Self-correcting semiconductor material sheet arranging machine and control method thereof

Abstract

The invention relates to the field of equipment special for processing semiconductors, in particular to a self-correcting semiconductor material sheet arranging machine and a control method thereof.The self-correcting semiconductor material sheet arranging machine structurally comprises a machine body, a feeding assembly and a material distributing assembly, the feeding assembly and the material distributing assembly are arranged on the machine body, the number of the material distributing assembly transferred each time is larger than one, and the feeding assembly comprises a feeding area, a material arranging area, a material distributing area and a material fixing area; according to the device, a plurality of tightly arranged semiconductor material sheets are unfolded by the material distribution assembly in the material distribution area, and a plurality of unfolded and regularly arranged semiconductor material sheets are received and placed by the material fixing assembly in the material fixing area, so that sufficient supplied material supplementation is performed for the material distribution assembly mechanism; a plurality of semiconductor material sheets are provided for the material distribution assembly mechanism before the material distribution assembly mechanism executes material distribution every time, and the material distribution assembly mechanism can take and use the plurality of semiconductor material sheets at the same time, so that the operation intensity of the material distribution assembly mechanism can be relieved on the basis that the same or more semiconductor material sheets are filled in unit time.

Description

Technical Field

[0001] The invention relates to the field of equipment dedicated to processing semiconductors, and in particular to a self-correcting semiconductor material arrangement machine and a control method thereof. Background Art

[0002] In semiconductor processing, semiconductors need to be arranged and filled into a carrier tape. The carrier tape has slots provided for the semiconductor tablets so that the semiconductor tablets that fall into it can automatically correct their positions. Subsequent lamination operations will also correct the positions of the semiconductor tablets. After lamination, a carrier tape with semiconductor tablets is formed, so that the carrier tape can be used directly to supply semiconductor tablets to the circuit board during the production of electronic component circuit boards.

[0003] The traditional film arrangement and taping machine is a way of instantly coordinating the filling needs with the conveying operation and the transfer operation, that is, performing a single feeding, a single material picking and moving, and a single positioning operation in sequence. The speed of the process and the amount of filling per unit time are achieved by compressing the time of the above three operations. This makes the material picking and moving mechanism in the process often in a high-speed operation state, which is more prone to damage during long-term use. Summary of the invention

[0004] In view of the above problems, the present invention provides a self-correcting semiconductor wafer arrangement machine and a control method thereof. The structure of the self-correcting semiconductor wafer arrangement machine includes a machine body installed at the rear stage of a semiconductor wafer feeding device, an upper belt wheel and a winding wheel are respectively provided at the front and rear of the machine body, the upper belt wheel is equipped with a rolled carrier tape and the carrier tape is wound around the middle of the machine body and wound onto the winding wheel, a loading assembly is provided on the machine body for receiving semiconductor wafers provided by the semiconductor wafer feeding device, and a distribution assembly is also provided on the machine body for transferring the semiconductor wafers on the loading assembly to the carrier tape; the number of semiconductor wafers transferred from the loading assembly by the distribution assembly at a single time is greater than one, and the semiconductor wafer has downward pins on both sides; the loading assembly includes a base and a feeding area, a discharging area, a dividing area and a fixing area are respectively provided on the base. The material distribution area is provided with a pushing assembly for delivering a plurality of semiconductor sheets to the material distribution area, the material distribution area is provided with a material distribution assembly for driving a plurality of semiconductor sheets to be spread out and arranged at intervals, and the material distribution area is provided with a material distribution assembly for receiving the semiconductor sheets arranged at intervals; the material distribution assembly comprises a transposition mechanism and a suction cup arm driven by the transposition mechanism to reciprocate between the carrier and the loading mechanism, a connecting seat is provided at the end of the transposition mechanism and a transposition arm is provided on the connecting seat, a plurality of suction cup arms are provided and arranged at intervals on the transposition arm for adsorbing the semiconductor sheets on the material distribution area; the feeding area and the material distribution area are in an inclined state, the material distribution area and the material distribution area are arranged horizontally from the material distribution area, and the pins of the semiconductor sheets arranged at intervals on the material distribution area are located in the arrangement direction of the semiconductor sheets.

[0005] Furthermore, the pushing assembly includes a pushing plate and a pushing actuator that drives the pushing plate to move, the pushing actuator is installed on a base, the pushing plate is arranged downward along the edge of the feeding area to form a side wall structure of the discharging area, and moves toward the distributing area under the drive of the pushing actuator; a partition assembly is also provided between the feeding area and the discharging area, which is used to separate the semiconductor sheet in the feeding area from the discharging area when the pushing assembly drives the semiconductor sheet in the discharging area to move toward the distributing area.

