Ion implanter with cleaning function and cleaning method thereof

Abstract

The invention discloses an ion implanter with a cleaning function and a cleaning method thereof, and relates to the technical field of ion implantation device.The structure of an ion implanter in the prior art is optimized and improved, and a cleaning assembly is additionally arranged; the cleaning assembly is used for efficiently and conveniently removing and cleaning impurities adhered to the ion implanter by using air pressure and self deformation; the technical effect that the ion implanter can efficiently and conveniently replace manual work to complete self-cleaning is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of ion implantation equipment, and in particular to an ion implantation machine with a cleaning function and a cleaning method thereof. Background Art

[0002] The ion implanter is a type of high-voltage small accelerator with the largest number of applications. It obtains the required ions from an ion source, accelerates the ion beam, and is used for ion implantation of semiconductor materials, large-scale integrated circuits and devices. The ion beam generated by the ion implanter is injected into the wafer.

[0003] In order to solve the technical problems in the prior art that the process of positioning the wafer when the ion implantation equipment performs ion implantation on the wafer is relatively cumbersome, the positioning process is likely to squeeze and damage the wafer, and the process of removing the processed wafer is likely to cause damage and dirt to the wafer, the Chinese invention patent with patent number CN202311811471.6 discloses an ion implantation equipment for semiconductor processing, which optimizes and improves the structure of the ion implantation carrier plate of the prior art, utilizes a floating rod-shaped block with an isolation cushion to contact the side of the wafer, and fixes it by extrusion; and assists the transfer of the wafer by controlling the up and down movement of the floating rod-shaped block.

[0004] This type of ion implanter with a carrier, target plate and clamping structure generally requires regular manual cleaning of the carrier, target plate and clamping structure in order to reduce cross contamination, maintain process stability and ensure chip performance and reliability, so as to maintain the high standards of the entire semiconductor manufacturing process. The manual cleaning process is cumbersome, time-consuming and requires downtime for cleaning, which is not conducive to the efficient progress of the process.

[0005] Therefore, there is a need for an ion implanter with a cleaning function to efficiently and conveniently realize automatic cleaning of the ion implanter, thereby ensuring high standards and low labor intensity in the wafer processing process. Summary of the invention

[0006] The embodiments of the present application provide an ion implanter with a cleaning function, thereby solving the technical problems in the prior art that ion implanters cannot efficiently and conveniently perform automatic self-cleaning, and manual cleaning is labor-intensive, cumbersome and inefficient. The technical effect that the ion implanter can efficiently and conveniently replace manual self-cleaning is achieved.

[0007] The embodiment of the present application provides an ion implanter with a cleaning function, comprising a carrier, a cleaning component and an air pump device connected to an air storage space;

[0008] The cleaning assembly comprises a displacement guide rail positioned on the ground, a support stand which is longitudinally arranged and slides along the displacement guide rail and is a telescopic rod structure, a support cross plate and a cleaning belt assembly;

[0009] The supporting horizontal plate is a hard rectangular plate arranged horizontally, fixed on the side wall of the supporting vertical frame, and a U-shaped annular frame is positioned at the bottom;

[0010] The cleaning belt assembly is in the shape of a reel as a whole, and includes two top reels parallel to each other and a cleaning belt; the top reel is arranged horizontally and is rotatably connected to the supporting horizontal plate; the cleaning belt is a belt-shaped elastic rubber film, one side of which is coated with self-adhesive tape, and the two ends are respectively wound and positioned on the two top reels, and the non-adhesive surface is close to the bottom surface of the annular frame; the annular frame, the supporting horizontal plate and the cleaning belt together enclose a closed rectangular block-shaped air storage space.

[0011] Preferably, the supporting horizontal plate is not in direct contact with the supporting vertical frame;

[0012] A rotating cylinder is positioned on the top of the supporting horizontal plate;

[0013] The rotating column is a horizontally arranged hard column, one end of which is connected to the supporting frame and rotates around its own axis, and rotates under the drive of the motor;

[0014] When cleaning is required, the rotating cylinder is controlled to rotate to realize the rotation or even flipping of the supporting horizontal plate.

