A double-layer atom chip gyroscope and a cold atom cluster ring beam forming method thereof

Abstract

A double-layer atom chip gyroscope is composed of two layers of atom chips, the surface chip structure can generate a closed smooth guiding center with no magnetic field zero point ring magnetic guide; the bottom chip can generate a hierarchical transition magnetic trap, so that the cold atom group is smoothly and efficiently loaded into the ring magnetic guide from the macroscopic magnetic optical trap, while increasing the magnetic trap in the ring waveguide angle direction. Through the cooperation of the two layers of chips in time sequence, when the cold atom group is loaded into the ring magnetic guide from the dimple trap formed by the bottom chip, the angular restraint of the magnetic trap to the cold atom group disappears, the radial restraint increases, and the cold atom group provides additional angular momentum, realizes the cold atom group ring beam, and detects the matter wave gyroscope effect. The wire layout of the two layers of chips is a plane structure, which is easy to etch on the chip surface and convenient to debug, and the system is robust.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of atomic precision measurement, and particularly to the field of atomic gyroscope. In this field, it is needed to generate a ring-shaped matter wave interference of cold atom groups, specifically a double-layer atom chip gyroscope to generate a ring-shaped magnetic guide capable of loading cold atom groups and form a ring-shaped beam of cold atom groups. BACKGROUND

[0002] To realize a guided atom chip gyroscope, a core challenge lies in constructing a ring-shaped magnetic potential well capable of guiding cold atom groups to interfere along a closed loop. Although Ling Yun-Long et al. (2020, Acta Phys. Sin. 69(10) 100301) proposed an atom chip structure that can generate a ring-shaped magnetic guide with a smooth guided center and no magnetic field zero point. The structure is composed of three wires containing Archimedean spirals and circular arcs, which are staggered at intervals of π / 3. Among them, the Archimedean spiral part is used to generate a ring-shaped magnetic guide, and the circular arc part is used to connect the current, solving the gap problem of the ring-shaped magnetic guide.

[0003] However, this scheme has significant limitations in practical application. First, although the structure can generate the required ring-shaped magnetic guide, the fluctuation of the central magnetic potential energy exceeds the range of the two-photon kinetic energy provided by the beam-splitting laser. This means that, without an additional kinetic energy supplement mechanism, the cold atom groups are difficult to complete a full circle of motion in the ring-shaped magnetic guide, and cannot form the necessary ring-shaped beam to detect the matter wave gyroscope effect. Second, from the perspective of cold atom loading, the complexity and divergence of the three-wire Archimedean spiral structure bring additional challenges. Cold atoms captured in a macroscopic magnetic optical trap need to be transferred to a ring-shaped magnetic trap through a transition magnetic trap, but due to the particularity of the structure, it is difficult to effectively wire around to generate other magnetic traps in addition to the ring-shaped magnetic guide, which greatly limits the flexibility and efficiency of the loading process.

[0004] Therefore, how to solve the problems of cold atom loading and kinetic energy supplement while maintaining the advantages of the ring-shaped magnetic guide has become a bottleneck in current technology development. SUMMARY

[0005] To overcome the shortcomings of the prior art, the present application proposes a double-layer atom chip gyroscope, which can solve the problem that cold atom groups are difficult to move completely in the ring-shaped magnetic guide generated by the three-wire Archimedean spiral structure to form a ring-shaped beam, and the challenge of efficient transfer of cold atom groups from a macroscopic magnetic optical trap to a ring-shaped magnetic guide.

[0006] The technical solution of the present application is as follows:

[0007] In one aspect, the present application provides a double-layer atom chip gyroscope, which is characterized by being pasted by a surface layer chip and a bottom layer chip, the surface layer chip is used for generating a ring-shaped magnetic guide with a closed smooth guide center and a zero magnetic field point; the bottom layer chip is used for generating a hierarchical transition magnetic trap to realize the transfer of a cold atom group from a macroscopic magneto-optical trap to a ring-shaped magnetic guide and further cooling in the transfer process; the surface layer chip and the bottom layer chip provide additional angular momentum for the cold atom group through the cooperation of the time sequence and the change of the magnetic trap structure, so as to realize a ring-shaped beam for detecting the matter wave gyroscope effect.

