Substrate processing apparatus and defect detection method for substrate processing apparatus

Abstract

Disclosed is an apparatus for processing a substrate, the apparatus including: a support unit including a rotating chuck supporting the substrate, a rotating shaft supporting the rotating chuck, and a driver providing a rotating force to the rotating shaft; and a determination unit for determining whether or not a defect exists in the rotating shaft, where the determination unit determines whether or not a defect exists in the rotating shaft based on a current value applied to the driver in a case where the rotating shaft rotates.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0110651 filed in the Korean Intellectual Property Office on August 23, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The invention relates to a substrate processing device and a defect detection method for the substrate processing device. Background Art

[0004] In order to manufacture semiconductor devices, various processes such as photography, deposition, ashing, etching and ion implantation are performed. In addition, before and after performing these processes, a cleaning process is performed to clean particles remaining on the substrate.

[0005] The above process may also be performed while rotating the substrate supported on the support unit. For example, in the cleaning process, chemicals, deionized water (DIW) and an organic solvent are supplied to the substrate rotating while supported on the support unit. In addition, in the etching process, a wet etching process supplies an etchant to the substrate rotating while supported on the support unit.

[0006] Therefore, the process is performed with the substrate rotating, and in this case, a supporting unit rotating the substrate includes a rotating shaft connected to a chuck to which the substrate is connected, and the rotating shaft rotates at a high speed to rotate the substrate.

[0007] Therefore, the conventional rotating shaft may wear parts connected to the chuck and generate dust when rotating at a high speed, and the generated dust may affect the processing process of the substrate.

[0008] For this reason, the conventional support unit performs inspection by periodically measuring the vibration of the rotating shaft with the process stopped, which is too time-consuming for the inspection.

[0009] Alternatively, conventional bearing units can predict the presence of defects in a rotating shaft by analyzing the pattern of the amount of current required for rotation, but many variables are considered, making it difficult to predict defects in a rotating shaft. Summary of the invention

[0010] The present invention is directed to providing a substrate processing apparatus and a defect detection method for the substrate processing apparatus which can easily determine whether a rotation axis is defective only by analyzing a pattern of current values.

[0011] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those of ordinary skill in the art.

[0012] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a supporting unit comprising a rotating chuck for supporting the substrate, a rotating shaft for supporting the rotating chuck, and a driver for providing a rotational force to the rotating shaft; and a determining unit for determining whether the rotating shaft has a defect, wherein the determining unit determines whether the rotating shaft has a defect based on a current value applied to the driver when the rotating shaft rotates.

[0013] According to the exemplary embodiment, the determination unit may include an abnormality diagnosis module in which a relationship between the current value and the state of the rotating shaft is preset, and determine whether the rotating shaft has a defect through the abnormality diagnosis module.

[0014] According to an exemplary embodiment, the abnormality diagnosis module may have a correlation amount between the vibration of the rotating shaft and the state of the rotating shaft, and a correlation amount between the current value and the state of the rotating shaft based on the correlation amount between the vibration of the rotating shaft and the current value as data, and determine whether the rotating shaft has a defect based on the current value in the data.

[0015] According to an exemplary embodiment, the data may include a current abnormality pattern formed in the form of a database (DB).

[0016] According to an exemplary embodiment, the support unit may further include a bearing connected to the rotating shaft, and the defect in the rotating shaft may include a defect caused by wear of the bearing.

[0017] According to an exemplary embodiment, the driver may include a motor, and the determination unit may detect a torque value of the motor, convert the torque value into a current value, and determine whether the rotating shaft has a defect.

[0018] According to an exemplary embodiment, the abnormality diagnosis module may detect a time point at which a defect occurs in the rotating shaft through vibration measurement, and identify a change pattern of a current value from the detected time point as an abnormality pattern to determine whether the rotating shaft has a defect.

[0019] According to an exemplary embodiment, the vibration value measured when measuring the vibration may be measured by acceleration with respect to the vibration of the supporting unit.

[0020] According to the exemplary embodiment, the vibration value measured when the vibration is measured may be measured by a displacement amount with respect to the vibration of the supporting unit.

[0021] According to the exemplary embodiment, the vibration value measured when the vibration is measured may be measured by a sound generated by the vibration of the supporting unit.

[0022] According to an exemplary embodiment, the determination unit may include: a vibration detection unit, which is installed on the supporting unit to measure the vibration value of the supporting unit; a current detection unit, which is electrically connected to the supporting unit to detect the current value applied to the motor rotating the supporting unit; and an inspection unit, which receives the vibration value and the current value from the vibration detection unit and the current detection unit as input, determines the rotation error of the supporting unit based on the vibration value, and determines the rotation abnormality of the substrate by applying an abnormality diagnosis model to the current value at the time point when the rotation error of the supporting unit is determined.

[0023] Another exemplary embodiment of the present invention provides a defect detection method for a substrate processing device, which determines whether a rotating shaft has a defect when a supporting unit including a rotating shaft and supporting a substrate processes a substrate while rotating the substrate. The defect detection method includes: generating an abnormality diagnosis module in which a correlation amount between a current value and a state of the rotating shaft is preset; and determining, through the abnormality diagnosis module, whether the rotating shaft has a defect based on a current value applied to a driver that rotates the rotating shaft while the rotating shaft rotates.

