Display apparatus and method of controlling the same

Abstract

The invention relates to a display apparatus and a method of controlling the display apparatus. The display device includes: a touch panel; a display panel; and a touch integrated circuit (IC) configured to determine whether a first frequency, which is a driving frequency of the display panel, matches a second frequency, which is a driving frequency of the touch panel, and when the first frequency matches the second frequency, change the second frequency to a third frequency different from the first frequency.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2023-0110133 filed on August 22, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] The present disclosure relates to a display device and a method of controlling the display device, and more particularly, to a display device including a touch panel and a method of controlling the display device including the display panel and the touch panel. Background Art

[0004] A touch panel is a device for identifying a user's input action or event. Generally, when a touch panel is touched by an object such as a finger or a stylus, the touch panel may generate an electrical signal to detect the presence and location of the touch. In the case of a user touch, noise may appear in the electrical signal.

[0005] In order to reduce power consumption, a display device supporting a low power consumption driving mode has recently been developed. Various control methods are required to drive a touch panel with low power. Summary of the invention

[0006] Embodiments may provide a method of controlling a display device that avoids generation of noise caused by a user's touch.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the disclosure.

[0008] According to one or more embodiments, a display device may include: a touch panel; a display panel; and a touch integrated circuit (IC), configured to determine whether a first frequency as a driving frequency of the display panel matches a second frequency as a driving frequency of the touch panel, and when the first frequency matches the second frequency, the touch IC changes the second frequency to a third frequency different from the first frequency.

[0009] In an embodiment, the first frequency may be determined based on a display mode of the display panel.

[0010] In an embodiment, the display device may further include: a processor connected to the display panel, and the processor is configured to recognize a change in the information about the first frequency, and the touch IC receives the information about the first frequency from the processor.

[0011] In an embodiment, the display panel may be directly connected to the touch IC through an external pin, and the touch IC may be further configured to monitor a change in the information about the first frequency.

[0012] In an embodiment, the touch IC may be further configured to determine whether the user touch signal includes harmonic noise based on whether the first frequency matches the second frequency.

[0013] In an embodiment, when it is determined that the user touch signal includes the harmonic noise, the touch IC may change the second frequency to the third frequency by changing the second frequency to a hopping frequency selected from a plurality of predetermined hopping frequencies.

[0014] In an embodiment, the touch IC changes the second frequency to the third frequency by changing analog parameters stored in the touch IC.

[0015] In an embodiment, when it is determined that the user touch signal includes the harmonic noise, the touch IC may change the second frequency to the third frequency by dithering the second frequency to a predetermined frequency band.

[0016] In an embodiment, the touch IC changes the second frequency to the third frequency by changing digital bits stored in the touch IC.

[0017] In an embodiment, the predetermined frequency band may be in the range of 233 kHz to 264 kHz, inclusive.

[0018] In an embodiment, the touch IC and the processor may be arranged on a printed board, the touch panel and the touch IC may be connected to each other through a plurality of sensing signal lines and a plurality of driving signal lines, the display panel and the processor may be connected to each other through a mobile industrial processor interface (MIPI) transmission line, and the plurality of sensing signal lines and the plurality of driving signal lines may at least partially cross the MIPI transmission line.

[0019] According to one or more embodiments, a method for controlling a display device includes a display panel and a touch panel, wherein the method includes: receiving information about a first frequency through a touch integrated circuit (IC) connected to the touch panel, the first frequency being a driving frequency of the display panel; determining through the touch IC whether the first frequency matches a second frequency, the second frequency being a driving frequency of the touch panel; and when the first frequency matches the second frequency, changing the second frequency to a third frequency different from the first frequency through the touch IC.

[0020] In an embodiment, the receiving the information about the first frequency may include: receiving the information about the first frequency from a processor through the touch IC, the processor being configured to identify a change in the information about the first frequency, the first frequency being determined based on a mode of the display panel.

[0021] In an embodiment, the method may further include: monitoring, by the touch IC directly connected to the display panel through an external pin, a change in the information on the first frequency.

[0022] In an embodiment, the determining whether the first frequency matches the second frequency may include: determining whether the user touch signal includes harmonic noise based on whether the first frequency matches the second frequency.

[0023] In an embodiment, the changing the second frequency to the third frequency may include: when the user touch signal includes the harmonic noise, changing the second frequency to the third frequency by changing the second frequency to a hopping frequency selected from a plurality of predetermined hopping frequencies.

[0024] In an embodiment, the changing the second frequency to the third frequency may include: changing the second frequency to the third frequency by changing a simulation parameter stored in the touch IC.

[0025] In an embodiment, the changing the second frequency to the third frequency may include: when the user touch signal includes the harmonic noise, changing the second frequency to the third frequency by dithering the second frequency to a predetermined frequency band.

[0026] In an embodiment, the changing the second frequency to the third frequency may include: changing the second frequency to the third frequency by changing digital bits stored in the touch IC.

[0027] In an embodiment, receiving the information about the first frequency may include: switching the first display mode of the display panel to the second display mode based on user touch; and receiving the information about the first frequency through the touch IC, wherein the first frequency is determined based on the second display mode of the display panel.

[0028] In addition, a computer program stored in a computer-readable recording medium for execution to implement the present disclosure may also be provided.

[0029] Furthermore, a computer-readable recording medium having a computer program for executing the method implementing the present disclosure stored therein may also be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description in conjunction with the accompanying drawings, in which:

[0031] Figure 1A is a plan view of a display device according to an embodiment;

[0032] Figure 1B It is taken along the line I-I' Figure 1A A schematic cross-sectional view of a display device shown in ;

[0033] Figure 1C is a diagram showing an intersection area of ​​a plurality of lines in a display device according to an embodiment;

[0034] Figure 2 is a block diagram of a display device according to an embodiment;

[0035] Figure 3 is a flowchart illustrating an operation in which a touch integrated circuit (IC) according to an embodiment changes a second frequency to a third frequency;

[0036] Figure 4 According to the embodiment Figure 3 A block diagram of a flow chart;

[0037] Figure 5 is a block diagram of a process of changing a second frequency to a third frequency when a display panel according to an embodiment is directly connected to a touch IC according to an embodiment;

[0038] Figure 6 is a flowchart illustrating an operation of changing a second frequency to a third frequency when harmonic noise occurs according to an embodiment;

[0039] Figure 7 is a diagram for explaining changing the second frequency by a frequency hopping method according to an embodiment;

[0040] Figure 8 is a flowchart illustrating an operation of changing a second frequency to a third frequency when harmonic noise occurs according to an embodiment; and

[0041] Fig. 9 is a diagram for explaining changing the second frequency by a dithering method according to an embodiment. DETAILED DESCRIPTION

[0042] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein like reference numerals denote like elements throughout. In this regard, the embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, the embodiments are described below only by operating the accompanying drawings to explain aspects of the specification.

[0043] As used herein, the word "or" means a logical "OR," thus, unless the context dictates otherwise, the expression "A, B, or C" means "A and B and C," "A and B but not C," "A and C but not B," "B and C but not A," "A but not B and not C," "B but not A and not C," and "C but not A and not B." Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0044] Since the present disclosure allows various changes and multiple embodiments, specific embodiments will be shown in the drawings and described in detail in the written description. The effects and features of the present disclosure and the methods for implementing the present disclosure will become apparent with reference to the embodiments and drawings described in detail below. However, the present disclosure can be implemented in many different forms and should not be construed as being limited to the embodiments described herein.

