A pneumatic gripper for wafer single wafer cleaning equipment

Abstract

This invention discloses a pneumatic gripper for a wafer cleaning device, comprising an upper cover and a housing disposed at the bottom of the upper cover, with a sealed cavity formed between the upper cover and the housing. The upper end of the upper cover has an air outlet, and the side of the upper cover has an air inlet. A guide post is disposed at the bottom inner side of the housing, and a piston cylinder is movably sleeved on the outer side of the upper end of the guide post. A first spring is vertically disposed inside the piston cylinder, and the bottom edge of the piston cylinder is chamfered. This pneumatic gripper for wafer cleaning effectively grips wafers through the coordinated operation of the air inlet, air outlet, fixing plate, vertical arm, limiting base block, piston cylinder, first spring, guide post, push rod, second spring, and rollers. It has a simple structure, is easy to manufacture and install, occupies little space, and can adapt to wafers of different sizes.

Description

Technical Field

[0001] This invention relates to the field of wafer single-wafer production equipment, and in particular to a pneumatic gripper for wafer single-wafer cleaning equipment. Background Technology

[0002] In semiconductor manufacturing processes, precise wafer handling and positioning are fundamental to ensuring the smooth operation of subsequent processing steps, especially in critical stages such as wafer cleaning. Traditional mechanical grippers hold wafers through physical contact. During this process, factors such as gripper material, design precision, or improper operation can leave micro-scratches or introduce contaminants onto the wafer surface, directly threatening the performance of semiconductor devices and the yield of the final product. To address this challenge, the industry has begun exploring and implementing the application of pneumatic grippers. Pneumatic grippers operate based on air pressure control, using adjusted gas pressure to achieve gentle and stable clamping of the wafer. Compared to mechanical grippers, pneumatic grippers exhibit greater flexibility, achieving a more uniform clamping force distribution without damaging the wafer surface, which is crucial for protecting wafers from physical damage.

[0003] However, despite the enormous potential of pneumatic grippers in semiconductor manufacturing, their current applications still face some limitations. First, existing pneumatic gripper designs are often complex, containing multiple precision components and control systems, which not only increases manufacturing costs but also places higher demands on subsequent maintenance. Second, most pneumatic grippers are optimized for specific wafer sizes and lack broad compatibility with wafers of different sizes. This has become a pressing issue in semiconductor manufacturing, especially given the increasing diversity of wafer sizes due to technological advancements and changing market demands.

[0004] Therefore, it is necessary to propose a pneumatic gripper for a single-wafer cleaning device to solve the above problems. Summary of the Invention

[0005] The main objective of this invention is to provide a pneumatic gripper for a wafer cleaning device, which can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A pneumatic gripper for a wafer cleaning device includes an upper cover and a housing disposed at the bottom of the upper cover, with a sealed cavity formed between the upper cover and the housing. The upper end of the upper cover is provided with an air outlet, and the side of the upper cover is provided with an air inlet. A guide post is provided at the bottom inner side of the housing, and a piston cylinder is movably sleeved on the outer side of the upper end of the guide post. A first spring is vertically arranged inside the piston cylinder, and the bottom edge of the piston cylinder is chamfered. A push rod that can be radially displaced along the housing is uniformly arranged around the outer periphery of the inner side of the housing. A roller corresponding to the bottom edge of the piston cylinder is rotatably connected to one end of the push rod near the center of the housing. A second spring is sleeved on the outer end of the push rod near the roller, and the second spring is configured to be compressible when the push rod is displaced away from the center of the housing. A fixing plate is provided at the end of the push rod away from the roller, and a vertical arm is vertically arranged at the bottom of the fixing plate. A limiting block protruding from the side wall of the vertical arm is provided at the bottom of the vertical arm.

[0008] Preferably, a pin is rotatably provided at one end of the push rod near the center of the housing, and the roller is mounted on the pin.

[0009] Preferably, the lower end of the guide post is threaded to the center of the inner bottom of the housing.

[0010] Preferably, a sensor is provided at one bottom end of the housing;

[0011] The bottom of the housing is provided with a bottom cover, and one end of the bottom cover is provided with a sensor through slot corresponding to the sensor.

[0012] Preferably, the bottom periphery of the housing is uniformly surrounded by pressure blocks that correspond one-to-one with the push rods. The bottom of the pressure blocks and the corresponding positions on the top of the housing are provided with sliding grooves adapted to the push rods, and the push rods are slidably connected to the inside of the sliding grooves.

[0013] Preferably, a second rubber block is vertically provided on the inward-facing side of the lower end of the support arm.