[0015] Preferably, the cleaning assembly further comprises a shift frame and a frame shift assembly;

[0016] The shift frame is a U-shaped hard frame, the top surface contour shape and size are the same as the bottom contour shape and size of the annular frame, located directly below the annular frame, and the height is less than 3 cm;

[0017] The frame shifting assembly is used to drive the shifting frame to approach and move away from the annular frame, and is an electric telescopic rod structure, with a plurality of rods, a position near one end of which is fixed on the side wall of the supporting horizontal plate, and a position near the other end of which is fixed on the side wall of the shifting frame;

[0018] Before cleaning is needed, the shift frame is controlled to move to clamp the cleaning tape close to the annular frame.

[0019] Furthermore, there are multiple carriers; a tray that can rotate around its own axis is positioned on the ground, and the multiple carriers are evenly distributed on the tray.

[0020] Further, it includes a stage and a shift assembly;

[0021] The upper surface of the carrier is provided with three sliding blocks arranged radially and sliding;

[0022] The platform is provided with three storage slots, and the storage slots correspond to the sliding blocks one by one;

[0023] Each storage tank is provided with a floating rod; the floating rod is arranged longitudinally, slidably positioned on the sliding block, and slides along the vertical direction;

[0024] A supporting telescopic body is provided at the bottom of the floating rod. The supporting telescopic body is a telescopic rod structure, which is arranged longitudinally. A wheel body is provided at the bottom, and the top is fixed to the bottom of the floating rod. When clamping the wafer, the sliding block slides to drive the floating rod to move closer and clamp the wafer.

[0025] The floating rod is a quadrangular hollow rod body, with a belt-shaped buffer pad, a built-in reel and a limit rod, and a rectangular front groove is provided on the surface away from the sliding block;

[0026] A front baffle plate which is longitudinally arranged and in the shape of a rectangular plate is fixed on the front groove, and two sides of the front baffle plate are fixed on the side walls of the front groove;

[0027] The limit rod is a hard round rod arranged transversely, the end of which is fixed on the inner wall of the floating rod, and is arranged near the bottom of the front groove and below the front groove;

[0028] The buffer pad passes through the inner wall between the limiting rod and the floating rod, the bottom of the front baffle, the top of the front baffle in sequence, and is finally wound on the built-in reel.

[0029] Furthermore, the main body of the displacement component is a clamping claw or a vacuum suction cup.

[0030] Preferably, when performing different times of clamping and positioning, the length of the supporting telescopic body is flexibly adjusted to improve the utilization rate of the buffer pad.

[0031] Preferably, the cleaning assembly can clean and maintain the carrying tray, the fixed clamping sheet and the clamping soft block.

[0032] Preferably, it also includes an air guide block;

[0033] The air guide block is a columnar block, arranged longitudinally, with the top fixed to the bottom of the supporting horizontal plate and surrounded by an annular frame;

[0034] The bottom surface of the air guide block is provided with an annular air suction groove, which is connected to the air pump device;

[0035] A ring-shaped heating body is provided near the center of the bottom surface of the air guide block. The ring-shaped heating body is an electric heating wire, which plays a role of melting through the cleaning belt after heating;

[0036] The bottom surface of the air guide block is provided with an air outlet groove and an air intake groove, both of which are connected with the air pump device and are surrounded by the ring-shaped heating body.

