Display device

Abstract

The display device includes a first substrate, a barrier film, and a second substrate; a thin film transistor layer, an emission material layer, an encapsulation layer, and a touch detection unit stacked on the second substrate; and a pad region in the non-display region and including a pad connected to the driving substrate and facing the first substrate, the pad including: a pad contact hole formed by etching the second substrate and the barrier film; a first inorganic film and a pad electrode stacked on an inner circumferential surface of the pad contact hole; and a rear contact hole etched through a portion of the first substrate and to which the pad of the driving substrate is bonded, the first inorganic film having an intermediate hole connecting the pad contact hole and the rear contact hole, and the pad of the driving substrate being electrically connected to the pad electrode through the lower conductive ink.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0105084 filed in the Korean Intellectual Property Office on August 10, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Aspects of some embodiments of the present disclosure relate to a display device. Background Art

[0004] With the development of an information-oriented society, consumers' demand for display devices continues to increase. The display device may be a flat panel display device such as a liquid crystal display device, a field emission display device, and a light-emitting display device. The light-emitting display device may include an organic light-emitting display device including an organic light-emitting diode as a light-emitting element or an inorganic light-emitting display device including an inorganic light-emitting diode as a light-emitting element.

[0005] The display panel of the display device includes a display area where pixels for displaying an image are arranged and a non-display area (or frame area) located around the display area (e.g., at the periphery of the display area or outside the footprint of the display area). Lines for driving pixels may be located in the non-display area. The non-display area of ​​the display panel does not display an image. As the size or footprint of the non-display area decreases, the display area may be relatively expanded.

[0006] The above information disclosed in this Background section is only for enhancement of understanding of the background technology, and therefore the information discussed in this Background section does not necessarily constitute prior art. Summary of the invention

[0007] Aspects of some embodiments of the present disclosure include a display device that can relatively increase a display area by reducing a non-display area.

[0008] According to some embodiments of the present disclosure, a display device may include: a substrate including a first substrate, a barrier film, and a second substrate sequentially stacked on each other; a thin film transistor layer, an emission material layer, an encapsulation layer, and a touch detection unit sequentially stacked on the second substrate; and a pad area located in a non-display area of ​​the substrate and including a plurality of pads connected to a drive substrate and facing the first substrate. According to some embodiments, each of the plurality of pads may include: a pad contact hole formed by etching the second substrate and the barrier film; a first inorganic film and a pad electrode sequentially stacked on an inner peripheral surface of the pad contact hole; and a rear contact hole formed by etching a portion of the first substrate aligned with the pad contact hole, the pad of the drive substrate being bonded to the bottom of the rear contact hole. According to some embodiments, the first inorganic film forms an intermediate hole connecting the pad contact hole with the rear contact hole, and the pad electrode covers at least a portion of the intermediate hole, and the pad of the drive substrate is electrically connected to the pad electrode covering the intermediate hole through the lower conductive ink.

[0009] According to some embodiments, the driving substrate may include: a pad bonded to the bottom of the rear contact hole; a pad hole penetrating a portion of the pad aligned with the middle hole in a thickness direction; a lower conductive ink covering an inner peripheral surface of the pad hole; and a protective resin covering the lower conductive ink.

[0010] According to some embodiments, the driving substrate may include a flexible printed circuit board (FPCB) and a driver chip as a chip on film (COF) on the FPCB.

[0011] According to some embodiments, the driving substrate may include a flexible substrate and a driver chip as a chip on plastic (COP) on the flexible substrate.

[0012] According to some embodiments, the first inorganic film is in the same layer as an inorganic film included in the thin film transistor layer.

[0013] According to some embodiments, the pad electrode is in the same layer as a source electrode or a drain electrode of a thin film transistor in the thin film transistor layer.

[0014] According to some embodiments, the pad electrode is one of a signal pad extending from a signal line for driving pixels in a display area, a power pad extending from a power line, an electrostatic pad electrically connected to an electrostatic line, and a touch driving pad electrically connected to a touch line of a touch detection unit.

[0015] According to some embodiments, the display device may include a second inorganic film covering the pad electrode on the inner peripheral surface of the pad contact hole. According to some embodiments, the second inorganic film is in the same layer as the inorganic film in the encapsulation layer.

[0016] According to some embodiments, the display device may include a planarization film covering the pad electrode on the inner peripheral surface of the pad contact hole. According to some embodiments, the planarization film is in the same layer as at least one of the planarization film in the thin film transistor layer and the pixel defining layer in the emission material layer.

[0017] According to some embodiments, a display device may include: an upper conductive ink covering a pad electrode on an inner peripheral surface of a pad contact hole; and a protective resin covering the upper conductive ink, the upper conductive ink and the lower conductive ink being connected to each other through a middle hole.

[0018] According to some embodiments of the present disclosure, a display device may include: a substrate including a first substrate, a barrier film, and a second substrate sequentially stacked on each other; a thin film transistor layer, an emission material layer, an encapsulation layer, and a touch detection unit sequentially stacked on the second substrate; and a pad area located in a non-display area of ​​the substrate and including a plurality of pads connected to a drive substrate and facing the first substrate. According to some embodiments, each of the plurality of pads may include: a pad contact hole formed by etching the second substrate and the barrier film; a first inorganic film and a pad electrode sequentially stacked on an inner peripheral surface of the pad contact hole; and a rear contact hole formed by etching a portion of the first substrate aligned with the pad contact hole. According to some embodiments, the first inorganic film forms an intermediate hole connecting the pad contact hole with the rear contact hole, and the pad of the drive substrate is electrically connected to the pad electrode through the intermediate hole and the upper conductive ink covering the pad electrode.

[0019] According to some embodiments, the driving substrate may include a flexible printed circuit board (FPCB) and a driver chip as a chip on film (COF) on the FPCB.

[0020] According to some embodiments, the driving substrate may include a flexible substrate and a driver chip as a chip on plastic (COP) on the flexible substrate.

[0021] According to some embodiments, the first inorganic film is in the same layer as an inorganic film included in the thin film transistor layer.

[0022] According to some embodiments, the pad electrode is in the same layer as a source electrode or a drain electrode of a thin film transistor in the thin film transistor layer.

[0023] According to some embodiments, the pad electrode is one of a signal pad extending from a signal line for driving pixels in a display area, a power pad extending from a power line, an electrostatic pad electrically connected to an electrostatic line, and a touch driving pad electrically connected to a touch line of a touch detection unit.

[0024] According to some embodiments, the pad of the driving substrate may include a groove aligned with the middle hole.

[0025] According to some embodiments, the recess of the pad is filled with a portion of the upper conductive ink.

[0026] According to some embodiments, the driving substrate may include: a substrate; a pad on the substrate and bonded to the bottom of the rear contact hole; a pad hole penetrating the pad and a portion of the substrate aligned with the middle hole in a thickness direction; a lower conductive ink covering an inner peripheral surface of the pad hole; and a protective resin covering the lower conductive ink. According to some embodiments, the lower conductive ink is connected to the upper conductive ink through the pad hole and the middle hole.

[0027] According to some embodiments, the driving substrate may include: a substrate bonded to the bottom of the rear contact hole; a pad under the substrate; a pad hole penetrating the pad and a portion of the substrate aligned with the middle hole in a thickness direction; a lower conductive ink covering an inner peripheral surface of the pad hole; and a protective resin covering the lower conductive ink. According to some embodiments, the lower conductive ink is connected to the upper conductive ink through the pad hole and the middle hole.

[0028] According to some embodiments, the display area may be relatively expanded by reducing the non-display area.

[0029] However, aspects of the embodiments according to the present disclosure are not limited to those described herein. The above and other aspects of the embodiments according to the present disclosure will become more apparent to those skilled in the art in the art to which the present disclosure belongs by referring to the detailed description of the present disclosure given below. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects and features according to embodiments of the present disclosure will become more apparent by describing aspects of some embodiments of the present disclosure in more detail with reference to the accompanying drawings, in which:

[0031] Figure 1 is a plan view of a display device according to a comparative example.

[0032] Figure 2 is a cross-sectional view of a display device according to a comparative example.

[0033] Figure 3 is a plan view of a display device according to some embodiments of the present disclosure.

[0034] Figure 4 is a cross-sectional view of a display device according to some embodiments of the present disclosure.

[0035] Figure 5 is a cross-sectional view illustrating a structure of a portion of a display area of ​​a display panel according to some embodiments.

[0036] Figure 6is a plan view illustrating a portion of a non-display area of ​​a display panel according to some embodiments.

[0037] Figure 7 is a flowchart for explaining a method of manufacturing a display device according to some embodiments of the present disclosure.

[0038] Figure 8 is a cross-sectional view for explaining a process of forming a pad contact hole using a hard mask.

[0039] Fig. 9 is a cross-sectional view for explaining a process of forming a pad electrode in a pad contact hole.

[0040] Fig.10 is a cross-sectional view for explaining a process of forming a rear contact hole to expose a portion of a pad contact hole from a rear surface of a display panel.

[0041] Fig.11 is a cross-sectional view for explaining a process of bonding a driving substrate to a rear contact hole.

[0042] Fig.12 is a cross-sectional view for explaining a process of filling a pad contact hole with a conductive ink covering a pad electrode.

[0043] Fig.13 is a cross-sectional view illustrating a structure of a portion of a non-display area of ​​a display panel according to some embodiments.

[0044] Fig.14 A part of the display panel is specifically shown Fig.13 A cross-sectional view of the pad area shown in FIG.

[0045] Fig.15 It is shown Fig.13 0 is a view of an example in which the drive substrate shown in 0 is implemented as a flexible substrate.

[0046] Fig.16 A part of the display panel is specifically shown Fig.15 A cross-sectional view of a pad contact hole shown in FIG.

[0047] Fig.17 is a cross-sectional view of a display panel in which a pad electrode and a driving substrate are electrically connected to each other through a lower conductive ink filling a rear contact hole according to some embodiments.

