A method for manufacturing a device for preventing wetting and a device for preventing wetting

Abstract

The application belongs to the technical field of liquid storage and relates to a preparation method of an anti-infiltration device and the anti-infiltration device. The anti-infiltration device is used for preventing a to-be-stored liquid from infiltrating a container. The preparation method specifically comprises the following steps: providing an anti-infiltration layer; forming a plurality of first supporting microstructures and a plurality of second supporting microstructures located between adjacent two first supporting microstructures on the anti-infiltration layer; wherein the height of the first supporting microstructure is greater than the height of the second supporting microstructure, and the distance between the adjacent two second supporting microstructures is less than the diameter of the liquid. The anti-infiltration device prepared by the method provided in the scheme can effectively solve the problem that the to-be-stored liquid is suspended on the wall of the container when the to-be-stored liquid is stored and stored, improve the utilization rate of the to-be-stored liquid, reduce waste, and avoid the pollution of acid or alkali solution or process residual materials to the to-be-stored liquid without the need of treating the inner wall of the container by using the acid or alkali solution or the sand blasting and polishing process.

Description

Technical Field

[0001] This application relates to the field of liquid storage technology, and in particular to a method for preparing an anti-wetting device, an anti-wetting device, and a container with anti-wetting function. Background Technology

[0002] Liquid gallium can wet the surfaces of all metals, so metal containers cannot be used to hold it to prevent contamination and wetting. Containers for liquid gallium are typically made of glass, ceramic, or plastic. However, liquid gallium can also wet these materials, easily forming a liquid film. Taking the most common plastic materials—polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), acrylonitrile butadiene styrene (ABS), and nylon—as examples, after holding liquid gallium, a layer of gallium film usually adheres to the inner wall of the container and cannot be removed. A 1000ml PE beaker can hold 6g of liquid gallium, a 3L PP container can hold 20g, and a 5L PP container can hold 30g. The larger the container's volume and the larger its internal surface area, the more liquid gallium can be suspended.

[0003] To reduce the amount of liquid gallium adhering to the inner wall of a container, existing technologies use hydrochloric acid or sodium hydroxide solution to clean the inner wall, thereby increasing the contact angle between the liquid gallium and the plastic surface, causing the gallium film adhering to the inner wall to shrink into small balls and detach. However, the liquid gallium will be dissolved by hydrochloric acid or sodium hydroxide, resulting in loss. At the same time, hydrochloric acid or sodium hydroxide will also contaminate the liquid gallium, leading to a decrease in the purity of the liquid gallium. In addition, existing technologies also use passivation to form a rough surface on the inner wall of the container, which reduces the contact area between liquid gallium and the inner wall of the container, reducing adhesion and thus reducing the amount of liquid gallium adhering to the inner wall to some extent. However, the uniformity of the rough surface is difficult to control. Non-uniform surfaces tend to have better gallium-repellent properties in rough areas, avoiding the hanging of liquid gallium, while some areas with lower roughness still have hanging liquid gallium. At the same time, regardless of whether sandblasting or polishing is used to directly passivate the inner wall of the container, the sandblasting or polishing materials will adhere to the inner wall, thereby contaminating the liquid gallium and reducing the purity of the liquid gallium.

[0004] In summary, existing methods for preventing liquid gallium from wetting containers have some drawbacks. Using acid or alkali solutions to clean the inner wall of the device can dissolve and contaminate the liquid gallium, leading to gallium loss or reduced purity. On the other hand, using sandblasting or polishing processes to roughen the inner wall of the container cannot effectively prevent liquid gallium from adhering to the wall, and the sandblasting or polishing materials can contaminate the liquid gallium, resulting in reduced purity. Summary of the Invention

[0005] Therefore, the technical problem to be solved by this application is to overcome the problem that the existing methods of preventing liquid gallium from wetting the inner wall of the cleaning device with acid and alkali solutions will dissolve and contaminate the liquid gallium, resulting in loss or reduction of purity of the liquid gallium; while the use of sandblasting or polishing processes to roughen the inner wall of the container cannot effectively prevent liquid gallium from adhering to the wall, and the sandblasting or polishing materials will contaminate the liquid gallium, resulting in reduction of purity of the liquid gallium.

[0006] To address the aforementioned technical problems, this application provides a method for preparing an anti-wetting device, which is used to prevent the liquid to be stored from wetting the container, comprising:

[0007] Provide a wetting-resistant layer;

[0008] A plurality of first support microstructures and a plurality of second support microstructures located between two adjacent first support microstructures are formed on the anti-wetting layer;

[0009] The height of the first support microstructure is greater than the height of the second support microstructure, and the distance between two adjacent second support microstructures is less than the diameter of the liquid to be stored.

[0010] In this application, multiple first support microstructures are formed on the surface of the anti-wetting layer, and multiple second support microstructures are formed between adjacent first support microstructures. The first support microstructures reduce the contact area between the liquid to be stored and the anti-wetting layer. Simultaneously, the height of the second support microstructures is smaller than that of the first support microstructures, and the spacing between adjacent second support microstructures is smaller than the diameter of the liquid to be stored. For small-diameter liquid droplets present on the surface of the anti-wetting layer, the smaller second support microstructures can reduce the contact area between the droplets and the anti-wetting layer, thereby reducing the adhesion between the liquid to be stored and the anti-wetting layer, and thus reducing the amount of liquid to be stored. The adhesion of the liquid to the container surface prevents the liquid to be stored from wetting the container. Furthermore, due to the air gap between adjacent support microstructures (including the first and second support microstructures), the liquid to be stored cannot penetrate into the interior of the support microstructures, but flows on the surface of the support microstructures, exhibiting a phenomenon similar to superhydrophobicity. In addition, the present application forms support microstructures on the surface of the anti-wetting layer, eliminating the need to treat the container with acid or alkali solutions or sandblasting processes. This not only effectively solves the problem of the liquid hanging on the container wall during storage and holding, but also improves the utilization rate of the liquid to be stored, reduces waste, and avoids contamination of the liquid to be stored.

[0011] Preferably, the liquid to be stored can be liquid gallium, liquid indium, or liquid tin, etc.

[0012] Preferably, the method further includes:

[0013] Multiple nanostructures are formed on the surface of the first and second support microstructures away from the anti-wetting layer.

[0014] In this application, by forming nanostructures on the first and second support microstructures, the contact area between the liquid to be stored and the anti-wetting layer can be further reduced, the contact angle can be increased, and the amount of liquid adhering to the liquid to be stored can be reduced.

