A laminating device for producing and processing RFID tags

Abstract

The present invention relates to the technical field of laminating machines, and in particular to a laminating and bonding device for producing and processing RFID tags, comprising a bottom plate, above which are arranged a conveying unit, a chip conveying unit, a preheating unit, a sealing conveying unit and a high-temperature laminating unit; the present invention can solve the following problems existing in the prior art in the process of laminating RFID tags: the chip and coated paper cannot be separately loaded during loading, which easily causes the chip and coated paper to be displaced during the subsequent movement process, thereby causing the lamination failure of the electronic tag and increasing the cost; and the device structure is too complicated, which easily increases the possibility of device damage; the present invention does not need to add an additional driving device, and only controls the present invention to complete all work through a hydraulic rod, so the structure is simple and the cost is reduced; hot melt adhesive is used to make the release paper and the chip adhere to each other, so as to avoid chip displacement and increase the laminating effect; the stacking block is double-limited by a square block and a contact block to avoid displacement of the stacking block.

Description

Technical Field

[0001] The invention relates to the technical field of laminating machines, and in particular to a laminating and bonding device for producing and processing RFID tags. Background Art

[0002] Radio Frequency Identification (RFID) is a technology that uses radio waves for contactless automatic identification and data acquisition. The production steps of RFID tags mainly include chip manufacturing, antenna design, chip flipping, lamination synthesis, testing and verification, and packaging and warehousing. The lamination synthesis of RFID tags is the process of combining multi-layer structures such as chips, antennas and packaging materials through specific process methods to form a complete RFID tag. Generally, RFID tags are laminated with multiple layers of raw materials such as coated paper, chips, conductive adhesive, antennas, hot melt adhesive and release paper. However, before lamination, the chip, conductive adhesive and antenna as well as hot melt adhesive and release paper are usually combined together separately to increase lamination efficiency and quality.

[0003] A large number of laminating devices for electronic tags are also disclosed in the prior art. For example, Chinese patent publication number CN117565528A discloses a laminating machine and laminating method for electronic tags, including a transmission belt, a feeding assembly, a pre-pressing assembly, a laminating assembly and a heat preservation assembly. The output end of the hydraulic pump is fixedly connected to a heat preservation plate, a heat conduction block is slidably connected in the exchange tank, and the annular heat conduction plate and the heat preservation box are connected by a heat conduction rod.

[0004] When it is in use, the pre-pressing component uses heat-conducting oil to achieve preliminary bonding of the conductive material to the upper and lower plastic substrates and semiconductor chips. The heat-conducting block and heat-conducting rod of the insulation component transfer the heat source temperature to the pre-pressing heat-conducting oil. The insulation plate and the insulation component are rotated to keep the hot pressing plate at an appropriately high temperature. The lamination work of the electronic label production line is automatically completed by coordinating the components.

[0005] However, the above-mentioned electronic label laminating device still has some shortcomings in actual use:

[0006] 1. In the process of laminating the electronic label in the above-mentioned prior art, the release paper, chip and coated paper are stacked together at the same time when loading, which easily causes the chip and coated paper to shift during the subsequent movement to the hot pressing plate, resulting in the chip and coated paper not being in the center of the release paper when laminating the release paper, chip and coated paper, resulting in the release paper and coated paper not completely covering the chip, affecting the quality of the finished electronic label and increasing the cost.

[0007] 2. The heat energy transfer of the above-mentioned electronic tag pressure-bearing device is too complicated and will increase the heat energy consumption in the process of heat energy transfer, which not only increases the investment cost but also fails to save heat energy and extend the service life of the electronic tag pressure-bearing device.

[0008] An overly complex structure not only increases the cost but also increases the possibility of device damage, which is not conducive to the production of electronic tags.

[0009] Therefore, based on the above-stated viewpoints, there is still room for improvement in the existing electronic label lamination methods. Summary of the invention

[0010] In order to solve the above problems, the present invention provides a laminating and bonding device for RFID tag production and processing, comprising a bottom plate, baffles are arranged on both sides of the upper end of the bottom plate near the length direction, a conveying unit located above the bottom plate is arranged between the two baffles, a chip conveying unit, a preheating unit, a sealing plate conveying unit and a high-temperature laminating unit located above the conveying unit are sequentially installed on the opposite sides of the two baffles along the length direction, the chip conveying unit and the sealing plate conveying unit are symmetrically distributed along the preheating unit, and a partition plate for separating the high-temperature laminating unit and the sealing plate conveying unit is installed between the two baffles, wherein:

[0011] The conveying unit includes a conveying belt installed between two baffles, and a limiting assembly located above the conveying belt is installed on the opposite sides of the two baffles. The chip conveying unit and the sealing plate conveying unit respectively include a first conveying belt and a second conveying belt arranged between the two baffles, and a grabbing assembly is installed under the first conveying belt and the second conveying belt. The preheating unit includes a preheating plate arranged between the two baffles and located above the conveying belt. The high-temperature lamination unit includes a laminating plate arranged between the two baffles and located above the conveying belt.

[0012] As a preferred technical solution of the present invention, the conveying unit also includes a plurality of rotating shafts rotatably arranged on opposite sides of the two baffles and evenly distributed along their length direction, the conveying belt is sleeved on the outer walls of the plurality of rotating shafts, the outer wall of the conveying belt is installed with a plurality of evenly distributed stacking blocks, the outer wall of the stacking block is symmetrically provided with two protruding blocks that are in sliding contact with the baffle along the length direction, and a square block for limiting the stacking block is installed between two adjacent protruding blocks.

[0013] As a preferred technical solution of the present invention, the limit assembly includes a reciprocating group located above the transmission belt, two reciprocating groups respectively located below the first conveyor belt and the second conveyor belt are installed on opposite sides of the two baffles, the reciprocating group includes two fixed rings installed on opposite sides of the two baffles and distributed up and down, a sliding rod is provided between the two fixed rings for common sliding penetration, an extension block located between the two fixed rings is provided on the side of the sliding rod away from the baffle, a telescopic spring rod is installed between the upper end of the extension block and the upper fixed ring, a contact rack located between the two fixed rings is provided on one side of the sliding rod in the width direction, and a contact block is installed at the lower end of the sliding rod;

[0014] The reciprocating group also includes a gear shaft that rotates and passes through the two baffles. The gear shaft is located on the side of the sliding rod close to the preheating unit. The outer wall of the gear shaft is sleeved with a staggered gear located on the inner side of the baffle. The staggered gear is meshed with the contact rack. The outer walls of the two gear shafts on the same side of the baffle and the outer wall of the rotating shaft are jointly sleeved with a limiting belt located on the opposite sides of the two baffles.