[0008] Further, the surface layer chip is arranged on an atom chip substrate by three wires with the same shape staggered at a rotation angle of π / 3, each wire is composed of a first straight wire segment, a first Archimedes spiral wire segment, a first circular arc wire, a second circular arc wire segment, a second Archimedes spiral wire segment and a second straight wire segment in sequence; wherein the first straight wire segment and the second straight wire segment are used for current input and output respectively; the first Archimedes spiral wire segment and the second Archimedes spiral wire segment are used for generating a ring-shaped magnetic field guide.

[0009] Further, the expression of the center of the first Archimedes spiral wire segment and the second Archimedes spiral wire segment in polar coordinates is:

[0010] r=5+(0.3 / π)θ, wherein r is the radius of the center of the Archimedes spiral wire segment, and θ is the rotation angle.

[0011] Further, the first circular arc wire segment is connected with the starting point of the first Archimedes spiral wire segment, the first straight wire segment is connected with the ending point of the first Archimedes spiral wire segment and is tangent to the first Archimedes spiral wire segment; the second circular arc wire segment is connected with the starting point of the second Archimedes spiral wire segment, and the second straight wire segment is connected with the ending point of the second Archimedes spiral wire segment and is tangent to the second Archimedes spiral wire segment.

[0012] Further, the bottom layer chip is arranged on an atom chip substrate by five parallel wires and a sixth wire vertically penetrating the five wires, a plurality of Z-shaped wire structures are constructed by loading different currents on the wires to generate a hierarchical transition magnetic trap, including a macroscopic Z trap, a Z-shaped micro-magnetic trap and a dimple trap, so as to realize the smooth transfer of a cold atom group from a macroscopic magneto-optical trap to a ring-shaped magnetic guide.

[0013] Further, the five wires are respectively a first wire, a second wire, a third wire, a fourth wire and a fifth wire, wherein the third wire is arranged at the center of the atomic chip substrate, has a width of 0.1 mm, the second wire and the fourth wire are symmetrically distributed with the third wire as a central axis, and the distance between the second wire and the fourth wire is 2 mm, and the width of the second wire and the fourth wire is 0.2 mm; the first wire and the fifth wire are symmetrically distributed with the third wire as a central axis, and the distance between the first wire and the fifth wire is 6 mm, and the width of the first wire and the fifth wire is 0.5 mm; the sixth wire is arranged at the lower part of the atomic chip substrate, and the distance between the sixth wire and the lower edge of the atomic chip substrate is 14.8 mm, and the width of the sixth wire is 0.5 mm.

[0014] The two-layer chip wire layout is a planar structure, which is easy to etch on the chip surface and convenient for debugging, and the system has strong robustness.

[0015] In another aspect, the application also provides a method for generating a ring-shaped beam current by using the above-mentioned double-layer atomic chip gyroscope, characterized in that,

[0016] First, the macroscopic Z-trap is formed by loading current through the wires of the bottom layer chip, and the cold atom group in the macroscopic magnetic optical trap is connected;

[0017] Then, the current is gradually adjusted, so that the magnetic trap moves towards the surface of the chip and is compressed, and finally the cold atom group is loaded into the dimple trap;

[0018] The current and the bias magnetic field of the bottom layer chip are turned off, and the modulation current is loaded on the three wires of the surface layer chip to form a ring-shaped magnetic guide below the surface layer chip, at this time, the cold atom group is loaded from the dimple trap into the ring-shaped magnetic guide, and the cold atom group obtains additional angular momentum to form a ring-shaped beam current.

[0019] Compared with the prior art, the application has the following beneficial effects:

[0020] 1) After the surface layer chip loads the modulation current, a ring-shaped magnetic guide with a closed smooth guide center and no magnetic field zero point can be generated, and the cold atom group can realize loop interference by using the magnetic guide to detect the matter wave gyroscope effect, and the surface layer chip wire is a planar structure for easy processing and manufacturing;

[0021] 2) The bottom layer chip can generate a magnetic potential well with a gradually compressed x-direction, a gradually increased magnetic trap frequency and a gradually close magnetic trap center to the chip surface, so that the cold atom group can be efficiently transferred and loaded into the ring-shaped magnetic guide from the macroscopic magnetic optical trap, and the bottom layer chip wire is also a planar structure for easy processing and manufacturing;

