Method and system for detecting defects on workpiece surface

Abstract

The present application relates to a method and system for detecting defects on the surface of a workpiece. The method for detecting defects on the surface of a workpiece includes: when the first supporting structure is at a first preset position, determining that the imaging condition of the first acquisition part of the workpiece to be detected in the image acquisition module meets the first imaging condition, the first current position of the second supporting structure; calculating the plane motion path according to the first current position; when the first supporting structure is at a second preset position, determining that the imaging condition of the second acquisition part of the workpiece to be detected in the image acquisition module meets the second imaging condition, the second current position of the second supporting structure; calculating the arc edge motion path according to the second current position; controlling the image acquisition module to capture multiple plane images and multiple arc edge images to perform defect detection on the surface of the workpiece to be detected and generate target detection results. The method provided by the present application improves the accuracy of workpiece surface defect detection.

Description

Technical Field

[0001] The present application relates to the field of machine vision detection technology, and in particular to a method and system for detecting defects on the surface of a workpiece. Background Art

[0002] With the rapid development of the smart wearable industry, defect detection of various components within these devices is becoming increasingly important. For smartwatches, the watch cover is a crucial component, and its factory quality directly impacts the user experience. While smaller than traditional mobile phone covers, watch covers have a larger curved edge area, making defect detection more challenging and requiring stricter inspection regulations, making manual inspection challenging.

[0003] Currently, automated inspection equipment based on machine vision offers advantages such as high efficiency, accuracy, and low cost, making it suitable for defect detection on watch covers to a certain extent. For glass covers, glass manufacturers often implement a dedicated inspection process for appearance defects before coating the white glass watch covers to ensure proper operation of the coating process. Conventional imaging technology typically inspects the curved edges of watch covers at a separate station, but the curved edges of various glass covers vary significantly, making a single station unable to accommodate all types of glass covers. Therefore, edge inspection consumes significant equipment space and time, impacting inspection efficiency. Summary of the Invention

[0004] In order to solve the above technical problems, an embodiment of the present application provides a method and system for detecting defects on the surface of a workpiece.

[0005] In a first aspect, an embodiment of the present application provides a method for detecting defects on a workpiece surface, comprising:

[0006] When the first supporting structure is at a first preset position, it is determined that an imaging condition of a first acquisition portion of the workpiece to be inspected in the image acquisition module meets a first imaging condition, the first current position of the second supporting structure; wherein the workpiece to be inspected is fixed to the first supporting structure and the image acquisition module is fixed to the second supporting structure; and the first imaging condition refers to a planar imaging condition of the workpiece;

[0007] Calculating a planar motion path for the workpiece to be inspected based on the first current point, and determining a plurality of first shooting points on the planar motion path;

[0008] When the first supporting structure is at a second preset position, determining that an imaging condition of a second acquisition portion of the workpiece to be inspected in the image acquisition module meets a second imaging condition, the second current position of the second supporting structure; wherein the second imaging condition refers to an imaging condition of a curved surface of the workpiece;

[0009] Calculating an arc edge motion path for the workpiece to be inspected based on the second current point, and determining a plurality of second shooting points on the arc edge motion path;

[0010] The image acquisition module is controlled to obtain multiple plane images when the second supporting structure is at each first shooting point, and the image acquisition module is controlled to obtain multiple arc edge images when the second supporting structure is at each second shooting point; defect detection is performed on the surface of the workpiece to be inspected based on the multiple plane images and the multiple arc edge images to generate a target detection result.

[0011] In a second aspect, an embodiment of the present application provides a system for detecting defects on a workpiece surface. The system includes an image acquisition module, a support module, and a control module.

[0012] The image acquisition module is used to acquire images of the surface of the workpiece to be inspected;

[0013] The support module is used to support the image acquisition module and the workpiece to be inspected, wherein the support module includes a first support structure and a second support structure, the workpiece to be inspected is fixed on the first support structure, and the image acquisition module is fixed on the second support structure;

[0014] The control module is used to execute the method of the first aspect mentioned above.

[0015] In a third aspect, a device for detecting defects on a workpiece surface is provided, the device comprising an image acquisition module, a support module, and a control module, wherein the support module comprises a first support structure for supporting the image acquisition module and a second support structure for supporting a workpiece to be inspected, such that the image acquisition module is placed above the workpiece to be inspected, wherein:

[0016] The image acquisition module is used to acquire the surface image of the workpiece to be inspected in a plane posture and an arc edge posture;

[0017] The control module is used to execute the method of the first aspect mentioned above.

[0018] In a fourth aspect, a device for detecting defects on a workpiece surface is provided, the device comprising:

[0019] a first determining unit configured to determine, when the first supporting structure is at a first preset position, a first current position of the second supporting structure when an imaging condition of a first acquisition portion of the workpiece to be inspected in the image acquisition module satisfies a first imaging condition; wherein the workpiece to be inspected is fixed to the first supporting structure, and the image acquisition module is fixed to the second supporting structure; and the first imaging condition refers to a planar imaging condition of the workpiece;

[0020] a first path planning unit, configured to calculate a planar motion path for the workpiece to be inspected based on the first current point, and determine a plurality of first shooting points on the planar motion path;

[0021] a second determining unit, configured to determine, when the first supporting structure is at a second preset position, a second current position of the second supporting structure when an imaging condition of a second acquisition portion of the workpiece to be inspected in the image acquisition module satisfies a second imaging condition; wherein the second imaging condition refers to an imaging condition of a curved surface of the workpiece;

[0022] a second path planning unit, configured to calculate an arc-edge motion path for the workpiece to be inspected based on the second current point, and determine a plurality of second shooting points on the arc-edge motion path;

[0023] a shooting unit, configured to control the image acquisition module to capture a plurality of planar images when the second supporting structure is at each first shooting point, and to control the image acquisition module to capture a plurality of arc edge images when the second supporting structure is at each second shooting point;

[0024] The detection unit is used to perform defect detection on the surface of the workpiece to be inspected based on multiple plane images and multiple arc edge images, and generate target detection results.

[0025] The present application provides a method for detecting defects on the surface of a workpiece, comprising: determining, when the first supporting structure is at a first preset position, a first current position of a second supporting structure when the imaging condition of a first acquisition part of the workpiece to be detected in an image acquisition module meets a first imaging condition; wherein the workpiece to be detected is fixed on the first supporting structure, and the image acquisition module is fixed on the second supporting structure; the first imaging condition refers to a planar imaging condition of the workpiece; calculating a planar motion path for the workpiece to be detected based on the first current position, and determining a plurality of first shooting points on the planar motion path; and determining, when the first supporting structure is at a second preset position, a second acquisition point position of the workpiece to be detected. When the imaging condition of the collected part in the image acquisition module meets the second imaging condition, the second current point position of the second support structure; wherein the second imaging condition refers to the arc surface imaging condition of the workpiece; the arc edge motion path of the workpiece to be detected is calculated according to the second current point position, and a plurality of second shooting points are determined on the arc edge motion path; the image acquisition module is controlled to obtain a plurality of plane images when the second support structure is at each first shooting point position, and the image acquisition module is controlled to obtain a plurality of arc edge images when the second support structure is at each second shooting point position; defect detection is performed on the surface of the workpiece to be detected based on the plurality of plane images and the plurality of arc edge images, and a target detection result is generated. The present application realizes the plane and arc surface detection of the workpiece by adjusting the point position of the support structure, solves the problems of difficult arc edge detection, high complexity and large imaging interference in the existing workpiece appearance detection technology, and effectively improves the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 A schematic structural diagram of a workpiece surface defect detection system provided in an embodiment of the present application;

[0029] Figure 2 A schematic flow chart of a method for detecting defects on a workpiece surface provided in an embodiment of the present application;

[0030] Figure 3 A schematic diagram of a workpiece posture provided in an embodiment of the present application;

[0031] Figure 4 for Figure 2 Schematic diagram of a detailed process of S201 in a method for detecting defects on a workpiece surface;

[0032] Figure 5 for Figure 2 Schematic diagram of a detailed process of S205 in a method for detecting defects on a workpiece surface;

[0033] Figure 6 A schematic diagram of a workpiece acquisition triggering process provided in an embodiment of the present application;

[0034] Figure 7 A schematic structural diagram of a device for detecting defects on a workpiece surface provided in an embodiment of the present application;

[0035] Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0036] In order to more clearly understand the above-mentioned objectives, features and advantages of the present application, the scheme of the present application will be further described below. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other.

[0037] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application can also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present application, not all of the embodiments.

[0038] Currently, when inspecting the cover plates of smart devices, in addition to the fact that arc edge detection cannot take into account all types of glass cover plates, the existing reverse support structure will inevitably interfere with imaging, resulting in a large number of over-inspections of the inspection equipment, affecting detection efficiency and failing to reflect the advantages of automated equipment.