[0048] Fig.18 According to some embodiments, Fig.17 0026 is a cross-sectional view of a portion of a display panel showing aspects of a pad contact hole as shown in FIG.

[0049] Fig.19 It is shown Fig.170 is a view of an example in which the drive substrate shown in 0 is implemented as a flexible substrate.

[0050] Fig. 20 According to some embodiments, Fig.19 0026 is a cross-sectional view of a portion of a display panel showing aspects of a pad contact hole as shown in FIG.

[0051] Fig.21 is a cross-sectional view of a portion of a display panel, and particularly, a cross-sectional view of a pad contact hole for increasing a contact area of ​​a conductive ink by etching a portion of a protrusion included in a driving substrate according to some embodiments.

[0052] Fig. 22 is a cross-sectional view of a portion of a display panel, and specifically, is a cross-sectional view of a pad contact hole in which a pad electrode is composed of a plurality of metal layers according to some embodiments.

[0053] Fig.23 is a cross-sectional view of a portion of a display panel in which a pad electrode and a driving substrate are electrically connected to each other by a conductive ink filling a rear contact hole according to some embodiments.

[0054] Fig.24 is a cross-sectional view of a portion of a display panel including pad contact holes of different types according to some embodiments.

[0055] Fig.25 is a cross-sectional view of a portion of a display panel in which an organic protection film is formed on some of the pad contact holes according to some embodiments.

[0056] Fig.26 is a cross-sectional view of a portion of a display panel in which a planarization film is formed on some of the pad contact holes according to some embodiments.

[0057] Fig. 27 It shows that Fig.26 0 is a cross-sectional view of an example in which the drive substrate shown in FIG. 1 is implemented as a portion of a display panel of a flexible substrate.

[0058] Fig.28 According to some embodiments, Fig.26 0 is a cross-sectional view of a portion of a display panel in which the shape of a pad electrode is modified.

[0059] Fig.29 It shows that Fig.28 0 is a cross-sectional view of an example in which the drive substrate shown in FIG. 1 is implemented as a portion of a display panel of a flexible substrate.

[0060] Fig.30 is a cross-sectional view illustrating an example of a portion of a display panel in which the conductive ink includes an upper conductive ink and a lower conductive ink.

[0061] Fig.31 It shows that Fig.30 0 is a cross-sectional view of an example in which the drive substrate shown in FIG. 1 is implemented as a portion of a display panel of a flexible substrate.

[0062] Fig.32 is a cross-sectional view illustrating an example of a portion of a display panel in which a pad contact hole and a rear contact hole are filled with conductive ink.

[0063] Fig.33 It shows that Fig.32 0 is a cross-sectional view of an example in which the drive substrate shown in FIG. 1 is implemented as a portion of a display panel of a flexible substrate.

[0064] Fig.34 It is shown that the Fig.33 FIG. 4 is a cross-sectional view of an example of a portion of a display panel in which an inorganic film in a flexible substrate is removed.

[0065] Fig.35 is a cross-sectional view of a portion of a display panel in which a pad electrode and a driving substrate are electrically connected to each other by a conductive ink filling a rear contact hole according to some embodiments.

[0066] Fig.36 is a cross-sectional view of an example of a portion of a display panel in which a flexible substrate of a drive substrate includes a single polymer layer.

[0067] Fig.37 is a cross-sectional view illustrating an example of a portion of a display panel in which a pad contact hole and a rear contact hole are filled with conductive ink. DETAILED DESCRIPTION

[0068] Aspects of some embodiments of the present disclosure will now be described more fully below with reference to the accompanying drawings, in which aspects of some embodiments of the present disclosure are shown. However, the present invention may be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. Specifically, these embodiments are provided so that the present disclosure will be more thorough and complete, and will more fully convey the scope of the embodiments according to the present disclosure to those skilled in the art.

[0069] It will also be understood that when a layer is referred to as being 'on' another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Like reference numerals refer to like components throughout the specification.

[0070] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the teachings of the present invention, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0071] The features of each of the various embodiments of the present disclosure may be partially or completely combined with each other, and may be technically coordinated with each other in various ways, and the various embodiments may be implemented independently of each other, or may be implemented together in association with each other.

[0072] Hereinafter, aspects of some embodiments will be described in more detail with reference to the accompanying drawings.

[0073] Figure 1 is a plan view of a display device according to a comparative example. Figure 2 is a cross-sectional view of a display device according to a comparative example.

[0074] exist Figure 1 In the plan view of FIG. 1 , for the convenience of explanation, the upper side, the lower side, the left side, and the right side are defined. The up-down direction refers to the vertical direction or the column direction, and is defined as the first direction DR1. The left-right direction refers to the horizontal direction or the row direction, and is defined as the second direction DR2. The vertical direction is defined as the third direction DR3.

[0075] refer to Figure 1 and Figure 2 , the display device 1 according to the comparative example may include a display panel 10. The display panel 10 may include a substrate SUB including a flexible polymer material such as polyimide. Therefore, the display panel 10 may be curved, bent, folded, or rolled.

[0076] The display panel 10 may include a main region MR, a bending region BR extending from one side of the main region MR, and an auxiliary region SR extending from one side of the bending region BR. The bending region BR may be located between the main region MR and the auxiliary region SR, and may be bent at a certain curvature (e.g., a set or predetermined curvature). As the bending region BR is bent, the auxiliary region SR may overlap with the main region MR in a thickness direction (e.g., a third direction DR3).

[0077] In the display panel 10, a display area DA displaying an image may be located inside the main region MR. In the display panel 10, a non-display area NDA not displaying an image may be a remaining area other than the display area DA. When viewed from the top, the main region MR may have a shape substantially similar to the appearance of the display device 1. The main region MR may be a flat area located in one plane.

[0078] The display area DA of the display panel 10 may be located at the center of the main region MR. The display area DA may include a plurality of pixels. The display area DA may have a rectangular shape or a rectangular shape with rounded corners.

[0079] In the main region MR, the non-display area NDA may be located around the display area DA. In the main region MR, the non-display area NDA may extend from the outer boundary of the display area DA to the edge of the display panel 10. In the non-display area NDA of the main region MR, a signal line or a driving circuit for applying a signal to the display area DA may be arranged.

[0080] The bending region BR may be connected to one end of the main region MR. The width of the bending region BR may be smaller than the width of the main region MR (the width of the shorter side). In the bending region BR, the display panel 10 may bend downward with a curvature in the thickness direction, that is, in the direction away from the display surface.

[0081] The auxiliary region SR may extend from one end of the bending region BR in a direction parallel to the main region MR. The auxiliary region SR may overlap with the main region MR in the thickness direction of the display panel 10. The auxiliary region SR may overlap with the non-display area NDA at an edge of the main region MR, and may also overlap with the display area DA of the main region MR.

[0082] The driver chip 20 may be located on the auxiliary region SR of the display panel 10. The driver chip 20 may include an integrated circuit for driving the display panel 10. The driver chip 20 may be mounted on the display panel 10 in the auxiliary region SR.

[0083] The driver chip 20 may be attached to the display panel 10 through an anisotropic conductive film, or attached to the display panel 10 through ultrasonic bonding.

[0084] The pad area may be located at an end of the auxiliary region SR of the display panel 10. The display panel 10 may be connected to the display driving substrate 30 through the pad area. The display driving substrate 30 may be a flexible printed circuit board or a film.

[0085] A plurality of signal lines may be located in the auxiliary region SR, the bending region BR, and the main region MR. The signal line may extend from the main region MR to a pad region of the auxiliary region SR via the bending region BR.

[0086] As mentioned above, in Figure 1 and Figure 2In the display device 1 according to the comparative example shown in , as the bending area BR of the display panel 10 is bent, the auxiliary area SR where the pad area and the driver chip 20 are located is placed so that it faces downward in the thickness direction. In order to reduce the width of the non-display area NDA other than the display area DA of the display device 1 according to the comparative example (i.e., the border width or the width of the dead zone), it is necessary to increase the curvature of the bending area BR. However, as the curvature of the bending area BR increases, defects are more likely to occur on the line. For this reason, there is a limitation in increasing the curvature of the bending area BR in order to reduce the width of the non-display area NDA (i.e., the border width or the width of the dead zone).

[0087] In view of the above, according to some embodiments of the present disclosure, the display panel 10 does not include a curved bending area, and the pad area 430 (see Figure 4 ) is connected to a drive substrate 410 (see Figure 4 ) driver circuit, so that Figure 1 and Figure 2 Compared with the comparative example shown in , the width of the non-display area NDA (ie, the width of the frame or the width of the dead zone) can be reduced. Figures 3 to 37 A display device 1 according to some embodiments of the present disclosure is described in detail.

[0088] Figure 3 is a plan view of a display device 1 according to some embodiments of the present disclosure. Figure 4 is a cross-sectional view of a display device 1 according to some embodiments of the present disclosure.

[0089] refer to Figure 3 and Figure 4 , the display device 1 can display a moving image or a still image. The display device 1 can be applied to portable electronic devices such as mobile phones, smart phones, tablet PCs, smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs), as well as various products such as televisions, notebooks, monitors, billboards, and Internet of Things devices. Examples of the display device 1 may include an organic light-emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light-emitting display device, a micro-LED display device, and the like. In the following description, an organic light-emitting display device will be described as an example of the display device 1. However, it should be understood that the embodiments according to the present disclosure are not limited thereto.

[0090] The display device 1 may include a display panel 10. The display panel 10 may include a substrate SUB including a flexible polymer material such as polyimide. Therefore, the display panel 10 may be curved, bent, folded, or rolled.

