding to the back surface 70b is performed to set the silicon wafer 70 to a desired thickness that does not affect the device characteristics. In the BG process, for example, a back grinding wheel 71 such as a diamond wheel is used to grind the silicon wafer 70.

[0201] Then, if Figure 7 As shown in FIG. 1B , the silicon wafer 70 is cut along the prescribed cutting line. That is, a step of cutting the silicon wafer 70 into chips each corresponding to the image sensor 2 according to a predetermined arrangement is performed. In the cutting process, the silicon wafer 70 set on the chuck stage 72 is cut into individual chips respectively corresponding to the image sensor 2 by a cutting blade 73. As a result, the image sensors 2 as a large number of sensor chips are obtained.

[0202] On the other hand, Figure 8 As shown in A of FIG. 5 , a step of manufacturing the package main body 3 is performed. In this process, frame installation is performed in which a frame 6 is set on the substrate 5. In the frame installation process, the frame 6 including the step forming portion 31, the clip portion 32, the hook portion 33 and the recessed portion 60 is prepared in advance, for example, by injection molding using a resin material such as epoxy resin. The frame 6 is fixed to a predetermined portion of the surface 5a of the substrate 5 by an adhesive such as an epoxy resin adhesive. Thus, the package main body 3 having the structure in which the frame 6 is placed on the substrate 5 is obtained.

[0203] Next, if Figure 8 As shown in FIG. 1B, a step of setting the image sensor 2 obtained as a result of the dicing process on the substrate 5 is performed. That is, a die bonding for bonding the image sensor 2 to the substrate 5 is performed. At this time, the image sensor 2 is bonded and fixed to a predetermined mounting portion of the surface 5a of the substrate 5 by an adhesive such as an insulating or conductive resin paste, that is, a die bonding material 9.

[0204] Next, if Figure 8 As shown in FIG. C, a step of providing wires 10 for electrically connecting substrate 5 and image sensor 2 is performed. Here, wire bonding for electrically connecting electrodes 15 of substrate 5 and electrodes formed on front surface 2a of image sensor 2 using wires 10 is performed.

[0205] Through the above-described processing, an image sensor unit 1A as a solid-state imaging device having a configuration in which the image sensor 2 is mounted on the package body portion 3 is obtained. A step of attaching the cover glass 4 to the image sensor unit 1A is performed. Note that the cover glass 4 is prepared by cutting a glass plate having a predetermined shape into a rectangular shape.

[0206] Fig. 93 is an explanatory diagram of the step of attaching the cover glass 4. When the protective glass cover 4 is mounted, first, the protective glass cover 4 is placed in the following mounting setting state relative to the clip portion 32 and the hook portion 33. That is, Fig. 9 As shown in A, the cover glass 4 is placed on one side in the X direction ( Fig. 9 The edge portion of the right side in A) is fitted into the recess 50 formed by the hook portion 33, and the other side in the X direction ( Fig. 9 The edge portion of the cover glass 4 (on the left side in A) contacts the clip portion 32. In this state, the lower corner of the cover glass 4 relative to the clip portion 32 contacts the upper inclined surface 47.

[0207] from Fig. 9 The attached setting state of the glass cover 4 shown in A is as follows Fig. 9 As shown in FIG. 1B , a force is applied to press the cover glass 4 toward the side (lower side) corresponding to the frame 6 (see arrow C1). Here, pressure is applied to the cover glass 4 so as to act mainly on, for example, a portion of the cover glass 4 on the side in contact with the clip portion 32. The clip portion 32 receiving the downward force from the cover glass 4 elastically deforms, thereby widening the distance to the hook portion 33 while allowing the corner portion of the cover glass 4 pushed downward to slide on the upper inclined surface 47 (see arrow C2). That is, the clip portion 32 bends in such a manner that the support column 41 bends toward the outside.

[0208] Then, when the cover glass 4 reaches a position exceeding the pressing protrusion 42 relative to the clip portion 32 while moving downward on the side in contact with the clip portion 32, that is, when A of the upper surface 4 is positioned below the ridge 49 of the clip portion 32, the clip portion 32 returns from the elastically deformed state. Fig. 9 As shown in C, the clip portion 32 returns to the original natural state (see arrow C3), and the protective glass 4 is supported on the glass support surface 23. That is, the glass cover 4 is supported on the glass support surface 23, and is installed between the pair of step forming portions 31, the clip portion 32 and the hook portion 33, and is held and fixed to the frame body portion 26 by these glass cover fixing portions.

[0209] By attaching the cover glass 4 as described above, the solid-state imaging device 1 is obtained. In the solid-state imaging device 1, an adhesive is not used to fix the cover glass 4, and the cover glass 4 is temporarily fixed to the frame 6. Note that in the example of the above-mentioned manufacturing method, after the frame mounting process is performed on the substrate 5, the chip bonding and the wire bonding are performed on the substrate 5, but the order of these processes may be reversed. That is, the steps of chip bonding and wire bonding may be performed first, and then the step of mounting the frame on the substrate 5 may be performed.

[0210] <3. Use Example of Solid-State Imaging Device According to First Embodiment>

[0211] As a use example of the solid-state imaging device 1 according to the first embodiment of the present technology, reference will be made to Fig.10 Describe how to remove the glass cover 4.

[0212] In a state where the cover glass 4 is attached to the package main body portion 3, the solid-state imaging device 1 receives inspection for imaging by the image sensor 2, is transported as a product, or is mounted on a set substrate. In addition, the cover glass 4 is used as a member for obtaining good handleability of the solid-state imaging device 1 during a step of mounting a lens unit on the solid-state imaging device 1, etc., or for preventing foreign matter from entering the inner part of the package of the solid-state imaging device 1.

[0213] On the other hand, for example, when the solid-state imaging device 1 is incorporated into a predetermined arrangement structure forming an electronic device such as a camera device, the cover glass 4 is removed from the package body portion 3. That is, as one use mode of the solid-state imaging device 1, the solid-state imaging device 1 is used together with the cover glass 4 which is removed once attached to the package body portion 3.

[0214] For example, Fig.10 As shown in FIG. 1A, the glass cover 4 is removed from the solid-state imaging device 1 mounted on the setting substrate 18 by reflow soldering, and the setting substrate 18 is a circuit board having a predetermined circuit structure. The solid-state imaging device 1 is electrically connected to the setting substrate 18 by connecting the terminal electrode 16 to the electrode portion provided on the front surface side of the setting substrate 18 by the solder ball 19.

[0215] like Fig.10 As shown in A, a tool 75 such as a precision flat-head screwdriver is used to remove the glass cover 4. The tool 75 has a shaft portion 75a as a main body and a grip portion 75b. The front end portion of the shaft portion 75a is inserted into the recess 60, and the tool 75 is used to remove the cover glass 4 using the lever principle. The details are as follows.

[0216] like Fig.10 As shown in FIG. 1A, first, the top end portion of the shaft portion 75a of the tool 75 passes through the exposed portion 60a (see FIG. Figure 1 ) is inserted into the recess 60 of the frame 6. Here, the tool 75 is inserted obliquely from the outside to the inside relative to the recess 60 along the X direction.

[0217] like Fig.10 As shown in B, by operating tool 75 to Fig.10In the state shown in A, the tool 75 acts to lift the cover glass 4 by pushing down the side corresponding to the gripping portion 75b (see arrow D1), and its tip portion contacts the lower surface 4b of the cover glass 4 (see arrow D2). That is, by pushing down the side corresponding to the gripping portion 75b of the tool 75, the front end side of the tool 75 is raised by the lever principle with the contact portion of the shaft portion 75a and the edge wall portion 66 of the outer side of the recess 60 as a fulcrum, and the cover glass 4 receives the force pushed from the lower side. The cover glass 4 lifted by the tool 75 presses the holding protrusion 42 of the clip portion 32 from below.

[0218] The clip portion 32 receiving the upward force from the glass cover 4 elastically deforms to widen the distance to the hook portion 33 while allowing the corner portion of the glass cover 4 pushed upward to slide on the lower inclined surface 48 (see arrow D3). That is, the clip portion 32 bends in such a way that the support column 41 bends outward.

[0219] Then, when the cover glass 4 reaches a position exceeding the pressing protrusion 42 relative to the clip portion 32 while moving upward on the side in contact with the clip portion 32, that is, when the lower surface 4b is positioned above the ridge 49 of the clip portion 32, the clip portion 32 returns from the elastically deformed state. Fig.10 As shown in FIG. 3C , the clip portion 32 returns to the original natural state (see arrow D4), and the engagement of the cover glass 4 with the clip portion 32 is released. From this state, the fitting portion of the cover glass 4 is pulled out relative to the recess 50 of the hook portion 33, whereby the cover glass 4 is removed from the frame 6.

[0220] As described above, the image sensor unit 1A (see Figure 8 C) A configuration in which the device is mounted on a setting substrate 18.

[0221] According to the solid-state imaging device 1 according to the present embodiment as described above, the attached state of the glass cover 4 can be obtained to obtain good handleability of the solid-state imaging device 1 and prevent foreign matter from entering the inner part of the package, and the glass cover 4 can be easily removed to solve problems such as ghosting and light spots caused by the presence of the glass cover 4.

[0222] That is, according to the configuration including the cover holding portion that detachably holds the cover glass 4 relative to the frame 6, the cover glass 4 can be easily removed, for example, when the lens housing is installed in the solid-state imaging device 1 by the setting manufacturer without relying on a specialist. Therefore, it is possible to prevent the occurrence of defects such as flare due to the glass cover 4 and ensure the function of the image sensor 2. In addition, when the solid-state imaging device 1 is mounted on the setting substrate 18, by attaching the cover glass 4, good operability can be obtained and foreign matter can be prevented from entering the inner part of the package. As described above, with the solid-state imaging device 1, an image sensor package in which the cover glass 4 is easily attached and detached can be realized.

[0223] The solid-state imaging device 1 includes the cover fixing portion 30 as a cover holding portion that fixes the glass cover 4 to the frame 6 by restricting the movement of the glass cover 4 supported on the glass supporting surface 23 relative to the frame main body portion 26. According to this configuration, the glass cover 4 can be fixed without applying an adhesive to the glass supporting surface 23 for placing and supporting the glass cover 4. As a result, it is not necessary to forcibly peel off the joint portion, and the glass cover 4 can be easily removed.

[0224] In addition, for example, since the adhesive does not remain on the glass support surface 23, after the image sensor unit 1A is incorporated into the device, the adhesive can be prevented from adhering as dust to the image sensor 2 in the inner portion of the package. This prevents the imaging surface of the image sensor 2 from being contaminated, so that the performance of the image sensor 2 can be ensured. In addition, since the adhesive is not used to fix the cover glass 4, the image sensor 2 can be prevented from being contaminated by outgassing generated by the organic material contained in the adhesive, and the performance of the image sensor 2 can be ensured.

[0225] Furthermore, since the cover glass 4 separated from the frame 6 does not contain adhesive or the like adhering thereto, the cover glass 4 can be properly cleaned and reused. This makes it possible to reduce material costs.

[0226] Furthermore, since no adhesive is applied to the glass support surface 23, there is no residue of the adhesive on the glass support surface 23 in the state where the cover glass 4 is removed, and the glass support surface 23 can be kept in a clean state. Therefore, in the image sensor unit 1A in the state where the cover glass 4 is removed, the glass support surface 23 can be used as, for example, a bonding surface to be bonded to a housing or the like of a setting structure, a guide plane used in tilt adjustment (adjustment of the tilt of the imaging surface) when the image sensor unit 1A is attached to the setting structure, or a bonding surface of a new part to be bonded to the package main body portion 3.

[0227] For example, Fig.11 As shown, the glass support surface 23 in the image sensor device 1A serves as a support surface for a lens housing 76 mounted on the image sensor device 1A. The lens housing 76 has a support cylinder 77 formed in a cylindrical shape, and supports one or more lenses 78 in the support cylinder 77. The lens housing 76 is arranged so that the lens 78 is positioned above the image sensor 2 in the orientation of the optical axis in the up-down direction relative to the frame 6. According to the configuration in which the lens housing 76 is mounted in the image sensor unit 1A, light condensed by the lens 78 is incident on the light receiving surface of the image sensor 2.

[0228] The lens housing 76 is provided in a state where the support cylinder 77 is fixed to the frame 6 through the pair of step forming portions 31, the clip portion 32 and the hook portion 33. The lens housing 76 has a flange portion 79 at the lower end portion of the support cylinder 77 so as to receive the engagement action of the pair of step forming portions 31, the clip portion 32 and the hook portion 33. The flange portion 79 is formed so that the shape, size and thickness (dimension in the vertical direction) of the outer shape when viewed from above are substantially the same as those of the glass cover 4.

[0229] The lens housing 76 is fixed to the frame 6 by engaging the flange portion 79 of the support cylinder 77 with the pair of step forming portions 31, the clip portion 32, and the hook portion 33 in the same manner as the cover glass 4. That is, as described above, by engaging one side ( Fig.11 The lens housing 76 is attached to the frame 6 by embedding the edge portion (on the right side in the figure) in the recess 50 of the hook portion 33 and holding the edge portion on the other side of the flange portion 79 in the X direction to the clip portion 32. In the state where the lens housing 76 is mounted on the frame 6, the lens housing 76 is supported on the frame body portion 26 in such a manner that the lower surface of the flange portion 79, i.e., the bottom surface 77a, and the lower opening end surface of the support cylinder 77 serve as contact surfaces with the glass support surface 23.

[0230] As described above, when the lens housing 76 is mounted on the image sensor unit 1A with the cover glass 4 removed, the glass support surface 23 is used as a support surface for the lens housing 76, and the step forming portion 31, the clip portion 32 and the hook portion 33 provided in the frame 6 can be used to fix the lens housing 76 to the frame 6.

[0231] According to this configuration, for example, compared with the case where the lens housing 76 is mounted on the setting substrate 18 to which the image sensor unit 1A is soldered by the solder balls 19, the lens housing 76 can be mounted on the glass support surface 23 on the package side, wherein the accuracy of adjustment with respect to the optical axis of the image sensor 2 can be obtained relatively easily. Therefore, the glass support surface 23 can be used as a reference surface, and the lens housing 76 can be accurately set relative to the image sensor 2 without being affected by the tilt due to the solder connection with the setting substrate 18. Note that the lens housing 76 can be mounted relative to the setting substrate 18.

[0232] Furthermore, the frame 6 includes a pair of step forming portions 31 and retaining portions (32, 33) arranged to face each other as a cover fixing portion. According to this configuration, the cover glass 4 can be easily detachably fixed to the frame 6 and held by the frame 6 by a simple configuration. By providing a pair of step forming portions 31 in addition to the retaining portions (32, 33), the cover glass 4 held by the retaining portions (32, 33) can be prevented from being displaced laterally in the Y direction relative to the frame main body portion 26 by the pair of step forming portions 31, and the cover glass 4 can be effectively fixed.

[0233] The frame 6 includes the clip portion 32 and the hook portion 33 as the retaining portion. According to this configuration, the cover glass 4 can be easily attached to and detached from the frame 6 by utilizing the elastic deformation of the clip portion 32. Specifically, according to the holding structure in which the retaining portion acting on one side of the cover glass 4 is the clip portion 32 and the retaining portion acting on the opposite side is the hook portion 33, the force acting on the cover glass 4 when attaching and detaching the cover glass 4 can be suppressed, allowing the cover glass 4 to be efficiently attached and detached.

[0234] Furthermore, the frame 6 has an opening portion of the recess 60 at the glass support surface 23. According to this configuration, when the cover glass 4 is removed using the tool 75, the tool 75 can easily act on the cover glass 4, and the cover glass 4 can be easily removed. In the tool 75, by covering the contact portion with the cover glass 4 with a resin or the like, dust or particles generated due to the contact between the tool 75 and the cover glass 4 can be suppressed. Note that as the tool 75, a dedicated tool for removing the cover glass 4 can be used.

[0235] Furthermore, according to the fixing structure of the cover glass 4 of the present embodiment, since the cover glass 4 does not hermetically seal the opening portion 25 of the frame 6, it is possible to suppress an increase in stress accompanying an increase in the internal partial pressure of the cavity 8 of the package during reflow or the like when the solid-state imaging device 1 is mounted on the setting substrate. Therefore, deformation such as warping of the package due to reflow mounting, cracking of the cover glass 4, disconnection of the lead 10, and the like can be suppressed.

[0236] <4. Modification of Solid-State Imaging Device According to First Embodiment>

[0237] A modification example of the solid-state imaging device 1 according to the first embodiment of the present technology will be described.

[0238] (First Modification)

[0239] like Fig.12 and Fig.13 As shown, the solid-state imaging device 1 of the first modified example includes a clip portion 32 instead of the two hook portions 33 provided on the right wall portion 20 of the frame main body portion 26 and the recessed portion 60 between these clip portions 32. That is, the solid-state imaging device 1 of the first modified example includes the clip portion 32 and the recessed portion 60 on each of the two sides facing each other in the X direction in the frame main body portion 26.

[0240] Will refer to Fig.14 The steps of attaching the cover glass 4 in the method for manufacturing the solid-state imaging device 1 according to the first modification are described. In the attachment of the cover glass 4, first, the cover glass 4 is placed in the following attachment setting state with respect to the clip portions 32 on both the left and right sides. That is, as shown in FIG. Fig.14As shown in FIG. 1A , the cover glass 4 enters a state in which the edge portions on both sides in the X direction are in contact with the clip portion 32. In this state, the lower corners of the left and right edge portions of the cover glass 4 are in contact with the upper inclined surface 47 of the clip portion 32.

[0241] from Fig.14 The attached setting state of the glass cover 4 shown in A is as follows. Fig.14 As shown in FIG. 1B , a force (see arrow E1) is applied to press the cover glass 4 toward the side (lower side) corresponding to the frame 6. The left and right clip portions 32 receiving the downward force from the cover glass 4 are elastically deformed to expand the distance therebetween while allowing the corner portion of the cover glass 4 pushed downward to slide on the upper inclined surface 47 (see arrow E2).

[0242] Then, when the cover glass 4 reaches a position exceeding the pressing protrusion 42 relative to the clip portion 32 while moving downward on the side in contact with the clip portion 32, the clip portion 32 returns from the elastically deformed state. Fig.14 As shown in FIG. C, the left clamping part 32 and the right clamping part 32 return to the initial natural state (see arrow E3), and a state is obtained in which the protective glass 4 is supported on the glass supporting surface 23. That is, the cover glass 4 is supported on the glass supporting surface 23 and is fitted between the pair of step forming parts 31 and the left and right clamping parts 32, and is held and fixed on the frame main body part 26 by these cover fixing parts. The cover glass 4 is attached as described above, and the solid-state imaging device 1 is obtained.

[0243] In the removal of the cover glass 4 in the solid-state imaging device 1 of the first modification, as Fig.10 As shown in FIG. 1A , the tool 75 uses the recessed portions 60 formed in the left wall portion 20 and the right wall portion 20 of the frame body portion 26, and releases the engagement state of the clip portion 32 for both the left edge portion and the right edge portion of the cover glass 4 or for each of the left edge portion and the right edge portion. Here, the clip portion 32 releases the engagement of the cover glass 4 by temporary elastic deformation that causes the support column 41 to bend outward as described above.

[0244] According to the configuration of the first modification, compared with the holding structure of the cover glass 4 by the clip portions 32 and the hook portions 33 as described above, the cover glass 4 can be firmly fixed and held relative to the frame 6 by the clip portions 32 on both the left and right sides. That is, a relatively stable attached state of the cover glass 4 can be obtained.

[0245] Furthermore, according to the configuration of the first modified example, in the step of attaching the cover glass 4 to the frame 6, the operation direction of the cover glass 4 to the frame 6 can be only in one direction (downward). Therefore, the cover glass 4 can be easily attached to the frame 6 by a relatively simple operation. The simple operation when attaching the cover glass 4 is advantageous, for example, in the case where the attachment of the cover glass 4 is automatically performed by a mechanical device.

[0246] (Second Modification)

[0247] like Fig.15 and Fig.16 As shown in , as in the first modification, the solid-state imaging device 1 according to the second modification includes the clip portions 32 on the left and right sides, and fixes the cover glass 4 to the frame 6 in a state where the clip portions 32 extend through the holes 4d formed in the cover glass 4.

[0248] In the second modification, the cover glass 4 has a larger dimension in the X direction than the frame body 26 of the frame 6, and the left and right sides of the cover glass 4 protrude from the frame 6. That is, the cover glass 4 has a protrusion 4e protruding outward in the left-right direction from the outer shape of the glass support surface 23 of the frame 6 when viewed from above.

[0249] The cover glass 4 has four holes 4d corresponding to the four clip portions 32. Each hole 4d has a rectangular opening shape along the outer shape of the cover glass 4. The hole 4d corresponds to the outer size of the clip portion 32 in a plan view, and has an opening size that allows the clip portion 32 to extend therethrough. Fig.15 In the example shown, the hole 4d has substantially the same size in the Y direction as the clip portion 32. Further, the hole 4d of the glass cover 4 has an opening size that does not interfere with the movable range of elastic deformation of the clip portion 32, thereby allowing elastic deformation of the clip portion 32 when the glass cover 4 is attached to or detached from the frame 6 in the X direction.

[0250] In the glass cover 4, a portion between each pair of holes 4d facing each other in the X direction is a portion located between the left clamping portion 32 and the right clamping portion 32. Therefore, a pair of holes 4d facing each other in the X direction are formed so that a dimension F1 between the left and right inner side surfaces 4f is substantially the same as a dimension between the inner side surfaces 43 of the clamping portions 32 on the left and right sides.

[0251] In addition, the glass cover 4 has a cutout portion 4g as a shape portion for exposing a recess 60 for removing the glass cover 4 formed in the glass supporting surface 23 at the edge portions on the left and right sides. Fig.15In the example shown, the notch portion 4g is formed into a concave shape with the outer side in the left-right direction as the opening side in a plan view, and the left and right inner side surfaces 4h are formed so that the exposed portion 60a appears in the concave portion 60. Note that the shape of the portion of the cover glass 4 for exposing the concave portion 60 is not limited.

[0252] In the second modification, for example, the hole 4d and the cutout portion 4g of the shielding glass cover 4 are formed by cutting a glass plate with a predetermined tool such as a cutting blade, using an etching method, or the like.

[0253] As in the second modification, in the structure having the clip portions 32 on both the left and right sides, a structure may be adopted in which the holes 4d are formed to extend through the left and right edge portions of the cover glass 4, and the holes 4d are used as holding holes for the clip portions 32. According to this configuration, for example, the protruding portion 4e of the cover glass 4 can be used to obtain good operability of the solid-state imaging device 1.

[0254] (Other Modifications)

[0255] Other modifications of the solid-state imaging device 1 according to the present embodiment include the following configurations.

[0256] The step forming portion 31, the clip portion 32, and the hook portion 33 of the frame 6 may be portions provided by attaching a separate member to a member forming the frame main body portion 26. In the case of such a configuration, the member forming the step forming portion 31, etc., is fixed to the member forming the frame main body portion 26 by a mechanical coupling structure such as fitting or insertion, bonding with an adhesive, etc. According to the configuration in which the step forming portion 31, etc. is formed as a separate member, for example, when the frame 6 is formed by resin molding using a mold, molding of each partial piece can be performed, so that molding can be performed relatively easily.

