Method and apparatus for healing microcracks in a component

Abstract

The application discloses a method and device for healing internal micro-cracks of a component, and belongs to the technical field of material processing. The method comprises the following steps: obtaining the shape of internal micro-cracks to be healed of a component to be healed; selecting the largest crack as a target micro-crack according to the shape; determining current input energy capable of healing the target micro-crack according to the size of the target micro-crack; establishing a finite element model of the target micro-crack according to the properties of the component to be healed, and determining a plurality of groups of pulse current parameters according to the current input energy, so as to perform electroplastic processing on the finite element model by using the plurality of groups of pulse current parameters respectively, and obtaining an electroplastic processing result; determining target pulse current parameters capable of achieving the best healing effect of the target micro-crack by using the electroplastic processing result, so as to perform electroplastic processing on the component to be healed by using the target pulse current parameters, and healing internal micro-cracks of the component. According to the scheme, the internal micro-cracks of the component can be healed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of material processing, and in particular to a method and device for healing internal micro-cracks of a component. BACKGROUND

[0002] During the forming and service of a metal component, micro-cracks and other micro-defects may be generated inside the component. Under cyclic loading, the micro-cracks and other micro-defects existing in the material will cause fatigue failure of the mechanical part during use, and the existence of the micro-cracks will greatly reduce the service life and reliability of the metal component. Therefore, repairing the micro-cracks generated in the metal component can effectively improve the service life and meet the requirements of sustainable development of the manufacturing industry.

[0003] In the related art, the internal micro-cracks of the component are not processed. Therefore, it is necessary to provide a method for healing internal micro-cracks of a component. SUMMARY

[0004] The present application provides a method and device for healing internal micro-cracks of a component. The technical solution is as follows:

[0005] In one aspect, a method for healing internal micro-cracks of a component is provided, comprising:

[0006] obtaining a micro-crack morphology to be healed inside a component to be healed;

[0007] selecting a maximum crack as a target micro-crack according to the morphology;

[0008] determining a current input energy that can heal the target micro-crack according to the size of the target micro-crack;

[0009] establishing a finite element model of the target micro-crack according to the properties of the component to be healed, and determining a plurality of pulse current parameters according to the current input energy, to perform electroplastic processing on the finite element model using the plurality of pulse current parameters to obtain an electroplastic processing result;

[0010] determining target pulse current parameters that make the healing effect of the target micro-crack best using the electroplastic processing result, to perform electroplastic processing on the component to be healed using the target pulse current parameters to heal the internal micro-cracks of the component.

[0011] In another aspect, a device for healing internal micro-cracks of a component is provided, comprising:

[0012] a morphology obtaining unit configured to obtain a micro-crack morphology to be healed inside a component to be healed;

[0013] a selection unit configured to select a maximum crack as a target micro-crack according to the morphology;

[0014] an energy determining unit configured to determine a current input energy capable of healing the target micro-crack according to the size of the target micro-crack;

[0015] a result determining unit configured to establish a finite element model of the target micro-crack according to the attribute of the member to be healed, and determine a plurality of pulse current parameters according to the current input energy, so as to respectively perform an electroplastic processing on the finite element model by using the plurality of pulse current parameters, and obtain an electroplastic processing result;

[0016] a parameter determining unit configured to determine a target pulse current parameter capable of achieving the best healing effect on the target micro-crack by using the electroplastic processing result, so as to perform an electroplastic processing on the member to be healed by using the target pulse current parameter, and heal the micro-crack in the member.

[0017] In another aspect, a computer device is provided, which comprises a memory and a processor, the memory is configured to store a computer program, and the processor is configured to execute the computer program stored in the memory, so as to implement the steps of the method for healing the micro-crack in the member.

[0018] In another aspect, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to implement the steps of the method for healing the micro-crack in the member.

[0019] In another aspect, a computer program product is provided, which comprises a computer program, and the computer program is executed by a processor to implement the steps of the method for healing the micro-crack in the member.