[0045] Throughout the present disclosure, the same reference numerals in the accompanying drawings represent the same elements. The present disclosure does not describe all elements of the embodiments, and omits general content or repeated content between the embodiments in the technical field of the present disclosure. The terms "unit, module, component, block" used in the present disclosure can be implemented in software or hardware, and according to the embodiment, multiple "units, modules, components, blocks" can be implemented as one component, or one "unit, module, component, block" can include multiple components.

[0046] Throughout the disclosure, when one part is "connected to" another part, it includes a direct connection and an indirect connection, and the indirect connection includes connection through a wireless communication network.

[0047] Furthermore, when a portion “includes” any component, the portion may further include other components, rather than excluding the existence of other components, unless otherwise stated.

[0048] It will be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another component.

[0049] An expression used in the singular includes the expression in the plural unless it has an obviously different meaning in the context.

[0050] The identifier used for each operation is used for convenience of explanation. The identifier does not interpret the order of each operation, and each operation may be performed in a manner different from the specified order unless a specific order is clearly stated in the context.

[0051] The present disclosure will now be described more fully with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. Like reference numerals in the drawings represent like elements, and thus their description will not be repeated.

[0052] Figure 1A is a plan view of a display device 1 according to an embodiment, Figure 1B It is taken along the line I-I' Figure 1A , and Figure 1C is a diagram showing an intersection area of ​​a plurality of lines in the display device 1 according to the embodiment.

[0053] Reference Figure 1A , the display device 1 may include a display panel 11 including a touch panel TP and a printed board FCB. The display panel 11 may include a driver DI for driving pixels. A touch integrated circuit (IC) TIC and a processor AP may be provided on the printed board FCB.

[0054] Reference Figure 1A , the display device 1 can be a portable electronic device, such as a mobile phone, a smart phone, a desktop personal computer (PC), a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation device or an ultra mobile PC (UMPC), etc., and the display device 1 can also be used as a display screen of various products (such as a television, a notebook computer, a monitor, a billboard or an Internet of Things (IoT) device, etc.). In addition, the display device 1 according to the embodiment can be used as a wearable device, such as a smart watch, a watch phone, a glasses-type display, and a head-mounted display (HMD). In addition, the display device 1 according to the embodiment can be used as a dashboard of a vehicle, a center control panel of a vehicle or a central information display (CID) set on the dashboard, a rearview mirror display that replaces a side mirror of a vehicle, and a display screen set on the back of a front seat as an entertainment device for rear passengers of the vehicle.

[0055] The display panel 11 may include a display area DA and a non-display area NDA.

[0056] Although not shown in the figure, a plurality of pixels displaying an image may be arranged in the display area DA. Each of the plurality of pixels may include a light emitting element. The light emitting element may be an organic light emitting diode (OLED).

[0057] The non-display area NDA of the display panel 11 is arranged around the display area DA. The non-display area NDA may be a frame area. The non-display area NDA may surround all sides of the display area DA, but is not limited thereto. The driver DI, the touch IC TIC, and the processor AP that drive the display panel 11 may be arranged in the non-display area NDA. In this case, the touch ICTIC and the processor AP may be provided on the printed board FCB.

[0058] The display panel 11 may be driven by the driver DI to display an image. In an embodiment, the driver DI may be formed in the form of an IC chip to be directly disposed on the substrate of the display panel 11 by a chip on glass (COG) or a chip on plastic (COP) method. In another embodiment, the driver DI may be disposed on a printed board FCB electrically connected to a substrate 100 (refer to FIG. 1 ) disposed on the display panel 11. Figure 1B ) on one side of the terminal unit. The printed board FCB may be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0059] The driver DI may drive the display panel 11 by transmitting signals to pixels of the display panel 11 based on input image data and control signals provided from the processor AP. In an embodiment, the driver DI may include a data driver that supplies data signals to the pixels and a controller that outputs control signals to the data driver. The controller may output control signals to a gate driver (not shown) provided on the substrate 100 of the display panel 11. The data driver may be arranged in the non-display area NDA and supply gate signals to the pixels according to the driving frequency of the display panel 11. The data driver may supply data signals to the pixels according to the driving frequency of the display panel 11.

[0060] The processor AP may be a graphics processing unit (GPU) or an application processor AP including a GPU, and in the present disclosure, the processor AP may refer to a processor AP including a GPU. The processor AP may transmit input image data and control signals to the driver DI. According to an embodiment, when the display mode of the display panel 11 changes, the first frequency may be changed, and the first frequency is the driving frequency of the display panel 11. The change in the display mode of the display panel 11 may comprehensively refer to a situation in which the driving frequency changes, such as a situation in which the display screen is switched, a situation in which the rear video shooting mode is switched to the front video shooting mode, or a situation in which the resolution changes. In an embodiment, the processor AP may change the first frequency according to the display mode, and transmit the first frequency information to the driver DI and the touch IC TIC according to the changed first frequency. In an embodiment, the first frequency information may be a vertical synchronization signal or a horizontal synchronization signal. The period of the vertical synchronization signal or the horizontal synchronization signal may vary according to the first frequency.

[0061] The touch IC TIC may be formed in the form of an IC chip to be disposed on a printed board FCB electrically connected to a terminal unit arranged on one side of a substrate of the display panel 11. The touch IC TIC may drive the touch panel TP to detect a touch or approach of a conductive object.

[0062] The touch panel TP may include an area corresponding to the display area DA and the non-display area NDA of the display panel 11 .

[0063] The touch panel TP may be a capacitive touch panel that senses a capacitance change caused by a touch of a conductive object (e.g., a finger or a stylus pen, etc.). In addition, according to an embodiment, the touch panel TP may be an additional touch panel attached to the display panel 11, or may be an embedded touch panel formed in the display panel 11. For example, the touch panel TP may be an on-cell type built-in touch panel or an in-cell type built-in touch panel, but is not limited thereto.

[0064] In the touch panel TP, an area corresponding to the display area DA of the display panel 11 may include a touch sensing area TSA. User touch sensing electrodes may be arranged in the touch sensing area TSA. For example, the user touch sensing electrodes may include a plurality of driving electrodes TEa and a plurality of sensing electrodes REa.

[0065] In an embodiment, the touch panel TP may be arranged only in a limited area required for touch recognition. In this case, the touch panel TP overlaps a portion of the display area DA, but may not overlap another portion of the display area DA.

[0066] Reference Figure 1A A touch sensing area TSA may be defined in the touch panel TP, the touch sensing area TSA may correspond to the display area DA of the display panel 11, and a touch sensor TSa may be provided in the touch sensing area TSA. In addition, a touch IC TIC controlling each touch sensor TSa may be provided on the printed board FCB.

