Method of three-dimensionally decorating substrate to produce exterior component
By depositing an enamel carrier layer on a ceramic substrate and firing sealed ceramic or metal decorative elements, the problem of instability in positioning and bonding of decorative elements in the prior art is solved, and a more stable manufacturing of external components is achieved.
Patent Information
- Application Number
- CN202411157399.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-23
- Filing Date
- 2024-08-22
- Publication Date
- 2025-02-25
AI Technical Summary
In the prior art, the decorative elements of the external components are difficult to grasp and position due to their small size, and after being fastened to the substrate by driving, bonding or threaded connection, the bonding between the decorative elements and the substrate cannot be effectively controlled. Condition.
The support layer is melted by depositing an enamel carrier layer on the decorative area of the ceramic substrate and firing at high temperatures, and then depositing the ceramic or metal decorative elements on the carrier layer and sealing the decorative elements on the substrate by firing, Form external components.
Three-dimensional decoration of the substrate is realized, the positioning and bonding stability of the decorative elements are improved, and the bonding instability problems caused by the connection method is avoided.
Smart Images
Figure CN119502599A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the decoration of timepieces, jewellery or fashion articles and in particular to the manufacture of external parts.
[0002] More particularly, the invention relates to a method for three-dimensionally decorating a substrate in order to manufacture an external part. The method can be advantageously applied to any external part in the field of watchmaking, jewellery or fashion items such as leather goods, spectacles, writing instruments or portable electronic devices. Background Art
[0003] In the above fields, exterior parts can be formed by assembling elements made of different materials. In particular, exterior parts comprising metal and / or ceramic decorative elements fastened to a ceramic substrate are particularly attractive, although not very common due to their manufacturing complexity.
[0004] More specifically, the very small size of the decorative elements makes them difficult to grip and position on the substrate.
[0005] Another disadvantage of this type of assembly is that, since the decorative element is fastened to the substrate by driving, gluing or screwing, it is not possible to control the bond between the decorative element and the substrate over time. Summary of the invention
[0006] To this end, the present invention overcomes the above-mentioned drawbacks by proposing a method for three-dimensionally decorating a substrate for manufacturing an exterior component, the method comprising the following steps:
[0007] - depositing at least one enamel carrier layer on a decorative area of the outer surface of the ceramic substrate, said decorative area being intended to receive a decorative element;
[0008] - firing the substrate including the carrier layer so as to melt the carrier layer;
[0009] - depositing a decorative element in solid form made of a ceramic material and / or a metallic material on said carrier layer, the material of said decorative element being chosen such that its melting temperature is higher than the glass transition temperature of the material constituting said carrier layer;
[0010] - Sealing the decorative element to the substrate by firing to form an exterior component.
[0011] In a specific embodiment, the present invention may also include one or more of the following features taken alone or in any combination that is technically possible.
[0012] In a particular embodiment, when the melting temperature of the material constituting the decorative element is greater than 1000 degrees Celsius, the firing of the substrate and the carrier layer and the sealing of the decorative element to the substrate are performed in the same step.
[0013] In a particular embodiment, a blind cavity is produced in the substrate so as to form the decorative area, and the shape of the blind cavity corresponds to the shape of the decorative element which is deposited so as to extend beyond said cavity.
[0014] In a specific embodiment, the cavity has a depth of at least 0.01 mm, preferably 0.1 mm.
[0015] In a particular embodiment, the carrier layer is made of borosilicate enamel or feldspar.
[0016] In a particular embodiment, the carrier layer is made of sodium borosilicate enamel.
[0017] In a specific embodiment, when the melting temperature of the material constituting the decorative element is lower than 1000 degrees Celsius, after the step of firing the substrate including the carrier layer, the carrier layer is surface treated to flatten its surface and make its thickness uniform.