[0024] According to an exemplary embodiment, the generation of an abnormal diagnosis module may include: a vibration detection unit installation operation, which installs the vibration detection unit on a supporting unit including a rotating shaft; a rotating shaft rotation operation, which rotates the rotating shaft; a vibration value detection operation, which detects the vibration value of the rotating shaft through the vibration detection unit; an abnormal time detection operation, which receives the vibration value as input by the inspection unit and determines the abnormal time point of the supporting unit based on the vibration value; an abnormal pattern storage operation, which identifies and stores the pattern of the current value of the rotational force provided to the supporting unit from the abnormal time point of the supporting unit as an abnormal pattern by the inspection unit; and an abnormal pattern detection operation, which updates the abnormal pattern for the current value identified as the abnormal pattern to the abnormal diagnosis module, and determines the rotation abnormality of the rotating shaft using the abnormal diagnosis module.

[0025] According to an exemplary embodiment, the defect detection method may further include an updating operation of updating the abnormality diagnosis module updated in the abnormal pattern detection operation to other substrate processing units in which the rotation axis is installed.

[0026] According to an exemplary embodiment, the abnormality diagnosis module may have a correlation amount between the vibration of the rotating shaft and the state of the rotating shaft, and a correlation amount between the current value and the state of the rotating shaft based on the correlation amount between the vibration of the rotating shaft and the current value as data, and determine whether the rotating shaft has a defect based on the current value in the data.

[0027] According to an exemplary embodiment, the data may include a current abnormality pattern formed in the form of a database.

[0028] According to the exemplary embodiment, the rotating shaft may rotate while being connected to the bearing, and the defect of the rotating shaft may include a defect caused by wear of the bearing.

[0029] According to an exemplary embodiment, the driver may include a motor, and the abnormality diagnosis module may convert a torque value of the motor into a current value to determine whether the rotating shaft has a defect.

[0030] According to an exemplary embodiment, the abnormality diagnosis module may detect a time point at which a defect occurs in the rotating shaft through vibration measurement, and identify a change pattern of a current value from the detected time point as an abnormality pattern to determine whether the rotating shaft has a defect.

[0031] Another exemplary embodiment of the present invention provides a substrate processing apparatus for processing a substrate by rotating the substrate, the substrate processing apparatus comprising: a determination unit, wherein the determination unit comprises: a chamber having a processing space; a plurality of support units for supporting the substrate in the processing space and supporting the substrate by rotating the substrate; a liquid discharge unit for discharging a chemical liquid in a liquid phase onto a substrate supported on each of the plurality of support units; a liquid supply unit for supplying the chemical liquid to the liquid discharge unit; a vibration detection unit mounted on any one of the plurality of support units and measuring a vibration value for one of the support units; a current detection unit , the current detection unit is installed in each of the multiple supporting units and detects the current value of the rotating substrate; and the inspection unit is used to receive the vibration value and the current value together with the vibration detection unit and the current detection unit, apply the vibration abnormality diagnosis module to the vibration value to determine the rotation abnormality of the substrate, and apply the abnormality diagnosis module to the current value at the abnormal time point when the abnormality is determined to determine the rotation abnormality of the substrate, and the inspection unit measures the time point when the defect occurs in the rotating shaft through the vibration measurement of the vibration detection unit, and identifies the change pattern of the current value from the detected time point as an abnormal pattern to determine whether the rotating shaft is defective, and applies the abnormality diagnosis module to each of the multiple supporting units to determine the abnormality of each rotating shaft.

[0032] According to the present invention, compared with the conventional case where it is difficult to determine whether the rotating shaft has a defect only by analyzing the pattern of the current value, an abnormal pattern of the current value can be ensured, making it very easy to determine whether the rotating shaft has a defect based only on the current value of the motor.

[0033] The effects of the present inventive concept are not limited to the above-mentioned effects, and those skilled in the art will clearly understand unmentioned effects from the specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a top plan view showing a substrate processing facility according to an exemplary embodiment of the present invention.

[0035] Figure 2 To show Figure 1 Cross-sectional view of substrate processing equipment.

[0036] Figure 3 for Figure 2 A block diagram of an example of a determination unit is shown in FIG.

[0037] Figure 4 is a flow chart showing a defect detection method for a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0038] Figure 5 For comparison Figure 4 Graphs of the time and vibration value for detecting abnormality of a rotating shaft, and graphs of the time and current value for detecting abnormality of a rotating shaft in a defect detection method for substrate processing equipment shown in FIG. DETAILED DESCRIPTION

[0039] Hereinafter, exemplary embodiments for implementing the present invention will be described with reference to the accompanying drawings, and in this case, when a specific component element "includes" a specific component element throughout the specification, unless otherwise specified, it is deemed to mean that it may further include other components, rather than controlling other components. In addition, when describing electronic hardware or electronic software, the term "... unit" such as described in the specification is considered to refer to a unit that processes at least one function or operation, and when describing a mechanical device, it means a component, function, purpose, point or driving element. In addition, hereinafter, the same or similar configuration will be described by using the same figure mark, and overlapping descriptions of the same component elements will be omitted.