[0020] The technical scheme provided by the present application can bring at least the following beneficial effects:

[0021] Since the crack position is empty, after the pulse current is input to the member, the crack position is short-circuited, so that the current intensity around the crack increases, the temperature around the crack increases, and then the heat generated under the action of high temperature collides to make the two sides of the crack contact. In addition, a compressive stress is generated at the micro-crack, which can cause plastic deformation. Therefore, after the two sides of the crack contact, they will not recover, thereby achieving the purpose of healing the micro-crack. In the present scheme, the largest crack in the member to be healed is taken as the target micro-crack, the current input energy capable of healing the target micro-crack is determined, and then the finite element model is used to determine the target pulse current parameter capable of achieving the best healing effect on the target micro-crack and satisfying the current input energy. As long as the target micro-crack can be healed, other cracks smaller than the target micro-crack can also be healed. Therefore, the present scheme can heal the micro-crack in the member. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings described below are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0023] Figure 1 is a flow chart of a method for healing micro-cracks in a component according to an embodiment of the present application;

[0024] Figure 2 is a structural schematic diagram of a device for healing micro-cracks in a component according to an embodiment of the present application;

[0025] Figure 3 is a hardware architecture diagram of a computing device according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0027] The following describes a specific implementation of the above concept.

[0028] Reference is made to Figure 1 A method for healing micro-cracks in a component according to an embodiment of the present application comprises:

[0029] Step 100: Obtain the morphology of micro-cracks to be healed in a component to be healed;

[0030] Step 102: Select the largest crack as a target micro-crack according to the morphology;

[0031] Step 104: Determine the current input energy that can heal the target micro-crack according to the size of the target micro-crack;

[0032] Step 106: Establish a finite element model of the target micro-crack according to the properties of the component to be healed, and determine a plurality of groups of pulse current parameters according to the current input energy, so as to perform electroplastic processing on the finite element model by using the plurality of groups of pulse current parameters respectively, and obtain an electroplastic processing result;

[0033] In step 108, the target pulse current parameter that makes the target micro-crack healing effect best is determined by using the electroplastic treatment result, so as to use the target pulse current parameter to perform electroplastic treatment on the component to be healed, and heal the micro-crack in the component.

[0034] In the embodiment of the present application, since the crack position is empty, after the pulse current is applied to the component, the crack position is short-circuited, so that the current intensity around the crack is increased to increase the temperature around the crack, and then the heat generated under the high temperature collides to make the two sides of the crack contact. In addition, the compressive stress generated at the micro-crack can cause plastic deformation, so that the two sides of the crack do not contact after the crack is healed, thereby achieving the purpose of healing the micro-crack. In the present scheme, the largest crack in the component to be healed is taken as the target micro-crack, the current input energy that can heal the target micro-crack is determined, and then the target pulse current parameter that satisfies the current input energy and makes the healing effect of the target micro-crack best is determined by using the finite element model. As long as the target micro-crack can be healed, other cracks smaller than the target micro-crack can also be healed. Therefore, the present scheme can heal the micro-crack in the component.

[0035] The following describes Figure 1 The execution mode of each step is shown.

[0036] Firstly, steps 100 and 102 are described simultaneously.

[0037] In the embodiment of the present application, the component to be healed can be a component that is just shaped (for example, shaped by 3D printing, cold rolling, etc.), or a component in service. The component is a metal part with electrical conductivity, such as titanium alloy, aluminum alloy, steel, high-temperature alloy, etc. If the micro-crack in the component is not healed, the micro-crack existing in the material will cause fatigue failure of the mechanical part during use under the action of cyclic load. Therefore, it is necessary to heal the micro-crack.

[0038] In the embodiment of the present application, in order to heal the micro-crack, the electroplastic method is used to apply pulse current to the component, so that the crack contacts and plastic deformation is generated, and the micro-crack is healed. The difficulty of healing the micro-crack by pulse current lies in the selection of pulse current parameters. The key to healing the micro-crack is to form a high temperature gradient near the crack, so as to generate a large enough thermal stress, and the thermal stress value is controlled by the pulse current parameter. The influence of the pulse parameter on the healing of the micro-crack is essentially that the input of the pulse current provides the necessary energy for the healing of the micro-crack. Therefore, the pulse current input energy is an important basis for selecting appropriate pulse parameters.