[0018] In a particular embodiment, during the sealing step, the substrate, the carrier layer and the decorative element are subjected to temperatures between 500 degrees Celsius and 1500 degrees Celsius. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Other characteristics and advantages of the present invention will become apparent from the following detailed description, given by way of example and not limiting in any way, with reference to the accompanying drawings, in which:
[0020] - Figure 1a to Figure 1c schematically showing in cross-section the steps involved in carrying out a method for decorating a substrate for manufacturing an exterior component according to a first alternative embodiment of the invention;
[0021] - Figure 1d to Figure 1f Schematically shown are cross-sectional views of the steps involved in carrying out a method for decorating a substrate for manufacturing an exterior component according to a second alternative embodiment of the invention.
[0022] It should be noted that for the sake of clarity, the drawings are not necessarily drawn to scale. DETAILED DESCRIPTION
[0023] The invention relates to a method for three-dimensionally decorating a substrate 11 in order to manufacture an external part 10, such as Figure 1c and Figure 1f More specifically, the steps of the first alternative embodiment of the method are as follows: Figure 1a to Figure 1c The steps of a second alternative embodiment of the method are shown schematically in Figure 1d to Figure 1f It is schematically shown in FIG. 1 and described subsequently.
[0024] For example, in the field of watchmaking, external part 10 may form a dial, a plate, a bridge, a gear train, an oscillating weight, a bezel, a middle part, a link of a bracelet or a clasp of a bracelet.
[0025] In a first alternative embodiment, the method comprises a step of depositing at least one enamel carrier layer 12 on the decorative area of the outer surface 110 of the substrate 11, such as Figure 1a As shown. Once the outer part 10 has been manufactured, the outer surface 110 is intended to be visible to the user. In addition, the decorative area constitutes a flat portion of the outer surface 110 and is intended to receive a decorative element, as described in more detail below.
[0026] In this alternative embodiment of the invention, the carrier layer 12 is made of borosilicate enamel or feldspar, the borosilicate being for example sodium borosilicate.Herein, for reasons of language and simplified reading, the singular is used when referring to the carrier layer 12, but the carrier layer 12 may consist of a stack of layers.
[0027] Advantageously, the substrate 11 is made of a ceramic, for example a dense ceramic such as zirconium oxide, aluminum oxide, yttrium aluminum garnet (also known as "YAG"), sapphire or a mixture of these elements.
[0028] Substrate 11 and carrier layer 12 are then fired in a furnace at a temperature between 500 and 1500 degrees Celsius, preferably 1000 degrees Celsius, so that carrier layer 12 melts and chemically adheres to substrate 11. Due to its composition, adhesion of carrier layer 12 to substrate 11 is guaranteed after this step.
[0029] The support layer 12 is preferably surface treated after the firing step, such as Figure 1b In order to flatten its visible surface and make its thickness uniform. More specifically, as shown in the figure Figure 1a As shown in an enlarged manner, the support layer 12 may vary in thickness. In particular, due to surface tension phenomena occurring during firing of the base layer 12, the surface of the base layer 12 may have a series of depressions and protrusions, and due to the wettability of the layer, the thickness of the base layer 12 may be greater at the center of the outer surface 110 than at its periphery. Furthermore, if the outer surface 110 does not extend horizontally, i.e. forms a slope, the base layer 12 may have a tendency to flow in the direction of the slope during firing and thus develop an excessive thickness under the effect of gravity and due to its thermoviscous properties.
[0030] The carrier layer 12 is preferably surface treated by mechanical abrasion, for example by grinding or sanding.
[0031] Then, if Figure 1c As shown, a decorative element 13 is deposited on all or part of the carrier layer 12. Such decorative element 13 is deposited in solid form. The decorative element 13 is advantageously made of a ceramic material and / or a metallic material, the material of the decorative element 13 being selected so that it has a melting temperature higher than the glass transition temperature of the material constituting the carrier layer 12, for example a melting temperature higher than 600 degrees Celsius. In this context, the term "metal material" refers to any metal alloy, any pure metal or any metal composite material.