[0257] In addition, the formation positions and numbers of the step forming portion 31, the clip portion 32, the hook portion 33, and the recessed portion 60 are not particularly limited. For example, the clip portion 32 and the hook portion 33 may be provided at one position, or may be provided at three or more positions. At least one of the clip portion 32 and the hook portion 33 may be provided on the wall portion 20 on all four side surfaces. In addition, the recessed portion 60 may be formed at two or more positions in the wall portion 20 where the clip portion 32 is provided.

[0258] <5. Configuration Example of Solid-State Imaging Device According to Second Embodiment>

[0259] Reference Figures 17 to 21 A configuration example of a solid-state imaging device 80 according to a second embodiment of the present technology is described. In each embodiment described below, components common to or corresponding to the components of the above-described embodiment are denoted by the same reference numerals, and description thereof is appropriately omitted.

[0260] The solid-state imaging device 80 according to the present embodiment is different from the solid-state imaging device 1 according to the first embodiment in the configuration of the frame 6 that supports the cover glass 4 relative to the substrate 5. In the present embodiment, the configuration corresponding to the clip portion 32 and the hook portion 33 according to the first embodiment is provided on the side corresponding to the cover glass 4, and as a part of the frame 6, the cover glass 4 is attached to and detached from the configuration on the side corresponding to the substrate 5.

[0261] like Figures 17 to 21 As shown in FIG. 1 , the frame 6 of the present embodiment includes: a substrate side frame 81 which is a first frame portion fixed to the substrate 5; and a glass side frame 82 which is a second frame portion forming a cover holding portion and detachably attached to the substrate side frame 81. That is, the solid-state imaging device 80 includes the glass side frame 82 as a cover holding portion which detachably holds the glass cover 4 relative to the substrate side frame 81 which is a part of the frame 6.

[0262] As described above, the frame 6 according to the present embodiment has a divided structure including the substrate side frame 81 which is the frame main body portion forming the package main body portion 3 together with the substrate 5 and the glass side frame 82 which is the glass supporting portion supporting the cover glass 4. The substrate side frame 81 and the glass side frame 82 may be members including the same material or may be members including different materials.

[0263] The glass side frame 82 and the cover glass 4 form a cover body 85 detachably attached to the image sensor unit 80A including the image sensor 2, the substrate 5, and the substrate side frame 81 (see FIG. Fig.21 ). The glass side frame 82 includes a clip portion 92 and a hook portion 93 .

[0264] The substrate side frame 81 is now described. The substrate side frame 81 is a portion having substantially the same configuration as the frame main body portion 26 according to the first embodiment. The substrate side frame 81 includes four wall portions 20 forming an opening portion 25, and these wall portions 20 form a frame-shaped frame portion on the substrate 5. The substrate side frame 81 is fixed to the substrate 5 by an adhesive with the lower surface 24, which is a surface perpendicular to the up-down direction, as a bonding surface with the surface 5a of the substrate 5.

[0265] Now, the glass side frame 82 is described. The glass side frame 82 includes: a frame-shaped main body portion 86, which is a frame-shaped main body portion that holds the shade glass cover 4; and a clip portion 92 and a hook portion 93, which are provided in the frame-shaped main body portion 86 and serve as an engaging portion that engages with the substrate side frame 81 to hold the glass side frame 82 to the substrate side frame 81. The glass side frame 82 includes an engaging portion 92 as a first engaging portion and an engaging portion 93 as a second engaging portion for engaging with the substrate side frame 81.

[0266] The frame-shaped main body portion 86 is a partial piece of an outer shape having a rectangular shape in a plan view, and its outer dimensions are larger than the outer dimensions of the plan view shape of the substrate side frame 81. The frame-shaped main body portion 86 includes a plate-shaped base portion 87 as a horizontal plate-shaped portion and four outer edge protrusions 88 as portions formed along the outer edge of the plate-shaped base portion 87 and protruding downward. The frame-shaped main body portion 86 has a transverse cross-sectional shape substantially having the shape of the letter "L" at each side portion forming the frame shape formed by the plate-shaped base portion 87 and the outer edge protrusions 88.

[0267] The frame-shaped main body portion 86 has an upper surface 86a and a lower surface 86b, both of which are horizontal surfaces. The upper surface 86a is the upper surface of the plate-shaped base 87, and the lower surface 86b is the lower surface of the four outer edge protrusions 88. In addition, the frame-shaped main body portion 86 has four inner side surfaces 86c and four outer side surfaces 86d formed to be perpendicular to the upper surface 86a and the lower surface 86b at each side portion forming the frame shape. The inner side surface 86c is the inner side surface of the outer edge protrusion 88.

[0268] The frame-shaped main body 86 has an opening 89 for fixing the passage of light received by the image sensor 2. The opening 89 is a rectangular hole extending through the plate-shaped base 87 in the plate thickness direction. The opening size of the opening 89 is smaller than the outer size of the glass cover 4. In the example shown in the figure, the opening 89 has an opening size that is substantially the same as the opening 25 of the substrate-side frame 81. The opening 89 is formed by the inner side surface 87a of the plate-shaped base 87. In addition, the opening shape and opening size of the opening 89 are not limited as long as the opening 89 is formed so as to include the entire pixel area 12 of the image sensor 2 in the opening area when viewed from above.

[0269] In the glass side frame 82, the horizontal lower surface of the plate-shaped base 87, which is a surface on the opposite side of the upper surface 86a of the frame-shaped main body portion 86, serves as a glass attachment surface 90 to which the cover glass 4 is attached. The glass attachment surface 90 is a stepped surface located on the upper side of the lower surface 86b of the frame-shaped main body portion 86, and is a surface where the lower side of the opening portion 89 is located. The cover glass 4 is fixed to the glass attachment surface 90 by an adhesive such as an ultraviolet (UV) curing resin so as to cover the entire opening portion 89 from below. The left and right side surfaces 4c of the cover glass 4 face the inner side surface 86c of the frame-shaped main body portion 86.

[0270] As described above, the clip portion 92 and the hook portion 93 are provided below the frame-shaped main body portion 86. The clip portion 92 and the hook portion 93 are portions having the same shape and size as the shape and size of the clip portion 32 and the hook portion 33 according to the first embodiment, respectively, and are provided as portions of a shape in which the clip portion 32 and the hook portion 33 are reversed. In addition, similarly to the clip portion 32 and the hook portion 33 as portions protruding from the glass support surface 23 of the frame main body portion 26 in the first embodiment, the clip portion 92 and the hook portion 93 are provided as portions protruding from the lower surface 86b of the frame main body portion 86. Therefore, in the description of the clip portion 92 and the hook portion 93, portions corresponding to the clip portion 32 and the hook portion 33 of the first embodiment are denoted by the same reference numerals, and description thereof is appropriately omitted.

[0271] The clip portion 92 and the hook portion 93 are provided at a pair of outer edge protrusions 88 opposing each other in the frame-shaped main body portion 86 , and the two pairs are provided to face each other.

[0272] Each clip portion 92 includes a support column 41 protruding from the lower surface 86b and a pressing protrusion 42 formed at a lower portion of the support column 41 (see Fig.21 The clip portion 92 is formed so that the outer side surface 44 is located on the same plane as the outer side surface 86 d of the frame-shaped main body portion 86 .

[0273] like Fig.21 As shown, each pressing protrusion 42 has a lower inclined surface 97 inclined in a direction from the lower side to the upper side from the outer side to the inner side in the left-right direction, as a surface corresponding to the upper inclined surface 47 of the clip portion 32 according to the first embodiment. The pressing protrusion 42 has an upper inclined surface 98 inclined downward from the outer side to the inner side in the left-right direction, as a surface corresponding to the lower inclined surface 48 of the clip portion 32 according to the first embodiment. The lower inclined surface 97 and the upper inclined surface 98 form a ridge 99 in the Y direction as an end portion on the protruding side of the pressing protrusion 42.

[0274] Each hook portion 93 includes a support column 51 protruding from the lower surface 86b and a pressing protrusion 52 formed at a lower portion of the support column 51 (see Fig.21 The hook portion 33 is formed so that the outer side surface 54 is located on the same plane as the outer side surface 86 d of the frame-shaped main body portion 86 .

[0275] like Fig.21As shown, the pressing protrusion 52 has a lower inclined surface 107 inclined in the direction from the lower side to the upper side from the outer side to the inner side in the left-right direction, as a surface corresponding to the upper inclined surface 57 of the hook portion 33 according to the first embodiment. In addition, the pressing protrusion 52 has a horizontal pressing surface 108, which is located below and faces the lower surface 86b of the frame-shaped main body portion 86, as a surface corresponding to the pressing surface 58 of the hook portion 33 according to the first embodiment. The lower inclined surface 107 and the holding surface 108 form a ridge 109 in the Y direction as an end portion on the protruding side of the holding protrusion 52.

[0276] The glass side frame 82 is fixed to the substrate side frame 81 by engaging the glass side frame 82 with the outer side of the substrate side frame 81 and clamping the substrate side frame 81 between the clip portion 92 and the hook portion 93. Therefore, the clip portion 92 and the hook portion 93 are set so that the dimension between the inner side surfaces 43 and 53 facing each other is substantially the same as or slightly larger than the dimension of the substrate side frame 81 in the X direction.

[0277] On the substrate side frame 81 side, engagement recesses 102, 103 are formed which are engagement portions respectively engaged by the clip portion 92 and the hook portion 93. The engagement recesses 102 and 103 are formed as recesses having shapes corresponding to the holding protrusions 42 and 52 of the clip portion 92 and the hook portion 93, respectively, at the vertical middle portions of the outer wall surfaces 22 of the left wall portion 20 and the right wall portion 20.

[0278] Each engagement recess 102 for the clip portion engaged by the clip portion 92 is formed into a V-shaped recess by inclined portions 102a and 102b corresponding to the lower inclined surface 97 and the upper inclined surface 98 of the pressing protrusion 42, respectively. The engagement recess 102 is formed to have a size that allows the entire pressing protrusion 42 or substantially the entire pressing protrusion to be fitted. Each engagement recess 103 for the hook portion engaged by the hook portion 93 is formed into a substantially V-shaped recess by an inclined portion 103a and a locking surface 103b corresponding to the lower inclined surface 107 and the retaining surface 108 of the pressing protrusion 52, respectively. The engagement recess 103 is formed to have a size that allows the entire pressing protrusion 52 or substantially the entire pressing protrusion to be fitted.

[0279] The engaging recesses 102, 103 are formed in a range corresponding to at least a portion of the clip portion 92 and the hook portion 93 formed in the Y direction. The engaging recesses 102 and 103 have substantially the same size as the clip portion 92 and the hook portion 93 in the Y direction, so that the clip portion 92 and the hook portion 93 can be positioned in the Y direction relative to the engaging recesses 102 and 103, and an action of positioning the glass side frame 82 relative to the substrate side frame 81 in the Y direction can be achieved.

[0280] The clip portions 92 attach and detach the glass side frame 82 to the substrate side frame 81 by temporary elastic deformation. Specifically, as temporary elastic deformation, each clip portion 92 is deformed to warp outward in the left-right direction relative to the substrate side frame 81 to which the glass side frame 82 is attached from above, thereby expanding the distance to the hook portion 93 (see Fig. 22 B). In addition, the clip portion 92 is also elastically deformed in the same manner when the glass side frame 82 is removed from the substrate side frame 81. Therefore, the clip portion 92 is formed as a flexible portion that can be appropriately bent when the glass side frame 82 is attached or detached.

[0281] In the substrate side frame 81, chamfered portions 110 are formed at left and right outer corners of upper portions of the left and right wall portions 20 and 20 engaged by the clip portions 92 and the hook portions 93 (see FIG. Fig.21 ). A chamfered portion 110 is formed in a portion of the wall portion 20 above the engaging recessed portions 102 and 103 .

[0282] Each chamfered portion 110 forms an inclined surface 111 that is inclined downward from the inside to the outside in the left-right direction at a corner formed by the upper surface 20a in the corresponding wall portion 20 and the outer wall surface 22. Although it is only an example, the inclination angle of the inclined surface 111 is 45°. The chamfered portion 110 is formed within a range of the Y direction corresponding to at least the forming portion of the clip portion 92 and the hook 93.

[0283] Furthermore, in the substrate side frame 81, a recess 60 for causing a tool for removing the cover body 85 from the substrate side frame 81 to act on the cover body 85 is formed in the left wall portion 20, and the left wall portion 20 is engaged with the clamp portion 92. That is, the substrate side frame 81 has the recess 60 that opens at the upper surface 20a and is partially covered by the cover glass 4. Fig.17 In the example shown in , the recessed portion 60 is formed in a portion located between two clip portions 92 in the Y direction in the left wall portion 20 .

[0284] The glass side frame 82 includes a cutout portion 84 at its left edge portion as a shape portion for facilitating access to the exposed portion 60a of the recess 60 formed in the substrate side frame 81 (see FIG. Fig.17 ).exist Fig.17 In the example shown, the notch portion 84 has a concave shape with the outer side (left side) in the left-right direction as the opening side when viewed from above. In the Y direction, the portion where the notch portion 84 is formed is the portion where the outer edge protrusion 88 is not formed (see Fig.19 ).

[0285] like Fig. 20As shown, in the glass side frame 82 , the side wall portion 91 is provided on the outer edge protrusions 88 of a set of opposite side portions different from the two sides including the clip portion 92 and the hook portion 93 among the four side portions of the frame-shaped main body portion 86 .

[0286] The side wall portion 91 is provided as a protrusion extending downward from the lower surface 86b of the frame-shaped main body portion 86. The side wall portion 91 is a portion that restricts the movement of the glass side frame 82 relative to the substrate side frame 81 in the Y direction by contacting the outer wall surface 22 of the wall portion 20. The side wall portion 91 includes: an inner wall surface 91a, which is an inner wall surface and contacts the outer wall surface 22 of the wall portion 20; an outer wall surface 91b, which is a wall surface opposite to the inner wall surface 91a; and a lower surface 91c, which has a horizontal plane shape.

[0287] The side wall portion 91 is provided over the entire range in the extension direction (X direction) of a pair of side portions of the frame-shaped main body portion 86 that face each other in the Y direction. However, the side wall portion 91 may be partially provided at a plurality of positions along the extension direction of the side surface portion of the frame-shaped main body portion 86 or may be provided at a plurality of positions.

[0288] The pair of side wall portions 91 is set so that the dimension between the inner wall surfaces 91a facing each other is substantially the same as or slightly larger than the dimension of the substrate side frame 81 in the Y direction. When the substrate side frame 81 is fitted between the pair of side wall portions 91, the pair of side wall portions 91 contact the outer wall surface 22 of the wall portion 20 at the inner wall surfaces 91a, thereby restricting the movement (lateral displacement) of the glass side frame 82 relative to the substrate side frame 81 in the Y direction.

[0289] <6. Method for Manufacturing Solid-State Imaging Device According to Second Embodiment>

[0290] Reference Fig. 22 An example of a method for manufacturing the solid-state imaging device 80 according to the second embodiment of the present technology is described.

[0291] In the method for manufacturing the solid-state imaging device 80, first, a chip bonding step of providing the image sensor 2 on the substrate 5 and a wire bonding step of connecting the substrate 5 and the image sensor 2 through the wires 10 are performed. Next, a frame mounting step of providing the substrate side frame 81 on the substrate 5 is performed. Through these steps, the image sensor unit 80A (see Fig.21 ).

[0292] Next, a step of attaching the cover glass 4 to the image sensor unit 80A is performed. Fig. 22 An example of a step of attaching the cover glass 4 is described. In the present embodiment, as attachment of the cover glass 4 , a cover body 85 having a configuration in which the cover glass 4 is fixed to the glass-side frame 82 is attached to the substrate-side frame 81 .

[0293] When installing the cover 85, first, the cover 85 is in the following installation setting state relative to the substrate side frame 81. Fig. 22 As shown in FIG. 1A , the cover body 85 enters a state where the hook portion 93 is engaged with the engagement recess 103 and the clip portion 92 is in contact with the left wall portion 20. Here, for example, Fig. 22 As shown in FIG. 8A , the clip portion 92 is supported by the wall portion 20 in a state where the lower inclined surface 97 is in contact with the inclined surface 111 of the chamfered portion 110 .

[0294] like Fig. 22 As shown in B, from Fig. 22 From the installation setting state of the cover body 85 shown in A, a force is applied to press the cover body 85 toward the side (lower side) corresponding to the substrate side frame 81 (see arrow G1). Here, the pressing force on the cover body 85 is applied so as to act mainly on the side portion of the frame-shaped main body 86 of the cover body 85, for example, on the side (left side) where the clip portion 92 is formed. When the cover body 85 is subjected to the downward force, when sliding on the inclined surface 111 in contact with the lower inclined surface 97 (see arrow G2), the clip portion 92 is elastically deformed to expand the distance to the hook 93.

[0295] Then, in the cover body 85, in a state where the side corresponding to the clip portion 92 in the left-right direction moves downward, when the pressing protrusion 42 of the clip portion 92 reaches the engaging recess 102 of the substrate side frame 81, the clip portion 92 returns from the elastically deformed state to fit into the engaging recess 102, and the hook portion 93 fits into the engaging recess 103. Therefore, as Fig. 22 As shown in C, the clip portions 92 return to their original natural state (see arrow G3), and a state is obtained in which the cover body 85 is attached to the substrate side frame 81. That is, a state is obtained in which the glass cover 4 is supported by the substrate side frame 81 via the glass side frame 82. The glass cover 4 is attached as described above, and the solid-state imaging device 80 is obtained.

[0296] In the removal of the cover glass 4 in the solid-state imaging device 80 of the present embodiment, as the removal of the cover body 85, the recess 60 formed in the left wall portion 20 of the substrate side frame 81 is used by the tool 75, as shown in FIG. Fig.10 As shown in A, the engagement state of the clip portion 92 is released relative to the left edge portion of the glass side frame 82. Here, the clip portion 92 is released from engagement with the wall portion 20 by temporary elastic deformation that causes the support column 41 to bend outward as described above.

[0297] In the solid-state imaging device 80 according to the present embodiment, the frame 6 includes the substrate side frame 81 and the glass side frame 82 that supports the cover glass 4 and includes the clip portion 92 and the hook portion 93. According to such a configuration, in the image sensor unit 80A in which the cover body 85 including the cover glass 4 is removed from the solid-state imaging device 80, the clip portion 92 and the hook portion 93 may not be left in the substrate side frame 81, so that the clip portion 92 and the hook portion 93 do not become an obstacle.

[0298] According to the frame 6 of the first embodiment, in the image sensor unit 1A with the cover glass 4 removed, the clip portion 32 and the hook portion 33 can be used to fix the lens housing 76 (see Fig.11 ). However, in the case where the clip portion 32 and the hook portion 33 are not used to fix the lens housing 76, the clip portion 32 and the hook portion 33, which are protrusions on the wall portion 20, sometimes become obstacles when, for example, attached to a set structure. In contrast, according to the solid-state imaging device 80 of the present embodiment, since the clip portion 92 and the hook portion 93 do not remain in the substrate side frame 81, which is the frame 6 after the cover glass 4 is removed, an image sensor unit 80A with good operability can be obtained.

[0299] Furthermore, in the substrate side frame 81, it is only necessary to form the engaging recesses 102 and 103 as the portion engaged by the clip portion 92 and the hook portion 93, so that complicated processing may not be required for the frame portion of the image sensor unit 80A. On the other hand, the glass side frame 82 having a relatively complicated shape with respect to the substrate side frame 81 can be reused after being removed as the cover body 85 including the cover glass 4. Therefore, the frame structure according to the present embodiment is economical.

[0300] Furthermore, by forming the chamfered portion 110 in the wall portion 20 corresponding to the clip portion 92 and the hook portion 93, the cover body 85 can be easily attached to the substrate side frame 81. That is, since a guiding action toward the side where the clip portion 92 is elastically deformed is obtained by utilizing the inclined surface 111 of the chamfered portion 110, the clip portion 92 and the hook portion 93 can be smoothly engaged with the engaging recessed portions 102, 103, and the cover body 85 can be easily and reliably mounted by a pressing operation from above the cover body 85.

[0301] In addition, the substrate side frame 81 has the recess 60 opened in the upper surface 20a of the wall portion 20. According to this configuration, when the cover body 85 is removed using the tool 75, the tool 75 can easily act on the cover glass 4 or the glass side frame 82, and the cover glass 4 can be easily removed.

[0302] In this embodiment, similarly to the modification of the first embodiment, the glass side frame 82 may also have the clip portion 92 and the recessed portion 60 on both sides opposite to each other in the X direction. In this case, on the side corresponding to the substrate side frame 81, engaging recessed portions 102 engaged by the clip portion 92 are formed on both sides in the X direction. In addition, in the glass side frame 82, the clip portion 92, the hook portion 93, and the side wall portion 91 may be portions provided by attaching separate members to the member forming the frame-shaped main body portion 86.

[0303] In addition, the formation positions and numbers of the clip portion 92, the hook portion 93, the side wall portion 91 and the recess 60 are not particularly limited. For example, the clip portion 92 and the hook portion 93 may be provided at one position, or may be provided at three or more positions. In addition, at least one of the clip portion 92 and the hook portion 93 may be provided on all four sides of the frame-shaped main body portion 86. In addition, the recess 60 may be formed at two or more positions of the side portion where the clip portion 92 is provided.

[0304] <7. Configuration Example of Solid-State Imaging Device According to Third Embodiment>

[0305] Reference Figure 23 to Figure 27 A configuration example of a solid-state imaging device 120 according to a third embodiment of the present technology is described. The solid-state imaging device 120 according to the present embodiment is different from that of the second embodiment in the configuration of a frame portion that holds the cover glass 4 in the frame 6 .

[0306] like Figure 23 to Figure 27 As shown, the frame 6 according to the present embodiment includes a substrate side frame 121 which is a first frame portion fixed to the substrate 5 and a glass side frame 122 which is a second frame portion forming a cover holding portion and detachably attached to the substrate side frame 121. That is, the solid-state imaging device 120 includes the glass side frame 122 as a cover holding portion which detachably holds the cover glass 4 relative to the substrate side frame 121 which forms a part of the frame 6.

[0307] As described above, the frame 6 according to the present embodiment has a divided structure including the substrate side frame 121 which is the frame body portion forming the package body portion 3 together with the substrate 5 and the glass side frame 122 which is the glass supporting portion supporting the glass cover 4 .

[0308] The glass side frame 122 forms together with the cover glass 4 a cover body 125 detachably attached to the image sensor unit 120A (see FIG. Fig.26 and Fig. 27 ). The image sensor unit 120A includes the image sensor 2 , the substrate 5 , and a substrate-side frame 121 .

[0309] The substrate-side frame 121 has four walls 20 forming an opening 25, similarly to the substrate-side frame 81 of the second embodiment, and these walls 20 form a frame-shaped frame portion on the substrate 5. The substrate-side frame 121 is fixed to the substrate 5 by an adhesive.