[0039] In order to determine the appropriate current input energy, in the embodiment of the present application, it is necessary to first determine the micro-crack morphology to be healed in the internal part of the component to be healed. In one embodiment of the present application, the size of the micro-crack is 0.5-200 um. Since the size of the micro-crack is small, belonging to the um level, therefore, the micro-crack morphology needs to be obtained by high-resolution industrial CT scanning, with a scanning accuracy of 0.1-50 um, so as to ensure that the micro-crack with a size of 0.5-200 um can be scanned.

[0040] In the embodiment of the present application, after obtaining the micro-crack morphology to be healed in the internal part of the component to be healed, the micro-crack morphology can be counted by using a data processing software, which can be Matlab, Python, origin, etc. Among them, the micro-crack morphology includes the size (length, width and depth) of the micro-crack and the volume density corresponding to the micro-crack with different lengths.

[0041] During the healing of the micro-crack, if the current input energy of the pulse current is too small, the micro-crack will not be completely healed, and if the current input energy of the pulse current is too large, the internal part of the component will be completely melted, affecting the service life of the component. Therefore, it is necessary to select appropriate current input energy. In the embodiment of the present application, it is considered that if the micro-crack with the largest size can be healed, the micro-cracks with other sizes in the component can also be healed, and since the size of the micro-crack is 0.5-200 um, the current input energy capable of healing the micro-crack with the largest size can make the micro-crack with small size form an integral part with the component after healing, and there is no temperature difference, so that not only the micro-crack with small size can be healed, but also the quality of the component can be ensured not to be damaged.

[0042] In one embodiment of the present application, the largest crack is selected as the target micro-crack according to the morphology, which can be selected by any one of the following ways:

[0043] The first way: based on the morphology of each micro-crack in the internal part of the component to be healed, the size of each micro-crack is counted by using a data processing software, and the micro-crack with the largest size is selected as the target micro-crack;

[0044] The second way: based on the morphology of each micro-crack in the internal part of the component to be healed, the volume density corresponding to the micro-crack with different sizes is counted by using a data processing software, and the micro-crack with the size corresponding to the highest volume density is selected as the target micro-crack.

[0045] The volume density refers to the number of micro-cracks in a unit volume. The highest volume density refers to the micro-crack size with the most number of micro-cracks in a unit volume.

[0046] Then, the step 104 "determining the current input energy that can make the target micro crack heal according to the size of the target micro crack" and the step 106 "establishing a finite element model of the target micro crack according to the properties of the member to be healed, and determining a plurality of pulse current parameters according to the current input energy, so as to respectively perform electroplastic treatment on the finite element model by using the plurality of pulse current parameters, and obtain an electroplastic treatment result" are simultaneously described.

[0047] In the embodiment of the present application, when the properties of the metal member are determined, the current input energy used for healing micro cracks of the same size is approximately equal. In the step 104, when the current input energy that can make the target micro crack heal according to the size of the target micro crack is determined, the current input energy can be determined by experimental data.

[0048] In one implementation, the step 104 can be implemented by the following method:

[0049] S1: determining whether there is experimental data of a member sample with the same properties as the properties of the member to be healed based on the properties of the member to be healed; the experimental data includes current input energy required for healing micro cracks of different sizes corresponding to the member sample; wherein, the current input energy required for healing the micro crack of the sample size is obtained by: for the micro crack of the sample size in the member sample, the current input energy is input to the member sample in a plurality of small amounts, so as to observe the healing process of the micro crack in the member sample, and obtain the total current input energy used for completely healing the micro crack of the sample size;

[0050] S2: if yes, then the current input energy that can make the target micro crack heal is directly obtained by using the experimental data of the member sample with the same properties according to the size of the target micro crack;

[0051] S3: if no, then the current input energy is determined by using the experimental data of a member sample with other properties similar to the properties of the member to be healed according to the size of the target micro crack.

[0052] The properties of the member include metal material, rigidity, strength, etc.