[0015] Preferably, the formation of a plurality of first support microstructures on the anti-wetting layer and a plurality of second support microstructures located between two adjacent first support microstructures includes:

[0016] Provide a one-nanometer imprinting base mold;

[0017] Multiple first grooves are formed at intervals on the nanoimprint base mold, multiple second grooves are formed at intervals between two adjacent first grooves, and multiple nano grooves are formed at the bottom of the first grooves and the second grooves to obtain a nanoimprint mold.

[0018] The anti-wetting layer is imprinted using the nanoimprint mold to form a plurality of first protrusions corresponding one-to-one with the first groove, a plurality of second protrusions corresponding one-to-one with the second groove, and a plurality of nano protrusions corresponding one-to-one with the plurality of nano grooves;

[0019] The anti-wetting layer, the plurality of first protrusions, the plurality of second protrusions, and the plurality of nano protrusions are heated and cured to form a plurality of first support microstructures having the nanostructures and a plurality of second support microstructures having the nanostructures on the anti-wetting layer.

[0020] In this application, a first support microstructure with a nanostructure on its surface and a second support microstructure with a nanostructure on its surface are formed on the anti-wetting layer using nanoimprinting technology. This eliminates the need to use sandblasting or polishing processes to prepare the support microstructure, thus avoiding contamination of the liquid to be stored by sandblasting or polishing materials.

[0021] It is worth noting that, due to the small size of the support microstructure, it is easy to deform during the nanoimprinting process. However, as long as the formed support microstructure can support the liquid to be stored, the presence of an air layer at the bottom of the support can reduce the contact area between the liquid to be stored and the anti-wetting layer, reduce the adhesion of the liquid to be stored, increase the contact angle, and thus reduce the amount of liquid to be stored adhering.

[0022] Preferably, the formation of a plurality of first support microstructures on the anti-wetting layer and a plurality of second support microstructures located between two adjacent first support microstructures includes:

[0023] Provide a transfer substrate and a temporary substrate;

[0024] A plurality of first support microstructures having multiple nanostructures on top are formed on the transfer substrate at intervals, and a plurality of second support microstructures having multiple nanostructures on top are formed at intervals between two adjacent first support microstructures.

[0025] The plurality of first support microstructures and the plurality of second support microstructures on the transfer substrate are transferred to the temporary substrate;

[0026] The plurality of first support microstructures and the plurality of second support microstructures on the temporary substrate are transferred to the anti-wetting layer.

[0027] In this application, a first support microstructure, a second support microstructure, and a nanostructure with regular shapes are formed on the anti-wetting layer using transfer technology. Similarly, there is no need to use sandblasting or polishing processes to prepare the support microstructure, thus avoiding contamination of the liquid to be stored by sandblasting or polishing materials.

[0028] Preferably, after forming the first support microstructure and the second support microstructure, the method further includes:

[0029] The anti-wetting layer is subjected to an electrostatic treatment so that the electrostatically treated anti-wetting layer is electrostatically adsorbed onto the inner wall of the container.

[0030] In this application, the anti-wetting layer is charged to retain the charge inside the anti-wetting layer, and the anti-wetting layer is attached to the surface of the inner wall of the container in a vacuum environment. This eliminates the need to use crosslinking agents or adhesives containing volatile organic compounds to attach the anti-wetting layer to the inner wall of the container. This prevents air bubbles or impurities from affecting the anti-wetting layer and the inner wall of the container, and also avoids the anti-wetting layer from falling off due to the failure of crosslinking agents or adhesives over a long period of use.

[0031] Preferably, the surface resistivity of the side of the anti-wetting layer in contact with the container after electrostatic treatment is [value missing]. .

[0032] In this application, the ease of implementation of the electrostatic treatment and the charge retention performance are controlled by the surface resistivity of the anti-wetting layer after electrostatic treatment. When the surface resistivity of the anti-wetting layer on the side in contact with the container after electrostatic treatment is insufficient... During electrostatic treatment, the charge is easily conducted to the surface of the anti-wetting layer and escapes to the outside (e.g., the atmosphere), making it difficult to form a charge-carrying tendency on the surface or inside the anti-wetting layer. This results in the anti-wetting layer not being able to maintain its charge for a long time, and the electrostatic adsorption force easily decreases, affecting the adsorption effect of the anti-wetting layer inside the container. When the surface resistivity of the side of the anti-wetting layer in contact with the container exceeds [a certain value] after electrostatic treatment... In such cases, more complex equipment or processes are required to treat the anti-wetting layer, making its surface highly insulating, which increases the cost of live treatment.

[0033] Preferably, the distance between two adjacent first support microstructures is less than the diameter of the liquid to be stored; and / or

[0034] The size of the first support microstructure is larger than the size of the second support microstructure.

[0035] In this application, the distance between adjacent first support microstructures is less than the diameter of the liquid to be stored, which allows the liquid to be stored to be located on the surface of the anti-wetting layer under the support of the first support microstructures. For liquids to be stored with a diameter smaller than the spacing between the first support microstructures, they can also be located on the surface of the anti-wetting layer under the support of the smaller second support microstructures, so that the liquid to be stored will not come into complete contact with the surface of the anti-wetting layer and will not wet the container.

[0036] Preferably, the material of the anti-wetting layer is the same as the material of the container; and / or

[0037] The thickness of the anti-wetting layer is 0.1~0.3mm; and / or

[0038] The thickness of the anti-wetting device is 0.3mm~0.5mm; and / or

[0039] The height of the first supporting microstructure is 1 / 4 to 1 / 2 of the thickness of the anti-wetting device; and / or

[0040] The plurality of first support microstructures are arranged in an equilateral triangular array; and / or

[0041] Each of the first supporting microstructures is cylindrical or cuboid in shape; and / or

[0042] Three to five second protrusions are spaced apart between two adjacent first support microstructures; and / or

[0043] Each of the second support microstructures is cylindrical or cuboid in shape; and / or

[0044] The size of the first support microstructure is 80 μm to 100 μm; the height of the first support microstructure is 150 μm to 200 μm; the distance between two adjacent first support microstructures is 100 μm to 180 μm; and / or

[0045] The dimensions of the second support microstructure are 10 μm to 50 μm; the height of the second support microstructure is 20 μm to 60 μm; the distance between two adjacent second support microstructures is 10 μm to 20 μm; and / or

[0046] The shapes of the nanostructures include triangular pyramids, pentagons, hexagons, claw shapes; and / or

[0047] The size of the nanostructure is 1 nm to 100 nm; the height of the nanostructure is 1 nm to 100 nm.