[0310] The glass side frame 122 has: a frame-shaped main body 126, which is a frame-shaped main body for holding the glass cover 4; and a pair of clamps 132 as a joining portion, which are arranged in the frame-shaped main body 126 and joined to the substrate side frame 121 to hold the glass side frame 122 to the substrate side frame 121.

[0311] The frame-shaped main body 126 is a part having a rectangular shape in a plan view, and has four frame-shaped side portions 128, and its outer dimensions are larger than the outer dimensions in a plan view of the substrate side frame 121. The frame-shaped main body 126 has an upper surface 126a and a lower surface 126b, both of which are horizontal planes. In addition, the frame-shaped main body 126 has four outer side surfaces 126d formed perpendicularly to the upper surface 126a and the lower surface 126b in the side portions 128.

[0312] The frame-shaped body portion 126 has an opening portion 129 for fixing a passage of light received by the image sensor 2. The opening portion 129 is a rectangular hole extending through the frame-shaped body portion 126 in the up-down direction. The frame-shaped body portion 126 has four upper portion inner side surfaces 129a at the upper portion of the frame-shaped body portion 126 and four lower portion inner side surfaces 129b located outside the upper portion inner side surfaces 129a at the lower portion of the frame-shaped body portion 126 as surfaces forming the opening portion 129.

[0313] Regarding the opening portion 129, the opening size of the lower side at the lower surface 126b of the frame-shaped main body portion 126 is slightly larger than the opening size of the upper side at the upper surface 126a of the frame-shaped main body portion 126. The opening portion 129 has an upper opening size that is smaller than the outer size of the cover glass 4 and a lower opening size that is substantially equal to or slightly larger than the outer size of the cover glass 4. In addition, the opening portion 129 only needs to be formed so as to include the entire pixel region 12 of the image sensor 2 in the opening region when viewed from above, and the opening shape and opening size of the opening portion 129 are not limited.

[0314] In the glass side frame 122, a step surface which is a horizontal surface facing downward between the upper portion inner side surface 129a and the lower portion inner side surface 129b is a glass attachment surface 130. The glass mounting surface 130 is formed at approximately the center of the opening portion 129 in the up-down direction. The glass cover 4 is fixed to the glass attachment surface 130 by an adhesive so as to cover the entire opening portion 129 from below. The left side surface and the right side surface 4c of the glass cover 4 face the lower inner side surface 129b (see FIG. 1 ). Fig.25 ).

[0315] The clips 132 are provided with respect to the left and right sides 128 of the frame-shaped main body portion 126. The clips 132 are examples of a rotary engagement body rotatably supported with respect to the frame-shaped main body portion 126 in a state urged in a predetermined direction by a coil spring 133 as an urging member. The substrate side frame 121 including the frame-shaped main body portion 126 and the left and right clips 132 is configured to be bilaterally symmetrical or substantially bilaterally symmetrical.

[0316] Each clip 132 includes a support base 141 having an outer portion shape of a substantially quadrangular prism along the Y direction as the longitudinal direction, and a clip main body 142 protruding downward from the support base 141. The clip 132 is arranged in a state where substantially the entire support base 141 is positioned in a recess 134 formed in the middle portion in the Y direction of each of the left and right sides 128 of the frame-shaped main body 126. The recess 134 is a concave cutout portion with the outer side in the left-right direction as the opening side when viewed from above. The clip 132 is arranged in a state where the clip main body 142 protrudes downward from the frame-shaped main body 126.

[0317] The clip 132 is rotatably supported with respect to the frame-shaped main body portion 126 with the Y direction as the rotation axis direction by a support shaft 135, which extends through the clip 132 with the Y direction as the axial direction and has two end sides inserted into the left and right side portions 128 of the frame-shaped main body portion 126. The support shaft 135 is a straight round bar-shaped member, extends through the shaft support hole 141c formed in the support base portion 141 of the clip 132, and is inserted into the shaft support holes 126c in the portions on both sides of the Y direction of the recessed portion 134 formed in the side surface portion 128 of the frame-shaped main body portion 126. For example, the support shaft 135 is provided in a state of being fixed to one of the clip 132 and the frame-shaped main body portion 126, and rotatably supports the clip 132 with respect to the frame-shaped main body portion 126.

[0318] The support base 141 has right-angled cutouts 143 at the inner and upper corners in the left-right direction (see FIG. Fig.25 The cutout portion 143 is formed by a horizontal lower surface 143a as a surface facing upward and a side surface 143b extending upright from the left-right outer side of the lower surface 143a. The side surface 143b is a surface opposite to the side wall surface 134a, which is one of the surfaces facing the left-right outer side of the recessed portion 134 forming the frame-shaped main body portion 126.

[0319] The clamp body 142 extends downward from the support base 141, and has a pressing protrusion 145 on the inner side of the lower end portion in the left-right direction. In the clamp body 142, an outer side surface 142a as an outer surface in the left-right direction is located on the same plane as the side surface of the outer side in the left-right direction of the support base 141, and an inner side surface 142b as an inner surface in the left-right direction is located on the outer side in the left-right direction of the edge of the inner side of the support base 141 in the left-right direction. In addition, the clamp body 142 is formed in the middle part of the Y direction relative to the support base 141. The support base portion 141 has a lower surface 141a, and the clamp body 142 protrudes downward from this lower surface.

[0320] like Fig.25 As shown, the pressing protrusion 145 includes a lower inclined surface 151, a horizontal pressing surface 152, and a vertical end surface 153, the lower inclined surface 151 is inclined from the outside to the inside in the left-right direction along the direction from the lower side to the upper side, the horizontal pressing surface 152 forms a right angle with the inner side surface 142b, and the vertical end surface 153 is a surface between the lower inclined surface 151 and the pressing surface 152. The holding surface 152 is located below the inner portion in the left-right direction of the support base 141.

[0321] The coil spring 133 is an example of an elastic body acting on the clip 132, and is provided between the left and right sides 128 and 128 of the frame-shaped main body portion 126 and the clip 132, wherein the extension / contraction direction of the clip in the left-right direction is above the support shaft 135 in the up-down direction. It is configured so that the urging force of the left coil spring 133 and the right coil spring 133 closes the lower part of the left clip 132 and the right clip 132 rotating around the support shaft 135. The coil spring 133 is provided at two positions on both sides of each clip 132 at a predetermined interval in the Y direction (see Fig.23 ).

[0322] Each coil spring 133 has an inner portion in the left-right direction, which is one end portion side in the extension / contraction direction, and the inner portion is inserted into an inner portion spring support hole 155 formed in each of the left and right side portions 128 of the frame-shaped main body portion 126 (see Fig.25 ). The inner spring support hole 155 is a circular hole opened toward the side wall surface 134a.

[0323] On the other hand, the coil spring 133 has an outer portion in the left-right direction, which is the other end side in the extension / contraction direction, and the outer portion is inserted into the outer portion spring support hole 156 formed in the support base 141 of the clip 132 (see FIG. Fig.25). The outer spring support hole 156 is a circular hole opened in the side surface 143b of the cutout portion 143. The outer spring support hole 156 is formed to face the inner spring support hole 155 at a position on the outer side in the left-right direction, and supports the coil spring 133 together with the inner spring support hole 155.

[0324] The coil spring 133 is interposed between the frame-shaped body 126 and the clamp 132 in a state where one end side is in contact with the bottom surface 155a of the inner spring support hole 155 and the other end side is in contact with the bottom surface 156a of the outer spring support hole 156, and presses the upper end portion of the clamp 132 above the support shaft 135 from the inner side to the outer side in the left-right direction of the frame-shaped body 126. That is, the coil spring 133 is rotated in the rotation direction of the clamp 132 rotatably supported by the support shaft 135 (see Fig.25 , as shown by arrow H1 , the lower end portion of the clip 132 is pushed to move to the inside in the left-right direction relative to the frame-shaped main body 126 .

[0325] In the cover body 125 removed from the image sensor unit 120A, for example, by bringing the corner portion 141b located on the inner side in the left-right direction and on the lower side of the support base 141 into contact with the side wall surface 134a of the recess 134, each clip 132 is restricted from rotating in the direction urged by the coil spring 133 (see Fig.25 and Fig.28 A). In addition, a portion that functions as a stopper may be separately provided to limit the rotation of the clamp 132.

[0326] In addition, the clamp 132 includes a protruding edge portion 146, which is a protruding portion extending outward in the left-right direction, at the upper portion of the support base 141. The protruding edge portion 146 is formed over the entire range of the Y direction of the clamp 132. The protruding edge portion 146 extends the upper surface 132a of the clamp 132 located on the same plane as the upper surface 126a of the frame-shaped main body portion 126 to the outside in the left-right direction, and is formed to protrude to the outside in the left-right direction relative to the outer side surface 142a of the clamp main body portion 142 to have a cross-sectional shape along a substantially rectangular shape. For example, the protruding edge portion 146 is used as a gripping portion for rotating the clamp 132 when the cover body 125 is attached to and detached from the image sensor unit 120A.

[0327] The glass side frame 122 is fixed to the substrate side frame 121 by engaging the left and right clamps 132 with the outer sides of the substrate side frame 121 in the left-right direction so that the substrate side frame 121 is clamped between the left and right clamps 132 .

[0328] The substrate side frame 121 includes an engaging recess 158, which is an engaging portion engaged by the left clamp 132 and the right clamp 132 (see FIG. Fig.26 The joining recess 158 is a notch portion formed as a recess relative to the outer wall surface 22 and the lower surface 24 of the wall portion 20, and is formed by a wall surface 158a located on the inner side of the outer wall surface 22 in the left-right direction, side surfaces 158b on both sides of the Y direction, and a horizontal upper surface 158c facing downward.

[0329] The engaging recess 158 is formed at the middle part of the wall 20 on the left and right sides in the Y direction, within the range of the entire jig body 142 corresponding to the length of the jig body 142 of the jig 132 in the Y direction. The engaging recess 158 is formed in substantially the upper and lower halves of the wall 20 in the up-down direction. The engaging recess 158 is formed to have a size that allows the entire or substantially the entire holding protrusion 145 of the clip 132 to be assembled. By making the size of the engaging recess 158 in the Y direction, that is, the size between the side surfaces 158b, and the size of the jig body 142 substantially the same, the jig 132 can be positioned relative to the engaging recess 158 in the Y direction, and the effect of positioning the glass side frame 122 relative to the substrate side frame 121 in the Y direction can be obtained.

[0330] The clip 132 is rotatably supported relative to the frame-shaped main body portion 86 in a state where it is urged by the coil spring 133 in a direction to engage with the engaging recess 158 formed in the substrate side frame 81. When the clip 132 is in a state of engaging with the engaging recess 158, the pressing surface 152 of the pressing protrusion 145 contacts with the upper surface 158c of the engaging recess 158, and the inner side surface 142b of the clip main body portion 142 contacts with the outer wall surface 22 of the wall portion 20 (see Fig.25 Therefore, when the left and right clamps 132 are engaged with the substrate side frame 121 in the engagement recess 158 , the left-right dimension of the inner side surfaces 142 b facing each other is substantially the same as the dimension of the substrate side frame 121 in the X direction.

[0331] Furthermore, in the substrate side frame 121, chamfered portions 160 are formed at left and right outer corners of upper portions of the left and right wall portions 20 to be engaged by the clips 132. The chamfered portions 160 are formed at portions above the engaging recesses 158 in each wall portion 20.

[0332] Each chamfered portion 160 forms an inclined surface 161 that is inclined downward from the inside to the outside in the left-right direction at a corner portion formed by the upper surface 20a in the corresponding wall portion 20 and the outer wall surface 22. Although it is only an example, the inclination angle of the inclined surface 161 is 45°. The chamfered portion 160 is formed at least in the range corresponding to the forming portion of the clamp 132 in the Y direction. Fig.26 In the example shown in , the chamfered portion 160 is formed in substantially the same range as the engaging recessed portion 158 in the Y direction.

[0333] In addition, in the frame 6, a gasket 165 as a sealing portion is provided between the upper surface 20a of the wall portion 20 which is the joint surface of the substrate side frame 121 and the glass side frame 122 and the lower surface 126b of the frame-shaped main body portion 126. The gasket 165 is an annular quadrilateral gasket having a substantially rectangular shape, and is provided in a state of being fitted in a fitting groove 167 formed in a substantially rectangular shape in the lower surface 126b to follow the opening shape of the opening portion 129 (see Fig. 27 ).

[0334] In a state where the left and right clips 132 and 132 are engaged with the engagement recesses 158, the gasket 165 is sandwiched between the upper surface 20a of each wall portion 20 and the lower surface 126b of the frame-shaped body portion 126 and is compressed and deformed. The airtightness of the cavity 8 can be obtained by the gasket 165. Note that the fitting recess for fitting the gasket 165 may be formed in the upper surface 20a of the wall portion 20.

[0335] <8. Method for Manufacturing Solid-State Imaging Device According to Third Embodiment>

[0336] Reference Fig.28 An example of a method for manufacturing the solid-state imaging device 120 according to the third embodiment of the present technology is described. It should be noted that in the method for manufacturing the solid-state imaging device 120, the step of obtaining the image sensor unit 120A is similar to that of the above-mentioned embodiment, and therefore the description thereof is omitted, and the step of attaching the cover glass 4 to the image sensor unit 120A will be described.

[0337] In the present embodiment, as the attachment of the cover glass 4 , the cover body 125 having a configuration in which the cover glass 4 is fixed to the glass-side frame 122 is attached to the substrate-side frame 121 .

[0338] When installing the cover 125, first, the cover 125 is in the following installation setting state relative to the substrate side frame 121. Fig.28 As shown in A, the cover 125 is in a state where the left and right clips 132 are in contact with the respective wall portions 20. Here, for example, each clip 132 is supported by the wall portion 20 in a state where the lower inclined surface 151 is in contact with the inclined surface 161 of the chamfered portion 160.

[0339] from Fig.28 From the installation and fixing state of the cover body 125 shown in A, as shown in FIG. Fig.28As shown in FIG. 1B , a force (see arrow J1) is applied to press the cover body 125 toward the side (lower side) corresponding to the substrate side frame 121. When the cover body 125 receives the downward force, the clip 132 rotates against the urging force of the coil spring 133, thereby widening the distance between the clips 132 on both sides in the left-right direction (see arrow J2) while sliding on the inclined surface 161 in contact with the lower inclined surface 151.

[0340] Then, in the cover body 125 that moves downward relative to the substrate side frame 121, when the holding protrusion 145 of the clip 132 reaches the engaging recess 158 of the substrate side frame 121, as shown in FIG. Fig.28 As shown in FIG. 1C, the left clip 132 and the right clip 132 are rotated by the thrust of the coil spring 133 from the state of being rotated against the thrust of the coil spring 133, and are fitted into the engaging recess 158 (see arrow J3). Thus, the cover body 125 is mounted on the substrate side frame 121. That is, the state in which the cover glass 4 is supported by the substrate side frame 121 via the glass side frame 122 is obtained. The cover glass 4 is attached as described above, and the solid-state imaging device 120 is obtained.

[0341] Note that the cover 125 can be attached to the substrate side frame 121 by, for example, the following method. That is, when the left and right clamps 132 are engaged with the engagement recess 158, the protruding edge portion 146 is used as a grip portion or a knob portion, and the left and right clamps 132 are rotated to overcome the urging force of the coil spring 133, and are in a widened state in advance. After the frame-shaped main body portion 126 of the cover 125 is placed on the substrate side frame 121, the rotation operation of the left and right clamps 132 is released, so that the pressing protrusion 145 is directly engaged with the engagement recess 158.

[0342] The cover glass 4 in the solid-state imaging device 120 of the present embodiment is removed, for example, as follows, as the cover 125 is removed. That is, as described above, by rotating the left and right clamps 132 in the direction of widening by the protruding edge portions 146, the engagement with the engagement recess 158 is released, and in this state, the cover 125 is lifted relative to the substrate side frame 121, so that the cover 125 is removed.

[0343] According to the solid-state imaging device 120 of the present embodiment, similarly to the solid-state imaging device 80 according to the second embodiment, in the image sensor unit 120A in which the cover body 125 is removed from the solid-state imaging device 120, the clip 132 can be prevented from remaining on the substrate side frame 121, thereby realizing the image sensor unit 120A having good operation characteristics. In addition, in the substrate side frame 121, it is only necessary to form the engaging recess 158 as a portion engaged by the clip 132, so that complicated processing may not be required for the frame portion of the image sensor unit 120A. In addition, the glass side frame 122 can be reused after being disassembled as the cover body 125 including the cover glass 4.

[0344] In addition, in the solid-state imaging device 120 according to the present embodiment, the glass side frame 122 includes a spring-type clip 132 that receives the action of the coil spring 133 as an engagement portion relative to the substrate side frame 121. According to this configuration, the cover body 125 including the cover glass 4 can be easily removed without using a tool such as a screwdriver. In addition, by pressing the cover body 125 from above, the cover body 125 can be easily installed.

[0345] When the cover glass 4 is removed using the lever principle using a tool as in the above-described embodiment, it is necessary to apply a considerable force to the cover glass 4 and the frame 6 by the tool. In contrast, according to the configuration including the spring-type clip 132 according to the present embodiment, the cover body 125 can be removed without the tool acting on the cover glass 4 and the frame 6. As a result, it is possible to suppress the breakage of the cover glass 4 and the frame 6 that may be caused by the action of the tool on the cover glass 4 and the frame 6, and the generation of dust and the like caused by the breakage.

[0346] Furthermore, by forming the chamfered portion 160 on the wall portion 20 corresponding to the left and right clamps 132, the cover 125 can be easily attached to the substrate side frame 121. That is, the inclined surface 161 of the chamfered portion 160 has a guiding function to rotate the clamp 132 outward in the left and right directions, so that the clamp 132 can be smoothly engaged with the engagement recess 158, and the cover 125 can be easily and reliably attached.

[0347] Furthermore, the frame-shaped main body portion 126 of the substrate side frame 121 and the glass side frame 122 is hermetically sealed by the gasket 165. According to this configuration, the hermeticity of the cavity 8 can be ensured in a state where the cover body 125 is attached to the image sensor unit 120A, and a reduction in reliability due to moisture absorption and intrusion of dust into the cavity 8 can be suppressed. Furthermore, since moisture absorption of the cavity 8 can be suppressed, for example, at the time of reflow, generation of cracks or the like in the package due to an increase in the internal partial pressure accompanying evaporation of moisture absorbed by the cavity 8 can be suppressed.

[0348] <9. Modification of Solid-State Imaging Device According to Third Embodiment>

[0349] Will refer to Figure 29 to Figure 31 A modification of the solid-state imaging device 120 according to the third embodiment of the present technology is described. The solid-state imaging device 120 of this modification has a configuration in which the attachment direction of the clip 132 in the glass side frame 122 is opposite in the left-right direction, and the clip 132 is engaged with the inner side of the left wall portion 20 and the right wall portion 20 of the substrate side frame 121.

[0350] like Figure 29 to Figure 31 As shown, in the structure of this modified example, the clip body 142 of the clip 132 has a pressing protrusion 145 on the left-right outer side of the lower end portion. The clip body 142 has an inner surface in the left-right direction located on the same plane as the side surface located on the inner side in the left-right direction of the support base 141, and forms an inner side surface 132b of the clip 132 together with the support base 141 (see Fig.30 The inner surface 132b is a surface facing the side wall surface 134a of the recess 134 in the glass side frame 122. In the clip body 142, the outer surface 142c as the outer surface in the left-right direction is located on the inner side of the side surface 141d of the support base 141 in the left-right direction.

[0351] The pressing protrusion 145 includes a lower inclined surface 171 which is inclined from the outside to the inside in the left-right direction in the direction from the lower side to the upper side, a horizontal pressing surface 172 which forms a right angle with the outer side surface 142c, and a vertical end surface 173 which is a surface between the lower inclined surface 171 and the pressing surface 172. The holding surface 172 is located below the outer portion in the left-right direction of the support base 141.

[0352] In this modification, a support shaft 135 for supporting the jig 132 is provided on an upper portion of the support base 141 .

[0353] The coil spring 133 is provided between the left and right sides 128 and the clip 132 of the frame-shaped main body 126, wherein the extending direction of the clip 132 is located below the support shaft 135 in the up-down direction in the left-right direction. It is configured so that the urging force of the left and right coil springs 133 and the lower part of the left and right clips 132, which rotate around the support shaft 135, opens.

[0354] Each coil spring 133 presses the lower portion of the support base 141 of the clip 132 (which is the portion below the support shaft 135) from the inside in the left-right direction to the outside relative to the frame-shaped main body portion 126. That is, the coil spring 133 is rotated in the rotation direction (see Fig.30, arrow K1), wherein the lower end portion of the clip 132 is moved to the outside in the left-right direction relative to the frame-shaped main body portion 126. It is to be noted that, in the cover body 125 removed from the image sensor unit 120A, a portion serving as a stopper for limiting the rotation of the clip 132 in the direction urged by the coil spring 133 is appropriately provided in the clip 132 or the like.

[0355] The glass side frame 122 is fixed to the substrate side frame 121 by engaging the left and right clamps 132 with the inner side of the substrate side frame 121 in the left-right direction. On the side corresponding to the substrate side frame 121, an engaging recess 158 as a portion engaged by the left clamp 132 and the right clamp 132 is formed as a recess in the inner wall surface 21 and the lower surface 24 of each wall portion 20. Each engaging recess 158 is formed by a wall surface 158a located on the outer side of the inner wall surface 21 in the left-right direction, a side surface 158b on both sides of the Y direction, and a horizontal upper surface 158c facing downward. In the state where the clamp 132 is engaged with the engaging recess 158, the pressing surface 172 of the pressing protrusion 145 abuts against the upper surface 158c of the engaging recess 158, and the outer side surface 142c of the clamp body 142 abuts against the inner wall surface 21 of the wall portion 20.

[0356] Furthermore, in the substrate side frame 121, chamfered portions 160 are formed at left and right inner corners of upper portions of the left and right wall portions 20, 20 to be engaged by the clips 132. Each chamfered portion 160 forms an inclined surface 161 inclined downward from the outer side to the inner side in the left-right direction at a corner formed by the upper surface 20a and the inner wall surface 21 in the corresponding wall portion 20.

[0357] According to the structure of this modification, when the cover 125 is installed, the clamp 132 temporarily rotates against the force of the coil spring 133, so that the distance between the clamps 132 on the left and right sides is narrowed. Then, in the cover 125 that moves downward relative to the substrate side frame 121, when the retaining protrusion 145 of the clamp 132 reaches the engaging recess 158, the left and right clamps 132 are rotated by the urging force of the coil spring 133 and fit into the engaging recess 158. When the cover 125 is removed from the substrate side frame 121, the clamp 132 also performs a similar rotation operation. It should be noted that in the rotation operation of the clamp 132 against the urging force of the coil spring 133, for example, an operation of pressing the lower portion of the side surface 141d of the support base 141 of the left and right clamps 132 is performed.