[0015] As a preferred technical solution of the present invention, the chip conveying unit and the sealing plate conveying unit both include a lower shaft and an upper shaft rotatably arranged between the two baffles, and a first conveyor belt and a second conveyor belt are respectively sleeved between the lower shaft and the upper shaft in the chip conveying unit and between the lower shaft and the upper shaft in the sealing plate conveying unit, and the outer walls of the first conveyor belt and the second conveyor belt are both provided with a plurality of evenly distributed suction holes, and the outer wall of the lower shaft is provided with a plurality of annular staggered grooves staggered with the suction holes.

[0016] As a preferred technical solution of the present invention, a plurality of limiting shafts for limiting the first conveyor belt and the second conveyor belt are rotatably penetrated between the two baffles, the opposite sides of the first conveyor belt and the second conveyor belt are gradually inclined downward, and the inner side walls of the two baffles are both installed with sealing strips located on the upper and lower sides of the first conveyor belt and the second conveyor belt;

[0017] An extension plate is arranged on any side wall of the bottom plate, a vacuum pump is installed on the upper end of the extension plate through a mounting block, and the first conveyor belt and the second conveyor belt are both connected to the vacuum pump through a pipeline.

[0018] As a preferred technical solution of the present invention, the grabbing assembly includes a circular shaft and a connecting shaft, the circular shaft and the connecting shaft are rotatably penetrated on opposite sides of the two baffles, the circular shaft and the connecting shaft on the same baffle are respectively located below the first conveyor belt and the second conveyor belt, a square cylinder connected to the connecting shaft is installed between the circular shaft and the connecting shaft, a separation plate for separating the interior of the square cylinder is provided on the inner wall of the square cylinder, a plurality of circumferentially equidistantly distributed telescopic rods are installed on the outer wall of the square cylinder along the length direction, a plurality of through holes connected to the telescopic rods are opened on the outer wall of the square cylinder, and the telescopic rods are composed of The invention is composed of a fixed tube arranged on the outer wall of the square tube and a telescopic tube in sliding contact with the inner wall of the fixed rod, a connecting ring is sleeved on the outer wall of the telescopic rod away from the square tube, a synchronous rod is installed between two adjacent connecting rings, a suction net is arranged at one end of the telescopic rod away from the square tube, an annular groove is opened on the inner wall of the telescopic tube close to the suction net, an annular gasket is installed at one end of the annular groove away from the suction net, a plurality of limit plates passing through the suction net are installed at one end of the annular gasket close to the suction net, an ejection spring is arranged between the annular gasket and the square tube, and a force unloading spring is installed between the annular gasket and the suction net;

[0019] The grab assembly also includes an elliptical groove formed on the inner side wall of the baffle, and a resisting rod is arranged between the connecting ring near one side of the baffle and the baffle, and the resisting rod is slidably docked in the elliptical groove.

[0020] As a preferred technical solution of the present invention, the preheating plate is located between the first conveyor belt and the second conveyor belt, a mounting groove is provided at the lower end of the preheating plate, and a plurality of evenly distributed heating plates are arranged on the top wall of the mounting groove.

[0021] As a preferred technical solution of the present invention, the high-temperature lamination unit includes a receiving plate arranged on the opposite sides of the two baffles, the receiving plate is located on the side of the partition plate away from the sealing plate conveying unit, a hydraulic rod is installed at the upper end of the receiving plate, a parallel plate is arranged at the telescopic end of the top of the hydraulic rod, connecting blocks are installed on the opposite sides of the two parallel plates, and a laminating plate is jointly arranged at the lower ends of the two connecting blocks, a heating groove is opened inside the laminating plate, and a heating net is installed on the bottom wall of the heating groove.

[0022] As a preferred technical solution of the present invention, two vertical grooves are provided on opposite sides of the two baffles, which are located on the side of the partition plate away from the sealing plate conveying unit, and displacement rods are slidably arranged in the vertical grooves, and a parallel plate is installed between the two displacement rods on the same baffle;

[0023] Any vertical groove on the same baffle is set to be through, and a driving rack is installed after the displacement rod in the vertical groove slides out. The opposite sides of the two baffles are provided with linkage gears that mesh with the driving rack through the rotation of the positioning shaft. A ratchet and pawl mechanism is set between the linkage gears on the positioning shaft and its outer wall. Any positioning shaft and the lower shaft close to it are connected by belt transmission, and the outer walls of the two lower shafts are sleeved with relative gears that mesh with each other.

[0024] As a preferred technical solution of the present invention, the driving rack on one of the baffles is located on the side of the linkage gear away from the lower shaft, and the driving rack on the other baffle is located on the side of the linkage gear close to the lower shaft, and the positioning shaft and the rotating shaft that are not connected to the lower shaft belt drive are connected through a belt drive.

[0025] In summary, this application includes the following beneficial technical effects:

[0026] 1. In the process of laminating RFID tags, the present invention controls the rotation of the conveyor belt, the first conveyor belt, the second conveyor belt, the circular shaft and the gear shaft through a hydraulic rod, without adding an additional driving device. The present invention only controls the loading and lamination of RFID tags through the hydraulic rod, which has a simple structure and reduces costs.

[0027] 2. The present invention preliminarily heats the hot melt adhesive on the surface of the release paper through a preheating plate, so that the heated hot melt adhesive can bond the chip and the release paper together, thereby avoiding displacement of the chip due to shaking when the release paper is subsequently moved and processed, thereby increasing the lamination effect of the RFID tag.

[0028] 3. The present invention controls the upward movement of the sliding rod and the contact block through the mutual cooperation of the offset gear and the contact rack, and then the contact block moves downward under the action of the telescopic spring rod to limit the stacking block, thereby achieving continuous limitation of the stacking block, avoiding displacement of the stacking block and causing lamination failure, and increasing the lamination effect of the RFID tag. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0030] Figure 1 It is a structural schematic diagram of the present invention.

[0031] Figure 2 It is a structural schematic diagram of the limiting component of the present invention.