[0040] Further, when an element or layer is referred to as being "on another element or layer," "connected to another element or layer," "coupled to another element or layer," "attached to another element or layer," "adjacent to another element or layer," or "covering another element or layer," the element or layer may be directly on another element or layer, directly connected to another element or layer, directly coupled to another element or layer, directly attached to another element or layer, directly adjacent to another element or layer, or directly covering another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly connected to an element or layer," or "directly bonded to another element or layer," it should be understood that there are no intervening elements or layers. Throughout the specification, the same reference numerals represent the same elements. The term "and / or" used in the present invention also includes all combinations and sub-combinations of one or more of the listed items.

[0041] Figure 1 is a top plan view showing a substrate processing facility according to an exemplary embodiment of the present invention. Figure 2 To show Figure 1 Cross-sectional view of substrate processing equipment.

[0042] See also Figure 1 and Figure 2 , the substrate processing facility 1 includes an index module 10 and a process processing module 20, and the index module 10 includes a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process processing module 20 are sequentially arranged in a row. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process processing module 20 are arranged is referred to as a first direction 12, when viewed from above, a direction perpendicular to the first direction 12 is referred to as a second direction 14, and a direction perpendicular to a plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0043] The carrier 18 containing the substrate W therein is placed on the loading port 120. A plurality of loading ports 120 are provided, and the plurality of loading ports are arranged in a row along the second direction 14. Figure 1 In the figure, four loading ports 120 are shown. However, the number of loading ports 120 can be increased or decreased according to conditions such as process efficiency and occupied space of the process processing module 20. A groove (not shown) supporting the edge of the substrate is formed in the carrier 18. The groove is arranged in a plurality along the third direction 16, and the substrates are located in the carrier to be stacked while being spaced apart from each other along the third direction 16. As the carrier 18, a front open unified pod (FOUP) can be used.

[0044] The process processing module 20 may include a buffer unit 20, a transfer chamber 240, and process chambers 260 and 280. The transfer chamber 240 is arranged so that its length direction is parallel to the first direction 12. The process chambers 260 and 280 are arranged on opposite sides of the transfer chamber 240 in the second direction 14. The process chambers 260 may be arranged to be symmetrical with respect to the transfer chamber 240. Some process chambers 260 and 280 are arranged along the longitudinal direction of the transfer chamber 240. In addition, some process chambers 260 and 280 are arranged stacked thereon. That is, the process chamber 240 may be arranged on opposite sides of the transfer chamber 240 in an arrangement of A×B (A and B are natural numbers equal to or greater than 1). Here, A is the number of process chambers 260 and 280 arranged in a line along the first direction 12, and B is the number of process chambers 260 arranged in a line along the third direction 16. When four or six process chambers 260 are provided on each of the opposite sides of the transfer chamber 240, the process chambers 260 and 280 may be provided in a 2×2 or 3×2 arrangement. The number of process chambers 260 and 280 may be increased or decreased. Unlike the foregoing, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chambers 260 and 280 may be provided as a single layer on one side and on the opposite side of the transfer chamber 240. In addition, the process chambers 260 and 280 may be provided in various arrangements other than the above.

[0045] The process chambers 260 and 280 of the present exemplary embodiment may be classified as including a cleaning chamber and a drying chamber. In this case, the cleaning chamber may be a substrate processing facility for cleaning a substrate, which will be described below, and the drying chamber may be a substrate processing facility for drying a substrate.

[0046] The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 may provide a space in which the substrate W stays before being transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 is provided with a groove (not shown) in which the substrate W is placed, and the groove (not shown) is provided in plurality to be spaced apart from each other along the third direction 16. In the buffer unit 220, a side facing the transfer frame 140 and a side facing the transfer chamber 240 are each open.

[0047] The transfer frame 140 transfers the substrate W between the carrier 18 located at the loading port 120 and the buffer unit 220. The transfer frame 140 is provided with an index track 142 and an index robot 144. The index track 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is mounted on the index track 142 and moves linearly in the second direction 14 along the index track 142. The index robot 144 includes a base 144a, a body 144b and an index arm 144c. The base 144a is installed to be movable along the index track 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable in the third direction 16 on the base 144a. Further, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and provided to be movable forward and backward with respect to the body 144b. The plurality of index arms 144c are configured to be driven individually. The index arms 144c are configured to be stacked in a state of being spaced apart from each other in the third direction 16. When the substrate W is transferred from the process module 20 to the carrier 18, some of the index arms 144c may be used, and when the substrate W is transferred from the carrier 130 to the process module 20, other of the plurality of index arms 144c may be used. This can prevent particles generated from the substrate W before the process from being attached to the substrate W after the process during the process of loading and unloading the substrate W by the index robot 144.

[0048] The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260. A guide rail 242 and a main robot 244 are provided to the transfer chamber 240. The guide rail 242 is provided so that its longitudinal direction is parallel to the first direction 12. The main robot 244 is mounted on the guide rail 242 and moves linearly on the guide rail 242 along the first direction 12. The main robot 244 includes a base 244a, a body 244b and a main arm 244c. The base 244a is installed to be movable along the rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable on the base 244a in the third direction 16. Further, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b and is provided to be movable forward and backward with respect to the body 244b.

[0049] Hereinafter, the substrate processing apparatus 300 disposed in the process chamber 260 will be described. In the present exemplary embodiment, a case where the substrate processing apparatus 300 performs a liquid treatment process on a substrate is described as an example. The liquid treatment process further includes a process of cleaning the substrate.