[0022] 3) When the cold atom group is loaded from the dimple trap formed by the bottom layer chip into the ring-shaped magnetic guide formed by the surface layer chip, the angular constraint of the magnetic trap on the cold atom group disappears, the radial constraint increases, and additional angular momentum is provided to the cold atom group, so that the cold atom group forms a ring-shaped beam current. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a structural schematic diagram of the surface chip of the double-layer atomic chip gyroscope of the present application;

[0024] Figure 2 is a structural schematic diagram of a single wire in the surface chip of the double-layer atomic chip gyroscope of the present application;

[0025] Figure 3 is a structural schematic diagram of the bottom chip of the double-layer atomic chip gyroscope of the present application;

[0026] Figure 4 is an overall assembly diagram of the surface chip and the bottom chip of the double-layer atomic chip gyroscope of the present application. DETAILED DESCRIPTION

[0027] The technical solutions of the present application will be described in detail below in combination with the drawings and examples, but the protection scope of the present application should not be limited thereby.

[0028] A double-layer atomic chip gyroscope is formed by pasting two layers of atomic chips, namely a surface chip and a bottom chip. The surface chip is used to generate a ring-shaped magnetic guide with a closed smooth guide center and a zero point of magnetic field. The bottom chip is responsible for generating a hierarchical transition magnetic trap to realize smooth and efficient transfer of a cold atom group from a macroscopic magnetic optical trap to a ring-shaped magnetic guide, and further cooling in the transfer process. The two layers of atomic chips are coordinated in time sequence, and the magnetic trap structure is changed to provide additional angular momentum for the cold atom group, thereby realizing a ring-shaped beam for detecting the matter wave gyroscope effect.

[0029] Please refer to Figure 1 , Figure 1is a structural schematic diagram of a surface chip of a double-layer atomic chip gyroscope of the present application, as shown in the figure, the surface chip is composed of three wires of the same shape staggered on the atomic chip substrate at a rotation angle of π / 3, and the distance between the centers of adjacent wires is kept at 0.1 mm. The starting end 11 of the first wire, the starting end 21 of the second wire and the starting end 31 of the third wire are current input ends; the terminal end 16 of the first wire, the terminal end 26 of the second wire and the terminal end 36 of the third wire are current output ends. In this embodiment, the size of the chip substrate is 30.0 mm x 30.0 mm, the width of the three wires is 90 μm, the width of the groove between each wire is 10 μm, the width of the groove in the non-functional area is widened to 100 μm, the insulation resistance between each wire is > 200 MΩ, the working current is greater than 1 A, and the duration of simultaneous current loading of each wire is up to 20 s. The atomic chip substrate has a total of 3 layers, the uppermost layer is a gold (Au) layer with a thickness greater than 4 μm, which can provide a reflectivity of ≥ 90% at 780 nm (the reference value of the root mean square roughness of the chip surface is ≤ 10 nm); the second layer is SiO2 with a thickness of 0.5 μm; the third layer is Si with a thickness of 300 μm. Gold is easy to adsorb the working element rubidium, and a layer of fog-like rubidium powder will adhere to the surface of such a chip after long-term use, affecting the reflection quality of the gold layer, so a layer of quartz film with a thickness of 10 nm is coated on the functional area of 20.0 mm x 20.0 mm after completion to prevent the functional area from adsorbing rubidium atoms.

[0030] Figure 2 is a structural schematic diagram of a single wire in the surface chip of the double-layer atomic chip gyroscope of the present application, as shown in the figure, each wire comprises in turn: a first straight wire segment 1, a first Archimedes spiral wire segment 2, a first circular arc wire 3, a second circular arc wire segment 4, a second Archimedes spiral wire segment 5 and a second straight wire segment 6. Among them, the first straight wire segment 1 and the second straight wire segment 6 are respectively used for current input and output; the first Archimedes spiral wire segment 2 and the second Archimedes spiral wire segment 5 are responsible for generating a ring-shaped magnetic field guide; the first circular arc wire 3 and the second circular arc wire segment 4 are used to connect different parts.

[0031] Each wire has central symmetry, and each segment of the spiral, the circular arc and the straight wire are smoothly connected. In this structure, the expression of the center of the Archimedes spiral wire segment in polar coordinates is:

[0032] r = 5 + (0.3 / π)θ, where r is the radius (mm) of the center of the Archimedes spiral wire segment, and θ is the rotation angle, and the set rotation angle is 0 to 17π / 18. According to the expression, the starting radius of the center of the Archimedes spiral wire segment is 5 mm, and the radius increases by 0.3 mm every π angle. The center of the circular arc wire segment is a semicircle with a diameter of 5 mm connected with the starting point of the Archimedes spiral wire segment; the straight wire segment is connected with the terminal point of the Archimedes spiral wire segment and is tangent to it.