[0006] Furthermore, the material dividing assembly includes a plurality of transfer blocks, each of which is provided with a placement surface for placing semiconductor sheets delivered from the discharge area, and the material dividing assembly also includes a movable frame and a cross rail beam, the transfer block is slidably mounted on the cross rail beam; the states of the transfer block on the cross rail beam include a tightened state and an expanded state, the movable frame is provided with a first material dividing actuator for driving the transfer block to switch between the tightened state and the expanded state, the transfer block in the tightened state is close to the discharge area for receiving semiconductor sheets, and the expanded state drives a plurality of semiconductor sheets to expand and be arranged at regular intervals; a mounting frame is installed at the bottom end of the base, the movable frame is slidably mounted on the mounting frame, and a second material dividing actuator is provided on the mounting frame for driving the movable frame to move toward the fixed material area.

[0007] Furthermore, a single transfer block is provided with a raised spacing protrusion on one side close to the next transfer block, and the transfer block in the tightened state is abutted against the next transfer block through the spacing protrusion, and a gap is formed between the transfer blocks above the spacing protrusion, and the gap is the spacing space between two adjacent transfer blocks; the spacing of the gap is greater than the sum of the thicknesses of the two pins and less than the spacing between the two suction cup arms.

[0008] Furthermore, a connecting piece is provided between the transfer blocks, the first material distribution actuator is connected to the transfer block at one end, the first material distribution actuator drives the transfer block at one end to move and the transfer blocks are driven to move by the connecting piece, and the connecting piece keeps the same distance between the unfolded transfer blocks; the connecting piece includes a connecting rope or a connecting pin.

[0009] Furthermore, the material fixing component includes a connecting plate and a plurality of supporting seats, the connecting plate is provided with reference grooves arranged at intervals, the supporting seats are installed in the reference grooves, the connecting plate is slidably installed on the mounting frame, and the states of the supporting seats in the mounting frame include a low position state in which the distance to the bottom of the mounting frame is closer than the adjacent transfer block, and a high position state in which the distance to the bottom of the mounting frame is farther than the adjacent transfer block; the transfer block in the expanded state is inserted into the supporting seats arranged at intervals, and the semiconductor sheet is received and transferred to the supporting seat by the supporting seat rising from the low position to the high position; a material fixing actuator is provided in the mounting frame and is connected to the connecting plate, which is used to drive the supporting seat to switch between the low position and the high position; the spacing of the reference grooves is equal to the spacing of the suction cup arms.

[0010] Furthermore, two adjacent support seats are used to support a semiconductor sheet, and a depression is provided near the edge of the top of the support seat for the pins of the semiconductor sheet to be embedded; one side of the top of the support seat close to the semiconductor sheet is a blade edge or a thin edge, the top of the blade edge is sharp and the thickness of the thin edge is less than the thickness of the pin.

[0011] Furthermore, the transposition arm is rotatably connected to the connecting seat, and a rotary actuator is provided on the connecting seat to drive the transposition arm to rotate; when the transposition mechanism drives the connecting seat to move toward the upper material assembly, the transposition arm is driven by the rotary actuator to rotate so that the length direction of the transposition arm is parallel to the arrangement direction of the semiconductor sheets.

[0012] Furthermore, the partition assembly includes a stand, a swing arm and a partition plate, the stand is installed at the end of the feed area, the swing arm and the partition plate are swingably installed on the stand, an elastic member is provided between the swing arm and the stand to provide elastic force for the swing arm to swing upward, the partition plate extends downward and is located above the semiconductor sheet at the end of the feed area; a pressure frame is provided on the push plate, the pressure frame is provided with an inclined inclined pressure section and a horizontal stabilizing section, the inclined inclined pressure section is used to resist the swing arm and drive the swing arm to swing downward during the movement of the push plate to the distribution area, and the partition plate follows the swing and pushes the semiconductor sheet in the feed area upward.