[0067] The touch sensor TSa may include a plurality of drive electrodes TEa and a plurality of sensing electrodes REa arranged in a touch sensing area TSA. The plurality of drive electrodes TEa may be arranged in a first direction (x direction) and spaced apart from each other in a second direction (y direction). The drive electrodes TEa adjacent to each other in the first direction may be connected to each other by connecting electrodes to form a drive line. The plurality of sensing electrodes REa may be arranged in a second direction (y direction) and spaced apart from each other in the first direction (x direction). The sensing electrodes REa adjacent to each other in the second direction may be connected to each other by connecting electrodes to form a sensing line. The drive line and the sensing line may cross each other. For example, in a plan view, the sensing line formed by the plurality of sensing electrodes REa may be arranged to cross the drive line formed by the plurality of drive electrodes TEa.

[0068] The multiple driving electrodes TEa can be electrodes used to apply driving signals Tx through the touch IC TIC to drive the touch panel TP, and each of the driving lines formed by connecting the multiple driving electrodes TEa to each other can be connected to the driving signal line TL, so that the multiple driving electrodes TEa can receive the driving signals Tx from the touch IC TIC.

[0069] The plurality of sensing electrodes REa are electrodes for the touch panel TP to sense a user touch signal, and the plurality of sensing electrodes REa may be electrodes for applying a sensing signal Rx to the touch IC TIC. Each of the sensing lines formed by connecting the plurality of sensing electrodes REa to each other may be connected to a sensing signal line RL. When a user touch signal is sensed by the plurality of sensing electrodes REa, the sensing signal Rx may be transmitted to the touch IC TIC through the plurality of sensing signal lines RL.

[0070] like Figure 1A As shown in , a plurality of sensing signal lines RL and a plurality of driving signal lines TL may be arranged in an area of ​​the touch panel TP corresponding to the non-display area NDA of the display panel 11. The plurality of driving signal lines TL may be signal lines for the touch IC TIC to apply electrical signals to the plurality of sensing electrodes REa of the touch panel TP, and the plurality of sensing signal lines RL may be signal lines that transmit electrical signals from the sensing electrodes provided on the touch panel TP to the touch IC TIC. The non-display area NDA may not include the touch sensing area TSA. In another embodiment, the non-display area NDA may also include a portion of the touch sensing area TSA. Figure 1A In the embodiment, a plurality of sensing signal lines and a plurality of driving signal lines are respectively shown as RL and TL, and the plurality of sensing signal lines RL and the plurality of driving signal lines TL are not limited to Figure 1A those shown, and may also include lines required for transmitting the sensing signal Rx and the driving signal Tx.

[0071] When a conductive object is touched, the touch panel TP can transmit a sensing signal Rx to the touch IC TIC through a plurality of sensing signal lines RL, and the touch IC TIC can recognize whether a touch input occurs and touch information such as a touched position by sensing changes in capacitance between the driving electrode TEa and the sensing electrode REa.

[0072] Reference Figure 1A , the touch IC TIC may include a signal driver 12a, a signal sensor 12b, and a memory 12c. The signal driver 12a may be electrically connected to a plurality of driving electrodes TEa on the touch panel TP through a plurality of driving signal lines TL to apply a driving signal Tx to the plurality of driving electrodes TEa according to the driving frequency of the touch panel TP. The signal driver 12a may receive a control signal according to the driving frequency of the touch panel TP from the control unit 12d, and in response to the control signal, apply the driving signal Tx to the plurality of driving electrodes TEa according to the driving frequency of the touch panel TP. The signal sensor 12b may be electrically connected to a plurality of sensing electrodes REa on the touch panel TP through a plurality of sensing signal lines RL to receive sensing signals Rx from the plurality of sensing electrodes REa, and convert the received sensing signals Rx into digital signals. The driving frequency of the touch panel TP may be determined based on the period or frequency of the vertical synchronization signal (Vsync) and the horizontal synchronization signal (Hsync).

[0073] In an embodiment, the signal sensor 12b may include an analog front end for receiving an analog signal and an analog-to-digital converter for converting the received analog signal into a digital signal. The memory 12c may store software or algorithms for operating the touch IC TIC, etc. The memory 12c may include a random access memory (RAM) or a flash memory.

[0074] The control unit 12d may control the operation of the touch IC TIC. The control unit 12d may transmit a control signal to the signal driver 12a according to the driving frequency of the touch panel TP. It may determine whether there is a touch input and a touch position based on the sensing signal Rx received from the plurality of sensing electrodes REa on the touch panel TP. The control unit 12d may include a microcontroller unit (MCU) or a central processing unit (CPU).

[0075] In an embodiment, the control unit 12d may be provided as a single chip. Figure 1A As shown in FIG. 1 , the touch ICTIC may be provided as a single chip including the control unit 12d. In another embodiment, the control unit 12d may be composed of a single chip separate from the touch IC TIC.

[0076] The touch IC TIC can sense changes in mutual capacitance between the plurality of drive electrodes TEa and the plurality of sensing electrodes REa, changes in self-capacitance of the plurality of drive electrodes TEa, or changes in self-capacitance of the plurality of sensing electrodes REa. Since the plurality of drive electrodes TEa and the plurality of sensing electrodes REa are arranged on the entire surface of the touch sensing area TSA, the touch IC TIC can sense changes in mutual capacitance of the touch sensing area TSA or changes in self-capacitance of the touch sensing area TSA. The signal sensor 12b of the touch IC TIC can generate a sensing signal based on the changes in mutual capacitance of the touch sensing area TSA or changes in self-capacitance of the touch sensing area TSA, and transmit the generated sensing signal to the control unit 12d.

[0077] The control unit 12d may determine whether a touch input occurs and a touch position based on the sensing signal, and may control an operation mode of the touch IC TIC.

[0078] The control unit 12d may receive first frequency information about the display panel 11 to identify a first frequency, which is a driving frequency of the display panel 11. The control unit 12d may determine whether the first frequency matches a second frequency, which is a driving frequency of the touch panel TP, and when the first frequency matches the second frequency, the driving frequency of the touch panel TP may be changed to a third frequency different from the first frequency. The control unit 12d may transmit a control signal to the signal driver 12a according to the changed driving frequency. The signal driver 12a may apply a driving signal Tx to a plurality of driving electrodes TEa according to the changed driving frequency of the touch panel TP.

[0079] Reference Figure 1B , also refer to Figure 1A , the display element layer 200, the encapsulation layer 300, and the touch sensor layer 400 may be sequentially stacked in the third direction (z direction) in the display area DA of the substrate 100. The organic light emitting diode OLED and the pixel circuit PC electrically connected to the organic light emitting diode OLED may be provided on the display element layer 200. The display panel 11 may include the display element layer 200 and the encapsulation layer 300, and the touch panel TP may include the touch sensor layer 400.

[0080] The substrate 100 may include an insulating material such as glass, quartz, or polymer resin, etc. The substrate 100 may be a rigid substrate, or a flexible substrate that is bendable, foldable, or rollable, etc.

[0081] The buffer layer 201 may be disposed on the substrate 100 to reduce or block penetration of foreign matter, moisture, or external air from the lower portion of the substrate 100 and to provide a flat surface on the semiconductor layer Act of the pixel circuit PC. The buffer layer 201 may include an inorganic material such as an oxide or a nitride, an organic material, or a composite of an organic material and an inorganic material, and may include a single-layer or multi-layer structure including an inorganic material and an organic material.