[0014] Preferably, a piston rod is vertically arranged on the top inner side of the piston cylinder. The guide post has a hollow structure. The lower end of the piston rod extends through the guide post, the housing, and the bottom cover to the bottom of the bottom cover. The piston rod, guide post, housing, and bottom cover are all movably connected. A cylinder corresponding to the piston rod is arranged at the bottom of the bottom cover. A piston for movably sealing connection with the inner side of the cylinder is arranged at the bottom of the piston rod. An annular groove is arranged on the outer periphery of the bottom of the cylinder. A slide cylinder is vertically and movably sealed to the inner side of the annular groove. A suction cup is arranged at the bottom of the slide cylinder. A third spring is vertically arranged between the top of the slide cylinder and the top inner side of the annular groove. An exhaust hole communicating with the annular groove is arranged on the upper side wall of the cylinder.

[0015] Preferably, the upper side wall of the cylinder is provided with a pressure relief hole that communicates with the inner cavity of the cylinder.

[0016] Preferably, the upper end of the inward-facing side of the vertical arm is evenly and movably provided with ball bearings along the height direction, and in the initial state of the third spring, the bottom of the suction cup is lower than the lowest ball bearing, and the top of the limiting block is lower than the bottom of the suction cup.

[0017] A second rubber block is provided at the lower end of the inward-facing side of the vertical arm.

[0018] Preferably, the top of the limiting base block is provided with an arc-shaped first rubber block.

[0019] Compared with the prior art, the present invention provides a pneumatic gripper for a wafer single-wafer cleaning device, which has the following beneficial effects:

[0020] This wafer cleaning equipment features a pneumatic gripper that effectively grips wafers through the coordinated operation of an air inlet, air outlet, fixed plate, vertical arm, limiting base block, piston cylinder, first spring, guide column, push rod, second spring, and rollers. It boasts a simple structure, is easy to manufacture and install, and occupies little space. The gripping force can be controlled by adjusting the number of coils in the second and first springs, reducing the breakage rate and lowering costs through adjustments. Furthermore, the quick-change vertical arm allows for compatibility with different wafer types.

[0021] The pneumatic gripper of this wafer cleaning equipment, through the coordinated operation of a piston rod, cylinder, piston, annular groove, third spring, pressure relief hole, exhaust hole, slide cylinder, suction cup, and ball bearings, can easily grip stacked wafers. The linkage between the device and the piston cylinder results in a compact structure, ease of use, and improved efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is an exploded view of the present invention;

[0024] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the vertical arm in the first embodiment of the present invention;

[0026] Figure 5 This is a cross-sectional structural schematic diagram of the second embodiment of the present invention;

[0027] Figure 6 This is the present invention. Figure 5 Enlarged view of point A in the middle;

[0028] Figure 7 This is the present invention. Figure 5 Enlarged view of section B in the middle.

[0029] In the diagram: 1. Top cover; 2. Air inlet; 3. Air outlet; 4. Housing; 5. Fixing plate; 6. Vertical arm; 7. Limiting bottom block; 8. Piston cylinder; 9. First spring; 10. Guide post; 11. Pressure block; 12. Slide groove; 13. Push rod; 14. Second spring; 15. Sensor; 16. Bottom cover; 17. Sensor through slot; 18. Pin; 19. Roller; 20. Piston rod; 21. Cylinder; 22. Piston; 23. Annular groove; 24. Third spring; 25. Pressure relief hole; 26. Exhaust hole; 27. Slide cylinder; 28. Suction cup; 29. ​​Ball bearing; 30. First rubber block; 31. Second rubber block. Detailed Implementation

[0030] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0031] First embodiment, such as Figure 1-4 As shown, a pneumatic gripper for a wafer cleaning device includes an upper cover 1 and a housing 4 disposed at the bottom of the upper cover 1, with a sealed cavity formed between the upper cover 1 and the housing 4. An air outlet 3 is provided at the upper end of the upper cover 1, and an air inlet 2 is provided on the side of the upper cover 1. A guide post 10 is threaded at the center of the bottom inner side of the housing 4. A piston cylinder 8 is movably sleeved on the outer side of the upper end of the guide post 10. A first spring 9 is vertically disposed inside the piston cylinder 8. The bottom edge of the piston cylinder 8 is chamfered. Push rods 13, which can be radially displaced along the housing 4, are uniformly arranged around the outer periphery of the inner side of the housing 4. Specifically, pressure blocks 11, corresponding to the push rods 13, are uniformly arranged around the bottom periphery of the housing 4. Slide grooves 12, adapted to the push rods 13, are provided at the bottom of the pressure blocks 11 and at corresponding positions on the top of the housing 4. The push rods 13 are slidably connected to the inner side of the slide grooves 12. The end of the push rod 13 closest to the center of the housing 4 is rotatably connected to the inner side of the slide grooves 12. A roller 19 corresponding to the bottom edge of the piston cylinder 8 is connected. Specifically, a pin 18 is rotatably provided at the end of the push rod 13 near the center of the housing 4, and the roller 19 is mounted on the pin 18. A second spring 14 is sleeved on the outer end of the push rod 13 near the roller 19, and the second spring 14 is configured to be compressed when the push rod 13 is displaced away from the center of the housing 4. A fixing plate 5 is provided at the end of the push rod 13 away from the roller 19. A vertical arm 6 is provided at the bottom of the fixing plate 5. A limiting bottom block 7 protruding from the side wall of the arm 6 is provided at the bottom of the arm 6. A sensor 15 is provided at one end of the bottom of the housing 4. A bottom cover 16 is provided at the bottom of the housing 4. A sensor through groove 17 corresponding to the sensor 15 is provided at one end of the bottom cover 16. In order to avoid damage, a second rubber block 31 is vertically provided on the inward side of the lower end of the arm 6. An arc-shaped first rubber block 30 is provided on the top of the limiting bottom block 7.