[0048] In this application, the anti-wetting layer is made of the same material as the container, ensuring that its electrical properties are consistent with the container surface, thereby ensuring a more stable and effective electrostatic adsorption process. The thickness of the anti-wetting layer does not affect the holding capacity of the liquid to be stored, and its thinness and low weight make it easier to adhere to the inner wall of the container. Simultaneously, the aforementioned limitation on the height of the supporting microstructures ensures that they are firmly fixed to the anti-wetting layer, improving the stability of the first and second supporting microstructures. The first supporting microstructures are arranged in an equilateral triangular array, ensuring that the distance between any two adjacent first supporting microstructures is the same, guaranteeing the uniformity of the first supporting microstructures, and avoiding the problem of insufficient support for liquid droplets due to excessive spacing between the first supporting microstructures. This further improves the superhydrophobic performance of the anti-wetting device and reduces the adhesion of the liquid to be stored. Three to five second supporting microstructures are arranged between two adjacent first supporting microstructures, which not only provide good support for the smaller diameter liquid to be stored but also ensure the uniformity of the second supporting microstructures.

[0049] Furthermore, when the liquid to be stored is liquid gallium metal, since the diameter of the liquid gallium metal droplets is approximately 200μm to 500μm, by limiting the size of the first support microstructure and controlling the distance between adjacent first support microstructures to be smaller than the diameter of the liquid gallium metal droplets, the liquid gallium metal droplets can be positioned on the surface of the anti-wetting layer under the support of the first support microstructure. At the same time, by limiting the size of the second support microstructure and the distance between adjacent second support microstructures, even if there are liquid gallium metal droplets with a diameter smaller than the distance between adjacent first support microstructures, the second support microstructures disposed between the first support microstructures can still provide good support for them, preventing small-diameter liquid gallium metal droplets from adhering to the surface of the anti-wetting layer.

[0050] Furthermore, the shape of the nanostructures can be regular or irregular, and the size of the nanostructures is all at the nanometer level. It is similar to the formation of regularly arranged hills (i.e., the first and second supporting microstructures) on the surface of the anti-wetting layer. The nanostructures on the top of the hills are similar to the raised tops of bunkers growing on the hills. The gaps in the hills are filled with air, thus forming an extremely thin air layer at the nanometer level. Since the liquid to be stored is relatively large to these microstructures, the nanostructures can support the liquid. When the liquid to be stored falls on the surface of the anti-wetting layer, it can only make contact with the supporting microstructures and the raised tops of the bunkers through a layer of nano-air, and cannot further wet the liquid. This increases the contact angle and reduces the amount of liquid adhering to the surface.

[0051] This application also provides an anti-wetting device, which is prepared using the above-described method for preparing an anti-wetting device.

[0052] This application also provides a container with anti-wetting function, which includes the above-mentioned anti-wetting device and a container. The anti-wetting device is adsorbed on the inner wall of the container to prevent the liquid to be stored from wetting the container.

[0053] Preferably, the liquid to be stored is liquid gallium, and the container is used for storing and holding the liquid gallium. The material of the container can be plastic, such as polyvinyl chloride (PVC).

[0054] Polyethylene (PE), polypropylene (PP), or acrylonitrile butadiene styrene (ABS).

[0055] By employing an anti-wetting device with a supporting microstructure, it is possible to reduce the adhesion of liquid gallium metal to the inner wall of the plastic container during storage or holding, thereby improving the utilization rate of liquid gallium metal and reducing waste.

[0056] The method for preparing the anti-wetting device provided in this application has the following beneficial effects:

[0057] (1) The method for preparing the anti-wetting device provided in this application includes providing an anti-wetting layer, forming a plurality of first support microstructures on the anti-wetting layer, and forming a plurality of second support microstructures between two adjacent first support microstructures; wherein, the height of the first support microstructure is greater than the height of the second support microstructure, and the distance between two adjacent second support microstructures is less than the diameter of the liquid to be stored. This application reduces the contact area between the liquid to be stored and the anti-wetting layer by forming support microstructures on the anti-wetting layer, eliminating the need to treat the container with acid or alkali solutions or sandblasting and polishing processes, thus avoiding contamination of the liquid to be stored by acid or alkali solutions or process residues, and ensuring the purity of the liquid to be stored. The first support microstructure reduces the contact area between the liquid to be stored and the anti-wetting layer. Simultaneously, since the spacing between adjacent second support microstructures is smaller than the diameter of the liquid to be stored, smaller droplets of the liquid to be stored on the surface of the anti-wetting layer can have their contact area reduced by the smaller second support microstructures, thus reducing the adhesion between the liquid and the anti-wetting layer. This reduces the adhesion of the liquid to the container surface and prevents the liquid from wetting the container. Furthermore, the air gap between adjacent support microstructures prevents the liquid to be stored from penetrating into the interior of the support microstructures, instead causing it to flow on the surface of the support microstructures, exhibiting a superhydrophobic phenomenon, thereby achieving the effect of preventing the liquid to be stored from wetting the anti-wetting device.

[0058] (2) The anti-wetting device prepared by the method provided in this application effectively solves the problem of the liquid being suspended on the container wall during storage and holding, improves the utilization rate of the liquid to be stored, reduces waste, and does not require treatment of the inner wall of the container, thus avoiding contamination of the liquid to be stored. Attached Figure Description

[0059] To make the content of this application easier to understand, the following detailed description is provided based on specific embodiments and accompanying drawings, wherein:

[0060] Figure 1 A flowchart illustrating the preparation method of an anti-wetting device provided in this application;

[0061] Figure 2 This is a schematic diagram illustrating the fabrication structure of an anti-wetting device provided in this application; wherein, Figure 2 (a) in the diagram is a schematic diagram of the anti-wetting layer structure. Figure 2 (b) is a schematic diagram of the formation of the first support microstructure on the anti-wetting layer. Figure 2 (c) is a schematic diagram of the formation of a second support microstructure on the anti-wetting layer. Figure 2 (d) is a schematic diagram of the formation of nanostructures on the first and second support microstructures;

[0062] Figure 3 This application provides a schematic diagram of the preparation process of an anti-wetting device; wherein, Figure 3 (a) in the figure is a schematic diagram of the basic nanoimprint mold. Figure 3 (b) is a schematic diagram of the structure forming grooves on the nanoimprint base mold. Figure 3 (c) in the middle is to Figure 3 (b) is a schematic diagram of the structure printed onto the surface of the anti-wetting layer. Figure 3 (d) in the diagram is a schematic diagram of the formation of a supporting microstructure on the anti-wetting layer;