[0039] In response to technical issues in the above-mentioned workpiece white glass appearance inspection technology, such as difficulty in detecting arc edges, high complexity of the inspection system, large imaging interference, and interference from the workpiece back support structure, the embodiments of the present application provide a method for detecting defects on the workpiece surface. The provided image acquisition module is a reflective imaging module composed of a camera and at least two light sources, which effectively avoids imaging interference from the lower surface of the workpiece and the support module. Moreover, based on the multi-axis control of the support module and the image acquisition module, the shooting points can be customized according to the appearance and shape of different workpieces, which is compatible with the inspection requirements of most workpiece upper surfaces and improves the inspection efficiency. This will be described in detail through one or more of the following embodiments.

[0040] The defect detection method for the workpiece surface provided in the embodiment of the present application can be applied to the defect detection scenario of the workpiece surface. The method can be performed by a defect detection device / system for the workpiece surface, and the device can be implemented by software and / or hardware, and the device can be integrated into an electronic device. Among them, the electronic device can include but is not limited to mobile terminals such as smart phones, laptops, digital broadcast receivers, personal digital assistants (PDAs), tablet computers (Tablet Personal Computers, Tablet PCs), PMPs (portable multimedia players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), wearable devices, etc., and fixed terminals such as digital televisions, desktop computers, smart home devices, etc.

[0041] Figure 1 This is a schematic diagram of the structure of a workpiece surface defect detection system provided in an embodiment of the present application. The defect detection system includes an image acquisition module 1, a support module 2, and a control module 3, wherein:

[0042] The image acquisition module 1 is used to acquire images of the surfaces of the workpieces 1-6 to be inspected;

[0043] The support module 2 is used to support the image acquisition module 1 and the workpiece to be inspected 1-6, wherein the support module 2 includes a first support structure 2-2 and a second support structure 2-1. The workpiece to be inspected 1-6 is fixed on the first support structure 2-2, and the image acquisition module 1 is fixed on the second support structure 2-1;

[0044] The control module 3 is used to execute the defect detection method for the workpiece surface, specifically: controlling the support module 2 and the image acquisition module 1, wherein the control module 3 includes a driving module and a processing module, the driving module is used to control the first support structure 2-2 to run to a preset point and a shooting point, and the processing module is used to calculate the motion path for the workpiece 1-6 to be inspected and to perform defect detection on the surface of the workpiece 1-6 to be inspected based on the image to generate a target detection result; wherein the shooting point is determined on the motion path.

[0045] Among them, the image acquisition module 1 includes a camera 1-1, a lens 1-2 and a filter 1-3. The camera 1-1 and the lens 1-2 are connected for image acquisition, and the filter 1-3 is connected to the rear end of the lens 1-2 for filtering out ambient stray light.

[0046] It is understandable that the camera 1-1 is connected to the lens 1-2 for image acquisition, and the filter 1-3 is connected to the rear end of the lens 1-2 for filtering out other ambient stray light.

[0047] Among them, the image acquisition module 1 also includes multiple lighting devices configured with different light source types, and the multiple lighting devices include a first lighting device 1-4 configured with a planar light source and a second lighting device 1-5 configured with a strip light source, wherein the light-emitting panel of the first lighting device 1-4 is composed of a plurality of first light-emitting unit patches of a first set frequency, and the front end of the first lighting device 1-4 is configured with quartz glass, and the light-emitting panel of the second lighting device 1-5 is composed of a plurality of second light-emitting unit patches of a second set frequency, and the front end of the second lighting device 1-5 is configured with a cylindrical mirror.

[0048] Optionally, the first lighting device is used to illuminate at least part of the multiple first light-emitting units to uniformly diverge the emitted first light beam through the quartz glass to a first surface area of ​​the workpiece to be inspected; wherein the first light beam is used to form non-uniform bright field illumination on the surface of the workpiece to be inspected; the second lighting device is used to illuminate at least part of the multiple second light-emitting units to shrink and converge the emitted second light beam through a cylindrical mirror to a second surface area of ​​the workpiece to be inspected; wherein the second light beam is used to form dark field illumination on the surface of the workpiece to be inspected.

[0049] It is understandable that the light-emitting panel of the first lighting device 1-4 is composed of a plurality of specific frequency LED light-emitting unit (first light-emitting unit) patches, and the specific frequency refers to a pre-set first set frequency. By selecting LEDs of different wavelengths, the desired spectral characteristics can be achieved. Among them, the first light-emitting patch can be an LED light-emitting unit patch, and the layout of the plurality of LED light-emitting unit patches corresponds to the size of the light-emitting panel and also corresponds to the different lengths and widths of the workpieces to be tested. Among them, the front end of the first lighting device 1-4 is configured with quartz glass, which can make the light source uniformly diverge. After being lit, the first light beam emitted by at least part of the first light-emitting unit is uniformly diverged to the first surface area of ​​the workpiece through the quartz glass. The workpiece 1-6 reflects the light, forming non-uniform bright field illumination in the first surface area, which can highlight the semi-bright field defects of the workpiece. The semi-bright field generally detects protrusions, depressions, dirt, etc. The light-emitting panel of the second lighting device 1-5 is composed of a plurality of LED light-emitting units (second light-emitting units) patches of a specific frequency, wherein the specific frequency refers to a pre-set second set frequency, wherein the first set frequency and the second set frequency may be the same or different, and may be determined according to the testing requirements of the workpiece. The front end of the second lighting device 1-5 is provided with a cylindrical mirror, which can make the light beam shrink and converge in the front. At least part of the second light beam emitted by the second light-emitting unit is shrunk and converged to the second surface area of ​​the workpiece through the cylindrical mirror, and is reflected by the workpiece 1-6 to be tested, forming dark field illumination in the second surface area, which can highlight the dark field defects of some workpieces. The dark field generally detects fine scratches, etc.

[0050] It is understandable that the number of the first lighting devices 1 - 4 and the second lighting devices 1 - 5 is not limited and can be determined according to the detection requirements of the workpiece.

[0051] It can be understood that the second supporting structure 2-1 fixes the image acquisition modules 1-1 to 1-5 respectively. The first supporting structure 2-2 fixes the workpiece to be tested 1-6.

[0052] Optionally, the first support structure is provided with a first adjustment axis adjustable in the direction of 0 to 360 degrees, and the first adjustment axis includes an α-axis and a β-axis, wherein the α-axis and the β-axis are used to adjust the tilt posture of the workpiece to be detected relative to the image acquisition module.

[0053] It is understood that the workpiece is fixed on the first support structure 2-2, for example, Figure 1 As shown, the lower surface of the workpiece is adsorbed onto the first support structure 2-2. The first support structure 2-2 is provided with a first adjustment axis that can be adjusted in a direction of 0 to 360 degrees. The first adjustment axis includes an α-axis and a β-axis. In other words, the first support structure 2-2 can be adjusted in the α-axis and β-axis directions, and the adjustment range of the α-axis and the β-axis can reach 0 to 360 degrees. The α-axis and the β-axis are used to adjust the tilt posture of the workpiece relative to the image acquisition module. In other words, the angular posture of the workpiece can be adjusted by adjusting the α-axis and the β-axis.

[0054] Optionally, the second support structure is provided with a second adjustment axis that can be adjusted in multiple degrees of freedom directions, and the second adjustment axis includes an x-axis, a y-axis and a z-axis, wherein the x-axis and the y-axis are used to adjust the field of view position of the image acquisition module, and the z-axis is used to adjust the vertical distance between the image acquisition module and the workpiece to be detected, and the vertical distance reflects the focus of the image.

[0055] As can be understood, the image acquisition module 1 is fixed to the second support structure 2-1, and the second support structure 2-1 is provided with a second adjustment axis that can be adjusted in multiple degrees of freedom. The second adjustment axis includes an x-axis, a y-axis, and a z-axis. The control module can realize adjustment in the three degrees of freedom of the x-axis, y-axis, and z-axis. Adjustment in the x-axis and y-axis directions can change the field of view position of the camera in the image acquisition module, so that all workpieces can be scanned and imaged. Adjustment in the z-axis direction can change the vertical distance between the camera and the workpiece. The vertical distance reflects the focus of the captured image. That is, adjustment in the z-axis can ensure that the captured image is in clear focus.

[0056] Optionally, the control module includes a driving module and a motion controller. The driving module is used to control the movement of the support module and to provide real-time feedback of the movement position to the motion controller. The motion controller is used to output a high-level signal for controlling the strobing of multiple lighting devices when receiving the feedback of the movement position.

[0057] It can be understood that the control module 3 is used to control the light source triggering of the camera 1-1, the first lighting device 1-4 and the second lighting device 1-5 in the image acquisition module 1 and the posture adjustment of the support module 2. The control module 3 is used to execute the following workpiece surface defect detection method. For specific instructions, please refer to the following embodiment.