[0032] The decorative element 13 is then sealed to the substrate 11 by firing the assembly consisting of the substrate 11, the carrier layer 12 and the decorative element 13, so as to form the exterior component 10. The firing can be performed at a temperature between 500 degrees Celsius and 1500 degrees Celsius. The firing temperature corresponds to the glass transition temperature of the material of the carrier layer 12 and must be lower than the melting point of the material constituting the decorative element 13 in order not to degrade it.
[0033] During firing, pressure may be applied to the decorative element 13 in order to ensure its adhesion to the carrier layer 12. Such pressure may be applied by a weight exerted on the decorative element 13.
[0034] When the melting temperature of the material constituting the decorative element 13 is greater than 1000 degrees Celsius, the firing of the substrate 11 and the carrier layer 12 can advantageously be performed during the step of sealing the decorative element 13 to the substrate 11. Thus, a single firing step allows the carrier layer 12 to melt and allows the decorative element to be sealed to the substrate 11. In this case, it is clear that the method does not include a step of surface treatment of the carrier layer 12.
[0035] The second alternative embodiment of the invention corresponds to the first alternative embodiment described above, except that a preliminary step is performed before depositing the carrier layer 12, during which a blind cavity 14 forming the decorative area is produced in the substrate 11. In particular, the cavity 14 is produced through the outer surface 110. This cavity 14 is therefore intended to receive the carrier layer 12 and the decorative element 13 when these are deposited respectively. The cavity is made so that its shape corresponds to the shape of the decorative element 13, as Figure 1f The cavity 14 can be manufactured by laser processing.
[0036] Furthermore, the decorative element 13 is deposited so as to extend beyond the cavity 14 .
[0037] The cavity 14 has a depth of at least 0.01 mm, preferably 0.1 mm, to make it easier to position the decorative element 13 within the cavity 14 .
[0038] In this alternative embodiment of the invention, the carrier layer 12 may be deposited in the cavity 14 in powder form.
[0039] More generally, it should be noted that the embodiments and examples considered above have been described by way of non-limiting examples and that other alternatives are therefore possible.
Claims
1. A method for three-dimensionally decorating a substrate (11) to produce an exterior component (10), the method comprising the following steps: - depositing at least one enamel carrier layer (12) on a decorative area of the outer surface (110) of the ceramic substrate (11), the decorative area being intended to receive the decorative element (13); - firing the substrate (11) including the carrier layer (12) so as to melt the carrier layer; - depositing a decorative element (13) in solid form made of a ceramic material and / or a metallic material on the carrier layer (12), the material of the decorative element being selected such that its melting temperature is higher than the glass transition temperature of the material constituting the carrier layer (12); - Sealing the decorative element (13) to the substrate (11) by firing to form the exterior component (10).
2. The method according to claim 1, wherein: When the melting temperature of the material constituting the decorative element (13) is greater than 1000 degrees Celsius, the firing of the substrate (11) and the carrier layer (12) and the sealing of the decorative element (13) to the substrate (11) are performed during the same step.
3. The method according to claim 1 or claim 2, wherein: A blind cavity (14) is formed in the substrate (11) to form the decorative area, and the shape of the blind cavity corresponds to the shape of the decorative element (13), which is deposited to extend beyond the cavity (14).
4. The method according to claim 3, wherein: The cavity (14) has a depth of at least 0.01 mm, preferably 0.1 mm.
5. The method according to any one of claims 1 to 3, wherein: The carrier layer (12) is made of borosilicate enamel or feldspar.
6. The method according to claim 5, wherein: The carrier layer (12) is made of sodium borosilicate enamel.
7. The method according to claim 1, wherein: When the melting temperature of the material constituting the decorative element (13) is lower than 1000 degrees Celsius, after the step of firing the substrate (11) including the carrier layer (12), the carrier layer is surface treated to flatten its surface and make its thickness uniform.
8. The method according to any one of claims 1 to 6, wherein: During the sealing step, the substrate (11), the carrier layer (12) and the decorative element (13) are subjected to temperatures between 500 and 1500 degrees Celsius.