[0033] Please refer to Figure 3 , Figure 3 is the structure diagram of the bottom chip of the double-layer atom chip gyroscope of the present application. As shown in the figure, the bottom chip is composed of five first wires 41, second wires 42, third wires 43, fourth wires 44 and fifth wires 45 arranged in parallel with each other in sequence on the atom chip substrate, and a sixth wire 46 vertically penetrating the five wires. Among them, the third wire 43 is arranged at the center of the atom chip substrate, with a width of 0.1 mm, and can carry a maximum current of more than 2A. The second wire 42 and the fourth wire 44 are symmetrically distributed with the third wire 43 as the center axis, and the distance between them is 2 mm, the width is 0.2 mm, and the maximum current that can be loaded is more than 4A. The first wire 41 and the fifth wire 45 are symmetrically distributed with the third wire 43 as the center axis, and the distance between them is 6 mm, the width is 0.5 mm, and the maximum current that can be carried is more than 10A. The sixth wire 46 is arranged at the lower part of the atom chip substrate, and the distance from the lower edge of the atom chip substrate is 14.8 mm, the width is 0.5 mm, and the maximum current that can be carried is also more than 10A.

[0034] The material of the atom chip substrate can be a gold-filled PCB, which is convenient for processing and heat dissipation. The size of the gold-filled version is 40.0 mm x 40.0 mm, the surface gold thickness is 1 μm, the lower copper surface thickness is 35 μm, and the bottom layer is a 1 mm thick PCB version.

[0035] The bottom chip wire surface and the back surface of the surface chip are pasted by using vacuum glue, wherein the distance between the four edges of the surface chip and the edges of the bottom chip is 5 mm, and the overall assembly is as follows Figure 4 a, wherein the center of the sixth wire 46 of the bottom chip and the center of the first Archimedes spiral wire segment 2 of the second wire in the surface chip are vertically projected to coincide as Figure 4 b.

[0036] The two-layer chip can realize efficient transfer of cold atom groups from a macroscopic magnetic optical trap to a ring-shaped magnetic guide by step-by-step conduction, and form a ring-shaped beam, the specific steps are as follows:

[0037] Step one, the bottom chip is used to generate a hierarchical transition magnetic trap to realize the transfer of cold atom groups from a macroscopic magnetic optical trap to a macroscopic Z trap, to a Z-shaped micro magnetic trap and a dimple trap, and finally to the position of the ring-shaped magnetic guide. The process is as follows:

[0038] 1. In the case of a 0.5 mT bias magnetic field in the y direction, the first wire 41 and the fifth wire 45 are turned on, and when carrying a current of 10A, the magnetic trap position is located 1.5 mm below the surface chip, forming a macroscopic Z trap to transfer the cold atom group in the macroscopic magnetic optical trap to the surface of the chip;

[0039] 2. Keeping the bias magnetic field constant, gradually decrease the current in the first wire 41 and the fifth wire 45, and increase the current in the second wire 42 and the fourth wire 44 to achieve compression of the magnetic trap in the x direction. When the wire current is reduced to 4A and the current in the first wire 41 and the fifth wire 45 gradually decreases to 0, the magnetic trap frequency increases and the magnetic trap position is located 0.5mm below the surface chip. At this time, optical pumping is performed to load the cold atom cluster into the Z-shaped micro magnetic trap.

[0040] 3. With the bias magnetic field unchanged, when the current in the second wire 42 and the fourth wire 44 continues to decrease to 2A, the magnetic trap frequency further increases. The magnetic trap position is 0.1mm below the surface chip, which is the position where the annular magnetic guide is formed.

[0041] 4. The middle third wire 43 is turned on, and the current in the second wire 42 and the fourth wire 44 gradually decreases to 0. Together with the bias magnetic field, a dimple trap is formed, keeping the magnetic trap 0.1mm below the surface chip. This increases the confinement of the magnetic trap in the x-direction. Here, the center of the sixth wire 46 is tangent to the center of the annular magnetic guide, so the x-direction is the angular direction of the annular magnetic guide. At the same time, evaporation cooling is performed to increase the density of cold atomic clusters, preparing for the loading of the annular magnetic guide.