[0058] As can be understood, the control module 3 includes a host computer program that sequentially sets the planar motion paths and arc-edge motion paths of the first support structure 2-1 and the second support structure 2-2. After receiving the spatial coordinates of the support modules from the motion controller, the drive module in the control module 3 controls the support structures to move to the shooting point by adjusting the x-axis, y-axis, and z-axis, as well as the α-axis and β-axis, and provides real-time feedback on the support structure's motion position to the motion controller. After receiving the feedback on the motion position, the motion controller determines whether it is the shooting point. Upon determining the shooting point, the circuit is triggered to output a high-level signal capable of controlling the strobing of multiple lighting devices, causing the first lighting device 1-4 and the second lighting device 1-5 to strobe. The camera 1-1 then takes a picture, controlling the light source and camera, completing a pulse cycle. At the next moment, the next pulse response is completed at the shooting point, and the next pulse response is completed until the workpiece's planar motion path and arc-edge motion path are completed, achieving the goal of capturing and storing all points.

[0059] Based on the above embodiments, Figure 2 A flow chart of a method for detecting defects on a workpiece surface provided in an embodiment of the present application is provided, which is applied to the above-mentioned defect detection system or control module on the workpiece surface, specifically including the following: Figure 2 The following steps are shown:

[0060] S201: When the first supporting structure is at a first preset position, it is determined that the imaging condition of the first acquisition part of the workpiece to be inspected in the image acquisition module meets the first imaging condition, and the first current position of the second supporting structure.

[0061] The workpiece to be inspected is fixed on the first supporting structure, and the image acquisition module is fixed on the second supporting structure; the first imaging condition refers to the planar imaging condition of the workpiece.

[0062] It is understandable that image acquisition is performed on the planar area of ​​the workpiece to be inspected (hereinafter referred to as the workpiece), and the workpiece can be a watch cover. Specifically, the first supporting structure is set to a first preset point position, and the workpiece is fixed on the first supporting structure. This setting of the first supporting structure can keep the workpiece in a horizontal posture. Subsequently, the point position of the second supporting structure is adjusted so that the imaging condition of the first acquisition part of the workpiece in the image acquisition module meets the first imaging condition, and the first current point position of the second supporting structure in this case is determined. Among them, the first imaging condition refers to the planar imaging condition when the workpiece is imaged in a planar area, and the planar imaging condition can be set according to the detection requirements of the workpiece.

[0063] It can be understood that the first preset point position means that both the α axis and the β axis are 0 degrees, so that the workpiece is always in a horizontal posture when performing planar area image acquisition (picture collection).

[0064] For example, see Figure 3 , Figure 3 A schematic diagram of a workpiece posture provided in an embodiment of the present application is shown as follows: Figure 3 As shown in the figure, when the α-axis and β-axis of the first support structure are both 0 degrees, the workpiece is in a horizontal posture / planar posture, in which case a planar image of the workpiece can be captured. When at least one of the α-axis and β-axis of the first support structure is not 0 degrees, the workpiece is in an inclined posture / arc edge posture, as shown in the figure. Figure 3 As shown, the workpiece has an arc angle of α in the β-axis direction. In this case, the arc edge image of the workpiece can be collected.

[0065] S202: Calculate a planar motion path for the workpiece to be inspected based on the first current point, and determine a plurality of first shooting points on the planar motion path.

[0066] As can be understood, based on the above-described S201, a planar motion path is calculated based on the first current position of the second support structure in the horizontal posture of the workpiece. The planar motion path refers to the motion path of the second support structure, ensuring that the image acquisition module can capture complete planar information of the workpiece. After the planar motion path of the second support structure is planned, multiple first shooting points are determined on the planar motion path. The shooting points refer to the motion points / planned points of the second support structure. The image acquisition module will subsequently capture images at these shooting points.

[0067] The first current point includes a first initial point and a first end point.

[0068] Optionally, the calculation of the planar motion path for the workpiece to be inspected based on the first current point in S202 and the determination of multiple first shooting points on the planar motion path can be specifically implemented by the following steps:

[0069] Based on the first initial point and the first end point, a straight line fitting is performed to determine a planar motion path for the workpiece to be inspected, wherein the length of the planar motion path is greater than the length of the workpiece to be inspected; and multiple first shooting points are determined on the planar motion path according to a set step size.

[0070] It is understandable that the first current point involves the position data and direction signals of each axis in the x-axis, y-axis, and z-axis, wherein the first current point includes a first initial point and a first end point. The first initial point refers to the specific point at which image acquisition starts, and the first end point refers to the specific point at which image acquisition ends. Based on the first initial point and the first end point, a straight line fitting is performed to obtain a plane motion path, that is, the path of the plane image acquisition is a fitted straight line between the two points, wherein the path length of the plane motion path is greater than the length of the workpiece, or the path length of the plane motion path is greater than the length of the area to be inspected of the workpiece. For example, if only the middle area of ​​the workpiece is inspected, the path length can be greater than the length of the middle area. Subsequently, the first shooting points are evenly distributed along the plane motion path, and the image acquisition module takes pictures when the second support structure moves to the shooting point. The two first shooting points can be separated by a set step length, and the set step lengths between adjacent first shooting points can be the same or different, and can be set according to the acquisition requirements.

[0071] S203: When the first supporting structure is at a second preset position, it is determined that the imaging condition of the second acquisition part of the workpiece to be inspected in the image acquisition module meets the second imaging condition, and the second current position of the second supporting structure.

[0072] Among them, the second imaging condition refers to the arc surface imaging condition of the workpiece, the second preset point refers to the β axis being at least one arc of 0 degrees, 90 degrees, 180 degrees and 280 degrees, and the α axis is determined based on the current arc of the β axis and the imaging condition.

[0073] It is understandable that, based on the above S202, the image of the arc edge area of ​​the workpiece is captured. Specifically, the first support structure is set at a second preset point. The second preset point refers to the curvature setting for the β axis and the α axis, wherein the β axis is at least one of 0 degrees, 90 degrees, 180 degrees, and 280 degrees. The α axis can be determined according to the current curvature of the β axis and the imaging situation. The specific determination method is not limited. For example, the β axis is set to 0 degrees, 90 degrees, 180 degrees, and 280 degrees in sequence, which means that four arc edges need to be captured subsequently. In one possible scenario, taking the workpiece as a rectangle as an example, the second capture location is a corner of the workpiece. The corner refers to the corner formed between the short side and the adjacent long side. The β value corresponds to a certain arc edge. For example, the short side is 0 degrees and the adjacent long side is 90 degrees. The α value is determined by the curvature of the workpiece arc edge. For example, if it is approximately 30 degrees, the α value is also 30 degrees, so that the arc edge imaging approaches a plane and has a better imaging effect.

[0074] S204 : Calculate an arc-edge motion path for the workpiece to be inspected according to the second current point, and determine a plurality of second shooting points on the arc-edge motion path.

[0075] It is understood that, based on the above-described S203, the calculation method for the arc edge motion path is similar to the calculation method for the planar motion path in S203, and will not be further described here. The arc edge motion path primarily refers to the motion path for capturing images of the workpiece's arc edge. In this arc edge motion path, the first support structure secures the workpiece in an inclined position to capture the workpiece's arc edge area. It is understood that the order in which the arc edge image and the planar image are captured is not limited.

[0076] The second current point includes a second initial point and a second end point.

[0077] Optionally, the above calculation of the arc edge motion path for the workpiece to be inspected based on the second current point position and determination of multiple second shooting points on the arc edge motion path can be specifically implemented through the following steps:

[0078] Based on the second initial point and the second end point, straight line fitting is performed to determine the arc edge motion path for the workpiece to be inspected, wherein the length of the arc edge motion path is greater than the length of the workpiece to be inspected; and multiple second shooting points are determined on the arc edge motion path according to the set step size.

[0079] It is understood that the second acquisition component includes a first corner and a second corner. The first corner can be understood as the specific corner where arc edge image acquisition begins, and the second corner can be understood as the specific corner where arc edge image acquisition ends. The specific method for determining the multiple second shooting points is similar to the specific method for determining the multiple first shooting points described above and is not further described here.

[0080] S205. Control the image acquisition module to capture multiple plane images when the second supporting structure is at each first shooting point, and control the image acquisition module to capture multiple arc edge images when the second supporting structure is at each second shooting point.

[0081] It is understood that, based on the above-mentioned S204, the image acquisition module is controlled to capture the planar area of ​​the workpiece when the second support structure moves to each first shooting point, obtaining multiple planar images, each of which includes the complete workpiece surface. The complete workpiece surface refers to the complete area of ​​the workpiece that needs to be inspected, excluding other areas that do not need to be inspected. Subsequently, the image acquisition module is controlled to capture the arc edge area of ​​the workpiece when the second support structure moves to each second shooting point, obtaining multiple arc edge images, each of which includes the complete workpiece arc surface. It is understood that there is no restriction on the order of image acquisition control for the planar area and the arc edge area. To reduce acquisition time, the planar area can be acquired first and then the arc edge area, that is, the planar surface of the workpiece can be acquired first and then the arc edge.