[0053] During the experiment, if a component sample with the same properties as the component to be healed has been used in the experiment, the current input energy corresponding to the size of the target microcrack can be obtained using the experimental data. During the experiment, when performing a healing experiment on a target microcrack of the sample size in the component sample, the standard current input energy is determined. This standard current input energy includes: the standard amount of input current energy and the standard duration. After each application of standard current input energy, the average healing size is determined by observing the healing status of the microcrack in the component sample using CT. If the microcrack is not healed, the next application of standard current input energy is performed. If the microcrack is healed, the total energy of the applied standard current input energy is counted, and this total energy is used as the current input energy required to heal the sample size of the component sample.

[0054] It is evident that the current input energy corresponding to different component sizes can be obtained through the experiment.

[0055] However, due to the limited experimental data on component samples, it is impossible to conduct experiments on all components with different properties. Therefore, experimental data from component samples with similar properties can be used to roughly determine the current input energy. This similarity can be achieved by using the same metallic material but different stiffness or strength; or by using different metallic materials but with the same or similar stiffness and strength.

[0056] It should be noted that the similarity attribute can be determined by those skilled in the art based on the actual similarity situation. If there is neither experimental data on the same attribute nor experimental data on similar attributes, then the component to be cured can be considered as a component sample for experimentation to obtain experimental data, providing experimental data for subsequent components with the same attribute, thus facilitating the cure of subsequent components with the same attribute.

[0057] Since the difficulty of this embodiment of the invention lies in how to determine the appropriate pulse current parameters, once the current input energy is determined, multiple sets of pulse current parameters corresponding to the current input energy can be determined by the calculation relationship between the pulse current parameters and the current input energy.

[0058] The operational relationship is as follows:

[0059]

[0060] Where q is the input current energy, ρ i For t i The resistivity of the component material at the corresponding temperature at any given time, j(t) is the expression for the current density, and m is the total number of pulse currents;

[0061] The expression of the current density corresponding to different pulse waveforms is different; the expression of the current density is related to the pulse period, the pulse interval time, the pulse current type, and the current density amplitude.

[0062] Specifically, the pulse waveform can at least include a damped decay wave, a square wave, a sine wave, a triangular wave, and a sawtooth wave.

[0063] When the pulse waveform is a damped decay wave, the expression of the current density is:

[0064]

[0065]

[0066] wherein j m is the current density amplitude, with the unit of A / mm 2 , t p is the pulse period, a is the pulse current decay coefficient (dimensionless), I 1m and I 2m are the first peak value and the second peak value of the pulse current respectively.

[0067] When the pulse waveform is a square wave, the expression of the current density is:

[0068] j(t)=j m (t<t p / 2);

[0069] j(t)=-j m (t p / 2<t<t p )

[0070] When the pulse waveform is a sine wave, the expression of the current density is:

[0071]

[0072] When the pulse waveform is a triangular wave, the expression of the current density is:

[0073] j(t)=kt(t<tp / 4)

[0074]

[0075]

[0076] When the pulse waveform is a sawtooth wave, the expression of the current density is:

[0077] j(t)=kt(t<tp / 2);

[0078]

[0079] According to the expression of the current density and the operation relationship, a plurality of groups of pulse current parameters corresponding to different pulse waveforms can be obtained.

[0080] In order to simulate the healing effect of each group of pulse current parameters on the to-be-healed component, a component finite element model can be used for simulation. The finite element model only includes one micro-crack, i.e., a target micro-crack, and only the healing effect of the pulse current parameters on the target micro-crack needs to be observed. It should be noted that the finite element model is constructed based on the properties of the to-be-healed component, so that the changes in the internal structure of the metal component after the pulse current is applied can be accurately represented. The construction method of the finite element model can be realized by using the prior art, and thus will not be described herein.

[0081] In the embodiment of the present application, the electroplastic effect of the plurality of groups of pulse current parameters on the finite element model is the morphology of the target micro-crack in the finite element model.