[0050] Figure 2 To show Figure 1 Cross-sectional view of substrate processing equipment. Figure 2 The substrate processing apparatus 300 further includes a chamber 310, a processing container 320, a support unit 340, a lifting unit 360, a liquid discharge unit 400, a gas flow forming unit 500, a liquid supply unit 600, and a controller 900. The chamber 310 provides a processing space 312 in which a process for processing a substrate W is performed.

[0051] The processing container 320 is positioned in the processing space 312 and is set to a cup-like shape with a top opening. When viewed from above, the processing container 320 is positioned to overlap with the exhaust pipe. The processing container 320 includes an internal collection container 322 and an external collection container 326. Each of the collection containers 322 and 326 collects different processing solutions from the processing solutions used in the process. The internal collection container 322 is set to an annular shape around the support unit 340, and the external collection container 326 is set to an annular shape around the internal collection container 322. The internal space 322a of the internal collection container 322 and the space 326a between the external collection container 326 and the internal collection container 322 are used as inlets for the processing solutions to flow into the internal collection container 322 and the external collection container 326, respectively. The collecting lines 322b and 326b are connected to the bottom surfaces of the collecting containers 322 and 326, respectively, to extend vertically downward. Each of the collecting lines 322b and 326b serves as a drain pipe to drain the treatment solution that has been introduced through the respective collecting containers 322 and 326. The drained treatment solution may be reused by an external treatment solution regeneration system (not shown).

[0052] The support unit 340 is provided as a substrate support unit 340 for supporting and rotating the substrate W. The support unit 340 is provided in the processing container 320. During the processing process, the substrate support unit 340 supports the substrate W and rotates the substrate W. The support unit includes a rotating chuck 342, a support pin 344, a chuck pin 346, and a rotating shaft 348. The rotating chuck 342 has a top surface, which is substantially circular when viewed from the top. The rotating shaft 348 rotatable by a driver is fixedly coupled to the bottom surface of the rotating chuck 342. In one example, the driver can be formed by a motor 349. A plurality of support pins 344 are provided. The support pins 344 are spaced apart at the edge portion of the top surface of the rotating chuck 342 and protrude upward from the rotating chuck 342. The support pins 334 are arranged in combination with each other to have an overall annular ring shape. The support pins 344 support the edge of the rear surface of the substrate W so that the substrate W is spaced apart from the top surface of the rotating chuck 2631 by a predetermined distance. A plurality of chuck pins 346 are provided. The chuck pin 346 is arranged to be farther from the center of the rotating chuck 342 than the supporting pin 344. The chuck pin 346 is arranged to protrude upward from the rotating chuck 342. The chuck pin 346 supports the outer side of the substrate W to prevent the substrate W from being laterally separated from its static position when the supporting unit 340 rotates. The chuck pin 346 is arranged to be linearly movable between a standby position and a supporting position along the radial direction of the rotating chuck 342. The standby position is a position farther from the center of the rotating chuck 342 relative to the supporting position. When the substrate W is loaded into the supporting unit 340 or unloaded from the supporting unit 340, the chuck pin 346 is positioned in the standby position, and when a process is performed on the substrate W, the chuck pin 346 is positioned in the supporting position. At the supporting position, the chuck pin 346 contacts the outer side of the substrate W.

[0053] The lifting unit 360 adjusts the relative height between the process container 320 and the support unit 340. The lifting unit 360 linearly moves the process container 320 in the upward and downward directions. When the process container 320 moves up and down, the relative height of the process container 320 relative to the support unit 340 changes. The lifting unit 360 includes a bracket 360, a moving shaft 362, and a driver 364. The bracket 362 is fixedly installed on the outer wall of the process container 320, and the moving shaft 364 moved in the vertical direction by the driver 366 is fixedly coupled to the bracket 364. When the substrate W is placed on the support unit 340 or lifted and lowered from the support unit 340, the process container 320 is lowered so that the support unit 340 protrudes above the process container 320. In addition, when the process is being performed, the height of the process container 320 is adjusted so that the processing solution flows into the preset collection container according to the type of the processing solution supplied to the substrate W.

[0054] As described above, the elevating unit 360 may move the supporting unit 340 , rather than the process container 320 , in the upward and downward directions.

[0055] The liquid discharge unit 400 supplies various types of liquids to the substrate W. The liquid discharge unit 400 further includes a plurality of nozzles 410 to 430. Each nozzle is moved to a process position and a standby position by a nozzle position driver 440. Herein, the process position is defined as a position where the nozzles 410 to 430 can discharge liquid onto the substrate W positioned in the process container 320, and the standby position is defined as a position where the nozzles 410 to 430 wait outside the process position. According to an example, the process position may be a position where the nozzles 410 to 430 can supply liquid to the center of the substrate W. For example, when viewed from above, the nozzles 410 to 430 may be linearly or axially moved to move between the process position and the standby position. The processing solution discharged from the liquid discharge unit 400 onto the substrate W may be a liquefied processing solution. In addition, at the standby position, the collection pipe 450 may be disposed below the third nozzle 430. When the third nozzle 430 discharges a chemical liquid for cleaning, the collection pipe 450 collects the chemical liquid.