[0082] Optionally, the plane running path refers to the path running along the x-axis or y-axis direction when the workpiece to be inspected is placed horizontally; the arc edge motion path refers to the path running along the arc edge direction when the workpiece to be inspected is placed at an angle; wherein, the z-axis refers to the coordinate axis in the same direction of the workpiece to be inspected and the image acquisition device.

[0083] Understandable, such as Figure 3 The coordinate axes shown in the figure are in a plane posture. The horizontal direction refers to the xy axis, and the z axis refers to the coordinate axis in the same direction (vertical direction) as the image acquisition device and the workpiece. That is, the image acquisition device is located above the workpiece. One possible acquisition method is to acquire along the x axis, that is, from front to back. Another possible acquisition direction is to acquire along the y axis, that is, from left to right. In other words, the image acquisition module is controlled to move on the xy plane. Figure 3 As shown in the figure, when the workpiece is in an arc edge posture, the arc edge is tilted, and the complete arc edge image can be collected along the arc edge direction, as shown in the figure. Figure 3 For a scene, the image is collected along the x-axis direction. In this case, the x-axis direction represents the arc edge direction. If the image is rotated to the adjacent arc edge, the image is collected along the y-axis direction. In this case, the y-axis direction represents the arc edge direction.

[0084] S206 , performing defect detection on the surface of the workpiece to be inspected according to the multiple plane images and the multiple arc edge images, and generating a target detection result.

[0085] It is understood that, based on the above-described S205, the plane image and arc edge image captured under the illumination of the above-described illumination device may highlight semi-brightfield defects and / or darkfield defects. Based on this, most defects, or even all defects, on the workpiece surface can be identified and a target detection result generated. It is understood that after the plane image and arc edge image are captured, the images are stored in real time or periodically for subsequent processing and analysis.

[0086] Optionally, in S206, defect detection is performed on the surface of the workpiece to be inspected based on the multiple plane images and the multiple arc edge images to generate a target detection result. This can be specifically achieved through the following steps:

[0087] The areas to be inspected are respectively intercepted from multiple plane images and multiple arc edge images; the defects on the surface of the workpiece to be inspected are identified through the grayscale value differences of the areas to be inspected, and the target inspection results are obtained.

[0088] It is understandable that the defects on the surface of the workpiece in semi-bright field and dark field are highlighted in the arc edge image and the plane image. Therefore, in order to improve the recognition accuracy and reduce the amount of image processing, the area containing the above defects in the image can be directly cut out and stored as the region of interest. The region of interest is the area to be detected. The number of areas to be detected is not limited. There is a situation where a certain plane image includes multiple areas to be detected, that is, it includes both bright field areas and dark field areas, and there may also be situations where only bright field areas or only dark field areas are included. In addition, there may be some overlapping areas between multiple areas to be detected. After determining the area to be detected, the grayscale value difference of the area to be detected is calculated, the defects on the upper surface of the workpiece are identified, and the target detection result is obtained, wherein the target detection result includes the position of each defect on the upper surface of the workpiece.

[0089] The area to be detected includes a bright field area and / or a dark field area.

[0090] Optionally, the above method of identifying defects on the surface of the workpiece to be inspected by using the grayscale value difference of the area to be inspected to obtain the target inspection result can be specifically implemented by the following steps:

[0091] The bright field area and the dark field area are stitched together to form a bright field image and a dark field image respectively. The grayscale values ​​in the bright field image and the dark field image are extracted respectively. By comparing the grayscale value difference with the background, the defects on the surface of the workpiece to be inspected are screened out and the corresponding position of each defect is determined. Among them, the defect grayscale value of the bright field image is lower than the background grayscale value; the defect grayscale value of the dark field image is higher than the background grayscale value.

[0092] It is understandable that the intercepted bright field area and dark field area are stitched together to obtain a bright field image and a dark field image of the workpiece. Specifically, if there is an overlap between the bright field area and the dark field area intercepted from adjacent images, stitching can be completed based on the overlap. Other possible stitching methods are not described here. Subsequently, the grayscale values ​​in the bright field image and the dark field image are extracted respectively. The grayscale value extracted from the bright field image is recorded as the first grayscale value, and the grayscale value extracted from the dark field is recorded as the second grayscale value. The difference between the extracted grayscale value and the background grayscale value is compared to screen out defects, defect-corresponding areas, and defect-corresponding positions. For brightfield images, after the first lighting device illuminates the light-emitting unit, the light beam emitted by the light-emitting unit passes through the quartz glass at the front end of the first lighting device and then diverges uniformly. Due to the spectral projection properties of quartz glass, the illumination beam essentially does not penetrate the upper surface of the glass. The light beam forms non-uniform brightfield illumination on the workpiece's upper surface, which in turn highlights semi-brightfield defects. The grayscale value of such defects is slightly lower than the background grayscale value. Therefore, the region where the first defect grayscale value is less than the background grayscale value can be determined as the first defect region where a semi-brightfield defect exists. For darkfield images, after the second lighting device illuminates the light-emitting unit, the light beam it emits passes through a hemispherical cylindrical lens, causing the beam to converge in front. Almost all of the light beam is reflected by the workpiece to the camera, forming darkfield illumination, which is used to highlight darkfield defects. The grayscale value of such defects is slightly higher than the background grayscale value. Therefore, the region where the second defect grayscale value is greater than the background grayscale value can be determined as the second defect region where a semi-brightfield defect exists. Other methods for identifying workpiece surface defects using brightfield and darkfield images are not limited.

[0093] The present invention provides a method for detecting defects on the surface of a workpiece. This method eliminates the need for separate inspection stations for both the arc edge and plane areas of the workpiece. By controlling the image acquisition module and the support module, defect detection can be achieved in both the arc edge and plane areas, improving detection efficiency. Furthermore, imaging is performed only on the top surface of the workpiece, eliminating interference from the back surface of the workpiece and the support structure, ensuring imaging accuracy. Consequently, by controlling multiple axes, such as the x-axis, y-axis, z-axis, α-axis, and β-axis, the workpiece is switched to the corresponding inspection posture, meeting the workpiece's requirements for plane and arc edge inspections. This method is highly feasible and reduces inspection costs, providing a better user experience.

[0094] Based on the above embodiments, Figure 4 for Figure 2 FIG. 1 is a schematic diagram of a detailed flow chart of S201 in a method for detecting defects on a workpiece surface. In the above S201, when it is determined that the imaging condition of the first acquisition portion of the workpiece to be detected in the image acquisition module meets the first imaging condition, the first current point position of the second support structure can be specifically determined as follows: Figure 4 The following steps are shown:

[0095] S401. For the second supporting structure, the first adjustment in the x-axis, y-axis and z-axis directions refers to adjusting the x-axis and y-axis so that the first initial position is at the center of the field of view of the image acquisition module, adjusting the z-axis so that the planar imaging of the first initial position in the image acquisition module is clearly focused, and determining the x-axis, y-axis and z-axis after the first adjustment as the first initial point position.

[0096] The first acquisition portion is the target edge of the workpiece to be inspected.

[0097] It is understandable that a first adjustment is made to the x-axis, y-axis, and z-axis of the second support structure. The first adjustment can be understood as an adjustment to the actual acquisition starting point. Specifically, the first adjustment includes: adjusting the x-axis and y-axis until the first initial position of the workpiece is in the center of the camera's field of view, and adjusting the z-axis until the plane imaging is in focus. Taking the workpiece as a rectangle as an example, the first acquisition position can be at least one target edge of the workpiece. The target edge can be a complete edge or a section of an edge. Further, the first acquisition position includes a first initial position and a first end position. The first initial position is the first short side of the workpiece, and the first end position is the other short side of the workpiece, recorded as the second short side. That is, when performing plane area acquisition, it moves from one short side of the workpiece to the other short side. After the first adjustment of the x-axis, y-axis, and z-axis is made so that the camera imaging condition meets the imaging conditions of the first short side being in the center of the camera's field of view and the plane imaging being in focus, the x-axis, y-axis, and z-axis at this time are determined as the first initial point position.

[0098] S402 , performing a second adjustment on the second supporting structure in the x-axis direction so that the first end position is located at the center of the field of view of the image acquisition module, and updating the first initial point position according to the second adjusted x-axis to obtain a first end point position.