[0091] The display panel 10 includes a display area DA and a non-display area NDA. The non-display area NDA may refer to other areas except the display area DA. The pad area 430 exposed on the rear side of the display panel 10 is located in the non-display area NDA. The pad area 430 is exposed through a portion of the rear surface of the display panel 10 in the non-display area NDA. The pad area 430 may be connected to the drive substrate 410 arranged to face the rear surface of the display panel 10. The pad area 430 of the display panel 10 may include a pad electrode 922 (see Fig. 9 ). The pad electrode 922 may be formed by, for example, conductive ink 1211 (see Fig.12 ) (eg, metal ink) is electrically connected to pads (eg, bumps) of the drive substrate 410 .

[0092] In the non-display area NDA, a signal line or a driver circuit for applying a signal to the display area DA may be arranged The signal line may extend from the display area DA to the pad area 430 via the non-display area NDA.

[0093] The driver chip 411 may be located on the drive substrate 410. The driver chip 411 may include an integrated circuit for driving the display panel 10. The driver chip 411 may be an integrated circuit in the form of a COP (chip on plastic). In this case, the drive substrate 410 may include a plastic substrate (or a flexible substrate) containing a flexible polymer material such as polyimide. The driver chip 411 may be an integrated circuit in the form of a COF (chip on film). In this case, the drive substrate 410 may be a substrate in the form of a film such as a flexible printed circuit board (FPCB). That is, the drive substrate 410 of the display device 1 according to some embodiments described herein may be a plastic substrate (or a flexible substrate) containing a flexible polymer material such as polyimide or a film-type substrate such as a flexible printed circuit board (FPCB).

[0094] The lead pad area connected to the main board 420 may be located at the end of the drive substrate 410. The drive substrate 410 may be connected to the main board 420 through the lead pad area 430 located at the end of the drive substrate 410. A processor (i.e., a host or controller) that controls the overall operation of the display device 1, a memory, a touch driver circuit, and a power supply circuit may be located on the main board 420.

[0095] Thus, in the display device 1 according to some embodiments, the display panel 10 does not include a bending area, and is connected to a driver circuit such as the driving substrate 410 through the rear surface. Figure 1 and Figure 2 The display device 1 can reduce the width of the non-display area NDA (ie, the border width or the width of the dead zone) as compared to the comparative example shown in FIG.

[0096] Figure 5 is a cross-sectional view illustrating a structure of a portion of a display area DA of a display panel 10 according to some embodiments.

[0097] In reference Figure 5 In the description of FIG. 1 , an element located “on” the display panel 10 may mean an element located on the front side of the display panel 10 in the third direction DR3. The front side of the display panel 10 may refer to a side on which a light emitting element included in the display panel 10 emits light to display an image.

[0098] refer to Figure 5 , the display panel 10 uses a flexible plastic substrate as a base substrate. The substrate SUB may be made of an insulating material such as a polymer resin. For example, the substrate SUB may be made of polyimide. Therefore, the substrate SUB may be bent, folded, or curled. The substrate SUB may include a multilayer including a first substrate SUB1, a second substrate SUB2, and a barrier film BR located between the first substrate SUB1 and the second substrate SUB2. For example, the substrate SUB of the display panel 10 includes a first substrate SUB1, a barrier film BR located on the first substrate SUB1, and a second substrate SUB2 located on the barrier film BR. The first substrate SUB1 and the second substrate SUB2 may include a flexible material such as polyimide.

[0099] The barrier film BR is a film for protecting the thin film transistor of the thin film transistor layer TFTL and the emission layer 172 of the emission material layer EML from external moisture. The barrier film BR may be formed of a plurality of inorganic films 911 (refer to Fig. 9 For example, the barrier film BR may be composed of a plurality of layers in which one or more inorganic films 911 of a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked on each other.

[0100] A thin film transistor layer TFTL including a thin film transistor, an emission material layer EML including a light emitting element LEL, an encapsulation layer TFEL encapsulating the light emitting element LEL, and a touch detection unit TDU may be sequentially stacked on the second substrate SUB2. According to some embodiments, Figure 5At least some of the layers shown in the figure may not be located in the non-display area NDA of the display panel 10. Since the thin film transistor layer TFTL, the emission material layer EML, and the encapsulation layer TFEL are responsible for displaying an image, they may be referred to as a display unit DU, but the name is not limited thereto.

[0101] The thin film transistor of the pixel driver circuit for driving each pixel is located on the second substrate SUB2. Figure 5 A first thin film transistor TFT1 among the thin film transistors of the pixel driver circuit is shown. For example, the first thin film transistor TFT1 may be used as a driving transistor in the pixel driver circuit.

[0102] The first thin film transistor TFT1 may include a first active layer ACT1 and a first gate electrode G1. The first active layer ACT1 may include polycrystalline silicon, single crystalline silicon, low temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor.

[0103] The first active layer ACT1 may include a first source region S1, a first channel region, and a first drain region D1. The first channel region may overlap with the first gate electrode G1 in a third direction DR3 that is a thickness direction of the substrate SUB. The first source region S1 may be located on one side of the first active layer ACT1, and the first drain region D1 may be located on a side of the first active layer ACT1 opposite to the one side. The first source region S1 and the first drain region D1 may not overlap with the first gate electrode G1 in the third direction DR3. The first source region S1 and the first drain region D1 may have conductivity by doping a silicon semiconductor or an oxide semiconductor with ions or impurities.

[0104] The gate insulator 130 may be located on the first active layer ACT1 of the first thin film transistor TFT1. The gate insulator 130 may be formed of an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0105] The first gate electrode G1 of the first thin film transistor TFT1 and the first capacitor electrode CAE1 may be located on the gate insulator 130. The first gate electrode G1 may overlap the first active layer ACT1 in the third direction DR3. Figure 5 The first gate electrode G1 and the first capacitor electrode CAE1 are spaced apart from each other in the example shown in , but the first gate electrode G1 and the first capacitor electrode CAE1 may be connected to each other. The first gate electrode G1 and the first capacitor electrode CAE1 may be composed of a single layer or a plurality of layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0106] The interlayer dielectric film 140 may be located on the first gate electrode G1 of the first thin film transistor TFT1 and the first capacitor electrode CAE1. For example, the first interlayer dielectric film 141 may be located on the first gate electrode G1 of the first thin film transistor TFT1 and the first capacitor electrode CAE1. The first interlayer dielectric film 141 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer dielectric film 141 may be made of a plurality of inorganic films.

[0107] The second capacitor electrode CAE2 may be located on the first interlayer dielectric film 141. The second capacitor electrode CAE2 may overlap with the first capacitor electrode CAE1 of the first thin film transistor TFT1 in the third direction DR3. When the first capacitor electrode CAE1 is connected to the first gate electrode G1, the second capacitor electrode CAE2 may overlap with the first gate electrode G1 in the third direction DR3. Because the first interlayer dielectric film 141 has a dielectric constant (e.g., a set or predetermined dielectric constant), a capacitor may be formed by the first capacitor electrode CAE1, the second capacitor electrode CAE2, and the first interlayer dielectric film 141 located therebetween. The second capacitor electrode CAE2 may be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0108] The second interlayer dielectric film 142 may be positioned over the second capacitor electrode CAE2. The second interlayer dielectric film 142 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer dielectric film 142 may be made of a plurality of inorganic films.

[0109] The first anode connection electrode ANDE1 may be located on the second interlayer dielectric film 142. The first anode connection electrode ANDE1 may be connected to the first drain region D1 of the first thin film transistor TFT1 through a first connection contact hole ANCT1 penetrating the gate insulator 130, the first interlayer dielectric film 141, and the second interlayer dielectric film 142. The first anode connection electrode ANDE1 may be composed of a single layer or a plurality of layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0110] The first planarization film 160 may be positioned across the first anode connection electrode ANDE1 for providing a flat surface across a height difference due to the first thin film transistor TFT1. The first planarization film 160 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0111] The second anode connection electrode ANDE2 may be located on the first planarization film 160. The second anode connection electrode ANDE2 may be connected to the first anode connection electrode ANDE1 through a second connection contact hole ANCT2 penetrating the first planarization film 160. The second anode connection electrode ANDE2 may be composed of a single layer or a plurality of layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0112] The second planarization film 180 may be located on the second anode connection electrode ANDE2. The second planarization film 180 may be formed as an organic layer such as acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin.

[0113] The light emitting elements LEL and the bank 190 may be located on the second planarization film 180. Each of the light emitting elements LEL includes a pixel electrode 171, an emission layer 172, and a common electrode 173.

[0114] The pixel electrode 171 may be located on the second planarization film 180. The pixel electrode 171 may be connected to the second anode connection electrode ANDE2 through a third connection contact hole ANCT3 penetrating the second planarization film 180.

[0115] In a top emission structure in which light is emitted from the emission layer 172 toward the common electrode 173, the pixel electrode 171 may be made of a metal material having high reflectivity such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0116] The bank 190 can separate the pixel electrode 171 on the second planarization film 180 to define a light emitting region, such as an emission region, of each pixel. In the emission regions EA1 and EA2, the pixel electrode 171, the emission layer 172, and the common electrode 173 are sequentially stacked on each other so that holes from the pixel electrode 171 and electrons from the common electrode 173 are recombined with each other in the emission layer 172 to emit light.

[0117] exist Figure 5In the example shown in , the embankment 190 defines a first emission area EA1 of a first pixel and a second emission area EA2 of a second pixel adjacent to each other. The embankment 190 may be arranged to cover the edge of the pixel electrode 171. The embankment 190 may be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin. The embankment 190 may also be referred to as a pixel defining layer. According to some embodiments, the display panel 10 includes a plurality of pixels including a first pixel, a second pixel, and a third pixel. For example, the first pixel may include a first emission area EA1 that emits a first color, the second pixel may include a second emission area EA2 that emits a second color, and the third pixel may include a third emission area that emits a third color. According to some embodiments, the plurality of pixels may also include a fourth pixel, and the fourth pixel may include a fourth emission area that emits a fourth color.