[0082] A barrier layer 101 that blocks external air penetration may also be included between the substrate 100 and the buffer layer 201. Each of the barrier layer 101 and the buffer layer 201 may include silicon oxide (SiO 2 ) or silicon nitride (SiN x ).

[0083] A pixel circuit PC including a thin film transistor TFT and a storage capacitor Cst is disposed on the buffer layer 201 .

[0084] The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a drain electrode DE, and a source electrode SE.

[0085] The semiconductor layer Act may be disposed on the buffer layer 201 and may include polycrystalline silicon. In another embodiment, the semiconductor layer Act may include amorphous silicon. In another embodiment, the semiconductor layer Act may include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti) and zinc (Zn). The semiconductor layer Act may include a channel region, a source region and a drain region, wherein the source region and the drain region are doped with impurities. The source region and the drain region may be arranged on both sides of the channel region, respectively.

[0086] A first gate insulating layer 203 may be provided to cover the semiconductor layer Act. The first gate insulating layer 203 may include, for example, silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x )(ZnO x Can be ZnO or ZnO 2) etc. The first gate insulating layer 203 may include a single layer or multiple layers each including the above-mentioned inorganic insulating material.

[0087] The gate electrode GE is disposed on the first gate insulating layer 203 to overlap the semiconductor layer Act. The gate electrode GE may include molybdenum (Mo), aluminum (Al), copper (Cu), or Ti, etc., and may include a single layer or multiple layers. For example, the gate electrode GE may include a single layer of Mo.

[0088] A second gate insulating layer 204 may be provided to cover the gate electrode GE. The second gate insulating layer 204 may include an inorganic insulating material such as silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x )(ZnO x Can be ZnO or ZnO 2 ) etc. The second gate insulating layer 204 may include a single layer or multiple layers each including the above-mentioned inorganic insulating material.

[0089] The second electrode CE2 of the storage capacitor Cst may be disposed on the second gate insulating layer 204. The second electrode CE2 may overlap the gate electrode GE. The gate electrode GE and the second electrode CE2 may overlap each other with the second gate insulating layer 204 interposed therebetween to form the storage capacitor Cst. That is, the gate electrode GE may serve as the first electrode CE1 of the storage capacitor Cst.

[0090] The second electrode CE2 may include Al, platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), Mo, Ti, tungsten (W) or Cu, and may be a single layer or multiple layers each containing the above materials.

[0091] An interlayer insulating layer 205 may be formed to cover the second electrode CE2. The interlayer insulating layer 205 may include silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al 2 O3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x )(ZnO x Can be ZnO or ZnO 2 ) etc. The interlayer insulating layer 205 may include a single layer or a plurality of layers each including the above-mentioned inorganic insulating material.

[0092] The buffer layer 201 , the first gate insulating layer 203 , the second gate insulating layer 204 , and the interlayer insulating layer 205 may be referred to as an inorganic insulating layer.

[0093] The source electrode SE and the drain electrode DE are disposed on the interlayer insulating layer 205. Each of the source electrode SE and the drain electrode DE may include a conductive material including Mo, Al, Cu, or Ti, and may include a multilayer or a single layer each including the above materials. For example, each of the source electrode SE and the drain electrode DE may include a multilayer structure of Ti / Al / Ti. In some embodiments, the source electrode SE or the drain electrode DE may be omitted. For example, the thin film transistors TFT adjacent to each other may share the source region or the drain region of the semiconductor layer Act, and the source region or the drain region may be used as the source electrode SE or the drain electrode DE.

[0094] The planarization insulating layer 207 may be disposed to cover the source electrode SE and the drain electrode DE. The planarization insulating layer 207 may provide a flat base surface for the pixel electrode 210 disposed on an upper portion of the planarization insulating layer 207.

[0095] The planarization insulating layer 207 may include an organic material or an inorganic material, and may have a single-layer structure or a multi-layer structure. The planarization insulating layer 207 may include a general polymer such as polystyrene (PS), benzocyclobutene (BCB), hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA), a polymer derivative containing a phenol group, an acrylic polymer, an imide polymer (e.g., polyimide), an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, or a vinyl alcohol polymer. The planarization insulating layer 207 may include a general polymer such as silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x )(ZnO x Can be ZnO or ZnO 2 ) etc. When the planarization insulating layer 207 is formed, the upper surface of the layer may be chemically mechanically polished to provide a flat upper surface after the layer is formed.

[0096] The pixel electrode 210 may be disposed on the planarization insulating layer 207. The planarization insulating layer 207 may have a via hole exposing any one of the source electrode SE and the drain electrode DE of the thin film transistor TFT, and the pixel electrode 210 may contact the source electrode SE or the drain electrode DE through the via hole to be electrically connected to the thin film transistor TFT.

[0097] The pixel electrode 210 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). The pixel electrode 210 may include a reflective film containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a compound thereof. For example, the pixel electrode 210 may have a conductive oxide containing ITO, IZO, ZnO or In above / below the above reflective film. 2 O 3 In this case, the pixel electrode 210 may have a stack structure of ITO / Ag / ITO.

[0098] The pixel defining layer 209 may cover the edge of the pixel electrode 210 on the planarization insulating layer 207 and may have a pixel opening OP exposing a central portion of the pixel electrode 210. An emission region of the organic light emitting diode OLED, ie, the size and shape of a pixel, is defined by the pixel opening OP.

[0099] The pixel defining layer 209 can prevent arcing, etc., from being generated at the edge of the pixel electrode 210 by increasing the distance between the edge of the pixel electrode 210 and the counter electrode 230 above the pixel electrode 210. The pixel defining layer 209 can be formed of an organic insulating material (such as polyimide, polyamide, acrylic resin, BCB, HMDSO, and phenolic resin) by spin coating, etc.

[0100] The pixel defining layer 209 may be formed in black. The pixel defining layer 209 may include a light blocking material and may be provided in black. The light blocking material may include carbon black, carbon nanotubes, a resin or paste including a black dye, metal particles (such as Ni, Al, Mo and alloys thereof), metal oxide particles (e.g., chromium oxide) or metal nitride particles (e.g., chromium nitride), etc. When the pixel defining layer 209 includes a light blocking material, reflection of external light by a metal structure disposed below the pixel defining layer 209 may be reduced.

[0101] The intermediate layer 220 may be disposed between the pixel electrode 210 and the opposing electrode 230. The intermediate layer 220 may include a first functional layer 221, an emission layer 222, and a second functional layer 223.

[0102] An emission layer 222 formed to correspond to the pixel electrode 210 is disposed within the pixel opening OP of the pixel defining layer 209. The emission layer 222 may include a polymer material or a low molecular weight material, and may emit red, green, blue, or white light.

[0103] The first and second functional layers 221 and 223 may be respectively disposed under or on the emission layer 222. In an embodiment, unlike the emission layer 222 patterned and arranged for each pixel, the first and second functional layers 221 and 223 may be integrally provided over the entire surface of the display area DA.