[0099] It is understandable that, based on S401, after determining the initial point of acquisition, a second adjustment is made to the x-axis. The second adjustment refers to an adjustment to determine the end point of acquisition. Specifically, the second adjustment includes: adjusting the x-axis to the end point, at which time the first end part of the workpiece is within the camera's field of view, for example, the second short side is within the camera's field of view. It is understandable that when determining the first initial point, the x-axis, y-axis, and z-axis all need to be adjusted. When subsequently determining the first end point, only the x-axis needs to be adjusted, that is, the plane image is acquired on the same horizontal plane (the y-axis and z-axis are the same). Based on this, the initial point and end point of the plane acquisition are determined.

[0100] Optionally, when it is determined that the imaging condition of the second acquisition portion of the workpiece to be inspected in the image acquisition module meets the second imaging condition, the second current point position of the second support structure can be specifically achieved through the following steps:

[0101] A third adjustment is made to the second supporting structure in the x-axis, y-axis and z-axis directions so that the second initial part is at the center of the field of view of the image acquisition module, and the arc edge imaging of the second initial part in the image acquisition module is clearly focused, and the x-axis, y-axis and z-axis after the third adjustment are determined as the second initial point position; a fourth adjustment is made to the x-axis so that the second end part is at the center of the field of view of the image acquisition module, and the second initial point position is updated according to the x-axis after the fourth adjustment to obtain the second end point position; wherein the second acquisition part is the target corner, and the target corner is the corner formed by two connected edges of the workpiece to be inspected.

[0102] It is understandable that the arc edge area of ​​the workpiece is imaged in the same way as the plane area. Specifically, when the second support structure is at the second initial point, the x-axis and y-axis are adjusted so that the second initial position is in the center of the camera's field of view, and the z-axis is adjusted so that the arc edge imaging is in clear focus. Based on the above example, the second initial position is the first corner, which refers to the corner formed by the first short side and the first long side, and the second end position is the second corner, which refers to another corner formed by the second short side and the second long side. A possible implementation scenario is to adjust the x-axis and y-axis so that the first corner is in the center of the camera's field of view, and adjust the z-axis so that the arc edge imaging is in clear focus. That is, when the first corner is in the center of the camera's field of view, the workpiece arc edge can be imaged in the camera. Then adjust the x-axis to the end point. At this time, the second corner of the workpiece is within the camera's field of view, that is, the first corner is the starting point of the arc edge imaging, and the second corner is the end point of the arc edge imaging. The method of determining the initial point and end point of the arc edge area and the plane area is the same, so it will not be repeated here.

[0103] It is understandable that each time the second preset point of the first support structure is determined, the second current point of the second support structure needs to be calculated under the second preset point. The second preset point (α axis and β axis) adjusts the tilt posture of the workpiece. For example, the β axis in the second preset point is 90 degrees. In this case, it is necessary to adjust the x-axis, y-axis and z-axis of the second support structure in the above manner to determine the second current point (including the second initial point and the second end point). When the β axis is 180 degrees, the second current point of the second support structure also needs to be calculated. By analogy, the point adjustment of the four arc edges is completed, that is, each tilt posture of the workpiece needs to calculate the second current point of the second support structure under the tilt posture.

[0104] The present application provides a method for detecting defects on the surface of a workpiece. For flat area mapping, the α and β axes of the first support structure are set to 0, so that the workpiece is always in a horizontal position. The x, y, and z axes are then flexibly adjusted to capture a complete and clear flat image. For flat area mapping, the β axis of the first support structure is set to 0, 90, 180, and 280 degrees. The α axis is then adjusted according to the β axis to maintain a variety of tilted positions of the workpiece. The x, y, and z axes are then flexibly adjusted to capture a complete and clear image of the arc edge. This multi-axis adjustment method reduces the limitations of the workpiece itself and the acquisition equipment, and is applicable to both flat and arc surface mapping of different workpieces.

[0105] Based on the above embodiments, Figure 5 for Figure 2 The detailed flow diagram of S205 in a method for detecting defects on a workpiece surface is shown. In the above S205, the image acquisition module is controlled to capture multiple plane images when the second support structure is at each first shooting point. Specifically, the following steps are performed: Figure 5 The following steps are shown:

[0106] It is understood that the image acquisition module includes a camera device and multiple lighting devices, the multiple lighting devices include a first lighting device configured with a planar light source and a second lighting device configured with a strip light source. Other lighting devices configured with other types of light sources are not described here in detail, and the number of first lighting devices and second lighting devices is not limited. In addition, the layout of each lighting device on the second support structure is not limited and can be adjusted according to the inspection requirements of the workpiece. For example, Figure 1 As shown, a first lighting device and a second lighting device can be deployed below the camera respectively.

[0107] S501 , controlling a plurality of first light-emitting units included in a first lighting device to light up at least partially, so as to emit a first light beam to a first surface area of ​​a workpiece to be inspected.

[0108] The first light beam is used to form non-uniform bright field illumination on the surface of the workpiece to be inspected.

[0109] It is understandable that the inspection requirements of the workpiece are obtained, and the inspection requirements include parameter information of the workpiece, etc. Based on the inspection requirements and the configuration information of the image acquisition module, the number of light-emitting units to be illuminated in each lighting device and the position of the light-emitting units to be illuminated can be determined. In other words, the lighting device can be configured according to the inspection requirements of the workpiece. For example, if the workpiece size is relatively small, some of the lighting units can be configured to be illuminated. If the workpiece size is relatively large, all of the lighting units can be configured to be illuminated. Other ways of configuring the lighting device according to the inspection requirements of the workpiece are not limited. The following embodiment is described in detail using the example of lighting all light-emitting units.

[0110] In one possible scenario, multiple first light-emitting units are controlled to light up simultaneously, and the light beams are evenly diverged to the first surface area of ​​the workpiece. The first surface area refers to an area that can be illuminated by the first lighting device. Under the illumination of multiple first light-emitting units, the first surface area and / or the first surface area and adjacent areas will form non-uniform bright field illumination to highlight semi-bright field defects.

[0111] S502: Control a plurality of second light-emitting units included in a second lighting device to light up at least partially, and emit a second light beam to a second surface area of ​​the workpiece to be inspected.

[0112] The second light beam is used to form dark field illumination on the surface of the workpiece to be inspected.

[0113] It is understood that, based on the above-described S501, multiple second light-emitting units are controlled to illuminate simultaneously, and the light beams are narrowed and converged on the second surface area of ​​the workpiece. The second surface area refers to an area that can be illuminated by the second lighting device. Under the illumination of multiple second light-emitting units, adjacent areas of the second surface area will form dark field illumination to highlight dark field defects. The first surface area and the second surface area are different. In addition, there is no restriction on the control order of the first lighting device and the second lighting device.

[0114] S503 , controlling the camera device to photograph the surface of the workpiece to be inspected when the second supporting structure is at each first photographing point, to obtain a plurality of planar images.

[0115] It can be understood that, based on the above-described S502, after controlling the first and second lighting devices to illuminate their respective surface areas, the second support structure is controlled to move according to the first shooting points assigned along the planar motion path, and the camera device is controlled to capture the workpiece surface at each first shooting point to obtain a planar image. In other words, the workpiece remains horizontal and motionless, and the second support structure, carrying the image capture module, moves from the first initial point to the first end point according to the first shooting points, completing the capture of the entire planar area of ​​the workpiece. This implementation scenario involves simultaneously measuring and illuminating different surface areas of the workpiece with at least two lighting devices, followed by image capture, i.e., capturing images after at least two lighting devices are simultaneously illuminated.

[0116] Another method of controlling the image acquisition module to acquire multiple plane images, that is, when the image acquisition module is provided with two lighting devices with different power supply types, can be specifically implemented by the following steps:

[0117] At least some of the plurality of first light-emitting units are controlled to light up, so that first light beams emitted by at least some of the first light-emitting units are uniformly diverged through the quartz glass to a first surface area of ​​the workpiece to be inspected; the non-uniform bright field illumination formed by the first light beam on the surface of the workpiece to be inspected is photographed by a camera device to obtain a first type of plane image reflecting semi-bright field defects; and / or at least some of the plurality of second light-emitting units are controlled to light up, so that second light beams emitted by at least some of the second light-emitting units are converged to a second surface area of ​​the workpiece to be inspected through a cylindrical mirror; the dark field illumination formed by the second light beam on the surface of the workpiece to be inspected is photographed by the camera device to obtain a second type of plane image reflecting dark field defects; wherein the plurality of plane images include the first type of plane image and / or the second type of plane image.

[0118] It is understandable that another possible scenario is to perform image acquisition after lighting up the lighting device alone, wherein the multiple lighting devices can be lit up in sequence, in order, or periodically. For example, after controlling the multiple first light-emitting units included in the first lighting device to light up simultaneously, the camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each shooting point, and obtain multiple first-type plane images, wherein the first-type plane images reflect semi-bright field defects. After completing the control of the first lighting device, after controlling the multiple second light-emitting units included in the second lighting device to light up simultaneously, the camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each shooting point, and obtain multiple second-type plane images, wherein the second-type plane images reflect dark field defects, wherein the multiple plane images include first-type plane images and second-type plane images. For another example, only the first lighting device is controlled to obtain first-type plane images. For another example, only the second lighting device is controlled to obtain second-type plane images. Other possible control scenarios are not limited.