[0118] The emission layer 172 may be located on the pixel electrode 171 and the bank 190. The emission layer 172 may include an organic material to emit light of a specific color. For example, the emission layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0119] The common electrode 173 may be located on the emission layer 172. The common electrode 173 may be disposed to cover the emission layer 172. The common electrode 173 may be a common layer commonly arranged across the first emission region EA1, the second emission region EA2, and the third emission region. A covering layer may be formed on the common electrode 173.

[0120] In a top-emitting organic light-emitting diode, the common electrode 173 may be formed of a transparent conductive material (TCP) capable of transmitting light such as ITO and IZO or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), and an alloy of magnesium (Mg) and silver (Ag). When the common electrode 173 is formed of a semi-transmissive metal material, light extraction efficiency may be improved by using a microcavity.

[0121] The spacer 191 may be located on the bank 190. The spacer 191 may support a mask during a process of manufacturing the emission layer 172. The spacer 191 may be formed of an organic layer such as acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin.

[0122] The encapsulation layer TFEL may be located on the common electrode 173. The encapsulation layer TFEL includes at least one inorganic film to prevent oxygen or moisture from penetrating into the emission material layer EML. In addition, the encapsulation layer TFEL includes at least one organic layer to protect the emission material layer EML from impurities such as dust. For example, the encapsulation layer TFEL includes a first inorganic encapsulation film TFE1, an organic encapsulation film TFE2, and a second inorganic encapsulation film TFE3.

[0123] The first inorganic encapsulation film TFE1 may be located on the common electrode 173, the organic encapsulation film TFE2 may be located on the first inorganic encapsulation film TFE1, and the second inorganic encapsulation film TFE3 may be located on the organic encapsulation film TFE2. The first inorganic encapsulation film TFE1 and the second inorganic encapsulation film TFE3 may be composed of a plurality of layers in which one or more inorganic layers of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The organic encapsulation film TFE2 may be an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc.

[0124] The touch detection unit TDU may be located on the encapsulation layer TFEL. The touch detection unit TDU may be a mutual capacitance touch sensor or a self capacitance touch sensor. Figure 5 The mutual capacitance touch sensor is shown in FIG. 1 , but the present disclosure is not limited thereto. The touch detection unit TDU includes a first touch insulating film TINS1 , a bridge electrode BE1 , a second touch insulating film TINS2 , a driving electrode TE, a sensing electrode RE, and a third touch insulating film TINS3 .

[0125] The first touch insulating film TINS1 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0126] The bridge electrode BE1 may be located on the first touch insulating film TINS1 and may be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0127] The second touch insulating film TINS2 is arranged throughout the bridge electrode BE1. The second touch insulating film TINS2 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Alternatively, the second touch insulating film TINS2 may be formed of an organic layer such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0128] The driving electrode TE and the sensing electrode RE may be located on the second touch insulating film TINS2. The driving electrode TE and the sensing electrode RE may be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0129] The driving electrode TE and the sensing electrode RE may overlap the bridge electrode BE1 in the third direction DR3. The driving electrode TE may be connected to the bridge electrode BE1 through a touch contact hole TCNT1 passing through the first touch insulating film TINS1.

[0130] The third touch insulating film TINS3 is formed over the driving electrode TE and the sensing electrode RE. The third touch insulating film TINS3 may provide a flat surface over the height difference formed by the driving electrode TE, the sensing electrode RE, and the bridge electrode BE1. The third touch insulating film TINS3 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0131] Figure 6 is a plan view showing a portion of a non-display area NDA of a display panel 10 according to some embodiments. For example, Figure 6 An example of a non-display area NDA around the pad area 430 may be shown.

[0132] refer to Figure 6 In the non-display area NDA of the display panel 10 according to some embodiments, a signal line 611 and a power line 612 for driving pixels in the display area DA may be arranged. In addition, a touch connection line 613 for driving the touch detection unit TDU may be located in the non-display area NDA. The touch connection line 613 may be connected to a touch electrode (e.g., Figure 5 The signal line 611, the power line 612, and the touch connection line 613 may extend to the pad area 430. The pad area 430 may be connected to a driver circuit such as the drive substrate 410 through the rear surface of the display panel 10.

[0133] According to some embodiments, a static electricity line 614 for preventing static electricity may be further located in the non-display area NDA, and the static electricity line 614 may extend to the pad area 430 .

[0134] Here, the pad region 430 of the display panel 10 includes a plurality of pads PD connected to the drive substrate 410 through the rear side of the display panel 10. The pads PD may include a signal pad electrically connected to the signal line 611, a power pad electrically connected to the power line 612, an electrostatic pad electrically connected to the electrostatic line 614, and a touch drive pad electrically connected to the touch connection line 613.

[0135] According to some embodiments, the signal line 611 may include a gate fan-out line connected to a gate line of the display area DA, a data fan-out line connected to a data line of the display area DA, or an emission fan-out line connected to an emission signal line of the display area DA. These signal lines 611 may be located in the same layer as the first anode connection electrode ANDE1 or the second anode connection electrode ANDE2 of the display area DA.

[0136] According to some embodiments, the power line 612 may include a high level voltage supply line ELVDD and a low level voltage supply line ELVSS as lines for supplying driving power to the pixels of the display area DA. Such a power line 612 may be located in the same layer as the first anode connection electrode ANDE1 or the second anode connection electrode ANDE2 of the display area DA.

[0137] exist Figure 6 In FIG. 6 , a solid line 601 indicates a boundary at a corner of the display panel 10 . Figure 6 In FIG. 6 , a solid line 602 is an imaginary line indicating a boundary between the non-display area NDA and the display area DA of the display panel 10. Figure 6 In the figure, the solid line 603 represents the inorganic films TFE1 and TFE3 of the encapsulation layer TFEL of the display panel 10 (see Figure 5 As shown in the figure, the signal line 611 and the power line 611 for driving the pixels of the display area DA can be formed on the inorganic films TFE1 and TFE3 (see Figure 5 ) extends along the non-display area NDA to the pad area 430. That is, the signal line 611 and the power line 612 for driving the pixels of the display area DA are not located in the inorganic films TFE1 and TFE3 of the encapsulation layer TFEL (see Figure 5 ) is located outside the inorganic packaging area.

[0138] Figure 7 is a flowchart for explaining a method of manufacturing the display device 1 according to some embodiments of the present disclosure. Figure 8 is a cross-sectional view for explaining a process of forming the pad contact hole 810 using the hard mask HM. Fig. 9 8 is a cross-sectional view for explaining a process of forming a pad electrode 922 in a pad contact hole 810 . Fig.10 is a cross-sectional view for explaining a process of forming a rear contact hole 1010 to expose a portion of the pad contact hole 810 from the rear surface of the display panel 10 . Fig.11 is a cross-sectional view for explaining a process of bonding the driving substrate 410 to the rear contact hole 1010 . Fig.12 1 is a cross-sectional view for explaining a process of filling the pad contact hole 810 with the conductive ink 1211 (also referred to as upper conductive ink 1211 ) covering the pad electrode 922 .

[0139] Figure 7 At least some of the manufacturing processes shown in can be omitted. Figure 7 Before or after each of the manufacturing processes shown in , additional manufacturing processes described herein or known in the art may be performed.

[0140] In the following, we will combine Figures 8 to 12 refer to Figure 7 A method of manufacturing the display device 1 according to some embodiments is described.

[0141] refer to Figure 7 In step 710, a substrate SUB is prepared by sequentially stacking a first substrate SUB1, a barrier film BR, and a second substrate SUB2. The first substrate SUB1 and the second substrate SUB2 may include a flexible material such as polyimide. The barrier film BR may be composed of a plurality of layers in which one or more inorganic layers of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked on each other.

[0142] refer to Figure 7 and Figure 8 At step 720, a patterned hard mask HM is formed on the second substrate SUB2, and a pad contact hole 810 of the pad area 430 is formed at a portion of the non-display area NDA using the hard mask HM as an etching mask. The pad contact hole 810 penetrates the second substrate SUB2 and the barrier film BR to expose a portion of the first substrate SUB1 on the front side of the substrate SUB. The hard mask HM may include ITO, IZO, IGZO, AlO x 、ZrO x or HfO x .

[0143] refer to Figure 7 and Fig. 9 In step 730, a thin film transistor layer TFTL, an emission material layer EML, an encapsulation layer TFEL, and a touch detection unit TDU are sequentially formed. Step S730 is performed after the process of forming the pad contact hole 810 of the pad area 430 using the hard mask HM, and step S730 includes a backplane process for forming the thin film transistor layer TFTL and a deposition process for the emission material layer EML. In step 730, when the thin film transistor layer TFTL is formed, a signal line 611, a power line 612, and a pad electrode 922 for driving the pixels of the display area DA may be formed together. Fig. 9 As shown in , the pad connection line 921 can be connected to the pad electrode 922, and the pad connection line 921 can be one of a signal line, a power line, an electrostatic line, and a touch connection line. The pad electrode 922 and the pad connection line 921 can be formed in the same layer. The pad electrode 922 and the pad connection line 921 can be located in the same layer as the first anode connection electrode ANDE1 or the second anode connection electrode ANDE2 in the display area DA.

[0144] The inner peripheral surface of the pad contact hole 810 is covered by at least one inorganic film 911 deposited in the backplane process. As a portion of the inorganic film 911 located inside the pad contact hole 810 is removed, a middle hole MH is formed through which a portion of the first substrate SUB1 is exposed from the front side of the substrate SUB. For example, the inorganic film 911 (e.g., the first inorganic film 911) is located inside the pad contact hole 810, and the inorganic film 911 forms a middle hole MH, which has a second width smaller than the first width of the pad contact hole 810 and exposes a portion of the first substrate SUB1 on the front side of the substrate SUB. Therefore, the internal space of the pad contact hole 810 may have a stepped shape having a width that decreases toward the bottom. Here, the inner peripheral surface of the pad contact hole 810 may refer to the side surface of the second substrate SUB2 located inside the pad contact hole 810 and the side surface of the barrier film BR.