[0104] The first functional layer 221 may be a single layer or a multilayer. For example, when the first functional layer 221 includes a polymer material, the first functional layer 221 may be a hole transport layer having a single layer structure, and may include poly (3,4) -ethylenedioxythiophene (PEDOT) or polyaniline (PANI). When the first functional layer 221 includes a low molecular weight material, the first functional layer 221 may include a hole injection layer and a hole transport layer.

[0105] The second functional layer 223 may be selectively arranged. For example, when each of the first functional layer 221 and the emission layer 222 includes a low molecular weight material, the second functional layer 223 may be preferably formed. The second functional layer 223 may be a single layer or a multilayer. The second functional layer 223 may include an electron transport layer or an electron injection layer. In some embodiments, at least one of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may be omitted.

[0106] The counter electrode 230 may include a conductive material having a relatively low work function. For example, the counter electrode 230 may include a (semi) transparent layer including Ag, Mg, Al, Ni, Cr, lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the counter electrode 230 may also include a conductive material such as ITO, IZO, ZnO, or In over the (semi) transparent layer including the above materials. 2 O 3 In an embodiment, the counter electrode 230 may include Ag and Mg.

[0107] The stack structure of the pixel electrode 210 , the intermediate layer 220 , and the opposing electrode 230 , which are sequentially stacked, may form an organic light emitting diode OLED.

[0108] In an embodiment, a capping layer (not shown) may be provided on the organic light emitting diode OLED. The capping layer may improve the emission efficiency of the organic light emitting diode OLED by the principle of constructive interference. The capping layer may be an organic capping layer including an organic material, an inorganic capping layer including an inorganic material, or a composite capping layer including an organic material and an inorganic material.

[0109] The encapsulation layer 300 may be disposed on the organic light emitting diode OLED. In an embodiment, the encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, the encapsulation layer 300 may include a first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330 and an organic encapsulation layer 320 disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330.

[0110] Each of the first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may include one or more inorganic insulating materials. The inorganic insulating material may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), zinc oxide (ZnO x )(ZnO x Can be ZnO or ZnO 2 ), silicon oxide (SiO 2 ), Silicon Nitride (SiN x ) or / and silicon oxynitride (SiO x N y ). The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be formed by chemical vapor deposition.

[0111] The organic encapsulating layer 320 may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl sulfonate, polyoxymethylene, polyarylate, HMDSO, acrylic resin, or a combination thereof.

[0112] The encapsulation layer 300 may completely cover the display area DA and extend toward the non-display area NDA to cover at least a portion of the non-display area NDA.

[0113] As described above, the encapsulation layer 300 may provide a flatter base surface by including the organic encapsulation layer 320. Therefore, even when components of the touch sensor layer 400 are formed through a continuous process, a defect rate of touch sensing may be reduced.

[0114] Reference Figure 1B The touch sensor layer 400 may have a multi-layer structure. The touch sensor layer 400 includes a sensing electrode ( Figure 1A The sensing electrode REa connected to the sensing electrode is connected to the sensing signal line ( Figure 1A The sensing signal line RL), the driving electrode ( Figure 1A The driving electrode TEa is connected to the driving electrode and the driving signal line ( Figure 1A The touch sensor layer 400 includes a driving signal line TL) and at least one insulating layer. The touch sensor included in the touch sensor layer 400 may sense an external input by using, for example, a capacitance method.

[0115] The touch sensor layer 400 may include a first touch insulating layer 410 , a first touch conductive layer MTL1 , a second touch insulating layer 420 , a second touch conductive layer MTL2 , and a third touch insulating layer 430 .

[0116] The first touch insulation layer 410 may be directly located on the encapsulation layer 300. The first touch insulation layer 410 may include an inorganic material or an organic material, and may be provided as a single layer or a multi-layer.

[0117] The first touch insulation layer 410 may prevent the encapsulation layer 300 from being damaged and block interference signals that may occur when the touch sensor layer 400 is driven.

[0118] For example, each of the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may have a single-layer structure or a stacked multi-layer structure. The conductive layer of the single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include Mo, Ag, Ti, Cu, Al, and alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as ITO, IZO, or indium tin zinc oxide (ITZO). In addition, the transparent conductive layer may include a conductive polymer such as PEDOT, metal nanowires, or graphene.

[0119] The conductive layer of the multilayer structure may include multiple metal layers. The multiple metal layers may have a three-layer structure of, for example, Ti / Al / Ti. The conductive layer of the multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0120] In another embodiment, each of the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may include a plurality of patterns. The first touch conductive layer MTL1 may include a first conductive pattern, and the second touch conductive layer MTL2 may include a second conductive pattern. The first conductive pattern and the second conductive pattern may form a touch sensor.

[0121] The first touch conductive layer MTL1 and the second touch conductive layer MTL2 may be electrically connected to each other through a contact hole. In an embodiment, the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may each have a mesh structure to allow light emitted from the organic light emitting diode OLED to pass through the first touch conductive layer MTL1 and the second touch conductive layer MTL2. At this time, each of the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may be arranged not to overlap with the emission area EA.

[0122] The second touch insulating layer 420 may include an organic material. The organic material may include at least one material selected from the group consisting of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin. The second touch insulating layer 420 may also include an inorganic material. The inorganic material may include a material selected from the group consisting of silicon nitride (SiN x ), aluminum nitride (AlN), zirconium nitride (ZrN), titanium nitride (TiN), hafnium nitride (HfN), tantalum nitride (TaN), silicon oxide (SiO 2 ) and aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tin oxide (SnO 2 ), cerium oxide (CeO 2 ) and silicon oxynitride (SiO x N y ) is selected from the group consisting of at least one material.

[0123] The third touch insulating layer 430 may be disposed on the second touch conductive layer MTL2. The third touch insulating layer 430 may have a single layer structure or a multi-layer structure. The third touch insulating layer 430 may include an organic material, an inorganic material, or a composite material.

[0124] Figure 1B 1 shows a case where the touch sensor layer 400 is directly formed on the encapsulation layer 300, and the display panel 11 (refer to Figure 1A) includes a touch sensor layer 400, but the present disclosure is not limited thereto. In another embodiment, the touch sensor layer 400 may be provided as a functional module separated from the display panel 11, and may be coupled to the display panel 11 by an optically transparent adhesive or the like.

[0125] In the embodiments, reference Figure 1A and Figure 1B , the first touch conductive layer MTL1 may include a second connection electrode CTE2 connecting the plurality of sensing electrodes REa to each other. The second touch conductive layer MTL2 may include a plurality of sensing electrodes REa, a plurality of driving electrodes TEa, and a first connection electrode CTE1 connecting the plurality of driving electrodes TEa to each other. That is, the plurality of driving electrodes TEa may be connected to each other through the first connection electrode CTE1 formed on the same layer, and the plurality of sensing electrodes REa may be connected to each other through the second connection electrode CTE2 formed on a different layer, and the second connection electrodes CTE2 are connected to each other through the contact hole. In an embodiment, the plurality of driving electrodes TEa and the first connection electrode CTE1 may be formed integrally.