[0358] The above-mentioned operation and effect can also be obtained by the configuration of this modified example. In addition, other modifications of the solid-state imaging device 120 according to the present embodiment include the following configurations. In the above-mentioned construction example, the clip 132 and the engaging recess 158 engaged by the clip 132 are arranged on both sides facing each other in the left-right direction in the frame-shaped packaging structure, but the combination of the clip 132 and the engaging recess 158 can be arranged on three sides or four sides in the frame-shaped package. In addition, multiple sets of combinations of the clip 132 and the engaging recess 158 can be arranged on each side of the frame-shaped package.

[0359] <10. Configuration Example of Solid-State Imaging Device According to Fourth Embodiment>

[0360] Reference Figure 32 to Figure 35 The solid-state imaging device 180 according to the fourth embodiment of the present technology is different from the solid-state imaging device 1 according to the first embodiment in the configuration of the cover holding portion that detachably holds the glass cover 4 relative to the frame 6.

[0361] The solid-state imaging device 180 according to the present embodiment includes a step forming portion 181 as a cover holding portion, and a bonding portion 182 interposed between the frame main body portion 26 and the cover glass 4 , the step forming portion 181 being provided on the upper side of the frame main body portion 26 .

[0362] The step forming portion 181 is a portion formed as a part of the frame 6, and is provided as a protrusion extending upward from the glass supporting surface 23. The step forming portion 181 is a portion that forms a step portion 185 relative to the glass supporting surface 23 and contacts the side surface 4c of the protective glass cover 4 to restrict movement of the protective glass cover 4 relative to the frame 6.

[0363] The step forming portion 181 is a wall-shaped portion formed along substantially the entire circumference of the frame shape of the frame main body 26 when viewed from above, with respect to the frame main body 26 formed into a frame shape by four wall portions 20. Therefore, the step forming portion 181 includes four step forming wall portions 183 formed on each wall portion 20, and these step forming wall portions 183 form a frame shape in a plan view.

[0364] The step forming portion 181 is provided on the wall portion 20 in such a manner that the step forming wall portion 183 is located on the outer side (the side corresponding to the outer wall surface 22) in the wall thickness direction of the wall portion 20, and forms a step portion 185 together with the glass supporting surface 23. The step forming portion 181 includes an inner side surface 186, which is an inner wall surface of the step forming wall portion 183 and serves as a contact surface with the side surface 4c of the glass cover 4, an outer side surface 187, and a horizontal upper surface 188. The step forming portion 181 is formed so that the outer side surface 187 is located on the same plane as the outer wall surface 22 of the wall portion 20.

[0365] In a plan view, the step-forming wall portion 183 is provided at each wall portion 20 over the entire range in the extension direction of the wall portion 20. Note that the step-forming wall portion 183 formed on the left wall portion 20 is formed in a range other than the formation portion of the recess 60 formed in the central portion in the extension direction of the wall portion 20. That is, the step-forming wall portion 183 formed on the left wall portion 20 is divided in the Y direction at the formation position of the recess 60. However, the step-forming wall portion 183 may be provided partially on the corresponding wall portion 20 or at a plurality of positions along the extension direction of the wall portion 20.

[0366] In the step forming portion 181, the upper surface 188 of each step forming wall portion 183 is a step surface that is higher than the glass support surface 23. In the step portion 185, the inner side surface 186 is located outside the inner wall surface 21 of the wall portion 20 and is formed as a surface parallel to the inner wall surface 21. Fig.34 In the example shown, the step forming the wall portion 183 has a wall thickness of about 1 / 2 of the wall thickness of the wall portion 20. However, the dimension of the wall thickness of the step forming wall portion 183 is not particularly limited.

[0367] The steps of the pair of wall portions 183 facing each other in the Y direction are arranged so that the dimension between the inner side surfaces 186 facing each other is substantially the same as or slightly larger than the dimension of the protective glass 4 in the Y direction. The pair of step-forming wall portions 183 facing each other in the X direction are arranged so that the dimension between the inner side surfaces 186 facing each other is larger than the dimension of the cover glass 4 in the X direction, and a gap 189 is formed between the left step-forming wall portion 183 and the cover glass 4.

[0368] The gap 189 is a slit-like space portion in the Y direction formed by the inner side surface 186 of the left step forming wall portion 183, which are surfaces facing each other on the glass support surface 23, and the left side surface 4c of the glass cover 4. In the present embodiment, in order to form the gap 189, the wall thickness of the left step forming wall portion 183 is thinned by a dimension substantially the same as the width of the gap 189 compared with the other step forming wall portions 183.

[0369] In the step forming portion 181, four step forming wall portions 183 form a rectangular opening portion 190 that opens upward corresponding to the outer shape of the glass cover 4. In a state where the glass cover 4 is fitted in the opening portion 190, the step forming portion 181 restricts the movement of the glass cover 4 in the horizontal direction on the glass supporting surface 23 by contacting the side surface 4c of the glass cover 4 at the inner side surface 186. In a state where the glass cover 4 is fitted in the opening portion 190, the four side surfaces 4c are contact surfaces or opposing surfaces with respect to the inner side surfaces 186 of the step forming wall portions 183. As described above, the step forming portion 181 is a portion where the step portion 185 for preventing lateral displacement of the shade glass cover 4 supported on the glass supporting surface 23 is formed, and serves as a portion for positioning the shade glass cover 4 with respect to the frame main body portion 26.

[0370] In the example shown in the figure, the vertical dimension of the step forming portion 181 is larger than the plate thickness dimension of the glass cover 4. However, the vertical dimension of the step forming portion 181 may be substantially the same as the plate thickness dimension of the glass cover 4, or may be smaller than the plate thickness dimension of the glass cover 4.

[0371] The bonding portion 182 is a portion including an adhesive for fixing the glass cover 4 to the frame body portion 26. As an adhesive forming the bonding portion 182, a pressure-sensitive adhesive that performs temporary bonding is used. The bonding portion 182 is a peeling material that changes its state when receiving external partial energy, for example, and thus has peelability so as to easily separate the glass cover 4 from the frame 6.

[0372] As the material of the bonding portion 182, for example, a peeling material is used that changes from a state in which the adhesive strength is relatively strong to a state that allows easy peeling by chemical reaction or physical reaction (a state in which the adhesive strength is reduced). The chemical reaction may be, for example, irradiation with light such as ultraviolet (UV) light or laser, heating to a temperature within a predetermined temperature range, etc. A UV easily peelable peeling material is, for example, a pressure-sensitive adhesive whose adhesive strength is reduced by irradiation with UV. In addition, the physical reaction is, for example, laser ablation, etc. In addition, as the material of the bonding portion 182, for example, a photocurable material such as a UV curable resin, a thermosetting material such as a thermosetting resin, or a material using a mixture thereof as a base material may be used.

[0373] In addition, as the adhesive forming the bonding portion 182, for example, a polyamide-based or polyester-based hot melt adhesive can be used. Note that the hot melt adhesive is an adhesive containing neither water nor an organic solvent, is solid at room temperature, and becomes liquid when heated.

[0374] The bonding portion 182 is interposed between the glass support surface 23 and the peripheral edge portion of the lower surface 4b of the glass cover 4, and bonds these surfaces. The bonding portion 182 is formed by applying a pressure-sensitive adhesive to the glass support surface 23, thereby completing the glass cover support surface 23, which is a portion of the inner portion of the step-forming wall portion 183 on the upper side of the wall portion 20. Therefore, in a plan view, the bonding portion 182 has four side portions 182a along the frame shape of the frame-shaped main body portion 126.

[0375] Note that the mode of applying the pressure-sensitive adhesive to the glass support surface 23 (i.e., the mode of forming the bonding portion 182) is not particularly limited. The pressure-sensitive adhesive may be applied to the glass support surface 23, for example, linearly applied in a discontinuous manner in the extending direction of the glass support surface 23 in each wall portion 20, may be applied in a plurality of parallel lines, or may be applied to a plurality of positions in a dotted line manner. Furthermore, the amount of application of the pressure-sensitive adhesive and the application area may be set according to the size of the glass cover 4, etc., so that the holding force (adhesive strength) required for the glass cover 4 can be ensured.

[0376] <11. Method for Manufacturing Solid-State Imaging Device According to Fourth Embodiment>

[0377] Reference Fig.36 An example of a method for manufacturing the solid-state imaging device 180 according to the fourth embodiment of the present technology is described.

[0378] like Fig.36 As shown in A of FIG. 1 , similarly to the first embodiment, a step of manufacturing the package body portion 3 is performed by a frame mounting step of setting a frame 6 on a substrate 5. Thereafter, an image sensor unit 180A is obtained by performing a chip bonding step of the image sensor 2 and a wire bonding step of the leads 10 on the package body portion 3.

[0379] Next, if Fig.36 As shown in FIG. 6B , a step of forming a bonding portion 182 on the glass support surface 23 of the frame 6 is performed. The bonding portion 182 is a peeling layer formed between the glass support surface 23 and the glass cover 4, and is provided for the purpose of separating the glass cover 4 from the frame 6. The bonding portion 182 is formed by applying a pressure-sensitive adhesive for forming the bonding portion 182 on the glass support surface 23 with a dispenser or the like. Note that the bonding portion 182 can be formed by bonding a sheet-like member (e.g., a peeling tape) to the glass support surface 23.

[0380] Then, if Fig.36 As shown in FIG. 1C, for example, using a mounter or the like, the glass cover 4 is fitted to the opening portion 190 through the step forming portion 181, and the glass cover 4 is fixed to the glass support surface 23 through the bonding portion 182. Here, a treatment process for curing the bonding portion 182, such as light irradiation or heating, is performed according to the characteristics of the bonding portion 182. In addition, the position of the protective glass cover 4 on the glass support surface 23 is adjusted so that the gap 189 is formed on the left side where the recessed portion 60 of the protective glass cover 4 is located.

[0381] By attaching the cover glass 4 as described above, a solid-state imaging device 180 is obtained. In the solid-state imaging device 180, the cover glass 4 is in a state where the cover glass 4 is temporarily fixed to the frame 6 in a sense by the bonding portion 182 including a pressure-sensitive adhesive of a type that is easily peeled off by heat, UV, stress, etc.

[0382] <12. Use Example of Solid-State Imaging Device According to Fourth Embodiment>

[0383] As a use example of the solid-state imaging device 1 according to the first embodiment of the present technology, reference will be made to Fig.37 Described is how to remove the cover glass 4. That is, as one use mode of the solid-state imaging device 180, the solid-state imaging device is used with the cover glass 4 which is removed once attached to the package main body portion 3.

[0384] For example, Fig.37 As shown in FIG. 1A , the cover glass 4 is removed in a state where the solid-state imaging device 180 is mounted on the setting substrate 18 by reflow of the solder balls 19 .

[0385] First, by irradiating or heating the bonding portion 182 with light of a predetermined wavelength such as UV light, for example, the bonding portion 182 enters a state where the adhesive strength is reduced, that is, a state where it is easily peeled off. Fig.37 As shown in A, in the case where the bonding portion 182 is irradiated with light by the light source 191, light applied from the side surface corresponding to the transparent or translucent cover glass 4 is transmitted through the cover glass 4 and applied to the bonding portion 182. Here, in the case where UV light is used as the irradiation light of the bonding portion 182, glass having a high transmittance with respect to the wavelength of the UV light is used as the cover glass 4.

[0386] After the adhesive strength of the bonding portion 182 is reduced, the cover glass 4 is removed using the lever principle with the tool 75. Fig.37 As shown in FIG. 1B , the tip of the shaft portion 75a of the tool 75 is inserted into the recess 60 of the frame 6 through the exposed portion 60a (see FIG. 1B ). Fig.32), and then operate the tool 75 to push down the side corresponding to the gripping portion 75b (see arrow L1), whereby the tool 75 acts so as to make the tip contact with the lower surface 4b of the glass cover 4 and lift the glass cover 4 using the lever principle (see arrow L2). In addition, since the adhesive strength of the bonding portion 182 is reduced, the glass cover 4 is easily peeled off from the glass supporting surface 23.

[0387] In the operation of removing the cover glass 4 using the tool 75, since there is a gap 189 (see FIG. 18A ) between the cover glass 4 and the left step forming the wall portion 183, Fig.37 A), so the cover glass 4 is smoothly lifted without interfering with the step forming the wall portion 183. Then, the cover glass 4 is removed from the frame 6 by pulling out the cover glass 4 from the opening portion 190 formed by the step forming portion 181.

[0388] As mentioned above, Fig.37 C, a configuration is obtained in which the image sensor unit 180A is mounted on the setting substrate 18. Note that in a state where the shielding glass cover 4 is removed, a portion of the bonding portion 182 remains on at least one of the glass supporting surface 23 and the peripheral edge portion of the lower surface 4b of the shielding glass cover 4.

[0389] According to the solid-state imaging device 180 according to the present embodiment as described above, similar to the solid-state imaging device 1 according to the first embodiment, the cover glass 4 can be easily attached and detached. In particular, the solid-state imaging device 180 of the present embodiment includes a step forming portion 181 as a cover holding portion, and a bonding portion 182, the step forming portion 181 restricting the movement of the glass cover 4, and the bonding portion 182 fixing the glass cover 4 to the glass supporting surface 23. According to this configuration, it is possible to obtain a configuration in which the cover glass 4 can be easily removed without complicating the shape of the frame 6.

[0390] In addition, by utilizing the configuration in which the step structure is provided by the step forming portion 181 on the outer peripheral portion of the upper portion of the frame 6, when the lens housing is attached to the image sensor unit 180A after removing the cover glass 4, the step forming portion 181 serves as a supporting portion of the lens housing, thereby preventing the coupling portion 182 remaining on the side surface corresponding to the frame 6 from adhering to the lens housing.

[0391] That is, according to the configuration including the step forming portion 181, in a state where the cover glass 4 is removed, the step forming portion 181 exists as a portion where the pressure-sensitive adhesive for fixing the cover glass 4 does not remain at a position above the formation surface of the bonding portion 182. Therefore, in the image sensor unit 180A in a state where the cover glass 4 is removed, the step forming portion 181 can be used as, for example, a bonding portion to a housing having a setting structure, a bonding portion to a new part of the package main body portion 3, or the like. In addition, when the image sensor unit 180A is attached to the setting structure, the upper surface 188 of the step forming portion 181 can be used as, for example, a reference surface in tilt adjustment.

[0392] For example, Fig.38 As shown, the step forming portion 181 in the image sensor unit 180A is used as a supporting portion for the lens housing 76 mounted on the image sensor unit 180A. The lens housing 76 has a supporting cylinder 195 formed in a quadrangular prism shape corresponding to the shape of the step forming portion 181, and supports one or more lenses 197 in the supporting cylinder 195. The lens housing 76 is fixed to the frame 6 in a state where the lower end portion of the supporting cylinder 195 is fitted to the step forming portion 181.

[0393] The lens housing 76 has a step portion 198 at the lower end portion of the support cylinder 195 so as to fit the step portion 181. The step portion 198 is a portion formed by cutting off the outer peripheral side of the lower end portion of the support cylinder 195 in a right angle manner when viewed in longitudinal section. The step portion 198 forms a frame-shaped insertion port 199 on the inner peripheral side of the lower end portion of the support cylinder 195 to be inserted into the opening 190 formed by the step portion 181.

[0394] The step portion 198 has a side surface 198a and an outer lower surface 198b that are in contact with the inner surface 186 and the upper surface 188 of the step forming wall portion 183, respectively, and is formed so that the step forming portion 181 is adapted to these surfaces. By fitting the upper end portion of the step forming portion 181 to the step portion 198 of the support cylinder 195, the lens housing 76 is fixed to the frame 6. That is, the lens housing 76 is installed on the frame 6 by inserting the insertion port 199 into the opening portion 190 on the side corresponding to the frame 6.

[0395] In a state where the lens housing 76 is attached to the frame 6, the bottom portion surface 195a of the lens housing 76 (which is the lower end surface of the insertion port 199 and is the lower open end surface of the support cylinder 195) faces the glass support surface 23 at the upper portion position. That is, the lens housing 76 is arranged so that the bottom surface 195a is located above and spaced apart from the bonding portion 182 on the glass support surface 23. Note that when fixing the support cylinder 195 to the step forming portion 181 of the frame 6, an adhesive or a fixing tool such as a bolt is appropriately used.

[0396] As described above, when the lens housing 76 is mounted on the image sensor unit 180A in a state where the cover glass 4 is removed, the step forming portion 181 provided on the frame 6 can be used as a fixing portion of the lens housing 76 relative to the frame 6 .

[0397] According to this configuration, for example, the lens housing 76 can be mounted in a portion on the package side where accuracy in adjustment with respect to the optical axis of the image sensor 2 can be relatively easily obtained, compared with a case where the lens housing 76 is mounted with respect to the setting substrate 18. As a result, the upper surface 188 of the step forming portion 181 can be used as a reference surface, for example, and the lens housing 76 can be accurately set with respect to the image sensor 2 without being affected by the inclination due to the solder connection with the setting substrate 18.

[0398] Furthermore, the frame 6 has an opening of the recess 60 at the glass support surface 23. According to this configuration, the tool 75 can easily act on the cover glass 4, and the cover glass 4 can be easily removed in a state where the adhesive strength of the bonding portion 182 is reduced.

[0399] It is to be noted that, in the solid-state imaging device 180, the frame 6 may not form the recess 60. When the recess 60 is not formed in the frame 6, the step forming portion 181 may be formed over the entire periphery so as to form a frame shape in a plan view without separating the step forming wall portion 183 on the left side. In this case, the gap 189 between the cover glass 4 and the left step forming the wall portion 183 may not be formed.

[0400] <13. Modification of Solid-State Imaging Device According to Fourth Embodiment>

[0401] A modification of the solid-state imaging device 1 according to the fourth embodiment of the present technology will be described.

[0402] (First Modification)

[0403] like Fig.39 As shown, in the solid-state imaging device 180 of the first modified example, the inner side surface 186 forming the gap 189 is an inclined surface, and the gap 189 is formed between the step forming wall portion 183 on the side (left side) of the frame 6 where the recessed portion 60 is formed and the cover glass 4. The inner side surface 186 is an inclined surface that descends from the outer side (left side) in the left-right direction toward the inner side (right side) in the left-right direction.

[0404] That is, Fig.39As shown, in the cross-sectional view, the inner surface 186 is inclined so that the step-forming wall portion 183 gradually tapers from the lower side to the upper side (the width becomes narrower). In this way, since the inner surface 186 is an inclined surface, the gap 189 is a space portion that gradually expands from the lower side toward the upper side. In the example shown, the inclination angle of the inner surface 186 relative to the up-down direction is about 15°. However, the size of the inclination of the inner surface 186 is not particularly limited.

[0405] In this way, the gap 189 can be formed by making the inner side surface 186 of the step forming wall portion 183 an inclined surface. The gap 189 enables the cover glass 4 to be smoothly lifted in the operation of removing the cover glass 4 using the tool 75 as described above. Fig.33 resemblance, Fig.39 For and along Fig.32 The diagram corresponds to a cross-sectional end view taken along line NN in FIG.

[0406] (Second Modification)

[0407] The solid-state imaging device 180 of the second to fifth modified examples has a configuration suitable in the case where a hot melt adhesive is used as an adhesive for forming the bonding portion 182. In the second modified example, the solid-state imaging device 180 includes a hot melt adhesive portion 182B formed of a hot melt adhesive as a bonding portion formed of an adhesive that fixes the cover glass 4 to the glass supporting surface 23.

[0408] like Figure 40 to Figure 42 As shown, in the second modification, a recessed portion 201 serving as a recessed portion for positioning the thermal fusion bonding portion 182B is formed on the glass supporting surface 23 .

[0409] The recessed portion 201 is a recessed portion which has a lateral cross-sectional shape substantially in the shape of the letter "U" and has an open side on the upper side and is linearly formed in each wall portion 20 in the extending direction in a plan view. The recessed portion 201 has four side portions 201a along the plan view shape of the glass support surface 23 and is formed in a frame shape in a plan view. However, a part of the recessed portion 201 may be formed intermittently with respect to the frame shape in a plan view, for example.

[0410] like Fig.41 As shown in FIG. 1 , the recessed portion 201 has a bottom surface 202, an outer surface 203 as a side surface on the outer peripheral side, and an inner surface 204 as a side surface on the inner peripheral side. The bottom surface 202 is a stepped surface parallel to the glass support surface 23. The space inside the recessed portion 201 is a space for applying the hot melt adhesive, that is, a space for forming the hot melt bonding portion 182B. By covering the recessed portion 201 with the glass cover 4 from above, a hollow portion in a passage shape is formed along the extended shape of the recessed portion 201.

[0411] The protective glass 4 is fixed to the frame 6 by the heat fusion bonding portion 182B formed in the recessed portion 201, wherein the lower surface 4b of the peripheral edge portion serves as an adhesive surface with the bottom surface 202 of the recessed portion 201. The heat fusion bonding portion 182B for fixing the protective glass cover 4 to the frame 6 is inserted between the bottom surface 202 of the recessed portion 201 and the lower surface 4b of the protective glass cover 4. By forming the heat fusion bonding portion 182B on the entire recessed portion 201, which is formed in a frame shape on the entire periphery, the space between the frame 6 and the glass cover 4 is hermetically sealed.

[0412] like Fig.41 As shown, in the structure in which the recessed portion 201 is formed on the glass support surface 23, the wall portion 205 is formed on the inner peripheral side of the step portion 185. In addition, in the structure in which the recessed portion 201 is formed, the glass support surface 23 is divided into an outer peripheral support surface 23a of the outer peripheral side of the recessed portion 201 and an inner peripheral support surface 23b of the inner peripheral side of the recessed portion 201. At least one of the outer peripheral support surface 23a, the inner peripheral support surface 23b and the bottom surface 202 of the recessed portion 201 becomes a support surface for supporting the glass cover 4. The bottom surface 202 supports the glass cover 4 through the thermal fusion bonding portion 182B. The inner peripheral support surface 23b is the upper surface of the wall portion 205. In the wall portion 205, the surface opposite to the inner side surface 204 of the recessed portion 201 is the upper edge portion of the inner wall surface 21 of the wall portion 20.

[0413] exist Fig.41 In the example shown, the gap 210 exists between the lower surface 4b of the cover glass 4 and the glass support surface 23, but the gap 210 does not necessarily exist. The presence or absence of the gap 210 is related to the amount of adhesive forming the heat fusion bonding portion 182B, the size and depth of the recessed portion 201, and the like. When there is no gap 210, the cover glass 4 is supported by the frame 6 in a state of contacting the outer peripheral support surface 23a and the inner peripheral support surface 23b. In this case, in the case where the heights of the outer peripheral support surface 23a and the inner peripheral support surface 23b are different, the cover glass 4 is in contact with the support surface of the higher one of the outer peripheral support surface 23a and the inner peripheral support surface 23b.

[0414] Will refer to Fig.42 A method for manufacturing the configuration of the second modification is described. With respect to the structure of the second modification, the frame 6 having the step forming portion 181 and the recessed portion 201 is manufactured by injection molding, for example, using a mold such as a transfer mold. With respect to the frame 6, for example, when the frame 6 is a frame including resin, a frame assembly in an assembled state in which a plurality of frame elements to be the frame 6 are connected is integrally molded by a mold, and the frame assembly is divided into separate pieces for each frame element, thereby manufacturing the frame 6.