[0145] According to some embodiments, pad electrode 922 extends from signal line 611 or power line 612 and contacts inorganic film 911 on the inner circumferential surface of pad contact hole 810 and the inner circumferential surface of middle hole MH formed by patterning inorganic film 911 .

[0146] refer to Figure 7 and Fig.10 In step 740, the first substrate SUB1 is etched to form a rear contact hole 1010 that exposes a portion of the pad contact hole 810 from the rear surface of the display panel 10 (e.g., the first substrate SUB1 is etched to form a rear contact hole 1010 that is aligned with the pad contact hole 810). The process of forming the rear contact hole 1010 may adopt a laser process or a chemical etching process. The rear contact hole 1010 may be a single hole that exposes a plurality of pad contact holes 810 from the rear surface of the display panel 10.

[0147] refer to Figure 7 and Fig.11 In step 750, the drive substrate 410 may be bonded to the rear contact hole 1010. For example, the drive substrate 410 may be a film-type substrate 410 such as a flexible printed circuit board (FPCB). In this case, an adhesive 1120 such as a pressure-sensitive adhesive (PSA) and an optically clear adhesive (OCA) may be used to attach the protrusions of the pads 1110 of the drive substrate 410 to the rear contact holes 1010. It should be noted that the drive substrate 410 is not limited to a film-type substrate SUB such as a flexible printed circuit board (FPCB), and may be a flexible substrate for mounting an integrated circuit such as a COP (chip on plastic). For example, the flexible substrate may be a substrate formed via the same process as the substrate SUB of the display panel 10. For example, as with reference Figure 8 Similar to the substrate SUB of the display panel 10 described above, the drive substrate 410 may include a first substrate DSUB1 (see Fig.16 ), barrier film DBR (see Fig.16 ) and the second substrate DSUB2 (see Fig.16 ) are sequentially stacked on each other substrates DSUB (see Fig.16 ).

[0148] refer to Figure 7 and Fig.12 In step 760, the inside of the pad contact hole 810 is filled with a conductive ink 1211 (e.g., metal ink), and the conductive ink 1211 may be covered with a protective resin 1221. The conductive ink 1211 may contact the pad electrode 922 inside the pad contact hole 810, and may contact the pad 1110 of the drive substrate 410 through the rear contact hole 1010. Therefore, the drive substrate 410 and the pad electrode 922 located on the rear side of the substrate SUB may be electrically connected to each other through the conductive ink 1211.

[0149] In the following, reference will be made to Figures 13 to 37 The pad area 430 according to some embodiments is described in more detail. The pad area 430 may include a plurality of pads PD. The plurality of pads PD may include a signal pad electrically connected to a signal line 611 for driving pixels in the display area DA, a power pad electrically connected to a power line, an electrostatic pad electrically connected to an electrostatic line 614, and a touch driving pad electrically connected to a touch connection line 613. Therefore, referring to Figures 13 to 37 The described pad PD may mean one of a signal pad, a power pad, an electrostatic pad, and a touch drive pad. Figures 13 to 37 One pad PD included in the pad region 430 is illustrated, but the pad PD shown in the drawing may be one of a signal pad, a power pad, an electrostatic pad, and a touch driving pad.

[0150] Fig.13 is a cross-sectional view illustrating a structure of a portion of a non-display area NDA of a display panel 10 according to some embodiments. Fig.14 A specific diagram of a portion of the display panel 10 is shown. Fig.13 A cross-sectional view of the pad area 430 is shown in FIG.

[0151] refer to Fig.13 and Fig.14 , the display panel 10 according to some embodiments may include a substrate SUB, and the substrate SUB may be a flexible substrate in which a first substrate SUB1, a barrier film BR, and a second substrate SUB2 are sequentially stacked on each other.

[0152] According to some embodiments, the display panel 10 includes a display area DA and a non-display area NDA. Therefore, the substrate SUB may be divided into the display area DA and the non-display area NDA.

[0153] As reference Figure 5 As described, the thin film transistor layer TFTL, the emission material layer EML, the encapsulation layer TFEL and the touch detection unit TDU are sequentially formed in the display area DA. A planarization layer FL such as inkjet resin may be located on the touch detection unit TDU, and a polarization layer POL may be located on the planarization layer FL.

[0154] The non-display area NDA may include: a fan-out wiring area 1311, in which a signal line 611 and a power line 612 are located; a dam area 1312, which is located on the outside of the fan-out wiring area 1311 and includes at least one dam DM; an inorganic encapsulation area 1313, in which only an inorganic encapsulation film is formed; and an outermost area 1314, which is located on the outside of the inorganic encapsulation area 1313.

[0155] According to some embodiments, the pad region 430 and the crack prevention dam CDM may be located in the outermost region 1314. The signal line 611 and the power line 612 located in the fan-out wiring region 1311 may extend to the pad region 430 located in the outermost region 1314 via the dam region 1312 and the inorganic encapsulation region 1313. The outermost region 1314 of the non-display area NDA may be referred to as a crack prevention region because the crack prevention dam CDM is located, or may be referred to as an unencapsulated region because no encapsulation layer is formed. However, it should be understood that the present disclosure is not limited thereto.

[0156] In the outermost region 1314, no encapsulation layer TFEL, planarization layer FL, or polarization layer POL is located, and a pad region 430 may be located. The pad region 430 may be electrically connected to the drive substrate 410 located on the rear side of the display panel 10 using the conductive ink 1211 in at least one of the pad contact hole 810 and the rear contact hole 1010. It should be noted that in some embodiments, the pad region 430 may not be located in the outermost region 1314, but may be located in the inorganic encapsulation region 1313 (see Fig.17 ).

[0157] According to some embodiments, pad region 430 may be located in outermost region 1314 of non-display area NDA where encapsulation layer TFEL is not formed. Pad region 430 is electrically connected to driving substrate 410 using conductive ink 1211 (eg, upper conductive ink 1211) in pad contact hole 810.

[0158] In the following, reference will be made to Fig.14 Features of pad region 430 are described in greater detail.

[0159] refer to Fig.14 Each of the plurality of pads PD included in the pad region 430 includes a pad contact hole 810 formed by etching the second substrate SUB2 and the barrier film BR and a rear contact hole 1010 aligned with the pad contact hole 810 and formed by etching the first substrate SUB1. The drive substrate 410 is bonded to the rear contact hole 1010 using an adhesive 1120.

[0160] According to some embodiments, the first inorganic film 911 of each of the plurality of pads PD and the pad electrode 922 covering the first inorganic film 911 are located on the inner circumferential surface of the pad contact hole 810. The first inorganic film 911 is aligned with the inorganic films 130, 141, and 142 included in the thin film transistor layer TFTL (see Figure 5 ) are located in the same layer. That is, the first inorganic film 911 covering the pad contact hole 810 may be formed during the backplane process of forming the thin film transistor layer TFTL. The first inorganic film 911 forms a middle hole MH connecting the pad contact hole 810 with the back contact hole 1010. The middle hole MH may be formed during the backplane process of forming the thin film transistor layer TFTL.

[0161] According to some embodiments, the middle hole MH may be located at the center of the pad contact hole 810. The diameter of the middle hole MH may be smaller than the diameter of the pad contact hole 810.

[0162] According to some embodiments, the pad electrode 922 may be located in the same layer as a source electrode or a drain electrode of a thin film transistor included in the thin film transistor layer TFTL. For example, the pad electrode 922 may be located in the same layer as the source electrode or the drain electrode of the thin film transistor included in the thin film transistor layer TFTL. Figure 5 The first anode connection electrode ANDE1 or the second anode connection electrode ANDE2 described is located in the same layer. The pad electrode 922 may cover the entirety or at least a portion of the middle hole MH which is an opening of the first inorganic film 911 .

[0163] According to some embodiments, the inside of pad contact hole 810 may be filled with conductive ink 1211 . Conductive ink 1211 may cover a portion of pad electrode 922 and middle hole MH. Protective resin 1221 may be located on conductive ink 1211 .

[0164] According to some embodiments, the drive substrate 410 may be bonded to the bottom of the rear contact hole 1010. The drive substrate 410 according to some embodiments may include a substrate 1410 in the form of a flexible printed circuit board (FPCB) and a driver chip 411 in the form of a chip on film (COF) located on the substrate 1410. For example, the drive substrate 410 may include the substrate 1410 and a pad 1411 (e.g., a bump) located on the substrate 1410. The pad 1411 of the drive substrate 410 is directly bonded to the bottom of the rear contact hole 1010 through the adhesive 1120, and thus may be in contact with the middle hole MH. The pad 1411 of the drive substrate 410 may be electrically connected to the pad electrode 922 through the conductive ink 1211 covering the middle hole MH and the pad electrode 922.

[0165] Here, the drive substrate 410 is not limited to the FPCB. For example, the drive substrate 410 may be a flexible substrate (eg, Fig.16 The substrate DSUB in the.

[0166] Fig.15 and Fig.16 1 shows an embodiment in which the drive substrate 410 is implemented as a flexible substrate that is the same as or similar to the substrate SUB of the display panel 10. For example, Fig.15 It shows that Fig.13 4 is a view of an example in which the drive substrate 410 shown in FIG. 4 is implemented as a flexible substrate. Fig.16 is a part of the display panel 10 (for example, Fig.15 8 is a cross-sectional view of a pad contact hole 810 shown in FIG.

