Semiconductor glass substrate laser processing equipment

Abstract

The invention relates to the technical field of laser processing, in particular to semiconductor glass substrate laser processing equipment which comprises a first shell. The second shell is positioned at the lower part of the first shell; the top of the corrugated pipe is connected to the first shell, and the bottom of the corrugated pipe is connected to the second shell; a lens barrel movably coupled to the second housing and having one or more lenses mounted therein; a sliding member coupled to a lower end of the lens barrel, the lower end contacting a surface of the object; the spring is arranged between the second shell and the warp cylinder and provides downward elastic force for the warp cylinder; according to the present invention, even if a lens barrel of the laser processing apparatus is inclined in response to a surface curvature of an object and a focal point deviates from a positive position, an optical path can be changed by changing an attitude of a refractive member, thereby maintaining the focal point at the positive position of the object, and thus uniform processing quality can be ensured regardless of flatness of the object.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, in particular to semiconductor glass substrate laser processing equipment. Background Art

[0002] Traditionally, this type of laser processing equipment is mainly used for processes such as cutting, scribing, patterning and marking solid materials such as metals, ceramics and plastics, but it has recently been widely used to cut glass substrates for displays. When laser processing transparent and brittle materials such as glass substrates, it is very important to use a precision optical system to accurately focus the laser on the surface or inside the material. This is because even a slight misalignment in the position of the focus will result in the failure to form a smooth cross-section, thereby increasing the risk of cracks. On the other hand, with the trend of larger and thinner displays in recent years, the need to focus the optical system in response to the warping or surface bending of the glass substrate during laser processing has become increasingly prominent. For this reason, semiconductor glass substrate laser processing equipment has been proposed. Summary of the invention

[0003] In view of this, the present invention provides a semiconductor glass substrate laser processing device to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0004] The technical solution of the present invention is implemented as follows: a semiconductor glass substrate laser processing device comprises a first shell; a second shell, located at the lower part of the first shell; a bellows, the top of which is connected to the first shell and the bottom of which is connected to the second shell; a lens barrel, which is movably coupled to the second shell and has one or more lenses installed inside it; a sliding member, which is coupled to the lower end of the lens barrel and contacts the surface of the object; a spring, which is arranged between the second shell and the warp barrel and provides a downward elastic force to the warp barrel; a laser processing device is provided, which comprises at least one refractive member, the edge of which is coupled to the inner wall of the bellows.

[0005] Further preferably, it includes at least one refractive member, which is a light-transmitting material with a refractive index greater than that of air, and whose edge is bonded to the inner wall of the bellows to transmit the incident laser; a second shell, located at the lower part of the first shell; a bellows, whose top is connected to the first shell and whose bottom is connected to the second shell; a lens barrel, which is movably coupled to the second shell and has one or more lenses installed inside it; a sliding member, which is coupled to the lower end of the lens barrel, and the lower end contacts the surface of the object; a spring, which is arranged between the second shell and the warp cylinder to provide a downward elastic force to the warp cylinder; at least one refractive member installed inside the first shell, the second shell or the bellows; a plurality of distance sensors, which are used to detect the distance between the first shell and the second shell; and a rotating shaft portion for the refractive member.

[0006] Further preferably, a control unit is included, which uses the detection results of multiple distance sensors to control the rotation drive unit to rotate the refractive member, a through hole long along the moving direction for the laser beam to pass through is formed at the bottom of the sliding member, and the contact parts formed on both sides of the through hole have a curved surface or an inclined surface with the lowest center part and rising as it moves away from the center.

[0007] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0008] According to the present invention, the lens barrel of the laser processing device is inclined corresponding to the surface curvature of the object, so that the focus is positioned at the correct position, and even if it deviates, the optical path can be changed by changing the position of the refractive member, so that the focus can be maintained at the correct position of the object, which ensures uniform processing quality regardless of the flatness of the object.

[0009] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 is a diagram of a conventional laser processing device with an autofocus function;

[0012] Figure 2 This is a diagram of the defocusing phenomenon of a conventional laser processing device;

[0013] Figure 3 is a cross-sectional view of a laser processing apparatus according to a first embodiment of the present invention;

[0014] Figure 4 is a diagram of a sliding member;

[0015] Figure 5 is a view of a laser processing apparatus according to a first embodiment of the present invention;

[0016] Figure 6 is a cross-sectional view of a laser processing apparatus according to a second embodiment of the present invention;

[0017] Figure 7 is a diagram showing a view in which a plurality of distance sensors are installed.