[0056] The plurality of nozzles 410 to 430 discharge different types of liquids. The chemical liquid discharged from the nozzles 410 to 430 may include at least one of chemicals, a rinse liquid, and a drying fluid. Figure 2 In an exemplary embodiment, the first nozzle 410 may be a nozzle for discharging chemicals. The second nozzle 420 may be a nozzle for discharging a rinse liquid. The third nozzle 430 may be a nozzle for discharging a drying fluid. For example, the chemical may be a liquid capable of etching a film formed on the substrate W or removing particles remaining on the substrate W. The chemical may be a liquid having a strong acid or strong base property. The chemical may include sulfuric acid, hydrofluoric acid, or ammonia. The rinse liquid may be a solution capable of rinsing the chemical remaining on the substrate W. For example, the rinse liquid may be pure water. The drying fluid may be provided as a liquid capable of replacing the residual rinse liquid on the substrate W. The drying fluid may be a liquid having a lower surface tension than the rinse liquid. The drying fluid may be an organic solvent. The drying fluid may be isopropyl alcohol (IPA). The third nozzle 430 may be connected to a liquid supply unit 600 to be described later.

[0057] The airflow forming unit 500 forms a downward airflow in the processing space 312. The airflow forming unit 500 supplies airflow from the upper part of the chamber 310 and discharges airflow from the lower part of the chamber 310. The airflow forming unit 500 further includes an airflow supply unit 520 and a discharge unit 540. The airflow supply unit 520 and the discharge unit 540 are positioned facing each other in the vertical direction.

[0058] The airflow supply unit 520 supplies gas in a downward direction. The gas supplied from the airflow supply unit 520 can be air with impurities removed therefrom. The airflow supply unit 520 further includes a fan 522, an airflow supply line 524, a supply valve 528, and a filter 526. The fan 522 is mounted on the top plate surface of the chamber 310. When viewed from above, the fan 522 is positioned to face the processing container. The fan 522 can be positioned to provide air toward the substrate W positioned in the processing container. The airflow supply line 524 is connected to the fan 522 to supply air to the fan 522. The supply valve 528 is installed in the airflow supply line 524 to adjust the amount of air supplied. The filter 526 is installed in the airflow supply line 524 to filter the air. For example, the filter 526 can remove particles and moisture contained in the air.

[0059] The discharge unit 540 discharges the processing space 312. The discharge unit 540 further includes a discharge pipe 542, a decompression member 546, and a discharge valve 548. The discharge pipe 542 is installed on the bottom surface of the chamber 310 and is provided as a pipe for discharging the processing space 312. The discharge pipe 542 is positioned so that the discharge port faces upward. The discharge pipe 542 is positioned so that the discharge port is communicated with the interior of the processing container. That is, the top of the discharge pipe 542 is located in the processing container. Therefore, the downward airflow formed in the processing container is discharged through the discharge pipe 542.

[0060] The decompression member 546 reduces the pressure of the discharge pipe 542. Negative pressure is formed in the discharge pipe 542 by the decompression member 546, and the negative pressure discharges the process container. The discharge valve 548 is installed in the discharge pipe 542, and opens and closes the discharge port of the discharge pipe 542. The discharge valve 548 adjusts the discharge amount.

[0061] Figure 3 for Figure 2 A block diagram of an example of a determination unit is shown.

[0062] Reference again Figure 3 , the substrate processing apparatus according to the exemplary embodiment of the present invention may further include a bearing 349 a and a determination unit 700 .

[0063] The bearing 349a is installed on at least one of the lower surface and the outer periphery of the rotating shaft 348. In this case, the bearing 349a may be configured to be included in the support unit 340. When the rotating shaft 348 rotates, the bearing 349a may rotate in connection with the rotating shaft 348, thereby supporting the rotating shaft 348 while reducing the friction force on the rotating shaft 348. In this case, the bearing 349a is consumed and worn when the rotating shaft 348 rotates, which may cause dust in a vibrating state.

[0064] The determination unit 700 determines whether the rotating shaft 348 has a defect based on the current value applied to the driver when the rotating shaft 348 rotates. Here, the defect of the rotating shaft 348 is determined in a state where the rotating shaft 348 vibrates abnormally and the vibration value increases to a preset value or more. In this case, the defect of the rotating shaft 348 may be vibration caused by wear of the bearing 349a.

[0065] Here, the determination unit 700 may receive in real time the current value from the driver formed by the motor 349. Alternatively, the determination unit 700 may receive the input of the torque value of the motor 349 and convert the torque value into the current value, thereby receiving the input of the current value of the motor 349 without a configuration for calculating the current value.

[0066] Meanwhile, the determination unit 700 for determining whether the rotating shaft 348 has a defect may further include an abnormality diagnosis module 704, in which a relationship between the current value and the state of the rotating shaft 348 is preset. In this case, the abnormality diagnosis module 704 may store data of various current abnormality patterns when the current value increases above the preset value in the form of a database (DB), and continuously determine whether the data of the current pattern corresponds to the current abnormality pattern. The abnormality diagnosis module 704 is capable of detecting an abnormality of the rotating shaft 348, and replacing the rotating shaft 348 when the current pattern caused by the abnormality of the rotating shaft 348 corresponds to the current abnormality pattern, thereby preventing dust from being generated between the rotating shaft 348 and the bearing 349a. Therefore, by determining a defect in the rotating shaft 348, the substrate processing apparatus according to the exemplary embodiment of the present invention is capable of preventing dust generated by the rotating shaft 348 from entering the substrate W during process processing.