[0063] Figure 4 A schematic diagram of the preparation process of another anti-wetting device provided in this application; wherein, Figure 4 (a) is a schematic diagram of the structure forming the support microstructure on the transfer substrate. Figure 4 (b) is a schematic diagram of the structure for transferring the support microstructure on the transfer substrate to the temporary substrate. Figure 4 (c) is a schematic diagram of the structure for transferring the support microstructure on the temporary substrate to the anti-wetting layer;

[0064] Figure 5 A schematic diagram of the structure of the anti-wetting device provided in this application attached to the inner wall of the container;

[0065] Figure 6A top view of an anti-wetting device provided in this application;

[0066] Figure 7 A schematic diagram of liquid gallium droplets of different diameters on the surface of the anti-wetting device provided in this application;

[0067] Figure 8 A schematic diagram illustrating the formation of nanostructures on the surface of the first supporting microstructure provided in this application; wherein... Figure 8 (a) is a schematic diagram of a pentagonal nanostructure formed on the surface of the first supporting microstructure. Figure 8 (b) is a schematic diagram of a pyramidal nanostructure formed on the surface of the first supporting microstructure;

[0068] Figure 9 Optical photographs of the surface of the anti-wetting devices prepared in Examples 3 and 4, showing liquid gallium metal. Figure 9 Image (a) is an optical photograph of liquid gallium on the surface of the anti-wetting device prepared in Example 4. Figure 9 (b) is an optical photograph of liquid gallium on the surface of the anti-wetting device prepared in Example 3;

[0069] Figure 10 A schematic diagram comparing the contact angles of liquid gallium metal when it is placed in different containers;

[0070] Explanation of reference numerals in the accompanying drawings: 1. Anti-wetting layer; 2. First support microstructure; 3. Second support microstructure; 4. Nanostructure; 5. Nanoimprint base mold; 6. First groove; 7. Second groove; 8. Nanogroove; 9. Transfer substrate; 10. Temporary substrate; 11. Container; 12. Liquid gallium droplet. Detailed Implementation

[0071] The present application will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present application, but the embodiments are not intended to limit the present application.

[0072] Existing technologies contain a large body of literature on the wetting properties of water and oil, aiming to reduce water or oil wetting to decrease contaminant adhesion. However, due to significant differences between water, oil, and liquid gallium, including differences in density, surface adhesion, metallic bonds, chemical bonds between inorganic and organic substances, and surface tension, and because liquid gallium is solid below approximately 29 degrees Celsius and liquid above approximately 29 degrees Celsius (with a low solid-liquid transition temperature), its properties differ from those of water and oil. Therefore, existing technologies concerning the contact angle and surface adhesion of water and oil are not very relevant. For example, the surface tension of liquid gallium is greater than that of water and oil. The thin layer of liquid gallium in contact with air is the surface layer, and the distribution of gallium atoms in the surface layer is sparser than that in the interior, resulting in larger interatomic spacing and stronger attractive forces. Because surface tension and contact angle are related, liquid gallium has a relatively high surface tension and abundant excess surface free energy (the surface tensions of water and liquid gallium differ macroscopically; for example, when water is in a small test tube, the surface of the water is concave, while when liquid gallium is in a small test tube, the surface of the liquid gallium is convex). Therefore, small droplets formed under microstructure support will not decompose into even smaller droplets within a relatively small support contact area. Furthermore, since gallium is a relatively niche semiconductor material that has only emerged in recent years, its application areas are not very large, which has led to little attention being paid to the problem of gallium adhesion inside containers holding liquid gallium. Based on this, this application provides a method for fabricating an anti-wetting device to solve the problem of liquid gallium adhering to the inner wall of a container, thereby improving the utilization rate of liquid gallium. It is understood that the anti-wetting device prepared in this application is not only suitable for preventing liquid gallium from wetting the container, but also for other liquids, such as liquid indium and liquid tin.

[0073] Please refer to the following: Figure 1 and Figure 2 , Figure 1 The diagram shown is a flowchart of the preparation method of the anti-wetting device provided in this application. Figure 2 The diagram shown is a schematic representation of the fabrication structure of the anti-wetting device provided in this application. This anti-wetting device is used to prevent the liquid to be stored from wetting the container. The specific fabrication steps of this anti-wetting device include:

[0074] S1: As Figure 2 As shown in (a), an anti-wetting layer 1 is provided.

[0075] The thickness of the anti-wetting layer 1 can be 0.1mm to 0.3mm, for example: 0.1mm, 0.15mm, 0.2mm, 0.25mm or 0.3mm. The thickness of the anti-wetting layer 1 will not affect the holding of the liquid to be stored. When the thickness of the anti-wetting layer 1 is thin, its own weight is very small, and it is easier to adhere to the inner wall of the container.

[0076] S2: As Figure 2 (b) in the middle and as in Figure 2 As shown in (c), a plurality of first support microstructures 2 are formed on the anti-wetting layer 1, and a plurality of second support microstructures 3 are formed between two adjacent first support microstructures 2.

[0077] The height of the first support microstructure 2 is greater than the height of the second support microstructure 3, and the distance between two adjacent second support microstructures 3 is less than the diameter of the liquid.

[0078] In one implementation, such as Figure 2 As shown in (d), the preparation method of the anti-wetting device further includes:

[0079] S3: Multiple nanostructures 4 are formed on the surface of the first support microstructure 2 and the second support microstructure 3 on the side away from the anti-wetting layer 1.

[0080] By forming nanostructures 4 on the first support microstructure 2 and the second support microstructure 3, the contact area between the liquid to be stored and the anti-wetting layer 1 can be further reduced, the contact angle can be increased, and the amount of liquid adhering to the liquid to be stored can be reduced.

[0081] Furthermore, when the liquid to be stored is liquid gallium, due to the large surface tension of liquid gallium and its large excess surface free energy, the small droplets formed by the liquid gallium will not decompose into more and smaller droplets under the smaller support contact surface. Therefore, by forming nanostructures 4 on the top of the first support microstructure 2 and the second support microstructure 3, the contact area between the liquid gallium and the anti-wetting layer 1 can be further reduced, the contact angle can be increased, and the amount of liquid gallium adhering can be reduced.

[0082] In one implementation, such as Figure 3 As shown, the first supporting microstructure 2, the second supporting microstructure 3, and the nanostructure 4 can be prepared using nanoimprint lithography. The specific preparation process includes:

[0083] S10: As Figure 3 As shown in (a), a nanoimprint base mold 5 is provided.