[0042] Step 2: Turn off the bias magnetic field and the current in the bottom-layer chip's wires. Apply a modulation current to the three wires of the surface-layer chip. The expressions for the modulation current are as follows:

[0043] I1=I a +I b sin(ω b t+φ),

[0044] I2=-I a -I b sin(ω b t),

[0045] I3 = I a +I b sin(ω b t-φ),

[0046] Among them I a For DC magnitude, I b Let ω be the magnitude of the exchange, t be time, and ω be the value of the exchange. b Where φ is the modulation frequency, and φ is the phase difference of the modulation current applied to different conductors.

[0047] After testing, I was set. a / I b =10, which can suppress fluctuations in the size of the magnetic guidance center when the applied current I a For 1A, I bAt 0.1A, the magnitude of the magnetic field at the center of the ring magnetic guide is approximately 0.25mT, with fluctuations of approximately 0.005mT. Because the relative positions of the three wires in the surface chip constantly change with the angle θ, to ensure that the change in the current phase difference of the three wires within a loop remains consistent, the current phase difference φ is set to 2π / 3. The magnitude of the magnetic field experienced by the atoms trapped in the magnetic trap is a time-averaged value and is independent of the modulation frequency. However, the adiabatic approximation of atomic motion requires that the modulation frequency of the magnetic trap should be less than the Larmor oscillation frequency and greater than the frequency of the magnetic trap itself. 87 Rb(5 2 S 1 / 2 F = 2, m F =2), its Larmor frequency at the magnetic guidance center is approximately ω. L The frequency of the toroidal magnetic guide trap is approximately ω, which is approximately 2π × 5.2 MHz. t ≈2π×30Hz, therefore, choose ω b = 2π × 10kHz.

[0048] After a modulated current is applied to the surface chip wires, a ring-shaped magnetic guide is formed 0.1 mm below the surface chip. Cold atomic clusters transfer from the dimple trap to the ring-shaped magnetic guide, resulting in the disappearance of angular confinement and an increase in radial confinement, thus achieving cluster-splitting circulation. When the applied current I... a For 1A, I b At 0.1A, the magnitude of the magnetic field at the center of the toroidal magnetic guide is approximately 0.25 mT, with fluctuations of approximately 0.005 mT, and the shallowest depth of the magnetic trap is approximately 0.3 mT. For 87 Rb(5 2 S 1 / 2 F = 2, m F In case of (2), the fluctuation of the toroidal magnetic guiding magnetic field is approximately 3.4 μK, and the shallowest depth of the magnetic trap is approximately 200 μK. After undergoing the previous stage of evaporation and cooling, the temperature of the cold atom clusters is generally below 10 μK. Therefore, this magnetic trap depth is sufficient to confine the movement of the cold atom clusters within the trap, and the heated cold atoms will also escape, thus acting as a filter. 87 Rb(5 2 S 1 / 2 F = 2, m F =2) 780nm band split laser two-photon momentum The potential energy is approximately 1 μK, which is smaller than the magnetic field fluctuations. However, because the cold atom cluster loses its angular confinement and gains greater radial confinement when loaded into the toroidal magnetic guide by the dimple trap, the change in the magnetic trap structure allows the cold atoms to gain additional momentum in the angular direction. Furthermore, the initial position of the cold atom cluster loaded into the toroidal guide is not the lowest point of the entire guiding potential energy. The magnetic field fluctuations can also be reduced by decreasing the modulation current, thereby enabling the cold atom cluster to successfully form a toroidal beam for detecting the matter wave gyroscope effect.

[0049] In this embodiment, the efficient transfer of cold atom group from macroscopic magneto-optical trap to ring-shaped magnetic guiding is realized by the hierarchical transition magnetic well of the bottom chip, and the cold atom group is further cooled in the transfer process. The fluctuation of the central magnetic field of the magnetic guiding is suppressed by the layout design of the wires of the surface chip and the use of modulated current. The bottom chip and the surface chip cooperate in time sequence and change the magnetic well structure to provide additional angular momentum for the cold atom group, thereby ensuring that the cold atom group can stably form a ring-shaped beam. The wire layout of the two-layer chip is a planar structure, which is easy to etch on the surface of the chip and is convenient for debugging and maintenance.