[0167] Except that the driving substrate 410 is implemented as a flexible substrate that is the same as or similar to the substrate SUB of the display panel 10, Fig.15 and Fig.16 The embodiment shown is similar to Fig.13 and Fig.14 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0168] refer to Fig.15 and Fig.16, the drive substrate 410 according to some embodiments may include a substrate DSUB and a driver chip 411 located on the substrate DSUB. The substrate DSUB of the drive substrate 410 may be a flexible substrate substantially the same as the substrate SUB of the display panel 10. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be a substrate SUB and DSUB generated from a single mother substrate. The substrate DSUB of the drive substrate 410 and the substrate SUB of the display panel 10 may be separated via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0169] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The first substrate DSUB1 of the drive substrate 410 may be formed via the same process as the first substrate SUB1 of the display panel 10. The barrier film DBR of the drive substrate 410 may be formed via the same process as the barrier film BR of the display panel 10. The second substrate DSUB2 of the drive substrate 410 may be formed via the same process as the second substrate SUB2 of the display panel 10.

[0170] According to some embodiments of the present disclosure, the inorganic film 1611 and the metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and they may be respectively made of the same material via the same process as the first inorganic film 911 and the pad electrode 922 included in the display panel 10. According to some embodiments, the pad 1621 of the drive substrate 410 is an electrode extending from the lead and may be directly bonded to the bottom of the rear contact hole 1010 by the adhesive 1120. The pad 1621 of the drive substrate 410 may be electrically connected to the pad electrode 922 by the conductive ink 1211 covering the middle hole MH and the pad electrode 922.

[0171] Fig.17 is a cross-sectional view of a display panel 10 in which a pad electrode 922 and a driving substrate 410 are electrically connected to each other by a conductive ink 1212 (also referred to as a lower conductive ink 1212 ) filling a rear contact hole 1010 , according to some embodiments. Fig.18 is a cross-sectional view of a portion of the display panel 10, specifically, Fig.17 8 is a cross-sectional view of a pad contact hole 810 shown in FIG.

[0172] In addition to the back contact hole 1010 being filled with the lower conductive ink 1212, Fig.17 The embodiment shown is similar to Fig.13 and Fig.14The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0173] refer to Fig.17 and Fig.18 , the driving substrate 410 according to some embodiments may include a substrate 1410 in the form of a flexible printed circuit board (FPCB) and a driver chip in the form of a chip on film (COF) located on the substrate 1410 .

[0174] According to some embodiments, the pad region 430 may be located in the non-display area NDA and may be located where the encapsulation layer TFEL is formed. For example, the pad region 430 may be located in the inorganic encapsulation region 1313 where only the inorganic encapsulation film is formed.

[0175] According to some embodiments, each of the plurality of pads PD may be formed of a pad contact hole 810 formed by etching the second substrate SUB2 and the barrier film BR, a first inorganic film 911 and a pad electrode 922 sequentially stacked on an inner peripheral surface of the pad contact hole 810, and an etched portion of the first substrate SUB1 aligned with the pad contact hole 810. The pad 1411 of the drive substrate 410 may include a rear contact hole 1010 bonded to the bottom surface.

[0176] According to some embodiments, first inorganic film 911 forms middle hole MH connecting pad contact hole 810 with back contact hole 1010. Pad electrode 922 is arranged to at least partially cover middle hole MH.

[0177] According to some embodiments, the pad 1411 of the driving substrate 410 may be electrically connected to the pad electrode 922 covering the middle hole MH through the lower conductive ink 1212 .

[0178] According to some embodiments, the driving substrate 410 may include a pad 1411 bonded to the bottom of the rear contact hole 1010, a pad hole penetrating the portion of the pad 1411 aligned with the middle hole MH in the thickness direction, a lower conductive ink 1212 covering the inner peripheral surface of the pad hole, and a protective resin 1222 covering the lower conductive ink 1212.

[0179] According to some embodiments, the second inorganic film 1811 covering the pad electrode 922 may be located on the inner circumferential surface of the pad contact hole 810. The second inorganic film 1811 may be aligned with the inorganic film TFE1 or TFE3 (see FIG. 1 ) included in the encapsulation layer TFEL of the display area DA. Figure 5 ) are located in the same layer. For example, the second inorganic film 1811 may be Figure 5 The first inorganic encapsulating film TFE1 or the second inorganic encapsulating film TFE3 described is located in the same layer.

[0180] Fig.19 It shows that Fig.17 4 is a view of an example in which the drive substrate 410 shown in FIG. 4 is implemented as a flexible substrate. Fig. 20 is a cross-sectional view of a portion of the display panel 10, specifically, Fig.19 8 is a cross-sectional view of a pad contact hole 810 shown in FIG.

[0181] Except that the driving substrate 410 is implemented as a flexible substrate that is the same as or similar to the substrate SUB of the display panel 10, Fig.19 and Fig. 20 The embodiment shown is similar to Fig.17 and Fig.18 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0182] refer to Fig.19 and Fig. 20 , the drive substrate 410 according to some embodiments may include a substrate DSUB and a driver chip located on the substrate DSUB. The substrate DSUB of the drive substrate 410 may be a flexible substrate substantially the same as the substrate SUB of the display panel 10. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be a substrate SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0183] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The inorganic film 1611 and the metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and they may be made of the same material as the first inorganic film 911 and the pad electrode 922 included in the display panel 10 via the same process, respectively.

[0184] According to some embodiments, the pad 1621 of the driving substrate 410 may be an electrode extending from a lead and may be directly bonded to the bottom of the rear contact hole 1010 through the adhesive 1120. The pad 1621 of the driving substrate 410 may have a bent shape at the pad hole and may be arranged to cover the side surface of the inorganic film 1611 accordingly.

[0185] Fig.21is a cross-sectional view of a portion of the display panel 10 , and specifically, is a cross-sectional view of a pad contact hole 810 in which a contact area of ​​a conductive ink 1211 is increased by etching a portion of a protrusion included in a driving substrate 410 according to some embodiments.

[0186] In addition to forming the groove 2111 in the pad 1411 of the driving substrate 410, Fig.21 The embodiment shown is similar to Fig.13 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0187] refer to Fig.21 , the pad 1411 of the driving substrate 410 according to some embodiments may include a groove 2111 aligned with the middle hole MH. The groove 2111 formed in the pad 1411 may be formed by performing an etching process to etch at least a portion of the pad 1411. As shown in the drawings, the groove 2111 of the pad 1411 may be filled with a portion of the upper conductive ink 1211 in the middle hole MH.

[0188] Fig. 22 is a cross-sectional view of a portion of the display panel 10 , and specifically, is a cross-sectional view of a pad contact hole 810 in which a pad electrode 922 is composed of a plurality of metal layers according to some embodiments.

[0189] In addition to using a plurality of metal layers 2211 and 2212 to form the pad electrode 922, Fig. 22 The embodiment shown is similar to Fig.13 and Fig.14 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0190] refer to Fig. 22 According to some embodiments, the pad electrode 922 may include a plurality of metal layers 2211 and 2212. For example, the pad electrode 922 may include a first pad electrode 2211 covering the first inorganic film 911 and a second pad electrode 2212 covering the pad electrode 922. For example, the first pad electrode 2211 may be the same as the above reference Figure 5 The first anode connection electrode ANDE1 described above is located in the same layer, and the second pad electrode 2212 can be the same as that described above. Figure 5 The depicted second anode connection electrode ANDE2 is situated in the same layer.

[0191] Fig.23 is a cross-sectional view of a portion of a display panel 10 in which a pad electrode 922 and a driving substrate 410 are electrically connected to each other by a conductive ink 1211 filling a rear contact hole 1010 according to some embodiments.

[0192] In addition to using a plurality of metal layers 2211 and 2212 to form the pad electrode 922, Fig.23 The embodiment shown is similar to Fig.17 and Fig.18 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0193] refer to Fig.23 According to some embodiments, the pad electrode 922 may include a plurality of metal layers 2211 and 2212. For example, the pad electrode 922 may include a first pad electrode 2211 covering the first inorganic film 911 and a second pad electrode 2212 covering the pad electrode 922. For example, the first pad electrode 2211 may be the same as the above reference Figure 5 The first anode connection electrode ANDE1 described above is located in the same layer, and the second pad electrode 2212 can be the same as that described above. Figure 5 The depicted second anode connection electrode ANDE2 is situated in the same layer.

[0194] Fig.24 is a cross-sectional view of a portion of a display panel 10 including pad contact holes 810 of different types according to some embodiments.

[0195] In addition to the pad region 430 including at least one first pad 2411 located in the inorganic encapsulation region 1313 and at least one second pad 2412 located in the outermost region 1314 on the outer side of the inorganic encapsulation region 1313, Fig.24 The embodiment shown is similar to Fig.13 and Fig.14 The illustrated embodiments are substantially the same; and therefore, redundant descriptions will be omitted.

[0196] refer to Fig.24 , the pad region 430 according to some embodiments may include a composite structure including a first pad 2411 located in the inorganic encapsulation region 1313 and a second pad 2412 located in the outermost region 1314 on the outside of the inorganic encapsulation region 1313 .

[0197] According to about Fig.24 In the embodiment shown in FIG. 1 , the first pad 2411 located in the inorganic packaging region 1313 may be the same as that in the embodiment shown in FIG. Fig.17 and Fig.18 The pad regions 430 depicted are substantially the same.

[0198] According to about Fig.24 In the embodiment shown in FIG. 1 , the second pad 2412 in the outermost region 1314 located on the outer side of the inorganic packaging region 1313 may be the same as that in the embodiment shown in FIG. Fig.13 and Fig.14 The pad regions 430 depicted are substantially the same.

[0199] According to some embodiments, the first pad 2411 and the second pad 2412 may be pads PD that transmit the same signal or the same power voltage. For example, the signal applied to the first pad 2411 may be the same as the signal applied to the second pad 2412. Alternatively, the power voltage applied to the first pad 2411 may be the same as the power voltage applied to the second pad 2412. To this end, the first pad 2411 and the second pad 2412 may be positioned adjacent to each other and may be formed in pairs.

[0200] According to some embodiments, the first pad 2411 and the second pad 2412 may be pads PD transmitting different signals or different power voltages. That is, the first pad 2411 and the second pad 2412 may be driven independently of each other.