[0084] S20: As Figure 3 As shown in (b), a plurality of first grooves 6 are formed on the nanoimprint base mold 5 at intervals, a plurality of second grooves 7 are formed between two adjacent first grooves 6 at intervals, and a plurality of nano grooves 8 are formed at the bottom of the first grooves 6 and the second grooves 7 to obtain the nanoimprint mold.

[0085] Specifically, after obtaining the nanoimprint mold, the nanoimprint mold can be heated first, so that the grooves on the nanoimprint mold can be imprinted onto the anti-wetting layer 1. The heating temperature of the nanoimprint mold can be 80℃~120℃.

[0086] S30: As Figure 3 As shown in (c), a nanoimprinting mold is used to imprint the anti-wetting layer 1 to form a plurality of first protrusions corresponding to the first groove 6, a plurality of second protrusions corresponding to the second groove 7, and a plurality of nano protrusions corresponding to the plurality of nano grooves 8.

[0087] S40: As Figure 3 As shown in (d), the anti-wetting layer 1, multiple first protrusions, multiple second protrusions and multiple nano protrusions are heated and cured to form multiple first support microstructures 2 and multiple second support microstructures 3 with nano microstructures 4 on the anti-wetting layer 1.

[0088] By using nanoimprinting technology, a first supporting microstructure 2, a second supporting microstructure 3, and a nano-microstructure 4 are formed on the anti-wetting layer 1, resulting in an anti-wetting layer 1 containing supporting microstructures. This eliminates the need for sandblasting or polishing processes to prepare the supporting microstructures, thus avoiding the problem of contamination of the liquid to be stored by sandblasting or polishing materials.

[0089] It is worth noting that, due to the small size of the support microstructure, it is easy to deform during the nanoimprinting process. However, as long as the formed support microstructure can support the liquid droplets to be stored, the presence of an air layer at the bottom of the support can reduce the contact area between the liquid droplets to be stored and the anti-wetting layer 1, reduce the adhesion of the liquid to be stored, increase the contact angle, and thus reduce the amount of liquid to be stored adhering.

[0090] In another embodiment, such as Figure 4 As shown, the first supporting microstructure 2, the second supporting microstructure 3, and the nanostructure 4 can also be prepared using nanoprinting technology. The specific preparation process includes:

[0091] S101: Provide a transfer substrate 9 and a temporary substrate 10.

[0092] S102: As Figure 4 As shown in (a), a plurality of first support microstructures 2 having a plurality of nano-microstructures 4 on top are formed on a transfer substrate 9 at intervals, and a plurality of second support microstructures 3 having a plurality of nano-microstructures 4 on top are formed at intervals between two adjacent first support microstructures 2.

[0093] In one embodiment, the support microstructure can be formed on the transfer substrate 9 using injection molding or laser ablation processes.

[0094] S103: As Figure 4 As shown in (b), a plurality of first support microstructures 2 and a plurality of second support microstructures 3 on the transfer substrate 9 are transferred to the temporary substrate 10.

[0095] S104: As Figure 4 As shown in (c), a plurality of first support microstructures 2 and a plurality of second support microstructures 3 on the temporary substrate 10 are transferred to the anti-wetting layer 1.

[0096] Although the preparation of support microstructures on the anti-wetting layer 1 using nano-transfer technology requires two transfers and the process steps are more complex than nanoimprinting technology, it can form support microstructures with regular shapes on the anti-wetting layer 1, avoiding the problem of deformation of the support microstructures during the preparation process; similarly, it does not require the use of sandblasting or polishing processes to prepare support microstructures, avoiding the problem of contamination of the liquid to be stored by sandblasting or polishing materials.

[0097] In one embodiment, by disposing the anti-wetting device prepared in the above embodiments on the inner wall of the container, a container with anti-wetting function can be obtained. Specifically, after forming the supporting microstructure on the anti-wetting layer 1, the following is further included:

[0098] S4: As Figure 5 As shown, the anti-wetting layer 1 is subjected to an electrostatic treatment so that the electrostatically treated anti-wetting layer 1 is electrostatically adsorbed onto the inner wall of the container 11.

[0099] By subjecting the anti-wetting layer 1 to an electrical charge, the charge is retained inside the anti-wetting layer. The anti-wetting layer 1 is then attached to the surface of the inner wall of the container 11 under vacuum conditions. This eliminates the need to use crosslinking agents or adhesives containing volatile organic compounds to attach the anti-wetting layer 1 to the inner wall of the container 11. This prevents air bubbles or impurities from affecting the anti-wetting layer 1 and the inner wall of the container 11, and also avoids the anti-wetting layer 1 from falling off due to the failure of crosslinking agents or adhesives over a long period of use.

[0100] Furthermore, the surface resistivity of the side of the anti-wetting layer 1 that contacts the container 11 after electrostatic treatment is [missing information]. .

[0101] The ease of implementation and charge retention performance of the anti-wetting layer 1 after electro-treatment are controlled by the surface resistivity of the anti-wetting layer 1 after electro-treatment. When the surface resistivity of the anti-wetting layer 1 on the side in contact with the container 11 after electro-treatment is insufficient... During electrostatic treatment, the charge is easily conducted to the surface of the anti-wetting layer 1 and escapes to the outside (e.g., the atmosphere), making it difficult to form a charge-carrying tendency on the surface or inside of the anti-wetting layer 1. This results in the anti-wetting layer 1 being unable to maintain its charge for a long time, and the electrostatic adsorption force easily decreases, affecting the adsorption effect of the anti-wetting layer 1 inside the container 11. When the surface resistivity of the side of the anti-wetting layer 1 in contact with the container 11 exceeds [a certain value], [further details are needed]. In such cases, more complex equipment or processes are required to treat the anti-wetting layer 1, so that the surface of the anti-wetting layer 1 has high insulation, which leads to an increase in the cost of live treatment.

[0102] Furthermore, the material of the anti-wetting layer 1 is the same as the material of the container 11.

[0103] The anti-wetting layer 1 is made of the same material as the container 11, so that its electrical properties are consistent with those of the container 11 surface, thereby ensuring that the electrostatic adsorption process is more stable and effective.

[0104] For example, if the material of container 11 is PVC, then the material of anti-wetting layer 1 is also PVC; PVC, PE, PP, ABS and other plastic materials are all common plastic materials on the market, which are easy to purchase or customize and are inexpensive.

[0105] Furthermore, the distance between two adjacent first support microstructures 2 is less than the diameter of the liquid.