[0037] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0038] By optimizing and improving the structure of the ion implanter in the prior art, a cleaning component is added; the cleaning component uses air pressure and its own deformation to efficiently and conveniently remove the debris stuck on the ion implanter; the technical problems that the ion implanter in the prior art cannot automatically clean itself efficiently and conveniently, and the manual cleaning is labor-intensive, cumbersome and inefficient are effectively solved, thereby achieving the technical effect that the ion implanter can efficiently and conveniently replace manual self-cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram of the structure of a cleaning component of an ion implanter with a cleaning function;

[0040] Figure 2 This is a schematic diagram of the overall structure of an ion implanter with a cleaning function;

[0041] Figure 3 It is a schematic diagram of the positional relationship of the various components of the cleaning assembly;

[0042] Figure 4 is a schematic diagram of the structure of the cleaning component;

[0043] Figure 5 A schematic diagram of the positional relationship between the shift frame of the cleaning component and the cleaning belt;

[0044] Figure 6 Schematic diagram of the internal structure of the floating rod;

[0045] Figure 7 It is a schematic diagram of the connection relationship between the air pump assembly and various components;

[0046] Figure 8 It is a schematic diagram of the position relationship between the air guide block and the supporting horizontal plate;

[0047] Fig. 9 It is a simplified structural diagram of the gas guide block;

[0048] Fig.10 is a schematic diagram of the deformation state of the cleaning belt;

[0049] Fig.11 This is a simplified diagram of the structure of the cleaning belt after deformation.

[0050] In the figure:

[0051] The carrier 120, the sliding block 130, the floating rod 140, the buffer pad 141, the built-in reel 142, the front groove 144, the limit rod 145, the front baffle 146, the storage groove 150, the supporting telescopic body 160, the tray 200, the shifting assembly 300, the air pump device 370, the shifting guide rail 410, the supporting stand 420, the supporting cross plate 430, the annular frame 431, the rotating cylinder 440, the cleaning belt assembly 450, the top reel 451, the cleaning belt 452, the shifting frame 460, the frame shifting assembly 470, the air guide block 480, the annular air suction groove 481, the ring-shaped heating body 482, the air outlet groove 483, and the air suction groove 484. DETAILED DESCRIPTION

[0052] To facilitate the understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0053] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation method.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0055] Embodiment 1

[0056] like Figures 1 to 5 As shown, the ion implanter with cleaning function of the present application includes a carrier 120 , a cleaning component and an air pump device 370 .

[0057] The carrier 120 is used to carry and clamp the wafer that needs to be ion implanted. A clamping mechanism is provided on the top surface of the carrier 120. This is a prior art and will not be described in detail here.

[0058] The cleaning assembly is used to clean the stage 120 and other components by sticking and removing, and includes a shift guide rail 410 positioned on the ground for guiding, a support stand 420 arranged longitudinally and sliding along the shift guide rail 410, a support horizontal plate 430 and a cleaning belt assembly 450;

[0059] The shift guide rail 410 is arranged on the ground, and its existence enables the support stand 420 to be close to and away from the part to be cleaned;

[0060] The support stand 420 is an electric telescopic rod structure, used to carry and position the support horizontal plate 430;

[0061] The support horizontal plate 430 is a hard rectangular plate arranged transversely, and is used to carry and position the cleaning belt assembly 450, wherein one side wall is positioned on the side wall of the support stand 420 near the top;

[0062] The bottom of the supporting horizontal plate 430 is provided with an annular frame 431; the annular frame 431 is a square-shaped frame, which is arranged horizontally, and the top surface is fixed to the bottom of the supporting horizontal plate 430, and the bottom surface edge is smooth; the annular frame 431 positioned on the supporting horizontal plate 430 and the supporting horizontal plate 430 together form a rectangular block space with an opening at the bottom;

[0063] The diameter of the inscribed circle of the annular frame 431 is larger than the diameter of the wafer to be processed;

[0064] The cleaning belt assembly 450 is in the shape of a reel as a whole, and includes two overhead reels 451 and a cleaning belt 452; the overhead reel 451 is a roller with a built-in motor, which is arranged horizontally and axially perpendicular to the length direction of the support stand 420, and is rotatably connected to the support cross plate 430 and is located on the top of the support cross plate 430; the two overhead reels 451 are parallel to each other and are respectively used to retract and release the cleaning belt 452; the cleaning belt 452 is a belt-shaped elastic rubber film, which is always in a stretched state, one side is coated with self-adhesive, and the two ends are respectively wound and positioned on the two overhead reels 451, and the non-adhesive surface is close to the bottom surface of the annular frame 431; the annular frame 431, the support cross plate 430 and the cleaning belt 452 together enclose a closed rectangular block space, and for the convenience of description, this space is defined as an air storage space.