[0032] Figure 3 It is a schematic structural diagram of the lower shaft and the first conveyor belt of the present invention.

[0033] Figure 4 It is a structural schematic diagram of the positioning shaft and the rotating shaft of the present invention.

[0034] Figure 5 It is a structural schematic diagram of the grabbing assembly of the present invention.

[0035] Figure 6 It is a structural schematic diagram of the telescopic rod of the present invention.

[0036] Figure 7 It is a structural schematic diagram of the preheating plate of the present invention.

[0037] Figure 8 It is a schematic structural diagram of the high temperature lamination unit of the present invention.

[0038] Fig. 9 It is a structural schematic diagram of the synchronous gear and the matching gear of the present invention.

[0039] Fig.10 It is a schematic structural diagram of the relative gears of the present invention.

[0040] Fig.11 It is a structural schematic diagram of the positioning shaft and the rotating shaft of the present invention.

[0041] Fig.12 The present invention Fig.11 A partial enlarged view of point A.

[0042] Fig.13 The present invention Fig.11 A partial enlarged view of point B.

[0043] In the figure, 1, bottom plate; 2, baffle; 3, transmission unit; 31, transmission belt; 32, limit assembly; 33, rotating shaft; 34, stacking block; 35, protruding block; 36, square block; 37, reciprocating group; 371, fixed ring; 372, sliding rod; 373, extension block; 374, telescopic spring rod; 375, contact rack; 376, contact block; 377, gear shaft; 378, offset gear; 379, limit belt; 4, high temperature lamination unit; 41, lamination plate; 42, receiving plate; 43, hydraulic rod; 44, parallel plate; 45, connecting block; 46, heating groove; 47, heating net; 5, chip conveying unit; 51, first conveyor belt; 511, lower shaft; 512, upper shaft; 513, suction hole; 514, annular dislocation groove; 515, limit shaft; 516, sealing strip; 517, Extension plate; 518, vacuum pump; 52, grab assembly; 521, circular shaft; 522, connecting shaft; 523, square tube; 524, separation plate; 525, telescopic rod; 526, through hole; 527, fixed tube; 528, telescopic tube; 529, connecting ring; 530, synchronous rod; 531, suction net; 532, annular groove; 533, annular gasket; 534, limit plate; 535, ejection spring; 536, unloading spring; 537, elliptical groove; 538, resistance rod; 6, sealing plate conveying unit; 61, second conveyor belt; 7, preheating unit; 71, preheating plate; 72, mounting groove; 73, heating plate; 8, partition plate; 9, vertical groove; 91, displacement rod; 92, driving rack; 93, positioning shaft; 94, linkage gear; 95, relative gear; 96, synchronous gear; 97, matching gear. DETAILED DESCRIPTION

[0044] The following is combined with Figure 1-Figure 13 Embodiments of the present invention are described in detail.

[0045] The embodiment of the present application discloses a laminating and bonding device for producing and processing RFID tags. It should be noted that the laminating and bonding device for producing and processing RFID tags of the present application is mainly used in the process of high-temperature lamination of RFID tags. In terms of technical effect, it can avoid the displacement of chips during the lamination process and can double-limit the stacking blocks, so as to ensure that the stacking blocks will not be displaced during the lamination process, thereby increasing the lamination effect of the RFID tags; in particular, after the chip is placed on the release paper, the hot melt adhesive on the release paper can be preliminarily melted by the preheating plate, and the melted hot melt adhesive and the chip are adhered to each other, so that the chip and the release paper are adhered together, thereby reducing the possibility of chip displacement, increasing the lamination effect of the RFID tags, and the melted hot melt adhesive is beneficial to the subsequent lamination work of the RFID tags.

[0046] Embodiment 1:

[0047] Reference Figure 1 As shown, in order to realize the lamination of release paper, chip and coated paper in the production process of RFID tags, specifically, this embodiment provides a laminating device for RFID tag production and processing, including a base plate 1, baffles 2 are arranged on both sides of the upper end of the base plate 1 near its length direction, a conveying unit 3 located above the base plate 1 is arranged between the two baffles 2, and a chip conveying unit 5, a preheating unit 7, a sealing plate conveying unit 6 and a high-temperature lamination unit 4 located above the conveying unit 3 are sequentially installed on the opposite sides of the two baffles 2 along the length direction, the chip conveying unit 5 and the sealing plate conveying unit 6 are symmetrically distributed along the preheating unit 7, and a partition plate 8 for separating the high-temperature lamination unit 4 and the sealing plate conveying unit 6 is installed between the two baffles 2.

[0048] Furthermore, in this embodiment, the conveying unit 3 includes a conveying belt 31 installed between the two baffles 2, and a limiting assembly 32 located above the conveying belt 31 is installed on the opposite side of the two baffles 2. The chip conveying unit 5 and the sealing plate conveying unit 6 respectively include a first conveying belt 51 and a second conveying belt 61 arranged between the two baffles 2, and a grabbing assembly 52 is installed under the first conveying belt 51 and the second conveying belt 61. The preheating unit 7 includes a preheating plate 71 arranged between the two baffles 2 and located above the conveying belt 31. The high-temperature lamination unit 4 includes a laminating plate 41 arranged between the two baffles 2 and located above the conveying belt 31.

[0049] In actual application, the release paper is first placed on the top of the conveying unit 3, and then the conveying unit 3 drives the release paper to move to the bottom of the high-temperature laminating unit 4. During this period, the release paper will pass through the bottom of the chip conveying unit 5, the preheating unit 7 and the sealing plate conveying unit 6 in turn. At the same time, the first conveyor belt 51 and the second conveyor belt 61 can respectively move the chip and the coated paper to the top of the conveying unit 3. When the release paper moves to the bottom of the chip conveying unit 5, the release paper can be limited by the limiting component 32, so that the release paper is under the first conveyor belt 51 and the second conveyor belt 61, and the release paper is accurately positioned to ensure that the grabbing component 52 will not be misplaced when placing the chip on the release paper, thereby increasing the lamination effect of the RFID tag; the chip located on the chip conveying unit 5 is removed by the grabbing component 52 and the chip is placed on the release paper, and the conveying unit 3 releases the release paper and The chip moves to the bottom of the preheating unit 7, and the hot melt adhesive on the surface of the release paper is preliminarily heated by the preheating plate 71, so that the heated hot melt adhesive can bond the chip and the release paper together, thereby avoiding the chip from being displaced due to shaking when the release paper is subsequently moved and processed, thereby increasing the lamination effect of the RFID tag; then the conveying unit 3 drives the release paper and the chip to move to the sealing plate conveying unit 6, and when located below the sealing plate conveying unit 6, the coated paper located above the sealing plate conveying unit 6 is removed by the grabbing assembly 52 and placed above the release paper and the chip, and then the conveying unit 3 drives the chip, coated paper and release paper to move to the high-temperature lamination unit 4, and when the release paper, chip and coated paper are moved to the bottom of the high-temperature lamination unit 4, the release paper, chip and coated paper are subjected to high-temperature lamination through the laminating plate 41, thereby achieving the lamination of the RFID tag and increasing the lamination efficiency of the RFID tag.