[0201] Fig.25 is a cross-sectional view of a portion of a display panel 10 in which an organic protective member 2510 is formed on some of the pad contact holes 810 according to some embodiments.

[0202] In addition to the organic protective member 2510 being located on the second pad 2412, Fig.25 The embodiment shown is similar to Fig.24 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar elements may be omitted.

[0203] refer to Fig.25 , an organic protective member 2510 having a height (eg, a set or predetermined height) may be located on the second pad 2412. Since the second pad 2412 is covered by the organic protective member 2510, it may not be easy to fill the second pad 2412 with the conductive ink 1211. Fig.25 Some embodiments shown in which the organic protection member 2510 is located on the second pad 2412 may be capable of electrically connecting the pad electrode 922 of the second pad 2412 to the drive substrate 410 by using the conductive ink 1212 that penetrates the drive substrate 410 and is bonded to the pad 1411 of the rear contact hole 1010. In this case, the protective resin 1222 covering the conductive ink 1212 connected to the first pad 2411 and the protective resin 1222 covering the conductive ink 1212 connected to the second pad 2412 may be connected to each other on the drive substrate 410.

[0204] Fig.25 The organic protective member 2510 shown in FIG. 1 may be a pixel defining layer 190 (see FIG. 10 ) included in the emission material layer EML. Figure 5) and / or the planarization layers 160 and 180 in the thin film transistor layer TFTL (see Figure 5 ) in at least one of the above references. For example, the organic protective member 2510 may be located in the same Figure 5 At least one of the first planarizing film 160 , the second planarizing film 180 , and the bank 190 is described as a member in the same layer.

[0205] Fig.26 is a cross-sectional view of a portion of a display panel 10 in which a planarization film 2610 is formed on some of the pad contact holes 810 according to some embodiments.

[0206] In addition to the fact that the planarization film 2610 is positioned instead of the second inorganic film 1811 covering the pad electrode 922, Fig.26 The embodiment shown is similar to Fig.17 The illustrated embodiments are substantially the same; and therefore, redundant descriptions will be omitted.

[0207] refer to Fig.26 , each pad PD according to some embodiments may include a planarization film 2610 covering the pad electrode 922 on the inner circumferential surface of the pad contact hole 810 .

[0208] According to some embodiments, the planarization film 2610 may include: a first planarization film 2611, and planarization films 160 and 180 (see Figure 5 ) is located in the same layer; and a second planarization film 2612, and the pixel defining layer 190 (see Figure 5 ) are located in the same layer. The planarization film 2610 may be the same as that in the above reference Figure 5 At least one of the first planarization film 160 , the second planarization film 180 , and the bank 190 is described as being located in the same layer as the protective film.

[0209] Fig. 27 It shows that Fig.26 4 is a cross-sectional view of an example in which the drive substrate 410 shown in FIG. 4 is implemented as a portion of the display panel 10 of a flexible substrate.

[0210] In addition to the driving substrate 410 being a flexible substrate, Fig. 27 The embodiment shown is similar to Fig.26 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of some components may be omitted.

[0211] refer to Fig. 27, the drive substrate 410 according to some embodiments may include a substrate DSUB and a driver chip located on the substrate DSUB. The substrate DSUB of the drive substrate 410 may be a flexible substrate substantially the same as the substrate SUB of the display panel 10. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be a substrate SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0212] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The inorganic film 1611 and the metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and they may be made of the same material as the first inorganic film 911 and the pad electrode 922 included in the display panel 10 via the same process, respectively.

[0213] According to some embodiments, the pad 1621 of the driving substrate 410 may be an electrode extending from a lead and may be directly bonded to the bottom of the rear contact hole 1010 through the adhesive 1120. The pad 1621 of the driving substrate 410 may have a bent shape at the pad hole and may be arranged to cover the side surface of the inorganic film 1611 accordingly.

[0214] Fig.28 According to some embodiments, Fig.26 0 is a cross-sectional view of a portion of the display panel 10 in which the shape of the pad electrode 922 shown in FIG.

[0215] In addition to the conductive ink 1212 being in direct contact with the side surface of the pad electrode 922, Fig.28 The embodiment shown is similar to Fig.26 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of some components may be omitted.

[0216] refer to Fig.28 In each pad PD according to some embodiments, the pad electrode 922 does not cover the middle hole MH, so that the middle hole MH can be completely opened. The conductive ink 1212 that penetrates the pad 1411 of the drive substrate 410 in the thickness direction can cover the completely opened middle hole MH, and thus the conductive ink 1211 can directly contact the side surface of the pad electrode 922.

[0217] Fig.29 It shows that Fig.284 is a cross-sectional view of an example in which the drive substrate 410 shown in FIG. 4 is implemented as a portion of the display panel 10 of a flexible substrate.

[0218] In addition to the driving substrate 410 being a flexible substrate, Fig.29 The embodiment shown is similar to Fig.28 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0219] refer to Fig.29 , the drive substrate 410 according to some embodiments may include a substrate DSUB and a driver chip located on the substrate DSUB. The substrate DSUB of the drive substrate 410 may be a flexible substrate substantially the same as the substrate SUB of the display panel 10. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be a substrate SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0220] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The inorganic film 1611 and the metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and they may be made of the same material as the first inorganic film 911 and the pad electrode 922 included in the display panel 10 via the same process, respectively.

[0221] According to some embodiments, the pad 1621 of the driving substrate 410 may be an electrode extending from a lead and may be directly bonded to the bottom of the rear contact hole 1010 through the adhesive 1120. The pad 1621 of the driving substrate 410 may have a bent shape at the pad hole and may be arranged to cover the side surface of the inorganic film 1611 accordingly.

[0222] Fig.30 12 is a cross-sectional view illustrating an example of a portion of the display panel 10 in which the conductive ink includes an upper conductive ink 1211 and a lower conductive ink 1212 .

[0223] In addition to the conductive ink including the upper conductive ink 1211 and the lower conductive ink 1212, Fig.30 The embodiment shown is similar to Fig.13 and Fig.14 The embodiments shown are essentially the same.

[0224] refer to Fig.30In each pad PD according to some embodiments, the upper conductive ink 1211 covers the pad electrode 922 on the inner peripheral surface of the pad contact hole 810, and the lower conductive ink 1212 of the pad 1411 penetrating the drive substrate 410 in the thickness direction is connected to the upper conductive ink 1211 through the middle hole MH.

[0225] According to some embodiments, the driving substrate 410 includes a pad 1411 bonded to the bottom of the rear contact hole 1010 and a substrate 1410 located below the pad 1411. The driving substrate 410 includes a pad hole penetrating the driving substrate 410 in the thickness direction, and the pad hole is aligned with the middle hole MH. The pad hole is filled with the lower conductive ink 1212, and the lower conductive ink 1212 is electrically connected to the upper conductive ink 1211 through the pad hole and the middle hole MH. Therefore, the pad 1411 located below the driving substrate 410 is electrically connected to the pad electrode 922 of the display panel 10 through the lower conductive ink 1212 and the upper conductive ink 1211.

[0226] According to some embodiments, the driving substrate 410 may further include a protective resin 1222 covering the lower conductive ink 1212 of the substrate SUB.

[0227] Fig.31 It shows that Fig.30 4 is a cross-sectional view of an example in which the drive substrate 410 shown in FIG. 4 is implemented as a portion of the display panel 10 of a flexible substrate.

[0228] In addition to the driving substrate 410 being a flexible substrate, Fig.31 The embodiment shown is similar to Fig.30 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0229] refer to Fig.31 , the drive substrate 410 according to some embodiments may include a substrate DSUB and a driver chip located on the substrate DSUB. The substrate DSUB of the drive substrate 410 may be a flexible substrate substantially the same as the substrate SUB of the display panel 10. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be a substrate SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0230] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The inorganic film 1611 and the metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and they may be made of the same material as the first inorganic film 911 and the pad electrode 922 included in the display panel 10 via the same process, respectively.

[0231] According to some embodiments, the first substrate DSUB1 of the drive substrate 410 may be directly bonded to the bottom of the rear contact hole 1010, and the leads and pads 1621 of the drive substrate 410 may be located on the lower surface of the second substrate DSUB2. The upper surface of the drive substrate 410 may be a surface where the first substrate DSUB1 is located, and may refer to a surface directly bonded to the bottom of the rear contact hole 1010. The lower surface of the drive substrate 410 may refer to a surface opposite to the upper surface.

[0232] Fig.32 is a cross-sectional view showing an example of a portion of the display panel 10 in which the pad contact hole 810 and the back contact hole 1010 are filled with conductive inks 1211 and 1212 .

[0233] In addition to the pad of the driving substrate 410 being directly attached to the bottom of the rear contact hole 1010, Fig.32 The embodiment shown is similar to Fig.30 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0234] refer to Fig.32 , the pad 1411 of the driving substrate 410 according to some embodiments is directly bonded to the bottom of the rear contact hole 1010, and the substrate 1410 may be located on the lower surface of the pad 1411. The upper surface of the driving substrate 410 is a surface where the lead and the pad 1411 are located, and may refer to a surface directly bonded to the bottom of the rear contact hole 1010. The lower surface of the driving substrate 410 may refer to a surface opposite to the upper surface.

[0235] Fig.33 It shows that Fig.32 4 is a cross-sectional view of an example in which the drive substrate 410 shown in FIG. 4 is implemented as a portion of the display panel 10 of a flexible substrate.

[0236] In addition to the pad 1621 of the driving substrate 410 being directly attached to the bottom of the rear contact hole 1010, Fig.33 The embodiment shown is similar to Fig.31 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0237] refer to Fig.33 , the pad 1621 of the drive substrate 410 according to some embodiments may be directly bonded to the bottom of the rear contact hole 1010, and the first substrate DSUB1 may define the lower surface of the drive substrate 410. The upper surface of the drive substrate 410 may be a surface where the lead and the pad 1621 are located, and may refer to a surface directly bonded to the bottom of the rear contact hole 1010. The lower surface of the drive substrate 410 may refer to a surface opposite to the upper surface.