[0032] Second embodiment, such as Figure 5-7As shown, to grip stacked wafers, unlike the above scheme, a piston rod 20 is vertically installed at the top inner side of the piston cylinder 8. The guide post 10 has a hollow structure. The lower end of the piston rod 20 extends through the guide post 10, the housing 4, and the bottom cover 16 to the bottom of the bottom cover 16. The piston rod 20 is movably guided to the guide post 10, the housing 4, and the bottom cover 16. A cylinder 21 corresponding to the piston rod 20 is installed at the bottom of the bottom cover 16. A piston 22 is installed at the bottom of the piston rod 20 for movably sealing to the inner side of the cylinder 21. An annular groove 23 is provided on the outer periphery of the bottom of the cylinder 21. A slide cylinder 27 is vertically and movably sealed to the inner side of the annular groove 23. A suction cup 28 is provided at the bottom. A third spring 24 is vertically arranged between the top of the slide cylinder 27 and the inner top of the annular groove 23. An exhaust hole 26 communicating with the annular groove 23 is provided on the upper side wall of the cylinder 21. A pressure relief hole 25 communicating with the inner cavity of the cylinder 21 is provided on the upper side wall of the cylinder 21. In order to facilitate the wafer being pushed down by the suction cup 28, a ball bearing 29 is evenly arranged along the height direction on the upper end of the inward side of the vertical arm 6. In the initial state of the third spring 24, the bottom of the suction cup 28 is lower than the lowest ball bearing 29, and the top of the limiting block 7 is lower than the bottom of the suction cup 28. In order to avoid damage, a second rubber block 31 is provided on the lower end of the inward side of the vertical arm 6.

[0033] Working principle:

[0034] For handling and cleaning wafers that are not stacked, the device is connected to a robotic arm or similar equipment that drives its movement. External air pumps can be connected to the air inlet 2 and air outlet 3 for control. During operation, the robotic arm moves the device above the wafers. Once sensor 15 detects its position, air is supplied to the air inlet 2 via the air pump. This causes the piston cylinder 8 to move downwards under pressure, compressing the first spring 9. The lower end of the piston cylinder 8 pushes the roller 19, which in turn pushes the push rod 13 outwards, compressing the second spring 14 and thus the fixing plate 5... The arm 6 and the limiting block 7 are moved outward as a whole until the limiting block 7 is completely outside the wafer. Then the robot continues to move the whole device downward until the limiting block 7 is below the wafer. Then the air outlet 3 releases air, the first spring 9 returns to its original position, the piston cylinder 8 moves upward, the second spring 14 returns to its original position, and the push rod 13 moves the arm 6 and the limiting block 7 inward as a whole through the fixing plate 5. Then the second rubber block 31 on the side of the arm 6 clamps the wafer. If the wafer is small, it can be supported by the first rubber block 30 on the top of the limiting block 7.