[0050] Reference Figure 1 and Figure 2 As shown, in order to enable the conveyor belt 31 to accurately position the stacking block 34 in the process of driving the stacking block 34 to move toward the high-temperature laminating unit 4, based on this, in the present embodiment, the conveyor unit 3 also includes a plurality of rotating shafts 33 rotatably arranged on opposite sides of the two baffles 2 and evenly distributed along the length direction thereof, the conveyor belt 31 is sleeved on the outer walls of the plurality of rotating shafts 33, and a plurality of evenly distributed stacking blocks 34 are installed on the outer wall of the conveyor belt 31, and the outer wall of the stacking block 34 is symmetrically provided with two protruding blocks 35 in sliding contact with the baffle 2 along the length direction, and a square block 36 for limiting the stacking block 34 is installed between two adjacent protruding blocks 35.

[0051] Further, in this embodiment, the limiting assembly 32 includes a reciprocating group 37 located above the transmission belt, and two reciprocating groups 37 respectively located below the first conveyor belt 51 and the second conveyor belt 61 are installed on opposite sides of the two baffles 2. The reciprocating group 37 includes two fixing rings 371 installed on opposite sides of the two baffles 2 and distributed up and down, and a sliding rod 372 is slidably penetrated between the two fixing rings 371. An extension block 373 located between the two fixing rings 371 is provided on the side of the sliding rod 372 away from the baffle 2, and a telescopic spring rod 374 is installed between the upper end of the extension block 373 and the upper fixing ring 371. A contact rack 375 located between two fixed rings 371 is provided on one side of the sliding rod 372 in the width direction, and a contact block 376 is installed at the lower end of the sliding rod 372; the reciprocating group 37 also includes a gear shaft 377 that rotates and passes through the two baffles 2. The gear shaft 377 is located on the side of the sliding rod 372 close to the preheating unit 7. The outer wall of the gear shaft 377 is sleeved with a staggered gear 378 located on the inner side of the baffle 2. The staggered gear 378 is meshed with the contact rack 375. The outer walls of the two gear shafts 377 on the same side of the baffle 2 and the outer wall of the rotating shaft 33 are jointly sleeved with a limiting belt 379 located on the opposite sides of the two baffles 2.

[0052] It should be noted that the offset gear 378 contacts the contact rack 375 twice for each rotation, and at the same time drives the sliding rod 372 and the contact block 376 to move upward twice; the telescopic spring rod 374 always applies a downward thrust to the extension plate 517 and the sliding rod 372, so that the contact block 376 can quickly limit the next stacking block 34, avoiding the contact block 376 missing the best time to limit the next stacking block 34.

[0053] In actual application, after the release paper is placed on the stacking block 34, the conveyor belt 31 is driven to rotate by the rotating shaft 33, and the conveyor belt 31 drives the stacking block 34 to move toward the high-temperature lamination unit 4. In the process of the stacking block 34 driven by the conveyor belt 31, the stacking block 34 can be limited by the square block 36 to prevent the stacking block 34 from being displaced during the movement, thereby causing subsequent lamination failure. When the stacking block 34 moves to the bottom of the chip conveying unit 5, the stacking block 34 can be limited for a second time by the contact block 376 to increase the lamination effect. After the chip is placed on the stacking block 34 by the grabbing component 52, the stacking block 34 is controlled to move toward the preheating unit 7 by the conveyor belt 31. The rotating shaft 33 controls the rotation of the gear shaft 377 through the limiting belt 379, and the gear shaft 377 drives the offset gear 378 to rotate. The rotation of the offset gear 378 controls the sliding rod 372 to move upward, and the sliding rod 372 drives the contact block 376 to move upward synchronously, thereby releasing the limit of the contact block 376 on the stacking block 34, ensuring that the conveyor belt 31 can smoothly drive the stacking block 34 to move toward the preheating unit 7. When the next stacking block 34 comes under the chip conveying unit 5, the sliding rod 372 moves downward rapidly under the action of the telescopic spring rod 374, so that the contact block 376 limits the stacking block 34 again, thereby achieving continuous limitation of the stacking block 34 and avoiding displacement of the stacking block 34.

[0054] Reference Figure 1 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, in order to realize the grabbing and placing of the chip and coated paper, based on this, in this embodiment, the chip conveying unit 5 and the sealing plate conveying unit 6 both include a lower shaft 511 and an upper shaft 512 rotatably arranged between the two baffles 2, and a first conveying belt 51 and a second conveying belt 61 are respectively sleeved between the lower shaft 511 and the upper shaft 512 of the chip conveying unit 5 and between the lower shaft 511 and the upper shaft 512 of the sealing plate conveying unit 6. The first conveying belt 51 and the second conveying belt 61 are outer sleeved. The walls are provided with multiple evenly distributed suction holes 513, and the outer wall of the lower shaft 511 is provided with multiple annular offset grooves 514 which are staggered with the suction holes 513; multiple limiting shafts 515 for limiting the first conveyor belt 51 and the second conveyor belt 61 are rotatably penetrated between the two baffles 2, and the opposite sides of the first conveyor belt 51 and the second conveyor belt 61 are gradually inclined downward, and the inner walls of the two baffles 2 are installed with sealing strips 516 located on the upper and lower sides of the first conveyor belt 51 and the second conveyor belt 61.