Claims

1. A dual-layer atomic chip gyroscope, characterized in that, Composed of a surface chip and a bottom chip, the surface chip generates a closed, smooth, annular magnetic guide with no magnetic field zero at its center. The bottom chip generates a graded transition magnetic trap to transfer cold atom clusters from a macroscopic magneto-optical trap to the annular magnetic guide, and further cools them during the transfer process. Through timing coordination and changes in the magnetic trap structure, the surface chip and bottom chip provide additional angular momentum to the cold atom clusters, thereby realizing an annular beam for detecting the matter wave gyroscope effect. The underlying chip consists of five parallel wires and a sixth wire that runs vertically through the five wires, arranged on an atomic chip substrate. By applying different currents to the wires, multiple Z-shaped wire structures are constructed to generate a hierarchical transition magnetic trap, including a macroscopic Z-trap, a Z-shaped micro magnetic trap, and a dimple trap, thereby achieving a smooth transfer of cold atomic clusters from a macroscopic magneto-optical trap to a ring magnetic guide. The five wires are the first wire (41), the second wire (42), the third wire (43), the fourth wire (44), and the fifth wire (45). The third wire (43) is located at the center of the atomic chip substrate and has a width of 0.1 mm. The second wire (42) and the fourth wire (44) are symmetrically distributed about the third wire (43) as the central axis and are 2 mm apart with a width of 0.2 mm. The first wire (41) and the fifth wire (45) are symmetrically distributed about the third wire (43) as the central axis and are 6 mm apart with a width of 0.5 mm. The sixth wire (46) is located at the bottom of the atomic chip substrate and is 14.8 mm away from the bottom edge of the atomic chip substrate with a width of 0.5 mm.

2. The dual-layer atomic chip gyroscope according to claim 1, characterized in that, The surface chip consists of three identical wires arranged alternately on the atomic chip substrate at a rotation angle of π / 3. Each wire is composed of a first straight wire segment (1), a first Archimedean spiral wire segment (2), a first circular arc wire segment (3), a second circular arc wire segment (4), a second Archimedean spiral wire segment (5), and a second straight wire segment (6). The first straight wire segment (1) and the second straight wire segment (6) are used for current input and output, respectively. The first Archimedean spiral wire segment (2) and the second Archimedean spiral wire segment (5) are used to generate a ring magnetic field for guidance.

3. A dual-layer atomic chip gyroscope according to claim 2, characterized in that, The polar coordinates for the centers of the first Archimedean spiral segment (2) and the second Archimedean spiral segment (5) are as follows: r = 5 + (0.3 / π)θ Where r is the radius of the center of the Archimedean spiral conductor segment, and θ is the rotation angle.

4. A dual-layer atomic chip gyroscope according to claim 2, characterized in that, The first arc-shaped conductor is connected to the starting point of the first Archimedean spiral conductor segment, and the first straight conductor segment is connected to the ending point of the first Archimedean spiral conductor segment and is tangent to it; the second arc-shaped conductor segment is connected to the starting point of the second Archimedean spiral conductor segment, and the second straight conductor segment is connected to the ending point of the second Archimedean spiral conductor segment and is tangent to it.

5. A method for generating a ring beam using a dual-layer atomic chip gyroscope as described in any one of claims 1-4, characterized in that, First, current is applied through the wires of the underlying chip to form a macroscopic Z-well, which in turn connects to the cold atom clusters within the macroscopic magneto-optical trap. Then, the current is gradually adjusted to move and compress the magnetic trap toward the chip surface, ultimately loading the cold atom cluster into the dimple trap; The current and bias magnetic field of the bottom chip are turned off, while the three wires of the top chip are loaded with modulated current to form a ring magnetic guide under the top chip. At this time, the cold atom cluster is loaded from the dimple trap into the ring magnetic guide. The cold atom cluster gains additional momentum in the angular direction and forms a ring beam.

6. The method for generating a ring beam using a dual-layer atomic chip gyroscope according to claim 5, characterized in that, The three wires of the surface chip are loaded with modulation current, and the expressions for the modulation current are as follows: I1=I a +I b sin(ω b t+φ), I2=-I a -I b sin(ω b t), I3=I a +I b sin(ω b t-φ), Among them I a For DC magnitude, I b Let ω be the magnitude of the exchange, t be time, and ω be the value of the exchange. b Where φ is the modulation frequency, and φ is the phase difference of the modulation current applied to different conductors.

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