[0126] Refer to Figure 1A In a plan view, each of the first connection electrode CTE1 and the second connection electrode CTE2 may be arranged to cross each other. Since an insulating layer (eg, the second touch insulating layer 420) is arranged between the first connection electrode CTE1 and the second connection electrode CTE2, the first connection electrode CTE1 and the second connection electrode CTE2 overlapped with each other may form a capacitor.

[0127] In another embodiment, the layer on which the plurality of driving electrodes TEa are disposed and the layer on which the plurality of sensing electrodes REa are disposed may be different layers.

[0128] Each of the plurality of driving electrodes TEa and the plurality of sensing electrodes REa may be arranged in a structure in which a plurality of continuous polygons in a rhombus are connected to each other, but the present disclosure is not limited thereto. The shape, size or arrangement of the plurality of driving electrodes TEa and the plurality of sensing electrodes REa may be variously changed according to the shape, size or arrangement of the display area DA.

[0129] Refer again Figure 1A, the driver DI and the processor AP may be connected to each other through a mobile industry processor interface (MIPI) transmission line MIPIL. The MIPI transmission line MIPIL may refer to a wired communication line connected between the driver DI and the processor AP to transmit and receive input and output signals. In an embodiment, the driver DI may be disposed on a substrate 100, the processor AP may be disposed on a printed board FCB connected to the substrate 100, and the MIPI transmission line MIPIL connecting the driver DI and the processor AP to each other may be disposed on the substrate 100 and the printed board FCB.

[0130] According to an embodiment, the plurality of sensing signal lines RL, the plurality of driving signal lines TL, and the MIPI transmission line MIPIL may at least partially cross each other on the substrate 100 and the printed board FCB. For example, the plurality of sensing signal lines RL, the plurality of driving signal lines TL, and the MIPI transmission line MIPIL may at least partially cross each other in the area ISA. For example, referring to Figure 1C , a plurality of sensing signal lines RL (ie, sensing signal lines 110 ), a plurality of driving signal lines TL (ie, driving signal lines 120 ), and MIPI transmission lines MIPIL (ie, MIPI transmission lines 130 ) may at least partially cross each other on the printed board FCB.

[0131] Figure 2 is a block diagram of a display device 1 according to the embodiment.

[0132] Reference Figure 2 , also refer to Figure 1A , the display device 1 may include a display panel 11, a touch panel TP, and a printed board FCB. Figure 2 The display device 1 of FIG. 1 may have the same configuration and operation as the display device 1 of FIG. 1 . The touch panel TP may be provided on the display panel 11 , and the printed board FCB may be electrically connected to a terminal unit arranged on one side of a substrate of the display panel 11 .

[0133] A plurality of pixels may be disposed on the display panel 11 , and the plurality of pixels may display an image according to a driving frequency of the display panel 11 .

[0134] A plurality of touch sensors TSa may be disposed on the touch panel TP, and each of the plurality of touch sensors TSa may include a plurality of driving electrodes TEa and a plurality of sensing electrodes REa. The touch sensor TSa may sense a touch according to a driving frequency of the touch panel TP.

[0135] In an embodiment, the display device 1 may include a display panel 11 , a touch panel TP, and a driver DI, but is not limited thereto and may include various components.

[0136] In an embodiment, the processor AP and the touch IC TIC may be disposed on the printed board FCB, but the present disclosure is not limited thereto, and different components may also be disposed on the printed board FCB.

[0137] The touch IC TIC can supply a driving signal Tx according to the second frequency to the multiple driving electrodes TEa of the touch panel TP through the multiple driving signal lines TL, and when the user touches, the sensing signal Rx sensed by the multiple sensing electrodes REa of the touch panel TP can be transmitted to the touch IC TIC on the printed board FCB through the multiple sensing signal lines RL.

[0138] As described above, when the mode of the display panel 11 changes, the driving frequency of the display panel 11 may change. The driving frequency of the display panel 11 may be a frame frequency for driving the display panel 11 in response to the mode of the display panel 11, and the period or frequency of the vertical synchronization signal (Vsync) and the horizontal synchronization signal (Hsync) provided from the processor AP may change according to the frame frequency. The processor AP on the printed board FCB may transmit information of the changed driving frequency to the driver DI. In the present disclosure, the driving frequency of the display panel 11 may be referred to as a first frequency, and the driving frequency information may be referred to as first frequency information. The electrical signal transmitted from the processor AP to the driver DI may be transmitted via the MIPI transmission line MIPIL (refer to Figure 1A ) is transmitted, and the first frequency information can be, for example, a vertical synchronization signal (Vsync) or a horizontal synchronization signal (Hsync).

[0139] Figure 3 FIG. 1 is a diagram showing a touch IC TIC according to an embodiment (refer to FIG. 1 ). Figure 2 ) is a flowchart of the operation of changing the second frequency to the third frequency.

[0140] Reference Figure 3 , also refer to Figure 2 Operation S310 may refer to an operation in which the touch IC TIC receives information about a first frequency, the first frequency being a driving frequency of the display panel 11.

[0141] In an embodiment, the first frequency may be determined based on the display mode. Since the driving frequency may vary based on the display mode, when the display mode is switched, the driving frequency of driving the display panel 11 may also vary.

[0142] In an embodiment, when the display mode changes based on user input, the first frequency may be determined. The user input may be a user touch. That is, the display mode may be changed by user touch, and when the display mode is changed, the first frequency may be changed. For example, when the display screen of the display panel 11 is switched by user touch and the display mode is changed, the processor AP may change the first frequency corresponding to the changed display mode, and the period of the vertical synchronization signal (Vsync) and the horizontal synchronization signal (Hsync) provided to the driver DI may vary according to the changed first frequency. The processor AP may provide the vertical synchronization signal (Vsync) and the horizontal synchronization signal (Hsync) as the first frequency information to the touch IC TIC according to the first frequency corresponding to the changed display mode. When the first frequency changes, the touch IC TIC may receive information about the changed first frequency from the processor AP.

[0143] In an embodiment, the processor AP may transmit information about the first frequency to the driver DI to drive and control the display panel 11, and also transmit information about the first frequency to the touch IC TIC. The processor AP may determine the change of the first frequency in real time, and transmit information about the changed first frequency to the driver DI and the touch IC TIC in real time when the first frequency changes.

[0144] In another embodiment, the touch IC TIC may be directly connected to the display panel 11 through an external pin. Since the touch IC TIC is directly connected to the display panel 11 through the pin, the touch IC TIC may directly monitor the change of the information about the first frequency at which the display panel 11 is driven by the driver DI without passing through the processor AP, and may determine the change of the first frequency in real time based on the display mode.

[0145] In the present disclosure, the touch IC TIC drives the electrode ( Figure 1A The driving electrode TEa) applies a driving signal ( Figure 1A The frequency at which the sensing electrode REa on the touch panel TP receives the sensing signal Rx) can be referred to as the second frequency. In an embodiment, the sensing frequency (the sensing frequency is the frequency at which the sensing electrode REa on the touch panel TP receives the sensing signal Rx) can be equal to the driving frequency (the driving frequency is the frequency at which the touch IC TIC applies the driving signal Tx to the driving electrode TEa to drive the touch panel TP).

[0146] Operation S320 may refer to an operation in which the touch IC TIC determines whether the first frequency matches the second frequency.