[0055] Furthermore, in the present embodiment, the grabbing assembly 52 comprises a circular shaft 521 and a connecting shaft 522, the circular shaft 521 and the connecting shaft 522 are rotatably penetrated on opposite sides of the two baffles 2, the circular shaft 521 and the connecting shaft 522 on the same baffle 2 are respectively located below the first conveyor belt 51 and the second conveyor belt 61, a square cylinder 523 connected to the connecting shaft 522 is installed between the circular shaft 521 and the connecting shaft 522, a separation plate 524 for separating the interior of the square cylinder 523 is provided on the inner wall of the square cylinder 523, a plurality of circumferentially equidistantly distributed telescopic rods 525 are installed on the outer wall of the square cylinder 523 along the length direction, a plurality of through holes 526 connected to the telescopic rods 525 are opened on the outer wall of the square cylinder 523, the telescopic rod 525 is composed of a fixed tube 527 arranged on the outer wall of the square cylinder 523 and a telescopic tube 528 in sliding contact with the inner wall of the fixed tube 527, the telescopic rod 525 is away from the square cylinder 523. A connecting ring 529 is sleeved on the outer wall of one side of the square cylinder 523, and a synchronization rod 530 is installed between two adjacent connecting rings 529. A suction net 531 is provided at the end of the telescopic rod 525 away from the square cylinder 523. An annular groove 532 is opened on the inner wall of the telescopic tube 528 close to the suction net 531. An annular gasket 533 is installed at the end of the annular groove 532 away from the suction net 531. A plurality of limiting pieces 534 that pass through the suction net 531 are installed at the end of the annular gasket 533 close to the suction net 531. An ejection spring 535 is arranged between the annular gasket 533 and the square cylinder 523, and a force unloading spring 536 is installed between the annular gasket 533 and the suction net 531. The grabbing assembly 52 also includes an elliptical groove 537 opened on the inner side wall of the baffle 2, and a resistance rod 538 is arranged between the connecting ring 529 close to the side of the baffle 2 and the baffle 2, and the resistance rod 538 is slidably docked in the elliptical groove 537.

[0056] Furthermore, in this embodiment, an extension plate 517 is provided on any side wall of the base plate 1, and a vacuum pump 518 is installed on the upper end of the extension plate 517 through a mounting block, and the connecting shaft 522, the first conveyor belt 51 and the second conveyor belt 61 are all connected to the vacuum pump 518 through a pipeline.

[0057] It should be noted that the circular shaft 521 only rotates 180 degrees each time when it rotates, and the ejection spring 535 does not apply force to the annular gasket 533 when the telescopic rod 525 is extended to its longest point. When the telescopic rod 525 is separated from its longest point, the ejection spring 535 gradually applies an ejection force to the annular gasket 533 toward the side of the suction net 531, thereby increasing the gripping effect of the suction net 531 on the chip and coated paper, and the unloading spring 536 always applies a thrust to the annular gasket 533 toward the side of the square tube 523, thereby ensuring that the annular gasket 533 will not be subjected to the ejection force from the ejection spring 535 when the telescopic rod 525 is extended to its longest point and releasing the limit on the chip and coated paper.

[0058] It should be further explained that, during the rotation of the telescopic rod 525, one end of the resistance rod 538 slides and docks in the elliptical groove 537, so the telescopic rod 525 can be extended and retracted along the path of the elliptical groove 537 during the rotation. When the telescopic rod 525 is located below the first conveyor belt 51 or above the conveyor belt 31, the telescopic rod 525 is in the longest extended state, and the separation plate 524 is used to divide the square cylinder 523 and the connecting shaft 522 into two parts, and only one half of the cross-section of the pipe connected to the connecting shaft 522 is connected to the connecting shaft 522.

[0059] In actual application, the chip needs to be placed above the first conveyor belt 51 first, and then the air inside the first conveyor belt 51 is extracted through the vacuum pump 518, so that the suction holes 513 on the surface of the first conveyor belt 51 generate suction, thereby ensuring that the chip will not fall during the rotation of the first conveyor belt 51. When the chip passes through the lower shaft 511, the annular offset groove 514 can ensure that the suction hole 513 still has suction, thereby preventing the chip from falling and causing damage when passing through the lower shaft 511, reducing the risk of chip falling and reducing costs.

[0060] When the stacking block 34 moves to the bottom of the chip conveying unit 5, the stacking block 34 is limited by the limiting assembly 32. At this time, the telescopic rod 525 is below the first conveyor belt 51. The air in the square tube 523 and the telescopic rod 525 is extracted by the vacuum pump 518, so that the surface of the suction net 531 generates suction to adsorb the chips above the first conveyor belt 51 on the surface of the suction net 531, so as to capture the chips. Then the circular shaft 521 drives the square tube 523 and the connecting shaft 522 to rotate, and the square tube 523 drives the telescopic rod 525 on its surface to rotate, and the telescopic rod 525 drives the connecting ring 529, the synchronous rod 530 and the resistance rod 538 to rotate synchronously. During the movement, the telescopic rod 525 gradually shortens under the cooperation of the abutting rod 538 and the elliptical groove 537 from the beginning of rotation to the rotation to 90 degrees, and the ejection spring 535 exerts an ejection force on the annular gasket 533 toward the side of the suction net 531 under the extrusion of the telescopic tube 528. The annular gasket 533 moves toward the side of the suction net 531 under the action of the ejection spring 535 and drives the limiting piece 534 to move synchronously. The limiting piece 534 gradually passes through the suction net 531 and limits the chip during the movement toward the side of the suction net 531, so as to prevent the chip from falling during the rotation of the telescopic rod 525 and increase the chip grabbing effect of the suction net 531.

[0061] When the telescopic rod 525 rotates from 90 degrees to above the conveyor belt 31, the vacuum pump 518 gradually releases the suction of the telescopic rod 525. When the telescopic rod 525 rotates to above the conveyor belt 31, the vacuum pump 518 completely releases the suction on the telescopic rod 525, and the chip falls to the top of the stacking block 34 after losing the suction. During this period, the telescopic rod 525 gradually extends under the cooperation of the resistance rod 538 and the elliptical groove 537, and the ejection spring 535 gradually releases the ejection force applied to the annular gasket 533. The annular gasket 533 and the limiting plate 534 move to one side of the square tube 523 under the action of the unloading spring 536 to reset and release the limit on the chip, and then the chip falls to the top of the stacking block 34, so as to achieve the capture and placement of the chip, thereby ensuring that the chip can be smoothly placed above the stacking block 34 to increase the subsequent lamination effect.