[0065] The air pump device 370 is a combination of an air pump, an air valve and an air pipe, which is connected to the air storage space and can control the amount of gas in the air storage space through its own operation and thus control the expansion and contraction deformation of the cleaning belt 452.

[0066] When the ion implanter with cleaning function in the embodiment of the present application needs to be cleaned:

[0067] After the shifting assembly 300 (grips, etc.) has clamped the wafer on the carrier 120, the supporting stand 420 is controlled to shift so that it is close to the carrier 120, and the supporting cross plate 430 is moved to directly above the carrier 120; thereafter, the air pump device 370 is controlled to operate, thereby increasing the amount of gas in the gas storage space and causing the cleaning belt 452 to deform and fit tightly against the carrier 120 and the components thereon, and then the cleaning belt 452 is controlled to contract for sticky cleaning; after performing the sticky cleaning action multiple times, the components are reset (in order to clean more thoroughly, the top reel 451 can also be controlled to rotate before resetting to replace the cleaning belt 452 that is close to the annular frame 431, and then another sticky cleaning is performed).

[0068] Preferably, the supporting transverse plate 430 is not in direct contact with the supporting stand 420; a rotating cylinder 440 is positioned on the top of the supporting transverse plate 430; the rotating cylinder 440 is a horizontally arranged hard cylinder, one end of which is connected to the supporting stand 420 and rotates around its own axis, and rotates under the drive of a motor; when cleaning is required, the rotating cylinder 440 can be controlled to rotate to realize the rotation or even flipping of the supporting transverse plate 430, and then the clamps and vacuum suction cups used for moving wafers can be cleaned by removing sticky substances.

[0069] In order to further expand the amount that the cleaning belt 452 that constitutes the air storage space can expand, and further expand the cleaning range and cleaning effect; preferably, the cleaning component also includes a shift frame 460 and a frame shift component 470; the shift frame 460 is a U-shaped hard frame, and the top surface contour shape and size are the same as the bottom contour shape and size of the annular frame 431, located directly below the annular frame 431, and the height is less than 3 cm; the frame shift component 470 is used to drive the shift frame 460 to approach and move away from the annular frame 431, and is an electric telescopic rod structure, with a plurality of them, the position near one end is fixed on the side wall of the supporting cross plate 430, and the position near the other end is fixed on the side wall of the shift frame 460; before cleaning is needed, the shift frame 460 is controlled to move to clamp the cleaning belt 452 close to the annular frame 431; when the cleaning belt 452 needs to be moved, the shift frame 460 is first controlled to move to loosen the cleaning belt 452 close to the annular frame 431.

[0070] Furthermore, three sliding blocks 130 are slidably positioned on the top of the platform 120 , and a buffer pad 141 made of silicone material is provided on the surface of the sliding block 130 close to the center of the platform 120 .

[0071] Furthermore, there are multiple carriers 120 ; a tray 200 that can rotate around its own axis is positioned on the ground, and multiple carriers 120 are evenly distributed on the tray 200 .

[0072] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:

[0073] The invention solves the technical problems in the prior art that the ion implanter cannot efficiently and conveniently perform automatic self-cleaning, and the manual cleaning is labor-intensive, cumbersome and inefficient, and achieves the technical effect that the ion implanter can efficiently and conveniently replace manual self-cleaning.