[0415] like Fig.42As shown in FIG. 1A , the frame 6 is fixed to the substrate 5 subjected to the chip bonding step of the image sensor 2 and the wire bonding step of the lead 10 using an adhesive 211 such as an epoxy resin adhesive. The adhesive 211 is applied in a frame shape with the outer shape of the substrate 5 on the surface 5a corresponding to the shape of the frame 6 in a plan view. Note that the adhesive 211 may be applied to the frame 6.

[0416] After the frame mounting step of providing the frame 6 on the substrate 5, the step of attaching the cover glass 4 to the frame 6 is performed. In the step of attaching the cover glass 4, as shown in FIG. Fig.42 As shown in FIG. 1B, a hot melt bonding portion 182B is formed in the recessed portion 201 of the frame 6. The hot melt bonding portion 182B is formed by, for example, applying a hot melt adhesive to the recessed portion 201 over the entire circumference using a hot melt dispenser. As the hot melt adhesive, for example, a material that melts at a reflow temperature (for example, about 260° C.) when the solid-state imaging device 180 is reflow mounted on the setting substrate 18 is used (see Fig.37 A).

[0417] The heat fusion bonding portion 182B may be partially formed with respect to the recessed portion 201 having a frame shape in a plan view. The heat fusion bonding portion 182B may be formed, for example, only at four corner portions of the frame-shaped recessed portion 201, or may be formed with respect to a pair of opposing side surface portions 201a among four side surface portions 201a of the recessed portion 201.

[0418] After applying the hot melt adhesive into the recessed portion 201, the cover glass 4 is mounted to the opening portion 190 formed by the step forming portion 181 by a mounter or the like, and the cover glass 4 is fixed by the heat fusion bonding portion 182B. As described above, the solid-state imaging device 180 in which the cover glass 4 is fixed to the frame 6 by the heat fusion bonding portion 182B is obtained.

[0419] When the cover glass 4 is removed, the heat fusion bonding part 182B is heated to a predetermined temperature to convert the heat fusion bonding part 182B into a liquid. The cover glass 4 is removed from the frame 6 in a state where the heat fusion bonding part 182B is in a liquid state. For example, as described above, the cover glass 4 is removed by utilizing the lever principle with the tool 75, or by causing a predetermined jig or device to be adsorbed to the upper surface 4a of the cover glass 4 and pulling up the cover glass 4.

[0420] According to the configuration of the second modification, since the frame 6 has the recessed portion 201 as a forming space of the engaging portion for fixing the cover glass 4, in the step of forming the heat fusion bonding portion 182B, during the reflow mounting of the solid-state imaging device 180, or when the cover glass 4 is removed, it is possible to suppress the molten heat fusion material from protruding from the glass supporting surface 23. Furthermore, since the frame 6 has the step forming portion 181 that restricts the movement of the cover glass 4 on the glass supporting surface 23, it is possible to prevent the cover glass 4 from being displaced in the lateral direction in a state where the heat fusion bonding portion 182B is melted due to the flow of the heat fusion bonding portion 182B or the like.

[0421] Furthermore, by providing the hot melt bonding portion 182B along the entire periphery of the frame shape of the frame 6, the airtightness of the cavity 8 can be ensured, and the reduction in reliability due to moisture absorption and dust intrusion into the cavity 8 can be suppressed. Furthermore, since moisture absorption in the cavity 8 can be suppressed, an increase in the internal partial pressure of the cavity 8 during reflow or the like can be suppressed.

[0422] (Variant 3)

[0423] The third modification is a modification of the recessed portion 201 formed on the frame 6 for arranging the heat fusion bonding portion 182B. Fig.43 As shown, in the configuration of the third modification, the recessed portion 201 in which the thermal fusion bonding portion 182B is positioned is formed by a concave curved surface 206 having a curved shape in a side sectional view of the solid-state imaging device 180 .

[0424] exist Fig.43 In the example shown in , the concave curved surface 206 has a substantially semi-elliptical shape in a side surface cross-sectional view and is substantially symmetrically formed. In the structure of the third modified example, the wall portion 205 forming the inner peripheral support surface 23b is formed on the inner peripheral side of the concave curved surface 206. At least one of the outer peripheral support surface 23a, the inner peripheral support surface 23b, and the concave curved surface 206 of the recessed portion 201 becomes a support surface for supporting the glass cover 4. The concave curved surface 206 supports the glass cover 4 through the thermal fusion bonding portion 182B.

[0425] As described above, the groove shape (cross-sectional shape) of the recessed portion 201 may be a curved shape or the like, and the groove shape of the recessed portion 201 is not particularly limited. However, from the viewpoint of manufacturing the frame 6 by injection molding using a mold, the groove shape of the groove recessed portion 201 is preferably a shape (negative angle portion) that does not have a portion that forms an angle less than perpendicular to the moving direction of the mold.

[0426] (Variant 4)

[0427] like Fig.44As shown in FIG. 1 , in the fourth modified example, the recessed portion 201 is not formed on the side of the frame 6 corresponding to the glass support surface 23, and a recessed portion 221 is formed as a recessed portion for positioning the heat fusion bonding portion 182B on the lower surface 4b of the glass cover 4 that is opposite to the glass support surface 23. That is, the recessed portion 221 is formed on the outer peripheral edge portion of the lower surface 4b of the glass cover 4, which is the portion facing the glass support surface 23. The recessed portion 221 forms a frame shape along the outer shape of the glass cover 4. However, for example, the recessed portion 221 may be partially formed in an intermittent manner with respect to the frame shape.

[0428] exist Fig.44 In the example shown, the recessed portion 221 is formed by a concave curved surface 222 having a curved shape in a side sectional view of the solid-state imaging device 180. The concave curved surface 222 has a substantially semi-elliptical shape in a side sectional view and is formed substantially symmetrically. For example, the recessed portion 221 may be a concave portion having a lateral cross-sectional shape substantially having the shape of the letter "U" and having an open side on the lower side, and the recessed shape (cross-sectional shape) of the recessed portion 221 is not particularly limited. By covering the recessed portion 221 with the glass support surface 23 from below, a passage-shaped hollow portion is formed along the extended shape of the recessed portion 221.

[0429] In the structure in which the recessed portion 221 is formed on the glass cover 4, the lower surface 4b of the glass cover 4 is separated into an outer surface portion 4j of the outer portion of the recessed portion 221 and an inner surface portion 4k of the inner portion of the recessed portion 221. At least one of the outer surface portion 4j, the inner surface portion 4k and the concave curved surface 222 of the recessed portion 221 is a surface supported by the glass supporting surface 23. The concave curved surface 222 is supported by the glass supporting surface 23 via the heat fusion bonding portion 182B.

[0430] As described above, the shape portion forming the arrangement space of the heat fusion bonding portion 182B may be formed on the side corresponding to the cover glass 4. For example, the recessed portion 221 is formed by cutting or etching the cover glass 4 with a cutting blade or the like. According to the structure of the fourth modification, the cover glass 4 can be easily removed from the frame 6 by heating the heat fusion bonding portion 182B to melt it.

[0431] (Variant 5)

[0432] In the fifth modification, the shape portion of the arrangement space of the heat fusion bonding portion 182B is formed on both the side surface corresponding to the frame 6 and the side surface corresponding to the glass cover 4. Fig.45 As shown, recessed portions 201 and 221 (in which the heat fusion bonding portion 182B is positioned) are formed on the glass supporting surface 23 of the frame 6 and the lower surface 4 b of the glass cover 4 .

[0433] exist Fig.45In the example shown in FIG. 1 , the recessed portion 201 on the side surface corresponding to the frame 6 and the recessed portion 221 on the side surface corresponding to the glass cover 4 are formed to be substantially vertically symmetrical. The upper groove recessed portion 201 and the lower groove recessed portion 221 form a passage-shaped hollow portion that follows the extended shape of these groove recessed portions and has a horizontally long substantially elliptical cross-sectional shape.

[0434] As described above, the shape portion forming the arrangement space of the heat fusion bonding portion 182B may be formed on the side surface corresponding to the frame 6 and the side surface corresponding to the cover glass 4. That is, the shape portion forming the arrangement space of the heat fusion bonding portion 182B is formed on at least one of the glass supporting surface 23 of the frame 6 and the lower surface 4b of the cover glass 4.

[0435] According to the structure of the fifth modification, it is easy to ensure the volume of the space for arranging the heat fusion bonding portion 182B, compared with the structure in which the recessed portions 201, 221 are formed on one of the frame 6 and the cover glass 4. Note that the recessed portion 201 on the side surface corresponding to the frame 6 and the recessed portion 221 on the side surface corresponding to the cover glass 4 may have different shapes, and the shape of each recessed portion, the positional relationship between the recessed portions, etc. are not particularly limited.

[0436] <14. Configuration Example of Solid-State Imaging Device According to Fifth Embodiment>

[0437] Reference Fig.46 A configuration example of a solid-state imaging device 230 according to a fifth embodiment of the present technology is described. In the solid-state imaging device 230 according to the present embodiment, the frame 6 supporting the cover glass 4 is detachably provided relative to the substrate 5. That is, regarding the fixing structure of the frame 6 relative to the substrate 5, the solid-state imaging device 230 includes a frame holding portion that detachably holds the frame 6 relative to the substrate 5.

[0438] In the solid-state imaging device 230, the cover glass 4 is fixed to the glass support surface 23 of the frame 6. The cover glass 4 is fixed to the frame 6 by an adhesive including, for example, a light-curing resin such as a thermosetting resin or an ultraviolet (UV) curing resin, wherein the lower surface 4b of the peripheral edge portion serves as a bonding surface with the glass support surface 23.

[0439] The solid-state imaging device 230 includes a step forming portion 231 as a frame holding portion, the step forming portion 231 being provided below the frame main body portion 26 , and a bonding portion 232 interposed between the frame main body portion 26 and the substrate 5 .

[0440] The step forming portion 231 is a portion formed as a part of the frame 6 and is provided as a protrusion extending downward from the lower surface 24 of the frame body portion 26. The step forming portion 231 is a portion that forms a step portion 235 relative to the lower surface 24 of the frame body portion 26 and contacts the side surface 5 c of the substrate 5 to restrict movement of the substrate 5 relative to the frame 6.

[0441] The step forming portion 231 is a wall-like portion formed along the frame shape of the frame main body portion 26 substantially over the entire circumference in a bottom view relative to the frame main body portion 26 configured in a frame shape by four wall portions 20. Therefore, the step forming portion 231 includes four step forming wall portions 233 formed on the lower side of each wall portion 20, and these step forming wall portions 233 form a frame shape in a bottom view.

[0442] The step forming portion 231 is provided on the lower side of the wall portion 20 so that the step forming wall portion 233 is located on the outer side in the wall thickness direction of the wall portion 20 (corresponding to the side of the outer wall surface 22), and forms a step portion 235 together with the lower surface 24. The step forming portion 231 includes an inner side surface 236, which is the inner wall surface of the step forming wall portion 233 and serves as a contact surface with the side surface 5c of the substrate 5, an outer side surface 237, and a horizontal lower surface 238, the inner side surface 236 is the inner wall surface of the step forming wall portion 233 and serves as a contact surface with the side surface 5c of the substrate 5, and the outer side surface 237 is the wall surface opposite to the inner side surface 236. The step forming portion 231 is formed so that the outer side surface 237 is located on the same plane as the outer side wall surface 22 of the wall portion 20.

[0443] The step forming wall portion 233 is provided at each wall portion 20 over the entire range in the extending direction of the wall portion 20 in a bottom view. However, the step forming wall portion 183 may be provided partially on the corresponding wall portion 20 or at a plurality of positions along the extending direction of the wall portion 20.

[0444] In the step forming portion 231, the lower surface 238 of each step forming wall portion 233 is a step surface lower than the lower surface 24 of the frame body portion 26. At the step portion 235, the inner side surface 236 is located at the outer portion of the inner wall surface 21 of the wall portion 20 and is formed as a surface parallel to the inner wall surface 21. Fig.46 In the example shown, the step forming the wall portion 233 has a wall thickness of about 1 / 2 of the wall thickness of the wall portion 20. However, the dimension of the wall thickness of the step forming wall portion 233 is not particularly limited.

[0445] The step forming portion 231 has a rectangular opening portion 240 formed by four step forming wall portions 233, and the rectangular opening portion 240 opens downward corresponding to the outer shape of the substrate 5. The opening portion 240 has an opening size that is substantially the same as or slightly larger than the outer size of the substrate 5 when viewed from above. The step forming portion 231 restricts the relative movement of the frame 6 relative to the substrate 5 in the horizontal direction by contacting the side surface 5c of the substrate 5 at the inner side surface 236 when the substrate 5 is assembled in the opening portion 240. When the substrate 5 is assembled in the opening portion 240, the four side surfaces 5c are contact surfaces or opposing surfaces with respect to the inner side surfaces 236 of the step forming wall portions 233. As described above, the step forming portion 231 is a portion where the step portion 235 for preventing the substrate 5 from being displaced laterally relative to the frame 6 is formed, and serves as a portion for positioning the substrate 5 relative to the frame main body portion 26.

[0446] In the example shown in the figure, the vertical dimension of the step forming portion 231 is smaller than the plate thickness of the substrate 5. However, the vertical dimension of the step forming portion 231 may be substantially the same as the plate thickness of the substrate 5 or may be larger than the plate thickness of the substrate 5.

[0447] The bonding portion 232 is a portion including an adhesive for fixing the frame main body portion 26 to the substrate 5. As an adhesive forming the bonding portion 232, a pressure-sensitive adhesive that performs temporary bonding is used. The bonding portion 232 is a peeling material that changes its state when receiving external partial energy, for example, and thus has peelability, thereby easily separating the cover glass 4 from the frame 6. Since the material of the bonding portion 232 is similar to that of the bonding portion 182 according to the fourth embodiment, its description will be omitted.

[0448] The bonding portion 232 is interposed between the lower surface 24 of the frame-shaped main body portion 126 and the peripheral portion of the surface 5a of the substrate 5, and joins these surfaces. The bonding portion 232 is formed to completely cover the lower surface 24, which is a portion of the inner portion of the step-forming wall portion 233 on the lower side of the wall portion 20, by applying a pressure-sensitive adhesive to the lower surface 24. Therefore, the bonding portion 232 has four side portions 232a of a frame shape along the lower surface 24 in a bottom view.

[0449] Note that the mode of applying the pressure-sensitive adhesive to the lower surface 24 of the frame-shaped main body portion 126 (i.e., the mode of forming the bonding portion 232) is not particularly limited. The pressure-sensitive adhesive may be applied to the lower surface 24, for example, linearly in a discontinuous manner in the extension direction of the lower surface 24 in each wall portion 20, may be applied to multiple parallel lines, or may be applied to multiple positions in a dotted line manner. In addition, the coating amount and coating area of ​​the pressure-sensitive adhesive are set according to the size of the substrate 5, etc., so that the required holding force (adhesive strength) of the substrate 5 can be ensured.

[0450] <15. Method for Manufacturing Solid-State Imaging Device According to Fifth Embodiment>

[0451] Will refer to Fig.47 An example of a method for manufacturing the solid-state imaging device 230 according to the fifth embodiment of the present technology is described.

[0452] like Fig.47 As shown in FIG. 1A , in the method for manufacturing a solid-state imaging device 230, a step of manufacturing a frame having glass 246 by fixing a cover glass 4 to a glass support surface 23 of a frame 6 is performed. The frame 6 having a step forming portion 231 is manufactured by injection molding using a mold such as a transfer mold. The cover glass 4 is fixed to the glass support surface 23 by an adhesive to close the entire opening portion 25 of the frame 6.

[0453] Next, if Fig.47 As shown in FIG. 2B , a step of forming a bonding portion 232 on the lower surface 24 of the frame 6 is performed. The bonding portion 232 is a peeling layer formed between the lower surface 24 and the substrate 5, and is provided for the purpose of separating the frame 6 from the substrate 5. The bonding portion 232 is formed by applying a pressure-sensitive adhesive for forming the bonding portion 232 to the lower surface 24 using a dispenser or the like. The bonding portion 232 can be formed by attaching a sheet-like member such as a peeling tape to the lower surface 24.

[0454] On the other hand, as a configuration in which a frame with the glass 246 is attached, a sensor mounting substrate having a configuration in which a step of chip-bonding the image sensor 2 to the substrate 5 and a step of wire-bonding of the leads 10 are performed is manufactured.

[0455] Then, if Fig.47 As shown in FIG. 2C , for example, the substrate 5 is mounted to the opening portion 240 formed by the step forming portion 231 using a chip mounter or the like, and the frame 6 is fixed to the surface 5a of the substrate 5 by the bonding portion 232. Here, depending on the characteristics of the bonding portion 232, a treatment process for curing the bonding portion 232, such as light irradiation or heating, is performed.

[0456] By attaching the frame with the glass 246 as described above, the solid-state imaging device 230 is obtained. In the solid-state imaging device 230, the frame 246 with glass is in a state where the frame 246 with glass is temporarily fixed to the substrate 5 in a sense by the bonding portion 232 including a pressure-sensitive adhesive of a type that is easily peeled off by heat, UV, stress, etc. Note that when the frame 246 with glass is attached to the substrate 5, the bonding portion 232 may be formed on the side corresponding to the substrate 5. In addition, a step of fixing the cover glass 4 to the frame 6 after fixing the frame 6 to the substrate 5 may be performed.

[0457] In the solid-state imaging device 230 according to the present embodiment, as the cover glass 4 is removed, the frame with the glass 246 is removed from the substrate 5. When the frame with the glass 246 is removed, the bonding portion 232 is irradiated or heated by light of a predetermined wavelength such as UV light, for example, so that the bonding portion 232 enters a state where the adhesive strength is reduced, that is, a state where it is easy to peel off. Then, in a state where the adhesive strength of the bonding portion 232 is reduced, the frame with the glass 246 is removed from the substrate 5. By removing the frame with the glass 246 from the solid-state imaging device 230, a sensor mounting substrate is obtained. Note that in a state where the frame with the glass 246 is removed, a portion of the bonding portion 232 remains on at least one of the lower surface 24 of the frame 6 and the peripheral portion of the surface 5a of the substrate 5.

[0458] According to the solid-state imaging device 230 according to the present embodiment as described above, the cover glass 4 can be easily attached and detached together with the frame 6 as a frame with the glass 246. Specifically, the solid-state imaging device 230 of the present embodiment includes: a step forming portion 231 that restricts the movement of the frame 6 relative to the substrate 5; and a bonding portion 232 that fixes the frame 6 to the substrate 5. According to this configuration, it is possible to obtain a configuration in which the cover glass 4 can be easily removed without making the shape of the frame 6 complicated.

[0459] <16. Modification of Solid-State Imaging Device According to Fifth Embodiment>

[0460] A modification of the solid-state imaging device 230 according to the fifth embodiment of the present technology will be described. The solid-state imaging device 230 of the modification described below has a configuration suitable for a case where a hot melt adhesive is used as an adhesive for forming the bonding portion 232. In the modification according to the fifth embodiment, the solid-state imaging device 230 includes a hot melt bonding portion 232B including a hot melt adhesive as a bonding portion including an adhesive for fixing the frame main body portion 26 to the substrate 5.

[0461] (First Modification)

[0462] like Fig.48 and Fig.49 As shown, in the first modification, a recessed portion 251 serving as a recessed portion for positioning the thermal fusion bonding portion 232B is formed on the lower surface 24 of the frame body portion 26 .

[0463] The recessed portion 251 is a concave portion having a lateral cross-sectional shape that is substantially in the shape of the letter "U" and having an open side on the lower side, and is linearly formed in each wall portion 20 along the extension direction in a bottom view. The recessed portion 251 has four side portions in a bottom-view shape along the lower surface 24, and is formed in a frame shape in a bottom view. However, a portion of the recessed portion 251 may be formed intermittently with respect to the frame shape in a top view, for example.

[0464] like Fig.49 As shown, the recessed portion 251 has an upper surface 252 as the bottom surface of the recessed portion, an outer surface 253 as the side surface on the outer peripheral side, and an inner surface 254 as the side surface on the inner peripheral side. The upper surface 252 is a stepped surface parallel to the lower surface 24. The space inside the recessed portion 251 is a space for applying the hot melt adhesive, that is, a space for forming the hot melt bonding portion 232B. By covering the recessed portion 251 with the substrate 5 from below, a passage-shaped hollow portion is formed along the extended shape of the recessed portion 251.

[0465] The substrate 5 is fixed to the frame 6 by the heat fusion bonding portion 232B formed in the recessed portion 251 with the surface 5a of the peripheral portion as a bonding surface to the upper surface 252 of the recessed portion 251. The heat fusion bonding portion 232B for fixing the frame 6 to the substrate 5 is interposed between the upper surface 252 of the recessed portion 251 and the surface 5a of the substrate 5. By forming the heat fusion bonding portion 182B over the entire recessed portion 251, the space between the substrate 5 and the frame 6 is hermetically sealed, and the recessed portion 251 is formed in a frame shape over the entire periphery.

[0466] like Fig.49 As shown, in the configuration in which the recessed portion 251 is formed in the lower surface 24 of the frame main body portion 26, the wall portion 255 is formed on the inner peripheral side of the step portion 235. In addition, in the structure in which the recessed portion 251 is formed, the lower surface 24 is divided into a part of the outer peripheral side of the recessed portion 251, that is, an outer peripheral lower surface 24a, and a part of the inner peripheral side of the recessed portion 251, that is, an inner peripheral lower surface 24b. At least one of the outer peripheral lower surface 24a, the inner peripheral lower surface 24b, and the upper surface 252 of the recessed portion 251 is a surface supported by the substrate 5. The upper surface 252 is supported by the substrate 5 through the hot melt bonding portion 232B. The inner peripheral lower surface 24b is the lower surface of the wall portion 255. In the wall portion 255, the surface opposite to the inner side surface 254 of the recessed portion 251 is the lower edge portion of the inner wall surface 21 of the wall portion 20.

[0467] exist Fig.49 In the example shown, the gap 260 exists between the surface 5a of the substrate 5 and the lower surface 24 of the frame body portion 26, but the gap 260 does not necessarily exist. The presence or absence of the gap 260 is related to the amount of adhesive forming the hot melt bonding portion 232B, the size and depth of the recessed portion 251, etc. When there is no gap 260, the substrate 5 supports the frame 6 in a state of contacting the outer peripheral lower surface 24a and the inner peripheral lower surface 24b. In this case, when the heights of the outer peripheral lower surface 24a and the inner peripheral lower surface 24b are different from each other, the substrate 5 contacts the lower surface of the outer peripheral lower surface 24a and the inner peripheral lower surface 24b.

[0468] According to the structure of the first modified example, since the recessed portion 251 is provided as a space for forming a joint portion for fixing the frame 6 to the substrate 5, it is possible to suppress the molten hot melt material from protruding from the lower surface 24 of the frame main body 26 in the process of forming the hot melt bonding portion 232B, at the time of reflow mounting of the solid-state imaging device 230, or at the time of removing the frame with the glass 246. In addition, since the frame 6 has the step forming portion 231 for limiting the relative movement with respect to the substrate 5, it is possible to prevent the frame 6 from being displaced laterally due to the flow of the hot melt bonding portion 232B in a state where the hot melt bonding portion 232B is melted.