[0062] Reference Figure 7 and Figure 8 As shown, in order to preheat and perform high-temperature lamination on the RFID tag, based on this, in this embodiment, the preheating plate 71 is located between the first conveyor belt 51 and the second conveyor belt 61, and a mounting groove 72 is opened at the lower end of the preheating plate 71, and a plurality of evenly distributed heating plates 73 are arranged on the top wall of the mounting groove 72.

[0063] Furthermore, in this embodiment, the high-temperature lamination unit 4 includes a receiving plate 42 arranged on the opposite sides of the two baffles 2, the receiving plate 42 is located on the side of the partition plate 8 away from the sealing plate conveying unit 6, a hydraulic rod 43 is installed on the upper end of the receiving plate 42, and a parallel plate 44 is provided at the telescopic end of the top of the hydraulic rod 43, and connecting blocks 45 are installed on the opposite sides of the two parallel plates 44, and a laminating plate 41 is commonly provided at the lower ends of the two connecting blocks 45, a heating groove 46 is opened inside the laminating plate 41, and a heating net 47 is installed on the bottom wall of the heating groove 46.

[0064] In actual application, after the chip is placed on the release paper, the stacking block 34 is controlled by the conveyor belt 31 to move toward the laminating plate 41. During this period, when the stacking block 34 passes under the preheating plate 71, the hot melt adhesive on the release paper is initially melted by the heating plate 73, so that the chip can adhere to the release paper, avoiding displacement of the chip when the conveyor belt 31 controls the movement of the chip toward the laminating plate 41, thereby increasing the lamination effect of the RFID tag; then the conveyor belt 31 controls the stacking block 34 to move to the bottom of the second conveyor belt 61 and pass through The grabbing assembly 52 grabs the coated paper above the second conveyor belt 31 and places the coated paper above the release paper. Then the conveyor belt 31 continues to control the stacking block 34 to move toward the side of the laminate 41 and moves to below the laminate 41. At this time, the hydraulic rod 43 controls the laminate 41 to move downward to above the stacking block 34 and heats the lower end of the laminate 41 through the heating net 47. When the laminate 41 contacts the stacking block 34, the stacking block 34 is heated and laminated, thereby achieving the lamination synthesis treatment of the RFID tag.

[0065] Reference Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 As shown, in order to provide driving force for the device through the extension and retraction of the hydraulic rod 43, based on this, in the present embodiment, two vertical grooves 9 are provided on the opposite sides of the two baffles 2, which are located on the side of the partition plate 8 away from the sealing plate conveying unit 6, and a displacement rod 91 is slidably arranged in the vertical groove 9, and a parallel plate 44 is installed between the two displacement rods 91 on the same baffle 2; any vertical groove 9 on the same baffle 2 is set through, and a driving rack 92 is installed after the displacement rod 91 in the vertical groove 9 slides out, and the opposite sides of the two baffles 2 are rotatably provided with a linkage gear 94 meshing with the driving rack 92 through the positioning shaft 93, and a ratchet and pawl mechanism is provided between the positioning shaft 93 and the linkage gear 94 on its outer wall, and any positioning shaft 93 is connected to the lower shaft 511 close to it through a belt drive, and the outer walls of the two lower shafts 511 are sleeved with relative gears 95 and synchronous gears 96 that mesh with each other, and the outer wall of the circular shaft 521 is sleeved with a matching gear 97 located on the side of the baffle 2 close to the synchronous gear 96.

[0066] Furthermore, in this embodiment, the driving rack 92 on one baffle plate 2 is located on the side of the linkage gear 94 away from the lower shaft 511, and the driving rack 92 on the other baffle plate 2 is located on the side of the linkage gear 94 close to the lower shaft 511, and the positioning shaft 93 and the rotating shaft 33 that are not connected to the lower shaft 511 with a belt drive are connected through a belt drive.

[0067] It should be noted that the ratchet and pawl mechanism provided between the positioning shaft 93 and the linkage gear 94 on its outer wall can control the driving rack 92 to drive the linkage gear 94 to rotate in one direction, but will not drive the linkage gear 94 to rotate in the opposite direction.

[0068] In actual application, firstly, the parallel plate 44 is controlled to move downward by the hydraulic rod 43. When the parallel plate 44 drives the driving rack 92 to move downward through the displacement rod 91, the driving rack 92 drives the positioning shaft 93 and the linkage gear 94 to rotate. The positioning shaft 93 controls the lower shaft 511 to rotate through the belt transmission. The lower shaft 511 drives another lower shaft 511 on the same side of the baffle 2 to rotate through two relative gears 95. The two lower shafts 511 respectively drive the first conveyor belt 51 and the second conveyor belt 61 to rotate. The lower shaft 511 drives the synchronous gear 96 to rotate, and the synchronous gear 96 drives the matching gear 97 and the circular shaft 521 to rotate; when the hydraulic rod 43 controls the parallel plate 44 to move downward to the lowest point, the driving rack 92 away from the side of the relative gear 95 drives the linkage gear 94 and the positioning shaft 93 to rotate, and the positioning shaft 93 controls the rotation shaft 33 to rotate through the belt transmission, and the rotation shaft 33 drives the conveyor belt 31 to rotate, so as to achieve the purpose of the hydraulic rod 43 providing driving force for the device, without the need to set up an additional driving device, thereby reducing costs.

[0069] When working:

[0070] Step 1: After placing the release paper on top of the stacking block 34, the conveyor belt 31 is driven to rotate by the rotating shaft 33, and the conveyor belt 31 drives the stacking block 34 to move toward the high-temperature lamination unit 4. During this period, the stacking block 34 passes under the first conveyor belt 51, under the preheating plate 71 and under the second conveyor belt 61 in turn.

[0071] Step 2: Place the chip on top of the first conveyor belt 51, and then use the vacuum pump 518 to extract the air inside the first conveyor belt 51, so that the suction holes 513 on the surface of the first conveyor belt 51 generate suction, thereby ensuring that the chip will not fall off during the rotation of the first conveyor belt 51. When the chip passes through the lower shaft 511, the annular offset groove 514 can ensure that the suction hole 513 still has suction, thereby preventing the chip from falling off and causing damage when passing through the lower shaft 511.