[0119] Optionally, when the second supporting structure is at each second shooting point, the control process of controlling the image acquisition module to capture multiple arc edge images is the same as the control process of capturing multiple plane images, which will not be described in detail here.

[0120] Another method of controlling the image acquisition module to acquire multiple planar images, that is, when the image acquisition module is provided with an illumination device, can be specifically implemented by the following steps:

[0121] The first lighting device includes a plurality of first light-emitting units that are controlled to be at least partially illuminated to emit a first light beam to a first surface area of ​​the workpiece to be inspected; wherein the first light beam forms non-uniform bright field illumination or dark field illumination in the first surface area; and the camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each first shooting point to obtain a plurality of planar images.

[0122] Understandably, this scenario involves the installation of only one lighting device, such as a first lighting device. The light source type configured for the first lighting device can provide semi-brightfield illumination or darkfield illumination, meaning that a single lighting device can be configured based on detection requirements. Furthermore, the lighting field that the first lighting device can produce can be switched by configuring the light-emitting unit, for example, switching the first lighting device from darkfield illumination to brightfield illumination. Other possible lighting device combinations are not limited and can be determined based on user needs.

[0123] The defect detection method for the workpiece surface provided in the present application is provided with multiple lighting devices with different light sources in the image acquisition module. By controlling the lighting of multiple lighting devices, defects on the workpiece surface can be detected in dark field, bright field and semi-bright field, which can meet different detection needs.

[0124] Based on the above embodiments, Figure 6 A schematic diagram of a workpiece collection triggering process provided in an embodiment of the present application, the specific implementation scenario is as follows:

[0125] by Figure 1 Taking the system shown as an example, a host computer program is written in the control module 3, which sequentially sets the planar motion path (planar path) and arc edge motion path (arc edge path) of the first support structure 2-1 and the second support structure 2-2. After receiving the position value and direction signal from the motion controller, the servo drive system (servo controller) in the control module 3 controls the support structure to move to the planned point (shooting point / photographing point) by adjusting the x-axis, y-axis, z-axis, α-axis, and β-axis, and provides real-time feedback on the support structure's motion position. The motion controller is configured on the support structure to control the support structure's movement. After receiving the feedback on the motion position, the motion controller determines whether it is the shooting point. If the shooting point is determined, the circuit is triggered and outputs a high-level signal, causing the first lighting device 1-4 and the second lighting device 1-5 to flash, and the camera 1-1 to take a photo, thus controlling the light source and camera to complete a pulse cycle. At the next moment, the next pulse response is completed when the workpiece reaches the shooting point. After the planar motion path and the arc edge motion path are completed, all points are photographed and stored. The captured images are then reassembled according to the above-mentioned bright field and dark field areas to form bright field and dark field images of workpieces 1-6 respectively. The processing unit extracts the grayscale value in the image and, by comparing the grayscale value difference with the background, screens out the defects and their locations to generate the detection results.

[0126] Figure 7 This is a schematic diagram of the structure of a device for detecting defects on a workpiece surface provided in an embodiment of the present application. The device provided in an embodiment of the present application can execute the processing flow provided in an embodiment of a method for detecting defects on a workpiece surface, such as Figure 7As shown, the apparatus 700 includes a first determination unit 701, a first path planning unit 702, a second determination unit 703, a second path planning unit 704, a shooting unit 705, and a detection unit 706, wherein:

[0127] A first determining unit 701 is configured to determine, when the first supporting structure is at a first preset position, a first current position of the second supporting structure when an imaging condition of a first acquisition portion of the workpiece to be inspected in the image acquisition module satisfies a first imaging condition; wherein the workpiece to be inspected is fixed to the first supporting structure and the image acquisition module is fixed to the second supporting structure; and the first imaging condition refers to a planar imaging condition of the workpiece;

[0128] A first path planning unit 702 is configured to calculate a planar motion path for the workpiece to be inspected based on the first current point, and determine a plurality of first shooting points on the planar motion path;

[0129] A second determining unit 703 is configured to determine, when the first supporting structure is at a second preset position, a second current position of the second supporting structure when an imaging condition of a second acquisition portion of the workpiece to be inspected in the image acquisition module satisfies a second imaging condition; wherein the second imaging condition refers to an imaging condition of a curved surface of the workpiece;

[0130] A second path planning unit 704 is configured to calculate an arc-edge motion path for the workpiece to be inspected based on the second current point, and determine a plurality of second shooting points on the arc-edge motion path;

[0131] The shooting unit 705 is used to control the image acquisition module to capture a plurality of planar images when the second support structure is at each first shooting point, and to control the image acquisition module to capture a plurality of arc edge images when the second support structure is at each second shooting point;

[0132] The detection unit 706 is used to perform defect detection on the surface of the workpiece to be inspected based on the multiple plane images and the multiple arc edge images, and generate a target detection result.

[0133] The first preset point position refers to that both the α axis and the β axis are 0 degrees, so that the workpiece to be inspected is in a horizontal posture;

[0134] The second preset point position refers to the β axis being at least one of an arc of 0 degrees, 90 degrees, 180 degrees and 280 degrees, and the α axis is determined according to the current arc of the β axis and the imaging condition.

[0135] The first acquisition position includes a first initial position and a first end position, and the first current point includes a first initial point and a first end point.

[0136] Optionally, the first determining unit 701 is configured to:

[0137] Performing a first adjustment on the second support structure in the x-axis, y-axis, and z-axis directions, wherein the first adjustment is to adjust the x-axis and y-axis so that the first initial position is at the center of the field of view of the image acquisition module, and to adjust the z-axis so that the planar imaging of the first initial position in the image acquisition module is clearly focused, and determining the x-axis, y-axis, and z-axis after the first adjustment as the first initial point position;

[0138] A second adjustment is made to the second support structure in the x-axis direction so that the first end position is at the center of the field of view of the image acquisition module, and the first initial point position is updated according to the second adjusted x-axis to obtain the first end point position; wherein the first acquisition position is the target edge of the workpiece to be inspected.

[0139] Optionally, the first determining unit 701 is configured to:

[0140] Performing straight line fitting based on the first initial point and the first end point to determine a planar motion path for the workpiece to be inspected, wherein a length of the planar motion path is greater than a length of the workpiece to be inspected;

[0141] A plurality of first shooting points are determined on the planar motion path according to the set step length.

[0142] The image acquisition module includes a first lighting device and a camera device.

[0143] Optionally, the shooting unit 705 is configured to:

[0144] The first lighting device includes a plurality of first light-emitting units that are at least partially illuminated to emit a first light beam to a first surface area of ​​the workpiece to be inspected; wherein the first light beam forms non-uniform bright field illumination or dark field illumination on the first surface area;

[0145] The camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each first photographing point to obtain a plurality of planar images.

[0146] The image acquisition module includes a first lighting device, a second lighting device and a camera device.

[0147] Optionally, the shooting unit 705 is configured to:

[0148] Controlling the plurality of first light-emitting units included in the first lighting device to light up at least partially, emitting a first light beam to a first surface area of ​​the workpiece to be inspected; wherein the first light beam forms non-uniform bright field illumination on the first surface area;

[0149] Controlling the plurality of second light-emitting units included in the second lighting device to light up at least partially, emitting a second light beam to a second surface area of ​​the workpiece to be inspected; wherein the second light beam forms dark field illumination on the second surface area;

[0150] The camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each first shooting point to obtain a plurality of plane images, wherein the plurality of plane images include a first type of plane image reflecting semi-bright field defects and a second type of plane image reflecting dark field defects.

[0151] The second collection site includes a second initial site and a second end site.

[0152] Optionally, the second determining unit 704 is configured to:

[0153] Performing a third adjustment on the second support structure in the x-axis, y-axis, and z-axis directions so that the second initial position is located at the center of the field of view of the image acquisition module and the arc edge imaging of the second initial position in the image acquisition module is clearly focused, and determining the x-axis, y-axis, and z-axis after the third adjustment as the second initial point position;

[0154] Performing a fourth adjustment on the second support structure in the x-axis direction so that the second end position is at the center of the field of view of the image acquisition module, and updating the second initial point position according to the x-axis after the fourth adjustment to obtain a second end point position;

[0155] The second acquisition position is the target corner, which is a corner formed by two connected edges of the workpiece to be inspected.

[0156] Optionally, the detection unit 706 is configured to:

[0157] respectively intercepting regions to be detected from a plurality of plane images and a plurality of arc edge images;

[0158] By using the grayscale value difference of the area to be inspected, the defects on the surface of the workpiece to be inspected are identified and the target inspection result is obtained.