[0013] A control method for a self-correcting semiconductor wafer arrangement machine comprises the following steps:

[0014] In the first step, the feeding area supplies semiconductor chips to the discharging area, and the pushing component in the discharging area pushes the semiconductor chips to the distributing component in the distributing area;

[0015] In the second step, the semiconductor sheets are placed on the material distribution assembly accordingly, and the material distribution assembly moves toward the material setting area, so that the semiconductor sheets on the material distribution assembly are spread out and arranged at regular fixed intervals before reaching the material setting area;

[0016] In the third step, the semiconductor sheets on the material distribution component are unfolded and arranged at regular fixed intervals before reaching the material fixing area, and the unfolded material distribution component is inserted into the spaced fixing component, and the fixing component rises to lift the semiconductor sheets on the material distribution component, and the semiconductor sheets are received and transferred to the fixing component, and then the material distribution component returns to its original position;

[0017] In the fourth step, the position change mechanism drives the suction cup arm to adsorb the semiconductor material on the fixed material component, and then the position change arm brings a row of suction cup arms and the suction cup arms bring the semiconductor material to the top of the carrier, and the semiconductor material is placed in the carrier. The carrier is rolled up towards the winding wheel after coating.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention provides a plurality of semiconductor chips to the material distribution component mechanism before each material distribution operation, and allows the material distribution component mechanism to take a plurality of semiconductor chips at the same time, thereby reducing the operation intensity of the material distribution component mechanism on the basis of filling the same or more semiconductor chips per unit time;

[0020] The present invention provides a feeding area, a discharging area, a dividing area and a fixing area in the loading assembly, and arranges a dividing assembly in the dividing area to unfold a plurality of closely arranged semiconductor sheets, and arranges a fixing assembly in the fixing area to receive and place a plurality of unfolded regularly arranged semiconductor sheets, thereby providing sufficient material replenishment for the distribution assembly mechanism, allowing the distribution assembly mechanism to take a larger number of semiconductor sheets at a time, and reducing the operating intensity of the distribution assembly mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The present invention is a schematic diagram of the overall structure of a self-correcting semiconductor wafer arrangement machine.

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the feeding component and the cloth component of the present invention.

[0023] Figure 3 It is a top view structural schematic diagram and area division diagram of the feeding assembly of the present invention.

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the material pushing component and the material dividing component of the present invention, as well as a three-dimensional schematic diagram of a local partition component.

[0025] Figure 5 Schematic diagram of state transition of the partition assembly of the present invention.

[0026] Figure 6 It is a schematic diagram of the three-dimensional structure of the material dividing component and the material fixing component of the present invention.

[0027] Figure 7Schematic diagram of the three-dimensional structure of two implementation modes of the connecting piece on the transfer block of the present invention.

[0028] Figure 8 This is a schematic diagram of the state transition of the material setting component of the present invention receiving semiconductor sheets from the material distribution component.

[0029] Fig. 9 It is a three-dimensional structural schematic diagram of two embodiments of the bearing seat of the present invention and a partial schematic diagram of the two embodiments.

[0030] Fig.10 It is a schematic diagram of the state transition of the material distributing component of the present invention taking and discharging materials from the loading component.

[0031] In the figure: A, semiconductor sheet; 1, machine body; 2, upper belt wheel; 3, reel wheel; 4, carrier belt; 5, loading assembly; 6, cloth assembly;

[0032] 5a, feeding area; 5b, discharging area; 5c, distributing area; 5d, fixing area; 51, base; 52, partition; 53, pushing assembly; 54, distributing assembly; 55, fixing assembly; 56, mounting frame; 57, partition assembly; 61, transposition mechanism; 62, connecting seat; 63, suction cup arm; 64, transposition arm; 65, rotary actuator;

[0033] 531, push plate; 532, push material actuator; 533, guide column; 534, guide seat; 535, pressure frame; 541, transfer block; 542, mobile frame; 543, cross rail beam; 544, first material distribution actuator; 545, second material distribution actuator; 551, bearing seat; 552, connecting plate; 553, fixed material actuator; 571, stand; 572, swing arm; 573, partition plate; 574, elastic member;

[0034] 535a, oblique pressure section; 535b, stabilizing section; 541a, placement surface; 541b, gap; 541c, spacing protrusion; 541d, connecting rope; 541e, connecting pin; 551a, blade edge; 551b, thin edge; 552a, reference groove. DETAILED DESCRIPTION