[0018] Figure numerals: 10, object; 12, inclined surface; 100, laser processing device; 102, reflector; 110, first shell; 112, lower flange; 120, second shell; 122, guide rail; 130, bellows; 140, lens barrel; 142, upper flange; 145, lens; 150, spring; 160, sliding member; 162, internal space; 164, through hole; 168, top connecting part; 166, contact part; 170, refractive member; 180, rotating shaft part; 190, distance sensor. DETAILED DESCRIPTION

[0019] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0020] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0021] First embodiment

[0022] like Figure 3 As shown in the cross-sectional view, the semiconductor glass substrate laser processing equipment according to the first embodiment of the present invention includes a laser processing device 100, which includes a first shell 110, in which a reflecting mirror 102 is arranged; a second shell 120, which is connected to the bottom of the first shell 110 through a bellows 130; a lens barrel 140, which is movably connected to the second shell 120 and has one or more lenses 145 installed therein; it includes a spring 150 installed between the second shell 120 and the lens barrel 140, a sliding member 160 connected to the bottom of the lens barrel 140, and a refractive member 170 installed inside the bellows 130.

[0023] The laser processing device 100 is used to collect laser light emitted from the laser light source 80 and incident into the first housing 110 through the transmission optical system 90 onto the surface of the object 10 through the reflection mirror 102, the refractive member 170, the lens 145 and the like.

[0024] The first housing 110 has an inner space 162 through which incident laser light passes, and a lower flange 112 may be formed at the bottom thereof; the first housing 110 may be a fixed housing, and may be coupled to the linear guide rail 122 for movement.

[0025] Although the accompanying drawings show a reflector 102 installed in the first shell 110, this is merely exemplary and thus may be omitted as desired and a greater number of reflectors 102 may be installed; the bellows 130 has an internal space 162 connected to the interior of the first shell 110, a top connected to the lower flange 112 of the first shell 110, and a bottom connected to the top or side of the second shell 120.

[0026] The bellows 130 connects the second housing 120 to the first housing 110. When the sliding member 160 disposed at the bottom of the lens barrel 140 contacts the surface of the object 10 and reaches the inclined surface during movement, the lens barrel 140 and the second housing 120 are naturally inclined to absorb the contact shock.

[0027] The second shell 120 has an internal space 162 that is connected to the interior of the bellows 130, and is open at the top and bottom; a spring 150 mounting structure (not shown in the figure) can be formed in the internal ceiling of the second shell 120, and the top of the spring 150 is inserted or fixed therein.

[0028] The second housing 120 is used to guide the lifting movement of the lens barrel 140 . To this end, a vertical guide rail 122 for guiding the lifting movement of the lens barrel 140 may also be formed on the inner wall of the second housing 120 .

[0029] The lens barrel 140 is used to support at least one lens 145, which focuses the laser passing through the first shell 110 and the bellows 130 onto the surface or inside of the object 10; when the top is inserted into the bottom opening of the second shell 120, the bottom can protrude outside the second shell 120.

[0030] The spring 150 installed between the lens barrel 140 and the second housing 120 serves to apply elastic force to the lens barrel 140 in a downward direction.

[0031] In the accompanying drawings, the spiral spring 150 is installed between the top of the lens barrel 140 and the ceiling of the second shell 120, but there is no particular restriction on the installation position and specific type of the spring 150; there is no particular restriction on the type and number of lenses 145 installed in the lens barrel 140; of course, the lens 145 must be positioned so as to be able to focus on a specific position of the object 10; the sliding member 160 is installed at the bottom of the lens barrel 140, and is used for sliding movement while always contacting the surface of the object 10 during the laser processing process.

[0032] In other words, when the laser processing apparatus 100 moves over the fixed object 10 or the object 10 moves under the fixed object 10 , the lower contact portion 166 of the sliding member 160 must always remain in contact with the surface of the object 10 .

[0033] Since the spring 150 and the sliding member 160 are always subjected to downward elastic force, the sliding member 160 moves under slight pressure on the surface of the object 10; even if there is a curvature on the surface of the object 10, it can always contact the surface of the object 10 due to the action of the spring 150.

[0034] Reference Figure 3 and Figure 4 The sliding member 160 has an internal space 162 connected to the interior of the lens barrel 140, and a through hole 164 formed at the bottom for the laser to pass through; it includes contact portions 166 formed on both sides of the through hole 164 and in contact with the object 10, and a top connecting portion 168 formed at the top to be connected to the bottom of the lens barrel 140.

[0035] The contact portion 166 of the sliding member 160 is preferably formed lowest on both sides of the optical axis C and increases as it moves away from the optical axis C to minimize friction resistance during movement; for example, as shown in the figure, the contact portion 166 can form a curved surface, or conversely, can form an inclined plane.