[0159] The area to be detected includes a bright field area and / or a dark field area.

[0160] Optionally, the detection unit 706 is configured to:

[0161] The bright field area and the dark field area are stitched together to form a bright field image and a dark field image respectively;

[0162] The grayscale values ​​in the bright field image and dark field image are extracted respectively. By comparing the grayscale value difference with the background, the defects on the surface of the workpiece to be inspected are screened out and the corresponding position of each defect is determined. Among them, the grayscale value of the defect in the bright field image is lower than the background grayscale value; the grayscale value of the defect in the dark field image is higher than the background grayscale value.

[0163] Figure 7 The device for detecting defects on the surface of a workpiece in the embodiment shown can be used to implement the technical solution of the above-mentioned method embodiment. Its implementation principle and technical effects are similar and will not be described in detail here.

[0164] Based on the above embodiments, the present application provides a device for detecting defects on the surface of a workpiece, such as Figure 2 As shown, the device includes an image acquisition module, a support module and a control module. The support module includes a first support structure supporting the image acquisition module and a second support structure supporting the workpiece to be inspected, so that the image acquisition module is placed above the workpiece to be inspected, wherein:

[0165] The image acquisition module is used to acquire images of the surface of the workpiece to be inspected in a plane posture and an arc edge posture; the control module is used to execute the workpiece surface defect detection method of any one of claims 1-10 above.

[0166] The image acquisition module includes a camera device, which includes a camera, a lens and a filter. The camera and the lens are connected for image acquisition, and the filter is connected to the rear end of the lens for filtering out ambient stray light.

[0167] Among them, the image acquisition module also includes multiple lighting devices configured with different light source types, and the multiple lighting devices include a first lighting device configured with a planar light source and a second lighting device configured with a strip light source, wherein the light-emitting panel of the first lighting device is composed of multiple first light-emitting unit patches with a first set frequency, and the front end of the first lighting device is configured with quartz glass, and the light-emitting panel of the second lighting device is composed of multiple second light-emitting unit patches with a second set frequency, and the front end of the second lighting device is configured with a cylindrical mirror.

[0168] The first support structure is provided with a first adjustment axis that can be adjusted in the direction of 0 to 360 degrees. The first adjustment axis includes an α-axis and a β-axis. The α-axis and the β-axis are used to adjust the tilt posture of the workpiece to be inspected relative to the image acquisition module.

[0169] The second support structure is provided with a second adjustment axis that can be adjusted in multiple degrees of freedom directions. The second adjustment axis includes an x-axis, a y-axis and a z-axis. Among them, the x-axis and the y-axis are used to adjust the field of view position of the image acquisition module, and the z-axis is used to adjust the vertical distance between the image acquisition module and the workpiece to be detected. The vertical distance reflects the focus of the image.

[0170] It is understandable that the detailed description of the various components included in the workpiece surface defect detection equipment can be found in the above embodiments and will not be repeated here.

[0171] Figure 8 This is a schematic diagram of the structure of the electronic device provided in the embodiment of the present application. Figure 8, which shows a schematic structural diagram of an electronic device 800 suitable for implementing the embodiments of the present application. The electronic device 800 in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), wearable electronic devices, and the like, as well as fixed terminals such as digital TVs, desktop computers, smart home devices, and the like. Figure 8 The electronic device shown is merely an example and should not limit the functions and scope of use of the embodiments of the present application.

[0172] like Figure 8 As shown, the electronic device 800 may include a processing device 801 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 802 or a program loaded from a storage device 808 into a random access memory (RAM) 803 to implement a defect detection method for a workpiece surface according to an embodiment of the present application. Various programs and data required for the operation of the electronic device 800 are also stored in the RAM 803. The processing device 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0173] Typically, the following devices may be connected to the I / O interface 805: an input device 806 including, for example, a touch screen, a touchpad, a keyboard, a mouse, a camera, a microphone, an accelerometer, a gyroscope, etc.; an output device 807 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 808 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 809. The communication device 809 may allow the electronic device 800 to communicate with other devices wirelessly or by wire to exchange data. Although Figure 8 The electronic device 800 is shown with various devices, but it should be understood that it is not required to implement or possess all of the devices shown. More or fewer devices may be implemented or possessed instead.

[0174] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a non-transitory computer-readable medium, and the computer program contains program code for executing the method shown in the flowchart, thereby implementing the defect detection method for the workpiece surface as described above. In such an embodiment, the computer program can be downloaded and installed from the network through the communication device 809, or installed from the storage device 808, or installed from the ROM 802. When the computer program is executed by the processing device 801, the above-mentioned functions defined in the method of the embodiment of the present application are performed.

[0175] It should be noted that the computer-readable medium mentioned above in this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this application, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, device, or device. In this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, which carries computer-readable program code. This propagated data signal can take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to wires, optical cables, RF (radio frequency), etc., or any suitable combination thereof.

[0176] In some embodiments, the client and server can communicate using any currently known or future developed network protocol, such as HTTP (HyperText Transfer Protocol), and can be interconnected with any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network ("LAN"), a wide area network ("WAN"), an internet (e.g., the Internet), and a peer-to-peer network (e.g., an ad hoc peer-to-peer network), as well as any currently known or future developed network.

[0177] The computer-readable medium may be included in the electronic device, or may exist independently without being incorporated into the electronic device.

[0178] Optionally, when the above one or more programs are executed by the electronic device, the electronic device may also execute other steps described in the above embodiments.

[0179] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including, but not limited to, object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0180] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0181] The units involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of a unit does not, in some cases, constitute a limitation on the unit itself.

[0182] The functions described above herein may be performed, at least in part, by one or more hardware logic components. For example, and without limitation, exemplary types of hardware logic components that may be used include: field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chip (SOCs), complex programmable logic devices (CPLDs), and the like.

[0183] In the context of the present application, a machine-readable medium can be a tangible medium that can contain or store a program for use by an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0184] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or gateway that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article or gateway. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the presence of other identical elements in the process, method, article or gateway that includes the elements.

[0185] The foregoing description is intended only to provide specific embodiments of the present application, which will enable those skilled in the art to understand and implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments described herein, but is intended to be construed in the broadest manner consistent with the principles and novel features disclosed herein.

Claims

1. A method for detecting defects on a workpiece surface, characterized in that: The method comprises: When the first supporting structure is at a first preset position, it is determined that the imaging condition of the first acquisition portion of the workpiece to be inspected in the image acquisition module meets the first imaging condition, the first current position of the second supporting structure; wherein the workpiece to be inspected is fixed on the first supporting structure, and the image acquisition module is fixed on the second supporting structure; and the first imaging condition refers to a planar imaging condition of the workpiece; Calculating a planar motion path for the workpiece to be inspected based on the first current point, and determining a plurality of first shooting points on the planar motion path; When the first supporting structure is at a second preset position, determining that an imaging condition of a second acquisition portion of the workpiece to be inspected in the image acquisition module meets a second imaging condition, the second current position of the second supporting structure; wherein the second imaging condition refers to an imaging condition of a curved surface of the workpiece; Calculating an arc edge motion path for the workpiece to be inspected according to the second current point, and determining a plurality of second shooting points on the arc edge motion path; controlling the image acquisition module to capture a plurality of planar images when the second supporting structure is at each first shooting point position, and controlling the image acquisition module to capture a plurality of arc edge images when the second supporting structure is at each second shooting point position; Defect detection is performed on the surface of the workpiece to be inspected according to the multiple plane images and the multiple arc edge images to generate a target detection result.

2. The method according to claim 1, characterized in that The first acquisition part includes a first initial part and a first end part, the first current point position includes a first initial point position and a first end point position, and when determining that the imaging condition of the first acquisition part of the workpiece to be inspected in the image acquisition module meets the first imaging condition, the first current point position of the second support structure includes: Performing a first adjustment on the second supporting structure in the x-axis, y-axis, and z-axis directions, wherein the first adjustment is to adjust the x-axis and the y-axis so that the first initial position is at the center of the field of view of the image acquisition module, and to adjust the z-axis so that the planar imaging of the first initial position in the image acquisition module is clearly focused, and determining the x-axis, y-axis, and z-axis after the first adjustment as the first initial point position; A second adjustment is performed on the second supporting structure in the x-axis direction so that the first end position is at the center of the field of view of the image acquisition module, and the first initial point position is updated according to the x-axis after the second adjustment to obtain the first end point position; wherein, the first acquisition position is the target edge of the workpiece to be inspected.

3. The method according to claim 2, characterized in that The step of calculating a planar motion path for the workpiece to be inspected based on the first current point and determining a plurality of first shooting points on the planar motion path includes: Performing straight line fitting based on the first initial point and the first end point to determine a planar motion path for the workpiece to be inspected, wherein a length of the planar motion path is greater than a length of the workpiece to be inspected; A plurality of first shooting points are determined on the planar motion path according to a set step length.