[0147] When the touch IC TIC receives information about the first frequency (the first frequency is the driving frequency of the display panel 11) from the processor AP while driving the touch panel TP according to the second frequency, the touch IC TIC can determine whether the first frequency matches the second frequency by comparing the first frequency and the second frequency. When the first frequency matches the second frequency, since the second frequency (the second frequency is the driving frequency of the touch panel TP) becomes a harmonic (high frequency), noise may appear in the user touch signal. In the present disclosure, the noise generated by the matching of the first frequency with the second frequency can be referred to as harmonic noise. For example, in the case where the first frequency (the first frequency is the driving frequency of the display panel 11) is 260kHz and the second frequency (the second frequency is the driving frequency of the touch panel TP) is 240kHz, since harmonic noise does not occur, the user touch operation can be performed normally. However, in the case where the first frequency is 240kHz and the second frequency is 240kHz, since the second frequency becomes a harmonic, harmonic noise may appear during the user touch operation.

[0148] Operation S330 may refer to an operation in which, when the first frequency matches the second frequency in operation S320, the touch IC TIC changes the second frequency to a third frequency different from the first frequency.

[0149] When harmonic noise occurs during a user touch operation when the first frequency matches the second frequency, the touch IC TIC may change the second frequency to a third frequency different from the first frequency. In an embodiment, when the first and second frequencies received by the touch IC TIC are 250 kHz, the touch IC TIC may change the second frequency to another frequency other than 240 kHz within a noise-free range.

[0150] Figure 4 is a diagram showing a method according to an embodiment of the present invention. Figure 3 A block diagram of the flow chart.

[0151] Reference Figure 4 , in an embodiment, the processor AP may be electrically connected to the touch IC TIC provided on the printed board FCB through an external pin, and may be electrically connected to the driver DI through a MIPI transmission line.

[0152] In operation S401, the processor AP may transmit the first frequency information determined based on the display mode to the driver DI and the touch IC TIC. As described above, the switching of the display mode may comprehensively refer to a situation in which the driving frequency of the display panel 11 is changed. In an embodiment, the processor AP may recognize the switching of the display mode in real time, change the first frequency when the display mode is switched, and transmit the first frequency information to the driver DI and the touch IC TIC in real time according to the changed first frequency. The driver DI and the touch IC TIC may determine the first frequency by analyzing the first frequency information. In an embodiment, the analysis of the first frequency information may refer to determining the period or frequency of the vertical synchronization signal (Vsync) or the horizontal synchronization signal (Hsync).

[0153] When the touch IC TIC receives the first frequency information, the touch IC TIC may compare the first frequency with the second frequency (the second frequency is the driving frequency of the touch panel TP) to determine whether the first frequency matches the second frequency. When the first frequency matches the second frequency, the touch IC TIC may change the second frequency to a third frequency different from the first frequency in operation S402, and the touch IC TIC may drive the touch panel TP with the changed third frequency in operation S403.

[0154] When the first frequency matches the second frequency, harmonic noise may generally appear in the user touch signal during the user touch operation, but even when the first frequency matches the second frequency, harmonic noise may not appear during the touch sensing operation. According to an embodiment, even if harmonic noise does not appear during the user touch operation, when the first frequency matches the second frequency, the touch IC TIC may change the second frequency to a third frequency different from the first frequency.

[0155] In another embodiment, when harmonic noise occurs during a user touch operation, even when the first frequency does not match the second frequency, the second frequency may be changed to a frequency different from the first frequency within a noise-free range. When the jitter value at a specific frequency is greater than a predetermined value, the touch IC TIC may determine that harmonic noise has occurred. Since the signal has a higher jitter value, the signal waveform of the digital pulse is disturbed on the time axis, and thus the signal with a higher jitter value may represent an unstable signal.

[0156] Figure 5 is a block diagram illustrating a process of changing a second frequency to a third frequency when the display panel 11 according to the embodiment is directly connected to the touch IC TIC according to the embodiment.

[0157] Reference Figure 5, also referring to FIG. 1 , in an embodiment, the touch IC TIC may be directly connected to the display panel 11 through a pin. In this case, as described above, in operation S501, the touch IC TIC may directly monitor information about the first frequency (the first frequency is the driving frequency of the display panel 11) without passing through the processor AP, and may determine the first frequency by analyzing the information about the first frequency by itself within a certain period of time. That is, the touch IC TIC may directly monitor changes in the first frequency by being directly connected to the display panel 11, and the control unit ( Figure 1A The control unit 12d) of the touch IC TIC can determine the value of the first frequency by analyzing the information about the first frequency. The touch IC TIC can determine whether the first frequency matches the second frequency, which is the driving frequency of the touch panel TP. When the first frequency matches the second frequency, the touch IC TIC can change the second frequency to a third frequency different from the first frequency in operation S502. The touch IC TIC can drive the touch panel TP with the changed third frequency in operation S503. That is, the touch IC TIC can apply the driving signal Tx according to the third frequency to the driving electrode on the touch panel TP through a plurality of driving signal lines TL, thereby driving the touch panel TP.

[0158] Figure 6 is a flowchart illustrating an operation of changing a second frequency to a third frequency when harmonic noise occurs according to an embodiment. Figure 7 is a diagram for explaining changing the second frequency by a frequency hopping method according to an embodiment.

[0159] Reference Figure 6 , also refer to Figure 3 In an embodiment, operation S330 in which the touch IC TIC determines whether the first frequency matches the second frequency may include operation S610 of determining whether harmonic noise occurs in the user touch signal.

[0160] When harmonic noise appears in the user touch signal, the touch IC TIC may change the second frequency to a third frequency different from the first frequency. In this case, in operation S620, the touch IC TIC may change the second frequency to a third frequency different from the first frequency by jumping to a predetermined frequency band stored in the memory (i.e., by changing the second frequency to any one of the frequency hopping included in the predetermined frequency band). The third frequency may be any frequency included in the noise-free range. The noise-free range may refer to a range in which no noise occurs during the user touch operation. In an embodiment, the noise-free range may be from about 233kHz to about 264kHz. By jumping to a predetermined frequency band stored in the memory ( Figure 1A The method of changing the second frequency to the third frequency can be achieved by changing the frequency stored in the memory (12c) of the touch IC TIC Figure 1A For example, referring to Figure 7 , when the first frequency and the second frequency received by the touch IC TIC are 240kHz (710), the touch IC TIC can jump to any one of 233kHz, 235kHz and 261kHz (720) as the frequency in the memory ( Figure 1A The second frequency is changed to a third frequency by using a frequency (700) within the noise-free range stored in the memory 12c). The frequencies of 233 kHz, 235 kHz, and 261 kHz may be referred to as predetermined hopping frequencies, and the selected frequency among them may be referred to as hopping frequencies.

[0161] Even when harmonic noise does not occur in the user touch signal, the touch IC TIC may continuously monitor whether harmonic noise occurs. As described above, when the jitter value at a specific frequency is greater than a predetermined value, the touch IC TIC may determine that harmonic noise has occurred.

[0162] Figure 8 is a flowchart illustrating an operation of changing a second frequency to a third frequency when harmonic noise occurs according to an embodiment. Fig. 9 is a diagram for explaining changing the second frequency by a dithering method according to an embodiment.