[0469] In addition, by providing the hot melt bonding portion 232B along the entire periphery of the frame shape of the frame 6, the airtightness of the cavity 8 can be ensured, and the reduction in reliability due to moisture absorption and dust intrusion into the cavity 8 can be suppressed. In addition, since moisture absorption in the cavity 8 can be suppressed, the increase in the internal partial pressure of the cavity 8 during reflow, etc. can be suppressed.

[0470] (Second Modification)

[0471] The second modification is a modification of the recessed portion 251 formed on the frame 6 for arranging the heat fusion bonding portion 232B. Fig.50 As shown, in the configuration of the second modification, the recessed portion 251 in which the thermal fusion bonding portion 232B is located is formed by a concave curved surface 256 having a curved shape in a side sectional view of the solid-state imaging device 230 .

[0472] exist Fig.50 In the example shown, the concave curved surface 256 has a substantially semi-elliptical shape in a side surface cross-sectional view and is formed substantially symmetrically. In the structure of the second modified example, the wall portion 255 forming the inner peripheral lower surface 24b is formed on the inner peripheral side of the concave curved surface 256. At least one of the outer peripheral lower surface 24a, the inner peripheral lower surface 24b and the concave curved surface 256 of the recessed portion 251 is a surface supported by the substrate 5. The concave curved surface 256 is received by the substrate 5 through the heat fusion bonding portion 232B.

[0473] As described above, the groove shape (cross-sectional shape) of the recessed portion 251 may be a curved shape or the like, and the groove shape of the recessed portion 251 is not particularly limited.

[0474] (Variant 3)

[0475] like Fig.51As shown, in the third modification, the recessed portion 251 is not formed on the side corresponding to the lower surface 24 of the frame main body portion 26, and a recessed portion 271 as a recessed portion for positioning the heat fusion bonding portion 232B is formed in the surface 5a, which is the upper surface of the substrate 5 facing the lower surface 24. That is, the groove recessed portion 271 is formed in the outer peripheral edge portion of the surface 5a of the substrate 5, which is the portion facing the lower surface 24 of the frame main body portion 26. The recessed portion 271 is formed in a frame shape along the outer shape of the substrate 5. However, for example, the recessed portion 271 may be partially formed in an intermittent manner relative to the frame shape.

[0476] exist Fig.51 In the example shown, in the side sectional view of the solid-state imaging device 230, the recessed portion 271 is formed by a concave curved surface 272 having a curved shape. The concave curved surface 272 has a substantially semi-elliptical shape in the side sectional view and is formed substantially symmetrically. It should be noted that, for example, the recessed portion 271 may be a recess having a transverse cross-sectional shape substantially in the shape of the letter "U" and having an open side on the upper side, and the recessed portion shape (transverse cross-sectional shape) of the recessed portion 271 is not particularly limited. The groove recessed portion 271 is covered by the lower surface 24 of the frame main body portion 26 from the upper side, so that a passage-shaped hollow portion is formed along the extended shape of the groove recessed portion 271.

[0477] In the structure in which the recessed portion 271 is formed on the substrate 5, the surface 5a of the substrate 5 is divided into an outer surface portion 5d of the outer portion of the recessed portion 271 and an inner surface portion 5e of the inner portion of the recessed portion 271. At least one of the outer surface portion 5d, the inner surface portion 5e and the concave curved surface 272 of the recessed portion 271 is a surface that supports the lower surface 24 of the frame body portion 26. The concave curved surface 272 supports the lower surface 24 through the heat fusion bonding portion 232B.

[0478] As described above, the shape portion of the arrangement space forming the heat-melt bonding portion 232B can be formed on the side surface corresponding to the substrate 5. The recessed portion 271 of the substrate 5 can be formed by a well-known method. For example, in the case where the substrate 5 is a ceramic substrate of a multilayer structure in which sheet-like parts composed of ceramic materials or the like are stacked, by forming a through opening portion that penetrates each sheet-like part and is stacked as a portion for forming the recessed portion 271, the recessed portion 271 can be formed on the side corresponding to the surface 5a of the substrate 5 in the stacked state. In addition, the groove recessed portion 271 can be formed by a processing device for the substrate 5 (such as a drill). In the third variant, by heating the heat-melt bonding portion 232B and melting the heat-melt bonding portion 232B, the frame 246 with glass can also be easily removed from the substrate 5.

[0479] (Variant 4)

[0480] In the fourth modification, a portion of the shape forming the arrangement space of the heat-melting bonding portion 232B is formed on the side corresponding to the frame 6 and the side corresponding to the substrate 5. Fig.52 As shown, recessed portions 251 , 271 in which the heat fusion bonding portion 232B is positioned are formed on the lower surface 24 of the frame body portion 26 and the surface 5 a of the substrate 5 .

[0481] exist Fig.52 In the example shown, the recessed portion 251 corresponding to the side of the frame 6 and the recessed portion 271 corresponding to the side of the substrate 5 are formed to be substantially vertically symmetrical. The upper groove recessed portion 251 and the lower groove recessed portion 271 form a hollow portion of a passage shape following the extended shape of these groove recessed portions, and have a horizontally long substantially elliptical cross-sectional shape.

[0482] As described above, the shape portion forming the arrangement space of the heat fusion bonding portion 232B may be formed on the side surface corresponding to the frame 6 and the side surface corresponding to the substrate 5. That is, the shape portion forming the arrangement space of the heat fusion bonding portion 232B is formed in at least one of the lower surface 24 corresponding to the frame 6 side and the surface 5a of the substrate 5.

[0483] According to the structure of the fourth modification, the volume of the space for arranging the heat fusion bonding portion 232B can be easily ensured compared with the structure in which the recessed portions 251 and 271 are formed in any one of the frame 6 and the substrate 5. Note that the recessed portion 251 on the side corresponding to the frame 6 and the recessed portion 271 on the side corresponding to the substrate 5 may have different shapes, and the shape of each recessed portion, the positional relationship between the recessed portions, etc. are not particularly limited.

[0484] <17. Configuration Example of Solid-State Imaging Device According to Sixth Embodiment>

[0485] Reference Figure 53 to Figure 57 A configuration example of a solid-state imaging device 280 according to a sixth embodiment of the present technology is described. The solid-state imaging device 280 according to the present embodiment is different from the solid-state imaging device 230 according to the fifth embodiment in the configuration of a frame holding portion that detachably holds the frame 6 relative to the substrate 5.

[0486] like Figure 53 to Figure 57 As shown, the solid-state imaging device 280 includes a hook portion 281 as a frame holding portion, which is an engagement portion provided on the lower side of the frame main body portion 26 and fixes the frame 6 to the substrate 5 by engaging with the substrate 5. Each hook portion 281 is a portion formed as a part of the frame 6 and a holding protrusion portion provided as a protrusion extending downward from the lower surface 24 of the frame main body portion 26.

[0487] The hook portion 281 is provided on the lower side of each wall portion 20 forming the frame body portion 26 at the central portion of the wall portion 20 in the extending direction. Therefore, in the frame 6, the hook portion 281 is provided at a total of four positions, one position for each wall portion 20. The hook portions 281 provided on the wall portions 20 opposite to each other are provided at positions opposite to each other. However, the hook portions 281 provided on the wall portions 20 opposite to each other may be provided at different positions in the extending direction of the wall portion 20.

[0488] The hook portion 281 is provided on the outer side (corresponding to the side of the outer wall surface 22) of each wall portion 20 in the wall thickness direction of the wall portion 20. The hook portion 281 includes a support column 291 protruding from the lower surface 24 of the frame body portion 26 and a retaining protrusion 292 protruding from the inner side of the support column 291. Here, the inner side of the support column 291 is located on the center side of the substrate 5 when viewed from above, and the hook portions 281 provided on the facing wall portions 20 are provided so that the protruding directions of the pressing protrusions 292 are opposite to each other.

[0489] The support column 291 is a wall-shaped portion having a thickness direction in the wall thickness direction of the wall portion 20, and includes an inner side surface 293 (which is an inner wall surface), an outer side surface 294 (which is a wall surface opposite to the inner side surface 29), and a horizontal lower surface 295 (see FIG. Fig.55 The hook portion 281 is formed so that the outer side surface 294 is located on the same plane as the outer wall surface 22 of the wall portion 20. Moreover, the hook portion 281 has side end surfaces 296 on both sides of the extension direction of the wall portion 20, and is formed to have a uniform cross-sectional shape in the entire extension direction of the wall portion 20.

[0490] The hook portion 281 is formed so that the dimension in the vertical direction is substantially the same as or substantially the same as the plate thickness dimension of the substrate 5. Therefore, the lower surface 295 of the hook portion 281 is located on a substantially the same plane as or on the same plane as the back surface 5b of the substrate 5. In the hook portion 281, the inner side surface 293 is located outside the inner wall surface 21 of the wall portion 20 and is formed as a surface parallel to the inner wall surface 21. Fig.55 In the example shown, the thickness dimension of the support column 291 is about 1 / 6 of the wall thickness of the wall portion 20. However, the thickness dimension of the support column 291 is not particularly limited.

[0491] The pressing protrusion 292 is formed at the middle portion of the support column 291 in the up-down direction. The pressing protrusion 292 includes: an upper inclined surface 297, which is inclined downward from the outside to the inside in the wall thickness direction of the wall portion 20; and a lower inclined surface 298, which is inclined from the outside to the inside in the wall thickness direction of the wall portion 20 in the direction from the lower side to the upper side (see Fig.55 ).

[0492] The pressing protrusion 292 has a peak shape with the peak side located on the inner side formed by the upper inclined surface 297 and the lower inclined surface 298 in the side view. The upper inclined surface 297 and the lower inclined surface 298 form a ridge portion 299 as an end portion of the protruding side of the pressing protrusion 292 in the extending direction of the wall portion 20 in the bottom view. Fig.55 In the example shown, the upper inclined surface 297 and the lower inclined surface 298 are formed to be vertically symmetrical in a side view, and are formed so that the angle formed in the side view is about 80°. In addition, there is no limitation on the angle of the upper inclined surface 297 and the lower inclined surface 298 when viewed from the side.

[0493] On the side corresponding to the substrate 5, an engaging recess 301 is formed as an engaging portion to be engaged by each hook portion 281. The engaging recess 301 is formed at the center in the longitudinal direction of the four side surfaces 5c of the substrate 5 so as to correspond to the arrangement of the four hook portions 281. The engaging portion of the hook portion 281 with respect to the engaging recess 301 is an engaging fixing portion 300 between the substrate 5 and the frame 6. The solid-state imaging device 280 has four engaging fixing portions 300.

[0494] The engaging recess 301 is formed so that the outer side surface 294 of the hook portion 281 is flush with the side surface 5c of the substrate 5 in the state of engaging the hook portion 281. The engaging recess 301 is a cutout recess formed by side surfaces 302, 302 opposite to each other and an engaging face portion 303 located on the inner side, and has an open side on the outer side in a plan view, and the hook portion 281 is fitted in the recess.

[0495] In the bonding surface portion 303, a recessed portion 305 is formed, which is a recessed portion that is engaged with the pressing protrusion 292. The recessed portion 305 is formed in the bonding surface portion 303 in the lateral direction in the middle portion in the up-down direction. The recessed portion 305 is a portion in which a recessed portion having an opening side is formed on the outside in the side cross-sectional view of the substrate 5, and is formed by a surface on the deep side of the concave shape of the recessed portion 305, that is, an inner surface, that is, an inner side surface 305a, and an upper surface 305b and a lower surface 305c that are opposite in the up-down direction (refer to Fig.55 ).

[0496] The frame 6 is fixed to the substrate 5 in a manner of being sandwiched between two sets of opposite hook portions 281. The hook portions 281 are fitted into the recesses of the engaging recesses 301 so that the outer side surfaces 294 are flush with the side surfaces 5c of the substrate 5, and the retaining protrusions 292 are engaged in the recess portions 305 so that the hook portions 281 are engaged with the engaging recesses 301. The hook portions 281 opposite to each other are arranged so that the dimension between the inner side surfaces 293 opposite to each other is slightly larger than or substantially equal to the dimension between the engaging surface portions 303 of the engaging recesses 301 located on the opposite sides of the substrate 5. Fig.55In the illustrated example, the hook portion 281 is engaged with the engagement recess 301 in a state in which a substantially half portion of the retaining protrusion 292 on the side corresponding to the ridge portion 299 is located in the recess 305 .

[0497] Note that the hook 281 and the engaging recess 301 may be formed so that the entire pressing protrusion 292 is positioned in the recess 305 in the engaged state. In addition, the engaging shape of the hook 281 and the engaging recess 301 is not particularly limited. For example, the engaging recess 301 may have a V-shaped recess corresponding to the peak shape of the pressing protrusion 292 as a portion engaging with the pressing protrusion 292 of the hook 281.

[0498] The engaging recess 301 is formed in a range corresponding to at least the forming portion of the hook 281 in the longitudinal direction of each side surface 5c of the substrate 5. The dimension between the side surfaces 302 of the engaging recess 301 is substantially the same as the dimension between the side end surfaces 296 of the hook 281, so that the hook 281 can be positioned relative to the corresponding engaging recess 301 in the longitudinal direction of the side surface 5c of the substrate 5, and the function of positioning the frame 6 relative to the substrate 5 can be obtained.

[0499] In the substrate 5 , similar to the recessed portion 271 of the substrate 5 according to the fifth embodiment described above, the engaging recessed portion 301 can be formed by a known method such as a method using the laminated structure of the substrate 5 or a method using a processing apparatus.

[0500] The hook portion 281 engages with the engaging recess 301 formed in the substrate 5 with temporary elastic deformation. Specifically, as the temporary elastic deformation, the hook portion 281 is deformed to bend outward, thereby widening the distance to the mating hook portion 281 on the opposite side from the substrate 5 attached thereto from above with respect to the frame 6 (see Fig.59 B). In addition, when the frame 6 is removed from the substrate 5, the hook portion 281 also undergoes the same elastic deformation. Therefore, the hook portion 281 is formed as a portion having flexibility that allows the hook portion 281 to be bent appropriately when the frame 6 is attached or detached. Note that in the engagement recess 301, a chamfered portion that guides the elastic deformation of the hook portion 281 when the frame 6 is attached to the substrate 5 may be formed on the upper portion of the engagement surface portion 303.

[0501] <18. Method for Manufacturing Solid-State Imaging Device According to Sixth Embodiment>

[0502] Reference Fig.58 and Fig.59 An example of a method for manufacturing the solid-state imaging device 280 according to the sixth embodiment of the present technology is described.

[0503] In the method for manufacturing the solid-state imaging device 280, a step of manufacturing the frame 246 with glass is performed by fixing the glass cover 4 to the glass support surface 23 of the frame 6. Regarding the frame 6, when the frame 6 is a frame including resin, for example, Fig.58 As shown in A, a frame assembly 6Y in an assembled state is integrally molded by injection molding or the like using a mold, wherein a plurality of frame elements 6X of the frame 6 to be manufactured are connected, and the frame assembly 6Y is divided into individual frame elements 6X, thereby manufacturing the frame 6.

[0504] Then, if Fig.58 As shown in FIG. 2B , the cover glass 4 is attached to the frame 6 so as to close the entire opening portion 25 of the frame 6. The cover glass 4 is fixed by an adhesive 310 applied to the glass support surface 23 of the frame 6. As a result, a Fig.57 The frame with glass 246 is shown. The frame with glass 246 is attached to a sensor mounting substrate 247, which is a substrate 5 on which the image sensor 2 is mounted (see Fig.57 ).

[0505] Reference Fig.59 An example of the steps of attaching the frame to the glass 246 is described. In the attachment of the frame to the glass 246, first, the frame 246 with the glass is in the following attachment setting state relative to the sensor mounting substrate 247. That is, as Fig.59 As shown in A, the frame 246 with glass is in a state where the four hooks 281 are in contact with the substrate 5 at positions corresponding to the engaging recesses 301 of the substrate 5. Here, each hook 281 is supported by the substrate 5 in a state where the lower inclined surface 298 is in contact with the upper corner portion of the substrate 5.

[0506] from Fig.59 A shows the attached setting state of the frame 246 with glass, as shown in FIG. Fig.59 As shown in FIG. 2B , a force (see arrow M1) is applied to press the frame 246 with glass toward the side (lower side) corresponding to the substrate 5. When the frame 246 with glass receives the downward force, each hook 281 is elastically deformed to widen the distance to the mating hook 281 on the opposite side while sliding on the corner of the substrate 5 in contact with the lower inclined surface 298 (see arrow M2).

[0507] Then, in the frame with the glass 246 moved downward relative to the substrate 5, when the stop protrusion 292 of each hook portion 281 reaches the recessed portion 305 of the engaging recessed portion 301 of the substrate 5, as shown in FIG. Fig.59As shown in C, the hook portion 281 returns from the elastic deformation state, and the stop protrusion 292 engages with the recess portion 305 to engage with the engagement recess 301 (see arrow M3). As a result, a state is obtained in which the frame with the glass 246 is attached to the substrate 5. By attaching the frame to the glass 246 as described above, the solid-state imaging device 280 is obtained.

[0508] In the solid-state imaging device 280 according to the present embodiment, the frame with the glass 246 is removed from the substrate 5 as the cover glass 4 is removed. The frame 246 with the glass is removed from the substrate 5 by releasing the engagement of the hook portion 281 with the engagement recess 301. Here, the engagement of the hook portion 281 with the engagement recess 301 is released by temporary elastic deformation such as outward warping as described above. In addition, as a method of removing the frame 246 with the glass, a method can be used in which the claw portion 281 is broken, the engagement of the frame 6 with the substrate 5 is released, and the frame 246 with the glass is removed from the substrate 5. By removing the frame with the glass 246 from the solid-state imaging device 280, a sensor mounting substrate 247 is obtained.

[0509] According to the solid-state imaging device 280 according to the present embodiment as described above, the cover glass 4 can be easily attached and detached together with the frame 6 as a frame with the glass 246. In particular, the solid-state imaging device 280 of the present embodiment includes the hook portion 281 as a frame holding portion provided on the lower side of the frame 6. According to this configuration, a configuration can be obtained in which the cover glass 4 can be easily removed without using a pressure-sensitive adhesive or the like.

[0510] Furthermore, the hook portion 281 is provided as a holding protruding piece portion that is engaged with the engaging recess 301 of the substrate 5 by temporary elastic deformation. According to this configuration, since the frame 246 with glass can be attached by a simple operation such as a pressing operation on the frame 246 with glass, the cover glass 4 can be easily attached.

[0511] Furthermore, the hook portions 281 are arranged so that their lower surfaces 295 are flush with the back surface 5b of the substrate 5. According to this configuration, since the lower portions of the hook portions 281 can be prevented from protruding toward the side corresponding to the back surface 5b of the substrate 5, the substrate 5 can be mounted on the set substrate 18 (solid-state imaging device 280) while the frame 246 with glass is attached to the substrate 5. From the viewpoint of obtaining such an effect, the hook portions 281 can be arranged so that the dimension in the up-down direction (i.e., the protruding dimension from the lower surface 24 of the frame main body portion 26 serving as a support surface relative to the surface 5a of the substrate 5) is smaller than the plate thickness dimension of the substrate 5.

[0512] Furthermore, according to the fixing structure using the hook portion 281, the frame 6 is supported on the substrate 5 without inserting an adhesive or the like between the face 5a of the substrate 5 and the lower surface 24. Therefore, even in a state where the frame having the glass 246 is removed from the sensor mounting substrate 247, the cleanliness of the surface 5a of the substrate 5 can be maintained. Therefore, the adhesive present on the surface 5a of the substrate 5 can be prevented from adhering as dust to the image sensor 2 in the package inner portion, and the performance of the image sensor 2 can be ensured.

[0513] Furthermore, according to the configuration in which the cover glass 4 is removed together with the frame 6 relative to the substrate 5, for example, in the case where a lens housing is provided for the image sensor 2 on the sensor mounting substrate 247 in a state in which the frame having the glass 246 is removed, a high degree of freedom in the distance between the image sensor 2 and the lens of the lens housing can be obtained. As a result, the degree of freedom in designing the lens holder can be improved.

[0514] <19. Modification of Solid-State Imaging Device According to Sixth Embodiment>

[0515] A modification example of the solid-state imaging device 280 according to the sixth embodiment of the present technology will be described.

[0516] (First Modification)

[0517] like Fig.60 As shown, in the first modification, two engaging and fixing portions 300 are provided on each side portion of the frame main body portion 26 which is frame-shaped when viewed from above, and the two engaging and fixing portions 300 are respectively formed by a combination of a hook portion 281 on the side corresponding to the frame 6 and an engaging recessed portion 301 on the side corresponding to the substrate 5. Therefore, in the structure of the first modification, the frame 6 has the hook portion 281 at eight positions, the substrate 5 has the engaging recessed portion 301 at eight positions, and the engaging and fixing portions 300 are provided at eight positions in total.

[0518] exist Fig.60 In the example shown, in each side surface 5c forming the outer part shape of the substrate 5 in a plan view, an engaging recess 301 engaged by the hook portion 281 of the frame 6 is formed at a position near the left end portion and the right end portion of the side surface 5c. The two engaging fixing portions 300 of each side portion are arranged symmetrically in the X direction and the Y direction.

[0519] As described above, according to a configuration in which the joining and fixing portion 300 is provided at two positions on each side portion of the frame main body portion 26, the fixing action of the frame having the glass 246 relative to the substrate 5 can be improved and the frame can be firmly fixed using the glass 246, compared to a configuration in which the joining and fixing portion 300 is provided at one position on each side portion.

[0520] (Second Modification)

[0521] like Fig.61 As shown, in the second modification, the engaging fixing portion 300 is provided at the four corner portions of the substrate 5. In the second modification, chamfered portions 311 forming an inclined surface 312 between adjacent side surfaces 5c are formed at the four corner portions of the substrate 5 having a rectangular shape in a plan view, and recessed portions 305 engaged by the pressing protrusion 292 are formed in the inclined surface 312. It should be noted that in Fig.61 , for the sake of convenience, a plane cross section is partially shown.

[0522] In the present modification, the engaging fixing portion 300 is an engaging portion of the pressing protrusion 292 of the hook portion 281 on the side corresponding to the frame 6 with respect to the recessed portion 305 on the side corresponding to the substrate 5. On the side corresponding to the frame 6, the hook portion 281 is provided at the four corners on the lower side of the frame main body portion 26 corresponding to the recessed portion 305 at the four corners of the substrate 5 so that the protruding side of the pressing protrusion 292 faces the center of the frame 6 in a plan view.

[0523] As in the first and second variants, the number and arrangement positions of the joining and fixing parts 300 can be appropriately changed according to the size and purpose of the outer body. However, from the perspective of obtaining a good fixing effect for fixing the frame 6 to the substrate 5, the joining and fixing parts 300 are provided at least two positions in total, one at the opposite side portion or the corner portion.