[0074] Embodiment 2

[0075] The cushion pad 141 is prone to extrusion deformation and aging under the influence of temperature after repeated use and needs to be replaced; in order to further improve the practicality of the present application, increase its functions so that it has the function of automatically replacing the cushion pad 141 instead of manual work, the embodiment of the present application is further expanded and optimized on the basis of the above embodiment, specifically:

[0076] like Figure 2 and Figure 6 As shown, the ion implanter of the present application includes a carrier 120, a tray 200 and a shift assembly 300;

[0077] The carrier 120 is cylindrical and positioned on the top of the tray 200, and there are multiple carriers 120;

[0078] The upper surface of the carrier 120 is provided with three radially arranged and sliding sliding blocks 130;

[0079] The carrier 120 is provided with three storage slots 150 , which correspond to the sliding blocks 130 one by one and are arranged close to the sliding blocks 130 ;

[0080] Each storage tank 150 is provided with a floating rod 140; the floating rod 140 is longitudinally arranged, slidably positioned on the sliding block 130, and slides along the vertical direction;

[0081] The bottom of the floating rod 140 is provided with a supporting telescopic body 160, which is an electric telescopic rod structure, arranged longitudinally, with a wheel body at the bottom and the top fixed to the bottom of the floating rod 140; when clamping the wafer, the sliding block 130 slides to drive the floating rod 140 to move closer and clamp the wafer;

[0082] The floating rod 140 is a quadrangular hollow rod body, with a belt-shaped buffer pad 141, a built-in reel 142 and a limit rod 145 built in, and a rectangular front groove 144 is provided on the surface away from the sliding block 130;

[0083] A front baffle plate 146 which is longitudinally arranged and in the shape of a rectangular plate is fixed to the front groove 144, and two sides of the front baffle plate 146 are fixed to the side walls of the front groove 144;

[0084] The limit rod 145 is a hard round rod arranged transversely, with its end fixed on the inner wall of the floating rod 140, arranged near the bottom of the front groove 144 and below the front groove 144; the distance between the limit rod 145 and the inner wall of the floating rod 140 is 0.8 to 1 times the normal thickness of the buffer pad 141;

[0085] The buffer pad 141 passes through the space between the limit rod 145 and the inner wall of the floating rod 140, the bottom of the front baffle 146, the top of the front baffle 146, and finally winds around the built-in reel 142; due to the existence of the limit rod 145, the buffer pad 141 remains stationary under the action of friction;

[0086] The main body of the displacement component 300 is a clamping claw or a vacuum suction cup, which is used for transfer and is a prior art.

[0087] After the buffer pad 141 has been used for a certain period of time, the sliding block 130 can be controlled to slide and squeeze the floating rod 140 so that it squeezes the inner wall of the storage groove 150 to fix the floating rod 140; thereafter, the cleaning component can be controlled to operate so that the cleaning belt 452 is deformed and adheres to the lower half of the buffer pad 141 that is close to the front baffle 146; then the cleaning component is controlled to move upward as a whole, causing the buffer pad 141 to shift and then replace the buffer pad 141 that is close to the front baffle 146.

[0088] When performing different times of clamping and positioning, the length of the supporting telescopic body 160 can be flexibly adjusted to thereby improve the utilization rate of the buffer pad 141 .

[0089] Preferably, the structure of the shifting assembly 300 of the present application is the same as the structure of the wafer transfer assembly disclosed in the Chinese invention patent with patent number CN202311811471.6; the cleaning assembly of the present application can also clean and maintain the carrying tray, the fixed clamping sheet and the clamping soft block.

[0090] Embodiment 3

[0091] In order to further improve the cleaning effect and the cleaning ability of dust and debris in corners and gaps, the embodiment of the present application adds an air guide block 480 on the basis of the above embodiment, and uses the impact airflow to lift the dust and debris in the gaps at the top surface of the carrier 120 and other positions and collect them before they spread; specifically:

[0092] like Figures 7 to 11 As shown, the air guide block 480 is a columnar block, arranged longitudinally, with the top fixed to the bottom of the supporting horizontal plate 430 and surrounded by the annular frame 431; the top area of ​​the air guide block 480 is approximately one sixth of the bottom area of ​​the supporting horizontal plate 430;

[0093] The bottom surface of the air guide block 480 is a plane, and an annular air suction groove 481 is provided on the bottom surface. The annular air suction groove 481 is annular and communicates with the air pump device 370, and acts as a gas channel.