[0035] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] Examples, such as Figure 1-Figure 10As shown: The present invention provides a self-correcting semiconductor material arrangement machine and a control method thereof. The structure of the self-correcting semiconductor material A arrangement machine includes a body 1 installed at the rear stage of the semiconductor material A feeding device. The body 1 is provided with an upper belt wheel 2 and a winding wheel 3 at the front and rear, respectively. The upper belt wheel 2 is provided with a rolled carrier tape 4 and the carrier tape 4 is wound around the middle of the body 1 and wound onto the winding wheel 3. The middle of the body 1 is a working feeding area. A coating mechanism is provided after the working feeding area and before the winding wheel 3. As is known, the coating mechanism is used In order to coat the carrier tape 4 so as to retain the semiconductor material A in the carrier tape 4, a loading assembly 5 is provided in the middle area of ​​the machine body 1 for receiving the semiconductor material A provided by the semiconductor material A feeding device. The semiconductor material A feeding device can be a vibrating loading table and the horizontal height is slightly higher than the loading assembly 5. It is known that the semiconductor material A provided to the loading assembly 5 by the feeding device has a certain initial velocity. The machine body 1 is also provided with a distributing assembly 6 for transferring the semiconductor material A on the loading assembly 5 to the carrier tape 4;

[0037] Among them, the number of semiconductor chips A transferred from the loading component 5 by the material distribution component 6 at a time is greater than one. In this embodiment, the number is twelve. Those skilled in the art can set the number according to actual needs, and the amount of semiconductor chips A transferred per unit time is greater than that of the prior art. The semiconductor chips A targeted by the dedicated semiconductor processing equipment in this embodiment have downward pins on both sides. For this purpose, the loading component 5 and the material distribution component 6 are set;

[0038] As for the loading component 5, the loading component 5 includes a base 51 and a feeding area 5a, a discharge area 5b, a dividing area 5c and a fixing area 5d are respectively provided on the base 51, a pushing component 53 is provided in the discharge area 5b for sending a plurality of semiconductor tablets A to the dividing area 5c, a dividing area 54 is provided in the dividing area 5c for driving a plurality of semiconductor tablets A to be spread out and arranged at intervals, and a fixing area 5d is provided with a fixing component 55 for receiving the semiconductor tablets A arranged at intervals, wherein it should be noted that the feeding area 5a and the discharge area 5b are in an inclined state, the dividing area 5c and the fixing area 5d are arranged horizontally from the discharge area 5b, and the pins of the semiconductor tablets A arranged at intervals on the fixing area 5d are located in the arrangement direction of the semiconductor tablets A;

[0039] Feeding zone 5a: A plurality of partitions 52 are provided on the base 51, and the gaps between the partitions 52 on the base 51 form a channel structure of the feeding zone 5a. The length of the feeding zone 5a is not more than twice the length of the discharge zone 5b.

[0040] Discharge area 5b part: The pushing assembly 53 includes a pushing plate 531 and a pushing actuator 532 that drives the pushing plate 531 to move. The pushing actuator 532 is installed on the base 51. The pushing plate 531 is arranged downward along the edge of one side of the feeding area 5a to form the side wall structure of the discharge area 5b, and moves toward the distribution area 5c under the drive of the pushing actuator 532. Two guide columns 533 parallel to the moving direction of the pushing plate 531 are also provided at the rear end of the pushing plate 531, and a guide seat 534 is provided on the base 51 to slide with the guide column 533, so that the movement can be more stable when the push plate 531 adopts a longer length.

[0041] It should be noted that a partition assembly 57 is further provided between the feed area 5a and the discharge area 5b, which is used to separate the semiconductor sheet A in the feed area 5a from the discharge area 5b when the push assembly 53 drives the semiconductor sheet A in the discharge area 5b to move toward the material distribution area 5c. To this end, the partition assembly 57 includes a stand 571, a swing arm 572 and a partition plate 573. The stand 571 is installed at the end of the feed area 5a, and the swing arm 572 and the partition plate 573 are swingably installed on the stand 571. An elastic member 574 is provided between the swing arm 572 and the stand 571 to provide an elastic force for the swing arm 572 to swing upward. The partition plate 573 extends downward and is located at Above the semiconductor sheet A at the end of the feeding area 5a, and at the same time, a pressure frame 535 is provided on the push plate 531, and the pressure frame 535 is provided with an inclined inclined pressure section 535a and a horizontal stabilizing section 535b. The inclined inclined pressure section 535a is used to resist against the swing arm 572 and drive the swing arm 572 to swing downward when the push plate 531 moves to the material distribution area 5c, and the partition plate 573 follows the swing and pushes the semiconductor sheet A in the feeding area 5a to the top of the feeding area 5a. A cotton pad is also provided on the side of the partition plate 573 close to the semiconductor sheet A, which is used to squeeze the nearest semiconductor sheet A toward the base 51 when pushing to reduce the occurrence of warping.