[0072] When the stacking block 34 moves to the bottom of the chip conveying unit 5, the stacking block 34 is limited by the limiting assembly 32. At this time, the telescopic rod 525 is below the first conveyor belt 51. The air in the square tube 523 and the telescopic rod 525 is extracted by the vacuum pump 518, so that the surface of the suction net 531 generates suction to adsorb the chips above the first conveyor belt 51 on the surface of the suction net 531, so as to capture the chips. Then the circular shaft 521 drives the square tube 523 and the connecting shaft 522 to rotate, and the square tube 523 drives the telescopic rod 525 on its surface to rotate, and the telescopic rod 525 drives the connecting ring 529, the synchronous rod 530 and the resistance rod 538 to rotate synchronously. During the movement, the telescopic rod 525 gradually shortens under the cooperation of the abutting rod 538 and the elliptical groove 537 from the beginning of rotation to the rotation to 90 degrees, and the ejection spring 535 exerts an ejection force on the annular gasket 533 toward the side of the suction net 531 under the extrusion of the telescopic tube 528. The annular gasket 533 moves toward the side of the suction net 531 under the action of the ejection spring 535 and drives the limiting piece 534 to move synchronously. The limiting piece 534 gradually passes through the suction net 531 and limits the chip during the movement toward the side of the suction net 531, so as to prevent the chip from falling during the rotation of the telescopic rod 525 and increase the chip grabbing effect of the suction net 531.

[0073] When the telescopic rod 525 rotates from 90 degrees to above the conveyor belt 31, the vacuum pump 518 gradually releases the suction of the telescopic rod 525. When the telescopic rod 525 rotates to above the conveyor belt 31, the vacuum pump 518 completely releases the suction on the telescopic rod 525, and the chip falls to the top of the stacking block 34 after losing the suction. During this period, the telescopic rod 525 gradually extends under the cooperation of the resistance rod 538 and the elliptical groove 537, and the ejection spring 535 gradually releases the ejection force applied to the annular gasket 533. The annular gasket 533 and the limiting plate 534 move to one side of the square tube 523 under the action of the unloading spring 536 to reset and release the limit on the chip, and then the chip falls to the top of the stacking block 34, so as to achieve the capture and placement of the chip, thereby ensuring that the chip can be smoothly placed above the stacking block 34.

[0074] Step 3: When the stacking block 34 passes under the preheating plate 71, the hot melt adhesive above the release paper is initially melted by the heating plate 73, so that the chip can adhere to the release paper, avoiding displacement of the chip in the process of the conveyor belt 31 controlling the chip to move to the laminate 41, thereby increasing the lamination effect of the RFID tag; then the conveyor belt 31 controls the stacking block 34 to move to the bottom of the second conveyor belt 61, grabs the coated paper above the second conveyor belt 31 through the grabbing assembly 52, and places the coated paper above the release paper.

[0075] Step 4: Continue to control the stacking block 34 to move toward the side of the laminate 41 and move it to the bottom of the laminate 41 through the conveyor belt 31. At this time, the hydraulic rod 43 controls the laminate 41 to move downward to the top of the stacking block 34 and heats the lower end of the laminate 41 through the heating net 47. When the laminate 41 contacts the stacking block 34, the stacking block 34 is heated and laminated to achieve the lamination synthesis treatment of the RFID tag.

[0076] Step 5: Remove the laminated RFID tag.

[0077] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0078] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A laminating and bonding device for producing and processing RFID tags, comprising a base plate (1), baffles (2) are arranged on both sides of the upper end of the base plate (1) near the base plate (1) in the longitudinal direction, a conveying unit (3) located above the base plate (1) is arranged between the two baffles (2), a chip conveying unit (5), a preheating unit (7), a sealing plate conveying unit (6) and a high-temperature laminating unit (4) located above the conveying unit (3) are sequentially installed on opposite sides of the two baffles (2) along the longitudinal direction, the chip conveying unit (5) and the sealing plate conveying unit (6) are symmetrically distributed along the preheating unit (7), a partition plate (8) for separating the high-temperature laminating unit (4) and the sealing plate conveying unit (6) is installed between the two baffles (2), characterized in that: The conveying unit (3) comprises a conveying belt (31) installed between two baffles (2); a limiting assembly (32) located above the conveying belt (31) is installed on opposite sides of the two baffles (2); the chip conveying unit (5) and the sealing plate conveying unit (6) respectively comprise a first conveying belt (51) and a second conveying belt (61) arranged between the two baffles (2); a grabbing assembly (52) is installed below the first conveying belt (51) and the second conveying belt (61); the preheating unit (7) comprises a preheating plate (71) arranged between the two baffles (2) and located above the conveying belt (31); and the high-temperature laminating unit (4) comprises a laminating plate (41) arranged between the two baffles (2) and located above the conveying belt (31); The grab assembly (52) comprises a circular shaft (521) and a connecting shaft (522). The circular shaft (521) and the connecting shaft (522) are rotatably penetrated on opposite sides of the two baffles (2). The circular shaft (521) and the connecting shaft (522) on the same baffle (2) are respectively located below the first conveyor belt (51) and the second conveyor belt (61). A square tube (523) connected to the connecting shaft (522) is installed between the circular shaft (521) and the connecting shaft (522). A separation plate (524) for separating the inside of the square tube (523) is provided on the inner wall. A plurality of telescopic rods (525) equidistantly distributed around the circumference are installed on the outer wall of the square tube (523) along the length direction. A plurality of through holes (526) connected to the telescopic rods (525) are opened on the outer wall of the square tube (523). The telescopic rods (525) are connected by a fixed tube (527) provided on the outer wall of the square tube (523). ) and a telescopic tube (528) in sliding contact with the inner wall of the fixed rod, a connecting ring (529) is sleeved on the outer wall of the telescopic rod (525) away from the square tube (523), a synchronization rod (530) is installed between two adjacent connecting rings (529), a suction net (531) is provided at one end of the telescopic rod (525) away from the square tube (523), an annular groove (532) is provided on the inner wall of the telescopic tube (528) close to the suction net (531), an annular gasket (533) is installed at one end of the annular groove (532) away from the suction net (531), a plurality of limit plates (534) passing through the suction net (531) are installed at one end of the annular gasket (533) close to the suction net (531), an ejection spring (535) is provided between the annular gasket (533) and the square tube (523), and a force unloading spring (536) is installed between the annular gasket (533) and the suction net (531); The grab assembly (52) further comprises an elliptical groove (537) formed on the inner side wall of the baffle (2), and a resistance rod (538) is provided between the connecting ring (529) on one side close to the baffle (2) and the baffle (2), and the resistance rod (538) is slidably docked in the elliptical groove (537).