4. The method according to claim 1, wherein The image acquisition module includes a first lighting device and a camera device, and the controlling the image acquisition module to capture a plurality of planar images when the second supporting structure is at each first shooting point position includes: Controlling the plurality of first light-emitting units included in the first lighting device to light up at least partially, emitting a first light beam to a first surface area of ​​the workpiece to be inspected; wherein the first light beam forms non-uniform bright field illumination or dark field illumination on the first surface area; The camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each first photographing point to obtain a plurality of planar images.

5. The method according to claim 1, wherein The image acquisition module includes a first lighting device, a second lighting device, and a camera device. The controlling the image acquisition module to capture a plurality of planar images when the second supporting structure is at each first shooting point position includes: Controlling the plurality of first light-emitting units included in the first lighting device to light up at least partially, emitting a first light beam to a first surface area of ​​the workpiece to be inspected; wherein the first light beam forms non-uniform bright field illumination on the first surface area; and / or, Controlling the plurality of second light-emitting units included in the second lighting device to light up at least partially, emitting a second light beam to a second surface area of ​​the workpiece to be inspected; wherein the second light beam forms dark field illumination on the second surface area; The camera device is controlled to photograph the surface of the workpiece to be inspected when the second supporting structure is at each first shooting point to obtain a plurality of plane images, wherein the plurality of plane images include a first type of plane image reflecting semi-bright field defects and a second type of plane image reflecting dark field defects.

6. The method according to claim 1, characterized in that The second acquisition part includes a second initial part and a second end part, the second current point position includes a second initial point position and a second end point position, and when determining that the imaging condition of the second acquisition part of the workpiece to be inspected in the image acquisition module meets the second imaging condition, the second current point position of the second supporting structure includes: Performing a third adjustment on the second support structure in the x-axis, y-axis, and z-axis directions so that the second initial position is located at the center of the field of view of the image acquisition module and the arc edge imaging of the second initial position in the image acquisition module is clearly focused, and determining the x-axis, y-axis, and z-axis after the third adjustment as the second initial point position; Performing a fourth adjustment on the second supporting structure in the x-axis direction so that the second end position is located at the center of the field of view of the image acquisition module, and updating the second initial point position according to the x-axis after the fourth adjustment to obtain the second end point position; The second acquisition portion is a target corner, and the target corner is a corner formed by two connected edges of the workpiece to be inspected.

7. The method according to claim 1, characterized in that The performing defect detection on the surface of the workpiece to be inspected based on the multiple plane images and the multiple arc edge images to generate a target detection result includes: intercepting areas to be detected from the multiple plane images and the multiple arc-edge images respectively; The defects on the surface of the workpiece to be inspected are identified by the grayscale value difference of the area to be inspected, and the target inspection result is obtained.

8. The method according to claim 7, characterized in that The area to be inspected includes a bright field area and / or a dark field area, and the defects on the surface of the workpiece to be inspected are identified by grayscale value differences in the area to be inspected to obtain a target inspection result, including: Splicing the bright field area and the dark field area to form a bright field image and a dark field image respectively; The grayscale values ​​in the bright field image and the dark field image are extracted respectively, and the defects on the surface of the workpiece to be inspected are screened out by comparing the background grayscale value difference, and the corresponding position of each defect is determined; wherein the defect grayscale value of the bright field image is lower than the background grayscale value; the defect grayscale value of the dark field image is higher than the background grayscale value.

9. The method according to claim 1, characterized in that The first preset point position means that the first support structure is at 0 degrees in both the α-axis and the β-axis directions, so that the workpiece to be inspected is in a horizontal posture; The second preset point position refers to the first support structure having at least one arc of 0 degrees, 90 degrees, 180 degrees and 280 degrees in the β-axis direction, and a target arc in the α-axis direction, wherein the target arc is determined based on the current arc of the β-axis and the imaging condition.

10. The method according to claim 9, characterized in that The plane running path refers to the path running along the x-axis or y-axis direction when the workpiece to be inspected is placed horizontally; the arc edge motion path refers to the path running along the arc edge direction when the workpiece to be inspected is placed at an angle; wherein the z-axis refers to the coordinate axis in the same direction of the workpiece to be inspected and the image acquisition device.

11. A system for detecting defects on a workpiece surface, characterized in that: The defect detection system includes an image acquisition module, a support module and a control module, wherein: The image acquisition module is used to acquire an image of the surface of the workpiece to be inspected; The support module is used to support the image acquisition module and the workpiece to be inspected, wherein the support module includes a first support structure and a second support structure, the workpiece to be inspected is fixed on the first support structure, and the image acquisition module is fixed on the second support structure; The control module is used to control the support module and the image acquisition module to execute the workpiece surface defect detection method according to any one of claims 1 to 10.

12. The system according to claim 11, wherein: The first support structure is provided with a first adjustment axis that can be adjusted in the direction of 0 to 360 degrees. The first adjustment axis includes an α-axis and a β-axis, wherein the α-axis and the β-axis are used to adjust the tilt posture of the workpiece to be detected relative to the image acquisition module.

13. The system according to claim 11, wherein: The second support structure is provided with a second adjustment axis that can be adjusted in multiple degrees of freedom directions, and the second adjustment axis includes an x-axis, a y-axis and a z-axis, wherein the x-axis and the y-axis are used to adjust the field of view position of the image acquisition module, and the z-axis is used to adjust the vertical distance between the image acquisition module and the workpiece to be inspected, and the vertical distance reflects the focus of the image.

14. The system according to claim 11, wherein: The image acquisition module includes a camera device and multiple lighting devices configured with different light source types. The multiple lighting devices include a first lighting device configured with a planar light source and a second lighting device configured with a strip light source. The light-emitting panel of the first lighting device is composed of multiple first light-emitting unit patches with a first set frequency, and the front end of the first lighting device is configured with quartz glass. The light-emitting panel of the second lighting device is composed of multiple second light-emitting unit patches with a second set frequency, and the front end of the second lighting device is configured with a cylindrical mirror.

15. The system according to claim 14, wherein: The first lighting device is used to light up at least part of the plurality of first light-emitting units to uniformly disperse the emitted first light beam through the quartz glass to a first surface area of ​​the workpiece to be inspected; wherein the first light beam is used to form non-uniform bright field illumination on the surface of the workpiece to be inspected; The second lighting device is used to light up at least part of the multiple second light-emitting units to shrink and converge the emitted second light beam to the second surface area of ​​the workpiece to be inspected through the cylindrical mirror; wherein, the second light beam is used to form dark field illumination on the surface of the workpiece to be inspected.

16. The system according to claim 14, wherein: The control module includes a driving module and a motion controller. The driving module is used to control the movement of the support module and to provide real-time feedback of the movement position to the motion controller. The motion controller is used to output a high-level signal for controlling the strobing of the multiple lighting devices when receiving the feedback of the movement position.

17. A device for detecting defects on the surface of a workpiece, characterized in that: The device includes an image acquisition module, a support module and a control module. The support module includes a first support structure supporting the image acquisition module and a second support structure supporting a workpiece to be inspected, so that the image acquisition module is placed above the workpiece to be inspected, wherein: The image acquisition module is used to acquire images of the surface of the workpiece to be inspected in a plane posture and an arc edge posture; The control module is used to execute the workpiece surface defect detection method described in any one of claims 1 to 10.

18. The device according to claim 17, characterized in that The image acquisition module includes a camera device, which includes a camera, a lens and a filter. The camera and the lens are connected for image acquisition, and the filter is connected to the rear end of the lens for filtering out ambient stray light.

19. The device according to claim 18, characterized in that The image acquisition module also includes multiple lighting devices configured with different light source types, including a first lighting device configured with a planar light source and a second lighting device configured with a bar light source, wherein the light-emitting panel of the first lighting device is composed of multiple first light-emitting unit patches with a first set frequency, and the front end of the first lighting device is configured with quartz glass, and the light-emitting panel of the second lighting device is composed of multiple second light-emitting unit patches with a second set frequency, and the front end of the second lighting device is configured with a cylindrical mirror.

20. The apparatus according to claim 17, wherein The first support structure is provided with a first adjustment axis that can be adjusted in the direction of 0 to 360 degrees, and the first adjustment axis includes an α-axis and a β-axis, wherein the α-axis and the β-axis are used to adjust the tilt posture of the workpiece to be inspected relative to the image acquisition module; The second support structure is provided with a second adjustment axis that can be adjusted in multiple degrees of freedom directions, and the second adjustment axis includes an x-axis, a y-axis and a z-axis, wherein the x-axis and the y-axis are used to adjust the field of view position of the image acquisition module, and the z-axis is used to adjust the vertical distance between the image acquisition module and the workpiece to be inspected, and the vertical distance reflects the focus of the image.

Images