[0042] The material distribution area 5c: the material distribution component 54 includes a plurality of transfer blocks 541, and the transfer blocks 541 are provided with a placement surface 541a for placing the semiconductor tablets A sent from the discharge area 5b. In this embodiment, the placement surface 541a adopts a soft particle surface structure, such as a rubber particle surface, which is used to appropriately increase the stability of the semiconductor tablets A; the material distribution component 54 at this location needs to perform two functions, namely, moving to the fixed material area 5d and unfolding the transfer blocks 541;

[0043] In executing the function of moving to the material setting area 5d, the material distribution component 54 also includes a moving frame 542 and a cross rail beam 543, the cross rail beam 543 is installed on the moving frame 542, the transfer block 541 is slidably installed on the cross rail beam 543, the bottom end of the base 51 is equipped with a mounting frame 56, the moving frame 542 is slidably installed on the mounting frame 56 through a slide rail, and the mounting frame 56 is provided with a second material distribution actuator 545 for driving the moving frame 542 to move to the material setting area 5d;

[0044] In the function of expanding the transfer block 541, the states of the transfer block 541 on the cross rail beam 543 include a tightened state and an expanded state. The mobile frame 542 is provided with a first material distribution actuator 544 for driving the transfer block 541 to switch between the tightened state and the expanded state. The transfer block 541 in the tightened state is close to the discharge area 5b for receiving the semiconductor material A. For this purpose, a single transfer block 541 is provided with a raised spacing convex portion 541c on one side close to the next transfer block 541. 541 abuts against the next transfer block 541 through the spacing convex portion 541c, and a gap 541b is formed between the transfer blocks 541 above the spacing convex portion 541c. The gap 541b is the spacing space between two adjacent transfer blocks 541. The spacing of the gap 541b is greater than the sum of the thicknesses of the two pins and less than the spacing of the two suction cup arms 63, so that when receiving the semiconductor tablet A in the discharge area 5b, the main body of the semiconductor tablet A can enter the placement surface 541a and the pins can enter the gap 541b.

[0045] The transfer block 541 in the expanded state drives several semiconductor sheets A to expand and arrange at regular intervals. For this purpose, connecting parts are provided between the transfer blocks 541. The first material distribution actuator 544 is connected to the transfer block 541 at one end. The connecting parts maintain the same spacing between the expanded transfer blocks 541. The connecting parts can be connecting ropes 541d or connecting pins 541e. The two ends of the connecting ropes 541d are installed on the transfer block 541 by bolts. After a hole is dug in the middle of the transfer block 541 and a lateral slot is opened, the connecting pin 541e can be installed. Subsequently, when the first material distribution actuator 544 drives the transfer block 541 at one end to move, the remaining transfer blocks 541 are driven to move by the connecting parts, so as to expand and arrange at regular fixed intervals.

[0046] The material fixing area 5d part: the material fixing component 55 includes a connecting plate 552 and a plurality of bearing seats 551. The connecting plate 552 is provided with reference grooves 552a arranged at intervals. The bearing seats 551 are installed in the reference grooves 552a. It should be noted that the spacing of the reference grooves 552a is equal to the spacing of the suction cup arms 63, or equal to the spacing of each semiconductor material sheet A slot on the carrier 4. The reference grooves 552a are used to arrange and position the front and rear semiconductor materials A, and are compatible with the suction cup arms 63 and the carrier 4 of the next level, so that the material pushing component 53 and the material dividing component 54 of the previous level are adapted and assembled for this purpose;

[0047] The connecting plate 552 is slidably mounted on the mounting frame 56. The mounting frame 56 is provided with a material fixing actuator 553 connected to the connecting plate 552. With the bottom of the mounting frame 56 as a reference, the state of the supporting seat 551 in the mounting frame 56 includes a low position state in which the distance from the bottom of the mounting frame 56 is closer than the adjacent transfer block 541, and a high position state in which the distance from the bottom of the mounting frame 56 is farther than the adjacent transfer block 541. Specifically, since the transfer block 541 has no lifting function, after the transfer block 541 moves to the supporting seat 551, the initial position of the supporting seat 551, that is, the low position state, is lower than the transfer block 541. Subsequently, the transfer block 541 in the unfolded state is inserted into the supporting seats 551 arranged at intervals, and the semiconductor material A is received and transferred to the supporting seat 551 by the supporting seat 551 rising from the low position state to the high position state, and the material fixing actuator 553 is used to drive the supporting seat 551 to switch between the low position state and the high position state;