[0094] A ring-shaped heating body 482 is provided near the center of the bottom surface of the air guide block 480. The ring-shaped heating body 482 is in a ring shape (C shape) and is an electric heating wire. After heating, it plays a role of melting through the cleaning belt 452. An air outlet groove 483 and an air suction groove 484 are provided on the bottom surface of the air guide block 480. Both of them are connected to the air pump device 370 and are surrounded by the ring-shaped heating body 482.

[0095] After the cleaning target is cleaned by the sticky removal method in the above embodiment, the air pump device 370 is controlled to operate, under the premise that the cleaning belt 452 is clamped by the shift frame 460, so that the annular air suction groove 481 adsorbs the cleaning belt 452, and then pumps air into the air storage space to make the cleaning belt 452 swell; the supporting cross plate 430 is controlled to move downward so that the cleaning belt 452 contacts the part to be cleaned; then the ring-shaped heating body 482 is controlled to heat and melt a notch on the cleaning belt 452, and then the air outlet groove 483 and the air suction groove 484 are controlled to intake air and exhaust air respectively, so as to form an airflow in the space below the cleaning belt 452, and the dust and debris in the gap are lifted up, and most of the lifted debris is stuck to the cleaning belt 452; finally, the components are reset to complete the cleaning.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An ion implanter with a cleaning function, comprising a carrier (120), characterized in that: Also included is a cleaning component and an air pump device (370) in communication with the air storage space; The cleaning assembly comprises a displacement guide rail (410) positioned on the ground, a support stand (420) which is arranged longitudinally and slides along the displacement guide rail (410) and is a telescopic rod structure, a support cross plate (430) and a cleaning belt assembly (450); The supporting horizontal plate (430) is a hard rectangular plate arranged transversely, fixed on the side wall of the supporting vertical frame (420), and a U-shaped annular frame (431) is positioned at the bottom; The cleaning belt assembly (450) is in the shape of a reel as a whole, and comprises two top reels (451) parallel to each other and a cleaning belt (452); the top reel (451) is arranged horizontally and is rotatably connected to the supporting transverse plate (430); the cleaning belt (452) is a belt-shaped elastic rubber film, one side of which is coated with adhesive, and the two ends are respectively wound and positioned on the two top reels (451), and the non-adhesive surface is closely attached to the bottom surface of the annular frame (431); the annular frame (431), the supporting transverse plate (430) and the cleaning belt (452) together enclose a closed rectangular block-shaped air storage space.

2. The ion implanter with cleaning function as claimed in claim 1, characterized in that: The supporting horizontal plate (430) does not directly contact the supporting vertical frame (420); A rotating cylinder (440) is positioned on the top of the supporting horizontal plate (430); The rotating column (440) is a hard column arranged transversely, one end of which is connected to the supporting frame (420) and rotates around its own axis, and rotates under the drive of the motor; When cleaning is required, the rotating cylinder (440) is controlled to rotate to realize the rotation or even flipping of the supporting horizontal plate (430).

3. The ion implanter with cleaning function as claimed in claim 1 or 2, characterized in that: The cleaning assembly further comprises a shift frame (460) and a frame shift assembly (470); The shift frame (460) is a U-shaped hard frame, the top surface contour shape and size are the same as the bottom contour shape and size of the annular frame (431), located directly below the annular frame (431), and the height is less than 3 cm; The frame shifting assembly (470) is used to drive the shifting frame (460) to move closer to and away from the annular frame (431), and is an electric telescopic rod structure, with a plurality of rods, a position close to one end of which is fixed to the side wall of the supporting horizontal plate (430), and a position close to the other end of which is fixed to the side wall of the shifting frame (460); Before cleaning is required, the shift frame (460) is controlled to move to clamp the cleaning belt (452) that is close to the annular frame (431).