[0036] In addition, in order to reduce friction resistance, such as Figure 4 As shown in (a), it is preferred to minimize the width of the contact portion 166 that contacts the object 10, but it is not necessarily limited thereto; as required, a contact portion 166 having a predetermined width can be formed at the bottom of the sliding member 160, such as Figure 4 (b) as shown.

[0037] Preferably, the through hole 164 is formed in an elongated shape along the moving direction of the sliding member 160 ; this is because only the contact portions 166 on both sides of the through hole 164 can slide and move smoothly along the moving direction while contacting the surface of the object 10 .

[0038] During laser processing, when the lens barrel 140 is tilted due to the curvature of the surface of the object 10 , the refractive member 170 serves to move the position of the focal point.

[0039] The refractive component 170 is a light-transmitting material having a refractive index greater than that of air. Its function is to transmit laser light without refraction when it is perpendicular to the optical axis, and to change the optical path due to the refractive index difference with air when it deviates from the perpendicular optical axis. The refractive component 170 can be made of glass, sapphire, etc., with flat surfaces on both sides, or other materials.

[0040] The refractive member 170 is installed to be perpendicular to the optical axis C of the first housing 110 without external force, and the edge is fixed to the bellows 130 .

[0041] To this end, the edge of the refractive member 170 may be fixed to the inner wall of the bellows 130 , the top of the refractive member 170 and the first housing 110 may be connected through the bellows 130 , and the bottom of the refractive member 170 and the second housing 120 may be connected through another bellows 130 .

[0042] Although two refractive members 170 are installed in the drawings, the number or thickness of the refractive members 170 is not particularly limited and may be appropriately selected in consideration of the type or flatness of a processing object.

[0043] Next, the principle of automatically adjusting the focus of the laser processing apparatus 100 in response to the surface curvature of the object 10 according to the embodiment of the present invention will be described.

[0044] First, if Figure 3 As shown, it is assumed that the laser processing device 100 moves to the right relative to the object 10 when the lower contact portion 166 of the sliding member 160 is in contact with the surface of the object 10; in this case, as shown in FIG. Figure 5 As shown, when the contact portion 166 of the sliding member 160 contacts the inclined surface 12 of the object 10 and starts to rise, when the downstream side of the contact portion 166 of the sliding member 160 first contacts the inclined surface 12 relative to the moving direction, the downstream side of the lens barrel 140 is higher than the upstream side, and the optical axis of the lens barrel 140 is slightly inclined relative to the optical axis C of the first shell 110; on the other hand, when the lens barrel 140 is inclined, the second shell 120 connected to the lens barrel 140 is also inclined in the same direction as the lens barrel 140; as a result, the downstream side of the bellows 130 installed between the first shell 110 and the second shell 120 is pushed and compressed upward; in this way, when the bellows 130 When the downstream side is compressed upward, the refractive member 170 installed inside the bellows 130 also rises on the downstream side, and the angle of the surface of the refractive member 170 and the optical axis C of the first shell 110 deviates from the vertical and tilts; in addition, when the refractive member 170 is tilted, due to the difference in refractive force with the air, the optical path of the laser moves slightly to the right in the figure, which also causes the focal position of the laser passing through the lens 145 of the lens barrel 140 to move; if it is assumed that the lens barrel 140 is set to form the focus of the laser on the surface of the object 10 in a vertical state, in the absence of the refractive member 170, if the lens barrel 140 is tilted due to the inclined surface 12, the position of the focus F1 must be spaced d from the surface of the object 10, as shown in FIG. Figure 5; however, when the refractive member 170 according to the embodiment of the present invention is installed, since the optical path of the laser light moves along the slightly inclined surface 12 due to the refractive member 170, a focus F2 can be formed on the surface of the object 10; in other words, according to the present invention, even when the lens barrel 140 is tilted due to the curvature formed on the surface of the object 10, the refractive member 170 installed in the bellows 130 also tilts and moves the optical path together, so that the focus of the laser light can always be formed on the surface of the object 10; therefore, according to the present invention, although the surface of the object 10 is curved, uniform processing quality can be achieved; the laser processing device 100 according to the first embodiment of the present invention adjusts the focus in an unpowered manner, wherein the position of the refractive member 170 is changed due to the deformation of the bellows 130, but since it is not limited thereto, power can also be used to adjust the position of the refractive member 170.