[0048] Two adjacent supporting seats 551 are used to support a semiconductor sheet A. A depression is provided near the edge of the top of the supporting seat 551 for embedding the pins of the semiconductor sheet A. To this end, the side of the top of the supporting seat 551 close to the semiconductor sheet A is a cutting edge 551a or a thin edge 551b. The top of the cutting edge 551a is sharp and the thickness of the thin edge 551b is less than the thickness of the pin. More specifically, the side of the cutting edge 551a close to the depression is inclined, and the thin edge 551b is slightly inclined outward, which is more suitable for embedding the pins of the semiconductor sheet A.

[0049] As for the cloth assembly 6, the cloth assembly 6 includes a transposition mechanism 61 and a suction cup arm 63 driven by the transposition mechanism 61 to reciprocate between the carrier belt 4 and the feeding mechanism. The transposition mechanism 61 is a reciprocating structure known to those skilled in the art. Specifically, it includes a turntable, a slider that can rotate independently outside the turntable, and a connecting rod that slides with the slider and is eccentrically hinged to the turntable. When the turntable rotates, the connecting rod will first retract toward the slider side. After crossing the line connecting the center of the turntable and the center of the slider, the rotation of the turntable will drive the connecting rod to retract. The rod is pulled out from the slider, and the purpose of picking up and releasing materials can be achieved by only setting the workstations at the two positions of the beginning of contraction and the end of extraction. A connecting seat 62 is installed at the end of the transposition mechanism 61, and a transposition arm 64 is installed on the connecting seat 62. A plurality of suction cup arms 63 are arranged at intervals on the transposition arm 64 for adsorbing the semiconductor material A on the fixed material area 5d. The transposition arm 64 is rotatably connected to the connecting seat 62, and a rotary actuator 65 is provided on the connecting seat 62 to drive the transposition arm 64 to rotate.

[0050] It should be noted that, in this embodiment, the rotary actuator 65 adopts a motor, while the push actuator 532, the first material distribution actuator 544, the second material distribution actuator 545, the metering actuator 553, etc. adopt cylinders.

[0051] In the specific implementation, it is divided into two parts: backup material filling and final filling. The backup material filling provides a certain number of semiconductor chips A for direct use by the final filling, and includes the following control methods;

[0052] In the first step, the feeding area 5a supplies semiconductor tablets A to the discharging area 5b. The semiconductor tablets A in the feeding area 5a slide downward into the discharging area 5b and are accumulated to the required number, i.e., twelve. The pusher plate 531 provided in the pusher assembly 53 in the discharging area 5b is slightly longer than the sum of the required widths of the semiconductor tablets A. The pusher plate 531 is pushed out by the pusher actuator 532 in the discharging area 5b, and the twelve semiconductor tablets A are pushed onto the distributing assembly 54 in the distributing area 5c.

[0053] In the second step, the twelve semiconductor tablets A are placed one by one on the twelve transfer blocks 541, the main body of the semiconductor tablet A enters the placement surface 541a, and the pins enter the gap 541b, then the push plate 531 is retracted, the feeding area 5a continues to supply semiconductor tablets A to the discharge area 5b, and the second material distribution actuator 545 starts to drive the moving frame 542 to move from the discharge area 5b to the fixed material area 5d. During the movement, the first material distribution actuator 544 drives the transfer block 541 at one end to move, and the remaining transfer blocks 541 are driven to move by the connecting parts, so that the transfer blocks 541 are unfolded and arranged in regular fixed intervals before reaching the fixed material area 5d;

[0054] In the third step, the transfer block 541 is unfolded and arranged at regular fixed intervals before reaching the fixed material area 5d, and the second material distribution actuator 545 continues to drive, the unfolded transfer block 541 is inserted into the spaced supporting seats 551, and the fixed material actuator 553 drives the supporting seats 551 to move from the low position to the high position, that is, it rises and lifts the semiconductor sheet A on the transfer block 541, and receives and transfers the semiconductor sheet A to the supporting seats 551. Two adjacent supporting seats 551 are used to carry one semiconductor sheet A, and the pins of the semiconductor sheet A enter the groove of the supporting seat 551 along the blade edge 551a or the thin edge 551b, and are properly stabilized on the supporting seat 551, and then the material distribution assembly 54 returns to its original position;