[0082] Finally, for step 108, the target pulse current parameter that achieves the best healing effect of the target micro-crack is determined by using the electroplastic treatment result, so that the to-be-healed component is subjected to electroplastic treatment by using the target pulse current parameter, and the internal micro-crack of the component is healed.

[0083] If the target micro-crack is not completely healed in the plurality of electroplastic results, the pulse current parameter corresponding to the smallest size is selected as the target pulse current parameter with the best healing effect. If the target micro-crack is completely healed in the plurality of electroplastic results, the pulse current parameter closest to the healing state is selected as the target pulse current parameter with the best healing effect.

[0084] After the target pulse current parameter is determined, the to-be-healed component is directly subjected to electroplastic treatment by using the target pulse current parameter, and the internal micro-crack of the component is healed.

[0085] Further, if the current input energy is roughly determined according to the similar properties in step 104, after step 108, the following steps can also be included: obtaining the healing result obtained by using the target pulse current parameter to perform electroplastic treatment on the to-be-healed component; comparing the micro-crack morphology in the healing result with the to-be-healed micro-crack morphology to obtain the healing effect; determining whether the current input energy is accurate by using the healing effect, and if not, adjusting the current input energy by using the healing effect. Thus, the healing effect is used as a sample to realize the healing of components with the same properties as the to-be-healed component, and the adjusted current input energy can be used to improve the healing effect of other to-be-healed components.

[0086] In the embodiment of the present application, the healing result obtained after the electroplastic treatment of the target micro-crack in the component by using the target pulse current parameter is also based on the industrial CT scanning. If the volume density and size (length, width and depth) of the micro-crack in the component change, the volume density of the micro-crack is reduced by 50% to 80% and the size of the micro-crack is reduced by 20% to 80%, the healing effect is determined to be achieved.

[0087] Please refer to Figure 2 The embodiment of the present application also provides a healing device for a micro-crack in a component, which comprises:

[0088] The shape acquisition unit 200 is configured to acquire the shape of the micro-crack to be healed in the component to be healed.

[0089] The selection unit 202 is configured to select the largest crack as the target micro-crack according to the shape.

[0090] The energy determination unit 204 is configured to determine the current input energy that can heal the target micro-crack according to the size of the target micro-crack.

[0091] The result determination unit 206 is configured to establish a finite element model of the target micro-crack according to the properties of the component to be healed, and determine a plurality of groups of pulse current parameters according to the current input energy, so as to perform electroplastic treatment on the finite element model by using the plurality of groups of pulse current parameters respectively, and obtain electroplastic treatment results.

[0092] The parameter determination unit 208 is configured to determine the target pulse current parameter that can achieve the best healing effect for the target micro-crack by using the electroplastic treatment results, so as to perform electroplastic treatment on the component to be healed by using the target pulse current parameter, and heal the micro-crack in the component.

[0093] In an embodiment of the present application, the selection unit is specifically configured to: based on the shape of each micro-crack in the component to be healed, use a data processing software to count the size of each micro-crack, and select the micro-crack with the largest size as the target micro-crack; or based on the shape of each micro-crack in the component to be healed, use a data processing software to count the volume density corresponding to the micro-crack with different sizes, and select the micro-crack with the size corresponding to the highest volume density as the target micro-crack.

[0094] In an embodiment of the present application, the pulse current parameter comprises: pulse period, pulse interval time, pulse current type, pulse waveform, current density amplitude and total pulse current processing time.

[0095] When the result determination unit determines a plurality of groups of pulse current parameters according to the current input energy, the result determination unit specifically comprises:

[0096] Determine the multiple groups of pulse current parameters corresponding to the current input energy by using the following operation relationship:

[0097]

[0098] Wherein, q is the current input energy, p is the resistivity of the component material at the temperature corresponding to the time t, j(t) is the expression of the current density, and m is the total number of pulse currents. i i j(t) is the expression of the current density, and m is the total number of pulse currents.

[0099] The expression of the current density corresponding to different pulse waveforms is different; the expression of the current density is related to the pulse period, the pulse interval time, the pulse current type, and the current density amplitude.

[0100] In an embodiment of the present application, the micro-crack morphology is obtained by high-resolution industrial CT scanning.