[0238] Fig.34 It is shown that the Fig.33 0 is a cross-sectional view of an example of a portion of a display panel 10 in which an inorganic film 911 in a flexible substrate is removed.

[0239] Except that the driving substrate 410 does not include the inorganic film 1611, Fig.34 The embodiment shown is similar to Fig.33 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0240] refer to Fig.34 , the driving substrate 410 may not include an inorganic film (eg, Fig.33 For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be substrates SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0241] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and may be formed of the same material via the same process as the pad electrode 922 included in the display panel 10.

[0242] Fig.35 is a cross-sectional view of a portion of a display panel 10 in which a pad electrode 922 and a driving substrate 410 are electrically connected to each other by a conductive ink 1212 filling a rear contact hole 1010 according to some embodiments.

[0243] Except that the driving substrate 410 does not include the inorganic film 1611, Fig.35 The embodiment shown is similar to Fig. 20The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0244] refer to Fig.35 , the driving substrate 410 may not include an inorganic film (eg, Fig.33 For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be substrates SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0245] According to some embodiments, the substrate DSUB of the drive substrate 410 may be a substrate DSUB in which a first substrate DSUB1, a barrier film DBR, and a second substrate DSUB2 are sequentially stacked on each other. The metal layer DML forming the lead and the pad 1621 may be located on the second substrate DSUB2 of the drive substrate 410, and may be formed of the same material via the same process as the pad electrode 922 included in the display panel 10.

[0246] also, Fig.35 The pad 1621 of the driving substrate 410 shown in FIG. 4 may be similar to Fig. 20 The pad 1621 in FIG. 1 has a bent shape at the pad hole and may be positioned to cover the side surface of the second substrate DSUB2.

[0247] Fig.36 is a cross-sectional view of a portion of the display panel 10 illustrating an example in which the flexible substrate of the drive substrate 410 includes a single polymer layer.

[0248] In addition to the driving substrate 410, the first substrate (eg, Fig.33 In addition to the substrate DSUB1), Fig.36 The embodiment shown is basically the same as that described in Fig.35 The illustrated embodiments are the same; and therefore, some redundant descriptions of similar components may be omitted.

[0249] refer to Fig.36 According to some embodiments, the driving substrate 410 may not include a first substrate (eg, Fig.33The drive substrate 410 and the substrate SUB of the display panel 10 may include a first substrate DSUB1 in the display panel 10, but may include a second substrate DSUB2 as a single polymer layer. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be substrates SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0250] According to some embodiments, the substrate of the drive substrate 410 may be a substrate in which the barrier film DBR and the second substrate DSUB2 are sequentially stacked on each other and the first substrate DSUB1 is removed from the substrate during the manufacturing process. For example, the first substrate DSUB1 included in the drive substrate 410 may be removed in a process of forming the rear contact hole 1010 of the display panel 10 in the mother substrate.

[0251] Fig.37 is a cross-sectional view of a portion of the display panel 10 illustrating an example in which the flexible substrate of the drive substrate 410 includes a single polymer layer.

[0252] In addition to the driving substrate 410, the first substrate (eg, Fig.33 In addition to the substrate DSUB1), Fig.37 The embodiment shown is similar to Fig.31 The illustrated embodiments are substantially the same; and therefore, some redundant descriptions of similar components may be omitted.

[0253] refer to Fig.37 According to some embodiments, the driving substrate 410 may not include a first substrate (eg, Fig.33 The drive substrate 410 and the substrate SUB of the display panel 10 may include a first substrate DSUB1 in the display panel 10, but may include a second substrate DSUB2 as a single polymer layer. For example, the drive substrate 410 and the substrate SUB of the display panel 10 may be substrates SUB and DSUB generated from a single mother substrate, and may be divided into the drive substrate 410 and the substrate SUB of the display panel 10 via a process of cutting the mother substrate. Therefore, the stacking structure of the drive substrate 410 may be at least partially the same as the stacking structure of the display panel 10.

[0254] In summarizing the detailed description, those skilled in the art will appreciate that many changes and modifications may be made to the disclosed embodiments without departing substantially from the principles of the present invention. Therefore, the disclosed embodiments of the present invention are used only in a general and descriptive sense, and not for the purpose of limitation.

Claims

1. A display device, comprising: a substrate including a first substrate, a barrier film, and a second substrate sequentially stacked on each other; A thin film transistor layer, an emission material layer, a packaging layer and a touch detection unit are sequentially stacked on the second substrate; as well as a pad region in a non-display region of the substrate and comprising a plurality of pads connected to a drive substrate and facing the first substrate, Wherein, each of the plurality of pads comprises: a pad contact hole formed by etching the second substrate and the barrier film; A first inorganic film and a pad electrode are sequentially stacked on an inner peripheral surface of the pad contact hole; and a rear contact hole formed by etching a portion of the first substrate aligned with the pad contact hole, the pad of the drive substrate being bonded to a bottom of the rear contact hole, wherein the first inorganic film forms an intermediate hole connecting the pad contact hole with the rear contact hole, and the pad electrode covers at least a portion of the intermediate hole, and The pad of the driving substrate is electrically connected to the pad electrode covering the middle hole through lower conductive ink.

2. The display device according to claim 1, wherein: The driving substrate comprises: the pad bonded to the bottom of the rear contact hole; A pad hole, penetrating a portion of the pad aligned with the middle hole in a thickness direction; The lower conductive ink covers the inner peripheral surface of the pad hole; and The protective resin covers the lower conductive ink.

3. The display device according to claim 1, wherein: The driving substrate includes a flexible printed circuit board and a driver chip as a chip-on-film on the flexible printed circuit board.

4. The display device according to claim 1, wherein: The driving substrate includes a flexible substrate and a driver chip as a chip-on-plastic on the flexible substrate.

5. The display device according to claim 1, wherein: The first inorganic film is in the same layer as an inorganic film included in the thin film transistor layer.

6. The display device according to claim 1, wherein: The pad electrode is in the same layer as a source electrode or a drain electrode of a thin film transistor in the thin film transistor layer.

7. The display device according to claim 1, wherein: The pad electrode is at least one of a signal pad extending from a signal line for driving pixels in a display area, a power pad extending from a power line, an electrostatic pad electrically connected to an electrostatic line, and a touch driving pad electrically connected to a touch line of the touch detection unit.

8. The display device according to claim 1, further comprising: a second inorganic film covering the pad electrode on the inner peripheral surface of the pad contact hole, The second inorganic film is in the same layer as the inorganic film in the encapsulation layer.

9. The display device according to claim 1, further comprising: a planarization film covering the pad electrode on the inner peripheral surface of the pad contact hole, The planarization film is in the same layer as at least one of the planarization film in the thin film transistor layer and the pixel defining layer in the emission material layer.

10. The display device according to claim 2, further comprising: Applying conductive ink to cover the pad electrode on the inner peripheral surface of the pad contact hole; as well as Protective resin, covering the upper conductive ink, Wherein, the upper conductive ink and the lower conductive ink are connected to each other through the middle hole.

11. A display device, comprising: a substrate including a first substrate, a barrier film, and a second substrate sequentially stacked on each other; A thin film transistor layer, an emission material layer, a packaging layer and a touch detection unit are sequentially stacked on the second substrate; as well as a pad region in a non-display region of the substrate and comprising a plurality of pads connected to a drive substrate and facing the first substrate, Wherein, each of the plurality of pads comprises: a pad contact hole formed by etching the second substrate and the barrier film; A first inorganic film and a pad electrode are sequentially stacked on an inner peripheral surface of the pad contact hole; and a rear contact hole formed by etching a portion of the first substrate aligned with the pad contact hole, wherein the first inorganic film forms a middle hole connecting the pad contact hole and the back contact hole, and The pad of the driving substrate is electrically connected to the pad electrode through the middle hole and the upper conductive ink covering the pad electrode.

12. The display device according to claim 11, wherein: The driving substrate includes a flexible printed circuit board and a driver chip as a chip-on-film on the flexible printed circuit board.

13. The display device according to claim 11, wherein: The driving substrate includes a flexible substrate and a driver chip as a chip-on-plastic on the flexible substrate.

14. The display device according to claim 11, wherein: The first inorganic film is in the same layer as an inorganic film included in the thin film transistor layer.

15. The display device according to claim 11, wherein: The pad electrode is in the same layer as a source electrode or a drain electrode of a thin film transistor in the thin film transistor layer.

16. The display device according to claim 11, wherein: The pad electrode is at least one of a signal pad extending from a signal line for driving pixels in a display area, a power pad extending from a power line, an electrostatic pad electrically connected to an electrostatic line, and a touch driving pad electrically connected to a touch line of the touch detection unit.

17. The display device according to claim 11, wherein: The pad of the driving substrate includes a groove aligned with the middle hole.

18. The display device according to claim 17, wherein: The groove of the pad of the driving substrate is filled with a portion of the upper conductive ink.

19. The display device according to claim 11, wherein: The driving substrate comprises: substrate; the pad electrically connected to the pad electrode, on the substrate and bonded to the bottom of the rear contact hole; a pad hole penetrating the pad and a portion of the substrate aligned with the middle hole in a thickness direction; A lower conductive ink covering the inner peripheral surface of the pad hole; and Protective resin, covering the lower conductive ink, Wherein, the lower conductive ink is connected to the upper conductive ink through the pad hole and the middle hole.

20. The display device according to claim 11, wherein: The driving substrate comprises: a substrate bonded to the bottom of the rear contact hole; the pad electrically connected to the pad electrode, below the substrate; a pad hole penetrating the pad and a portion of the substrate aligned with the middle hole in a thickness direction; A lower conductive ink covering the inner peripheral surface of the pad hole; and A protective resin covers the lower conductive ink, wherein the lower conductive ink is connected to the upper conductive ink through the pad hole and the middle hole.

Images