[0067] In this case, when the data of the current abnormality pattern is stored in the form of DB, the abnormality diagnosis module 704 can set the detection time point of the data of the current abnormality pattern based on the time point at which the defect of the rotating shaft 348 is generated by the vibration measurement. In this case, when the defect of the rotating shaft 348 is determined by the vibration measurement, the abnormality diagnosis module 704 determines the defect by determining whether the measured vibration corresponds to the data of the vibration abnormality pattern. In this case, the abnormality diagnosis module 704 can store the data of the vibration abnormality pattern in the form of DB, and determine whether the vibration abnormality pattern in the DB corresponds to the measured vibration value to determine the defect of the rotating shaft 348. In other words, the abnormality diagnosis module 704 sets the detection time point for the data of the current abnormality pattern by using the correlation between the vibration of the rotating shaft 348 and the state of the rotating shaft 348. Therefore, since the abnormality diagnosis module 704 determines whether the rotating shaft 348 has a defect by the time point at which the vibration occurs when the abnormality of the rotating shaft 348 is detected, the abnormality diagnosis module 704 is not unnecessarily driven when the rotating shaft 348 rotates normally, thereby reducing the load factor of the determination unit 700. Furthermore, since the abnormality diagnostic module 704 accurately determines and detects the point in time when the rotating shaft 348 has a defect through vibration measurement, the abnormality diagnostic module 704 can more accurately determine whether the rotating shaft 348 has an abnormality.

[0068] As an example of the determination unit 700 , the determination unit 700 may further include a vibration detection unit 701 , a current detection unit 702 , and a checking unit 703 .

[0069] The vibration detection unit 701 may be mounted on the support unit 340 to measure a vibration value of the support unit 340. In this case, the vibration detection unit 701 may include any one of an acceleration sensor, a displacement sensor, and an acoustic sensor. When the vibration detection unit 701 is configured as an acceleration sensor, the vibration detection unit 701 may measure a vibration value generated when the support unit 340 vibrates by measuring the acceleration of the vibration of the support unit 340. Further, when the vibration detection unit 701 is configured as a displacement sensor such as a laser sensor, the vibration detection unit 701 is able to measure a vibration value generated when the support unit 340 vibrates by measuring a displacement amount measured in response to the vibration of the support unit 340. In addition, when the vibration detection unit 701 is configured as an acoustic sensor, the vibration detection unit 701 is able to measure a vibration value generated when the support unit 340 vibrates by measuring a displacement of a surface tremor of the support unit 340 using an acoustic wave.

[0070] The current detection unit 702 may be electrically connected to the support unit 340 to detect a current value of the motor 349 that rotates the support unit 340. In this case, the current detection unit 702 may measure the current value of the motor 349 in real time as in the example described above, or may measure the torque value of the motor 349 by converting the torque value into the current value. In the case of converting the torque value of the motor 349 into the current value, the torque value may be converted into the current value by multiplying the input torque value by a conversion rate constant.

[0071] The inspection unit 703 may include a device having a control function and a signal processing function, such as a controller or a DAQ. Therefore, the inspection unit 703 may convert the analog signal value measured by the vibration detection unit 701 into a digital signal value, and analyze the converted digital signal value using the abnormality diagnosis module 704. Specifically, the inspection unit 703 may receive the vibration value and the current value from the vibration detection unit 701 and the current detection unit 702 as input, and continuously store and record the input vibration value and current value. In this case, the inspection unit 703 determines the rotation error of the support unit 340 based on the vibration value input to the vibration detection unit 701. The inspection unit 703 may use the abnormality diagnosis module 704 to determine the rotation error of the support unit 340. When the pattern of the input vibration value matches or approaches the vibration abnormality pattern stored in the form of DB within a specific range, the abnormality diagnosis module 704 may determine that the rotating shaft 348 has a vibration abnormality. In this case, the inspection unit 703 applies the abnormality diagnosis module 704 to the current value at the abnormal time t01 determined by the rotation error of the support unit 340 to determine the rotation abnormality of the substrate W. In this case, the abnormality diagnosis module 704 can store various current abnormality patterns of the current value when the vibration increases to above the set value in the form of DB as described above, and continuously determine whether the current pattern corresponds to the current abnormality pattern. In this case, the abnormality diagnosis module 704 can more accurately determine the abnormality in the rotating shaft 348 because the abnormality diagnosis module 704 accurately determines and detects the time point when the rotating shaft 348 has a defect through vibration measurement.

[0072] Next, the defect detection method for the substrate processing equipment as described above will be described.

[0073] Figure 4 is a flowchart illustrating a defect detection method for a substrate processing apparatus according to an exemplary embodiment of the present invention. Figure 5 For comparison purposes Figure 4 Graphs showing the time and vibration value for detecting abnormality of a rotating shaft and the time and current value for detecting abnormality of a rotating shaft in a defect detection method for substrate processing equipment shown in FIG.

[0074] Reference again Figure 5, a defect detection method for a substrate processing device according to an exemplary embodiment of the present invention includes: generating a defect diagnosis module 704 based on a preset correlation between a current value of a motor 349 (as a driver) and a state of a rotating shaft 348 (S01); determining whether the rotating shaft 348 has a defect based on a current value applied to the motor 349 that rotates the rotating shaft 348 when the rotating shaft 348 rotates through the abnormality diagnosis module 704 (S02); and updating the defect diagnosis module 704 to the corresponding substrate processing device (S03).