[0055] In the fourth step, the transposition mechanism 61 drives the connecting seat 62 to move toward the upper material component 5. During this process, the transposition arm 64 is driven by the rotary actuator 65 to rotate so that the length direction of the transposition arm 64 is parallel to the arrangement direction of the semiconductor material A and close to the supporting seat 551, and the semiconductor material A is adsorbed by the suction cup arm 63. Then the transposition mechanism 61 moves in the opposite direction and the rotary actuator 65 reverses, so that the transposition arm 64 brings a row of suction cup arms 63, and the suction cup arm 63 brings the semiconductor material A to the top of the carrier 4, and the semiconductor material A is placed in the carrier 4. The carrier 4 is rolled up in the direction of the winding wheel 3 after coating. The inside of the carrier 4 is equipped with a slot for the semiconductor material A so that the semiconductor material A that falls in can automatically correct its position. At the same time, the subsequent coating operation will also play a role in correcting the position of the semiconductor material A.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A self-correcting semiconductor wafer arrangement machine, comprising a machine body installed at the rear stage of a semiconductor wafer feeding device, wherein an upper belt wheel and a winding wheel are respectively provided at the front and rear of the machine body, wherein the upper belt wheel is provided with a rolled carrier tape and the carrier tape is wound around the middle of the machine body and wound onto the winding wheel, wherein: The machine body is provided with a loading assembly for receiving semiconductor tablets provided by a semiconductor tablet feeding device, and the machine body is also provided with a distribution assembly for transferring the semiconductor tablets on the loading assembly to the carrier tape; The number of semiconductor chips transferred by the material distribution component from the material loading component at a time is greater than one, and the semiconductor chip has downward pins on both sides; The loading assembly includes a base and is respectively provided with a feeding area, a discharging area, a dividing area and a fixing area. The discharging area is provided with a pushing assembly for sending a plurality of semiconductor tablets to the dividing area. The dividing area is provided with a dividing assembly for driving a plurality of semiconductor tablets to be spread out and arranged at intervals. The fixing area is provided with a fixing assembly for receiving the semiconductor tablets arranged at intervals. The material distribution assembly includes a transposition mechanism and a suction cup arm driven by the transposition mechanism to reciprocate between the carrier belt and the feeding mechanism, a connecting seat is installed at the end of the transposition mechanism and a transposition arm is installed on the connecting seat, and a plurality of suction cup arms are arranged at intervals on the transposition arm for adsorbing semiconductor material sheets on the fixed material area; The feeding area and the discharging area are in an inclined state, the dividing area and the metering area are arranged transversely from the discharging area, and the pins of the semiconductor tablets arranged at intervals on the metering area are located in the arrangement direction of the semiconductor tablets.

2. A self-correcting semiconductor wafer arrangement machine according to claim 1, characterized in that: The pusher assembly includes a pusher plate and a pusher actuator for driving the pusher plate to move, the pusher actuator is installed on the base, the pusher plate is arranged downward along the edge of the feeding area to form a side wall structure of the discharge area, and moves toward the distributing area under the drive of the pusher actuator; A partitioning assembly is also provided between the feed area and the discharge area, for separating the semiconductor tablets in the feed area from the discharge area when the pushing assembly drives the semiconductor tablets in the discharge area to move toward the dividing area.

3. A self-correcting semiconductor wafer arrangement machine according to claim 2, characterized in that: The material distribution assembly includes a plurality of transfer blocks, each of which is provided with a placement surface for placing semiconductor chips sent from the discharge area. The material distribution assembly also includes a moving frame and a cross rail beam, and the transfer block is slidably mounted on the cross rail beam; The states of the transfer block on the cross rail beam include a tightened state and an expanded state. The mobile frame is provided with a first material distribution actuator for driving the transfer block to switch between the tightened state and the expanded state. The transfer block in the tightened state is close to the discharge area for receiving semiconductor sheets. The expanded state drives a plurality of semiconductor sheets to be expanded and arranged at regular intervals. A mounting frame is installed at the bottom end of the base, and the movable frame is slidably installed on the mounting frame. A second material distribution actuator is provided on the mounting frame to drive the movable frame to move toward the material setting area.

4. The self-correcting semiconductor wafer arrangement machine according to claim 3, characterized in that: A raised spacing convex portion is provided on one side of a single transfer block close to the next transfer block, and the transfer block in the tightened state abuts against the next transfer block through the spacing convex portion, and a gap is formed between the transfer blocks above the spacing convex portion, and the gap is the spacing space between two adjacent transfer blocks; The spacing of the gap is greater than the sum of the thicknesses of the two pins and less than the spacing between the two suction cup arms.