[0106] Furthermore, the size of the first support microstructure 2 is larger than the size of the second support microstructure 3; or, the width of the first support microstructure 2 is larger than the width of the second support microstructure 3, and the length of the first support microstructure 2 is larger than the length of the second support microstructure 3.

[0107] The distance between adjacent first support microstructures 2 is less than the diameter of the liquid to be stored, which allows the liquid to be stored to be located on the surface of the anti-wetting layer 1 under the support of the first support microstructures 2. For liquids to be stored with a diameter smaller than the distance between the first support microstructures 2, they can also be located on the surface of the anti-wetting layer 1 under the support of the smaller second support microstructures 3, so that the liquid to be stored will not come into complete contact with the surface of the anti-wetting layer 1 and will not wet the container 11.

[0108] Furthermore, the thickness of the anti-wetting device can be 0.3mm to 0.5mm, for example: 0.3mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm or 0.5mm.

[0109] Furthermore, the height of the first support microstructure 2 is 1 / 4 to 1 / 2 of the thickness of the anti-wetting device, for example: 1 / 4, 5 / 16, 3 / 8, 7 / 16 or 1 / 2, so that the support microstructure (including the first support microstructure 2 and the second support microstructure 3) can be firmly fixed on the anti-wetting layer 1, thereby improving the stability of the first support microstructure 2 and the second support microstructure 3.

[0110] In one specific embodiment, such as Figure 6As shown, multiple first support microstructures 2 are arranged in an equilateral triangular array on the surface of the anti-wetting layer 1; 3 to 5 second support microstructures 3 are distributed at intervals between two adjacent first support microstructures 2.

[0111] The first support microstructures 2 are arranged in the form of three vertices of an equilateral triangle. This ensures a constant distance between adjacent first support microstructures 2, guarantees the uniformity of the first support microstructures 2 on the surface of the anti-wetting layer 1, and avoids the problem of insufficient support for the liquid droplets to be stored due to excessive spacing between the first support microstructures 2. This further improves the superhydrophobic performance of the anti-wetting device and reduces the adhesion of the liquid to be stored. Three to five second support microstructures 3 are arranged between two adjacent first support microstructures 2. These second support microstructures 3 can provide good support for smaller diameter liquid droplets to be stored, while also ensuring the uniformity of the second support microstructures 3 on the surface of the anti-wetting layer 1.

[0112] Furthermore, the first supporting microstructure 2 is cylindrical or cuboid in shape; and / or, the second supporting microstructure 3 is cylindrical or cuboid in shape.

[0113] In this embodiment, the shapes of the first supporting microstructure 2 and the second supporting microstructure 3 are not limited. For example, the shape of the first supporting microstructure 2 can be a cylinder, cuboid, cube, or prism; the shape of the second supporting microstructure 3 can also be a cylinder, cuboid, cube, or prism. When the shapes of the first supporting microstructure 2 and the second supporting microstructure 3 are cylinders, the dimensions of the first supporting microstructure 2 and the second supporting microstructure 3 are the diameters of the cylinders; when the first supporting microstructure 2 and the second supporting microstructure 3 are cuboids or cubes, the dimensions of the first supporting microstructure 2 and the second supporting microstructure 3 are the length and width of their cross-sections.

[0114] In one specific embodiment, the size of the first support microstructure 2 is 80μm to 100μm, for example: 80μm, 83μm, 86μm, 89μm, 92μm, 95μm, 97μm or 100μm; the height of the first support microstructure 2 is 150μm to 200μm, for example: 150μm, 160μm, 170μm, 180μm, 190μm or 200μm; the distance between two adjacent first support microstructures 2 is 100μm to 180μm, for example: 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm or 180μm. The size of the second support microstructure 3 is 10μm to 50μm, for example: 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm; the height of the second support microstructure 3 is 20μm to 60μm, for example: 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm or 60μm; the distance between two adjacent second support microstructures 3 is 10μm to 20μm, for example: 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm or 20μm.

[0115] It is understood that the above dimensions can be length, width, diameter or radius, etc. For example, the shape of the first support microstructure 2 is rectangular, and the length and width of the first support microstructure 2 are both 80μm~100μm.

[0116] Specifically, taking liquid gallium as an example, the volume of a single drop of liquid gallium is 0.05 ml to 0.1 ml. Ideally, the droplet should be spherical. According to the formula for the volume of a sphere... The diameter of the droplet can be calculated to be approximately 200μm~500μm. Due to the high free energy on the surface of liquid gallium, multiple droplets can merge to form larger droplets after contact. The larger the droplet, the heavier it is. Since the contact angle between the droplet and the anti-wetting layer 1 is relatively large, its adhesion to the surface of the anti-wetting layer 1 is also relatively poor, making it easier for it to roll off the surface of the anti-wetting layer 1. Figure 7The diagram shows liquid gallium droplets 12 of different diameters on the surface of the anti-wetting device. By limiting the size of the first support microstructure 2 and controlling the distance between adjacent first support microstructures 2 to be less than the diameter of the liquid gallium droplets 12, the liquid gallium droplets 12 can be positioned on the surface of the anti-wetting layer 1 under the support of the first support microstructure 2. At the same time, by limiting the size of the second support microstructure 3 and the distance between adjacent second support microstructures 3, even if there are liquid gallium droplets 12 with a diameter smaller than the distance between adjacent first support microstructures 2, the second support microstructures 3 set between the first support microstructures 2 can still provide good support for them, preventing the smaller diameter liquid gallium droplets 12 from adhering to the surface of the anti-wetting layer 1.

[0117] Furthermore, the shape of the nanostructure 4 includes a triangular pyramid, a pentagon, a hexagon, or a claw shape; and / or, the size of the nanostructure 4 is 1 nm to 100 nm, and the height of the nanostructure 23 is 1 nm to 100 nm.

[0118] Specifically, the shape of the nanostructure 4 can be a regular or irregular pattern, such as... Figure 8 As shown, Figure 8 (a) is a schematic diagram of a pentagonal nanostructure 4 disposed on the surface of the first supporting microstructure 2. Figure 8 (b) is a schematic diagram of a pyramidal nanostructure 4 disposed on the surface of the first supporting microstructure 2. The nanostructures 4 are all nanometer-sized, similar to regularly arranged hills (i.e., the first supporting microstructure 2 and the second supporting microstructure 3) formed on the surface of the anti-wetting layer 1. The nanostructures 4 on the top of the hills are similar to a raised bunker dome growing on the hills. The gaps in the hills are filled with air, thus forming an extremely thin air layer only nanometer-sized. Since the liquid to be stored is relatively large for these microstructures, the supporting microstructures can support the liquid droplets. When the liquid droplets are on the surface of the anti-wetting layer 1, they can only make contact with the supporting microstructures and the bunker dome through a layer of nanometer air, and cannot further wet the liquid, thereby increasing the contact angle and reducing the amount of liquid adhering to the surface.