[0045] Second embodiment

[0046] Figure 6 The laser processing device 100 according to the second embodiment of the present invention is shown. The laser processing device 100 has a first housing 110 in which a reflecting mirror 102 is arranged, a second housing 120 connected to a bellows 130, a lens barrel 140 movably connected to the second housing 120 and having one or more upper flanges 142 installed therein; a spring 150 installed between the second housing 120 and the lens barrel 140; a sliding member 160 connected to the bottom of the lens barrel 140; and a refractive member 170 installed inside the bellows 130, which is the same as the first embodiment; however, unlike the first embodiment, in the laser processing device according to the second embodiment of the present invention, In the laser processing device 100a according to the second embodiment of the present invention, the edge of the refractive member 170 is not connected to the bellows 130, but is installed to be rotated by a separate rotating shaft portion 180; in addition, the difference from the first embodiment is that a plurality of distance sensors 190 are installed between the first shell 110 and the second shell 120; in addition, in the drawings, the refractive member 170 is shown to be installed inside the bellows 130, but is not limited thereto, and the refractive member 170 may be installed inside the first shell 110 or the second shell 120; in the laser processing device 100a according to the second embodiment of the present invention, the number or thickness of the refractive member 170 may also be selected according to different needs; at the same time, as Figure 7As shown, a plurality of distance sensors 190 are mounted on the top of the second shell 120, and detect the distance between the lower flange 112 of the first shell 110 and the second shell 120 at a plurality of positions respectively; preferably, three or more distance sensors 190 are arranged at equal intervals; a control unit (not shown in the figure) of the laser processing device 100 includes: during laser processing, the detection results of the plurality of distance sensors 190 can be periodically checked, and the detected distance information can be used to calculate the inclination angle of the lens barrel 140; in addition, the control unit uses the inclination angle of the lens barrel 140 to calculate the required translation distance; using the calculated translation distance, the required rotation angle of the refractive member 170 can be calculated, thereby controlling the rotation axis part 180; in this way, the posture of the refractive member 170 is controlled by the rotation axis part 180 using the detection result of the distance sensor 190, which has the advantage of being able to move the focus to a more precise position compared with the first embodiment.

[0047] The preferred embodiments of the present invention are described above, but the present invention is not limited to the above embodiments and can be implemented through various modifications or modifications. As an example, the laser processing device 100, 100a according to the present invention is designed for cutting or processing a glass substrate using a laser, but the specific use is not limited to this, so it can be used to process various materials such as metal, ceramics, plastics, leather and wood; as another example, the laser processing equipment 100, 100a according to the present invention is designed for cutting objects using a laser, but is not limited to this, so it can also be applied to other processes such as scribing, patterning and marking; in this way, the present invention can be modified or modified in various forms during specific application processes, and if the modified or modified embodiment includes the technical idea of ​​the present invention disclosed in the scope of the patent claims described later, it belongs to the scope of rights of the present invention.

Claims

1. Semiconductor glass substrate laser processing equipment, characterized in that: The invention comprises a first shell; a second shell located at the lower part of the first shell; a bellows, the top of which is connected to the first shell and the bottom of which is connected to the second shell; a lens barrel, which is movably coupled to the second shell and has one or more lenses installed inside; a sliding member, which is coupled to the lower end of the lens barrel and contacts the surface of the object; and a spring, which is arranged between the second shell and the warp barrel and provides a downward elastic force to the warp barrel.

2. The semiconductor glass substrate laser processing equipment according to claim 1, characterized in that: The invention comprises at least one refractive member, which is a light-transmitting material with a refractive index greater than that of air, and whose edge is bonded to the inner wall of the bellows to transmit the incident laser; a second housing, which is located at the lower part of the first housing; a bellows, whose top is connected to the first housing and whose bottom is connected to the second housing; a lens barrel, which is movably coupled to the second housing and has one or more lenses installed inside it; a sliding member, which is coupled to the lower end of the lens barrel and contacts the surface of the object; a spring, which is arranged between the second housing and the warp barrel and provides a downward elastic force to the warp barrel; at least one refractive member installed inside the first housing, the second housing or the bellows; and a plurality of distance sensors for detecting the distance between the first housing and the second housing; Used to rotate the shaft portion of the refractive member.

3. The semiconductor glass substrate laser processing equipment according to claim 1, characterized in that: The invention comprises a control unit which controls a rotation driving unit to rotate a refractive member by using detection results of a plurality of distance sensors, a through hole which is long in a moving direction and is used for passing a laser beam is formed at the bottom of the sliding member, and contact parts formed on both sides of the through hole have a curved surface or an inclined surface which is lowest at the center and rises as it is away from the center.

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