5. The self-correcting semiconductor wafer arrangement machine according to claim 3, characterized in that: A connecting piece is provided between the transfer blocks, the first material distribution actuator is connected to the transfer block at one end, the first material distribution actuator drives the transfer block at one end to move, and the transfer blocks are driven to move by the connecting piece, and the connecting piece keeps the same distance between the unfolded transfer blocks; The connecting member includes a connecting rope or a connecting pin.

6. The self-correcting semiconductor wafer arrangement machine according to claim 3, characterized in that: The material-fixing assembly includes a connecting plate and a plurality of bearing seats, the connecting plate is provided with reference grooves arranged at intervals, the bearing seats are installed in the reference grooves, the connecting plate is slidably installed on the mounting frame, and the states of the bearing seats in the mounting frame include a low position state in which the distance to the bottom of the mounting frame is closer than the adjacent transfer block, and a high position state in which the distance to the bottom of the mounting frame is farther than the adjacent transfer block; The transfer block in the unfolded state is inserted into the spaced-apart supporting seats, and the semiconductor material sheets are received and transferred to the supporting seats by the supporting seats rising from the low position to the high position; a material-fixing actuator is provided in the mounting frame and connected to the connecting plate, which is used to drive the supporting seats to switch between the low position and the high position; The spacing of the reference grooves is equal to the spacing of the suction cup arms.

7. The self-correcting semiconductor wafer arrangement machine according to claim 6, characterized in that: Two adjacent support seats are used to support a semiconductor tablet, and a recess is provided near the edge of the top of the support seat for the pins of the semiconductor tablet to be embedded; One side of the top of the support seat close to the semiconductor sheet is a cutting edge or a thin edge, the top of the cutting edge is sharp and the thickness of the thin edge is less than the thickness of the pin.

8. A self-correcting semiconductor wafer arrangement machine according to claim 1 or 6, characterized in that: The transposition arm is rotatably connected to the connecting seat, and a rotary actuator is provided on the connecting seat to drive the transposition arm to rotate; When the transposition mechanism drives the connecting seat to move toward the upper material assembly, the transposition arm is driven by the rotary actuator to rotate so that the length direction of the transposition arm is parallel to the arrangement direction of the semiconductor tablets.

9. The self-correcting semiconductor wafer arrangement machine according to claim 2, characterized in that: The partition assembly comprises a stand, a swing arm and a partition plate, the stand is mounted at the end of the feed zone, the swing arm and the partition plate are swingably mounted on the stand, an elastic member is provided between the swing arm and the stand to provide an elastic force for the swing arm to swing upward, and the partition plate extends downward and is located above the semiconductor sheet at the end of the feed zone; The push plate is provided with a pressure frame, which is provided with an inclined oblique pressure section and a horizontal stabilizing section. The inclined oblique pressure section is used to resist the swing arm and drive the swing arm to swing downward when the push plate moves to the material distribution area. The partition plate follows the swing and pushes the semiconductor sheet in the feeding area upward.

10. A control method for a self-correcting semiconductor wafer arrangement machine, characterized in that: The method is carried out by using any one of claims 1 to 9 of the self-correcting semiconductor wafer arrangement machine, comprising the following steps: In the first step, the feeding area supplies semiconductor chips to the discharging area, and the pushing component in the discharging area pushes the semiconductor chips to the distributing component in the distributing area; In the second step, the semiconductor sheets are placed on the material distribution assembly accordingly, and the material distribution assembly moves toward the material setting area, so that the semiconductor sheets on the material distribution assembly are spread out and arranged at regular fixed intervals before reaching the material setting area; In the third step, the semiconductor sheets on the material distribution component are unfolded and arranged at regular fixed intervals before reaching the material fixing area, and the unfolded material distribution component is inserted into the spaced fixing component, and the fixing component rises to lift the semiconductor sheets on the material distribution component, and the semiconductor sheets are received and transferred to the fixing component, and then the material distribution component returns to its original position; In the fourth step, the position change mechanism drives the suction cup arm to adsorb the semiconductor material on the fixed material component, and then the position change arm brings a row of suction cup arms and the suction cup arms bring the semiconductor material to the top of the carrier, places the semiconductor material in the carrier, and the carrier is rolled up towards the winding wheel after coating.

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