2. The laminating and bonding device for producing and processing RFID tags according to claim 1, characterized in that: The conveying unit (3) further comprises a plurality of rotating shafts (33) rotatably disposed on opposite sides of the two baffles (2) and evenly distributed along the length direction thereof; a conveying belt (31) is sleeved on the outer walls of the plurality of rotating shafts (33); a plurality of evenly distributed stacking blocks (34) are mounted on the outer wall of the conveying belt (31); two protruding blocks (35) in sliding contact with the baffles (2) are symmetrically disposed on the outer wall of the stacking block (34) along the length direction; and a square block (36) for limiting the stacking block (34) is mounted between two adjacent protruding blocks (35).

3. The laminating and bonding device for producing and processing RFID tags according to claim 1, characterized in that: The limiting assembly (32) comprises a reciprocating group (37) located above the transmission belt, two reciprocating groups (37) respectively located below the first conveyor belt (51) and the second conveyor belt (61) are installed on opposite sides of the two baffles (2), the reciprocating group (37) comprises two fixing rings (371) installed on opposite sides of the two baffles (2) and distributed up and down, a sliding rod (372) is slidably passed through the two fixing rings (371), an extension block (373) located between the two fixing rings (371) is arranged on the side of the sliding rod (372) away from the baffle (2), a telescopic spring rod (374) is installed between the upper end of the extension block (373) and the upper fixing ring (371), a contact rack (375) located between the two fixing rings (371) is arranged on one side in the width direction of the sliding rod (372), and a contact block (376) is installed on the lower end of the sliding rod (372); The reciprocating group (37) further comprises a gear shaft (377) rotatably inserted into the two baffles (2); the gear shaft (377) is located on a side of the sliding rod (372) close to the preheating unit (7); an outer wall of the gear shaft (377) is sleeved with an offset gear (378) located on the inner side of the baffle (2); the offset gear (378) is meshed with a contact rack (375); and the outer walls of the two gear shafts (377) on the same side of the baffle (2) and the outer wall of the rotating shaft (33) are sleeved with a limiting belt (379) located on the opposite sides of the two baffles (2).

4. The laminating and bonding device for producing and processing RFID tags according to claim 1, characterized in that: The chip conveying unit (5) and the sealing plate conveying unit (6) both comprise a lower shaft (511) and an upper shaft (512) which are rotatably arranged between the two baffles (2), and a first conveying belt (51) and a second conveying belt (61) are respectively sleeved between the lower shaft (511) and the upper shaft (512) in the chip conveying unit and between the lower shaft (511) and the upper shaft (512) in the sealing plate conveying unit, and the outer walls of the first conveying belt (51) and the second conveying belt (61) are both provided with a plurality of evenly distributed suction holes (513), and the outer wall of the lower shaft (511) is provided with a plurality of annular offset grooves (514) which are staggered with the suction holes (513).

5. The laminating and bonding device for producing and processing RFID tags according to claim 4, characterized in that: A plurality of limiting shafts (515) for limiting the position of the first conveyor belt (51) and the second conveyor belt (61) are rotatably provided between the two baffles (2); opposite sides of the first conveyor belt (51) and the second conveyor belt (61) are gradually inclined downward; inner side walls of the two baffles (2) are both provided with sealing strips (516) located on the upper and lower sides of the first conveyor belt (51) and the second conveyor belt (61); An extension plate (517) is provided on any side wall of the bottom plate (1); a vacuum pump (518) is installed on the upper end of the extension plate (517) via a mounting block; and the first conveyor belt (51) and the second conveyor belt (61) are both connected to the vacuum pump (518) via a pipeline.

6. The laminating and bonding device for producing and processing RFID tags according to claim 1, characterized in that: The preheating plate (71) is located between the first conveyor belt (51) and the second conveyor belt (61), a mounting groove (72) is provided at the lower end of the preheating plate (71), and a plurality of evenly distributed heating plates (73) are provided on the top wall of the mounting groove (72).

7. The laminating and bonding device for producing and processing RFID tags according to claim 1, characterized in that: The high-temperature laminating unit (4) comprises a receiving plate (42) arranged on opposite sides of the two baffles (2), the receiving plate (42) being located on the side of the partition plate (8) away from the sealing plate conveying unit (6), a hydraulic rod (43) being installed on the upper end of the receiving plate (42), a parallel plate (44) being installed at the telescopic end of the top of the hydraulic rod (43), connecting blocks (45) being installed on opposite sides of the two parallel plates (44), a laminating plate (41) being commonly installed at the lower ends of the two connecting blocks (45), a heating groove (46) being opened inside the laminating plate (41), and a heating net (47) being installed on the inner bottom wall of the heating groove (46).

8. The laminating and bonding device for producing and processing RFID tags according to claim 7, characterized in that: Two vertical grooves (9) are provided on opposite sides of the two baffles (2) and are located on the side of the partition plate (8) away from the sealing plate conveying unit (6). Displacement rods (91) are slidably arranged in the vertical grooves (9). A parallel plate (44) is installed between the two displacement rods (91) on the same baffle (2); Any vertical groove (9) on the same baffle (2) is set through, and the displacement rod (91) in the vertical groove (9) is installed with a driving rack (92) after sliding out, and the opposite sides of the two baffles (2) are provided with a linkage gear (94) meshing with the driving rack (92) through the positioning shaft (93) rotationally, and a ratchet pawl mechanism is provided between the positioning shaft (93) and the linkage gear (94) on its outer wall, and any positioning shaft (93) and the lower shaft (511) close to it are connected through a belt drive, and the outer walls of the two lower shafts (511) are sleeved with relative gears (95) and synchronous gears (96) that mesh with each other, and the outer wall of the circular shaft (521) is sleeved with a matching gear (97) located on the side of the baffle (2) close to the synchronous gear (96).

9. The laminating and bonding device for producing and processing RFID tags according to claim 8, characterized in that: The driving rack (92) on one of the baffles (2) is located on a side of the linkage gear (94) away from the lower shaft (511), and the driving rack (92) on the other baffle (2) is located on a side of the linkage gear (94) close to the lower shaft (511). The positioning shaft (93) and the rotating shaft (33) that are not connected to the lower shaft (511) by belt transmission are connected by belt transmission.

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