[0119] Based on the preparation method of the anti-wetting device provided in the above embodiments, this application embodiment also provides an anti-wetting device, which is prepared by the above-described preparation method of the anti-wetting device.

[0120] In one embodiment, the liquid to be stored is liquid gallium metal, and the container is used for storing and holding the liquid gallium metal. The material of the container can be plastic, such as PVC, PE, PP, or ABS.

[0121] By employing an anti-wetting device with a supporting microstructure, it is possible to reduce the adhesion of liquid gallium metal to the inner wall of the plastic container during storage or holding, thereby improving the utilization rate of liquid gallium metal and reducing waste.

[0122] The technical solution of this application will be described in more detail below with reference to several embodiments. However, it should be understood that the following embodiments are only for explaining and illustrating the technical solution and do not limit the scope of this application. Example 1

[0123] This embodiment provides a method for preparing an anti-wetting device, which specifically includes the following steps:

[0124] S1: Provides a 0.1mm thick anti-wetting layer.

[0125] The anti-wetting layer is made of PVC.

[0126] S2: Using nanoimprinting technology, multiple first support microstructures with a size of 80μm and a height of 150μm are formed in an equilateral triangular array on the anti-wetting layer. Three second support microstructures with a size of 10μm and a height of 20μm are formed between two adjacent first support microstructures.

[0127] The temperature at which the nanoimprinting mold is heated during the nanoimprinting process is 80℃; the first and second support microstructures are both cuboid in shape; the distance between two adjacent first support microstructures is 100μm; and the distance between two adjacent second support microstructures is 10μm.

[0128] S3: Perform an electrostatic treatment on the anti-wetting layer, and then electrostatically adsorb the electrostatically treated anti-wetting layer onto the inner wall of the container.

[0129] The surface resistivity of the anti-wetting layer on the side furthest from the supporting microstructure after electrostatic treatment is .

[0130] Example 2

[0131] This embodiment provides a method for preparing an anti-wetting device, which specifically includes the following steps:

[0132] S1: Provides a 0.2mm thick anti-wetting layer.

[0133] The anti-wetting layer is made of PVC.

[0134] S2: Using nanoimprinting technology, multiple first support microstructures with a size of 90μm and a height of 175μm are formed in an equilateral triangular array on the anti-wetting layer. Four second support microstructures with a size of 30μm and a height of 40μm are formed between two adjacent first support microstructures.

[0135] The temperature at which the nanoimprinting mold is heated during the nanoimprinting process is 100℃; the first and second support microstructures are both cuboid in shape; the distance between two adjacent first support microstructures is 140μm; and the distance between two adjacent second support microstructures is 15μm.

[0136] S3: Perform an electrostatic treatment on the anti-wetting layer, and then electrostatically adsorb the electrostatically treated anti-wetting layer onto the inner wall of the container.

[0137] The surface resistivity of the anti-wetting layer on the side furthest from the supporting microstructure after electrostatic treatment is .

[0138] Example 3

[0139] This embodiment provides a method for preparing an anti-wetting device, which specifically includes the following steps:

[0140] S1: Provides a 0.3mm thick anti-wetting layer.

[0141] The anti-wetting layer is made of PVC.

[0142] S2: Using nanoimprinting technology, multiple first support microstructures with a size of 100μm and a height of 200μm are formed in an equilateral triangular array on the anti-wetting layer. Five second support microstructures with a size of 50μm and a height of 60μm are formed between two adjacent first support microstructures.

[0143] The temperature at which the nanoimprinting mold is heated during the nanoimprinting process is 120℃; the first and second support microstructures are both cuboid in shape; the distance between two adjacent first support microstructures is 180μm; and the distance between two adjacent second support microstructures is 20μm.

[0144] S3: Perform an electrostatic treatment on the anti-wetting layer, and then electrostatically adsorb the electrostatically treated anti-wetting layer onto the inner wall of the container.

[0145] The surface resistivity of the anti-wetting layer on the side furthest from the supporting microstructure after electrostatic treatment is .

[0146] Example 4

[0147] This embodiment provides a method for preparing an anti-wetting device, which specifically includes the following steps:

[0148] S1: Provides a 0.3mm thick anti-wetting layer.

[0149] The anti-wetting layer is made of PVC.

[0150] S2: Using nanoimprinting technology, multiple first support microstructures with a size of 100μm and a height of 200μm are formed in an equilateral triangular array on the anti-wetting layer. Five second support microstructures with a size of 50μm and a height of 60μm are formed between two adjacent first support microstructures. On the surface of the first and second support microstructures away from the anti-wetting layer, nanostructures with a size of 100nm and a height of 100nm are formed.

[0151] The temperature at which the nanoimprinting mold is heated during the nanoimprinting process is 120℃; the first and second supporting microstructures are both cuboids; the nanostructure is pentagonal; the distance between two adjacent first supporting microstructures is 180μm; and the distance between two adjacent second supporting microstructures is 20μm.

[0152] S3: Perform an electrostatic treatment on the anti-wetting layer, and then electrostatically adsorb the electrostatically treated anti-wetting layer onto the inner wall of the container.

[0153] The surface resistivity of the anti-wetting layer on the side furthest from the supporting microstructure after electrostatic treatment is .

[0154] like Figure 9 Optical photographs of the surface of the anti-wetting devices prepared in Examples 3 and 4, showing liquid gallium metal. Figure 9 Image (a) is an optical photograph of liquid gallium on the surface of the anti-wetting device prepared in Example 4. Figure 9 (b) is an optical photograph of liquid gallium on the surface of the anti-wetting device prepared in Example 3.

[0155] from Figure 9 As can be seen, the same liquid gallium droplets adhere differently in the two anti-wetting devices. Figure 9 In (a), the liquid gallium droplets exhibit a better spherical shape and a larger contact angle with the anti-wetting layer, indicating that the liquid gallium has less adhesion to the anti-wetting layer surface. Figure 9 In (b), the liquid gallium droplets have poor sphericity and a small contact angle between the droplets and the anti-wetting layer, indicating that there is still a risk of liquid gallium adhering to the surface of the anti-wetting layer. By comparison, it can be seen that forming nanostructures on the surfaces of the first and second support microstructures can further increase the contact angle between liquid gallium and the anti-wetting layer.