4. The ion implanter with cleaning function as claimed in claim 1, characterized in that: The number of the carriers (120) is multiple; a tray (200) capable of rotating around its own axis is positioned on the ground, and the multiple carriers (120) are evenly distributed on the tray (200).

5. The ion implanter with cleaning function as claimed in claim 3, characterized in that: It comprises a carrier (120) and a shifting assembly (300); Three sliding blocks (130) arranged radially and sliding are positioned on the upper surface of the carrier (120); The carrier (120) is provided with three storage slots (150), and the storage slots (150) correspond to the sliding blocks (130) one by one; Each storage tank (150) is provided with a floating rod (140); the floating rod (140) is longitudinally arranged, slidably positioned on the sliding block (130), and slides along the vertical direction; A supporting telescopic body (160) is provided at the bottom of the floating rod (140). The supporting telescopic body (160) is a telescopic rod structure, which is arranged longitudinally, has a wheel body at the bottom, and a top fixed to the bottom of the floating rod (140); when clamping a wafer, the sliding block (130) slides to drive the floating rod (140) to move closer to and clamp the wafer; The floating rod (140) is a quadrangular prism-shaped hollow rod body, with a belt-shaped buffer pad (141), a built-in reel (142) and a limit rod (145) built in, and a rectangular front groove (144) is provided on the surface away from the sliding block (130); A front baffle plate (146) which is longitudinally arranged and in the shape of a rectangular plate is fixed on the front groove (144), and two sides of the front baffle plate (146) are fixed on the side walls of the front groove (144); The limiting rod (145) is a hard round rod arranged transversely, the end of which is fixed on the inner wall of the floating rod (140), and is arranged close to the bottom of the front groove (144) and below the front groove (144); The buffer pad (141) sequentially passes through between the limiting rod (145) and the inner wall of the floating rod (140), the bottom of the front baffle (146), the top of the front baffle (146), and is finally wound on the built-in reel (142).

6. The ion implanter with cleaning function as claimed in claim 5, characterized in that: The main body of the displacement component (300) is a clamping claw or a vacuum suction cup.

7. The ion implanter with cleaning function as claimed in claim 5, characterized in that: When performing different times of clamping and positioning, the length of the supporting telescopic body (160) is flexibly adjusted to thereby improve the utilization rate of the buffer pad (141).

8. The ion implanter with cleaning function as claimed in claim 5, characterized in that: The cleaning assembly can clean and maintain the carrying tray, the fixed clamping sheet and the clamping soft block.

9. The ion implanter with cleaning function as claimed in claim 5, characterized in that: Also included is an air guide block (480); The air guide block (480) is a columnar block, arranged longitudinally, with its top fixed to the bottom of the supporting horizontal plate (430) and surrounded by an annular frame (431); The bottom surface of the air guide block (480) is provided with an annular air suction groove (481), and the annular air suction groove (481) is connected to the air pump device (370); A ring-shaped heating body (482) is provided near the center of the bottom surface of the air guide block (480), and the ring-shaped heating body (482) is an electric heating wire, which plays a role of melting through the cleaning belt (452) after heating; The bottom surface of the air guide block (480) is provided with an air outlet groove (483) and an air intake groove (484), both of which are connected to the air pump device (370) and are surrounded by the ring-shaped heating body (482).

10. A method for cleaning an ion implanter, characterized in that: The ion implanter with cleaning function as claimed in claim 1 comprises the following steps: after the wafer on the carrier (120) is removed, the supporting stand (420) is controlled to move closer to the carrier (120), and the supporting horizontal plate (430) is moved to the top of the carrier (120); Thereafter, the air pump device (370) is controlled to operate, the amount of gas in the gas storage space is increased, thereby causing the cleaning belt (452) to deform and adhere closely to the carrier (120) and the components thereon, and then the cleaning belt (452) is controlled to contract to perform adhesive removal cleaning; after multiple adhesive removal actions, the components are reset.

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