[0075] First, operation S01 of generating the abnormality diagnosis module 704 may include a vibration detection unit installation operation S10, a rotation shaft rotation operation S20, a vibration value detection operation S30, an abnormal time detection operation S40, an abnormal pattern storage operation S50, and an abnormal pattern detection operation S60.

[0076] In the vibration detecting unit mounting operation S10, the vibration detecting unit 701 is mounted on the support unit 340 including the rotation shaft 348. Here, the vibration detecting unit 701 may be equipped with the acceleration sensor, the displacement sensor, and the acoustic sensor as described above.

[0077] In the rotating shaft rotating operation S20, the rotating shaft 348 is rotated. In this case, the rotating shaft 348 may be driven by the motor 349 as the driver as described above, and the rotating shaft 348 may be rotated with the bearing 349a connected to the rotating shaft 348.

[0078] In the vibration value detecting operation S30 , the vibration detecting unit 701 may detect a vibration value of the rotating shaft 348 .

[0079] In the abnormal time detection operation S40, the vibration value is input to the inspection unit 703, and the abnormal time t01 of the support unit 340 is determined by the vibration value. Herein, as described above, when the pattern of the input vibration value matches or approaches the vibration abnormality pattern stored in the DB form within a specific range, it can be determined that the rotating shaft 348 has a vibration abnormality.

[0080] In the abnormal pattern storing operation S50 , the checking unit 703 recognizes and stores a pattern of a current value provided to the rotational force of the supporting unit 340 at the abnormal time t01 from the supporting unit 340 as an abnormal pattern.

[0081] In the abnormal pattern detection operation S60, the abnormal pattern of the current value identified as the abnormal pattern is updated to the abnormality diagnosis module 704 to determine the abnormality of the rotation of the rotating shaft 348 using the abnormality diagnosis module 704. Therefore, the abnormality diagnosis module 704 can determine the abnormality of the rotating shaft 348 only by analyzing the current value.

[0082] In the updating operation S03, the abnormality diagnosis module 704 updated in the abnormal pattern detection operation S60 is updated to other substrate processing equipment on which the rotating shaft 348 is installed. In this case, even when the vibration detection unit 701 is not installed, the other substrate processing equipment can detect the abnormality of the rotating shaft 348 based only on the current value of the motor 349.

[0083] Therefore, in the substrate processing apparatus and the defect detection method for the substrate processing apparatus according to the exemplary embodiment of the present invention, when the defect of the rotating shaft 348 is determined using the current value, the time when the defect occurs is identified by the measured vibration value, and the pattern of the current value from the time when the defect occurs is identified as an abnormal pattern and stored in the form of a DB in the abnormal diagnosis module 704. In this case, the abnormal diagnosis module 704 updates the abnormal pattern for each fault condition of the rotating shaft 348 having a different set of fault symptoms, thereby detecting more types of defects.

[0084] Therefore, compared with the conventional situation where it is difficult to determine whether the rotating shaft 348 is defective only by analyzing the pattern of the current value, the substrate processing equipment and the defect detection method for the substrate processing equipment according to the exemplary embodiment of the present invention can ensure the abnormal pattern of the current value, so that it is very easy to determine whether the rotating shaft 348 is defective based only on the current value of the motor 349.

[0085] Although the substrate processing equipment according to the exemplary embodiment of the present invention has been described mainly by the example of the cleaning process, of course, the substrate processing equipment according to the exemplary embodiment of the present invention is also applicable to the etching process. In other words, although the present invention is described above with reference to specific matters such as specific components and with reference to limited exemplary embodiments and drawings, these are provided for a more overall understanding of the present invention, the present invention is not limited to the above exemplary embodiments, and technicians in the field to which the present invention belongs can make various modifications and changes from these descriptions.

[0086] Therefore, the spirit of the present invention should not be limited to the described exemplary embodiments, and not only the claims described later but all modifications equivalent to the claims belong to the scope of the present invention.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a support unit, the support unit comprising a rotation chuck supporting a substrate, a rotation shaft supporting the rotation chuck, and a driver providing a rotation force to the rotation shaft; as well as a determination unit, the determination unit being used to determine whether the rotating shaft has a defect, The determination unit determines whether the rotating shaft has a defect based on a current value applied to the driver when the rotating shaft rotates.

2. The device according to claim 1, wherein: The determination unit includes an abnormality diagnosis module in which a relationship between the current value and the state of the rotating shaft is preset, and Whether the rotating shaft has a defect is determined by the abnormality diagnosis module.

3. The device according to claim 2, wherein: The abnormality diagnosis module has a correlation between the vibration of the rotating shaft and the state of the rotating shaft, and a correlation between the vibration of the rotating shaft and the current value as data, and determines whether the rotating shaft has a defect based on the current value in the data.

4. The device according to claim 3, wherein: The data includes current abnormality patterns formed in the form of a database.

5. The device according to claim 3, wherein: The support unit further includes a bearing connected to the rotating shaft, and The defects in the rotating shaft include defects caused by bearing wear.