[0156] like Figure 10 The diagram shows a comparison of the contact angles of liquid gallium when it is placed in different containers; the vertical axis represents the contact angle (CA). Figure 10(a) in the figure represents the contact angle between liquid gallium metal and the container when the liquid gallium metal is placed directly in the container without an anti-wetting device; Figure 10 (b) represents the contact angle between liquid gallium metal and the anti-wetting layer when liquid gallium metal is placed in a container with an anti-wetting device prepared using the method provided in Example 3 attached to its inner wall; Figure 10 (c) represents the contact angle between liquid gallium metal and the anti-wetting layer when liquid gallium metal is placed in a container with an anti-wetting device prepared using the method provided in Example 4 attached to its inner wall.

[0157] from Figure 10 As can be seen, when liquid gallium is directly placed in a container without any treatment, the contact angle between the container and the liquid gallium droplets is 81.2°, indicating partial wetting. After an anti-wetting layer containing a first support microstructure and a second support microstructure is provided inside the container, the contact angle between the anti-wetting layer and the liquid gallium droplets is 142.6°. This shows that the anti-wetting device prepared using the methods provided in Examples 1 to 3 of this application can effectively increase the contact angle between the liquid gallium and the anti-wetting layer, thereby effectively preventing the liquid gallium from hanging on the inner wall of the container. In addition, after an anti-wetting layer containing a first support microstructure, a second support microstructure, and a nanostructure is provided inside the container, the contact angle between the anti-wetting layer and the liquid gallium is 158.5°. This shows that the anti-wetting device prepared using the method provided in Example 4 of this application can further increase the contact angle between the liquid gallium and the anti-wetting layer, reducing the amount of liquid gallium adhering to the surface.

[0158] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.

Claims

1. A method for preparing an anti-wetting device, characterized in that, The anti-wetting device is used to prevent the liquid to be stored from wetting the container, wherein the liquid to be stored is liquid gallium, liquid indium, or liquid tin, and the method includes: Provide a wetting-resistant layer; A plurality of first support microstructures and a plurality of second support microstructures located between two adjacent first support microstructures are formed on the anti-wetting layer; The anti-wetting layer is subjected to an electrostatic treatment, causing it to be electrostatically adsorbed onto the inner wall of the container; wherein, the surface resistivity of the side of the anti-wetting layer in contact with the container after the electrostatic treatment is [missing information]. ; The anti-wetting layer completely covers the inner wall of the container, which includes the side surface and the bottom surface; the height of the first supporting microstructure is greater than the height of the second supporting microstructure, and the distance between two adjacent second supporting microstructures is less than the diameter of the liquid to be stored; the material of the anti-wetting layer is the same as the material of the container.

2. The method for preparing the anti-wetting device according to claim 1, characterized in that, The method further includes: Multiple nanostructures are formed on the surface of the first and second support microstructures away from the anti-wetting layer.

3. The method for preparing the anti-wetting device according to claim 1, characterized in that, The formation of a plurality of first support microstructures on the anti-wetting layer and a plurality of second support microstructures located between two adjacent first support microstructures includes: Provide a one-nanometer imprinting base mold; Multiple first grooves are formed at intervals on the nanoimprint base mold, multiple second grooves are formed at intervals between two adjacent first grooves, and multiple nano grooves are formed at the bottom of the first grooves and the second grooves to obtain a nanoimprint mold. The anti-wetting layer is imprinted using the nanoimprint mold to form a plurality of first protrusions corresponding one-to-one with the first groove, a plurality of second protrusions corresponding one-to-one with the second groove, and a plurality of nano protrusions corresponding one-to-one with the plurality of nano grooves; The anti-wetting layer, the plurality of first protrusions, the plurality of second protrusions, and the plurality of nano protrusions are heated and cured to form a plurality of first support microstructures with nanostructures and a plurality of second support microstructures with nanostructures on the anti-wetting layer.

4. The method for preparing the anti-wetting device according to claim 1, characterized in that, The formation of a plurality of first support microstructures on the anti-wetting layer and a plurality of second support microstructures located between two adjacent first support microstructures includes: Provide a transfer substrate and a temporary substrate; A plurality of first support microstructures having multiple nanostructures on top are formed on the transfer substrate at intervals, and a plurality of second support microstructures having multiple nanostructures on top are formed at intervals between two adjacent first support microstructures. The plurality of first support microstructures and the plurality of second support microstructures on the transfer substrate are transferred to the temporary substrate; The plurality of first support microstructures and the plurality of second support microstructures on the temporary substrate are transferred to the anti-wetting layer.

5. The method for preparing the anti-wetting device according to claim 1, characterized in that, The distance between two adjacent first support microstructures is less than the diameter of the liquid to be stored; and / or The size of the first support microstructure is larger than the size of the second support microstructure.

6. The method for preparing the anti-wetting device according to claim 3, characterized in that, The thickness of the anti-wetting layer is 0.1~0.3mm; and / or The thickness of the anti-wetting device is 0.3mm~0.5mm; and / or The height of the first supporting microstructure is 1 / 4 to 1 / 2 of the thickness of the anti-wetting device; and / or The plurality of first support microstructures are arranged in an equilateral triangular array; and / or Each of the first supporting microstructures is cylindrical or cuboid in shape; and / or Three to five second protrusions are spaced apart between two adjacent first support microstructures; and / or Each of the second support microstructures is cylindrical or cuboid in shape; and / or The size of the first support microstructure is 80 μm to 100 μm; the height of the first support microstructure is 150 μm to 200 μm; the distance between two adjacent first support microstructures is 100 μm to 180 μm; and / or The dimensions of the second support microstructure are 10 μm to 50 μm; the height of the second support microstructure is 20 μm to 60 μm; the distance between two adjacent second support microstructures is 10 μm to 20 μm; and / or The shapes of the nanostructures include triangular pyramids, pentagons, hexagons, claw shapes; and / or The size of the nanostructure is 1 nm to 100 nm; the height of the nanostructure is 1 nm to 100 nm.

7. A device for preventing wetting, characterized in that, The anti-wetting device is prepared by the method for preparing the anti-wetting device according to any one of claims 1-6.

8. A receiving device with anti-wetting function, characterized in that, The invention includes the anti-wetting device and container as described in claim 7, wherein the anti-wetting device is adsorbed onto the inner wall of the container and completely covers the inner wall of the container, for preventing the liquid to be stored from wetting the container.

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