[0524] (Variant 3)

[0525] Reference Figure 62 to Figure 65 A third modification of the solid-state imaging device 280 according to the sixth embodiment of the present technology is described. The configuration of the third modification includes a retaining pin portion 321 as a frame retaining portion, which is an engaging portion provided below the frame main body portion 26 and configured to fix the frame 6 to the substrate 5 by engaging with the substrate 5. Each retaining pin portion 321 is a portion formed as a part of the frame 6 and a retaining protrusion portion provided as a protrusion extending downward from the lower surface 24 of the frame main body portion 26.

[0526] The retaining pin portion 321 is provided on the lower side of each wall portion 20, and the frame body portion 26 is formed at the central portion in the extension direction of the wall portion 20. Therefore, in the frame 6, the retaining pin portion 321 is provided at a total of four positions, one position for each wall portion 20. The retaining pin portions 321 provided on the wall portions 20 opposite to each other are provided at positions opposite to each other. However, the retaining pin portions 321 provided on the wall portions 20 opposite to each other may be provided at different positions in the extension direction of the wall portion 20.

[0527] The retaining pin portion 321 is provided at the middle portion of the wall portion 20 in the wall thickness direction of the wall portion 20. The retaining pin portion 321 is a portion having a substantially columnar outer shape, and vertically protrudes from the lower surface 24 of the frame body portion 26. The retaining pin portion 321 has an outer peripheral surface 322 along the cylindrical outer shape and a horizontal lower surface 323. The retaining pin portion 321 has a cutout retaining recess 324 on the inner side of the middle portion in the up-down direction. Here, in a plan view, the inner side of the retaining pin portion 321 is the center side of the substrate 5, and the opening sides of the retaining recesses 324 of the retaining pin portions 321 provided on the wall portions 20 facing each other face each other.

[0528] The holding recess 324 is a cutout portion having an open side on the lateral side in the side sectional view (longitudinal sectional view of the retaining pin portion 321) of the frame 6. The holding recess 324 is formed by an inner side surface 324a which is an outer surface and a surface on the deep side of the concave shape of the holding recess 324, and an upper surface 324b and a lower surface 324c facing each other in the up-down direction (see FIG. Fig.63 ). The retaining recess 324 is formed within a range forming a substantially semicircular shape in a cross-sectional view of the retaining pin portion 321. In the retaining recess 324, an inner side surface 324a is a rectangular surface, and an upper surface 324b and a lower surface 324c are substantially semicircular surfaces.

[0529] The retaining pin portion 321 is formed such that the dimension in the up-down direction is substantially the same as or the same as the plate thickness dimension of the substrate 5. Therefore, the lower surface 323 of the retaining pin portion 321 is located on substantially the same plane as or the same plane as the rear surface 5b of the substrate 5.

[0530] On the side corresponding to the substrate 5, an engaging hole portion 331 is formed, which is an engaging portion engaged by the corresponding retaining pin portion 321. The engaging hole portion 331 is formed near the central portion in the longitudinal direction of the four side surfaces 5c of the substrate 5, corresponding to the arrangement of the four retaining pin portions 321. The engaging portion of the retaining pin portion 321 relative to the engaging hole portion 331 serves as an engaging fixing portion 300 between the substrate 5 and the frame 6.

[0531] The engaging hole portion 331 is formed as an opening portion extending through the substrate 5 in the plate thickness direction, and has a long hole shape in which longitudinal directions in opposite directions of the retaining pin portion 321 provided on the wall portion 20 face each other. A retaining protrusion 332 engaged with the retaining recess 324 of the retaining pin portion 321 is formed on the inner side of the inner peripheral surface 331a of the engaging hole portion 331 (on the center side of the substrate 5).

[0532] The pressing protrusion 332 is formed at the middle portion of the thickness direction of the substrate 5 inside the engaging hole portion 331. The pressing protrusion 332 has an upper inclined surface 333 inclined downward from the inside (the center side of the substrate 5) toward the outside (which is the opposite side), and a lower inclined surface 334 inclined in the direction from the lower side to the upper side from the outside toward the inside (see FIG. Fig.63 ).

[0533] The pressing protrusion 332 has a peak shape formed by an upper inclined surface 333 and a lower inclined surface 334, the peak side of which is located on the outside in a side view. The upper inclined surface 333 and the lower inclined surface 334 form a ridge 335 as an end portion on the protruding side of the pressing protrusion 332 in the extending direction of the side surface 5c of the substrate 5 in a plan view. Fig.63 In the example shown, the upper inclined surface 333 and the lower inclined surface 334 are formed to be vertically symmetrical in a side view, and are formed so that the angle formed in the side view is about 80°. Note that there is no limitation on the angle formed by the upper inclined surface 333 and the lower inclined surface 334 in a side view.

[0534] The frame 6 is fixed to the substrate 5 in such a manner that the substrate 5 is sandwiched between two sets of retaining pin portions 321 facing each other. The retaining pin portions 321 are inserted into the engaging hole portions 331 and engage with the engaging hole portions 331 by engaging the retaining protrusions 332 with the retaining recesses 324. The stopper pin portions 321 opposing each other are arranged so that the dimension between the inner side surfaces 324a opposing each other is slightly larger than or substantially equal to the dimension between the ridges 335 of the stopper protrusions 332 of the engaging hole portions 331 located on the opposite sides of the substrate 5. Fig.63 In the illustrated example, the retaining pin portion 321 is engaged with the engagement hole portion 331 in a state in which a substantially half portion of the retaining protrusion 332 on the side corresponding to the ridge portion 335 is positioned in the retaining recess 324 .

[0535] Note that the retaining pin portion 321 and the engaging hole portion 331 may be formed so that the entire retaining protrusion 332 is positioned in the retaining recess 324 in the engaged state. In addition, the engaging shape of the retaining pin portion 321 and the engaging hole portion 331 is not particularly limited. For example, the retaining pin portion 321 may have a V-shaped recess corresponding to the ridge shape of the retaining protrusion 332 as a portion that engages with the retaining protrusion 332 of the engaging hole portion 331.

[0536] In the engaging hole portion 331, by setting the dimension in the width direction of the long hole shape to be substantially the same as the dimension of the outer diameter of the retaining pin portion 321, the retaining pin portion 321 can be positioned relative to the corresponding engaging hole portion 331 in the width direction of the long hole shape, and a function of positioning the frame 6 relative to the substrate 5 can be obtained. In addition, the engaging hole portion 331 can be formed by a known method such as a method using a stacked structure of the substrate 5 and a method using a processing device.

[0537] The retaining pin portion 321 engages with the engaging hole portion 331 formed in the substrate 5 under temporary elastic deformation. Specifically, as the temporary elastic deformation, the retaining pin portion 321 is deformed to bend outward, thereby widening the distance from the substrate 5 of the upper attachment frame 6 to the mating retaining pin portion 321 on the opposite side (see Fig.66 B). In addition, even when the frame 6 is removed from the substrate 5, the retaining pin portion 321 performs similar elastic deformation. Therefore, the retaining pin portion 321 is formed to have a flexible portion that allows the retaining pin portion 321 to be appropriately bent when the frame 6 is attached or detached. In addition, the engaging hole portion 331 has a length that ensures a space that allows the retaining pin portion 321 to be elastically deformed in the longitudinal direction of the long hole shape. It should be noted that in the engaging hole portion 331, a chamfered portion that guides the elastic deformation of the retaining pin portion 321 when the frame 6 is attached to the substrate 5 may be formed on the upper side of the retaining protrusion 332.

[0538] Will refer to Fig.66 An example of a method for manufacturing the configuration of the third modification example of the solid-state imaging device 280 according to the sixth embodiment of the present technology is described.

[0539] With the mold as described above, the frame 6 having the retaining pin portion 321 is manufactured by injection molding or the like. Then, by fixing the glass cover 4 to the frame 6 with an adhesive, the frame 246 having glass is obtained. The frame 246 having glass is attached to the sensor mounting substrate 247 .

[0540] In the attachment of the frame and the glass 246, first, the frame 246 with the glass is in the following attachment setting state relative to the sensor mounting substrate 247. That is, as Fig.66 As shown in A, the frame 246 with glass is placed in a state where the four retaining pin portions 321 are in contact with the substrate 5 at positions corresponding to the engaging hole portions 331 of the substrate 5. Here, the pressing pin portions 321 are supported by the substrate 5 in a state where the lower end portions thereof are in contact with the upper inclined surfaces 333 of the pressing protrusions 332 in the engaging hole portions 331.

[0541] from Fig.66 The attached setting state of the frame with glass 246 shown in A is as follows Fig.66As shown in FIG. 2B , a force (see arrow N1) is applied to press the frame with glass 246 toward the side (lower side) corresponding to the substrate 5. When the frame with glass 246 receives the downward force, each retaining pin portion 321 is elastically deformed to widen the distance to the mating hook portion 281 on the opposite side while sliding on the upper inclined surface 333 in contact with the lower end portion (see arrow N2).

[0542] Then, in the frame where the glass 246 moves downward relative to the substrate 5, when the retaining pin portion 321 is further inserted into the engaging hole portion 331 and the retaining recess 324 of the retaining pin portion 321 reaches the retaining protrusion 332 of the engaging hole portion 331 of the substrate 5, as shown in FIG. Fig.66 As shown in FIG. 3C, the retaining pin portion 321 returns from the elastic deformation state, and the retaining recess 324 engages with the retaining protrusion 332 and engages with the engaging hole portion 331 (see arrow N3). As a result, a state is obtained in which the frame with the glass 246 is attached to the substrate 5. By attaching the frame to the glass 246 as described above, the solid-state imaging device 280 is obtained.

[0543] In the structure of this modification, the engagement of the retaining pin portion 321 with the engagement hole portion 331 is released, thereby removing the frame 246 with glass from the substrate 5. Here, the engagement of the retaining pin portion 321 with the engagement hole portion 331 is released by temporary elastic deformation such as outward warping as described above. In addition, as a method for removing the frame with glass 246, a method of breaking the retaining pin portion 321 to release the engagement of the frame 6 with the substrate 5 and removing the frame with glass 246 from the substrate 5 can be used.

[0544] (Variant 4)

[0545] like Fig.67 and Fig.68 As shown, in the fourth modification, the four corners of the substrate 5 are provided with a bonding fixing portion 300, which is formed by a combination of a retaining pin portion 321 on the side corresponding to the frame 6 and a bonding hole portion 331 on the side corresponding to the substrate 5. The bonding hole portion 331 is formed into a long hole shape in a plan view, and the length direction is along the diagonal line of the substrate 5. In each bonding hole portion 331, a pressing protrusion 332 is formed on the inner side of the length direction of the long hole shape (the center side of the substrate 5).

[0546] In the fourth variant, on the side corresponding to the frame 6, the retaining pin portion 321 is arranged at the four corner portions on the lower side of the frame main body portion 26 so as to correspond to the engaging hole portions 331 at the four corner portions of the substrate 5, and the opening side of the retaining recess 324 faces the center side of the frame 6 in a plan view.

[0547] Similar to the fourth modification, the number and arrangement positions of the joining and fixing portions 300 can be appropriately changed according to the size and purpose of the exterior body.

[0548] <20. Configuration Example of Solid-State Imaging Device According to Seventh Embodiment>

[0549] Will refer to Figure 69 to Figure 71 A configuration example of a solid-state imaging device 340 according to a seventh embodiment of the present technology is described. The solid-state imaging device 340 according to the present embodiment is different from the solid-state imaging device 280 according to the sixth embodiment in the bonding structure between a bonding portion as a frame holding portion that detachably holds the frame 6 relative to the substrate 5 and a bonding portion on a side corresponding to the substrate 5.

[0550] like Figure 69 to Figure 71 As shown, the solid-state imaging device 340 includes a retaining pin portion 341 as a frame holding portion, which is an engaging portion provided on the lower side of the frame main body portion 26 to fix the frame 6 to the substrate 5 by engaging with the substrate 5. Each retaining pin portion 341 is a portion formed as a portion of the frame 6, and is provided as a protrusion extending downward from the lower surface 24 of the frame main body portion 26.

[0551] The retaining pin portion 341 is provided on the lower side of each wall portion 20, forming the frame body portion 26 at the central portion in the extending direction of the wall portion 20. Therefore, in the frame 6, the retaining pin portion 341 is provided at a total of four positions, one position for each wall portion 20.

[0552] The retaining pin portion 341 is provided at the middle portion of the wall portion 20 in the wall thickness direction of the wall portion 20. The retaining pin portion 341 has a shape similar to the retaining pin portion 321 according to the sixth embodiment. That is, the retaining pin portion 341 is a substantially columnar portion protruding vertically from the lower surface 24 of the frame body portion 26, and has an outer peripheral surface 342 along the columnar outer shape and a horizontal lower surface 343.

[0553] The four retaining pin portions 341 are arranged so as to be located on the circumference of a virtual circle S1 centered at the central position O1 of the frame 6 in a plan view (see FIG. Fig.69 ). Specifically, each of the four retaining pin portions 341 is arranged to position the center position of the circular shape, which is the outer portion of the shape in the planar cross-sectional view, on the virtual circle S1. Fig.69 In the example shown, four retaining pin portions 341 are arranged at equal angular intervals (90° intervals) in the circumferential direction of the virtual circle S1, and are provided at symmetrical positions in each of the X direction and the Y direction in the frame 6. In the present embodiment, the center position O1 of the frame 6 coincides with the center position of the substrate 5 in a plan view, and is the center position of the solid-state imaging device 340.

[0554] Each retaining pin portion 341 has a cutout retaining recess 344 at a middle portion in the up-down direction. The retaining recesses 344 of the four retaining pin portions 341 are formed so that the opening side is on the same side in the direction along the virtual circle S1. In the present embodiment, the retaining recesses 344 are formed in the retaining pin portion 341 so that the opening side is the front side in the left rotation direction in a plan view in the direction along the virtual circle S1 (see FIG. 1 ). Fig.69 , arrow T1).

[0555] The holding recess 344 is a cutout portion having an open side on the lateral side in the side sectional view (longitudinal sectional view of the retaining pin portion 341) of the frame 6. The holding recess 344 is formed by an inner side surface 344a which is a surface on the deep side of the concave shape of the holding recess 344, and an upper surface 344b and a lower surface 344c, the inner side surface 344a being a surface on the deep side of the concave shape of the holding recess 344, and the upper surface 344b and the lower surface 344c facing each other in the up-down direction (see FIG. Fig.70 ). The retaining recess 344 is formed within a range forming a substantially semicircular shape in a cross-sectional view of the retaining pin portion 341. In the retaining recess 344, the inner side surface 344a is a rectangular surface, and the upper surface 344b and the lower surface 344c are substantially semicircular surfaces.

[0556] The retaining pin portion 341 is formed such that the dimension in the up-down direction is substantially the same as or the same as the plate thickness dimension of the substrate 5. Therefore, the lower surface 343 of the retaining pin portion 341 is located on substantially the same plane as or the same plane as the rear surface 5b of the substrate 5.

[0557] On the side corresponding to the substrate 5, an engaging hole portion 351 is formed, which is an engaging portion engaged by the corresponding retaining pin portion 341. The engaging hole portion 351 is formed near the central portion in the longitudinal direction of the four side surfaces 5c of the substrate 5, corresponding to the arrangement of the four retaining pin portions 321. The engaging portion of the retaining pin portion 341 relative to the engaging hole portion 351 serves as an engaging fixing portion 360 between the substrate 5 and the frame 6.

[0558] The bonding hole portion 351 is formed as an opening portion extending through the substrate 5 in the plate thickness direction, and has a long hole shape when viewed from above. The bonding hole portion 351 is formed so that the length direction of the long hole shape is along the circumference of the imaginary circle S1 in the substrate 5 when viewed from above. Specifically, four bonding hole portions 351 are provided in such a manner that the center position in the width direction of the long hole shape is along the imaginary circle S1. Fig.69 In the example shown, four engagement holes 351 are arranged at equal angular intervals in the circumferential direction of the virtual circle S1, corresponding to the arrangement of four retaining pins 341. An engaging protrusion 352 is formed on the inner circumferential surface 351a of the engagement hole 351 to engage with the retaining recess 344 of the retaining pin 341.

[0559] In the four engagement hole portions 351, the end portions on the same side along the direction of the virtual circle S1 are provided with a fitting protrusion 352. In the present embodiment, in a plan view along the direction of the virtual circle S1, the fitting protrusion 352 is formed in each engagement hole portion 351 in the left rotation direction (see Fig.69 , at the front end part of arrow T1).

[0560] The engaging protrusion 352 is formed in the middle portion of the substrate 5 in the thickness direction in the engaging hole portion 351. The engaging protrusion 352 is a portion having a protruding shape along a rectangular shape relative to the inner peripheral surface 351a of the engaging hole portion 351 in a side surface cross-sectional view. The engaging protrusion 352 is formed by a protruding end surface 352a as an end surface on the protruding side and an upper surface 352b and a lower surface 352c parallel to each other (see FIG. Fig.70 ). In the fitting protrusion 352, the protruding end surface 352a is a rectangular surface, and the upper surface 352b and the lower surface 352c are substantially semicircular surfaces.

[0561] The frame 6 is fixed to the substrate 5 in a state where the four retaining pin portions 341 are engaged with the corresponding engaging hole portions 351. The retaining pin portions 341 are inserted into the engaging hole portions 351 and engaged with the engaging hole portions 351 by fitting the fitting protrusions 352 into the retaining recesses 344. The distance between the upper surface 344b and the lower surface 344c of the retaining recesses 344 of the retaining pin portions 341 is substantially the same as the dimension between the upper surface 352b and the lower surface 352c of the mounting protrusion 352 (i.e., the dimension in the up-down direction of the mounting protrusion 352).

[0562] The retaining pin portion 341 and the engaging hole portion 351 are configured so that in a state where the lower surface 24 of the frame body portion 26 of the frame 6 is in contact with the surface 5a of the substrate 5, the fitting protrusion 352 is fitted into the retaining recess 344 by a relative sliding movement in the lateral direction with respect to the substrate 5. That is, the retaining recess 344 and the fitting protrusion 352 are arranged to be fitted to each other by being relatively close to each other by the sliding movement of the frame 6 on the substrate 5. In the fitting between the retaining recess 344 and the mounting protrusion 352, the upper surface 344b and the lower surface 344c of the retaining recess 344 serve as sliding surfaces with respect to the upper surface 352b and the lower surface 352c of the mounting protrusion 352, respectively.

[0563] The holding recess 344 and the assembly protrusion 352 are formed so that the assembly state is maintained by friction between the contact surfaces, etc., and the contact surfaces become sliding surfaces when assembled. Regarding the dimensions in the up-down direction, for example, the holding recess 344 and the assembly protrusion 352 have a dimensional relationship that allows the retaining pin portion 341 in the assembled state to provide an action of clamping the assembly protrusion 352 in the up-down direction. Fig.70In the illustrated example, the retaining pin portion 341 is engaged with the engagement hole portion 351 in a state in which substantially the entire fitting protrusion 352 is positioned in the retaining recess 344 .

[0564] In addition, if Fig.70 As shown, chamfered portions 353 for obtaining a guiding action for insertion and assembly may be formed on the upper and lower sides of the protruding side end portion of the assembly protrusion 352 to be inserted into the holding recess 344. Chamfered portions for obtaining a guiding action for insertion and assembly may be formed on the upper and lower sides of the opening edge portion of the holding recess 344 retaining the pin portion 341.

[0565] Note that the engagement shape of the retaining pin portion 341 and the engagement hole portion 351 is not particularly limited. For example, the engaging protrusion 352 of the engagement hole portion 351 may be a portion of a tapered shape whose dimension in the up-down direction gradually decreases toward the protruding front end side. For example, the engaging protrusion 352 of the engagement hole portion 351 may also be a mountain-top-shaped protrusion portion that is the same as the pressing protrusion 332 of the sixth embodiment. The engagement shape of the retaining pin portion 341 and the engagement hole portion 351 may be any shape as long as they can be engaged with each other by the sliding movement of the frame 6 on the substrate 5, and an engagement action that can maintain a mutually engaged state (not easily removed) in the normal use environment of the solid-state imaging device 340 can be obtained.

[0566] In the engaging hole portion 351, by setting the dimension in the width direction of the long hole shape to be substantially the same as the dimension of the outer diameter of the retaining pin portion 341, the retaining pin portion 341 can be positioned relative to the corresponding engaging hole portion 351 in the width direction of the long hole shape, and a function of positioning the frame 6 relative to the substrate 5 can be obtained. The engaging hole portion 351 can be formed by a known method, such as a method using a laminated structure of the substrate 5 or a method using a processing device.

[0567] The retaining pin portion 341 of the frame 6 and the substrate 5 including the engaging hole portion 351 (engaged by the retaining pin portion 341) are configured so that the retaining pin portion 341 engages with the engaging hole portion 351 formed in the substrate 5 with the up and down direction as the rotation axis direction through relative rotation between the frame 6 and the substrate 5.

[0568] As described above, the straight line in the up-down direction passing through the position where the center positions O1 of the frame 6 and the substrate 5 coincide with each other or are in the vicinity thereof becomes the rotation axis of the relative rotation of the frame 6 and the substrate 5. In addition, the four retaining pin portions 341 and the four engaging hole portions 351 are arranged on the circumference of the common virtual circle S1, and are configured so that, with the circumferential direction of the virtual circle S1 as the relative movement direction of the relative rotation between the frame 6 and the substrate 5, engagement of the movement in the direction in which the frame 6 and the substrate 5 approach each other and release of the engagement in the direction in which the frame 6 and the substrate 5 move away from each other are performed.

[0569] <21. Method for Manufacturing Solid-State Imaging Device According to Seventh Embodiment>

[0570] Reference Fig.72 and Fig.73 An example of a method for manufacturing the solid-state imaging device 340 according to the seventh embodiment of the present technology is described.

[0571] With the mold as described above, the frame 6 having the retaining pin portion 341 is manufactured by injection molding or the like. Then, by fixing the glass cover 4 to the frame 6 using an adhesive, a frame 246 having glass is obtained (see FIG. Fig.71 ). A frame 246 with glass is attached to a sensor mounting substrate 247.

[0572] When mounting the frame 246 with glass, first, the frame 246 with glass is set relative to the sensor mounting substrate 247 in a state where the four retaining pin portions 341 are inserted into the space portion opposite to the fitting protrusion 352 in the engaging hole portion 351 of the substrate 5. That is, first, as Fig.73 As shown in FIG. 2A , the frame 246 with glass is in a state where each retaining pin portion 341 is located above a space portion opposite to a side corresponding to the fitting protrusion 352 in the longitudinal direction of the elongated hole shape in the corresponding engaging hole portion 351. From this state, the frame 246 with glass and the substrate 5 are relatively moved in the up-down direction to move toward each other, the retaining pin portion 341 is inserted into the engaging hole portion 351 (see arrow U1), and the frame 6 is placed on the substrate 5.

[0573] Results, such as Fig.72 A and Fig.73 As shown in FIG. 2B , the lower surface 24 of the frame 6 contacts the surface 5 a of the substrate 5 , and the retaining recess 344 of each retaining pin portion 341 located in the engaging hole portion 351 faces the fitting protrusion 352 . Fig.72 As shown in A of FIG. 1 , in a state where the frame 246 having glass is set on the substrate 5, in a plan view, the rectangular outer shapes of the frame 6 and the substrate 5 are offset from each other in the rotation direction around the center position O1. It should be noted that Fig.72 In A, the outer shape of the frame 6 is indicated by a two-dot chain line.