[0163] Reference Figure 8 In an embodiment, operation S330 in which the touch IC TIC determines whether the first frequency matches the second frequency may include operation S810 of determining whether harmonic noise occurs in the user touch signal.

[0164] When harmonic noise appears in the user touch signal, the touch IC TIC may change the second frequency to a third frequency different from the first frequency. In this case, in operation S820, the touch IC TIC may change the second frequency to the third frequency by jittering the second frequency to a predetermined frequency band. In this case, jittering may be a technique for removing noise generated by intentionally adding noise to a signal.

[0165] By changing the frequency in the jitter method, harmonic noise can be eliminated by intentionally adding jitter noise to the user touch signal. The third frequency can be any one of the frequencies included in the noise-free range, and the noise-free range can be from about 233kHz to about 264kHz. The method of changing the second frequency to a third frequency different from the first frequency by adding jitter noise to the user touch signal can be achieved by changing the memory ( Figure 1AIn this case, since there is no need to change the analog parameters stored in the touch IC TIC, the second frequency can be changed to a third frequency different from the first frequency with minimal operations. By changing the frequency of the dithering method, the second frequency can be changed to a third frequency different from the first frequency within the noise-free range (as a frequency close to the second frequency).

[0166] Reference Fig. 9 , also refer to Figure 2 , a diagram 900 shows a jitter value according to a first frequency (kHz) received by the touch IC TIC from the processor AP. Fig. 9 In the embodiment of the present invention, when the signal has a high jitter value, the signal waveform of the digital pulse is disturbed on the time axis, and thus the signal with a high jitter value may represent an unstable signal. For example, in the case where the second frequency received by the touch IC TIC is 240kHz, when the first frequency determined based on the mode of the display panel is 240kHz (910) (which is equal to the second frequency), harmonic noise may occur, and the touch IC TIC may change the first frequency in the memory ( Figure 1A The digital bits embedded in the memory 12c) change the second frequency to a third frequency close to 240kHz within the noise-free range.

[0167] The operations of the methods or algorithms described in connection with the embodiments may be implemented directly as hardware, software modules executed by hardware, or a combination thereof. The software modules may reside in random access memory (RAM), read-only memory (ROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, hard disk, removable disk, compact disk (CD)-ROM, or any type of computer-readable recording medium known in the art to which the present disclosure belongs.

[0168] According to an embodiment, a method of controlling a display device to prevent noise generated by a user's touch is provided.

[0169] According to the embodiments, the limitation of a structure in which physical interference may not be avoided may be overcome, and noise generated by a user's touch may be avoided by a method of controlling a display device.

[0170] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects that are not mentioned will be clearly understood from the following description by those having ordinary skill in the art.

[0171] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects within each embodiment should generally be considered as other similar features or aspects that can be used in other embodiments. Although the embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes can be made in form and detail without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, wherein: The display device comprises: Touch panel; display panel; and A touch integrated circuit is configured to determine whether a first frequency as a driving frequency of the display panel matches a second frequency as a driving frequency of the touch panel, and when the first frequency matches the second frequency, the touch integrated circuit changes the second frequency to a third frequency different from the first frequency.

2. The display device according to claim 1, wherein: The first frequency is determined based on a display mode of the display panel.

3. The display device according to claim 2, wherein: The display device further includes a processor connected to the display panel, and the processor is configured to identify a change in the information about the first frequency, The touch integrated circuit receives the information about the first frequency from the processor.

4. The display device according to claim 2, wherein: The display panel is directly connected to the touch integrated circuit through an external pin, and the touch integrated circuit is further configured to monitor a change in information about the first frequency.

5. The display device according to claim 3, wherein: The touch integrated circuit is further configured to determine whether the user touch signal includes harmonic noise based on whether the first frequency matches the second frequency.

6. The display device according to claim 5, wherein: When it is determined that the user touch signal includes the harmonic noise, The touch integrated circuit changes the second frequency to the third frequency by changing the second frequency to a hopping frequency selected from a plurality of predetermined hopping frequencies.

7. The display device according to claim 6, wherein: The touch integrated circuit changes the second frequency to the third frequency by changing an analog parameter stored in the touch integrated circuit.

8. The display device according to claim 5, wherein: When it is determined that the user touch signal includes the harmonic noise, the touch integrated circuit changes the second frequency to the third frequency by dithering the second frequency to a predetermined frequency band.

9. The display device according to claim 8, wherein: The touch integrated circuit changes the second frequency to the third frequency by changing digital bits stored in the touch integrated circuit.

10. The display device according to claim 8, wherein: The predetermined frequency band is within the range of 233 kHz to 264 kHz, inclusive.

11. The display device according to claim 3, wherein: The touch integrated circuit and the processor are arranged on a printed board. The touch panel and the touch integrated circuit are connected to each other through a plurality of sensing signal lines and a plurality of driving signal lines. The display panel and the processor are connected to each other via a mobile industrial processor interface transmission line, and The plurality of sensing signal lines and the plurality of driving signal lines at least partially cross the mobile industry processor interface transmission lines.

12. A method for controlling a display device, the display device comprising a display panel and a touch panel, wherein: The method comprises: receiving information about a first frequency through a touch integrated circuit connected to the touch panel, the first frequency being a driving frequency of the display panel; determining, by the touch integrated circuit, whether the first frequency matches a second frequency, where the second frequency is a driving frequency of the touch panel; and When the first frequency matches the second frequency, the second frequency is changed to a third frequency different from the first frequency by the touch integrated circuit.

13. The method according to claim 12, wherein: The receiving the information about the first frequency comprises: The information about the first frequency is received from a processor through the touch integrated circuit, and the processor is configured to identify a change in the information about the first frequency, the first frequency being determined based on a mode of the display panel.

14. The method according to claim 12, wherein: The method further includes monitoring, by the touch integrated circuit directly connected to the display panel through an external pin, a change in the information about the first frequency.

15. The method according to claim 13, wherein: The determining whether the first frequency matches the second frequency includes determining whether the user touch signal includes harmonic noise based on whether the first frequency matches the second frequency.

16. The method according to claim 15, wherein: The changing the second frequency to the third frequency includes, when the user touch signal includes the harmonic noise, changing the second frequency to the third frequency by changing the second frequency to a hopping frequency selected from a plurality of predetermined hopping frequencies.

17. The method according to claim 16, wherein: The changing the second frequency to the third frequency includes: changing the second frequency to the third frequency by changing an analog parameter stored in the touch integrated circuit.

18. The method according to claim 15, wherein: The changing the second frequency to the third frequency includes: when the user touch signal includes the harmonic noise, changing the second frequency to the third frequency by dithering the second frequency to a predetermined frequency band.

19. The method according to claim 18, wherein: The changing the second frequency to the third frequency includes: changing the second frequency to the third frequency by changing digital bits stored in the touch integrated circuit.

20. The method according to claim 12, wherein: The receiving the information about the first frequency includes: switching a first display mode of the display panel to a second display mode based on a user touch; and The information about the first frequency is received through the touch integrated circuit, and the first frequency is determined based on the second display mode of the display panel.

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