6. The device according to claim 1, wherein: The drive includes a motor, and The determination unit detects a torque value of the motor, converts the torque value into a current value, and determines whether the rotating shaft has a defect.

7. The device according to claim 2, wherein: The abnormality diagnosis module detects a time point at which a defect occurs in the rotating shaft through vibration measurement, and identifies a change pattern of a current value from the detected time point as an abnormality pattern to determine whether the rotating shaft has a defect.

8. The device according to claim 7, wherein: The vibration value measured when measuring the vibration is measured by an acceleration with respect to the vibration of the support unit.

9. The device according to claim 7, wherein: The vibration value measured when measuring the vibration is measured by a displacement amount with respect to the vibration of the support unit.

10. The device according to claim 7, wherein: The vibration value measured when measuring the vibration is measured by the sound generated by the vibration of the supporting unit.

11. The device according to claim 1, wherein: The determining unit comprises: a vibration detection unit, the vibration detection unit being mounted on the support unit to measure a vibration value of the support unit; a current detection unit electrically connected to the support unit to detect a current value applied to the motor rotating the support unit; and An inspection unit that receives the vibration value and the current value from the vibration detection unit and the current detection unit as input, determines the rotation error of the support unit based on the vibration value, and determines the rotation abnormality of the substrate by applying an abnormality diagnosis model to the current value at a time point when the rotation error of the support unit is determined.

12. A defect detection method for a substrate processing apparatus, the defect detection method determining whether a rotation axis has a defect when a support unit including the rotation axis and supporting a substrate processes a substrate while rotating the substrate, the defect detection method comprising: generating an abnormality diagnosis module, wherein the abnormality diagnosis module is preset with a correlation between the current value and the state of the rotating shaft; as well as By the abnormality diagnosis module, it is determined whether the rotating shaft has a defect based on a current value applied to a driver that rotates the rotating shaft when the rotating shaft rotates.

13. The defect detection method according to claim 12, wherein: The generation of the abnormality diagnosis module includes: a vibration detection unit installation operation of installing the vibration detection unit on a support unit including the rotation shaft; a rotating shaft rotating operation, wherein the rotating shaft rotating operation rotates the rotating shaft; a vibration value detecting operation of detecting a vibration value of the rotating shaft by the vibration detecting unit; an abnormal time detection operation, wherein the inspection unit receives the vibration value as an input and determines an abnormal time point of the support unit based on the vibration value; an abnormal pattern storing operation of recognizing and storing, by the inspection unit, a pattern of current values ​​of a rotational force supplied to the support unit from a time point of abnormality of the support unit as an abnormal pattern; and An abnormal pattern detection operation of updating the abnormal pattern for the current value identified as the abnormal pattern to the abnormality diagnosis module and determining the rotation abnormality of the rotating shaft using the abnormality diagnosis module.

14. The defect detection method according to claim 13, further comprising: An updating operation is performed to update the abnormality diagnosis module updated in the abnormal pattern detection operation to other substrate processing units equipped with the rotation axis.

15. The defect detection method according to claim 12, wherein: The abnormality diagnosis module has a correlation between the vibration of the rotating shaft and the state of the rotating shaft, and a correlation between the vibration of the rotating shaft and the current value as data, and determines whether the rotating shaft has a defect based on the current value in the data.

16. The defect detection method according to claim 12, wherein: The data includes current abnormality patterns formed in the form of a database.

17. The defect detection method according to claim 12, wherein: The rotating shaft rotates while being connected to the bearing, and The defects of the rotating shaft include defects due to bearing wear.

18. The defect detection method according to claim 12, wherein: The drive includes a motor, and The abnormality diagnosis module converts a torque value of the motor into a current value to determine whether the rotating shaft has a defect.

19. The defect detection method according to claim 12, wherein: The abnormality diagnosis module detects a point in time when the defect occurs in the rotating shaft through vibration measurement, and identifies a change pattern of a current value from the detected point in time as an abnormality pattern to determine whether the rotating shaft has a defect.

20. A substrate processing apparatus for processing a substrate by rotating the substrate, the substrate processing apparatus comprising: Determine the unit, Wherein, the determining unit includes: A chamber having a processing space; a plurality of supporting units, the plurality of supporting units being used to support the substrate in the processing space and to support the substrate by rotating the substrate; a liquid discharging unit for discharging a chemical liquid in a liquid phase onto a substrate supported on each of the plurality of supporting units; a liquid supply unit for supplying the chemical liquid to the liquid discharge unit; a vibration detection unit that is mounted on any one of the plurality of support units and measures a vibration value for one of the support units; a current detection unit installed in each of the plurality of support units and detecting a current value rotating the substrate; and an inspection unit, the inspection unit being configured to receive the vibration value and the current value together with the vibration detection unit and the current detection unit, apply a vibration abnormality diagnosis module to the vibration value to determine the rotation abnormality of the substrate, and apply the abnormality diagnosis module to the current value at an abnormal time point when the abnormality is determined to determine the rotation abnormality of the substrate, and The inspection unit detects a time point at which a defect occurs in the rotating shaft through vibration measurement by the vibration detection unit, and identifies a change pattern of the current value from the detected time point as an abnormal pattern to determine whether the rotating shaft has a defect, and The abnormality diagnosis module is applied to each of the plurality of support units to determine abnormality of each of the rotation shafts.

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