[0101] The size of the micro-crack is 0.5-200 um.

[0102] In an embodiment of the present application, the energy determination unit is specifically configured to determine whether there is experimental data of a component sample having the same attribute as the attribute of the component to be healed based on the attribute of the component to be healed; the experimental data includes current input energy required for healing micro-cracks of different sizes of the component sample; wherein, the current input energy required for healing micro-cracks of the sample size of the component sample is obtained by the following method: for the micro-cracks of the sample size in the component sample, the current input energy is passed to the component sample in a small amount of multiple ways to observe the healing process of the micro-cracks in the component sample, and the total current input energy used to completely heal the micro-cracks of the sample size is obtained; if yes, the current input energy that can heal the target micro-crack is directly obtained by using the experimental data of the component sample having the same attribute according to the size of the target micro-crack; if no, the current input energy is determined by using the experimental data of the component sample having other attributes similar to the attribute of the component to be healed according to the size of the target micro-crack.

[0103] In an embodiment of the present application, the device can further include a comparison and adjustment unit configured to, after determining the current input energy by using the experimental data of the component sample having other attributes similar to the attribute of the component to be healed, obtain a healing result obtained by performing electroplastic processing on the component to be healed by using the target pulse current parameter; compare the micro-crack morphology in the healing result with the micro-crack morphology to be healed to obtain a healing effect; determine whether the current input energy is accurate by using the healing effect, and adjust the current input energy by using the healing effect if the current input energy is not accurate.

[0104] ​It should be noted that the above-mentioned embodiment provides a healing device for internal micro-cracks of a component, which is only exemplified by the above-mentioned division of each functional module. In actual application, the above-mentioned functions can be completed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the healing device for internal micro-cracks of a component and the healing method for internal micro-cracks of a component provided in the above-mentioned embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be described here.

[0105] Embodiments of the present application also provide a computer device, which refers to Figure 3 The computer device includes a processor and a memory, and the memory stores at least one instruction, at least one program, a code set or an instruction set. The at least one instruction, at least one program, code set or instruction set is loaded and executed by the processor to implement the healing method for internal micro-cracks of a component provided by each method embodiment.

[0106] Embodiments of the present application also provide a computer readable storage medium, which stores at least one instruction, at least one program, a code set or an instruction set. The at least one instruction, at least one program, code set or instruction set is loaded and executed by the processor to implement the healing method for internal micro-cracks of a component provided by each method embodiment.

[0107] Embodiments of the present application also provide a computer program product, which includes a computer program. The processor of the computer device reads the computer program from the computer readable storage medium. The processor executes the computer program, so that the computer device executes the healing method for internal micro-cracks of a component described in any of the above-mentioned embodiments.

[0108] For the convenience of description, the above system or device is described as various modules or units in function. Of course, in the implementation of the present application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0109] From the above description of the embodiments, those skilled in the art can clearly understand that the present application can be implemented by means of software and necessary general hardware platforms. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes a plurality of instructions for making a computer device (which can be a personal computer, server, or network device, etc.) execute the methods described in each embodiment or some parts of the embodiments of the present application.

[0110] Finally, it needs to be pointed out that, in this document, relational terms such as first, second, third, and fourth and the like can only be used to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual relationship or order between or among such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0111] The above description is merely preferred embodiments of the present application, and it is obvious to those skilled in the art that, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as falling within the scope of the present application.

Claims

1. A method for healing microcracks in a structure, characterized by, The method comprises the following steps: acquiring the morphology of micro-cracks in a component to be healed; selecting a maximum crack as a target micro-crack according to the morphology; determining a current input energy capable of healing the target micro-crack according to the size of the target micro-crack; establishing a finite element model of the target micro-crack according to the properties of the component to be healed, and determining a plurality of pulse current parameters according to the current input energy, so as to perform electroplastic treatment on the finite element model by using the plurality of pulse current parameters respectively, and obtain electroplastic treatment results; determining target pulse current parameters capable of achieving the best healing effect of the target micro-crack by using the electroplastic treatment results, and performing electroplastic treatment on the component to be healed by using the target pulse current parameters, so as to heal the micro-cracks in the component.