[0574] Then, from the state in which the frame 246 with glass is set relative to the substrate 5, an operation of relatively rotating the frame 246 with glass and the substrate 5 to rotate in the up-down direction around the rotation axis is performed. Here, the direction of the relative rotation of the frame 246 with glass and the substrate 5 is the direction in which the frame 246 with glass rotates in the left-hand direction (counterclockwise direction) relative to the substrate 5 in a plan view (see Fig.72 A, arrow U2).

[0575] like Fig.72 B and Fig.73 As shown in FIG. 3C, as the frame, the glass 246, and the substrate 5 rotate relative to each other, the retaining pin portion 341 moves in the engaging hole portion 351 toward the engaging protrusion 352, the engaging protrusion 352 engages in the retaining recess 344 (see arrow U3), and the retaining pin portion 341 engages with the engaging hole portion 351. As a result, a state in which the frame with the glass 246 is attached to the substrate 5 is obtained.

[0576] In the state where the retaining pin portion 341 is engaged with the engaging hole portion 351, the outer shapes of the frame 6 and the substrate 5 are consistent with each other in a plan view. In the present embodiment, the relative rotation angle of the frame with the glass 246 relative to the substrate 5 is about 10° from the setting state of the frame with the glass 246 relative to the substrate 5 to the state where the retaining pin portion 341 is engaged with the engaging hole portion 351. However, the angle of relative rotation varies depending on the length of the long hole shape of the engaging hole portion 351, the outer diameter of the retaining pin portion 341, and the like. By attaching the frame to the glass 246 as described above, the solid-state imaging device 340 is obtained.

[0577] In the present embodiment, the frame 246 with glass is removed from the substrate 5 by releasing the engagement of the retaining pin portion 341 with the engagement hole portion 351. The engagement of the retaining pin portion 341 with the engagement hole portion 351 is released by relatively rotating the frame with glass 246 and the substrate 5 in the direction opposite to the attachment of the frame with glass 246 (right rotation direction in a plan view). In addition, as a method for removing the frame with glass 246, a method of breaking the retaining pin portion 341 to release the engagement of the frame 6 with the substrate 5 and removing the frame with glass 246 from the substrate 5 may be used. By removing the frame with glass 246 from the solid-state imaging device 340, the sensor mounting substrate 247 is obtained.

[0578] According to the solid-state imaging device 340 according to the present embodiment as described above, since the retaining pin portion 341 provided on the lower side of the frame 6 is provided as a frame retaining portion, similar to the solid-state imaging device 280 according to the sixth embodiment, the glass cover 4 can be easily attached to and detached from the frame 6 which is a frame having the glass 246 without using a pressure-sensitive adhesive or the like.

[0579] In addition, in the solid-state imaging device 340, the engagement fixing portion 360 formed by the retaining pin portion 341 and the engagement hole portion 351 is configured to be engaged and released by the relative rotation of the frame 6 and the substrate 5. According to this configuration, according to this configuration, the frame 246 with glass can be attached and detached by a simple operation such as a rotation operation on the frame 246 with glass, so that the cover glass 4 can be easily attached and detached. Other effects are the same as those of the sixth embodiment.

[0580] <22. Modification of Solid-State Imaging Device According to Seventh Embodiment>

[0581] A modification example of the solid-state imaging device 340 according to the seventh embodiment of the present technology will be described. Fig.74 and Fig.75 As shown, in this modification, the engaging fixing portions 360 are provided at the four corner portions of the substrate 5, and the engaging fixing portions 360 are formed by a combination of the retaining pin portions 341 on the side corresponding to the frame 6 and the engaging hole portions 351 on the side corresponding to the substrate 5. In this modification, as described above, the retaining pin portions 341 and the engaging hole portions 351 are arranged to be located on the circumference of the virtual circle S1 centered at the center position O1 of the solid-state imaging device 340.

[0582] In the present modification, on the side corresponding to the frame 6, the retaining pin portions 341 are provided at the four corners on the lower side of the frame main body portion 26 so as to correspond to the engaging hole portions 351 at the four corners of the substrate 5. In the retaining pin portions 341, the retaining recessed portions 344 are formed so that the opening side is the left rotation direction in a plan view along the direction of the virtual circle S1 (see FIG. Fig.74 , the front side on the arrow V1). In addition, in the engagement hole portion 351, when viewed from above in the direction of the virtual circle S1, the fitting protrusion 352 is formed at the front end portion in the left rotation direction.

[0583] In the configuration of this modification, the frame 246 with glass is rotated in the left rotation direction about the axis in the up-down direction relative to the substrate 5 in a plan view in a state where the four retaining pin portions 341 are inserted into the engaging hole portions 351, whereby the retaining pin portions 341 are engaged with the engaging hole portions 351, and the frame 246 with glass is fixed to the substrate 5. In addition, by rotating the frame with glass 246 in the right rotation direction relative to the substrate 5 in a plan view, the engagement between the retaining pin portions 341 and the engaging hole portions 351 is released, and the frame with glass 246 is removed. As in this modification, the number and arrangement positions of the engaging and fixing portions 360 can be appropriately changed according to the size and purpose of the exterior body.

[0584] <23. Configuration Example of Electronic Device>

[0585] Reference Fig.76 An application example of the semiconductor device according to the above-described embodiment to an electronic device is described.

[0586] For example, a semiconductor device (solid-state imaging device) according to the present technology can be used as various types of devices for sensing light such as visible light, infrared light, ultraviolet light, and X-rays. The solid-state imaging device according to the present technology can be applied to all electronic devices that use a solid-state imaging element as an image capturing unit (photoelectric converter), such as a camera device such as a digital still camera or a video camera, a mobile terminal device with an imaging function, a copier using a solid-state imaging element as an image reading unit, a vehicle-mounted sensor that captures images of the front, rear, surrounding, interior, etc. of a car, and a distance measuring sensor that measures the distance between vehicles, etc. In addition, the solid-state imaging device can be formed as a chip, or can be in the form of a module having an imaging function in which an imaging unit and a signal processing unit or an optical system are packaged together.

[0587] like Fig.76 As shown, the camera device 500 as an electronic device includes an optical unit 502, a solid-state imaging device 501, a digital signal processor (DSP) circuit 503 as a camera signal processing circuit, a frame memory 504, a display unit 505, a recording unit 506, an operation unit 507, and a power supply unit 508. The DSP circuit 503, the frame memory 504, the display unit 505, the recording unit 506, the operation unit 507, and the power supply unit 508 are appropriately connected via a connection line 509 such as a bus. The solid-state imaging device 501 is any one of the solid-state imaging devices according to the above-mentioned embodiments. In addition, the solid-state imaging device 501 may be a solid-state imaging device in a state where the cover glass 4 is removed, such as an image sensor unit 1A (see Figure 8 C), the image sensor unit 80A with the cover 85 removed (see Fig.21 ), or the sensor mounting substrate 247 having the frame of the glass 246 is removed from the solid-state imaging device 280 (see Fig.57 ).

[0588] The optical unit 502 includes a plurality of lenses, and captures incident light (image light) from a subject to form an image on an imaging surface of the solid-state imaging device 501. The solid-state imaging device 501 converts the light amount of the incident light imaged on the imaging surface by the optical unit 502 into an electrical signal for each pixel, and outputs the electrical signal as a pixel signal.

[0589] The display unit 505 includes, for example, a panel-type display device such as a liquid crystal panel or an organic electroluminescent (EL) panel, and displays a moving image or a still image captured by the solid-state imaging device 501. The recording unit 506 records the moving image or the still image captured by the solid-state imaging device 501 on a recording medium such as a hard disk or a semiconductor memory.

[0590] The operation unit 507 issues operation commands for various functions of the camera apparatus 500 under user operation. The power supply unit 508 appropriately supplies various power sources used as operation power sources for the DSP circuit 503, frame memory 504, display unit 505, recording unit 506, and operation unit 507 to these supply targets.

[0591] According to the camera device 500 as described above, with respect to the solid-state imaging device 501, the attached state of the glass cover 4 can be obtained so as to obtain good operability and prevent foreign matter from entering the inner part of the package, and the glass cover 4 can be easily removed to solve problems such as ghosting and light spots caused by the presence of the glass cover 4.

[0592] The description of the above-mentioned embodiments is an example of the present technology, and the present technology is not limited to the above-mentioned embodiments. Therefore, of course, even in the case other than the above-mentioned embodiments, various modifications can be made according to the design, etc. without departing from the technical concept of the present disclosure. In addition, the effects described in the present disclosure are only examples and are not limited, and other effects can be provided. In addition, the structure of the above-mentioned embodiment and the structure of each modification example can be appropriately combined.

[0593] In the above-described embodiment, the semiconductor element is the image sensor 2 as a light receiving element, but the semiconductor element according to the present technology is not limited to the image sensor. For example, the semiconductor element according to the present technology may be a light emitting element such as a vertical cavity surface emitting laser (VCSEL), a laser diode, or a light emitting diode (LED). In addition, the imaging device as a semiconductor device may have a configuration in which a plurality of semiconductor elements are provided in one chip or a configuration in which a plurality of semiconductor elements are provided as a plurality of chips.

[0594] In addition, in the above-mentioned embodiment, the transparent glass cover 4 has been given as an example of the cover member according to the present technology, but the cover member according to the present technology is not limited to a transparent member, and may be a translucent or opaque covering body. In addition, the shape of the cover member according to the present technology is not limited to a rectangular plate shape, and may be other shapes, such as a disk shape.

[0595] It should be noted that the present technology can also adopt the following configurations. (1)

[0597] A semiconductor device comprising:

[0598] substrate;

[0599] a semiconductor element mounted on a substrate;

[0600] a cover member that covers the semiconductor element from above;

[0601] a frame supporting the cover member relative to the substrate; and

[0602] The cover holding portion holds the cover member in a detachable manner with respect to at least a portion of the frame. (2)

[0604] The semiconductor device according to (1), wherein

[0605] The frame includes a frame body portion that surrounds the semiconductor element and forms a support surface that supports the cover member, and

[0606] The semiconductor device further includes a cover fixing portion as a cover holding portion, which is provided on an upper side of the frame main body portion and fixes the cover member to the frame by restricting movement of the cover member supported on the supporting surface relative to the frame main body portion. (3)

[0608] The semiconductor device according to (2), wherein

[0609] The cover member is a member having a flat plate shape, and

[0610] The frame includes: a step forming portion that forms a step relative to the support surface and contacts the side surface of the cover member to restrict movement of the cover member; and a retaining portion that contacts the side surface of the cover member and restricts movement of the cover member in a direction away from the support surface. (4)

[0612] The semiconductor device according to (3), wherein

[0613] The framework includes as a retention part,

[0614] a clip portion configured to attach and detach the cover member to and from the frame main body portion using temporary elastic deformation, and

[0615] The hook portion is provided on the opposite side to the clip portion across the cover member, and the hook portion allows an edge portion of the cover member to be fitted between the hook portion and the support surface. (5)

[0617] The semiconductor device according to any one of (2) to (4), wherein

[0618] The frame body portion has a recessed portion that opens at the support surface and is partially covered by the cover member. (6)

[0620] The semiconductor device according to (1), wherein

[0621] The framework includes:

[0622] a first frame portion fixed to the substrate, and

[0623] The second frame portion forms a cover holding portion and is detachably attached to the first frame portion. (7)

[0625] The semiconductor device according to (6), wherein

[0626] The second frame part includes:

[0627] a frame-shaped main body portion, holding a cover member, and

[0628] An engaging portion is provided in the main body portion and engages with the first frame portion so that the second frame portion is held by the first frame portion. (8)

[0630] The semiconductor device according to (7), wherein

[0631] The engaging portion is a rotation engaging body that is rotatably supported relative to the main body portion in a state where it is urged by the urging member in a direction to engage with the engaging portion formed in the first frame portion. (9)

[0633] The semiconductor device according to any one of (6) to (8), wherein

[0634] The first frame portion includes a recessed portion that is open at an upper surface and is partially covered by a cover member. (10)

[0636] The semiconductor device according to (1), wherein

[0637] The frame includes a frame body portion that surrounds the semiconductor element and forms a support surface that supports the cover member, and

[0638] The semiconductor device further includes: as a cover holding portion,

[0639] a step forming portion provided on an upper side of the frame main body portion, forming a step portion with respect to the support surface, and the step forming portion contacts a side surface of the cover member to restrict movement of the cover member, and

[0640] The bonding portion is interposed between the frame body portion and the cover member and includes an adhesive for fixing the cover member to the frame body portion. (11)

[0642] The semiconductor device according to (10), wherein

[0643] The frame body portion has a recessed portion that opens at the support surface and is partially covered by the cover member. (12)

[0645] The semiconductor device according to (10) or (11), wherein

[0646] The adhesive comprises a hot melt adhesive, and

[0647] A recess for positioning the coupling portion is formed in at least one of the support surface and a lower surface of the cover member facing the support surface. (13)

[0649] A semiconductor device comprising:

[0650] substrate;

[0651] a semiconductor element mounted on a substrate;

[0652] a cover member that covers the semiconductor element from above;

[0653] a frame supporting the cover member relative to the substrate; and

[0654] The frame holding portion holds the frame in a detachable manner relative to the substrate. (14)

[0656] The semiconductor device according to (13), wherein

[0657] The frame includes a frame body portion that surrounds the semiconductor element and forms a support surface that supports the cover member,

[0658] The cover member is secured to the support surface, and

[0659] The semiconductor device further includes: as a frame holding portion,

[0660] a step forming portion provided on the lower side of the frame main body portion, forming a step portion with respect to the lower surface of the frame main body portion, and the step forming portion contacts the side surface of the substrate to restrict movement of the substrate, and

[0661] The bonding part is interposed between the frame body part and the substrate and includes an adhesive for fixing the frame body part to the substrate. (15)

[0663] The semiconductor device according to (14), wherein

[0664] The adhesive comprises a hot melt adhesive, and

[0665] A recess for positioning the coupling portion is formed in at least one of a lower surface of the frame body portion and an upper surface of the substrate facing the lower surface. (16)

[0667] The semiconductor device according to (13), wherein

[0668] The frame includes a frame body portion that surrounds the semiconductor element and forms a support surface that supports the cover member,

[0669] The cover member is secured to the support surface, and

[0670] The semiconductor device further includes a bonding portion as a frame holding portion, which is provided on a lower side of the frame main body portion and fixes the frame to the substrate by bonding with the substrate. (17)

[0672] The semiconductor device according to (16), wherein

[0673] The engaging portion includes a retaining tab portion configured to be in a state of being retained to the engaging portion formed in the substrate by temporary elastic deformation. (18)

[0675] The semiconductor device according to (16), wherein

[0676] The engaging portion and the substrate are configured such that relative rotation of the frame and the substrate with the up-and-down direction as a rotation axis direction results in a state in which the engaging portion engages with an engaging portion formed in the substrate. (19)

[0678] An electronic device, comprising:

[0679] Semiconductor device, the semiconductor device comprising:

[0680] substrate;

[0681] a semiconductor element mounted on a substrate;

[0682] a cover member that covers the semiconductor element from above;

[0683] a frame supporting the cover member relative to the substrate; and

[0684] The cover holding portion holds the cover member in a detachable manner relative to at least a portion of the frame. (20)

[0686] An electronic device, comprising:

[0687] Semiconductor device, the semiconductor device comprising:

[0688] substrate;

[0689] a semiconductor element mounted on a substrate;

[0690] a cover member that covers the semiconductor element from above;

[0691] a frame supporting the cover member relative to the substrate; and

[0692] The frame holding portion holds the frame in a detachable manner relative to the substrate.

[0693] Reference Symbols List

[0694] 1Solid-state imaging device (semiconductor device)

[0695] 2Image sensor (semiconductor device)

[0696] 4Glass cover (cover member)

[0697] 4b Lower surface

[0698] 4c Side surface

[0699] 5 Base

[0700] 5a surface (upper surface)

[0701] 6 Framework

[0702] 20 Wall

[0703] 20a Upper surface

[0704] 23 Glass support surface (support surface)

[0705] 24 Lower surface

[0706] 26 Main frame

[0707] 30 cover fixing portion (cover holding portion)

[0708] 31 Step forming portion (cover fixing portion)

[0709] 32 Clip part (cover fixing part, retaining part)

[0710] 33 hook part (cover fixing part, retention part)

[0711] 35 Step

[0712] 60 recess

[0713] 80 Solid-state imaging device (semiconductor device)

[0714] 81 substrate side frame (first frame portion)

[0715] 82 glass side frame (second frame part)

[0716] 86 frame-shaped main body (main body)

[0717] 92 Clip part (joint part)

[0718] 93 hook (joint)

[0719] 102 Engagement recess

[0720] 103 Engagement recess

[0721] 120 Solid-state imaging device (semiconductor device)

[0722] 121 substrate side frame (first frame portion)

[0723] 122 glass side frame (second frame part)

[0724] 126 frame-shaped main body (main body)

[0725] 132 Clip (joint, rotating joint)

[0726] 133 Coil spring (pushing member)

[0727] 158 joint recess (joint part)

[0728] 180 Solid-state imaging device (semiconductor device)

[0729] 181 Step forming part

[0730] 182 Joint

[0731] 182B Hot melt bonding

[0732] 185 Steps

[0733] 201 depression (concave)

[0734] 221 depression (concave)

[0735] 230 Solid-state imaging device (semiconductor device)

[0736] 231 Step forming part

[0737] 232 Joint

[0738] 232B Hot melt bonding

[0739] 251 depression (concave)

[0740] 271 depression (concave)

[0741] 280 Solid-state imaging device (semiconductor device)

[0742] 281 hook portion (frame holding portion, engaging portion, retaining tab portion)

[0743] 301 joint recess (joint part)

[0744] 321 retaining pin portion (frame retaining portion, engaging portion, retaining tab portion)

[0745] 331 joint hole portion (joint portion)

[0746] 340 Solid-state imaging device (semiconductor device)

[0747] 341 retaining pin portion (frame retaining portion, engaging portion)

[0748] 351Jointing hole portion (joining portion)

[0749] 500 Camera device (electronic device)

[0750] 501 solid-state imaging device (semiconductor device).

Claims

1. A semiconductor device comprising: substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; as well as The cover holding portion detachably holds the cover member with respect to at least a portion of the frame.

2. The semiconductor device according to claim 1, wherein The frame includes a frame body portion that surrounds the semiconductor element and forms a support surface that supports the cover member, and The semiconductor device further includes a cover fixing portion as the cover holding portion, which is provided on an upper side of the frame main body portion and fixes the cover member to the frame by restricting movement of the cover member supported on the support surface relative to the frame main body portion.

3. The semiconductor device according to claim 2, wherein: The cover member is a member having a flat plate shape, and The frame includes: a step forming portion as the cover fixing portion, the step forming portion forming a step portion relative to the support surface and contacting the side surface of the cover member to limit the movement of the cover member; and a retaining portion, the retaining portion contacting the side surface of the cover member and limiting the movement of the cover member in a direction away from the support surface.

4. The semiconductor device according to claim 3, wherein: The frame includes as the retaining portion a clip portion configured to attach and detach the cover member to and from the frame main body portion using temporary elastic deformation, and A hook portion is provided on a side opposite to the clip portion across the cover member, and allows an edge portion of the cover member to be fitted between the hook portion and the support surface.

5. The semiconductor device according to claim 2, wherein: The frame body portion has a recessed portion that opens at the support surface and is partially covered by the cover member.

6. The semiconductor device according to claim 1, wherein The framework includes: a first frame portion fixed to the substrate, and A second frame portion forms the cover holding portion and is detachably attached to the first frame portion.

7. The semiconductor device according to claim 6, wherein The second frame portion comprises: a frame-shaped main body portion holding the cover member, and An engaging portion is provided in the main body portion and is engaged with the first frame portion so that the second frame portion is held by the first frame portion.

8. The semiconductor device according to claim 7, wherein: The engaging portion is a rotation engaging body that is rotatably supported relative to the main body portion in a state where it is urged by an urging member in a direction to engage with the engaging portion formed in the first frame portion.

9. The semiconductor device according to claim 6, wherein: The first frame portion includes a recessed portion that is open at an upper surface and is partially covered by the cover member.

10. The semiconductor device according to claim 1, wherein The frame includes a frame body portion that surrounds the semiconductor element and forms a support surface that supports the cover member, and The semiconductor device further includes a cover holding portion a step forming portion provided on an upper side of the frame main body portion, forming a step portion with respect to the support surface, and the step forming portion contacts a side surface of the cover member to restrict movement of the cover member, and A bonding portion is interposed between the frame body portion and the cover member and includes an adhesive for fixing the cover member to the frame body portion.

11. The semiconductor device according to claim 10, wherein The frame body portion has a recessed portion that opens at the support surface and is partially covered by the cover member.

12. The semiconductor device according to claim 10, wherein: The adhesive comprises a hot melt adhesive, and A recess for positioning the coupling portion is formed in at least one of the support surface and a lower surface of the cover member facing the support surface.

13. A semiconductor device comprising: substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; as well as The frame holding portion holds the frame detachably relative to the substrate.

14. The semiconductor device according to claim 13, wherein the frame includes a frame main body portion which surrounds the semiconductor element and forms a support surface for supporting the cover member, The cover member is secured to the support surface, and The semiconductor device further includes a frame holding portion a step forming portion provided on the lower side of the frame main body portion, forming a step portion with respect to the lower surface of the frame main body portion, and the step forming portion contacts the side surface of the substrate to restrict movement of the substrate, and The bonding portion is interposed between the frame body portion and the substrate and includes an adhesive for fixing the frame body portion to the substrate.

15. The semiconductor device according to claim 14, wherein The adhesive comprises a hot melt adhesive, and A recess for positioning the coupling portion is formed in at least one of a lower surface of the frame body portion and an upper surface of the substrate facing the lower surface.

16. The semiconductor device according to claim 13, wherein: the frame includes a frame main body portion which surrounds the semiconductor element and forms a support surface for supporting the cover member, The cover member is secured to the support surface, and The semiconductor device further includes a bonding portion as the frame holding portion, the bonding portion being provided at a lower side of the frame main body portion and fixing the frame to the substrate by bonding with the substrate.

17. The semiconductor device according to claim 16, wherein: The engaging portion includes a retaining tab portion configured to be in a state of being retained to the engaging portion formed in the substrate by temporary elastic deformation.

18. The semiconductor device according to claim 16, wherein: The engaging portion and the substrate are arranged such that relative rotation of the frame and the substrate with the up-and-down direction as a rotation axis direction results in a state in which the engaging portion engages with an engaging portion formed in the substrate.

19. An electronic device comprising: A semiconductor device, comprising: substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and The cover holding portion detachably holds the cover member with respect to at least a portion of the frame.

20. An electronic device comprising: A semiconductor device, comprising: substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and The frame holding portion holds the frame detachably relative to the substrate.

Images