[0035] For handling and cleaning stacked wafers, the process is similar to the one described above. The device is moved above the wafers. However, unlike the previous method, when the piston cylinder 8 moves downwards, it also moves the piston rod 20 downwards. The piston rod 20 then pushes the piston 22 downwards, causing the suction cup 28 to adhere to the top of the wafer. Finally, when exhausting air through the vent 3, the piston cylinder 8 moves upwards, causing the piston rod 20 to move upwards. Due to the negative pressure, the wafer is moved upwards. The slide cylinder 27 moves upwards in the annular groove 23, compressing the third spring 24 to adapt. After the top wafer separates from the bottom wafer, the robot arm removes the wafer using this device. Before the piston 22 reaches the top of the pressure relief hole 25, one end of the limiting block 7 moves to the bottom of the wafer. The vertical arm 6 clamps the wafer using the ball bearings 29. As the piston rod 20 moves upward, the piston 22 will move to the top of the pressure relief hole 25, thereby relieving the pressure inside the suction cup 28. The third spring 24 will reset and move downward, and the wafer will be pushed downward by the suction cup 28. Then the wafer will separate from the ball 29 and reach the second rubber block 31, where it will be held by the second rubber block 31 or supported by the first rubber block 30. Since the bottom of the suction cup 28 is lower than the bottom ball 29 in the initial state of the third spring 24, and the top of the limiting block 7 is lower than the bottom of the suction cup 28, a gap will be formed between the wafer pushed down by the suction cup 28 and the suction cup 28. This will reduce the obstruction of the wafer by the suction cup 28 during subsequent cleaning and will not affect the cleaning process. Moreover, the ball 29 is arc-shaped and has line contact with the bottom of the wafer, so it will not affect the cleaning process either.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A pneumatic gripper for a wafer single-wafer cleaning equipment, characterized in that, The device includes a top cover (1) and a housing (4) located at the bottom of the top cover (1), with a sealed cavity formed between the top cover (1) and the housing (4). The top cover (1) has an air outlet (3) at its upper end and an air inlet (2) on its side. The bottom inner side of the housing (4) has a guide post (10), and a piston cylinder (8) is movably sleeved on the outer side of the upper end of the guide post (10). A first spring (9) is vertically arranged inside the piston cylinder (8), and a chamfer is provided at the bottom edge of the piston cylinder (8). The outer periphery of the inner side of the housing (4) is uniformly surrounded by a spring that can move radially along the housing (4). The push rod (13) is rotatably connected to a roller (19) corresponding to the bottom edge of the piston cylinder (8) at one end of the push rod (13) near the center of the housing (4). A second spring (14) is sleeved on the outer end of the push rod (13) near the roller (19). The second spring (14) is configured to be compressed when the push rod (13) is displaced away from the center of the housing (4). A fixing plate (5) is provided at the end of the push rod (13) away from the roller (19). A vertical arm (6) is provided at the bottom of the fixing plate (5). A limiting bottom block (7) protruding from the side wall of the vertical arm (6) is provided at the bottom of the vertical arm (6). The push rod (13) is rotatably provided with a pin (18) at one end near the center of the housing (4), and the roller (19) is provided on the pin (18); The lower end of the guide post (10) is threaded to the center of the inner bottom of the housing (4); A sensor (15) is provided at one bottom end of the housing (4); a bottom cover (16) is provided at the bottom of the housing (4), and a sensor through groove (17) corresponding to the sensor (15) is provided at one end of the bottom cover (16). The bottom of the outer periphery of the housing (4) is uniformly surrounded by pressure blocks (11) that correspond one-to-one with the push rod (13). The bottom of the pressure block (11) and the corresponding position of the top of the housing (4) are provided with sliding grooves (12) that are adapted to the push rod (13). The push rod (13) is slidably connected to the inside of the sliding groove (12). A second rubber block (31) is vertically installed on the inward side of the lower end of the arm (6). A piston rod (20) is vertically installed on the top inner side of the piston cylinder (8). The guide column (10) is a hollow structure. The lower end of the piston rod (20) extends through the guide column (10), the housing (4), and the bottom cover (16) to the bottom of the bottom cover (16). The piston rod (20) is connected to the guide column (10), the housing (4), and the bottom cover (16) in a movable guide connection. A cylinder (21) corresponding to the piston rod (20) is provided at the bottom of the bottom cover (16). The bottom of the piston rod (20) is provided with a cylinder (21) corresponding to the piston rod (20). A piston (22) is provided for a movable sealing connection with the inner side of the cylinder (21). An annular groove (23) is provided on the bottom periphery of the cylinder (21). A slide cylinder (27) is vertically and movablely sealed to the inner side of the annular groove (23). A suction cup (28) is provided at the bottom of the slide cylinder (27). A third spring (24) is vertically provided between the top of the slide cylinder (27) and the top of the inner side of the annular groove (23). An exhaust hole (26) communicating with the annular groove (23) is provided on the upper side wall of the cylinder (21). The upper side wall of the cylinder (21) is provided with a pressure relief hole (25) that communicates with the inner cavity of the cylinder (21). The upper end of the inward side of the vertical arm (6) is uniformly provided with ball bearings (29) along the height direction. When the third spring (24) is in its initial state, the bottom of the suction cup (28) is lower than the lowest ball bearing (29), and the top of the limiting block (7) is lower than the bottom of the suction cup (28). The lower end of the inward side of the vertical arm (6) is provided with a second rubber block (31). The top of the limiting bottom block (7) is provided with an arc-shaped first rubber block (30).

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