2. The method of claim 1, wherein, The step of selecting a maximum crack as a target micro-crack according to the morphology comprises the following steps: based on the morphology of each micro-crack in the component to be healed, using a data processing software to count the size of each micro-crack, and selecting a micro-crack with the largest size as a target micro-crack; or based on the morphology of each micro-crack in the component to be healed, using a data processing software to count the volume density corresponding to micro-cracks with different sizes, and selecting a micro-crack with the size corresponding to the highest volume density as a target micro-crack. The pulse current parameters comprise a pulse period, a pulse interval time, a pulse current type, a pulse waveform, a current density amplitude and a total pulse current treatment time.

3. The method of claim 1, wherein, The step of determining a plurality of pulse current parameters according to the current input energy comprises the following steps: determining a plurality of pulse current parameters corresponding to the current input energy by using the following operation relationship: The expression of the current density corresponding to different pulse waveforms is different; the expression of the current density is related to the pulse period, the pulse interval time, the pulse current type and the current density amplitude. where q is the current input energy, p i is the resistivity of the component material at the temperature corresponding to time t i j(t) is the expression of the current density, and m is the total number of pulse currents; 4. The method according to any one of claims 1-3, wherein the morphology of the micro-cracks is obtained by high-resolution industrial CT scanning; the size of the micro-cracks is 0.5-200 um. The step of determining a current input energy capable of healing the target micro-crack according to the size of the target micro-crack comprises the following steps:

5. The method of claim 1, wherein, based on the properties of the component to be healed, determining whether there is experimental data of a component sample with the same properties; the experimental data comprises current input energy required for healing micro-cracks with different sizes corresponding to the component sample; wherein, the current input energy required for healing a sample size micro-crack is obtained in the following manner: for a sample size micro-crack in the component sample, a small amount of current input energy is input into the component sample for multiple times, so as to observe the healing process of the micro-cracks in the component sample, and obtain the total current input energy used for completely healing the sample size micro-crack; if yes, the current input energy capable of healing the target micro-crack is directly obtained by using the experimental data of the component sample with the same properties according to the size of the target micro-crack; if no, the current input energy is determined by using experimental data of a component sample with other properties similar to the properties of the component to be healed according to the size of the target micro-crack. ​ 6. The method of claim 5, wherein, After determining the current input energy by using experimental data of a component sample with other properties similar to the properties of the component to be healed, the method further comprises: obtaining a healing result obtained by performing electroplastic treatment on the component to be healed by using the target pulse current parameters; comparing the microcrack morphology in the healing result with the microcrack morphology to be healed to obtain a healing effect; determining whether the current input energy is accurate by using the healing effect, and adjusting the current input energy by using the healing effect if the current input energy is not accurate.

7. A device for healing microcracks in a structure, characterized in that, The device comprises: a morphology obtaining unit configured to obtain a microcrack morphology to be healed inside a component to be healed; a selecting unit configured to select a maximum crack as a target microcrack according to the morphology; an energy determining unit configured to determine a current input energy that can heal the target microcrack according to a size of the target microcrack; a result determining unit configured to establish a finite element model of the target microcrack according to properties of the component to be healed, and determine a plurality of sets of pulse current parameters according to the current input energy, so as to perform electroplastic treatment on the finite element model by using the plurality of sets of pulse current parameters respectively to obtain electroplastic treatment results; a parameter determining unit configured to determine target pulse current parameters that make the healing effect of the target microcrack best by using the electroplastic treatment results, so as to perform electroplastic treatment on the component to be healed by using the target pulse current parameters to heal the microcrack inside the component.

8. A computer device, comprising: The computer device comprises a memory and a processor, the memory is configured to store a computer program, and the processor is configured to execute the computer program stored in the memory to implement the steps of the method according to any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, and the computer program is executed by a processor to implement the steps of the method according to any one of claims 1-6.

10. A computer program product, characterised in that, The computer program is executed by a processor to implement the steps of the method according to any one of claims 1-6.

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